CN117406557A - Heat abstractor and photoetching machine - Google Patents

Heat abstractor and photoetching machine Download PDF

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Publication number
CN117406557A
CN117406557A CN202311416384.0A CN202311416384A CN117406557A CN 117406557 A CN117406557 A CN 117406557A CN 202311416384 A CN202311416384 A CN 202311416384A CN 117406557 A CN117406557 A CN 117406557A
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CN
China
Prior art keywords
heat exchange
exchange plate
heat
circulating pipe
cooling mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311416384.0A
Other languages
Chinese (zh)
Inventor
零萍
陈锡媛
陈超
徐照
涂先勤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhongshan Aiscent Technologies Co ltd
Original Assignee
Zhongshan Aiscent Technologies Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhongshan Aiscent Technologies Co ltd filed Critical Zhongshan Aiscent Technologies Co ltd
Priority to CN202311416384.0A priority Critical patent/CN117406557A/en
Publication of CN117406557A publication Critical patent/CN117406557A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209—Thermal management, e.g. fan control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20281—Thermal management, e.g. liquid flow control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

The invention discloses a heat dissipation device, which comprises: the device comprises a supporting seat, a water cooling mechanism, an air cooling mechanism and a heat exchange disc, wherein the supporting seat is provided with a supporting surface; the water cooling mechanism comprises a water storage bin and a first circulating pipe group, the first circulating pipe group extends to the supporting surface and can cool the supporting surface, the water cooling mechanism comprises a blower and a second circulating pipe group, and the second circulating pipe group extends to the supporting surface and can cool the supporting surface; the heat exchange plate can drive the refrigerant fluid transferred by the first circulating pipe group and the second circulating pipe group to swirl relative to the supporting surface. The contact area between the refrigerant fluid and the heat exchange disc is greatly increased by the vortex flowing refrigerant fluid, and the flow speed of heat at the heat exchange disc can be effectively improved, so that the heat dissipation efficiency can be greatly improved, and the heat at the moving system can be timely discharged.

