CN117265624A - Solar cell electroplating device - Google Patents
Solar cell electroplating device Download PDFInfo
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- CN117265624A CN117265624A CN202311177883.9A CN202311177883A CN117265624A CN 117265624 A CN117265624 A CN 117265624A CN 202311177883 A CN202311177883 A CN 202311177883A CN 117265624 A CN117265624 A CN 117265624A
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- electroplating
- plating apparatus
- battery plate
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- 238000009713 electroplating Methods 0.000 title claims abstract description 97
- 238000001179 sorption measurement Methods 0.000 claims abstract description 42
- 239000000523 sample Substances 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 23
- 238000007747 plating Methods 0.000 claims description 74
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000005260 corrosion Methods 0.000 claims description 7
- 230000007797 corrosion Effects 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 14
- 230000000694 effects Effects 0.000 abstract description 7
- 230000005684 electric field Effects 0.000 abstract description 6
- 150000001768 cations Chemical class 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000003487 electrochemical reaction Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
- C25D7/126—Semiconductors first coated with a seed layer or a conductive layer for solar cells
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The embodiment of the invention provides a solar cell electroplating device, which comprises: an electroplating bath, wherein the electroplating bath is filled with electroplating liquid; the cathode carrier is provided with an adsorption surface for adsorbing and fixing the battery piece, and a cathode probe is arranged in the area where the adsorption surface is located; the anode roller is arranged in the electroplating bath, located below the cathode carrier, and rotationally connected with the electroplating bath, and the surface of the anode roller is provided with a turbulence structure protruding from the circumferential surface. According to the battery piece electroplating device disclosed by the embodiment of the invention, in the process of electroplating by horizontally moving the battery piece, the anode roller rotates, so that convection of electroplating liquid can be accelerated by utilizing the turbulence structure protruding out of the circumferential surface of the anode roller, meanwhile, the electric field intensity can be improved by the tip discharge effect of the turbulence structure, the electroplating speed can be improved, and the electroplating productivity of the battery piece can be improved.
Description
Technical Field
The invention relates to the technical field of solar cell electroplating, in particular to a solar cell electroplating device.
Background
In the preparation of the electrode of the solar cell, the traditional process generally adopts a screen printing process, and the electroplating technology is used as a novel electrode preparation method, so that the research is more and more widely conducted. The plating electrode has a higher aspect ratio and a better conductivity than the screen printing electrode, so that the internal resistance of the battery is reduced, and the loss of shading and the like is reduced, thereby further improving the photoelectric conversion efficiency of the solar battery. Electroplating is used as a promising electrode preparation method, so that the cost in the solar cell production process can be greatly reduced.
In the current electroplating device, the light and thin battery piece floats on the surface of the electroplating liquid by utilizing the surface tension of the electroplating liquid, and the battery piece is driven by a roll shaft to move and convey along the horizontal direction, so that the electroplating preparation of grid lines in different areas of the battery piece is realized. In order to avoid the plating solution from wetting the upper surface of the battery plate, the plating solution needs to be controlled to flow at a low speed in the plating device, so that the liquid level is kept stable.
However, in such a plating apparatus, since the flow rate of the plating solution is low, the electrochemical reaction rate of the battery sheet and the plating solution is lowered, so that the plating efficiency is lowered, and the productivity of the solar battery sheet is restricted.
Disclosure of Invention
The invention provides a solar cell electroplating device, which aims to solve the problems of low efficiency and low productivity caused by low flow rate of electroplating liquid in the conventional electroplating device.
The embodiment of the invention provides a solar cell electroplating device, which comprises:
an electroplating bath, wherein the electroplating bath is filled with electroplating liquid;
the cathode carrier is provided with an adsorption surface for adsorbing and fixing the battery piece, and a conductive cathode is arranged in the area where the adsorption surface is located;
the anode roller is arranged in the electroplating bath, located below the cathode carrier, and rotationally connected with the electroplating bath, and the surface of the anode roller is provided with a turbulence structure protruding from the circumferential surface.
Optionally, the turbulence structure is a strip-shaped turbulence sheet arranged along the axial direction of the anode roller.
Optionally, a plurality of the strip-shaped spoilers are distributed around the axial direction of the anode roll.
