CN117391015A - Temperature compensation method, device and equipment for ultrasonic transducer and storage medium - Google Patents
Temperature compensation method, device and equipment for ultrasonic transducer and storage medium Download PDFInfo
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Abstract
The invention provides a temperature compensation method, a device, equipment and a storage medium of an ultrasonic transducer, wherein the method obtains an optimal working impedance value by obtaining temperature experimental data and an impedance calculation formula of the ultrasonic transducer, calculates according to the temperature experimental data and the impedance calculation formula, obtains a compensation capacitance calculation formula, calculates and analyzes according to the temperature experimental data, the optimal working impedance value and the compensation capacitance calculation formula to obtain a capacitance compensation curve of the compensation capacitance changing along with the temperature, selects a variable capacitor according to the capacitance compensation curve, designs a temperature compensation circuit according to the variable capacitor, and adopts the temperature compensation circuit to perform temperature compensation on the ultrasonic transducer. According to the invention, the impedance value of the ultrasonic transducer is adjusted by adopting the variable capacitor, so that the impedance value of the ultrasonic transducer can be kept to be the optimal working impedance value under any temperature adjustment, and further the working efficiency of the ultrasonic transducer is not reduced due to the change of the ambient temperature.
Description
Technical Field
The present invention relates to the field of ultrasound systems, and in particular, to a method, an apparatus, a device, and a storage medium for temperature compensation of an ultrasound transducer.
Background
Ultrasonic transducers are key components in ultrasonic technology that convert electrical energy into mechanical vibrational energy and transfer it into a medium to generate ultrasonic waves, the performance of which directly affects the sensitivity of the system as a core component of an ultrasonic system.
In practical applications, the internal parameters of the ultrasonic transducer are inevitably affected in the face of temperature changes, which results in a decrease in the efficiency of the ultrasonic transducer, and thus reducing the influence of temperature on the ultrasonic transducer is a problem to be solved.
Disclosure of Invention
In view of the foregoing, it is desirable to provide a method, apparatus, device and storage medium for compensating temperature of an ultrasonic transducer, so as to solve the technical problem that the performance of the ultrasonic transducer is reduced due to environmental temperature change.
In order to solve the above problems, the present invention provides a temperature compensation method for an ultrasonic transducer, comprising:
acquiring temperature experimental data and an impedance calculation formula of an ultrasonic transducer, and calculating according to the temperature experimental data and the impedance calculation formula to obtain an optimal working impedance value;
acquiring a compensation capacitance calculation formula, and carrying out calculation analysis according to the temperature experimental data, the optimal working impedance value and the compensation capacitance calculation formula to obtain a capacitance compensation curve of the compensation capacitance changing along with the temperature;
selecting a variable capacitor according to the capacitance compensation curve;
designing a temperature compensation circuit according to the variable capacitor;
and adopting the temperature compensation circuit to perform temperature compensation on the ultrasonic transducer.
Optionally, the acquiring temperature experimental data and an impedance calculation formula of the ultrasonic transducer, and calculating according to the temperature experimental data and the impedance calculation formula to obtain an optimal working impedance value includes:
placing the ultrasonic transducer in a constant temperature experiment box;
carrying out temperature experiments on the ultrasonic transducer by changing the temperature of the constant temperature experiment box to obtain temperature experiment data of the ultrasonic transducer working at different temperatures;
and obtaining the optimal working temperature of the ultrasonic transducer, and calculating according to the optimal working temperature, the temperature experimental data and a preset impedance calculation formula to obtain an optimal working impedance value.
Optionally, before obtaining the temperature experimental data and the impedance calculation formula of the ultrasonic transducer and calculating according to the temperature experimental data and the impedance calculation formula, the method further includes:
acquiring a first equivalent circuit of the ultrasonic transducer;
and analyzing and calculating the equivalent circuit to obtain the impedance calculation formula.
