CN117288438A - Chip testing device - Google Patents
Chip testing device Download PDFInfo
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- CN117288438A CN117288438A CN202311250535.XA CN202311250535A CN117288438A CN 117288438 A CN117288438 A CN 117288438A CN 202311250535 A CN202311250535 A CN 202311250535A CN 117288438 A CN117288438 A CN 117288438A
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- 238000012360 testing method Methods 0.000 title claims abstract description 51
- 230000003287 optical effect Effects 0.000 claims abstract description 36
- 230000008878 coupling Effects 0.000 claims description 23
- 238000010168 coupling process Methods 0.000 claims description 23
- 238000005859 coupling reaction Methods 0.000 claims description 23
- 238000005286 illumination Methods 0.000 claims description 15
- 230000001502 supplementing effect Effects 0.000 claims description 12
- 238000001914 filtration Methods 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 239000013307 optical fiber Substances 0.000 abstract description 19
- 238000011056 performance test Methods 0.000 abstract description 4
- 238000003384 imaging method Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 7
- 239000000523 sample Substances 0.000 description 7
- 239000012634 fragment Substances 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 201000004569 Blindness Diseases 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/0207—Details of measuring devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a chip testing device, which relates to the technical field of chip testing equipment. The observation assembly comprises a camera module and a first light splitting plate, the first light splitting plate is arranged in parallel with the reflector, and the first light splitting plate is used for reflecting laser reflected by the reflector and reflecting the laser out in a first light path; the first light path is located on an optical axis of the camera module. When the chip is tested, the optical performance index and the electrical performance index of the chip can be tested respectively only by starting and stopping the light source, the position of the optical fiber is not required to be switched, and the testing efficiency is improved. In addition, when the chip is used for testing the optical performance index, the optical fiber can not block the sight line of the chip observed by the camera module, so that the position of the chip can be conveniently adjusted, the laser can fully irradiate the photosensitive surface of the chip, and the accuracy of the optical performance test of the chip is improved.
Description
Technical Field
The invention relates to the technical field of chip testing equipment, in particular to a chip testing device.
Background
The core element of the laser detector is a chip, and the chip needs to test the photoelectric performance index in the production process. When the optical performance index is tested, light with specific wavelength is generally irradiated to a position right above the photosensitive surface of the chip through an optical fiber, light emitted from the tail end of the optical fiber is not parallel light, but is divergent light with a small angle, and the general divergence angle is about 6-8 degrees, so that the tail end of the optical fiber is required to be very close to the photosensitive surface of the chip, and the light diverged from the tail end of the optical fiber can be prevented from exceeding the range of the photosensitive surface of the chip.
When the electrical performance index is tested, the conventional photoelectric detector chip testing equipment moves the microscopic imaging system to the position right above the chip to be tested, observes the position of the chip and the crimping position of the probe, and tests the electrical performance of the chip. After the electrical performance test is completed, the tail end of the optical fiber is moved to the position right above the chip, the chip is irradiated with light, and the optical performance index is tested. Therefore, in the process of testing the electrical performance and optical performance indexes of the chip, the positions of the microscopic imaging system and the optical fiber need to be switched back and forth, so that the testing efficiency is reduced. In addition, when the optical performance index of the chip is tested, the optical fiber is positioned between the chip and the microscopic imaging system, the optical fiber shields the sight of the microscopic imaging system for observing the chip, whether the light emitted by the optical fiber is completely within the range of the photosensitive surface of the chip is invisible, blindness is achieved, and whether the position of the optical fiber is correct or not can only be reversely pushed by monitoring the feedback current generated on the chip, so that the test of the optical performance index of the chip is influenced.
Disclosure of Invention
In view of the foregoing, it is necessary to provide a chip testing apparatus, which solves the problem that in the prior art, in the process of testing the electrical performance and optical performance indexes of the chip, the positions of the microscopic imaging system and the optical fiber need to be switched back and forth, so as to reduce the testing efficiency. In addition, when the optical performance index of the chip is tested, the optical fiber is positioned between the chip and the microscopic imaging system, the optical fiber shields the line of sight of the microscopic imaging system for observing the chip, and the technical problem of testing the optical performance index of the chip is affected.
