CN117399243A - Dispensing head for chip packaging and working method thereof - Google Patents
Dispensing head for chip packaging and working method thereof Download PDFInfo
- Publication number
- CN117399243A CN117399243A CN202311715613.9A CN202311715613A CN117399243A CN 117399243 A CN117399243 A CN 117399243A CN 202311715613 A CN202311715613 A CN 202311715613A CN 117399243 A CN117399243 A CN 117399243A
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- China
- Prior art keywords
- glue
- ring
- wall
- sleeve
- dispensing head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000003292 glue Substances 0.000 claims abstract description 129
- 238000007789 sealing Methods 0.000 claims abstract description 41
- 210000000056 organ Anatomy 0.000 claims description 72
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 230000009471 action Effects 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000004891 communication Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W90/00—Enabling technologies or technologies with a potential or indirect contribution to greenhouse gas [GHG] emissions mitigation
- Y02W90/10—Bio-packaging, e.g. packing containers made from renewable resources or bio-plastics
Abstract
The invention relates to the technical field of dispensing, in particular to a dispensing head for chip packaging and a working method thereof; the invention provides a dispensing head for chip packaging, which comprises: the fixing sleeve is hollow, and the rubber conveying pipe is fixed in the fixing sleeve; the connecting sleeve is fixed at the lower end of the fixed sleeve, and a containing cavity is formed in the connecting sleeve; the sealing limiting part is arranged in the connecting sleeve in a sliding manner, and is sleeved on the outer wall of the rubber conveying pipe; the dispensing head is suitable for being inserted into the accommodating cavity and is clamped with the sealing limiting part; after dispensing is finished, the outer sleeve of the dispensing head is pushed upwards, and the outer sleeve slides upwards to absorb the glue in the dispensing head under negative pressure, so that the glue is prevented from dripping; when the glue outlet of the dispensing head is blocked, the glue conveying pipe continuously conveys glue into the dispensing head, and the glue is suitable for pushing the sealing limiting part to slide upwards so as to enable the sealing limiting part of the dispensing head to drop.
Description
Technical Field
The invention relates to the technical field of dispensing, in particular to a dispensing head for chip packaging and a working method thereof.
Background
The dispensing head is used as an output element of the dispensing machine and is of a cylindrical or tubular structure, in the dispensing process, the dispensing head is close to the surface of a workpiece, glue is input from one end of the dispensing head, bulge is formed at the output of the other end, and along with the increase of the bulge of the output glue, the glue is attached to the surface of the workpiece to form glue drops.
In the prior art, glue needs to pass through a glue metal joint, a plastic pipe, a special custom metal dispensing head and a linking base from a storage bin to a dispensing head, and the traditional dispensing head has a complex structure; the metal dispensing head and the glue pipe joint are easy to slip and damage the glue pipe. Therefore, it is necessary to develop a dispensing head for chip packaging and a working method thereof.
Disclosure of Invention
The invention aims to provide a dispensing head for chip packaging and a working method thereof.
In order to solve the above technical problems, the present invention provides a dispensing head for chip packaging, comprising:
the glue dispensing device comprises a fixed sleeve, a connecting sleeve, a glue conveying pipe, a glue dispensing head and a sealing limit part, wherein the fixed sleeve is hollow, and the glue conveying pipe is fixed in the fixed sleeve;
the connecting sleeve is fixed at the lower end of the fixed sleeve, and a containing cavity is formed in the connecting sleeve;
the sealing limiting part is arranged in the connecting sleeve in a sliding manner, and is sleeved on the outer wall of the rubber conveying pipe;
the dispensing head is suitable for being inserted into the accommodating cavity and is clamped with the sealing limiting part;
after dispensing is finished, pushing the outer sleeve of the dispensing head upwards, and enabling the outer sleeve to slide upwards to absorb glue in the dispensing head under negative pressure, so that glue dripping is prevented;
when the glue outlet of the dispensing head is blocked, the glue conveying pipe continuously conveys glue into the dispensing head, and the glue is suitable for pushing the sealing limiting part to slide upwards so as to enable the sealing limiting part of the dispensing head to drop.