Description

Heat abstractor and photoetching machine
Technical Field
The invention relates to the technical field of lithography, in particular to a heat dissipation device and a lithography machine.
Background
It is known that in the working process of a photoetching machine, a mask plate needs to be driven to move through a movement system, so that the forming and etching effects of laser on photosensitive adhesive are achieved through the movement path of the mask plate. The motion system will generate a larger heat consumption during operation. At present, the accumulated heat is mainly dissipated by blowing air to the motion system, however, the heat dissipation mode has the problem of low efficiency.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides a heat dissipating device which can efficiently perform heat dissipating operation.
The invention also provides a photoetching machine with the heat dissipation device.
According to an embodiment of the first aspect of the present invention, a heat dissipating device includes: the device comprises a supporting seat, a water cooling mechanism, an air cooling mechanism and a heat exchange disc, wherein the supporting seat is provided with a supporting surface; the water cooling mechanism is arranged on the supporting seat and comprises a water storage bin and a first circulating pipe group, and the first circulating pipe group extends to the supporting surface and can cool the supporting surface; the air cooling mechanism is arranged on the supporting seat, the water cooling mechanism comprises an air blower and a second circulating pipe group, and the second circulating pipe group extends to the supporting surface and can cool the supporting surface; the heat exchange plate is arranged at the supporting surface, and the first circulating pipe group and the second circulating pipe group are connected with the heat exchange plate; the heat exchange plate can drive the refrigerant fluid transferred by the first circulating pipe group and the second circulating pipe group to swirl relative to the supporting surface.
The heat dissipation device provided by the embodiment of the invention has at least the following beneficial effects: the support base may support the motion system through a support surface. When the motion system is required to dissipate heat, the water cooling mechanism and the air cooling mechanism can be started together, and the first circulating pipe group and the second circulating pipe group are used for conveying refrigerant fluid to the heat exchange plate respectively. The heat exchange plate can cool the supporting surface through the refrigerant fluid, so that heat of a motion system in contact with the supporting surface can be rapidly dissipated.
The refrigerant fluid transferred to the heat exchange plate by the first circulating pipe group and the second circulating pipe group can flow on the heat exchange plate in a vortex mode. The contact area between the refrigerant fluid and the heat exchange disc is greatly increased by the vortex flowing refrigerant fluid, and the flow speed of heat at the heat exchange disc can be effectively improved, so that the heat dissipation efficiency can be greatly improved, and the heat at the moving system can be timely discharged.
According to some embodiments of the invention, the water cooling mechanism comprises a first heat exchanger arranged in the supporting seat, and the water storage bin, the first heat exchanger and the heat exchange plate are sequentially connected through the first circulating pipe group.
According to some embodiments of the invention, the air cooling mechanism comprises an air duct disposed within the support base, the air duct having a vent opening communicating outside the support base, at least a portion of the first heat exchanger being located within the air duct.
According to some embodiments of the invention, the air cooling mechanism comprises a compressor and a second heat exchanger, and the blower, the compressor, the second heat exchanger and the heat exchange plate are connected in sequence through the second circulation pipe group.
According to some embodiments of the invention, an air duct is arranged in the supporting seat, the air duct is provided with a ventilation opening extending out of the supporting seat, and an air outlet communicated with the air duct is arranged at the supporting surface; the heat exchange plate is positioned at one end of the air duct, and the second circulating pipe group is respectively connected to two ends of the air duct.
According to some embodiments of the invention, a fan is arranged on the heat exchange plate, and the fan can drive the air flow in the air duct to pass through the water cooling mechanism and the heat exchange plate and flow towards the supporting surface.
According to some embodiments of the invention, the heat exchange plate is provided with a vortex flow passage, and the fan is positioned at the center of the vortex flow passage; the water cooling mechanism and the heat exchange plate are respectively covered on two sides of the vortex flow channel, so that wind flow in the air duct can only flow along the vortex direction of the vortex flow channel.
According to some embodiments of the invention, the heat exchange plate is provided with a water-cooled tube which is reciprocally curled with respect to the heat exchange plate, the water-cooled tube being connected to the first circulation tube group and enabling refrigerant fluid within the first circulation tube group to swirl at the heat exchange plate through the water-cooled tube.
According to some embodiments of the invention, the heat exchanger plate is provided with a plurality of heat conductive pads in contact with the support surface and spacing the heat exchanger plate from the support surface.
A lithographic apparatus according to an embodiment of a second aspect of the present invention includes a heat sink according to an embodiment of the first aspect of the present invention.
The photoetching machine provided by the embodiment of the invention has at least the following beneficial effects: the support base may support the motion system through a support surface. When the motion system is required to dissipate heat, the water cooling mechanism and the air cooling mechanism can be started together, and the first circulating pipe group and the second circulating pipe group are used for conveying refrigerant fluid to the heat exchange plate respectively. The heat exchange plate can cool the supporting surface through the refrigerant fluid, so that heat of a motion system in contact with the supporting surface can be rapidly dissipated.