In order to achieve the above technical purpose, the technical solution of the present invention provides a chip testing device, including:
the illumination assembly comprises a light source and a reflector, wherein the emitting end of the light source can emit light beams, and the reflector is arranged opposite to the emitting end of the light source and can reflect the light beams emitted by the light source;
the observation assembly comprises a first light splitting plate and a camera module, wherein the first light splitting plate and the reflector are arranged in parallel, and the first light splitting plate is used for reflecting the light beams reflected by the reflector and reflecting the light beams out through a first light path; the optical axis of the camera module is located in the first optical path and is used for observing the chip located in the first optical path.
Further, the illumination assembly further comprises a coupling lens, the coupling lens is located between the light source and the reflector, and a light outlet of the light source is located at a focus of the coupling lens.
Further, the illumination assembly further comprises a first diaphragm located between the coupling lens and the reflector, the first diaphragm being used for filtering non-parallel light emitted via the coupling lens.
Further, the illumination assembly further comprises a second diaphragm, the second diaphragm is located between the first diaphragm and the reflector, and the second diaphragm is used for filtering non-parallel light after passing through the first diaphragm.
Further, the camera module comprises a CCD camera and a first convex lens, wherein the first convex lens is positioned between the CCD camera and the first light splitting plate, and a viewing mirror of the CCD camera is positioned at a focus of the first convex lens.
Further, the camera module further includes a second convex lens located between the first convex lens and the first light-splitting plate.
Further, the observation assembly further comprises a light supplementing module, the light supplementing module comprises a light supplementing lamp and a second light splitting plate, the second light splitting plate is located between the first convex lens and the second convex lens, light of the light supplementing lamp irradiates on the second light splitting plate, and a light path reflected by the second light splitting plate is located on an optical axis of the CCD camera.
Further, the chip testing device further comprises a first adjusting assembly, the first adjusting assembly comprises a fixing shell, a swivel base and two first adjusting screws, the swivel base is rotationally connected with the fixing shell, the first light splitting plate is arranged on the swivel base, the swivel base is provided with a flange, the two first adjusting screws are connected with the fixing shell in a threaded mode and are respectively located on two sides of the flange, and the two first adjusting screws can rotate relative to the swivel base so as to drive the swivel base to rotate through threaded matching.
Further, the swivel mount still includes first pedestal, second pedestal, first spring and second adjusting screw, first pedestal with the second pedestal passes through first spring coupling, second adjusting screw threaded connection in first pedestal, second pedestal joint first beam splitter plate, the second adjusting screw can order about when rotating the second pedestal is followed its thickness direction and is removed.
Further, the chip testing device further comprises a second adjusting assembly, the second adjusting assembly comprises a fixed seat, a movable seat, a second spring and a third adjusting screw, the fixed seat is connected with the movable seat through the second spring, the reflector is arranged on the movable seat, the third adjusting screw is connected with the movable seat in a threaded manner, and can abut against the fixed seat when rotating, and the fixed seat drives the movable seat to move through a reaction force.
Compared with the prior art, the invention has the beneficial effects that: when the chip is tested, the chip can be placed on the first optical path. When the electrical performance index of the chip needs to be tested, the light source can be turned off, and the chip can be observed through the camera module as the chip is positioned on the optical axis of the camera module. When the light performance index of the chip needs to be tested, the light source can be turned on, the light beam emitted by the light source is reflected to the first light splitting plate after being reflected by the reflector, the light beam is reflected to the chip through the first light path by the first light splitting plate, the chip emits visible light after being irradiated by the light beam, the visible light can be imaged on the camera module through the first light splitting plate, so that an operator can observe the position of the chip and adjust the position of the chip through the camera module, and the photosensitive surface of the chip is entirely irradiated by the light beam. Therefore, compared with the prior art, the optical performance index and the electrical performance index of the chip can be tested respectively only by opening and closing the light source, the position of the optical fiber is not required to be switched, and the testing efficiency is improved. In addition, when the chip is used for testing the optical performance index, the optical fiber can not block the sight line of the chip observed by the camera module, so that the position of the chip can be conveniently adjusted, the light beam can fully irradiate the photosensitive surface of the chip, and the accuracy of the optical performance test of the chip is improved.
Drawings
FIG. 1 is a schematic view of a chip test device according to the present invention;
FIG. 2 is a schematic diagram of a chip testing apparatus according to the present invention;
FIG. 3 is a schematic diagram of another view of the chip testing apparatus according to the present invention;
FIG. 4 is an enlarged schematic view of portion A of FIG. 3;
FIG. 5 is a schematic illustration of the first adjustment assembly of the present invention shown disassembled;
FIG. 6 is a schematic illustration of a second adjustment assembly of the present invention shown disassembled;
FIG. 7 is a schematic view of a fixing base of the present invention;
FIG. 8 is a schematic exploded view of a third adjustment assembly of the present invention;
fig. 9 is a schematic exploded view of another view of the third adjustment assembly of the present invention.
Detailed Description
Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which form a part hereof, and together with the description serve to explain the principles of the invention, and are not intended to limit the scope of the invention.
Referring to fig. 1 and 2, the present invention provides a chip testing apparatus 100, where the chip testing apparatus 100 can test the optical performance index and the electrical performance index of the chip 6, and in the testing process, the two tests do not affect each other, and no additional accessories are required to be added or reduced, so that the testing efficiency is improved.
When the chip 6 is tested for electrical performance index, it is necessary to observe whether the chip 6 is connected with the probe correctly, so as to ensure that the probe is accurately pricked on the electrode of the chip 6.
When the chip 6 performs the optical performance index test, the photosensitive surface of the chip 6 needs to be completely irradiated by the light emitted by the optical fiber, so that the chip 6 is promoted to generate current, and the optical performance index of the chip 6 is obtained through the test current.
The chip testing device 100 comprises an illumination component 1 and an observation component 2, an operator can observe whether the chip 6 and the probe are connected correctly through the observation component 2, the illumination component 1 is used for illuminating the photosensitive surface of the chip 6, so that the chip 6 generates current, and the light performance index of the chip 6 can be fed back through a corresponding side current device.
The illumination assembly 1 comprises a light source 11 and a mirror 12, and the viewing assembly 2 comprises a camera module 21 and a first light-splitting plate 22, the first light-splitting plate 22 and the mirror 12 being arranged in parallel. The light source 11 is used for emitting a light beam, and the light beam can be irradiated to the chip after being reflected by the reflector 12. There are many kinds of light sources 11, such as optical fibers.
The first light-splitting plate 22 is defined to receive the light reflected by the mirror 12 and reflect the light to the chip 6 in a first optical path, which is located on the optical axis of the camera module 21.
When the chip 6 is subjected to the light performance index test, the light source 11 is turned on, the light beam emitted by the light source 11 can irradiate the reflector 12, then reflected by the reflector 12, reflected by the light beam to the first light splitting plate 22, reflected by the light beam to the chip 6 along the first light path, and the chip 6 can generate current when being illuminated so as to test the light performance index of the chip 6 through the component for measuring the current. Meanwhile, an operator can observe whether the photosensitive surface of the chip 6 is covered by the light emitted by the light source 11 in real time through the camera module 21, and if the photosensitive surface is not covered by the light emitted by the light source 11, the operator can adjust the position of the light source 11 or the reflective mirror 12 so that the light emitted by the light source 11 covers the photosensitive surface of the chip 6, thereby improving the accuracy of measuring the optical performance index of the chip 6. In addition, there is no view shielding on the optical axis of the camera module 21, so that an operator can easily observe whether or not the photosensitive surface of the chip 6 is covered entirely by the light emitted from the light source 11 through the camera module 21.