Optionally, before the obtaining the compensation capacitance calculation formula and performing calculation analysis according to the temperature experimental data, the optimal working impedance value and the compensation capacitance calculation formula to obtain a capacitance compensation curve of the compensation capacitance changing along with the temperature, the method further includes:
adding a variable capacitor in a first equivalent circuit of the ultrasonic transducer to obtain a second equivalent circuit;
calculating according to the second equivalent circuit to obtain a calculation relation between the compensation capacitance and the impedance;
substituting the optimal working impedance value into the calculation relation to obtain a compensation capacitance calculation formula.
Optionally, the selecting a variable capacitor according to the capacitance compensation curve includes:
according to the capacitance compensation curve, a variable capacitance diode and a fixed capacitance are selected to form the variable capacitor;
under the condition that the variable capacitor applies corresponding bias voltages at different working temperatures, the curve of the variable capacitor changing along with temperature is close to the capacitance compensation curve.
Optionally, the designing a temperature compensation circuit according to the variable capacitor includes:
designing a controllable voltage output circuit according to the bias voltage;
performing a simulation experiment according to the parameters of the variable capacitor and the controllable voltage output circuit to obtain simulation experiment parameters;
and correcting the controllable voltage output circuit according to the simulation experiment parameters to obtain the final temperature compensation circuit.
Optionally, the controllable voltage output circuit is formed by combining a pulse width modulation output circuit with an amplifier.
Further, the present invention also provides an ultrasonic transducer temperature compensation device, including:
the optimal impedance acquisition module is used for acquiring temperature experimental data and an impedance calculation formula of the ultrasonic transducer, and calculating according to the temperature experimental data and the impedance calculation formula to obtain an optimal working impedance value;
the compensation curve calculation module is used for obtaining a compensation capacitance calculation formula, and carrying out calculation analysis according to the temperature experimental data, the optimal working impedance value and the compensation capacitance calculation formula to obtain a capacitance compensation curve of the compensation capacitance changing along with the temperature;
the capacitance selection module is used for selecting a variable capacitor according to the capacitance compensation curve;
the compensation circuit design module is used for designing a temperature compensation circuit according to the variable capacitor;
and the temperature compensation module is used for carrying out temperature compensation on the ultrasonic transducer by adopting the temperature compensation circuit.
Further, the invention also provides electronic equipment, which comprises a memory and a processor, wherein the memory is used for storing programs;
the processor is coupled to the memory for executing the program stored in the memory to implement the steps in the ultrasound transducer temperature compensation method of any of the above.
Further, the present invention also provides a non-transitory computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements the ultrasound transducer temperature compensation method as described in any of the above.
The beneficial effects of the invention are as follows: according to the temperature compensation method of the ultrasonic transducer, the temperature experimental data and the impedance calculation formula of the ultrasonic transducer are obtained, the optimal working impedance value is obtained through calculation according to the temperature experimental data and the impedance calculation formula, the compensation capacitance calculation formula is obtained, calculation and analysis are carried out according to the temperature experimental data, the optimal working impedance value and the compensation capacitance calculation formula, a capacitance compensation curve of the compensation capacitance changing along with the temperature is obtained, a variable capacitor is selected according to the capacitance compensation curve, a temperature compensation circuit is designed according to the variable capacitor, and the temperature compensation circuit is adopted for carrying out temperature compensation on the ultrasonic transducer. According to the invention, the impedance value of the ultrasonic transducer is adjusted by adopting the variable capacitor, so that the impedance value of the ultrasonic transducer can be kept to be the optimal working impedance value under any temperature adjustment, and further the working efficiency of the ultrasonic transducer is not reduced due to the change of the ambient temperature.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic flow chart of an embodiment of a temperature compensation method for an ultrasonic transducer according to the present invention;
fig. 2 is a schematic flow chart of an embodiment of step S101 in the temperature compensation method of an ultrasonic transducer according to the present invention;
FIG. 3 is a schematic diagram of a first equivalent circuit in the temperature compensation method of the ultrasonic transducer of the present invention;
fig. 4 is a schematic flow chart of an embodiment of the temperature compensation method for an ultrasonic transducer before step S102;
FIG. 5 is a graph of temperature-compensated capacitance of an embodiment of a method for temperature compensation of an ultrasonic transducer according to the present invention;
FIG. 6 is a schematic diagram of an embodiment of an ultrasonic transducer temperature compensation apparatus according to the present invention;
fig. 7 is a schematic structural diagram of an embodiment of an electronic device according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the schematic drawings are not drawn to scale. A flowchart, as used in this disclosure, illustrates operations implemented according to some embodiments of the present invention. It should be appreciated that the operations of the flow diagrams may be implemented out of order and that steps without logical context may be performed in reverse order or concurrently. Moreover, one or more other operations may be added to or removed from the flow diagrams by those skilled in the art under the direction of the present disclosure.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
The embodiment of the invention provides an ultrasonic transducer temperature compensation method, an ultrasonic transducer temperature compensation device, electronic equipment and a storage medium, and the method, the device and the storage medium are respectively described below.
