CN117252016A - Verification method and device for heat conducting adhesive selection, electronic equipment and readable storage medium - Google Patents
Verification method and device for heat conducting adhesive selection, electronic equipment and readable storage medium Download PDFInfo
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- CN117252016A CN117252016A CN202311255279.3A CN202311255279A CN117252016A CN 117252016 A CN117252016 A CN 117252016A CN 202311255279 A CN202311255279 A CN 202311255279A CN 117252016 A CN117252016 A CN 117252016A
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- 238000000034 method Methods 0.000 title claims abstract description 50
- 239000000853 adhesive Substances 0.000 title claims abstract description 48
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 48
- 238000012795 verification Methods 0.000 title claims abstract description 22
- 239000003292 glue Substances 0.000 claims abstract description 197
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 63
- 239000011248 coating agent Substances 0.000 claims abstract description 49
- 238000000576 coating method Methods 0.000 claims abstract description 49
- 238000007711 solidification Methods 0.000 claims abstract description 25
- 230000008023 solidification Effects 0.000 claims abstract description 25
- 230000000694 effects Effects 0.000 claims abstract description 22
- 230000008859 change Effects 0.000 claims abstract description 20
- 230000017525 heat dissipation Effects 0.000 claims abstract description 17
- 238000004590 computer program Methods 0.000 claims description 6
- 238000004088 simulation Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 5
- 238000004364 calculation method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/08—Thermal analysis or thermal optimisation
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Abstract
The invention provides a verification method, a verification device, electronic equipment and a readable storage medium for selecting heat conduction glue, which relate to the technical field of heat conduction glue selection, wherein the heat conduction glue is arranged between a heat dissipation boss and a chip and comprises the following steps: according to the heat-conducting glue information corresponding to the current selection of the heat-conducting glue, calculating the heat resistance of the heat-conducting glue in unit area, the maximum deformation and the coating height which can be born after solidification; judging whether the thermal resistance of the unit area of the heat-conducting glue is smaller than or equal to the thermal resistance threshold requirement, whether the maximum deformation bearable after the solidification of the heat-conducting glue is larger than the change amount of the gluing gap between the chip and the heat-radiating boss under the effect of heat influence, and whether the coating height of the heat-conducting glue is larger than the target gluing gap; according to the judging result, verifying whether the current selection of the heat-conducting adhesive is qualified or not; the technical problem of how to select proper heat conducting glue types for different domain controllers is solved.
Description
Technical Field
The present invention relates to the field of heat conductive adhesive selection, and in particular, to a method and apparatus for verifying heat conductive adhesive selection, an electronic device, and a readable storage medium.
Background
The vehicle-mounted domain controller is an indispensable component for intelligent realization of automobiles. Along with the increasing functions that the automobile domain controller needs to realize, the heating power of the chip is greater and greater, in order to prevent the phenomenon that the chip can not appear excessive temperature, a heat dissipation boss structure is generally designed on the controller shell, and heat dissipation boss and chip are filled through heat conduction glue.
However, the heat dissipation effect of the domain controller is affected by the type selection of the heat-conducting glue, so how to select appropriate heat-conducting glue types for different domain controllers is a technical problem to be solved.
Disclosure of Invention
Accordingly, the present invention is directed to a method, an apparatus, an electronic device, and a readable storage medium for verifying a type selection of a heat-conducting glue, which solve the technical problem of how to select a proper heat-conducting glue type for different domain controllers.
In a first aspect, an embodiment provides a method for verifying selection of a heat-conducting resin, where the heat-conducting resin is disposed between a heat-dissipating boss and a chip, the method including:
calculating the thermal resistance of the unit area of the heat conducting adhesive, the maximum deformation and the coating height which can be born after solidification according to the heat conducting adhesive information corresponding to the current selection type of the heat conducting adhesive;
judging whether the thermal resistance of the unit area of the heat-conducting glue is smaller than or equal to the thermal resistance threshold requirement, whether the maximum deformation bearable after the solidification of the heat-conducting glue is larger than the change amount of the gluing gap between the chip and the heat-radiating boss under the effect of heat influence, and whether the coating height of the heat-conducting glue is larger than the target gluing gap;
and verifying whether the current selection of the heat-conducting glue is qualified or not according to the judging result.