When the electrical performance index test is performed on the chip 6, the light source 11 is turned off, and the light source 11 stops emitting light. An operator can observe whether the chip 6 is connected with the probe correctly through the camera module 21 so as to ensure that the probe is accurately pricked on the electrode of the chip 6, and the accuracy of measuring the electrical performance index of the chip 6 is improved.
In an embodiment, the illumination assembly 1 further comprises a coupling lens 13, the coupling lens 13 is located between the light source 11 and the reflective mirror 12, the light outlet of the light source 11 is located at the focal point of the coupling lens 13, and the coupling lens 13 is a convex lens. The coupling lens 13 can diffuse the light emitted from the light source 11 into a light flux in which a large amount of parallel light is present near the middle of the light flux and a small amount of parallel light is present on both sides of the light flux. After the light emitted by the light source 11 passes through the coupling lens 13 to form a light beam, the illumination area of the light finally irradiated on the photosensitive surface of the chip 6 is large, and the photosensitive surface of the chip 6 can be covered as much as possible.
Diaphragms may be disposed between the coupling lens 13 and the reflective mirror 12, and the number of diaphragms is not limited, and may be one, two or more, and is not limited herein. The diaphragm is used to filter the non-parallel light on both sides of the light beam passing through the coupling lens 13, so that the purity of the parallel light of the light beam irradiated on the reflector 12 is higher, and finally the light irradiated on the chip 6 is more concentrated through multiple reflections.
In an embodiment, the illumination assembly 1 comprises one diaphragm, defined as a first diaphragm 14. The first diaphragm 14 is located between the coupling lens 13 and the reflective mirror 12, and the first diaphragm 14 is used for filtering non-parallel light emitted through the coupling lens 13, and the light beam passing through the first diaphragm 14 has high purity of parallel light.
Referring to fig. 1 and 3, in another embodiment, the illumination assembly 1 includes two diaphragms, respectively defined as a first diaphragm 14 and a second diaphragm 15, the second diaphragm 15 is located between the first diaphragm 14 and the reflective mirror 12, and the second diaphragm 15 is used to filter non-parallel light after passing through the first diaphragm 14, so that the purity of parallel light in the light beam is further improved, and finally, the light irradiated on the chip 6 is more concentrated.
In one embodiment, the camera module 21 includes a CCD camera 211 and a first convex lens 212, the first convex lens 212 being located between the CCD camera 211 and the first spectroscopic plate 22, and a viewer of the CCD camera being located at a focal point of the first convex lens. The chip 6 can emit light when being illuminated by the light source 11, and the light is imaged by the CCD camera 211 through the first convex lens 212, so that an operator can observe whether the chip 6 is correctly connected with the probe through the CCD camera 211, and the chip 6 can be conveniently tested for electrical performance indexes.
In an embodiment, the camera module 21 further includes a second convex lens 213, and the second convex lens 213 is located between the first convex lens 212 and the first beam splitter plate 22. The light emitted by the chip 6 can form parallel light through the second convex lens 213, so that more light irradiates the first convex lens 212, and the light passing through the first convex lens 212 irradiates the CCD camera 211, so that an operator can observe the chip 6 more clearly, and the accuracy of the electrical property test of the chip 6 is improved.
In an embodiment, the observation assembly 2 further includes a light supplementing module, the light supplementing module includes a light supplementing lamp 214 and a second light splitting plate 215, the second light splitting plate 215 is located between the first convex lens 212 and the second convex lens 213, light of the light supplementing lamp 214 irradiates on the second light splitting plate 215, a light path reflected by the second light splitting plate 215 is located on an optical axis of the CCD camera 211, and since the chip 6 is also located on the optical axis of the CCD camera 211, light reflected by the second light splitting plate 215 can irradiate on the chip 6 to supplement light for the chip 6, so that an operator can observe the chip 6 more clearly through the CCD camera 211, which is beneficial to improving accuracy of electrical performance test of the chip 6.
The positions of the first light splitting plate 22 and the reflective mirror 12 can be manually adjusted, so that the first light splitting plate 22 and the reflective mirror 12 can be positioned at proper positions, and the electrical performance index and the optical performance index of the chip 6 are tested in an auxiliary manner.
The chip testing apparatus 100 further includes a first adjusting component 3, a second adjusting component 4, and a third adjusting component 5, where the first adjusting component 3 is used for adjusting a position of the first light-splitting plate 22, for example, driving the first light-splitting plate 22 to rotate and driving the first light-splitting plate 22 to move along a thickness direction thereof. The second adjusting component 4 is used for adjusting the position of the reflective mirror 12, for example, can drive the reflective mirror 12 to rotate and drive the reflective mirror 12 to move along the thickness direction. The third adjusting component 5 is used for adjusting the position of the light source 11 so that the light source 11 is at a proper position, and more parallel light can be irradiated on the reflector 12 by the light beam emitted by the light source 11.
Referring to fig. 3 and 4, in an embodiment, the first adjusting assembly 3 includes a fixed shell 31, a swivel base 32 and two first adjusting screws 33, the swivel base 32 is rotationally connected with the fixed shell 31, the first light splitting plate 22 is disposed on the swivel base 32, the swivel base 32 has a flange 351, the first adjusting screws 33 are all in threaded connection with the fixed shell 31 and are respectively located at two sides of the flange 351, the two first adjusting screws 33 can rotate relative to the swivel base 32 to drive the flange 351 to move through threaded matching movement, so that the swivel base 32 is driven to rotate through the flange 351, and the angle of the first light splitting plate 22 is adjusted.
The fixed housing 31 is coupled with a first coupling member 34, the first coupling member 34 having two protrusions 341 disposed at intervals, and a movable groove 342 formed between the two protrusions 341. The two first adjusting screws 33 are respectively connected with the two protrusions 341 in a threaded manner, and the end parts of the first adjusting screws 33 extend into the movable grooves 342. The swivel base 32 is connected with a second connecting piece 35, the second connecting piece 35 is T-shaped, and the part of the second connecting piece 35 extending into the movable groove 342 is the flange 351. An operator can use a screwdriver to drive the two first adjusting screws 33 to rotate, so that the first adjusting screws 33 move close to or far away from the flange 351 through threaded fit, and the flange 351 drives the swivel mount 32 to rotate, so that the angle of the first light-splitting plate 22 is adjusted. In other embodiments, the swivel mount 32 can be driven to rotate relative to the fixed housing 31 in a variety of configurations, which are not described herein.
Referring to fig. 5, further, the swivel base 32 further includes a first base 321, a second base 322, a first spring 323 and a second adjusting screw 324, where the first base 321 and the second base 322 are connected by the first spring 323, the second adjusting screw 324 is screwed on the first base 321, the second base 322 is clamped with the first light splitting plate 22, and the second adjusting screw 324 can drive the second base 322 to move along the thickness direction when rotating. The second seat 322 drives the first spring 323 to extend and accumulate elastic force in the moving process, so that the second seat 322 is in a tightening state after changing the position, and the phenomenon that the first light-splitting plate 22 shakes in the using process to influence the test of the chip 6 is avoided.
Referring to fig. 6 and 7, the second adjusting assembly 4 includes a fixed seat 41, a movable seat 42, a second spring 43 and a third adjusting screw 44, the fixed seat 41 and the movable seat 42 are connected through the second spring 43, the mirror 12 is disposed on the movable seat 42, the third adjusting screw 44 is screwed to the movable seat 42 and can abut against the fixed seat 41 when rotating, the fixed seat 41 drives the movable seat 42 to move along the thickness direction thereof through a reaction force, so that the movable seat 42 drives the mirror 12 to move, and the position of the mirror 12 is adjusted.
The fixing seat 41 is provided with a clamping slot 411, the clamping slot 411 is matched with the movable seat 42 in shape, the movable seat 42 is clamped in the clamping slot 411 to limit the movable seat 42 to rotate along the circumferential direction relative to the fixing seat 41, and the movable seat 42 can only move along the thickness direction so as to drive the reflective mirror 12 to move along the thickness direction, so that the position of the reflective mirror 12 is adjusted.
The fixing seat 41 is provided with a first light port 412 and a second light port 413, and the central axis of the first light port 412 and the central axis of the second light port 413 are perpendicular to each other. The first light port 412 is used for allowing light emitted by the light source 11 to enter the fixed seat 41 to irradiate the reflector 12, and after the reflector 12 reflects the light, the reflected light is emitted through the second light port 413 and irradiates the first light splitting plate 22.
In the process of moving the movable seat 42 relative to the fixed seat 41, the second spring 43 stretches to accumulate elastic force, so that both the movable seat 42 and the reflective mirror 12 can be in a tightening state, and in the use process, the reflective mirror 12 is not easy to shake to influence the test of the chip 6.
The number of the third adjusting screws 44 is two, and the third adjusting screws are arranged diagonally to the movable base 42. An operator can manually control one or both of the third adjustment screws 44 to rotate to adjust the position of the mirror 12.
The movable seat 42 is also provided with a limiting elastic piece 45 through a screw, and the limiting elastic piece 45 is used for limiting the reflector 12 so as to prevent the reflector 12 from being separated from the movable seat 42. Because spacing shell fragment 45 passes through the screw to be installed in remove seat 42, and spacing shell fragment 45 can rotate relative to remove seat 42 for spacing shell fragment 45 can be fixed in a plurality of rotation positions through the screw elasticity, so spacing shell fragment 45 can be spacing to not unidimensional reflector 12, removes seat 42 mountable multiple unidimensional reflector 12.
Referring to fig. 8 and 9, the third adjusting assembly 5 includes a mounting seat 51, a face shell 52, a fourth adjusting screw 53, a fifth adjusting screw 54 and a return spring 55, the mounting seat 51 is provided with a mounting groove 511, the face shell 52 is clamped in the mounting groove 511, the fourth adjusting screw 53 and the fifth adjusting screw 54 are both in threaded connection with the mounting seat 51, and when the fourth adjusting screw 53 and the fifth adjusting screw 54 rotate, the moving directions of the fourth adjusting screw 53 and the fifth adjusting screw 54 are mutually perpendicular. The number of the return springs 55 is two, the two return springs 55 are respectively positioned in the moving directions of the fourth adjusting screw 53 and the fifth adjusting screw 54, and two ends of the return springs 55 are respectively connected with the face shell 52 and the groove wall of the mounting groove 511. The middle part of the surface shell 52 is provided with a threaded opening 521, the threaded opening 521 is used for being connected with the light source 11 in a threaded manner, and the light emitting direction of the light source 11 is parallel to the thickness direction of the surface shell 52. When the face-piece 52 moves, the light source 11 can follow the face-piece 52.
When it is desired to adjust the position of the light source 11, the operator may manually rotate the fourth adjustment screw 53 or the fifth adjustment screw 54, or manually rotate both the fourth adjustment screw 53 and the fifth adjustment screw 54. When the fourth and fifth adjusting screws 53 and 54 are rotated relative to the mount 51, the fourth and fifth adjusting screws 53 and 54 can move in the longitudinal direction thereof by screw engagement to move against the face case 52, changing the position of the light source 11, while the face case 52 presses against the return spring 55 to accumulate the elastic force. When the fourth and fifth adjusting screws 53 and 54 are rotated to retract and reset, the reset spring 55 releases the elastic force to drive the panel case 52 to move and reset. By this structure, the position of the light source 11 can be adjusted quickly and conveniently.
Referring to fig. 2, the second adjusting component 4 and the third adjusting component 5 are connected by a plurality of sliding rods 16, and the first diaphragm 14 and the second diaphragm 15 are both slidably disposed on the sliding rods 16, so that the positions of the first diaphragm and the second diaphragm can be adjusted by sliding up and down on the sliding rods 16.
The present invention is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present invention are intended to be included in the scope of the present invention.
Claims (10)
1. A chip testing apparatus, comprising:
the illumination assembly comprises a light source and a reflector, wherein the emitting end of the light source can emit light beams, and the reflector is arranged opposite to the emitting end of the light source and can reflect the light beams emitted by the light source;
the observation assembly comprises a first light splitting plate and a camera module, wherein the first light splitting plate and the reflector are arranged in parallel, and the first light splitting plate is used for reflecting the light beams reflected by the reflector and reflecting the light beams out through a first light path; the optical axis of the camera module is located in the first optical path and is used for observing the chip located in the first optical path.
2. The chip testing apparatus according to claim 1, wherein the illumination assembly further comprises a coupling lens, the coupling lens being located between the light source and the reflector, the light outlet of the light source being located at a focal point of the coupling lens.
3. The chip testing apparatus according to claim 2, wherein the illumination assembly further comprises a first diaphragm between the coupling lens and the mirror, the first diaphragm for filtering non-parallel light emitted via the coupling lens.
4. The chip testing apparatus according to claim 3, wherein the illumination assembly further comprises a second diaphragm, the second diaphragm being located between the first diaphragm and the mirror, the second diaphragm being configured to filter non-parallel light after passing through the first diaphragm.
5. The chip testing apparatus according to claim 1, wherein the camera module includes a CCD camera and a first convex lens, the first convex lens being located between the CCD camera and the first spectroscopic plate, a scope of the CCD camera being located at a focal point of the first convex lens.
6. The chip testing apparatus according to claim 5, wherein the camera module further comprises a second convex lens, the second convex lens being located between the first convex lens and the first light-splitting plate.
7. The chip testing device of claim 5, wherein the observation assembly further comprises a light supplementing module, the light supplementing module comprises a light supplementing lamp and a second light splitting plate, the second light splitting plate is located between the first convex lens and the second convex lens, light of the light supplementing lamp irradiates the second light splitting plate, and an optical path reflected by the second light splitting plate is located on an optical axis of the CCD camera.
8. The device according to claim 1, further comprising a first adjusting assembly, wherein the first adjusting assembly comprises a fixing shell, a swivel base and two first adjusting screws, the swivel base is rotatably connected with the fixing shell, the first light splitting plate is arranged on the swivel base, the swivel base is provided with a flange, the two first adjusting screws are in threaded connection with the fixing shell and are respectively located on two sides of the flange, and the two first adjusting screws can rotate relative to the swivel base to drive the swivel base to rotate through threaded matching movement.
9. The chip testing device of claim 8, wherein the swivel mount further comprises a first base, a second base, a first spring, and a second adjusting screw, wherein the first base and the second base are connected by the first spring, the second adjusting screw is in threaded connection with the first base, the second base is clamped with the first light splitting plate, and the second adjusting screw can drive the second base to move along the thickness direction of the second base when rotating.
10. The chip testing apparatus of claim 1, further comprising a second adjustment assembly, the second adjustment assembly comprising a fixed seat, a movable seat, a second spring, and a third adjustment screw, the fixed seat and the movable seat being connected by the second spring, the mirror being disposed on the movable seat, the third adjustment screw being threadably coupled to the movable seat and being capable of abutting the fixed seat when rotated, the fixed seat being urged to move by a reaction force.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311250535.XA CN117288438A (en) | 2023-09-25 | 2023-09-25 | Chip testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311250535.XA CN117288438A (en) | 2023-09-25 | 2023-09-25 | Chip testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117288438A true CN117288438A (en) | 2023-12-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311250535.XA Pending CN117288438A (en) | 2023-09-25 | 2023-09-25 | Chip testing device |
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| Country | Link |
|---|---|
| CN (1) | CN117288438A (en) |
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2023
- 2023-09-25 CN CN202311250535.XA patent/CN117288438A/en active Pending
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