Preferably, the dispensing head comprises: the outer sleeve, the outer positioning ring, the positioning cylinder and the glue dripping cone are fixed at the lower end of the positioning cylinder, and the glue dripping cone and the positioning cylinder are hollow;
the positioning cylinder is provided with a ring groove along the circumferential direction;
the outer sleeve is sleeved on the outer wall of the glue dropping cone, and the outer sleeve is arranged in the annular groove in a sliding manner;
the outer positioning ring is fixed on the inner wall of the outer sleeve and is suitable for being clamped and sealed with the sealing limiting part;
when the outer sleeve is pushed to move upwards, the outer locating ring is suitable for pushing the sealing limiting part to synchronously move upwards, so that the sealing limiting part can be clamped and sealed with the outer locating ring.
Preferably, the outer positioning ring is in a shape of C, and an opening of the outer positioning ring faces to the inner wall of the connecting sleeve.
Preferably, a convex ring is fixed at the lower end of the outer wall of the rubber conveying pipe, and a slope is arranged at the joint of the convex ring and the rubber conveying pipe;
when the sealing limiting part slides upwards along the convex ring, the inner ring of the sealing limiting part is suitable for contracting to be abutted against the outer wall of the rubber conveying pipe.
Preferably, the outer wall of the convex ring is sleeved with an inner positioning ring, and the inner positioning ring is clamped and sealed with the sealing limiting part.
Preferably, the inner positioning ring is in a shape of C, and an opening of the inner positioning ring faces to the outer wall of the rubber conveying pipe.
Preferably, the seal stopper includes: the two organ plates, the inner positioning block and the outer positioning block are symmetrically arranged, and the two organ plates are circumferentially arranged around the outer wall of the rubber conveying pipe;
the inner positioning block is fixed at the lower end of the inner ring of the organ disk and is suitable for being inserted into the inner positioning ring;
the outer positioning block is fixed at the lower end of the outer ring of the organ disk and is suitable for being inserted into the outer positioning ring.
Preferably, the inner positioning block is arc-shaped, and the outer side of the inner positioning ring is protruded towards the inner positioning ring direction.
Preferably, the outer positioning ring is arc-shaped, and the inner side of the outer positioning block protrudes towards the outer positioning ring.
Preferably, a flexible member is secured between two adjacent organ plates, said flexible member being adapted to seal the gap between the two organ plates.
Preferably, the inner wall of the connecting sleeve is provided with a telescopic groove, the joint of the telescopic groove and the inner wall of the connecting sleeve is provided with an inclined plane, and the telescopic groove is arranged above the convex ring;
the outer sleeve pushes the two organ plates to move upwards, and the inner ring and the outer ring of the organ plates are suitable for being abutted with the side wall of the telescopic groove and the outer wall of the rubber conveying pipe;
the inner positioning block and the outer positioning block are separated from the inner positioning ring and the outer positioning ring respectively.
On the other hand, the invention also provides a working method of the dispensing head for chip packaging, which comprises the following steps:
when the rubber head is installed, the upper end of the outer sleeve moves upwards along the inner wall of the connecting sleeve, and the outer sleeve is suitable for pushing the two organ plates to move upwards;
the inner ring of the organ disk is contracted and slid towards the outer wall of the rubber conveying pipe, and is suitable for being abutted with the outer wall of the rubber conveying pipe;
synchronously, the outer ring of the organ disk expands and slides towards the side wall of the expansion groove, and the outer ring of the organ disk is suitable for being abutted with the side wall of the expansion groove;
at this time, the inner positioning block is suitable for being inserted into the inner positioning ring, and the outer positioning block is suitable for being inserted into the outer positioning ring;
the organ disk slides downwards under the action of the elasticity of the compression spring until the inner ring and the outer ring of the organ disk are respectively abutted with the outer wall of the convex ring and the inner wall of the connecting sleeve, at the moment, the inner positioning block is tightly clamped and sealed with the inner positioning ring, and the outer positioning block is tightly clamped and sealed with the outer positioning ring;
the glue conveying pipe is suitable for conveying glue into the glue dropping cone, and the glue dropping cone is suitable for dispensing glue to the workpiece;
after dispensing, pushing the outer sleeve to move upwards, wherein the outer sleeve is suitable for pushing the two organ plates to move upwards, and the space above the dispensing cone is increased so as to prevent glue in the dispensing cone from dripping downwards;
when the glue outlet of the glue dripping cone is blocked, the glue conveying pipe conveys glue into the glue dripping cone, the glue is suitable for pushing the organ disk to move upwards, the inner ring and the outer ring of the organ disk are respectively abutted with the outer wall of the glue conveying pipe and the side wall of the telescopic groove, and the outer sleeve and the glue dripping cone are suitable for being separated from the outer positioning block.
