CN117319589A - Method for determining a stored lifetime value of an EMMC chip in a camera - Google Patents
Method for determining a stored lifetime value of an EMMC chip in a camera Download PDFInfo
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/76—Television signal recording
- H04N5/907—Television signal recording using static stores, e.g. storage tubes or semiconductor memories
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- H—ELECTRICITY
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- H04N1/21—Intermediate information storage
- H04N1/2104—Intermediate information storage for one or a few pictures
- H04N1/2112—Intermediate information storage for one or a few pictures using still video cameras
- H04N1/2116—Picture signal recording combined with imagewise recording, e.g. photographic recording
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The application provides a method for determining a stored lifetime value of an EMMC chip in a camera, the camera comprising an SOC chip comprising a lifetime value calculation module and an SDIO module, the SDIO module being in communication with the EMMC chip, the method comprising: the service life value calculation module receives a notification message sent by the SDIO module, wherein the notification message comprises a first data writing amount aiming at the EMMC chip in the current statistical period; the service life value calculating module updates the total data writing amount of the EMMC chip based on the first data writing amount; and the life value calculation module determines a target second precision life value of the EMMC chip based on the data writing total amount, a second data writing amount corresponding to the target first precision life value, a third data writing amount corresponding to the candidate first precision life value and the target first precision life value, wherein the second precision is superior to the first precision. Through the technical scheme of the application, the data loss in the EMMC chip can be avoided, and the user loss is reduced.
Description
Technical Field
The present application relates to the field of storage technologies, and in particular, to a method for determining a storage lifetime value of an EMMC chip in a camera.
Background
For front-end devices (such as cameras, etc.), EMMC (Embedded Multi Media Card ) chips are typically used as a local storage medium, while NAND FLASH is used inside the EMMC chip, so that the number of erases of the EMMC chip is limited, resulting in a limited lifetime value of the EMMC chip.
For example, taking a video file with a code rate of 8Mbps as an example, if the actual capacity of the EMMC chip is 8g and the number of times of erasing of the EMMC chip is 3000, when the video file is stored by the EMMC chip, the EMMC chip is erased 10 times every 24 hours, so that the EMMC chip can only be used for 61 days, that is, after 61 days, the probability of error is high when writing data into the EMMC chip, and the accuracy of the data cannot be guaranteed. When the working time of the EMMC chip reaches the service life value, the front-end equipment cannot normally operate, so that data in the EMMC chip is lost, and a large loss is caused for a user.
Disclosure of Invention
The application provides a method for determining a stored lifetime value of an EMMC chip in a camera, characterized in that the camera comprises an SOC chip comprising a lifetime value calculation module and an SDIO module, the SDIO module being in communication with the EMMC chip, the method comprising:
The service life value calculation module receives a notification message sent by the SDIO module, wherein the notification message comprises a first data writing amount aiming at the EMMC chip in a current statistical period;
the life value calculating module updates the total data writing amount of the EMMC chip based on the first data writing amount;
the life value calculation module determines a target second precision life value of the EMMC chip based on the total data writing amount, a second data writing amount corresponding to the target first precision life value, a third data writing amount corresponding to the candidate first precision life value and the target first precision life value;
wherein the second precision is better than the first precision; the target first precision life value is a first precision life value updated by the EMMC chip for the last time, and the candidate first precision life value is a first precision life value updated by the EMMC chip for the penultimate time; the second data writing amount is the total data writing amount of the EMMC chip when the target first precision lifetime value is updated, and the third data writing amount is the total data writing amount of the EMMC chip when the candidate first precision lifetime value is updated.
As can be seen from the above technical solution, in the embodiment of the present application, for a camera using an EMMC chip as a local storage medium, the target second precision lifetime value of the EMMC chip may be determined based on the total data writing amount of the EMMC chip, the data writing amount corresponding to the target first precision lifetime value, the data writing amount corresponding to the candidate first precision lifetime value, and the target first precision lifetime value, so that the lifetime value of the EMMC chip may be accurately counted, and the lifetime health status of the EMMC chip (e.g., the target second precision lifetime value) may be actively pushed to the user, so as to remind the user to save the data (e.g., configuration parameters, video files, etc.) in the EMMC chip in time before the lifetime upper limit of the EMMC chip arrives, thereby avoiding data loss in the EMMC chip, avoiding the loss that cannot be estimated due to important data loss, and reducing the user loss.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following description will briefly describe the drawings that are required to be used in the embodiments of the present application or the description in the prior art, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings may also be obtained according to these drawings of the embodiments of the present application for a person having ordinary skill in the art.
Fig. 1 is a flow chart of a method for determining a stored lifetime value of an EMMC chip in a camera in one embodiment of the present application;
FIG. 2 is a schematic diagram of a camera in one embodiment of the present application;
FIG. 3 is a flow chart of a method for determining a stored lifetime value of an EMMC chip in a camera in one embodiment of the present application;
fig. 4 is a schematic diagram of a data storage manner of an EMMC chip in an embodiment of the present application.
Detailed Description
The terminology used in the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to any or all possible combinations including one or more of the associated listed items.
It should be understood that although the terms first, second, third, etc. may be used in embodiments of the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, a first message may also be referred to as a second message, and similarly, a second message may also be referred to as a first message, without departing from the scope of the present application. Depending on the context, furthermore, the word "if" used may be interpreted as "at … …" or "at … …" or "in response to a determination".
In the embodiments of the present application, a method for determining a storage lifetime value of an EMMC chip in a camera is provided and applied to a target device using the EMMC chip as a local storage medium, such as a front-end device (e.g., a camera) or a server, where the type of the target device is not limited, so long as the target device uses the EMMC chip as a device of the local storage medium.
Illustratively, the camera further includes a System On Chip (SOC) Chip, which may include a life value calculation module and an SDIO (Secure Digital Input and Output, secure digital input output) module, the SDIO module being in communication with the EMMC Chip, the life value calculation module being in communication with the SDIO module.
