CN117304648B - Preparation method of main insulating plate of super-hydrophobic circuit breaker - Google Patents
Preparation method of main insulating plate of super-hydrophobic circuit breaker Download PDFInfo
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- CN117304648B CN117304648B CN202311074936.4A CN202311074936A CN117304648B CN 117304648 B CN117304648 B CN 117304648B CN 202311074936 A CN202311074936 A CN 202311074936A CN 117304648 B CN117304648 B CN 117304648B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 230000003075 superhydrophobic effect Effects 0.000 title claims abstract description 13
- 239000000945 filler Substances 0.000 claims abstract description 56
- 239000002131 composite material Substances 0.000 claims abstract description 54
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 claims abstract description 54
- 229920002748 Basalt fiber Polymers 0.000 claims abstract description 48
- 239000003822 epoxy resin Substances 0.000 claims abstract description 32
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 32
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 18
- 239000012286 potassium permanganate Substances 0.000 claims abstract description 17
- 239000011159 matrix material Substances 0.000 claims abstract description 16
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 12
- 239000004698 Polyethylene Substances 0.000 claims abstract description 6
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 6
- 229920000573 polyethylene Polymers 0.000 claims abstract description 6
- 239000000203 mixture Substances 0.000 claims abstract description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 37
- 238000003756 stirring Methods 0.000 claims description 36
- 239000007787 solid Substances 0.000 claims description 34
- 238000001914 filtration Methods 0.000 claims description 33
- 238000010438 heat treatment Methods 0.000 claims description 32
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 21
- 238000002156 mixing Methods 0.000 claims description 21
- 238000001723 curing Methods 0.000 claims description 19
- 238000001035 drying Methods 0.000 claims description 18
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 16
- 238000002791 soaking Methods 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 14
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 claims description 13
- DDFYFBUWEBINLX-UHFFFAOYSA-M tetramethylammonium bromide Chemical compound [Br-].C[N+](C)(C)C DDFYFBUWEBINLX-UHFFFAOYSA-M 0.000 claims description 13
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims description 11
- 230000032683 aging Effects 0.000 claims description 11
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 10
- 239000012212 insulator Substances 0.000 claims description 10
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 9
- 230000001105 regulatory effect Effects 0.000 claims description 9
- 239000002994 raw material Substances 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 4
- 229940089951 perfluorooctyl triethoxysilane Drugs 0.000 claims description 3
- LRWZZZWJMFNZIK-UHFFFAOYSA-N 2-chloro-3-methyloxirane Chemical compound CC1OC1Cl LRWZZZWJMFNZIK-UHFFFAOYSA-N 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims description 2
- PUSKHXMZPOMNTQ-UHFFFAOYSA-N ethyl 2,1,3-benzoselenadiazole-5-carboxylate Chemical group CCOC(=O)C1=CC=C2N=[Se]=NC2=C1 PUSKHXMZPOMNTQ-UHFFFAOYSA-N 0.000 claims description 2
- 238000000967 suction filtration Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 21
- 239000000377 silicon dioxide Substances 0.000 abstract description 10
- 238000011068 loading method Methods 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 239000011810 insulating material Substances 0.000 abstract description 3
- 239000002105 nanoparticle Substances 0.000 abstract description 3
- 230000001590 oxidative effect Effects 0.000 abstract 1
- OZRVXYJWUUMVOW-UHFFFAOYSA-N 2-[[4-[4-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=C1)=CC=C1C(C=C1)=CC=C1OCC1CO1 OZRVXYJWUUMVOW-UHFFFAOYSA-N 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 8
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to the technical field of insulating materials, and discloses a preparation method of a main insulating plate of a super-hydrophobic circuit breaker. The beneficial effects are that: the basalt fiber is modified by the potassium permanganate solution and the tetraethyl orthosilicate in sequence, the potassium permanganate solution is used for pre-oxidizing the basalt to obtain the manganese dioxide modified basalt, the wear resistance is improved, the dispersibility of the basalt surface is improved, and the uniform loading of the silica nanoparticles in the subsequent step is facilitated; the mass ratio of tetraethyl orthosilicate to the manganese dioxide modified basalt is controlled to be 1:2, the composite filler with good hydrophobicity and wear resistance can be prepared; the silane coupling agent is used for modifying the composite filler, so that the compatibility of the composite filler and a matrix material is increased; the matrix material is a mixture of epoxy resin, liquid crystal epoxy resin and alkylene oxide-polyethylene glycol-alkylene oxide, and the mass ratio is 8:1:1.
Description
Technical Field
The invention relates to the technical field of insulating materials, and discloses a preparation method of a main insulating plate of a super-hydrophobic circuit breaker.
Background
The light rail open circuit insulator can reduce cost and save maintenance time by adopting a sectional power failure or power supply mode, so the light rail open circuit insulator is very important for a light rail traffic system. The equipment is always exposed in outdoor environment and is often corroded by rainwater, so that good weather resistance, corrosion resistance and hydrophobicity are required to improve the maintenance efficiency of a light rail system and the service life of a circuit breaker.
In the prior art, a light rail circuit breaker insulator usually uses resin as a matrix material and basalt fiber as a reinforcing material; the basalt fiber surface active groups are more, the basalt fiber is easy to combine with epoxy resin, meanwhile, the basalt fiber strength is higher, and the light rail short-circuit insulating paint added with basalt fiber as filler has good mechanical properties, but has some problems: the basalt fiber has higher surface energy, the surface energy of the basalt fiber is required to be modified to reduce, the basalt fiber can have higher hydrophobicity, and the unique surface pore structure of the basalt fiber has poorer wear resistance, so that the problem of how to prepare an insulating material with superhydrophobic performance and good wear resistance is needed to be solved.
Therefore, the preparation method of the main insulating plate of the circuit breaker, which has superhydrophobicity and good wear resistance, has important significance.
Disclosure of Invention
The invention aims to provide a preparation method of a main insulating plate of a super-hydrophobic circuit breaker, which aims to solve the problems in the background technology.
In order to solve the technical problems, the invention provides the following technical scheme:
A preparation method of a main insulating plate of a super-hydrophobic circuit breaker comprises the following steps:
S1: sequentially using potassium permanganate solution and tetraethyl orthosilicate to modify and clean basalt fiber to obtain composite filler; adding a silane coupling agent and absolute ethyl alcohol, and aging for 8-10 hours at 30-70 ℃ to obtain modified composite filler;
s2: adding the modified composite filler into a matrix material, heating for 5-6 h at 80-90 ℃, adding a curing agent, uniformly mixing, and heating and curing to obtain the main insulating plate of the circuit breaker.
More optimally, the main insulating plate of the circuit breaker insulator comprises the following raw materials in parts by weight: 280-310 parts of matrix material, 170-190 parts of curing agent and 120-140 parts of modified composite filler.
More preferably, the curing agent is a polyamide 651 curing agent.
More preferably, the preparation of the modified composite filler comprises the following steps: s11: adding purified basalt fiber into potassium permanganate solution, preserving heat for 4-6 hours at 50-60 ℃, filtering, taking out solid, and drying to obtain manganese dioxide modified basalt;
S12: dispersing tetraethyl orthosilicate and manganese dioxide modified basalt in absolute ethyl alcohol, regulating the pH to 7-11 by ammonia water, filtering, taking out solid, and drying to obtain composite filler;
s13: and (3) adding a silane coupling agent and absolute ethyl alcohol into the composite filler, and aging for 8-10 hours at the temperature of 30-70 ℃ to obtain the modified composite filler.
More optimally, the weight portions are as follows: 110-120 parts of composite filler, 150-200 parts of absolute ethyl alcohol and 8-12 parts of silane coupling agent; the composite filler comprises the following raw materials in parts by weight: 20-30 parts of purified basalt fiber, 100-120 parts of potassium permanganate solution, 10-15 parts of tetraethyl orthosilicate and 150-200 parts of absolute ethyl alcohol; the mass ratio of tetraethyl orthosilicate to the manganese dioxide modified basalt is 1:2.
