CN117261227B - Preparation method of thermal interface material based on 3D printing framework and thermal interface material - Google Patents
Preparation method of thermal interface material based on 3D printing framework and thermal interface material Download PDFInfo
- Publication number
- CN117261227B CN117261227B CN202311054207.2A CN202311054207A CN117261227B CN 117261227 B CN117261227 B CN 117261227B CN 202311054207 A CN202311054207 A CN 202311054207A CN 117261227 B CN117261227 B CN 117261227B
- Authority
- CN
- China
- Prior art keywords
- printing
- thermal interface
- interface material
- heat
- outer ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 title claims abstract description 115
- 238000010146 3D printing Methods 0.000 title claims abstract description 109
- 238000002360 preparation method Methods 0.000 title abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 45
- 239000000945 filler Substances 0.000 claims abstract description 39
- 239000002131 composite material Substances 0.000 claims abstract description 35
- 239000000839 emulsion Substances 0.000 claims abstract description 33
- 229920000642 polymer Polymers 0.000 claims abstract description 21
- 239000002245 particle Substances 0.000 claims abstract description 18
- 238000002156 mixing Methods 0.000 claims abstract description 17
- 239000011265 semifinished product Substances 0.000 claims abstract description 12
- 238000005096 rolling process Methods 0.000 claims abstract description 9
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 7
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 55
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 55
- 230000008093 supporting effect Effects 0.000 claims description 44
- 239000000843 powder Substances 0.000 claims description 18
- 229910010293 ceramic material Inorganic materials 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 8
- 239000004677 Nylon Substances 0.000 claims description 7
- 229920001778 nylon Polymers 0.000 claims description 7
- 239000011231 conductive filler Substances 0.000 claims description 3
- NJVOHKFLBKQLIZ-UHFFFAOYSA-N (2-ethenylphenyl) prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1C=C NJVOHKFLBKQLIZ-UHFFFAOYSA-N 0.000 claims description 2
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 238000000149 argon plasma sintering Methods 0.000 claims description 2
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 2
- 239000002041 carbon nanotube Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 229910003465 moissanite Inorganic materials 0.000 claims description 2
- 229910021382 natural graphite Inorganic materials 0.000 claims description 2
- 239000012188 paraffin wax Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920002530 polyetherether ketone Polymers 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 229920002545 silicone oil Polymers 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims 7
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims 7
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims 7
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 1
- 238000012546 transfer Methods 0.000 abstract description 23
- 239000004020 conductor Substances 0.000 abstract description 12
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical class N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 19
- 229910052582 BN Inorganic materials 0.000 description 17
- 238000001723 curing Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 12
- 230000005540 biological transmission Effects 0.000 description 10
- 238000011049 filling Methods 0.000 description 10
- 241000283070 Equus zebra Species 0.000 description 9
- 238000010276 construction Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 8
- 238000011161 development Methods 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 238000005245 sintering Methods 0.000 description 7
- 238000007639 printing Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 238000004891 communication Methods 0.000 description 5
- 230000001976 improved effect Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000000110 selective laser sintering Methods 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- -1 Polydimethylsiloxane Polymers 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 238000002076 thermal analysis method Methods 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical group [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- 229910018557 Si O Inorganic materials 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 230000002143 encouraging effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000011232 storage material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/379—Handling of additively manufactured objects, e.g. using robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
- B33Y40/20—Post-treatment, e.g. curing, coating or polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
- B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Ceramic Engineering (AREA)
- Civil Engineering (AREA)
- Composite Materials (AREA)
- Structural Engineering (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Robotics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
Abstract
The invention provides a preparation method of a thermal interface material based on a 3D printing framework, which belongs to the technical field of heat conducting materials, and comprises the following steps: obtaining a 3D printing template through 3D printing; the basic components of the polymer emulsion and the curing agent are mixed according to the weight ratio of 10:1, mixing to obtain polymer emulsion; mixing inorganic heat conducting particles with the polymer emulsion according to a mass ratio of 3:2, mixing to obtain a heat-conducting composite filler; injecting the heat-conducting composite filler into the 3D printing template, transferring the heat-conducting composite filler into a die, and tightly arranging the heat-conducting composite filler in a cavity of the 3D printing template through a rolling process to obtain a semi-finished product; and (3) solidifying and forming the semi-finished product to obtain the thermal interface material based on the 3D printing framework. According to the method, the 3D printing template is used, and the heat-conducting composite filler is obtained through rolling and assembling, so that the prepared thermal interface material has excellent directional heat transfer performance. The invention also provides a thermal interface material based on the 3D printing framework.
Description
Technical Field
The invention belongs to the technical field of heat conducting materials, and particularly relates to a preparation method of a thermal interface material based on a 3D printing framework and the thermal interface material.
Background
Thermal Interface Materials (TIMs) are a general term for materials applied between heat dissipating devices and heat generating devices to reduce the use of them.
High temperatures can have deleterious effects on stability, reliability and life, such as excessive temperatures compromising the junction of the semiconductor, damaging the connection interface of the circuit, increasing the resistance of the conductor and causing mechanical stress damage. Therefore, ensuring that heat generated by the heat-generating electronic components can be discharged in time has become an important aspect of microelectronic product system assembly, and for portable electronic products (such as notebook computers, etc.) with high integration level and assembly density, heat dissipation has even become a technical bottleneck problem for the whole product. In the microelectronics field, an emerging discipline has evolved, thermal management materials including thermal interface materials and thermal storage materials. The thermal interface material is a material used for specially researching a safe heat dissipation mode and heat dissipation equipment of various electronic equipment. Therefore, the thermal interface material plays a very critical role in thermal management, and is an important research branch in this discipline.