Optionally, a plurality of the strip-shaped spoilers are uniformly distributed at equal intervals. Optionally, a hollow cavity for containing anode metal is arranged in the anode roller, and a convection pore for communicating the hollow cavity with the electroplating solution is arranged on the surface of the anode roller.
Optionally, the battery piece electroplating device further includes:
the output end of the cathode driving assembly is fixedly connected with the cathode carrier, and the cathode driving assembly drives the cathode carrier to synchronously move with the battery piece.
Optionally, the battery piece electroplating device further includes:
the vacuum pump, the adsorption surface is provided with a plurality of absorption holes, absorption hole with the vacuum pump intercommunication.
Optionally, the conductive cathode is a rod-shaped probe detachably connected with the cathode carrier; or, the conductive cathode is a cathode contact arranged on the adsorption surface. Optionally, the surface of the cathode carrier is provided with a corrosion-resistant insulating coating.
Optionally, the cathode carrier includes:
the carrier base is fixedly connected with the output end of the cathode driving assembly;
the carrier cover plate is stacked and fixed with the carrier base, a vacuum cavity is arranged between the first side of the carrier cover plate and the carrier base, the second side of the carrier cover plate is provided with an adsorption surface, the adsorption hole is communicated with the vacuum cavity, and the vacuum cavity is communicated with the vacuum pump.
Optionally, the cathode carrier further comprises:
the sealing ring is arranged between the carrier cover plate and the carrier base.
Optionally, the carrier cover plate is provided with a through hole penetrating through the first side and the second side, and the rod-shaped probe penetrates through the through hole and is in threaded connection with the carrier base.
Optionally, the battery piece electroplating device further includes:
the light sources are arranged in the electroplating tank and distributed on two sides of the axis of the anode roller.
According to the battery piece electroplating device provided by the embodiment of the invention, the rotatable anode roller is arranged in the electroplating bath, and the battery piece is adsorbed by the cathode carrying platform, so that the battery piece is positioned between the cathode carrying platform and the anode roller, at the moment, one surface of the battery piece can be soaked by electroplating liquid, and the other surface of the battery piece is kept to be adsorbed and attached to the cathode carrying platform, so that the other surface can be prevented from being soaked and stained by the electroplating liquid. In the process of electroplating by horizontally moving the battery piece, the anode roller rotates, the turbulent flow structure protruding out of the circumferential surface of the anode roller can be utilized to accelerate convection of electroplating liquid, meanwhile, the electric field intensity can be improved by the tip discharge effect of the turbulent flow structure, the electroplating speed can be improved, and the electroplating capacity of the battery piece can be improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments of the present invention will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a battery plate electroplating apparatus according to an embodiment of the invention;
FIG. 2 illustrates a top view of the battery plate electroplating apparatus of FIG. 1 in an embodiment of the invention;
FIG. 3 illustrates a side view of the battery plate electroplating apparatus of FIG. 1 in an embodiment of the invention;
FIG. 4 is a schematic view showing the structure of an anode roll in the embodiment of the present invention;
FIG. 5 is a schematic view showing the position of a battery plate when electroplating is started in an embodiment of the invention;
FIG. 6 is a schematic diagram showing the position of a battery plate at the end of electroplating in an embodiment of the invention;
FIG. 7 is a schematic view showing the structure of a cathode carrier according to an embodiment of the present invention;
FIG. 8 is a schematic top view of a cathode carrier in an embodiment of the invention;
FIG. 9 shows a schematic cross-sectional view along A-A of FIG. 8 in an embodiment of the invention;
FIG. 10 shows a schematic cross-sectional view along B-B of FIG. 8 in accordance with an embodiment of the invention;
fig. 11 shows a schematic view of a stage base according to an embodiment of the present invention.
