CN117393893A

CN117393893A - Battery and power consumption system

Info

Publication number: CN117393893A
Application number: CN202210770704.1A
Authority: CN
Inventors: 尧吉兵; 罗自皓
Original assignee: Zhuhai Cosmx Power Co Ltd
Current assignee: Zhuhai Cosmx Power Co Ltd
Priority date: 2022-06-30
Filing date: 2022-06-30
Publication date: 2024-01-12

Abstract

The invention provides a battery and an electricity utilization system, wherein the battery comprises a first electric core; a heat source component; the energy storage device comprises a thermoelectric conversion module and an electric storage unit, wherein the thermoelectric conversion module comprises M semiconductor pairs which are sequentially connected in series, the semiconductor pairs comprise a first semiconductor and a second semiconductor, and M is a positive integer; the first semiconductor and the second semiconductor are respectively contacted with a cold source component and a heat source component; the electric storage unit is electrically connected with the first semiconductor and the second semiconductor to form a loop. The invention solves the problem of low efficiency of radiating the battery by using a natural convection radiating mode.

Description

Battery and power consumption system

Technical Field

The invention relates to the technical field of lithium ion batteries, in particular to a battery and an electric system.

Background

Lithium ion batteries are a type of rechargeable battery, and are representative of modern high-performance batteries. With the continuous development of the performance and capacity of lithium ion batteries, more heat is generated by various components in the battery during the charge and discharge of the lithium ion battery.

At present, a natural convection heat dissipation mode is generally adopted for heat dissipation of the interior of the battery. The natural convection heat dissipation mode generally transfers heat inside the battery to the external environment through natural convection and heat radiation, and has low efficiency.

Disclosure of Invention

The embodiment of the invention provides a battery and an electric system, which are used for solving the problem of low efficiency of radiating the battery by using a natural convection radiating mode.

The embodiment of the invention provides a battery, which comprises:

a first cell;

a heat source component;

the energy storage device comprises a thermoelectric conversion module and an electric storage unit, wherein the thermoelectric conversion module comprises M semiconductor pairs which are sequentially connected in series, the semiconductor pairs comprise a first semiconductor and a second semiconductor, and M is a positive integer; the first semiconductor and the second semiconductor are respectively contacted with a cold source component and a heat source component; the electric storage unit is electrically connected with the first semiconductor and the second semiconductor to form a loop.

Optionally, the first end of the first semiconductor is connected with the first end of the second semiconductor;

the first end of the first semiconductor and the first end of the second semiconductor are connected with a heat source component of the battery;

the second end of the first semiconductor and the second end of the second semiconductor are connected with a cold source component.

Optionally, the second end of the second semiconductor of the first one of the M semiconductor pairs is connected to the second end of the first semiconductor of the following semiconductor pair;

The second ends of the first semiconductors of the last semiconductor pair of the M semiconductor pairs are connected with the second ends of the second semiconductors of the previous semiconductor pair;

the second end of the second semiconductor of any one intermediate semiconductor pair of the M semiconductor pairs is connected to the second end of the first semiconductor of an adjacent semiconductor pair.

Optionally, the second ends of the first semiconductors of the first one of the M semiconductor pairs are electrically connected to the electric storage unit, and the second ends of the second semiconductors of the last one of the M semiconductor pairs are electrically connected to the electric storage unit.

Optionally, the battery further comprises a second electric core and a circuit board;

the first battery core and the second battery core are connected through the circuit board.

Optionally, the first battery cell includes a first housing and a first battery cell body located in the first housing, the first housing includes a first edge seal, the first battery cell body includes a first tab extending from the first edge seal, and/or

The second battery cell comprises a second shell and a second battery cell body positioned in the second shell, the second shell comprises a second sealing edge, and the second battery cell body comprises a second lug extending from the second sealing edge.

Optionally, the number of heat source components is at least one, the heat source components including at least one of:

a first temperature switch located on the first seal;

a second temperature switch located on the second seal;

and the field effect transistor is positioned on the circuit board.

Alternatively, the thermoelectric conversion modules are provided corresponding to the heat source members, and in the case where the number of the thermoelectric conversion modules is at least two, at least two of the thermoelectric conversion modules are connected in series.

Optionally, at least two of the thermoelectric conversion modules are connected in series by wires and/or conductors.

Optionally, the first end of the first semiconductor and the first end of the second semiconductor are connected by a first conductive connection pad;

the first semiconductor and the second semiconductor are abutted with the corresponding heat source component through the first conductive connecting sheet, and/or

The second end of the first semiconductor comprises a second conductive connecting sheet; the second end of the second semiconductor comprises a third conductive connecting sheet;

the first semiconductor and the second semiconductor are respectively abutted with the corresponding cold source component through the second conductive connecting sheet and the third conductive connecting sheet.

Optionally, the part of the first conductive connecting sheet connected with the corresponding heat source component is provided with a first heat conductive adhesive, and/or

And the second conductive connecting sheet and/or the part, connected with the corresponding cold source component, of the third conductive connecting sheet is/are respectively provided with second heat-conducting glue.

Optionally, the energy storage device further comprises a voltage amplifier for amplifying the voltage of the thermoelectric conversion module;

one end of the voltage amplifier is electrically connected with the first end of the electric storage unit through the thermoelectric conversion module, and the second end of the voltage amplifier is electrically connected with the second end of the electric storage unit.

Optionally, the energy storage device further comprises a control chip and a change-over switch, the control chip is electrically connected with the change-over switch and used for controlling the on-off of the change-over switch, one end of the change-over switch is electrically connected with one end of the electric equipment through the electric storage unit, and the other end of the change-over switch is electrically connected with the other end of the electric equipment.

The embodiment of the invention also provides an electric system, which comprises electric equipment and the battery, wherein the electric equipment comprises a cold source component, and an electric storage unit of the battery is electrically connected with the electric equipment to form a power supply loop.

