CN117429058A - Hybrid 3D printing rapid manufacturing method of structural member integrated with sensing function - Google Patents
Hybrid 3D printing rapid manufacturing method of structural member integrated with sensing function Download PDFInfo
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- CN117429058A CN117429058A CN202311652162.9A CN202311652162A CN117429058A CN 117429058 A CN117429058 A CN 117429058A CN 202311652162 A CN202311652162 A CN 202311652162A CN 117429058 A CN117429058 A CN 117429058A
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- 238000010146 3D printing Methods 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 238000006073 displacement reaction Methods 0.000 claims abstract description 58
- 238000012544 monitoring process Methods 0.000 claims abstract description 13
- 238000007639 printing Methods 0.000 claims description 123
- 230000008021 deposition Effects 0.000 claims description 42
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- 238000000034 method Methods 0.000 claims description 28
- 239000011265 semifinished product Substances 0.000 claims description 26
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
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- 229910052799 carbon Inorganic materials 0.000 claims description 4
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- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/118—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using filamentary material being melted, e.g. fused deposition modelling [FDM]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Abstract
The application discloses a hybrid 3D printing rapid manufacturing method of a structural member integrating a sensing function, which relates to the technical field of 3D printing. Because sensing unit and other circuit structure direct integration are on waiting to make the structure, consequently can not take place the condition that shifts and drops, the reliability in use is higher, and sensing unit and waiting to make the structure direct contact moreover, no longer pass through glue etc. and paste the structure, the strain monitoring is more accurate for the global displacement field that follow-up reconfiguration obtained is also more accurate.
Description
Technical Field
The application relates to the technical field of 3D printing, in particular to a hybrid 3D printing rapid manufacturing method of a structural member integrating a sensing function.
Background
Along with the increasing demand of intelligent devices, the demand of structure sensing integration technology in the fields of aerospace, biomedical equipment, human health monitoring, fault diagnosis and the like is also increasing. For intelligent components such as a deformed aircraft, a deployable satellite antenna, a soft robot and the like, real-time monitoring of a global displacement field has become a basic function of deformation sensing and attitude control.
In order to realize global displacement field monitoring of a structural member, sensing units such as a metal strain gauge or a fiber bragg grating sensor are generally stuck to a plurality of different monitoring positions of the structural member at present, and the global displacement field of the structural member can be obtained by combining strain information sensed by each sensing unit with different reconstruction algorithms. However, the mounting reliability of the glue adhesion mode between the sensing unit and the structural member is low, the situation that the sensing unit falls off possibly occurs, and the sensing unit can also monitor inaccurate strain information due to the existence of the glue.
Disclosure of Invention
Aiming at the problems and the technical requirements, the application provides a hybrid 3D printing rapid manufacturing method of a structural member integrating a sensing function, and the technical scheme of the application is as follows:
a hybrid 3D printing rapid manufacturing method of a structural member integrating a sensing function includes:
establishing a finite element model of the structural member to be manufactured according to the geometric characteristics and the material properties of the structural member to be manufactured, and performing modal analysis;
according to the modal analysis result, combining the deformation characteristic parameters concerned by the structural member to be manufactured, and determining the layout positions of each sensing unit laid on the structural member to be manufactured;
designing a sensing circuit structure according to the layout positions of each sensing unit on the structural member to be manufactured;
and printing the structural member to be manufactured by using a fused deposition printing platform in the mixed 3D printing system according to the geometric characteristics and the material properties of the structural member to be manufactured, and printing the sensing circuit structure on the structural member to be manufactured by using a direct writing printing platform in the mixed 3D printing system to manufacture the structural member to be manufactured integrated with the sensing circuit structure.
The further technical scheme is that the structure to be manufactured, which is integrated with the sensing circuit structure, is manufactured by utilizing the hybrid 3D printing system, and the structure to be manufactured further comprises:
performing fused deposition printing on the transfer film by utilizing a fused deposition printing platform in the mixed 3D printing system according to the geometric characteristics and material properties of a structural member to be manufactured, suspending printing when printing layer by layer to a plane where the sensing circuit structure is positioned, and obtaining a semi-finished product of the structural member, wherein a groove with a preset thickness is formed on the surface of the semi-finished product of the structural member at a sensing circuit area occupied by the sensing circuit structure;
transferring the semi-finished product of the structural part to a direct writing printing platform in a hybrid 3D printing system by using a transfer film, and printing and manufacturing a sensing circuit structure in a groove of the semi-finished product of the structural part corresponding to a sensing circuit area by using the direct writing printing platform;
and transferring the semi-finished product of the structural member with the manufactured sensing circuit structure to a fused deposition printing platform by using a transfer film, and continuing to print on the surface of the semi-finished product of the structural member by using the fused deposition printing platform according to the geometric characteristics and the material properties of the structural member to be manufactured until the structural member to be manufactured with the embedded sensing circuit structure is manufactured.