The dispensing head for chip packaging has the beneficial effects that the effect of rapidly disassembling the dispensing head is realized through the cooperation of the dispensing head and the sealing limiting part, and meanwhile, the outer sleeve moves upwards, so that the glue in the glue dripping cone can be adsorbed upwards, and the glue in the glue dripping cone is prevented from dripping downwards; when the glue dropping cone is blocked, the glue dispensing head can automatically fall off to remind of replacing the glue dispensing head.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a perspective view of a preferred embodiment of a dispensing head for chip packaging in accordance with the present invention;
FIG. 2 is an internal perspective view of a dispensing head for chip packaging according to the present invention;
FIG. 3 is a longitudinal cross-sectional view of the dispensing head and connecting sleeve of the present invention;
FIG. 4 is a perspective view of the dispensing head and seal retainer of the present invention;
fig. 5 is a perspective view of the seal stopper of the present invention.
In the figure:
1. a fixed sleeve; 2. connecting sleeves; 20. a telescopic slot; 21. a receiving chamber; 3. a rubber conveying pipe; 31. a convex ring; 32. an inner positioning ring;
4. dispensing heads; 41. an outer sleeve; 42. an outer positioning ring; 43. a positioning cylinder; 44. a glue dripping cone;
5. sealing limit part; 51. an organ disk; 52. positioning blocks; 53. and an outer positioning block.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In a first embodiment, as shown in fig. 1 to 5, the present invention provides a dispensing head 4 for chip packaging, including: the glue delivery pipe comprises a fixed sleeve 1, a connecting sleeve 2, a glue delivery pipe 3, a glue dispensing head 4 and a sealing limit part 5, wherein the inside of the fixed sleeve 1 is hollow, and the glue delivery pipe 3 is fixed in the fixed sleeve 1; a connecting pipe is fixed at the upper end of the fixed sleeve 1, and the connecting pipe is suitable for communicating the rubber bin with the rubber conveying pipe 3; the fixed sleeve 1 is fixed at the movable end of a mechanical arm, and the mechanical arm is suitable for driving the dispensing head 4 to move so as to facilitate the dispensing work of the workpiece. The connecting sleeve 2 is fixed at the lower end of the fixed sleeve 1, and an accommodating cavity 21 is formed in the connecting sleeve 2; the dispensing head 4 is suitable for shrinking and sliding towards the connecting sleeve 2; the sealing limiting part 5 is arranged in the connecting sleeve 2 in a sliding manner, and the sealing limiting part 5 is sleeved on the outer wall of the rubber conveying pipe 3; the dispensing head 4 is suitable for being inserted into the accommodating cavity 21, and the dispensing head 4 is clamped with the sealing limiting part 5; after the glue bin is pressurized, the glue in the glue bin is suitable for moving into the dispensing head 4 through the connecting pipe and the glue conveying pipe 3, and dispensing the glue to the workpiece through the glue dispensing cone 44. After dispensing, the outer sleeve 41 of the dispensing head 4 is pushed upwards, when the outer sleeve 41 slides upwards, the space at the upper part of the positioning cylinder 43 is increased, the outer sleeve 41 drives the sealing and absorbing part to synchronously move upwards, so that the internal space of the positioning cylinder 43 and the outer sleeve 41 is increased, negative pressure is formed in the positioning cylinder 43 and the outer sleeve 41, the negative pressure is suitable for absorbing glue in the dispensing head 4, and the glue is prevented from dripping through the lower end of the glue dripping cone 44; when the glue outlet of the dispensing head 4 is blocked, the glue conveying pipe 3 continuously conveys glue into the dispensing head 4, and the glue is suitable for pushing the sealing limiting part 5 to slide upwards so as to enable the dispensing head 4 to drop on the sealing limiting part 5. Through the cooperation of the dispensing head 4 and the sealing limiting part 5, the effect of rapidly disassembling the dispensing head 4 is realized, meanwhile, the outer sleeve 41 moves upwards, so that the glue in the glue dripping cone 44 can be adsorbed upwards, and the glue in the glue dripping cone 44 is prevented from dripping downwards; when the dispensing cone 44 is blocked, the dispensing head 4 can automatically drop off to remind the replacement of the dispensing head 4.
