CN117350226A

CN117350226A - State parameter acquisition method of IGBT device

Info

Publication number: CN117350226A
Application number: CN202311254769.1A
Authority: CN
Inventors: 王平尔; 孟菲
Original assignee: Heze Jianuo Network Technology Co ltd
Current assignee: Heze Jianuo Network Technology Co ltd
Priority date: 2023-09-26
Filing date: 2023-09-26
Publication date: 2024-01-05

Abstract

The invention relates to the technical field of power electronics, in particular to a state parameter acquisition method of an IGBT device. The method comprises the following steps: acquiring an IGBT working circuit diagram and a PCB layout diagram; planning the light source position according to the IGBT working circuit diagram and the PCB layout diagram, so as to acquire light source position data; carrying out line connection planning on the IGBT working circuit diagram so as to obtain an optical fiber connection scheme; performing a mechanical test on the adapted optical fiber, thereby obtaining optical fiber mechanical data; performing transmission loss simulation calculation on the optical fiber mechanical data so as to obtain a transmission loss data set; performing optical fiber line connection according to the transmission loss data set and the optical fiber connection scheme, so as to obtain a detection connection line; the invention can realize the high-precision, high-speed, interference-free and damage-free acquisition of the state parameters of the IGBT device.

Description

State parameter acquisition method of IGBT device

Technical Field

The invention relates to the technical field of power electronics, in particular to a state parameter acquisition method of an IGBT device.

Background

The IGBT device is an important power semiconductor device and is widely applied to the fields of alternating current drive systems, power conversion, industrial automation and the like. In order to ensure the normal operation of the IGBT device and improve the reliability of the IGBT device, accurate monitoring and analysis of the state of the IGBT device are important. Currently, various methods for acquiring IGBT device state parameters, such as a current sensor, a voltage sensor, a temperature sensor, and the like, have been proposed. However, these methods have some drawbacks such as low accuracy, slow acquisition speed, complex mounting, and impact on device structure.

Disclosure of Invention

Based on this, the present invention needs to provide a method for acquiring a state parameter of an IGBT device, so as to solve at least one of the above technical problems.

In order to achieve the above purpose, a method for collecting state parameters of an IGBT device includes the following steps:

step S1: acquiring an IGBT working circuit diagram and a PCB layout diagram; planning the light source position according to the IGBT working circuit diagram and the PCB layout diagram, so as to acquire light source position data; carrying out line connection planning on the IGBT working circuit diagram so as to obtain an optical fiber connection scheme;

step S2: performing a mechanical test on the adapted optical fiber, thereby obtaining optical fiber mechanical data; performing transmission loss simulation calculation on the optical fiber mechanical data so as to obtain a transmission loss data set; performing optical fiber line connection according to the transmission loss data set and the optical fiber connection scheme, so as to obtain a detection connection line; arranging the microchip laser sources based on the detected connecting line light source position data, thereby obtaining a parameter detection circuit;

step S3: generating a square wave digital signal by a digital signal generator; driving and modulating a laser diode of a microchip laser source by using a square wave digital signal so as to obtain a stable laser signal;

Step S4: using a single photon detector based on a silicon germanium compound to carry out transmission beam capturing on the adaptive optical fiber so as to obtain a parameter digital electric signal;

step S5: signal processing is carried out on the parameter digital electric signals, so that state parameter data are obtained; and visualizing the state parameter data, thereby obtaining the visualized state parameter.

According to the invention, the effective coverage and connection of each extreme of the IGBT device can be realized by planning the position of the light source and the circuit connection scheme, which means that the parameters such as the voltage, the current, the temperature and the like of the collector electrode, the grid electrode and the emitter electrode can be detected at the same time, thereby improving the coverage rate and the reliability of the parameter detection. The quality and stability of the adaptive optical fiber can be ensured through mechanical testing, which means that signal interference or loss caused by damage, looseness, bending and the like of the optical fiber can be avoided, and the accuracy and stability of parameter detection are improved. By using the microchip laser source, non-contact parameter detection of the IGBT device can be realized, which means that any sensor or probe is not required to be installed on the IGBT device, so that the problems of poor contact or damage and the like possibly existing in the traditional method are avoided, and the safety and efficiency of parameter detection are improved. By using a single photon detector based on silicon germanium compounds, a high sensitivity capture of the transmitted beam in the optical fiber can be achieved, which means that weak optical signals can be detected with low power consumption and low noise, thereby improving the sensitivity and resolution of parameter detection. By using a digital signal generator and laser diode driving modulation, accurate control and adjustment of the microchip laser source can be realized, which means that parameters such as output power, wavelength, frequency and the like of the laser source can be adjusted according to different detection requirements and conditions, thereby improving the flexibility and adaptability of parameter detection. The extraction and analysis of the IGBT device state parameter data can be realized by carrying out signal processing on the parameter digital electric signals, which means that the original signals can be optimized and converted by utilizing digital signal processing technologies such as filtering, amplifying, sampling, encoding and the like, thereby improving the intelligence and the functionality of parameter detection. Visual display and monitoring of the state parameter data of the IGBT device can be realized by visualizing the state parameter data, which means that the state parameter data can be clearly and aesthetically presented in a pattern, a chart, a curve and the like, thereby improving the visibility and usability of parameter detection.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of a non-limiting implementation, made with reference to the accompanying drawings in which:

fig. 1 is a schematic flow chart of a state parameter collection method of an IGBT device according to an embodiment.

Fig. 2 shows a detailed step flow diagram of step S2 of an embodiment.

Fig. 3 shows a detailed step flow diagram of step S29 of an embodiment.

Fig. 4 shows a detailed step flow diagram of step S295 of an embodiment.

Detailed Description

The following is a clear and complete description of the technical method of the present patent in conjunction with the accompanying drawings, and it is evident that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.

Furthermore, the drawings are merely schematic illustrations of the present invention and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus a repetitive description thereof will be omitted. Some of the block diagrams shown in the figures are functional entities and do not necessarily correspond to physically or logically separate entities. The functional entities may be implemented in software or in one or more hardware modules or integrated circuits or in different networks and/or processor methods and/or microcontroller methods.