The further technical scheme is that the deformation characteristic parameters focused on the structural member to be manufactured comprise deformation types and deformation focused areas;
the method for determining the number of the sensing units arranged on the structural member to be manufactured and the arrangement positions of the sensing units comprises the following steps:
determining the number n of sensing units arranged on a structural member to be manufactured according to the modal analysis result of each order of modes related to the deformation type, wherein n is an integer parameter;
and determining the arrangement positions of each of the n sensing units according to the modal analysis result in the deformation attention area.
The further technical scheme is that the determining of the number n of the sensing units arranged on the structural member to be manufactured comprises:
and selecting n target mode orders which enable the sum of corresponding effective masses to reach a preset duty ratio of the total mass of the structure from all the mode orders related to the deformation type by taking the least number of the selected mode orders as a principle, and taking the number n of the selected target mode orders as the number n of the sensing units arranged on the structural member to be manufactured.
The further technical scheme is that determining the arrangement positions of the n sensing units according to the modal analysis result in the deformation attention area comprises the following steps:
constructing a displacement modal matrix ψ by utilizing displacement modes of N grid nodes in a finite element model of a structural member to be manufactured, wherein the N grid nodes are positioned in a deformation concern area and are respectively under N target modal orders N×n ；
All grid nodes in the finite element model of the structural member to be manufactured are arranged and combined to obtain a plurality of candidate combinations, wherein each candidate combination comprises n grid nodes; constructing a strain modal matrix ψ corresponding to each candidate combination by utilizing strain modalities of n grid nodes in each candidate combination under n target modal orders respectively n×n ；
According to the strain modal matrix psi corresponding to each candidate combination n×n Displacement mode matrix phi N×n And selecting one candidate combination which is most accurate in deformation displacement monitoring of the structural member to be manufactured from all the candidate combinations as an optimal candidate combination, and determining the positions of n grid nodes in the optimal candidate combination as the arrangement positions of n sensing units respectively.
The further technical scheme is that the selecting the optimal candidate combination from all candidate combinations comprises the following steps:
according to the strain modal matrix psi corresponding to each candidate combination n×n Displacement mode matrix phi N×n Constructing displacement strain transformation corresponding to candidate combinationMatrix change T N×n ＝Φ N×n ·[(Φ n×n )T·Ψ n×n ]-1·(Ψ n×n )T；
Combining with the norm judgment criterion of the minimum condition number, converting the displacement strain with minimum norm into a matrix T N×n The corresponding candidate combination is taken as the optimal candidate combination.
The further technical scheme is that for any one candidate combination obtained by construction: the node distance between any two grid nodes in the candidate combination is larger than the size of a single sensing unit, and the maximum distance of all grid nodes in all directions does not exceed a preset distance threshold.
The further technical scheme is that the design of the sensing circuit structure according to the determined layout positions of the sensing units comprises the following steps: the sensing device comprises a plurality of sensing units, a plurality of single-ended electrodes and a common electrode, wherein the plurality of sensing units are respectively positioned at the arrangement positions of the sensing units, the common electrode is positioned at one side of each sensing unit and connected with the first end of each sensing unit, the plurality of single-ended electrodes are positioned at the other side of each sensing unit opposite to the common electrode, and each single-ended electrode is respectively connected with the second end of a corresponding sensing unit.
The further technical scheme is that the printing sensing circuit structure comprises:
printing a layer of epoxy resin on the semi-finished product of the structural member;
printing and manufacturing each sensing unit in the sensing circuit structure by taking carbon paste as a printing material;
printing and manufacturing a common electrode and each single-end electrode in the sensing circuit structure by using silver paste as a printing material;
and connecting outgoing lines to the common electrode, and respectively connecting outgoing lines to the single-ended electrodes to manufacture the sensing circuit structure.
In a mixed 3D printing system, a fused deposition printing platform and a direct writing printing platform are adjacently arranged, and the horizontal heights of the object stage surfaces of the two printing platforms are the same;
the transfer film is pulled towards the direction of the direct writing printing platform to transfer the object stage surface of the direct writing printing platform in a translational manner, and the transfer film is pulled towards the direction of the fused deposition printing platform to transfer the object stage surface of the fused deposition printing platform in a translational manner, so that the semi-finished product of the structural component with the sensing circuit structure is located at the fused deposition printing platform.