Referring to fig. 3 and 4, the dispensing head 4 includes: the outer sleeve 41, the outer positioning ring 42, the positioning cylinder 43 and the glue dripping cone 44, wherein the glue dripping cone 44 is fixed at the lower end of the positioning cylinder 43, and the glue dripping cone 44 and the positioning cylinder 43 are hollow; the glue dropping cone 44 and the positioning cylinder 43 are integrally arranged, a glue outlet is formed in the lower end of the glue dropping cone 44, and glue in the glue dropping cone 44 is suitable for dispensing glue to a workpiece through the glue outlet. The positioning cylinder 43 is provided with a ring groove along the circumferential direction; the annular is internally fixed with a plurality of fixing strips, the fixing strips are radially arranged along the positioning cylinder 43, the outer sleeve 41 is provided with a plurality of vertical grooves matched with the positioning strips, the vertical grooves are axially arranged along the outer sleeve 41, the fixing strips are suitable for sliding in the vertical grooves, damping is arranged between the positioning strips and the outer sleeve 41, namely, when no external force pushes the outer sleeve 41, the outer sleeve 41 does not vertically slide downwards relative to the positioning cylinder 43. The outer sleeve 41 is sleeved on the outer wall of the glue dropping cone 44, and the outer sleeve 41 is arranged in the annular groove in a sliding manner; the inner wall of the outer sleeve 41 is sealed with the inner wall of the annular groove in a sliding manner, and when glue is conveyed into the positioning cylinder 43 through the glue conveying pipe 3, the glue cannot flow into the annular groove through a gap between the positioning cylinder 43 and the outer sleeve 41. The outer positioning ring 42 is fixed on the inner wall of the outer sleeve 41, and the outer positioning ring 42 is suitable for being clamped and sealed with the seal limiting part 5; when the dispensing head 4 is assembled, the outer positioning ring 42 is adapted to push the outer positioning block 53 so that the organ disk 51 can move horizontally upwards. When the outer sleeve 41 is pushed to move upwards, the outer positioning ring 42 is suitable for pushing the seal limiting part 5 to move upwards synchronously, so that the seal limiting part 5 can be clamped and sealed with the outer positioning ring 42.
Referring to fig. 3, the outer positioning ring 42 is in a shape of "C", and the opening of the outer positioning ring 42 faces the inner wall of the connecting sleeve 2. A convex ring 31 is fixed at the lower end of the outer wall of the rubber conveying pipe 3, and a slope is arranged at the joint of the convex ring 31 and the rubber conveying pipe 3; when the sealing limiting part 5 slides upwards along the convex ring 31, the inner ring of the sealing limiting part 5 is suitable for contracting to be abutted against the outer wall of the rubber conveying pipe 3; and in synchronization, the outer ring of the sealing limiting part 5 is suitable for expanding and sliding to be abutted to the side wall direction of the telescopic groove 20, at this time, the inner positioning block 52 is positioned on the upper inner ring of the inner positioning ring 32, the outer positioning block 53 is positioned on the upper outer ring of the outer positioning ring 42, and the outer positioning block 53 is suitable for being inserted into the outer positioning ring 42.
Referring to fig. 3, an inner positioning ring 32 is sleeved on the outer wall of the convex ring 31, and the inner positioning ring 32 is clamped and sealed with the seal limiting portion 5. The inner positioning ring 32 is in a shape of C, and the opening of the inner positioning ring 32 faces the outer wall of the rubber conveying pipe 3. The inner positioning block 52 is adapted to be inserted into the inner positioning ring 32, and the inner positioning ring 32 is adapted to hug and seal the inner positioning block 52 when the inner positioning block 52 is inserted into the inner positioning ring 32.