More preferably, the preparation of the purified basalt fiber comprises the following steps: soaking basalt fiber in absolute ethyl alcohol for 2-3 h, cleaning in acetone for 18-20 h, and airing for 3-4 h after suction filtration.
More preferably, the heating and curing is divided into two sections, wherein the first section is insulated for 2-3 hours at 130-140 ℃ and the second section is insulated for 4-5 hours at 50-60 ℃.
More preferably, the matrix material comprises an epoxy resin and the silane coupling agent comprises 1H, 2H-perfluorooctyl triethoxysilane.
More preferably, the matrix material is a mixture of epoxy resin, liquid crystal epoxy resin and alkylene oxide-polyethylene glycol-alkylene oxide, and the mass ratio is 8:1:1.
More optimally, the preparation method of the liquid crystal epoxy resin comprises the following steps: taking 4, 4-biphenol and epichlorohydrin, uniformly stirring, heating to 45-50 ℃, stirring for 1-2 h, adding sodium hydroxide, stirring for 10-20 min, adding tetramethyl ammonium bromide, heating to 65-75 ℃ for reacting for 5-6 h, stirring for 2-3 h at room temperature, cooling to room temperature, suction filtering, and taking out solid to obtain the liquid crystal epoxy resin.
More preferably, the liquid crystal epoxy resin is 4, 4-biphenol diglycidyl ether.
More optimally, the 4, 4-biphenol diglycidyl ether comprises the following raw materials in parts by weight: 10 to 15 parts of 4, 4-biphenol, 30 to 40 parts of epoxy chloropropane, 1 to 2 parts of sodium hydroxide and 0.01 to 0.05 part of tetramethyl ammonium bromide.
Compared with the prior art, the invention has the following beneficial effects:
(1) The manganese dioxide particles formed in situ by heating the potassium permanganate are used for modifying basalt fibers, so that the wear resistance is improved, meanwhile, the dispersibility of the basalt surfaces is improved, the uniform loading of the silica nanoparticles in the subsequent step is facilitated, the deposition effect of the silica particles is greatly improved, and the sequence of loading manganese dioxide and then loading silica is significant.
(2) The surface energy of the basalt is reduced by using tetraethyl orthosilicate to modify the basalt, so that the hydrophobic capacity of the basalt is greatly improved, and meanwhile, more coarse structures are attached to the surface of basalt fibers, so that the wear resistance is increased; the mass ratio of tetraethyl orthosilicate to the manganese dioxide modified basalt is controlled to be 1:2, the composite filler with good hydrophobicity and wear resistance can be prepared; the silane coupling agent is used for modifying the composite filler, so that the binding capacity with a matrix material is improved, and meanwhile, the basalt fiber and the epoxy resin can be subjected to surface modification to reduce the surface energy, so that the hydrophobicity is increased.
(3) The matrix material is a mixture of epoxy resin, liquid crystal epoxy resin and alkylene oxide-polyethylene glycol-alkylene oxide, and the mass ratio is 8:1:1, the liquid crystal epoxy resin has orderly molecular arrangement, excellent comprehensive performance and good heat resistance, forms a self-reinforced structure in the curing process, can solve the problem of poor toughness of the epoxy resin, has lower viscosity, can enhance the fluidity when being blended with the epoxy resin, and can reduce the mechanical performance and the corrosion resistance when being added too much; the addition of the alkylene oxide-polyethylene glycol-alkylene oxide can improve the toughness and the impact resistance of the epoxy resin, and excessive addition can lead to poor processability, so that the matrix material obtained by proportionally blending the three substances has excellent performance.