Description of the drawings:
plating bath-10, cathode carrier-11, anode roller-12, turbulence structure-13, light source-14, plating power supply-20, battery piece-30, liquid supply barrel-40, liquid supply pump-41, conductive cathode-111, carrier base-112, carrier cover-113, vacuum cavity-114, sealing ring-115.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 6, there is shown a battery piece electroplating device provided in an embodiment of the present invention, the battery piece electroplating device including:
a plating tank 10, wherein a plating solution is contained in the plating tank 10;
a cathode carrier 11, wherein the cathode carrier 11 is provided with an adsorption surface for adsorbing and fixing the battery piece 30, and a conductive cathode is arranged in the area where the adsorption surface is located;
the anode roller 12 is disposed in the plating tank 10 below the cathode carrier 11 and is rotatably connected with the plating tank 10, and a turbulence structure 13 protruding from the circumferential surface is disposed on the surface of the anode roller 12.
As shown in fig. 1 and 2, the battery plate plating apparatus according to the embodiment of the present invention includes a plating tank 10 for containing a plating solution, a cathode stage 11 electrically connected to the negative electrode of a plating power supply 20, and an anode roller 12 electrically connected to the positive electrode of the plating power supply 20. Plating cell 10 may be a cube-like container with an open top for cathode carrier 11 to carry battery plate 30. As shown in fig. 3, the cathode carrier 11 is provided with an adsorption surface for adsorbing and fixing the battery piece 30, the adsorption surface may be a lower surface of the cathode carrier 11 facing the bottom of the plating tank 10, a conductive cathode is provided in a region corresponding to the adsorption surface, the conductive cathode is made of a conductive material, is electrically connected to the negative electrode of the plating power supply 20, and protrudes from the adsorption surface and can be in contact with the surface of the battery piece 30.
As shown in fig. 4, the anode roll 12 is a cylindrical roll shaft structure, the anode roll 12 may include a roll shaft body 121 and a rotating shaft portion 112 connected to the plating tank 10, the diameter of the roll shaft body 121 may be larger than that of the rotating shaft portion 112, and two ends of the rotating shaft portion 112 may be sleeved with conductive slip rings, the anode roll 12 is installed in the plating tank 10 and located below the cathode carrier 11, the anode roll 12 spans two opposite side walls of the plating tank 10, the conductive slip rings are fixed on the side walls and electrically connected to the positive electrode of the plating power supply 20, and the rotating shaft portion 112 may be driven to rotate relative to the conductive slip rings by a motor installed outside the plating tank 10. When the anode roller 12 rotates, the turbulence structures 13 protruding from the circumferential surface of the anode roller can stir the electroplating solution in the electroplating tank 10, promote the flow of the electroplating solution, enable the electroplating solution subjected to electrochemical reaction to quickly flow in a convection manner, enable the concentration of the electroplating solution in each place in the electroplating tank to be more uniform, and avoid the concentration lower caused by the lack of metal cations in the concentrated electroplating place. It should be noted that the turbulence structure 13 is not limited to a strip or block structure, and is not limited to a continuous or segmented structure, and the surface of the anode roll 12 may be protruded to stir the plating solution.
In addition, in the plating circuit formed by the plating power supply 20, the cathode stage 11, the battery piece 30, the plating liquid and the anode roller 12, the utilization efficiency of the plating liquid can be improved by controlling the timing of power-on and power-off of the plating power supply 20. As shown in fig. 5, the cathode carrier 11 moves along the X direction to gradually approach the axis of the anode roller 12, when the right edge of the battery piece 30 moves to the M position, the right edge of the battery piece 30 coincides with the longitudinal section of the anode roller 12, the gap between the lower surface of the battery piece 30 and the end of the turbulence structure 13 is minimal, at this time, the tip discharge effect of the turbulence structure 13 protruding from the surface of the anode roller 12 forms a strong electric field between the battery piece 30 and the turbulence structure 13, and the plating rate of the battery piece 30 passing through the position can be increased. As shown in fig. 6, the movement of the battery plate 30 is continued in the X direction until the left edge of the battery plate 30 moves to the M position and then leaves the M position, and the plating process is completed. In combination with the above-mentioned electroplating process, the power supply state of the electroplating power supply 20 can be maintained in the time period when the right side edge and the left side edge of the battery piece 30 move between the M positions, and at this time, the electroplating process is performed, and the electroplating power supply 20 can be cut off before the right side edge of the battery piece 30 does not reach the M position and after the left side edge of the battery piece 30 leaves the M position, so that the formation of the grid lines with inconsistent width and thickness on the battery piece 30 can be avoided.