The beneficial technical effects of this application are:
the application discloses a quick manufacturing method of hybrid 3D printing of structure integrating sensing function adopts the mode that fused deposition printing and direct writing printing combine, directly integrates the structure to be manufactured and makes on the structure to be manufactured and strain monitoring, combines the reconstruction algorithm to reconstruct and obtain the global displacement field of the structure to be manufactured. Because sensing unit and other circuit structure direct integration are on waiting to make the structure, consequently can not take place the condition that shifts and drops, the reliability in use is higher, and sensing unit and waiting to make the structure direct contact moreover, no longer pass through glue etc. and paste the structure, the strain monitoring is more accurate for the global displacement field that follow-up reconfiguration obtained is also more accurate.
The method also determines the layout positions of the sensing units with the minimized quantity of the sensing units based on the modal algorithm, so that the monitoring positions of the sensing units are more reasonable and accurate, the sensing circuit structure is also more simplified, and the manufacturing difficulty is simplified. The displacement strain conversion matrix of the optimal candidate combination determined in the combination design stage of the strain information acquired by the sensing unit can successfully acquire the full-field displacement information of the structural member under the condition of unknown load, and compared with the traditional method based on the combination of the fiber grating sensor and the displacement reconstruction algorithm, the method has the advantages of low cost, high manufacturing speed, high reconstruction precision and the like, and is suitable for popularization and application in the aspects of design and manufacturing of sensing-displacement reconstruction functions-integrated structures or devices.
The method not only can manufacture the sensing circuit structure on the surface of the structural member to be manufactured, but also can embed the sensing circuit structure in the structural member to be manufactured, thereby further improving the use reliability of the sensing circuit structure.
Drawings
Fig. 1 is a method flow diagram of a hybrid 3D printing rapid prototyping method in accordance with one embodiment of the present application.
FIG. 2 is a schematic diagram of a sensor circuit configuration and its occupied sensor circuit area as designed in one example.
FIG. 3 is a schematic diagram of a structure to be fabricated with the sensing circuit structure of FIG. 2 surface-integrated.
Fig. 4 is a schematic diagram of a manufacturing flow of a structural member to be manufactured based on the sensing circuit structure of fig. 2.
FIG. 5 is a schematic diagram of printing implemented with a hybrid 3D printing system in one embodiment.
FIG. 6 is a flow chart of a method of determining placement locations of individual sensing units on a structure to be fabricated in accordance with one embodiment of the present application.
Fig. 7 is a graph of data comparing measured displacement fields of a bending experiment performed on a fabricated structural member with reconstructed displacement fields obtained by displacement reconstruction in one example.
Fig. 8 is a graph of data comparing measured displacement fields of a torsion experiment performed on a fabricated structural member with reconstructed displacement fields obtained by displacement reconstruction in one example.
Detailed Description
The following describes the embodiments of the present application further with reference to the accompanying drawings.
The application discloses a hybrid 3D prints quick manufacturing method of structure integrating sensing function, please refer to the method flow chart shown in FIG. 1, the hybrid 3D prints quick manufacturing method includes the following steps:
and step 1, establishing a finite element model of the structural member to be manufactured according to the geometric characteristics and the material properties of the structural member to be manufactured, and performing modal analysis. The specific modal analysis method is not described in detail in the application, and after modal analysis, the strain mode and the displacement mode of each grid node in the finite element model under different orders can be determined.
And 2, determining the layout positions of each sensing unit laid on the structural member to be manufactured according to the modal analysis result and the deformation characteristic parameters focused on the structural member to be manufactured.
The deformation characteristic parameters focused on the structural member to be manufactured comprise deformation types and deformation focused areas, and in practical application, deformation conditions are not necessarily focused on all areas of the structural member to be manufactured, so that the deformation focused areas are all or part of the structural member to be manufactured. The type of deformation of interest also indicates the direction of deformation, particularly as determined by the actual situation, such as the type of deformation that is common is vertical bending deformation.
In the conventional method, the layout positions of the sensing units can be determined empirically as in the conventional method, but the layout positions obtained by determining the layout positions in this way may be unreasonable, which may affect the accuracy of the global displacement field reconstructed later. For a better strain monitoring effect, the application determines the arrangement position of each sensor unit by a modal analysis method.
And 3, designing a sensing circuit structure according to the layout positions of each sensing unit on the structural member to be manufactured.
The designed sensing circuit structure comprises a plurality of sensing units and sensing electrodes, wherein each sensing unit is respectively positioned at the arrangement position of each sensing unit, each sensing unit is respectively connected with an outgoing line through the sensing electrode to realize signal extraction, the size and the structure of each sensing unit are pre-configured, and the specifications of each sensing unit are generally identical.
