CN117296211A

CN117296211A - Small-sized high-speed connector

Info

Publication number: CN117296211A
Application number: CN202280031841.1A
Authority: CN
Inventors: M·罗兰兹; J·肖博尔; A·Y·泽里比洛弗; T·恩斯明格
Original assignee: Amphenol Corp
Current assignee: Amphenol Corp
Priority date: 2021-04-30
Filing date: 2022-04-29
Publication date: 2023-12-26

Abstract

Connectors for use with high speed signals. The connector may include a leadframe assembly in a connector housing. The leadframe assemblies may include signal conductive elements and ground conductive elements arranged in a repeating pattern, and one or more wave segments attached to the ground conductive elements. The wave plate may extend more than half the length of the signal conducting element. The valleys of the wave plate may be soldered to the ground conductive element by wire bonds. The wire bond may extend over a majority of the length of the conductive element. This configuration enables accurate and repeatable signal-to-ground spacing to be established, thereby improving signal integrity, even for small (micro) connectors. Such connectors may be used to meet signal integrity requirements for connectors designed for 112GBps and beyond.

Description

Small-sized high-speed connector

RELATED APPLICATIONS

This patent application claims priority and benefit from the following applications: U.S. provisional patent application No. 63/182,739, entitled "mini-high speed CONNECTOR, high density electrical interconnect," filed on month 4 and 30 of 2021, the entire contents of which are incorporated herein by reference; and U.S. provisional patent application No. 63/228,514, entitled "mini high speed CONNECTOR," filed 8/2 at 2021, the entire contents of which are incorporated herein by reference.

Technical Field

The present application relates generally to interconnect systems for electronic devices, including electrical connectors and methods of manufacturing electrical connectors.

Background

Electrical connectors are used in many electronic systems. It is often easier and more cost-effective to manufacture the system as separate electronic subassemblies such as Printed Circuit Boards (PCBs) that can be connected together by electrical connectors. Having separable connectors enables components of electronic systems manufactured by different manufacturers to be easily assembled. The separable connector also enables components to be easily replaced after assembly of the system in order to replace defective components or upgrade the system with higher performance components.

A known arrangement for connecting several printed circuit boards is to have one printed circuit board act as a back plate. Other printed circuit boards, referred to as "daughter boards," "daughter cards," or "midplanes," may be connected by a backplane. The back plane is a printed circuit board on which a number of connectors may be mounted. Conductive traces in the backplane may be electrically connected to signal conductors in the connectors so that signals may be routed between the connectors. The daughter card may also have a connector mounted thereon. The connector mounted on the daughter card may be inserted into the connector mounted on the backplane. In this way, signals may be routed between daughter cards through the backplane. The daughter card may be inserted into the backplane at a right angle. Connectors for these applications may therefore include right angle bends, and are commonly referred to as "right angle connectors.

The connectors can also be used in other configurations to interconnect printed circuit boards. Sometimes, one or more smaller printed circuit boards may be connected to another larger printed circuit board. In this configuration, the larger printed circuit board may be referred to as a "motherboard" and the printed circuit board connected to the motherboard may be referred to as a "daughter board". In addition, circuit boards of the same size or similar sizes may sometimes be arranged in parallel. Connectors for these applications are commonly referred to as "stacked connectors" or "mezzanine connectors.

The connector may also be used to enable signals to be routed to or from the electronic device. Connectors known as "I/O connectors" may be mounted to a printed circuit board, typically at the edge of the printed circuit board. The connector may be configured as a receptacle connector that mates with a plug at one end of the cable assembly such that the cables in the cable assembly are connected to the printed circuit board through the receptacle connector. The other end of the cable may be connected to other electronic devices.

The plug and I/O receptacle connectors are typically manufactured to standards that enable mating of components from different manufacturers. For example, the four-way small form factor pluggable (QSFP) standard defines a compact hot plug transceiver for data communication applications. The form factor and electrical interface are specified by the multi-source protocol (MSA) under the initiative of the Small Form Factor (SFF) committee. Components manufactured according to the QSFP standard are widely used to interface network hardware (e.g., servers and switches) to fiber optic cables or active or passive cable assemblies.

The QSFP plug mates with a receptacle, which is typically mounted on a Printed Circuit Board (PCB). To block electromagnetic interference (EMI), the receptacle may be positioned within a metal cage that is also mounted to the PCB. The receptacle is typically positioned at the back portion of the cage. The front portion of the cage typically extends through a panel of the electronic device and has an opening for receiving a plug. A channel extends from the opening at the front portion of the cage toward the rear portion for guiding the plug into engagement with the receptacle.

In some systems, the plug may include a transceiver that converts signals between a format used within the electronic device containing the receptacle and a format for transmission over the cable. In some systems, the cable may contain an optical fiber for carrying an optical signal, and the transceiver may be an optoelectronic transceiver. A transceiver may also be provided for a cable carrying electrical signals because the signals may be amplified or converted between a signal format used on the cable and a signal format used within the device.

Over time, these standards continue to evolve to support electronic devices that transmit or receive larger amounts of data. The latest standards tend to include more channels through the connector than earlier standards. Each channel provides a path for data flows to and from the electronic device, the more channels, the more data flows supported, and the more bandwidth supported, which is represented in bits per second that can pass into and out of the device through the connector. Generally, as the number of channels increases, the components of the connector are miniaturized so that the overall size of the connector does not increase proportionally with the increase in the number of channels.

An alternative method of manufacturing connectors that support greater bandwidth is to construct connectors that can transmit bits at higher frequencies. For example, connectors that can pass frequencies up to 30GHz with a relatively low degree of distortion may pass more bits per second than connectors that can only operate at frequencies of 15 GHz.

Another way to enable connectors to support larger bandwidths is to employ modulation techniques that better utilize the available bandwidth. PAM4 is an example of a protocol for providing a larger bandwidth.

Disclosure of Invention

Aspects of the present disclosure relate to connectors for high speed signals.

In one aspect, an electrical connector includes a corrugated metal member soldered to a ground conductor.

In another aspect, an electrical connector includes a plurality of leadframe assemblies inserted into a housing. Two or more of the leadframe assemblies may be held together by clamps. The clamp may be engaged with the housing.

Some embodiments relate to a leadframe assembly. The lead frame assembly may include: a lead frame housing; a plurality of conductive elements held by the leadframe housing in a row extending along a row direction, each conductive element including a mating contact portion, a mounting portion opposite the mating contact portion, and an intermediate portion extending between the mating contact portion and the mounting portion; and one or more waveform slices comprising a plateau portion and a valley portion, wherein: the plurality of conductive elements may include a signal conductive element and a ground conductive element, and the valleys of the one or more waveform pieces may be attached to the ground conductive element.

In some embodiments, the leadframe housing may include a portion elongated in the row direction; the one or more waveform slices may include: a first sheet portion disposed adjacent to a first side of the portion of the leadframe housing elongated in the row direction; and a second sheet portion disposed adjacent to a second side of the portion of the leadframe housing elongated in the row direction, the second side being opposite the first side.

In some embodiments, the portion of the leadframe housing elongated in the row direction may have a width in a direction perpendicular to the row direction, which may not exceed 50% of a length of the intermediate portion of the conductive element.

In some embodiments, the leadframe housing may include a wider portion extending from the portion elongated in the row direction, the plurality of conductive elements may include conductive elements held by the wider portion of the leadframe housing, and the conductive elements held by the wider portion of the leadframe housing are configured for power or for signals having a lower signal frequency than the signal conductive elements.

In some embodiments, for the signal conducting element, the one or more waveform slices may extend along 50% to 99% of the length of the signal conducting element.

In some embodiments, the signal conductive elements and the ground conductive elements may be arranged in a repeating pattern, and the plateau portion of the one or more waveform slices may be aligned with the signal conductive elements between two adjacent ground conductive elements.

In some embodiments, the plateau of the one or more waveform slices may be spaced apart from the corresponding signal conductive element by a first distance along a direction perpendicular to the row, the center of the signal conductive element may be spaced apart from the edge of the corresponding adjacent ground conductive element by a second distance, and the first distance may be no greater than the second distance.

In some embodiments, the plurality of conductive elements may include conductive elements that interrupt the repeating pattern.

In some embodiments, the intermediate portions of the conductive elements may each include a first portion and a second portion separated by a transition region.

In some embodiments, the one or more waveform pieces may include a first waveform piece attached to the first portion of the middle portion of the ground conductive element and a second waveform piece attached to the second portion of the middle portion of the ground conductive element.

In some embodiments, the transition region of the ground conductor may include an aperture extending through the transition region.

In some embodiments, the second wave plate may include a member extending above and between selected mounting portions of the plurality of conductive elements.

In some embodiments, the one or more waveform pieces may include a third waveform piece attached to the first portion of the middle portion of the ground conductive element, and the third waveform piece may be separated from the first waveform piece by a portion of the leadframe housing.

In some embodiments, the third wave plate may include a member extending above and between selected mating contacts of the plurality of conductive elements.

In some embodiments, the thickness of the one or more waveform slices may be less than the thickness of the plurality of conductive elements.

In some embodiments, the one or more corrugated sheets may be made of a material having a conductivity that is lower than a conductivity of a material of the plurality of conductive elements.

In some embodiments, the valleys of the one or more wave plates may be attached to the ground conductive element by a weld.

In some embodiments, the weld may cover more than 50% of the length of the valley.

In some embodiments, the leadframe housing and the one or more wave segments may have complementary features that engage, whereby the one or more wave segments may be accurately positioned relative to the plurality of conductive elements.

In some embodiments, the valleys of the one or more wave plates may be attached to the ground conductive element at wire bonds, and each wire bond may have a length to width aspect ratio of greater than 5:1.

Some embodiments relate to an electrical connector. The electrical connector may include: a first leadframe assembly, the first leadframe assembly may include: a plurality of first conductive elements, each first conductive element including a mating contact portion, a mounting portion opposite the mating contact portion, and an intermediate portion extending between the mating contact portion and the mounting portion; and a first leadframe housing holding the plurality of first conductive elements in a first row, the first leadframe housing including a plurality of first features aligned in a row direction parallel to the first row, the plurality of first features being separated from each other by a first gap.

In some embodiments, the electrical connector may include: a second leadframe assembly stacked above the first leadframe assembly, the second leadframe assembly comprising: a plurality of second conductive elements each including a mating contact portion, a mounting portion opposite the mating contact portion, and an intermediate portion extending between the mating contact portion and the mounting portion; and a second leadframe housing holding the plurality of second conductive elements in a second row, the second leadframe housing including a plurality of second features aligned parallel to the row direction and shaped to fit in the first gap of the first leadframe housing such that the second leadframe assembly cannot move in the row direction relative to the first leadframe assembly.

In some embodiments, the first leadframe housing of the first leadframe assembly may include a third feature on one side of the first leadframe housing, the second leadframe housing of the second leadframe assembly may include a fourth feature on one side of the second leadframe housing, and the third feature of the first leadframe housing and the fourth feature of the second leadframe housing may be shaped to interlock such that the second leadframe assembly cannot move relative to the first leadframe assembly in a longitudinal direction perpendicular to the row direction.

In some embodiments, the second leadframe housing of the second leadframe assembly may include a latching feature, and the electrical connector may include a connector housing including a latching feature within the connector housing for engaging the latching feature of the second leadframe housing of the second leadframe assembly such that the second leadframe assembly cannot move relative to the first leadframe assembly in a transitional direction perpendicular to the row direction.

In some embodiments, the first leadframe assembly may include one or more first waveform pieces including a land portion and a valley portion, the valley portion of the one or more first waveform pieces being attached to a selected conductive element of the plurality of first conductive elements, the second leadframe assembly may include one or more second waveform pieces including a land portion and a valley portion, the valley portion of the one or more second waveform pieces being attached to a selected conductive element of the plurality of second conductive elements, and the one or more second waveform pieces may be separated from the one or more first waveform pieces by the plurality of first conductive elements and the plurality of second conductive elements.

In some embodiments, the electrical connector may include: a third leadframe assembly stacked above the second leadframe assembly, the third leadframe assembly comprising: a plurality of third conductive elements, each third conductive element including a mating contact portion, a mounting portion opposite the mating contact portion, and an intermediate portion extending between the mating contact portion and the mounting portion, and a third leadframe housing holding the plurality of third conductive elements in a third row, the third leadframe housing including a plurality of fifth features aligned along the row direction, the plurality of fifth features being separated from each other by a second gap.

In some embodiments, the electrical connector may include: a fourth leadframe assembly stacked above the third leadframe assembly, the fourth leadframe assembly comprising: a plurality of fourth conductive elements, each fourth conductive element including a mating contact portion, a mounting portion opposite the mating contact portion, and an intermediate portion extending between the mating contact portion and the mounting portion, and a fourth leadframe housing holding the plurality of fourth conductive elements in a fourth row, the fourth leadframe housing including a plurality of sixth features aligned parallel to the row direction and shaped to fit in the second gap of the third leadframe housing such that the fourth leadframe assembly cannot move relative to the third leadframe assembly in the row direction.

In some embodiments, the intermediate portions of the plurality of fourth conductive elements may each include two or more transition regions separating portions of the corresponding intermediate portions.

In some embodiments, the fourth leadframe assembly may include three or more wave segments each attached to a corresponding portion of the intermediate portions of the plurality of fourth conductive elements.

In some embodiments, the electrical connector may include: a housing, the housing comprising: a first side wall and a second side wall opposite to each other, a mounting surface extending between the first side wall and the second side wall and exposing mounting portions of the plurality of first conductive elements, mounting portions of the plurality of second conductive elements, mounting portions of the plurality of third conductive elements and mounting portions of the plurality of fourth conductive elements, and a mating surface extending between the first side wall and the second side wall, the mating surface comprising: a first slot exposing mating contacts of the plurality of first conductive elements and mating contacts of the plurality of second conductive elements, a second slot exposing mating contacts of the plurality of third conductive elements and mating contacts of the plurality of fourth conductive elements, and a region between the first slot and the second slot, the region including at least one opening extending through the region.

In some embodiments, the electrical connector may include a pair of prongs (fork) disposed along a diagonal of the mounting face of the housing.

In some embodiments, the connector housing may include a rear end opposite the mating face, and the electrical connector may include a shroud at the rear end of the connector housing.

In some embodiments, the mounting portions of the first plurality of conductive elements and the mounting portions of the second plurality of conductive elements may include tail portions extending in first and second directions opposite each other, the intermediate portions of the first plurality of conductive elements and the intermediate portions of the second plurality of conductive elements may each include a portion that is closer to the corresponding mounting portion than to the corresponding mating contact portion, the portion of the intermediate portions of the first plurality of conductive elements may extend at a first angle to the first direction, the portion of the intermediate portions of the second plurality of conductive elements may extend at a second angle to the second direction, and the first and second angles may be complementary.

In some embodiments, the first angle and the second angle may not be right angles.

Some embodiments relate to a leadframe assembly. The lead frame assembly may include: a leadframe housing including a first feature; a plurality of conductive elements held by the leadframe housing in rows, each conductive element including a mating contact portion, a mounting portion opposite the mating contact portion, and an intermediate portion extending between the mating contact portion and the mounting portion, the plurality of conductive elements including a signal conductive element and a ground conductive element; and a plurality of waveform pieces including a land portion provided corresponding to a signal conductive element of the plurality of conductive elements and a valley portion provided corresponding to a ground conductive element of the plurality of conductive elements, the plurality of waveform pieces including: a first wave plate disposed between distal ends of mating contacts of the plurality of conductive elements and the leadframe housing, and a second wave plate including a second feature that engages the first feature of the leadframe housing.

In some embodiments, the first feature and the second feature may be located at a central portion of the leadframe housing and a central portion of the second waveform slice.

In some embodiments, the middle portions of the conductive elements may each include a first portion and a second portion separated by a transition region, and the first wave plate may be attached to the first portion of the middle portion of the ground conductive element.

In some embodiments, the plurality of wave segments may include a third wave segment attached to a second portion of the middle portion of the ground conductive element.

In some embodiments, the third wave plate may include a member extending above and between selected mounting portions of the plurality of conductive elements.

In some embodiments, the first wave plate may include a member extending above and between selected mating contacts of the plurality of conductive elements.

In some embodiments, the one or more corrugated sheets are made of a material having a conductivity that is lower than a conductivity of a material of the plurality of conductive elements.

In some embodiments, the leadframe housing and the plurality of wave segments may have complementary features that are engageable, whereby the one or more wave segments may be accurately positioned relative to the plurality of conductive elements.

Some embodiments relate to an electrical connector. The electrical connector may include: a first leadframe assembly, the first leadframe assembly comprising: a first leadframe housing, a plurality of first conductive elements held by the first leadframe housing in a first row, each conductive element including a mating contact portion, a mounting portion opposite the mating contact portion, and an intermediate portion extending between the mating contact portion and the mounting portion, and one or more first wave segments including a land portion and a valley portion, the valley portion of the one or more first wave segments being attached to a selected conductive element of the plurality of first wave segments; a second leadframe assembly, the second leadframe assembly comprising: a second leadframe housing, and a plurality of second conductive elements held by the second leadframe housing in a second row, each conductive element including a mating contact, a mounting portion opposite the mating contact, and an intermediate portion extending between the mating contact and the mounting portion; and a first clamp holding the first and second leadframe assemblies such that the second leadframe assemblies are stacked on top of the first leadframe assemblies and the plurality of second conductive elements in the second row are parallel to the plurality of first conductive elements in the first row.

In some embodiments, the clip may include a latching feature and the electrical connector may include a connector housing including a latching feature within the connector housing that engages with the latching feature of the clip.

In some embodiments, the clip may include an annular portion that holds the first leadframe housing of the first leadframe assembly and the second leadframe housing of the second leadframe assembly, and the latching feature of the clip may extend from the annular portion.

In some embodiments, the second leadframe assembly may include one or more second wave segments including a land portion and a valley portion, the valley portion of the one or more second wave segments may be attached to selected conductive elements of the plurality of second, and the one or more second wave segments may be separated from the one or more first wave segments by the plurality of first conductive elements and the plurality of second conductive elements.

In some embodiments, the plurality of first conductive elements may include signal conductive elements and ground conductive elements, the plurality of second conductive elements may include signal conductive elements and ground conductive elements, and the second row may be offset from the first row in a direction in which the row extends such that a ground conductive element of the plurality of first ones of the first row at least partially overlaps a corresponding signal conductive element of the plurality of second ones of the second rows.

In some embodiments, the electrical connector may include: a third leadframe assembly, the third leadframe assembly comprising: a third leadframe housing, and a plurality of third conductive elements held by the third leadframe housing in a third row, each conductive element including a mating contact, a mounting portion opposite the mating contact, and an intermediate portion extending between the mating contact and the mounting portion; and a member extending between the second leadframe housing and the third leadframe housing such that the third leadframe assembly is stacked on top of the second leadframe assembly.

In some embodiments, the member may include one or more prongs.

In some embodiments, the electrical connector may include: a fourth leadframe assembly, the fourth leadframe assembly comprising: a fourth leadframe housing, and a plurality of fourth conductive elements held by the fourth leadframe housing in a fourth row, each conductive element including a mating contact, a mounting portion opposite the mating contact, and an intermediate portion extending between the mating contact and the mounting portion; and a second clamp holding the third and fourth leadframe assemblies such that the fourth leadframe assembly is stacked on top of the third leadframe assembly.

In some embodiments, the fourth leadframe assembly may include three or more wave segments each attached to a corresponding portion of the plurality of fourth intermediate portions.

Some embodiments relate to a method of manufacturing a leadframe assembly. The method may include: providing a leadframe comprising a plurality of conductive elements arranged in rows, each conductive element comprising a mating contact portion, a mounting portion opposite the mating contact portion, and an intermediate portion extending between the mating contact portion and the mounting portion; molding an insulating material over a first selected area of the intermediate portions of the plurality of conductive elements; aligning one or more sheets with a second selected area of the intermediate portion of the plurality of conductive elements; soldering a first region of the one or more sheets to a first conductive element; and welding a second region of the one or more sheets to a second conductive element, wherein the second conductive element is closer to an end of the row than the first conductive element.

In some embodiments, the one or more sheets may include a land portion and a valley portion, and the first region and the second region are valley portions.

In some embodiments, the insulating material may cover no more than 50% of the middle portion of the signal conducting element.

In some embodiments, the method may include severing the tie bar connecting one or more sheets.

In some embodiments, the method may include bending the intermediate region of the plurality of conductive elements such that a first portion and a second portion of the plurality of conductive elements are separated by a respective inflection point, the second portion extending at an acute or obtuse angle relative to the tail of the corresponding mount.

In some embodiments, the first region of the one or more pieces of sheet material may be attached to the first conductive element by wire bonds along 50% to 99% of the length of the first region.

These techniques may be used alone or in any combination. The above summary is provided by way of illustration only and is not intended to be limiting.

Drawings

The figures are not intended to be drawn to scale. In the drawings, identical or nearly identical components that are illustrated in various figures may be represented by like numerals. For simplicity, not every component may be labeled in every drawing. In the drawings:

FIG. 1A is a simplified schematic diagram of an electronic device including stacked I/O connectors within a cage, according to some embodiments.

FIG. 1B is a perspective view of an alternative embodiment of a cage for a stacked I/O connector according to some embodiments.

FIG. 1C is a perspective view of a transceiver with an integrated heat sink that may be inserted into a channel of the cage of FIG. 1B, according to some embodiments.

FIG. 2A is a front side perspective view of an I/O connector according to some embodiments.

FIG. 2B is a rear side perspective view of the I/O connector of FIG. 2A according to some embodiments.

Fig. 3 is a partially exploded view of the I/O connector of fig. 2A with the leadframe assembly removed from the housing, according to some embodiments.

Fig. 4A is a top side perspective view of the leadframe assembly of fig. 3, according to some embodiments.

Fig. 4B is a bottom side perspective view of the leadframe assembly of fig. 4A, according to some embodiments.

Fig. 4C is a partial cross-sectional view of the leadframe assembly of fig. 4A, taken along the line labeled "4C-4C" in fig. 4A, in accordance with some embodiments.

Fig. 5A is a top side perspective view of the top lead frame assembly of fig. 3, with the lead frame housing hidden, according to some embodiments.

Fig. 5B is a top perspective view of the lead frame of fig. 5A, according to some embodiments.

Fig. 5C is a top perspective view of the wave plate of fig. 5A, with the lead frame and lead frame housing hidden, according to some embodiments.

Fig. 5D is a perspective view of the waveform slices of fig. 5C from a mating interface (mating interface) according to some embodiments.

Fig. 5E is a perspective view of the waveform slices of fig. 5C from a mounting interface, according to some embodiments.

Fig. 6 is a bottom perspective view of the bottom leadframe assembly of fig. 3, with the leadframe housing hidden, according to some embodiments.

Fig. 7A is a front side perspective view of a stacked I/O connector according to some embodiments.

Fig. 7B is a rear side perspective view of the stacked I/O connector of fig. 7A, according to some embodiments.

FIG. 8 is a partially exploded view of the stacked I/O connector of FIG. 7A, according to some embodiments.

Fig. 9A is a front side perspective view of a leadframe assembly of the stacked I/O connector of fig. 8, according to some embodiments.

Fig. 9B is a side perspective view of the leadframe assembly of fig. 9A, according to some embodiments.

Fig. 10A is a front side perspective view of the leadframe assembly of fig. 9A with the leadframe housing removed, according to some embodiments.

Fig. 10B is a side perspective view of the leadframe assembly of fig. 10A, according to some embodiments.

Fig. 11A is a perspective view of a wave shaped tab of the top lead frame assembly of fig. 10A, with the tab at the mounting side removed, from the mating interface, in accordance with some embodiments.

Fig. 11B is a perspective view of a wave shaped tab of the top lead frame assembly of fig. 10A, with the tab at the mating side removed, from the mounting interface, in accordance with some embodiments.

Fig. 12A is a perspective view of an alternative embodiment of the lead frame assembly of fig. 9A, according to some embodiments.

Fig. 12B is a side perspective view of the leadframe assembly of fig. 12A, according to some embodiments.

Fig. 12C is another perspective view of the leadframe assembly of fig. 12A, according to some embodiments.

Fig. 13A is a perspective view of a portion of a wave plate of the lead frame assembly of fig. 12C, according to some embodiments.

Fig. 13B is a front perspective view of the waveform slice of fig. 13A, according to some embodiments.

Fig. 14 is a perspective view of a leadframe housing of the leadframe assembly of fig. 12C, according to some embodiments.

Detailed Description

The inventors have recognized and appreciated connector design techniques that meet electrical and mechanical requirements to support greater bandwidth through more channels and/or high frequency operation. Some of these techniques may work and miniaturize connectors that support higher frequencies in concert.

In one aspect, the electrical connector may have rows of conductive elements. The conductive elements may each have mating contacts configured for mating with complementary mating contacts of a plug or other connector. Each conductive element may also have a tail configured for mounting the connector to other structures, such as a printed circuit board or a cable. Each conductive element may also have an intermediate portion joining the mating contact portion and the tail portion.

Some of the conductive elements in each row may serve as signal conductors and other conductive elements may serve as ground conductors. In some embodiments, signal conductors or pairs of signal conductors may be arranged alternately (interleaved) with ground conductors along a row. One or more corrugated sheets (corrugated sheets) may be electrically and mechanically attached to several ground terminals in a plurality of ground conductors in a row. The wave plate may have a plateau and a valley, the valley being attached to the ground conductor. The attachment may be achieved by laser welding. In some embodiments, the attachment may be via wire bonds (line welds) along more than 50% of the length of the valleys. In some embodiments, the weld may exceed 60%, 70%, 80%, or 90% of the length of the valley. The aspect ratio of the length to the width of the wire bond may be greater than 2:1, for example, in some embodiments, greater than 5:1, greater than 10:1, or greater than 50:1.

The mechanical attachment of the wave plate to the conductive element (e.g., via a weld) may provide mechanical rigidity to the leadframe assembly even though the housing portion of the leadframe assembly is relatively small. In the case of a smaller housing portion, each signal conductor may be surrounded by air over a relatively large proportion of its length, which may reduce dielectric losses and provide a desired impedance or other desired characteristic. For high frequency signals, the support provided by the mechanical attachment of the waveform slices to the ground member is particularly important, as changes in position can result in changes in impedance, which can reduce the integrity of the signal passing through the interconnect system that includes the connector. The weld, particularly a weld extending over a large proportion of the length of the conductive element, may provide sufficient support.

In some embodiments, the signal conductors may alternate with ground conductors. The wave plate may be positioned such that the plateau is aligned with the signal conductor.

In embodiments where the connector is configured to carry high-speed differential signals, the conductive elements may constitute a repeating ground-signal (G-S) pattern or G-S-G pattern. In some embodiments, the pattern may be interrupted, for example by a conductive element configured for power or low frequency control signals. In some embodiments, the waveform slices may also be interrupted at locations where the repeating pattern of signal and ground conductors is interrupted, such that two or more waveform slices collectively span the row. Alternatively or additionally, one or more wave plates may be mechanically attached to a leadframe assembly that contains rows of conductive elements at locations where the pattern is interrupted.

In some embodiments, each row of conductive elements may be held in an insulating housing, which may be formed in an over-molding operation. In an electrical connector, one or more leadframe assemblies may be held in a housing. One or more corrugated metal sheets may be attached to each leadframe assembly. In some embodiments, the conductive elements in the leadframe assemblies may be elongated (elongated) in a direction orthogonal to the row direction. A single wave plate may span the leadframe assemblies in the row direction.

There may be a plurality of corrugated sheets attached to the ground conductors in the row that are spaced apart along the direction of elongation of the conductive element. For example, a right angle connector may have one or more inflection points (points) that cause the conductive elements to bend through an angle that positions the mating interface (mating interface) of the connector at a 90 degree angle relative to the mounting interface (mounting interface) of the connector. In some embodiments, the ground conductive elements may have holes at the inflection points, which may enable the use of less force to bend the lead frame, which may have a wider ground conductive element than the signal conductive element. Such holes may make it more likely that the conductive element will remain in place when bent. Separate wavy patches may be attached on both sides of the inflection point. Further, portions of the conductive elements may be covered by insulating portions of the housing of the lead frame, and thus the waveform pieces cannot be attached. Separate wavy patches may be attached on both sides of the inflection point. Further, the mating contact portion of the conductive element may be bent (flex), and a separate wave plate may be attached at a portion of the middle portion of the ground conductor, which may be a portion adjacent to the mating contact portion. In some embodiments, the individual wave plates may include protrusions protruding away from the leadframe housing toward mating contacts of the signal conductive elements, which may reduce signal distortion at the mating interface, thereby improving the integrity of the signals passing therethrough, even at high frequencies.

For example, in some embodiments, there may be three waveform slices along the length of the conductive element. In other embodiments, there may be more than three wave plates with a divider along the length of the conductive element. In some embodiments, the plurality of wave plates may cover substantially all of the length of the middle portion of the conductive element available for attachment. The sheet may cover at least 60% of the length of the intermediate portion of the conductive element. For example, in some embodiments, such coverage may be in excess of 70% or 80%.

In some embodiments, manufacturing techniques may be used to improve the accuracy and repeatability (reproducibility) of alignment of the waveform slices along the length of the conductive element, even if separate slices are present in the product. Ensuring consistent alignment of the wave plates along the length of the conductive elements in the leadframe assemblies avoids impedance variations and other effects that can disrupt signal integrity. In some embodiments, alignment may be achieved by stamping multiple wave plates from a single piece of metal. After stamping, the areas of the single piece of sheet metal corresponding to the individual wave pieces in the final product can be joined by tie bars. After the wave plate is soldered to the ground conductor, the tie bar may be removed. In some embodiments, the leadframe assemblies may be configured with openings that enable tools to pass through the leadframe assemblies at the locations of the tie bars so that the tie bars may be removed. Thus, the leadframe assemblies may include one or more holes through the leadframe assemblies at locations having a partition between the wave segments. Alternatively or additionally, the tie bar may be relatively thin so that it bends (e.g., when the leadframe assembly is bent at an angle) or curves (e.g., when the mating contact portion is bent). In such an embodiment, some or all of the relatively thin tie-rods may be retained.

The connector construction techniques described herein may also facilitate accurate relative positioning of conductive members within an electrical connector, which helps to maintain signal integrity even at high frequencies, even for small (micro) connectors where small deviations in the parts relative to the true position can have a significant impact on signal integrity. In some embodiments, one or more of the wave plates in the leadframe assemblies may include features that engage features in the leadframe assemblies. For example, the insulative portion of the leadframe assembly may include a locating feature, such as a slot, into which a portion of the wave plate may be inserted. When the insulating portion is accurately and reproducibly formed with respect to the ground conductor, which may occur, for example, when using an injection molding operation, engaging the shield with the locating features of the insulating portion ensures accurate positioning of the wave plate with respect to the conductive elements of the leadframe assembly.

Furthermore, regardless of the attachment technique employed, accurate and repeatable signal-to-ground positioning can be achieved using the waveform slices. The sheet formed by the wave shape can have an accurate and repeatable shape.

The signal-to-ground spacing may be established using one or more of these techniques so that it is accurate and repeatable, providing high signal integrity, even for high frequency signals. The land and land portions of the waveform slices that join the valleys may serve as the nearest ground reference for signal conductors (which may be, for example, single signal conductors or differential pairs) located between the ground conductors. By accurately forming the waveform and accurately establishing the attachment position, the shape of the area of the waveform piece between the ground conductors is established. Such accurate positioning may accurately and reproducibly establish a nearest ground reference for the signal conductors. Such a ground reference may be established over a substantial length of the conductive element to help achieve high signal integrity, even at high frequencies.

In some embodiments, the waveform slices may have different characteristics than the conductive elements in the electrical connector. For example, the wave plate may be thinner than the conductive element, and/or the wave plate may have a lower conductivity than the conductive element. In some embodiments, the waveform slices may be less than 0.12 millimeters, such as 0.1 millimeters or less, or 0.08 millimeters or less. In some embodiments, the conductive element may be at least 10% thicker than the waveform slices, or may be at least 20% thicker than the waveform slices. For example, the conductivity of the conductive element may be at least 5 times the conductivity of the waveform slices. In some embodiments, the conductivity may be, for example, at least 10 times, 20 times, or 25 times. As a specific example, the corrugated sheets may be 0.08 millimeter thick quarter hard 304 stainless steel. But in other embodiments a 301 stainless steel alloy or other alloy may be used.

In some embodiments, accurate relative positioning may be established between rows of conductive elements by a clamp that holds two or more leadframe assemblies together and/or positions the leadframe assemblies relative to the connector housing. The connector has one or more ports formed such that mating portions of the conductive elements line opposite surfaces of the opening in the housing, and different leadframe assemblies may be positioned such that mating portions of different leadframe assemblies line different sides of the opening. These lead frames may be clamped together prior to insertion into the housing. The use of a clamp can ensure a reliable and repeatable mating force when a plug is inserted into a port, even for small (micro) connectors that may have thin portions that tend to yield, even in the operating temperature range where the plastic components of the connector may tend to yield.

In some embodiments, the clip may include features such as spring fingers that engage the connector housing.

In some embodiments, accurate relative positioning between rows of conductive elements may be achieved by shaping the leadframe housing with interlocking features. When features of the leadframe housing are interlocked, the leadframe assemblies may be reliably positioned relative to each other even when subjected to forces during use. For example, such interlocking features may be used to establish the relative position of a leadframe assembly having conductive elements with mating portions lining the same slots of a connector housing. The leadframe housing may also include features such as protrusions that engage the connector housing.

These techniques may be used for I/O receptacle connectors that may be used, for example, in devices such as switches, routers, servers, and other high performance electronic devices. As shown in fig. 1A, the electronic system 100 may include an enclosure 140 that includes a panel 142 having at least one opening 144 therethrough. Electronic system 100 may also include a printed circuit board 130 within enclosure 140. The electronic system 100 may also include a cage 110. The cage 110 may be mounted to the printed circuit board 130 and may surround a connector mounted to the printed circuit board 130. The electronic system 100 may also include a fan 150. For example, the fan 150 may exhaust air from the enclosure, thereby creating an airflow 180 (fig. 1C).

In some embodiments, the cage 110 may be configured to provide shielding from electromagnetic interference. The cage 110 may be formed of any suitable metal or other conductive material and is connected to ground to shield EMI. The cage 110 may be formed from sheet metal that is bent into a suitable shape. However, some or all of the cage components may be made of other materials, such as die cast metal.

In the example shown in fig. 1A, the cage 110 may include a first passage 112. The cage 110 may include a second passage 114. The cage 110 may include a third passageway 116. In the illustrated embodiment, the second channel 114 is between the first channel 112 and the third channel 116. The first channel 112 may be adjacent to the printed circuit board 130. In this example, the first channel 112 and the third channel 116 may each be configured to receive a transceiver, each of which may mate with a connector.

The cage 110 may be defined by a conductive top wall, a conductive bottom wall, and/or conductive side walls. These walls and/or baffles inside the cage 110 may form the top and bottom walls of the channel. One or more wall members may be combined to provide shielding around each channel and transceiver that may be inserted into the channel.

According to some embodiments, the fan 150 may be positioned to flow air over the cage 110 or through the cage 110. For example, the fan 150 may be positioned to exhaust air from the enclosure 140. Fig. 1A schematically illustrates the fan 150 adjacent to the wall of the enclosure 140, but the fan 150 may be positioned in any suitable location. For example, the fan 150 may be positioned within the enclosure 140. In some embodiments, such as in rack-mounted electronic devices, the I/O connectors may be exposed in the front of the enclosure and one or more fans exhaust air from the opposite rear of the enclosure. However, it should be understood that other suitable locations may create a pressure drop to allow air to flow over the components within the electronics enclosure.

In the illustrated embodiment, the second channel 114 has a face exposed within the opening 144, the face having a honeycomb pattern of holes. The apertures may enable air to flow into the second passage 114 such that air flow through the cage 110 may enable heat generated by the transceivers within the passages 112 and 116 to be dissipated.

In some embodiments, the cage may enable the air flow to cool the transceiver mated with the stacked I/O connector without an intermediate passage (e.g., second passage 114). Fig. 1B shows such a cage 110B with passages 112B and 116B, but without intermediate passages. In this example, the cage 110B includes holes 160 in the vertical side walls of the cage and holes 162 in the top surface of the cage. Similar holes may also be included in the back 164, but are not visible in fig. 1B.

In the example of fig. 1B, channels 112B and 116B are sized to receive a transceiver with an integrated heat sink 172. Fig. 1C illustrates an exemplary transceiver 170. Transceiver 170 includes a paddle card 174 configured for insertion into a slot of a receptacle connector within the cage.

In the illustrated embodiment, the heat sink 172 includes a plurality of heat dissipating fins that extend vertically and parallel to the length of the channel into which they are inserted. The air flow along the elongated dimension of the channel may flow along the air flow direction 180 through the fins and along the fins, thereby removing heat. In the illustrated embodiment, the heat sink 172 includes a cover plate, but in some embodiments such a cover plate may not be present.

Fig. 2A-2B illustrate an electronic system 200. The electronic system 200 may include an I/O connector 300 mounted to a printed circuit board 201. Fig. 2A illustrates a front side perspective view of an I/O connector 300 according to some embodiments. Fig. 2B illustrates a rear side perspective view of an I/O connector 300 according to some embodiments. Fig. 3 illustrates a partially exploded view of an I/O connector 300, with a leadframe assembly 302 and leadframe assembly 304 removed from the housing, according to some embodiments.

The connector 300 may include a housing 202 that holds a leadframe assembly 302 and a leadframe assembly 304. The housing 202 may include side walls 204A and 204B opposite each other, and a mounting surface 208 extending between the side walls 204A and 204B and configured to face the printed circuit board 201. The mounting face 208 may have fastening features 216 configured to enhance the attachment between the connector 300 and the circuit board 201. The housing 202 may include a mating surface 206 extending between the side walls 204A and 204B. Mating face 206 may extend perpendicular to mounting face 208. Mating face 206 may include slot 210 and mating contacts 512 of leadframe assemblies 302 and 304 may be exposed from slot 210. A card (not shown), such as a paddle card or a plug connector of a transceiver, may be inserted into slot 210. The mating portion 512 may establish an electrical connection with the card by contacting pads on the card. The housing 202 may have an opening 212 for dissipating heat generated at the mating interface. The housing 202 may include a rear end 214 opposite the mating face 206. The rear end 214 may be substantially open.

The connector 300 may include a top lead frame assembly 304 and a bottom lead frame assembly 302. Each leadframe assembly may include conductive elements held by a leadframe housing in rows. The top and bottom leadframe assemblies 304, 302 may be vertically stacked and held together, for example, by clamps 306 attached on opposite sides of the leadframe housing. The clip may have an annular portion 308, and a side portion of the leadframe housing may be inserted into the annular portion 308. The clip 306 may enable the leadframe assemblies 302, 304 to be stacked together prior to insertion into the connector housing. The jig 306 also ensures a positional relationship between the components in the mounting direction. The clamp 306 may have a latching function rather than providing latching features on the housing (housing is susceptible to creep at high temperatures). The clip may be metallic and may have fingers 310 and tabs 312 extending from the annular portion 308. The fingers 310 and tabs 312 may be configured to latch onto mating features 314 within the connector housing 202.

The leadframe housing of the assemblies may be configured to hold conductive elements in each assembly in place and also to ensure a relative positional relationship between the assemblies when the assemblies are stacked. Fig. 4A illustrates a top side perspective view of leadframe assemblies 302 and 304 according to some embodiments. Fig. 4B illustrates a bottom side perspective view of leadframe assemblies 302 and 304, according to some embodiments. The leadframe housing may have protrusions 420 and 422 extending substantially parallel to the surface mount tail. When the top and bottom lead frame assemblies are stacked together, the protrusions of the respective lead frame housings are pushed against each other, and the relative positional relationship between the assemblies in the mating direction is ensured.

As shown, the leadframe housing (e.g., leadframe housing 402 of top leadframe 304, leadframe housing 408 of bottom leadframe 302) may have two portions (e.g., portions 404 and 406 of leadframe housing 402, portions 410 and 412 of leadframe housing 408) that are elongated (elongated) substantially adjacent to the mating interface and the other is elongated (elongated) substantially adjacent to the mounting interface. The width (e.g., width w) of the elongated portion of the leadframe housing may be significantly less than the length of the intermediate portion of the conductive element. In some embodiments, the width w may not exceed 50% of the length of the middle portion of the conductive element, 40% of the length of the middle portion of the conductive element, or 20% of the length of the middle portion of the conductive element. This configuration may expose a majority of the middle portion of the conductive element and shield the majority of the middle portion of the conductive element from one or more corrugated sheets (e.g., corrugated sheets 522, 524, 526). The leadframe housing may have a central portion (e.g., central portion 414) that is wider than the elongated portion. This configuration may enhance the mechanical strength of the leadframe assembly. The leadframe housing may have tabs (e.g., tabs 416) extending substantially perpendicular to adjacent portions of the intermediate portion of the conductive element. Features of the leadframe housing (e.g., central portion 414, tabs 416, extensions 418) may be aligned with complementary features of the wave plate (e.g., grooves and openings) to ensure accurate positioning of the wave plate relative to the conductive elements of the leadframe assembly.

The lead frame of the assembly may include rows (e.g., rows 542) of conductive elements 510 held by the lead frame housing. Fig. 4C illustrates a partial cross-sectional view of leadframe assemblies 302 and 304 along the line labeled "4C-4C" in fig. 4A, in accordance with some embodiments. Fig. 5A is a top perspective view of a component (part) 500 of the top leadframe assembly 304 with the leadframe housing 402 removed, according to some embodiments. Fig. 5B is a top perspective view of a leadframe 502 of the top leadframe assembly 304 according to some embodiments. Each conductive element 510 may include a mating portion 512, a mounting portion 514 opposite the mating portion 512, and an intermediate portion 516 extending between the mating portion 512 and the mounting portion 514. The intermediate portion 516 may include a first portion 538 and a second portion 540, the first portion 538 and the second portion 540 being separated by a transition 518, the transition 518 may include an inflection point. In the illustrated example, the mounting portion 514 may include tail portions configured for surface mounting to a circuit board. Other forms of contact tails may be used, such as press-fit contacts, "eye-of-the-needle" contacts.

Some of the conductive elements in each row may function as signal conductors (e.g., signal conductors 504) and other conductive elements may function as ground conductors (e.g., ground conductors 516). It should be appreciated that the ground conductor need not be connected to ground (earth ground), but is shaped to carry a reference potential, which may include ground, DC voltage, or other suitable reference potential. The shape of the "ground" or "reference" conductors may be different from the shape of the signal conductors, which are configured to provide suitable signal transmission characteristics for high frequency signals. In the illustrated embodiment, the signal conductors within a column are grouped in pairs, such pairs being positioned for edge coupling to support differential signals. In some embodiments, signal conductors or pairs of signal conductors may alternate with ground conductors along a row. The conductive elements may be in a repeating ground-signal (G-S) pattern or a G-S-G pattern. In some embodiments, the pattern may be interrupted, for example by a conductive element configured for a power supply or low frequency control signal. For example, the conductive element 508 corresponding to the wider central portion (e.g., central portion 414) of the leadframe housing may be configured for power or low frequency signals.

One or more wave plates may be mechanically attached to the lead frame containing the rows of conductive elements at the locations where the pattern is interrupted. Fig. 5C illustrates a top perspective view of the waveform slices 522, 524, 526 with the leadframe 502 removed, according to some embodiments. Fig. 5D illustrates a perspective view of the waveform slices 522, 524, 526 from the mating interface, according to some embodiments. Fig. 5E is a perspective view of the waveform slices 522, 524, 526 from the mounting interface, according to some embodiments. As shown, the waveform slices may have a plateau 532 and a valley 534 connected by a transition 536. The valleys may be attached to the ground conductors 506. The attachment may be achieved by laser welding. In some embodiments, the attachment may be via wire bonds (line bonds) along more than 50% of the length of the middle portion of the conductive element. In some embodiments, the solder area may comprise 60%, 70%, 80% or 90% of the middle portion of the conductive element.

The one or more corrugated sheets may extend substantially along the length of the intermediate portion of the conductive element. This configuration enables shielding of the signal conductors in a manner similar to shielding of the conductors of coaxial or twinax cables, enabling the connector to operate at high frequencies with high performance. In the illustrated example, the top lead frame assembly 304 includes three wave plates 522, 524, and 526. A first wave plate 522 is between the first portion 404 of the leadframe housing 402 and the transition region 518 of the conductive element. The second wave plate 524 is between the transition 518 of the conductive element and the mounting interface. The third waveform piece 526 is adjacent to the mounting interface.

The inventors have recognized and appreciated a tradeoff between the number of valleys and the consistency (uniformity) of the waveform slices. In the illustrated example, the central portion of the waveform slices has no valleys, thereby improving manufacturing uniformity. On the other hand, the central portions of the second and third wave plates include protrusions 528 and 530 extending between adjacent central conductive elements. The protrusions 528 and 530 may provide shielding at mating interfaces and mounting interfaces where crosstalk may be more severe. In some embodiments, the protrusions 528 and 530 may also be tie bars that connect the waveform piece 526 to the strap prior to severing the tie bars from the strap.

The wave plates 522, 524, 526 may be made of a conductive material or a lossy material such that the ground conductors are electrically coupled through the wave plates 522, 524, 526. In some embodiments, the corrugated sheets may be made of stainless steel, which may be easier to laser weld than copper, but less conductive than copper, making the stainless steel function more like a lossy material.

The inventors have recognized and appreciated a method of consistently manufacturing wave plates in a connector. In some embodiments, the method may begin by providing a leadframe that includes a plurality of conductive elements (e.g., conductive elements 510) arranged in a row (e.g., row 542). The method may include molding an insulating material over a first selected area of the middle portion of the conductive element, such as molding leadframe housings 402 and 408 over corresponding leadframes. The method may include providing a waveform slice. In some embodiments, the wave plate may be stamped from a sheet material. The sheet material may be flat prior to stamping. The sheet material may be, but need not be, stretchable. If there are multiple waveform pieces, they can be punched simultaneously and held on the strip.

The sheet may have openings and/or recesses that mate with alignment features, such as tabs, of the leadframe housing. The method may include aligning the sheet with the second selected area of the middle portion of the conductive element by aligning the opening 550 and/or recess of the sheet with an alignment feature of the leadframe housing (e.g., tab 416 or tab 450), thereby providing for greater repeatability of the manufacturing process. In some embodiments, a central portion of the sheet may first be soldered to a corresponding central ground conductor located at the first valley 546. Subsequently, the platform 532 of the side of the sheet may be secured in place as the valley 534 of the side of the sheet is soldered to the corresponding ground conductor. After the welding is completed, the sheet may be cut from the strip.

Fig. 6 is a bottom perspective view of a component 600 of the bottom leadframe assembly 302 with the leadframe housing 408 removed, according to some embodiments. The bottom leadframe assembly 302 may include a plurality of conductive elements arranged in rows 642. The bottom lead frame assembly 302 may be configured in a similar manner as the top lead frame assembly 304. On the other hand, in the illustrated example, the wave plates 522, 524, 526 of the top lead frame assembly 304 are located on the top surface of the top assembly, while the wave plates 622, 624, 626 of the bottom lead frame assembly 302 are located on the bottom surface of the bottom assembly. This configuration achieves miniaturization of the connector. In some embodiments, the leadframe assemblies may have wave segments on both the top and bottom surfaces.

The conductive elements of the bottom lead frame assembly row 642 may be offset (offset) from the conductive elements of the top lead frame assembly 304 row 542 in the direction of extension in which the rows 542 and 642 extend such that the ground conductive elements 506 in the row 642 at least partially overlap with the corresponding signal conductive elements 604 in the row 542, and vice versa. One example is shown in fig. 4C, which shows a partial cross-sectional view of leadframe assemblies 302 and 304 along the line labeled "4C-4C" in fig. 4A.

The shape of the wave plate may be designed such that the plateau may be used as the nearest ground reference for the corresponding signal conductor. In the example shown in fig. 4A, the plateau of the waveform slices 526 is spaced apart from the corresponding signal conductive elements by a first distance d1 in a direction perpendicular to the rows 542. The centers of the signal conductive elements are spaced apart from the edges of the corresponding adjacent ground conductive elements by a second distance d2. The first distance d1 may be configured to be not greater than the second distance d2. In some embodiments, the first spacing d1 may be equal to the second spacing d2, which enables shielding of the signal conductors in a manner similar to shielding of the conductors of a coaxial cable or a dual coaxial cable to enable the connector to operate at high frequencies with high performance. It should be appreciated that although the platform 532 is shown as being aligned with a pair of signal conductors 504, the platform of the wave shield may be configured to be aligned with a single signal conductor.

Some I/O receptacle connectors may have multiple ports, each of which may mate with a plug connector. When the port stacks are stacked one above the other, the I/O connectors may be referred to as "stacked" connectors. Fig. 7A illustrates a front side perspective view of a stacked I/O connector 700, according to some embodiments. Fig. 7B illustrates a rear side perspective view of a stacked I/O connector 700, according to some embodiments. Fig. 8 illustrates a partially exploded view of a stacked I/O connector 700, according to some embodiments. In this example, connector 700 is a stacked surface mount connector configured to mate with two transceivers inserted into two slots 710 and 720, one above the other of the two slots 710 and 720. As shown, the connector 700 may have a housing 722. The housing 722 may have a heat sink 702 between the two slots 710 and 720. A sleeve 704 may be attached to the rear of the housing. The sleeve 704 may be made of metal to enhance the rigidity of the housing 722. The sleeve 704 may include an opening 706 such that heat may be able to be dissipated via the opening 706. The connector may include four leadframe assemblies 708, 710, 712, and 714 vertically stacked. The first component 708 and the second component 710 are configured to receive a transceiver from a lower slot 710. Third component 712 and fourth component 714 are configured to receive transceivers from higher slots 720. The materials and techniques described above may be used to fabricate the leadframe assemblies 708, 710, 712, and 714.

Fig. 9A illustrates a front side perspective view of leadframe assemblies 708, 710, 712, and 714 of a stacked I/O connector 700 according to some embodiments. Fig. 9B illustrates a side view of leadframe assemblies 708, 710, 712, and 714, according to some embodiments. As shown, the first component 708 and the second component 710 may be configured in a similar manner as the components 302 and 304 of fig. 4A-4B. The third component 712 and the fourth component 714 may also be similarly configured, but with features adapted to be stacked on top of the first component 708 and the second component 710. The connector may include a member 716, the member 716 extending between the leadframe housings of the second and third assemblies 710, 712 such that when the leadframe assemblies 712 are stacked above the leadframe assemblies 710. The protrusions of the second and third leadframe housings may push against the members 716, which ensures a positional relationship between the components in the mating direction. The member 716 may include a fastening feature such as a fork 718 configured for mounting to a circuit board.

Fig. 10A illustrates a front side perspective view of a portion 1000 of leadframe assemblies 708, 710, 712, and 714 with leadframe housings removed, according to some embodiments. Fig. 10B is a side perspective view of a component 1000 of leadframe assemblies 708, 710, 712, and 714 according to some embodiments. Fig. 11A is a perspective view of a wave shaped sheet of third and fourth leadframe assemblies 712, 714 from a mating interface, with the sheet at the mounting side removed, according to some embodiments. Fig. 11B is a perspective view of a wave shaped sheet of third and fourth leadframe assemblies 712, 714 from a mounting interface, with the sheet at the mounting side removed, according to some embodiments.

In the illustrated example, the leadframe assemblies 708, 710, 712, and 714 include leadframes 720, 722, 724, and 726, respectively. Similar to leadframe 502 of fig. 5B, leadframes 720, 722, 724, and 726 may each include a plurality of conductive elements arranged in rows. Each conductive element may include a mating contact 772, a mounting portion 774 opposite the mating contact 772, and an intermediate portion 776 extending between the mating contact 772 and the mounting portion 774.

The intermediate portions 776 may each include two or more portions separated by one or more transition regions 770. Each portion of the intermediate portion may have a corresponding wave patch. In the illustrated example, the lead frame 720 has three wave plates 732, 734, and 726; leadframe 722 has three wave plates 742, 744, and 746; leadframe 724 has three waveform slices 752, 754, and 756; the lead frame 726 has four wavy sheets 762, 764, 766, and 768. For each leadframe assembly, the corresponding wave segments may together cover substantially all of the length of the intermediate portion of the conductive element. In some embodiments, the respective wave plates may together cover at least 60% of the length of the middle portion of the conductive element. For example, in some embodiments, such coverage may be more than 70% or more than 80%.

The mounting portion 774 may include tail portions configured for surface mounting to a circuit board. The tail portions of the leadframe assemblies 720 and 722 may extend in first and second directions opposite each other. The first direction and the second direction may be parallel to a surface of the circuit board. In the illustrated example, a portion 778 of the middle portion of the conductive element of the leadframe 720 may extend at a first angle α from the first direction. The portion 780 of the middle portion of the conductive element of the leadframe 722 may extend at a second angle β to the second direction. The first angle α and the second angle β may be complementary angles such that a portion of the middle portion of the conductive element of the lead frame 720 is parallel to a portion of the middle portion of the conductive element of the lead frame 722. Additionally or alternatively, the second angle β may be an obtuse angle such that the area of the portion of the middle portion of the conductive element of the leadframe 720 is greater than if the second angle β were a right angle. Making the area facing the rear of the connector housing larger may promote heat dissipation.

Fig. 12A illustrates a perspective view of an alternative embodiment of the leadframe assemblies 708, 710, 712, and 714 illustrated in fig. 9A, according to some embodiments. As shown, the connector may include vertically stacked leadframe assemblies 1208, 1210, 1212, and 1214, and a pair of prongs 1218, which may be disposed near diagonal corners of the mounting face of the housing 722. Fig. 12B is a side perspective view of leadframe assemblies 1208, 1210, 1212, and 1214. Fig. 12C is another perspective view of leadframe assemblies 1208, 1210, 1212, and 1214, according to some embodiments.

Leadframe assemblies 1208, 1210, 1212, and 1214 may include waveform slices corresponding to the waveform slices shown in fig. 10B. It should be understood that not all waveform masks are labeled with reference numerals in fig. 12C, but this should not limit aspects of the disclosure. In the illustrated example, the lead frame assembly 1212 includes a wave shield 1256, which wave shield 1256 may correspond to the wave shield 756 in fig. 10B. Leadframe assembly 1214 includes a wave shield 1266 and a wave shield 1268, which wave shield 1266 may correspond to wave shield 766 in fig. 10B, and which wave shield 1268 may correspond to wave shields 762 and 768 in fig. 10B. Fig. 13A shows a perspective view of a wave plate 1256 of the leadframe assembly 1212 and a wave plate 1266 of the leadframe assembly 1214. Fig. 13B shows a front perspective view of waveform pieces 1256 and 1266. The lands 1302 of the waveform slices 1256 and 1266 may extend beyond the valleys 1304 and away from the corresponding leadframe housings 1222 and 1224 toward mating contacts of the conductive elements. This configuration may reduce signal distortion at the mating interface, thereby improving the integrity of the passing signal, even at high frequencies.

As shown in fig. 12C, the leadframe assembly 1214 may include a housing member 1270 having features that facilitate accurate alignment of the wave shield 1268 with the conductive elements of the leadframe assembly 1214. As shown, the housing member 1270 may be characterized by a protrusion at a central portion (along the row direction) of the leadframe assemblies 1214. In addition, some of the protrusions may be substantially aligned with the grounded conductive element of the leadframe assembly 1214. The ground conductive elements may be wider than the signal conductive elements and may include apertures 1274 in their transition regions. Such holes may facilitate bending the lead frame to form the transition region. For example, such apertures may enable the transition zone to more accurately maintain a desired angle.

Referring back to fig. 12B, leadframe assemblies 1208, 1210, 1212, and 1214 may include leadframe housings 1202, 1204, 1222, and 1224, respectively. The shape of the leadframe housing may be designed to establish accurate relative positioning between rows of conductive elements. Fig. 14 shows perspective views of leadframe housings 1202, 1204, 1222, and 1224 of leadframe assemblies 1208, 1210, 1212, and 1214.

As shown, the leadframe housing 1222 may include features 1402 aligned parallel to the row direction and separated from each other by gaps 1404. Leadframe housing 1224 may include features 1406 aligned parallel to the row direction and separated from each other by gaps 1408. Features 1406 of leadframe housing 1224 may be shaped to fit within gaps 1404 of leadframe housing 1222. The features 1402 of the leadframe housing 1222 may be shaped to fit in the gaps 1408 of the leadframe housing 1224. In this way, features of adjacent leadframe assemblies may be interlocked to maintain the leadframe assemblies in a desired position relative to one another. This configuration ensures that the leadframe assemblies 1212 and 1214 cannot move relative to each other in the row direction.

The leadframe housing 1222 may include features 1410 on one side of the leadframe housing 1222. Leadframe housing 1224 may include features 1412 on one side of leadframe housing 1224. The features 1410 of the leadframe housing 1222 and the features 1412 of the leadframe housing 1224 may be shaped to mate with each other such that the leadframe assemblies 1212 and 1214 cannot move relative to each other in a longitudinal direction perpendicular to the row direction. Leadframe housing 1224 may include latching features 1414. The connector housing 722 may include latching features within the connector housing to engage with latching features 1414 of the leadframe housing 1224 such that the leadframe assemblies 1214 cannot move relative to the leadframe assemblies 1212 in a transitional direction perpendicular to the row direction.

It should be appreciated that the techniques of leadframe assemblies 708, 710, 712, and 714 shown in fig. 9A and the techniques of leadframe assemblies 1208, 1210, 1212, and 1214 shown in fig. 12A may be used alone or in any suitable combination. The present disclosure should not be limited in these respects.

The foregoing description of various embodiments is provided for the purpose of illustration only and other embodiments, modifications, and equivalents are within the scope of the invention as set forth in the claims below. For example, the techniques described herein may be used together or in any combination to provide a connector that delivers high frequency signals, such as a connector that delivers signals above 40Gbps using the NRZ protocol or 50Gbps using the PAM4 protocol. For example, the connector may transmit signals at these frequencies with less than 6% near-end and/or far-end crosstalk and/or less than-20 dB attenuation. However, in other embodiments, the operating frequency range of the connector may be higher.

Having thus described a number of embodiments, it is to be appreciated various alterations, modifications, and improvements will readily occur to those skilled in the art. Such alterations, modifications, and improvements are intended to be within the spirit and scope of the invention. Accordingly, the foregoing description and drawings are by way of example only.

Various modifications may be made to the exemplary structures shown and described herein. As a specific example of a possible variation, embodiments are described herein in which the connection between the transceiver and the connector is an electrical connection. Embodiments in which the connection is an optical connection may also be employed.

For example, a lossy material such as a lossy plastic may be molded over, plated over, adhered to, or otherwise electrically coupled to the waveform plate and/or the ground conductor.

Such materials may be considered lossy: the material will interact with the material to dissipate a sufficient portion of the electromagnetic energy that significantly affects the performance of the connector. The important effects are caused by attenuation in the frequency range of interest to the connector. In some configurations, the lossy material may suppress resonance within the ground structure of the connector, and the frequency range of interest may include the natural frequency of the resonant structure without the lossy material in place. In other configurations, the frequency range of interest may be all or part of the operating frequency range of the connector.

To test whether a material is lossy, the material may be tested in a frequency range that can be less than or different from the frequency range that is of interest to the connector in which the material is used. For example, the test frequency may range from 10GHz to 25GHz. Alternatively, the lossy material may be identified from measurements made at a single frequency, such as 15 GHz.

The losses may be caused by interactions of the electric field component of the electromagnetic energy with the material, in which case the material may be referred to as electrically lossy. Alternatively or additionally, the loss may be caused by an interaction of a magnetic field component of electromagnetic energy with a material, in which case the material may be referred to as magnetically lossy.

The electrically lossy material can be formed from lossy dielectric material and/or poorly conductive material. The electrically lossy material can be formed from materials conventionally considered dielectric materials, such as those having an electrical loss tangent (electric loss tangent) greater than about 0.01, greater than 0.05, or between 0.01 and 0.2 over the frequency range of interest. The "electrical loss tangent" is the ratio of the imaginary part to the real part of the complex dielectric constant of a material.

Electrically lossy materials can also be formed from materials that are generally considered conductors, but are relatively poor conductors in the frequency range of interest. These materials may be conductive in the frequency range of interest, but with some loss, such that the material is less conductive than the conductors of the electrical connector, but better than the insulator used in the connector. Such materials may comprise conductive particles or regions that are sufficiently dispersed such that they do not provide high conductivity, or that are otherwise prepared to have such properties: this property results in a relatively weak bulk conductivity compared to a good conductor such as copper in the frequency range of interest. For example, die cast metal or poorly conductive metal alloys may provide adequate loss in certain configurations.

Electrically lossy materials of this type typically have bulk conductivities of about 1 siemens/meter to about 100,000 siemens/meter, or about 1 siemens/meter to about 30,000 siemens/meter, or 1 siemens/meter to about 10,000 siemens/meter. In some embodiments, materials having bulk conductivities between about 1 siemens/meter and about 500 siemens/meter may be used. As a specific example, a material having a conductivity between about 50 siemens/meter and 300 siemens/meter may be used. However, it should be appreciated that the conductivity of the material may be selected empirically or through electrical simulation using known simulation tools to determine the conductivity that provides the appropriate Signal Integrity (SI) characteristics in the connector. For example, the SI characteristic measured or simulated may be low crosstalk combined with low signal path attenuation or insertion loss, or low insertion loss bias as a function of frequency.

It should also be appreciated that the lossy member need not have uniform properties throughout its volume. For example, the lossy member may have, for example, an insulating skin or a conductive core. A component may be identified as lossy if its properties are, on average, sufficient to attenuate electromagnetic energy in the region of interaction with the electromagnetic energy.

In some embodiments, the lossy material is formed by adding a filler comprising particles to the binder. In such embodiments, the lossy member may be formed by molding or otherwise shaping the binder with filler into a desired form. The lossy material may be molded over and/or through openings in the conductors, which may be ground conductors or shields of the connector. Molding the lossy material over or through the openings in the conductor may ensure intimate contact between the lossy material and the conductor, which may reduce the likelihood that the conductor will support resonance at frequencies of interest. Such intimate contact may, but need not, result in ohmic contact between the lossy material and the conductor.

Alternatively or additionally, the lossy material may be molded over or injected into the insulating material, for example in a two shot molding operation, or vice versa. The lossy material may be positioned against or sufficiently close to the ground conductor to provide significant coupling with the ground conductor. Close contact does not require electrical coupling between the lossy material and the conductor, as sufficient electrical coupling, such as capacitive coupling, between the lossy member and the conductor can produce the desired result. For example, in some cases, a coupling of 100pF between the lossy member and the ground conductor may have a significant effect on suppressing resonance in the ground conductor. In other examples employing frequencies in the range of about 10GHz or greater, the reduction in electromagnetic energy in the conductor may be provided by a sufficient capacitive coupling between the lossy material and the conductor having a mutual capacitance of at least about 0.005pF, such as a mutual capacitance in the range of about 0.01pF to about 100pF, about 0.01pF to about 10pF, or about 0.01pF to about 1 pF. To determine whether the lossy material is coupled to the conductor, the coupling may be measured at a test frequency such as 15GHz or in a test range such as 10GHz to 25 GHz.

To form the electrically lossy material, the filler can be conductive particles. Examples of conductive particles that may be used as fillers to form electrically lossy materials include carbon or graphite formed as fibers, flakes, nanoparticles, or other types of particles. Various forms of fibers may be used, either in woven or nonwoven form, coated or uncoated. Nonwoven carbon fibers are one suitable material. Metals in the form of powders, flakes, fibers or other particles may also be used to provide suitable electrical loss characteristics. Alternatively, combinations of fillers may be used. For example, metal plated carbon particles may be used. Silver and nickel are suitable metal coatings for the fibers. The coated particles may be used alone or in combination with other fillers such as carbon flakes.

Preferably, the filler will be present in a volume percentage sufficient to allow formation of a conductive path from particle to particle. For example, when metal fibers are used, the fibers may be present at about 3% to 40% by volume. The amount of filler can affect the conductive properties of the material.

The binder or matrix may be any material that will solidify to position the filler, cure to position the filler, or can be otherwise used to position the filler. In some embodiments, the bonding agent may be a thermoplastic material conventionally used in the manufacture of electrical connectors to facilitate molding the electrically lossy material into a desired shape and into a desired location as part of the manufacture of the electrical connector. Examples of such materials include Liquid Crystal Polymers (LCP) and nylon. However, many alternative forms of binder materials may be used. Curable materials such as epoxy resins may be used as the binder. Alternatively, a material such as a thermosetting resin or an adhesive may be used.

While the binder materials described above may be used to form electrically lossy materials by forming a binder around the conductive particulate filler, other binders or other ways of forming lossy materials may be used. In some examples, the conductive particles may be impregnated into the formed matrix material or may be coated onto the formed matrix material, such as by applying a conductive coating to a plastic or metal part. As used herein, the term "binder" includes materials that encapsulate, impregnate, or otherwise act as a substrate to hold a filler.

For example, the magnetically lossy material may be formed from materials conventionally considered ferromagnetic materials, such as those having a magnetic loss tangent (magnetic loss tangent) greater than about 0.05 over a range of frequencies of interest. The "magnetic loss tangent" is the ratio of the imaginary part to the real part of the complex dielectric constant of a material. Materials with higher loss tangent values may also be used.

In some embodiments, the magnetically lossy material may be formed from a binder or matrix material filled with particles that provide magnetically lossy properties to the layer. The magnetically lossy particles can be in any convenient form, such as flakes or fibers. Ferrite is a common magnetically lossy material. Materials such as magnesium ferrite, nickel ferrite, lithium ferrite, yttrium garnet, or aluminum garnet may be used. In the frequency range of interest, ferrites generally have a magnetic loss tangent of greater than 0.1. Presently preferred ferrite materials have a loss tangent between about 0.1 and 1.0 in the frequency range of 1GHz to 3GHz, and more preferably have a magnetic loss tangent above 0.5 in this frequency range.

The actual magnetically lossy material or mixtures containing magnetically lossy material may also exhibit dielectric or conductive loss effects of useful magnitude over portions of the frequency range of interest. Similar to the manner in which the electrically lossy material can be formed as described above, suitable materials can be formed by adding a filler to the binder that produces magnetic losses.

The material may be both a lossy dielectric or a lossy conductor and a magnetically lossy material. Such materials may be formed, for example, by using partially conductive magnetically lossy fillers or by using a combination of magnetically lossy fillers and electrically lossy fillers.

The lossy portion can also be formed in a variety of ways. In some examples, the binder material and filler may be molded into a desired shape and then secured to the shape. In other examples, the binder material may be formed into a sheet or other shape from which lossy members having a desired shape may be cut. In some embodiments, the lossy portion may be formed by interleaving layers of lossy and conductive materials, such as metal foil. The layers may be firmly attached to each other, such as by using epoxy or other adhesive, or may be held together in any other suitable manner. The layers may have a desired shape before they can be secured to each other, or may be stamped or otherwise formed after they are held together. As a further alternative, the lossy portion may be formed by plating a plastic or other insulating material with a lossy coating, such as a diffusion metal coating.

As another example of a variation, in some embodiments, the contact tails are shown as surface mount elements. However, other configurations may also be used, such as press-fit "eye of the needle" compliant sections designed to fit in the vias of a printed circuit board, solderable pins, etc., as aspects of the present disclosure are not limited to using any particular mechanism to attach a connector to a printed circuit board.

Further, the connector described herein is configured for mating with a transceiver in accordance with OSFP standards. The techniques described herein may be used for connectors configured to operate according to any SFP standard (e.g., QSFP-DD standard) or for other I/O connectors even though the I/O connector is not specifically configured to operate according to the SFP standard. Furthermore, the techniques described herein may be used for single port or stacked connectors. Furthermore, one or more of the techniques described herein may also be applied to connector configurations other than I/O connectors, such as for backplane connectors.

For purposes of this patent application and any patent issued thereto, the indefinite articles "a" and "an" as used in the specification and claims should be understood to mean "at least one" unless explicitly indicated to the contrary. The phrase "and/or" as used in the specification and claims should be understood to refer to "either or both" in conjunction with an element, i.e., elements that are in some cases present at the same time and in other cases not present at the same time. A plurality of elements listed with "and/or" should be understood in the same way, i.e. such combination of "one or more" of the elements. Other elements may optionally be present in addition to the explicitly specified elements of the phrase "and/or", whether related or unrelated to those elements specifically specified.

The use of "including," "comprising," "having," "containing," "involving," and/or variations thereof herein, is meant to encompass the items listed thereafter and equivalents thereof as well as additional items.

It should also be understood that, in any method claimed herein that includes more than one step or act, the order of the steps or acts of the method is not necessarily limited to the order in which the steps or acts of the method are recited, unless explicitly indicated to the contrary.

Claims

1. A leadframe assembly, comprising:

a lead frame housing;

a plurality of conductive elements held by the leadframe housing in a row extending along a row direction, each conductive element including a mating contact portion, a mounting portion opposite the mating contact portion, and an intermediate portion extending between the mating contact portion and the mounting portion; and

one or more waveform slices comprising a plateau portion and a valley portion, wherein:

the plurality of conductive elements includes signal conductive elements and ground conductive elements, an

The valleys of the one or more wave plates are attached to the ground conductive element.

2. The leadframe assembly according to claim 1, wherein:

The lead frame housing includes a portion elongated in the row direction;

the one or more waveform slices include:

a first sheet portion disposed adjacent to a first side of the portion of the leadframe housing elongated in the row direction; and

a second sheet portion disposed adjacent to a second side of the portion of the leadframe housing elongated in the row direction, the second side being opposite the first side.

3. The leadframe assembly according to claim 2, wherein:

the portion of the leadframe housing elongated in the row direction has a width in a direction perpendicular to the row direction that is no more than 50% of a length of the intermediate portion of the conductive element.

4. A leadframe assembly according to claim 3, wherein:

the leadframe housing includes a wider portion extending from the portion elongated in the row direction,

the plurality of conductive elements includes conductive elements held by the wider portion of the leadframe housing, an

The conductive element held by the wider portion of the leadframe housing is configured for power or for a signal having a lower signal frequency than the signal conductive element.

5. The leadframe assembly of claim 1, wherein for the signal conductive element, the one or more wave segments extend along 50% to 99% of a length of the signal conductive element.

6. The leadframe assembly according to claim 1, wherein:

the signal conductive elements and the ground conductive elements are arranged in a repeating pattern, an

The plateau of the one or more waveform slices is aligned with the signal conductive element between two adjacent ground conductive elements.

7. The leadframe assembly according to claim 6, wherein:

the plateau portions of the one or more corrugated sheets are spaced apart from the corresponding signal conductive elements by a first distance in a direction perpendicular to the rows,

the center of the signal conductive element is spaced a second distance from the edge of the corresponding adjacent ground conductive element, an

The first distance is not greater than the second distance.

8. The leadframe assembly according to claim 6, wherein:

the plurality of conductive elements includes conductive elements that interrupt the repeating pattern.

9. The leadframe assembly according to claim 1, wherein:

The intermediate portions of the conductive elements each include a first portion and a second portion separated by a transition region.

10. The leadframe assembly according to claim 9, wherein:

the one or more waveform slices include:

a first wave plate attached to the first portion of the middle portion of the ground conductive element, an

A second wave plate attached to the second portion of the middle portion of the ground conductive element.

11. The leadframe assembly according to claim 10, wherein:

the transition region of the ground conductor includes an aperture extending through the transition region.

12. The leadframe assembly according to claim 11, wherein:

the second wave plate includes a member extending above and between selected mounting portions of the plurality of conductive elements.

13. The leadframe assembly according to claim 11, wherein:

the one or more wave plates include a third wave plate attached to the first portion of the middle portion of the ground conductive element, an

The third wave plate is separated from the first wave plate by a portion of the leadframe housing.

14. The leadframe assembly according to claim 13, wherein:

the third wave plate includes a member extending over and between selected mating contacts of the plurality of conductive elements.

15. The leadframe assembly according to claim 1, wherein:

the thickness of the one or more corrugated sheets is less than the thickness of the plurality of conductive elements.

16. The leadframe assembly according to claim 1, wherein:

the one or more corrugated sheets are made of a material having a conductivity that is lower than the conductivity of the material of the plurality of conductive elements.

17. The leadframe assembly according to claim 16, wherein:

the valleys of the one or more wave plates are attached to the ground conductive element by a weld.

18. The leadframe assembly according to claim 17, wherein:

the weld covers more than 50% of the length of the valley.

19. The leadframe assembly according to claim 1, wherein:

The leadframe housing and the one or more wave segments have complementary features that engage, whereby the one or more wave segments are precisely positioned relative to the plurality of conductive elements.

20. The leadframe assembly according to claim 1, wherein:

the valleys of the one or more wave plates are attached to the ground conductive element at wire bonds, an

Each wire bond has a length to width aspect ratio greater than 5:1.

21. An electrical connector, comprising:

a first leadframe assembly, the first leadframe assembly comprising:

a plurality of first conductive elements each including a mating contact portion, a mounting portion opposite the mating contact portion, and an intermediate portion extending between the mating contact portion and the mounting portion; and

a first leadframe housing holding the plurality of first conductive elements in a first row, the first leadframe housing including a plurality of first features aligned in a row direction parallel to the first row, the plurality of first features being separated from each other by a first gap.

22. The electrical connector of claim 21, wherein the electrical connector comprises:

A second leadframe assembly stacked above the first leadframe assembly, the second leadframe assembly comprising:

a plurality of second conductive elements each including a mating contact portion, a mounting portion opposite the mating contact portion, and an intermediate portion extending between the mating contact portion and the mounting portion; and

a second leadframe housing holding the plurality of second conductive elements in a second row, the second leadframe housing including a plurality of second features aligned parallel to the row direction, and the plurality of second features shaped to fit in the first gap of the first leadframe housing such that the second leadframe assembly cannot move relative to the first leadframe assembly in the row direction.

23. The electrical connector of claim 22, wherein:

the first leadframe housing of the first leadframe assembly includes a third feature on one side of the first leadframe housing,

the second leadframe housing of the second leadframe assembly includes a fourth feature on one side of the second leadframe housing, and

The third feature of the first leadframe housing and the fourth feature of the second leadframe housing are shaped to interlock such that the second leadframe assembly cannot move relative to the first leadframe assembly in a longitudinal direction perpendicular to the row direction.

24. The electrical connector of claim 22, wherein:

the second leadframe housing of the second leadframe assembly includes a latching feature, and

the electrical connector includes a connector housing including a latching feature within the connector housing for engagement with the latching feature of the second leadframe housing of the second leadframe assembly such that the second leadframe assembly cannot move relative to the first leadframe assembly in a transitional direction perpendicular to the row direction.

25. The electrical connector of claim 21, wherein:

the first leadframe assembly includes one or more first wave segments including a land portion and a valley portion, the valley portion of the one or more first wave segments being attached to a selected conductive element of the plurality of first conductive elements,

The second leadframe assembly includes one or more second wave segments including a land portion and a valley portion, the valley portion of the one or more second wave segments being attached to a selected conductive element of the plurality of second conductive elements, an

The one or more second waveform slices are separated from the one or more first waveform slices by the plurality of first conductive elements and the plurality of second conductive elements.

26. The electrical connector of claim 21, wherein the electrical connector comprises:

a third leadframe assembly stacked above the second leadframe assembly, the third leadframe assembly comprising:

a plurality of third conductive elements each including a mating contact portion, a mounting portion opposite the mating contact portion, and an intermediate portion extending between the mating contact portion and the mounting portion, an

A third leadframe housing holding the plurality of third conductive elements in a third row, the third leadframe housing including a plurality of fifth features aligned along the row direction, the plurality of fifth features being separated from each other by a second gap.

27. The electrical connector of claim 26, wherein the electrical connector comprises:

a fourth leadframe assembly stacked above the third leadframe assembly, the fourth leadframe assembly comprising:

a plurality of fourth conductive elements each including a mating contact portion, a mounting portion opposite the mating contact portion, and an intermediate portion extending between the mating contact portion and the mounting portion, an

A fourth leadframe housing holding the plurality of fourth conductive elements in a fourth row, the fourth leadframe housing including a plurality of sixth features aligned parallel to the row direction, and the plurality of sixth features shaped to fit in the second gap of the third leadframe housing such that the fourth leadframe assembly cannot move relative to the third leadframe assembly in the row direction.

28. The electrical connector of claim 27, wherein:

the intermediate portions of the plurality of fourth conductive elements each include two or more transition regions separating portions of the corresponding intermediate portions.

29. The electrical connector of claim 27, wherein:

the fourth leadframe assembly includes three or more wave segments each attached to a corresponding portion of the intermediate portions of the plurality of fourth conductive elements.

30. The electrical connector of claim 27, wherein the electrical connector comprises:

a housing, the housing comprising:

a first sidewall and a second sidewall opposite to each other,

a mounting surface extending between the first side wall and the second side wall and exposing mounting portions of the plurality of first conductive elements, mounting portions of the plurality of second conductive elements, mounting portions of the plurality of third conductive elements, and mounting portions of the plurality of fourth conductive elements, and

a mating surface extending between the first sidewall and the second sidewall, the mating surface comprising:

a first groove exposing the mating contact portions of the plurality of first conductive elements and the mating contact portions of the plurality of second conductive elements,

a second groove exposing the mating contact portions of the plurality of third conductive elements and the mating contact portions of the plurality of fourth conductive elements, an

A region between the first slot and the second slot, the region including at least one opening extending through the region.

31. The electrical connector of claim 30, wherein the electrical connector comprises:

a pair of prongs disposed along a diagonal of the mounting surface of the housing.

32. The electrical connector of claim 30, wherein:

the connector housing includes a rear end opposite the mating face, and

the electrical connector includes a shroud at the rear end of the connector housing.

33. The electrical connector of claim 22, wherein:

the mounting portions of the plurality of first conductive elements and the mounting portions of the plurality of second conductive elements include tail portions extending in first and second directions opposite each other,

the intermediate portions of the first plurality of conductive elements and the intermediate portions of the second plurality of conductive elements each include a portion that is closer to the corresponding mounting portion than to the corresponding mating contact portion,

the portion of the intermediate portions of the plurality of first conductive elements extend at a first angle to the first direction,

The portion of the intermediate portions of the plurality of second conductive elements extending at a second angle to the second direction, an

The first angle and the second angle are complementary.

34. The electrical connector of claim 33, wherein:

the first angle and the second angle are not right angles.

35. A leadframe assembly, comprising:

a leadframe housing including a first feature;

a plurality of conductive elements held by the leadframe housing in rows, each conductive element including a mating contact portion, a mounting portion opposite the mating contact portion, and an intermediate portion extending between the mating contact portion and the mounting portion, the plurality of conductive elements including a signal conductive element and a ground conductive element; and

a plurality of waveform slices including a plateau portion and a valley portion, the plateau portion being disposed in correspondence with a signal conductive element of the plurality of conductive elements, the valley portion being disposed in correspondence with a ground conductive element of the plurality of conductive elements, the plurality of waveform slices comprising:

a first wave plate disposed between distal ends of the mating contact portions of the plurality of conductive elements and the leadframe housing, an

A second wave plate including a second feature that engages the first feature of the leadframe housing.

36. The leadframe assembly according to claim 35, wherein:

the first feature and the second feature are located at a central portion of the leadframe housing and a central portion of the second wave plate.

37. The leadframe assembly of claim 35, wherein, for the signal conductive element,

the one or more wave plates extend along 50% to 99% of the length of the signal conducting element.

38. The leadframe assembly according to claim 35, wherein:

The plateau of the one or more wave plates is aligned with the signal conductive element between two adjacent ground conductive elements.

39. The leadframe assembly according to claim 38, wherein:

The first distance is not greater than the second distance.

40. The leadframe assembly according to claim 38, wherein:

41. The leadframe assembly according to claim 35, wherein:

the intermediate portions of the conductive elements each include a first portion and a second portion separated by a transition region, an

The first wave plate is attached to a first portion of the middle portion of the ground conductive element.

42. The leadframe assembly according to claim 41, wherein:

the plurality of wave plates includes a third wave plate attached to a second portion of the middle portion of the ground conductive element.

43. The leadframe assembly according to claim 42, wherein:

the transition region of the ground conductor includes a hole extending through the transition region.

44. The leadframe assembly according to claim 42, wherein:

the third wave plate includes a member extending above and between selected mounting portions of the plurality of conductive elements.

45. The leadframe assembly according to claim 35, wherein:

The first wave plate includes a member extending over and between selected mating contacts of the plurality of conductive elements.

46. The leadframe assembly according to claim 35, wherein:

47. The leadframe assembly according to claim 35, wherein:

48. The leadframe assembly according to claim 47, wherein:

49. The leadframe assembly according to claim 35, wherein:

the leadframe housing and the plurality of wave segments have complementary features that engage, whereby the one or more wave segments are precisely positioned relative to the plurality of conductive elements.

50. The leadframe assembly according to claim 35, wherein:

Each wire bond has a length to width aspect ratio greater than 5:1.

51. An electrical connector, comprising:

a first leadframe assembly, the first leadframe assembly comprising:

a first lead frame housing is provided with a first lead frame,

a plurality of first conductive elements held in a first row by the first leadframe housing, each conductive element including a mating contact portion, a mounting portion opposite the mating contact portion, and an intermediate portion extending between the mating contact portion and the mounting portion, an

One or more first waveform pieces including a plateau portion and a valley portion, the valley portion of the one or more first waveform pieces being attached to a selected conductive element of the plurality of first conductive elements;

a second leadframe assembly, the second leadframe assembly comprising:

a second lead frame housing

A plurality of second conductive elements held in a second row by the second leadframe housing, each conductive element including a mating contact portion, a mounting portion opposite the mating contact portion, and an intermediate portion extending between the mating contact portion and the mounting portion; and

A first clamp holding the first and second leadframe assemblies such that the second leadframe assemblies are stacked on top of the first leadframe assemblies and the plurality of second conductive elements in the second row are parallel to the plurality of first conductive elements in the first row.

52. The electrical connector of claim 51, wherein:

the clip includes a latching feature, an

The electrical connector includes a connector housing including a latching feature within the connector housing that engages with the latching feature of the clamp.

53. The electrical connector of claim 52, wherein:

the clamp includes an annular portion that holds the first leadframe housing of the first leadframe assembly and the second leadframe housing of the second leadframe assembly, an

The latching feature of the clip extends from the annular portion.

54. The electrical connector of claim 51, wherein:

55. The electrical connector of claim 51, wherein:

the plurality of first conductive elements includes signal conductive elements and ground conductive elements,

the plurality of second conductive elements includes signal conductive elements and ground conductive elements, an

The second row is offset from the first row in a direction in which the row extends such that a ground conductive element of the plurality of first conductive elements in the first row at least partially overlaps a corresponding signal conductive element of the plurality of second conductive elements in the second row.

56. The electrical connector of claim 51, wherein the electrical connector comprises:

a third leadframe assembly, the third leadframe assembly comprising:

third lead frame housing

A plurality of third conductive elements held by the third leadframe housing in a third row, each conductive element including a mating contact portion, a mounting portion opposite the mating contact portion, and an intermediate portion extending between the mating contact portion and the mounting portion; and

A member extending between the second leadframe housing and the third leadframe housing such that the third leadframe assembly is stacked on top of the second leadframe assembly.

57. An electrical connector as recited in claim 56, wherein:

the member includes one or more prongs.

58. The electrical connector of claim 56, wherein the electrical connector comprises:

a fourth leadframe assembly, the fourth leadframe assembly comprising:

fourth lead frame housing

A plurality of fourth conductive elements held in a fourth row by the fourth leadframe housing, each conductive element including a mating contact portion, a mounting portion opposite the mating contact portion, and an intermediate portion extending between the mating contact portion and the mounting portion; and

a second clamp holding the third and fourth leadframe assemblies such that the fourth leadframe assembly is stacked on top of the third leadframe assembly.

59. The electrical connector of claim 58, wherein:

60. The electrical connector of claim 58, wherein:

61. The electrical connector of claim 58, wherein the electrical connector comprises:

a housing, the housing comprising:

a first sidewall and a second sidewall opposite to each other,

62. The electrical connector of claim 61, wherein:

the connector housing includes a rear end opposite the mating face, and

63. The electrical connector of claim 51, wherein:

The first angle and the second angle are complementary.

64. The electrical connector of claim 63, wherein:

the first angle and the second angle are not right angles.

65. A method of manufacturing a leadframe assembly, the method comprising:

providing a leadframe comprising a plurality of conductive elements arranged in rows, each conductive element comprising a mating contact portion, a mounting portion opposite the mating contact portion, and an intermediate portion extending between the mating contact portion and the mounting portion;

molding an insulating material over a first selected area of the intermediate portions of the plurality of conductive elements;

aligning one or more sheets with a second selected area of the intermediate portion of the plurality of conductive elements;

soldering a first region of the one or more sheets to a first conductive element; and

a second region of the one or more sheets is welded to a second conductive element, wherein the second conductive element is closer to an end of the row than the first conductive element.

66. The method according to claim 65, wherein:

the one or more sheets include a plateau and a valley, and the first region and the second region are valleys.

67. The method according to claim 65, wherein:

the insulating material covers no more than 50% of the middle portion of the signal conducting element.

68. The method as recited in claim 65, wherein the method comprises:

cutting the connecting rod for connecting one or more sheets.

69. The method as recited in claim 65, wherein the method comprises:

the intermediate regions of the plurality of conductive elements are bent such that the first and second portions of the plurality of conductive elements are separated by respective inflection points, the second portion extending at an acute or obtuse angle relative to the tail of the corresponding mounting portion.

70. The method according to claim 65, wherein:

a first region of the one or more pieces of sheet material is attached to the first conductive element by wire bonds along 50% to 99% of the length of the first region.