CN117372434B - Positioning system and method for PCB production - Google Patents
Positioning system and method for PCB production Download PDFInfo
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- G06T7/90—Determination of colour characteristics
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- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention discloses a positioning system and a positioning method for PCB production, which belong to the technical field of PCB production positioning, and the method comprises the following steps: acquiring CCD equipment information, and setting the installation position of the supplementary positioning equipment based on the CCD equipment information; acquiring PCB distribution information to be positioned, and determining a plurality of datum points according to the PCB distribution information; setting supplementary reference information corresponding to each reference point, installing corresponding supplementary positioning equipment at the installation position, and debugging the supplementary positioning equipment; initially positioning a PCB to be positioned; setting a standard square matrix of each datum point; acquiring primary frame gray level detection data and a detection square matrix of each datum point in real time; adjusting the PCB so as to identify a standard square matrix in the primary frame gray level detection data; and determining a PCB positioning adjustment step according to each standard square matrix and each detection square matrix, and adjusting according to the obtained PCB positioning adjustment step to finish positioning adjustment.
Description
Technical Field
The invention belongs to the technical field of PCB production and positioning, and particularly relates to a positioning system and method for PCB production.
Background
Along with the continuous development of the semiconductor process technology, the production speed and the process complexity of the PCB are also increased continuously, and the PCB is positioned accurately, which is a necessary premise of working accuracy, no matter the PCB is a traditional PCB chip mounter or a rapidly developed PCB character jet printer.
However, existing PCB production positioning systems typically require high capital costs, including purchase and maintenance costs for hardware equipment and software systems. This is a large burden for some small micro-enterprises; therefore, a positioning system with lower cost and lower equipment precision is used by many small micro enterprises, so that the reject ratio is higher, the profit is reduced, and a vicious circle is formed; therefore, for many small and micro PCB production enterprises, how to improve the positioning accuracy of the PCB on the premise of not inputting higher cost on the basis of the existing PCB production positioning system is a current problem to be solved; based on the above, the invention provides a positioning system and a positioning method for PCB production.
Disclosure of Invention
In order to solve the problems of the scheme, the invention provides a positioning system and a positioning method for PCB production, which are used for optimizing the PCB production positioning precision of a small-sized PCB production enterprise.
The aim of the invention can be achieved by the following technical scheme:
the positioning method for PCB production comprises the following steps:
step S1: acquiring CCD equipment information, and setting a corresponding installation position of the supplementary positioning equipment based on the CCD equipment information;
step S2: acquiring PCB distribution information to be positioned, and determining a plurality of datum points according to the PCB distribution information;
Further, the setting method of the reference point includes:
Determining the points to be selected, identifying the types of the target light, and performing physical simulation on the PCB to obtain simulation priority data of each point to be selected, wherein the simulation priority data comprises each target square matrix of the points to be selected;
combining the simulation priority data of each point to be selected to obtain a plurality of groups of positioning combinations to be selected, screening each positioning combination to be selected to obtain a target positioning combination, and setting each point to be selected in the target positioning combination as a datum point.
Further, the method for performing the physical simulation of the PCB comprises the following steps:
Placing a PCB (printed Circuit Board) on a standard position, adjusting the positions of the supplemental positioning equipment and the PCB, synchronously applying each target light to irradiate each point to be selected, and collecting simulation images of various target lights corresponding to each point to be selected, wherein one group of simulation images comprises a standard image and a plurality of unit images;
Gray processing is carried out on the unit image and the standard image to obtain a unit gray image and a standard gray image, corresponding initial frames are marked in the standard gray image and each unit gray image according to the positions of the points to be selected, gray values of each pixel point in the initial frames are identified, and initial frame gray data corresponding to the standard gray image and each unit gray image are formed; respectively marking standard primary selection frame gray data and unit primary selection frame gray data;
Identifying and analyzing the obtained standard primary selection frame gray data and the unit primary selection frame gray data, determining to-be-selected combinations in the standard images, and eliminating the analog images without the to-be-selected combinations;
Determining a target square matrix corresponding to the standard image according to the combination to be selected, and marking a corresponding simulation label on the target square matrix;
And integrating all target square matrixes of the points to be selected to form simulation priority data of the points to be selected.