The principle of the thermal interface material for reducing the heat dissipation device and the heating device is as follows: there are very fine, rugged gaps between the surface and the heat sink, which if they are mounted directly together, will have an actual contact area of only 10% of the area of the heat sink base, the remainder being the air gap. Because air is only 0.024W/(m.K), the heat is a poor conductor, the contact thermal resistance between the electronic element and the radiator is very large, the heat conduction is seriously hindered, and finally the radiator has low efficiency. The gaps are filled with a thermal interface material with high thermal conductivity, air in the gaps is discharged, an effective heat conduction channel is established between the electronic element and the radiator, and the thermal contact resistance can be greatly reduced, so that the function of the radiator can be fully exerted.
The development of 5G communication technology has resulted in compact arrangements of precision parts, which makes new thermal interface materials for directional heat transfer a necessary trend for the development of heat conducting materials.
Disclosure of Invention
In order to solve the problem of insufficient directional heat transfer performance of the existing thermal interface material, the invention provides a preparation method of the thermal interface material based on a 3D printing framework, the method uses a PA1212 material as a 3D printing template, and the 3D printing template and the heat conducting composite filler are in good interfacial connection through a rolling assembly process, so that the prepared thermal interface material has excellent directional heat transfer performance, and the method is simple in process operation, small in safety pollution and easy for large-scale industrialized popularization.
The invention also provides a thermal interface material based on the 3D printing framework.
The invention is realized by the following technical scheme:
The invention provides a preparation method of a thermal interface material based on a 3D printing framework, which comprises the following steps:
Obtaining a 3D printing template through 3D printing;
the basic components of the polymer emulsion and the curing agent are mixed according to the weight ratio of 10:1, mixing to obtain polymer emulsion;
mixing inorganic heat conducting particles with the polymer emulsion according to a mass ratio of 3:2, mixing to obtain a heat-conducting composite filler;
injecting the heat-conducting composite filler into the 3D printing template, transferring the heat-conducting composite filler into a die, and tightly arranging the heat-conducting composite filler in a cavity of the 3D printing template through a rolling process to obtain a semi-finished product;
and (3) solidifying and forming the semi-finished product to obtain the thermal interface material based on the 3D printing framework.
Further, the 3D printing template comprises an outer ring and a supporting bar, wherein the outer ring is in a circular ring shape, the sections of the outer ring and the supporting bar are rectangular, and the outer ring and the supporting bar are connected in any one of the following connection modes;
The support bars are arranged in the outer ring, the support bars comprise annular bars and linear bars, the annular bars are in a circular shape, the number of the annular bars is 5, the diameters of the annular bars are different, the axes of the annular bars are coincident with the axis of the outer ring, the linear bars are linear, the number of the linear bars is 4, one end of each linear bar is connected to the outer edge of the innermost annular bar, the other end of each linear bar is connected to the inner edge of the outer ring, the linear bars are intersected with the rest annular bars, and the extension lines of the linear bars are perpendicular to and intersected with the axis of the outer ring;
The supporting bar is in a spiral shape, the outer end of the supporting bar is connected with the inner edge of the outer ring, and the inner end of the supporting bar is intersected with the axis of the outer ring;
And C, the supporting strips are arranged in the outer ring, the number of the supporting strips is 11, the supporting strips are mutually parallel, and two ends of the supporting strips are connected with the inner edge of the outer ring.
Further, the thickness of the 3D printing template is 1mm, and the diameter is 25.4mm;
wherein the thickness of the outer ring and the supporting strips is 1mm, and the width of the outer ring and the supporting strips is 1mm;
In the 3D printing template with the connection mode of the outer ring and the support bar being A, the inner diameter of the innermost annular bar is 1.7mm;
In the 3D printing template with the connection mode of the outer ring and the support bar being C, the width of a cavity gap farthest from the center of the ring is 1.7mm.
Further, when the connection mode of the outer ring and the supporting strips is A and C, the widths of the cavities formed between the outer ring and the supporting strips and between the supporting strips are the same as the widths of the supporting strips;
When the connection mode of the outer ring and the supporting strips is B, the width of the cavity gap formed by the spiral supporting strips is the same as the width of the supporting strips.
Further, obtaining a 3D printing template through 3D printing specifically includes:
and placing the 3D printing raw material into a 3D printing device, and obtaining the 3D printing template through laser sintering.
Further, the 3D printing raw material comprises any one of nylon powder, TPU powder and PEEK powder;
wherein the nylon powder is nylon PA1212 powder, the particle size is 50-60 μm, and the melting point is 180 ℃.
Further, the curing temperature of the polymer emulsion is less than 160 ℃, and the polymer emulsion comprises any one of PDMS, vinyl silicone oil, silicone-acrylate emulsion, styrene-acrylate emulsion, epoxy resin and paraffin;
Wherein the PDMS is Sy lgard 184, and the viscosity is 3900cps.
Further, the inorganic heat conducting particles comprise any one of ceramic materials s-BN, ceramic materials Al N, ceramic materials SiC, diamond, gold, silver, copper, al 2O3, znO, mgO, caO, carbon fibers, carbon nanotubes, graphene, graphite and natural graphite.
Further, the polymer emulsion is PDMS emulsion, the inorganic heat conducting particles are s-BN, the proportion of the s-BN in the thermal interface material is 35-50wt%, the thermal interface material is solid and slightly sticky, the curing temperature of the semi-finished product is 140-160 ℃, and the curing time is 15-25min.
Further, the mold is a stainless steel mold.
Further, the step of solidifying and forming the semi-finished product to obtain the thermal interface material based on the 3D printing framework specifically comprises the following steps:
and curing and forming the semi-finished product under a heat source to obtain the thermal interface material based on the 3D printing framework, wherein the heat source comprises a hot table, an oven and a flat vulcanizing machine.
Further, inorganic heat conducting particles and the polymer emulsion are mixed according to a mass ratio of 3:2, specifically comprising:
mixing inorganic heat conducting particles with the polymer emulsion by high-speed manual stirring or high-speed mechanical mixing, wherein the mass ratio of the inorganic heat conducting particles to the polymer emulsion is 3:2.