Considering that each sensing unit needs to be led out of two sensing electrodes respectively, and the number of sensing units in the scene of the application is generally more, the lead-out wires are easy to be led to be redundant in wiring, the complexity of a circuit is high, and the manufacturing difficulty is increased, so that in order to simplify the structure, in one embodiment, the sensing circuit structure obtained by design comprises: a plurality of sensing units 1, a common electrode 2 and a plurality of single-ended electrodes. The sensing units 1 are respectively located at the arrangement positions of the sensing units, the common electrode 2 is located at one side of each sensing unit 1 and connected with the first end of each sensing unit 1, the single-ended electrodes 3 are located at the other side of each sensing unit 1 relative to the common electrode 2, and each single-ended electrode 3 is respectively connected with the second end of a corresponding sensing unit 1. The specific structure of the common electrode 2 can be set up in a self-defined manner, and is generally designed based on the principle of simplifying the electrode structure as much as possible.
The design can enable one end of a plurality of sensing units to share the same common electrode, so that the number of the sensing electrodes is reduced, and the lead-out wire wiring mode is simplified. In practical application, each sensing unit is often located on the same plane, and fig. 2 is a schematic plan view of the designed sensing circuit structure on the structural member 10 to be manufactured, where the actual common electrode 2 and each single-end electrode 3 also need to be connected with outgoing lines respectively. In the example of fig. 2, if two ends of each sensing unit are respectively connected with one sensing electrode according to the conventional method, 10 sensing electrodes are required to be respectively used for signal extraction, and after the simplified design method of the embodiment is adopted, only 6 sensing electrodes are required to be used for signal extraction, so that the wiring complexity is simplified. It should be noted that, in fig. 2, the planar structure of the structural member 10 to be manufactured is taken as an example of a regular rectangular structure, and the structural member 10 to be manufactured may have any structure.
And 4, printing the structural member to be manufactured by using a fused deposition printing platform in the mixed 3D printing system according to the geometric characteristics and the material properties of the structural member to be manufactured, and printing the sensing circuit structure on the structural member to be manufactured by using a direct writing printing platform in the mixed 3D printing system to manufacture the structural member to be manufactured of the integrated sensing circuit structure.
The hybrid 3D printing system used in this application includes fused deposition printing platform (FDM) and direct writing printing platform (DIW), both of which can employ off-the-shelf equipment, mainly including stage and printing assembly, the printing assembly being used for printing on the stage.
The method is that after the structure to be manufactured is printed by fused deposition, the sensing circuit structure is directly printed on the surface of the structure to be manufactured. And performing fused deposition printing on the transfer film by utilizing a fused deposition printing platform in the mixed 3D printing system according to the geometric characteristics and the material properties of the structural member to be manufactured, and printing layer by layer to finish the structural member to be manufactured. Utilize the transfer membrane to wait to make the structure and transfer to directly write the print platform, utilize directly writing the print platform and continue to print according to the sensing circuit structure on waiting to make the structure surface, include: firstly, printing a layer of epoxy resin on the surface of the semi-finished product 100 of the structural member, and then printing and manufacturing each sensing unit 1 in the sensing circuit structure by taking carbon paste as a printing material. After the sensing unit is manufactured, the common electrode 2 and each single-end electrode 3 in the sensing circuit structure are manufactured by printing with silver paste with low resistance as a printing material. After all electrodes are manufactured, lead wires are connected to the common electrode 2, and lead wires are respectively connected to the single-ended electrodes 3, so that a sensing circuit structure is manufactured. Printing the sensing circuit structure shown in fig. 2 on the surface of the irregular structural member to be manufactured, wherein the structural member to be manufactured with the sensing circuit structure integrated on the surface is shown in fig. 3. Alternatively, polyimide PI film is used as the transfer film.
In another way, in order to further improve the reliability and protect the sensing circuit structure, the sensing circuit structure is embedded in the structural member to be manufactured, and then the method comprises the following steps:
(1) And performing fused deposition printing on the transfer film by utilizing a fused deposition printing platform in the mixed 3D printing system according to the geometric characteristics and the material properties of the structural member to be manufactured, and suspending printing when printing layer by layer to the plane where the sensing circuit structure is positioned, so as to obtain a semi-finished product of the structural member.
The sensing circuit structure manufactured by the method is embedded in the structural member to be manufactured, and the embedded position of the sensing circuit structure is predetermined, so that the plane where the sensing circuit structure is located can be predetermined, and specific printing parameters and modes of fused deposition printing are not repeated.