It will be understood that, although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of example embodiments. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

In order to achieve the above objective, referring to fig. 1 to 4, the present invention provides a method for collecting state parameters of an IGBT device, the method comprising the steps of:

specifically, for example, an IGBT operating circuit diagram and a PCB layout diagram are obtained from a manufacturer or a design unit of the IGBT device, and an optimal solution for the light source position is determined according to the structural and functional characteristics of the IGBT device, for example, a light source is disposed near or in the middle of a collector, a gate, and an emitter, so that parameters of the IGBT device are detected and controlled, and light source position data is obtained. Then, according to each element and node in the IGBT working circuit diagram, a proper line connection scheme is designed, so that the optical fiber can be connected with each pole of the IGBT device and matched with the microchip laser source, and the optical fiber connection scheme is obtained.

specifically, for example, a special mechanical testing instrument is used to perform mechanical performance tests on the adaptive optical fiber such as stretching, bending, torsion and the like so as to check whether the adaptive optical fiber meets the standard requirements, and mechanical parameters such as strength, rigidity, elasticity and the like are recorded so as to acquire optical fiber mechanical data. And then, according to the optical fiber mechanical data and an optical fiber connection scheme, connecting the optical fiber with the collector, the grid and the emitter of the IGBT device by using a proper welding or bonding method, ensuring that the connection is firm and the normal work of the IGBT device is not influenced, and thus completing the connection of the optical fiber and the IGBT device. And then, installing a microchip laser source on the PCB according to the light source position data, and connecting the microchip laser source with an optical fiber, thereby completing the arrangement of the microchip laser source. And finally, connecting the PCB with an external power supply and a controller, thereby obtaining the parameter detection circuit.

specifically, for example, a digital signal generator is used as a control terminal, and a square wave digital signal with a certain frequency and amplitude is generated and transmitted to the microchip laser source through a cable or wirelessly. Then, the square wave digital signal is utilized to drive and modulate the laser diode in the microchip laser source, so that the laser diode can emit corresponding laser signals according to the change of the square wave digital signal, and the corresponding laser signals are transmitted to the IGBT device through the optical fiber. The square wave digital signal has the characteristics of simplicity, stability, easiness in control and the like, and can effectively adjust the working state and output power of the laser diode, so that a stable laser signal is obtained.

specifically, for example, a single photon detector based on a silicon germanium compound is used as a receiving end, and a light beam emitted from a microchip laser source and transmitted through an IGBT device and an optical fiber is captured and converted. Because of the advantages of high efficiency, low noise, high sensitivity, etc., the germanosilicide compound can effectively detect single or small quantity of incident photons and convert them into digital electrical signals. Therefore, by analyzing the amplitude, frequency, phase and other information in the digital electric signal, the parameter data of the IGBT device, such as temperature, pressure, current, voltage and the like, can be obtained.

Specifically, the parameter digital electric signal is subjected to processing such as filtering, amplifying, demodulating, encoding, etc. using dedicated signal processing software or hardware to remove or reduce noise and interference, and effective information is extracted to acquire state parameter data. Then, according to different requirements and targets, a proper visualization method and tool are selected, such as charts, curves, colors, animations and the like, state parameter data are converted into visual and easily understood graphics or images, and the visual state parameters are displayed on a screen or other devices.

Preferably, step S1 comprises the steps of:

step S11: acquiring an IGBT working circuit diagram and a PCB layout diagram;

specifically, the IGBT operating circuit diagram and the PCB layout diagram are obtained, for example, from a manufacturer or a design unit of the IGBT device.

Step S12: performing three-dimensional modeling on the PCB layout diagram so as to obtain a PCB three-dimensional model;

specifically, the PCB layout is three-dimensionally modeled, for example, using specialized three-dimensional modeling software or tools, such as SolidWorks, autoCAD, etc., to generate three-dimensional geometries and structures of the PCB board, and saved as corresponding file formats, such as STL, OBJ, etc., to obtain a three-dimensional model of the PCB board.

Step S13: performing simulation analysis on the optimal position of the microchip laser source according to the three-dimensional model of the PCB, so as to obtain optimal position data;

specifically, for example, using specialized simulation analysis software or tools, such as ANSYS, COMSOL, etc., according to the three-dimensional model of the PCB board and the performance parameters and operating conditions of the microchip laser source, the optimal position of the microchip laser source is subjected to simulation analysis to optimize its layout and distribution on the PCB board, and consider its illumination effect and influence on the IGBT device, thereby obtaining optimal position data.

Step S14: determining key points of a collector, a grid and an emitter in an IGBT working circuit diagram so as to obtain detected points;

specifically, for example, the positions and connection manners of the collector, gate and emitter in the IGBT operating circuit diagram are observed and analyzed, the key points thereof on the IGBT device such as the end points, turning points, crossing points, etc. are determined, and the coordinates and identifiers thereof are recorded, thereby obtaining the detected points.

Step S15: calculating optical channel parameters of the microchip laser source and the detected point, thereby obtaining optical channel parameters;

specifically, for example, using specialized optical calculation software or tools, such as Zemax, optiCAD, parameter calculation is performed on the optical channel between the microchip laser source and the detected point, such as angle, direction, intensity, wavelength, polarization, etc., of the light beam, according to the optimal position data of the microchip laser source and the coordinates and identifiers of the detected point, and the influence factors such as refraction, reflection, diffraction, scattering, etc., which may exist in the optical channel are considered, so as to obtain the optical channel parameters.

Step S16: determining the model specification of the optical fiber according to the optical channel parameters, thereby obtaining an adaptive optical fiber;

Specifically, for example, the performance parameters and working conditions of different types and brands of optical fibers, such as core diameter, cladding layer, refractive index, loss, transmission rate, temperature resistance, pressure resistance and the like, are searched and compared, and the most suitable optical fiber model and specification are selected according to the optical channel parameters and the working environment of the IGBT device, so that the adaptive optical fiber is obtained.

Step S17: and carrying out line connection planning according to the optimal position data and the spatial distribution of detected points based on the PCB layout diagram, thereby obtaining the optical fiber connection scheme.

Specifically, for example, professional line design software or tools, such as Eagle, aluminum Designer, etc., are used to plan and optimize the line connection between the microchip laser source and the inspected point based on the PCB layout and the optimal position data and the spatial distribution of the inspected point, and consider the problems of interference, impedance, electromagnetic compatibility, etc. that may exist in the line connection, thereby obtaining the optical fiber connection scheme.