The refrigerant fluid transferred to the heat exchange plate by the first circulating pipe group and the second circulating pipe group can flow on the heat exchange plate in a vortex mode. The contact area between the refrigerant fluid and the heat exchange disc is greatly increased by the vortex flowing refrigerant fluid, and the flow speed of heat at the heat exchange disc can be effectively improved, so that the heat dissipation efficiency can be greatly improved, and the heat at the moving system can be timely discharged.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic diagram of a heat dissipating device according to an embodiment of the present invention;
FIG. 2 is a schematic view of the interior of the heat sink shown in FIG. 1;
FIG. 3 is a schematic rear view of a heat exchanger plate of the heat sink shown in FIG. 1;
fig. 4 is a schematic front view of a heat exchange plate of the heat dissipating device shown in fig. 1.
Reference numerals: a support base 100; a support surface 150; an air duct 200; a vent 230; an air outlet 250; a water cooling mechanism 300; a water reservoir 310; a first heat exchanger 320; an air cooling mechanism 400; a compressor 410; a blower 420; a second heat exchanger 430; a water-cooled tube 450; a heat exchange plate 500; a swirl flow passage 530; a fan 550; a thermal pad 570;
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present invention and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
Referring to fig. 1, a heat dissipating device includes: the air cooling device comprises a supporting seat 100, a water cooling mechanism 300, an air cooling mechanism 400 and a heat exchange plate 500, wherein the supporting seat 100 is provided with a supporting surface 150; the water cooling mechanism 300 is arranged on the supporting seat 100, and the water cooling mechanism 300 comprises a water storage bin 310 and a first circulating pipe group, wherein the first circulating pipe group extends to the supporting surface 150 and can cool the supporting surface 150; the air cooling mechanism 400 is arranged on the supporting seat 100, the water cooling mechanism 300 comprises a blower 420 and a second circulating pipe group, and the second circulating pipe group extends to the supporting surface 150 and can cool the supporting surface 150; the heat exchange plate 500 is arranged at the supporting surface 150, and the first circulating pipe group and the second circulating pipe group are connected with the heat exchange plate 500; the heat exchange plate 500 can drive the refrigerant fluid transferred from the first circulation tube group and the second circulation tube group to perform vortex flow relative to the supporting surface 150. The support base 100 may support the motion system through the support surface 150. When the heat dissipation needs to be performed on the motion system, the water cooling mechanism 300 and the air cooling mechanism 400 can be started together, and the first circulation tube group and the second circulation tube group are used for conveying the refrigerant fluid to the heat exchange plate 500 respectively. The heat exchange plate 500 can cool the supporting surface 150 by the refrigerant fluid, so that heat of a motion system in contact with the supporting surface 150 can be rapidly dissipated. The refrigerant fluid transferred to the heat exchange plate 500 by the first circulation tube group and the second circulation tube group swirls on the heat exchange plate 500. The contact area between the refrigerant fluid and the heat exchange disc 500 is greatly increased by the refrigerant fluid flowing in the vortex manner, and the flow speed of heat at the heat exchange disc 500 can be effectively increased, so that the heat dissipation efficiency can be greatly improved, and the heat at the moving system can be timely discharged.
Specifically, the first circulation tube group and the second circulation tube group are connected with fluid pumps, so that the refrigerant fluid can be driven to move to the heat exchange plate 500.
In certain embodiments, referring to fig. 2, the water cooling mechanism 300 includes a first heat exchanger 320 disposed within the support 100, and the sump 310, the first heat exchanger 320, and the heat exchange plate 500 are sequentially connected by a first circulation tube group. The reservoir 310 stores therein a liquid for heat exchange. After the first circulation tube group transfers the liquid in the water storage bin 310 to the first heat exchanger 320, the first heat exchanger 320 exchanges heat between the liquid and the fluid at the heat exchange plate 500, so that the fluid flowing to the heat exchange plate 500 becomes a refrigerant fluid, and the heat exchange plate 500 can dissipate heat through the refrigerant fluid, so as to ensure that the heat dissipation effect of the heat exchange plate 500 on the supporting surface 150 can be smoothly performed.
It is contemplated that the water cooling mechanism 300 may also be formed by other components, such as the first circulation tube set directly drives the liquid in the water storage bin 310 to the heat exchange plate 500 for heat dissipation. Therefore, the specific embodiment of the water cooling mechanism 300 is not limited only, but can be adjusted accordingly according to the actual situation, and is not limited herein.
In certain embodiments, referring to fig. 2, the air cooling mechanism 400 comprises an air duct 200 disposed within the support base 100, the air duct 200 having a vent 230 communicating to the exterior of the support base 100, at least a portion of the first heat exchanger 320 being located within the air duct 200. After the blower 420 is started, the air flow will be driven to flow from the ventilation opening 230 into the air duct 200, and flow in the air duct 200. In the process of flowing in the air duct 200, the air flow will contact with the first heat exchanger 320 and take away the heat at the first heat exchanger 320, so that the first heat exchanger 320 can be kept to operate in a lower temperature state, and further the cooling operation of the fluid at the heat exchange disc 500 can be ensured to be smoothly performed.