Referring to fig. 1, which is a schematic flow chart of the method, the method may include:
step 101, the lifetime value calculation module receives a notification message sent by the SDIO module, where the notification message may include a first data writing amount for the EMMC chip in the current statistics period.
For example, in the current statistics period, the SDIO module may count the data writing amount for the EMMC chip in real time; when the ending condition of the current statistical period is met, the SDIO module determines a first data writing amount aiming at the EMMC chip in the current statistical period, sends a notification message to the life value calculation module, receives the notification message by the life value calculation module, and the notification message can comprise the first data writing amount.
When the data writing quantity of the EMMC chip reaches a preset threshold value, the SDIO module determines that the ending condition of the current statistical period is met; alternatively, the SDIO module may determine a power-down time point of the camera, and determine that an end condition of the current statistical period is satisfied at a target time point before the power-down time point.
And 102, updating the total data writing amount of the EMMC chip by the life value calculation module based on the first data writing amount.
Step 103, the lifetime value calculation module determines a target second precision lifetime value of the EMMC chip based on the total data writing amount, the second data writing amount corresponding to the target first precision lifetime value, the third data writing amount corresponding to the candidate first precision lifetime value, and the target first precision lifetime value. Wherein the second precision may be better than the first precision, that is, the second precision lifetime value is a high precision lifetime value, the first precision lifetime value is a low precision lifetime value; for example, the accuracy of the target second accuracy lifetime value may be 1%, 0.5%, 0.1%, or the like, and the accuracy of the target first accuracy lifetime value (candidate first accuracy lifetime value) may be 10%, or the like. The target first precision life value is the last updated first precision life value of the EMMC chip, and the candidate first precision life value is the last updated first precision life value of the EMMC chip; the second data writing amount is the total data writing amount of the EMMC chip when the target first precision lifetime value is updated, and the third data writing amount is the total data writing amount of the EMMC chip when the candidate first precision lifetime value is updated.
In a possible implementation manner, before step 103, the lifetime value calculation module may further obtain a current first precision lifetime value from a designated register of the EMMC chip, and obtain, from the target data partition of the EMMC chip, a second data writing amount corresponding to the target first precision lifetime value, a third data writing amount corresponding to the candidate first precision lifetime value, and the target first precision lifetime value. On the basis, if the current first precision life value is different from the target first precision life value, the target first precision life value can be updated to be a candidate first precision life value, and the second data writing amount corresponding to the target first precision life value is updated to be a third data writing amount corresponding to the candidate first precision life value; updating the current first precision life value into a target first precision life value, and updating a second data writing amount corresponding to the target first precision life value based on the total data writing amount; and storing the second data writing quantity corresponding to the target first precision lifetime value and the target first precision lifetime value into the target data partition of the EMMC chip.
In one possible implementation, the lifetime value calculation module may determine the target second precision lifetime value of the EMMC chip using the following formula: x= { 100X (a-D)/B } +c; wherein X represents a target second precision lifetime value, a represents a total data writing amount, B represents a difference between the second data writing amount and the third data writing amount, C represents a target first precision lifetime value, and D represents a target data writing amount corresponding to the target first precision lifetime value.
In a possible implementation, after step 103, the lifetime value calculation module may further obtain a stored second precision lifetime value from the target data partition of the EMMC chip; if the target second precision lifetime value is different from the stored second precision lifetime value, the lifetime value calculation module may update the target second precision lifetime value to the stored second precision lifetime value and update the current time point to the stored time point; the lifetime value calculation module may then store the updated stored second precision lifetime value and the stored time point to the target data partition of the EMMC chip.
In one possible implementation, after the lifetime value calculation module stores the updated stored second precision lifetime value and the stored time point to the target data partition of the EMMC chip, if the updated stored second precision lifetime value is greater than the lifetime value threshold, the lifetime value calculation module may further send an early warning message to the user device, where the early warning message may include the updated stored second precision lifetime value and the stored time point.
In one possible implementation manner, after receiving the notification message sent by the SDIO module, the lifetime value calculation module may further determine the write amplification factor of the EMMC chip based on the second data write amount corresponding to the target first precision lifetime value, the third data write amount corresponding to the candidate first precision lifetime value, and the target storage size of the EMMC chip. The writing amplification factor is greater than or equal to 1, when the writing amplification factor is greater, the life value of the EMMC chip is consumed faster, and when the writing amplification factor is smaller, the life value of the EMMC chip is consumed slower, for example, when the writing amplification factor is equal to 1, the life value is consumed most desirably.
Illustratively, the lifetime value calculation module may obtain the actual capacity size of the EMMC chip from a specified register of the EMMC chip, and the lifetime value calculation module may obtain the configured target erasure number; on this basis, the lifetime value calculation module may determine a target storage size based on the actual capacity size and the target number of erasures.
Illustratively, the lifetime value calculation module may determine the write amplification factor of the EMMC chip using the following formula: y= (E x F)/B; in the above formula, Y is used to represent the write amplification factor of the EMMC chip, B is used to represent the difference between the second data writing amount and the third data writing amount, E is used to represent the target storage size, and F is used to represent the interval value between the target first precision lifetime value and the candidate first precision lifetime value.
For example, after the lifetime value calculation module determines the write amplification factor of the EMMC chip, the lifetime value calculation module may further store the write amplification factor to a target data partition of the EMMC chip; and if the write amplification factor is greater than an amplification factor threshold (which may be empirically configured), the lifetime value calculation module may also send an early warning message to the user device, which may include the write amplification factor.
As can be seen from the above technical solution, in the embodiment of the present application, for a camera using an EMMC chip as a local storage medium, the target second precision lifetime value of the EMMC chip may be determined based on the total data writing amount of the EMMC chip, the data writing amount corresponding to the target first precision lifetime value, the data writing amount corresponding to the candidate first precision lifetime value, and the target first precision lifetime value, so as to accurately count the lifetime value of the EMMC chip, and actively push the lifetime health status of the EMMC chip (such as the target second precision lifetime value, the write amplification factor, etc.) to the user, so as to remind the user to save the data (such as the configuration parameters and the video files, etc.) in the EMMC chip in time before the lifetime upper limit of the EMMC chip arrives, thereby avoiding the loss of the data in the EMMC chip, avoiding the loss that cannot be estimated due to the loss of important data, and reducing the user loss.