Fig. 1 is a schematic flow chart of an embodiment of a temperature compensation method for an ultrasonic transducer according to the present invention, as shown in fig. 1, which includes:
s101, acquiring temperature experimental data and an impedance calculation formula of an ultrasonic transducer, and calculating according to the temperature experimental data and the impedance calculation formula to obtain an optimal working impedance value;
s102, acquiring a compensation capacitance calculation formula, and carrying out calculation analysis according to temperature experimental data, an optimal working impedance value and the compensation capacitance calculation formula to obtain a capacitance compensation curve of the compensation capacitance changing along with temperature;
s103, selecting a variable capacitor according to a capacitance compensation curve;
s104, designing a temperature compensation circuit according to the variable capacitor;
s105, performing temperature compensation on the ultrasonic transducer by adopting a temperature compensation circuit.
It should be noted that, the ultrasonic transducer is generally composed of a sound absorbing material, an acoustic matching layer, a damping block, piezoelectric ceramics, a backing and a housing; the input end of the ultrasonic transducer is input with a certain power excitation signal, the piezoelectric ceramic generates mechanical vibration to emit ultrasonic waves due to inverse piezoelectric effect, the ultrasonic waves received by the ultrasonic transducer act on the piezoelectric ceramic to cause the accumulation of charges on the upper surface and the lower surface of the piezoelectric ceramic to form potential difference, the backing is used for absorbing the redundant tail vibration of the piezoelectric ceramic, the acoustic matching layer can be coupled with the propagation of ultrasonic waves under different mediums to avoid the overlarge loss of the ultrasonic waves at the medium interface, the shell plays a supporting and fixing role to protect the structure of the ultrasonic transducer from being damaged and to carry out electromagnetic shielding, and the damping block can reduce wafer aftershock and clutter and improve the resolution.
It can be understood that the performance parameters of the ultrasonic transducer include working frequency, electromechanical coupling coefficient, mechanical quality factor, impedance, directional characteristic, efficiency and the like, wherein the ultrasonic transducer needs to be matched with the impedance of the output end of the transmitter and the input end of the receiver, so that the impedance is calculated to be very important, the impedance has a great influence on the ultrasonic transducer, the resonant frequency (namely the optimal working frequency) of the ultrasonic transducer and the impedance thereof are in a nonlinear relation, when the working temperature of the ultrasonic transducer changes, the dielectric constant of a device inside the ultrasonic transducer also changes, so that the impedance value of the ultrasonic transducer changes, the resonant frequency of the ultrasonic transducer also changes, so that the ultrasonic transducer cannot work at the optimal working frequency, and the efficiency of the ultrasonic transducer is reduced.
Compared with the prior art, the temperature compensation method of the ultrasonic transducer provided by the invention obtains the temperature experimental data and the impedance calculation formula of the ultrasonic transducer, calculates according to the temperature experimental data and the impedance calculation formula to obtain the optimal working impedance value, obtains the compensation capacitance calculation formula, calculates and analyzes according to the temperature experimental data, the optimal working impedance value and the compensation capacitance calculation formula to obtain the capacitance compensation curve of the compensation capacitance changing along with the temperature, selects the variable capacitor according to the capacitance compensation curve, designs the temperature compensation circuit according to the variable capacitor, and adopts the temperature compensation circuit to carry out temperature compensation on the ultrasonic transducer. According to the invention, the impedance value of the ultrasonic transducer is adjusted by adopting the variable capacitor, so that the impedance value of the ultrasonic transducer can be kept to be the optimal working impedance value under any temperature adjustment, the working efficiency of the ultrasonic transducer can not be reduced due to the change of the ambient temperature, and the technical problem of performance reduction of the ultrasonic transducer due to the change of the ambient temperature is solved.
