CN117285794A - Water-based epoxy resin grouting material and preparation method thereof - Google Patents
Water-based epoxy resin grouting material and preparation method thereof Download PDFInfo
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- CN117285794A CN117285794A CN202311196061.5A CN202311196061A CN117285794A CN 117285794 A CN117285794 A CN 117285794A CN 202311196061 A CN202311196061 A CN 202311196061A CN 117285794 A CN117285794 A CN 117285794A
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 111
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 111
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 59
- 239000000463 material Substances 0.000 title claims abstract description 51
- 238000002360 preparation method Methods 0.000 title abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 34
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 13
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 13
- 239000007800 oxidant agent Substances 0.000 claims abstract description 13
- 230000001590 oxidative effect Effects 0.000 claims abstract description 13
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 9
- 238000003756 stirring Methods 0.000 claims description 27
- 238000005303 weighing Methods 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 15
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims description 12
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 10
- 239000004952 Polyamide Substances 0.000 claims description 9
- 229920002647 polyamide Polymers 0.000 claims description 9
- 229940048053 acrylate Drugs 0.000 claims description 8
- PQUXFUBNSYCQAL-UHFFFAOYSA-N 1-(2,3-difluorophenyl)ethanone Chemical compound CC(=O)C1=CC=CC(F)=C1F PQUXFUBNSYCQAL-UHFFFAOYSA-N 0.000 claims description 7
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 7
- 229940047670 sodium acrylate Drugs 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical class OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 6
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 claims description 6
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 6
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims description 6
- ZZZCUOFIHGPKAK-UHFFFAOYSA-N D-erythro-ascorbic acid Natural products OCC1OC(=O)C(O)=C1O ZZZCUOFIHGPKAK-UHFFFAOYSA-N 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 5
- 229930003268 Vitamin C Natural products 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 235000019154 vitamin C Nutrition 0.000 claims description 5
- 239000011718 vitamin C Substances 0.000 claims description 5
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 claims description 4
- VAPQAGMSICPBKJ-UHFFFAOYSA-N 2-nitroacridine Chemical compound C1=CC=CC2=CC3=CC([N+](=O)[O-])=CC=C3N=C21 VAPQAGMSICPBKJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000011837 N,N-methylenebisacrylamide Substances 0.000 claims description 4
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 claims description 4
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 claims description 4
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 claims description 4
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 13
- 239000011347 resin Substances 0.000 abstract description 13
- 239000002250 absorbent Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 239000002994 raw material Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- SNICXCGAKADSCV-JTQLQIEISA-N (-)-Nicotine Chemical compound CN1CCC[C@H]1C1=CC=CN=C1 SNICXCGAKADSCV-JTQLQIEISA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 231100000086 high toxicity Toxicity 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229960002715 nicotine Drugs 0.000 description 1
- SNICXCGAKADSCV-UHFFFAOYSA-N nicotine Natural products CN1CCCC1C1=CC=CN=C1 SNICXCGAKADSCV-UHFFFAOYSA-N 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000010125 resin casting Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000012855 volatile organic compound Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/44—Amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5026—Amines cycloaliphatic
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention provides a waterborne epoxy resin grouting material and a preparation method thereof, and relates to the technical field of resin grouting material preparation. The aqueous epoxy resin grouting material consists of 45-55% of A component and 45-55% of B component according to mass percent; the component A consists of 55-70% of aqueous epoxy resin, 10-25% of acrylate, 0.1-0.5% of reducing agent and the balance of water according to mass percent; the component B consists of 55-70% of aqueous epoxy resin curing agent, 5-10% of accelerator, 5-10% of low molecular aqueous epoxy resin curing agent, 0.1-0.5% of cross-linking agent, 0.1-0.5% of oxidant and the balance of water according to mass percent. The aqueous epoxy resin grouting material provided by the invention has short gel time and small shrinkage rate.
Description
Technical Field
The invention relates to the technical field of resin grouting material preparation, in particular to a water-based epoxy resin grouting material and a preparation method thereof.
Background
Most of the traditional epoxy resin materials are oily epoxy resin, contain volatile organic compounds, and have high toxicity. Along with the enhancement of environmental awareness and the limitation of environmental protection policies, epoxy resin materials are developing in the forward direction of water-based. The water-based epoxy resin not only maintains the excellent performance of the oily epoxy resin, but also has the special advantages of green pollution-free, strong operability, good applicability, good safety and the like.
However, the aqueous epoxy resin material is an emulsion using water as a dispersion medium, and is a material with high specific heat capacity compared with a common organic solvent, so that the aqueous epoxy resin material is difficult to volatilize, has the defects of long gel time, large shrinkage rate and the like, and is difficult to apply to the field of repairing concrete cracks.