In an alternative embodiment, the step of calculating the thermal resistance of the thermal conductive adhesive per unit area, the maximum deformation bearable after curing and the coating height according to the thermal conductive adhesive information corresponding to the current selection type of the thermal conductive adhesive includes:
determining heat conducting glue information according to the current selection of the heat conducting glue; the heat-conducting glue information comprises a heat-conducting coefficient, a heat-conducting glue thermal expansion coefficient, an aspect ratio of coatable heat-conducting glue and a fracture elongation rate of the solidified heat-conducting glue;
and calculating the thermal resistance of the heat conducting glue in unit area based on the target gluing gap, the heat conducting coefficient and the difference value.
In an alternative embodiment, the method further comprises:
calculating a size chain by a least square method to obtain the size tolerance of the gluing gap;
determining an initial glue gap based on the dimensional tolerance;
comparing the difference value between the initial gluing gap and the dimensional tolerance with a thickness threshold value of the heat conducting glue;
if the difference value between the initial gluing gap and the dimensional tolerance is larger than the thickness threshold value of the heat conducting glue, determining the initial gluing gap as the target gluing gap;
if the difference value between the initial gluing gap and the dimensional tolerance is smaller than the thickness threshold value of the heat conducting glue, determining the target gluing gap based on the current gluing gap; the current gluing gap is the sum of the dimensional tolerance and the thickness threshold of the heat conducting glue.
In an optional embodiment, the step of calculating the thermal resistance of the unit area of the thermal conductive adhesive, the maximum deformation bearable after curing and the coating height according to the thermal conductive adhesive information corresponding to the current type of the thermal conductive adhesive further includes:
calculating the maximum deformation bearable by the heat-conducting glue after solidification based on the initial glue coating gap, the current glue coating gap and the fracture elongation after solidification of the heat-conducting glue;
and determining the coating height of the heat-conducting glue based on the product of the height-to-width ratio of the heat-conducting glue to be coated and the minimum width of the heat-radiating boss.
In an alternative embodiment, the method further comprises:
and calculating the change amount of the gluing gap between the chip and the heat dissipation boss under the effect of heat influence based on the product of the thermal expansion coefficient of the heat conduction adhesive and the maximum temperature difference of the heat conduction adhesive in the thermal simulation process of the chip.
In an alternative embodiment, the step of verifying the current type of the heat-conducting glue according to the determination result includes:
if the thermal resistance of the unit area of the heat conducting glue is smaller than or equal to the thermal resistance threshold requirement, the maximum deformation bearable after the solidification of the heat conducting glue is larger than the change amount of the gluing gap between the chip and the heat radiating boss under the effect of heat influence, and the coating height of the heat conducting glue is larger than the target gluing gap, the current selection of the heat conducting glue is verified to be qualified.
In an optional embodiment, the step of verifying the current type of the heat-conducting glue according to the determination result further includes:
if the thermal resistance of the unit area of the heat conducting glue is greater than the thermal resistance threshold, the maximum deformation bearable after the solidification of the heat conducting glue is smaller than or equal to the change amount of the gluing gap between the chip and the heat radiating boss under the effect of heat influence, or the coating height of the heat conducting glue is smaller than or equal to the target gluing gap, the current selection of the heat conducting glue is verified to be unqualified, and the heat conducting glue is reselected.
In a second aspect, an embodiment provides a verification device for selecting a heat-conducting glue, where the heat-conducting glue is disposed between a heat-dissipating boss and a chip, and the device includes:
the calculating module is used for calculating the thermal resistance of the unit area of the heat conducting adhesive, the maximum deformation and the coating height which can be born after solidification according to the heat conducting adhesive information corresponding to the current selection type of the heat conducting adhesive;
the judging module is used for judging whether the thermal resistance of the unit area of the heat-conducting glue is smaller than or equal to the thermal resistance threshold value requirement, whether the maximum deformation bearable after the heat-conducting glue is larger than the change amount of the gluing gap between the chip and the heat-radiating boss under the effect of heat influence, and whether the coating height of the heat-conducting glue is larger than the target gluing gap;
and the verification module is used for verifying whether the current selection of the heat-conducting adhesive is qualified or not according to the judging result.