Further, the method for determining the target square matrix corresponding to the standard image according to the to-be-selected combination comprises the following steps:
Determining reference combinations in gray data of primary frames of all units, setting corresponding to-be-selected square matrixes and reference square matrixes according to gray values corresponding to pixel points of the to-be-selected combinations and the reference combinations, respectively marking the to-be-selected square matrixes and the reference square matrixes as A i and B, wherein i=1, 2, … … and n, and n is the number of the to-be-selected square matrixes; and calculating a corresponding candidate value FC according to a formula FC= |A iBT |, and selecting a candidate matrix with the highest candidate value as a target matrix of the standard image.
Further, the method for screening each to-be-selected bit combination comprises the following steps:
Identifying the number of the points to be selected in each positioning combination to be selected, and marking the number of the points to be selected as N d;
Detecting and counting a to-be-selected positioning value and a standard positioning value corresponding to each to-be-selected bit combination, and marking the obtained to-be-selected positioning value and the standard positioning value as D x、Db respectively;
According to the formula Calculating a corresponding priority value;
wherein: y rate is a priority value; b 1、b2 are all proportional coefficients, and the value range is 0<b 1≤1,0<b2 to be less than or equal to 1; x=d x-Db,X1 is a threshold; lambda is an adjustment coefficient;
And selecting the positioning combination to be selected with the largest priority value as a target positioning combination.
Step S3: setting supplementary reference information corresponding to each datum point, installing corresponding supplementary positioning equipment at the installation position, and debugging the supplementary positioning equipment according to the supplementary reference information;
step S4: positioning adjustment is carried out on the PCB needing to be positioned by utilizing CCD equipment, and initial positioning is completed;
Step S5: setting a standard square matrix of each datum point; acquiring primary frame gray level detection data and a detection square matrix corresponding to each datum point in real time;
Further, the method for acquiring the primary frame gray level detection data and the detection square matrix comprises the following steps:
acquiring acquired images of the datum points, identifying analog labels of the standard square matrixes, marking corresponding primary selection frames in the acquired images according to the analog labels, carrying out gray processing on the images in the primary selection frames, identifying corresponding gray values, and integrating the gray values into primary selection frame gray detection data;
and determining a corresponding detection square matrix in the primary selection frame gray level detection data according to the simulation label.
Step S6: adjusting the PCB so as to identify a standard square matrix in the primary frame gray level detection data;
step S7: and determining a PCB positioning adjustment step according to the positions between the standard square matrixes and the detection square matrixes, and adjusting according to the obtained PCB positioning adjustment step to finish positioning adjustment of the PCB.
Further, the PCB positioning adjustment step comprises:
step S71: identifying the standard square matrix and detecting the position of the square matrix;
step S72: calculating an adjustment angle and a translation step for adjusting the standard square matrix to the detection square matrix;
Calculating by using the existing mathematical calculation method;
Step S73: adjusting the PCB according to the obtained adjusting angle and the translation step;
Step S74: identifying each standard square matrix C and each detection square matrix D after adjustment, calculating a corresponding check square matrix P according to a formula P=CD T, and if P=E, successfully adjusting; when p+.e, return to step S71.
A positioning system for PCB production comprises a sample analysis module, a CCD positioning module and a complementary positioning module;
the sample analysis module is used for setting corresponding datum points according to the PCB distribution information and setting corresponding installation positions of the complementary positioning equipment based on CCD equipment information;
Determining the points to be selected, identifying the types of the target lights, placing the PCB on a standard position, adjusting the positions of the supplemental positioning equipment and the PCB, synchronously applying each target light to irradiate each point to be selected, and collecting the analog images of various target lights corresponding to each point to be selected, wherein one group of analog images comprises a standard image and a plurality of unit images;
Gray processing is carried out on the unit image and the standard image to obtain a unit gray image and a standard gray image, corresponding initial frames are marked in the standard gray image and each unit gray image according to the positions of the points to be selected, gray values of each pixel point in the initial frames are identified, and initial frame gray data corresponding to the standard gray image and each unit gray image are formed; respectively marking standard primary selection frame gray data and unit primary selection frame gray data;
Identifying and analyzing the obtained standard primary selection frame gray data and the unit primary selection frame gray data, determining to-be-selected combinations in the standard images, and eliminating the analog images without the to-be-selected combinations;
Determining a target square matrix corresponding to the standard image according to the combination to be selected, and marking a corresponding simulation label on the target square matrix;
integrating all target square matrixes of the points to be selected to form simulation priority data of the points to be selected;
combining the simulation priority data of each point to be selected to obtain a plurality of groups of positioning combinations to be selected, screening each positioning combination to be selected to obtain a target positioning combination, and setting each point to be selected in the target positioning combination as a datum point.
The CCD positioning module is used for positioning and adjusting the PCB to be positioned to finish initial positioning;
the PCB is conveyed to the workbench through a conveyor belt or a manipulator, then the CCD camera searches for a mark datum point in a designated area, the datum point coordinate and the standard point coordinate difference are calculated, the workbench is controlled by a servo motor to rotate by a certain angle, and the workbench is translated through a X, Y shaft, so that the PCB moves to be overlapped with the datum position, and the whole positioning work is completed.
The supplementary positioning module is used for carrying out supplementary positioning adjustment after initial positioning and setting a standard square matrix of each datum point; acquiring acquired images of the datum points, identifying analog labels of the standard square matrixes, marking corresponding primary selection frames in the acquired images according to the analog labels, carrying out gray processing on the images in the primary selection frames, identifying corresponding gray values, and integrating the gray values into primary selection frame gray detection data;
determining a corresponding detection matrix in the primary selection frame gray level detection data according to the simulation label;
adjusting the PCB so as to identify a standard square matrix in the primary frame gray level detection data;
And determining a PCB positioning adjustment step according to the positions between the standard square matrixes and the detection square matrixes, and adjusting according to the obtained PCB positioning adjustment step to finish positioning adjustment of the PCB.
A computer readable storage medium having stored thereon a computer program which when executed by a processor realizes the steps of a positioning method for PCB production.
Compared with the prior art, the invention has the beneficial effects that:
By comprehensively analyzing the CCD positioning system and the supplementary positioning equipment, intelligent analysis setting of the datum points on the PCB is realized, the datum points are not selected according to the mode of selecting Mark points by the original CCD positioning system, positioning analysis of the supplementary positioning equipment is considered, and positioning accuracy is improved.
The complementary positioning equipment is arranged, so that the mutual coordination between the CCD positioning system and the complementary positioning equipment is realized, the complementary positioning equipment is utilized to optimize the positioning of the PCB, the positioning precision is improved, the complementary cost is greatly reduced, and the user can conveniently refit the existing PCB positioning system; the cost input of the user is reduced, and the use of the user is facilitated.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive effort to a person skilled in the art.
Fig. 1 is a functional block diagram of the present invention.
Detailed Description
The technical solutions of the present invention will be clearly and completely described in connection with the embodiments, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1, a positioning method for PCB production includes:
Step S1: acquiring CCD equipment information, and setting a mounting position corresponding to the supplementary positioning equipment according to the acquired CCD equipment information;
the CCD equipment information comprises the existing related information such as a positioning mode, positioning precision, equipment model and the like.
The positioning mode of the supplementary positioning device is to supplement and position the target light, such as laser with various required colors, and the target light is marked; the corresponding supplementary positioning device is the corresponding target light emitting device and the corresponding data processing module.
Namely, according to CCD equipment information, the corresponding target installation position is determined on the premise of not influencing the existing CCD positioning system. The CCD positioning system is the existing system for positioning the PCB by utilizing the CCD industrial camera.
Step S2: acquiring PCB distribution information to be positioned, and determining a plurality of datum points according to the acquired PCB distribution information;
The PCB distribution information is the existing information such as PCB size information, component distribution information and the like which need to be positioned;
The reference point is equivalent to the Mark point in the CCD, but has a difference with the Mark point, so that the consideration factor of selecting the reference point in the invention comprises the subsequent data analysis of the supplementary positioning equipment, rather than selecting two points diagonally opposite to the PCB as is commonly done at present, and only the requirement of the CCD positioning system can be met, but the overall requirement can not be met.