The above technical solutions of the embodiments of the present application are described below with reference to specific application scenarios.
The video camera generally uses an EMMC chip as a local storage medium, and NAND FLASH is adopted inside the EMMC chip, so that the number of erasures of the EMMC chip is limited, resulting in a limited lifetime value of the EMMC chip. Taking a video file with a code rate of 8Mbps as an example, if the actual capacity of the EMMC chip is 8G and the erasing times of the EMMC chip is 3000 times, when the video file is stored by the EMMC chip, the EMMC chip is erased 10 times every 24 hours, so that the EMMC chip can only be used for 61 days, that is, after 61 days, the error probability is high when writing data into the EMMC chip, and the data accuracy cannot be ensured. When the working time of the EMMC chip reaches the service life value, the camera cannot normally operate, so that data in the EMMC chip is lost, and a large loss is caused for a user.
In view of the above findings, the embodiment of the present application provides a lifetime early warning method for an EMMC chip, which may be applied to a target device using the EMMC chip as a local storage medium, where the target device may be a front-end device (such as a camera) or a server, and the following description will be given by taking the camera as an example. When the video camera uses the EMMC chip as a local storage medium, the video camera can accurately count the life value of the EMMC chip and actively push the life health state of the EMMC chip to a user so as to remind the user to save data, such as configuration parameters, video files and the like, in time before the life upper limit value of the EMMC chip arrives.
Referring to fig. 2, which is a schematic diagram of a structure of a camera, the camera may include an EMMC chip and an SOC chip, and the SOC chip may include a life value calculation module and an SDIO module, the SDIO module being in communication with the EMMC chip, and the life value calculation module being in communication with the SDIO module. The SOC chip may further include a video module, where the video module is configured to send a video file to the SDIO module, and the SDIO module stores the video file to the EMMC chip.
The SOC chip may include a lifetime value calculation module, which may be a hardware entity or an application (such as emmc_app), and implement a function of the lifetime value calculation module by running the application.
The life value calculating module may communicate with the SDIO module, and the communication manner is not limited, for example, the life value calculating module communicates with the SDIO module by calling the ioctl (input output control, input-output control) interface, and the SDIO module communicates with the life value calculating module by calling the ioctl interface. Of course, the ioctl interface is merely an example, and the present embodiment is not limited thereto as long as communication between the life value calculation module and the SDIO module is possible.
The SOC chip may include an SDIO module, which may also be referred to as an SDIO controller, and the SDIO module may communicate with the EMMC chip, which is not limited in the communication manner. For example, the SDIO module may transmit a request message to the EMMC chip to request information stored by the EMMC chip, and the EMMC chip may transmit the information stored by itself to the SDIO module. For another example, the SDIO module may send the video file to the EMMC chip to cause the EMMC chip to store the video file.
The SOC chip can comprise a video module, the video module can be a hardware entity or an application program (such as video APP), and the function of the video module is realized by running the application program. The video module sends the video file to the SDIO module, and the SDIO module stores the video file to the EMMC chip.
The EMMC chip is used for storing video files, the lifetime of the NAND FLASH, EMMC chip is NAND FLASH, and when the lifetime of NAND FLASH reaches the upper limit, the error rate of the written data is greatly improved. NAND FLASH is divided into the following three types: SLC (Single-Level Cell), 1bit/Cell, has the characteristics of high speed and long service life, and has a erasing life of about 10 ten thousand times; MLC (Multi-Level Cell), namely 2bit/Cell, has the characteristic of general life of the speed, according to the difference of the craft, about 3000 times of erasing life; TLC (Trinary-Level Cell), i.e. 3bit/Cell, has the characteristics of slow speed and short lifetime, about 500-1000 erasure lifetime according to the process difference.
Based on the above application scenario, an embodiment of the present application provides a lifetime value determining method, which is shown in fig. 3, and is a flow chart of the lifetime value determining method, and the method may include the following steps:
step 301, in a current statistics period, the SDIO module counts the data writing amount for the EMMC chip in real time; when the ending condition of the current statistical period is met, the SDIO module determines the first data writing quantity aiming at the EMMC chip in the current statistical period and sends a notification message to the life value calculation module, wherein the notification message can comprise the first data writing quantity aiming at the EMMC chip in the current statistical period.
For example, since the video module sends the video file to the SDIO module, and the SDIO module stores the video file to the EMMC chip, the SDIO module may count the data writing amount for the EMMC chip in real time. For example, assuming that the time T1 is the starting time of the current statistics period, the data writing amount of the time T1 is 0, and from the time T1, the SDIO module updates the data writing amount for the EMMC chip based on the size of the video file each time the video file is stored in the EMMC chip.
When the end condition of the current statistics period is met, the current time is recorded as time T2, the SDIO module uses the data writing amount of time T2 as the first data writing amount, that is, the first data writing amount is a time period from time T1 to time T2, and for the data writing amount of the EMMC chip, it is assumed that, during the time period, video files with the size of S1 are written to the EMMC chip together, and the first data writing amount is S1.
For example, when the end condition of the current statistical period is satisfied, the SDIO module may send a notification message to the lifetime value calculation module, the notification message may include the first data write amount. The notification message may be a Netlink message, or may be another type of message, which is not limited in type.
In one possible implementation, the end condition of the current statistical period may include, but is not limited to, the following manner, which is, of course, merely an example, and the present embodiment does not limit the "end condition".
In mode 1, when the data writing amount for the EMMC chip reaches a preset threshold (which may be empirically configured, for example, 1gb,500mb, etc.), the SDIO module determines that the ending condition of the current statistical period is satisfied.
