CN117421864A - Process determination method, process determination device, computer equipment and storage medium - Google Patents

Abstract

This application relates to a process determination method, device, computer equipment and storage medium, and relates to the field of artificial intelligence technology. The method includes: determining the initial resonant frequency and initial quality factor of the device to be analyzed in an initial state; packaging the device to be analyzed according to at least one candidate process to obtain the device to be analyzed in at least one candidate packaging state, and determining the device to be analyzed. Analyze the candidate resonant frequency and candidate quality factor of the device in each candidate packaging state; according to the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state Quality factor determines the target process corresponding to the device to be analyzed from each candidate process. This application can accurately determine the target process from the candidate processes, ensuring that after the device to be analyzed is packaged according to the target process, the quality factor of the device to be analyzed is minimally affected.

Description

Process determination methods, devices, computer equipment and storage media

Technical field

This application relates to the field of artificial intelligence technology, and in particular to a process determination method, device, computer equipment and storage medium.

Background technique

In order to ensure that the device structure of some vulnerable devices is protected from the influence of the external environment, the devices need to be vacuum encapsulated, thereby effectively reducing the air resistance of the device and improving the sensitivity and performance stability of the device. For example, for MEMS (MicroElectro Mechanical Systems, microelectromechanical systems) devices, wafer-level vacuum packaging technology can be used for packaging processing.

However, there are many candidate processes (which can be bonding processes) for vacuum packaging of devices. When using different candidate processes to vacuum package the same device, it will have different impacts on the quality factor of the device. Therefore, now In the prior art, the quality factors of devices after vacuum packaging processing in different candidate processes can be obtained, and the quality factors of each device can be compared to determine the target process that has the smallest impact on the quality factor of the device among the candidate processes.

However, there are many factors that affect the quality factor of the device, and it is impossible to accurately determine the target process that has the least impact on the quality factor of the device from the candidate processes using existing technology.

Contents of the invention

Based on this, it is necessary to provide a process determination method, device, computer equipment and storage medium that can optimize the packaging bonding process in view of the above technical problems.

In the first aspect, this application provides a process determination method, which method includes:

Determine the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state;

Package the device to be analyzed according to at least one candidate process, obtain the device to be analyzed in at least one candidate packaging state, and determine the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state;

According to the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state, the target process corresponding to the device to be analyzed is determined from each candidate process.

In one embodiment, based on the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state, the candidate process is determined from each candidate process. Analyze the target process corresponding to the device, including:

According to the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state, the target quality change of the device to be analyzed in each candidate packaging state is determined quantity;

According to the target quality variation of the device to be analyzed in each candidate packaging state, the target process corresponding to the device to be analyzed is determined from each candidate process.

In one embodiment, based on the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state, it is determined that the device to be analyzed is in each candidate state. The target quality variation in the packaging state includes:

For each candidate packaging state, determine the resonance change amount between the candidate resonant frequency and the initial resonant frequency of the device to be analyzed in the candidate packaging state, and determine the candidate quality factor and initial quality of the device to be analyzed in the candidate packaging state The amount of initial quality variation between factors;

Perform a difference operation on the initial quality change amount and the resonance change amount to obtain the target quality change amount of the device to be analyzed in the candidate packaging state.

In one embodiment, the resonance change amount between the candidate resonant frequency and the initial resonant frequency of the device to be analyzed in the candidate packaging state is determined, and the candidate quality factor and the initial quality of the device to be analyzed in the candidate packaging state are determined. The amount of initial quality variation between factors, including:

Perform a difference operation between the candidate resonant frequency and the initial resonant frequency of the device to be analyzed in the candidate packaging state to obtain the first operation result;

The ratio of the first operation result and the initial resonant frequency is used as the resonance change amount;

Perform a difference operation between the candidate quality factor and the initial quality factor of the device to be analyzed in the candidate packaging state to obtain the second operation result;

The ratio of the second operation result and the initial quality factor is used as the initial quality change amount.

In one embodiment, the target process corresponding to the device to be analyzed is determined from each candidate process based on the target quality change of the device to be analyzed in each candidate packaging state, including:

According to the target quality variation of the device to be analyzed in each candidate packaging state, determine the target packaging state with the smallest target quality variation from each candidate packaging state;

The candidate process corresponding to the target packaging state is used as the target process corresponding to the device to be analyzed.

In one embodiment, determining the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state includes:

Determine the modal mass, modal stiffness and modal damping force coefficient of the device to be analyzed;

According to the modal quality and modal stiffness, determine the initial resonant frequency of the device to be analyzed in the initial state;

According to the modal quality, modal damping force coefficient and initial resonant frequency of the device to be analyzed, the initial quality factor of the device to be analyzed in the initial state is determined.

In a second aspect, this application also provides a process determination device, including:

The first determination module is used to determine the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state;

The second determination module is used to package the device to be analyzed according to at least one candidate process, obtain the device to be analyzed in at least one candidate packaging state, and determine the candidate resonant frequency and candidate quality of the device to be analyzed in each candidate packaging state. factor;

The third determination module is used to determine the candidate resonant frequency and candidate quality factor from each candidate process based on the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state. Analyze the target process corresponding to the device.

In a third aspect, this application also provides a computer device, including a memory and a processor. The memory stores a computer program. When the processor executes the computer program, it implements the following steps:

Determine the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state;

Package the device to be analyzed according to at least one candidate process, obtain the device to be analyzed in at least one candidate packaging state, and determine the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state;

According to the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state, the target process corresponding to the device to be analyzed is determined from each candidate process.

In a fourth aspect, this application also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the following steps are implemented:

Determine the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state;

Package the device to be analyzed according to at least one candidate process, obtain the device to be analyzed in at least one candidate packaging state, and determine the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state;

According to the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state, the target process corresponding to the device to be analyzed is determined from each candidate process.

In a fifth aspect, this application also provides a computer program product, including a computer program that implements the following steps when executed by a processor:

Determine the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state;

Package the device to be analyzed according to at least one candidate process, obtain the device to be analyzed in at least one candidate packaging state, and determine the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state;

According to the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state, the target process corresponding to the device to be analyzed is determined from each candidate process.

The above-mentioned process determination method, device, computer equipment and storage medium are based on the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state, from Determine the target process corresponding to the device to be analyzed among each candidate process. Due to the above process, when this application determines the target process from each candidate process, it not only considers the initial quality factor and the candidate quality factor in each candidate packaging state, but also considers the initial resonant frequency and the candidate resonant frequency in each candidate packaging state. , furthermore, the influence of other factors (resonant frequency) on the change of the quality factor of the device to be analyzed is eliminated, so that the target process can be accurately determined from the candidate processes in the future, ensuring that after the device to be analyzed is packaged according to the target process, the The quality factor of the analytical device is minimally affected.

Description of the drawings

In order to more clearly explain the technical solutions in the embodiments of the present application or related technologies, the drawings needed to be used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings in the following description are only for the purpose of describing the embodiments or related technologies. For some embodiments of the application, those of ordinary skill in the art can also obtain other drawings based on these drawings without exerting creative efforts.

Figure 1 is an application environment diagram of the process determination method provided by the embodiment of the present application;

Figure 2 is a flow chart of a process determination method provided by an embodiment of the present application;

Figure 3 is a flow chart of steps for determining the target process corresponding to the device to be analyzed provided by the embodiment of the present application;

Figure 4 is a flow chart of steps for determining the target quality change provided by an embodiment of the present application;

Figure 5 is a flow chart of steps for determining the initial resonant frequency and initial quality factor provided by the embodiment of the present application;

Figure 6 is a flow chart of another process determination method provided by the embodiment of the present application;

Figure 7 is a structural block diagram of the first process determination device provided by the embodiment of the present application;

Figure 8 is a structural block diagram of the second process determination device provided by the embodiment of the present application;

Figure 9 is a structural block diagram of a third process determination device provided by an embodiment of the present application;

Figure 10 is a structural block diagram of the fourth process determination device provided by the embodiment of the present application;

Figure 11 is a structural block diagram of the fifth process determination device provided by the embodiment of the present application;

Figure 12 is an internal structure diagram of a computer device in one embodiment.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application.