Based on the same inventive concept, the invention provides a thermal interface material based on a 3D printing framework, which is prepared by the preparation method of the thermal interface material based on the 3D printing framework.
Based on the same inventive concept, the invention also provides a thermal interface material based on the 3D printing framework, which comprises a 3D printing template and a heat conduction filler tightly filled in the cavity of the 3D printing template;
the heat-conducting filler is formed by uniformly mixing s-BN with PDMS emulsion and then solidifying, wherein in the heat-conducting filler, the mass ratio of the s-BN to the PDMS emulsion is 5:5-7:3, and the PDMS emulsion is prepared by mixing the basic components of PDMS and a solidifying agent according to the weight ratio of 10:1, and mixing.
One or more technical solutions in the embodiments of the present invention at least have the following technical effects or advantages:
1. According to the preparation method of the thermal interface material based on the 3D printing framework, the ratio of the particles such as s-BN and the PDMS emulsion is 5:5-7:3, the heat conducting material with high filling content effectively solves the problems of high cost, environmental pollution and the like caused by surface treatment, chemical modification and other processes in the process of developing the high heat conducting material, reduces pollution and waste of chemical treatment, shortens the process flow, and the like.
2. According to the preparation method of the thermal interface material based on the 3D printing framework, the novel thermal interface material with the complex heat conduction path is induced to be constructed by adopting the 3D printing templates with different shapes, so that the preparation method has a enlightening effect on constructing the novel thermal interface material with high heat conduction, and further proves the advantages of the templates with the three shapes A, B and C.
3. The thermal interface material prepared by the method has higher in-plane thermal conductivity, the through-plane thermal conductivity is as high as 3.0-3.3 W.m -1K-1, the thermal interface material has great encouraging effect on directional heat transmission and development of the thermal interface material, and the thermal interface material has the advantages of simplicity in operation, short flow, less pollution, low raw material cost and the like, so that the thermal interface material is suitable for mass production and use.
4. The preparation method of the thermal interface material based on the 3D printing framework can be widely applied to high-frequency high-precision instruments and digital products, can effectively solve the problems of compact stacking and difficult heat dissipation of elements caused by thinning and miniaturization of electronic products (such as a notebook computer main board, a mobile phone main board and the like), realizes directional heat transmission, and in the heat transmission process, firstly realizes heat transmission through an s-BN/PDMS composite filler, and the support bar has lower heat transmission performance, so that the heat transmission direction is changed to a certain extent, and therefore, the effect of directional heat transmission is generated, and the difficult heat dissipation problem of the electronic elements caused by compact stacking is greatly satisfied.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a drawing of four different shaped PA1212 templates referred to in examples 1-4 of the present invention;
FIG. 2 is a microscopic SEM image of the PA1212 powder before and after sintering in examples 1-4 of the present invention;
FIG. 3 is a cross-sectional microscopic SEM image and EDS image of s-BN/PDMS/PA1212 of example 3 of the present invention;
FIG. 4 shows the thermal conductivity of four different shapes of s-BN/PDMS/PA1212 materials prepared in examples 1 to 4 of the present invention;
FIG. 5 is a plot of the thermal stability points of the PA1212 template and BN/PDMS composites of examples 1 to 4 according to the present invention;
FIG. 6 is a finite element simulation of the four s-BN/PDMS/PA1212 materials prepared in examples 1 to 4 of the present invention in the through plane direction. (ambient temperature 20 ℃ C., instantaneous temperature of 100 ℃ C. For heat source)
Wherein, 1-outer ring, 2-support bar, 3-annular bar, 4-linear bar.
Detailed Description
The advantages and various effects of the present invention will be more clearly apparent from the following detailed description and examples. It will be understood by those skilled in the art that these specific embodiments and examples are intended to illustrate the invention, not to limit the invention.
Throughout the specification, unless specifically indicated otherwise, the terms used herein should be understood as meaning as commonly used in the art. Accordingly, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification will control.
Unless otherwise specifically indicated, the various raw materials, reagents, instruments, equipment and the like used in the present invention are commercially available or may be prepared by existing methods.
The whole idea of the invention is as follows:
According to the invention, on one hand, the influence of different heat conduction paths on the heat conduction performance of the thermal interface material based on the 3D printing framework is researched through the 3D printing templates with different shapes. The heat conduction path is induced by the construction of the thermal interface material, so that the heat transmission is realized, and the design of the thermal interface material based on the 3D printing framework is beneficial to assembling the directional heat transmission material. On the other hand, the invention is favorable for solving the problem that 3D printing manufacturing industry enters a bottleneck period caused by single performance, difficult function modification and the like of a 3D printing product, and provides a novel method for combining processes such as a 3D printing template method, rolling, structure construction, thermosetting molding and the like, thereby realizing the assembly work of the PA1212 framework and the BN/PDMS composite material and successfully constructing a novel thermal interface material with high heat conductivity.
The 3D printing technology is known as the core technology of the third industrial revolution, and promotes the development of the manufacturing industry by virtue of the characteristics of flexible process, small batch, high quality, individuation, integration and the like. Materials suitable for 3D printing include metals, ceramics, polymers and the like, wherein the polymer materials become the most promising materials by virtue of the characteristics of low forming temperature, low sintering power, high sintering precision and the like. Currently, 3D printing techniques are classified into ink printing and laser build-up material manufacturing techniques according to a molding manner. Among the laser-based additive material manufacturing techniques, the Selective Laser Sintering (SLS) technique, which is based on powder sintering, is one of the earliest, most widely used and most successful 3D printing techniques. With the development of science and technology, the problems of electromagnetic pollution, heat management and the like are more acute, the 3D printing product with single material cannot meet the requirements of new times, and the development of multifunctional 3D printing materials becomes a necessary trend. According to the invention, the novel thermal interface material is induced to be constructed around the 3D printing templates with different shapes, the structural construction of the 3D printing templates and the heat conducting filler can be realized through an assembly method, and finally the novel thermal interface material with high heat conductivity is obtained.