For example, in the current statistics period, the SDIO module counts the data writing amount for the EMMC chip in real time; when the data writing quantity of the EMMC chip reaches a preset threshold value, the SDIO module determines a first data writing quantity and sends a notification message to the life value calculation module, wherein the notification message comprises the first data writing quantity.
Taking the preset threshold value of 1GB as an example, when the data writing amount for the EMMC chip reaches 1GB, a notification message is sent to the lifetime value calculation module, where the notification message includes a first data writing amount of 1GB. In consideration of the fact that the data writing amount of the GB level possibly accompanies the life value change of the EMMC chip, when the data writing amount of the EMMC chip reaches 1GB, a notification message is sent to the life value calculation module.
Mode 2, the SDIO module determines a power-down time point of the camera, and determines that an end condition of the current statistical period is satisfied at a target time point (an interval between the target time point and the power-down time point may be empirically configured, obviously, based on the power-down time point and the interval, the target time point may be determined) before the power-down time point.
For example, in the current statistics period, the SDIO module counts the data writing amount for the EMMC chip in real time. If at a certain moment, the SDIO module learns the power-down time point of the camera, then, based on the difference between the power-down time point and the configured interval, a target time point (the target time point is located before the power-down time point) may be determined, and when the target time point is reached, the SDIO module may determine the first data writing amount and send a notification message to the lifetime value calculation module, where the notification message includes the first data writing amount.
Since the data writing amount counted by the SDIO module is cleared after the camera is powered down, the SDIO module may send a notification message to the lifetime value calculation module at a target time point before the power-down time point.
And 3, when the data writing quantity aiming at the EMMC chip reaches a preset threshold value, determining that the ending condition of the current statistical period is met by the SDIO module. And the SDIO module determines a power-down time point of the camera, and determines that the ending condition of the current statistical period is met at a target time point before the power-down time point.
Step 302, the lifetime value calculation module receives a notification message sent by the SDIO module, where the notification message may include a first data writing amount for the EMMC chip in the current statistics period.
For example, after receiving the notification message, the lifetime value calculation module may trigger to execute the subsequent step, and if the lifetime value calculation module does not receive the notification message, the subsequent step is not required to be executed, and the lifetime value calculation module continues to wait for receiving the notification message.
Step 303, the lifetime value calculation module obtains the current lifetime value of the first precision from the designated register of the EMMC chip, and obtains the actual capacity of the EMMC chip from the designated register of the EMMC chip.
The EMMC chip illustratively includes a designated register, which may be, for example, an ext_csd register, without limitation as to the type of designated register. The actual capacity size of the EMMC chip can be stored in the designated register, and the actual capacity size is configured when the EMMC chip leaves the factory, such as 8GB, 16GB, and the like.
The specific register can also store the current first precision life value of the EMMC chip, the initial value of the current first precision life value is 0, and in the use process of the EMMC chip, the EMMC chip can modify the current first precision life value and update the modified current first precision life value into the specific register.
In the use process of the EMMC chip, the current first precision lifetime value may be modified according to a first precision, where the first precision is a relatively coarse precision, such as 8%, 10%, 15%, etc., and for convenience of description, the first precision is exemplified by 10% in this embodiment. The current first precision lifetime value is 0 when the EMMC chip leaves the factory, indicating that the lifetime consumption of the EMMC chip is 0%. During the use of the EMMC chip, data is continuously written into the EMMC chip and data in the EMMC chip is continuously erased, so that the life of the EMMC chip is continuously consumed. If the life consumption of the EMMC chip is changed from 0% to 10%, the EMMC chip modifies the current first precision life value to 1, and updates the current first precision life value to 1 to a specified register. If the life consumption of the EMMC chip is changed from 10% to 20%, the EMMC chip modifies the current first precision life value to 2 and updates the current first precision life value of 2 to the specified register, and so on.
In summary, the specified register of the EMMC chip may include the current first precision lifetime value of the EMMC chip and the actual capacity size of the EMMC chip, and thus, the lifetime value calculation module may obtain the current first precision lifetime value and the actual capacity size of the EMMC chip from the specified register of the EMMC chip.
For example, the lifetime value calculation module sends a request message to the SDIO module requesting data within a specified register. After receiving the request message, the SDIO module sends a CMD8 message to the EMMC chip, and of course, the CMD8 message is only an example, and the type of the CMD8 message is not limited, and the CMD8 message is a communication command defined in the EMMC standard protocol, and is used for reading data in a specified register of the EMMC chip.
After receiving the CMD8 message, the EMMC chip sends the data in the specified register (such as the current first precision lifetime value and the actual capacity size) to the SDIO module, and the SDIO module sends a response message to the lifetime value calculation module, where the response message includes the current first precision lifetime value and the actual capacity size of the EMMC chip.
In summary, the lifetime value calculation module may read the data in the designated register of the EMMC chip, and then analyze the current first precision lifetime value of the EMMC chip and the actual capacity of the EMMC chip.
And step 304, the life value calculation module acquires the total data writing amount of the EMMC chip, the second data writing amount corresponding to the target first precision life value, the third data writing amount corresponding to the candidate first precision life value, the candidate first precision life value and the target first precision life value from the target data partition of the EMMC chip.
Illustratively, the target first precision lifetime value is the last updated first precision lifetime value of the EMMC chip, and the candidate first precision lifetime value is the last updated first precision lifetime value of the EMMC chip; the second data writing amount is the total data writing amount of the EMMC chip when the target first precision lifetime value is updated, and the third data writing amount is the total data writing amount of the EMMC chip when the candidate first precision lifetime value is updated.
For example, a partition for storing lifetime data may be divided in the EMMC chip, and the partition is denoted as a target data partition, where the target data partition is used to store lifetime data of the EMMC chip, and the lifetime data may include, but is not limited to, a total data write amount, a first precision lifetime value, a data write amount corresponding to the first precision lifetime value, a time point corresponding to the first precision lifetime value, a second precision lifetime value, a time point corresponding to the second precision lifetime value, a write amplification factor, and the like.