In an embodiment of the invention, a battery includes a first cell; a heat source component; the energy storage device comprises a thermoelectric conversion module and an electric storage unit, wherein the thermoelectric conversion module comprises M semiconductor pairs which are sequentially connected in series, each semiconductor pair comprises a first semiconductor and a second semiconductor, and M is a positive integer; the first semiconductor and the second semiconductor are respectively contacted with the cold source component and the heat source component; the electric storage unit is electrically connected with the first semiconductor and the second semiconductor to form a circuit. Through the arrangement, heat generated by components in the battery can be converted into electric energy and stored, and on one hand, the thermoelectric conversion module comprises M semiconductor pairs which are sequentially connected in series, so that the heat dissipation efficiency of the battery is improved, and the temperature of electronic components in the battery is reduced. On the other hand, the thermoelectric conversion module stores electric energy through the energy storage unit, so that the utilization rate of energy sources is improved, and the energy storage device provided by the embodiment is more environment-friendly.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an energy storage device according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a thermoelectric conversion module according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a thermoelectric conversion module according to an embodiment of the present invention;

fig. 4 is a third schematic structural view of a thermoelectric conversion module according to an embodiment of the present invention;

fig. 5 is a schematic structural view of a thermoelectric conversion module according to an embodiment of the present invention;

fig. 6 is a schematic connection diagram of a plurality of thermoelectric conversion modules according to an embodiment of the present invention;

FIG. 7 is an exploded schematic view of the plurality of thermoelectric conversion modules provided in FIG. 6;

fig. 8 is a schematic view of a battery according to an embodiment of the present invention;

fig. 9 is an exploded view of the battery provided in fig. 8;

fig. 10 is a schematic structural diagram of a cell unit without a thermoelectric conversion module according to an embodiment of the present invention;

FIG. 11 is an enlarged schematic view of area A of FIG. 10;

fig. 12 is a schematic structural diagram of a battery cell unit provided with a thermoelectric conversion module according to an embodiment of the present invention;

fig. 13 is an enlarged schematic view of region B in fig. 12.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which are derived by a person skilled in the art from the embodiments according to the invention without creative efforts, fall within the protection scope of the invention.

Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The terms "first," "second," and the like, as used herein, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. "upper", "lower", "left", "right", etc. are used merely to indicate a relative positional relationship, which changes accordingly when the absolute position of the object to be described changes.

As shown in fig. 1 to 13, an embodiment of the present invention provides a battery including:

a first cell 10;

a heat source member 20;

the energy storage device 30, the energy storage device 30 includes a thermoelectric conversion module 301 and an electric storage unit 302, the thermoelectric conversion module 301 includes M semiconductor pairs connected in series in sequence, the semiconductor pairs include a first semiconductor 3011 and a second semiconductor 3012, and M is a positive integer; the first semiconductor 3011 and the second semiconductor 3012 are in contact with the heat source component 20 and the heat sink component 2, respectively; the power storage unit 302 is electrically connected to the first semiconductor 3011 and the second semiconductor 3012 to form a circuit.

In a specific implementation, each of the M semiconductor pairs includes a first semiconductor 3011 and a second semiconductor 3012, wherein specific structures of the first semiconductor 3011 and the second semiconductor 3012 are not limited herein. For example, in some embodiments, the first semiconductor 3011 is an N-type semiconductor and the second semiconductor 3012 is a P-type semiconductor.

For convenience of understanding, the first semiconductor 3011 and the second semiconductor 3012 will be collectively referred to as semiconductors hereinafter, that is, unless otherwise specified, the semiconductors described in the subsequent embodiments may be understood as the first semiconductor 3011 and/or the second semiconductor 3012.

It should be understood that semiconductors may also be understood as thermoelectric materials. Specifically, the first semiconductor 3011 is an N-type semiconductor, which can be understood as a thermoelectric material of N-type for the first semiconductor 3011. The second semiconductor 3012 is a P-type semiconductor, which is understood to mean that the second semiconductor 3012 is a P-type thermoelectric material.

It should be understood that the specific materials of the semiconductor are not limited herein. For example, in some embodiments, the semiconductor may be an inorganic thermoelectric material. Still further, the semiconductor may be at least one of: bismuth (III) telluride, biTe, tin selenide, snSe, lead telluride, pbTe, and silicon germanium (SiGe).

In other embodiments, the semiconductor may be an organic thermoelectric material. Still further, the semiconductor may be: polymers of 3,4-ethylenedioxythiophene (3, 4-ethoxylene dioxy thiophene, EDOT) (Poly (3, 4-ethylenedioxythiophene), PEDOT).

In other embodiments, the semiconductor may also be an inorganic-organic composite.

It is to be understood that the first semiconductor 3011 and the second semiconductor 3012 are in contact with the heat source component 20 and the heat sink component 2, respectively, wherein the specific structures of the heat source component 20 and the heat sink component 2 are not limited herein. In the case where the temperature of the heat source component 20 is lower than the temperature of the cold source component 2, the electric storage unit 302 is electrically connected to the first semiconductor 3011 and the second semiconductor 3012 to form a circuit, and the electric storage unit 302 stores electric energy generated by the first semiconductor 3011 and the second semiconductor 3012 based on the circuit.

In particular, the case where the temperature of the heat source part 2 is lower than the temperature of the heat source part 20 may be understood as a case where the temperature increases as the heat source part 20 in the battery continuously generates heat during the charge and discharge of the battery until the temperature of the heat source part 20 is higher than the temperature of the heat source part 2.

It is understood that the electric storage unit 302 is an electric storage device that can store electric energy as chemical energy in a charging manner after discharging, and convert the chemical energy into electric energy again when discharging is required. The specific structure of the power storage unit 302 is not limited herein. For example, in some embodiments, the power storage unit 302 is a battery. In other embodiments, the electrical storage unit 302 is a capacitor.

In the present embodiment, the electric storage unit 302 is electrically connected to the first semiconductor 3011 and the second semiconductor 3012 to form a loop, and it is understood that both ends of the electric storage unit 302 are electrically connected to the second end of the first semiconductor 3011 in the first semiconductor pair and the second end of the second semiconductor 3012 in the last semiconductor pair, respectively, to form a loop.

It is understood that the heat source component 20 is a component included in the battery. The heat sink member 2 may be a member included in the battery or may be a member other than the battery. For example, in some embodiments, cold source component 2 is a component within the battery that is at a lower temperature than heat source component 20 in the battery operating state. In other embodiments, cold source component 2 is a component that is cooler than heat source component 20 in the powered device when the battery is in operation after the battery is installed in the powered device.

For ease of understanding, the following will exemplify. The heat source member 20 may be a member that generates a large amount of heat during the charge and discharge of the battery. For example, in some embodiments, the heat source component 20 is a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) tube, referred to as a MOS tube. In other embodiments, the heat source component 20 is a Thermal Cut-Off (TCO) 305.

In an embodiment of the invention, the battery comprises a first cell 10; a heat source member 20; the energy storage device 30, the energy storage device 30 includes a thermoelectric conversion module 301 and an electric storage unit 302, the thermoelectric conversion module 301 includes M semiconductor pairs connected in series in sequence, the semiconductor pairs include a first semiconductor 3011 and a second semiconductor 3012, and M is a positive integer; the first semiconductor 3011 and the second semiconductor 3012 are in contact with the heat source component 20 and the heat sink component 2, respectively; the power storage unit 302 is electrically connected to the first semiconductor 3011 and the second semiconductor 3012 to form a circuit. Through the arrangement, heat generated by components in the battery can be converted into electric energy and stored, and on one hand, because the thermoelectric conversion module 301 comprises M semiconductor pairs which are sequentially connected in series, the heat dissipation efficiency of the battery is improved, and the temperature of electronic components in the battery is reduced. On the other hand, the thermoelectric conversion module 301 stores electric energy through the energy storage unit, so that the utilization rate of energy is improved, and the energy storage device 30 provided in this embodiment is more environment-friendly.

