CN117381661A - Polishing head assembly and substrate polishing method - Google Patents

Polishing head assembly and substrate polishing method Download PDF

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Publication number
CN117381661A
CN117381661A CN202311498101.1A CN202311498101A CN117381661A CN 117381661 A CN117381661 A CN 117381661A CN 202311498101 A CN202311498101 A CN 202311498101A CN 117381661 A CN117381661 A CN 117381661A
Authority
CN
China
Prior art keywords
air bag
substrate
polishing head
module
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311498101.1A
Other languages
Chinese (zh)
Inventor
尹影
庞浩
李婷
边润立
司马超
于然
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Jingyi Precision Technology Co ltd
Original Assignee
Beijing Jingyi Precision Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Jingyi Precision Technology Co ltd filed Critical Beijing Jingyi Precision Technology Co ltd
Priority to CN202311498101.1A priority Critical patent/CN117381661A/en
Publication of CN117381661A publication Critical patent/CN117381661A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • B24B37/30Work carriers for single side lapping of plane surfaces
    • B24B37/32Retaining rings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories

Abstract

The invention discloses a polishing head assembly and a substrate polishing method, wherein the polishing head assembly comprises an air bag module, a plurality of independent cavities are formed in the air bag module, the air bag module comprises a plurality of air bag units, and two adjacent air bag units are mutually and independently formed or share one side wall, so that the air pressure in each cavity can be respectively controlled, the pressure applied to different areas of a substrate can be respectively controlled, the pressure borne by the substrate is matched with the pressure required by the substrate, and the uniformity of substrate grinding is ensured.