Based on the above situation, the process determination method provided by the embodiment of the present application can be applied in the application environment as shown in Figure 1. In one embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as shown in Figure 1 . The computer device includes a processor, memory, and network interfaces connected through a system bus. Wherein, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes non-volatile storage media and internal memory. The non-volatile storage medium stores operating systems, computer programs and databases. This internal memory provides an environment for the execution of operating systems and computer programs in non-volatile storage media. The database of the computer device is used to store the acquisition data of the process determination method. The network interface of the computer device is used to communicate with external terminals through a network connection. The computer program, when executed by the processor, implements a process determination method.

This application discloses a process determination method, device, computer equipment and storage medium. Through the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, as well as the candidate resonant frequency and the candidate resonant frequency of the device to be analyzed in each candidate packaging state. The candidate quality factor determines the target process corresponding to the device to be analyzed from each candidate process.

In an exemplary embodiment, as shown in FIG. 2 , a process determination method is provided, which is described by taking the method applied to the computer equipment in FIG. 1 as an example, including the following steps 201 to 203 . in:

Step 201: Determine the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state.

Among them, the device to be analyzed can be a MEMS device, and the MEMS device can include: capacitive Z-axis double decoupling tuning fork gyroscope, MEMS microphone, micromotor, micropump, microoscillator, etc.

The initial state refers to the state of the device to be analyzed when it is not packaged, and/or the state of the device to be analyzed at a specified moment. The initial resonant frequency refers to the resonant frequency of the device to be analyzed in the initial state; the initial quality factor refers to the quality factor of the device to be analyzed in the initial state.

As an implementation method, when it is necessary to determine the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, the resonant frequency can be calculated based on the modal mass, modal stiffness and modal damping force coefficient of the device to be analyzed. Formula and quality factor calculation formula to obtain the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state.

Specifically, the modal quality and modal stiffness of the device to be analyzed are substituted into the resonant frequency calculation formula to obtain the initial resonant frequency of the device to be analyzed in the initial state. Further, the initial resonant frequency and modal stiffness of the device to be analyzed in the initial state are obtained. The modal mass and modal damping force coefficient are substituted into the quality factor calculation formula to obtain the initial quality factor of the device to be analyzed in the initial state.

As another implementation method, when it is necessary to determine the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, the device to be analyzed can be tested through the resonant frequency test circuit and the quality factor test circuit to obtain the values of the device to be analyzed respectively. Initial resonant frequency and initial quality factor in the initial state.

Specifically, the device to be analyzed is connected to the resonant frequency test circuit, and the device to be analyzed is tested through the resonant frequency test circuit to obtain the resonant frequency test result, which is the initial resonant frequency of the device to be analyzed in the initial state; The device to be analyzed is connected to the quality factor test circuit, and the device to be analyzed is tested through the quality factor test circuit to obtain the quality factor test result, which is the initial quality factor of the device to be analyzed in the initial state.

As another implementation method, when it is necessary to determine the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, the device to be analyzed can be detected through the resonant frequency optical detector and the quality factor optical detector. According to the detection results, Obtain the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state.

Specifically, the laser is irradiated on the device to be analyzed, the optical signal is received through the resonant frequency optical detector, the optical signal is converted and analyzed into photoelectric signals, and the initial resonant frequency of the device to be analyzed in the initial state is obtained; the laser is irradiated onto the device to be analyzed. On the analysis device, the optical signal is detected and received through the quality factor optical detector, and the optical signal is converted and analyzed into photoelectric signals to obtain the initial quality factor of the device to be analyzed in the initial state.

To sum up, there are many methods for determining the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state. This application does not limit the method of determining the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state.

Step 202: Package the device to be analyzed according to at least one candidate process to obtain the device to be analyzed in at least one candidate packaging state, and determine the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state.

Among them, the candidate process refers to the bonding process used to package the device to be analyzed; the candidate packaging state refers to the state of the device to be analyzed after being packaged by the candidate process. The candidate resonant frequency refers to the resonant frequency of the device to be analyzed in the candidate packaging state; the candidate quality factor refers to the quality factor of the device to be analyzed in the candidate packaging state.

It should be noted that using different candidate processes to package the device to be analyzed will have varying degrees of impact on the quality factor of the device to be analyzed. Therefore, the change in the quality factor of the device to be analyzed before and after packaging can be analyzed to enable subsequent Determine the target process from the candidate process. However, the quality factor will not only be changed by the packaging of the candidate process, but also by the bonding stress. Therefore, the change in the resonant frequency of the device to be analyzed before and after packaging can be obtained and analyzed. quantity to reflect the degree of influence of bonding stress on the quality factor, thereby eliminating the influence of the resonant frequency (bonding stress) on the change in the quality factor of the device to be analyzed, so that the target process can be accurately determined from the candidate processes.

It should be noted that the candidate process includes candidate process technology and candidate process environment, where the candidate process technology refers to the packaging process of the device to be analyzed, and the candidate process environment refers to the environment in which the device to be analyzed is packaged; where, Candidate process environments can be divided into packaging air pressure environment and packaging environment temperature.

It is further explained that the candidate process technologies of each candidate process are different, and/or the candidate process environments are different; among them, the candidate process environments are different including the following three situations: (1) The packaging air pressure environment is different, but the packaging environment temperature is the same; (2) The packaging air pressure environment is the same, but the packaging environment temperature is different; (3) The packaging air pressure environment is different, and the packaging environment temperature is also different.

It should be noted that there are many methods for determining the candidate resonant frequency and candidate quality factor of the device to be analyzed in the candidate packaging state. For example, according to the resonant frequency calculation formula and the quality factor calculation formula, determine the candidate resonant frequency and candidate quality factor of the device to be analyzed in the candidate packaging state. Candidate resonant frequency and candidate quality factor, or, test the device to be analyzed through the resonant frequency test circuit and quality factor test circuit, and determine the candidate resonant frequency and candidate quality factor of the device to be analyzed in the candidate packaging state according to the test results, or, The device to be analyzed is detected through the resonant frequency optical detector and the quality factor optical detector, and based on the detection results, the candidate resonant frequency and candidate quality factor of the device to be analyzed in the candidate packaging state are determined. It can be understood that the candidate resonant frequency and candidate quality factor of the device to be analyzed in the candidate packaging state can be determined in a variety of ways. The method for determining the candidate resonant frequency and candidate quality factor of the device to be analyzed in the candidate packaging state will not be discussed here. Let’s go into details one by one. The above three methods will be explained in detail below:

As an implementation method, when it is necessary to determine the candidate resonant frequency and candidate quality factor of the device to be analyzed in the candidate packaging state, the modal quality, modal stiffness and modal damping force of the device to be analyzed in the candidate packaging state can be Coefficient, through the resonant frequency calculation formula and the quality factor calculation formula, the candidate resonant frequency and candidate quality factor of the device to be analyzed in the candidate packaging state are obtained.

Specifically, the modal quality and modal stiffness of the device to be analyzed in the candidate packaging state are substituted into the resonant frequency calculation formula to obtain the candidate resonant frequency of the device to be analyzed in the candidate packaging state. Further, the candidate resonant frequency of the device to be analyzed in the candidate package is obtained. The candidate resonant frequency in the state, as well as the modal quality and modal damping force coefficient of the device to be analyzed in the candidate packaging state are substituted into the quality factor calculation formula to obtain the candidate quality factor of the device to be analyzed in the candidate packaging state.