Referring to table 1, as an example of life data, regarding the process of updating the life data, reference may be made to the following embodiment, and in step 304, the life data shown in table 1 is taken as an example for explanation.
TABLE 1
S11 represents the total amount of data writing for the EMMC chip, and the amount of data of S11 has been written in the EMMC chip at time point T11. S13 indicates that when the first precision lifetime value of the EMMC chip is 10%, the lifetime consumption of the EMMC chip is changed from 0% to 10% for the data writing amount of the EMMC chip at time T13, and the data amount of S13 has been written in the EMMC chip. S14 indicates that when the first precision lifetime value of the EMMC chip is 20%, the lifetime consumption of the EMMC chip is changed from 10% to 20% at time T14 for the data writing amount of the EMMC chip, and the data amount of S14 has been written in the EMMC chip. S15 indicates that when the first precision lifetime value of the EMMC chip is 30%, the lifetime consumption of the EMMC chip is changed from 20% to 30% at time T15 with respect to the data writing amount of the EMMC chip, and the data amount of S15 has been written in the EMMC chip.
Further, at time T21, the second precision lifetime value of the EMMC chip is 32, the write amplification factor is 1.1, at time T22, the second precision lifetime value of the EMMC chip is 32.5%, the write amplification factor is 1.1, and at time T23, the second precision lifetime value of the EMMC chip is 34%, the write amplification factor is 1.2.
In summary, the target data partition of the EMMC chip may include lifetime data, so the lifetime value calculation module may obtain, from the target data partition of the EMMC chip, a total data writing amount of the EMMC chip, a second data writing amount corresponding to the target first precision lifetime value, a third data writing amount corresponding to the candidate first precision lifetime value, and the target first precision lifetime value. Referring to table 1, the total data writing amount is S11, the target first precision lifetime value is 30% (i.e., the last updated first precision lifetime value of the EMMC chip), the candidate first precision lifetime value is 20% (the last updated first precision lifetime value of the EMMC chip), the second data writing amount corresponding to the target first precision lifetime value is S15, and the third data writing amount corresponding to the candidate first precision lifetime value is S14.
For example, the life value calculation module sends a request message to the SDIO module requesting life data within the target data partition. And after receiving the request message, the SDIO module sends a request message to the EMMC chip, wherein the request message is used for requesting the service life data in the target data partition. After receiving the request message, the EMMC chip sends the service life data in the target data partition to the SDIO module, and the SDIO module sends a response message to the service life value calculation module, wherein the response message comprises the service life data in the target data partition.
In summary, the lifetime value calculation module may read lifetime data in the target data partition of the EMMC chip, and then analyze the total data writing amount, the second data writing amount corresponding to the target first precision lifetime value, the third data writing amount corresponding to the candidate first precision lifetime value, and the target first precision lifetime value.
In one possible implementation, the SOC chip may deploy a driver with which the lifetime value calculation module may communicate through ioctl, which may read lifetime data within the target data partition of the EMMC chip by invoking the standard interface of the SDIO module. Of course, the above manner is merely an example, and is not limited thereto, as long as the lifetime value calculation module can obtain lifetime data in the target data partition of the EMMC chip.
Step 305, the lifetime value calculation module updates the total data writing amount of the EMMC chip based on the first data writing amount.
For example, in step 302, the lifetime value calculation module may obtain the first data writing amount, e.g. S1, and in step 304, the lifetime value calculation module may obtain the total data writing amount S11 at the time point T11, so the lifetime value calculation module may update the total data writing amount of the EMMC chip, the updated total data writing amount is S21 (s11+s1), and the current time point (e.g. T31) is taken as the time point of the total data writing amount S21. Then, the lifetime value calculation module updates the data write total S21 to the target data partition of the EMMC chip, as shown in table 2.
TABLE 2
Step 306, the lifetime value calculation module determines whether the current first precision lifetime value is the same as the target first precision lifetime value.
If different, step 307 may be performed, and if the same, step 308 may be performed.
For example, in step 303, the lifetime value calculation module may obtain the current first precision lifetime value from the specified register, and in step 304, the lifetime value calculation module may obtain the target first precision lifetime value (e.g., 30%) from the target data partition, so that if the current first precision lifetime value is 30%, the current first precision lifetime value is the same as the target first precision lifetime value, and if the current first precision lifetime value is 40%, the current first precision lifetime value is different from the target first precision lifetime value.
Step 307, updating the target first precision lifetime value to be a candidate first precision lifetime value, and updating the second data writing amount corresponding to the target first precision lifetime value to be a third data writing amount corresponding to the candidate first precision lifetime value; and updating the current first precision life value into a target first precision life value, and updating a second data writing quantity corresponding to the target first precision life value based on the total data writing quantity. And storing the second data writing quantity corresponding to the target first precision life value and the target first precision life value into the target data partition, namely updating the target data partition of the EMMC chip.
In step 304, the lifetime value calculation module may obtain, from the target data partition, 30% of the target first precision lifetime value, 20% of the second data writing amount corresponding to the target first precision lifetime value, and S14 of the third data writing amount corresponding to the candidate first precision lifetime value, and on this basis, if the current first precision lifetime value is 40%, the lifetime value calculation module updates "30%" to be the candidate first precision lifetime value, that is, the updated candidate first precision lifetime value is 30%, and updates "S15" to be the third data writing amount corresponding to the candidate first precision lifetime value, that is, the updated third data writing amount is S15. The life value calculating module updates the current first precision life value by 40% to a target first precision life value, namely, the updated target first precision life value is 40%, and updates the second data writing amount corresponding to the target first precision life value based on the total data writing amount S21 of the current time point (such as T31), namely, the updated second data writing amount is S21.
Further, the lifetime value calculation module may further store the second data writing amount S21 corresponding to the target first precision lifetime value 40% and the target first precision lifetime value to the target data partition of the EMMC chip, as shown in table 3.
