CN117276144B - Semiconductor water-cooling cavity structure and semiconductor processing equipment - Google Patents
Semiconductor water-cooling cavity structure and semiconductor processing equipment Download PDFInfo
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- CN117276144B CN117276144B CN202311556195.3A CN202311556195A CN117276144B CN 117276144 B CN117276144 B CN 117276144B CN 202311556195 A CN202311556195 A CN 202311556195A CN 117276144 B CN117276144 B CN 117276144B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 42
- 238000001816 cooling Methods 0.000 title claims abstract description 35
- 238000012545 processing Methods 0.000 title claims abstract description 35
- 239000000498 cooling water Substances 0.000 claims abstract description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 106
- 238000005192 partition Methods 0.000 claims description 47
- 230000000903 blocking effect Effects 0.000 claims description 3
- 210000001503 joint Anatomy 0.000 claims description 2
- 230000004888 barrier function Effects 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000000306 component Substances 0.000 description 22
- 230000009286 beneficial effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 239000008358 core component Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a semiconductor water-cooling cavity structure and semiconductor processing equipment, which belong to the technical field of semiconductor processing and manufacturing, wherein the semiconductor water-cooling cavity structure comprises an upper disk surface, a lower disk surface and an outer disk surface, the outer disk surface is cylindrical, the lower disk surface is arranged in the outer disk surface, and the upper disk surface is covered on one end of the outer disk surface; the upper disc surface and the lower disc surface are arranged oppositely and are matched to form an internal water channel for accommodating cooling water; an external water channel surrounding the lower disc surface is arranged between the inner side wall of the external disc surface and the outer side wall of the lower disc surface. The invention is characterized in that the upper disc surface, the lower disc surface and the outer disc surface are mutually matched and combined into a whole, an inner water channel and an outer water channel are respectively formed inside and outside the lower disc surface, the cross section area of the water channel is greatly increased, the integral heat exchange amount and the cooling efficiency are improved, and meanwhile, the internal materials are reduced, so that the weight of parts is reduced.
Description
Technical Field
The invention belongs to the technical field of semiconductor processing and manufacturing, and particularly relates to a semiconductor water-cooling cavity structure and semiconductor processing equipment.
Background
In a semiconductor device, a heat treatment process for a wafer is an essential link, and a structure for cooling a heated wafer is also a key core component in the semiconductor device.
The structure for cooling the heated wafer usually adopts a cooling water channel for cooling, and under the condition that the cooling water channel is an independent channel structure, the technical scheme of designing a process cooling water system, namely a PCW cooling water channel, in the structure needing cooling is common and has higher cost performance. Currently, referring to fig. 6, in the prior art, a metal monolith is generally used to directly manufacture an integral structure, a water channel structure is designed at a corresponding position, the water channel structure is manufactured together in the integral manufacture, and finally an internal water channel is formed by welding at an end face.
However, the above-described solutions of the prior art have the following drawbacks: 1. the whole processing mode is very challenging to raw materials and processing cost, and is not beneficial to equipment cost control; 2. due to the adoption of the integral processing mode, the limitation of the processing technology is required to be considered in the design of the internal water channel. In addition, the structural design of the cooling waterway water channel is relatively simple, the cross section area of the water channel is smaller, and the heat exchange and cooling efficiency is low.
Disclosure of Invention
Based on the technical problems existing in the prior art, the invention provides a semiconductor water cooling cavity structure and semiconductor processing equipment, and aims to solve the technical problems that a water channel structure in a cooling cavity in the prior art is limited by an integral processing technology, heat exchange and cooling efficiency is low, and the integral processing mode causes high material cost and processing cost and large weight.