The invention can realize the overall design and planning of the IGBT device parameter detection system by acquiring the IGBT working circuit diagram and the PCB layout diagram, which means that each component and the connection mode of the parameter detection system can be reasonably arranged and configured according to the working principle and the characteristics of the IGBT device and the structure and the function of the PCB, thereby improving the integrity and the consistency of the parameter detection system. The three-dimensional display and operation of the PCB can be realized by carrying out three-dimensional modeling on the PCB layout, which means that the shape, the size, the position and the like of the PCB can be intuitively observed and adjusted in a three-dimensional space, thereby improving the visibility and the usability of the parameter detection system. The optimal position of the microchip laser source can be subjected to simulation analysis according to the three-dimensional model of the PCB, so that optimal configuration and adjustment of the microchip laser source can be realized, which means that the output direction, angle, distance and the like of the microchip laser source can be simulated and tested in a simulation environment, so that the position and parameters which are most suitable for the parameter detection system are found, and the efficiency and stability of the parameter detection system are improved. The accurate positioning and identification of each extreme of the IGBT device can be realized by determining the key points of the collector, the grid and the emitter in the IGBT working circuit diagram, which means that the key points to be detected on the collector, the grid and the emitter can be definitely marked and distinguished according to the circuit structure and the function of the IGBT device and the detection requirement and condition of the parameter detection system, thereby improving the accuracy and the reliability of the parameter detection system. By calculating the parameters of the optical channel between the microchip laser source and the detected point, reasonable design and selection of the optical channel can be realized, which means that the parameters of the type, wavelength, power and the like of the light source required to be used for the optical channel can be scientifically calculated and selected according to the relative position, distance, angle and other factors between the microchip laser source and the detected point, and the indexes of sensitivity, resolution, stability and the like required to be met by the optical channel, so that the sensitivity and resolution of the parameter detection system are improved. The optical fiber model specification is determined according to the optical channel parameters, so that reasonable selection and matching of the adaptive optical fiber can be realized, which means that the model, specification, material and the like of the optical fiber can be properly determined and matched according to the characteristics of transmission efficiency, loss, refractive index and the like required to be possessed by the optical fiber and the conditions of environment temperature, humidity, vibration and the like required to be adapted to the optical fiber, which are determined by the optical channel parameters, so that the adaptability and the stability of the parameter detection system are improved. The reasonable planning and arrangement of the optical fiber connection scheme can be realized by carrying out line connection planning according to the optimal position data and the spatial distribution of detected points based on the PCB layout, which means that the connection mode, the path, the length and the like of the optical fiber can be reasonably planned and arranged according to the spatial structure and the functional partition of the PCB, the optimal position data of the microchip laser source and the spatial distribution of the detected points, thereby improving the safety and the aesthetic property of the parameter detection system.

Preferably, step S13 comprises the steps of:

step S131: acquiring optical attribute data corresponding to components in the three-dimensional model of the PCB;

specifically, for example, optical attribute data, such as reflectivity, refractive index, transmissivity, absorptivity, etc., of each component in the three-dimensional model of the PCB board is queried and collected, and stored as corresponding file formats, such as TXT, CSV, etc., so as to obtain optical attribute data corresponding to the component in the three-dimensional model of the PCB board.

Step S132: the method comprises the steps of importing a three-dimensional model of a PCB into CAD software, and setting the three-dimensional model of the PCB by utilizing the optical attribute numbers corresponding to components so as to obtain a simulation model;

specifically, for example, professional CAD software or tools, such as SolidWorks, autoCAD, are used to import the three-dimensional model of the PCB into the CAD software, and the three-dimensional model of the PCB is set by using optical attribute data corresponding to the components, so as to give corresponding optical characteristics and effects to the three-dimensional model of the PCB, and stored in corresponding file formats, such as STL and OBJ, so as to obtain the simulation model.

Step S133: constructing a three-dimensional model of the microchip laser source, and adjusting the emission mode of the microchip laser source so as to obtain a light source model;

Specifically, the microchip laser source is three-dimensionally modeled, for example, using specialized three-dimensional modeling software or tools, such as SolidWorks, autoCAD, etc., to generate three-dimensional geometries and structures of the microchip laser source and stored as corresponding file formats, such as STL, OBJ, etc. And then, according to the performance parameters and working conditions of the microchip laser source, adjusting the emission mode of the microchip laser source, such as the emission angle, the emission direction, the intensity, the wavelength, the polarization and the like, and storing the emission mode as a corresponding file format, such as TXT, CSV and the like, so as to obtain a light source model.

Step S134: scanning and analyzing edge positions of key nodes in the simulation model so as to obtain candidate position data, wherein the candidate position data comprises a plurality of candidate positions;

specifically, for example, using specialized scan analysis software or tools, such as Zemax, optiCAD, the edge positions of the key nodes in the simulation model are scanned and analyzed to detect whether they are suitable as the best positions of the microchip laser sources, and the candidate position data is obtained by evaluating and sorting the positions according to the optical channel parameters and effects between the positions and detected points, and recording the coordinates and identifiers thereof. Wherein the candidate location data comprises a plurality of candidate locations for subsequent selection and optimization.

Step S135: importing the light source model into a simulation model according to the candidate position data, thereby obtaining a simulation model containing the light source;

specifically, for example, using specialized CAD software or tools, such as SolidWorks, autoCAD, the light source model is imported into the simulation model according to the coordinates and identifiers in the candidate position data, and is aligned and matched with the components and PCB boards in the simulation model, and stored in a corresponding file format, such as STL, OBJ, etc., so as to obtain the simulation model containing the light source.

Step S136: performing optical transmission simulation on the simulation model containing the light source, and calculating the light intensity distribution from each alternative position in the candidate position data to the key node, so as to obtain light intensity distribution data;

specifically, for example, special optical transmission simulation software or tools, such as Zemax, optiCAD, are used for performing optical transmission simulation on the simulation model containing the light source, tracking and analyzing the light beam from each alternative position to the key node in the candidate position data according to the emission mode and parameters in the simulation model containing the light source and the optical properties and effects of components and PCBs in the simulation model containing the light source, calculating the light intensity distribution of the light beam in different positions and directions, and storing the light intensity distribution in corresponding file formats, such as TXT, CSV, and the like, so as to obtain the light intensity distribution data.

Step S137: and optimally screening the candidate position data by utilizing the light intensity distribution data, thereby obtaining optimal position data.

Specifically, for example, specialized optimal screening software or tools, such as MATLAB, excel, etc., are used to perform optimal screening on candidate position data by using the light intensity distribution data, and according to different evaluation indexes and objective functions, such as maximizing the average light intensity of the key nodes, minimizing the light intensity difference between the key nodes, minimizing the output power of the microchip laser source, etc., the optimal candidate position is selected, and the coordinates and identifiers thereof are recorded, so as to obtain the optimal position data.

According to the invention, the optical characteristics and influence of each component on the PCB can be known and mastered by acquiring the optical attribute data corresponding to the components in the three-dimensional model of the PCB, so that the theoretical basis and knowledge reserve of the parameter detection system are improved. The three-dimensional model of the PCB is imported into CAD software, and the three-dimensional model of the PCB is set by utilizing the optical attribute numbers corresponding to the components, so that the optical effect and the action of each component on the PCB can be simulated and displayed, and the visibility and the usability of the parameter detection system are improved. By constructing a three-dimensional model of the microchip laser source and adjusting the emission mode of the microchip laser source, the shape, size, position, direction and other parameters of the microchip laser source can be freely controlled and changed, so that the flexibility and adaptability of the parameter detection system are improved. By scanning and analyzing the edge positions of the key nodes in the simulation model, the proper positions where the microchip laser sources are possibly placed can be quickly searched and found, so that the efficiency and convenience of the parameter detection system are improved. By importing the light source model into the simulation model according to the candidate position data, the interaction and the influence between the microchip laser source and each component on the PCB can be observed and compared at different positions, so that the accuracy and the reliability of the parameter detection system are improved. The light intensity distribution condition of the key node can be quantized and evaluated under different positions by carrying out optical transmission simulation on the simulation model containing the light source and calculating the light intensity distribution from each alternative position in the candidate position data to the key node, so that the sensitivity and the resolution of the parameter detection system are improved. The optimal position of the microchip laser source can be determined and selected by optimally screening the candidate position data by utilizing the light intensity distribution data, thereby improving the optimality and stability of the parameter detection system.

