CN117428347A - Diamond slice processing device and technology and diamond slice - Google Patents
Diamond slice processing device and technology and diamond slice Download PDFInfo
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- CN117428347A CN117428347A CN202311604510.5A CN202311604510A CN117428347A CN 117428347 A CN117428347 A CN 117428347A CN 202311604510 A CN202311604510 A CN 202311604510A CN 117428347 A CN117428347 A CN 117428347A
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 93
- 239000010432 diamond Substances 0.000 title claims abstract description 93
- 238000005516 engineering process Methods 0.000 title abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 70
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 230000003746 surface roughness Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 8
- 238000003698 laser cutting Methods 0.000 claims description 6
- 238000003754 machining Methods 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 abstract description 26
- 230000007547 defect Effects 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 230000001404 mediated effect Effects 0.000 abstract 1
- 239000013078 crystal Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000002035 prolonged effect Effects 0.000 description 5
- 230000008646 thermal stress Effects 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
In order to solve the problems, the invention discloses a diamond slice processing device and a diamond slice processing technology, and belongs to the field of semiconductor processing. The technical scheme is that the diamond slice processing device comprises a laser system and a clamping tool: the laser system comprises a laser head, wherein the laser head comprises a lens group, a water nozzle and a gas nozzle which are sequentially arranged along the laser path direction, and the water nozzle and the gas nozzle are coaxial with the focal line of the lens group; the clamping tool comprises a rotary clamping part, the rotary clamping part is used for fixing a diamond substrate to be processed and driving the diamond substrate to rotate, and a rotating shaft of the rotary clamping part is perpendicular to the laser path direction. The invention has the advantages that in the cutting process, the water-mediated laser can cool the workpiece to be cut, thereby greatly reducing the heat affected zone, eliminating the taper defect and realizing the high surface quality with low surface roughness; the low-stress cutting of the inch-grade diamond can be realized by prolonging the working distance of the laser and the tool design.
Description
Technical Field
The invention belongs to the field of semiconductor processing, and particularly relates to a diamond slice processing device, a diamond slice processing technology and a diamond slice.
Background
Diamond has excellent electrical properties, such as forbidden band width up to 5.48eV, breakdown field strength up to 10MV/cm, electron/hole mobility of 4500/3800cm 2 The alloy is known as a final semiconductor, and has extremely high heat conductivity (2200W/m.K), so that the alloy has wide application prospect in the fields of electrician electronics, aerospace, heat dissipation devices and the like. However, the ultra-high hardness and low fracture toughness of diamond lead to cutting difficulties. Traditional cutting modes such as wire cutting and the like are poor in processing surface quality, low in efficiency and serious in loss, and particularly in the field of inch-grade diamond cutting, practical application of diamond products is limited.
The laser cutting has the advantages of high processing precision, wide application range and the like, and is considered as an ideal diamond cutting processing technology. However, laser cutting processing of diamond segments has the following problems:
firstly, laser processing utilizes a high-energy laser beam, has the characteristic of high energy density, and has no effective cooling means, so that a heat affected zone exists on the cutting surface of the diamond and larger stress is generated; secondly, due to the optical characteristics of laser and the accumulation of cut products, the laser cutting seam is in a conical groove shape, and the surface precision is low; in addition, the laser beam is affected by the external environment, and the laser beam has the phenomenon of divergence although being focused, collimated and the like, and the power of the laser is obviously attenuated along with the emitting distance of the laser, so that the cutting depth of the laser is limited, and the size of a product is restricted.
Disclosure of Invention
The invention provides a diamond slice processing device aiming at the problems of large slice stress, poor morphology quality and small processing size caused by large laser hot zone hardness in the existing diamond slice processing process.
In order to solve the problems, the technical scheme adopted by the invention is that the diamond slice processing device comprises a laser system and a clamping tool:
the laser system comprises a laser head, wherein the laser head comprises a lens group, a water nozzle and a gas nozzle which are sequentially arranged along the laser path direction, and the water nozzle and the gas nozzle are coaxial with the focal line of the lens group;
the clamping tool comprises a rotary clamping part, the rotary clamping part is used for fixing a diamond substrate to be processed and driving the diamond substrate to rotate, and a rotating shaft of the rotary clamping part is perpendicular to the laser path direction.
The device adopts the water-guided laser to cut, the water nozzle sprays out water columns, so that the coaxially-injected laser forms total reflection in the water columns, the water columns are used as laser conduction media, cutting heat can be taken away in time through water flow in the cutting process, meanwhile, the attenuation of the laser is reduced, and the thermal stress of slicing is greatly reduced compared with that of dry laser; an air curtain is formed around the water column by utilizing the air nozzle, and the effective cutting distance of laser is prolonged by gas protection and guiding; simultaneously, through rotatable centre gripping frock, can rotate the diamond substrate to cut many times at the circumference rotation angle of substrate, the cooperation air curtain water leads laser and can obtain bigger section.
Preferably, the clamping tool comprises a base, a rotating shaft provided with a rotary clamping part is arranged along the X-axis direction, a first clamping seat and a second clamping seat are arranged on the base, a first propping part is arranged on the first clamping seat, a second propping part is arranged on the second clamping seat, the first propping part and the second propping part are oppositely arranged and can rotate along the X-axis, and a rotation driving mechanism is arranged between the first propping part and the first clamping seat and/or between the second propping part and the second clamping seat; the first clamping seat and the second clamping seat can move relatively along the X-axis direction, and/or the first propping part can stretch and retract along the X-axis direction relative to the first clamping seat, and/or the second propping part can stretch and retract along the X-axis direction relative to the second clamping seat. The diamond substrate is fixed in a top clamping mode, the rotation axis and the axial position of the substrate can be better fixed, and the rotation precision and the cutting precision can be ensured by matching with the water guide laser beam for vertical cutting.
Preferably, along the X-axis direction, the first clamping seat is fixedly arranged at one end of the base, the sliding guide rail is arranged at the other end of the base, and the second clamping seat is arranged on the sliding guide rail. The fixed position of the first clamping seat can be used as a reference of the processing device and the position of the diamond substrate can be determined, so that the processing precision is ensured.
Preferably, the first tightening part comprises an active rotating shaft, the active rotating shaft penetrates through the first clamping seat, the rotating driving mechanism is a hollow motor and is arranged in the first clamping seat, and the active rotating shaft is fixedly connected with a rotor of the hollow motor; the second jacking part comprises a driven rotating shaft, the driven rotating shaft penetrates through the second clamping seat, and the driven rotating shaft is connected with the second clamping seat through a bearing assembly; the driving rotating shaft and the driven rotating shaft are arranged in line along the X-axis direction, and the opposite ends of the driving rotating shaft and the driven rotating shaft are respectively provided with a jacking disc.
Preferably, the water nozzle has a nozzle orifice diameter of 40-90 microns. The smaller water jet is adopted to form finer water columns, namely water guide laser beams, so that the cutting precision is improved.
Preferably, along the laser path direction, the nozzle of the water nozzle is in a diffuse conical shape, the nozzle of the gas nozzle is in a contracted conical shape, and the diameter of the large end of the nozzle of the gas nozzle is larger than that of the large end of the nozzle of the water nozzle. The laser passing position between the water nozzle and the gas nozzle forms a biconical cavity, so that laser energy can be prevented from being deposited on nozzle materials, thermal damage of a laser head is avoided, and energy loss is reduced.
On the other hand, the invention also provides a diamond slice process, which adopts the diamond slice processing device and comprises the following steps:
s1, clamping a diamond substrate on a clamping tool;
s2, laser cutting, namely, a laser head emits water to guide laser to cut the diamond substrate;
s3, rotating the clamping part to rotate the diamond substrate by an angle A;
s4, the laser head emits water guide laser again to cut the diamond substrate;
s5, obtaining the diamond slice.
The diamond substrate is cut for multiple times in multiple directions along the circumference through the water-guided laser, which is equivalent to superposition of multiple single cutting depths, so that a larger diamond slice can be obtained; meanwhile, the water guide laser can rapidly take away cutting heat through the water column, so that the temperature of a hot zone is greatly reduced, the thermal stress of a slice is greatly reduced, and meanwhile, the water column is a cylinder, so that the slice can be tidier, and the surface precision of the slice is improved.
Wherein the wavelength of the water guide laser is 532nm, the laser power is 15-35W, and the water pressure of the water nozzle is 2-4MPa. Proper laser and water pressure parameters are set, so that the machining efficiency is guaranteed, and meanwhile, the cooling performance under the water pressure is good.
Preferably, in step S3, the rotation angle is 180 °, and when the diamond substrate is not completely cut, steps S3 and S4 are repeated until the diamond substrate is completely cut and a diamond chip is obtained. The two cutting positions differ by 180 degrees, the laser beam feeding amount can be utilized to the greatest extent, the processing efficiency is improved, and meanwhile, the large-size base material is cut for multiple times to ensure cutting.
In a third aspect, the present invention also provides a diamond chip manufactured by the above process, wherein the surface roughness is not higher than 10.925nm, and the size is 7mm×7mm or more square chips or wafers with a diameter of 7mm or more. The diamond slice manufactured by the process has high surface quality, larger size and better performance.
According to the technical scheme, the invention has the advantages that: according to the processing device and the processing technology, the water guide laser protected by the air curtain is used for diamond slice processing, and the high-speed water flow is used as a light guide medium, so that the laser emission distance is prolonged, the energy loss is reduced, the heat generated by the laser can be rapidly taken away, the thermal stress is obviously reduced, and the taper defect is eliminated; the clamping tool capable of rotating is utilized, the diamond substrate is enabled to rotate, the cutting position is adjusted, the low-stress cutting of the inch-grade diamond can be achieved by matching with the prolonged water guide laser, the diamond slice with a larger size is obtained, the surface quality of the diamond slice is better, and the smoothness is higher.
Drawings
In order to more clearly illustrate the technical solutions of the present invention, the drawings that are needed in the description will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a laser head according to an embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view of a clamping tool according to an embodiment of the present invention.
Fig. 3 is a schematic top view of a clamping tool according to an embodiment of the invention.
Fig. 4 is a surface microstructure of a diamond segment in accordance with an embodiment of the present invention.
In the figure: 1. the device comprises a base, a sliding guide rail, a second clamping seat, a driven rotating shaft, a locking handle, a driving rotating shaft, a hollow motor, a first clamping seat, a lens group, a water nozzle, a water inlet, a gas nozzle, a gas inlet and a protective lens.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions of the present invention will be clearly and completely described below with reference to the drawings in this specific embodiment, and it is apparent that the embodiments described below are only some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, based on the embodiments in this patent, which would be within the purview of one of ordinary skill in the art without the particular effort to make the invention are intended to be within the scope of the patent protection.
Example 1
In this embodiment, the vertical direction is defined as the Z-axis direction, the cutting movement direction of the laser head in the horizontal plane is the Y-axis direction, and the X-axis direction is perpendicular to both the Y-axis and Z-axis directions.
The embodiment provides a diamond slice processingequipment, including laser system and centre gripping frock:
the laser system comprises a laser, a light path system and a laser head, wherein the laser head structure used by the device is shown in figure 1, the laser head structure comprises a lens group 9, a protective lens 12, a water nozzle 10 and a gas nozzle 11 which are sequentially arranged along the laser light path direction, the water nozzle 10 and the gas nozzle 11 are coaxial with the focal line of the lens group 9, a water inlet cavity is formed between a mounting plate of the protective lens 12 and the water nozzle at intervals, a water inlet 10-1 of the water inlet cavity is positioned at the periphery of the water inlet cavity, an air inlet cavity is formed between the water nozzle 10 and the gas nozzle 11 at intervals, and an air inlet 11-1 of the air inlet cavity is positioned at the periphery of the air inlet cavity. The diameter of the nozzle orifice of the water nozzle 10 is 40-90 micrometers, the nozzle orifice of the water nozzle 10 is in a diffuse conical shape along the laser path direction, the nozzle orifice of the gas nozzle 11 is in a contracted conical shape, the diameter of the nozzle orifice of the gas nozzle 11 is larger than that of the nozzle orifice of the water nozzle 10, so that a biconical cavity is formed at the laser passing position between the water nozzle and the gas nozzle, laser energy can be prevented from depositing on a nozzle material, thermal damage of a laser head is avoided, and energy loss is reduced. In the above-mentioned laser system, the laser that the laser instrument sent is penetrated into the spout of water nozzle 10 through the conduction of optical path system and the focus plastic of mirror group 9, and the chamber that intakes simultaneously is intake and is spouted in water nozzle 10 spout and form tiny water column, and then laser forms total reflection in the water column, produces water guide beam, simultaneously, the chamber that intakes is intake and is spouted from gas nozzle 11, forms the protection air curtain at water guide beam periphery, has isolated external impurity interference on the one hand, on the other hand realizes the direction through the air curtain to the extension water guide beam's the ejection distance, improvement cutting distance.
As shown in fig. 2 and 3, the clamping tool comprises a base 1, a first clamping seat 8 is fixedly arranged at one end of the base 1 along the X-axis direction, two sliding guide rails 2 are arranged at the other end of the base 1, the sliding guide rails 2 are of a smooth sliding block structure, the two sliding guide rails 2 are parallel to each other and along the X-axis direction, a second clamping seat 3 is arranged on the two sliding guide rails 2, a locking handle 5 is further arranged on the second clamping seat 3, and the second clamping seat 3 can be locked on the sliding guide rails by screwing the locking handle 5;
the first clamping seat 8 is internally provided with a hollow motor 7, a rotor of the hollow motor 7 is of an axial through structure, an active rotating shaft 6 is fixedly arranged in the rotor of the hollow motor 7, the active rotating shaft 6 is connected with the first clamping seat 8 in series along the X-axis direction, and a bearing group is arranged between the active rotating shaft 6 and the first clamping seat 8; the second clamping seat 3 is internally penetrated and provided with a driven rotating shaft 4, a bearing assembly is arranged between the driven rotating shaft 4 and the second clamping seat 3, the two bearing seat assemblies adopt opposite angular contact bearings, the driving rotating shaft 6 and the driven rotating shaft 4 are arranged in a collinear way along the X-axis direction, the opposite ends of the driving rotating shaft 6 and the driven rotating shaft 4 are respectively provided with a jacking disc, and the two jacking discs can oppositely clamp diamond substrates to be processed.
In other embodiments, in order to realize opposite-top clamping, the driving shaft may be configured to be capable of extending and retracting along the X-axis direction relative to the first clamping seat 8, or the driven shaft may be capable of extending and retracting along the X-axis direction relative to the second clamping seat 3, or both shafts may be capable of extending and retracting.
Example two
According to the processing device provided in the first embodiment, the present embodiment further provides a diamond slice process, and the processing device for diamond slices provided in the first embodiment is adopted, including the following steps:
s1, clamping a diamond substrate on a clamping tool;
s2, laser cutting, namely, a laser head emits water to guide laser to cut the upper part of the diamond substrate;
s3, driving the diamond base material by driving the driving rotating shaft and driving the driven rotating shaft to rotate 180 degrees, so that the lower part of the unprocessed diamond base material rotates to the upper part;
s4, the laser head emits water guide laser again to cut the current area (namely, the lower part which is turned over to the upper part) of the diamond substrate;
if the diamond substrate is not completely cut after the two times of cutting, repeating the steps S3 and S4 until the diamond substrate is completely cut;
s5, obtaining the diamond slice.
Wherein the wavelength of the water guide laser is 532nm, and the laser power is 15-35W.
Example III
Based on the diamond slice processing technology provided in the second embodiment, the diamond slice manufactured by the technology is provided, as shown in fig. 4, the surface roughness of the diamond slice is not higher than 10.925nm, and a square slice with the diameter of 7mm multiplied by 7mm or a wafer with the diameter of 7mm or more can be obtained, and in the diamond slice, the diamond crystal surfaces are (001), (111) and (110), and the surface orientation is 0-5 degrees.
The method for expressing three indices of crystal faces is exemplified by the cubic crystal form in the equiaxed crystal system, and the calibration process is as follows: obtaining the intercept of the crystal face to be specified in three coordinates (X, Y, Z directions defined in non-embodiment one) of x, y and z; taking the reciprocal of each intercept; the three reciprocal values are converted into prime integers, and the indexes of the crystal face are marked as (hk l) by adding parentheses, which are known in the art and are not described herein.
According to the processing device and the processing technology, the water guide laser protected by the air curtain is used for diamond slice processing, and the high-speed water flow is used as a light guide medium, so that the laser emission distance is prolonged, the energy loss is reduced, the heat generated by the laser can be rapidly taken away, the thermal stress is obviously reduced, and the taper defect is eliminated; the clamping tool capable of rotating is utilized, the diamond substrate is enabled to rotate, the cutting position is adjusted, the low-stress cutting of the inch-grade diamond can be achieved by matching with the prolonged water guide laser, the diamond slice with a larger size is obtained, the surface quality of the diamond slice is better, and the smoothness is higher.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The utility model provides a diamond slice processingequipment, includes laser system and centre gripping frock, its characterized in that:
the laser system comprises a laser head, wherein the laser head comprises a lens group, a water nozzle and a gas nozzle which are sequentially arranged along the laser path direction, and the water nozzle and the gas nozzle are coaxial with the focal line of the lens group;
the clamping tool comprises a rotary clamping part, the rotary clamping part is used for fixing a diamond substrate to be processed and driving the diamond substrate to rotate, and a rotating shaft of the rotary clamping part is perpendicular to the direction of a laser path.
2. The diamond slice machining device according to claim 1, wherein the clamping fixture comprises a base (1), a rotating shaft provided with a rotary clamping part is arranged along the X-axis direction, a first clamping seat (8) and a second clamping seat (3) are arranged on the base (1), a first jacking part is arranged on the first clamping seat (8), a second jacking part is arranged on the second clamping seat (3), the first jacking part and the second jacking part are oppositely arranged and can rotate along the X-axis, and a rotation driving mechanism is arranged between the first jacking part and the first clamping seat (8) and/or between the second jacking part and the second clamping seat (3);
the first clamping seat (8) and the second clamping seat (3) can move relatively along the X-axis direction, and/or the first propping part can stretch and retract relatively to the first clamping seat (8) along the X-axis direction, and/or the second propping part can stretch and retract relatively to the second clamping seat (3) along the X-axis direction.
3. The diamond slice machining device according to claim 2, wherein the first clamping seat (8) is fixedly arranged at one end of the base (1) along the X-axis direction, the sliding guide rail (2) is arranged at the other end of the base (1), and the second clamping seat (3) is arranged on the sliding guide rail (2).
4. The diamond slice machining device according to claim 2, wherein the first tightening part comprises an active rotating shaft (6), the active rotating shaft (6) penetrates through the first clamping seat (8), the rotating driving mechanism is a hollow motor (7) and is arranged inside the first clamping seat (8), and the active rotating shaft (6) is fixedly connected with a rotor of the hollow motor (7);
the second jacking part comprises a driven rotating shaft (4), the driven rotating shaft (4) penetrates through the second clamping seat (3), and the driven rotating shaft (4) is connected with the second clamping seat (3) through a bearing assembly;
the driving rotating shaft (6) and the driven rotating shaft (4) are arranged along the X-axis direction in a collinear manner, and the opposite ends of the driving rotating shaft (6) and the driven rotating shaft (4) are respectively provided with a jacking disc.
5. The diamond slice machining device according to claim 1, wherein the water nozzle (10) has a nozzle opening diameter of 40-90 microns.
6. The diamond slice processing device according to claim 1, wherein the nozzle of the water nozzle (10) is in a diffused conical shape along the direction of the laser light path, the nozzle of the gas nozzle (11) is in a contracted conical shape, and the diameter of the large end of the nozzle of the gas nozzle (11) is larger than the diameter of the large end of the nozzle of the water nozzle (10).
7. A diamond slicing process, characterized in that a diamond slicing apparatus according to any one of claims 1 to 6 is used, comprising the steps of:
s1, clamping a diamond substrate on a clamping tool;
s2, laser cutting, namely, a laser head emits water to guide laser to cut the diamond substrate;
s3, rotating the clamping part to rotate the diamond substrate by an angle A;
s4, the laser head emits water guide laser again to cut the diamond substrate;
s5, obtaining the diamond slice.
8. The diamond chip processing process according to claim 7, wherein the water guide laser wavelength is 532nm, the laser power is 15-35W, and the water pressure of the water nozzle is 2-4MPa.
9. The diamond chip machining process according to claim 7, wherein the rotation angle is 180 °, and when the diamond substrate is not completely cut, the steps S3 and S4 are repeated until the diamond substrate is completely cut and a diamond chip is obtained.
10. A diamond slice is characterized in that the surface roughness of the diamond slice is not higher than 10.925nm, the surfaces are (001), (111) and (110), the surface orientation is 0-5 degrees, and the diamond slice is a square slice with the shape of not less than 7mm multiplied by 7mm or a wafer with the diameter of not less than 7 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311604510.5A CN117428347A (en) | 2023-11-28 | 2023-11-28 | Diamond slice processing device and technology and diamond slice |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311604510.5A CN117428347A (en) | 2023-11-28 | 2023-11-28 | Diamond slice processing device and technology and diamond slice |
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| CN117428347A true CN117428347A (en) | 2024-01-23 |
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| CN202311604510.5A Pending CN117428347A (en) | 2023-11-28 | 2023-11-28 | Diamond slice processing device and technology and diamond slice |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117733375A (en) * | 2024-02-18 | 2024-03-22 | 河南景链新材料有限公司 | Laser processing device for diamond production |
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- 2023-11-28 CN CN202311604510.5A patent/CN117428347A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117733375A (en) * | 2024-02-18 | 2024-03-22 | 河南景链新材料有限公司 | Laser processing device for diamond production |
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