The setting method of the datum point comprises the following steps:
according to the requirement of selecting Mark points in the existing CCD positioning, determining each point to be selected meeting the requirement of Mark points according to the size information of the PCB, namely, each point to be selected can be used as the Mark point in a CCD positioning system;
Obtaining the type of the target light, performing physical simulation of the PCB, and obtaining simulation priority data of each point to be selected, wherein the simulation priority data comprises each target matrix of the point to be selected;
Combining the simulation priority data of each point to be selected to obtain a plurality of groups of combinations of the point to be selected, namely, on the premise of meeting the CCD positioning requirement, combining the simulation priority data corresponding to each point to be selected, wherein the same point to be selected possibly corresponds to a plurality of target square matrixes and can be provided with a plurality of points to be selected, and combining the points to be selected by utilizing the existing combination mode to obtain a plurality of non-repeated combinations, namely, the combinations of the point to be selected;
identifying the number of points to be selected in each combination of the points to be selected, and marking the number of the points to be selected as N d;
detecting for multiple times according to the setting information of each supplementary positioning device corresponding to each combination of the to-be-selected bit, calculating the positioning accuracy of the current CCD positioning system, counting through the multiple times of detection, marking as a to-be-selected bit value, obtaining the positioning accuracy of the original CCD positioning system, and marking as a standard positioning value; respectively marking the obtained to-be-selected positioning value and the standard positioning value as D x、Db;
According to the formula Calculating a corresponding priority value; wherein: y rate is a priority value; b 1、b2 are all proportional coefficients, and the value range is 0<b 1≤1,0<b2 to be less than or equal to 1; /(I)X=d x-Db,X1 is a threshold, - ≡denotes direct culling; lambda is an adjustment coefficient, which is set according to the to-be-selected value of each target square matrix corresponding to the to-be-selected bit combination, the sum of the to-be-selected values corresponding to the to-be-selected bit combination is calculated, the sum is marked as a comprehensive to-be-selected value, the average value of the comprehensive to-be-selected values corresponding to all the to-be-selected bit combinations is calculated, and then the adjustment coefficient = the comprehensive to-be-selected value/average value;
And selecting the to-be-selected positioning combination with the largest priority value as a target positioning combination, and setting each to-be-selected point in the target positioning combination as a datum point.
The method for performing the PCB physical simulation comprises the following steps:
Placing the PCB on a standard position, namely positioning the standard position at the standard position; the positions of the supplementary positioning equipment and the PCB are adjusted to enable the supplementary positioning equipment and the PCB to sequentially irradiate each point to be selected by using various target light types, collect analog images of various target lights corresponding to each point to be selected, collect the images by using the existing CCD camera, and reduce additional cost; the simulated image corresponding to the target light of one point to be selected is a group of images, is not a single image, but a combination of process images with certain small-amplitude angle offset adjustment, and is used for determining the recognition degree and the discrimination degree subsequently; since positioning is already performed based on the CCD positioning system at the time of positioning correction by the supplementary positioning device, even if there is an error, the deviation angle simulation of a large magnitude is not required.
Marking each image in the simulation image as a unit image, wherein the unit image corresponding to the PCB placed at the standard position is marked as a standard image; gray processing is carried out on the unit images and the standard images to obtain the unit gray images and the standard gray images, corresponding initial frames are marked in the standard gray images and the unit gray images according to positions of points to be selected, the initial frames are used for rapidly reducing analysis ranges, standard square matrixes, namely matrixes with the same row and column, are convenient to set, the initial frames do not need high precision, and a range is selected approximately;
Recognizing the gray value of each pixel point in the primary selection frame to form a standard gray image and primary selection frame gray data corresponding to each unit gray image; respectively marking the standard primary frame gray data and the unit primary frame gray data, carrying out identification analysis on the obtained standard primary frame gray data and the unit primary frame gray data, identifying whether the standard primary frame gray data has gray value combinations different from those in other unit primary frame gray data, namely, adjacent gray value combinations, taking gray values of all pixel points in the unit primary frame gray data as references, analyzing whether the standard primary frame gray data has gray value combinations of all pixel points, and judging whether the standard primary frame gray data has corresponding gray value combinations or not according to the standard primary frame gray data, wherein the gray value combinations have a limited number, namely, the maximum number, and are identified according to square matrix forms, namely, 2×2, 3×3, 4×4 and other gray value combinations;
if no combination is selected, rejecting the analog image, i.e. not considering the possibility;
if a combination to be selected exists, determining a reference combination closest to the combination to be selected in gray data of each unit primary frame, setting a corresponding square matrix to be selected and a corresponding reference square matrix according to gray values of each pixel point corresponding to the combination to be selected and the reference combination, respectively marking the square matrix to be selected and the reference square matrix as A i and B, wherein i represents the square matrix to be selected in the gray data of the standard primary frame, and i=1, 2, … …, n and n are the number of the square matrixes to be selected; and calculating a corresponding to-be-selected value FC according to a formula FC= |A iBT |, selecting a to-be-selected matrix with the highest to-be-selected value as a target matrix of the group of simulation images, and marking the target matrix with a corresponding simulation label, wherein the simulation label is simulation conditions of the simulation, such as information of a target light type, the to-be-selected value, a supplementary positioning equipment angle, a target matrix position and the like.