As another implementation method, when it is necessary to determine the candidate resonant frequency and candidate quality factor of the device to be analyzed in the candidate packaging state, the device to be analyzed can be tested through the resonant frequency test circuit and the quality factor test circuit to obtain the device to be analyzed respectively. Candidate resonant frequency and candidate quality factor in the candidate packaging state.

Specifically, the device to be analyzed in the candidate package state is connected to the resonant frequency test circuit, and the device to be analyzed in the candidate package state is tested through the resonant frequency test circuit to obtain the resonant frequency test result, which is the result to be analyzed. The candidate resonant frequency of the device in the candidate packaging state; connect the device to be analyzed in the candidate packaging state to the quality factor test circuit, and test the device to be analyzed in the candidate packaging state through the quality factor test circuit to obtain the quality factor test As a result, the result is the candidate quality factor of the device to be analyzed in the candidate package state.

As another implementation method, when it is necessary to determine the candidate resonant frequency and candidate quality factor of the device to be analyzed in the candidate packaging state, the device to be analyzed can be detected through the resonant frequency optical detector and the quality factor optical detector. According to the detection results , obtain the candidate resonant frequency and candidate quality factor of the device to be analyzed in the candidate packaging state.

Specifically, the laser is irradiated onto the device to be analyzed in the candidate packaging state, the optical signal is detected and received through the resonant frequency optical detector, and the photoelectric signal is converted and processed to obtain the candidate resonant frequency of the device to be analyzed in the candidate packaging state. ; Irradiate the laser onto the device to be analyzed in the candidate packaging state, detect and receive the optical signal through the quality factor optical detector, convert and process the photoelectric signal, and obtain the candidate quality factor of the device to be analyzed in the candidate packaging state.

Step 203: Based on the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state, determine the corresponding component of the device to be analyzed from each candidate process. target craft.

It should be noted that when packaging the device to be analyzed, the use of different candidate processes will have varying degrees of impact on the quality factor of the device to be analyzed. However, the quality factor will not only be affected by the candidate process. It changes due to the influence of packaging, and also changes due to bonding stress. Therefore, the change in the resonant frequency of the device to be analyzed before and after packaging can be obtained to reflect the degree of influence of bonding stress on the quality factor, thereby eliminating The influence of the resonant frequency (bonding stress) on the change of the quality factor of the device to be analyzed can be determined from each candidate process to determine the target process corresponding to the device to be analyzed.

Therefore, according to the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state, the device to be analyzed is in the candidate packaging state. According to the target quality variation under the analysis results, the target process corresponding to the device to be analyzed is determined from each candidate process.

Among them, the target quality change amount is used to represent the degree of influence of the candidate process on the quality factor of the device to be analyzed after eliminating the impact of the resonant frequency on the quality factor change of the device to be analyzed.

The target process refers to the candidate process corresponding to the target packaging state. Further, the target packaging state refers to the state that minimizes the target quality change among the candidate packaging states.

In one embodiment of the present application, when it is necessary to determine the target process corresponding to the device to be analyzed from each candidate process, the target quality change amount of the device to be analyzed in each candidate packaging state can be obtained through the quality calculation model, and then, The quality analysis model is used to conduct comparative analysis on the target quality changes, and determine the target process corresponding to the device to be analyzed from each candidate process.

Specifically, the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state are input into the quality calculation model to obtain the output of the quality calculation model. As a result, the result is the target quality change amount of the device to be analyzed in each candidate packaging state. Furthermore, the target quality change amount of the device to be analyzed in each candidate packaging state is input into the quality analysis model. According to the output results of the quality analysis model , determine the target process corresponding to the device to be analyzed from each candidate process.

The above process determination method determines the device to be analyzed from each candidate process based on the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state. Corresponding target technology. Due to the above process, when this application determines the target process from each candidate process, it not only considers the initial quality factor and the candidate quality factor in each candidate packaging state, but also considers the initial resonant frequency and the candidate resonant frequency in each candidate packaging state. , furthermore, the influence of other factors (resonant frequency) on the change of the quality factor of the device to be analyzed is eliminated, so that the target process can be accurately determined from the candidate processes in the future, ensuring that after the device to be analyzed is packaged according to the target process, the The quality factor of the analytical device is minimally affected.

As an embodiment, since the use of different candidate processes to package the device to be analyzed will have varying degrees of impact on the quality factor of the device to be analyzed, however, the quality factor will not only be affected by the packaging of the candidate process. It will also be changed due to bonding stress. Therefore, in order to accurately obtain the target process, the change in the resonant frequency of the device to be analyzed before and after packaging can be obtained to reflect the impact of bonding stress on the quality factor, thereby eliminating resonance. The influence of frequency (bonding stress) on the change in quality factor of the device to be analyzed. Specifically, based on the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, as well as the candidate resonance of the device to be analyzed in each candidate packaging state Frequency and candidate quality factor, determine the target process corresponding to the device to be analyzed from each candidate process, which may specifically include steps 301 to 303, wherein:

Step 301: Based on the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state, determine the quality of the device to be analyzed in each candidate packaging state. Target quality change amount.

It should be noted that since the quality factor will not only be changed by the packaging of the candidate process, but also by the bonding stress, it can be eliminated by determining the change in the resonant frequency of the device to be analyzed before and after packaging. The impact of bonding stress on the quality factor. When it is necessary to determine the target quality change of the device to be analyzed in each candidate packaging state, the specific content may include the following: For each candidate packaging state, determine the state of the device to be analyzed in the candidate packaging state. The resonance change amount between the candidate resonant frequency and the initial resonant frequency under the candidate resonant frequency, and the initial quality change amount between the candidate quality factor and the initial quality factor of the device to be analyzed in the candidate packaging state. For the initial quality change amount and resonance A difference operation is performed on the change amount, and the result of the difference operation is obtained, which is the target quality change amount of the device to be analyzed in each candidate packaging state.

To further explain, when determining the initial quality change and resonance change, the specific content may include the following: for each candidate packaging state, determine the candidate resonant frequency of the device to be analyzed in the candidate packaging state, and compare the candidate resonant frequency with the initial Perform a difference operation on the resonant frequency to obtain the first operation result, and use the ratio of the first operation result to the initial resonant frequency as the resonance change amount between the candidate resonant frequency and the initial resonant frequency of the device to be analyzed in the candidate packaging state; according to For the candidate quality factor of the device to be analyzed in the candidate packaging state, perform a difference operation between the candidate quality factor and the initial quality factor to obtain the second operation result, and use the ratio of the second operation result to the initial quality factor as the ratio of the device to be analyzed in the candidate package state. The initial quality change between the candidate quality factor and the initial quality factor in the candidate packaging state.