Optionally, in some embodiments, a first end of the first semiconductor 3011 is connected to a first end of the second semiconductor 3012;

the first end of the first semiconductor 3011 and the first end of the second semiconductor 3012 are both connected to the heat source component 20 of the battery;

A second end of the first semiconductor 3011 and a second end of the second semiconductor 3012 are connected to the cold source component 2.

For each of the M semiconductor pairs, a first end of a first semiconductor 3011 included in the semiconductor pair is connected to a first end of a second semiconductor 3012, the first end of the first semiconductor 3011 and the first end of the second semiconductor 3012 are both connected to the heat source member 20 of the battery, and the second end of the first semiconductor 3011 and the second end of the second semiconductor 3012 are both connected to the heat sink member 2.

The connection of the first end of the first semiconductor 3011 with the first end of the second semiconductor 3012 is understood to mean that the first end of the first semiconductor 3011 is electrically connected with the first end of the second semiconductor 3012. The specific manner in which the first end of the first semiconductor 3011 is electrically connected to the first end of the second semiconductor 3012 is not limited herein. For example, in some embodiments, the first end of the first semiconductor 3011 and the first end of the second semiconductor 3012 may be electrically connected by a conductive material. In other embodiments, where the heat source component 20 is a conductive material, the first end of the first semiconductor 3011 and the first end of the second semiconductor 3012 may be directly electrically connected via the heat source component 20.

The first end of the first semiconductor 3011 and the first end of the second semiconductor 3012 are both connected to the heat source component 20 of the battery, which is understood to mean that the first end of the first semiconductor 3011 and the first end of the second semiconductor 3012 are both thermally connected to the heat source component 20 of the battery, i.e., the heat of the heat source component 20 can be transferred to the first end of the first semiconductor 3011 and the first end of the second semiconductor 3012. In some embodiments, the first end of the first semiconductor 3011 and the first end of the second semiconductor 3012 are each in abutment with the heat source component 20.

It will be appreciated that in order to enhance the contact stability of the first end of the semiconductor with the heat source component 20, in some embodiments, the first end of the semiconductor may be in a fixed, thermally conductive connection with the heat source component 20, wherein the specific manner in which the first end of the semiconductor is in a fixed, thermally conductive connection with the heat source component 20 is not limited herein.

The connection of the second end of the first semiconductor 3011 and the second end of the second semiconductor 3012 to the cold source component 2 is understood to mean that the first end of the first semiconductor 3011 and the first end of the second semiconductor 3012 are both thermally connected to the cold source component 2 of the battery, i.e., the heat of the cold source component 2 can be transferred to the first end of the first semiconductor 3011 and the first end of the second semiconductor 3012. In some embodiments, the first end of the first semiconductor 3011 and the first end of the second semiconductor 3012 are each in abutment with the cold source component 2.

It will be appreciated that, in order to improve the contact stability between the first end of the semiconductor and the cold source component 2, in some embodiments, the first end of the semiconductor and the cold source component 2 may be fixedly and thermally connected, wherein a specific manner of fixedly and thermally connecting the first end of the semiconductor and the cold source component 2 is not limited herein.

For ease of understanding, a specific embodiment will be used as an example to describe the application principle of the energy storage device 30 according to the embodiment of the present invention. It should be noted that the energy storage device 30 according to the embodiment of the present invention is implemented based on Seebeck effect (Seebeck effect).

The seebeck effect is also called a first thermoelectric effect, and refers to a phenomenon that in the case where there is a temperature difference between both ends of a conductor or a semiconductor connected end to end, electrons and holes between the conductor or the semiconductor move to one end having a lower temperature, thereby generating a difference in temperature and potential at both ends having a different temperature.

First, a semiconductor pair will be described. In this embodiment, the first semiconductor 3011 is an N-type semiconductor, and the first end of the first semiconductor 3011 is thermally connected to the heat source member 20, and the second end of the first semiconductor 3011 is thermally connected to the heat sink member 2. In the case where the temperature of the heat source part 20 is greater than the temperature of the heat sink part 2, the temperature of the first end of the first semiconductor 3011 is greater than the temperature of the second end of the first semiconductor 3011. The first semiconductor 3011 is an N-type semiconductor in which free electrons are more electrons and holes are less electrons. Since the concentration of free electrons at the first end is high, the free electrons diffuse from the first end to the second end, and the direction of the thermoelectromotive force is formed so that the second end points to the first end.

In this embodiment, the first semiconductor 3011 is a P-type semiconductor, and the second semiconductor 3012 is thermally connected to the heat source member 20 at a first end of the second semiconductor 3012, and is thermally connected to the heat sink member 2 at a second end of the second semiconductor 3012. In the case where the temperature of the heat source member 20 is greater than the temperature of the heat sink member 2, the temperature of the first end of the second semiconductor 3012 is greater than the temperature of the second end of the second semiconductor 3012. The second semiconductor 3012 is a P-type semiconductor, and in the P-type semiconductor, free electrons are minority carriers and holes are majority carriers. Because of the higher concentration of holes at the first end, holes diffuse from the first end to the second end, and the direction of the thermoelectromotive force is directed from the first end to the second end.

In the embodiment of the present invention, including M semiconductor pairs sequentially connected in series, the first semiconductor 3011 and the second semiconductor 3012 in each semiconductor generate current based on the seebeck effect in the case where the temperature of the heat source part 20 is greater than the temperature of the heat sink part 2.

Both ends of the electric storage unit 302 are electrically connected to the second end of the first semiconductor 3011 in the first semiconductor pair and the second end of the second semiconductor 3012 in the last semiconductor pair, respectively, to form a loop. In the case where the temperature of the heat source part 20 is greater than the temperature of the cold source part 2, the M semiconductors generate a current in the direction shown in fig. 1 based on the seebeck effect to charge the electric storage unit 302, and the electric storage unit 302 can store electric energy generated by the first semiconductor 3011 and the second semiconductor 3012.

Optionally, in some embodiments, a second end of a first semiconductor 3011 of a first of the M semiconductor pairs is electrically connected to the power storage unit 302, and a second end of a second semiconductor 3012 is connected to a second end of a first semiconductor 3011 of a subsequent semiconductor pair;

a second end of a first semiconductor 3011 of a last semiconductor pair of the M semiconductor pairs is connected to a second end of a second semiconductor 3012 of a preceding semiconductor pair, and the second end of the second semiconductor 3012 is electrically connected to the electric storage unit 302;

the second end of the second semiconductor 3012 of any one intermediate semiconductor pair of the M semiconductor pairs is connected to the second end of the first semiconductor 3011 of the adjacent semiconductor pair.