And integrating all target square matrixes of the points to be selected to form simulation priority data of the points to be selected.
By comprehensively analyzing the CCD positioning system and the supplementary positioning equipment, intelligent analysis setting of the datum points on the PCB is realized, the datum points are not selected according to the mode of selecting Mark points by the original CCD positioning system, positioning analysis of the supplementary positioning equipment is considered, and positioning accuracy is improved.
Step S3: setting supplementary reference information corresponding to each reference point, wherein the supplementary reference information comprises information such as a target light type, a value to be selected, a supplementary positioning device angle, a target square matrix position and the like, installing corresponding supplementary positioning devices at the installation positions, and debugging the supplementary positioning devices according to the supplementary reference information; enabling the device to work according to preset information;
The complementary positioning equipment is arranged, so that the mutual coordination between the CCD positioning system and the complementary positioning equipment is realized, the complementary positioning equipment is utilized to optimize the positioning of the PCB, the positioning precision is improved, the complementary cost is greatly reduced, and the user can conveniently refit the existing PCB positioning system; the cost input of the user is reduced, and the use of the user is facilitated.
Step S4: performing PCB positioning adjustment, namely performing PCB positioning adjustment by using an original CCD positioning system by using CCD equipment to perform positioning adjustment on the PCB to be positioned; completing initial positioning; namely, after successful positioning according to CCD equipment, initial positioning is completed;
The PCB board is transported to a workbench through a conveyor belt or a manipulator, then a CCD camera searches a mark datum point in a designated area, the datum point coordinate and a standard point coordinate difference are calculated, the workbench is controlled by a servo motor to rotate for a certain angle, and then the workbench is translated through a X, Y shaft, so that the PCB board moves to be overlapped with the datum position, and the whole positioning work is completed.
Step S5: marking the target square matrix when determining each datum point as a standard square matrix; identifying the analog label of the standard square matrix, processing the image at each current datum point according to the identified analog label to obtain corresponding primary frame gray level detection data, namely marking the primary frame on the image, identifying gray level values in the primary frame, and determining a corresponding detection square matrix in the primary frame gray level detection data according to the analog label, namely identifying the square matrix according to the position corresponding to the standard square matrix;
step S6: the PCB is adjusted so that a standard square matrix is identified in the primary frame gray level detection data, namely the PCB is moved so that the standard square matrix appears in the primary frame gray level detection data, and the standard square matrix can be identified in the primary frame gray level detection data generally after the primary positioning is finished; if the data does not appear in the primary frame gray level detection data, fine adjustment is needed; fine tuning can be performed in combination with corresponding gray values;
step S7: and determining a PCB positioning adjustment step according to the positions between each standard square matrix and each detection square matrix, and adjusting according to the obtained PCB positioning adjustment step to finish positioning adjustment of the PCB.
The PCB positioning and adjusting steps comprise:
step S71: identifying the standard square matrix and detecting the position of the square matrix;
step S72: calculating an adjustment angle and a translation step for adjusting the standard square matrix to the detection square matrix;
Calculating by using the existing mathematical calculation method;
Step S73: adjusting the PCB according to the obtained adjusting angle and the translation step;
Step S74: identifying each standard square matrix C and each detection square matrix D after adjustment, calculating a corresponding check square matrix P according to a formula P=CD T, and if P=E, successfully adjusting; when p+.e, return to step S71.
A positioning system for PCB production comprises a sample analysis module, a CCD positioning module and a complementary positioning module;
the sample analysis module is used for setting corresponding datum points according to the PCB distribution information and setting corresponding installation positions of the complementary positioning equipment based on CCD equipment information;
Determining the points to be selected, identifying the types of the target lights, placing the PCB on a standard position, adjusting the positions of the supplemental positioning equipment and the PCB, synchronously applying each target light to irradiate each point to be selected, and collecting the analog images of various target lights corresponding to each point to be selected, wherein one group of analog images comprises a standard image and a plurality of unit images;
gray processing is carried out on the unit image and the standard image to obtain a unit gray image and a standard gray image, corresponding initial frames are marked in the standard gray image and the unit gray images according to positions of points to be selected, gray values of pixel points in the initial frames are recognized, and initial frame gray data corresponding to the standard gray image and the unit gray image are formed; respectively marking standard primary selection frame gray data and unit primary selection frame gray data;
identifying and analyzing the obtained standard primary selection frame gray data and the unit primary selection frame gray data, determining to-be-selected combinations in the standard images, and eliminating the analog images without the to-be-selected combinations; determining a target square matrix corresponding to the standard image according to the combination to be selected, and marking a corresponding simulation label on the target square matrix; integrating all target square matrixes of the points to be selected to form simulation priority data of the points to be selected; combining the simulation priority data of each point to be selected to obtain a plurality of groups of positioning combinations to be selected, screening each positioning combination to be selected to obtain a target positioning combination, and setting each point to be selected in the target positioning combination as a datum point.
The CCD positioning module is used for positioning and adjusting the PCB to be positioned to finish initial positioning;
the PCB is conveyed to the workbench through a conveyor belt or a manipulator, then the CCD camera searches for a mark datum point in a designated area, the datum point coordinate and the standard point coordinate difference are calculated, the workbench is controlled by a servo motor to rotate by a certain angle, and the workbench is translated through a X, Y shaft, so that the PCB moves to be overlapped with the datum position, and the whole positioning work is completed.
The supplementary positioning module is used for carrying out supplementary positioning adjustment after initial positioning and setting a standard square matrix of each datum point; acquiring the acquired images of the datum points, identifying the simulation labels of the standard square matrixes, marking corresponding primary selection frames in the acquired images according to the simulation labels, carrying out gray processing on the images in the primary selection frames, identifying corresponding gray values, and integrating the gray values into primary selection frame gray detection data;
Determining a corresponding detection square matrix in the primary frame gray level detection data according to the analog label;
adjusting the PCB so as to identify a standard square matrix in the primary frame gray level detection data;
And determining a PCB positioning adjustment step according to the positions between each standard square matrix and each detection square matrix, and adjusting according to the obtained PCB positioning adjustment step to finish positioning adjustment of the PCB.
The application also provides a corresponding embodiment of the computer readable storage medium. The computer readable storage medium stores a computer program which, when executed by a processor, implements the steps described in one of the above embodiments of a positioning method for PCB production.
The above formulas are all formulas with dimensions removed and numerical values calculated, the formulas are formulas which are obtained by acquiring a large amount of data and performing software simulation to obtain the closest actual situation, and preset parameters and preset thresholds in the formulas are set by a person skilled in the art according to the actual situation or are obtained by simulating a large amount of data.
The above embodiments are only for illustrating the technical method of the present invention and not for limiting the same, and it should be understood by those skilled in the art that the technical method of the present invention may be modified or substituted without departing from the spirit and scope of the technical method of the present invention.
Claims (9)
1. The positioning method for the production of the PCB is characterized by comprising the following steps of:
step S1: acquiring CCD equipment information, and setting a corresponding installation position of the supplementary positioning equipment based on the CCD equipment information;
step S2: acquiring PCB distribution information to be positioned, and determining a plurality of datum points according to the PCB distribution information;
Step S3: setting supplementary reference information corresponding to each datum point, installing corresponding supplementary positioning equipment at the installation position, and debugging the supplementary positioning equipment according to the supplementary reference information;
step S4: positioning adjustment is carried out on the PCB needing to be positioned by utilizing CCD equipment, and initial positioning is completed;
Step S5: setting a standard square matrix of each datum point; acquiring primary frame gray level detection data and a detection square matrix corresponding to each datum point in real time;
step S6: adjusting the PCB so as to identify a standard square matrix in the primary frame gray level detection data;
step S7: and determining a PCB positioning adjustment step according to the positions between the standard square matrixes and the detection square matrixes, and adjusting according to the obtained PCB positioning adjustment step to finish positioning adjustment of the PCB.