In one embodiment of the present application, it is determined that the initial resonant frequency of the device to be analyzed is ω ₀ and the initial quality factor is Q ₀ , and there are two candidate packaging states for the device to be analyzed, and the two candidate packaging states are respectively candidate packaging State 1 and candidate packaging state 2, where the candidate resonant frequency of the device to be analyzed in the candidate packaging state 1 is ω ₁ , the candidate quality factor of the device to be analyzed in the candidate packaging state 1 is Q1, and the candidate quality factor of the device to be analyzed in the candidate packaging state is Q1 The candidate resonant frequency under 2 is ω ₂ , and the candidate quality factor of the device to be analyzed in candidate packaging state 2 is Q ₂ , then the resonance change between the candidate resonant frequency of the device to be analyzed in candidate packaging state 1 and the initial resonant frequency The quantity is: (ω ₁ -ω ₀ )/ω ₀ , and the initial quality change between the candidate quality factor and the initial quality factor of the device to be analyzed in candidate packaging state 1 is: (Q ₁ -Q ₀ )/Q ₀ , the resonance change between the candidate resonant frequency of the device to be analyzed in candidate packaging state 2 and the initial resonant frequency is: (ω ₂ -ω ₀ )/w ₀ , the candidate quality factor of the device to be analyzed in candidate packaging state 2 The initial quality change from the initial quality factor is: (Q ₂ -Q ₀ )/ Q ₀ ; therefore, the target quality change of the device to be analyzed in candidate packaging state 1 is: (Q ₁ -Q ₀ )/ Q ₀ -(ω ₁ -ω ₀ )/ ω ₀ , the target quality change amount of the device to be analyzed in candidate packaging state 2 is: (Q ₂ -Q ₀ )/Q ₀ -(ω ₂ -ω ₀ )/ ω ₀ .

Step 302: Determine the target process corresponding to the device to be analyzed from each candidate process based on the target quality change of the device to be analyzed in each candidate packaging state.

It should be noted that when it is necessary to determine the target process corresponding to the device to be analyzed from each candidate process, the specific content may include the following: According to the target quality change of the device to be analyzed in each candidate packaging state, from each candidate packaging state Determine the target packaging state with the smallest change in target quality; use the candidate process corresponding to the target packaging state as the target process corresponding to the device to be analyzed.

Specifically, according to the target quality change amount of the device to be analyzed in each candidate packaging state, the target quality change amounts in each candidate packaging state are arranged in order from small to large, and the candidate package ranked first in the sorting result is determined. The target quality change amount of the state, the candidate process is the target process corresponding to the device to be analyzed.

In an embodiment of the present application, if the device to be analyzed has three candidate packaging states, namely candidate packaging state 1, candidate packaging state 2 and candidate packaging state 3, where the target quality change amount corresponding to candidate packaging state 1 is M1, the target quality change amount corresponding to candidate packaging state 2 is M2, the target quality change amount corresponding to candidate packaging state 3 is M3, and M1 < M2 < M3, since the target quality change amount M1 corresponding to candidate packaging state 1 is the smallest, Therefore, the candidate process corresponding to candidate packaging state 1 is used as the target process corresponding to the device to be analyzed.

The above process determination method determines the states of the device to be analyzed in each candidate packaging state through the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state. Then, based on the target quality variation of the device to be analyzed in each candidate packaging state, the target process corresponding to the device to be analyzed is determined from each candidate process. Since the above-mentioned process of the target quality change amount in each candidate packaging state of this application is based on the initial resonant frequency, initial quality factor, candidate resonant frequency and candidate quality factor of the device to be analyzed, the target quality change amount is jointly determined. Therefore, this application Compared with the existing technology, the application only determines the target quality change amount through the initial quality factor and candidate quality factors, which is more comprehensive. The obtained target quality change amount can more accurately reflect the degree of change in the quality factor of the device to be analyzed, so that it can be based on The target quality variation selects the target process.

In an exemplary embodiment, as shown in Figure 4, according to the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state , determining the target quality variation of the device to be analyzed in each candidate packaging state, including step 401 and step 402. in:

Step 401: For each candidate packaging state, determine the resonance change amount between the candidate resonant frequency and the initial resonant frequency of the device to be analyzed in the candidate packaging state, and determine the candidate quality factor of the device to be analyzed in the candidate packaging state. The initial quality change from the initial quality factor.

Among them, the resonance change amount refers to the change amount of the candidate resonance frequency of the device to be analyzed in each candidate packaging state compared to the initial resonance frequency, and is used to represent the bonding stress in the candidate process corresponding to each candidate packaging state. Impact on quality factor.

The initial quality change refers to the change in the candidate quality factor of the device to be analyzed in each candidate packaging state compared to the initial quality factor.

In one embodiment of the present application, for each candidate packaging state, when it is necessary to determine the resonance change amount between the candidate resonant frequency and the initial resonant frequency of the device to be analyzed in the candidate packaging state, the following content may be specifically included: : Perform a difference operation between the candidate resonant frequency and the initial resonant frequency of the device to be analyzed in the candidate packaging state to obtain the first operation result; use the ratio of the first operation result and the initial resonant frequency as the resonance variation amount.

To further explain, according to the candidate resonant frequency of the device to be analyzed in the candidate packaging state and initial resonant frequency/> , the candidate resonant frequency of the device to be analyzed in this candidate packaging state/> and initial resonant frequency/> Perform a difference operation to obtain the first operation result/> , convert the first operation result/> and initial resonant frequency/> The ratio of /> as the resonance variation.

According to the above description, the expression (1) that can determine the resonance variation of the device to be analyzed is as follows:

(1)

in, Refers to the resonance change amount,/> Refers to the candidate resonant frequency of the device to be analyzed in the candidate packaging state,/> Refers to the initial resonant frequency of the device to be analyzed in its initial state.

In an embodiment of the present application, when it is necessary to determine the initial quality change between the candidate quality factor and the initial quality factor of the device to be analyzed in the candidate packaging state, the specific content may include the following: the device to be analyzed is in the candidate packaging state A difference operation is performed between the candidate quality factor in the candidate packaging state and the initial quality factor to obtain the second operation result; further, the ratio of the second operation result and the initial quality factor is used as the initial quality change amount.

To further explain, according to the candidate quality factor of the device to be analyzed in the candidate packaging state and initial quality factor/> , the candidate quality factor of the device to be analyzed in this candidate packaging state/> and initial quality factor/> Perform a difference operation to obtain the first operation result/> , convert the first operation result/> and initial quality factor/> The ratio of /> as the initial quality change.

According to the above description, the expression (2) that can determine the initial quality change of the device to be analyzed is as follows:

(2)

in, Refers to the initial quality change of the device to be analyzed,/> Refers to the candidate quality factor of the device to be analyzed in the candidate packaging state,/> Refers to the initial quality factor of the device to be analyzed in its initial state.

Step 402: Perform a difference operation on the initial quality change amount and the resonance change amount to obtain the target quality change amount of the device to be analyzed in the candidate packaging state.

In one embodiment of the present application, when it is necessary to determine the target quality change amount of the device to be analyzed in the candidate packaging state, the specific content may include the following: According to the initial quality change amount and the resonance change amount, the initial quality change amount is A difference operation is performed with the resonance variation, and then, based on the difference operation result, the target quality variation of the device to be analyzed in the candidate packaging state is obtained.

To further explain, according to the initial quality change and resonance change/> , for the initial quality change/> and resonance change/> Perform a difference operation, and then, based on the difference operation result, that is/> , as the target quality variation of the device to be analyzed in this candidate packaging state.

According to the above description, the expression (3) that can determine the target quality change of the device to be analyzed in this candidate packaging state is as follows:

(3)

in, Refers to the target quality change amount of the device to be analyzed in the candidate packaging state,/> Refers to the candidate quality factor of the device to be analyzed in the candidate packaging state,/> Refers to the initial quality factor of the device to be analyzed in its initial state,/> Refers to the candidate resonant frequency of the device to be analyzed in the candidate packaging state,/> Refers to the initial resonant frequency of the device to be analyzed in its initial state.

The above process determination method determines, for each candidate packaging state, the resonance change amount between the candidate resonant frequency of the device to be analyzed in the candidate packaging state and the initial resonant frequency, and the candidate resonant frequency of the device to be analyzed in the candidate packaging state. The initial quality change between the quality factor and the initial quality factor is used to obtain the target quality change of the device to be analyzed in the candidate packaging state, which provides a basis for subsequent determination of the target process corresponding to the device to be analyzed from each candidate process.