For ease of understanding, the following will exemplify. See fig. 2-4 in detail.

As shown in fig. 2, in the case where M is equal to 2, the battery includes 2 semiconductor pairs connected in series in sequence. Wherein, for each semiconductor pair, a first end of the first semiconductor 3011 is connected to a first end of the second semiconductor 3012; the first end of the first semiconductor 3011 and the first end of the second semiconductor 3012 are both connected to the heat source component 20 of the battery; a second end of the first semiconductor 3011 and a second end of the second semiconductor 3012 are connected to the cold source component 2.

Since M is equal to 2, the first of the M semiconductor pairs can be understood as semiconductor pair A1 as shown in fig. 2, and the last of the M semiconductor pairs can be understood as semiconductor pair A2 as shown in fig. 2. The second end of the second semiconductor 3012 of the semiconductor pair A1 is connected to the second end of the first semiconductor 3011 of the semiconductor pair A2, and the second end of the first semiconductor 3011 of the semiconductor pair A2 is connected to the second end of the second semiconductor 3012 of the semiconductor pair A1.

As shown in fig. 3, in the case where M is equal to 3, the battery includes 3 semiconductor pairs connected in series in sequence. Wherein, for each semiconductor pair, a first end of the first semiconductor 3011 is connected to a first end of the second semiconductor 3012; the first end of the first semiconductor 3011 and the first end of the second semiconductor 3012 are both connected to the heat source component 20 of the battery; a second end of the first semiconductor 3011 and a second end of the second semiconductor 3012 are connected to the cold source component 2.

Since M is equal to 3, the first of the M semiconductor pairs may be understood as semiconductor pair B1 as shown in fig. 3, the last of the M semiconductor pairs may be understood as semiconductor pair B3 as shown in fig. 3, and the middle of the M semiconductor pairs may be understood as semiconductor pair B2. The second end of the second semiconductor 3012 of the semiconductor pair B1 is connected to the second end of the first semiconductor 3011 of the semiconductor pair B2, and the second end of the second semiconductor 3012 of the semiconductor pair B2 is connected to the second end of the first semiconductor 3011 of the semiconductor pair B3.

As shown in fig. 4, in the case where M is equal to 5, the battery includes 5 semiconductor pairs connected in series in sequence. Wherein, for each semiconductor pair, a first end of the first semiconductor 3011 is connected to a first end of the second semiconductor 3012; the first end of the first semiconductor 3011 and the first end of the second semiconductor 3012 are both connected to the heat source component 20 of the battery; a second end of the first semiconductor 3011 and a second end of the second semiconductor 3012 are connected to the cold source component 2.

Since M is equal to 5, the first of M semiconductor pairs can be understood as a semiconductor pair C1 as shown in fig. 3, the last of M semiconductor pairs can be understood as a semiconductor pair C3 as shown in fig. 3, and any one of M semiconductor pairs can be understood as a semiconductor pair C2, in this embodiment the number of intermediate semiconductor pairs is 3, i.e. the number of semiconductor pairs C2 is 3.

The second end of the second semiconductor 3012 of the semiconductor pair C1 is connected to the second end of the first semiconductor 3011 of the semiconductor pair C2 adjacent thereto, the second end of the second semiconductor 3012 of the semiconductor pair C2 is connected to the second end of the first semiconductor 3011 of the semiconductor pair C2 or the semiconductor pair C3 adjacent thereto, and the second end of the first semiconductor 3011 of the semiconductor pair C3 is connected to the second end of the second semiconductor 3012 of the semiconductor pair C2 adjacent thereto.

Optionally, in some embodiments, the battery further includes a second cell 40 and a circuit board 50;

the first cell 10 and the second cell 40 are connected by a circuit board 50.

Optionally, in some embodiments, the first cell 10 includes a first housing and a first cell 10 body disposed in the first housing, the first housing including a first seal, the first cell 10 body including a first tab extending from the first seal, and/or

The second battery cell 40 includes a second housing and a second battery cell 40 body disposed in the second housing, the second housing includes a second sealing edge, and the second battery cell 40 body includes a second tab extending from the second sealing edge.

The structure of the battery will be described below for convenience of understanding. Please refer to fig. 6-13.

The battery includes a thermoelectric conversion module 301, an electric storage unit 302, a battery cell unit, and a control circuit board unit. In this embodiment, the specific structure of the thermoelectric conversion module 301 may be referred to the description in the above embodiment, and will not be described here again. The connection relation between the components of the battery can be any conventional arrangement, and will not be described herein.

Further, the battery further includes a heat sensitive member, a cap plate, a film, a terminal wire, and an outer frame. The cover plate, the film and the outer frame enclose to form a containing cavity, the thermosensitive assembly, the thermoelectric conversion module 301, the battery cell unit and the control circuit board unit are all located in the containing cavity, the thermosensitive assembly, the thermoelectric conversion module 301, the battery cell unit and the terminal wires are all electrically connected with the control circuit board unit, and the connection relation of each component of the battery can be any conventional setting and is not repeated here.

In this embodiment, the thermal element is a negative temperature coefficient (Negative Temperature Coefficient, NTC) thermal element. The temperature sensing component is used for detecting the temperature of the battery, and the temperature of the battery is monitored through the thermistor, so that an alarm can be given when the temperature of the battery is higher than a threshold value. The cover plate is used for reinforcing the structural strength of the battery pack, and can be an injection molded plastic cover plate. The film is used for electrical insulation and or printing of logo marks, and the film may be a polyethylene terephthalate (polyethylene glycol terephthalate, PET) film. The terminal wire is used for electrically connecting the battery with the notebook system terminal. The shell is used for the injection molding of the outline of the battery, and the outer frame can be a plastic rubber frame.

Specifically, referring to fig. 10, the battery cell includes a first battery cell 10 and a second battery cell 40. The first battery cell 10 includes a first housing and a first battery cell 10 body located in the first housing, the first housing includes a first edge seal, the first battery cell 10 body includes a first tab extending from the first edge seal, and the second battery cell 40 includes a second housing and a second battery cell 40 body located in the second housing, the second housing includes a second edge seal, and the second battery cell 40 body includes a second tab extending from the second edge seal. The first electrode lug and the second electrode lug comprise a battery cell positive electrode lug and a battery cell negative electrode lug.

Specifically, referring to fig. 10, the control circuit board unit includes a circuit board 50, MOS transistors, resistors and other components, where components such as an electric storage unit 302, an integrated circuit (Integrated Circuit, IC), a FUSE (FUSE) and the like are soldered on the circuit board 50, and connection relationships of the components of the control circuit board unit may be any conventional arrangement, which is not described herein.

In a specific implementation, a metal guide plate is disposed on the circuit board 50, and after the battery cell positive electrode tab and the battery cell negative electrode tab are stacked with the metal guide plate, the battery cell positive electrode tab and the battery cell negative electrode tab can be welded to the circuit board 50 through a laser welding process, a resistance welding process, a soldering process and the like so as to realize circuit connection. The terminal wires are electrically connected to the circuit board 50 by metal lead thermocompression bonding. The thermistor is electrically connected to the circuit board 50 by soldering via a metal lead.

The specific material of the metal guide is not limited herein. For example, in some embodiments, the metallic material is any material having conductive capabilities. For example, the material of the metal guide may be nickel, copper, and aluminum.

Optionally, in some embodiments, the number of heat source components 20 is at least one, the heat source components 20 comprising at least one of:

A first temperature switch located on the first seal;

a second temperature switch on the second seal;

a field effect transistor on the circuit board 50.

It should be understood that the number of heat source components 20 is not limited herein. In particular implementations, the number of heat source components 20 may be at least one. In the case where the number of heat source members 20 is one, the corresponding heat source member 20 is the same for each of the M semiconductor pairs. In the case where the number of the heat source members 20 is at least two, the heat source members 20 corresponding to any two of the M semiconductor pairs may be the same or different.

In particular, the first temperature switch located on the first sealing edge can be understood as a TCO located on the first sealing edge. The second temperature switch located on the second seal may be understood as a TCO located on the second seal. A field effect transistor on the circuit board 50 may be understood as a MOS transistor on the circuit board 50, wherein the MOS transistor on the circuit board 50 may be one or more.

During the charge and discharge of the battery, the MOS transistor and TCO in the battery generally generate heat most seriously, so in this embodiment, the heat source component 20 includes at least one of the following: a first temperature switch located on the first seal; a second temperature switch on the second seal; a field effect transistor on the circuit board 50. Through the arrangement, the parts with more heat in the battery can be cooled preferentially, so that the temperature in the battery is effectively reduced.

Alternatively, in some embodiments, the thermoelectric conversion modules 301 are provided corresponding to the heat source part 20, and in the case where the number of thermoelectric conversion modules 301 is at least two, at least two thermoelectric conversion modules 301 are connected in series.

It is to be understood that in the case where the number of thermoelectric conversion modules 301 is at least two, the number of semiconductor pairs included in any two thermoelectric conversion modules 301 may be the same or different. For example, in some embodiments, the number of thermoelectric conversion modules 301 is 3, where one thermoelectric conversion module 301 includes 3 semiconductor pairs in series, one thermoelectric conversion module 301 includes 5 semiconductor pairs in series, and one thermoelectric conversion module 301 includes 5 semiconductor pairs in series.

The arrangement of the thermoelectric conversion modules 301 in correspondence with the heat source members 20 may be understood as the arrangement of the thermoelectric conversion modules 301 in one-to-one correspondence with the heat source members 20, may be understood as the arrangement of the thermoelectric conversion modules 301 in one-to-many or many-to-one correspondence with the heat source members 20, or may be understood as the arrangement of the thermoelectric conversion modules 301 in one-to-one, one-to-many or many-to-one correspondence with the heat source members 20.

In some embodiments, the thermoelectric conversion module 301 is disposed corresponding to the heat source component 20, and it is understood that the heat source component 20 corresponding to M semiconductor pairs included in the thermoelectric conversion module 301 is the heat source component 20.

For ease of understanding, the following will exemplify. For example, the heat source part 20 includes: a first temperature switch on the first seal, a second temperature switch on the second seal, and a field effect transistor on the circuit board 50.

In some embodiments, the thermoelectric conversion modules 301 are disposed in one-to-one correspondence with the heat source components 20, and the number of thermoelectric conversion modules 301 is 3, and each thermoelectric conversion module 301 is disposed in correspondence with one heat source component 20.

In other embodiments, the thermoelectric conversion modules 301 are disposed corresponding to the heat source component 20 one to one or one to many, and the number of thermoelectric conversion modules 301 may be 2, one thermoelectric conversion module 301 is disposed corresponding to a first temperature switch on a first sealing side, and a second temperature switch on a second sealing side, and another thermoelectric conversion module 301 is disposed corresponding to a field effect transistor on the circuit board 50.

In other embodiments, the thermoelectric conversion modules 301 are disposed corresponding to the heat source component 20 one to one or many to one, and then the number of thermoelectric conversion modules 301 may be 4, 2 thermoelectric conversion modules 301 are disposed corresponding to the first temperature switch on the first sealing edge, and another 2 thermoelectric conversion modules 301 are disposed corresponding to the second temperature switch on the second sealing edge and the field effect transistor on the circuit board 50 one to one.

The first end of the first semiconductor 3011 of the first semiconductor pair of the first thermoelectric conversion module 301 of the at least two thermoelectric conversion modules 301 after the series connection is connected to the second end of the electric storage unit 302, and the second end of the second semiconductor 3012 of the last semiconductor pair of the last thermoelectric conversion module 301 of the at least two thermoelectric conversion modules 301 after the series connection is connected to the second end of the electric storage unit 302, and forms a loop.

In the embodiment of the present invention, the thermoelectric conversion modules 301 are provided corresponding to the heat source member 20, and in the case where the number of thermoelectric conversion modules 301 is at least two, at least two thermoelectric conversion modules 301 are connected in series. By connecting at least two thermoelectric conversion modules 301 in series, the voltage across the electric storage unit 302 can be increased, thereby improving the efficiency of electric storage of the electric storage unit 302.

It should be understood that, in a specific implementation, as shown in fig. 6, the thermoelectric conversion module 301 is generally abutted against the corresponding heat sink member 2 and heat source member 20 after being packaged. In some embodiments, the thermoelectric conversion module 301 is packaged in a cylindrical structure and is abutted to the corresponding heat source component 20 and cold source component 2 through conductive connection sheets.

It should be understood that, in some embodiments, since the thermoelectric conversion modules 301 are generally packaged as a unitary structure, the heat source components 20 corresponding to the semiconductors in the thermoelectric conversion modules 301 are the same component, and the heat sink components 2 corresponding to the semiconductors in the thermoelectric conversion modules 301 are the same component for one thermoelectric conversion module 301.

It should be understood that the number of thermoelectric conversion modules 301 may be determined according to the number of heat source components 20 included in the battery, and as the number of heat source components 20 increases, the number of thermoelectric conversion modules 301 provided may also increase accordingly. In specific implementation, each heat source component 20 may correspond to at least one thermoelectric conversion module 301, or each thermoelectric conversion module 301 may correspond to at least one heat source component 20, depending on the specific structure and arrangement position of the heat source component 20.

It should be understood that, as shown in fig. 6, in some embodiments, the thermoelectric conversion modules 301 may be plural in number, and plural thermoelectric conversion modules 301 are electrically connected in series in sequence, and two ends of the electric storage unit 302 are electrically connected to the second end of the first semiconductor 3011 of the first thermoelectric conversion module 301 and the second end of the second semiconductor 3012 of the last thermoelectric conversion module 301, respectively, to form a charging circuit. As shown in fig. 6 and 7, the plurality of thermoelectric conversion modules 301 further includes at least one intermediate thermoelectric conversion module 301, and in particular, the electrical connection between any two adjacent thermoelectric conversion modules 301 may be understood as that the second end of the first semiconductor 3011 of the intermediate thermoelectric conversion module 301 is electrically connected to the second end of the second semiconductor 3012 of the previous thermoelectric conversion module 301, and the second end of the second semiconductor 3012 of the intermediate thermoelectric conversion module 301 is electrically connected to the second end of the first semiconductor 3011 of the next thermoelectric conversion module 301.

Optionally, in some embodiments, at least two thermoelectric conversion modules 301 are connected in series by wires and/or conductors.

In particular, the connection of at least two thermoelectric conversion modules 301 in series by wires and/or conductors is understood to mean that any two thermoelectric conversion modules 301 are electrically connected by wires or conductors such that a series relationship is formed between at least two thermoelectric conversion modules 301.

In a specific implementation, any two different thermoelectric conversion modules 301 may be connected in series in different ways. The series connection may be selectively achieved by wires or conductors or other alternative electrical connection means according to the relative positional relationship between any two thermoelectric conversion modules 301.

Optionally, in some embodiments, the first end of the first semiconductor 3011 and the first end of the first semiconductor 3011 are connected by a first conductive connection pad 3013;

the first semiconductor 3011 and the second semiconductor 3012 are abutted to the corresponding heat source member 20 via the first conductive connection piece 3013, and/or

The second end of the first semiconductor 3011 includes a second conductive tab 3014; the second end of the second semiconductor 3012 includes a third conductive connection pad 3015;

the first semiconductor 3011 and the second semiconductor 3012 are abutted against the corresponding cold source member 2 through the second conductive connecting piece 3014 and the third conductive connecting piece 3015, respectively.

The specific manner in which the first semiconductor 3011 and the second semiconductor 3012 are brought into contact with the corresponding heat source member 20 via the first conductive tab 3013 is not limited herein. For example, in some embodiments, the first semiconductor 3011 and the second semiconductor 3012 are directly or indirectly abutted to the corresponding heat source component 20 via the first conductive tabs 3013. Further, the first end of the first semiconductor 3011 and the first end of the second semiconductor 3012 are directly or indirectly abutted to the corresponding heat source component 20 via the second conductive connection tab 3014.

The specific manner in which the second end of the first semiconductor 3011 is abutted to the corresponding heat sink member 2 via the second conductive tab 3014 is not limited herein. For example, in some embodiments, the second end of the first semiconductor 3011 directly abuts or indirectly abuts the corresponding cold source component 2 via the second conductive tab 3014.

The specific manner in which the second end of the second semiconductor 3012 is abutted to the corresponding cold source component 2 via the third conductive connecting piece 3015 is not limited herein. For example, in some embodiments, the second end of the second semiconductor 3012 is directly or indirectly abutted to the corresponding cold source component 2 via the third conductive connection tab 3015.

For convenience of description, in the subsequent embodiments, the first conductive tab 3013, the second conductive tab 3014, and the third conductive tab 3015 are collectively referred to as conductive tabs. That is, the conductive connecting pieces in the subsequent embodiments may be understood as at least one of the first conductive connecting piece 3013, the second conductive connecting piece 3014, and the third conductive connecting piece 3015 without specific description.

It should be understood that the specific materials of the conductive tabs are not limited herein. In particular, the conductive tabs may be any material having conductive capabilities. For example, in some embodiments, the material of the conductive tabs is aluminum or graphene.

Note that in some embodiments, the first end of the first semiconductor 3011 and the first end of the first semiconductor 3011 in at least one of the M semiconductor pairs are connected by the first conductive connection pad 3013; the first semiconductor 3011 and the second semiconductor 3012 are abutted to the corresponding heat source component 20 through the first conductive connection tab 3013, and/or the second end of the first semiconductor 3011 includes a second conductive connection tab 3014; the second end of the second semiconductor 3012 includes a third conductive connection pad 3015; the first semiconductor 3011 and the second semiconductor 3012 are abutted against the corresponding cold source member 2 through the second conductive connecting piece 3014 and the third conductive connecting piece 3015, respectively.

For ease of understanding, any one of the M semiconductor pairs will be exemplified below. The first semiconductor 3011 has a first conductive connection piece 3013 at a first end, a second conductive connection piece 3014 at a second end, the first semiconductor 3011 is in contact with the heat source member 20 via the first conductive connection piece 3013, and the first semiconductor 3011 is in contact with the heat sink member 2 via the second conductive connection piece 3014.

The first end of the second semiconductor 3012 is provided with a first conductive connecting piece 3013, the second end is provided with a third conductive connecting piece 3015, the second semiconductor 3012 is abutted against the heat source component 20 through the first conductive connecting piece 3013, and the second semiconductor 3012 is abutted against the heat sink component 2 through the third conductive connecting piece 3015.

Since the conductive tabs have a heat conduction function, heat of the heat source part 20 may be transferred to the first end of the first semiconductor 3011 and the first end of the second semiconductor 3012 through the corresponding first conductive tab 3013, and heat of the heat sink part 2 may be transferred to the second end of the first semiconductor 3011 through the corresponding second conductive tab 3014 while being transferred to the second end of the second semiconductor 3012 through the corresponding third conductive tab 3015.

It should be appreciated that in order to avoid shorting, the second conductive tab 3014 of the first semiconductor 3011 and the third conductive tab 3015 of the second semiconductor 3012 should be insulated from each other. Specifically, the conductive connection pieces corresponding to one end, where an electrical connection relationship exists, between any two semiconductors may be electrically connected, and other conductive connection pieces may be mutually insulated.

Since the conductive connecting sheet has a conductive function, the first end of the first semiconductor 3011 and the first end of the second semiconductor 3012 are electrically connected by the conductive connecting sheet. The specific manner in which the first end of the first semiconductor 3011 and the first end of the second semiconductor 3012 are electrically connected by the conductive connection pad is not limited herein.

For example, in some embodiments, a first conductive tab 3013 provided at a first end of the first semiconductor 3011 is electrically connected to a first conductive tab 3013 provided at a first end of the second semiconductor 3012 by a target conductive tab. In other embodiments, the first conductive tab 3013 provided at the first end of the first semiconductor 3011 is integrally formed with the first conductive tab 3013 provided at the first end of the second semiconductor 3012.

In the embodiment of the present invention, a first end of the first semiconductor 3011 is provided with a first conductive connection pad 3013, a second end of the first semiconductor 3011 is provided with a second conductive connection pad 3014, and a second end of the second semiconductor 3012 is provided with a third conductive connection pad 3015. The semiconductor is abutted against the corresponding heat source member 20 and heat sink member 2 through the conductive connecting sheet. Because the conductive connecting sheet has the heat conduction and conduction capability, the heat conduction and conduction efficiency between the semiconductor and the cold source component 2 and/or the heat source component 20 can be improved through the arrangement of the conductive connecting sheet, and meanwhile, the contact area and the connection stability between the semiconductor and the cold source component 2 and/or the heat source component 20 are improved.

Optionally, in some embodiments, the portion of the first conductive tab 3013 connected to the corresponding heat source component 20 is provided with a first thermally conductive adhesive 3016, and/or

The second and third conductive connecting pieces 3014 and 3015 are respectively provided with a second heat conductive adhesive 3017 at the portions connected to the corresponding cold source members 2.

In the present embodiment, the portion of the first conductive connecting piece 3013 connected to the corresponding heat source component 20 is provided with a first heat conductive adhesive 3016, and the portions of the second conductive connecting piece 3014 and the third conductive connecting piece 3015 connected to the corresponding heat sink component 2 are provided with a second heat conductive adhesive 3017, respectively. By the arrangement of the first heat-conducting glue 3016 and/or the second heat-conducting glue 3017, on one hand, the heat transfer efficiency between the conductive connecting sheet and the corresponding cold source component 2 or heat source component 20 is further improved, and on the other hand, the connection stability between the conductive connecting sheet and the corresponding cold source component 2 or heat source component 20 is further improved.

Optionally, as shown in fig. 5, in some embodiments, the energy storage device 30 further includes a voltage amplifier 303, where the voltage amplifier 303 is configured to amplify the voltage of the thermoelectric conversion module 301;

one end of the voltage amplifier 303 is electrically connected to a first end of the electric storage unit 302 through the thermoelectric conversion module 301, and a second end of the voltage amplifier 303 is electrically connected to a second end of the electric storage unit 302.

It should be understood that the voltage amplifier 303 may be any electronic component having a circuit amplifying function, where the specific structure of the voltage amplifier 303 is not limited herein. For example, in some embodiments, the voltage amplifier 303 is an amplifying operator.

In the present embodiment, the voltage amplifier 303 is used to amplify the voltage of the thermoelectric conversion module 301 so that the potential difference generated by the thermoelectric conversion module 301 is increased by a voltage value larger than the electric energy stored in the electric storage unit 302. In a specific implementation, the voltage generated by the hot spot conversion module may be smaller, and by setting the voltage amplifier 303, the efficiency of electric energy storage may be improved.

Optionally, as shown in fig. 5, in some embodiments, the energy storage device 30 further includes a control chip 304 and a switch 305, where the control chip 304 is electrically connected to the switch 305 and is used to control on-off of the switch 305, one end of the switch 305 is electrically connected to one end of the electric device through the electric storage unit 302, and the other end of the switch 305 is electrically connected to the other end of the electric device.

It should be understood that the specific structure of the switch 305 is not limited herein. For example, in some embodiments, the switch 305 may be a MOS transistor or a field effect transistor (Field Effect Transistor, FET). It should be understood that the control chip 304 is used to control the on/off of the switch 305, and thus the charge and discharge conditions of the electric storage unit 302. As shown in fig. 5, in the case where the control chip 304 controls the changeover switch 305 to be in the off state, the thermoelectric conversion module 301 charges only the electric storage unit 302. In the case where the control chip 304 controls the changeover switch 305 to be in the on state, the thermoelectric conversion module 301 discharges to the electric device, and the electric storage unit 302 also supplies power to the electric device.

It should be appreciated that in some embodiments, control chip 304 may also adjust and match the power provided by power storage unit 302 and control chip 304 to the powered device.

It should be appreciated that energy storage device 30 also includes a protection element that is connected in series between the powered device and power storage unit 302. The protection element can protect the circuit and avoid the influence of overlarge current on the use of electric equipment. The specific structure of the protection element is not limited herein. For example, in some embodiments, the protection element may be a FUSE (FUSE) or a positive temperature coefficient (Positive Temperature Coefficient, PTC) thermistor.

In the embodiment of the present invention, the energy storage device 30 further includes a control chip 304 and a switch 305, where the control chip 304 is electrically connected to the switch 305 and is used to control on-off of the switch 305, one end of the switch 305 is electrically connected to one end of the electric equipment through the electric storage unit 302, and the other end of the switch 305 is electrically connected to the other end of the electric equipment. Through the arrangement, the electric energy generated by the thermoelectric conversion module 301 can be used for supplying power to the electric equipment, so that the capacity of the battery is increased in a phase-changing manner, and the cruising ability of the electric equipment is prolonged.

The embodiment of the invention also provides an electric system, which comprises electric equipment and the battery, wherein the electric equipment comprises the cold source component 2, and the electric storage unit 302 of the battery is electrically connected with the electric equipment to form a power supply loop.

It should be understood that the specific structure of the powered device is not limited herein. For example, in some embodiments, the powered device is a notebook computer. In other embodiments, the powered device is a cellular phone. The power utilization system comprises electric equipment and the battery, and the battery is installed in the electric equipment and is used for supplying power to the electric equipment.

The electric device comprises a cold source component 2, and the specific structure of the cold source device is not limited herein. For example, in an embodiment in which the powered device is a notebook computer, the cold source device may be a rear cover of the notebook computer. In an embodiment in which the electrical device is a mobile phone, the cold source device may be a mobile phone housing.

It should be noted that, the electric storage unit 302 of the battery is electrically connected with the electric equipment to form a power supply loop, and meanwhile, the electric core of the battery is also electrically connected with the electric equipment to form a power supply loop. Therefore, the capacity of the battery is improved in a phase-changing manner, and the cruising ability of the electric equipment is prolonged.

In the embodiment of the present invention, the power consumption system includes the above-mentioned battery, and the specific structure of the battery in the above-mentioned embodiment may refer to the description in the above-mentioned embodiment, which is not repeated herein. Since the battery in the above embodiment is adopted in the present embodiment, the power consumption system provided in the present embodiment has all the beneficial effects of the battery in the above embodiment.

For ease of understanding, a specific embodiment will be described below as an example to illustrate the practical application of the energy storage device 30. In this embodiment, an embodiment in which a battery is placed in a notebook computer will be described as an example.