Disclosure of Invention
(one) solving the technical problems
The invention aims to provide a waterborne epoxy resin grouting material and a preparation method thereof, which are used for solving the problems in the background technology.
(II) technical scheme
In order to achieve the above purpose, the invention is realized by the following technical scheme:
the aqueous epoxy resin grouting material consists of 45-55% of A component and 45-55% of B component according to mass percent;
the component A consists of 55-70% of aqueous epoxy resin, 10-25% of acrylate, 0.1-0.5% of reducing agent and the balance of water according to mass percent;
the component B consists of 55-70% of aqueous epoxy resin curing agent, 5-10% of accelerator, 5-10% of low-molecular aqueous epoxy resin curing agent, 0.1-0.5% of cross-linking agent, 0.1-0.5% of oxidant and the balance of water according to mass percent.
Preferably, the aqueous epoxy resin is selected from 220A and has an epoxy equivalent weight of 200g/eq.
Preferably, the acrylic acid salt is at least one selected from sodium acrylate and potassium acrylate.
Preferably, the reducing agent is at least one selected from vitamin C and white suspended solids.
Preferably, the aqueous epoxy resin curing agent is selected from 220B, and the active hydrogen equivalent is 200g/eq.
Preferably, the accelerator is at least one selected from 2,4, 6-tris (dimethylaminomethyl) phenol and triethanolamine.
Preferably, the low molecular aqueous epoxy resin curing agent is at least one selected from the group consisting of aqueous polyamides and isophorone diamine.
Preferably, the cross-linking agent is selected from at least one of N, N-methylenebisacrylamide, diacetone acrylamide and N-methylolacrylamide.
Preferably, the oxidant is at least one selected from sodium persulfate, ammonium persulfate, potassium persulfate and hydrogen peroxide.
On the other hand, the preparation method of the aqueous epoxy resin grouting material comprises the following steps:
s1: sequentially weighing the aqueous epoxy resin, the acrylic acid salt, the reducing agent and the water according to the mass percentage, mixing at room temperature, and uniformly stirring to obtain a component A;
s2: sequentially weighing a water-borne epoxy resin curing agent, an accelerator, a low-molecular water-borne epoxy resin curing agent, a cross-linking agent, an oxidant and water according to mass percent, mixing at room temperature, and uniformly stirring to obtain a component B;
s3: and sequentially weighing the component A and the component B according to the mass percentage, and uniformly stirring at room temperature to obtain the aqueous epoxy resin grouting material.
Preferably, in step S3, the amount ranges of the aqueous epoxy resin, the aqueous epoxy resin curing agent and the low-molecular aqueous epoxy resin curing agent are calculated according to the formula (1), the component a and the component B are weighed according to the mass percentage, and the aqueous epoxy resin grouting material is obtained by uniformly stirring at room temperature.
Epoxy resin amount/epoxy equivalent = epoxy curative amount/active hydrogen equivalent (1)
The formula (1) is known from the prior art, and is written by chemical industry Press, hu Yuming, of epoxy curing agent and additive.
(III) beneficial effects
The invention provides a waterborne epoxy resin grouting material and a preparation method thereof. Compared with the prior art, the method has the following beneficial effects:
1. the aqueous epoxy resin grouting material comprises aqueous epoxy resin, an aqueous epoxy resin curing agent, a low-molecular aqueous epoxy resin curing agent, an accelerator, acrylate, a reducing agent, a crosslinking agent and an oxidant, wherein the acrylate, the reducing agent, the crosslinking agent and the oxidant have high reactivity and high reaction heat release characteristics, the acrylate, the reducing agent, the crosslinking agent and the oxidant react to synthesize water-absorbent resin, and a large amount of heat is emitted, so that the temperature of the aqueous epoxy resin grouting material system is rapidly increased, the reaction rate of the aqueous epoxy resin, the aqueous epoxy resin curing agent, the small-molecular epoxy resin curing agent and the accelerator is improved, and the technical problem of long aqueous epoxy resin gel time is solved.
2. The invention utilizes the water-absorbent resin modified water-based epoxy resin synthesized by the reaction of the acrylate, the reducing agent, the cross-linking agent and the oxidant, and the water-absorbent resin absorbs free water in the water-based epoxy resin grouting material system, thereby not only improving the concentration of the epoxy resin and the curing agent in the water-based epoxy resin grouting material system, accelerating the reaction rate, but also inhibiting the volatilization of water in the system, and effectively solving the technical problem of serious shrinkage of the water-based epoxy resin grouting material caused by the volatilization of water.