TABLE 3 Table 3
Step 308, the lifetime value calculation module determines a target second precision lifetime value of the EMMC chip based on the total data writing amount, the second data writing amount corresponding to the target first precision lifetime value, the third data writing amount corresponding to the candidate first precision lifetime value, and the target first precision lifetime value. Wherein the second precision of the target second precision lifetime value may be better than the first precision of the target first precision lifetime value; for example, the second precision of the target second precision lifetime value may be 1%, 0.5%, 0.1%, etc., and for convenience of description, the first precision of the target first precision lifetime value may be 10% by taking 1% as an example.
For example, if the current first precision lifetime value is the same as the target first precision lifetime value, then, referring to step 304, the target first precision lifetime value is 30%, the second data writing amount corresponding to the target first precision lifetime value is S15, the candidate first precision lifetime value is 20%, the third data writing amount corresponding to the candidate first precision lifetime value is S14, and the total data writing amount is S21. The lifetime value calculation module determines a target second precision lifetime value of the EMMC chip based on the above information. For another example, if the current first precision lifetime value is different from the target first precision lifetime value, then, referring to step 307, the target first precision lifetime value is 40%, the second data writing amount corresponding to the target first precision lifetime value is S21, the candidate first precision lifetime value is 30%, the third data writing amount corresponding to the candidate first precision lifetime value is S15, and the total data writing amount is S21. The lifetime value calculation module determines a target second precision lifetime value of the EMMC chip based on the above information. The manner in which the target second precision lifetime value is determined in both cases is the same, as will be exemplified in the latter case.
In one possible implementation, the lifetime value calculation module may determine the target second precision lifetime value of the EMMC chip using the following formula: x= { 100X (a-D)/B } +c; wherein X represents a target second precision lifetime value, a represents a total data writing amount, B represents a difference between the second data writing amount and the third data writing amount, C represents a target first precision lifetime value, and D represents a target data writing amount corresponding to the target first precision lifetime value.
With respect to the target data writing amount D corresponding to the target first precision lifetime value, the multiple G may be calculated based on the precision of the target first precision lifetime value and the target first precision lifetime value, e.g., G is equal to the precision of the target first precision lifetime value divided by the target first precision lifetime value, and then, the product of the multiple G and B is taken as the target data writing amount D.
In summary, the above formula can be rewritten as: x= { 100X (a-G X B)/B } +c.
Referring to the above example, since the total amount of data writing is S21, a is S21. Since the second data writing amount is S21 and the third data writing amount is S15, B is the difference between S21 and S15. Since the target first precision lifetime value is 40%, C is 40%. Since the target first precision lifetime value is 40%, the precision of the target first precision lifetime value is 10%, and thus the multiple G is 4. To sum up, in this example, the above formula can be rewritten as: x= { 100X (a-4*B)/B } +40%, it is obvious that after substituting the above parameter a and parameter B into the formula, the target second precision lifetime value X of the EMMC chip can be obtained.
Step 309, the lifetime value calculation module determines a write amplification factor of the EMMC chip based on the second data writing amount corresponding to the target first precision lifetime value, the third data writing amount corresponding to the candidate first precision lifetime value, and the target storage size of the EMMC chip. The writing amplification factor is greater than or equal to 1, when the writing amplification factor is greater, the life value of the EMMC chip is consumed faster, otherwise, when the writing amplification factor is smaller, the life value of the EMMC chip is consumed slower, and if the writing amplification factor is 1, the writing amplification factor is optimal.
For example, if the current first precision lifetime value is the same as the target first precision lifetime value, see step 304, the target first precision lifetime value is 30%, the second data writing amount corresponding to the target first precision lifetime value is S15, the candidate first precision lifetime value is 20%, the third data writing amount corresponding to the candidate first precision lifetime value is S14, and the lifetime value calculation module determines the writing amplification factor of the EMMC chip based on the above information. For another example, if the current first precision lifetime value is different from the target first precision lifetime value, see step 307, the target first precision lifetime value is 40%, the second data writing amount corresponding to the target first precision lifetime value is S21, the candidate first precision lifetime value is 30%, the third data writing amount corresponding to the candidate first precision lifetime value is S15, and the lifetime value calculation module determines the write amplification factor of the EMMC chip based on the above information. The manner of determining the write amplification factor is the same in both cases, and will be exemplified later.
In one possible implementation, the lifetime value calculation module may determine the write amplification factor of the EMMC chip using the following formula: y= (E x F)/B; wherein Y is used for representing the write amplification factor of the EMMC chip, B is used for representing the difference value between the second data writing quantity and the third data writing quantity, E is used for representing the target storage size, and F is used for representing the interval value between the target first precision lifetime value and the candidate first precision lifetime value.
The lifetime value calculation module may obtain the configured target erasing times with respect to the target storage size E, where the target erasing times may be empirically configured, for example, 3000, 5000, etc., and on the basis of this, the lifetime value calculation module may determine the target storage size based on the actual capacity size of the EMMC chip (the lifetime value calculation module may obtain from a designated register of the EMMC chip, for example, 8G, 16G, etc.) and the target erasing times, for example, a product of the actual capacity size and the target erasing times may be used as the target storage size, for example, the target storage size may be 8 x 3000G.
Wherein, regarding the interval value F between the target first precision lifetime value and the candidate first precision lifetime value, it is the difference between the target first precision lifetime value and the candidate first precision lifetime value, that is, the precision of the target first precision lifetime value, such as 10%.
In summary, the above formula can be rewritten as: y= (8 x 3000 x 10%)/B.
Referring to the above example, since the second data writing amount is S21 and the third data writing amount is S15, B is the difference between S21 and S15. Obviously, based on the above formula y= (8×3000×10%)/B, after substituting the parameter B into the formula, the write amplification factor of the EMMC chip can be obtained.