Polydimethylsiloxane (PDMS) is used as an organic polymer material taking Si-O bond as a structural unit, has the advantages of good thermal stability, hydrophobicity, dielectric property, flexibility and the like, and has great application value in the fields of electronic packaging, waterproof coating, repairable sensors and the like. Taking the Dow Corning PDMS-184 as an example, the PDMS consists of two parts of a basic component and a curing agent, and the two parts are mixed according to the weight ratio of 10:1. The difference of curing temperatures causes the difference of curing time, the curing time at normal temperature (20 ℃) is 24 hours, and the curing can be fully performed in a high-temperature environment of 150 ℃ only for 15 minutes. The 3D printing template takes the nylon material as the raw material and has the characteristics of being intricate and complex, so that the 3D printing template has higher requirements on the curing temperature of the heat conducting filler. In addition, the heat conducting part works in a high-temperature environment for a long time, and has high requirements on the thermal stability of the material and the heat transfer direction. Therefore, PDMS is undoubtedly the best choice for a new thermal interface material as a low temperature cure, hydrophobicity, thermal stability, etc.
Boron Nitride (BN) is a ceramic material that is one of the main subjects of heat conducting materials by virtue of high in-plane thermal conductivity (600 w·m -1·K-1) and electrical insulating properties. BN is classified into hexagonal boron nitride (h-BN), lamellar boron nitride (BNNS), spherical boron nitride (s-BN), cubic Boron Nitride (CBN) and the like according to kinds, and BN has high in-plane thermal conductivity, and is an important bridge for studying directional heat transfer. Compared with polymer materials with low heat conduction performance (generally lower than 0.5 W.m -1·K-1), ceramics, metals, carbon-based materials and the like have regular crystal structures, and have great advantages in the aspects of phonon transmission, heat conduction path construction and the like. However, the low solubility, high hardness, etc. of materials such as ceramics limit the application range, and the filled heat-conducting composite material is the best development direction of high heat-conducting ceramic materials. The BN with high filling content is a main problem of causing the rapid increase of the viscosity, the reduction of the processability and the like of the composite system, and limits the progress of industrial application to a certain extent. In order to reduce negative effects caused by the viscosity of the system, the isotropic high-heat-conductivity s-BN is selected as the filler, so that the viscosity of the composite system is greatly reduced, the processability of the composite system is improved, and the method has very important significance for researching high-content filling of BN.
The thermal conductivity of a Thermal Interface Material (TIM) is closely related to the composition, content and distribution of thermally conductive particles. The ceramic, carbon-based and metal particles have excellent heat conduction performance, the carbon-based and metal particles are high in price, the problems of heat conduction and electric conduction performance, easiness in oxidation of metal materials and the like are solved, the method is difficult to be applied to TIM with high dielectric property and low cost, and the ceramic material becomes the best choice of the thermal interface material. The ceramic particles with high filling content can improve the heat conducting property of the composite material, however, the large-scale addition of the ceramic material easily causes the problems of the viscosity of the composite system, the cost increase, the processing difficulty and the like. In a composite system, the heat conducting particles have better heat transfer capacity (compared with polymers), so that the communication of the heat conducting particles has great significance for the directional transfer of heat. In summary, the uniform distribution and high content of the heat conducting particles in the composite system are the precondition of the heat conducting path and the construction of the heat conducting network, and are extremely important for the research of the thermal interface material. Therefore, the distribution state, the content and the like of BN in PDMS are closely related to the heat transfer performance of the new interface material.
Therefore, the invention discloses a novel thermal interface material for inducing and constructing a complex heat conduction path by a 3D printing template and a preparation method, wherein PA1212 powder is used as a raw material, different shapes of 3D printing templates are obtained through an SLS technology, the novel thermal interface material is formed by constructing the PA1212 printing template, PDMS emulsion and s-BN heat conduction filler through a structure, the s-BN filler is uniformly distributed in PDMS through mechanical stirring, the structural construction of the s-BN/PDMS heat conduction composite filler and the PA1212 template can be better realized by an assembly method, and the novel thermal interface material of BN/PDMS/PA1212 is obtained through thermosetting molding. The invention reserves the advantages of flexible design, high precision, individuation, integration and the like of 3D printing, has great advantages in the manufacturing field, and obtains the novel thermal interface material with high heat conduction through the design of the 3D printing templates with different shapes. In the invention, the novel BN/PDMS/PA1212 thermal interface material with the s-BN loading capacity of only 42wt% is characterized by in-plane thermal conductivity and through-plane thermal conductivity of 8.82-10.11 W.m -1K-1 and 3.0-3.3 W.m -1K-1, and has great research significance. In addition, the method has the advantages of simple operation, small pollution, contribution to industrialized popularization and the like.
The following describes a preparation method of a thermal interface material based on a 3D printing framework and the thermal interface material in detail with reference to examples and experimental data.
Example 1
The embodiment provides a preparation method of a thermal interface material based on a 3D printing framework, which comprises the following steps:
1. As shown in fig. 1, a 3D printing template-star-shaped (corresponding to the connection mode D of the outer ring and the support bar) is designed by three-dimensional modeling software (CAD, 3Ds MAX), PA1212 powder is tiled in a powder supply cylinder at 150 ℃, a single laser beam of 30W is used for sintering powder materials at a sintering speed of 2.28m/s and a scanning width of 0.08mm through strict control of 3D printing equipment, the temperature of the forming cylinder is rapidly increased to 175 ℃, at this time, the PA1212 powder is melted and accumulated at high temperature, and the 3D printing template is obtained through cooling.