Detailed Description
The following description of the technical solutions in the embodiments of the present invention will be clear and complete, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The following examples include the following materials: basalt fiber (diameter 6mm, jiangsu Gelong basalt continuous filament Co., ltd.); ethanol (CAS: 64-17-5); acetone (CAS: 67-64-1); potassium permanganate solution (0.02 mol/L, ala-dine); tetraethyl orthosilicate (CAS: 562-90-3, guangdong Weng Jiang chemical Co., ltd.); ammonia (concentration: 99%, CAS:1336-21-6, nanjing reagent); silane coupling agents (model: 1H, 2H-perfluorooctyl triethoxysilane, sigma Aldrich trade Co., ltd.); 4, 4-biphenol (CAS: 92-88-6); epichlorohydrin (CAS: 106-89-8); sodium hydroxide (CAS: 1310-73-2); tetramethyl ammonium bromide (CAS: 64-20-0); epoxy (E51, handan korida chemical materials limited); alkylene oxide-polyethylene glycol-alkylene oxide (EPO-PEG-EPO, mw-2000, allatin); curing agent (model: polyamide 651);
The following parts are mass parts;
example 1: s1: soaking 30 parts of basalt fiber in 100 parts of absolute ethyl alcohol for 2 hours, airing, soaking in 100 parts of acetone for 20 hours, suction-filtering to remove solids, airing for 3 hours to obtain purified basalt fiber;
s2: adding 20 parts of purified basalt fiber into 100 parts of potassium permanganate solution, preserving heat for 5 hours at 50 ℃, filtering, taking out solid, and drying to obtain manganese dioxide modified basalt;
S3: dispersing 10 parts of tetraethyl orthosilicate and 20 parts of manganese dioxide modified basalt in 150 parts of absolute ethyl alcohol, regulating the pH to 7 by using ammonia water, filtering, taking out solid, and drying to obtain composite filler;
S4: taking 110 parts of composite filler, adding 10 parts of silane coupling agent and 150 parts of absolute ethyl alcohol, and aging for 10 hours at 50 ℃ to obtain modified composite filler;
S5: uniformly stirring 10 parts of 4, 4-biphenol and 30 parts of epichlorohydrin, heating to 50 ℃, stirring for 1h, stirring for 10min, adding 0.03 part of tetramethyl ammonium bromide, heating to 65 ℃ for reacting for 5h, stirring for 2h at room temperature, cooling to room temperature, and suction filtering to obtain solid, thereby obtaining 4, 4-biphenol diglycidyl ether;
S6: mixing 240 parts of epoxy resin, 30 parts of 4, 4-biphenol diglycidyl ether and 30 parts of EPO-PEG-EPO uniformly, adding 130 parts of modified composite filler, heating and mixing for 5 hours at 90 ℃, adding 180 parts of curing agent, mixing uniformly, firstly preserving heat for 2 hours at 130 ℃, and then preserving heat for 5 hours at 50 ℃ to obtain the main insulating plate of the circuit breaker.
Example 2: s1: soaking 30 parts of basalt fiber in 100 parts of absolute ethyl alcohol for 2 hours, airing, soaking in 100 parts of acetone for 20 hours, suction-filtering to remove solids, airing for 3 hours to obtain purified basalt fiber;
S2: adding 30 parts of purified basalt fiber into 100 parts of potassium permanganate solution, preserving heat for 5 hours at 50 ℃, filtering, taking out solid, and drying to obtain manganese dioxide modified basalt;
s3: 15 parts of tetraethyl orthosilicate and 30 parts of manganese dioxide modified basalt are dispersed in 150 parts of absolute ethyl alcohol, the pH value is regulated to 7 by ammonia water, the solid is filtered and taken out, and the composite filler is obtained by drying;
s4: taking 110 parts of composite filler, adding 8 parts of silane coupling agent and 150 parts of absolute ethyl alcohol, and aging for 10 hours at 50 ℃ to obtain modified composite filler;
S5: uniformly stirring 15 parts of 4, 4-biphenol and 40 parts of epichlorohydrin, heating to 50 ℃, stirring for 1h, stirring for 10min, adding 0.03 part of tetramethyl ammonium bromide, heating to 65 ℃ for reacting for 5h, stirring for 2h at room temperature, cooling to room temperature, and suction filtering to obtain solid, thereby obtaining 4, 4-biphenol diglycidyl ether;
S6: 232 parts of epoxy resin, 29 parts of 4, 4-biphenol diglycidyl ether and 29 parts of EPO-PEG-EPO are uniformly mixed, 120 parts of modified composite filler is added, after heating and mixing for 5 hours at 90 ℃, 170 parts of curing agent is added, uniformly mixed, firstly, the temperature is kept at 130 ℃ for 2 hours, and then the temperature is kept at 50 ℃ for 5 hours, so that the main insulating plate of the circuit breaker is obtained.
