CN117423636A - Pre-wetting chamber internal and external air pressure balance control device and method - Google Patents

Pre-wetting chamber internal and external air pressure balance control device and method Download PDF

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Publication number
CN117423636A
CN117423636A CN202210814990.7A CN202210814990A CN117423636A CN 117423636 A CN117423636 A CN 117423636A CN 202210814990 A CN202210814990 A CN 202210814990A CN 117423636 A CN117423636 A CN 117423636A
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China
Prior art keywords
prewetting
air inlet
cavity
air
outside
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Pending
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CN202210814990.7A
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Chinese (zh)
Inventor
王辰
王坚
杨宏超
贾照伟
王晖
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ACM Research Shanghai Inc
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ACM Research Shanghai Inc
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Priority to CN202210814990.7A priority Critical patent/CN117423636A/en
Publication of CN117423636A publication Critical patent/CN117423636A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)

Abstract

The invention provides a device and a method for controlling the balance of air pressure inside and outside a prewetting cavity, wherein an air inlet and an air inlet pipeline connected with the air inlet are arranged on the prewetting cavity, the air inlet pipeline is connected with the air pressure outside the prewetting cavity, so that the air pressure inside and outside the prewetting cavity is balanced, an installation detection part is not required to be additionally arranged, and meanwhile, the extra operation is not required, so that water on the inner wall of the prewetting cavity can be well prevented from splashing outwards to a sensor outside the prewetting cavity when the prewetting cavity is opened to take out a wafer after the prewetting cavity is broken in vacuum, the phenomenon of interference is generated, the occurrence of false alarm of the sensor is prevented, and the processing efficiency of the wafer is improved.