In an exemplary embodiment, as shown in FIG. 5 , determining the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state includes steps 501 to 503 . in:

Step 501: Determine the modal mass, modal stiffness and modal damping force coefficient of the device to be analyzed.

Among them, the modal quality refers to the quality of the mode of the device to be analyzed, which can be used to evaluate the mass distribution and corresponding vibration characteristics of the device to be analyzed in a specific vibration mode. Furthermore, the mode of the device to be analyzed is The modes may include drive modes, and/or detection modes.

Among them, the modal stiffness refers to the stiffness in the mode of the device to be analyzed, which can be used to evaluate the vibration characteristics and corresponding structural stiffness of the device to be analyzed in a specific vibration mode.

Among them, the modal damping force coefficient refers to the damping force in the mode of the device to be analyzed, which can be used to evaluate the damping characteristics and corresponding energy dissipation capabilities of the device to be analyzed in a specific vibration mode.

It should be noted that there are many methods to determine the modal quality, modal stiffness and modal damping force coefficient of the device to be analyzed. For example, measuring the device to be analyzed through an optical sensor to determine the modal quality, modal modal quality and modal damping force coefficient of the device to be analyzed. Stiffness and modal damping force coefficient, or, through the modal analysis model, analyze the device to be analyzed to determine the modal mass, modal stiffness and modal damping force coefficient of the device to be analyzed. It can be understood that the modal mass, modal stiffness and modal damping force coefficients of the device to be analyzed can be determined in a variety of ways, and the determination of the modal mass, modal stiffness and modal damping force coefficients of the device to be analyzed is not included here. The methods will be described one by one. The above two methods will be explained in detail below:

As an implementation method, when it is necessary to determine the modal quality, modal stiffness and modal damping force coefficient of the device to be analyzed, the specific content may include the following: using a laser to vibrate the device to be analyzed, and using an optical sensor to vibrate the device to be analyzed. Measurement is performed to obtain the measurement results of the optical sensor, which are the modal quality, modal stiffness and modal damping force coefficient of the device to be analyzed.

As another implementation method, when it is necessary to determine the modal mass, modal stiffness and modal damping force coefficient of the device to be analyzed, the specific content may include the following: input the material properties, geometry and constraint conditions of the device to be analyzed into the model In the modal analysis model, the output result of the modal analysis model is obtained, which is the modal mass, modal stiffness and modal damping force coefficient of the device to be analyzed.

Step 502: Determine the initial resonant frequency of the device to be analyzed in the initial state based on the modal quality and modal stiffness.

It should be noted that when it is necessary to determine the initial resonant frequency of the device to be analyzed in the initial state, the modal quality, modal stiffness and resonant frequency calculation formula of the device to be analyzed can be The state stiffness is substituted into the resonant frequency calculation formula to obtain the initial resonant frequency of the device to be analyzed in the initial state.

Among them, the resonant frequency calculation formula is:

(4)

in, refers to the initial resonant frequency of the device to be analyzed in the initial state, k refers to the modal stiffness of the device to be analyzed, and m refers to the modal quality of the device to be analyzed.

Further explanation, it can be seen from formula (4) that the initial resonant frequency of the device to be analyzed is mainly determined by the modal stiffness and modal quality of the device to be analyzed. Among them, the modal stiffness of the device to be analyzed will be affected by the stress on the device to be analyzed. Changes occur due to the influence of residual stress. For example, if the device to be analyzed is a MEMS device, during the vacuum packaging process of the MEMS device, when the MEMS device structure is bonded under high temperature conditions and returns to room temperature, due to the bonding interface The mismatch in thermal expansion coefficients of heterogeneous materials will produce residual stress in the MEMS device, thereby affecting the modal stiffness of the MEMS device. For example, when residual stress exists in the MEMS device, it will cause the modal stiffness of the MEMS device to increase. , thereby increasing the initial resonant frequency of the MEMS device.

In one embodiment of the present application, if the device to be analyzed contains at least two modes, the initial resonant frequency of each mode is determined respectively. Specifically, if the device to be analyzed is a capacitive Z-axis double decoupled tuning fork gyro, The device to be analyzed includes a driving mode and a detection mode. The driving mode includes driving comb teeth and driving comb teeth, which are used for closed-loop drive control; the detection mode includes detection comb teeth and force feedback comb teeth, which are used to detect closed-loop control. When it is necessary to determine the initial resonant frequency of the device to be analyzed in the initial state, the device to be analyzed can be calculated based on the modal quality, modal stiffness and resonant frequency calculation formula of the device to be analyzed in the driving mode and detection mode. Substituting the modal quality and modal stiffness of the driving mode into the resonant frequency calculation formula, the initial resonant frequency of the driving mode of the device to be analyzed in the initial state is obtained; the modal quality and modal stiffness of the device to be analyzed in the detection mode are obtained. The modal stiffness is substituted into the resonant frequency calculation formula to obtain the initial resonant frequency of the detected mode of the device to be analyzed in the initial state.

To further explain, the expression of the initial resonant frequency of the driving mode of the device to be analyzed in the initial state is:

(5)

in, Refers to the initial resonant frequency of the driving mode of the device to be analyzed in the initial state,/> Refers to the modal stiffness of the device to be analyzed in the driving mode,/> It refers to the modal quality of the device to be analyzed in the driving mode.

To further explain, the expression of the initial resonant frequency of the detected mode of the device to be analyzed in the initial state is:

(6)

in, Refers to the initial resonant frequency of the detected mode of the device to be analyzed in the initial state,/> Refers to the modal stiffness of the device to be analyzed in the detection mode,/> It refers to the modal quality of the device to be analyzed in the detection mode.

Step 503: Determine the initial quality factor of the device to be analyzed in the initial state based on the modal quality, modal damping force coefficient and initial resonant frequency of the device to be analyzed.

It should be noted that when it is necessary to determine the initial quality factor of the device to be analyzed in the initial state, the damping ratio calculation formula can be substituted according to the modal quality, modal damping force coefficient and initial resonant frequency of the device to be analyzed in the driving mode. , obtain the damping ratio of the device to be analyzed in the initial state. Further, according to the damping ratio of the device to be analyzed in the initial state, substitute it into the quality factor calculation formula to obtain the initial quality factor of the device to be analyzed in the initial state.

Among them, the damping ratio calculation formula is:

(7)

in, refers to the damping ratio of the device to be analyzed in the initial state, c refers to the modal damping force coefficient of the device to be analyzed, m refers to the modal mass of the device to be analyzed,/> Refers to the initial resonant frequency of the device to be analyzed in its initial state.

Among them, the quality factor calculation formula is:

(8)

in, Refers to the quality factor of the device to be analyzed in its initial state,/> It refers to the damping ratio of the device to be analyzed in the initial state.

Further explanation, from formulas (7) and (8), it can be seen that the quality factor is mainly related to the damping force coefficient and the initial resonant frequency. Among them, the change of the damping force coefficient mainly comes from the change of the internal air pressure of the package cavity of the device to be analyzed. The greater the air pressure , the greater the damping force coefficient. For example, high-temperature bonding of MEMS devices during the vacuum packaging process may cause outgassing of materials inside the cavity, which in turn causes the air pressure in the MEMS device packaging cavity to rise and the damping force coefficient to increase, thus causing the quality factor decline.

In one embodiment of the present application, if the device to be analyzed contains at least two modes, the initial quality factor of each mode is determined respectively. Specifically, if the device to be analyzed is a capacitive Z-axis double decoupled tuning fork gyro, When it is necessary to determine the initial quality factor of the device to be analyzed in the initial state, the modal mass, modal damping force coefficient and initial resonant frequency of the device to be analyzed in the driving mode can be substituted into the damping ratio calculation formula to obtain the The driving mode damping ratio of the device to be analyzed in the initial state; substituting the modal quality, modal damping force coefficient and initial resonant frequency of the device to be analyzed in the detection mode into the damping ratio calculation formula, we get the device to be analyzed in The detection modal damping ratio in the initial state.