In a third aspect, an embodiment provides an electronic device, including a memory, a processor, where the memory stores a computer program executable on the processor, and where the processor implements the steps of the method according to any of the foregoing embodiments when the computer program is executed.
In a fourth aspect, embodiments provide a machine-readable storage medium storing machine-executable instructions that, when invoked and executed by a processor, cause the processor to implement the steps of the method of any of the preceding embodiments.
According to the verification method, the verification device, the electronic equipment and the readable storage medium for the heat conducting glue selection, the inventor finds that three parameters which can play important roles in the heat dissipation influence of the domain controller are calculated according to the current type of heat conducting glue information, namely the unit area thermal resistance of the heat conducting glue, the bearable maximum deformation and the coating height after solidification; respectively comparing and judging the three parameters with the corresponding threshold values; if all three parameters meet the requirements, the current selection of the heat-conducting glue can be judged, and the heat dissipation application reliability of the domain controller can be ensured.
Additional features and advantages of the disclosure will be set forth in the description which follows, or in part will be obvious from the description, or may be learned by practice of the techniques of the disclosure.
The foregoing objects, features and advantages of the disclosure will be more readily apparent from the following detailed description of the preferred embodiments taken in conjunction with the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a domain controller according to an embodiment of the present invention;
fig. 2 is a flowchart of a verification method for selecting a heat conducting adhesive according to an embodiment of the present invention;
FIG. 3 is a flowchart of another verification method for selecting a pattern of a heat-conducting resin according to an embodiment of the present invention;
fig. 4 is a functional block diagram of a verification device for selecting a heat conducting adhesive according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a hardware architecture of an electronic device according to an embodiment of the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
How to select a heat conducting adhesive to match the heat dissipation requirement of a current domain controller is a technical problem to be solved currently, and based on the technical problem, the verification method, the device, the electronic equipment and the readable storage medium for the heat conducting adhesive selection provided by the embodiment of the invention.
For the convenience of understanding the present embodiment, the verification method for selecting the heat conducting adhesive disclosed in the embodiment of the present invention is described in detail, and the method may be applied to intelligent control devices such as a controller, an upper computer, a server, etc. As shown in fig. 1, the domain controller includes a controller housing, a PCB circuit board, and a chip disposed on the PCB circuit board; in order to ensure the heat dissipation effect of the domain controller, a heat dissipation boss and heat conduction glue are arranged between the controller shell and the chip; the chip is provided with heat conducting glue, the heat conducting glue is provided with a heat radiating boss, and the heat radiating boss is provided with a controller shell.
Fig. 2 is a flowchart of a verification method for selecting a heat conducting adhesive according to an embodiment of the present invention.
As shown in fig. 2, the method comprises the steps of:
step S102, calculating the thermal resistance of the unit area of the heat-conducting glue, the maximum deformation and the coating height of the heat-conducting glue after solidification according to the heat-conducting glue information corresponding to the current selection type of the heat-conducting glue.
The inventor finds that the actually selected model of the heat-conducting glue can influence heat-conducting glue information, and the calculated heat resistance per unit area, the maximum deformation and the coating height of the heat-conducting glue after solidification can play an important role in the reliability verification of the heat-conducting glue selection in the subsequent steps.
Step S104, judging whether the thermal resistance of the unit area of the heat-conducting glue is smaller than or equal to the thermal resistance threshold requirement, whether the maximum deformation bearable after the solidification of the heat-conducting glue is larger than the change amount of the gluing gap between the chip and the heat-radiating boss under the effect of heat influence, and whether the coating height of the heat-conducting glue is larger than the target gluing gap.
Here, it is determined whether or not the thermal resistance per unit area of the heat conductive adhesive, the maximum deformation that can be tolerated after curing, and the coating height all satisfy the respective corresponding threshold requirements at the same time.
And step S106, verifying whether the current selection of the heat-conducting adhesive is qualified or not according to the judging result.
If the three parameters meet the threshold requirement at the same time, the reliability of the current type selection result of the heat conducting glue can be proved to meet the requirement.