Referring to fig. 2, fig. 2 is a schematic flow chart of an embodiment of step S101 in the temperature compensation method for an ultrasonic transducer according to the present invention, and in some embodiments of the present invention, step S101 includes:
s201, placing an ultrasonic transducer in a constant temperature experiment box;
s202, performing temperature experiments on the ultrasonic transducer by changing the temperature of a constant temperature experiment box to obtain temperature experiment data of the ultrasonic transducer working at different temperatures;
s203, obtaining the optimal working temperature of the ultrasonic transducer, and calculating according to the optimal working temperature, temperature experimental data and a preset impedance calculation formula to obtain an optimal working impedance value.
It can be understood that in the embodiment of the invention, an ultrasonic transducer is placed in a constant temperature experiment box, impedance analyzers are adopted to measure impedance, working frequency, piezoelectricity and other parameters of the ultrasonic transducer, the optimal working temperature of the ultrasonic transducer is obtained, the optimal working impedance value is calculated according to experimental parameters corresponding to the optimal working temperature, in a specific experiment, a PZT-5 type ultrasonic transducer can be adopted, a UC8020 type impedance analyzer is adopted, 25 ℃ is selected as the optimal working temperature, a probe on one side of the ultrasonic transducer is connected with the impedance analyzer so as to monitor impedance and other parameter changes in real time, and a probe on the other side of the ultrasonic transducer is placed in the constant temperature box so as to realize heating or cooling control. And calculating according to the parameters collected at 25 ℃ to obtain the optimal working impedance value.
In some embodiments of the present invention, before step S101, the method further includes:
acquiring a first equivalent circuit of an ultrasonic transducer;
and (5) analyzing and calculating the equivalent circuit to obtain an impedance calculation formula.
It should be noted that, the corresponding equivalent circuit diagram may be obtained by analyzing the characteristics of the ultrasonic transducer, the first equivalent circuit refers to an equivalent circuit diagram of the ultrasonic transducer without the variable capacitor connected in parallel, referring to fig. 3, fig. 3 is a schematic structural diagram of the first equivalent circuit in the temperature compensation method of the ultrasonic transducer according to the present invention, and the impedance calculation formula of the ultrasonic transducer may be obtained from the diagram:
wherein Z is impedance, C is equivalent capacitance, C 0 Is static capacitance, L is equivalent inductance, R is equivalent resistance,Is the resonant angular frequency.
Referring to fig. 4, fig. 4 is a schematic flow chart of an embodiment of the temperature compensation method for an ultrasonic transducer before step S102, and in some embodiments of the present invention, before step S102, the method includes:
s401, adding a variable capacitor in a first equivalent circuit of an ultrasonic transducer to obtain a second equivalent circuit;
s402, calculating according to the second equivalent circuit to obtain a calculation relation between the compensation capacitance and the impedance;
s403, substituting the optimal working impedance value into a calculation relation to obtain a compensation capacitance calculation formula.
It can be appreciated that in the embodiment of the present invention, since the temperature change affects each parameter of the ultrasonic transducer, resulting in impedance change and thus power reduction, a variable capacitor needs to be connected to perform temperature compensation to maintain the impedance of the ultrasonic transducer unchanged.
In order to determine the size and the variable range of the variable capacitor, the present embodiment adds an ideal variable capacitor meeting the requirement to the first equivalent circuit, and obtains an ultrasonic transducer to add the ideal variable capacitor C j The second equivalent circuit is analyzed to obtain the admittance calculation formula of the second equivalent circuit as follows:
。
it will be appreciated that admittance is the inverse of impedance, and as can be seen from the above admittance calculation formula, the parameters of the ultrasound transducer change as the temperature changes, by adjusting C j Impedance compensation is carried out on the value of the ultrasonic transducer, so that the total impedance value of the ultrasonic transducer is kept unchanged; the embodiment of the invention substitutes the optimal working admittance value (namely the optimal working impedance value) into the admittance calculation formula and carries out corresponding conversion to obtain the calculation formula of the variable capacitor (namely the compensation capacitance calculation formula), and the value of the equivalent circuit R, the value of the equivalent capacitance C and the static capacitance C of the ultrasonic transducer collected at different temperatures in a temperature experiment are calculated 0 Substituting the value of the equivalent inductance L and the value of the equivalent inductance L into a calculation formula of the variable capacitor to obtain capacitance values of the variable capacitor at different temperatures, and drawing a temperature-compensation capacitance curve graph according to the capacitance values corresponding to the different temperatures, wherein the temperature-compensation capacitance curve graph can refer to fig. 5.
In some embodiments of the present invention, step S103 includes:
according to the capacitance compensation curve, a variable capacitor is formed by selecting a variable capacitance diode and a fixed capacitance;
under the condition that corresponding bias voltages are applied to the variable capacitor at different working temperatures, the curve of the variable capacitor changing along with the temperature is close to the capacitance compensation curve.
It will be appreciated that in embodiments of the invention, the capacitance value of the variable capacitor at which the bias voltage acts should be consistent with the capacitance compensation curve; because the capacitance value of the varactor diode is generally smaller, a fixed capacitor is selected for corresponding compensation, in specific implementation, a plurality of variable capacitors and a plurality of fixed capacitors can be selected to form a variable capacitor according to specific requirements, and different bias voltages are applied to a plurality of different varactors, so that the variable capacitor keeps the impedance value of the ultrasonic transducer unchanged when the working temperature of the ultrasonic transducer changes.
In some embodiments of the present invention, step S104 includes:
designing a controllable voltage output circuit according to the bias voltage;
performing simulation experiments according to parameters of the variable capacitor and the controllable voltage output circuit to obtain simulation experiment parameters;
and correcting the controllable voltage output circuit according to the simulation experiment parameters to obtain a final temperature compensation circuit.
It will be appreciated that when designing the corresponding variable capacitor, the bias voltage control mode of the variable capacitor is also designed, and the control mode is that one working temperature of the ultrasonic transducer corresponds to one bias voltage output combination, if the variable capacitor comprises a plurality of varactors, a plurality of bias voltage outputs should exist, and one bias voltage output corresponds to one varactor.
It should be understood that, in the embodiment of the present invention, the controllable voltage output circuit is designed by using a chip in combination with a peripheral circuit such as a filter circuit and an amplifying circuit, specifically, an Apollo development board STM32F429 may be used to output a required voltage value after modulating and filtering a PWM wave, but the maximum value of the output voltage of the Apollo development board STM32F429 is only 3.3V, and the bias voltage required by the variable capacitor is greater than 3.3V at some temperatures, so that an operational amplifier is required to amplify the output voltage of the Apollo development board STM32F429 and output the amplified output voltage to the variable capacitor, so that the final output voltage value reaches the required purpose.
It should be noted that, in the embodiment of the present invention, in order to further ensure that the controllable voltage output circuit can meet the control of the variable capacitor, simulation software is used to perform a simulation experiment on the controllable voltage output circuit, and corresponding parameter modification is performed according to the experimental result.
In some embodiments of the invention, the controllable voltage output circuit is comprised of a pulse width modulated output circuit in combination with an amplifier.
It will be appreciated that in the embodiment of the present invention, the controllable voltage output circuit is used to output a voltage that meets the requirements of the variable capacitor, the pulse width modulation circuit is generally formed by a chip, the voltage output by the chip is generally smaller, and the bias voltage required by the variable capacitor may exceed the range of the voltage that can be output by the chip, so that an amplifier is required to amplify the output voltage.
Referring to fig. 6, fig. 6 is a schematic structural diagram of an embodiment of an ultrasonic transducer temperature compensation device according to the present invention.
Further, an embodiment of the present invention further provides an ultrasonic transducer temperature compensation device, including:
the optimal impedance obtaining module 601 is configured to obtain temperature experimental data and an impedance calculation formula of the ultrasonic transducer, and calculate according to the temperature experimental data and the impedance calculation formula to obtain an optimal working impedance value;
the compensation curve calculation module 602 is configured to obtain a compensation capacitance calculation formula, and perform calculation and analysis according to the temperature experimental data, the optimal working impedance value, and the compensation capacitance calculation formula, so as to obtain a capacitance compensation curve of the compensation capacitance changing along with the temperature;
the capacitance selecting module 603 is configured to select a variable capacitor according to a capacitance compensation curve;
a compensation circuit design module 604 for designing a temperature compensation circuit according to the variable capacitor;
the temperature compensation module 605 is used for performing temperature compensation on the ultrasonic transducer by adopting a temperature compensation circuit.
The temperature compensation device for an ultrasonic transducer provided in the foregoing embodiment may implement the scheme described in the foregoing embodiment of the temperature compensation method for an ultrasonic transducer, and the specific principles of the foregoing units may refer to the embodiment of the temperature compensation method for an ultrasonic transducer, which is not described herein again.
Referring to fig. 7, the present invention also provides an electronic device 700, the electronic device 700 comprising a processor 701, a memory 702 and a display 703. Fig. 7 shows only some of the components of the electronic device 700, but it should be understood that not all of the illustrated components are required to be implemented and that more or fewer components may be implemented instead.
The processor 701 may be a central processing unit (CentralProcessingUnit, CPU), microprocessor or other data processing chip in some embodiments for executing program code or processing data stored in the memory 702, such as the ultrasound transducer temperature compensation method of the present invention.
In some embodiments, the processor 701 may be a single server or a group of servers. The server farm may be centralized or distributed. In some embodiments, the processor 701 may be local or remote. In some embodiments, the processor 701 may be implemented in a cloud platform. In an embodiment, the cloud platform may include a private cloud, a public cloud, a hybrid cloud, a community cloud, a distributed cloud, an inter-internal, multiple clouds, or the like, or any combination thereof.
The memory 702 may be an internal storage unit of the electronic device 700 in some embodiments, such as a hard disk or memory of the electronic device 700. The memory 702 may also be an external storage device of the electronic device 700 in other embodiments, such as a plug-in hard disk provided on the electronic device 700, a smart memory card (SmartMediaCard, SMC), a secure digital (SecureDigital, SD) card, a flash card (FlashCard), or the like.
Further, the memory 702 may also include both internal storage units and external storage devices of the electronic device 700. The memory 702 is used for storing application software and various types of data for installing the electronic device 700.
The display 703 may be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, an OLED (organic light-emitting diode) touch, or the like in some embodiments. The display 703 is used for displaying information on the electronic device 700 and for displaying a visual user interface. The components 701-703 of the electronic device 700 communicate with each other over a system bus.
In one embodiment, when the processor 701 executes the ultrasound transducer temperature compensation program in the memory 702, the following steps may be implemented:
acquiring temperature experimental data and an impedance calculation formula of an ultrasonic transducer, and calculating according to the temperature experimental data and the impedance calculation formula to obtain an optimal working impedance value;
acquiring a compensation capacitance calculation formula, and carrying out calculation analysis according to temperature experimental data, an optimal working impedance value and the compensation capacitance calculation formula to obtain a capacitance compensation curve of the compensation capacitance changing along with temperature;
selecting a variable capacitor according to the capacitance compensation curve;
designing a temperature compensation circuit according to the variable capacitor;
and adopting a temperature compensation circuit to perform temperature compensation on the ultrasonic transducer.
It should be appreciated that the processor 701 may perform other functions in addition to the above functions when executing the ultrasound transducer temperature compensation program in the memory 702, particularly as described above with respect to the corresponding method embodiments.
Further, the type of the electronic device 700 is not particularly limited, and the electronic device 700 may be a mobile phone, a tablet computer, a Personal Digital Assistant (PDA), a wearable device, a laptop computer (laptop), or other portable electronic devices. Exemplary embodiments of portable electronic devices include, but are not limited to, portable electronic devices that carry IOS, android, microsoft or other operating systems. The portable electronic device described above may also be other portable electronic devices, such as a laptop computer (laptop) or the like having a touch-sensitive surface, e.g. a touch panel. It should also be appreciated that in other embodiments of the invention, the electronic device 700 may not be a portable electronic device, but rather a desktop computer having a touch-sensitive surface (e.g., a touch panel).
In yet another aspect, the present invention also provides a non-transitory computer readable storage medium having stored thereon a computer program which, when executed by a processor, is implemented to perform the ultrasound transducer temperature compensation method provided by the above methods, the method comprising:
acquiring temperature experimental data and an impedance calculation formula of an ultrasonic transducer, and calculating according to the temperature experimental data and the impedance calculation formula to obtain an optimal working impedance value;
acquiring a compensation capacitance calculation formula, and carrying out calculation analysis according to temperature experimental data, an optimal working impedance value and the compensation capacitance calculation formula to obtain a capacitance compensation curve of the compensation capacitance changing along with temperature;
selecting a variable capacitor according to the capacitance compensation curve;
designing a temperature compensation circuit according to the variable capacitor;
and adopting a temperature compensation circuit to perform temperature compensation on the ultrasonic transducer.
Those skilled in the art will appreciate that all or part of the flow of the methods of the embodiments described above may be accomplished by way of a computer program that instructs associated hardware, and that the program may be stored in a computer readable storage medium. The computer readable storage medium is a magnetic disk, an optical disk, a read-only memory or a random access memory.
The present invention is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present invention are intended to be included in the scope of the present invention.
Claims (10)
1. A method of temperature compensation for an ultrasonic transducer, comprising:
acquiring temperature experimental data and an impedance calculation formula of an ultrasonic transducer, and calculating according to the temperature experimental data and the impedance calculation formula to obtain an optimal working impedance value;
acquiring a compensation capacitance calculation formula, and carrying out calculation analysis according to the temperature experimental data, the optimal working impedance value and the compensation capacitance calculation formula to obtain a capacitance compensation curve of the compensation capacitance changing along with the temperature;
selecting a variable capacitor according to the capacitance compensation curve;
designing a temperature compensation circuit according to the variable capacitor;
and adopting the temperature compensation circuit to perform temperature compensation on the ultrasonic transducer.
2. The method for temperature compensation of an ultrasonic transducer according to claim 1, wherein the steps of obtaining temperature experimental data and an impedance calculation formula of the ultrasonic transducer, and calculating according to the temperature experimental data and the impedance calculation formula to obtain an optimal working impedance value include:
placing the ultrasonic transducer in a constant temperature experiment box;
carrying out temperature experiments on the ultrasonic transducer by changing the temperature of the constant temperature experiment box to obtain temperature experiment data of the ultrasonic transducer working at different temperatures;
and obtaining the optimal working temperature of the ultrasonic transducer, and calculating according to the optimal working temperature, the temperature experimental data and a preset impedance calculation formula to obtain an optimal working impedance value.
3. The method for temperature compensation of an ultrasonic transducer according to claim 1, wherein the steps of obtaining temperature experimental data and an impedance calculation formula of the ultrasonic transducer, and calculating according to the temperature experimental data and the impedance calculation formula, before obtaining an optimal working impedance value, further comprise:
acquiring a first equivalent circuit of the ultrasonic transducer;
and analyzing and calculating the equivalent circuit to obtain the impedance calculation formula.
4. The method for temperature compensation of an ultrasonic transducer according to claim 3, wherein before obtaining a capacitance compensation curve of the compensation capacitance with temperature change by obtaining a compensation capacitance calculation formula and performing calculation analysis according to the temperature experimental data, the optimal working impedance value and the compensation capacitance calculation formula, the method further comprises:
adding a variable capacitor in a first equivalent circuit of the ultrasonic transducer to obtain a second equivalent circuit;
calculating according to the second equivalent circuit to obtain a calculation relation between the compensation capacitance and the impedance;
substituting the optimal working impedance value into the calculation relation to obtain a compensation capacitance calculation formula.