The connection mode D of the outer ring 1 and the support bar 2 is specifically as follows: the support bars 2 are linear and are 22 in number, one end of each support bar 2 is connected with the inner edge of the outer ring 1, the other end of each support bar 2 extends to the axis of the outer ring 1, a plurality of support bars 2 are converged into a disc at the axis of the outer ring 1, and the axis of the disc coincides with the axis of the outer ring 1.
2. 3.644G of a polydimethylsiloxane basic component (polymer containing epoxy groups and silicate groups) and 0.364g of a curing agent (trace platinum catalyst) were weighed into a 50ml beaker, manually and vigorously stirred with a glass rod until uniform, and left standing for 5-10min, until the interior of the polydimethylsiloxane emulsion is bubble-free, 6g of spherical boron nitride (60 μm) was weighed into the beaker, and the mixture was stirred manually or mechanically at high speed until the s-BN/PDMS became fine microspheres, thus obtaining an s-BN/PDMS composite filler having a s-BN filler content of 42 wt%.
3. The s-BN/PDMS mixed filler is dispersed in a star-shaped PA1212 printing template cavity, the star-shaped PA1212 printing template cavity is slowly transferred to a customized stainless steel die, a layer of PI film is lightly covered on the upper surface and the lower surface of the stainless steel die respectively, a 3D printing material filled in the stainless steel die is rolled and filled under a customized iron roller, the roller length is 60mm, the weight is 0.55KG, 10.8kpa pressure is generated, the s-BN/PDMS mixed filler is tightly arranged in the star-shaped PA1212 template cavity after rolling for 5-10min, and the s-BN/PDMS mixed filler is compactly arranged, so that the arrangement of the star-shaped PA1212 template cavity is more beneficial to the communication of a heat conduction path, and a semi-finished product of the novel thermal interface material is obtained at the moment.
4. Transferring the semi-finished product of the novel thermal interface material to a constant temperature heat table or oven at 150 ℃, preserving heat for 15-20min, fully solidifying, closing the temperature, naturally cooling to room temperature, taking the s-BN/PDMS/PA1212 thermal interface material out of a stainless steel die with a wallpaper knife carefully, polishing with sand paper and cutting to obtain the star-shaped PA1212 template material filled with regular cylindrical s-BN/PDMS (22 filling areas, 16.36 apex angles and sector filling blocks with radius of 8.187 mm).
Example 2
The difference between the implementation method and the embodiment 1 is that the shape of the 3D printing template adopted in the steps 1 and 3 is changed, the star-shaped printing template is changed into a zebra shape (corresponding to the connection mode C of the outer ring and the support bar), and other steps and parameters are the same as those of the embodiment 1.
Example 3:
The difference between the implementation method and the embodiment 1 is that the shape of the 3D printing template adopted in the steps 1 and 3 is changed, the star-jet shape is changed into a spiral shape (corresponding to the connection mode B of the outer ring and the support bar), and other steps and parameters are the same as those of the embodiment 1.
Example 4:
The difference between the implementation method and the embodiment 1 is that the shape of the 3D printing template adopted in the steps 1 and 3 is changed, the star-jet shape is changed into a circular ring shape (corresponding to the connection mode A of the outer ring and the support bars), and other steps and parameters are the same as those of the embodiment 1.
The connection modes A, B and C of the outer ring 1 and the support bar 2 are as follows:
The support bar 2 is arranged in the outer ring 1, the support bar 2 comprises annular bars 3 and linear bars 4, the annular bars 3 are in a circular ring shape, the number is 5, the diameters of the annular bars 3 are different, the axes of the annular bars 3 are coincident with the axis of the outer ring 1, the linear bars 4 are linear, the number is 4, one end of each linear bar 4 is connected to the outer edge of the innermost annular bar 3, the other end of each linear bar 4 is connected to the inner edge of the outer ring 1, the linear bars 4 are intersected with the rest annular bars 3, and the extension lines of the linear bars 4 are perpendicular to and intersected with the axis of the outer ring 1;
the supporting strips 2 are spiral, the outer ends of the supporting strips 2 are connected with the inner edge of the outer ring 1, and the inner ends of the supporting strips are intersected with the axis of the outer ring 1;
And C, the supporting strips 2 are arranged in the outer ring 1, the supporting strips 2 are linear, the number of the supporting strips 2 is 11, the supporting strips 2 are mutually parallel, and two ends of the supporting strips 2 are connected with the inner edge of the outer ring 1.
SEM pictures, EDS pictures, heat conduction performance pictures, thermal analysis point diagrams and finite element simulation pictures of the thermal interface materials prepared in the embodiments 1-4 of the invention are shown in figures 3-6, and SEM pictures of PA1212 are shown in figure 2.
As shown in fig. 1, the 3D printing technology has the advantages of high precision, being beneficial to personalized design and production, and the like, the four PA1212 templates (respectively star-shot shape, zebra shape, spiral shape and circular ring shape) according to the embodiment of the invention have the thickness of other frameworks and the size of the gap cavity of 1mm except for star-shot shape, 22 star-shot shape frameworks gap cavity sizes, sector filling blocks with 16.36 vertex angles and 8.187mm radius, and the thickness of the frameworks of adjacent gap cavities is 1mm. The invention induces and constructs the heat conduction path through the heat conduction filling of the template gap, and has great significance for the construction and communication of the 3D printing template functional material.
As shown in fig. 2, the PA1212 powder has an oval spherical shape, a rough surface and a few holes (left image), and the surface of the PA1212 template material obtained by sintering with the SLS technology is smooth and compact (right image), so that the mechanical properties of the PA1212 template material are greatly improved, and the 3D printing template can meet most commercial uses.