In order to achieve the above object, according to one aspect of the present invention, there is provided a semiconductor water cooling cavity structure, including an upper disk surface, a lower disk surface and an outer disk surface, the outer disk surface is cylindrical, the lower disk surface is mounted in the outer disk surface, and the upper disk surface is covered at one end of the outer disk surface; the upper disc surface and the lower disc surface are arranged oppositely and are matched to form an internal water channel for accommodating cooling water; a first baffle component is arranged between the upper disk surface and the lower disk surface and is used for separating an internal water channel into a water inlet channel and a water outlet channel; an inner water channel water inlet communicated with the water inlet channel and an inner water channel water outlet communicated with the water outlet channel are arranged on the lower disc surface, and the inner water channel water inlet and the inner water channel water outlet are respectively used for inflow and outflow of cooling water; an external water channel surrounding the lower disc surface is arranged between the inner side wall of the external disc surface and the outer side wall of the lower disc surface, and two ends of the external water channel are respectively provided with an external water channel water inlet communicated with the water inlet channel and an external water channel water outlet communicated with the water outlet channel; the edge of the lower disk surface forms an annular bulge upwards in the disk surface direction, the annular bulge is abutted with one side of the upper disk surface facing the lower disk surface, and the annular bulge, the lower disk surface and the upper disk surface are enclosed to form an internal water channel; the inner side wall of the outer disk surface is provided with an inner flange, the inner flange is in butt joint with the outer side wall of the lower disk surface, the inner flange is arranged at intervals with the upper disk surface, and the upper disk surface, the outer disk surface, the inner flange and the lower disk surface are enclosed to form an outer water channel.
Optionally, a second baffle component for blocking cooling water is arranged in the external water channel, and the water inlet of the external water channel and the water outlet of the external water channel are respectively positioned at two sides of the second baffle component.
Optionally, the annular protrusion is provided with a first opening, the second baffle component is arranged between the upper disc surface and the inner flange, one end of the second baffle component in the length direction is abutted with the inner side wall of the outer disc surface, and the other end of the second baffle component in the length direction extends into the inner water channel through the first opening.
Optionally, the second baffle assembly separates the first opening into an external waterway water inlet and an external waterway water outlet; the first baffle component is arranged between the water inlet of the internal water channel and the water outlet of the internal water channel, one end of the first baffle component in the length direction is abutted with one end of the second baffle component extending to the internal water channel, and the other end of the first baffle component in the length direction is connected with the annular raised inner side wall.
Optionally, the first baffle component comprises a first baffle and a second baffle, and the second baffle is of an arc structure; the first partition plate is positioned between the water inlet of the internal water channel and the water outlet of the internal water channel, the second partition plate is arranged in the annular bulge at intervals, and the first partition plate is connected between the annular bulge and the second partition plate; the second baffle component comprises a first slot and a first insert block, the first slot is arranged on the lower disc surface, the first insert block is arranged on one side of the upper disc surface facing the lower disc surface, the first slot is a through slot, one side of the first slot is provided with a second opening, the second opening is formed on the outer side wall of the lower disc surface, and the second opening is communicated with the first opening; the first inserting block is inserted into the first slot, the outer side wall of the first inserting block is abutted with the inner side wall of the first slot, the first inserting block separates the first opening into an outer water channel water inlet and an outer water channel water outlet, one end, opposite to the upper disc surface, of the first inserting block is abutted with the inner flange, one end, in the length direction, of the first inserting block is abutted with the inner side wall of the outer disc surface, the other end, in the length direction, of the first inserting block is abutted with one end of the second separating plate, and the other end of the second separating plate is located between the first separating plate and the first slot.
Optionally, the second baffle has an arc of greater than 180 °.
Optionally, one or more first grooves for accommodating temperature sensors are formed on the surface of the first insert block facing the lower disc surface.
Optionally, the first baffle assembly further comprises a third baffle and a fourth baffle, one end of the third baffle is connected with the other end of the second baffle, and the other end of the third baffle extends towards the edge direction of the lower disc surface and is arranged at intervals with the annular bulge; the fourth baffle is located between third baffle and the first inserted block, and the fourth baffle set up with third baffle, first inserted block interval respectively, and the one end of fourth baffle is connected in annular bellied inside wall, and the other end of fourth baffle extends and sets up with the inside wall interval of second baffle down the central direction of quotation.
Optionally, a third baffle component is arranged in the water outlet channel, the third baffle component comprises a second slot arranged on the lower disc surface and a second insert block arranged on the upper disc surface, the second slot is arranged between the first slot and the third baffle, and the second slot is respectively arranged at intervals with the first slot and the third baffle; the second inserting block is inserted into the second slot, one end of the second inserting block is abutted against one end of the fourth partition board, which is far away from the annular bulge, and the other end of the second inserting block extends towards the center direction of the lower disk surface and is arranged at intervals with the second partition board; one or more second grooves for accommodating temperature sensors are arranged on one surface of the second plug block facing the lower disc surface.
According to another aspect of the present invention, there is provided a semiconductor processing apparatus comprising a semiconductor water-cooled cavity structure as described above.
The semiconductor water-cooling cavity structure provided by the invention has the beneficial effects that:
(1) The upper disc surface, the lower disc surface and the outer disc surface are mutually matched and combined into a whole, an inner water channel and an outer water channel are respectively formed in the lower disc surface and the outer part of the lower disc surface, so that the cross section area of the water channel is greatly increased, and the overall heat exchange quantity and cooling efficiency are improved;
(2) The internal water channel is divided into the water inlet channel and the water outlet channel through the first baffle component, so that internal materials are reduced, and the weight of parts in the same form is further reduced;
(3) The invention adopts the assembly processing technology, does not need integral processing of the monolith, greatly increases the cross section area of the water channel, reduces the weight of raw materials and processing time, and further reduces the processing and purchasing cost of parts.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is an exploded view of a semiconductor water-cooled cavity structure according to some embodiments of the present invention;
FIG. 2 is an exploded view of another angle of a semiconductor water-cooled cavity structure according to some embodiments of the present invention;
FIG. 3 is an assembled schematic view of a semiconductor water-cooled cavity structure according to some embodiments of the present invention;
FIG. 4 is a cross-sectional view of a semiconductor water-cooled cavity structure according to some embodiments of the present invention;
FIG. 5 is a cross-sectional view of an internal waterway and an external waterway provided in accordance with some embodiments of the present invention;
FIG. 6 is a schematic view of a fabricated waterway using a metal monolith.
Reference numerals related to the above figures are as follows:
1. a water channel;
10. an upper disc surface; 11. positioning columns;
20. a lower disc surface; 21. an annular protrusion; 22. a first opening; 23. positioning holes;
30. an outer disk surface; 31. an inner flange;
40. an internal waterway; 41. a water inlet channel; 42. a water outlet channel; 43. a water inlet of the inner water channel; 44. a water outlet of the inner water channel;
50. an external waterway; 51. an external water channel water inlet; 52. a water outlet of the outer water channel;
60. a first separator; 61. a second separator; 62. a third separator; 63. a fourth separator;
70. a first slot; 71. a first plug; 72. a second opening; 73. a first groove;
80. a second slot; 81. a second insert block; 82. and a second groove.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element. Embodiments of the invention and features of the embodiments may be combined with each other without conflict. The invention will be described in detail below with reference to the drawings in connection with embodiments.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "plurality" is two or more unless specifically defined otherwise.
As described in the background art, currently, the known solution is generally to directly process a monolithic structure using a metal monolith, design a water channel structure at a corresponding position, process the water channel structure together in the monolithic process, and finally weld the end surfaces to form an internal water channel. However, the above scheme has the following disadvantages: 1. the whole processing mode is very challenging to raw materials and processing cost, and is not beneficial to equipment cost control; 2. because of adopting the integral processing mode, the limit of the processing technology needs to be considered in the design of the internal water channel, the structural design of the water channel is relatively simple, the sectional area of the water channel is smaller, and the heat exchange and cooling efficiency is low.
Referring to fig. 1 to 5, in order to solve the above problems, according to an aspect of the present invention, there is provided a semiconductor water cooling cavity structure including an upper disk surface 10, a lower disk surface 20 and an outer disk surface 30, the outer disk surface 30 being cylindrical, the lower disk surface 20 being installed in the outer disk surface 30, the upper disk surface 10 being capped at one end of the outer disk surface 30; the upper disk surface 10 and the lower disk surface 20 are arranged oppositely and are matched to form an internal water channel 40 for containing cooling water; a first baffle assembly is arranged between the upper disc surface 10 and the lower disc surface 20 and is used for separating the internal water channel 40 into a water inlet channel 41 and a water outlet channel 42; the lower disc surface 20 is provided with an inner water channel water inlet 43 communicated with the water inlet channel 41 and an inner water channel water outlet 44 communicated with the water outlet channel 42, wherein the inner water channel water inlet 43 and the inner water channel water outlet 44 are respectively used for inflow and outflow of cooling water, and the inner water channel water inlet 43 is communicated with an external cooling system, such as a process cooling water system PCW, through a pipeline; an external water channel 50 surrounding the lower disc surface 20 is arranged between the inner side wall of the external disc surface 30 and the outer side wall of the lower disc surface 20, and two ends of the external water channel 50 are respectively provided with an external water channel water inlet 51 and an external water channel water outlet 52; wherein, the outer water channel water inlet 51 is communicated with the water inlet channel 41, and the outer water channel water outlet 52 is communicated with the water outlet channel 42. In actual use, cooling water enters the water inlet channel 41 through the inner water channel water inlet 43, flows into the outer water channel 50 through the outer water channel water inlet 51, flows into the water outlet channel 42 through the outer water channel water outlet 52, and finally returns to the external cooling system through the inner water channel water outlet 44. The semiconductor water cooling cavity structure provided by the embodiment is formed by mutually matching and combining the upper disk surface 10, the lower disk surface 20 and the outer disk surface 30 into a whole, and an inner water channel 40 and an outer water channel are respectively formed inside and outside the lower disk surface 20, so that the cross section area of the water channel is greatly increased, and the integral heat exchange capacity and the cooling efficiency are improved under the condition of the same external PCW service pressure, wherein the positions of the upper disk surface 10, the lower disk surface 20 and the outer disk surface 30 which are mutually connected can be fixed in a welding mode, and the cross section of the water channel is a cross section vertical to the axial direction of the lower disk surface 20; meanwhile, as the internal water channel 40 is divided into the water inlet channel 41 and the water outlet channel 42 only through the first baffle component, internal materials are greatly reduced, and the weight of parts in the same form is further reduced; in addition, as the semiconductor water-cooling cavity structure adopts an assembling processing technology, the integral processing of a monolith is not needed, the cross section area of a water channel is greatly increased, the weight of raw materials and the processing time are reduced, and the processing and purchasing cost of parts is further reduced.
Referring to fig. 1, in some embodiments, an annular protrusion 21 is formed on an edge of the lower disk surface 20 toward the upper disk surface 10, the annular protrusion 21 abuts against a side of the upper disk surface 10 facing the lower disk surface 20, and the annular protrusion 21, the lower disk surface 20, and the upper disk surface 10 enclose an internal water channel 40. It will be appreciated that the annular protrusion 21 is disposed along the edge of the lower disc surface 20, the upper disc surface 10 is disposed above the annular protrusion 21, and the upper disc surface 10 and the lower disc surface 20 are spaced apart from each other by the annular protrusion 21, thereby forming an accommodating space between the upper disc surface 10 and the lower disc surface 20 for accommodating the internal water channel 40 of the cooling water.
Referring to fig. 4 and 5, in some embodiments, the inner side wall of the outer disk surface 30 is spaced from the outer side wall of the lower disk surface 20, the inner side wall of the outer disk surface 30 is provided with an inner flange 31, the inner flange 31 abuts against the outer side wall of the lower disk surface 20, the inner flange 31 is spaced from the upper disk surface 10, and the upper disk surface 10, the outer disk surface 30, the inner flange 31 and the lower disk surface 20 enclose an outer water channel 50; a second baffle assembly for blocking cooling water is arranged in the external water channel 50, and the external water channel water inlet 51 and the external water channel water outlet 52 are respectively positioned at two sides of the second baffle assembly. Wherein, the inner flange 31 extends along the circumferential direction of the outer disk surface 30 to form an annular structure, the annular structure protrudes from the inner side wall of the outer disk surface 30, the inner flange 31 is positioned below the upper disk surface 10 and is arranged at a distance from the upper disk surface 10, so that the inner flange 31 can form an outer water channel 50 for containing cooling water with the upper disk surface 10, the outer disk surface 30 and the lower disk surface 20.
Referring to fig. 1 and 5, in some embodiments, the annular protrusion 21 has a first opening 22 thereon, the first opening 22 communicates with the inner waterway 40 and the outer waterway 50, respectively, for example, the annular protrusion 21 has two ends disposed at a distance from each other to form the first opening 22; the second baffle assembly is arranged between the upper disc surface 10 and the inner flange 31, and it is understood that the height of the second baffle assembly is the same as that of the external water channel; the second baffle component is provided with two ends along the length direction, one end of the second baffle component is abutted with the inner side wall of the outer disk surface 30, the other end of the second baffle component extends into the inner water channel 40 through the first opening 22, the second baffle component separates the first opening 22 into an outer water channel water inlet 51 and an outer water channel water outlet 52, and the second baffle component is positioned in the middle of the first opening 22; the first baffle assembly is arranged between the inner water channel water inlet 43 and the inner water channel water outlet 44, the height of the first baffle assembly is the same as that of the inner water channel 40, the first baffle assembly is provided with two ends along the length direction of the first baffle assembly, one end of the first baffle assembly in the length direction is abutted with one end of the second baffle assembly extending to the inner water channel 40, and the other end of the first baffle assembly in the length direction is connected with the inner side wall of the annular bulge 21. The first baffle assembly is connected with the second baffle assembly to divide the interior waterway 40 into a water inlet channel 41 and a water outlet channel 42, and the second baffle assembly also divides the first opening 22 into an exterior waterway water inlet 51 respectively communicating with the exterior waterway and the water inlet channel 41, and an exterior waterway water outlet 52 respectively communicating with the exterior waterway and the water outlet channel 42.
Referring to fig. 1, 2 and 5, in some embodiments, the first baffle assembly includes a first baffle 60 and a second baffle 61, the first baffle 60 and the second baffle 61 each having the same height as the interior waterway 40; the second partition 61 has a circular arc structure. The first partition 60 is located between the inner water inlet 43 and the inner water outlet 44, the second partition 61 is disposed at intervals inside the annular protrusion 21, the first partition 60 has two ends along its length direction, one end of which is connected to the inner sidewall of the annular protrusion 21, and the other end of which is connected to the second partition 61, wherein one end of the first partition 60 connected to the second partition 61 is preferably disposed between the two ends of the second partition 61. The second baffle assembly comprises a first slot 70 and a first insert block 71, the first slot 70 is arranged on the lower disc surface 20 and is positioned on one side of the first opening 22, the first insert block 71 is arranged on one side of the upper disc surface 10 facing the lower disc surface 20, the first slot 70 is a through slot, one side of the first slot 70 is provided with a second opening 72, the second opening 72 is formed on the outer side wall of the lower disc surface 20 so that the second opening 72 faces the inner side wall of the outer disc surface 30, and the second opening 72 is communicated with the first opening 22; the first insert 71 is inserted into the first slot 70, the outer side wall of the first insert 71 is abutted against the inner side wall of the first slot 70, the first insert 71 partitions the first opening 22 into the outer water inlet 51 and the outer water outlet 52, one end of the first insert 71 opposite to the upper disc surface 10 is abutted against the inner flange 31, one end of the first insert 71 in the length direction is abutted against the inner side wall of the outer disc surface 30, the other end of the first insert 71 in the length direction is abutted against one end of the second partition 61, the other end of the second partition 61 is located between the first partition 60 and the first slot 70, preferably, the one end of the first insert 71 abutted against the second partition 61 extends to the inner side of the second partition 61 and is arranged at an interval from the inner side wall of the second partition 61. The first partition 60, the second partition 61 and the first insertion block 71 are connected in sequence to partition the internal waterway 40 into the water inlet 41 and the water outlet 42, and the first insertion block 71 partitions the first opening 22 into the external waterway water inlet 51 and the external waterway water outlet 52 such that the external waterway water inlet 51 and the external waterway water outlet 52 are located at both ends of the external waterway 50, respectively.
Referring to fig. 5, in some alternative embodiments, the second baffle 61 may have an arc greater than 180 ° to increase the flow cross section of the cooling water.
Referring to FIG. 2, in some embodiments, the side of the first insert 71 facing the lower disk surface 20 is provided with one or more first grooves 73 for receiving temperature sensors. The temperature sensor can be conveniently provided by the first groove 73 on the first plug 71 without changing the installation position of the original temperature sensor.
Referring to fig. 1 and 5, in some embodiments, the first baffle assembly further includes a third baffle 62 and a fourth baffle 63, one end of the third baffle 62 is connected to the other end of the second baffle 61, and the other end of the third baffle 62 extends toward the edge of the disk surface 20 and is spaced apart from the annular protrusion 21; the fourth partition 63 is located between the third partition 62 and the first insert 71, and the fourth partition 63 is disposed at intervals with the third partition 62 and the first insert 71, respectively, one end of the fourth partition 63 is connected to the inner side wall of the annular protrusion 21, and the other end of the fourth partition 63 extends toward the center direction of the lower disc surface 20 and is disposed at intervals with the inner side wall of the second partition 61. It should be noted that, the third partition plate 62 and the fourth partition plate 63 are disposed in the water outlet channel 42, and are used for guiding the cooling water in the water outlet channel 42, and the cooling water flows to the center direction of the lower disk surface 20 along the channel formed by the fourth partition plate 63 and the first insert 71 after passing through the outer water outlet channel 52, and flows to the edge of the lower disk surface 20 along the channel formed by the fourth partition plate 63 and the third partition plate 62, thereby increasing the cross-sectional area of the water channel, and being beneficial to improving the overall heat exchange amount and cooling efficiency.
Referring to fig. 1, 2 and 5, in some embodiments, a third baffle assembly is disposed in the water outlet channel 42, the third baffle assembly includes a second slot 80 disposed on the lower disc surface 20 and a second insert 81 disposed on the upper disc surface 10, the second slot 80 is disposed between the first slot 70 and the third partition 62, and the second slot 80 is disposed at a distance from the first slot 70 and the third partition 62, respectively; the second insert block 81 is inserted into the second slot 80, the second insert block 81 is matched with the second slot 80, one end of the second insert block 81 is abutted against one end of the fourth partition board 63 away from the annular bulge 21, and the other end of the second insert block 81 extends towards the center direction of the disk surface 20 and is arranged at intervals with the inner side wall of the second partition board 61; the side of the second insert 81 facing the lower disc surface 20 is provided with one or more second grooves 82 for receiving temperature sensors. The second insertion groove 80 and the second insertion block 81 are provided in the water outlet channel 42, and can further guide the cooling water without changing the installation position of the original temperature sensor so as to increase the cross-sectional area of the water channel.
Referring to fig. 2, in some embodiments, a plurality of positioning posts 11 are provided on the upper disk surface 10, and a plurality of positioning holes 23 are provided on the lower disk surface 20, and the positioning posts 11 are inserted in one-to-one correspondence with the positioning holes 23.
According to another aspect of the present invention, there is provided a semiconductor processing apparatus comprising a semiconductor water-cooled cavity structure as in any of the embodiments described above. Because the semiconductor processing device provided by the embodiment of the present invention has the same advantages as the semiconductor water-cooling cavity structure of the above embodiment, the description thereof is omitted.
In summary, implementing the semiconductor water-cooling cavity structure and the semiconductor processing device provided in this embodiment has at least the following beneficial technical effects:
(1) The invention adopts the processing technology of assembling and welding to form the internal and external annular water channels, thereby greatly increasing the cross section area of the water channels, simultaneously adopting a small amount of baffle components in the interior, reducing the internal materials and further reducing the weight of parts in the same form;
(2) The processing mode of assembling and welding is adopted, and meanwhile, the weight and the processing time of raw materials can be reduced, so that the processing and purchasing cost of parts is reduced.
(3) The cross section area of the water channel is greatly increased, so that the whole heat exchange quantity and the cooling efficiency are improved under the condition of the same external PCW factory pressure.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (9)
1. The semiconductor water-cooling cavity structure is characterized by comprising an upper disk surface, a lower disk surface and an outer disk surface, wherein the outer disk surface is cylindrical, the lower disk surface is arranged in the outer disk surface, and the upper disk surface is covered at one end of the outer disk surface;
the upper disc surface and the lower disc surface are arranged oppositely and are matched to form an internal water channel for accommodating cooling water;
a first baffle component is arranged between the upper disk surface and the lower disk surface and is used for separating an internal water channel into a water inlet channel and a water outlet channel;
an inner water channel water inlet communicated with the water inlet channel and an inner water channel water outlet communicated with the water outlet channel are arranged on the lower disc surface, and the inner water channel water inlet and the inner water channel water outlet are respectively used for inflow and outflow of cooling water;
an external water channel surrounding the lower disc surface is arranged between the inner side wall of the external disc surface and the outer side wall of the lower disc surface, and two ends of the external water channel are respectively provided with an external water channel water inlet communicated with the water inlet channel and an external water channel water outlet communicated with the water outlet channel;
the edge of the lower disk surface forms an annular bulge upwards in the disk surface direction, the annular bulge is abutted with one side of the upper disk surface facing the lower disk surface, and the annular bulge, the lower disk surface and the upper disk surface are enclosed to form an internal water channel; the inner side wall of the outer disk surface is provided with an inner flange, the inner flange is in butt joint with the outer side wall of the lower disk surface, the inner flange is arranged at intervals with the upper disk surface, and the upper disk surface, the outer disk surface, the inner flange and the lower disk surface are enclosed to form an outer water channel;
the outside water channel is internally provided with a second baffle component for blocking cooling water, and the water inlet of the outside water channel and the water outlet of the outside water channel are respectively positioned at two sides of the second baffle component.
2. The semiconductor water-cooling cavity structure according to claim 1, wherein the annular protrusion is provided with a first opening, the second baffle component is arranged between the upper disk surface and the inner flange, one end of the second baffle component in the length direction is abutted with the inner side wall of the outer disk surface, and the other end of the second baffle component in the length direction extends into the inner water channel through the first opening.
3. The semiconductor water-cooled cavity structure of claim 2, wherein the second barrier assembly separates the first opening into an external waterway inlet and an external waterway outlet; the first baffle component is arranged between the water inlet of the internal water channel and the water outlet of the internal water channel, one end of the first baffle component in the length direction is abutted with one end of the second baffle component extending to the internal water channel, and the other end of the first baffle component in the length direction is connected with the annular raised inner side wall.
4. The semiconductor water-cooling cavity structure of claim 3, wherein the first baffle assembly comprises a first baffle and a second baffle, the second baffle being of a circular arc configuration;
the first partition plate is positioned between the water inlet of the internal water channel and the water outlet of the internal water channel, the second partition plate is arranged in the annular bulge at intervals, and the first partition plate is connected between the annular bulge and the second partition plate;
the second baffle component comprises a first slot and a first insert block, the first slot is arranged on the lower disc surface, the first insert block is arranged on one side of the upper disc surface facing the lower disc surface, the first slot is a through slot, one side of the first slot is provided with a second opening, the second opening is formed on the outer side wall of the lower disc surface, and the second opening is communicated with the first opening;
the first inserting block is inserted into the first slot, the outer side wall of the first inserting block is abutted with the inner side wall of the first slot, the first inserting block separates the first opening into an outer water channel water inlet and an outer water channel water outlet, one end, opposite to the upper disc surface, of the first inserting block is abutted with the inner flange, one end, in the length direction, of the first inserting block is abutted with the inner side wall of the outer disc surface, the other end, in the length direction, of the first inserting block is abutted with one end of the second separating plate, and the other end of the second separating plate is located between the first separating plate and the first slot.
5. The semiconductor water-cooled cavity structure of claim 4, wherein the arc of the second spacer is greater than 180 °.
6. The semiconductor water-cooling cavity structure according to claim 4, wherein one surface of the first insert facing the lower disc surface is provided with one or more first grooves for accommodating the temperature sensor.
7. The semiconductor water-cooling cavity structure according to claim 4, wherein the first baffle assembly further comprises a third baffle and a fourth baffle, one end of the third baffle is connected with the other end of the second baffle, and the other end of the third baffle extends towards the edge direction of the lower disc surface and is arranged at intervals with the annular bulge;
the fourth baffle is located between third baffle and the first inserted block, and the fourth baffle set up with third baffle, first inserted block interval respectively, and the one end of fourth baffle is connected in annular bellied inside wall, and the other end of fourth baffle extends and sets up with the inside wall interval of second baffle down the central direction of quotation.
8. The semiconductor water-cooling cavity structure according to claim 7, wherein a third baffle component is arranged in the water outlet channel, the third baffle component comprises a second slot arranged on the lower disk surface and a second insert block arranged on the upper disk surface, the second slot is arranged between the first slot and the third baffle, and the second slot is respectively arranged at intervals with the first slot and the third baffle;
the second inserting block is inserted into the second slot, one end of the second inserting block is abutted against one end of the fourth partition board, which is far away from the annular bulge, and the other end of the second inserting block extends towards the center direction of the lower disk surface and is arranged at intervals with the second partition board;
one or more second grooves for accommodating temperature sensors are arranged on one surface of the second plug block facing the lower disc surface.
9. A semiconductor processing apparatus comprising a semiconductor water-cooled cavity structure as claimed in any one of claims 1 to 8.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311556195.3A CN117276144B (en) | 2023-11-21 | 2023-11-21 | Semiconductor water-cooling cavity structure and semiconductor processing equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311556195.3A CN117276144B (en) | 2023-11-21 | 2023-11-21 | Semiconductor water-cooling cavity structure and semiconductor processing equipment |
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| CN117276144B true CN117276144B (en) | 2024-01-26 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201100974Y (en) * | 2007-09-18 | 2008-08-13 | 奇鋐科技股份有限公司 | Water cooling heat radiation module for electronic device |
| CN202049945U (en) * | 2011-04-25 | 2011-11-23 | 江阴市可控硅附件有限公司 | Water cooling radiator |
| CN111180399A (en) * | 2018-11-09 | 2020-05-19 | 宁波江丰电子材料股份有限公司 | Cooling plate and manufacturing method thereof |
| CN214168124U (en) * | 2020-12-31 | 2021-09-10 | 成都纽曼和瑞微波技术有限公司 | Cavity cover, cavity and plasma chemical vapor deposition equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM530013U (en) * | 2016-05-20 | 2016-10-01 | Kuan Ding Ind Co Ltd | Liquid-cooling heat dissipation device |
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- 2023-11-21 CN CN202311556195.3A patent/CN117276144B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201100974Y (en) * | 2007-09-18 | 2008-08-13 | 奇鋐科技股份有限公司 | Water cooling heat radiation module for electronic device |
| CN202049945U (en) * | 2011-04-25 | 2011-11-23 | 江阴市可控硅附件有限公司 | Water cooling radiator |
| CN111180399A (en) * | 2018-11-09 | 2020-05-19 | 宁波江丰电子材料股份有限公司 | Cooling plate and manufacturing method thereof |
| CN214168124U (en) * | 2020-12-31 | 2021-09-10 | 成都纽曼和瑞微波技术有限公司 | Cavity cover, cavity and plasma chemical vapor deposition equipment |
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| CN117276144A (en) | 2023-12-22 |
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