CN117336990A - Method for adjusting power supply of temperature adjusting device, electronic equipment and computing equipment - Google Patents

Abstract

The application provides a method for adjusting power supply of a temperature regulating device, electronic equipment and computing equipment. The method comprises the following steps: acquiring the current power of the computing device when the power supply supplies power to the computing device; determining a planned power which can be currently distributed to the temperature regulating device according to the current power of the computing equipment and the working state of the target component; wherein the temperature adjusting device is used for adjusting the temperature of the target component; determining the actual power distributed for the temperature regulating device according to the planned power, the target temperature of the target component and the heating value of the target component; and adjusting the power supply of the temperature regulating device according to the actual power. By the method, the temperature of the target component can be adjusted through the temperature adjusting device, so that the target component can operate in a proper temperature range.

Description

Method for adjusting power supply of temperature adjusting device, electronic equipment and computing equipment

Technical Field

The present disclosure relates to the field of computing devices, and in particular, to a method for adjusting power supply of a temperature adjustment device, an electronic device, and a computing device.

Background

With the development of edge computing technology, edge computing devices are becoming more and more widely used. Certain critical components of edge computing devices have certain requirements for operating temperatures. For example, the operating temperature range of an enterprise-level Solid State Disk (SSD) is 0-70 ℃.

However, the application sites of edge computing devices are typically closed environments or outdoors. The temperature in the closed environment or outdoors varies greatly, for example, from-50 ℃ to 50 ℃. Due to application site limitations, edge computing devices cannot dissipate heat by fans, but only natural conduction. Thus, edge computing devices have difficulty guaranteeing their own operating temperature in the case of extreme ambient temperatures.

In the above scenario, how to control the temperature of the critical components in the edge computing device so that the critical components operate in a suitable temperature range is a problem to be solved.

Disclosure of Invention

The embodiment of the application provides a method for adjusting power supply of a temperature adjusting device, electronic equipment and computing equipment, and the temperature adjusting device is used for adjusting the temperature of a target component by adjusting the working voltage of the temperature adjusting device, so that the target component can work in a proper temperature range.

In a first aspect, embodiments of the present application provide a method for adjusting power supplied to a temperature adjustment device, the method including:

acquiring the current power of the computing device when the power supply supplies power to the computing device;

determining a planned power which can be currently distributed to the temperature regulating device according to the current power of the computing equipment and the working state of the target component; wherein the temperature adjusting device is used for adjusting the temperature of the target component;

Determining the actual power distributed for the temperature regulating device according to the planned power, the target temperature of the target component and the heating value of the target component;

and adjusting the power supply of the temperature regulating device according to the actual power.

In the method, the power supply of the temperature regulating device can be regulated according to the current power of the computing equipment, the working state of the target component, the target temperature of the target component and the heating value of the target component. By the method, the target part can work in an environment with a large temperature change range, and the requirement on the temperature specification of the target part is reduced; the power of the temperature regulating device can be dynamically regulated according to the current power in the computing equipment and the working state of the target component; on the basis of ensuring that the total power consumption consumed by the computing equipment is not out of standard, the temperature regulating device can effectively regulate the temperature of the target component so that the temperature of the target component meets the working temperature requirement of the target component.

In one possible implementation, when a power supply supplies power to a computing device, obtaining current power of the computing device includes:

and when the power supply supplies power to the computing equipment, acquiring the current power of the computing equipment every a first preset time length.

In the method, the current power of the computing equipment can be continuously updated, and the dynamic adjustment of the planned power is realized.

In one possible implementation, determining a planned power currently capable of being allocated to the thermostat based on a current power of the computing device and an operating state of the target component includes:

if the target component is in the working state, acquiring the current power of the target component;

the projected power that can currently be allocated to the thermostat is determined as the total power provided by the power source minus the current power of the computing device and the current power of the target component, the remaining power.

In the method, when the target component is in the working state, the working power can be preferentially distributed to the target component and the functional component in the computing equipment, and the residual power can be distributed to the temperature regulating device, so that the power consumed by the temperature regulating device is not excessive, and the condition of insufficient system power is avoided.

In one possible implementation, determining a planned power currently capable of being allocated to the thermostat based on a current power of the computing device and an operating state of the target component includes:

if the target component is in an inactive state, determining that the planned power currently available for allocation to the thermostat is the total power provided by the power source minus the current power of the computing device, the remaining power.

In the method, when the target component is in the non-starting state, most of power provided by the power supply can be distributed to the temperature regulating device, so that the temperature regulating device can quickly regulate the temperature of the program target component.

In one possible embodiment, determining the actual power allocated to the temperature adjustment device according to the planned power, the target temperature of the target component, and the heating value of the target component includes:

acquiring current planned power, current power of the target component and current temperature of the target component every second preset time period;

determining a current expected power of the temperature regulating device according to the target temperature of the target component, the current power of the target component and the current temperature of the target component;

the smaller of the current planned power and the current desired power is determined as the actual power.

In the method, the expected power of the temperature regulating device can be continuously updated, the actual power is determined according to the current planned power and the current expected power, and the dynamic adjustment of the actual power is realized. On the basis of ensuring the working stability of the functional component and the target component in the computing equipment, the temperature regulating device is enabled to regulate the temperature of the target component.

In one possible embodiment, determining the current desired power of the thermostat based on the target temperature of the target component, the current power of the target component, and the current temperature of the target component includes:

acquiring a first corresponding relation, wherein the first corresponding relation comprises: the target temperature, the temperature of the target component and the power of the target component together correspond to the expected power;

and inquiring and obtaining the current expected power in the first corresponding relation according to the current temperature of the target component, the target temperature and the current power of the target component.

In the method, the current expected power can be determined according to the current temperature of the target component, the target temperature and the current power of the target component, so that the dynamic adjustment of the expected power is realized.