Referring to fig. 1 and 2, in the battery plate electroplating apparatus according to the embodiment of the invention, a liquid supply tank 40 and a liquid supply pump 41 are further disposed outside the electroplating tank 10, and the liquid supply tank 40 and the liquid supply pump 41 are communicated with the electroplating tank 10 through a pipeline, so that the electroplating solution can be circulated and supplemented into the electroplating tank 10 to maintain the cation concentration.
Therefore, the battery piece electroplating device provided by the embodiment of the invention is provided with the rotatable anode roller in the electroplating bath, and the battery piece is adsorbed by the cathode carrier, so that the battery piece is positioned between the cathode carrier and the anode roller, one surface of the battery piece can be soaked by the electroplating liquid, and the other surface of the battery piece is kept to be adsorbed and attached to the cathode carrier, so that the other surface of the battery piece can be prevented from being soaked and stained by the electroplating liquid. In the process of electroplating by horizontally moving the battery piece, the anode roller rotates, the turbulent flow structure protruding out of the circumferential surface of the anode roller can be utilized to accelerate convection of electroplating liquid, meanwhile, the electric field intensity can be improved by the tip discharge effect of the turbulent flow structure, the electroplating speed can be improved, and the electroplating capacity of the battery piece can be improved.
Alternatively, referring to fig. 4, the turbulence structure 13 is a strip-shaped turbulence sheet disposed along the axial direction of the anode roll 12.
Specifically, in one embodiment, the turbulence structure 13 may be a turbulence plate as shown in fig. 4, and the turbulence plate is elongated and disposed along the axial direction of the anode roll 12, and is attached and fixed to the circumferential surface of the anode roll 12. When the anode roll 12 rotates, the turbulence plates may act as paddles that agitate the plating solution. The continuously extending strip-shaped spoiler has larger surface area, and the effect of accelerating the flow of the electroplating solution is more remarkable. The anode roller 12 can be processed by adopting metallic titanium which is difficult to react with the electroplating solution, a bar-shaped spoiler can be directly machined on the cylindrical surface of the anode roller 12, and the bar-shaped spoiler can be processed separately in advance and then welded into a whole. In addition, although the cross section of the bar-shaped spoiler shown in fig. 4 is rectangular, the cross section of the bar-shaped spoiler may be triangular or semicircular, and the thinner the top of the bar-shaped spoiler is, the more obvious the point discharge effect thereof, and a stronger electric field may be formed between the spoiler structure 13 and the battery plate 30.
Alternatively, referring to fig. 4, a plurality of the strip-shaped spoilers are distributed around the axial direction of the anode roll 12.
Specifically, in one embodiment, as shown in fig. 4, a plurality of strip-shaped spoilers may be provided on the circumferential surface of the anode roll 12, so that agitation of the plating solution may be constantly maintained to promote convection when the strip-shaped spoilers are rotated.
Alternatively, referring to fig. 4, a plurality of the strip-shaped spoilers are uniformly distributed at equal intervals.
Specifically, in one embodiment, as shown in fig. 4, a plurality of strip-shaped spoilers may be uniformly distributed around the axial direction of the anode roller 12 at equal intervals, that is, the included angles formed by every two adjacent strip-shaped spoilers and the axis of the anode roller 12 are equal. When the anode roll 12 rotates at a constant rotation speed, as the plurality of strip-shaped spoilers are uniformly distributed, the time spent when each strip-shaped spoiler rotates to the position with the minimum distance between the strip-shaped spoilers and the surface to be plated of the battery piece 30 is the same, which is beneficial to keeping the stability of an electric field and keeping the consistency of grid lines of the battery piece 30 when plating. It will be appreciated that the higher the rotational speed of the anode roll 12, the shorter the time it takes for each strip spoiler to return again to the M position shown, or alternatively, the shorter the time for adjacent strip spoilers to take over, and the electroplating efficiency can be improved. The electroplating test result of the battery piece 30 with certain specification shows that the electroplating quality and efficiency are better when the rotating speed of the anode roller 12 is 300r/min-500 r/min.
Optionally, a hollow cavity for containing anode metal is arranged inside the anode roller 12, and a convection hole for communicating the hollow cavity and the electroplating solution is arranged on the surface of the anode roller 12.
Specifically, in one embodiment, the anode roll 12 may also be made using a hollow shaft tube such that the interior of the anode roll 12 forms a hollow cavity that may house anode metal corresponding to the plating cation, which may be copper particles, for example. To ensure that the copper particles react sufficiently with the plating solution to replenish the metal cations, convection apertures may be provided in the surface of the anode roll 12, communicating the hollow cavity with the plating solution, through which the plating solution reacts with the anode metal. The anode roll 12 can fully utilize the internal space of the anode roll 12 to design a soluble anode structure, so that a container for containing anode metal is not required to occupy the internal space of the electroplating tank 10.
Optionally, the battery piece electroplating device further includes:
the output end of the cathode driving assembly is fixedly connected with the cathode carrier 11, and the cathode driving assembly drives the cathode carrier 11 and the battery piece 30 to synchronously move.
Specifically, in one embodiment of the present invention, the battery plate electroplating device further includes a cathode driving assembly, where the cathode driving assembly is an assembly for providing driving power to the cathode carrier 11, and a power output end of the assembly is fixedly connected to the cathode carrier 11 and can drive the cathode carrier 11 to move in a translational manner along the illustrated X direction, and at this time, the battery plate 30 is adsorbed under the cathode carrier 11, and the cathode carrier 11 and the battery plate are synchronously moved, so that, compared with a conventional electroplating device, there is no relative movement between the cathode probe and the battery plate 30, and the cathode probe will not scratch the battery plate 30. It should be noted that the cathode driving assembly may be any assembly capable of outputting linear motion, such as a screw rod sliding block assembly, a gear rack assembly or a synchronous belt assembly, and the specific structure of the cathode driving assembly is not limited in the embodiment of the present invention. In addition, when the electroplating productivity needs to be further improved, under the condition of allowing the structural space, the electroplating device can be provided with a plurality of cathode carrying platforms 11, the plurality of cathode carrying platforms 11 can sequentially move in a flow line mode under the drive of the cathode driving assembly, the waiting time of loading and unloading the battery piece can be reduced, and the electroplating efficiency and productivity are further improved.
Optionally, referring to fig. 8, the battery plate electroplating device further includes:
the vacuum pump, the adsorption surface is provided with a plurality of adsorption holes 11a, and the adsorption holes 11a communicate with the vacuum pump.
Specifically, in one embodiment, in the battery sheet plating apparatus according to the embodiment of the present invention, the battery sheet 30 may be adsorbed and fixed on the adsorption surface of the cathode stage 11 by vacuum adsorption. As shown in fig. 8, a plurality of adsorption holes 11a are formed on the adsorption surface, the adsorption holes 11a can be formed in a rectangular shape in a surrounding manner on the adsorption surface, and openings of the adsorption holes 11a on the adsorption surface can be communicated together through grooves recessed on the adsorption surface, and an opening at the other end of the adsorption hole 11a is communicated with a vacuum pump. The vacuum adsorption fixing mode can realize nondestructive fixing of the battery piece 30, and when the negative pressure is larger, the adsorption is tighter, so that the electroplating solution is prevented from penetrating between the battery piece 30 and the adsorption surface.
Alternatively, the conductive cathode 111 is a rod-shaped probe or a cathode contact disposed on the adsorption surface.
Specifically, in one embodiment, the conductive cathode 111 located on the adsorption surface and capable of contacting the battery plate 30 in the embodiment of the present invention may be a rod-shaped probe, such as a shaft, and the rod-shaped probe is mounted on the cathode carrier 11, one end of the rod-shaped probe is fixed on the cathode carrier 11 and electrically connected to the negative electrode of the plating power supply 20 through a conductor such as a wire, and the other end of the rod-shaped probe protrudes from the adsorption surface and is capable of contacting the battery plate 30. The rod-shaped probe may be a retractable probe having an elastic member such as a spring mounted therein, and the end of the rod-shaped probe may be electrically connected to the surface of the battery plate 30 in a tight and reliable manner when the battery plate 30 is sucked and fixed to the suction surface after the end of the rod-shaped probe is protruded from the suction surface. The conductive cathode 111 may be a cathode contact protruding from the suction surface, may be formed integrally with the cathode stage 11 or may be formed by spot welding, or may be a dot-matrix conductive coating formed by printing with a conductive paint.
Alternatively, the rod-like probe is detachably connected to the cathode stage 11.
Specifically, in one embodiment, when the conductive cathode 111 in the battery plate plating apparatus according to the embodiment of the present invention is a rod-shaped probe, the rod-shaped probe is detachably connected to the cathode carrier 11, so as to facilitate maintenance and replacement of the rod-shaped probe.
Optionally, the surface of the cathode carrier 11 is provided with a corrosion-resistant insulating layer.
Specifically, in one embodiment, in order to prevent corrosion of the cathode carrier 11 caused when the cathode carrier 11 is in contact with the plating solution, and also prevent waste caused by plating the surface of the cathode carrier 11 with the cation deposition, a corrosion-resistant insulating layer is coated on the surface of the cathode carrier 11 where contact with the plating solution is required. For example, the rubber layer can be a corrosion-resistant rubber layer, and the rubber layer can provide certain elasticity, realize corrosion-resistant insulation and can also play a role of sealing and blocking electroplating liquid permeation.
Alternatively, referring to fig. 8 to 11, the cathode carrier 11 includes:
a carrier base 112, wherein the carrier base 112 is fixedly connected with the output end of the cathode driving assembly;
the carrier cover plate 113, the carrier cover plate 113 with the carrier base 112 stacks fixedly, be provided with the vacuum cavity 114 between the first side of carrier cover plate 113 with the carrier base 112, the second side of carrier cover plate 113 is provided with the adsorption face, adsorb hole 11a with vacuum cavity 114 intercommunication, vacuum cavity 114 with the vacuum pump intercommunication.
Specifically, in one embodiment, as shown in fig. 8 to 11, the cathode carrier 11 may include a carrier base 112 and a carrier cover plate 113 stacked on each other, where the carrier base 112 and the carrier cover plate 113 are both in rectangular plate structures, and a circle of edges of the two are provided with screw holes, and the stacked cathode carrier 11 may be fastened by screws. The first side of the carrier cover plate 113 is a side in contact with the carrier base 112, the side can be processed to form a groove, the carrier base 112 can also be processed to form a groove, after the carrier base 112 and the carrier cover plate 113 are stacked and fixed, a vacuum cavity 114 is formed between the carrier base 112 and the carrier cover plate 113, and the vacuum cavity 114 is communicated with a vacuum pump. The second side of the stage cover 113 is a side provided with an adsorption surface, and the adsorption hole 11a penetrates the first side and the second side, and the adsorption hole 11a communicates with the vacuum chamber 114. The carrier base 112 may be fixed to the output end of the cathode driving assembly, so as to drive the carrier cover 113 and the battery plate 30 adsorbed on the second side of the carrier cover 113.
Optionally, referring to fig. 9 or 10, the cathode carrier 11 further includes:
and a seal ring 115, wherein the seal ring 115 is disposed between the stage cover plate 113 and the stage base 112.
Specifically, in one embodiment, as shown in fig. 9 or 10, in order to avoid the plating solution from being sucked into the vacuum chamber 114 due to the leakage of the plating solution, an annular groove may be formed at a portion where the stage cover plate 113 and the stage base 112 contact each other, and a seal ring 115 may be fitted into the annular groove, so that the gas tightness of the cathode stage 11 is improved by elastic deformation of the seal ring 115.
Alternatively, referring to fig. 9, the stage cover plate 113 is provided with a through hole penetrating the first side and the second side, and the rod-shaped probe is screwed with the stage base 112 through the through hole.
Specifically, in one embodiment, as illustrated in fig. 9, in order to provide a sufficient installation space for the rod-shaped probe, a through hole penetrating through the first side and the second side may be provided in the stage cover plate 113, the through hole may be slightly larger than the diameter of the rod-shaped probe, a threaded hole is formed in the stage base 112, an external thread is provided at the bottom end of the rod-shaped probe, and the rod-shaped probe is screwed and fastened to the stage base 112 through the through hole by a threaded connection, so as to be in contact electrical connection with the battery plate 30.
Optionally, referring to fig. 3, the battery plate electroplating device further includes:
the light source 14 is disposed in the plating tank 10, and the light source 14 is distributed on two sides of the axis of the anode roller 12.
Specifically, in one embodiment, since the resistance of the battery plate 30 is relatively high, in order to reduce the plating difficulty, as shown in fig. 3, the light sources 14 may be disposed in the plating tank 10, and the two sets of light sources 14 are respectively located at two sides of the axis of the anode roller 12, and irradiate at the plating input position and the plating output position of the battery plate 30, so that the movement of carriers is promoted in a photoinduction manner by using the photoelectric effect, and the plating efficiency is improved.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present invention and the scope of the claims, which are to be protected by the present invention.
Claims (14)
1. A battery plate plating apparatus, characterized in that the battery plate plating apparatus comprises:
an electroplating bath, wherein the electroplating bath is filled with electroplating liquid;
the cathode carrier is provided with an adsorption surface for adsorbing and fixing the battery piece, and a conductive cathode is arranged in the area where the adsorption surface is located;
the anode roller is arranged in the electroplating bath, located below the cathode carrier, and rotationally connected with the electroplating bath, and the surface of the anode roller is provided with a turbulence structure protruding from the circumferential surface.
2. The battery plate plating apparatus according to claim 1, wherein the turbulence structure is a strip-shaped turbulence plate provided along an axial direction of the anode roller.
3. The battery plate plating apparatus according to claim 2, wherein a plurality of said strip-shaped spoilers are distributed around the axial direction of said anode roller.
4. The battery plate plating apparatus according to claim 3, wherein a plurality of the strip-shaped spoilers are uniformly distributed at equal intervals.
5. The battery plate plating apparatus as recited in claim 1, wherein a hollow cavity for containing anode metal is provided inside the anode roller, and a surface of the anode roller is provided with a convection hole communicating the hollow cavity and the plating solution.
6. The battery plate plating apparatus according to claim 1, further comprising:
the output end of the cathode driving assembly is fixedly connected with the cathode carrier, and the cathode driving assembly drives the cathode carrier to synchronously move with the battery piece.
7. The battery plate plating apparatus as recited in claim 6, wherein said battery plate plating apparatus further comprises:
the vacuum pump, the adsorption surface is provided with a plurality of absorption holes, absorption hole with the vacuum pump intercommunication.
8. The battery plate plating apparatus according to claim 1, wherein the conductive cathode is a rod-like probe or a cathode contact provided on the suction surface.
9. The battery plate plating apparatus as recited in claim 8, wherein said rod-like probe is detachably connected to said cathode stage.
10. The battery plate plating apparatus as recited in claim 1, wherein a surface of said cathode carrier is provided with a corrosion-resistant insulating coating.
11. The battery plate plating apparatus as recited in claim 9, wherein said cathode carrier comprises:
the carrier base is fixedly connected with the output end of the cathode driving assembly;
the carrier cover plate is stacked and fixed with the carrier base, a vacuum cavity is arranged between the first side of the carrier cover plate and the carrier base, the second side of the carrier cover plate is provided with an adsorption surface, the adsorption hole is communicated with the vacuum cavity, and the vacuum cavity is communicated with the vacuum pump.
12. The battery plate plating apparatus of claim 11, wherein the cathode carrier further comprises:
the sealing ring is arranged between the carrier cover plate and the carrier base.
13. The battery plate plating apparatus of claim 11, wherein the carrier cover plate is provided with a through hole penetrating the first side and the second side, and the rod-shaped probe is screwed with the carrier base through the through hole.
14. The battery plate plating apparatus according to claim 1, further comprising:
the light sources are arranged in the electroplating tank and distributed on two sides of the axis of the anode roller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311177883.9A CN117265624A (en) | 2023-09-12 | 2023-09-12 | Solar cell electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311177883.9A CN117265624A (en) | 2023-09-12 | 2023-09-12 | Solar cell electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117265624A true CN117265624A (en) | 2023-12-22 |
Family
ID=89199996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311177883.9A Pending CN117265624A (en) | 2023-09-12 | 2023-09-12 | Solar cell electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117265624A (en) |
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2023
- 2023-09-12 CN CN202311177883.9A patent/CN117265624A/en active Pending
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