In certain embodiments, referring to fig. 2, the air cooling mechanism 400 comprises a compressor 410 and a second heat exchanger 430, and the blower 420, the compressor 410, the second heat exchanger 430, and the heat exchange plate 500 are sequentially connected by a second circulation tube group. The compressor 410 can compress the low-pressure gas into high-pressure gas, so that the high-pressure heat dissipation airflow can flow in the second circulation tube group, and the heat dissipation efficiency is improved. The second heat exchanger 430 can exchange heat between the air flow generated by the blower 420 and the compressor 410 and the air flow at the heat exchange plate 500, so that the air flow at the heat exchange plate 500 can be directly and effectively cooled, and the heat dissipation operation at the supporting surface 150 can be smoothly performed.
It is contemplated that air cooling mechanism 400 may also be comprised of other components, such as blower 420 configured to blow air directly against support surface 150. Therefore, the specific embodiment of the air cooling mechanism 400 is not limited only, but can be adjusted accordingly according to the actual situation, and is not limited herein.
In some embodiments, referring to fig. 1, an air duct 200 is disposed in the support base 100, the air duct 200 has a vent 230 extending out of the support base 100, and an air outlet 250 is disposed at the support surface 150 and is in communication with the air duct 200; the heat exchange plate 500 is located at one end of the air duct 200, and the second circulation tube groups are connected to both ends of the air duct 200, respectively. When the blower 420 is activated, air will flow from the vent 230 into the air duct 200. The air flow entering the air duct 200 will not only flow into the second circulation tube group but will also move along the air duct 200 directly towards the heat exchange plate 500. Finally, the cooling effect of the heat exchange plate 500 can be further improved by obtaining the cooling medium wind flow transmitted by the air duct 200 and the second circulating pipe group, thereby effectively achieving the purpose of improving the heat dissipation efficiency.
Specifically, the air outlet 250 and the air vent 230 are provided with a filter screen, so that foreign matters outside are prevented from entering the support 100 and affecting various mechanisms.
In some embodiments, referring to fig. 3, a fan 550 is disposed on the heat exchange plate 500, and the fan 550 can drive the air flow in the air duct 200 to flow through the water cooling mechanism 300 and the heat exchange plate 500 and towards the supporting surface 150. The fan 550 can drive the wind flow at the heat exchange plate 500 to flow towards the supporting surface 150, so that the wind flow and the heat exchange plate 500 are effectively contacted directly and effectively, and the heat dissipation efficiency of the supporting surface 150 to the motion system can be improved. In addition, the air flow passes through the water cooling mechanism 300 before blowing to the supporting surface 150, and the cooling effect of the water cooling mechanism 300 is obtained, so that the temperature of the air flow born by the supporting surface 150 can be effectively reduced, and the supporting surface 150 can be ensured to obtain a sufficient heat dissipation effect.
In certain embodiments, referring to FIG. 3, heat exchange plate 500 is provided with a vortex flow channel 530, and fan 550 is located in the center of vortex flow channel 530; the water cooling mechanism 300 and the heat exchange plate 500 are respectively covered on both sides of the vortex flow channel 530 and enable the wind flow in the wind channel 200 to flow only in the vortex direction of the vortex flow channel 530. Under the guidance and limitation of the wind flow by the water cooling mechanism 300 and the heat exchange plate 500, the wind flow enters the vortex flow channel 530 and moves along the vortex direction of the vortex flow channel. Therefore, the wind flow and the heat exchange plate 500 can be fully contacted in the vortex flow process, so that the heat exchange plate 500 is ensured to obtain sufficient heat dissipation and cooling effects of the wind flow.
In certain embodiments, referring to fig. 3, the heat exchange plate 500 is provided with a water-cooled tube 450, the water-cooled tube 450 being reciprocally coiled with respect to the heat exchange plate 500, the water-cooled tube 450 being connected to the first circulation tube group and enabling refrigerant fluid within the first circulation tube group to swirl at the heat exchange plate 500 through the water-cooled tube 450. After the first circulation tube group conveys the refrigerant fluid into the water-cooling tube 450, the refrigerant fluid will swirl in the water-cooling tube 450 along the curling direction of the water-cooling tube 450, so as to fully improve the contact area and contact time between the refrigerant fluid and the heat exchange plate 500, and further effectively improve the heat dissipation and cooling efficiency of the heat exchange plate 500.
In certain embodiments, referring to FIG. 4, the heat exchange plate 500 is provided with a plurality of thermal pads 570, the thermal pads 570 contacting the support surface 150 and spacing the heat exchange plate 500 from the support surface 150. The thermal pad 570 allows the support surface 150 and the heat exchanger plate 500 to be spread apart so that the gap therebetween will allow airflow. Therefore, the air cooling mechanism 400 can blow air to the part, so that the effect of improving the heat dissipation efficiency is achieved.
An embodiment of a lithographic apparatus according to a second aspect of the present invention includes the above heat dissipating device. The support base 100 may support the motion system through the support surface 150. When the heat dissipation needs to be performed on the motion system, the water cooling mechanism 300 and the air cooling mechanism 400 can be started together, and the first circulation tube group and the second circulation tube group are used for conveying the refrigerant fluid to the heat exchange plate 500 respectively. The heat exchange plate 500 can cool the supporting surface 150 by the refrigerant fluid, so that heat of a motion system in contact with the supporting surface 150 can be rapidly dissipated. The refrigerant fluid transferred to the heat exchange plate 500 by the first circulation tube group and the second circulation tube group swirls on the heat exchange plate 500. The contact area between the refrigerant fluid and the heat exchange disc 500 is greatly increased by the refrigerant fluid flowing in the vortex manner, and the flow speed of heat at the heat exchange disc 500 can be effectively increased, so that the heat dissipation efficiency can be greatly improved, and the heat at the moving system can be timely discharged.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present invention.