In one possible embodiment, determining the actual power allocated to the temperature adjustment device according to the planned power, the target temperature of the target component, and the heating value of the target component includes:

acquiring current planned power, current power of the target component, current temperature of the target component and current environment temperature of the environment where the target component is located every second preset time length;

determining a current expected power of the temperature regulating device according to the target temperature of the target component, the current power of the target component, the current temperature of the target component and the current environment temperature;

The smaller of the current planned power and the current desired power is determined as the actual power.

In the method, the expected power of the temperature regulating device can be continuously updated, the actual power is determined according to the current planned power and the current expected power, and the dynamic adjustment of the actual power is realized. On the basis of ensuring the working stability of the functional component and the target component in the computing equipment, the temperature regulating device is used for regulating the temperature of the program target component.

In one possible embodiment, determining the current desired power of the thermostat based on the target temperature of the target component, the current power of the target component, the current temperature of the target component, and the current ambient temperature, includes:

acquiring a second corresponding relation, wherein the second corresponding relation comprises: the environment temperature, the target temperature, the temperature of the target component and the power of the target component together correspond to the expected power;

and inquiring in the first corresponding relation to obtain the current expected power according to the current temperature of the target component, the target temperature, the current power of the target component and the current environment temperature.

In the method, the current expected power can be determined according to the current environment temperature, the current temperature of the target component, the target temperature and the current power of the target component, so that the dynamic adjustment of the expected power is realized.

In one possible embodiment, the resistance of the temperature regulating device varies with temperature; adjusting the power supply of the temperature regulating device according to the actual power, comprising:

acquiring the current resistance of the temperature regulating device;

determining a planned supply current provided for the temperature regulating device according to the actual power and the current resistance value of the temperature regulating device;

obtaining the maximum allowable power supply current of the voltage stabilizer; wherein, the power supply supplies power to the temperature regulating device through the voltage stabilizer;

determining the smaller value of the maximum allowable power supply current and the planned power supply current as a target current provided for the temperature regulating device;

and determining the working voltage provided for the temperature regulating device according to the target current and the current resistance value of the temperature regulating device.

In the above method, the resistance value of the temperature adjusting device changes with temperature. The working voltage of the temperature regulating device can be determined according to the actual power, the maximum allowable power supply current of the voltage stabilizer and the current resistance value of the temperature regulating device, and the dynamic adjustment of the working voltage of the temperature regulating device is realized.

In a second aspect, embodiments of the present application provide an electronic device comprising a processor, a memory, wherein,

a memory for storing a computer program;

A processor for executing a computer program stored in a memory, such that the processor performs the method of any of the above first aspects.

The processor in the electronic equipment can execute the method for adjusting the power supply of the temperature regulating device, and the dynamic adjustment of the working voltage of the temperature regulating device is realized.

In a third aspect, embodiments of the present application provide a computing device comprising: a power supply, a target component, at least one functional component, a temperature regulating device, a PWM voltage stabilizer and a controller, wherein,

the power supply is used for supplying power to the target component, the at least one functional component and the voltage stabilizer;

the temperature adjusting device is attached to or arranged close to the target part and is used for adjusting the temperature of the target part; one end of the PWM voltage stabilizer is connected with the controller, and the other end of the PWM voltage stabilizer is connected with the temperature regulating device;

the controller is configured to perform the method of any of the above first aspects to adjust the power supply to the thermostat.

In the computing equipment, the controller can adjust the polarity and the size of the working voltage of the temperature adjusting device by adjusting the polarity and the duty ratio of the input signal of the PWM voltage stabilizer, so that the temperature adjusting device can adjust the temperature of the target component.

In one possible implementation, the computing device further includes a housing, wherein,

the power supply, and at least one functional component are disposed within the housing, and the temperature regulating device and the target component are disposed outside the housing.

In the computing device, the target component is arranged outside the shell, and when the temperature change range outside the shell is large, the temperature adjusting device can adjust the temperature of the target component so that the target component can work in a proper temperature range.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive faculty for a person skilled in the art.

FIG. 1 is a schematic diagram of a temperature control system according to an embodiment of the present application;

FIG. 2 is a graph showing the resistance characteristics of TEC at different temperatures and corresponding current values at 10V voltage;

FIG. 3 is a schematic diagram of a temperature control architecture according to an embodiment of the present disclosure;

Fig. 4 is a schematic control flow diagram of a temperature control system according to an embodiment of the present application;

fig. 5 is a schematic flow chart of a method for determining an operating voltage of a temperature adjustment device according to an embodiment of the present application;

fig. 6 is a schematic diagram of a temperature control system for power auto-negotiation of an external hard disk in an edge scenario according to an embodiment of the present application;

fig. 7 is a schematic hardware structure of an electronic device according to an embodiment of the present application;

fig. 8 is a schematic structural diagram of a computing device according to an embodiment of the present application.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present application as detailed in the accompanying claims.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The embodiment of the application relates to a semiconductor refrigeration chip (Thermo Electric Cooler, TEC), and for convenience of understanding, the semiconductor refrigeration chip is described first.

TEC: is a refrigerating device or heating device composed of semiconductor materials. When current flows through the TEC, heat generated by the current can be transferred from one end of the TEC to the other end, so that a cold end and a hot end are formed on the TEC, and cooling or heating of other devices is realized. By controlling the direction of the current flowing on the TEC, the TEC can be controlled to cool or heat other devices. For example, when the current flowing through the TEC is a forward current, the TEC may heat other devices; when the current flowing through the TEC is a reverse current, the TEC may cool other devices. When the current flowing on the TEC increases, the refrigerating capacity or the heating capacity of the TEC for other devices increases; as the current flowing on the TEC decreases, the cooling or heating capacity of the TEC for other devices decreases.

Next, in connection with fig. 1, a temperature control system is exemplarily shown.