2. The positioning method for PCB production of claim 1, wherein in step S2, the reference point setting method comprises:
Determining the points to be selected, identifying the types of the target light, and performing physical simulation on the PCB to obtain simulation priority data of each point to be selected, wherein the simulation priority data comprises each target square matrix of the points to be selected;
combining the simulation priority data of each point to be selected to obtain a plurality of groups of positioning combinations to be selected, screening each positioning combination to be selected to obtain a target positioning combination, and setting each point to be selected in the target positioning combination as a datum point.
3. The positioning method for PCB production of claim 2, wherein the method for PCB physical simulation comprises:
Placing a PCB (printed Circuit Board) on a standard position, adjusting the positions of the supplemental positioning equipment and the PCB, synchronously applying each target light to irradiate each point to be selected, and collecting simulation images of various target lights corresponding to each point to be selected, wherein one group of simulation images comprises a standard image and a plurality of unit images;
Gray processing is carried out on the unit image and the standard image to obtain a unit gray image and a standard gray image, corresponding initial frames are marked in the standard gray image and each unit gray image according to the positions of the points to be selected, gray values of each pixel point in the initial frames are identified, and initial frame gray data corresponding to the standard gray image and each unit gray image are formed; respectively marking standard primary selection frame gray data and unit primary selection frame gray data;
Identifying and analyzing the obtained standard primary selection frame gray data and the unit primary selection frame gray data, determining to-be-selected combinations in the standard images, and eliminating the analog images without the to-be-selected combinations;
Determining a target square matrix corresponding to the standard image according to the combination to be selected, and marking a corresponding simulation label on the target square matrix;
And integrating all target square matrixes of the points to be selected to form simulation priority data of the points to be selected.
4. A positioning method for PCB production according to claim 3, wherein the method for determining the target matrix corresponding to the standard image according to the combination to be selected comprises:
Determining reference combinations in gray data of primary frames of all units, setting corresponding to-be-selected square matrixes and reference square matrixes according to gray values corresponding to pixel points of the to-be-selected combinations and the reference combinations, respectively marking the to-be-selected square matrixes and the reference square matrixes as A i and B, wherein i=1, 2, … … and n, and n is the number of the to-be-selected square matrixes; and calculating a corresponding candidate value FC according to a formula FC= |A iBT |, and selecting a candidate matrix with the highest candidate value as a target matrix of the standard image.
5. The positioning method for PCB production of claim 4, wherein the method of screening each combination of bits to be selected comprises:
Identifying the number of the points to be selected in each positioning combination to be selected, and marking the number of the points to be selected as N d;
Detecting and counting a to-be-selected positioning value and a standard positioning value corresponding to each to-be-selected bit combination, and marking the obtained to-be-selected positioning value and the standard positioning value as D x、Db respectively;
According to the formula Calculating a corresponding priority value; wherein: y rate is a priority value; b 1、b2 are all proportional coefficients, and the value range is 0<b 1≤1,0<b2 to be less than or equal to 1; /(I)X=d x-Db,X1 is a threshold; lambda is an adjustment coefficient;
And selecting the positioning combination to be selected with the largest priority value as a target positioning combination.
6. The positioning method for PCB production of claim 1, wherein in step S5, the method for obtaining the preliminary frame gray level detection data and the detection matrix comprises:
acquiring acquired images of the datum points, identifying analog labels of the standard square matrixes, marking corresponding primary selection frames in the acquired images according to the analog labels, carrying out gray processing on the images in the primary selection frames, identifying corresponding gray values, and integrating the gray values into primary selection frame gray detection data;
and determining a corresponding detection square matrix in the primary selection frame gray level detection data according to the simulation label.
7. The positioning method for PCB production of claim 1, wherein in step S7, the PCB positioning adjustment step includes:
step S71: identifying the standard square matrix and detecting the position of the square matrix;
step S72: calculating an adjustment angle and a translation step for adjusting the standard square matrix to the detection square matrix;
Calculating by using the existing mathematical calculation method;
Step S73: adjusting the PCB according to the obtained adjusting angle and the translation step;
Step S74: identifying each standard square matrix C and each detection square matrix D after adjustment, calculating a corresponding check square matrix P according to a formula P=CD T, and if P=E, successfully adjusting; when p+.e, return to step S71; wherein E is an identity matrix.