In addition to the fact that printing is suspended from printing until the plane of the sensing circuit structure is located, when the printing path of fused deposition printing is planned according to the geometric characteristics of the structural member to be manufactured, the method has the advantage that a groove with the preset thickness is printed at the sensing circuit area occupied by the sensing circuit at the plane of the sensing circuit structure, so that the surface of the semi-finished product of the printed structural member is formed with the groove with the preset thickness at the sensing circuit area. The preset thickness of the groove is only required to be higher than the thickness of the sensing circuit structure, so that the sensing circuit structure can be completely embedded in the groove, the size of the groove is not required to be too large, otherwise, the overall strength of the structural member to be manufactured is obviously weakened. After the sensing circuit structure is determined, the occupied sensing circuit area can be determined, and the sensing circuit area at least covers the areas where each sensing unit, one common electrode and each single-ended electrode are located and also covers the areas of the outgoing lines where the common electrode and the single-ended electrodes are connected. The shape and the size of a specific sensing circuit area can be set in a self-defined mode, and the size of the sensing circuit area is not too large, and the sensing circuit area is generally obtained by expanding a certain margin according to the sensing circuit structure. For example, in the example of fig. 2, the occupied sensing circuit area determined from such a sensing circuit structure is shown as a shaded portion.
In this embodiment, the resulting semifinished structure 100 printed in this step is shown in fig. 4 (a), corresponding to the example of fig. 2 described above.
(2) And transferring the semi-finished product of the structural part to a direct writing printing platform in the mixed 3D printing system by using the transfer film, and printing and manufacturing a sensing circuit structure in a groove of the semi-finished product of the structural part corresponding to the sensing circuit region by using the direct writing printing platform. Comprising the following steps: firstly, a layer of epoxy resin is printed in a groove of the semi-finished product 100 of the structural member corresponding to the sensing circuit area, and then each sensing unit 1 in the sensing circuit structure is manufactured by printing with carbon paste as a printing material. After the sensing unit is manufactured, the common electrode 2 and each single-end electrode 3 in the sensing circuit structure are manufactured by printing with silver paste with low resistance as a printing material. After all electrodes are manufactured, lead wires are connected to the common electrode 2, and lead wires are respectively connected to the single-ended electrodes 3, so that a sensing circuit structure is manufactured. Referring to fig. 4, a schematic diagram of a structure 200 obtained after the sensor circuit structure is fabricated on the semi-finished structure 100 shown in (a) is shown in fig. b.
(3) And transferring the semi-finished product of the structural part with the manufactured sensing circuit structure to a fused deposition printing platform by utilizing a transfer film, and continuously printing on the surface of the semi-finished product of the structural part by utilizing the fused deposition printing platform according to the geometric characteristics and the material properties of the structural part to be manufactured according to the printing path planned before until the structural part to be manufactured with the embedded sensing circuit structure is manufactured.
Because the fused deposition printing is required to be continued on the surface of the semi-finished structural member, if the surface of the semi-finished structural member manufactured in the step (1) is flat, and the step (2) is used for manufacturing the sensing circuit structure on the surface of the semi-finished structural member directly, the sensing circuit structure is easily damaged by the scratch of the needle head of the printing assembly in the fused deposition printing platform, so that the embodiment is used for manufacturing the groove on the surface of the semi-finished structural member, and the sensing circuit structure is embedded in the groove of the semi-finished structural member and is lower than the surface of the semi-finished structural member, so that the sensing circuit structure is not influenced when the printing is continued in the step (3). Referring to fig. 4, a schematic diagram of a structure 300 to be manufactured obtained after continuing to perform fused deposition printing on the semi-finished structure 100 with the sensor circuit structure shown in (b) is shown in fig. c. It should be noted that fig. 4 (c) only shows a two-part laminated structure for distinguishing the part indicating the first fused deposition printing from the part indicating the second fused deposition printing, and the actual printing should be an integrated structure.
Regardless of the embodiment described above, and regardless of whether the sensing circuit structure is printed on the surface or inside of the structure to be fabricated, it is necessary to transfer between the two printing platforms, and for convenience, to transfer between the two printing platforms and for improving the reliability of the transfer, please refer to fig. 5, in the hybrid 3D printing system, the fused deposition printing platform FDM and the direct writing printing platform DIW are placed adjacently and the stage surfaces of the two printing platforms are at the same level. The transfer film 4 is laid on the stage surfaces of the two printing platforms, and sufficient allowance is left at both ends so as to facilitate dragging. Taking the above-mentioned in-line printing method as an example, in the above step (1), the semi-finished product 100 of the structural member is manufactured on the surface of the transfer film 4 by using the fused deposition printing platform FDM, and then the semi-finished product 100 of the structural member is transferred in a translational manner to the stage surface of the direct writing printing platform DIW by pulling the transfer film 4 in the direction of the direct writing printing platform DIW, as in fig. 5, the semi-finished product 100 of the structural member is moved to the stage surface of the direct writing printing platform DIW by pulling the transfer film 4 to the right. The sensing circuit structure may then be printed at the direct writing printing platform according to step (2) to manufacture the structure 200, after the manufacture is completed, the semi-finished product of the structural component of the sensing circuit structure is manufactured by pulling the transfer film towards the fused deposition printing platform FDM, that is, the surface of the stage of the fused deposition printing platform FDM is translated and transferred by the structure 200, as in fig. 5, the structure 200 is moved to the surface of the stage of the fused deposition printing platform FDM by pulling the transfer film 4 leftwards, and then fused deposition printing may be continued on the surface of the structure 200 by using the fused deposition printing platform FDM to obtain the structural component 300 to be manufactured.