Illustratively, the write amplification factor is one of factors for measuring the lifetime of the EMMC chip, and is equal to the actual amount of erased data divided by the amount of written data. For EMMC chips, when 1MB of valid data needs to be written, the actual erase NAND FLASH space is greater than or equal to 1MB of space. Referring to fig. 4, a schematic diagram of a data storage manner of an EMMC chip is shown, in the following storage manner, three blocks of data are actually stored, and simultaneously, three blocks of data are erased, and the write amplification factor of this manner is 1, which is advantageous for maximizing the lifetime of the EMMC chip. In the above storage mode, three blocks of data are actually stored, but one block of data is stored to two blocks of data, and the actual erasure data is six blocks of data, and the write amplification factor of this mode is 2, which is detrimental to the lifetime of the EMMC chip.
In summary, whether the data storage mode of the EMMC chip is suitable or not can be represented by the write amplification factor, and when the write amplification factor is relatively large, the user can be notified to change the data writing mode of the EMMC chip, so that the service life of the EMMC chip can be prevented from being consumed too fast, i.e. the service life of the EMMC chip is prolonged.
Step 310, the lifetime value calculation module determines whether the target second precision lifetime value is the same as the stored second precision lifetime value in the target data partition. If the same, the procedure may be ended without updating the target data partition of the EMMC chip, and if different, step 311 may be performed to update the target data partition of the EMMC chip.
In step 304, when the lifetime value calculation module obtains lifetime data from the target data partition of the EMMC chip, the stored second precision lifetime value may also be obtained from the target data partition of the EMMC chip, where the stored second precision lifetime value is the last updated second precision lifetime value, as shown in table 1, and the second precision lifetime value may be 34%.
On this basis, the lifetime value calculation module may determine whether the target second precision lifetime value is the same as the stored second precision lifetime value after obtaining the target second precision lifetime value (see step 308), and if so, perform step 311.
Step 311, if the target second precision lifetime value is different from the stored second precision lifetime value, the lifetime value calculation module updates the target second precision lifetime value to the stored second precision lifetime value, updates the current time point to the stored time point, and stores the updated stored second precision lifetime value and the stored time point to the target data partition of the EMMC chip.
In a possible implementation, assuming that the target second precision lifetime value is 41% and the current time point is T31, an entry may be added to the target data partition of the EMMC chip, and the updated stored second precision lifetime value and the stored time point are recorded through the entry, as shown in table 4. In another possible embodiment, assuming that the target second precision lifetime value is 41% and the current time point is T31, the second precision lifetime value in the target data partition of the EMMC chip may also be directly replaced, i.e. only the last updated second precision lifetime value (i.e. the stored second precision lifetime value) is retained in the target data partition, as shown in table 5.
TABLE 4 Table 4
TABLE 5
In one possible implementation, after the lifetime value calculation module determines the write amplification factor of the EMMC chip, the write amplification factor may also be stored in the target data partition of the EMMC chip, and obviously, this write amplification factor also corresponds to the time point T31, for example, the write amplification factor is 1.4, which is shown in table 6.
TABLE 6
In one possible implementation, based on the stored second precision lifetime value (i.e., the last updated second precision lifetime value) in the target data partition, if the stored second precision lifetime value is greater than a lifetime value threshold (which may be empirically configured, such as 80%, 90%, etc.), the lifetime value calculation module may also send an early warning message to the user device, which may include the stored second precision lifetime value and a stored point in time.
In addition, based on the write amplification factor (which may be any write amplification factor) in the target data partition, if the write amplification factor is greater than the amplification factor threshold (which may be empirically configured), the lifetime value calculation module may also send an early warning message to the user device, which may include the write amplification factor.
In the above process, the early warning message may be sent to the user equipment by means of a short message, a mail, a client, etc., which is not limited as long as the early warning message can be sent to the user equipment.
According to the technical scheme, in the embodiment of the application, the service life value of the EMMC chip can be accurately counted, the service life health state (such as the target second precision service life value, the write amplification factor and the like) of the EMMC chip is actively pushed to a user, the user is reminded to save the data (such as the configuration parameters and the video files) in the EMMC chip in time before the service life upper limit value of the EMMC chip arrives, so that the data loss in the EMMC chip is avoided, the loss which cannot be estimated due to important data loss is avoided, and the user loss is reduced.
The second precision life value of the target with better granularity, such as the second precision life value of the target with 1 percent precision, can be provided for the user, so that the life data of the EMMC chip can be accurately calculated, and the health condition of the EMMC chip can be accurately and effectively judged. Recording the time point of the life mutation of the EMMC chip can record the time point into a target data partition of the EMMC chip, so that a user can trace back the historical time point of the life change of the EMMC chip in real time, and the user can be fed back in real time, so that the user obtains better experience. By recording the write amplification factor of the EMMC chip, the user changes the usage mode of the camera according to the write amplification factor, and the lifetime of the EMMC chip is maximized. The service life of the EMMC chip can be accurate to 1% precision, so that data loss caused by data errors when the service life of the EMMC chip reaches the upper limit is greatly reduced.
The system, apparatus, module or unit set forth in the above embodiments may be implemented in particular by a computer chip or entity, or by a product having a certain function. A typical implementation device is a computer, which may be in the form of a personal computer, laptop computer, cellular telephone, camera phone, smart phone, personal digital assistant, media player, navigation device, email device, game console, tablet computer, wearable device, or a combination of any of these devices.
For convenience of description, the above devices are described as being functionally divided into various units, respectively. Of course, the functions of each element may be implemented in one or more software and/or hardware elements when implemented in the present application.
It will be appreciated by those skilled in the art that embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, embodiments of the present application may take the form of a computer program product on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) having computer-usable program code embodied therein.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
Moreover, these computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and changes may be made to the present application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. which are within the spirit and principles of the present application are intended to be included within the scope of the claims of the present application.
Claims (10)
1. A method for determining a stored lifetime value of an EMMC chip in a camera, the camera comprising an SOC chip including a lifetime value computation module and an SDIO module in communication with the EMMC chip, the method comprising:
the service life value calculation module receives a notification message sent by the SDIO module, wherein the notification message comprises a first data writing amount aiming at the EMMC chip in a current statistical period;
the life value calculating module updates the total data writing amount of the EMMC chip based on the first data writing amount;
the life value calculation module determines a target second precision life value of the EMMC chip based on the total data writing amount, a second data writing amount corresponding to the target first precision life value, a third data writing amount corresponding to the candidate first precision life value and the target first precision life value;
wherein the second precision is better than the first precision; the target first precision life value is a first precision life value updated by the EMMC chip for the last time, and the candidate first precision life value is a first precision life value updated by the EMMC chip for the penultimate time; the second data writing amount is the total data writing amount of the EMMC chip when the target first precision lifetime value is updated, and the third data writing amount is the total data writing amount of the EMMC chip when the candidate first precision lifetime value is updated.
2. The method of claim 1, wherein the step of determining the position of the substrate comprises,
the life value calculating module receives a notification message sent by the SDIO module, including:
in the current statistical period, the SDIO module counts the data writing quantity aiming at the EMMC chip in real time; when the ending condition of the current statistical period is met, determining a first data writing quantity aiming at an EMMC chip in the current statistical period, sending a notification message to the life value calculation module, and receiving the notification message by the life value calculation module;
when the data writing quantity aiming at the EMMC chip reaches a preset threshold value, determining that the ending condition of the current statistical period is met; or determining a power-down time point of the camera, and determining that the ending condition of the current statistical period is met at a target time point before the power-down time point.
3. The method according to claim 1, wherein the method further comprises:
the life value calculation module acquires a current first precision life value from a designated register of an EMMC chip, and acquires a second data writing amount corresponding to a target first precision life value, a third data writing amount corresponding to a candidate first precision life value and a target first precision life value from a target data partition of the EMMC chip;
If the current first precision life value is different from the target first precision life value, updating the target first precision life value into a candidate first precision life value, and updating the second data writing quantity corresponding to the target first precision life value into a third data writing quantity corresponding to the candidate first precision life value; updating the current first precision life value into a target first precision life value, and updating a second data writing quantity corresponding to the target first precision life value based on the total data writing quantity; and storing the second data writing quantity corresponding to the target first precision life value and the target first precision life value into the target data partition.
4. The method of claim 1, wherein the step of determining the position of the substrate comprises,
the lifetime value calculation module determines a target second precision lifetime value of the EMMC chip based on the total data writing amount, a second data writing amount corresponding to the target first precision lifetime value, a third data writing amount corresponding to the candidate first precision lifetime value, and the target first precision lifetime value, including:
the life value calculation module determines a target second precision life value of the EMMC chip by adopting the following formula:
X＝{100*(A-D)/B}+C；
wherein X represents the target second precision lifetime value, a represents the total amount of data written, B represents the difference between the second data written and the third data written, C represents the target first precision lifetime value, and D represents a target data written corresponding to the target first precision lifetime value.
5. The method of claim 1, wherein the step of determining the position of the substrate comprises,
the lifetime value calculation module determines a target second precision lifetime value of the EMMC chip based on the total data writing amount, a second data writing amount corresponding to the target first precision lifetime value, a third data writing amount corresponding to the candidate first precision lifetime value, and the target first precision lifetime value, and then the method further includes:
the life value calculation module acquires a stored second precision life value from a target data partition of the EMMC chip;
if the target second precision lifetime value is different from the stored second precision lifetime value, updating the target second precision lifetime value to the stored second precision lifetime value, and updating the current time point to the stored time point;
and storing the updated stored second precision lifetime value and the stored time point to the target data partition.
6. The method of claim 5, wherein after storing the updated stored second precision lifetime value and the stored point in time to the target data partition, the method further comprises:
and if the updated stored second precision lifetime value is greater than the lifetime value threshold, the lifetime value calculation module sends an early warning message to the user equipment, wherein the early warning message comprises the updated stored second precision lifetime value and a stored time point.
7. The method of any of claims 1-6, wherein after the life value calculation module receives the notification message sent by the SDIO module, the method further comprises:
the life value calculation module determines a write amplification factor of the EMMC chip based on a second data write amount corresponding to a target first precision life value, a third data write amount corresponding to a candidate first precision life value and a target storage size of the EMMC chip; and when the write amplification factor is larger, the life value of the EMMC chip is expressed to be consumed faster.
8. The method of claim 7, wherein the method further comprises:
the service life value calculating module obtains the actual capacity of the EMMC chip from a designated register of the EMMC chip, and obtains the configured target erasing times;
the target storage size is determined based on the actual capacity size and the target number of erasures.
9. The method of claim 7, wherein the step of determining the position of the probe is performed,
the lifetime value calculation module determines a write amplification factor of the EMMC chip based on a second data write amount corresponding to the target first precision lifetime value, a third data write amount corresponding to the candidate first precision lifetime value, and a target storage size of the EMMC chip, including:
The life value calculation module determines the write amplification factor of the EMMC chip by adopting the following formula:
Y＝(E*F)/B；
wherein Y is used to represent the write amplification factor, B is used to represent the difference between the second data write amount and the third data write amount, E is used to represent the target storage size, and F is used to represent the interval value between the target first precision lifetime value and the candidate first precision lifetime value.
10. The method of claim 7, wherein the step of determining the position of the probe is performed,
the lifetime value calculation module determines a write amplification factor of the EMMC chip based on the second data writing amount corresponding to the target first precision lifetime value, the third data writing amount corresponding to the candidate first precision lifetime value, and the target storage size of the EMMC chip, and the method further includes:
the life value calculation module stores the write amplification factor into a target data partition of an EMMC chip; and if the write amplification factor is greater than the amplification factor threshold, the lifetime value calculation module sends an early warning message to the user equipment, wherein the early warning message comprises the write amplification factor.
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