Among them, the expression of the driving mode damping ratio of the device to be analyzed in the initial state is:

(9)

in, Refers to the driving mode damping ratio of the device to be analyzed in the initial state,/> Refers to the driving mode damping force coefficient of the device to be analyzed in the initial state,/> Refers to the modal quality of the device to be analyzed in the driving mode,/> Refers to the initial resonant frequency of the driving mode of the device to be analyzed in the initial state.

Among them, the expression of the detection mode damping ratio of the device to be analyzed in the initial state is:

(10)

in, Refers to the detection modal damping ratio of the device to be analyzed in the initial state,/> Refers to the detected modal damping force coefficient of the device to be analyzed in the initial state,/> Refers to the modal quality of the device to be analyzed in the detection mode,/> Refers to the initial resonant frequency of the detected mode of the device to be analyzed in the initial state.

Further, according to the driving mode damping ratio of the device to be analyzed in the initial state, substitute the quality factor calculation formula to obtain the initial quality factor of the driving mode of the device to be analyzed in the initial state; according to the initial quality factor of the device to be analyzed in the initial state The detection mode damping ratio under is substituted into the quality factor calculation formula to obtain the initial quality factor of the detection mode of the device to be analyzed in the initial state.

Among them, the expression of the initial quality factor of the driving mode of the device to be analyzed in the initial state is:

(11)

in, Refers to the initial quality factor of the driving mode of the device to be analyzed in the initial state,/> It refers to the driving mode damping ratio of the device to be analyzed in the initial state.

Among them, the expression of the initial quality factor of the detection mode of the device to be analyzed in the initial state is:

(12)

in, Refers to the initial quality factor of the driving mode of the device to be analyzed in the initial state,/> It refers to the detection modal damping ratio of the device to be analyzed in the initial state.

In the above process determination method, the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state are obtained through the modal quality, modal stiffness and modal damping force coefficient of the device to be analyzed, which provides a basis for subsequent determination of the initial quality change. Base.

In one embodiment, when it is necessary to determine the target process corresponding to the device to be analyzed, the following process may be included, as shown in Figure 6:

Step 601: Determine the modal mass, modal stiffness and modal damping force coefficient of the device to be analyzed.

Step 602: Determine the initial resonant frequency of the device to be analyzed in the initial state based on the modal quality and modal stiffness.

Step 603: Determine the initial quality factor of the device to be analyzed in the initial state based on the modal quality, modal damping force coefficient and initial resonant frequency of the device to be analyzed.

Step 604: Package the device to be analyzed according to at least one candidate process to obtain the device to be analyzed in at least one candidate packaging state, and determine the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state.

Step 605: For each candidate packaging state, perform a difference operation between the candidate resonant frequency and the initial resonant frequency of the device to be analyzed in the candidate packaging state to obtain a first operation result.

Step 606: Use the ratio of the first calculation result to the initial resonant frequency as the resonance change amount.

Step 607: Perform a difference operation on the candidate quality factor of the device to be analyzed in the candidate packaging state and the initial quality factor to obtain a second operation result.

Step 608: Use the ratio of the second operation result and the initial quality factor as the initial quality change.

Step 609: Perform a difference operation on the initial quality change amount and the resonance change amount to obtain the target quality change amount of the device to be analyzed in the candidate packaging state.

Step 610: According to the target quality change amount of the device to be analyzed in each candidate packaging state, determine the target packaging state with the smallest target quality change amount from each candidate packaging state, and use the candidate process corresponding to the target packaging state as the candidate process corresponding to the device to be analyzed. target craft.

The above process determination method determines the device to be analyzed from each candidate process based on the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state. Corresponding target process. Due to the above process, when this application determines the target process from each candidate process, it not only considers the initial quality factor and the candidate quality factor in each candidate packaging state, but also considers the initial resonant frequency and the candidate resonant frequency in each candidate packaging state. , furthermore, the influence of other factors (resonant frequency) on the change of the quality factor of the device to be analyzed is eliminated, so that the target process can be accurately determined from the candidate processes in the future, ensuring that after the device to be analyzed is packaged according to the target process, the The quality factor of the analytical device is minimally affected.

It should be understood that although the steps in the flowcharts involved in the above embodiments are shown in sequence as indicated by arrows, these steps are not necessarily executed in the order indicated by arrows. Unless explicitly stated in this article, there is no strict order restriction on the execution of these steps, and these steps can be executed in other orders. Moreover, at least some of the steps in the flowcharts involved in the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily executed at the same time, but may be executed at different times. The execution order of these steps or stages is not necessarily sequential, but may be performed in turn or alternately with other steps or at least part of the steps or stages in other steps.

Based on the same inventive concept, embodiments of the present application also provide a process determination device for implementing the above-mentioned process determination method. The solution to the problem provided by this device is similar to the solution recorded in the above method. Therefore, for the specific limitations in one or more process determination device embodiments provided below, please refer to the above limitations on the process determination method. I won’t go into details here.

In an exemplary embodiment, as shown in Figure 7, a process determination device is provided, including: a first determination module 10, a second determination module 20 and a third determination module 30, wherein:

The first determination module 10 is used to determine the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state.

The second determination module 20 is used to package the device to be analyzed according to at least one candidate process, obtain the device to be analyzed in at least one candidate packaging state, and determine the candidate resonant frequency and candidate resonant frequency of the device to be analyzed in each candidate packaging state. Quality factor.

The third determination module 30 is configured to determine from each candidate process based on the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state. The target process corresponding to the device to be analyzed.

The above-mentioned process determination device determines the device to be analyzed from each candidate process based on the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state. Corresponding target technology. Due to the above process, when this application determines the target process from each candidate process, it not only considers the initial quality factor and the candidate quality factor in each candidate packaging state, but also considers the initial resonant frequency and the candidate resonant frequency in each candidate packaging state. , furthermore, the influence of other factors (resonant frequency) on the change of the quality factor of the device to be analyzed is eliminated, so that the target process can be accurately determined from the candidate processes in the future, ensuring that after the device to be analyzed is packaged according to the target process, the The quality factor of the analytical device is minimally affected.

In an exemplary embodiment, as shown in Figure 8, a process determination device is provided, in which the third determination module 30 includes: a first determination unit 31 and a second determination unit 32, wherein:

The first determination unit 31 is used to determine the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state. The target quality change amount in the candidate packaging state.

The second determination unit 32 is configured to determine the target process corresponding to the device to be analyzed from each candidate process based on the target quality change of the device to be analyzed in each candidate packaging state.

In an exemplary embodiment, as shown in Figure 9, a process determination device is provided, in which the first determination unit 31 includes: a first determination sub-unit 311 and a second determination sub-unit 312, wherein:

The first determination subunit 311 is used to determine, for each candidate packaging state, the resonance change amount between the candidate resonant frequency and the initial resonant frequency of the device to be analyzed in the candidate packaging state, and determine the resonant frequency of the device to be analyzed in the candidate package. The initial quality change between the candidate quality factor in the state and the initial quality factor.

The first determination subunit 311 is specifically used to perform a difference operation between the candidate resonant frequency and the initial resonant frequency of the device to be analyzed in the candidate packaging state to obtain the first operation result; and use the ratio of the first operation result to the initial resonant frequency as the resonance The amount of change; perform a difference operation between the candidate quality factor of the device to be analyzed in the candidate packaging state and the initial quality factor to obtain the second operation result; use the ratio of the second operation result and the initial quality factor as the initial quality change amount.

The second determination subunit 312 is used to perform a difference operation on the initial quality change amount and the resonance change amount to obtain the target quality change amount of the device to be analyzed in the candidate packaging state.

In an exemplary embodiment, as shown in Figure 10, a process determination device is provided, in which the second determination unit 32 includes: a third determination sub-unit 321 and a fourth determination sub-unit 322, wherein:

The third determination subunit 321 is configured to determine the target packaging state with the smallest target quality change from each candidate packaging state based on the target quality change of the device to be analyzed in each candidate packaging state.

The fourth determination subunit 322 is used to use the candidate process corresponding to the target packaging state as the target process corresponding to the device to be analyzed.

In an exemplary embodiment, as shown in Figure 11, a process determination device is provided, in which the first determination module 10 includes: a third determination unit 11, a fourth determination unit 12 and a fifth determination unit 13, among which:

The third determination unit 11 is used to determine the modal quality, modal stiffness and modal damping force coefficient of the device to be analyzed.

The fourth determination unit 12 is used to determine the initial resonant frequency of the device to be analyzed in the initial state based on the modal quality and modal stiffness.

The fifth determination unit 13 is used to determine the initial quality factor of the device to be analyzed in the initial state based on the modal quality, modal damping force coefficient and initial resonance frequency of the device to be analyzed.

Each module in the above-mentioned process determination device can be implemented in whole or in part by software, hardware and combinations thereof. Each of the above modules may be embedded in or independent of the processor of the computer device in the form of hardware, or may be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above modules.

In an exemplary embodiment, a computer device is provided. The computer device may be a terminal, and its internal structure diagram may be as shown in FIG. 12 . The computer device includes a processor, memory, input/output interface, communication interface, display unit and input device. Among them, the processor, memory and input/output interface are connected through the system bus, and the communication interface, display unit and input device are connected to the system bus through the input/output interface. Wherein, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes non-volatile storage media and internal memory. The non-volatile storage medium stores operating systems and computer programs. This internal memory provides an environment for the execution of operating systems and computer programs in non-volatile storage media. The input/output interface of the computer device is used to exchange information between the processor and external devices. The communication interface of the computer device is used for wired or wireless communication with external terminals. The wireless mode can be implemented through WIFI, mobile cellular network, NFC (Near Field Communication) or other technologies. The computer program, when executed by the processor, implements a process determination method. The display unit of the computer equipment is used to form a visually visible picture, and may be a display screen, a projection device or a virtual reality imaging device. The display screen can be a liquid crystal display or an electronic ink display. The input device of the computer device can be a touch layer covered on the display screen, or it can be a button, trackball or touch pad provided on the computer device casing, or it can be External keyboard, trackpad or mouse, etc.

Those skilled in the art can understand that the structure shown in Figure 12 is only a block diagram of a partial structure related to the solution of the present application, and does not constitute a limitation on the computer equipment to which the solution of the present application is applied. Specific computer equipment can May include more or fewer parts than shown, or combine certain parts, or have a different arrangement of parts.

In an exemplary embodiment, a computer device is provided, including a memory and a processor. A computer program is stored in the memory. When the processor executes the computer program, it implements the following steps:

Determine the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state;

Package the device to be analyzed according to at least one candidate process, obtain the device to be analyzed in at least one candidate packaging state, and determine the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state;

According to the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state, the target process corresponding to the device to be analyzed is determined from each candidate process.

In one embodiment, the processor also implements the following steps when executing the computer program:

According to the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state, the target quality change of the device to be analyzed in each candidate packaging state is determined quantity;

According to the target quality variation of the device to be analyzed in each candidate packaging state, the target process corresponding to the device to be analyzed is determined from each candidate process.

In one embodiment, the processor also implements the following steps when executing the computer program:

For each candidate packaging state, determine the resonance change amount between the candidate resonant frequency and the initial resonant frequency of the device to be analyzed in the candidate packaging state, and determine the candidate quality factor and initial quality of the device to be analyzed in the candidate packaging state The amount of initial quality variation between factors;

Perform a difference operation on the initial quality change amount and the resonance change amount to obtain the target quality change amount of the device to be analyzed in the candidate packaging state.

In one embodiment, the processor also implements the following steps when executing the computer program:

Perform a difference operation between the candidate resonant frequency and the initial resonant frequency of the device to be analyzed in the candidate packaging state to obtain the first operation result;

The ratio of the first operation result and the initial resonant frequency is used as the resonance change amount;

Perform a difference operation between the candidate quality factor and the initial quality factor of the device to be analyzed in the candidate packaging state to obtain the second operation result;

The ratio of the second operation result and the initial quality factor is used as the initial quality change amount.

In one embodiment, the processor also implements the following steps when executing the computer program:

According to the target quality variation of the device to be analyzed in each candidate packaging state, determine the target packaging state with the smallest target quality variation from each candidate packaging state;

The candidate process corresponding to the target packaging state is used as the target process corresponding to the device to be analyzed.

In one embodiment, the processor also implements the following steps when executing the computer program:

Determine the modal mass, modal stiffness and modal damping force coefficient of the device to be analyzed;

According to the modal quality and modal stiffness, determine the initial resonant frequency of the device to be analyzed in the initial state;

According to the modal quality, modal damping force coefficient and initial resonant frequency of the device to be analyzed, the initial quality factor of the device to be analyzed in the initial state is determined.

In one embodiment, a computer-readable storage medium is provided with a computer program stored thereon. When the computer program is executed by a processor, the following steps are implemented:

Determine the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state;

Package the device to be analyzed according to at least one candidate process, obtain the device to be analyzed in at least one candidate packaging state, and determine the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state;

According to the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state, the target process corresponding to the device to be analyzed is determined from each candidate process.

In one embodiment, the computer program, when executed by the processor, also implements the following steps:

According to the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state, the target quality change of the device to be analyzed in each candidate packaging state is determined quantity;

According to the target quality variation of the device to be analyzed in each candidate packaging state, the target process corresponding to the device to be analyzed is determined from each candidate process.

In one embodiment, the computer program, when executed by the processor, also implements the following steps:

For each candidate packaging state, determine the resonance change amount between the candidate resonant frequency and the initial resonant frequency of the device to be analyzed in the candidate packaging state, and determine the candidate quality factor and initial quality of the device to be analyzed in the candidate packaging state The amount of initial quality variation between factors;

Perform a difference operation on the initial quality change amount and the resonance change amount to obtain the target quality change amount of the device to be analyzed in the candidate packaging state.

In one embodiment, the computer program, when executed by the processor, also implements the following steps:

Perform a difference operation between the candidate resonant frequency and the initial resonant frequency of the device to be analyzed in the candidate packaging state to obtain the first operation result;

The ratio of the first operation result and the initial resonant frequency is used as the resonance change amount;

Perform a difference operation between the candidate quality factor and the initial quality factor of the device to be analyzed in the candidate packaging state to obtain the second operation result;

The ratio of the second operation result and the initial quality factor is used as the initial quality change amount.

In one embodiment, the computer program, when executed by the processor, also implements the following steps:

According to the target quality variation of the device to be analyzed in each candidate packaging state, determine the target packaging state with the smallest target quality variation from each candidate packaging state;

The candidate process corresponding to the target packaging state is used as the target process corresponding to the device to be analyzed.

In one embodiment, the computer program, when executed by the processor, also implements the following steps:

Determine the modal mass, modal stiffness and modal damping force coefficient of the device to be analyzed;

According to the modal quality and modal stiffness, determine the initial resonant frequency of the device to be analyzed in the initial state;

According to the modal quality, modal damping force coefficient and initial resonant frequency of the device to be analyzed, the initial quality factor of the device to be analyzed in the initial state is determined.