The structural member to be manufactured, which is manufactured by the manufacturing method, is integrated with the sensing circuit structure, the strain of the structural member to be manufactured can be monitored by utilizing the integrated sensing circuit structure, and the global displacement field of the structural member to be manufactured can be obtained by reconstructing by combining a reconstruction algorithm. Because sensing unit and other circuit structure are all direct integrated on waiting to make the structure, consequently can not take place the condition that shifts and drops, the use reliability is higher, and sensing unit and waiting to make the structure direct contact moreover, no longer pass through glues such as glue and paste the structure, the strain monitoring is more accurate for the global displacement field that follow-up reconfiguration obtained is also more accurate.
In the step 2, determining the layout positions of each sensing unit laid on the structural member to be manufactured according to the modal analysis result and the deformation characteristic parameter focused on the structural member to be manufactured includes the following steps, please refer to fig. 6:
step 510, determining the number n of the sensing units arranged on the structural member to be manufactured according to the modal analysis result of each order of modes related to the deformation type, wherein n is an integer parameter. Comprising the following steps: and selecting n target mode orders which enable the sum of corresponding effective masses to reach a preset duty ratio of the total mass of the structure from all the mode orders related to the deformation type by taking the least number of the selected mode orders as a principle, and taking the number n of the selected target mode orders as the number n of the sensing units arranged on the structural member to be manufactured.
The mode order of interest for each deformation type is determined according to the technical specifications in the art, and the predetermined duty cycle can be customized, and typically takes a value of about 85% -95%, such as typically taking 90%. When the sum of the effective masses of the n target modal orders reaches the preset duty ratio of the total mass of the structure, the accuracy of the reconstruction algorithm can be ensured, and the fewer the number of the sensing units is, the simpler the structure of the sensing circuit structure is, the more convenient the manufacturing is, the reliability is improved, so that the minimum number of the sensing units meeting the requirement is determined on the basis of ensuring the accuracy of the reconstruction algorithm by taking the sum as a standard.
For example, in an example, when the deformation type is vertical bending deformation, for all the modal orders corresponding to the vertical bending deformation, a minimum of 6 target modal orders are determined, so that the sum of the effective masses of the 6 target modal orders reaches 90% of the total mass of the structure, and the 6 target modal orders are respectively 1 st, 2 nd, 3 rd, 6 th and 7 th orders, so that it can be determined that 6 sensing units are needed.
And step 520, determining the arrangement positions of the n sensing units according to the modal analysis result in the deformation interest area.
(1) Constructing a displacement mode matrix phi by utilizing displacement modes of N grid nodes in a finite element model of a structural member to be manufactured, wherein the N grid nodes are positioned in a deformation concern area and are respectively under N target mode orders N×n 。
(2) All grid nodes in the finite element model of the structural member to be manufactured are arranged and combined to form a plurality of candidate combinations, and each candidate combination comprises n grid nodes. Then constructing a strain modal matrix ψ corresponding to the candidate combination by utilizing the strain modes of the n grid nodes in each candidate combination under n target modal orders n×n 。
In this step, considering some problems in actual fabrication, not all combinations obtained by full arrangement of n mesh nodes in the finite element model are taken as candidate combinations, but there are certain limitations including:
the node distance between any two grid nodes in the candidate combination is larger than the size of a single sensing unit, which is in consideration of the problem of interference in subsequent printing, when the node distance between the two grid nodes is smaller than or equal to the size of the sensing unit, the sensing units printed at the two grid nodes have interference, so that the combination which does not meet the condition is removed in order to avoid the interference.
In addition, the maximum distance in each direction of all grid nodes in the candidate combination does not exceed a predetermined distance threshold. When the grid node distance is far away, the scale of the sensing circuit structure is too large, the form of the electrode and the wiring of the outgoing line are complex, the manufacturing difficulty of the sensing circuit structure is improved, the occupied sensing circuit area is increased, the formed groove is large, the strength of the structural member to be manufactured is affected, and therefore the distance between the grid nodes in all directions such as the transverse direction and the longitudinal direction is not too large.