3. The aqueous solution of the water-absorbent resin synthetic raw material adopted by the invention has low viscosity and water phase, so that the water-absorbent resin synthetic raw material adopted by the invention can play a special role in reducing the viscosity of the water-based epoxy resin material and improving the fluidity of the water-based epoxy resin material while enhancing various performances of the water-based epoxy resin, thereby improving the operability of the water-based epoxy resin grouting material in repairing and pouring concrete cracks.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention are clearly and completely described, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Specific information of the raw materials used in the following examples and comparative examples are as follows:
the manufacturer of the water-based epoxy resin is Shanghai Han chemical industry Co., ltd, and the brand is 220A;
the manufacturer of the waterborne epoxy resin curing agent is Shanghai Han chemical industry Co., ltd, and the brand is 220B;
sodium acrylate, self-made in a laboratory, a preparation method, and a neutralization reaction of acrylic acid and sodium hydroxide acid base;
the potassium acrylate is prepared by self-making in a laboratory, the preparation method comprises the neutralization reaction of acrylic acid and potassium hydroxide acid base;
vitamin C, the manufacturer is Zhengzhou Yu and food additive Co., ltd, and the brand is AL-650037129305;
hanging white blocks, wherein manufacturers are used for flying chemical industry in the south of China, and the brand is AOX68;
2,4, 6-tris (dimethylaminomethyl) phenol, manufactured by Nicotine sunlight plastics Co., ltd, brand DMP-30;
triethanolamine, the manufacturer is Jinan Luying chemical industry, and the brand is optimization chemical 10001;
n, N-methylene bisacrylamide is manufactured by Shandong Haohao New Material Co., ltd, and the brand is Haohao HY546564654;
diacetone acrylamide, the manufacturer is Jia Ying chemical industry Co., ltd, and the brand is Jia Ying;
n-methylolacrylamide manufactured by Shanghai He Cong Utility company under the brand name He Cong NMA-48;
sodium persulfate, the manufacturer is Jinan Jin chemical industry Co., ltd, and the brand is Fujian Longxiana 015;
ammonium persulfate is manufactured by Jinan Jin chemical industry Co., ltd, and the brand name is Fujian Longxiang a012;
the manufacturer is the Wuhanxin aerospace industry Limited liability company;
waterborne polyamide, amine number 221mg/g, laboratory homemade, preparation methods reference: liu Cancan, wang Yaqin, yang Zhen, et al, synthesis and performance studies of polyamides of high flexibility and low relative molecular mass [ J ]. Chinese adhesives, 2018, 27 (3): 17-20, 25;
isoforartan diamine is manufactured by Western chemical technology (Shandong) Co., ltd, and has the brand name of Siya reagent B21898-100ml.
It will be appreciated that the above raw material reagents are only examples of some embodiments of the invention, so that the technical solution of the invention is more clear, and it is not represented that the invention can only employ the above reagents, and the scope of the claims is in particular. In addition, "parts" described in examples and comparative examples refer to parts by mass unless otherwise specified.
Any range recited in the invention includes any numerical value between the endpoints and any sub-range of any numerical value between the endpoints or any numerical value between the endpoints.
Example 1
S1: weighing 55 parts of water-based epoxy resin 220A, 25 parts of sodium acrylate, 0.5 part of vitamin C and 19.5 parts of water, and uniformly stirring at room temperature to obtain a component A;
s2: weighing 55 parts of a waterborne epoxy resin curing agent 220B, 5 parts of 2,4, 6-tris (dimethylaminomethyl) phenol, 0.5 part of N, N-methylenebisacrylamide, 5 parts of a waterborne polyamide, 0.5 part of sodium persulfate and 34 parts of water, and uniformly stirring at room temperature to obtain a component B;
s3: weighing 50 parts of the component A and 50 parts of the component B according to the mass ratio, and uniformly stirring at room temperature to obtain the waterborne epoxy resin grouting material.
Example 2
S1: weighing 70 parts of water-based epoxy resin 220A, 10 parts of potassium acrylate, 0.1 part of white suspending block and 19.9 parts of water, and uniformly stirring at room temperature to obtain a component A;
s2: weighing 70 parts of a waterborne epoxy resin curing agent 220B, 10 parts of triethanolamine, 0.1 part of diacetone acrylamide, 5 parts of isophorone diamine, 0.1 part of ammonium persulfate and 14.8 parts of water, and uniformly stirring at room temperature to obtain a component B;
s3: weighing 50 parts of the component A and 50 parts of the component B according to the mass ratio, and uniformly stirring at room temperature to obtain the waterborne epoxy resin grouting material.