5. The method of temperature compensation of an ultrasonic transducer of claim 1, wherein selecting a variable capacitor according to the capacitance compensation curve comprises:
according to the capacitance compensation curve, a variable capacitance diode and a fixed capacitance are selected to form the variable capacitor;
under the condition that the variable capacitor applies corresponding bias voltages at different working temperatures, the curve of the variable capacitor changing along with temperature is close to the capacitance compensation curve.
6. The ultrasonic transducer temperature compensation method of claim 5, wherein the designing a temperature compensation circuit according to the variable capacitor comprises:
designing a controllable voltage output circuit according to the bias voltage;
performing a simulation experiment according to the parameters of the variable capacitor and the controllable voltage output circuit to obtain simulation experiment parameters;
and correcting the controllable voltage output circuit according to the simulation experiment parameters to obtain the final temperature compensation circuit.
7. The method of temperature compensation of an ultrasonic transducer of claim 1, wherein the controllable voltage output circuit is comprised of a pulse width modulated output circuit in combination with an amplifier.
8. An ultrasonic transducer temperature compensation device, comprising:
the optimal impedance acquisition module is used for acquiring temperature experimental data and an impedance calculation formula of the ultrasonic transducer, and calculating according to the temperature experimental data and the impedance calculation formula to obtain an optimal working impedance value;
the compensation curve calculation module is used for obtaining a compensation capacitance calculation formula, and carrying out calculation analysis according to the temperature experimental data, the optimal working impedance value and the compensation capacitance calculation formula to obtain a capacitance compensation curve of the compensation capacitance changing along with the temperature;
the capacitance selection module is used for selecting a variable capacitor according to the capacitance compensation curve;
the compensation circuit design module is used for designing a temperature compensation circuit according to the variable capacitor;
and the temperature compensation module is used for carrying out temperature compensation on the ultrasonic transducer by adopting the temperature compensation circuit.
9. An electronic device comprising a memory and a processor, wherein the memory is configured to store a program;
the processor is coupled to the memory for executing the program stored in the memory for implementing the steps in the ultrasound transducer temperature compensation method of any of the preceding claims 1-7.
10. A non-transitory computer readable storage medium, having stored thereon a computer program, which when executed by a processor implements the ultrasound transducer temperature compensation method according to any of claims 1-7.
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| CN202311641476.9A CN117391015A (en) | 2023-12-04 | 2023-12-04 | Temperature compensation method, device and equipment for ultrasonic transducer and storage medium |
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Citations (5)
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|---|---|---|---|---|
| DE10027348A1 (en) * | 1999-06-03 | 2000-12-07 | Bosch Robert Corp | Circuit in capacitive distributor of an ultrasonic transducer for transmitting pulses and receiving ultrasound echo signals |
| JP2001017916A (en) * | 1999-07-09 | 2001-01-23 | Murata Mfg Co Ltd | Ultrasonic circuit |
| GB201201992D0 (en) * | 2012-02-03 | 2012-03-21 | Power Electronic Measurements Ltd | Temperature compensated current measurement |
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| CN108663411A (en) * | 2018-03-24 | 2018-10-16 | 北京工业大学 | A kind of temperature-compensation method of electromechanics impedance structure damage monitoring |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10027348A1 (en) * | 1999-06-03 | 2000-12-07 | Bosch Robert Corp | Circuit in capacitive distributor of an ultrasonic transducer for transmitting pulses and receiving ultrasound echo signals |
| JP2001017916A (en) * | 1999-07-09 | 2001-01-23 | Murata Mfg Co Ltd | Ultrasonic circuit |
| GB201201992D0 (en) * | 2012-02-03 | 2012-03-21 | Power Electronic Measurements Ltd | Temperature compensated current measurement |
| JP2014048246A (en) * | 2012-09-03 | 2014-03-17 | National Univ Corp Shizuoka Univ | Physical quantity detection system, physical quantity detection method, and physical quantity detection program |
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