Description

Polishing head assembly and substrate polishing method
Technical Field
The invention relates to the technical field of polishing, in particular to a polishing head assembly and a substrate polishing method.
Background
In the process of integrated circuit manufacturing, CMP (chemical mechanical polishing) equipment is mainly used for global planarization of a micro rough surface of a substrate after a film deposition process. Such planarization methods typically require mounting the substrate on a polishing head of a CMP apparatus and polishing the surface to be polished on the substrate against a rotating polishing pad.
The conventional polishing head comprises an air bag, as shown in fig. 1, and a membrane cavity is arranged in the air bag. When the polishing is needed, the film cavity is inflated, the air bag is inflated and deformed to the substrate, the substrate is extruded on the polishing pad, and the surface to be polished on the substrate is polished along with the rotation of the polishing pad.
However, the conventional airbag has the following disadvantages: because the membrane cavity is a cavity, although the membrane cavity is divided into a plurality of areas, the pressure in each area of the membrane cavity is the same, so the pressure on different areas of the substrate is the same, however, in the grinding process, the pressure required by the different areas of the substrate is different, the pressure applied to the substrate by the air bag is not matched with the pressure required by the substrate, and finally the grinding uniformity is poor.
In view of the above-described shortcomings, it is desirable to design a polishing head assembly and a substrate polishing method.
Disclosure of Invention
Therefore, the technical problem to be solved by the invention is that only one film cavity is arranged in the air bag in the conventional polishing head, and the pressures in all parts of the film cavity are the same, so that the pressure applied to the substrate by the air bag is mismatched with the pressure required by the substrate, and the polishing uniformity is poor, thereby providing the polishing head assembly and the substrate polishing method.
In order to solve the technical problems, the technical scheme of the invention is as follows:
the polishing head assembly comprises an air bag module, wherein a plurality of independent cavities are formed in the air bag module, the air bag module comprises a plurality of air bag units, and two adjacent air bag units are independently formed or share a side wall.
Further, the air bag unit is an air bag ring, and a plurality of air bag rings are sequentially arranged along the radial direction of the air bag module.
Further, the device also comprises a briquetting module, wherein the briquetting module is arranged at the bottom of the air bag module, the cavity is pressurized, and the pressure is conducted to the substrate through the briquetting module.
Further, the briquetting module comprises a plurality of briquetting units, and the briquetting units are connected to the bottoms of the air bag units in a one-to-one correspondence mode.
Further, the air bag unit and the briquetting unit are connected together through magnetic force, or the air bag unit and the briquetting unit are connected together through a sealing connector in a sealing manner.
Further, the air bag fixing device is further arranged, and the air bag fixing device is connected with the top of the air bag module.
Further, still include the adventitia structure, the gasbag module the briquetting module with the gasbag mounting is all installed in the chamber that holds of adventitia structure.
Further, the polishing head comprises a retaining ring and a polishing head body, wherein the polishing head body covers the outer membrane structure, and the outer membrane structure is pressed on the polishing head body by the retaining ring.
The technical scheme of the invention has the following advantages:
1. the polishing head assembly provided by the invention comprises an air bag module, wherein a plurality of independent cavities are formed in the air bag module, the air bag module comprises a plurality of air bag units, and two adjacent air bag units are mutually independently formed or share one side wall, so that the air pressure in each cavity can be respectively controlled, the pressures applied to different areas of a substrate can be respectively controlled, the pressure born by the substrate is matched with the pressure required by the substrate, and the uniformity of grinding the substrate is ensured.
2. The polishing head assembly provided by the invention comprises a plurality of pressing block units, wherein the pressing block units are connected to the bottoms of the air bag units in a one-to-one correspondence manner, so that the pressure of the air bag units can be directly and quickly conducted through the pressing block units, the efficiency of pressure conduction is improved, and the pressing effect on a substrate can be ensured by utilizing the hard characteristic of the pressing block units compared with the air bag units with soft textures.
3. According to the polishing head assembly provided by the invention, the air bag unit and the pressing block unit are connected together under the action of magnetic force, the assembly is simple and convenient, the air bag unit and the pressing block unit are connected together in a sealing way through the sealing connecting piece, and the cost is low.
4. The polishing head assembly provided by the invention further comprises an outer membrane structure, and the air bag module, the pressing block module and the air bag fixing piece are all arranged in the accommodating cavity of the outer membrane structure, so that the pressure in the air bag module can be transmitted to the outer membrane structure through the pressing block module and pushes the outer membrane structure to be pressed against the substrate, and the integrated outer membrane structure reduces process fluctuation with small amplitude and short interval, so that the polishing uniformity is integrally controlled.
A substrate polishing method, which adopts the polishing head assembly, comprises the following polishing steps:
each chamber is in a positive pressure state one by one from the inner side to the outer side of the air bag module, so that the accommodating cavity of the outer membrane structure is in a positive pressure state, and the pressure in the chamber and the accommodating cavity is transmitted to the substrate through the briquetting module to press the substrate to the grinding pad for grinding;
and adjusting the pressure in the corresponding cavity, and changing the pressure born by the corresponding area on the substrate to ensure that each area on the substrate is uniformly polished.
Further, before the polishing step, a slide step is further included:
the accommodating cavity is in a micro positive pressure state, and each cavity is in a positive pressure state one by one from the inner side to the outer side of the air bag module so as to discharge liquid on the substrate, and the outer film structure is in contact with the substrate;
and enabling the adjacent three chambers in the edge area to be in a negative pressure state, and enabling the corresponding air bag units to shrink to drive the corresponding briquetting units in the briquetting module to move upwards, and enabling the outer membrane structure to move upwards along with the briquetting units, so that gaps between the corresponding areas on the outer membrane structure and the substrate are increased, air pressure is reduced, and the substrate is adsorbed by the polishing head assembly under the pressure difference between the inner side and the outer side.
The technical scheme of the invention has the following advantages:
the substrate polishing method provided by the invention can respectively control the air pressure in each cavity so as to respectively control the pressure applied to different areas of the substrate, so that the pressure born by the substrate is matched with the pressure required by the substrate, and the uniformity of substrate polishing is ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a partial structure of an air bag according to the prior art;
FIG. 2 is a schematic diagram illustrating connection of an airbag module, a briquette module, an outer membrane structure and an airbag fixing member according to an embodiment of the present invention;
FIG. 3 is a top view of an airbag module according to an embodiment of the invention;
FIG. 4 is a schematic illustration of one connection of an airbag fastener, an airbag unit, and a briquette unit in an embodiment of the invention;
FIG. 5 is a schematic illustration of another connection of an airbag fastener, an airbag unit, and a briquette unit in an embodiment of the invention;
fig. 6 is a schematic view of a polishing head assembly according to an embodiment of the present invention.
Reference numerals illustrate:
1. a polishing head body; 2. an outer membrane structure; 3. a retaining ring; 4. an air bag unit; 41. a chamber; 5. a briquetting unit; 61. a magnet; 62. iron blocks; 71. a sealing screw; 72. a sealing compression ring structure; 8. an air bag fixing piece.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features of the different embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
As shown in fig. 2 to 6, the present embodiment provides a polishing head assembly including a polishing head main body 1, an outer membrane structure 2, a retainer ring 3, an air bag module, a press block module, and an air bag fixing member 8. The polishing head assembly is used to hold a substrate (not shown) and press the substrate against a polishing pad (not shown) so that the polishing pad polishes a surface to be polished on the substrate.
The polishing head main body 1 is connected to a motor, and is driven by the motor to rotate about its own axis.
The airbag module includes a plurality of airbag units 4. Each airbag unit 4 has a chamber 41 formed therein. In this embodiment, the air bag units 4 are annular, called as air bag rings, and a plurality of air bag rings are concentrically arranged, and for convenience of description, the 1 st air bag, the 2 nd air bag, the 3 rd air bag, the … … th air bag and the nth air bag of each air bag unit 4 are defined outwards from the center of the air bag module, and the corresponding chambers 41 are the 1 st chamber, the 2 nd chamber, the 3 rd chamber, the … … th chamber and the nth chamber. The plurality of airbag units 4 are arranged coplanar on the side facing the substrate. In the present embodiment, each airbag unit 4 is independently molded. When the air bag units 4 are not inflated, two adjacent air bag units 4 can be arranged in a clearance way. After inflation of the airbag units 4, adjacent airbag units 4 are connected, so that it is ensured that each region of the substrate is subjected to pressure from the airbag unit 4. In other embodiments, a plurality of airbag units 4 are integrally connected, and two adjacent airbag units 4 share a side wall. The plurality of air bag units 4 are respectively connected to respective pressure supply lines (not shown) so as to control the pressure in the chambers 41 of the air bag units 4 by the corresponding pressure supply lines.
The briquetting module comprises a plurality of briquetting units 5. The briquette units 5 are also annular, and a plurality of briquette units 5 are also concentrically arranged. In this embodiment, the briquetting units 5 are in one-to-one correspondence with the air bag units 4, the briquetting units 5 are connected below the air bag units 4, and after inflation, each air bag unit 4 transmits pressure to the substrate through the corresponding briquetting unit 5. In other embodiments, one briquette unit 5 may correspond to two or more airbag units 4. The briquetting unit 5 is made of nonmetallic hard material. The briquette unit 5 and the airbag unit 4 are fixed to each other. As an embodiment, the briquette unit 5 and the air bag unit 4 are attracted together by magnetic force, for example, a magnet 61 is provided in the briquette unit 5, an iron piece 62 is provided in the air bag unit 4, or an iron piece 62 is provided in the briquette unit 5, a magnet 61 is provided in the air bag unit 4, or a magnet 61 is provided in both the air bag unit 4 and the briquette unit 5, in which embodiment, the assembly of the air bag unit 4 and the briquette unit 5 is easy. As another embodiment, the air bag unit 4 and the press block unit 5 are connected together in a sealing manner by a sealing connection member (in this example, a sealing screw 71 or a sealing bolt), specifically, a sealing press ring structure 72 is provided at the bottom of the air bag unit 4, and the sealing screw 71 penetrates through the sealing press ring structure 72 to connect the air bag unit 4 and the press block unit 5 together, in this embodiment, the connection cost is low.
The airbag fixture 8 is attached to the top of the airbag unit 4. As an embodiment, the air bag fixing member 8 and the air bag unit 4 are also connected together through a sealing connection member, and similarly, a sealing compression ring structure 72 needs to be arranged at the top of the air bag unit 4, and a sealing screw 71 penetrates through the sealing compression ring structure 72 to connect the air bag fixing member 8 and the air bag unit 4 together in a sealing manner. As another embodiment, the airbag fixture 8 and the airbag unit 4 are attracted together by magnetic force.
The outer membrane structure 2 has a receiving cavity (not labeled) formed therein. The air bag module, the pressing block module and the air bag fixing piece 8 are all arranged in the outer film structure 2. The outer membrane structure 2 is pressed and fixed on the polishing head main body 1 through the retaining ring 3.
The method of assembling the polishing assembly provided in this embodiment is described below:
a plurality of air bag units 4 are concentrically arranged in sequence from inside to outside;
the bottom of each air bag unit 4 is correspondingly and fixedly connected with a pressing block unit 5;
fixedly connecting an airbag fixing member 8 with the top of each airbag unit 4;
the outer membrane structure 2 is arranged at the periphery of the air bag module, the pressing block module and the air bag fixing piece 8;
the outer membrane structure 2 is pressed and fixed on the polishing head main body 1 by the retaining ring 3.
The working procedure of the polishing head assembly provided in this embodiment is described below:
slide (adsorption of substrate):
the inner air bag unit 4 to the outer air bag unit 4 are inflated into the chamber 41 of the corresponding air bag unit 4 through the corresponding pressure supply pipeline to realize positive pressure (about 2psi to 3 psi) one by the corresponding pressure supply device corresponding to the outer film structure 2 so as to discharge liquid such as water on the substrate and contact the outer film structure 2 with the substrate;
controlling the air pressure in the three chambers 41 of the edge area, in this embodiment, the three chambers are the 3 rd chamber, the 4 th chamber and the 5 th chamber respectively, so that the three chambers are in a negative pressure state, the corresponding air bag units 4 shrink to drive the corresponding briquetting units 5 to move upwards, the gap between the corresponding area on the outer membrane structure 2 and the substrate is increased, the air pressure is reduced, and the substrate is adsorbed by the outer membrane structure 3 by virtue of the pressure difference between the inner side and the outer side; three chambers 41 in the edge area, such as the 3 rd chamber, the 4 th chamber and the 5 th chamber, are selected to be in a negative pressure state so as to increase the adsorption area;
in order to ensure the reliability of adsorption, an exhaust valve (not shown) of the 2 nd chamber is opened to enable the 2 nd chamber to be in a normal pressure state, then the exhaust valve is closed, meanwhile, the pressure change in the 2 nd chamber is detected, if the pressure of the 2 nd chamber gradually changes to be negative pressure and exceeds a preset negative pressure value, the adsorption is reliable, a substrate can be sucked up and moved, specifically, the 2 nd chamber is communicated with the 3 rd chamber, the 4 th chamber or the 5 th chamber through a pipeline, an air inlet control valve is arranged on the pipeline, an air inlet valve is fixed on a briquetting unit 5 corresponding to the 2 nd chamber, and under normal conditions, the air inlet valve is propped by a spring and is in a closed state, and when the pressure is basically adsorbed to move towards the briquetting unit 5, the air inlet control valve is propped up, so that the 2 nd chamber is communicated with other chambers of negative pressure, and the 2 nd chamber gradually enters into a negative pressure state; the 2 nd chamber is selected instead of the 1 st chamber, so as to avoid false alarm of slide failure caused by insufficient distance of the substrate moving towards the briquetting unit 5 corresponding to the 1 st chamber.
Polishing: the N, … …, 3, 2 and 1 chambers are inflated sequentially from inside to outside to enable the chambers to be in a positive pressure state, and simultaneously the accommodating chambers of the outer membrane structures 2 are inflated according to process requirements to enable the accommodating chambers to be in a positive pressure state, and the pressure in the chambers 41 is transferred to the substrate through the briquetting units 5 and the outer membrane structures 2 to enable the substrate to be pressed on the grinding pad for grinding. In this embodiment, compared with the design of only one large air bag and one large film cavity in the prior art, in this embodiment, a plurality of independent chambers 41 are formed in one air bag module, and pressure can be provided in the corresponding chambers 41 through independent pressure supply pipelines, so that the pressure in each chamber 41 can be independently adjusted according to needs, the pressure born by the substrate is matched with the pressure required by the substrate, further the area adjustment performance of the air bag module and the briquetting module is improved, the process fluctuation with large amplitude and long interval is reduced, the substrate grinding uniformity can be improved finally, in addition, a plurality of briquetting units 5 push one outer film structure 2 to press the substrate, namely, the substrate is pressed through the common outer film structure 2, the process fluctuation with small amplitude and short interval is reduced, the process consistency of the whole area can be improved, and the yield of the ground substrate is improved.
Maintenance: since the air bag unit 4 and the briquetting unit 5 are both located within the outer membrane structure 2 and do not contact corrosive chemical liquids, the service life of the air bag unit 4 is extended. In the maintenance process, only the outer membrane structure 2 is usually replaced, and the outer membrane structure 2 is pressed on the polishing head main body 1 through the retaining ring 3, so that the outer membrane structure 2 is easy to replace, and in addition, the outer membrane structure 2 is of a single-cavity structure, so that the processing difficulty of the outer membrane structure 2 is small, the processing cost is low, and the cost for replacing the outer membrane structure 2 is correspondingly low. The air bag unit 4 transmits pressure through the briquetting unit 5, so that the pressure transmission is more direct and quicker, and the pressing effect on the substrate can be ensured by utilizing the hard characteristic of the briquetting unit 5 per se compared with the air bag unit 4 with slightly soft texture.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the invention.

Claims (10)

1. The polishing head assembly is characterized by comprising an air bag module, wherein a plurality of independent cavities (41) are formed in the air bag module, the air bag module comprises a plurality of air bag units (4), and two adjacent air bag units (4) are independently formed or share one side wall.
2. A polishing head assembly according to claim 1, wherein the air bag unit (4) is an air bag ring, and a plurality of the air bag rings are arranged in sequence in a radial direction of the air bag module.
3. The polishing head assembly according to claim 2, further comprising a pressing block module provided at a bottom of the air bag module, pressurizing the inside of the chamber (41), and transmitting the pressure to the substrate through the pressing block module.
4. A polishing head assembly according to claim 3, wherein the briquetting module comprises a plurality of briquetting units (5), and the briquetting units (5) are connected to the bottom of the air bag unit (4) in a one-to-one correspondence.
5. A polishing head assembly according to claim 4, wherein the air bag unit (4) and the pressure block unit (5) are connected together by magnetic force, or the air bag unit (4) and the pressure block unit (5) are connected together by sealing connection.
6. A polishing head assembly according to claim 3, further comprising a balloon fixture (8), the balloon fixture (8) being connected to the top of the balloon module.
7. The polishing head assembly of claim 6, further comprising an outer membrane structure (2), wherein the airbag module, the briquetting module and the airbag fixture (8) are all mounted in a receiving cavity of the outer membrane structure (2).
8. The polishing head assembly according to claim 7, further comprising a retaining ring (3) and a polishing head body (1), the polishing head body (1) covering the outer membrane structure (2) and the outer membrane structure (2) being pressed against the polishing head body (1) by the retaining ring (3).
9. A method of polishing a substrate using the polishing head assembly according to any one of claims 3 to 8, comprising the steps of:
each chamber (41) is respectively in a positive pressure state from the inner side to the outer side of the air bag module one by one, so that the accommodating cavity of the outer membrane structure (2) is in a positive pressure state, the pressure in the chambers (41) and the accommodating cavity is transmitted to the substrate through the briquetting module, and the substrate is pressed on the grinding pad for grinding;
and adjusting the pressure in the corresponding chamber (41), and changing the pressure applied to the corresponding region on the substrate to uniformly grind each region on the substrate.
10. The method of polishing a substrate according to claim 9, further comprising, before the polishing step, a slide-loading step of:
the accommodating cavity is in a micro positive pressure state, and each cavity (41) is in a positive pressure state one by one from the inner side to the outer side of the air bag module so as to discharge liquid on the substrate, and the outer membrane structure (2) is in contact with the substrate;
the three adjacent chambers (41) in the edge area are in a negative pressure state, the corresponding air bag units (4) shrink to drive the corresponding briquetting units (5) in the briquetting module to move upwards, the outer membrane structure (2) moves upwards along with the briquetting units, the distance between the corresponding area on the outer membrane structure (2) and the substrate is increased, the air pressure is reduced, and the substrate is adsorbed by the polishing head component under the pressure difference between the inner side and the outer side.
CN202311498101.1A 2023-11-10 2023-11-10 Polishing head assembly and substrate polishing method Pending CN117381661A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311498101.1A CN117381661A (en) 2023-11-10 2023-11-10 Polishing head assembly and substrate polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311498101.1A CN117381661A (en) 2023-11-10 2023-11-10 Polishing head assembly and substrate polishing method

Publications (1)

Publication Number Publication Date
CN117381661A true CN117381661A (en) 2024-01-12

Family

ID=89471925

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311498101.1A Pending CN117381661A (en) 2023-11-10 2023-11-10 Polishing head assembly and substrate polishing method

Country Status (1)

Country Link
CN (1) CN117381661A (en)

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