Preferably, in step S136, the light intensity attenuation distribution condition from different alternative positions to the key node of the microchip laser source is calculated by a light intensity attenuation calculation formula, so as to obtain light intensity distribution data, and a basis is provided for the preferred position of the microchip laser source according to the light intensity distribution data, where the light intensity attenuation calculation formula is as follows:

wherein I (x, y, z) is the light intensity from the microchip laser source to the critical node (x, y, z), I ₀ The method is characterized in that the method comprises the steps of obtaining initial light intensity of a light source, wherein alpha is an attenuation coefficient of the light in air, lambda is the wavelength of the light, phi is the initial phase of the light, f (t) is a transmission function of the light in the z direction, t is all positions of the light passing through in the transmission process in the z direction, x is the distance of a key node in the horizontal direction, y is the distance of the key node in the vertical direction, and z is the distance of the key node in the depth direction.

The invention constructs a light intensity attenuation calculation formula which can calculate the light intensity attenuation distribution condition from different alternative positions to key nodes of the microchip laser source, thereby providing basis for the preferred position of the microchip laser source. The formula comprehensively considers a plurality of factors influencing the light intensity, namely, the attenuation coefficient alpha of the light in the air represents the loss degree of the light when the light propagates in the air, and the larger the attenuation degree is, the faster the light intensity is attenuated, and the smaller the attenuation degree is, the slower the light intensity is attenuated. It can be adjusted to accommodate different distances between the light source and the receiver depending on the actual environmental conditions. The wavelength lambda of the light, which represents the color and frequency of the light, the light of different wavelengths having different energy and penetration. The optical communication device can be selected according to actual application requirements so as to achieve the optimal optical communication effect. The initial phase phi of light, which represents the initial state of light as it emerges from the light source, has different interference and diffraction characteristics. It can be set according to the actual light source characteristics to increase the fluctuation and complexity of the light intensity. The transfer function f (t) of light in the z-direction, which represents the effect of all locations through which light passes in the z-direction on the intensity of light, including refraction, reflection, scattering, etc. of light in the medium. The method can be used for modeling according to an actual transmission medium so as to more accurately reflect the change rule of the light intensity. Through the combined action of the factors, the formula can reflect the change rule of the light intensity more accurately, and the fluctuation and the complexity of the light intensity are increased by utilizing trigonometric functions and integral operation, so that the light intensity is more difficult to crack. The formula can improve the safety and reliability of the microchip laser source.

Preferably, step S2 comprises the steps of:

step S21: performing tensile test and measurement on the material of the adaptive optical fiber, thereby obtaining maximum deformation data;

specifically, for example, a tensile machine is used to perform a tensile test on the material of the adaptive optical fiber, and a strain gauge is used to measure the deformation amount of the adaptive optical fiber, so as to obtain maximum deformation data. In the testing process, the material of the adaptive optical fiber is fixed at two ends of the tension machine, and the tension is gradually increased until the material breaks or the preset maximum tension is reached. Meanwhile, the strain gauge records the strain value of the material and calculates the deformation amount of the material, so that the maximum deformation data is obtained.

Step S22: performing torsion test and measurement on the material of the adaptive optical fiber, thereby obtaining a maximum torsion angle;

specifically, for example, a twisting machine is used to perform a twisting test on the material of the optical fiber, and an angle meter is used to measure the twisting angle of the material, so as to obtain the maximum twisting angle. In the testing process, the material of the adaptive optical fiber is fixed at one end of the twisting machine, and the torque is gradually increased until the material breaks or reaches the preset maximum torque. Simultaneously, the angle meter records the rotation angle of the material and calculates the torsion angle of the material, so as to obtain the maximum torsion angle.

Step S23: bending test and measurement are carried out on the material of the adaptive optical fiber, so that minimum radius data are obtained;

specifically, bending test is performed on the material of the adaptive optical fiber by using a bending machine, and the bending radius of the adaptive optical fiber is measured by using a radius meter, so as to obtain minimum radius data. In the testing process, the material of the adaptive optical fiber is fixed at one end of the bending machine, and the bending force is gradually increased until the material breaks or the preset maximum bending force is reached. Meanwhile, the radius gauge records the bending degree of the material and calculates the bending radius of the material, so that the minimum radius data is obtained.

Step S24: sorting and combining the maximum deformation data, the maximum torsion angle and the minimum radius data, thereby obtaining optical fiber mechanical data;

specifically, the maximum deformation data, the maximum torsion angle, and the minimum radius data are consolidated and arranged in a certain format and order, for example, using spreadsheet software, thereby obtaining the optical fiber mechanical data. The fiber optic mechanical data can be used to evaluate the material properties and reliability of the adapted fiber.

Step S25: inputting optical fiber mechanical data into a preset computer program, and carrying out transmission loss simulation calculation on the adaptive optical fiber under different bending radiuses so as to obtain a transmission loss data set, wherein the transmission loss data set comprises a plurality of transmission loss data;

Specifically, for example, using a preset computer program, transmission loss simulation calculation is performed on the adaptive optical fiber under different bending radii, and the calculation result is output as a transmission loss data set. The computer program simulates the transmission state of the optical fiber under different bending radiuses according to the optical fiber mechanical data and the physical characteristics of the optical fiber, and calculates the transmission loss of the optical fiber. The transmission loss data set includes a plurality of transmission loss data, each transmission loss data corresponding to a bend radius.

Step S26: performing sequencing analysis on the transmission loss data set so as to obtain a low-loss data set;

specifically, for example, a statistical analysis software is used to perform a sorting analysis on the transmission loss data set, and transmission loss data below a preset loss threshold is screened out according to the threshold, so as to obtain a low loss data set. The low loss data set reflects the excellent transmission performance of the adapted fiber at different bend radii.

Step S27: taking a bending radius range corresponding to the low-loss data set as an optimal radius range;

specifically, for example, a bending radius range corresponding to the low-loss data set is set as an optimal radius range, and the range is set as a design parameter of the adaptive optical fiber. The optimal radius range ensures that the adaptive optical fiber does not generate excessive transmission loss when being connected with the IGBT device.

Step S28: connecting a collector, a grid and an emitter of the IGBT device by using an adaptive optical fiber according to an optical fiber connection scheme and an optimal radius range, so as to obtain a detection connection line;

specifically, the collector, gate and emitter of the IGBT device are connected with the adaptive optical fiber, for example, according to an optical fiber connection scheme and an optimal radius range, thereby obtaining a detection connection line. The detection connection circuit can convert the electrical parameters of the IGBT device into optical signals and transmit the optical signals to an external circuit through an adaptive optical fiber.

Step S29: based on the detection connection line, a preset driving circuit and a control circuit, the microchip laser sources are arranged according to the light source position data, so that a parameter detection circuit is obtained.