Referring to fig. 4 and 5, the seal stopper 5 includes: the two organ plates 51, the inner positioning block 52 and the outer positioning block 53 are symmetrically arranged, and the two organ plates 51 are circumferentially arranged around the outer wall of the rubber conveying pipe 3; the organ plate 51 is in a semicircular shape, the positioning block 52 is fixed at the lower end of the inner ring of the organ plate 51, and the positioning block 52 is suitable for being inserted into the inner positioning ring 32; the number of the two positioning blocks 52 is two, and a flexible piece is arranged between the two positioning blocks 52, and when the organ plate 51 contracts and slides towards the outer wall of the rubber conveying pipe 3, the two positioning blocks 52 are suitable for extruding the flexible piece positioned in the middle; the outer positioning block 53 is fixed at the lower end of the outer ring of the organ disk 51, and the outer positioning block 53 is adapted to be inserted into the outer positioning ring 42. The number of the outer positioning blocks 53 is two, and a flexible piece is fixed between the two outer positioning blocks 53.
Preferably, the inner positioning block 52 is arc-shaped, and the outer side of the inner positioning ring 32 is protruded toward the inner positioning ring 32. The outer positioning ring 42 is arc-shaped, and the inner side of the outer positioning block 53 protrudes toward the outer positioning ring 42. A flexible member is fixed between two adjacent organ plates 51, and is adapted to seal a gap between the two organ plates 51. In order to facilitate the downward movement of the organ disk 51, a plurality of compression springs are fixed in the accommodating cavity 21, the lower ends of the compression springs are abutted against the organ disk 51, the outer sleeve 41 pushes the organ disk 51 to move upwards, and after the outer positioning block 53 is inserted into the outer positioning ring 42, the compression springs are suitable for pushing the organ disk 51 and the outer sleeve 41 to move downwards synchronously. The telescopic piece is arranged in the middle of the organ plate 51, when the outer sleeve 41 pushes the organ plate 51 to move upwards to the position above the convex ring 31, the telescopic piece is suitable for pushing the inner ring of the organ plate 51 to be abutted with the outer wall of the rubber conveying pipe 3, the telescopic piece is suitable for synchronously pushing the outer ring of the organ plate 51 to be abutted with the side wall of the telescopic groove 20, and the inner ring and the outer ring of the organ plate 51 extend to two sides respectively, so that the inner positioning block 52 and the outer positioning block 53 can be inserted into the inner positioning ring 32 and the outer positioning ring 42 in a clamping mode.
Referring to fig. 3, a telescopic groove 20 is formed in the inner wall of the connecting sleeve 2, an inclined plane is formed at the joint of the telescopic groove 20 and the inner wall of the connecting sleeve 2, and the telescopic groove 20 is arranged above the convex ring 31; wherein, the outer sleeve 41 pushes the two organ plates 51 to move upwards, and the inner and outer rings of the organ plates 51 are suitable for being abutted with the side wall of the expansion groove 20 and the outer wall of the rubber conveying pipe 3; the inner and outer positioning blocks 52, 53 are disengaged from within the inner and outer positioning rings 32, 42, respectively. The telescopic groove 20 is matched with the convex ring 31, the outer sleeve 41 pushes the organ disk 51 to move upwards, after the inner ring of the organ disk 51 is separated from the outer wall of the convex ring 31, the telescopic piece is suitable for pushing the inner ring of the organ disk 51 to be abutted with the outer wall of the rubber conveying pipe 3, the telescopic piece is suitable for synchronously pushing the outer ring of the organ disk 51 to be abutted with the side wall of the telescopic groove 20, and at the moment, the outer positioning blocks 53 synchronously slide outwards, so that the outer positioning blocks 53 can be blocked and inserted into the outer positioning rings 42.
The second embodiment further provides a working method of the dispensing head 4 for chip packaging on the basis of the first embodiment, which includes the same specific structure as the first embodiment as the dispensing head 4 for chip packaging in the first embodiment, and the working method of the dispensing head 4 for chip packaging is not described in detail herein, and is as follows:
when the rubber head 4 is installed, the upper end of the outer sleeve 41 moves upwards along the inner wall of the connecting sleeve 2, and the outer sleeve 41 is suitable for pushing the two organ plates 51 to move upwards;
the inner ring of the organ plate 51 is contracted and slid towards the outer wall of the rubber conveying pipe 3, and the inner ring of the organ plate 51 is suitable for being abutted with the outer wall of the rubber conveying pipe 3;
synchronously, the outer ring of the organ disk 51 expands and slides towards the side wall of the expansion groove 20, and the outer ring of the organ disk 51 is suitable for abutting against the side wall of the expansion groove 20;
at this time, the inner positioning block 52 is adapted to be inserted into the inner positioning ring 32, and the outer positioning block 53 is adapted to be inserted into the outer positioning ring 42;
the organ plate 51 slides downwards under the action of the elasticity of the compression spring until the inner and outer circles of the organ plate 51 are respectively abutted with the outer wall of the convex ring 31 and the inner wall of the connecting sleeve 2, at the moment, the inner positioning block 52 is clamped and sealed with the inner positioning ring 32, and the outer positioning block 53 is clamped and sealed with the outer positioning ring 42;
the glue delivery pipe 3 is suitable for delivering glue into the glue dropping cone 44, and the glue dropping cone 44 is suitable for dispensing glue to a workpiece;
after the adhesive is dispensed, the outer sleeve 41 is pushed to move upwards, the outer sleeve 41 is suitable for pushing the two organ plates 51 to move upwards, the space above the adhesive dripping cone 44 is increased, negative pressure can be formed inside the adhesive dripping cone 44, and the adhesive cannot drip downwards from the adhesive outlet of the adhesive dripping cone 44 under the action of self gravity; to avoid glue in the glue dispensing cone 44 from dripping downward.
When the glue outlet of the glue dripping cone 44 is blocked, the glue conveying pipe 3 conveys glue into the glue dripping cone 44, the glue gradually fills the space inside the glue dripping cone 44, and the glue is suitable for pushing the organ disk 51 to move upwards until the inner ring of the organ disk 51 is abutted against the outer wall of the glue conveying pipe 3, and synchronously, the outer ring of the organ disk 51 is abutted against the side wall of the telescopic groove 20; at this time, the outer positioning ring 42 can be separated from the outer positioning block 53, and the convex ring 31 can be separated from the inner positioning block 52; the outer sleeve 41 and the glue dispensing cone 44 are adapted to disengage from the outer positioning block 53 to achieve the effect that the glue dispensing cone 44 is automatically disengaged from the lower end of the organ disk 51.
The components (components not illustrating specific structures) selected in the application are all common standard components or components known to those skilled in the art, and the structures and principles of the components are all known to those skilled in the art through technical manuals or through routine experimental methods. Moreover, the software programs referred to in the present application are all prior art, and the present application does not relate to any improvement of the software programs.
In the description of embodiments of the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the several embodiments provided in this application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, the division of the units is merely a logical function division, and there may be other manners of division in actual implementation, and for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some communication interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
With the above-described preferred embodiments according to the present invention as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present invention. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.
Claims (12)
1. A dispensing head for chip packaging, comprising:
the plastic conveying device comprises a fixing sleeve (1), a connecting sleeve (2), a plastic conveying pipe (3), a dispensing head (4) and a sealing limiting part (5), wherein the inside of the fixing sleeve (1) is hollow, and the plastic conveying pipe (3) is fixed in the fixing sleeve (1);
the connecting sleeve (2) is fixed at the lower end of the fixed sleeve (1), and an accommodating cavity is formed in the connecting sleeve (2);
the sealing limiting part (5) is arranged in the connecting sleeve (2) in a sliding manner, and the sealing limiting part (5) is sleeved on the outer wall of the rubber conveying pipe (3);
the dispensing head (4) is suitable for being inserted into the accommodating cavity, and the dispensing head (4) is clamped with the sealing limiting part (5);
after dispensing, the outer sleeve (41) of the dispensing head (4) is pushed upwards, the outer sleeve (41) slides upwards to absorb the glue in the dispensing head (4) under negative pressure, and the glue is prevented from dripping;
when the glue outlet of the glue dispensing head (4) is blocked, the glue conveying pipe (3) continuously conveys glue into the glue dispensing head (4), and the glue is suitable for pushing the sealing limiting part (5) to slide upwards so as to enable the sealing limiting part (5) of the glue dispensing head (4) to drop.
2. The die attach head of claim 1, wherein:
the dispensing head (4) comprises: the outer sleeve (41), the outer positioning ring (42), the positioning cylinder (43) and the glue dripping cone (44), wherein the glue dripping cone (44) is fixed at the lower end of the positioning cylinder (43), and the glue dripping cone (44) and the positioning cylinder (43) are hollow;
the positioning cylinder (43) is provided with a ring groove along the circumferential direction;
the outer sleeve (41) is sleeved on the outer wall of the glue dropping cone (44), and the outer sleeve (41) is arranged in the annular groove in a sliding manner;
the outer positioning ring (42) is fixed on the inner wall of the outer sleeve (41), and the outer positioning ring (42) is suitable for being clamped and sealed with the sealing limiting part (5);
when the outer sleeve (41) is pushed to move upwards, the outer locating ring (42) is suitable for pushing the sealing limiting part (5) to move upwards synchronously, so that the sealing limiting part (5) can be clamped and sealed with the outer locating ring (42).
3. The die attach head of claim 2, wherein:
the outer positioning ring (42) is C-shaped, and an opening of the outer positioning ring (42) faces the inner wall of the connecting sleeve (2).
4. A dispensing head for chip packaging as defined in claim 3, wherein:
a convex ring (31) is fixed at the lower end of the outer wall of the rubber conveying pipe (3), and a slope is arranged at the joint of the convex ring (31) and the rubber conveying pipe (3);
when the sealing limiting part (5) slides upwards along the convex ring (31), the inner ring of the sealing limiting part is suitable for contracting to be abutted against the outer wall of the rubber conveying pipe (3).
5. The die attach head of claim 4, wherein:
an inner positioning ring (32) is sleeved on the outer wall of the convex ring (31), and the inner positioning ring (32) is clamped and sealed with the sealing limiting part (5).
6. The die attach head of claim 5, wherein:
the inner positioning ring (32) is in a C shape, and an opening of the inner positioning ring (32) faces to the outer wall of the rubber conveying pipe (3).
7. The die attach head of claim 6, wherein:
the seal limit part (5) comprises: the two organ plates (51), the inner positioning block (52) and the outer positioning block (53) are symmetrically arranged, and the two organ plates (51) are circumferentially arranged around the outer wall of the rubber conveying pipe (3);
the positioning block (52) is fixed at the lower end of the inner ring of the organ disk, and the positioning block (52) is suitable for being inserted into the positioning ring (32);
the outer positioning block (53) is fixed at the lower end of the outer ring of the organ plate, and the outer positioning block (53) is suitable for being inserted into the outer positioning ring (42).
8. The die attach head of claim 7, wherein:
the inner positioning block (52) is arc-shaped, and the outer side of the inner positioning ring (32) is protruded towards the inner positioning ring (32).
9. The die attach head of claim 8, wherein:
the outer positioning ring (42) is arc-shaped, and the inner side of the outer positioning block (53) protrudes towards the outer positioning ring (42).
10. The die attach head of claim 9, wherein:
a flexible member is fixed between two adjacent organ plates (51), and is suitable for sealing a gap between the two organ plates (51).
11. The die attach head of claim 10, wherein:
the inner wall of the connecting sleeve (2) is provided with a telescopic groove (20), an inclined plane is arranged at the joint of the telescopic groove (20) and the inner wall of the connecting sleeve (2), and the telescopic groove (20) is arranged above the convex ring (31);
the outer sleeve (41) pushes the two organ plates (51) to move upwards, and the inner and outer rings of the organ plates (51) are suitable for being abutted with the side wall of the telescopic groove (20) and the outer wall of the rubber conveying pipe (3);
the inner positioning block (52) and the outer positioning block (53) are separated from the inner positioning ring (32) and the outer positioning ring (42) respectively.
12. A method of operating a dispensing head for chip packaging, characterized in that a dispensing head for chip packaging as claimed in any one of claims 1-11 is used, comprising the steps of:
when the rubber head (4) is installed, the upper end of the outer sleeve (41) moves upwards along the inner wall of the connecting sleeve (2), and the outer sleeve (41) is suitable for pushing the two organ plates (51) to move upwards;
the inner ring of the organ plate (51) is contracted and slid towards the outer wall of the rubber conveying pipe (3), and the inner ring of the organ plate (51) is suitable for being abutted with the outer wall of the rubber conveying pipe (3);
synchronously, the outer ring of the organ disk (51) expands and slides towards the side wall of the telescopic groove (20), and the outer ring of the organ disk (51) is suitable for being abutted against the side wall of the telescopic groove (20);
at this time, the inner positioning block (52) is suitable for being inserted into the inner positioning ring (32), and the outer positioning block (53) is suitable for being inserted into the outer positioning ring (42);
the organ plate (51) slides downwards under the action of the elasticity of the compression spring until the inner ring and the outer ring of the organ plate (51) are respectively abutted with the outer wall of the convex ring (31) and the inner wall of the connecting sleeve (2), at the moment, the inner positioning block (52) is tightly clamped and sealed with the inner positioning ring (32), and the outer positioning block (53) is tightly clamped and sealed with the outer positioning ring (42);
the glue conveying pipe (3) is suitable for conveying glue into the glue dropping cone (44), and the glue dropping cone (44) is suitable for dispensing glue to a workpiece;
after dispensing, the outer sleeve (41) is pushed to move upwards, the outer sleeve (41) is suitable for pushing the two organ plates (51) to move upwards, and the space above the dispensing cone (44) is increased, so that glue in the dispensing cone (44) is prevented from being leaked downwards;
when the glue outlet of the glue dripping cone (44) is blocked, the glue conveying pipe (3) conveys glue into the glue dripping cone (44), the glue is suitable for pushing the organ disc (51) to move upwards until the inner ring and the outer ring of the organ disc (51) are respectively abutted with the outer wall of the glue conveying pipe (3) and the side wall of the telescopic groove (20), and the outer sleeve (41) and the glue dripping cone (44) are suitable for being separated from the outer positioning block (53).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311715613.9A CN117399243B (en) | 2023-12-14 | 2023-12-14 | Dispensing head for chip packaging and working method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311715613.9A CN117399243B (en) | 2023-12-14 | 2023-12-14 | Dispensing head for chip packaging and working method thereof |
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| Publication Number | Publication Date |
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| CN117399243A true CN117399243A (en) | 2024-01-16 |
| CN117399243B CN117399243B (en) | 2024-03-05 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110639762A (en) * | 2019-08-14 | 2020-01-03 | 安徽国晶微电子有限公司 | Multi-head glue dispensing device for packaging integrated circuit |
| CN210252919U (en) * | 2019-05-31 | 2020-04-07 | 武陟县爱华畜产制品有限公司 | Dispensing machine for processing shoes |
| CN212328772U (en) * | 2020-05-18 | 2021-01-12 | 苏州工业园区捷讯特精工模塑有限公司 | Efficient notebook keyboard production is with point gum machine constructs |
| CN217165116U (en) * | 2022-01-24 | 2022-08-12 | 余姚市远望电器有限公司 | Glue dispenser for circuit board |
| CN218190672U (en) * | 2022-06-14 | 2023-01-03 | 惠州市域恒电子科技有限公司 | Dispensing mechanism of dispensing machine |
| CN116899820A (en) * | 2023-09-14 | 2023-10-20 | 常州银河世纪微电子股份有限公司 | Double-hole dispensing head for chip and dispensing method thereof |
-
2023
- 2023-12-14 CN CN202311715613.9A patent/CN117399243B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210252919U (en) * | 2019-05-31 | 2020-04-07 | 武陟县爱华畜产制品有限公司 | Dispensing machine for processing shoes |
| CN110639762A (en) * | 2019-08-14 | 2020-01-03 | 安徽国晶微电子有限公司 | Multi-head glue dispensing device for packaging integrated circuit |
| CN212328772U (en) * | 2020-05-18 | 2021-01-12 | 苏州工业园区捷讯特精工模塑有限公司 | Efficient notebook keyboard production is with point gum machine constructs |
| CN217165116U (en) * | 2022-01-24 | 2022-08-12 | 余姚市远望电器有限公司 | Glue dispenser for circuit board |
| CN218190672U (en) * | 2022-06-14 | 2023-01-03 | 惠州市域恒电子科技有限公司 | Dispensing mechanism of dispensing machine |
| CN116899820A (en) * | 2023-09-14 | 2023-10-20 | 常州银河世纪微电子股份有限公司 | Double-hole dispensing head for chip and dispensing method thereof |
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|---|---|
| CN117399243B (en) | 2024-03-05 |
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