(3) According to the strain modal matrix phi corresponding to each candidate combination n×n Displacement mode matrix phi N×n And selecting one candidate combination which is most accurate in deformation displacement monitoring of the structural member to be manufactured from all candidate combinations as an optimal candidate combination.
The method for selecting the optimal candidate combination comprises the following steps: for each candidate combination, according to the strain modal matrix ψ corresponding to the candidate combination n×n Displacement mode matrix phi N×n Constructing a displacement strain conversion matrix T corresponding to the candidate combination N×n ＝Φ N×n ·[(Ψ n×n ) T ·Ψ n×n ] -1 ·(Ψ n×n ) T . Combining with norm judgment criterion of minimum condition number, converting displacement strain matrix T with minimum norm N×n The corresponding candidate combination is taken as the optimal candidate combination. And then determining the positions of n grid nodes in the optimal candidate combination as the layout positions of n sensing units respectively.
In one example, after determining the layout position of the sensing unit based on the method provided by the application, manufacturing a structural member to be manufactured according to the manufacturing method of the application, then performing bending experiments and torsion experiments on the manufactured structural member to be manufactured, and recording the integral displacement of the structural member to be manufactured at the edge and the displacement condition of the layout position of the single sensing unit by using a high-speed camera and a displacement sensor to obtain an actual measurement displacement field. In addition, also uses a sensing circuit junctionThe strain information acquired by each sensing unit is constructed, and the displacement strain conversion matrix T corresponding to the optimal candidate combination is utilized N×n The reconstructed displacement field of the structural member to be manufactured can be output. Comparing the reconstructed displacement field with the obtained actually measured displacement field, a comparison diagram of the actually measured displacement field of the bending experiment and the reconstructed displacement field obtained by the displacement reconstruction is shown in fig. 7, a comparison diagram of the actually measured displacement field of the torsion experiment and the reconstructed displacement field obtained by the displacement reconstruction is shown in fig. 8, and as can be seen from fig. 7 and 8, the data of the actually measured displacement field and the reconstructed displacement field obtained by the displacement reconstruction are highly reconstructed regardless of the complete experiment or the torsion experiment, so that the effectiveness of the method is illustrated.
What has been described above is only a preferred embodiment of the present application, which is not limited to the above examples. It is to be understood that other modifications and variations which may be directly derived or contemplated by those skilled in the art without departing from the spirit and concepts of the present application are to be considered as being included within the scope of the present application.
Claims (10)
1. The hybrid 3D printing rapid manufacturing method for the structural member integrating the sensing function is characterized by comprising the following steps of:
establishing a finite element model of the structural member to be manufactured according to the geometric characteristics and the material properties of the structural member to be manufactured, and performing modal analysis;
according to a modal analysis result and a deformation characteristic parameter focused on the structural member to be manufactured, determining the layout position of each sensing unit laid on the structural member to be manufactured;
designing a sensing circuit structure according to the layout positions of each sensing unit on the structural member to be manufactured;
and printing the structural member to be manufactured by using a fused deposition printing platform in the mixed 3D printing system according to the geometric characteristics and the material properties of the structural member to be manufactured, and printing the sensing circuit structure on the structural member to be manufactured by using a direct writing printing platform in the mixed 3D printing system to manufacture the structural member to be manufactured integrating the sensing circuit structure.
2. The hybrid 3D printing rapid prototyping method of claim 1, wherein prototyping the structure to be fabricated with the hybrid 3D printing system to obtain the structure integrated with the sensing circuit further comprises:
performing fused deposition printing on a transfer film by utilizing a fused deposition printing platform in a mixed 3D printing system according to the geometric characteristics and material properties of a structural member to be manufactured, suspending printing and obtaining a semi-finished product of the structural member when printing layer by layer to a plane where a sensing circuit structure is located, wherein a groove with a preset thickness is formed on the surface of the semi-finished product of the structural member at a sensing circuit area occupied by the sensing circuit structure;
transferring the semi-finished structural part to a direct writing printing platform in the hybrid 3D printing system by using a transfer film, and printing and manufacturing the sensing circuit structure in a groove of a sensing circuit area corresponding to the semi-finished structural part by using the direct writing printing platform;
and transferring the semi-finished product of the structural part with the manufactured sensing circuit structure to the fused deposition printing platform by using the transfer film, and continuing to print on the surface of the semi-finished product of the structural part by using the fused deposition printing platform according to the geometric characteristics and the material properties of the structural part to be manufactured until the structural part to be manufactured with the embedded sensing circuit structure is manufactured.