Specifically, the microchip laser light source is arranged according to the light source position data based on, for example, the detection connection line, a preset driving circuit, and a control circuit, thereby obtaining a parameter detection circuit. The parameter detection circuit can emit laser signals through the microchip laser source, drive and control the working state of the IGBT device, and receive and analyze the optical signals transmitted by the adaptive optical fibers, so that the parameter detection of the IGBT device is realized.

According to the invention, the deformation condition of the adaptive optical fiber under different tensile forces can be known and mastered by carrying out tensile test and measurement on the material of the adaptive optical fiber, so that the theoretical basis and knowledge reserve of the parameter detection system are improved. The torsion test and measurement of the material of the adaptive optical fiber can realize the understanding and grasp of the torsion condition of the adaptive optical fiber under different torsion forces, thereby improving the theoretical basis and knowledge reserve of the parameter detection system. The bending test and measurement of the material of the adaptive optical fiber can realize the understanding and grasp of the bending condition of the adaptive optical fiber under different bending radiuses, thereby improving the theoretical basis and knowledge reserve of the parameter detection system. By sorting and combining the maximum deformation data, the maximum torsion angle and the minimum radius data, the mechanical characteristics and performances of the adaptive optical fibers can be summarized and evaluated, so that the integrity and consistency of the parameter detection system are improved. By inputting the optical fiber mechanical data into a preset computer program, the transmission loss simulation calculation of the adaptive optical fiber under different bending radiuses can simulate and predict the transmission loss condition of the adaptive optical fiber under different bending radiuses, so that the visibility and usability of the parameter detection system are improved. The transmission loss data sets are sequenced and analyzed, so that the transmission loss conditions of the adaptive optical fibers under different bending radiuses can be compared and screened, and the accuracy and the reliability of the parameter detection system are improved. The optimal radius range of the adaptive optical fiber can be determined and selected by taking the bending radius range corresponding to the low-loss data set as the optimal radius range, so that the optimality and stability of the parameter detection system are improved. The collector, the grid and the emitter of the IGBT device are connected by using the adaptive optical fiber according to the optical fiber connection scheme and the optimal radius range, so that the effective coverage and connection of each extreme of the IGBT device can be realized, and the coverage rate and the reliability of the parameter detection system are improved. The microchip laser sources can be reasonably configured and adjusted by arranging the microchip laser sources according to the light source position data based on the detection connecting line, the preset driving circuit and the control circuit, so that the efficiency and the stability of the parameter detection system are improved.

Preferably, step S25 comprises the steps of:

step S251: inputting optical fiber data into a preset computer program, wherein the optical fiber data comprises maximum deformation data, maximum torsion angle and minimum radius data;

specifically, for example, the deformation, torsion and bending conditions of the microchip laser source are measured using the optical fiber sensor, and the optical fiber data outputted from the optical fiber sensor is inputted into a preset computer program to obtain the optical fiber data. The optical fiber data comprise maximum deformation data, maximum torsion angle and minimum radius data, and the data reflect the deformation degree and the position change of the microchip laser source.

Step S252: acquiring illumination intensity data of a microchip laser source;

specifically, for example, an optical power meter is used to measure the output illumination intensity of a microchip laser source and the electrical signal output by the optical power meter is converted into a digital signal to obtain illumination intensity data. Wherein the illumination intensity data is indicative of the output power and efficiency of the microchip laser source.

Step S253: calculating illumination energy of the illumination intensity data, so as to obtain an illumination power value;

specifically, for example, the light irradiation power value is obtained by calculating the output energy of the microchip laser source using the illumination intensity data and the surface area of the microchip laser source. By this step, in particular, the output energy of the microchip laser source at different deformations and positions can be obtained, for example.

Step S254: performing heat conduction calculation on the light irradiation power value so as to obtain temperature field distribution data;

specifically, for example, parameters such as a light irradiation power value, thermal conductivity, volume and the like of the microchip laser source are utilized to calculate the temperature change and distribution condition of the microchip laser source, thereby obtaining temperature field distribution data. By this step, in particular, for example, the temperature distribution and variation of the microchip laser source under different deformations and positions can be obtained.

Step S255: acquiring surface temperature data of the adaptive optical fiber under different bending radiuses according to the temperature field distribution data, and performing multi-physical field coupling transmission loss calculation on the surface temperature data so as to acquire a temperature rise loss evaluation result;

specifically, the surface temperature data of the adapted fiber is extracted, for example, from the temperature field distribution data. And then, by establishing a multi-physical field coupling model and taking the surface temperature data as boundary conditions, calculating the transmission loss of the adaptive optical fiber under different bending radiuses. And finally, analyzing the relation between the transmission loss and the temperature to obtain a temperature rise loss evaluation result.

Step S256: performing reliability analysis on the mechanical fracture risk of the adaptive optical fiber according to the maximum deformation data, thereby obtaining a fracture loss evaluation result;

Specifically, for example, maximum deformation data, and a reliability analysis of the mechanical fracture risk of the adapted fiber is performed based on the material properties and fracture criteria of the adapted fiber. And finally, analyzing the relation between the fracture risk and the bending radius to obtain a fracture loss evaluation result.

Step S257: performing ray tracing optical simulation calculation on the torsion imbalance effect of the adaptive optical fiber according to the maximum torsion angle, thereby obtaining a torsion loss evaluation result;

specifically, for example, the maximum torsion angle, and according to the structural parameters and the optical characteristics of the adaptive optical fiber, performing optical simulation calculation of the torsion imbalance effect of the adaptive optical fiber by using a ray tracing method. And finally, analyzing the relation between the torsion imbalance effect and the torsion angle to obtain a torsion loss evaluation result.

Step S258: carrying out finite difference constraint mode analysis on the refractive index polarization of the adaptive optical fiber according to the minimum radius data, thereby obtaining a refractive loss evaluation result;

specifically, for example, the finite difference constraint pattern analysis may be a numerical calculation method, such as a finite difference time domain method, a finite difference frequency domain method, or the like. The input of the method is minimum radius data and the refractive index polarization of the adaptive optical fiber, and the output is the refractive loss evaluation result. The method can consider the influence of the bending of the optical fiber on the optical fiber mode, so as to more accurately estimate the refractive loss.

Step S259: respectively taking the temperature rise loss evaluation result, the fracture loss evaluation result, the torsion loss evaluation result and the refraction loss evaluation result as a temperature loss factor, a mechanical failure loss factor, a torsion imbalance loss factor and a refractive index distortion loss factor; carrying out weight superposition analysis on the temperature loss factor, the mechanical failure loss factor, the torsion imbalance loss factor and the refractive index distortion loss factor, thereby obtaining a comprehensive loss evaluation result;

specifically, for example, the weight stack analysis may be a comprehensive evaluation method such as a hierarchical analysis method, a fuzzy comprehensive evaluation method, or the like. The method has the input of temperature rise loss evaluation result, fracture loss evaluation result, torsion loss evaluation result and refraction loss evaluation result, and the output of the method is comprehensive loss evaluation result. The method can give different weights according to the importance of different loss factors, so that a comprehensive loss evaluation index is obtained.

Step S2510: and carrying out transmission loss simulation calculation on the adaptive optical fiber under different bending radiuses according to the comprehensive loss evaluation result, thereby obtaining a transmission loss data set, wherein the transmission loss data set comprises a plurality of transmission loss data.

Specifically, for example, the transmission loss simulation calculation may be a simulation method such as a finite element method, a monte carlo method, or the like. The input of the method is the comprehensive loss evaluation result and the parameters of the adaptive optical fiber, and the output is the transmission loss data set. According to the method, transmission loss data of the adaptive optical fiber under different bending radiuses can be calculated according to comprehensive loss evaluation results under different bending radiuses.

According to the invention, the optical fiber data is input into the preset computer program, so that the temperature field distribution condition of the adaptive optical fiber under different bending radiuses can be rapidly and accurately calculated, and the efficiency and the accuracy of the transmission loss evaluation method are improved; secondly, by acquiring the illumination intensity data of the microchip laser source, the transmission performance of the adaptive optical fiber under different illumination conditions can be monitored in real time and dynamically, so that the sensitivity and the adaptability of the transmission loss evaluation method are improved; then, by carrying out illumination energy calculation on the illumination intensity data, quantitative and objective analysis on the thermal effect of the adaptive optical fiber under different illumination conditions can be realized, so that the scientificity and the credibility of the transmission loss evaluation method are improved; then, by conducting heat conduction calculation on the irradiation power value, the temperature field distribution condition of the adaptive optical fiber under different bending radiuses can be finely and finely simulated, so that the accuracy and the detail of the transmission loss evaluation method are improved; then, the surface temperature data of the adaptive optical fiber under different bending radiuses are obtained according to the temperature field distribution data, so that the surface states of the adaptive optical fiber under different bending radiuses can be intuitively and clearly displayed, and the visibility and usability of the transmission loss evaluation method are improved; thirdly, through carrying out multi-physical field coupling transmission loss calculation on the surface temperature data, the temperature rise loss condition of the adaptive optical fiber under different bending radiuses can be comprehensively and systematically evaluated, so that the integrity and consistency of the transmission loss evaluation method are improved; in addition, by carrying out reliability analysis on the mechanical fracture risk of the adaptive optical fiber according to the maximum deformation data, the fracture loss condition of the adaptive optical fiber under different tensile forces can be prevented and controlled, so that the safety and stability of the transmission loss evaluation method are improved; meanwhile, by performing ray tracing optical simulation calculation on the torsion imbalance effect of the adaptive optical fiber according to the maximum torsion angle, the torsion loss condition of the adaptive optical fiber under different torsion can be simulated and predicted, so that the predictability and controllability of the transmission loss evaluation method are improved; furthermore, by carrying out finite difference constraint mode analysis on the refractive index polarization of the adaptive optical fiber according to the minimum radius data, the calculation and analysis on the refractive loss condition of the adaptive optical fiber under different bending radiuses can be realized, so that the accuracy and reliability of the transmission loss evaluation method are improved; finally, by taking the temperature rise loss evaluation result, the fracture loss evaluation result, the torsion loss evaluation result and the refraction loss evaluation result as a temperature loss factor, a mechanical failure loss factor, a torsion imbalance loss factor and a refractive index distortion loss factor respectively, and carrying out weight superposition analysis on various loss evaluation results, the comprehensive loss conditions of the adaptive optical fiber under different bending radiuses can be comprehensively and balanced, so that the rationality and the optimality of the transmission loss evaluation method are improved; and the transmission loss simulation calculation of the adaptive optical fiber under different bending radiuses is carried out according to the comprehensive loss evaluation result, so that the transmission loss condition of the adaptive optical fiber under different bending radiuses can be simulated and predicted, and the visibility and usability of the transmission loss evaluation method are improved.

Preferably, step S29 comprises the steps of:

step S291: carrying out forward and reverse working voltage test on the detection circuit so as to obtain forward resistance reading and reverse resistance reading;

specifically, the detection circuit is subjected to forward and reverse operating voltage test, for example, by using a multimeter, and the resistance values of both ends thereof are measured to obtain forward resistance readings and reverse resistance readings. In the test process, the red and black pens of the universal meter are respectively contacted with two ends of the detection circuit, forward and reverse working voltages are switched, and meanwhile, the display value of the universal meter is recorded, so that forward resistance reading and reverse resistance reading are obtained.

Step S292: consistency judgment is carried out on the forward resistance reading and the reverse resistance reading, so that judgment result data is obtained;

specifically, for example, a consistency judgment algorithm is used to make consistency judgment on the forward resistance reading and the reverse resistance reading, and the judgment result data is output. The consistency judging algorithm compares whether the forward resistance reading and the reverse resistance reading are equal or similar according to a preset error range, and outputs judging result data according to a comparison result. The judgment result data may be consistency data or inconsistency data.

Step S293: when the judging result data is inconsistent data, positioning insulation damage points on the whole optical fiber connecting circuit, so as to obtain damage position data;

specifically, for example, when it is determined that the judgment result data is inconsistent data, insulation damage point positioning is performed on the whole optical fiber connection circuit, and damage position data is output. The insulation damage point positioning method utilizes an optical fiber sensing technology, and the positions of insulation damage points in the optical fiber connection circuit are calculated and damage position data are output by emitting laser pulses at one end of the optical fiber connection circuit and receiving reflected laser signals at the other end of the optical fiber connection circuit.

Step S294: stripping the optical fiber insulation layer from the insulation damage point according to the damage position data, and re-insulating the position of the insulation damage point;

specifically, for example, the optical fiber insulation layer peeling may be a physical treatment method such as laser cutting, mechanical scraping, or the like. The input of the method is damage position data and insulation damage points, and the output is re-insulated insulation damage points. The method can remove the insulating layer on the insulating damage point so as to expose the optical fiber core, and then re-insulate the position of the insulating damage point so as to restore the integrity of the optical fiber.

Step S295: repeating the steps S291 to S294 until the judgment result data is consistent data, and performing frequency response characteristic test on the detection circuit so as to obtain frequency response data; and evaluating and optimizing the detection circuit by utilizing the frequency response data, thereby obtaining the parameter detection circuit.

Specifically, for example, the frequency response characteristic test may be an electrical test method such as a network analyzer, a spectrum analyzer, or the like. The input of the method is the detection circuit and the consistency data, and the output is the frequency response data. The method can measure the input and output characteristics of the detection circuit under different frequencies, thereby evaluating the performance of the detection circuit and optimizing the performance so as to obtain the parameter detection circuit.

The forward and reverse working voltage test of the detection circuit can be carried out to measure and acquire the forward and reverse resistance values of each component in the detection circuit, so that the theoretical basis and knowledge reserve of the parameter detection system are improved. By carrying out consistency judgment on the forward resistance reading and the reverse resistance reading, whether faults such as insulation damage or short circuit exist in the detection circuit or not can be judged and identified, and therefore accuracy and reliability of the parameter detection system are improved. When the judging result data is inconsistent data, the insulation damage point positioning of the whole optical fiber connecting circuit can be realized to position and find the specific positions of faults such as insulation damage or short circuit, and the efficiency and convenience of the parameter detection system are improved. The optical fiber insulation layer is stripped from the insulation damage point according to the damage position data, and the insulation damage point is re-insulated, so that effective repair and treatment of faults such as insulation damage or short circuit can be realized, and the safety and stability of the parameter detection system are improved. By repeating steps S291 to S294 until the result data is consistent data, the frequency response characteristic of each component in the detection circuit can be tested and obtained by performing the frequency response characteristic test on the detection circuit, so that the theoretical basis and knowledge reserve of the parameter detection system are improved. The frequency response characteristics of each component in the detection circuit can be analyzed and evaluated by utilizing the frequency response data to evaluate and optimize the detection circuit, so that the optimality and stability of the parameter detection system are improved.

Preferably, step S295 includes the steps of:

step S2951: repeating the steps S291 to S294 until the judgment result data is consistent data, carrying out continuous frequency scanning signal transmission on the detection circuit through a preset network analyzer, and recording the transmission consumption and impedance parameters of the detection circuit in the frequency sweeping process, thereby obtaining frequency response data;

specifically, for example, the detection circuit may be a microwave circuit such as a filter, an amplifier, a mixer, or the like. The predetermined network analyzer may be an instrument capable of outputting and receiving microwave signals, such as a vector network analyzer. The continuous frequency sweep signal may be a signal that varies gradually from low frequency to high frequency, such as a linear sweep signal. The transmission consumption may be the degree of attenuation of the input signal by the detection circuit, such as insertion loss. The impedance parameter may be a degree of reflection, e.g. a reflection coefficient, of the input signal by the detection circuit.

Step S2952: drawing curves of amplitude values, phase values and impedance parameters of all frequency points in the frequency response data, so as to obtain a phase-frequency response curve and an impedance matching curve;

in particular, the amplitude may be, for example, a ratio of the input signal and the output signal, such as a transmission coefficient. The phase value may be a phase difference, such as a phase delay, of the input signal and the output signal. The impedance parameter may be an input impedance or an output impedance of the detection circuit, such as an impedance matrix. The curve plotting may be by graphically connecting data points into a curve, such as MATLAB.

Step S2953: performing linear phase range analysis on the phase frequency response curve so as to obtain a phase bandwidth parameter;

specifically, for example, the linear phase range analysis may calculate the slope change of the phase-frequency response curve at different frequency segments by using a mathematical method, such as a least square method. The phase bandwidth parameter may be the width of the phase-frequency response curve in a frequency band with a slope close to zero, e.g. the group delay bandwidth.

Step S2954: group delay change calculation is carried out on the phase bandwidth parameters, so that delay error data are obtained;

specifically, for example, the group delay variation calculation may calculate the variation rate of the phase bandwidth parameter at different frequency points by using a mathematical method, such as a differential method. The delay error data may be an absolute or relative value of the rate of change of the group delay, such as group delay distortion.

Step S2955: performing matching bandwidth analysis on the impedance matching curve so as to obtain matching bandwidth parameters;

in particular, for example, the matching bandwidth analysis may determine the shape of the impedance matching curve at different frequency bins, such as a smith chart, by using a graphical method. The matching bandwidth parameter may be the width of the impedance matching curve in a frequency band meeting a preset condition, for example a-10 dB bandwidth.

Step S2956: carrying out impedance matching degree analysis on the matching bandwidth parameters so as to obtain matching degree data;

specifically, for example, the impedance matching degree analysis may calculate the degree of deviation of the impedance matching curve at different frequency points, such as normalized impedance, by using a numerical method. The matching degree data may be a deviation value or a deviation ratio of the impedance matching curve, such as a reflection coefficient or a standing wave ratio.

Step S2957: performing high-speed performance evaluation on the detection circuit by using the phase bandwidth parameter, the delay error data and the matching degree data, thereby obtaining performance index data;

specifically, for example, high-speed performance evaluation can be performed by comprehensively analyzing the phase bandwidth parameter, delay error data, and matching degree data using an evaluation method, such as a weighted average method. The performance index data may be the quality of the detection circuit in high-speed signal transmission, such as signal-to-noise ratio or bit error rate.

Step S2958: and optimizing the detection circuit according to the performance index data, thereby obtaining the parameter detection circuit.

In particular, for example, the optimization may be performed by adjusting a structure or a parameter of the detection circuit using an optimization method, such as a genetic algorithm or a gradient descent method. The parameter detection circuit may be an optimized detection circuit, such as one that improves phase bandwidth, delay error, and matching.

According to the invention, by repeating the steps S291 to S294 until the judgment result data is consistent data, the transmission consumption and impedance parameters of the detection circuit under different frequencies can be continuously tested and recorded by carrying out continuous frequency scanning signal transmission on the detection circuit through the preset network analyzer, so that the theoretical basis and knowledge reserve of the parameter detection system are improved. The visual display and analysis of the phase frequency response characteristic and the impedance matching characteristic of the detection circuit under different frequencies can be realized by carrying out curve drawing on the amplitude, the phase value and the impedance parameter of each frequency point in the frequency response data, so that the visibility and usability of the parameter detection system are improved. The phase change condition of the detection circuit under different frequencies can be quantized and evaluated by carrying out linear phase range analysis on the phase frequency response curve, so that the accuracy and reliability of the parameter detection system are improved. The group delay change condition of the detection circuit under different frequencies can be calculated and predicted by carrying out group delay change calculation on the phase bandwidth parameters, so that the sensitivity and resolution of the parameter detection system are improved. The impedance matching condition of the detection circuit under different frequencies can be quantified and evaluated by carrying out matching bandwidth analysis on the impedance matching curve, so that the adaptability and stability of the parameter detection system are improved. The high-speed performance of the detection circuit can be evaluated and optimized comprehensively by utilizing the phase bandwidth parameter, the delay error data and the matching degree data, so that the optimality and stability of the parameter detection system are improved. The parameters of each component in the detection circuit, such as resistance, capacitance, inductance and the like, can be adjusted and improved by optimizing the detection circuit according to the performance index data, so that the efficiency and stability of the parameter detection system are improved.

Preferably, in step S2954, the error value calculation is performed on the group delay variation by a group delay error calculation formula based on the phase linear range, wherein the group delay error calculation formula is as follows:

wherein delta is group delay error, t ¹ For the transmission time of the signal, g (ω) is the frequency response function of the signal, ω is the angular frequency, g _k (ω _k ) To show the frequency response function of the kth sample point, ω _k Angular frequency, Δt, for the kth sample point ¹ _k For the time interval of the kth sample point,k is the sequence number of the sampling point, which is the phase accumulation amount of the signal.

The invention constructs a group delay error calculation formula which can calculate the error value of the group delay change, thereby providing an evaluation basis for the transmission quality of signals. The formula takes into account the following aspects: time t of signal transmission ¹ It shows the time experienced by the signal from the transmitting end to the receiving endThe shorter the interval, the higher the transmission efficiency of the signal, and the longer the interval, the lower the transmission efficiency of the signal. It can be measured according to the actual transmission distance and speed to reflect the transmission performance of the signal. The frequency response function g (ω) of the signal, which represents the amplitude and phase variation of the signal at different frequencies, is the better the spectral characteristics of the signal the smoother the signal, and the worse the spectral characteristics of the signal the more fluctuating. It can be obtained according to the actual signal source and channel characteristics to reflect the frequency domain characteristics of the signal. Phase accumulation of signal It shows that the smaller the phase change accumulated in the signal during transmission, the better the phase linearity of the signal, and the larger the phase linearity of the signal. It may be integrated according to the actual frequency response function to reflect the phase characteristics of the signal. The number k of sampling points, which indicates the number and position of times the signal is sampled during transmission, is higher the more the sampling accuracy is, and is lower the less the sampling accuracy is. It may be determined based on the actual sampling frequency and sampling time to reflect the sampling characteristics of the signal. Through the combined action of the aspects, the formula can calculate the error value of the group delay change, and the differential and summation operation is utilized, so that the sensitivity and accuracy of the error value are increased, and the error value can reflect the change condition of the group delay. The formula can improve the transmission quality and stability of signals.

Preferably, step S5 comprises the steps of:

step S51: signal enhancement is carried out on the parameter digital signals, so that enhanced parameter electric signals are obtained;

specifically, for example, the signal enhancement may be performed by filtering, amplifying, noise reducing, or the like, such as kalman filtering or wavelet transformation, on the parameter digital signal using a signal processing method. The enhanced parametric electrical signal may be a parametric digital signal that has been signal enhanced, such as a parametric digital signal having a higher signal-to-noise ratio or a sharper waveform.

Step S52: extracting data from the enhanced parameter electric signals so as to obtain state characteristic parameters;

specifically, for example, the data extraction may perform operations such as feature extraction, feature selection, feature dimension reduction, and the like on the enhanced parameter electrical signal by using a data mining method, such as principal component analysis or support vector machine. The state characteristic parameter may be a state-related characteristic value or a characteristic vector, such as frequency, amplitude, phase, etc., extracted from the enhanced parameter electrical signal.

Step S53: calculating state evaluation parameters of the state characteristic parameters so as to obtain the state parameters;

specifically, for example, the state evaluation parameter calculation may perform an operation such as state evaluation or state prediction on the state feature parameter by using a mathematical model or a machine learning model, such as linear regression or a neural network. The state parameter may be a parameter value or parameter vector calculated from the state characteristic parameter, such as health, lifetime, failure rate, etc., that is relevant to the state assessment.

Step S54: mapping the state parameters so as to obtain a state evaluation image;

in particular, for example, mapping may be performed by visual presentation or analysis of state parameters using graphical software or programming language, such as Excel or Python. The state evaluation image may be a graph or chart, such as a graph, bar chart, pie chart, etc., generated from the state parameters that is relevant to the state evaluation.

Step S55: and presenting the state evaluation image on a human-computer interaction interface, so as to acquire the visual state parameters.

In particular, for example, human-machine interaction interface presentations may perform operations such as QT or HTML for layout, beautification, interaction, etc. of state assessment images using interface design software or programming language. The visual state parameters may be state assessment images and associated written or prompted information, such as dashboards, reports, warnings, etc., presented to the user via the human-machine interface.

The invention can extract and amplify the effective information in the parameter digital signal by enhancing the parameter digital signal, thereby improving the sensitivity and resolution of the parameter detection system. For example, noise and interference in the parametric digital signal may be removed by filtering, smoothing, interpolation, etc., and amplified to a suitable voltage level to facilitate subsequent data extraction and analysis. The characteristic information in the enhanced parameter electric signal can be identified and extracted by extracting the data of the enhanced parameter electric signal, so that the accuracy and the reliability of the parameter detection system are improved. For example, the characteristic information such as frequency, amplitude, phase and the like in the enhanced parameter electrical signal can be extracted by fourier transform, wavelet transform, neural network and the like, and converted into a state characteristic parameter. The key information in the state characteristic parameters can be calculated and evaluated by calculating the state evaluation parameters, so that the adaptability and the stability of the parameter detection system are improved. For example, key information in the state characteristic parameters such as current, voltage, temperature, etc. can be calculated by a linear regression, support vector machine, random forest, etc. method, and converted into the state parameters. By plotting the state parameters, the visual display and analysis of the change trend and rule in the state parameters can be realized, so that the visibility and usability of the parameter detection system are improved. For example, the change trend and law in the state parameter may be plotted by a line graph, a bar graph, a scatter graph, or the like, and converted into a state evaluation image. The important information in the state evaluation image can be interactively displayed and interpreted by presenting the state evaluation image on a human-computer interaction interface, so that the interactivity and the friendliness of the parameter detection system are improved. For example, important information in the state evaluation image, such as a maximum value, a minimum value, an average value and the like, can be presented through buttons, sliders, menus and the like, and converted into visual state parameters.

The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

The foregoing is only a specific embodiment of the invention to enable those skilled in the art to understand or practice the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The method for collecting the state parameters of the IGBT device is characterized by comprising the following steps of:

2. The method for acquiring the state parameters of the IGBT device according to claim 1, wherein step S1 includes the steps of:

step S11: acquiring an IGBT working circuit diagram and a PCB layout diagram;

3. The method for acquiring the state parameters of the IGBT device according to claim 2, wherein step S13 includes the steps of:

4. The method for acquiring the state parameters of the IGBT device according to claim 3, wherein in step S136, the light intensity attenuation distribution condition from different alternative positions to the key node of the microchip laser source is calculated by a light intensity attenuation calculation formula, so as to acquire light intensity distribution data, and a basis is provided for the preferred position of the microchip laser source according to the light intensity distribution data, wherein the light intensity attenuation calculation formula is as follows:

5. The method for acquiring the state parameters of the IGBT device according to claim 1, wherein step S2 includes the steps of:

step S24: taking the maximum deformation data, the maximum torsion angle and the minimum radius data as optical fiber mechanical data;

6. The method for acquiring the state parameters of the IGBT device according to claim 5, wherein step S25 includes the steps of:

step S252: acquiring illumination intensity data of a microchip laser source;

7. The method for acquiring the state parameters of the IGBT device according to claim 5, wherein step S29 includes the steps of:

8. The method for acquiring the state parameters of the IGBT device according to claim 7, wherein step S295 includes the steps of:

9. The method for acquiring the state parameters of the IGBT device according to claim 8, wherein in step S2954, the group delay variation is calculated by a group delay error calculation formula based on the phase linear range, wherein the group delay error calculation formula is as follows:

10. The method for acquiring the state parameters of the IGBT device according to claim 1, wherein step S5 includes the steps of: