CN117272715A - System thermal insulation performance simulation test method under severe cold condition - Google Patents
System thermal insulation performance simulation test method under severe cold condition Download PDFInfo
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- 238000004088 simulation Methods 0.000 title claims abstract description 54
- 238000010998 test method Methods 0.000 title claims abstract description 25
- 238000009413 insulation Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 44
- 238000012360 testing method Methods 0.000 claims abstract description 40
- 238000004321 preservation Methods 0.000 claims abstract description 17
- 230000008569 process Effects 0.000 claims abstract description 12
- 239000012774 insulation material Substances 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 41
- 230000003993 interaction Effects 0.000 claims description 12
- 238000012546 transfer Methods 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 6
- 230000001052 transient effect Effects 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 238000000691 measurement method Methods 0.000 claims description 4
- 238000004422 calculation algorithm Methods 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 230000009191 jumping Effects 0.000 claims description 3
- 230000007935 neutral effect Effects 0.000 claims description 3
- 230000004044 response Effects 0.000 claims description 3
- 238000012805 post-processing Methods 0.000 claims description 2
- 230000036314 physical performance Effects 0.000 claims 2
- 238000005265 energy consumption Methods 0.000 abstract description 11
- 239000004814 polyurethane Substances 0.000 abstract description 10
- 239000004964 aerogel Substances 0.000 abstract description 7
- 239000011491 glass wool Substances 0.000 abstract description 7
- 238000005457 optimization Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 16
- 238000004364 calculation method Methods 0.000 description 7
- 229920002635 polyurethane Polymers 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention discloses a system thermal insulation performance simulation test method under severe cold conditions. In the invention, solidworks three-dimensional modeling software is adopted to build a model, and Abaqus finite element simulation software is used for carrying out steady-state thermal simulation on the outside temperature and indoor energy consumption conditions of different heat insulation material structures (50 mm Polyurethane (PU) sandwich boards, 50mm Glass Wool (GW) boards, 50mm aerogel felts (AG) and 50mm Vacuum Insulation Panels (VIP)) at different outdoor environment temperatures (-40 ℃/-20 ℃/0 ℃). The simulation is used for checking the optimization condition of using different structure heat preservation layers to temperature and energy consumption, and under the premise of not influencing the test accuracy, the following is assumed: the steady-state thermal simulation is carried out on the heat preservation system, so that the test efficiency of the whole test process is improved, the test precision is improved, the test can be more quickly and efficiently carried out in the test process, and the overall convenience in use is improved.
Description
Technical Field
The invention belongs to the technical field of heat preservation tests, and particularly relates to a system heat preservation performance simulation test method under severe cold conditions.
Background
And (3) continuously heating the room, maintaining the indoor temperature to be 10 ℃, and calculating the outside temperature and indoor energy consumption conditions of the heat preservation boards with different heat preservation structures at the outdoor environment temperature of-40 ℃/-20 ℃/0 ℃ by using the existing polyurethane sandwich board heat preservation layer with the thickness of 50 mm. It is therefore necessary to perform test calculations on its thermal insulation properties.
However, the overall accuracy of the common calculation method is not high enough, so that errors are easy to occur in the calculation process, and inaccurate calculation is caused.
Disclosure of Invention
The invention aims at: in order to solve the problems, a simulation test method for the heat preservation performance of the system under severe cold conditions is provided.
The technical scheme adopted by the invention is as follows: a system thermal insulation performance simulation test method under severe cold conditions comprises the following steps:
s1, firstly, a model is built, a 1:1 simplified model (total height is 40.5m, upper section is 8.3m, 4.7m, cuboid of 8.3m, 8.64m, 4.7m-14m, diameter of 3.3m is changed, lower section is 14m, 32.5m cuboid of 14 m) is built through Solidworks modeling software design, and the built model is imported into Abaqus simulation software.
S2, setting material properties, clicking a module after the model is imported, and selecting the properties; clicking "create materials", "thermal", "conductivity" in turn, setting the conductivity to the value required in the operating mode;
s3, assembling, namely selecting the assembly in the module. Clicking "CreateInstance", selecting "parts", clicking "determine";
s4, performing analysis steps, selecting analysis steps in a module, clicking a creation analysis part, and selecting heat transfer after assembly is completed. Clicking on "continue" sets "response" to "steady state";
s5, selecting 'interaction' in 'module', clicking 'create interaction', and selecting 'surface heat exchange condition'. Sequentially selecting each inner wall surface of the model, clicking the 'finishing' window, jumping out of the 'editing interaction' window, setting the 'film heat dissipation coefficient' as 0.006987 and setting the 'environment temperature' as 10 degrees;
s6, editing the load, selecting the load in a module, clicking the creating boundary condition, selecting the temperature, clicking the continuing, then sequentially selecting each outer wall surface of the model, and setting the temperature to be-40 ℃;
s7, meshing, namely selecting a 'mesh' in a 'module', clicking a 'seed for a component example', and changing the value of the 'approximate global size' into about one third of the original size. Then click "assign grid control attributes", select "neutral axis algorithm", click "determine". Then click "grid for part", grid number 49220. Then click "assign element type", select "heat transfer" in "family", click "determine";
s8, submitting a job, selecting the job in a module, and clicking the create job, continuing and determining in sequence; then selecting a job manager, clicking a submit, and checking a result after the work is completed;
s9, carrying out data post-processing, wherein the diameters of 11 meters are the average diameters of 14 meters, 8.64 meters and 8.3 meters for simplifying the different ring temperature data of the 50mm-PU sandwich board;
and S10, collecting and recording the data result obtained by the test, and ending the whole test flow.
In a preferred embodiment, after the thermal conductivity is set in the step S2, click "create section", click "entity", "homogenize", "determine", then click "assign section", fully select the model, and then click "complete".
In a preferred embodiment, in step S5, the "ambient temperature" of each outer wall surface is set to-40 degrees in sequence in step interaction.
In a preferred embodiment, in step S5, the temperature of each inner wall surface of the model is set to 10 degrees in sequence, so as to complete the simulation of the working condition.
In a preferred embodiment, in the step S2, the first step of studying the thermal insulation performance of the material is to be able to accurately determine the thermophysical properties of the material, and one of the main parameters reflecting the thermophysical properties of the material is the thermal conductivity coefficient. The thermal conductivity is generally denoted by λ, defined as: under steady state thermal equilibrium conditions, a 1 meter thick material has a temperature difference of 1 Kelvin (or degrees Celsius) across its surface, and heat is transferred through this material over a 1 square meter area in 1 second. The thermal conductivity unit is W/(mKelvin), i.e., W/(mK).
In a preferred embodiment, in the step S2, the thermal conductivity is a key indicator for measuring and identifying the thermal conductivity of the material, and its size is closely related to factors such as moisture content, humidity, temperature, etc., besides depending on the composition structure, composition and density of the material itself.
In a preferred embodiment, in the step S8, the test apparatus classifies the thermal conductivity by using a steady state method and a transient method, among various thermal conductivity measurement methods, which are more common. The steady state method is to construct a stable temperature field for the sample to be tested, and after the sample to be tested reaches the heat balance, the heat conductivity coefficient of the sample is calculated by the temperature gradient and the heat flow rate of the unit area of the sample to be tested. The transient method is to obtain the heat conductivity of the sample by measuring the temperature change rate in the sample to be tested in a short time. The project uses a steady-state heat flow method, and adopts a German Netzsch HFM446 heat flow meter method heat conductivity tester to test the heat conductivity of different samples according to the requirements of national standard GB/T10295-2008 heat flow meter method for measuring the steady-state thermal resistance and related characteristics of heat insulation materials.
In a preferred embodiment, in the step S8, the steady-state heat flow method is a classical method for measuring the thermal conductivity of a building thermal insulation material, and the principle is that the heat conductivity of the material is calculated according to a fourier one-dimensional steady-state heat conduction model by using an equilibrium state that the heat transfer rate is equal to the heat dissipation rate in the process of heat stable heat transfer, and by using the heat flow density, the temperature difference between two sides and the thickness of the sample.
In a preferred embodiment, in the step S8, the heat conductivity coefficient measuring device of the heat flow meter mainly comprises a measurement and control host, a heating plate, a double measuring plate, a heat flow sensor, a cooling plate and a low-temperature constant-temperature tank. During measurement, a sample (within 300 multiplied by 300 mm) is inserted between cold and hot plates of the equipment, a certain temperature gradient delta T is set, a calibrated and calibrated heat flow sensor is used for measuring the heat flow of a test piece, and the heat conductivity coefficient of the material can be automatically obtained through inputting the thickness of the test piece, the temperature gradient of the cold and hot plates and the passing stable heat flow.
In summary, due to the adoption of the technical scheme, the beneficial effects of the invention are as follows:
in the invention, solidworks three-dimensional modeling software is adopted to build a model, and Abaqus finite element simulation software is used for carrying out steady-state thermal simulation on the outside temperature and indoor energy consumption conditions of different heat insulation material structures (50 mm Polyurethane (PU) sandwich boards, 50mm Glass Wool (GW) boards, 50mm aerogel felts (AG) and 50mm Vacuum Insulation Panels (VIP)) at different outdoor environment temperatures (-40 ℃/-20 ℃/0 ℃). The simulation is used for checking the optimization condition of using different structure heat preservation layers to temperature and energy consumption, and under the premise of not influencing the test accuracy, the following is assumed: the steady-state thermal simulation is carried out on the heat preservation system, the fluctuation of the ambient temperature is not considered, the ambient temperature is constant temperature-40 ℃/-20 ℃/0 ℃, the constant temperature is constant for 10 ℃ on the inner wall surface, so that the test efficiency of the whole test process is improved, the test precision is improved, the test can be carried out more quickly and efficiently in the test process, and the integral convenience in use is improved.
Drawings
FIG. 1 is an overall system flow diagram of the present invention;
FIG. 2 is a schematic diagram of 50mm-VIP simulation results in the present invention;
FIG. 3 is a diagram showing simulation results of a 50mmGW according to the present invention;
FIG. 4 is a diagram showing simulation results of 50mmPU in the present invention;
FIG. 5 is a schematic diagram of simulation results of 50mmPU (-40 ℃) in the present invention;
FIG. 6 is a schematic diagram of the simulation results of 50mmPU (-20 ℃) of the invention;
FIG. 7 is a schematic diagram of simulation results of 50mmPU (0 ℃) in the present invention;
FIG. 8 is a schematic diagram of simulation results of a 50mmGW (-40 ℃) in the present invention;
FIG. 9 is a diagram showing simulation results of 50mmGW (-20 ℃) in the present invention;
FIG. 10 is a schematic diagram of simulation results of a 50mmGW (0 ℃) in the present invention;
FIG. 11 is a schematic diagram of the simulation results of 50mmAG (-40 ℃ C.) of the present invention;
FIG. 12 is a schematic diagram of simulation results of 50mmAG (-20 ℃ C.) in the present invention;
FIG. 13 is a schematic diagram of simulation results of 50mmAG (0 ℃ C.) in the present invention;
FIG. 14 is a diagram showing simulation results of 50mmVIP (-40 ℃ C.) in the present invention;
FIG. 15 is a diagram showing simulation results of 50mmVIP (-20 ℃ C.) in the present invention;
FIG. 16 is a schematic diagram showing the simulation results of 50mmVIP (-20 ℃ C.) of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
With reference to figures 1-16 of the drawings,
a system thermal insulation performance simulation test method under severe cold conditions comprises the following steps:
s1, firstly, a model is built, a 1:1 simplified model (total height is 40.5m, upper section is 8.3m, 4.7m, cuboid of 8.3m, 8.64m, 4.7m-14m, diameter of 3.3m is changed, lower section is 14m, 32.5m cuboid of 14 m) is built through Solidworks modeling software design, and the built model is imported into Abaqus simulation software. Numerical simulation method
The project adopts Solidworks three-dimensional modeling software to build a model, and uses Abaqus finite element simulation software to perform steady-state thermal simulation on the outside temperature and indoor energy consumption conditions of different heat insulation material structures (50 mm Polyurethane (PU) sandwich boards, 50mm Glass Wool (GW) boards, 50mm aerogel felts (AG) and 50mm Vacuum Insulation Panels (VIP)) at different outdoor environment temperatures (-40 ℃/-20 ℃/0 ℃).
The simulation is used for checking the optimization condition of using different structure heat preservation layers to temperature and energy consumption, and under the premise of not influencing the test accuracy, the following is assumed: and (3) carrying out steady-state thermal simulation on the heat preservation system, wherein the ambient temperature fluctuation is not considered, the external ambient temperature is constant temperature of-40 ℃/-20 ℃/0 ℃, and the inner wall surface is constant heat energy output-constant temperature of 10 ℃.
(1) Calculation equation
The Fourier combines the law of conservation of energy to establish a heat conduction differential equation, which is suitable for all heat conduction processes.
a: thermal diffusivity, m2/s;
Φ: the amount of heat generated by the heat source per unit time or volume,
W/m3
(2) Solution control
The unit is set as 'mm' in the solver, the solving type is set as 'Pressure-Based' (Based on the Pressure solver), and an energy (energy) equation is started.
(3) Grid control
In order to ensure the calculation accuracy, different grid sizes are set at different parts in consideration of calculation time, the thickness direction is thinner, and at least two layers of grids are ensured in the thickness.
(4) Convection coefficient:
calculating the external natural convection according to the following steps:
alpha: natural convection coefficient, W/(m2·deg.C);
omega: wind speed, m/s.
The indoor ambient wind speed is zero, α= 6.978W/(m2·deg.c).
(5) Convergence control:
the convergence threshold is set to 1e-08, and when the calculated residual is less than the threshold, the residual is considered to have converged.
S2, setting material properties, clicking a module after the model is imported, and selecting the properties; clicking "create materials", "thermal", "conductivity" in turn, setting the conductivity to the value required in the operating mode;
s3, assembling, namely selecting the assembly in the module. Clicking "CreateInstance", selecting "parts", clicking "determine";
s4, performing analysis steps, selecting analysis steps in a module, clicking a creation analysis part, and selecting heat transfer after assembly is completed. Clicking on "continue" sets "response" to "steady state";
s5, selecting 'interaction' in 'module', clicking 'create interaction', and selecting 'surface heat exchange condition'. Sequentially selecting each inner wall surface of the model, clicking the 'finishing' window, jumping out of the 'editing interaction' window, setting the 'film heat dissipation coefficient' as 0.006987 and setting the 'environment temperature' as 10 degrees;
s6, editing the load, selecting the load in a module, clicking the creating boundary condition, selecting the temperature, clicking the continuing, then sequentially selecting each outer wall surface of the model, and setting the temperature to be-40 ℃;
s7, meshing, namely selecting a 'mesh' in a 'module', clicking a 'seed for a component example', and changing the value of the 'approximate global size' into about one third of the original size. Then click "assign grid control attributes", select "neutral axis algorithm", click "determine". Then click "grid for part", grid number 49220. Then click "assign element type", select "heat transfer" in "family", click "determine";
s8, submitting a job, selecting the job in a module, and clicking the create job, continuing and determining in sequence; then selecting a job manager, clicking a submit, and checking a result after the work is completed; different ring temperature data of the m-PU sandwich panel, wherein the diameter of 11 meters is the average diameter of 14 meters, 8.64 meters and 8.3 meters;
and S10, collecting and recording the data result obtained by the test, and ending the whole test flow.
In the step S2, after the heat conductivity is set, click "create section", click "entity", "homogenize", "confirm", then click "assign section", select the model entirely, then click "finish".
In step S5, in the step interaction, the "ambient temperature" of each outer wall surface is set to-40 degrees in turn.
In step S5, the temperature of each inner wall surface of the model is set to 10 degrees in sequence, so as to complete the simulation of the working condition.
Table 1 shows the outer wall temperatures and energy consumption per hour for four materials of 50mm thickness at room constant temperature of 10deg.C, different ambient temperatures (-40deg.C, -20deg.C, 0deg.C). As can be seen from the table, the outer wall temperatures of the PU sandwich panels at-40 ℃ and-20 ℃ are greatly different from the ambient temperature (15.25% and 19.5%), and the internal energy consumption is great (25.23W/m 2 and 15.47W/m 2). It is recommended to use VIP with the thickness of 50mm to improve the heat preservation performance of the enclosure structure and reduce the energy consumption of heating equipment.
Table 1.50mm thickness different insulation material temperature drop and energy consumption simulation data
Different material thermal conductivity test report
1. Experimental materials
Polyurethane (PU) sandwich panels, glass Wool (GW), aerogel (Aerogel) mats and vacuum insulation panels (Vacuuminsulated panel, VIP).
2. Experimental equipment and testing method
2.1 introduction to thermal conductivity
The first step in studying the thermal conductivity and insulation properties of a material is to be able to accurately determine the thermophysical properties of the material, and one of the main parameters reflecting the thermophysical properties of the material is the thermal conductivity. The thermal conductivity is generally denoted by λ, defined as: under steady state thermal equilibrium conditions, a 1 meter thick material has a temperature difference of 1 Kelvin (or degrees Celsius) across its surface, and heat is transferred through this material over a 1 square meter area in 1 second. The thermal conductivity unit is W/(mKelvin), i.e., W/(mK).
The heat conductivity coefficient is a key index for measuring and identifying the heat conductivity of the material, and the size of the material depends on the composition structure, components and density of the material, and has close relation with factors such as water content, humidity and temperature.
2.2 test equipment
Among various methods for measuring thermal conductivity, a more common classification method is to classify by using a steady state method and a transient method. The steady state method is to construct a stable temperature field for the sample to be tested, and after the sample to be tested reaches the heat balance, the heat conductivity coefficient of the sample is calculated by the temperature gradient and the heat flow rate of the unit area of the sample to be tested. The transient method is to obtain the heat conductivity of the sample by measuring the temperature change rate in the sample to be tested in a short time. The project adopts a steady-state heat flow method, and adopts a German Netzsch HFM446 heat flow meter method heat conductivity coefficient tester to test the heat conductivity coefficients of different samples according to the requirements of national standard GB/T10295-2008 heat flow meter method for measuring the steady-state thermal resistance and related characteristics of heat insulation materials.
The steady-state heat flow method is a classical measurement method for the heat conductivity coefficient of a building heat-insulating material, and the principle of the method is that the heat conductivity coefficient of the material is calculated according to a Fourier one-dimensional steady-state heat conduction model and through the heat flow density, the temperature difference at two sides and the thickness of a sample by utilizing the balance state that the heat transfer rate is equal to the heat dissipation rate in the heat stable heat transfer process.
2.3 principle of testing
The heat conductivity coefficient tester of the heat flow meter mainly comprises a measurement and control host, a heating plate, two measuring plates, a heat flow sensor, a cooling plate and a low-temperature constant-temperature tank. During measurement, a sample (within 300 multiplied by 300 mm) is inserted between cold and hot plates of the equipment, a certain temperature gradient delta T is set, a calibrated and calibrated heat flow sensor is used for measuring the heat flow of a test piece, and the heat conductivity coefficient of the material can be automatically obtained through inputting the thickness of the test piece, the temperature gradient of the cold and hot plates and the passing stable heat flow.
3. Test results
Table 2 shows the results of thermal conductivity tests of the PU sandwich panel, glass wool, aerogel, and VIP materials at different average temperatures, and it can be seen that the lower the ambient temperature is, the lower the thermal conductivity of the same material is. Among the four test materials, the glass wool has the highest heat conductivity coefficient (-40-20 ℃ heat conductivity coefficient of 0.034-0.045W/(mK)), the PU sandwich board has the second heat conductivity coefficient (-40-20 ℃ heat conductivity coefficient of 0.026-0.031W/(mK)), the aerogel has the second heat conductivity coefficient (-40-20 ℃ heat conductivity coefficient of 0.024-0.026W/(mK)), and the VIP board has the lowest heat conductivity coefficient (-40-20 ℃ heat conductivity coefficient of 0.0033-0.0042W/(mK)). The VIP board has the best heat preservation/cold preservation effect, and the difference is an order of magnitude.
TABLE 2 thermal conductivity coefficient of different materials at different temperatures
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. A simulation test method for the heat preservation performance of a system under severe cold conditions is characterized by comprising the following steps: the simulation test method for the heat preservation performance of the system under the severe cold condition comprises the following steps:
firstly, establishing a model, establishing a 1:1 simplified model (total height is 40.5m, upper section is 8.3m, 8.64m, 4.7m cuboid, middle section is 8.3m, 4.7m-14m, 3.3m reducing, lower section is 14m, 32.5m cuboid) through Solidworks modeling software design, and introducing the established model into Abaqus simulation software;
s2, setting material properties, clicking a module after the model is imported, and selecting the properties; clicking "create materials", "thermal", "conductivity" in turn, setting the conductivity to the value required in the operating mode;
s3, assembling, namely selecting 'assembling' in 'modules'; clicking "CreateInstance", selecting "parts", clicking "determine";
s4, performing an analysis step, selecting an analysis step in a module, clicking a creation analysis part, and selecting heat transfer after assembly is completed; clicking on "continue" sets "response" to "steady state";
s5, selecting 'interaction' in 'modules', clicking 'create interaction', and selecting 'surface heat exchange conditions'; sequentially selecting each inner wall surface of the model, clicking the 'finishing' window, jumping out of the 'editing interaction' window, setting the 'film heat dissipation coefficient' as 0.006987 and setting the 'environment temperature' as 10 degrees;
s6, editing the load, selecting the load in a module, clicking the creating boundary condition, selecting the temperature, clicking the continuing, then sequentially selecting each outer wall surface of the model, and setting the temperature to be-40 ℃;
s7, dividing grids, selecting grids in a module, clicking to seed a component example, and changing the value of the approximate global size into about one third of the original size; then click "assign grid control attributes", select "neutral axis algorithm", click "determine"; clicking the 'mesh division for the component', wherein the number of meshes is 49220; then click "assign element type", select "heat transfer" in "family", click "determine";
s8, submitting a job, selecting the job in a module, and clicking the create job, continuing and determining in sequence; then selecting a job manager, clicking a submit, and checking a result after the work is completed;
s9, carrying out data post-processing, wherein the diameters of 11 meters are the average diameters of 14 meters, 8.64 meters and 8.3 meters for simplifying the different ring temperature data of the 50mm-PU sandwich board;
and S10, collecting and recording the data result obtained by the test, and ending the whole test flow.
2. The simulation test method for the thermal insulation performance of the system under severe cold conditions according to claim 1, wherein the simulation test method comprises the following steps: in the step S2, after the heat conductivity is set, click "create section", click "entity", "homogenize", "confirm", then click "assign section", select the model entirely, then click "finish".
3. The simulation test method for the thermal insulation performance of the system under severe cold conditions according to claim 1, wherein the simulation test method comprises the following steps: in step S5, in the step interaction, the "ambient temperature" of each outer wall surface is set to-40 degrees in turn.
4. The simulation test method for the thermal insulation performance of the system under severe cold conditions according to claim 1, wherein the simulation test method comprises the following steps: in step S5, the temperature of each inner wall surface of the model is set to 10 degrees in sequence, so as to complete the simulation of the working condition.
5. The simulation test method for the thermal insulation performance of the system under severe cold conditions according to claim 1, wherein the simulation test method comprises the following steps: in the step S2, the first step of researching the thermal insulation performance of the material is to accurately determine the thermal physical performance of the material, and one of the main parameters reflecting the thermal physical performance of the material is the thermal conductivity coefficient; the thermal conductivity is generally denoted by λ, defined as: under steady state heat balance conditions, a material 1 meter thick has a temperature difference of 1 Kelvin (or degrees Celsius) between two surfaces, and heat transferred through the material 1 square meter area is transferred in 1 second; the thermal conductivity unit is W/(mKelvin), i.e., W/(mK).
6. The simulation test method for the thermal insulation performance of the system under severe cold conditions according to claim 1, wherein the simulation test method comprises the following steps: in the step S2, the thermal conductivity is a key index for measuring and identifying the thermal conductivity of the material, and its size is closely related to factors such as moisture content, humidity and temperature besides depending on the composition structure, composition and density of the material.
7. The simulation test method for the thermal insulation performance of the system under severe cold conditions according to claim 1, wherein the simulation test method comprises the following steps: in the step S8, the test device classifies the test device by using a steady state method and a transient state method in various heat conductivity coefficient measurement methods; the steady state method is to construct a stable temperature field for the tested sample, and after the tested sample reaches heat balance, the heat conductivity coefficient of the tested sample is obtained by calculating through the temperature gradient and the heat flow rate of the unit area of the tested sample; the transient method is to obtain the heat conductivity coefficient of the sample by measuring the temperature change rate in the sample to be tested in a short time; the project uses a steady-state heat flow method, and adopts a German Netzsch HFM446 heat flow meter method heat conductivity tester to test the heat conductivity of different samples according to the requirements of national standard GB/T10295-2008 heat flow meter method for measuring the steady-state thermal resistance and related characteristics of heat insulation materials.
8. The simulation test method for the thermal insulation performance of the system under severe cold conditions according to claim 1, wherein the simulation test method comprises the following steps: in the step S8, the steady-state heat flow method is a classical measurement method for the thermal conductivity of a building thermal insulation material, and the principle is that the heat conductivity of the material is calculated according to a fourier one-dimensional steady-state heat conduction model by utilizing the equilibrium state that the heat transfer rate is equal to the heat dissipation rate in the process of heat stable heat transfer and through the heat flow density, the temperature difference at two sides and the thickness of a sample.
9. The simulation test method for the thermal insulation performance of the system under severe cold conditions according to claim 1, wherein the simulation test method comprises the following steps: in the step S8, the heat conductivity coefficient tester device of the heat flow meter mainly comprises a measurement and control host, a heating plate, a double-block measuring plate, a heat flow sensor, a cooling plate and a low-temperature constant-temperature tank; during measurement, a sample (within 300 multiplied by 300 mm) is inserted between cold and hot plates of the equipment, a certain temperature gradient delta T is set, a calibrated and calibrated heat flow sensor is used for measuring the heat flow of a test piece, and the heat conductivity coefficient of the material can be automatically obtained through inputting the thickness of the test piece, the temperature gradient of the cold and hot plates and the passing stable heat flow.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110015905A1 (en) * | 2009-07-14 | 2011-01-20 | Gm Global Technology Operations, Inc. | Algorithm for the efficient calculation of multiple fiber group materials within a specified fem |
| CN106872511A (en) * | 2017-04-13 | 2017-06-20 | 北京市市政工程研究院 | One kind simulation wall heat insulation material experimental provision |
| US20200217749A1 (en) * | 2018-07-18 | 2020-07-09 | Dalian University Of Technology | Parmeter similarity method for test simulation conditions of aerodynamic heating environment |
| CN111898299A (en) * | 2020-07-25 | 2020-11-06 | 福建工程学院 | PCR base manufacturing parameter optimization method based on finite element model numerical simulation |
| CN114925571A (en) * | 2022-05-26 | 2022-08-19 | 三峡大学 | Method for simulation calculation of finite element model of deep hole pouring bin considering heat insulation material |
-
2023
- 2023-08-14 CN CN202311018130.3A patent/CN117272715A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110015905A1 (en) * | 2009-07-14 | 2011-01-20 | Gm Global Technology Operations, Inc. | Algorithm for the efficient calculation of multiple fiber group materials within a specified fem |
| CN106872511A (en) * | 2017-04-13 | 2017-06-20 | 北京市市政工程研究院 | One kind simulation wall heat insulation material experimental provision |
| US20200217749A1 (en) * | 2018-07-18 | 2020-07-09 | Dalian University Of Technology | Parmeter similarity method for test simulation conditions of aerodynamic heating environment |
| CN111898299A (en) * | 2020-07-25 | 2020-11-06 | 福建工程学院 | PCR base manufacturing parameter optimization method based on finite element model numerical simulation |
| CN114925571A (en) * | 2022-05-26 | 2022-08-19 | 三峡大学 | Method for simulation calculation of finite element model of deep hole pouring bin considering heat insulation material |
Non-Patent Citations (2)
| Title |
|---|
| 许令来: "CL型外墙免拆保温模板合理构造及保温效果研究", 《中国优秀硕士学位论文全文数据库 工程科技Ⅱ辑(月刊)》, 15 January 2023 (2023-01-15), pages 2 - 4 * |
| 郭晓娟: "基于ANSYS 保温包装球壳模型的建立", 《包装工程》, 31 March 2011 (2011-03-31), pages 1 - 4 * |
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