CN117339255A - Wafer processing wastewater raw material recovery device and method - Google Patents
Wafer processing wastewater raw material recovery device and method Download PDFInfo
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- CN117339255A CN117339255A CN202311642432.8A CN202311642432A CN117339255A CN 117339255 A CN117339255 A CN 117339255A CN 202311642432 A CN202311642432 A CN 202311642432A CN 117339255 A CN117339255 A CN 117339255A
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- 239000002351 wastewater Substances 0.000 title claims abstract description 95
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000002994 raw material Substances 0.000 title claims abstract description 20
- 238000011084 recovery Methods 0.000 title claims abstract description 15
- 238000004062 sedimentation Methods 0.000 claims abstract description 85
- 239000007788 liquid Substances 0.000 claims abstract description 44
- 238000001556 precipitation Methods 0.000 claims abstract description 44
- 238000000227 grinding Methods 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 136
- 238000009826 distribution Methods 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 14
- 239000013049 sediment Substances 0.000 claims description 13
- 238000005192 partition Methods 0.000 claims description 12
- 238000004064 recycling Methods 0.000 claims description 9
- 230000001105 regulatory effect Effects 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 15
- 239000013078 crystal Substances 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract description 5
- 230000009471 action Effects 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 4
- 230000005484 gravity Effects 0.000 abstract description 4
- 238000000926 separation method Methods 0.000 abstract description 4
- 238000004065 wastewater treatment Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 description 13
- 238000010521 absorption reaction Methods 0.000 description 8
- 239000003921 oil Substances 0.000 description 8
- 239000002173 cutting fluid Substances 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 4
- 238000007667 floating Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D21/00—Separation of suspended solid particles from liquids by sedimentation
- B01D21/02—Settling tanks with single outlets for the separated liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D21/00—Separation of suspended solid particles from liquids by sedimentation
- B01D21/003—Sedimentation tanks provided with a plurality of compartments separated by a partition wall
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D21/00—Separation of suspended solid particles from liquids by sedimentation
- B01D21/003—Sedimentation tanks provided with a plurality of compartments separated by a partition wall
- B01D21/0033—Vertical, perforated partition walls
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Separation Of Suspended Particles By Flocculating Agents (AREA)
Abstract
The invention belongs to the technical field of wastewater treatment, and particularly relates to a wafer processing wastewater raw material recovery device and method. Because the wastewater generated by grinding the wafer contains a large amount of crystal powder, the invention utilizes the density difference of different substances to automatically separate under the action of gravity, and can realize the real-time precipitation separation of the wastewater raw material, namely, the wastewater is separated while being generated. In order to improve the sedimentation effect, the liquid sedimentation distance is increased, and a multi-stage slow flow groove is designed, so that powder in the liquid has higher probability to be sedimented into the filter tank. The device has simple structure and only uses devices such as plates, pipelines and the like; meanwhile, the processing technology is simple, and the manufacturing cost is low.
Description
Technical Field
The invention belongs to the technical field of wastewater treatment, and particularly relates to a wafer processing wastewater raw material recovery device and method.
Background
In the semiconductor industry, during wafer processing, grinding processes such as cutting, chamfering, thinning and the like are required to be performed on a wafer. During the process, grinding wheels are generally used for grinding the wafer, and a large amount of water is used for cooling in the process, so that a large amount of wastewater is finally formed. At present, waste water is generally discharged into a waste water treatment system directly in the industry, and is directly discarded. Since the wafer material is typically silicon, silicon carbide, lithium niobate, lithium tantalate, etc., these materials are expensive. The waste water generated in the chamfering, thinning and other processes contains a large amount of crystal powder, has high economic value, and directly discards the waste water to cause a large amount of crystal material waste. Meanwhile, in the grinding process of cutting, chamfering, thinning and the like, the processing wastewater is continuously generated, the accumulated generated quantity is huge, and no online direct recovery technology exists at present, so that the independent centralized collection quantity is too large to implement, and the waste treatment is generally direct.
To solve the above problems, patent document CN111138006a discloses a chamfering wastewater treatment and recycling device, which is composed of a lift pump, a three-layer sedimentation reactor and an extraction demulsification sedimentation separation device connected in series. The purification treatment of the solid matters in the wastewater is completed through a series of processes such as precipitation, chemical reaction and the like, but the whole device has the problems of complex structure, large amount of chemicals input, high cost, high energy consumption and the like.
The patent document with the publication number of CN113415853B discloses an integrated treatment device for mixed wastewater of chamfering and machining, wherein an oil absorption floating block floats on the upper surface of the wastewater by buoyancy and continuously moves under the drive of a belt, so that oil absorption equipment continuously and repeatedly moves in the wastewater, the oil absorption equipment has a stronger absorption effect on any position in an oil absorption tank, the absorption speed of insoluble floating oil substances is improved, and the collection efficiency of the insoluble floating oil substances is increased; meanwhile, through continuous movement and gas explosion of the oil absorption device, the stirring effect on waste water is enhanced, and the influence on the absorption of floating oil is avoided. The invention mainly aims at treating the greasy dirt in the chamfering wastewater, and meanwhile, the whole device has the problems of complex structure, large volume, high energy consumption, low efficiency and the like.
Patent document publication number CN102837221B discloses a cutting fluid precipitation recycling device with a movable precipitation frame, a material baffle inclined plate separates a discharge frame into a discharge frame chip cutting chamber with a discharge frame chip material inlet at the upper part and a discharge frame cutting fluid precipitation chamber with a cutting fluid outlet at the lower part. The invention discloses a cutting fluid sedimentation device, which is characterized in that a sedimentation frame mounting hole is formed in the upper front part of a cutting fluid sedimentation chamber of a discharge frame, two flat steel brackets are fixedly connected to the front wall and the rear wall of the cutting fluid sedimentation chamber of the discharge frame at the lower side of the sedimentation frame mounting hole, a sedimentation frame is slidably arranged on the flat steel brackets, the section shape of the sedimentation frame corresponds to the section shape of the inner cavity of the upper part of the cutting fluid sedimentation chamber of the discharge frame, one surface of the sedimentation frame, close to the sedimentation frame mounting hole, is provided with a sedimentation frame cover plate, a handle is arranged on the sedimentation frame cover plate, and a seepage hole is formed in the sedimentation frame bottom plate of the sedimentation frame.
Disclosure of Invention
Aiming at the defects and problems existing in the prior art, the invention provides a device and a method for recycling raw materials of wafer processing wastewater. The principle of the invention is that the density difference of different substances is utilized to automatically separate under the action of gravity, and simultaneously, in order to improve the efficiency, the real-time precipitation separation, namely the separation of waste liquid is carried out while generating, is carried out under the flowing state of the mixed liquid with different densities. Factors influencing the sedimentation effect in the flowing state are the flowing speed and the sedimentation distance, and the sedimentation effect is better when the flow speed is lower. The longer the distance that flows during the precipitation, the longer the time corresponding to the precipitation, the better the precipitation effect.
In order to achieve the purpose of reducing the flow rate, a plurality of horn-shaped slow flow groove structures are arranged in the settling tank, wastewater flows in from the small-caliber position of the slow flow groove, the volume of the water inlet end is small, the wastewater flows out from the large-caliber position, the volume of the water outlet end is large, and the liquid is concentrated and compressed at the small-caliber position, so that the flow rate of the liquid is large when the wastewater passes through the slow flow groove structures; the liquid flows to the large caliber, the liquid dispersion pressure is reduced, so that the liquid flow speed is reduced when the liquid passes through the large caliber, the powder and the particles in the liquid are subjected to reduced transverse flow force under the low flow speed, slowly sink under the action of gravity, and finally are deposited on the bottom plate of the filter tank. In order to improve the sedimentation effect and increase the liquid sedimentation distance, a multistage slow flow groove structure is designed in the sedimentation groove, the slow flow grooves are in series connection, the liquid flow distance is prolonged, particles in the liquid are enabled to have larger probability to sediment to the bottom of the filter groove, meanwhile, an overflow port is arranged at the high position of the baffle plate of the slow flow groove at the joint between the multistage slow flow groove structures, so that flowing liquid can flow out when being concentrated on the upper part of the liquid level, impact and traction force to bottom sediment are reduced, and sediment movement is avoided.
In addition, in order to reduce the liquid velocity of flow, can shunt waste water into the multilayer precipitation tank, each layer precipitation tank carries out parallelly connected design, makes the velocity of flow that waste water flowed through in each layer precipitation tank reduce as far as possible, simultaneously, the design of multilayer precipitation tank can carry out the synchronous sedimentation processing of a large amount of waste water, be the key that realizes real-time precipitation, real-time precipitation just is the in-process direct precipitation at equipment production waste water, that is carry out the sediment while producing waste water, the more parallelly connected sediment filter equipment, the total flow is big, the effect that realizes online precipitation is better.
In order to solve the problems existing in the background technology, the invention adopts the following technical scheme:
the wafer processing wastewater raw material recovery device comprises a precipitation tank, a flow-retarding tank, a baffle plate, a water inlet, a water outlet, an overflow port, a water collecting tank, a flow-dividing port, a frame, a water pump, a liquid level switch, an adjusting valve, a flow-dividing pipe, a water supply pipe, a water discharge pipe and a water supply port;
wherein, the water collecting tank is positioned at the bottom of the frame, a water pump is arranged in the water collecting tank, and a liquid level switch is arranged in the water collecting tank; the water pump is connected with the shunt tank through a water supply pipe;
the water inlet is connected with a water inlet pipe, and the water outlet pipe is connected with the water distribution pipe;
the shunt tank is connected with the precipitation tank through a shunt pipe, and the regulating valve is arranged on the shunt pipe;
the sedimentation tank is arranged in the frame, a water inlet and a water outlet are arranged on the sedimentation tank, the water outlet of the sedimentation tank is connected with the drain pipe, and the water inlet is connected with the shunt pipe;
wherein, the sedimentation tank is internally provided with a baffle plate, the baffle plate divides the sedimentation tank into two or more slow flow tanks, the slow flow tanks are in a horn shape, and the multistage slow flow tanks are in a series connection relationship; the head end or the tail end of the partition board is provided with an overflow port, the overflow port is positioned above the partition board and is positioned at the high position of the slow flow groove, in each slow flow groove, wastewater flows in from the small-caliber position of the slow flow groove, the volume of the water inlet end is small, the water outlet end flows out from the large-caliber position, and the volume of the water outlet end is large.
Preferably, the partition plates can be detached, the number of the partition plates can be adjusted, the number of the slow flow grooves is changed, and the balance of the wastewater precipitation effect and the working efficiency is realized;
preferably, the water inlet is arranged above the side surface of the diversion groove, the diversion opening is arranged below the side surface of the diversion groove, the water inlet is arranged below the side surface of the sedimentation groove, and the water outlet is arranged above the side surface of the sedimentation groove;
preferably, one or more layers of sedimentation tanks are arranged inside the frame.
Preferably, a plurality of layers of sedimentation tanks are arranged in the frame, a plurality of branches are arranged on the shunt tube, each branch is respectively connected into each sedimentation tank through a water inlet, the sedimentation tanks are in parallel connection, and an adjusting valve is arranged on each branch;
preferably, a plurality of shunt ports are designed on the shunt grooves, each shunt port is connected with a shunt pipe, each shunt pipe is connected to each sedimentation groove through a water inlet, the sedimentation grooves are in parallel connection, and the regulating valves are respectively arranged on each shunt pipe;
preferably, the aspect ratio of the length of the sedimentation tank is 1:1:0.1, and the length dimension is more than 0.5 m, so that the water flow distance can be ensured to be long enough, and the flow speed is slow enough, thereby achieving the sedimentation effect.
The working principle of the invention is as follows:
the water collecting tank is used for collecting waste liquid generated by equipment such as a chamfering machine, a thinning machine and the like, and after the collected waste liquid reaches a set height, the waste liquid is pumped to the diversion tank through the water pump so as to convert the lifting height of the waste liquid into potential energy;
the diversion channel enables the waste liquid to naturally flow down by gravity through a pipeline, and enters the sedimentation tank for sedimentation along the diversion channel, the regulating valve and the water inlet, and the effect of the regulating valve is that the waste water uniformly flows into the sedimentation tank due to the difference in height of the sedimentation tanks and the difference in waste water pressure; according to the amount of wastewater produced by processing equipment, a plurality of layers of sedimentation tanks can be arranged in the frame, so that real-time sedimentation of a large amount of wastewater is satisfied;
the sedimentation tank is divided into two or more slow flow tanks through a baffle plate, the slow flow tanks are horn-shaped, waste water flows in from the small caliber of the slow flow tank, the volume of the water inlet end is small, the waste water flows out from the large caliber, the volume of the water outlet end is large, the liquid flow rate is large in the case of small volume and the liquid flow rate is small in the case of large volume, and the waste water in the slow flow tanks can be precipitated under the condition of low-speed flow by utilizing the characteristic of uneven flow rate of water flow in the slow flow tanks, so that the sedimentation effect is improved;
the head end or the tail end of the baffle plate is provided with an overflow port, and the overflow port is positioned above the baffle plate and at the high position of the slow flow groove, so that particles in the waste liquid are not easy to flow out, and the sedimentation effect is better;
in order to lengthen the flowing distance of the waste water, the flow-retarding tanks are connected end to end and connected in series, namely, the tail end of the first-stage flow-retarding tank is connected with the head end of the second-stage flow-retarding tank until the last-stage flow-retarding tank, so that the waste liquid is precipitated through the multi-stage flow-retarding tanks, and finally the waste water after the precipitation is finished flows out of the last-stage flow-retarding tank, at the moment, crystal powder in all the waste liquid is precipitated at the bottom of the precipitation tank, only the waste water flows out of the drain pipe, the water flow of the waste water is continuously carried out in the precipitation process, and the purpose of real-time precipitation is finally realized, but the precipitation process is not realized under the static state of the waste liquid.
The method for recycling the wafer processing wastewater raw material by adopting the device comprises the following steps:
s1: wastewater generated in the operation process of the wafer processing equipment flows into the water collecting tank;
s2: when the liquid level of the wastewater in the water collecting tank rises to the upper limit position of a liquid level switch, a water pump is started, and the wastewater is pumped into the diversion tank through a water supply pipe;
s3: the diversion tank injects the wastewater into the precipitation tank through the diversion pipe and the regulating valve;
s4: after the wastewater flows into the settling tank, the wastewater enters a slow flow tank in the settling tank, the wastewater flows in from a small caliber position of the slow flow tank, the volume of a water inlet end is small, the wastewater flows out from a large caliber position, the volume of a water outlet end is large, when the liquid level of a first stage of slow flow tank rises to the height of an overflow port, the wastewater flows into a next stage of slow flow tank from the overflow port, and the wastewater finally reaches a last stage of slow flow tank in a circulating way;
s5: the wastewater after precipitation flows out through a water outlet of the precipitation tank and flows into a drain pipe;
s6: when more sediment is accumulated in the sedimentation tank, the device can be reused after the interior is cleaned.
The wafer processing comprises all grinding processes of the wafer, such as cutting, chamfering, grinding and thinning, and waste water generated by the processing contains wafer grinding powder;
wherein the sediment height ratio should be kept within 1/2 of the total sediment tank height, if the sediment tank needs to be cleaned more than necessary.
The beneficial effects of the invention are as follows:
1. according to the invention, through the structural design, the effects of reducing the flow velocity of the wastewater and lengthening the flow distance are realized, and finally, the real-time precipitation of the wastewater raw material is realized, namely, wastewater is generated at one side of the equipment, and the device synchronously processes the precipitated wastewater. Compared with the traditional method for collecting waste liquid by using a large-area sedimentation tank, the method for recycling raw materials after long-time sedimentation has the advantages of technical advancement, functional innovation and effect practicability;
2. the recovery device provided by the invention realizes high-efficiency precipitation by using a multi-stage slow flow tank and multi-layer precipitation tank structure, has short precipitation time, does not need long waiting time, and improves the comprehensive time utilization rate, namely, has high working efficiency; space advantage resources are fully utilized, and the resource utilization rate is higher; the device has small volume, convenient movement and strong flexibility, and can meet the use requirement of complex environments;
3. the device has simple structure and only uses devices such as plates, pipelines and the like; meanwhile, the processing technology is simple, and the manufacturing cost is low.
Drawings
The invention will be further described with reference to the drawings and examples,
FIG. 1 is a schematic diagram of a wafer processing wastewater raw material recovery device;
FIG. 2 is a schematic structural diagram of a precipitation tank;
FIG. 3 is a schematic view of the structure of a water collection sump;
FIG. 4 is a schematic view of the structure of the shunt channel;
FIG. 5 is a schematic structural view of a frame;
wherein, precipitation tank 1, slow flow tank 2, baffle 3, water inlet 4, delivery port 5, overflow mouth 6, water catch bowl 7, shunt tank 8, shunt ports 9, frame 10, water pump 11, liquid level switch 12, governing valve 13, shunt tubes 14, upper water pipe 15, drain pipe 16, upper water gap 17.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1: the wafer processing wastewater raw material recovery device is shown in fig. 1, and comprises a precipitation tank 1, a slow flow tank 2, a partition plate 3, a water inlet 4, a water outlet 5, an overflow port 6, a water collecting tank 7, a diversion tank 8, a diversion port 9, a frame 10, a water pump 11, a liquid level switch 12, an adjusting valve 13, a diversion pipe 14, a water supply pipe 15, a water discharge pipe 16 and a water supply port 17;
wherein, the frame 10 is shown in fig. 5, the water collecting tank 7 is positioned at the bottom of the frame 10, a water pump 11 is arranged in the water collecting tank 7, and a liquid level switch 12 is arranged in the water collecting tank 7; wherein, the water pump 11 is connected with the diversion groove 8 through the water supply pipe 15, and the water collecting groove is shown in figure 3;
the water distribution groove 8 is arranged at the top of the frame 10, a water distribution opening 9 and a water supply opening 17 are arranged on the water distribution groove 8, the water supply opening 17 is connected with a water supply pipe 15, the water distribution opening 9 is connected with a water distribution pipe 14, the water supply opening 17 is arranged above the side surface of the water distribution groove 8, the water distribution opening 9 is arranged below the side surface of the water distribution groove 8, and the water distribution groove is shown in fig. 4;
the shunt tank 8 is connected with the sedimentation tank 1 through a shunt tube 14, nine layers of sedimentation tanks are arranged in the frame, the shunt tube 14 is provided with a plurality of branches, each branch is respectively connected into each sedimentation tank through a water inlet, the sedimentation tanks are in parallel connection, and an adjusting valve is arranged on each branch;
wherein the sedimentation tank 1 is arranged in the frame 10, the sedimentation tank 1 is provided with a water inlet 4 and a water outlet 5, the water outlet 5 of the sedimentation tank 1 is connected with a drain pipe 16, the water inlet 4 is connected with a shunt pipe 14, the sedimentation tank is shown in figure 2, and the size of the sedimentation tank is that；
Wherein, the inside of the precipitation tank 1 is provided with a baffle plate 3, the baffle plate 3 divides the precipitation tank 1 into a plurality of horn-shaped slow flow grooves 2, and the multistage slow flow grooves 2 are connected in series; the head end or the tail end of the partition plate 3 is provided with an overflow port, the overflow port is positioned above the partition plate, waste water flows in from the small-caliber position of the slow flow groove, the volume of the water inlet end is small, the waste water flows out from the large-caliber position, and the volume of the water outlet end is large.
The method for recycling the wafer processing wastewater raw material comprises the following steps:
s1: connecting a water outlet of the chamfering machine with a water collecting tank 7 below the frame 10, and connecting the water collecting tank 7 by using a pipeline with the diameter of 50mm, wherein the total flow of waste water generated in the running process of equipment is 15L/min through flowing into the water collecting tank 7;
s2: when the wastewater level in the water collecting tank 7 rises to the upper limit position of the level switch 12, as shown in fig. 3, the water pump 11 is started, and the wastewater is pumped into the diversion tank 8 through the water inlet pipe 15;
s3: as the wastewater is continuously injected into the diversion groove 8 through the water inlet 17, the liquid level is continuously increased, after the liquid level is higher than the diversion opening 9, the wastewater is injected into the sedimentation groove through the diversion pipe 14 and the regulating valve 13, the sedimentation grooves with corresponding layers are selected according to the flow of the wastewater, in the embodiment, a nine-layer sedimentation groove structure is used, and as the height difference exists in each layer of sedimentation groove, the flow of each layer is required to be controlled by controlling the opening of the regulating valve 13, so that the flow is evenly distributed;
s4: after the wastewater flows into the sedimentation tank 1, the wastewater enters a slow flow tank 2 in the sedimentation tank 1 from a water inlet 4 of each layer, and after the liquid level of the first slow flow tank rises to the height of an overflow port 6 due to the action of a baffle plate 3, the overflow port overflows and flows into a next stage slow flow tank, in this example, ten stages of slow flow tanks are used, so that the wastewater which is finally subjected to multiple sedimentation is circulated to reach a last stage of slow flow tank;
s5: the wastewater after precipitation flows out through the water outlet 5 of the precipitation tank 1 and flows into the drain pipe 16;
s6: after a period of operation, when the crystal powder in the sedimentation tank 1 is accumulated more, shutdown cleaning is performed. And (3) carrying out drying treatment on the cleaned crystal powder by baking and then carrying out corresponding treatment. The device can be reused after being cleaned up, and the device is circulated in this way.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The wafer processing wastewater raw material recovery device is characterized by comprising a precipitation tank (1), a slow flow tank (2), a partition plate (3), a water inlet (4), a water outlet (5), an overflow port (6), a water collecting tank (7), a diversion tank (8), a diversion port (9), a frame (10), a water pump (11), a liquid level switch (12), an adjusting valve (13), a diversion pipe (14), a water feeding pipe (15), a water discharging pipe (16) and a water feeding port (17);
the water collecting tank (7) is positioned at the bottom of the frame (10), a water pump (11) is arranged in the water collecting tank (7), a liquid level switch (12) is arranged in the water collecting tank (7), and the water pump (11) is connected with the shunt tank (8) through a water feeding pipe (15);
the water distribution groove (8) is arranged at the top of the frame (10), a water distribution opening (9) and a water feeding opening (17) are arranged on the water distribution groove (8), the water feeding opening (17) is connected with the water feeding pipe (15), and the water distribution opening (9) is connected with the water distribution pipe (14);
the shunt tank (8) is connected with the precipitation tank (1) through a shunt tube (14), and the regulating valve (13) is arranged on the shunt tube (14);
the sedimentation tank (1) is arranged in the frame (10), a water inlet (4) and a water outlet (5) are arranged on the sedimentation tank (1), the water outlet (5) of the sedimentation tank (1) is connected with a drain pipe (16), and the water inlet (4) is connected with a shunt pipe (14);
wherein, a baffle plate is arranged in the sedimentation tank, the baffle plate (3) divides the sedimentation tank (1) into two or more slow flow tanks (2), the slow flow tanks are horn-shaped, and the multistage slow flow tanks are connected in series; the head end or the tail end of the partition board (3) is provided with an overflow port (6), the overflow port (6) is positioned above the partition board (3) and is positioned at the high position of the slow flow groove (2), in each slow flow groove, wastewater flows in from the small-caliber position of the slow flow groove, the volume of the water inlet end is small, the wastewater flows out from the large-caliber position, and the volume of the water outlet end is large.
2. The wafer processing wastewater raw material recovery device according to claim 1, wherein the partition plates (3) are detachable, the number of the partition plates can be adjusted, and the number of the slow flow grooves is changed.
3. The wafer processing wastewater raw material recovery device according to claim 1, wherein the water feeding port (17) is arranged above the side surface of the diversion tank (8), the diversion port (9) is arranged below the side surface of the diversion tank (8), the water inlet (4) is arranged below the side surface of the sedimentation tank (1), and the water outlet (5) is arranged above the side surface of the sedimentation tank (1).
4. A wafer processing wastewater raw material recovery device according to claim 1, characterized in that one or more layers of sedimentation tanks (1) are arranged inside the frame (10).
5. A wafer processing wastewater raw material recovery device according to any one of claims 1-4, characterized in that a plurality of sedimentation tanks (1) are arranged in the frame, a plurality of branches are arranged on the shunt tube (14), each branch is connected into each sedimentation tank through a water inlet (4), the sedimentation tanks are in parallel connection, and an adjusting valve (13) is arranged on each branch.
6. The wafer processing wastewater raw material recovery device according to any one of claims 1 to 4, wherein a plurality of sedimentation tanks (1) are arranged in the frame, a plurality of shunt ports (9) are arranged on the shunt tanks (8), each shunt port is connected with a shunt tube (14), each shunt tube is connected to each sedimentation tank through a water inlet (4), the sedimentation tanks are in parallel connection, and an adjusting valve (13) is respectively arranged on each shunt tube.
7. The apparatus according to claim 1, wherein the aspect ratio of the sedimentation tank is 1:1:0.1, and the length dimension is 0.5 m or more.
8. A method for recycling wafer processing wastewater raw materials by using the device as claimed in claim 1, comprising the following steps:
s1: wastewater generated in the operation process of the wafer processing equipment flows into a water collecting tank (7);
s2: when the wastewater level in the water collecting tank rises to the upper limit position of a liquid level switch (12), a water pump (11) is started, and the wastewater is pumped into the diversion tank (8) through a water supply pipe (15);
s3: the diversion tank (8) injects the wastewater into the precipitation tank (1) through the diversion pipe (14) and the regulating valve (13);
s4: after the wastewater flows into the settling tank (1), the wastewater enters a slow flow tank (2) in the settling tank, the wastewater flows in from a small-caliber position of the slow flow tank, the volume of a water inlet end is small, the wastewater flows out from a large-caliber position, the volume of a water outlet end is large, and when the liquid level of a first-stage slow flow tank rises to the height of an overflow port (6), the wastewater flows into a next-stage slow flow tank from the overflow port, and finally reaches a last-stage slow flow tank in a circulating way;
s5: the wastewater after the precipitation is discharged through a water outlet (5) of the precipitation tank (1) and flows into a drain pipe (16);
s6: when more sediment is accumulated in the sedimentation tank, the device can be reused after the interior is cleaned.
9. The method for recycling waste water from wafer processing according to claim 8, wherein in S1, the wafer processing includes all grinding processes of the wafer, and the waste water generated from the processing contains wafer grinding powder.
10. The method for recycling waste water materials from wafer processing according to claim 8, wherein in S6, the sediment height ratio is maintained within 1/2 of the entire sediment tank height, and if the sediment tank is cleaned more than necessary.
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