Fig. 1 is a schematic diagram of a temperature control system according to an embodiment of the present application. As shown in fig. 1, the temperature control system includes: a controller 101, a heat sink 102, a temperature regulating device 103, critical components 104, and a temperature sensor 105. The critical component 104 is a component that requires cooling or heating. The temperature regulating device 103 may cool or heat the critical component 104. The controller 101 may supply a voltage to the temperature regulating device 103.

In the above temperature control system, the temperature sensor 105 may sense the temperature of the critical component 104 and feed back the current temperature of the critical component 104 to the controller 101. The controller 101 may determine a driving voltage of the temperature adjusting device according to the target temperature of the critical component 104 and the current temperature of the critical component 104, and drive the temperature adjusting device 103 to operate by the determined driving voltage. The temperature regulating device 103 can transfer heat to the key component 104 to heat the key component 104 when in operation; alternatively, the temperature adjusting device 103 may absorb heat of the critical component 104 during operation, and radiate the heat to the air through the radiator 102 to cool the critical component 104.

In the temperature control system, when the temperature adjusting device works, the resistance value of the temperature adjusting device greatly changes along with the temperature. Next, the resistance characteristics of the temperature control device will be described with reference to fig. 2.

In one example, the temperature adjusting device is a TEC, and fig. 2 is a schematic diagram of the resistance characteristics of the TEC at different temperatures and corresponding current values at 10V. As shown in fig. 2, the abscissa indicates temperature, the ordinate on the left side indicates resistance value, and the ordinate on the right side indicates current value. In the illustrated temperature range (-50 ℃ to 120 ℃), the maximum resistance value and the minimum resistance value of the temperature regulating device differ by more than 2 times with the gradual increase of the temperature under the same power supply voltage. At a fixed supply voltage, the value of the current flowing through the thermostat will also change as the resistance of the thermostat changes. For example, in fig. 2, at a voltage of 10V, the maximum current value flowing through the temperature adjustment device is 2 times the minimum current value as the resistance value of the temperature adjustment device changes.

It should be noted that the temperature adjusting device in the present application may be any device that can heat or cool other components. For example, the temperature regulating device may be a TEC. The specific structure of the temperature adjusting device is not limited in the present application.

In the related art, after the current temperature of the key component is obtained, the controller may set a voltage with a fixed magnitude according to the target temperature of the key component and the current temperature of the key component, and drive the temperature adjusting device to work through the set voltage, so as to heat or cool the key component. The temperature of the thermostat itself may also change during the temperature regulation of the critical components. Therefore, the resistance value of the temperature adjusting device may change during the temperature adjustment of the critical component. For example, when the temperature of the temperature adjustment device decreases, the resistance value of the temperature adjustment device also decreases. The driving voltage of the temperature adjusting device is a fixed voltage, so that the current value flowing through the temperature adjusting device can be increased along with the decrease of the resistance value of the temperature adjusting device, and the power of the temperature adjusting device can be greatly increased.

In a power limited scenario, if the driving voltage of the temperature adjustment device is not controlled, the power of the temperature adjustment device is too high, which results in insufficient system power. For example, for a certain rated 50W device, a temperature regulating device is used for regulating the temperature of key components. At-50 ℃, the resistance value of the temperature regulating device is extremely low, and if the driving voltage of the temperature regulating device is not regulated, the system power is insufficient and faults occur because the power of the temperature regulating device is too high. In order to solve this problem, in the related art, a small driving voltage is configured to the temperature adjustment device to avoid an excessive operating power of the temperature adjustment device. However, when the driving voltage of the temperature adjusting device is small, the temperature adjusting device cannot quickly adjust the temperature of the critical component. Therefore, the above-described temperature adjustment method cannot adjust the temperature of the power-limited device. In order to solve the above technical problems, the embodiments of the present application provide a method for adjusting power supply of a temperature adjustment device, which can dynamically adjust power of the temperature adjustment device and dynamically adjust a driving voltage of the temperature adjustment device. By the method, in a power-limited scene, the temperature of the key components in the equipment can be regulated by using the temperature regulating device so that the key components can operate in a proper temperature range.

Next, a temperature control architecture according to an embodiment of the present application will be described with reference to fig. 3.

Fig. 3 is a schematic diagram of a temperature control architecture according to an embodiment of the present application. As shown in fig. 3, the temperature control architecture includes: the device comprises a power supply unit, a micro control unit (Microcontroller Unit, MCU), a voltage stabilizer, a radiator, a temperature adjusting device, key components, other functional modules, a first temperature sensor and a second temperature sensor.

In the above architecture, the power supply module may supply voltage to the MCU, the voltage regulator, the key components, the temperature adjusting device, and other functional modules. The MCU can monitor the power provided by the power supply unit, the power consumed by the key components and other functional modules, the temperature of the key components and the temperature of the temperature regulating device, and determine the working voltage of the temperature regulating device according to the monitoring data. The MCU can also control the polarity and duty cycle loaded at the input end IN+/IN-of the voltage stabilizer according to the working voltage of the temperature regulating device. The polarity and duty cycle of the voltage regulator input IN+/IN-determines the polarity and magnitude of the voltage at the voltage regulator output. The voltage stabilizer can adjust the polarity and the magnitude of the working voltage of the temperature adjusting device according to the control of the MCU. The thermostat may cool or heat critical components.

The first temperature sensor may be attached to or positioned near the temperature regulating device to reflect the current temperature of the temperature regulating device. In the actual use process, if the temperature sensor cannot be attached to the temperature adjusting device, the temperature of the temperature adjusting device can be calculated through the temperature of the key component. Illustratively, the second temperature sensor may be positioned in close proximity to the critical component, or the second temperature sensor may be positioned about the critical component. Depending on the availability of the measurement, the second temperature sensor may reflect the temperature of the critical component or the ambient temperature around the critical component.