FIG. 3 is SEM and EDS pictures of the s-BN/PDMS/PA1212 composite material with the s-BN filler content of 42wt%, and as can be seen from the Si and N element maps, the s-BN is well dispersed in the s-BN/PDMS composite filler, providing favorable conditions for constructing the heat conduction path; as shown by SEM and Si, N and C element maps, the s-BN/PDMS composite material is in good contact with the PA1212 template, and has no obvious layering phenomenon, so that the s-BN/PDMS composite material and the PA1212 template have good interface compatibility.
The invention adopts a laser heat conduction instrument (LFA 467) to evaluate the heat conduction performance of the thermal interface material, and uses a laser beam as a heat source to detect the surface temperature distribution of a sample so as to evaluate the heat conductivity of the material. The laser heat conduction method has great application prospect in the field of heat conduction measurement, and is also the most widely applied heat conduction evaluation means. As shown in FIG. 4, the thermal conductivity in the plane and the thermal conductivity in the through plane of the star-shaped thermal interface material in example 1 were only 3.56 and 0.78 W.m -1·K-1, and the heat transfer effect was not satisfactory. Whereas the thermal interface materials of zebra shape, spiral shape and torus shape in-plane thermal conductivities of examples 2 to 4 exhibited 8.8 to 10.1 W.m -1·K-1, the spiral shape of example 3 had more excellent path communicating effects; the thermal conductivity of the penetrating surface of the thermal interface material in the shape of the zebra, the spiral and the circular ring is 3.0-3.3 W.m -1·K-1, and compared with the star-shaped thermal interface material in the shape of the zebra, the spiral and the circular ring, the thermal conductivity of the thermal interface material in the shape of the zebra, the spiral and the circular ring is greatly improved. In summary, the 3D printing templates of the zebra shape, the spiral shape and the circular ring shape are more beneficial to the communication of the heat conduction paths, and the construction of the heat conduction paths by template induction is realized.
In order to study the thermal stability of the thermal interface material, the invention adopts a TGA thermogravimetric analyzer manufactured by Shanghai Zhenxi electric technology Co., ltd, and heats the temperature from 30 ℃ to 800 ℃ at a rate of 20K/min so as to analyze the thermal stability. The test results are shown in FIG. 5, wherein the BN/PDMS/PA1212 composite material with BN filling content of 42wt% has a thermal analysis point diagram and the decomposition temperature of BN/PDMS heat conductive filler is 430 ℃; the decomposition temperature of the PA1212 is 440 ℃, and the heat stability of the PA1212 and the PA1212 are both good, so that the PA1212 is suitable for most heat dissipation environments.
To further investigate the heat transfer process of the thermal interface material, the present invention performed heat transfer simulations using ANSYS software developed by ANSYS corporation, usa. As shown in FIG. 6, a finite element (ANSYS) simulation of the s-BN/PDMS/PA1212 composite with a BN loading of 42wt% across the face, at an ambient temperature of 20℃and a heat transfer surface at an instantaneous temperature of 100 ℃. As known from 0-0.26316s, the s-BN/PDMS heat-conducting material has absolute advantages in the heat transfer process, and the PA1212 template is still in a low-temperature state; as known by 0.26316-0.52632s, the s-BN/PDMS filler transfers heat to the PA1212 template of the interlayer to realize the heating process of heat transfer, and the central skeleton with a heavy star-shaped structure cannot be heated up rapidly by virtue of rare heat; as shown by 0.52632-1s, the 3D printing templates with zebra shapes, spiral shapes and circular ring shapes almost complete heat transfer of the s-BN/PDMS and the PA1212 template, the thermal interface materials are heated together, and the center of the 3D printing template with the star-shaped is still in a low-temperature state, so that the heat transfer requirement is difficult to meet. Therefore, the zebra shape, the spiral shape, and the circular ring shape have a superior heat transfer effect compared to the star-shaped 3D printing template.
The s-BN/PDMS heat-conducting filler is filled in the gaps of the disc framework, and the heat-conducting filler is tightly filled in the gaps of the disc framework through a rolling process, so that the air in the heat-conducting filler is discharged, and the heat-conducting property of the thermal interface material is improved. The heat conduction filler is communicated, so that a heat conduction path and a heat conduction network are formed, and an important condition is provided for heat transportation. The low thermal conductivity of the disk pattern impedes heat transfer, and the thermal interface material is formed with the thermal conductive filler, which is beneficial to directional heat transfer.
The novel thermal interface material with high through surface heat transfer, which is developed by the invention, only needs 42wt% of s-BN, the through thermal conductivity of which can reach 3.3 W.m -1·K-1, is 4.2 times of the same content of s-BN/PDMS (the thermal conductivity of the same content of s-BN/PDMS through surface is 0.73 W.m -1·K-1). The 3D printing framework has extremely low heat conduction performance (0.21 W.m -1·K-1), is a poor heat conductor, and the cavity gap of the composite material provides good heat conduction path for the high heat conduction s-BN/PDMS, so that the composite material provides favorable conditions for directional heat transfer by virtue of the low heat conduction layer of the 3D printing framework and the high heat conduction layer of the s-BN/PDMS. According to the invention, a novel directional high-heat-conductivity thermal interface material is constructed by combining a high-precision 3D printing technology with the s-BN/PDMS heat-conducting material.
According to the invention, the heat-conducting composite filler is tightly filled in the gaps of the 3D printing template, and the 3D printing template and the heat-conducting material are well assembled through the processes of a 3D printing template method, rolling, structure construction, thermosetting molding and the like, so that the heat-conducting property of the heat-conducting interface material is improved, and the problems of single function and difficult function filling of printing parts are solved. The invention has simple operation process, easily obtained materials, little pollution and easy industrialized popularization.