Description

Pre-wetting chamber internal and external air pressure balance control device and method
Technical Field
The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a prewetting cavity internal and external air pressure balance control device and method.
Background
In the integrated circuit manufacturing process, the prewetting cavity of the electroplating equipment provides a vacuum environment for the wafer and simultaneously prewettes the wafer, namely, the wafer is plated with a water film layer in the vacuum environment. After the wafer is subjected to the prewetting process in the prewetting cavity, air or nitrogen is introduced into the prewetting cavity to break the vacuum environment, so that the air pressure in the prewetting cavity is balanced with the external air pressure, and then the subsequent wafer processing step can be performed.
In the existing design, the air is introduced into the pre-wetting cavity, specifically, the top of the pre-wetting cavity is provided with an air vent, the air vent is connected with an air pipe, the air pipe is used for conveying air, and air or nitrogen is introduced into the pre-wetting cavity through the air vent, so that the purpose that the inside of the pre-wetting cavity is balanced with the atmospheric pressure outside the pre-wetting cavity is achieved.
Disclosure of Invention
In the actual development process, after the process of prewetting the wafer is finished, when the vacuum environment in the prewetting cavity is broken through introducing gas into the prewetting cavity, the air inlet valve is connected with a factory high-pressure nitrogen source, the air source from the factory has high pressure, on one hand, overshoot is generated in the process of venting to the atmospheric pressure, and the pressure in the prewetting cavity is higher than the ambient pressure, so that the edge of the prewetting cavity splashes out. The concrete steps are as follows: when the next process is needed to be carried out on the wafer, the prewetting cavity needs to be opened, but at the moment of opening the prewetting cavity, because the air pressure in the prewetting cavity is relatively high, water condensed on the inner wall of the prewetting cavity is easy to splash outside the prewetting cavity, and the result is that: at the moment of opening the prewetting chamber, water on the inner wall of the prewetting chamber splashes outwards and falls onto the leak-proof plate, thereby causing a sensor arranged on the leak-proof plate to alarm. Under the conditions that false alarms frequently occur and specific reasons of the alarms cannot be directly determined by staff, in order to ensure normal operation of wafer processing, a machine is stopped for safety check, so that the efficiency of wafer processing is greatly affected.
On the other hand, the pressure is higher to the impact in the cavity, so that the surface of the wafer is easy to blow dry, and the main purpose of the process is to pre-wet the wafer, so that the pre-wetting effect is affected if the surface of the wafer is blow-dried.
In order to solve the above problems, the present invention provides a pre-wetting chamber internal and external air pressure balance control device, comprising:
the air inlet is formed in the prewetting cavity;
one end of the air inlet pipeline is connected with the air inlet, and the other end of the air inlet pipeline is communicated with the atmospheric pressure outside the prewetting cavity;
the switch valve is arranged on the air inlet pipeline;
and after the prewetting process of the wafer is finished, the switch valve is opened, and the inside of the prewetting cavity is communicated with the atmospheric pressure outside the prewetting cavity through the air inlet and the air inlet pipeline so as to enable the atmospheric pressure inside the prewetting cavity to return to normal pressure.
According to a specific implementation manner of the embodiment of the application, the air inlet is arranged on the upper shell of the prewetting cavity.
According to a specific implementation manner of the embodiment of the application, the air inlet is arranged on the lower shell of the prewetting cavity.
According to a specific implementation manner of the embodiment of the application, the level of the air inlet is lower than the level of a wafer chuck used for holding the wafer inside the pre-wetting chamber.
According to a specific implementation manner of the embodiment of the application, the air inlet is arranged at the bottom of the lower shell of the prewetting cavity.
According to a specific implementation manner of the embodiment of the application, a filter is arranged on the air inlet pipeline.
According to a specific implementation manner of the embodiment of the application, a muffler or a buffer is arranged on the air inlet pipeline.
The invention also provides a control method for the balance of the air pressure inside and outside the prewetting cavity, which comprises the following steps:
an air inlet communicated with the inside of the prewetting cavity is arranged on the prewetting cavity, the air inlet is connected with an air inlet pipeline, the air inlet pipeline is connected with the atmospheric pressure outside the prewetting cavity, and a switch valve is arranged on the air inlet pipeline;
after the wafer prewetting process is completed, the switch valve is opened, and the inside of the prewetting cavity is communicated with the atmospheric pressure outside the prewetting cavity through the air inlet and the air inlet pipeline so as to enable the atmospheric pressure inside the prewetting cavity to return to normal pressure.
According to a specific implementation manner of the embodiment of the application, the method further comprises the following steps: a filter is disposed on the air intake duct.
According to a specific implementation manner of the embodiment of the application, the method further comprises the following steps: and the air inlet is arranged on the upper shell of the prewetting cavity.
According to a specific implementation manner of the embodiment of the application, the method further comprises the following steps: and the air inlet is arranged on the lower shell of the prewetting cavity.
According to a specific implementation manner of the embodiment of the application, the level of the air inlet is lower than the level of a wafer chuck used for holding the wafer inside the pre-wetting chamber.
According to a specific implementation manner of the embodiment of the application, the method further comprises the following steps: and the air inlet is arranged at the bottom of the lower shell of the prewetting cavity.
According to a specific implementation manner of the embodiment of the application, a muffler or a buffer is arranged on the air inlet pipeline.
According to the device and the method for controlling the balance of the air pressure inside and outside the prewetting cavity, the air inlet and the air inlet pipeline connected with the air inlet are arranged on the prewetting cavity, the air inlet pipeline is connected with the air pressure outside the prewetting cavity, so that the air pressure inside and outside the prewetting cavity is balanced, an additional installation detection part is not required to be arranged, and meanwhile, the additional operation is not required, so that the phenomenon that water on the inner wall of the prewetting cavity splashes outwards to a sensor outside the prewetting cavity due to the pressure difference when the prewetting process is completed, and interference is generated can be well avoided, the situation that the sensor generates false alarms is prevented, and the wafer processing efficiency is improved.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic cross-sectional view showing a prewetting device according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a pre-wetting chamber when an air inlet is arranged on an upper shell of the pre-wetting chamber according to the embodiment of the invention;
FIG. 3 is a schematic cross-sectional view showing the structure of the pre-wetting chamber when the air inlet is arranged on the side wall of the lower shell of the pre-wetting chamber in the embodiment of the invention; and
fig. 4 is a schematic cross-sectional view of the pre-wetting chamber when the air inlet is arranged at the bottom of the lower housing of the pre-wetting chamber in the embodiment of the invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, fig. 1 is a schematic cross-sectional structure of a pre-wetting apparatus according to an embodiment of the invention. As shown in fig. 1, the apparatus includes a pre-wetting chamber 100, a chuck 300 for placing and fixing a wafer 200 is disposed in the pre-wetting chamber 100, the chuck 300 is driven to rotate by a driving mechanism 400, and a magnetic fluid sealing device 500 is disposed outside the driving mechanism 400 to protect the driving mechanism 400 from sealing. Wherein the pre-wetting chamber 100 comprises an upper housing 101 and a lower housing 102.
The traditional wafer prewetting process comprises the following specific steps: placing a wafer 200 to be pre-wetted in the pre-wetting chamber 100; vacuumizing the prewetting chamber 100to reach a vacuum state, wherein the pressure is generally lower than 100Torr; in a vacuum state, a desired prewetting liquid, most commonly ultrapure water, is introduced into the prewetting chamber 100, the ultrapure water is sprayed on the wafer upper surface through a plurality of nozzles at the top of the prewetting chamber 100to cover the entire wafer 200 surface, and the ultrapure water enters a fine open-pore structure on the wafer 200 in the vacuum state. The opening size of the open cell structure on the wafer 200 is typically from 0.1um to 200um, and the depth of the open cell structure on the wafer 200 varies from 0.1um to 500 um. Under the vacuum condition, the open-pore structure on the wafer 200 and the surface of the wafer 200 are well pre-wetted, the whole microstructure can be filled with the pre-wetting liquid, the pre-wetting process is finished after the wafer 200 is wetted and infiltrated by the pre-wetting liquid, and air or nitrogen is injected into the pre-wetting chamber 100; the prewet chamber 100 is returned to the normal pressure state to complete the prewet process.
In the actual process, after the process of pre-wetting the wafer 200 is completed, the method of restoring the pre-wetting chamber 100to the normal pressure state is to introduce gas into the pre-wetting chamber 100 in the vacuum state. When the air is introduced into the pre-wetting cavity 100to break the vacuum environment in the pre-wetting cavity 100, on one hand, overshoot is generated in the process of ventilation to the atmospheric pressure, so that the edge of the pre-wetting cavity 100 is easy to splash out when the pre-wetting cavity is opened; on the other hand, the high pressure impacts the cavity, which easily causes the surface of the wafer 200 to be dried, and affects the process quality.
After carrying out targeted research on the problems found in the actual process, the invention provides a prewetting chamber internal and external air pressure balance control device, which comprises: an air inlet 103 arranged on the prewetting chamber 100, an air inlet pipeline 106 connected with the air inlet 103, and an on-off valve 600 arranged on the air inlet pipeline 106. Specifically, one end of the air inlet pipe 106 is connected to the air inlet 103, the other end of the air inlet pipe 106 is connected to the atmospheric pressure outside the prewetting chamber 100, and the air inlet pipe 106 is connected to the inside and the outside of the prewetting chamber 100 through the air inlet 103. After the wafer pre-wetting process is completed, the switch valve 600 is opened, and the interior of the pre-wetting chamber 100 is communicated with the atmospheric pressure outside the pre-wetting chamber 100 through the air inlet 103 and the air inlet pipeline 106, so that the atmospheric pressure inside the pre-wetting chamber 100 is restored to normal pressure.
The invention also provides a method for controlling the balance of the air pressure inside and outside the prewetting cavity, and the cleaning method is carried out by adopting the device for controlling the balance of the air pressure inside and outside the prewetting cavity.
The method for controlling the balance of the air pressure inside and outside the prewetting cavity comprises the following steps: after the prewetting process of the wafer is completed, a switch valve arranged on an air inlet pipeline is opened, and the inside of the prewetting cavity is communicated with the atmospheric pressure outside the prewetting cavity through an air inlet arranged on the prewetting cavity and the air inlet pipeline connected with the air inlet so as to enable the atmospheric pressure inside the prewetting cavity to return to normal pressure.
Specifically, an air inlet 103 communicated with the inside of the pre-wetting chamber 100 is arranged on the pre-wetting chamber 100, the air inlet 103 is connected with an air inlet pipeline 106, the air inlet pipeline 106 is connected with the atmospheric pressure outside the pre-wetting chamber 100, a switch valve 600 is arranged on the air inlet pipeline 106, and the switch valve 600 is opened when air inlet is needed and closed when vacuum is pumped.
Considering that after the process of pre-wetting the wafer 200 is completed, the air pressure inside the pre-wetting chamber 100 needs to be controlled to be the same as the external environment, the process of opening the pre-wetting chamber 100to take the wafer 200 can be ensured to be smoothly performed, so that the liquid inside the pre-wetting chamber 100 is prevented from splashing outwards, and the occurrence of the condition of false alarm of the sensor 700 is avoided. Specifically, the method for controlling the balance of the air pressure inside and outside the prewetting chamber 100 includes: after the pre-wetting process of the wafer 200 is completed, the on-off valve 600 is opened, and the inside of the pre-wetting chamber 100 is communicated with the atmospheric pressure outside the pre-wetting chamber 100 through the air inlet 103 and the air inlet pipe 106, so that the atmospheric pressure inside the pre-wetting chamber 100 is restored to normal pressure. Through setting up air inlet 103 and admission line 106 direct intercommunication external environment, need not the balanced air supply's of additional control and lets in, just can reach the effect of balanced prewetting chamber 100 inside and outside atmospheric pressure, simultaneously because need not the additional control air supply's of letting in, consequently also need not the accurate air supply's of control volume of letting in, only need open the ooff valve 600 that sets up on the admission line 106 and just can reach the balanced effect of the inside and outside atmospheric pressure of prewetting chamber 100 automatically.
After the pre-wetting process is completed, the inside of the pre-wetting chamber 100 is still in a vacuum state, the air pressure outside the pre-wetting chamber 100 is greater than the air pressure inside the pre-wetting chamber 100, and after the switch valve 600 is opened, air outside the pre-wetting chamber 100 enters the inside of the pre-wetting chamber 100 through the switch valve 600 until the air pressure inside the pre-wetting chamber 100 is the same as the air pressure outside the pre-wetting chamber 100, and at the moment, the pre-wetting chamber 100 is opened again, and the wafer 200 is taken away for the next process. Through directly setting up air inlet 103 on the prewetting chamber 100 casing, air inlet 103 connects air inlet pipe 106 and then connects the outside atmospheric pressure of prewetting chamber 100, balance the inside and outside pressure in prewetting chamber 100, need not to set up in addition and detect the purpose that atmospheric pressure can be accomplished to the part of atmospheric pressure, also need not to carry out extra operation to it, exemplary, let in operations such as high-pressure gas in the prewetting chamber 100, can avoid the inside water of prewetting chamber 100 outwards to splash to the outside sensor of prewetting chamber 100 in the moment that prewetting chamber 100 was opened, reach the emergence of the condition that the prevention sensor takes place the false alarm.
Further, in order to prevent contaminants in the air from entering the pre-wetting chamber 100 through the on-off valve 600 and contaminating the environment of the pre-wetting chamber 100 and the wafer 200, the embodiment of the present invention provides a filter 800 on the air inlet pipe 106. When air outside the pre-wetting chamber 100 is to enter the inside of the pre-wetting chamber 100 through the air inlet 103, it is necessary to pass through the filter 800 before entering the pre-wetting chamber 100 through the on-off valve 600.
In an embodiment of the present invention, the air inlet 103 may be provided on the upper housing 101 of the pre-wetting chamber 100. Referring to fig. 2, fig. 2 is a schematic cross-sectional view of the pre-wetting chamber when the air inlet 103 is disposed on the upper housing 101 of the pre-wetting chamber according to an embodiment of the invention. As shown in fig. 2, when the air inlet 103 is disposed on the upper housing 101 of the pre-wetting chamber 100, in the actual installation process, because the space on the upper portion of the pre-wetting chamber 100 is larger, the space available for installing the air inlet pipe 106 and the on-off valve 600 is larger, and in the process of installing the air inlet pipe 106 and the on-off valve 600, the installation and maintenance efficiency is improved to a greater extent because the structure required by the scheme is simpler.
In another embodiment, the air inlet 103 may also be provided on the lower housing 102 of the pre-wetting chamber 100. When the air inlet 103 is disposed on the lower housing 102 of the pre-wetting chamber 100, it includes both the case that the air inlet 103 is disposed on the sidewall of the lower housing 102 of the pre-wetting chamber 100 and the case that the air inlet 103 is disposed on the bottom wall of the lower housing 102 of the pre-wetting chamber 100. Referring to fig. 3, fig. 3 is a schematic cross-sectional view illustrating a structure of the pre-wetting chamber when the air inlet 103 is disposed on a lower housing sidewall of the pre-wetting chamber according to an embodiment of the invention. As shown in fig. 3, when the air inlet 103 is provided on the lower case 102, it is preferable that the air inlet 103 has a lower level than that of the chuck 300 for holding the wafer inside the pre-wet chamber 100 during normal processes. If the level of the air inlet 103 is higher than or equal to the level of the chuck 300 inside the pre-wetting chamber 100 during normal process, when clean air enters the pre-wetting chamber 100, the clean air is easy to directly blow to the wafer 200, so as to blow the surface of the wafer 200 dry, and the pre-wetting effect of the wafer 200 is affected.
In the actual pre-wetting process, the driving mechanism 400 drives the chuck 300 and the wafer 200 to rotate, and the magnetic fluid sealing device 500 arranged outside the driving mechanism 400 works in a wet environment for a long time, and in the prior art, the vent hole is arranged at the top of the pre-wetting chamber 100, when the vacuum environment is broken by inputting gas into the pre-wetting chamber 100, the gas is blown from top to bottom, besides the surface of the wafer 200 is easy to blow dry, the wet gas in the pre-wetting chamber 100 is easy to blow to the magnetic fluid sealing device 500, and in the long time working environment, the wet gas is easy to be brought into the magnetic fluid sealing device 500 through the side wall of the magnetic fluid sealing device 500, so that the magnetic fluid sealing device 500 is corroded, and the normal service life is affected. Referring to fig. 4, fig. 4 is a schematic cross-sectional view illustrating a structure of the pre-wetting chamber when the air inlet 103 is disposed at the bottom of the lower housing of the pre-wetting chamber according to an embodiment of the invention.
Specifically, an air inlet 103 is formed on a housing around the magnetic fluid sealing device 500, an air outlet 104 is formed in a portion, which is in contact with the side wall of the magnetic fluid sealing device 500, of the lower housing 102 from the air inlet 103 along the arrangement direction of the magnetic fluid sealing device 500, a channel between the air inlet 103 and the air outlet 104 is a gas conveying channel 105, an air inlet pipeline 106 is connected to the air inlet 103, and a switch valve 600 is arranged on the air inlet pipeline 106. After the pre-wetting process is completed, the on-off valve 600 is opened, clean air outside the pre-wetting chamber 100 enters the air delivery channel 105 through the air inlet pipe 106 and enters the interior of the pre-wetting chamber 100 through the air outlet 104 until the air pressure inside the pre-wetting chamber 100 is the same as the air pressure outside the pre-wetting chamber 100. In this process, clean air flows into the pre-wetting chamber 100 from the air outlet 104, clean and dry air is delivered into the pre-wetting chamber 100, and the moist air around the magnetic fluid sealing device 500 is carried away from the magnetic fluid sealing device 500, so that the effect of balancing the air pressure inside and outside the pre-wetting chamber 100 and protecting the magnetic fluid sealing device 500 from corrosion is achieved.
In order to ensure cleanliness of clean air during the actual process, a filter 800 is installed on the intake duct 106 to prevent contamination particles from being mixed in the clean air. Illustratively, the filter 800 in embodiments of the present invention has a filter cartridge filter diameter of 0.1um and less. Furthermore, in the embodiment of the present invention, a muffler or a buffer may be further added to the air inlet pipe 106 of the pre-wetting chamber 100to eliminate noise generated during rapid air intake, which is helpful for improving the working environment.
Although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (14)

1. The utility model provides a prewetting intracavity and external atmospheric pressure balance control device which characterized in that: comprising the following steps:
the air inlet is formed in the prewetting cavity;
one end of the air inlet pipeline is connected with the air inlet, and the other end of the air inlet pipeline is communicated with the atmospheric pressure outside the prewetting cavity;
the switch valve is arranged on the air inlet pipeline;
and after the prewetting process of the wafer is finished, the switch valve is opened, and the inside of the prewetting cavity is communicated with the atmospheric pressure outside the prewetting cavity through the air inlet and the air inlet pipeline so as to enable the atmospheric pressure inside the prewetting cavity to return to normal pressure.
2. The apparatus according to claim 1, wherein the air inlet is provided in the upper housing of the pre-wet chamber.
3. The apparatus according to claim 1, wherein the air inlet is provided in the lower housing of the pre-wet chamber.
4. The apparatus of claim 3, wherein the air inlet is at a level lower than a wafer chuck level for holding a wafer inside the pre-wet chamber.
5. The apparatus according to claim 3, wherein the air inlet is provided at the bottom of the lower housing of the pre-wet chamber.
6. The apparatus according to claim 1, wherein a filter is provided in the intake duct.
7. The apparatus according to claim 1, wherein a muffler or a buffer is provided on the intake pipe.
8. The method for controlling the balance of the air pressure inside and outside the prewetting cavity is characterized by comprising the following steps:
an air inlet communicated with the inside of the prewetting cavity is arranged on the prewetting cavity, the air inlet is connected with an air inlet pipeline, the air inlet pipeline is connected with the atmospheric pressure outside the prewetting cavity, and a switch valve is arranged on the air inlet pipeline;
after the wafer prewetting process is completed, the switch valve is opened, and the inside of the prewetting cavity is communicated with the atmospheric pressure outside the prewetting cavity through the air inlet and the air inlet pipeline so as to enable the atmospheric pressure inside the prewetting cavity to return to normal pressure.
9. The method for controlling the balance of air pressure inside and outside a prewetting chamber according to claim 8, further comprising the steps of: a filter is disposed on the air intake duct.
10. The method for controlling the balance of air pressure inside and outside a prewetting chamber according to claim 8, further comprising the steps of: and the air inlet is arranged on the upper shell of the prewetting cavity.
11. The method for controlling the balance of air pressure inside and outside a prewetting chamber according to claim 8, further comprising the steps of: and the air inlet is arranged on the lower shell of the prewetting cavity.
12. The method of claim 11, wherein the air inlet is at a level lower than a wafer chuck level for holding a wafer inside the pre-wet chamber.
13. The method for controlling the balance of air pressure inside and outside a prewetting chamber according to claim 11, further comprising the steps of: and the air inlet is arranged at the bottom of the lower shell of the prewetting cavity.
14. The method for controlling the balance of air pressure inside and outside a prewetting chamber according to claim 8, further comprising the steps of: and a silencer or a buffer is arranged on the air inlet pipeline.
CN202210814990.7A 2022-07-11 2022-07-11 Pre-wetting chamber internal and external air pressure balance control device and method Pending CN117423636A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210814990.7A CN117423636A (en) 2022-07-11 2022-07-11 Pre-wetting chamber internal and external air pressure balance control device and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210814990.7A CN117423636A (en) 2022-07-11 2022-07-11 Pre-wetting chamber internal and external air pressure balance control device and method

Publications (1)

Publication Number Publication Date
CN117423636A true CN117423636A (en) 2024-01-19

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210814990.7A Pending CN117423636A (en) 2022-07-11 2022-07-11 Pre-wetting chamber internal and external air pressure balance control device and method

Country Status (1)

Country Link
CN (1) CN117423636A (en)

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