Firstly, it should be noted that the battery pack structure scheme provided in this embodiment is a built-in battery, the built-in battery has a plurality of cells in various combination arrangements, and only one of the arrangements is shown in this embodiment.

In the process of charging and discharging the battery, the MOS tube and the TCO in the battery generate heat most seriously, so in this embodiment, the heat source component 20 includes three MOS tubes disposed on the circuit board 50, the TCO disposed on the first side and the TCO disposed on the second side, and the temperature of the back cover at the host end of the notebook computer is the lowest. In the present embodiment, the number of thermoelectric conversion modules 301 is 3, and 3 thermoelectric conversion modules 301 are arranged in one-to-one correspondence with 3 heat source members 20.

As shown in fig. 12 and 13, the number of thermoelectric conversion modules 301 is 3, and the 3 thermoelectric conversion modules 301 are serially connected in order. The heat source component 20 corresponding to the first thermoelectric conversion module 301 is a MOS tube, the heat source component 20 corresponding to the second thermoelectric conversion module 301 is a first TCO, and the heat source component 20 corresponding to the third thermoelectric conversion module 301 is a second TCO. The cold source components 2 corresponding to the 3 thermoelectric conversion modules 301 are all the rear covers of the host end of the notebook computer.

As shown in fig. 6 and 7, a conductive connecting piece is disposed at a first end of the first thermoelectric conversion module 301, and a heat conductive adhesive is disposed on a side of the conductive connecting piece, which is close to the heat source component 20, and the first end of the first thermoelectric conversion module 301 is disposed on the MOS tube. The first end of the second thermoelectric conversion module 301 is provided with a conductive connection piece, and a side of the conductive connection piece, which is close to the heat source component 20, is provided with a heat conductive glue, and the first end of the second thermoelectric conversion module 301 is placed on the first TCO. The first end of the third thermoelectric conversion module 301 is provided with a conductive connection piece, and a side of the conductive connection piece, which is close to the heat source component 20, is provided with a heat conductive glue, and the first end of the third thermoelectric conversion module 301 is placed on the second TCO.

The second end of the first semiconductor 3011 of the first one of the M semiconductor pairs of the first thermoelectric conversion module 301 is electrically connected to the first end of the electric storage unit 302 by a wire. The second end of the second semiconductor 3012 of the last semiconductor pair of the M semiconductor pairs of the first thermoelectric conversion module 301 is electrically connected to the second end of the first semiconductor 3011 of the first semiconductor pair of the M semiconductor pairs of the second thermoelectric conversion module 301 by a conductor.

The second end of the second semiconductor 3012 of the last semiconductor pair of the M semiconductor pairs of the second thermoelectric conversion module 301 is electrically connected to the second end of the first semiconductor 3011 of the first semiconductor pair of the M semiconductor pairs of the third thermoelectric conversion module 301 by a conductor.

The second end of the second semiconductor 3012 of the last semiconductor pair of the M semiconductor pairs of the third thermoelectric conversion module 301 is electrically connected to the second end of the electric storage unit 302 by a wire.

As shown in fig. 9, three through holes are provided in the film, one for each thermoelectric conversion module 301 after the respective components of the battery are mounted. The second end of the thermoelectric conversion module 301 is provided with a conductive connecting sheet, and a side of the conductive connecting sheet, which is close to the cold source component 2, is provided with a heat conducting adhesive, and the second end of the thermoelectric conversion module 301 passes through the corresponding through hole and is located outside the accommodating cavity. After the battery is placed in the notebook computer, the second ends of the 3 thermoelectric conversion modules 301 are all abutted with the rear cover of the host end of the notebook computer.

In the present embodiment, by arranging 3 thermoelectric conversion modules 301, the heat generated by 3 components with the most serious heat generation in the battery is converted into electric energy to be stored in the electric storage unit 302, and at the same time, the thermoelectric conversion modules 301 and the electric storage unit 302 can be controlled to supply power to the notebook electric energy by the control chip 304. Through the arrangement, the heat dissipation efficiency of the MOS tube and the TCO is improved, the temperature of key components such as surrounding chips, electronic components and the like can be synchronously reduced, the working performance and the service life of the lithium ion battery are improved, and the capacity of the battery is improved by phase change.

The foregoing is merely illustrative embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the technical scope of the present invention, and the invention should be covered. Therefore, the protection scope of the invention is subject to the protection scope of the claims.

Claims

1. A battery, comprising:

a first cell;

a heat source component;

2. The battery of claim 1, wherein the first end of the first semiconductor is connected to the first end of the second semiconductor;

3. The battery of claim 1, wherein the second end of the second semiconductor of a first one of the M semiconductor pairs is connected to the second end of the first semiconductor of a subsequent semiconductor pair;

4. The battery of claim 1, wherein the second ends of the first semiconductors of a first one of the M semiconductor pairs are electrically connected to the power storage unit, and the second ends of the second semiconductors of a last one of the M semiconductor pairs are electrically connected to the power storage unit.

5. The battery of claim 1, further comprising a second cell and a circuit board;

6. The battery of claim 5, wherein the battery is configured to provide the battery with a battery cell,

the first battery cell comprises a first shell and a first battery cell body positioned in the first shell, the first shell comprises a first sealing edge, the first battery cell body comprises a first tab extending from the first sealing edge, and/or

7. The battery of claim 6, wherein the number of heat source components is at least one, the heat source components comprising at least one of:

a first temperature switch located on the first seal;

a second temperature switch located on the second seal;

and the field effect transistor is positioned on the circuit board.

8. The battery according to claim 7, wherein the thermoelectric conversion modules are provided corresponding to the heat source member, and at least two of the thermoelectric conversion modules are connected in series in the case where the number of the thermoelectric conversion modules is at least two.

9. The battery according to claim 8, wherein at least two of the thermoelectric conversion modules are connected in series by a wire and/or a conductor.

10. The battery of claim 1, wherein the first end of the first semiconductor and the first end of the second semiconductor are connected by a first conductive connection tab;

11. The battery according to claim 10, wherein the portion of the first conductive connecting piece connected to the corresponding heat source member is provided with a first heat conductive adhesive, and/or

12. The battery of claim 1, wherein the energy storage device further comprises a voltage amplifier for amplifying a voltage of the thermoelectric conversion module;

13. The battery according to claim 1, wherein the energy storage device further comprises a control chip and a change-over switch, the control chip is electrically connected with the change-over switch and is used for controlling on-off of the change-over switch, one end of the change-over switch is electrically connected with one end of the electric equipment through the electric storage unit, and the other end of the change-over switch is electrically connected with the other end of the electric equipment.

14. An electrical system comprising an electrical consumer and a battery as claimed in any one of claims 1 to 13, the electrical consumer comprising a cold source component, an electrical storage unit of the battery being electrically connected to the electrical consumer to form a power supply loop.