Claims (10)

1. A heat sink, comprising:
a support base (100), the support base (100) being provided with a support surface (150);
the water cooling mechanism (300) is arranged on the supporting seat (100), the water cooling mechanism (300) comprises a water storage bin (310) and a first circulating pipe group, and the first circulating pipe group extends to the supporting surface (150) and can cool the supporting surface (150);
the air cooling mechanism (400) is arranged on the supporting seat (100), the water cooling mechanism (300) comprises a blower (420) and a second circulating pipe group, and the second circulating pipe group extends to the supporting surface (150) and can cool the supporting surface (150);
a heat exchange plate (500) arranged at the supporting surface (150), wherein the first circulating pipe group and the second circulating pipe group are connected with the heat exchange plate (500); the heat exchange plate (500) can drive the refrigerant fluid transferred by the first circulating pipe group and the second circulating pipe group to perform vortex flow relative to the supporting surface (150).
2. The heat sink as recited in claim 1, wherein:
the water cooling mechanism (300) comprises a first heat exchanger (320) arranged in the supporting seat (100), and the water storage bin (310), the first heat exchanger (320) and the heat exchange plate (500) are sequentially connected through the first circulating pipe group.
3. The heat sink as recited in claim 2, wherein:
the air cooling mechanism (400) comprises an air duct (200) arranged in the supporting seat (100), the air duct (200) is provided with a ventilation opening (230) communicated to the outside of the supporting seat (100), and at least part of the first heat exchanger (320) is positioned in the air duct (200).
4. The heat sink as recited in claim 1, wherein:
the air cooling mechanism (400) comprises a compressor (410) and a second heat exchanger (430), and the air blower (420), the compressor (410), the second heat exchanger (430) and the heat exchange plate (500) are sequentially connected through the second circulating pipe group.
5. The heat sink as recited in claim 4, wherein:
an air duct (200) is arranged in the support seat (100), the air duct (200) is provided with a ventilation opening (230) extending out of the support seat (100), and an air outlet (250) communicated with the air duct (200) is arranged at the support surface (150); the heat exchange plate (500) is located at one end of the air duct (200), and the second circulating pipe groups are respectively connected to two ends of the air duct (200).
6. The heat sink as recited in claim 5, wherein:
the heat exchange plate (500) is provided with a fan (550), and the fan (550) can drive air flow in the air duct (200) to pass through the water cooling mechanism (300) and the heat exchange plate (500) and flow towards the supporting surface (150).
7. The heat sink as recited in claim 6, wherein:
the heat exchange plate (500) is provided with a vortex flow channel (530), and the fan (550) is positioned in the center of the vortex flow channel (530); the water cooling mechanism (300) and the heat exchange plate (500) are respectively covered on two sides of the vortex flow channel (530) and enable wind flow in the air duct (200) to flow only along the vortex direction of the vortex flow channel (530).
8. The heat sink as recited in claim 1, wherein:
the heat exchange plate (500) is provided with a water-cooled tube (450), the water-cooled tube (450) is curled back and forth relative to the heat exchange plate (500), and the water-cooled tube (450) is connected with the first circulating tube group and enables refrigerant fluid in the first circulating tube group to flow at the heat exchange plate (500) in a vortex mode through the water-cooled tube (450).
9. The heat sink as recited in claim 1, wherein:
the heat exchange plate (500) is provided with a plurality of heat conductive pads (570), the heat conductive pads (570) being in contact with the support surface (150) and spacing the heat exchange plate (500) from the support surface (150).
10. A lithographic apparatus comprising a heat sink according to any one of claims 1 to 9.
CN202311416384.0A 2023-10-27 2023-10-27 Heat abstractor and photoetching machine Pending CN117406557A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311416384.0A CN117406557A (en) 2023-10-27 2023-10-27 Heat abstractor and photoetching machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311416384.0A CN117406557A (en) 2023-10-27 2023-10-27 Heat abstractor and photoetching machine

Publications (1)

Publication Number Publication Date
CN117406557A true CN117406557A (en) 2024-01-16

Family

ID=89490481

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311416384.0A Pending CN117406557A (en) 2023-10-27 2023-10-27 Heat abstractor and photoetching machine

Country Status (1)

Country Link
CN (1) CN117406557A (en)

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