In a practical preferred embodiment, the inventor finds that three parameters which can play important roles in the heat dissipation influence of the domain controller are calculated according to the current type of heat conduction glue information, namely the heat resistance of the heat conduction glue in unit area, the maximum deformation and the coating height which can be born after solidification; respectively comparing and judging the three parameters with the corresponding threshold values; if all three parameters meet the requirements, the current selection of the heat-conducting glue can be judged, and the heat dissipation application reliability of the domain controller can be ensured.
In some embodiments, the calculation of the three key parameters in step S102 may also be implemented by the steps in fig. 3, including:
step 1.1), according to the current type of the heat-conducting glue, determining heat-conducting glue information.
The heat conducting glue information comprises a heat conducting coefficient, a heat conducting glue thermal expansion coefficient, an aspect ratio of coatable heat conducting glue and a fracture elongation rate of the solidified heat conducting glue.
Step 1.2), calculating the thermal resistance of the heat conducting glue in unit area based on the target glue coating gap, the heat conducting coefficient and the difference value.
Specifically, the thermal resistance R per unit area of the heat conductive adhesive d Target paste gap H-thermal conductivity λ.
The target glue coating gap H can be calculated by the following steps:
calculating a size chain by a least square method to obtain the size tolerance + -delta H of the gluing gap; determining an initial glue gap H1 based on the dimensional tolerance Δh; it should be noted that, the initial glue gap H1 is set by a decimal fraction for the dimensional tolerance Δh; comparing the difference between the initial glue coating gap H1 and the dimensional tolerance delta H with a heat conducting glue thickness threshold (Bond Line Thickness, BLT); if the difference value between the initial gluing gap and the dimensional tolerance is larger than the thickness threshold value of the heat conducting glue, determining the initial gluing gap H1 as a target gluing gap; if the difference value between the initial gluing gap and the dimensional tolerance is smaller than the thickness threshold value of the heat conducting glue, determining a target gluing gap based on the current gluing gap H2; where the current glue gap h2=dimensional tolerance Δh+heat conductive glue thickness threshold BLT, the result remains one decimal rounded up.
Step 1.3), calculating the maximum deformation bearable after the heat-conducting glue is solidified based on the initial glue coating gap, the current glue coating gap and the fracture elongation after the heat-conducting glue is solidified.
Wherein, the maximum deformation L= (H1, H2) which can be born after the heat-conducting glue is solidified is multiplied by the fracture elongation rate after the heat-conducting glue is solidified is multiplied by 1.2 times of the safety coefficient.
Step 1.4), determining the coating height of the heat-conducting glue based on the product of the width-to-height ratio of the heat-conducting glue and the minimum width of the heat-radiating boss.
Wherein the height h3=minimum heat dissipating boss width x the height to width ratio a of the heat conductive adhesive can be applied.
In some embodiments, fig. 3 further illustrates that in step S104, it is required to determine whether the maximum deformation that can be tolerated after the curing of the heat-conducting glue is greater than the change of the glue gap between the chip and the heat-dissipating boss under the effect of heat, and the method further includes:
step 2.1), calculating the change D of the gluing gap between the chip and the heat dissipation boss under the effect of heat influence based on the product of the thermal expansion coefficient of the heat conduction adhesive and the maximum temperature difference delta T of the heat conduction adhesive in the thermal simulation process of the chip.
The maximum temperature difference delta T of the heat conducting glue in the heat simulation process of the chips can be understood as performing heat simulation on each chip under the condition that no boss is added, and reading the highest shell temperature as the hottest end temperature T1 of the heat conducting glue, the environment temperature T2 and the maximum temperature difference delta T=T1-T2 of the two ends of the heat conducting glue.
In some embodiments, fig. 3 also shows that, based on the foregoing embodiments, step S106 verifies the reliability of the current thermal conductive paste option according to different determination results, including:
step 3.1), if the thermal resistance of the unit area of the heat-conducting glue is smaller than or equal to the thermal resistance threshold requirement, the maximum deformation bearable after the solidification of the heat-conducting glue is larger than the change amount of the gluing gap between the chip and the heat-radiating boss under the effect of heat influence, and the coating height of the heat-conducting glue is larger than the target gluing gap, the current selection of the heat-conducting glue is verified to be qualified.