3. The hybrid 3D printing rapid fabrication method of claim 1, wherein the deformation characteristic parameters of interest for the structure to be fabricated include deformation type and deformation interest region;
the method for determining the number of the sensing units arranged on the structural member to be manufactured and the arrangement positions of the sensing units comprises the following steps:
determining the number n of sensing units arranged on a structural member to be manufactured according to the modal analysis result of each order of modes related to the deformation type, wherein n is an integer parameter;
and determining the arrangement positions of each of the n sensing units according to the modal analysis result in the deformation attention area.
4. A hybrid 3D printing rapid prototyping method as claimed in claim 3, wherein determining the number n of sensor units laid on the structure to be fabricated comprises:
and selecting n target mode orders which enable the sum of corresponding effective masses to reach a preset duty ratio of the total mass of the structure from all the mode orders related to the deformation type by taking the least number of the selected mode orders as a principle, and taking the number n of the selected target mode orders as the number n of the sensing units arranged on the structural member to be manufactured.
5. The hybrid 3D printing rapid prototyping method of claim 4, wherein determining the placement position of each of the n sensing units according to the modal analysis result in the deformed region of interest comprises:
constructing a displacement mode matrix phi by utilizing the displacement modes of N grid nodes in the deformation concern area in the finite element model of the structural member to be manufactured under N target mode orders N×n ；
All grid nodes in the finite element model of the structural member to be manufactured are arranged and combined to obtain a plurality of candidate combinations, wherein each candidate combination comprises n grid nodes; constructing a strain modal matrix ψ corresponding to each candidate combination by utilizing strain modes of n grid nodes in each candidate combination under n target modal orders respectively n×n ；
According to the strain modal matrix psi corresponding to each candidate combination n×n The displacement modal matrix phi N×n And selecting one candidate combination which is most accurate in deformation displacement monitoring of the structural member to be manufactured from all candidate combinations as an optimal candidate combination, and determining the positions of n grid nodes in the optimal candidate combination as the arrangement positions of n sensing units respectively.
6. The hybrid 3D printing rapid prototyping method of claim 5, wherein selecting an optimal candidate combination from among all candidate combinations comprises:
according to the strain modal matrix psi corresponding to each candidate combination n×n The displacement modal matrix phi N×n Constructing a displacement strain conversion matrix corresponding to the candidate combination
T N×n ＝Φ N×n ·[(Ψ n×n ) Butyl ·Ψ n×n ] -1 ·(Ψ n×n ) T ；
Combining with the norm judgment criterion of the minimum condition number, converting the displacement strain with minimum norm into a matrix T N×n And the corresponding candidate combination is taken as the optimal candidate combination.
7. The hybrid 3D printing rapid prototyping method of claim 5 wherein, for any one of the candidate combinations constructed: the node distance between any two grid nodes in the candidate combination is larger than the size of a single sensing unit, and the maximum distance of all grid nodes in all directions does not exceed a preset distance threshold.
8. The hybrid 3D printing rapid prototyping method of claim 1 wherein designing the sensing circuit structure according to the determined layout positions of the individual sensing units comprises: the sensing device comprises a plurality of sensing units, a plurality of single-ended electrodes and a common electrode, wherein the plurality of sensing units are respectively positioned at the arrangement positions of the sensing units, the common electrode is positioned at one side of each sensing unit and connected with the first end of each sensing unit, the plurality of single-ended electrodes are positioned at the other side of each sensing unit opposite to the common electrode, and each single-ended electrode is respectively connected with the second end of a corresponding sensing unit.
9. The hybrid 3D printing rapid prototyping method of claim 8, wherein printing the sensing circuit structure comprises:
printing a layer of epoxy resin on the semi-finished structural part;
printing and manufacturing each sensing unit in the sensing circuit structure by taking carbon paste as a printing material;
printing and manufacturing a common electrode and each single-ended electrode in the sensing circuit structure by using silver paste as a printing material;
and connecting outgoing lines to the common electrode, and respectively connecting outgoing lines to each single-ended electrode to manufacture the sensing circuit structure.
10. The hybrid 3D printing rapid prototyping method of claim 2 wherein in the hybrid 3D printing system, the fused deposition printing platform and the direct writing printing platform are placed adjacent and the stage surfaces of both printing platforms are the same in horizontal height;
the transfer film is pulled to the direction of the straight writing printing platform to transfer the structural part semi-finished product in a translational mode to the object stage surface of the straight writing printing platform to be positioned at the straight writing printing platform, and the transfer film is pulled to the direction of the fused deposition printing platform to transfer the structural part semi-finished product manufactured with the sensing circuit structure in a translational mode to the object stage surface of the fused deposition printing platform to be positioned at the fused deposition printing platform.
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