Example 3: s1: soaking 30 parts of basalt fiber in 100 parts of absolute ethyl alcohol for 2 hours, airing, soaking in 100 parts of acetone for 20 hours, suction-filtering to remove solids, airing for 3 hours to obtain purified basalt fiber;
s2: adding 20 parts of purified basalt fiber into 100 parts of potassium permanganate solution, preserving heat for 5 hours at 50 ℃, filtering, taking out solid, and drying to obtain manganese dioxide modified basalt;
S3: dispersing 12 parts of tetraethyl orthosilicate and 24 parts of manganese dioxide modified basalt in 150 parts of absolute ethyl alcohol, regulating the pH to 7 by using ammonia water, filtering, taking out solid, and drying to obtain composite filler;
S4: taking 110 parts of composite filler, adding 12 parts of silane coupling agent and 150 parts of absolute ethyl alcohol, and aging for 10 hours at 50 ℃ to obtain modified composite filler;
S5: taking 13 parts of 4, 4-biphenol and 35 parts of epichlorohydrin, uniformly stirring, heating to 50 ℃, stirring for 1h, stirring for 10min, adding 0.03 part of tetramethyl ammonium bromide, heating to 65 ℃ for reacting for 5h, stirring for 2h at room temperature, cooling to room temperature, and suction filtering to obtain solid, thereby obtaining 4, 4-biphenol diglycidyl ether;
s6: uniformly mixing 248 parts of epoxy resin, 31 parts of 4, 4-biphenol diglycidyl ether and 31 parts of EPO-PEG-EPO, adding 140 parts of composite filler, heating and mixing at 90 ℃ for 5 hours, adding 190 parts of curing agent, uniformly mixing, firstly preserving heat at 130 ℃ for 2 hours, and then preserving heat at 50 ℃ for 5 hours to obtain the main insulating plate of the circuit breaker.
Comparative example 1 (silica supported followed by manganese dioxide, remaining process steps are identical to example 1): s1: soaking 30 parts of basalt fiber in 100 parts of absolute ethyl alcohol for 2 hours, airing, soaking in 100 parts of acetone for 20 hours, suction-filtering to remove solids, airing for 3 hours to obtain purified basalt fiber;
S2: dispersing 10 parts of tetraethyl orthosilicate and 20 parts of purified basalt fibers in 150 parts of absolute ethyl alcohol, regulating the pH to 7 by using ammonia water, filtering, taking out solid, and drying to obtain silica modified basalt;
S3: adding 20 parts of silicon dioxide modified basalt into 100 parts of potassium permanganate solution, preserving heat for 5 hours at 50 ℃, filtering, taking out solid, and drying to obtain composite filler;
S4: taking 110 parts of composite filler, adding 10 parts of silane coupling agent and 150 parts of absolute ethyl alcohol, and aging for 10 hours at 50 ℃ to obtain modified composite filler;
S5: uniformly stirring 10 parts of 4, 4-biphenol and 30 parts of epichlorohydrin, heating to 50 ℃, stirring for 1h, stirring for 10min, adding 0.03 part of tetramethyl ammonium bromide, heating to 65 ℃ for reacting for 5h, stirring for 2h at room temperature, cooling to room temperature, and suction filtering to obtain solid, thereby obtaining 4, 4-biphenol diglycidyl ether;
S6: mixing 240 parts of epoxy resin, 30 parts of 4, 4-biphenol diglycidyl ether and 30 parts of EPO-PEG-EPO uniformly, adding 130 parts of modified composite filler, heating and mixing for 5 hours at 90 ℃, adding 180 parts of curing agent, mixing uniformly, firstly preserving heat for 2 hours at 130 ℃, and then preserving heat for 5 hours at 50 ℃ to obtain the main insulating plate of the circuit breaker.
Comparative example 2 (varying the mass ratio of tetraethyl orthosilicate to manganese dioxide modified basalt, the remaining process steps being identical to example 1): s1: soaking 30 parts of basalt fiber in 100 parts of absolute ethyl alcohol for 2 hours, airing, soaking in 100 parts of acetone for 20 hours, suction-filtering to remove solids, airing for 3 hours to obtain purified basalt fiber;
s2: adding 20 parts of purified basalt fiber into 100 parts of potassium permanganate solution, preserving heat for 5 hours at 50 ℃, filtering, taking out solid, and drying to obtain manganese dioxide modified basalt;
s3: dispersing 20 parts of tetraethyl orthosilicate and 20 parts of manganese dioxide modified basalt in 150 parts of absolute ethyl alcohol, regulating the pH to 7 by using ammonia water, filtering, taking out solid, and drying to obtain composite filler;
S4: taking 110 parts of composite filler, adding 10 parts of silane coupling agent and 150 parts of absolute ethyl alcohol, and aging for 10 hours at 50 ℃ to obtain modified composite filler;
S5: uniformly stirring 10 parts of 4, 4-biphenol and 30 parts of epichlorohydrin, heating to 50 ℃, stirring for 1h, stirring for 10min, adding 0.03 part of tetramethyl ammonium bromide, heating to 65 ℃ for reacting for 5h, stirring for 2h at room temperature, cooling to room temperature, and suction filtering to obtain solid, thereby obtaining 4, 4-biphenol diglycidyl ether;
S6: mixing 240 parts of epoxy resin, 30 parts of 4, 4-biphenol diglycidyl ether and 30 parts of EPO-PEG-EPO uniformly, adding 130 parts of modified composite filler, heating and mixing for 5 hours at 90 ℃, adding 180 parts of curing agent, mixing uniformly, firstly preserving heat for 2 hours at 130 ℃, and then preserving heat for 5 hours at 50 ℃ to obtain the main insulating plate of the circuit breaker.
Comparative example 3 (epoxy resin as matrix material, the remaining process steps are identical to example 1): s1: soaking 30 parts of basalt fiber in 100 parts of absolute ethyl alcohol for 2 hours, airing, soaking in 100 parts of acetone for 20 hours, suction-filtering to remove solids, airing for 3 hours to obtain purified basalt fiber;
s2: adding 20 parts of purified basalt fiber into 100 parts of potassium permanganate solution, preserving heat for 5 hours at 50 ℃, filtering, taking out solid, and drying to obtain manganese dioxide modified basalt;
S3: dispersing 10 parts of tetraethyl orthosilicate and 20 parts of manganese dioxide modified basalt in 150 parts of absolute ethyl alcohol, regulating the pH to 7 by using ammonia water, filtering, taking out solid, and drying to obtain composite filler;
S4: taking 110 parts of composite filler, adding 10 parts of silane coupling agent and 150 parts of absolute ethyl alcohol, and aging for 10 hours at 50 ℃ to obtain modified composite filler;
S5: uniformly stirring 10 parts of 4, 4-biphenol and 30 parts of epichlorohydrin, heating to 50 ℃, stirring for 1h, stirring for 10min, adding 0.03 part of tetramethyl ammonium bromide, heating to 65 ℃ for reacting for 5h, stirring for 2h at room temperature, cooling to room temperature, and suction filtering to obtain solid, thereby obtaining 4, 4-biphenol diglycidyl ether;
S6: 300 parts of epoxy resin, 210 parts of modified composite filler and 180 parts of curing agent are added after heating and mixing for 5 hours at 90 ℃, and the mixture is uniformly mixed, and is firstly subjected to heat preservation at 130 ℃ for 2 hours and then subjected to heat preservation at 50 ℃ for 5 hours, so that the main insulating plate of the circuit breaker is obtained.
Comparative example 4 (changing the mass ratio in the matrix material, the remaining process steps are identical to example 1): s1: soaking 30 parts of basalt fiber in 100 parts of absolute ethyl alcohol for 2 hours, airing, soaking in 100 parts of acetone for 20 hours, suction-filtering to remove solids, airing for 3 hours to obtain purified basalt fiber;
s2: adding 20 parts of purified basalt fiber into 100 parts of potassium permanganate solution, preserving heat for 5 hours at 50 ℃, filtering, taking out solid, and drying to obtain manganese dioxide modified basalt;
S3: dispersing 10 parts of tetraethyl orthosilicate and 20 parts of manganese dioxide modified basalt in 150 parts of absolute ethyl alcohol, regulating the pH to 7 by using ammonia water, filtering, taking out solid, and drying to obtain composite filler;
S4: taking 110 parts of composite filler, adding 10 parts of silane coupling agent and 150 parts of absolute ethyl alcohol, and aging for 10 hours at 50 ℃ to obtain modified composite filler;
S5: uniformly stirring 10 parts of 4, 4-biphenol and 30 parts of epichlorohydrin, heating to 50 ℃, stirring for 1h, stirring for 10min, adding 0.03 part of tetramethyl ammonium bromide, heating to 65 ℃ for reacting for 5h, stirring for 2h at room temperature, cooling to room temperature, and suction filtering to obtain solid, thereby obtaining 4, 4-biphenol diglycidyl ether;
S6: mixing 150 parts of epoxy resin, 100 parts of 4, 4-biphenol diglycidyl ether and 50 parts of EPO-PEG-EPO uniformly, adding 130 parts of modified composite filler, heating and mixing for 5 hours at 90 ℃, adding 180 parts of curing agent, mixing uniformly, firstly preserving heat for 2 hours at 130 ℃, and then preserving heat for 5 hours at 50 ℃ to obtain the main insulating plate of the circuit breaker.
Experiment: taking the main insulating plates of the circuit-breaking insulators obtained in examples 1 to 3 and comparative examples 1 to 4, (1) testing the water contact angle of the surface of the main insulating plate of the circuit-breaking insulator by using a SL200B type contact angle meter; (2) Wear resistance test was performed using a UMT-3 frictional wear tester, and the coefficient of friction was measured under the following conditions: loading 50N for 10min at a frequency of 3.3Hz; (3) Tensile strength is tested according to GB/T2567-2008 standard, and the stretching speed is 10mm/min; the specific results are shown in the following table;
Conclusion: as can be seen from the above table, example 1 is the best mode; from comparative example 1, it can be seen that when basalt fiber is modified, manganese dioxide is loaded on the surface of basalt fiber, and then silicon dioxide is loaded on the surface of basalt fiber, wherein manganese dioxide can improve the dispersibility of basalt surface, is beneficial to uniform loading of silicon dioxide nanoparticles, can greatly improve the deposition effect of silicon dioxide particles, and can not obtain filler with excellent performance when directly loading silicon dioxide; from comparative example 2, increasing the amount of tetraethyl orthosilicate resulted in a decrease in material properties, and it can be seen that the importance of the ratio defined by the present invention; as is clear from comparative examples 3 and 4, the toughness of the matrix material is poor when only epoxy resin is used, and the material performance can be improved by blending epoxy resin, liquid crystal epoxy resin and EPO-PEG-EPO according to a certain mass ratio.
In conclusion, the scheme provided by the invention can prepare the super-hydrophobic circuit breaker insulator main insulating plate with good wear resistance.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. A preparation method of a main insulating plate of a super-hydrophobic circuit breaker is characterized by comprising the following steps: the method comprises the following steps:
S1: sequentially using potassium permanganate solution and tetraethyl orthosilicate to modify and clean basalt fiber to obtain composite filler; adding a silane coupling agent and absolute ethyl alcohol, and aging for 8-10 hours at 30-70 ℃ to obtain modified composite filler;
S2: adding the modified composite filler into a matrix material, heating for 5-6 hours at 80-90 ℃, adding a curing agent, uniformly mixing, and heating and curing to obtain a main insulating plate of the circuit breaker;
The main insulating plate of the circuit breaker insulator comprises the following raw materials in parts by weight: 280-310 parts of matrix material, 170-190 parts of curing agent and 120-140 parts of modified composite filler;
the preparation of the modified composite filler comprises the following steps: s11: adding purified basalt fiber into potassium permanganate solution, preserving heat for 4-6 hours at 50-60 ℃, filtering, taking out solid, and drying to obtain manganese dioxide modified basalt;
S12: dispersing tetraethyl orthosilicate and manganese dioxide modified basalt in absolute ethyl alcohol, regulating the pH to 7-11 by ammonia water, filtering, taking out solid, and drying to obtain composite filler;
s13: adding a silane coupling agent and absolute ethyl alcohol into the composite filler, and aging for 8-10 hours at the temperature of 30-70 ℃ to obtain a modified composite filler;
The modified composite filler comprises the following raw materials in parts by weight: 110-120 parts of composite filler, 150-200 parts of absolute ethyl alcohol and 8-12 parts of silane coupling agent; the composite filler comprises the following raw materials in parts by weight: 20-30 parts of purified basalt fiber, 100-120 parts of potassium permanganate solution, 10-15 parts of tetraethyl orthosilicate and 150-200 parts of absolute ethyl alcohol; the mass ratio of tetraethyl orthosilicate to the manganese dioxide modified basalt is 1:2;
The matrix material is a mixture of epoxy resin E51, liquid crystal epoxy resin and alkylene oxide-polyethylene glycol-alkylene oxide, and the mass ratio is 8:1:1, a step of;
The preparation method of the liquid crystal epoxy resin comprises the following steps: taking 4, 4-biphenol and epichlorohydrin, uniformly stirring, heating to 45-50 ℃, stirring for 1-2 h, adding sodium hydroxide, stirring for 10-20 min, adding tetramethyl ammonium bromide, heating to 65-75 ℃ for reacting for 5-6 h, stirring for 2-3 h at room temperature, cooling to room temperature, and suction filtering to take out solid to obtain the liquid crystal epoxy resin;
The silane coupling agent comprises 1H, 2H-perfluoro octyl triethoxysilane.
2. The method for preparing the main insulating plate of the superhydrophobic circuit breaker according to claim 1, wherein the method comprises the following steps: the preparation of the purified basalt fiber comprises the following steps: soaking basalt fibers in absolute ethyl alcohol for 2-3 h, cleaning in acetone for 18-20 h, and airing for 3-4 h after suction filtration; the heating and curing process is divided into two sections, wherein the first section is insulated for 2-3 hours at 130-140 ℃ and the second section is insulated for 4-5 hours at 50-60 ℃.
3. The method for preparing the main insulating plate of the superhydrophobic circuit breaker according to claim 1, wherein the method comprises the following steps: the liquid crystal epoxy resin comprises the following raw materials in parts by weight: 10 to 15 parts of 4, 4-biphenol, 30 to 40 parts of epoxy chloropropane, 1 to 2 parts of sodium hydroxide and 0.01 to 0.05 part of tetramethyl ammonium bromide.
4. A superhydrophobic circuit-breaker insulator master insulation board prepared by the method for preparing a superhydrophobic circuit-breaker insulator master insulation board according to any one of claims 1-3.
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