Example 3
S1: weighing 65 parts of water-based epoxy resin 220A, 15 parts of sodium acrylate, 0.2 part of white suspending block and 19.8 parts of water, and uniformly stirring at room temperature to obtain a component A;
s2: weighing 55 parts of a waterborne epoxy resin curing agent 220B, 8 parts of triethanolamine, 0.2 part of N-methylol acrylamide, 6 parts of a waterborne polyamide, 0.2 part of hydrogen peroxide and 30.6 parts of water, and uniformly stirring at room temperature to obtain a component B;
s3: weighing 45 parts of the component A and 55 parts of the component B according to the mass ratio, and uniformly stirring at room temperature to obtain the waterborne epoxy resin grouting material.
Example 4
S1: weighing 60 parts of water-based epoxy resin 220A, 20 parts of sodium acrylate, 0.4 part of white suspending block and 19.6 parts of water, and uniformly stirring at room temperature to obtain a component A;
s2: weighing 70 parts of a waterborne epoxy resin curing agent 220B, 8 parts of triethanolamine, 0.4 part of N-methylol acrylamide, 10 parts of a waterborne polyamide, 0.4 part of ammonium persulfate and 11.2 parts of water, and uniformly stirring at room temperature to obtain a component B;
s3: weighing 55 parts of the component A and 45 parts of the component B according to mass percent, and uniformly stirring at room temperature to obtain the waterborne epoxy resin grouting material.
Comparative example 1
S1: weighing 25 parts of sodium acrylate, 0.5 part of vitamin C and 74.5 parts of water, and uniformly stirring at room temperature to obtain a component A;
s2: weighing 2 parts of N-methylol acrylamide, 2 parts of ammonium persulfate and 96 parts of water, and uniformly stirring at room temperature to obtain a component B;
s3: weighing 80 parts of the component A and 20 parts of the component B according to mass percent, and uniformly stirring at room temperature to obtain the water-absorbent resin material.
Comparative example 2
S1: weighing 100 parts of aqueous epoxy resin 220A as a component A;
s2: weighing 55 parts of a waterborne epoxy resin curing agent 220B, 5 parts of 2,4, 6-tris (dimethylaminomethyl) phenol, 5 parts of a waterborne polyamide and 35 parts of water, and uniformly stirring at room temperature to obtain a component B;
s3: weighing 35.5 parts of the A component and 64.5 parts of the B component according to mass percent, and uniformly stirring at room temperature to obtain the aqueous epoxy resin grouting material.
Comparative example 3
S1: weighing 55 parts of water-based epoxy resin 220A and 45 parts of water, and uniformly stirring at room temperature to obtain a component A;
s2: weighing 55 parts of a waterborne epoxy resin curing agent 220B, 5 parts of 2,4, 6-tris (dimethylaminomethyl) phenol, 5 parts of a waterborne polyamide and 35 parts of water, and uniformly stirring at room temperature to obtain a component B;
s3: weighing 50 parts of the component A and 50 parts of the component B according to the mass percentage, and uniformly stirring at room temperature to obtain the waterborne epoxy resin grouting material.
The aqueous epoxy resin grouting emulsions prepared in the above examples 1 to 4 and comparative examples 1 to 3 were subjected to the related tests according to the test items and test standards and methods shown in table 1, and the test results are shown in table 2.
Table 1 test criteria and method
| Test item | Test standard and method |
| Compressive Strength | GB/T2567-2008 method for testing resin casting body Performance |
| Viscosity of the mixture | GB/T2794-1995 determination of adhesive viscosity |
| Gel time | GB 12007.7-1989 method for determining gel time of epoxy resin |
| Shrinkage at 7d | GB/T13354-1992 method for measuring density of liquid adhesive and drainage method |
Table 2 test results
From the data in Table 2, it is clear that comparative examples 1 to 4 show that the amount of the water-absorbent resin material added is inversely related to the compressive strength, the gel time and the initial viscosity, and that the higher the amount of the water-absorbent resin material added, the lower the compressive strength, the lower the initial viscosity and the shorter the gel time.