Step 3.2), if the thermal resistance of the unit area of the heat-conducting glue is greater than the thermal resistance threshold requirement, the maximum deformation bearable after the solidification of the heat-conducting glue is smaller than or equal to the glue coating gap change amount between the chip and the heat-radiating boss under the effect of heat influence, or the coating height of the heat-conducting glue is smaller than or equal to the target glue coating gap, verifying that the current selection of the heat-conducting glue is unqualified, and reselecting the heat-conducting glue.
It should be noted that, at this time, the target glue gap in the steps of the foregoing embodiment may be redetermined according to the latest option.
In some embodiments, as shown in fig. 4, an embodiment of the present invention further provides a verification device 200 for selecting a heat conducting glue, where the heat conducting glue is disposed between a heat dissipating boss and a chip, and the device includes:
the calculation module 201 calculates the thermal resistance of the unit area of the heat-conducting glue, the maximum deformation and the coating height which can be born after solidification according to the heat-conducting glue information corresponding to the current selection type of the heat-conducting glue;
the judging module 202 judges whether the thermal resistance of the unit area of the heat-conducting glue is smaller than or equal to the thermal resistance threshold requirement, whether the maximum deformation bearable after the solidification of the heat-conducting glue is larger than the change amount of the gluing gap between the chip and the heat-radiating boss under the effect of heat influence, and whether the coating height of the heat-conducting glue is larger than the target gluing gap;
and the verification module 203 verifies whether the current selection type of the heat-conducting glue is qualified or not according to the judging result.
In some embodiments, the calculating module 201 is specifically further configured to determine the heat conductive adhesive information according to a current type of the heat conductive adhesive; the heat-conducting glue information comprises a heat-conducting coefficient, a heat-conducting glue thermal expansion coefficient, an aspect ratio of coatable heat-conducting glue and a fracture elongation rate of the solidified heat-conducting glue; and calculating the thermal resistance of the heat conducting glue in unit area based on the target gluing gap, the heat conducting coefficient and the difference value.
In some embodiments, the calculating module 201 is specifically further configured to perform a dimension chain calculation by using a least square method to obtain a dimension tolerance of the glue gap; determining an initial glue gap based on the dimensional tolerance; comparing the difference value between the initial gluing gap and the dimensional tolerance with a thickness threshold value of the heat conducting glue; if the difference value between the initial gluing gap and the dimensional tolerance is larger than the thickness threshold value of the heat conducting glue, determining the initial gluing gap as the target gluing gap; if the difference value between the initial gluing gap and the dimensional tolerance is smaller than the thickness threshold value of the heat conducting glue, determining the target gluing gap based on the current gluing gap; the current gluing gap is the sum of the dimensional tolerance and the thickness threshold of the heat conducting glue.
In some embodiments, the calculating module 201 is specifically further configured to calculate, based on the initial glue gap, the current glue gap, and the elongation at break after curing of the heat-conducting glue, a maximum deformation that can be tolerated after curing of the heat-conducting glue; and determining the coating height of the heat-conducting glue based on the product of the height-to-width ratio of the heat-conducting glue to be coated and the minimum width of the heat-radiating boss.
In some embodiments, the calculating module 201 is specifically further configured to calculate an amount of change in the adhesive gap between the chip and the heat dissipation boss under the effect of thermal influence based on a product of a thermal expansion coefficient of the heat-conducting adhesive and a maximum temperature difference of the heat-conducting adhesive in the thermal simulation process of the chip.
In some embodiments, the verification module 203 is specifically further configured to verify that the current selection of the heat-conducting glue is qualified if the thermal resistance of the unit area of the heat-conducting glue is less than or equal to the thermal resistance threshold requirement, the maximum deformation that the heat-conducting glue can bear after curing is greater than the change amount of the glue coating gap between the chip and the heat-dissipating boss under the effect of thermal influence, and the coating height of the heat-conducting glue is greater than the target glue coating gap.
In some embodiments, the verification module 203 is specifically further configured to verify that the current type selection of the heat-conducting glue is not qualified and reselect the type of the heat-conducting glue if the thermal resistance per unit area of the heat-conducting glue is greater than the thermal resistance threshold requirement, the maximum deformation that the heat-conducting glue can bear after curing is less than or equal to the change amount of the glue coating gap between the chip and the heat-dissipating boss under the effect of heat influence, or the coating height of the heat-conducting glue is less than or equal to the target glue coating gap.
Fig. 5 is a schematic hardware architecture of an electronic device 300 according to an embodiment of the present invention. Referring to fig. 5, the electronic device 300 includes: a machine-readable storage medium 301 and a processor 302, and may also include a non-volatile storage medium 303, a communication interface 304, and a bus 305; wherein the machine-readable storage medium 301, the processor 302, the non-volatile storage medium 303, and the communication interface 304 communicate with each other via a bus 305. The processor 302 may perform the above embodiments describe a method of verifying a thermal conductive glue pattern by reading and executing machine-executable instructions of verifying a thermal conductive glue pattern in the machine-readable storage medium 301.
The machine-readable storage medium referred to herein may be any electronic, magnetic, optical, or other physical storage device that can contain or store information, such as executable instructions, data, or the like. For example, a machine-readable storage medium may be: RAM (Radom Access Memory, random access memory), volatile memory, non-volatile memory, flash memory, a storage drive (e.g., hard drive), any type of storage disk (e.g., optical disk, dvd, etc.), or a similar storage medium, or a combination thereof.
The non-volatile medium may be a non-volatile memory, a flash memory, a storage drive (e.g., hard drive), any type of storage disk (e.g., optical disk, dvd, etc.), or a similar non-volatile storage medium, or a combination thereof.
It can be understood that the specific operation method of each functional module in this embodiment may refer to the detailed description of the corresponding steps in the above method embodiment, and the detailed description is not repeated here.
The embodiment of the invention provides a computer readable storage medium, in which a computer program is stored, and when the computer program code is executed, the method for verifying the selection of the heat conducting glue according to any one of the above embodiments can be implemented, and specific implementation can be referred to method embodiments and will not be repeated herein.
It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described system and apparatus may refer to corresponding procedures in the foregoing method embodiments, which are not described herein again.
In addition, in the description of embodiments of the present invention, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Finally, it should be noted that: the above examples are only specific embodiments of the present invention, and are not intended to limit the scope of the present invention, but it should be understood by those skilled in the art that the present invention is not limited thereto, and that the present invention is described in detail with reference to the foregoing examples: any person skilled in the art may modify or easily conceive of the technical solution described in the foregoing embodiments, or perform equivalent substitution of some of the technical features, while remaining within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention, and are intended to be included in the scope of the present invention.
Claims (10)
1. The verification method of heat conducting glue selection is characterized in that the heat conducting glue is arranged between a heat dissipation boss and a chip, and the method comprises the following steps:
calculating the thermal resistance of the unit area of the heat conducting adhesive, the maximum deformation and the coating height which can be born after solidification according to the heat conducting adhesive information corresponding to the current selection type of the heat conducting adhesive;
judging whether the thermal resistance of the unit area of the heat-conducting glue is smaller than or equal to the thermal resistance threshold requirement, whether the maximum deformation bearable after the solidification of the heat-conducting glue is larger than the change amount of the gluing gap between the chip and the heat-radiating boss under the effect of heat influence, and whether the coating height of the heat-conducting glue is larger than the target gluing gap;
and verifying whether the current selection of the heat-conducting glue is qualified or not according to the judging result.
2. The method of claim 1, wherein the step of calculating the thermal resistance per unit area, the maximum deformation that can be tolerated after curing, and the coating height of the thermal paste based on the thermal paste information corresponding to the current selection of the thermal paste, comprises:
determining heat conducting glue information according to the current selection of the heat conducting glue; the heat-conducting glue information comprises a heat-conducting coefficient, a heat-conducting glue thermal expansion coefficient, an aspect ratio of coatable heat-conducting glue and a fracture elongation rate of the solidified heat-conducting glue;
and calculating the thermal resistance of the heat conducting glue in unit area based on the target gluing gap, the heat conducting coefficient and the difference value.
3. The method according to claim 2, wherein the method further comprises:
calculating a size chain by a least square method to obtain the size tolerance of the gluing gap;
determining an initial glue gap based on the dimensional tolerance;
comparing the difference value between the initial gluing gap and the dimensional tolerance with a thickness threshold value of the heat conducting glue;
if the difference value between the initial gluing gap and the dimensional tolerance is larger than the thickness threshold value of the heat conducting glue, determining the initial gluing gap as the target gluing gap;
if the difference value between the initial gluing gap and the dimensional tolerance is smaller than the thickness threshold value of the heat conducting glue, determining the target gluing gap based on the current gluing gap; the current gluing gap is the sum of the dimensional tolerance and the thickness threshold of the heat conducting glue.
4. A method according to claim 3, wherein the step of calculating the thermal resistance per unit area, the maximum deformation that can be tolerated after curing, and the coating height of the thermal paste based on the thermal paste information corresponding to the current selection of thermal paste, further comprises:
calculating the maximum deformation bearable by the heat-conducting glue after solidification based on the initial glue coating gap, the current glue coating gap and the fracture elongation after solidification of the heat-conducting glue;
and determining the coating height of the heat-conducting glue based on the product of the height-to-width ratio of the heat-conducting glue to be coated and the minimum width of the heat-radiating boss.
5. The method according to claim 2, wherein the method further comprises:
and calculating the change amount of the gluing gap between the chip and the heat dissipation boss under the effect of heat influence based on the product of the thermal expansion coefficient of the heat conduction adhesive and the maximum temperature difference of the heat conduction adhesive in the thermal simulation process of the chip.
6. The method of claim 1, wherein the step of verifying the current selection of the heat conductive adhesive based on the determination comprises:
if the thermal resistance of the unit area of the heat conducting glue is smaller than or equal to the thermal resistance threshold requirement, the maximum deformation bearable after the solidification of the heat conducting glue is larger than the change amount of the gluing gap between the chip and the heat radiating boss under the effect of heat influence, and the coating height of the heat conducting glue is larger than the target gluing gap, the current selection of the heat conducting glue is verified to be qualified.
7. The method according to claim 1 or 6, wherein the step of verifying the current selection of the heat conductive adhesive according to the determination result, further comprises:
if the thermal resistance of the unit area of the heat conducting glue is greater than the thermal resistance threshold, the maximum deformation bearable after the solidification of the heat conducting glue is smaller than or equal to the change amount of the gluing gap between the chip and the heat radiating boss under the effect of heat influence, or the coating height of the heat conducting glue is smaller than or equal to the target gluing gap, the current selection of the heat conducting glue is verified to be unqualified, and the heat conducting glue is reselected.
8. Verification device of selection of heat conduction glue, its characterized in that, heat conduction glue sets up between heat dissipation boss and chip, the device includes:
the calculating module is used for calculating the thermal resistance of the unit area of the heat conducting adhesive, the maximum deformation and the coating height which can be born after solidification according to the heat conducting adhesive information corresponding to the current selection type of the heat conducting adhesive;
the judging module is used for judging whether the thermal resistance of the unit area of the heat-conducting glue is smaller than or equal to the thermal resistance threshold value requirement, whether the maximum deformation bearable after the heat-conducting glue is larger than the change amount of the gluing gap between the chip and the heat-radiating boss under the effect of heat influence, and whether the coating height of the heat-conducting glue is larger than the target gluing gap;
and the verification module is used for verifying whether the current selection of the heat-conducting adhesive is qualified or not according to the judging result.
9. An electronic device comprising a memory, a processor, the memory having stored therein a computer program executable on the processor, characterized in that the processor, when executing the computer program, implements the steps of the method of any of the preceding claims 1 to 7.
10. A machine-readable storage medium storing machine-executable instructions which, when invoked and executed by a processor, cause the processor to perform the steps of the method of any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311255279.3A CN117252016A (en) | 2023-09-25 | 2023-09-25 | Verification method and device for heat conducting adhesive selection, electronic equipment and readable storage medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311255279.3A CN117252016A (en) | 2023-09-25 | 2023-09-25 | Verification method and device for heat conducting adhesive selection, electronic equipment and readable storage medium |
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| Publication Number | Publication Date |
|---|---|
| CN117252016A true CN117252016A (en) | 2023-12-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311255279.3A Pending CN117252016A (en) | 2023-09-25 | 2023-09-25 | Verification method and device for heat conducting adhesive selection, electronic equipment and readable storage medium |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117252016A (en) |
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