8. A positioning system for PCB production, characterized in that a positioning method for PCB production according to any one of claims 1 to 7 is performed, comprising a sample analysis module, a CCD positioning module and a supplementary positioning module;
the sample analysis module is used for setting corresponding datum points according to the PCB distribution information and setting corresponding installation positions of the complementary positioning equipment based on CCD equipment information;
The CCD positioning module is used for positioning and adjusting the PCB to be positioned to finish initial positioning;
The supplementary positioning module is used for carrying out supplementary positioning adjustment after initial positioning and setting a standard square matrix of each datum point; acquiring primary frame gray level detection data and a detection square matrix corresponding to each datum point in real time; adjusting the PCB so as to identify a standard square matrix in the primary frame gray level detection data;
And determining a PCB positioning adjustment step according to the positions between the standard square matrixes and the detection square matrixes, and adjusting according to the obtained PCB positioning adjustment step to finish positioning adjustment of the PCB.
9. A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, implements the steps of a positioning method for PCB production according to any one of claims 1 to 7.
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102930266A (en) * | 2012-09-28 | 2013-02-13 | 廖怀宝 | Method for locating Mark points on PCB (printed circuit board) by utilizing outline gravity center method |
| CN109660697A (en) * | 2018-12-19 | 2019-04-19 | 森大（深圳）技术有限公司 | Pcb board position error automatic correcting method, device, equipment and storage medium |
| CN109752392A (en) * | 2018-12-24 | 2019-05-14 | 苏州江奥光电科技有限公司 | A kind of pcb board defect type detection system and method |
| CN110648308A (en) * | 2019-08-06 | 2020-01-03 | 广东工业大学 | Method for identifying and positioning defects of PCB (printed circuit board) lead |
| CN111598771A (en) * | 2020-01-15 | 2020-08-28 | 电子科技大学 | PCB (printed Circuit Board) defect detection system and method based on CCD (Charge coupled device) camera |
| CN114563687A (en) * | 2022-02-25 | 2022-05-31 | 苏州浪潮智能科技有限公司 | PCB fixing jig, automatic positioning method and system and storage medium |
| CN115239612A (en) * | 2021-04-23 | 2022-10-25 | 广州视源电子科技股份有限公司 | Circuit board positioning method, device, equipment and storage medium |
| CN116188447A (en) * | 2023-03-09 | 2023-05-30 | 苏州维嘉科技股份有限公司 | Method and device for detecting and positioning printed circuit board, electronic equipment and storage medium |
-
2023
- 2023-12-08 CN CN202311675280.1A patent/CN117372434B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102930266A (en) * | 2012-09-28 | 2013-02-13 | 廖怀宝 | Method for locating Mark points on PCB (printed circuit board) by utilizing outline gravity center method |
| CN109660697A (en) * | 2018-12-19 | 2019-04-19 | 森大（深圳）技术有限公司 | Pcb board position error automatic correcting method, device, equipment and storage medium |
| CN109752392A (en) * | 2018-12-24 | 2019-05-14 | 苏州江奥光电科技有限公司 | A kind of pcb board defect type detection system and method |
| CN110648308A (en) * | 2019-08-06 | 2020-01-03 | 广东工业大学 | Method for identifying and positioning defects of PCB (printed circuit board) lead |
| CN111598771A (en) * | 2020-01-15 | 2020-08-28 | 电子科技大学 | PCB (printed Circuit Board) defect detection system and method based on CCD (Charge coupled device) camera |
| CN115239612A (en) * | 2021-04-23 | 2022-10-25 | 广州视源电子科技股份有限公司 | Circuit board positioning method, device, equipment and storage medium |
| CN114563687A (en) * | 2022-02-25 | 2022-05-31 | 苏州浪潮智能科技有限公司 | PCB fixing jig, automatic positioning method and system and storage medium |
| CN116188447A (en) * | 2023-03-09 | 2023-05-30 | 苏州维嘉科技股份有限公司 | Method and device for detecting and positioning printed circuit board, electronic equipment and storage medium |
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