In one embodiment, a computer program product is provided, comprising a computer program that when executed by a processor implements the following steps:

Determine the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state;

Package the device to be analyzed according to at least one candidate process, obtain the device to be analyzed in at least one candidate packaging state, and determine the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state;

According to the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state, the target process corresponding to the device to be analyzed is determined from each candidate process.

In one embodiment, the computer program, when executed by the processor, also implements the following steps:

According to the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state, the target quality change of the device to be analyzed in each candidate packaging state is determined quantity;

According to the target quality variation of the device to be analyzed in each candidate packaging state, the target process corresponding to the device to be analyzed is determined from each candidate process.

In one embodiment, the computer program, when executed by the processor, also implements the following steps:

For each candidate packaging state, determine the resonance change amount between the candidate resonant frequency and the initial resonant frequency of the device to be analyzed in the candidate packaging state, and determine the candidate quality factor and initial quality of the device to be analyzed in the candidate packaging state The amount of initial quality variation between factors;

Perform a difference operation on the initial quality change amount and the resonance change amount to obtain the target quality change amount of the device to be analyzed in the candidate packaging state.

In one embodiment, the computer program, when executed by the processor, also implements the following steps:

Perform a difference operation between the candidate resonant frequency and the initial resonant frequency of the device to be analyzed in the candidate packaging state to obtain the first operation result;

The ratio of the first operation result and the initial resonant frequency is used as the resonance change amount;

Perform a difference operation between the candidate quality factor and the initial quality factor of the device to be analyzed in the candidate packaging state to obtain the second operation result;

The ratio of the second operation result and the initial quality factor is used as the initial quality change amount.

In one embodiment, the computer program, when executed by the processor, also implements the following steps:

According to the target quality variation of the device to be analyzed in each candidate packaging state, determine the target packaging state with the smallest target quality variation from each candidate packaging state;

The candidate process corresponding to the target packaging state is used as the target process corresponding to the device to be analyzed.

In one embodiment, the computer program, when executed by the processor, also implements the following steps:

Determine the modal mass, modal stiffness and modal damping force coefficient of the device to be analyzed;

According to the modal quality and modal stiffness, determine the initial resonant frequency of the device to be analyzed in the initial state;

According to the modal quality, modal damping force coefficient and initial resonant frequency of the device to be analyzed, the initial quality factor of the device to be analyzed in the initial state is determined.

It should be noted that the user information (including but not limited to user equipment information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all It is information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data need to comply with relevant regulations.

Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be implemented by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. , when executed, the computer program may include the processes of the above method embodiments. Any reference to memory, database or other media used in the embodiments provided in this application may include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive memory (ReRAM), magnetic variable memory (Magnetoresistive Random) Access Memory (MRAM), Ferroelectric Random Access Memory (FRAM), Phase Change Memory (PCM), graphene memory, etc. Volatile memory may include random access memory (Random Access Memory, RAM) or external cache memory. As an illustration and not a limitation, RAM can be in various forms, such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM). The databases involved in the various embodiments provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include blockchain-based distributed databases, etc., but are not limited thereto. The processors involved in the various embodiments provided in this application may be general-purpose processors, central processing units, graphics processors, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to this.

The technical features of the above embodiments can be combined in any way. To simplify the description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, all possible combinations should be used. It is considered to be within the scope of this manual.

The above embodiments only express several implementation modes of the present application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the patent scope of the present application. It should be noted that, for those of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all fall within the protection scope of the present application. Therefore, the scope of protection of this application should be determined by the appended claims.

Claims (10)

1. A process determination method, characterized in that the method includes: Determine the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state; Perform packaging processing on the device to be analyzed according to at least one candidate process, obtain the device to be analyzed in at least one candidate packaging state, and determine the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state; According to the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state, the corresponding device to be analyzed is determined from each candidate process. target technology. 2. The method according to claim 1, characterized in that, according to the initial resonant frequency and initial quality factor of the device to be analyzed in an initial state, and the candidates of the device to be analyzed in each candidate packaging state, Resonant frequency and candidate quality factor, determine the target process corresponding to the device to be analyzed from each candidate process, including: According to the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate quality factor of the device to be analyzed in each candidate packaging state, it is determined that the device to be analyzed is in each candidate packaging state. The target quality change amount; According to the target quality variation of the device to be analyzed in each candidate packaging state, the target process corresponding to the device to be analyzed is determined from each candidate process. 3. The method according to claim 2, characterized in that, according to the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state, and the candidate resonant frequency and candidate resonant frequency of the device to be analyzed in each candidate packaging state. Quality factor determines the target quality change of the device to be analyzed in each candidate packaging state, including: For each candidate packaging state, determine the resonance change amount between the candidate resonant frequency and the initial resonant frequency of the device to be analyzed in the candidate packaging state, and determine the candidate quality factor and initial quality of the device to be analyzed in the candidate packaging state The amount of initial quality variation between factors; A difference operation is performed on the initial quality change amount and the resonance change amount to obtain the target quality change amount of the device to be analyzed in the candidate packaging state. 4. The method according to claim 3, characterized in that: determining the resonance change amount between the candidate resonant frequency and the initial resonant frequency of the device to be analyzed in the candidate packaging state, and determining the resonant frequency of the device to be analyzed in the candidate packaging state. The initial quality change between the candidate quality factor and the initial quality factor in the packaged state includes: Perform a difference operation between the candidate resonant frequency and the initial resonant frequency of the device to be analyzed in the candidate packaging state to obtain a first operation result; The ratio of the first operation result and the initial resonant frequency is used as the resonance change amount; Perform a difference operation between the candidate quality factor and the initial quality factor of the device to be analyzed in the candidate packaging state to obtain a second operation result; The ratio of the second operation result and the initial quality factor is used as the initial quality change amount. 5. The method according to claim 2, wherein determining the target process corresponding to the device to be analyzed from each candidate process according to the target quality variation of the device to be analyzed in each candidate packaging state includes: According to the target quality variation of the device to be analyzed in each candidate packaging state, determine the target packaging state with the smallest target quality variation from each candidate packaging state; The candidate process corresponding to the target packaging state is used as the target process corresponding to the device to be analyzed. 6. The method of claim 1, wherein determining the initial resonant frequency and initial quality factor of the device to be analyzed in an initial state includes: Determine the modal mass, modal stiffness and modal damping force coefficient of the device to be analyzed; According to the modal quality and the modal stiffness, determine the initial resonant frequency of the device to be analyzed in the initial state; According to the modal quality, modal damping force coefficient and the initial resonant frequency of the device to be analyzed, the initial quality factor of the device to be analyzed in the initial state is determined. 7. A process determination device, characterized in that the device includes: The first determination module is used to determine the initial resonant frequency and initial quality factor of the device to be analyzed in the initial state; The second determination module is used to package the device to be analyzed according to at least one candidate process, obtain the device to be analyzed in at least one candidate packaging state, and determine the candidate resonant frequency of the device to be analyzed in each candidate packaging state. and candidate quality factors; The third determination module is configured to determine the initial resonant frequency and initial quality factor of the device to be analyzed from each candidate based on the initial resonant frequency and initial quality factor of the device to be analyzed in each candidate packaging state. In the process, the target process corresponding to the device to be analyzed is determined. 8. A computer device, comprising a memory and a processor, the memory stores a computer program, wherein the method of any one of claims 1 to 6 is implemented when the processor executes the computer program. step. 9. A computer-readable storage medium with a computer program stored thereon, characterized in that when the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented. 10. A computer program product, comprising a computer program, characterized in that, when executed by a processor, the computer program implements the steps of the method according to any one of claims 1 to 6.