From examples 1 and comparative examples 2 to 3, the problems of long gel time, large shrinkage, low early strength (e.g., 2h, 1d compressive strength) and the like of the aqueous epoxy resin after the addition of the water-absorbent resin raw material can be effectively solved. The water-absorbing resin is synthesized by the reaction of the acrylate, the reducing agent, the cross-linking agent and the oxidant, and a large amount of heat is released, so that the temperature of the water-based epoxy resin grouting material system is rapidly increased, the reaction rate of the water-based epoxy resin, the water-based epoxy resin curing agent, the micromolecular epoxy resin curing agent and the accelerator is improved, and the technical problem of long gel time of the water-based epoxy resin is solved. In addition, the reaction rate of the aqueous epoxy resin, the aqueous epoxy resin curing agent, the micromolecular epoxy resin curing agent and the accelerator is high, so that the aqueous epoxy resin grouting system can be cured and molded in a short time, and the early strength of the aqueous epoxy resin grouting system is improved. On the other hand, the water-absorbent resin modified water-based epoxy resin synthesized by the reaction of the acrylate, the reducing agent, the cross-linking agent and the oxidant absorbs free water in the water-based epoxy resin grouting material system, so that the concentration of the epoxy resin and the curing agent in the water-based epoxy resin grouting material system can be increased, the reaction speed can be accelerated, and the volatilization of water in the system can be inhibited, thereby effectively solving the technical problem that the water-based epoxy resin grouting material is seriously contracted due to the volatilization of water.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The water-based epoxy resin grouting material is characterized by comprising 45-55% of A component and 45-55% of B component according to mass percent;
the component A consists of 55-70% of aqueous epoxy resin, 10-25% of acrylate, 0.1-0.5% of reducing agent and the balance of water according to mass percent;
the component B consists of 55-70% of aqueous epoxy resin curing agent, 5-10% of accelerator, 5-10% of low-molecular aqueous epoxy resin curing agent, 0.1-0.5% of cross-linking agent, 0.1-0.5% of oxidant and the balance of water according to mass percent.
2. The aqueous epoxy resin grouting material according to claim 1, wherein the aqueous epoxy resin is 220A and the epoxy equivalent is 200g/eq.
3. The aqueous epoxy resin grouting material according to claim 1, wherein the acrylic acid salt is at least one selected from sodium acrylate and potassium acrylate.
4. The aqueous epoxy resin grouting material according to claim 1, wherein the reducing agent is at least one selected from the group consisting of vitamin C and white flakes.
5. The aqueous epoxy resin grouting material according to claim 1, wherein the aqueous epoxy resin curing agent is 220B and the active hydrogen equivalent is 200g/eq.
6. The aqueous epoxy resin grouting material according to claim 1, wherein the accelerator is at least one selected from the group consisting of 2,4, 6-tris (dimethylaminomethyl) phenol and triethanolamine.
7. The aqueous epoxy resin grouting material according to claim 1, wherein the low molecular weight aqueous epoxy resin curing agent is at least one selected from the group consisting of aqueous polyamide and isophorone diamine.
8. The aqueous epoxy resin grouting material according to claim 1, wherein the crosslinking agent is at least one selected from the group consisting of N, N-methylenebisacrylamide, diacetone acrylamide and N-methylolacrylamide.
9. The aqueous epoxy resin grouting material according to claim 1, wherein the oxidant is at least one selected from the group consisting of sodium persulfate, ammonium persulfate, potassium persulfate and hydrogen peroxide.
10. A method for preparing the aqueous epoxy resin grouting material as claimed in any one of claims 1 to 9, comprising the steps of:
s1: sequentially weighing the aqueous epoxy resin, the acrylic acid salt, the reducing agent and the water according to the mass percentage, mixing at room temperature, and uniformly stirring to obtain a component A;
s2: sequentially weighing a water-borne epoxy resin curing agent, an accelerator, a low-molecular water-borne epoxy resin curing agent, a cross-linking agent, an oxidant and water according to mass percent, mixing at room temperature, and uniformly stirring to obtain a component B;
s3: and sequentially weighing the component A and the component B according to the mass percentage, mixing at room temperature, and uniformly stirring to obtain the waterborne epoxy resin grouting material.
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| CN202311196061.5A CN117285794A (en) | 2023-09-18 | 2023-09-18 | Water-based epoxy resin grouting material and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117447640A (en) * | 2023-09-20 | 2024-01-26 | 河北宇阳泽丽防水材料有限公司 | High-elasticity acrylate grouting material |
| CN117447640B (en) * | 2023-09-20 | 2024-05-10 | 河北宇阳泽丽防水材料有限公司 | High-elasticity acrylate grouting material |
-
2023
- 2023-09-18 CN CN202311196061.5A patent/CN117285794A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117447640A (en) * | 2023-09-20 | 2024-01-26 | 河北宇阳泽丽防水材料有限公司 | High-elasticity acrylate grouting material |
| CN117447640B (en) * | 2023-09-20 | 2024-05-10 | 河北宇阳泽丽防水材料有限公司 | High-elasticity acrylate grouting material |
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