The MCU can control the temperature regulating device to refrigerate or heat the key components by regulating the polarity of the output voltage of the voltage stabilizer. For example, when the polarity of the voltage regulator output voltage is positive, the thermostat heats the critical component; when the polarity of the output voltage of the voltage stabilizer is negative, the temperature regulating device refrigerates the key components. It should be noted that the polarity of the voltage required for the operation of the temperature adjustment device is related to the specific structure and installation manner of the temperature adjustment device, and this is only an example, and the solution of the present application is not limited in any way.

The MCU can also control the voltage output by the voltage stabilizer by controlling the duty cycle of the input end IN+/IN < - > of the voltage stabilizer. The magnitude of the voltage stabilizer output voltage can control the heating capacity or the refrigerating capacity of the temperature regulating device, that is, the MCU can control the heating power or the refrigerating power of the temperature regulating device through the magnitude of the voltage stabilizer output voltage. For example, when the output voltage of the voltage stabilizer increases, the heating power or the cooling power of the temperature adjusting device to the key component increases; when the output voltage of the voltage stabilizer is reduced, the heating power or the refrigerating power of the temperature regulating device to the key components is reduced.

The voltage stabilizer can adjust the working voltage and the polarity of the temperature regulating device according to the control of the MCU. For example, the voltage regulator may be a pulse width modulated (Pulse Width Modulation, PWM) voltage regulator. The specific structure of the voltage stabilizer is not limited in this application.

The key components may be solid state Disk (Solid State Drives, SSD), hard Disk Drive (HDD), etc. Taking the external hard disk as an example, the target working temperature of the external hard disk is generally 0 ℃ to 70 ℃. The external hard disk is usually arranged in an outdoor environment, and the temperature of the outdoor environment can be widely changed, for example, from-50 ℃ to 50 ℃. In the practical application process, voltage can be supplied to the MCU, the voltage stabilizer, the temperature regulating device, the external hard disk and other functional components through the power supply unit. One end of the voltage stabilizer can be connected with the MCU, and the other end of the voltage stabilizer can be connected with the external hard disk. The MCU can periodically acquire the power consumed by the external hard disk and other functional modules, the temperature of the external hard disk and the temperature of the temperature regulating device, and update the working voltage of the temperature regulating device according to the data. The MCU can also control the voltage stabilizer to supply updated working voltage to the external hard disk. By the above method, the temperature of the external hard disk cartridge can be adjusted so as to operate in a suitable temperature range.

The technical scheme of the present application is described in detail below with specific examples. The following embodiments may be combined with each other, and some embodiments may not be repeated for the same or similar concepts or processes.

Fig. 4 is a schematic control flow chart of a temperature control system according to an embodiment of the present application. Referring to fig. 4, the process may include:

s401, when a power supply supplies power to the computing device, acquiring the current power of the computing device.

The execution subject of the application may be a computing device, or may be an MCU or other controller provided in the computing device.

The current power of the computing device is the power that is currently consumed by all of the functional components of the computing device.

Functional components may be components in a system that perform a particular function. For example, a hard disk implementing a server storage function, a network card implementing a server network communication function, and the like. It should be understood that the number of functional components operating within the computing device may be one or more, and embodiments of the present application do not limit the number of functional components operating within the computing device.

The current power of a computing device may be obtained in at least two ways:

Mode 1, the MCU reads the current power of the computing device from the power measurement device.

The power measuring equipment is arranged outside the functional components working in the computing equipment, and the MCU can read the power of the corresponding functional components from the power measuring equipment. The sum of the power consumed by all the functional components operating within the computing device is the current power of the computing device.

Mode 2, the MCU obtains the current power of the computing device from each functional unit.

Each functional unit can actively report own power to the MCU. The sum of the powers reported to the MCU by all functional components working in the computing device is the current power of the computing device.

It should be appreciated that the current power of the computing device may vary over time. In the embodiment of the application, the current power of the computing device can be obtained after the computing device is started and the MCU is initialized, or can be obtained in the running process of the computing device at intervals of a first preset time length, so that the power supply of the temperature adjusting device can be adjusted in time.

It should be noted that the first preset duration may be an equal interval duration, or the first preset duration may also be a non-equal interval duration. In the actual implementation process, the first preset time length can be set according to actual needs. For example, when the current power change frequency of the computing device is low, a larger first preset time period may be set; the smaller first preset duration may be set when the current power change frequency of the computing device is higher.

The planned power, the actual power, and the power supplied by the thermostat in S402-S404 all vary with the current power of the computing device. After each time the current power of the computing device is obtained, S402-S404 may determine the planned power, the actual power, and the power supply of the temperature adjustment device according to the latest current power of the computing device, so as to implement dynamic adjustment of the planned power, the actual power, and the operating voltage of the temperature adjustment device. According to the method, the working power distributed to the temperature regulating device can be adjusted according to the change of the working power of the functional component in the computing equipment, so that the situations of insufficient power of the computing equipment caused by overlarge power consumption of the temperature regulating device are avoided.

S402, determining the planned power which can be allocated to the temperature regulating device currently according to the current power of the computing equipment and the working state of the target component.

The target component is a functional component in the computing device that has certain requirements for operating temperature. For example, the target component may be a hard disk in a server, the hard disk operating at a temperature in the range of 0 ℃ to 70 ℃.

The functional components in S401 are all the functional components in the computing device except for the target component, i.e., the functional components in S401 do not include the target component.

The operational state of the target component is used to indicate whether the target component is in an operational state. The operational state of the target component may include: the target component is in an inactive state and the target component is in an active state.

The temperature adjusting device is used for heating or cooling the target component so as to adjust the temperature of the target component. The temperature regulating device may heat the target component when the temperature of the target component is below a suitable operating temperature for the target component; the thermostat may cool the target component when the temperature of the target component is above a suitable operating temperature for the target component. For example, the temperature regulating device may be a TEC.

The projected power is the maximum power that the power supply can provide to the thermostat. When the operating states of the target components are different, the manner of determining the planned power is also different. For two operating states of the target component, the determination of the planned power is at least two cases:

and 1, the target part is in an operating state.

If the target component is in the working state, acquiring the current power of the target component; the projected power that can currently be allocated to the thermostat is determined as the total power provided by the power source minus the current power of the computing device and the current power of the target component, the remaining power.

By way of example, assuming the target component is in operation, the total power provided by the power supply is 60W, the current power of the computing device is 20W, the current power of the target component is 10W, and the projected power is 30W.

Case 2, target component is in an inactive state.

If the target component is in an inactive state, determining that the planned power currently available for allocation to the thermostat is the total power provided by the power source minus the current power of the computing device, the remaining power.

By way of example, assuming the target component is in an inactive state, the total power provided by the power supply is 60W, the current power of the computing device is 20W, and the projected power is 40W.

It should be noted that, before determining the planned power, it may be determined whether the target component satisfies the start condition. Specifically, before determining the planned power, the current temperature of the target component may be acquired, and when the current temperature of the target component falls within the start temperature range of the target component, the target component may satisfy a start condition, at which time the target component may be started; when the current temperature of the target component does not fall within the start-up temperature range of the target component, the target component does not satisfy the start-up condition, at which time the target component may not be started up.

By way of example, assuming that the temperature of the target component is 10 ℃, and the start-up temperature of the target component is 5 ℃ to 15 ℃, the target component satisfies the start-up condition.

Assuming that the temperature of the target member is 10 ℃ and the start-up temperature of the target member is 15 ℃ to 20 ℃, the target member does not satisfy the start-up condition.

S403, determining the actual power distributed for the temperature regulating device according to the planned power, the target temperature of the target component and the heating value of the target component.

The target temperature of the target component is the operating temperature at which the target component is suitable. The target temperature of the target component may be a specific temperature value, or the target temperature of the target component may be a temperature range. For example, the target temperature of the enterprise-level SSD may be from 0 ℃ to 70 ℃, or alternatively, the target temperature of the enterprise-level SSD may be any one of the temperature values from 0 ℃ to 70 ℃. It should be appreciated that the target temperature of the target component is a known temperature value or temperature range. Alternatively, the target temperature of the target component may be stored in the MCU or in a memory.

The heating value of the target component may be determined based on the power of the target component. When the power of the target component increases, the heat generation amount of the target component increases; when the power of the target component decreases, the heat generation amount of the target component decreases. When the power of the target component is changed, the change value of the heat generation amount of the target component is related to the specific form of the target component, and the embodiment of the present application is not limited thereto. The corresponding relation between the power and the heating value of the target component can be determined by a table look-up or function fitting mode.

The power obtaining manner of the target component is consistent with the power obtaining manner of the functional component operating in the computing device, and reference may be made to S401 specifically, which is not described herein.

The actual power is the power that the power supply actually supplies to the thermostat.

When the difference between the ambient temperature of the environment where the target component is located and the temperature of the target component is smaller, and the actual power is determined, the ambient temperature of the environment where the target component is located can be not considered; however, when the difference between the ambient temperature of the environment where the target component is located and the temperature of the target component is large, the ambient temperature of the environment where the target component is located needs to be considered when determining the actual power. For the two cases, the determination of the actual power is as follows:

mode 1 does not consider the ambient temperature of the environment in which the target component is located.

Acquiring current planned power, current power of the target component and current temperature of the target component every second preset time period; determining a current expected power of the temperature regulating device according to the target temperature of the target component, the current power of the target component and the current temperature of the target component; the smaller of the current planned power and the current desired power is determined as the actual power.

It should be noted that the second preset duration may be an equal interval duration, or the second preset duration may also be a non-equal interval duration. The second preset time period may be equal to the first preset time period, or the second preset time period may be unequal to the first preset time period.

The MCU can directly measure the current temperature of the target component through a temperature sensor or directly/after compensation serve as the current temperature of the target component through measuring the current environmental temperature of the environment where the target component is located.

The desired power is the power required by the thermostat to cool or heat the target component at the present time.

When determining the desired power, a first correspondence may be obtained, where the first correspondence includes: the target temperature, the temperature of the target component and the power of the target component together correspond to the expected power; and inquiring and obtaining the current expected power in the first corresponding relation according to the current temperature of the target component, the target temperature and the current power of the target component. For example, the first correspondence may be a correspondence chart of the target temperature, the temperature of the target component, the power of the target component, and the desired power.

The first correspondence may be as shown in table 1:

TABLE 1

Target temperature	Temperature of target part	Power of target component	Desired power
				A 1	B 1	C 1	X 1
A 1	B 2	C 2	X 2
				……	……	……	……
A 2	B 3	C 3	X 3
				A 2	B 4	C 4	X 4
……	……	……	……

Assume that the target temperature is A ₁ The temperature of the target part is B ₂ The power of the target part is C ₂ The expected power is X ₂ . Wherein A is ₁ 、B ₂ 、C ₂ May be a specific numerical value or a numerical range.

The desired power may be greater than the planned power or the desired power may be less than the planned power. For the different magnitude relation between the expected power and the planned power, the actual power is determined by the following two conditions:

case 1: when the desired power is less than the planned power, i.e. the power required by the thermostat is less than the power that the power supply can supply to the thermostat, then the actual power is determined to be the desired power.

Under the condition, the power provided by the power supply to the temperature regulating device can meet the working requirement of the temperature regulating device, and the temperature regulating device can rapidly regulate the temperature of the program mark component.

Case 2: when the planned power is smaller than the desired power, i.e. the power that the power supply can supply to the temperature adjustment device is smaller than the power required by the temperature adjustment device, the actual power is determined to be the planned power.

Under the condition, the function component and the target component in the computing equipment can be ensured to work normally, and power can be supplied to the temperature regulating device, so that the temperature of the target component is regulated by the temperature regulating device.

Mode 2, consider the ambient temperature of the environment in which the target component is located.

Acquiring current planned power, current power of the target component, current temperature of the target component and current environment temperature of the environment where the target component is located every second preset time length; determining a current expected power of the temperature regulating device according to the target temperature of the target component, the current power of the target component, the current temperature of the target component and the current environment temperature; the smaller of the current planned power and the current desired power is determined as the actual power.

When determining the expected power, a second corresponding relation may be obtained, where the second corresponding relation includes: the environment temperature, the target temperature, the temperature of the target component and the power of the target component together correspond to the expected power; and inquiring in the first corresponding relation to obtain the current expected power according to the current temperature of the target component, the target temperature, the current power of the target component and the current environment temperature. For example, the second correspondence may be a correspondence chart of an ambient temperature, a target temperature, a temperature of the target component, a power of the target component, and a desired power.

The method for querying the expected power in the second corresponding relationship is similar to the method for querying the expected power in the first corresponding relationship, and will not be described herein. After determining the desired power, the specific determination manner of the actual power in the mode 2 is the same as that in the mode 1, and will not be described herein.

S404, adjusting the power supply of the temperature regulating device according to the actual power.

According to the method for adjusting the power supply of the temperature adjusting device, provided by the embodiment, the planned power which can be distributed to the temperature adjusting device by the power supply can be dynamically updated according to the current power of the computing equipment and the working state of the target component; and dynamically updating the actual power actually provided by the power supply to the temperature regulating device according to the planned power, the target temperature of the target component and the heating value of the target component. By the method, the working power distributed to the temperature regulating device can be timely adjusted according to the power changes of the functional component and the target component in the computing equipment, so that the temperature of the target component can be effectively regulated by the temperature regulating device on the basis that the functional component and the target component in the computing equipment can normally operate, and the condition of insufficient power of the computing equipment is avoided.

Since the resistance of the temperature adjusting device changes with the temperature, the temperature of the temperature adjusting device itself also changes during the temperature adjustment of the target component by the temperature adjusting device. Therefore, after the actual power is distributed to the temperature adjusting device according to the embodiment of fig. 4, the resistance value of the temperature adjusting device is continuously changed during the operation, and the operating voltage required by the temperature adjusting device is also changed. Next, a method for determining the operating voltage of the temperature adjusting device will be described in detail with reference to fig. 5.

Fig. 5 is a flow chart of a method for determining an operating voltage of a temperature adjusting device according to an embodiment of the present application. Referring to fig. 5, the method may include:

s501, acquiring the current resistance value of the temperature regulating device.

The resistance of the temperature regulating device changes along with the temperature, and the current resistance of the temperature regulating device is the resistance corresponding to the current temperature of the temperature regulating device.

For example, when the temperature adjusting device is a TEC, as the temperature of the temperature adjusting device increases gradually, the resistance of the temperature adjusting device increases gradually. The amplitude of the change of the resistance value of the temperature adjusting device along with the temperature of the temperature adjusting device can be seen in fig. 2, and the details are not repeated here.

The current resistance value of the temperature adjusting device can be obtained by the following method: acquiring the current temperature of the temperature regulating device; inquiring the resistance corresponding to the temperature according to the current temperature.

The current temperature of the thermostat may be obtained in at least two ways:

mode 1, can laminate on temperature regulation apparatus and set up temperature sensor, MCU can obtain temperature regulation apparatus's current temperature through this temperature sensor.

In the mode 2, if the temperature sensor cannot be provided in the temperature control device, the current temperature of the temperature control device can be estimated from the temperature of the target member.

S502, determining a planned supply current provided for the temperature regulating device according to the actual power and the current resistance value of the temperature regulating device.

The supply current is intended to be the maximum current that can flow in the thermostat. The planned supply current may be calculated by the following formula:

s503, obtaining the maximum allowable supply current of the voltage stabilizer.

The voltage stabilizer can adjust the working voltage and the polarity of the temperature regulating device according to the control of the MCU.

The maximum allowable supply current of the voltage regulator is the maximum safe current that can flow in the voltage regulator. It should be appreciated that when the current flowing in the voltage regulator is greater than the maximum allowable supply current for the voltage regulator, the voltage regulator may be damaged. The voltage regulator may be a PWM voltage regulator.

S504, determining the smaller value of the maximum allowable power supply current and the planned power supply current as the target current provided by the temperature regulating device.

The target current is the current flowing through the temperature regulating device when the temperature regulating device refrigerates or heats the target component.

The planned supply current may be greater than the maximum allowed supply current of the voltage regulator, or the planned supply current may be less than the maximum allowed supply current of the voltage regulator. For the different magnitude relation between the planned supply current and the maximum allowable supply current of the voltage stabilizer, the determination of the target current has the following two conditions:

Case 1: and when the maximum allowable supply current of the voltage stabilizer is smaller than the planned supply current, determining that the target current is the maximum allowable supply current of the voltage stabilizer.

In this case, the current flowing through the inside of the voltage stabilizer does not exceed the maximum allowable supply current of the voltage stabilizer, and the voltage stabilizer is not damaged during operation.

Case 2: and when the planned supply current is smaller than the maximum allowable supply current of the voltage stabilizer, determining the target current as the planned supply current.

In this case, the planned current can better meet the working requirement of the temperature regulating device, so that the temperature regulating device can quickly regulate the temperature of the program marker component.

S505, according to the target current and the current resistance value of the temperature regulating device, determining the working voltage provided for the temperature regulating device. After the target current is determined, the magnitude of the operating voltage can be calculated by the following formula:

operating voltage=target current×resistance value of temperature regulating device

It should be appreciated that when the temperature of the target component is less than the target temperature, the thermostat needs to heat the target component; when the temperature of the target component is greater than the target temperature, the thermostat needs to cool the target component.

The MCU can determine the temperature adjusting direction of the target component according to the temperature of the current target component and the target temperature, and determine the polarity of the working voltage according to the temperature adjusting direction; the temperature adjustment direction may be heating or cooling.

The polarity of the operating voltage required when the temperature adjustment device heats or cools the target member depends on the specific structure and mounting manner of the temperature adjustment device. For example, when the temperature adjusting device cools the target component, the polarity of the operating voltage is negative, and when the temperature adjusting device heats the target component, the polarity of the operating voltage is positive; alternatively, the polarity of the operating voltage is positive when the temperature adjusting device cools the target member, and negative when the temperature adjusting device heats the target member. The present application is not limited in this regard.

According to the working voltage determining method of the temperature adjusting device, the working voltage of the temperature adjusting device can be determined according to the actual power and the change of the resistance value of the temperature adjusting device, and the polarity of the working voltage is determined according to the temperature of the current target component and the target temperature. By the method, on the basis of ensuring that the target component works normally and the temperature of the target component is effectively regulated by the temperature regulating device, the power consumed by the temperature regulating device is not excessive, and the condition of insufficient system power is avoided.

The technical solution shown in the embodiments of fig. 4 to 5 will be described in detail below by way of specific examples with reference to fig. 6.

Fig. 6 is a schematic diagram of a temperature control system for power auto-negotiation of an external hard disk in an edge scenario according to an embodiment of the present application. As shown in fig. 6, the temperature control system includes: edge server and external hard disk box. The edge server comprises an MCU and a voltage stabilizer. The external hard disk box comprises a hard disk, a temperature adjusting device and a radiator.

In the system, the MCU can collect the temperature of the hard disk after receiving the starting request of the hard disk and judge whether the temperature of the hard disk is in a preset starting temperature range of the hard disk. If the temperature of the hard disk falls within the preset hard disk starting temperature range, the MCU controls the hard disk to be started. If the temperature of the hard disk does not fall within the preset starting temperature range of the hard disk, the MCU controls the hard disk to be not started, and most of power provided by the power supply is distributed to the temperature regulating device, so that the temperature regulating device can quickly regulate the temperature of the hard disk.

When the hard disk is not started, the temperature regulating device can collect the temperature of the hard disk at regular time after starting working, and judge whether the hard disk falls in a preset hard disk starting temperature range. If the temperature of the hard disk falls within the preset hard disk starting temperature range, the MCU controls the hard disk to be started.

After the hard disk is started, the MCU can execute the temperature control method of the power auto-negotiation provided by the embodiment of fig. 5 at regular time, and dynamically adjust the magnitude and polarity of the working voltage of the TEC.

According to the temperature control system for the power auto-negotiation of the external hard disk box in the edge scene, the temperature of the hard disk is regulated by the temperature regulating device, and the hard disk can work in the edge scene with a large temperature change range (for example, -50 ℃ to 50 ℃) and limited power by the method. In the process of adjusting the temperature of the hard disk by the temperature adjusting device, the actual power and the working voltage of the hard disk can be dynamically adjusted, the working temperature of the hard disk is ensured to meet the temperature requirement, the working power of the hard disk is ensured to meet the operation requirement, and the condition of insufficient power in a power limited scene is avoided.

Fig. 7 is a schematic hardware structure of an electronic device according to an embodiment of the present application. Referring to fig. 7, the electronic device 700 may include: a processor 701 and a memory 702, wherein the processor 701 and the memory 702 may communicate; illustratively, the processor 701 and the memory 702 are in communication via a communication bus 703, the memory 702 is configured to store program instructions, and the processor 701 is configured to invoke the program instructions in the memory to perform the method for adjusting the power supply of the thermostat as shown in any of the method embodiments described above.

Optionally, the electronic device 700 may also include a communication interface, which may include a transmitter and/or a receiver.

Alternatively, the processor may be a central processing unit (Central Processing Unit, CPU), but may also be other general purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific integrated circuits (Application Specific Integrated Circuit, ASIC), etc. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. The steps of a method disclosed in connection with the present application may be embodied directly in a hardware processor or in a combination of hardware and software modules within a processor.

Fig. 8 is a schematic structural diagram of a computing device according to an embodiment of the present application. Referring to fig. 8, the computing device 800 includes: a power source 801, a target component 802, at least one functional component 803, a thermostat 804, a PWM regulator 805, and a controller 806, wherein,

the power source 801 is used to supply power to the target component 802, the at least one functional component 803, and the PWM regulator 805;

the temperature adjusting device 804 is attached to or close to the target component 802, and the temperature adjusting device 804 is used for adjusting the temperature of the target component 802; one end of the PWM voltage stabilizer 805 is connected with the controller, and the other end of the PWM voltage stabilizer 805 is connected with the temperature regulating device 804;

The controller 806 is configured to perform the method of adjusting power to the thermostat shown in any of the method embodiments described above to adjust power to the thermostat.

In one possible embodiment, computing device 800 further includes a housing, wherein,

the power source 801, and at least one functional component 803 are disposed within the housing, and the temperature adjustment device 804 and the target component 802 are disposed outside the housing.

The configuration illustrated in the embodiment of the present application does not constitute a specific limitation of the electronic device 800. In other embodiments of the present application, electronic device 800 may include more or less components than illustrated, or certain components may be combined, or certain components may be split, or different arrangements of components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware. For example, the power source 801 in fig. 8 may be the power supply unit in fig. 3, the target component 802 may be the key component in fig. 3, the at least one functional component 803 may be the other functional module in fig. 3, the PWM voltage regulator 805 may be the voltage regulator in fig. 3, and the controller 806 may be the micro control unit in fig. 3.

The computing device provided in the embodiment of the present application may execute the scheme shown in the embodiment of the method, and its implementation principle and beneficial effects are similar, and will not be described herein again.

All or part of the steps for implementing the method embodiments described above may be performed by hardware associated with program instructions. The foregoing program may be stored in a readable memory. The program, when executed, performs steps including the method embodiments described above; and the aforementioned memory (storage medium) includes: read-only memory (ROM), RAM, flash memory, hard disk, solid state disk, magnetic tape, floppy disk, optical disk, and any combination thereof.

Embodiments of the present application are described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processing unit of a general purpose computer, special purpose computer, embedded processor, or other programmable terminal device to produce a machine, such that the instructions, which execute via the processing unit of the computer or other programmable terminal device, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.

These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable terminal device to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.

These computer program instructions may also be loaded onto a computer or other programmable terminal device to cause a series of operational steps to be performed on the computer or other programmable device to produce a computer implemented process such that the instructions which execute on the computer or other programmable device provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.

It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the embodiments of the present application fall within the scope of the claims and the equivalents thereof, the present application is intended to encompass such modifications and variations.

In the present application, the term "include" and variations thereof may refer to non-limiting inclusion; the term "or" and variations thereof may refer to "and/or". The terms "first," "second," and the like in this application are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. In the present application, "plurality" means two or more. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship.

Claims (12)

1. A method of regulating power to a thermostat, the method comprising:

acquiring the current power of the computing equipment when a power supply supplies power to the computing equipment;

determining a planned power which can be currently distributed to the temperature regulating device according to the current power of the computing equipment and the working state of a target component; wherein the temperature adjusting device is used for adjusting the temperature of the target component;

determining the actual power distributed to the temperature regulating device according to the planned power, the target temperature of the target component and the heating value of the target component;

And adjusting the power supply of the temperature regulating device according to the actual power.

2. The method of claim 1, wherein the powering the computing device at the power source, the obtaining the current power of the computing device, comprises:

and when the power supply supplies power to the computing equipment, acquiring the current power of the computing equipment every a first preset time length.

3. The method of claim 1 or 2, wherein determining a planned power currently available for allocation to the thermostat based on a current power of the computing device and an operating state of a target component comprises:

if the target component is in a working state, acquiring the current power of the target component;

the projected power that can be currently allocated to the thermostat is determined to be the power remaining after the total power provided by the power source minus the current power of the computing device and the current power of the target component.

4. A method according to any one of claims 1 to 3, wherein said determining a planned power currently allocable to the temperature regulating device based on a current power of the computing device and an operating state of a target component comprises:

If the target component is in an inactive state, determining that the planned power currently available for allocation to the thermostat is the total power provided by the power source minus the current power of the computing device, the remaining power.

5. The method according to any one of claims 1 to 4, wherein the determining the actual power allocated to the temperature adjustment device based on the planned power, the target temperature of the target component, and the heat generation amount of the target component includes:

acquiring the current planned power, the current power of the target component and the current temperature of the target component every a second preset time period;

determining a current desired power of the temperature regulating device according to a target temperature of the target component, a current power of the target component and the current temperature of the target component;

and determining the smaller value of the current planned power and the current expected power as the actual power.

6. The method of claim 5, wherein determining the current desired power of the thermostat based on the target temperature of the target component, the current power of the target component, and the current temperature of the target component comprises:

Acquiring a first corresponding relation, wherein the first corresponding relation comprises: the target temperature, the temperature of the target component, and the power of the target component collectively correspond to the desired power;

and inquiring the first corresponding relation to obtain the current expected power according to the current temperature of the target component, the target temperature and the current power of the target component.

7. The method according to any one of claims 1 to 4, wherein the determining the actual power allocated to the temperature adjustment device based on the planned power, the target temperature of the target component, and the heat generation amount of the target component includes:

acquiring the current planned power, the current power of the target component, the current temperature of the target component and the current environment temperature of the environment where the target component is located every second preset time period;

determining a current desired power of the thermostat based on a target temperature of the target component, a current power of the target component, a current temperature of the target component, and the current ambient temperature;

and determining the smaller value of the current planned power and the current expected power as the actual power.

8. The method of claim 7, wherein determining the current desired power of the thermostat based on the target temperature of the target component, the current power of the target component, the current temperature of the target component, and the current ambient temperature comprises:

obtaining a second corresponding relation, wherein the second corresponding relation comprises: the desired power corresponding to the ambient temperature, the target temperature, the temperature of the target component, and the power of the target component in common;

and inquiring the first corresponding relation to obtain the current expected power according to the current temperature of the target component, the target temperature, the current power of the target component and the current environment temperature.

9. The method according to any one of claims 1 to 8, wherein the resistance of the temperature regulating device varies with temperature;

the adjusting the power supply of the temperature adjusting device according to the actual power comprises the following steps:

acquiring the current resistance of the temperature regulating device;

determining a planned supply current provided for the temperature regulating device according to the actual power and the current resistance value of the temperature regulating device;

Obtaining the maximum allowable power supply current of the voltage stabilizer; wherein the power supply supplies power to the temperature regulating device through the voltage stabilizer;

determining the smaller of the maximum allowable supply current and the planned supply current as a target current provided for the thermostat;

and determining the working voltage provided for the temperature regulating device according to the target current and the current resistance value of the temperature regulating device.

10. An electronic device, comprising a processor, a memory, wherein,

the memory is used for storing a computer program;

the processor being configured to execute a computer program stored in the memory, such that the processor performs the method of any of the preceding claims 1-9.

11. A computing device, comprising: a power supply, a target component, at least one functional component, a temperature regulating device, a PWM voltage regulator, and a controller, wherein the power supply is configured to supply power to the target component, the at least one functional component, and the PWM voltage regulator;

the temperature adjusting device is attached to or arranged close to the target part, and is used for adjusting the temperature of the target part; one end of the PWM voltage stabilizer is connected with the controller, and the other end of the PWM voltage stabilizer is connected with the temperature regulating device;

The controller is configured to perform the method of any of claims 1-9 to regulate the power supply to the thermostat.

12. The computing device of claim 11, further comprising a housing, wherein,

the power supply, and the at least one functional component are disposed within the housing, and the temperature adjustment device and the target component are disposed outside the housing.