Finally, it is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (9)
1. A method for preparing a thermal interface material based on a 3D printing framework, the method comprising:
Obtaining a 3D printing template through 3D printing;
the basic components of the polymer emulsion and the curing agent are mixed according to the weight ratio of 10:1, mixing to obtain polymer emulsion;
mixing inorganic heat conducting particles with the polymer emulsion according to a mass ratio of 3:2, mixing to obtain a heat-conducting composite filler;
injecting the heat-conducting composite filler into the 3D printing template, transferring the heat-conducting composite filler into a die, and tightly arranging the heat-conducting composite filler in a cavity of the 3D printing template through a rolling process to obtain a semi-finished product;
Solidifying and forming the semi-finished product to obtain a thermal interface material based on a 3D printing framework;
the 3D printing template comprises an outer ring and a supporting bar, wherein the outer ring is in a circular ring shape, the sections of the outer ring and the supporting bar are rectangular, and the outer ring and the supporting bar are connected in any one of the following connection modes;
The support bars are arranged in the outer ring, the support bars comprise annular bars and linear bars, the annular bars are in a circular shape, the number of the annular bars is 5, the diameters of the annular bars are different, the axes of the annular bars are coincident with the axis of the outer ring, the linear bars are linear, the number of the linear bars is 4, one end of each linear bar is connected to the outer edge of the innermost annular bar, the other end of each linear bar is connected to the inner edge of the outer ring, the linear bars are intersected with the rest annular bars, and the extension lines of the linear bars are perpendicular to and intersected with the axis of the outer ring;
The supporting bar is in a spiral shape, the outer end of the supporting bar is connected with the inner edge of the outer ring, and the inner end of the supporting bar is intersected with the axis of the outer ring;
The supporting strips are arranged in the outer ring, the number of the supporting strips is 11, the supporting strips are mutually parallel, and two ends of the supporting strips are connected with the inner edge of the outer ring;
the thickness of the 3D printing template is 1mm, and the diameter is 25.4mm;
Wherein, the outer loop with the thickness of support bar is 1mm, and the width is 1mm.
2. The method for preparing a thermal interface material based on a 3D printing framework according to claim 1, wherein when the connection modes of the outer ring and the supporting bars are a and C, the widths of the cavities formed between the outer ring and the supporting bars and between the supporting bars are the same as the widths of the supporting bars;
When the connection mode of the outer ring and the supporting strips is B, the width of the cavity gap formed by the spiral supporting strips is the same as the width of the supporting strips.
3. The method for preparing the thermal interface material based on the 3D printing framework according to claim 1 or 2, wherein,
In the 3D printing template with the connection mode of the outer ring and the support bar being A, the inner diameter of the innermost annular bar is 1.7mm;
In the 3D printing template with the connection mode of the outer ring and the support bar being C, the width of a cavity gap farthest from the center of the ring is 1.7mm.
4. The method for preparing the thermal interface material based on the 3D printing framework according to claim 1, wherein the 3D printing template is obtained through 3D printing, specifically comprising the following steps:
Placing the 3D printing raw material into a 3D printing device, and obtaining a 3D printing template through laser sintering;
Wherein the 3D printing raw material comprises any one of nylon powder, TPU powder and PEEK powder;
wherein the nylon powder is nylon PA1212 powder, the particle size is 50-60 μm, and the melting point is 180 ℃.
5. The method for preparing the thermal interface material based on the 3D printing framework according to claim 1, wherein the curing temperature of the polymer emulsion is less than 160 ℃, and the polymer emulsion comprises any one of PDMS, vinyl silicone oil, silicone-acrylate emulsion, styrene-acrylate emulsion, epoxy resin and paraffin;
wherein the PDMS is Sylgard 184, and the viscosity is 3900cps.
6. The method for preparing a thermal interface material based on a 3D printing framework according to claim 1, wherein the inorganic heat conducting particles comprise any one of ceramic material s-BN, ceramic material AlN, ceramic material SiC, diamond, gold, silver, copper, al 2O3, znO, mgO, caO, carbon fiber, carbon nanotube, graphene, graphite and natural graphite.
7. The method for preparing the thermal interface material based on the 3D printing framework according to claim 1, wherein the polymer emulsion is PDMS emulsion, the inorganic heat conducting particles are s-BN, the ratio of s-BN in the thermal interface material is 35 wt% -50 wt%, the curing temperature of the semi-finished product is 140-160 ℃, and the curing time is 15-25min.
8. A thermal interface material based on a 3D printed skeleton, characterized in that the thermal interface material is prepared by a method for preparing a thermal interface material based on a 3D printed skeleton according to any one of claims 1-7.
9. The thermal interface material based on the 3D printing framework of claim 8, wherein the thermal interface material comprises a 3D printing template and a thermally conductive filler tightly filled in the 3D printing template cavity;
the heat-conducting filler is formed by uniformly mixing s-BN with PDMS emulsion and then solidifying, wherein in the heat-conducting filler, the mass ratio of the s-BN to the PDMS emulsion is 5:5-7:3, and the PDMS emulsion is prepared by mixing the basic components of PDMS and a solidifying agent according to the weight ratio of 10:1, and mixing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311054207.2A CN117261227B (en) | 2023-08-21 | 2023-08-21 | Preparation method of thermal interface material based on 3D printing framework and thermal interface material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311054207.2A CN117261227B (en) | 2023-08-21 | 2023-08-21 | Preparation method of thermal interface material based on 3D printing framework and thermal interface material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117261227A CN117261227A (en) | 2023-12-22 |
| CN117261227B true CN117261227B (en) | 2024-05-28 |
Family
ID=89211241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311054207.2A Active CN117261227B (en) | 2023-08-21 | 2023-08-21 | Preparation method of thermal interface material based on 3D printing framework and thermal interface material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117261227B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI259051B (en) * | 2005-01-21 | 2006-07-21 | Delta Electronics Inc | Heat dispersion module |
| JP2012060045A (en) * | 2010-09-13 | 2012-03-22 | Stanley Electric Co Ltd | Heat dissipation board |
| CN105144374A (en) * | 2013-04-23 | 2015-12-09 | 亚历克西乌和特里德控股公司 | Heat sink having a cooling structure with decreasing structure density |
| CN105256168A (en) * | 2015-10-26 | 2016-01-20 | 三峡大学 | Copper-based graphite self-lubricating composite material and preparing method thereof |
| WO2016148065A1 (en) * | 2015-03-13 | 2016-09-22 | 大沢健治 | Heat transfer device for cooling |
| CN112980136A (en) * | 2021-03-15 | 2021-06-18 | 中国科学院宁波材料技术与工程研究所 | Heat-conducting composite material and preparation method and application thereof |
| CN113895051A (en) * | 2021-10-08 | 2022-01-07 | 北京化工大学 | Preparation method of high-load-bearing polymer functional composite material based on 3D printing technology |
| WO2022254271A1 (en) * | 2021-06-02 | 2022-12-08 | 3M Innovative Properties Company | Shell structures for thermal interface materials |
| CN116314077A (en) * | 2023-05-19 | 2023-06-23 | 安徽百信信息技术有限公司 | Structure for improving thermoelectric conversion |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6730998B1 (en) * | 2000-02-10 | 2004-05-04 | Micron Technology, Inc. | Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same |
| US20030220432A1 (en) * | 2002-04-15 | 2003-11-27 | James Miller | Thermoplastic thermally-conductive interface articles |
| US20080120981A1 (en) * | 2003-03-25 | 2008-05-29 | Dean Adam J | Thermoacoustic cooling device with annular emission port |
| TW202134045A (en) * | 2019-10-25 | 2021-09-16 | 德商漢高智慧財產控股公司 | Three-dimensionally patternable thermal interface |
-
2023
- 2023-08-21 CN CN202311054207.2A patent/CN117261227B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI259051B (en) * | 2005-01-21 | 2006-07-21 | Delta Electronics Inc | Heat dispersion module |
| JP2012060045A (en) * | 2010-09-13 | 2012-03-22 | Stanley Electric Co Ltd | Heat dissipation board |
| CN105144374A (en) * | 2013-04-23 | 2015-12-09 | 亚历克西乌和特里德控股公司 | Heat sink having a cooling structure with decreasing structure density |
| WO2016148065A1 (en) * | 2015-03-13 | 2016-09-22 | 大沢健治 | Heat transfer device for cooling |
| CN105256168A (en) * | 2015-10-26 | 2016-01-20 | 三峡大学 | Copper-based graphite self-lubricating composite material and preparing method thereof |
| CN112980136A (en) * | 2021-03-15 | 2021-06-18 | 中国科学院宁波材料技术与工程研究所 | Heat-conducting composite material and preparation method and application thereof |
| WO2022254271A1 (en) * | 2021-06-02 | 2022-12-08 | 3M Innovative Properties Company | Shell structures for thermal interface materials |
| CN113895051A (en) * | 2021-10-08 | 2022-01-07 | 北京化工大学 | Preparation method of high-load-bearing polymer functional composite material based on 3D printing technology |
| CN116314077A (en) * | 2023-05-19 | 2023-06-23 | 安徽百信信息技术有限公司 | Structure for improving thermoelectric conversion |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117261227A (en) | 2023-12-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Yuan et al. | Thermal conductivity of polymer-based composites with magnetic aligned hexagonal boron nitride platelets | |
| Renteria et al. | Magnetically-functionalized self-aligning graphene fillers for high-efficiency thermal management applications | |
| JP4704899B2 (en) | Manufacturing method of heat conduction material | |
| EP3255969B1 (en) | Heat-conducting sheet and electronic device | |
| CN105580150B (en) | Thermal conductivity adhesive sheet, its manufacturing method and the electronic device using the thermal conductivity adhesive sheet | |
| CN103545273B (en) | Energy-storage radiating sheet and production method thereof | |
| EP3432695A1 (en) | Heat sink plate, manufacturing method thereof, and communication apparatus utilizing same | |
| Wu et al. | Epoxy-matrix composite with low dielectric constant and high thermal conductivity fabricated by HGMs/Al2O3 co-continuous skeleton | |
| Wang et al. | Multimaterial additive manufacturing of LTCC matrix and silver conductors for 3D ceramic electronics | |
| CN103772992A (en) | Thermal conductive composite material and preparation method thereof | |
| Lu et al. | Dynamic Leakage‐Free Liquid Metals | |
| Chen et al. | Near‐Theoretical Thermal Conductivity Silver Nanoflakes as Reinforcements in Gap‐Filling Adhesives | |
| CN109337291B (en) | Surface-modified graphene-carbon nitride-epoxy resin thermal interface material and preparation method thereof | |
| CN109971179B (en) | Heat conductive composite material | |
| CN112111153B (en) | Oriented heat conduction material and preparation method and application thereof | |
| CN117261227B (en) | Preparation method of thermal interface material based on 3D printing framework and thermal interface material | |
| Nakajima et al. | Novel polymer composite having diamond particles and boron nitride platelets for thermal management of electric vehicle motors | |
| Sahu et al. | A review on thermal properties of epoxy composites as thermal interface material | |
| CN111548586B (en) | Polymer-based composite heat conduction material and preparation method and application thereof | |
| Tran et al. | Radio frequency-assisted curing of on-chip printed CNT/silicone heatsinks produced by material extrusion 3D printing | |
| CN104708869A (en) | Aluminum-based copper-clad plate with high thermal conductivity and manufacturing method thereof | |
| CN115028999B (en) | Flexible heat storage and conduction sheet and preparation method thereof | |
| CN107603128A (en) | A kind of nonmetallic composite Nano heat sink material and preparation method thereof | |
| Wang et al. | GMP/Al2O3/ZnO/PDMS thermal interface materials with anisotropic thermal conductivity and electrical insulation ability obtained by 3D‐printing method | |
| CN113667272B (en) | Polymer-based high-thermal-conductivity material and preparation process thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |