CN117235825A - Positioning model arrangement method, device, equipment and medium - Google Patents
Positioning model arrangement method, device, equipment and medium Download PDFInfo
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Abstract
The embodiment of the disclosure relates to a positioning model arrangement method, a device, equipment and a medium, and relates to the technical field of computer aided design, wherein the method comprises the following steps: determining a blank line of an initial mold model; determining a target arrangement point position according to the blank line; the target arrangement point is positioned on the blank holder of the initial mold model; and arranging a preset positioning model on the initial mold model according to the target arrangement point positions to obtain a target mold model. According to the embodiment of the disclosure, the target arrangement point positions are determined based on the existing blank lines and the existing blank holders in the initial mold model, and the preset positioning model is arranged on the initial mold model according to the target arrangement point positions, so that automatic arrangement of the positioning model is realized, the time consumption for arranging the positioning model is reduced, and the efficiency for determining the final mold model is improved.
Description
Technical Field
The disclosure relates to the technical field of computer aided design, and in particular relates to a positioning model arrangement method, a device, equipment and a medium.
Background
The positioning tool is used for fixing the blank at a specified position, and the movement of the blank caused by stress in the blank forming process can be reduced through the positioning tool.
In the related art, in the process of performing the structural design of the mold, the placement of the positioning tool in the computer aided design (Computer Aided Design, CAD) software needs to be performed manually based on experience, which takes a long time and has low efficiency.
Disclosure of Invention
In order to solve the technical problems described above or at least partially solve the technical problems described above, the present disclosure provides a positioning model arrangement method, apparatus, device and medium.
The embodiment of the disclosure provides a positioning model arrangement method, which comprises the following steps:
determining a blank line of an initial mold model;
determining a target arrangement point position according to the blank line; wherein the target placement point is located on a binder of the initial mold model;
arranging a preset positioning model on the initial mold model according to the target arrangement point positions to obtain a target mold model;
wherein the determining of the blank line of the initial mold model comprises:
acquiring a plurality of process lines of the initial mold model;
and determining a process line which is farthest from the initial mold model and meets a preset flatness condition from the plurality of process lines as the blank line.
The embodiment of the disclosure also provides a positioning model arrangement device, which comprises:
a first determining module for determining a blank line of the initial mold model;
the second determining module is used for determining a target arrangement point position according to the blank line; wherein the target placement point is located on a binder of the initial mold model;
the arrangement module is used for arranging a preset positioning model on the initial die model according to the target arrangement point positions to obtain a target die model;
the first determining module is configured to: acquiring a plurality of process lines of the initial mold model; and determining a process line which is farthest from the initial mold model and meets a preset flatness condition from the plurality of process lines as the blank line.
The embodiment of the disclosure also provides an electronic device, which comprises: a processor; a memory for storing the processor-executable instructions; the processor is configured to read the executable instructions from the memory and execute the instructions to implement a positioning model arrangement method as provided by an embodiment of the disclosure.
The present disclosure also provides a computer-readable storage medium storing a computer program for executing the positioning model arrangement method as provided by the embodiments of the present disclosure.
Compared with the prior art, the technical scheme provided by the embodiment of the disclosure has the following advantages: the positioning model arrangement scheme provided by the embodiment of the disclosure determines a blank line of an initial mold model; determining a target arrangement point position according to the blank line; the target arrangement point is positioned on the blank holder of the initial mold model; arranging a preset positioning model on the initial mold model according to the target arrangement point positions to obtain a target mold model; determining a blank line of an initial mold pattern, comprising: obtaining a plurality of process lines of an initial mold model; and determining a process line which is farthest from the initial mold model and meets a preset flatness condition from a plurality of process lines as the blank line. By adopting the technical scheme, the target arrangement point position is determined based on the existing blank line and the existing blank holder in the initial mold model, and the preset positioning model is arranged on the initial mold model according to the target arrangement point position, so that the automatic arrangement of the positioning model is realized, the time consumption for arranging the positioning model is reduced, and the efficiency for determining the final mold model is improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.
In order to more clearly illustrate the embodiments of the present disclosure or the solutions in the prior art, the drawings that are required for the description of the embodiments or the prior art will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a schematic flow chart of a positioning model arrangement method according to an embodiment of the disclosure;
FIG. 2 is a schematic flow chart of a method for determining a blank line according to an embodiment of the disclosure;
FIG. 3 is a schematic diagram of a blank line provided in an embodiment of the present disclosure;
FIG. 4 is a flow chart of another positioning model arrangement method according to an embodiment of the present disclosure;
FIG. 5 is a schematic flow chart of determining a target mold model according to an embodiment of the disclosure;
FIG. 6 is a schematic diagram of determining a target normal provided by an embodiment of the present disclosure;
FIG. 7 is a schematic diagram of a preset positioning model according to an embodiment of the present disclosure;
FIG. 8 is a schematic diagram of another preset positioning model provided by an embodiment of the present disclosure;
FIG. 9 is a schematic diagram of a target mold model provided by an embodiment of the present disclosure;
FIG. 10 is a schematic structural view of a positioning model arrangement device according to an embodiment of the present disclosure;
fig. 11 is a schematic structural diagram of an electronic device according to an embodiment of the disclosure.
Detailed Description
In order that the above objects, features and advantages of the present disclosure may be more clearly understood, a further description of aspects of the present disclosure will be provided below. It should be noted that, without conflict, the embodiments of the present disclosure and features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure, but the present disclosure may be practiced otherwise than as described herein; it will be apparent that the embodiments in the specification are only some, but not all, embodiments of the disclosure.
In order to solve the above-described problems, embodiments of the present disclosure provide a positioning model arrangement method, which is described below in connection with specific embodiments.
Fig. 1 is a flow chart of a positioning model arrangement method provided in an embodiment of the present disclosure, which may be performed by a positioning model arrangement apparatus, where the apparatus may be implemented in software and/or hardware, and may be generally integrated in an electronic device. As shown in fig. 1, the method includes:
step 101, determining a blank line of an initial mold model.
The mold model may be a computer virtual model that assists in mold design. The initial mold model may be a mold model that is not subjected to positioning model arrangement. The type of the initial mold model is various, and the present embodiment is not limited, and for example, the initial mold model may be a drawing mold model, a trimming mold model, or a stamping mold model. A blank is understood to be the raw material to be die-machined and, alternatively, may be a sheet material. The blank line may be an edge line of the blank after the blank is placed in the position to be processed, and the blank line may be a closed line.
In an embodiment of the disclosure, the initial mold model may correspond to a plurality of process lines related to the processing technology, each process line may have a corresponding tag identifier, and the positioning model arrangement device may determine the process line with the tag identifier being the blank line identifier as the blank line. Alternatively, the positioning pattern arrangement may simulate handling of the blank by the initial die pattern, determine the placement position of the blank in the initial die pattern, and determine the edge line of the blank at the placement position as the blank line.
Fig. 2 is a flow chart of a method for determining a blank line according to an embodiment of the present disclosure, as shown in fig. 2, in some embodiments of the present disclosure, determining a blank line of an initial mold model includes:
in step 201, a plurality of process lines of an initial mold model are acquired.
The process line may be a line associated with a machining process, which may be understood as a line that aids in understanding the blank machining process. The process line is various, and the embodiment is not limited. For example, the process line may include a blank line, as well as a split line, a blank shrink line, and/or a Check Hole (CH) Hole line.
In this embodiment, the drawing of a plurality of process lines of the initial mold model is completed in advance, and the process lines are stored in process line data. However, the process line is presented to the user, who can determine the type of different process lines based on his own experience, and thus the specific type of each process line is not labeled in the process line data. To determine a blank line of the plurality of process lines, first, process line data of an initial mold model is loaded.
Step 202, determining a process line which is farthest from the initial mold model and meets a preset flatness condition from a plurality of process lines as a blank line.
The preset flattening condition may be a condition for representing flattening of the process line in a height direction of a model, wherein the height direction of the model may be a vertical axis direction in a coordinate system of a mold model of the initial mold model, and the height direction of the model may be understood as a same or opposite stamping direction in which the initial mold model processes the blank. The preset flattening conditions may be set according to user requirements, etc., and the flattening conditions are various, which is not limited in this embodiment.
The blank line is often the furthest process line from the die pattern from the process line, and in the case of a sheet of material, the blank line is often relatively flat. Thus, in the present embodiment, for each process line, the positioning model arrangement means may determine the maximum coordinate value and the minimum coordinate value of the process line in the model height direction, and determine the coordinate average value of the maximum coordinate value and the minimum coordinate value. Further, the process line with the largest coordinate average value is determined as the process line to be treated. After determining the process line to be treated, determining whether the process line to be treated meets a preset flatness condition. If so, the process line is flat, and accords with the condition that the blank is a plate, so that the process line to be treated is determined as the blank line. If the to-be-treated process line does not meet the preset flat condition, the process line is larger in fluctuation of the model telling direction and does not accord with the condition that the blank is a plate, and alarm information representing that the blank line cannot be determined is sent and displayed.
Fig. 3 is a schematic view of a blank line provided in an embodiment of the disclosure, as shown in fig. 3, in which fig. 3 shows a plurality of process lines, in which a process line 301 located at the uppermost position (i.e., farthest from the mold pattern) is determined as a process line to be treated. And if the to-be-treated process line meets the preset flattening condition, determining the to-be-treated process line as a blank line.
In some embodiments of the present disclosure, satisfying a preset flattening condition includes: if the height of the envelope body of the process line is smaller than a preset height threshold value, the preset flatness condition is determined to be met.
The envelope body may be a cuboid with the smallest volume including the process line, and the length, width and height directions of the envelope body may be cuboid parallel to the longitudinal axis, the transverse axis and the vertical axis of the mold model coordinate system respectively. The mold model coordinate system may be a preset mold model coordinate system. The height of the envelope body can be the minimum value of the length, width and height of the envelope body, and the height of the envelope body can be understood as the vertical distance value of the envelope body in the coordinate system of the mould model. The preset height threshold may be a preset maximum height value, and the preset height threshold may be set according to a user requirement, etc., which is not limited in this embodiment. For example, the preset height threshold may be 1 millimeter.
In this embodiment, after determining the process line to be processed furthest from the initial mold model, determining the height of an envelope of the process line to be processed, verifying whether the height of the envelope is smaller than a preset height threshold, and if yes, determining that the process line to be processed meets a preset flatness condition; otherwise, determining that the to-be-treated process line does not meet the preset flat condition. The process of determining the height of the envelope of the process line to be treated may include: firstly, determining an envelope body of a process line to be treated, and then determining the height of the envelope body; or, the height of the enveloping body of the process line to be treated can be directly determined according to the maximum difference value of the coordinate values of the process line to be treated in the vertical direction of the mould model coordinate system without determining the enveloping body of the process line to be treated.
For example, ifFor the maximum value of the envelope of the ith process line in the height direction of the model, +.>Is the minimum value of the envelope of the ith process line in the height direction of the model. />For the maximum value of the envelope of the process line to be treated in the height direction of the model, +.>Is the minimum value of the envelope of the process line to be treated in the height direction of the model. />Is->And->Average value of (2). Then->。
And after determining the processing line to be processed, judging whether the processing line to be processed meets the requirementsWherein->And if the process line to be treated is a preset height threshold value, determining that the fluctuation of the process line to be treated in the height direction of the model is smaller, wherein the process line to be treated meets a preset flat condition, and determining the process line to be treated as a blank line.
In the scheme, based on the characteristics of the blank line in the position dimension and the shape dimension, the automatic determination of the blank line in the process line is realized, the determination efficiency of the blank line is improved, and a foundation is created for the subsequent determination of the target die model.
102, determining a target arrangement point position according to a blank line; wherein the target placement point is located on the bead of the initial mold model.
The target placement point location may be a point location according to which a preset positioning model is placed. The blank holder can be a model of a circular pressing device arranged at the edge part between the upper die and the lower die of the die, and the probability of wrinkling caused by instability of the edge part of the blank in the drawing process can be reduced based on the blank holder.
In the embodiment of the disclosure, after determining the blank line, the positioning model arrangement device may determine a specific position of a target arrangement point for positioning the blank on the blank holder according to an interaction relationship between the blank and the blank holder of the initial mold model and the blank line corresponding to the blank in the blank processing process.
And 103, arranging a preset positioning model on the initial mold model according to the target arrangement point positions to obtain a target mold model.
The preset positioning model can be a computer virtual model corresponding to a preset positioning tool. Alternatively, the fixture may be a standard, or the fixture may be a non-standard.
In the embodiment of the disclosure, after the target placement point is determined, the initial positioning model is placed on the target placement point of the blank holder, and the target mold model is obtained.
The positioning model arrangement method provided by the embodiment of the disclosure comprises the following steps: determining a blank line of an initial mold model; determining a target arrangement point position according to the blank line; the target arrangement point is positioned on the blank holder of the initial mold model; and arranging a preset positioning model on the initial mold model according to the target arrangement point positions to obtain a target mold model. By adopting the technical scheme, the target arrangement point position is determined based on the existing blank line and the existing blank holder in the initial mold model, and the preset positioning model is arranged on the initial mold model according to the target arrangement point position, so that the automatic arrangement of the positioning model is realized, the time consumption for arranging the positioning model is reduced, and the efficiency for determining the final mold model is improved.
In some embodiments of the present disclosure, determining a target placement point from a blank line includes: projecting the blank line to the upper surface of the blank holder to obtain an arrangement line; the upper surface of the blank holder is the surface of the blank holder far away from the initial die model; a target placement point located on the placement line is determined.
Fig. 4 is a flow chart of another positioning model arrangement method according to an embodiment of the disclosure, as shown in fig. 4, the method includes:
in step 401, a blank line of an initial mold model is determined.
Step 402, projecting a blank line to the upper surface of the blank holder to obtain an arrangement line; the upper surface of the blank holder is the surface of the blank holder far away from the initial die model.
The upper surface of the blank holder is understood to be the surface of the blank holder that is adjacent to the blank line. Away from the initial mold pattern may be in a direction away from the center of the initial mold pattern. The arrangement line may be a projection line of the blank line projected to the binder in the height direction of the model. The arrangement line comprises target arrangement points for finally arranging a preset positioning model.
In this embodiment, the positioning pattern arranging device may project the blank line to the upper surface of the blank holder in the pattern height direction to obtain the arrangement line.
In step 403, a target placement point located on the placement line is determined.
In the present embodiment, after determining the arrangement line, the positioning model arrangement device may determine a plurality of points on the arrangement line as the target arrangement point positions.
In some embodiments of the present disclosure, determining a target placement point located on a placement line includes:
performing discrete processing on the arrangement lines to obtain a plurality of candidate arrangement points; and acquiring a first target placement point position in the plurality of candidate placement point positions, and determining the candidate placement point position which meets the preset symmetry condition with the first target placement point position in the plurality of candidate placement point positions as a second target placement point position.
Wherein the candidate placement points may be discrete points of the placement line. The first target placement point may be a manually selected candidate placement point of a plurality of candidate placement points. The second target placement point may be a candidate placement point automatically selected by the positioning placement device based on the first target placement point.
The preset symmetry condition may be a preset condition for judging whether the arrangement points are symmetrical, and the preset symmetry condition has a plurality of kinds, which is not limited in this embodiment. For example, the preset symmetry condition may include a preset transverse symmetry condition and/or a preset longitudinal symmetry condition. The preset transverse symmetry condition may be a condition for representing symmetry about a transverse and vertical plane of the model mold coordinate system, and the transverse and vertical plane may be a plane including a transverse axis and a vertical axis of the model mold coordinate system. The preset longitudinal symmetry condition may be a condition characterizing symmetry about a longitudinal vertical plane of the model mold coordinate system, which may be a plane including a longitudinal axis and a vertical axis of the mold model coordinate system.
In this embodiment, the arrangement line on the binder ring is discretized into a plurality of points, which are a plurality of candidate arrangement points. The user can select a first target arrangement point position from a plurality of candidate arrangement point positions through operations such as voice control operation, point selection operation and the like, the positioning model arrangement device obtains the first target arrangement point position, the candidate arrangement point position meeting the preset symmetry condition with the first target arrangement point position is determined to be a second target arrangement point position, and the first target arrangement point position and the second target arrangement point position are determined to be target arrangement point positions.
For example, if the preset symmetry condition includes a preset transverse symmetry condition, the candidate placement point symmetrical to the first target placement point with respect to the transverse and vertical surfaces of the model mold coordinate system is determined as the second target placement point. And if the preset symmetry condition comprises a preset longitudinal symmetry condition, determining the candidate arrangement point positions symmetrical to the first target arrangement point positions about the longitudinal vertical plane of the model mold coordinate system as second target arrangement point positions. And if the preset symmetry condition comprises a preset transverse symmetry condition and a preset longitudinal symmetry condition, determining the candidate arrangement points symmetrical with the first target arrangement point on the transverse and vertical surfaces of the model mold coordinate system and the candidate arrangement points symmetrical with the longitudinal and vertical surfaces of the model mold coordinate system as second target arrangement points.
Alternatively, in some embodiments of the present disclosure, if the blank line is a line that does not have symmetry. Correspondingly, the arrangement lines are lines without symmetry, and the candidate arrangement points are also without symmetry. Correspondingly, determining the candidate placement point meeting the preset symmetry condition with the first target placement point as the second target placement point may include:
determining a symmetry plane; wherein the symmetry plane can comprise a transverse plane and a vertical plane and/or a longitudinal plane of a mould model coordinate system; and determining a symmetrical point of the first target arrangement point with respect to a symmetrical plane, and determining the candidate arrangement point as a second target arrangement point if the distance between the candidate arrangement point closest to the symmetrical point and the symmetrical point is smaller than a preset distance threshold value. Therefore, under the condition that the candidate placement points do not have symmetry, the second target placement point which is symmetrical with the first target placement point in the candidate placement points can be determined.
In the scheme, the first target arrangement point positions are arrangement point positions based on manual determination, the second target arrangement point positions are arrangement point positions based on automatic determination of the first target arrangement point positions, an artificial and automatic arrangement mode is adopted, the freedom of setting the target arrangement point positions is reserved, meanwhile, the complexity of an arrangement point position determination algorithm is reduced, and the arrangement efficiency and accuracy are improved.
Alternatively, in the process of manually determining the first target placement point, the positioning model placement device may highlight the voltage regulating pad in the initial mold model to reduce the first target placement point from being manually placed at a position interfering with the voltage regulating pad. Further, a second target placement point is automatically determined based on the first target placement point.
And step 404, arranging a preset positioning model on the initial mold model according to the target arrangement point positions to obtain a target mold model.
In this embodiment, the positioning model arrangement device may determine the arrangement angle and the arrangement position of the preset positioning model according to the target arrangement point. Further, a preset positioning model is arranged according to the arrangement position and the arrangement angle, and a target mold model comprising an initial mold model and the preset positioning model is obtained.
Fig. 5 is a schematic flow chart of determining a target mold model according to an embodiment of the present disclosure, as shown in fig. 5, a preset positioning model is arranged on an initial mold model according to a target arrangement point, so as to obtain the target mold model, including:
step 501, determining a target normal of an arrangement line according to a target arrangement point position; wherein the target normal is terminated by a target placement point and points to the interior of the placement line.
The target normal line may be a normal line perpendicular to a target tangent line, and the target tangent line may be a tangent line of an arrangement line ending at a target arrangement point.
In the present embodiment, the positioning-model arranging device may project the arrangement line onto the transverse-longitudinal plane (i.e., XY plane) of the mold model coordinate system, resulting in a projected arrangement line. Correspondingly, the target arrangement point on the arrangement line is also projected to the transverse and longitudinal surfaces of the coordinate system of the mold model, so as to obtain the projected target arrangement point. And determining the target tangent of the projection arrangement line on the projection target arrangement point, taking the target tangent of the projection arrangement line as the projection of the target tangent of the arrangement line, and further determining two normals of the target tangent of the projection arrangement line. The normal line of the two normal lines directed to the inside of the projection arrangement line is determined as the projection of the target normal line of the arrangement line. Further, a line having the target arrangement point as an end point and the same direction as the projection of the target normal line is determined as the target normal line.
Fig. 6 is a schematic diagram for determining a target normal line according to an embodiment of the present disclosure, as shown in fig. 6, a closed curve in fig. 6 represents an arbitrarily shaped arrangement line, if the target arrangement point includes a point P, a tangent vector τ of the point P (i.e., a target tangent line) may be determined based on the arrangement line, and, since the arrangement line is a space curve, the tangent vector τ of the point P is a three-dimensional vector accordingly. Therefore, the arrangement line is projected to the transverse and longitudinal surfaces of the mould model coordinate system to obtain a projection arrangement line, and the target arrangement point is also projected to the transverse and longitudinal surfaces of the mould model coordinate system to obtain a projection target arrangement point. Normal to tangent vector τAnd normal->Two, the two normal vectors can be expressed as: />，/>Wherein->Representing normal +.>Is>Representing normal +.>Is the ordinate of (2); />Representing normal +.>Is>Representing normal +.>Is defined by the vertical coordinate of (c).
Further, determining the normalAnd normal->The middle is directed to the normal inside the projection arrangement line. Specifically, the positioning model arrangement means may acquire the origin O in the horizontal and vertical planes, perform point multiplication on the vector OP with the two normals, respectively, and determine the normal whose point multiplication result is greater than 0 as the target normal.
Step 502, arranging a preset positioning model on the initial mold model at a target arrangement point, and determining the positioning direction of the preset positioning model as the direction of a target normal line to obtain a target mold model.
The positioning direction may be a direction in which a positioning surface of the preset positioning model faces. The locating surface may be a planar surface in contact with the blank. That is, the orientation direction is understood to be the direction in which the preset orientation pattern applies force to the blank.
In this embodiment, after determining the target arrangement point and the target normal line, the positioning model arrangement device may arrange the preset positioning model at the target arrangement point, and adjust the angle of the preset positioning model so that the positioning direction of the preset positioning model coincides with the direction of the target normal line. And further, completing the arrangement of the preset positioning model on the initial mould model to obtain the target mould model.
As shown in fig. 6, in some embodiments of the present disclosure, the positioning mold arrangement apparatus may calculate an angle θ of the target normal line with the vector OP, and after placing the preset positioning model at the target arrangement point, adjust an angle of the preset positioning model according to the angle θ.
In some embodiments of the present disclosure, an origin of a positioning model coordinate system of the preset positioning model is located at a midpoint of a target line segment of the preset positioning model; the target line segment is an intersecting line segment of a positioning surface and a step surface of a preset positioning model, the step surface is a transition surface between a base part and a positioning part of the preset positioning model, and a transverse axis of a coordinate system of the positioning model is perpendicular to the positioning surface and points to the outside of the initial mold model; wherein the positioning portion includes a positioning surface.
The positioning model coordinate system can be a coordinate line established for a preset positioning model in advance. The positioning portion may be a complete part of the preset positioning model for positioning the blank, and the base portion may be a base for carrying the positioning portion in the preset positioning model. The positioning surface may be a surface in a positioning portion of the preset positioning model, which contacts the blank and positions the blank. The positioning portion includes the positioning surface. The outer part of the initial mould model may be understood as the direction away from the initial mould model.
Fig. 7 is a schematic diagram of a preset positioning model according to an embodiment of the present disclosure, as shown in fig. 7, a positioning portion is a component 701 in fig. 7, and a base portion is a component 702 in fig. 7. Fig. 8 is a schematic view of another preset positioning model provided in an embodiment of the present disclosure, as shown in fig. 8, the positioning surface is a surface 803, and the positioning surface is a surface that contacts the blank in the component 801 (i.e., the positioning portion) in fig. 8. The step surface is a surface 804, which is a transition surface between the component 801 (i.e., the positioning portion) and the component 802 (i.e., the base portion).
Correspondingly, arranging the preset positioning model at the target arrangement point, and determining the positioning direction of the preset positioning model as the direction of the target normal line comprises the following steps:
and coinciding the origin of the positioning model coordinate system with the target arrangement point, and setting the transverse axis direction of the positioning model coordinate system as the opposite direction of the target normal.
In this embodiment, since the initial coordinate systems of the preset positioning models of different models are different in establishment standard, the positioning model arrangement device may establish the positioning model coordinate system according to the unified standard. Specifically, the positioning model arrangement means may determine the positioning portion and the base portion of the preset positioning model, and determine the positioning surface in the positioning portion. Further, a transition surface between the positioning portion and the base portion is determined as a step surface, a line segment where the step surface intersects the positioning surface is determined as a target line segment, and a midpoint of the target line segment is determined as an origin of a positioning model coordinate system. And determining a coordinate axis which is perpendicular to the positioning surface and points to the outside of the initial mold model by taking the origin of coordinates as an end point as a transverse axis of the positioning coordinate system.
After determining the coordinate system of the preset positioning model, the positioning model arrangement device may move the preset positioning model until the origin of the positioning model coordinate system of the preset positioning model coincides with the target arrangement point. And rotating the preset positioning model until the transverse axis direction of the positioning model coordinate system of the preset positioning model is the opposite direction of the target normal. Alternatively, the positioning model arrangement device may determine an angle between the opposite direction of the target normal and the vector OP shown in fig. 6 in advance, and adjust the transverse axis direction of the positioning model coordinate system of the preset positioning model according to the angle.
Fig. 9 is a schematic diagram of a target mold model provided in an embodiment of the present disclosure, as shown in fig. 9, there are a plurality of parts 901 in fig. 9, where the parts 901 are preset positioning models, and after the preset positioning models are arranged on an initial mold model, the resulting overall model 902 is the target mold model.
In some embodiments of the present disclosure, the positioning model arrangement method further includes: judging whether the preset positioning model which is arranged is interfered with a voltage regulating pad in the initial mold model, and if so, generating and displaying warning information representing the interference.
Specifically, in this embodiment, the envelope of each preset positioning model, and the envelope of the voltage regulating pad may be determined. If the enveloping body of the preset positioning model interferes with the enveloping body of the voltage regulating pad, the interference between the preset positioning model and the voltage regulating pad is determined. Specifically, if the maximum value of the coordinates of the enveloping body of the preset positioning model is smaller than the minimum value of the coordinates of the enveloping body of the voltage regulating pad or the minimum value of the coordinates of the enveloping body of the preset positioning model is larger than the maximum value of the coordinates of the enveloping body of the voltage regulating pad in any one of the transverse direction, the longitudinal direction and the vertical direction, determining that the enveloping body of the preset positioning model does not interfere with the enveloping body of the voltage regulating pad.
According to the positioning model arrangement method, automatic determination of the blank line is achieved, the arrangement line is determined based on projection of the blank line, and the positioning direction of the preset positioning model is limited to be directed to the inside of the arrangement line, namely, the inside of the blank holder. And the warning of the interaction of the preset positioning model and the voltage regulating pad is also realized.
The positioning model arrangement method provided by the embodiment of the disclosure is applicable to blank lines with regular and irregular shapes, and the types of the initial mold model can include: the arrangement method of the positioning die has good universality and stability, and the arrangement efficiency and the intelligent degree of the positioning die are improved.
Fig. 10 is a schematic structural diagram of a positioning model arrangement device provided in an embodiment of the disclosure, where the device may be implemented by software and/or hardware, and may be generally integrated in an electronic device. As shown in fig. 10, the apparatus includes:
a first determining module 1001 for determining a blank line of an initial mold model;
a second determining module 1002, configured to determine a target placement point according to the blank line; wherein the target placement point is located on a binder of the initial mold model;
and the arrangement module 1003 is configured to arrange a preset positioning model on the initial mold model according to the target arrangement point location, so as to obtain a target mold model.
Optionally, the first determining module 1001 is configured to:
acquiring a plurality of process lines of the initial mold model;
and determining a process line which is farthest from the initial mold model and meets a preset flatness condition from the plurality of process lines as the blank line.
Optionally, the meeting the preset flattening condition includes:
and if the height of the enveloping body of the process line is smaller than a preset height threshold value, determining that the preset flatness condition is met.
Optionally, the second determining module 1002 includes:
the projection sub-module is used for projecting the blank line to the upper surface of the blank holder to obtain an arrangement line; the upper surface of the blank holder is the surface of the blank holder far away from the initial die model;
a first determination sub-module for determining the target placement point located on the placement line.
Optionally, the first determining submodule is configured to:
performing discrete processing on the arrangement lines to obtain a plurality of candidate arrangement points;
and acquiring a first target placement point position in the candidate placement points, and determining the candidate placement point position which meets the preset symmetry condition with the first target placement point position in the candidate placement points as a second target placement point position.
Optionally, the arrangement module 1003 includes:
the second determining submodule is used for determining a target normal line of the arrangement line according to the target arrangement point position; wherein the target normal takes the target arrangement point as an endpoint and points to the inside of the arrangement line;
and the arrangement sub-module is used for arranging the preset positioning model at the target arrangement point position on the initial mold model, determining the positioning direction of the preset positioning model as the direction of the target normal line, and obtaining the target mold model.
Optionally, an origin of a positioning model coordinate system of the preset positioning model is located at a midpoint of a target line segment of the preset positioning model; the target line segment is an intersecting line segment of a positioning surface and a step surface of the preset positioning model, the step surface is a transition surface between a base part and a positioning part of the preset positioning model, and a transverse axis of a coordinate system of the positioning model is perpendicular to the positioning surface and points to the outside of the initial mold model; wherein the positioning portion includes the positioning surface;
correspondingly, the arrangement sub-module is used for:
and coinciding the origin of the positioning model coordinate system with the target arrangement point position, and setting the transverse axis direction of the positioning model coordinate system as the opposite direction of the target normal.
The positioning model arrangement device provided by the embodiment of the disclosure can execute the positioning model arrangement method provided by any embodiment of the disclosure, and has the corresponding functional modules and beneficial effects of the execution method.
Fig. 11 is a schematic structural diagram of an electronic device according to an embodiment of the disclosure. As shown in fig. 11, the electronic device 1100 includes one or more processors 1101 and memory 1102.
The processor 1101 may be a Central Processing Unit (CPU) or other form of processing unit having positioning model placement capability and/or instruction execution capability, and may control other components in the electronic device 1100 to perform desired functions.
Memory 1102 may include one or more computer program products that may include various forms of computer-readable storage media, such as volatile memory and/or non-volatile memory. The volatile memory may include, for example, random Access Memory (RAM) and/or cache memory (cache), and the like. The non-volatile memory may include, for example, read Only Memory (ROM), hard disk, flash memory, and the like. One or more computer program instructions may be stored on the computer readable storage medium that the processor 1101 may execute to implement the positioning model placement method of embodiments of the present disclosure described above and/or other desired functions. Various contents such as an input signal, a signal component, a noise component, and the like may also be stored in the computer-readable storage medium.
In one example, the electronic device 1100 may further include: an input device 1103 and an output device 1104, which are interconnected by a bus system and/or other form of connection mechanism (not shown).
In addition, the input device 1103 may also include, for example, a keyboard, a mouse, and the like.
The output device 1104 may output various information to the outside, including the determined distance information, direction information, and the like. The output device 1104 may include, for example, a display, speakers, a printer, and a communication network and remote output devices connected thereto, etc.
Of course, only some of the components of the electronic device 1100 that are relevant to the present disclosure are shown in fig. 11, with components such as buses, input/output interfaces, etc. omitted for simplicity. In addition, the electronic device 1100 may include any other suitable components depending on the particular application.
In addition to the methods and apparatus described above, embodiments of the present disclosure may also be a computer program product comprising computer program instructions which, when executed by a processor, cause the processor to perform the positioning model arrangement method provided by the embodiments of the present disclosure.
The computer program product may write program code for performing the operations of embodiments of the present disclosure in any combination of one or more programming languages, including an object oriented programming language such as Java, C++ or the like and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computing device, partly on the user's device, as a stand-alone software package, partly on the user's computing device, partly on a remote computing device, or entirely on the remote computing device or server.
Further, embodiments of the present disclosure may also be a computer-readable storage medium having stored thereon computer program instructions, which when executed by a processor, cause the processor to perform the positioning model arrangement method provided by the embodiments of the present disclosure.
The computer readable storage medium may employ any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. The readable storage medium may include, for example, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or a combination of any of the foregoing. More specific examples (a non-exhaustive list) of the readable storage medium would include the following: an electrical connection having one or more wires, a portable disk, a hard disk, random Access Memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.
It should be noted that in this document, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing is merely a specific embodiment of the disclosure to enable one skilled in the art to understand or practice the disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown and described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A positioning model arrangement method, characterized by comprising:
determining a blank line of an initial mold model;
determining a target arrangement point position according to the blank line; wherein the target placement point is located on a binder of the initial mold model;
arranging a preset positioning model on the initial mold model according to the target arrangement point positions to obtain a target mold model;
wherein the determining of the blank line of the initial mold model comprises:
acquiring a plurality of process lines of the initial mold model;
and determining a process line which is farthest from the initial mold model and meets a preset flatness condition from the plurality of process lines as the blank line.
2. The method of claim 1, wherein the meeting a preset flattening condition comprises:
and if the height of the enveloping body of the process line is smaller than a preset height threshold value, determining that the preset flatness condition is met.
3. The method of claim 1, wherein the determining a target placement point location from the stock line comprises:
projecting the blank line to the upper surface of the blank holder to obtain an arrangement line; the upper surface of the blank holder is the surface of the blank holder far away from the initial die model;
determining the target placement point located on the placement line.
4. A method according to claim 3, wherein said determining the target placement point on the placement line comprises:
performing discrete processing on the arrangement lines to obtain a plurality of candidate arrangement points;
and acquiring a first target placement point position in the candidate placement points, and determining the candidate placement point position which meets the preset symmetry condition with the first target placement point position in the candidate placement points as a second target placement point position.
5. A method according to claim 3, wherein said arranging a preset positioning model on said initial mold model according to said target arrangement point location to obtain a target mold model comprises:
determining a target normal of the arrangement line according to the target arrangement point position; wherein the target normal takes the target arrangement point as an endpoint and points to the inside of the arrangement line;
and arranging the preset positioning model on the target arrangement point position on the initial mold model, and determining the positioning direction of the preset positioning model as the direction of the target normal line to obtain the target mold model.
6. The method of claim 5, wherein an origin of a positioning model coordinate system of the preset positioning model is located at a midpoint of a target line segment of the preset positioning model; the target line segment is an intersecting line segment of a positioning surface and a step surface of the preset positioning model, the step surface is a transition surface between a base part and a positioning part of the preset positioning model, and a transverse axis of a coordinate system of the positioning model is perpendicular to the positioning surface and points to the outside of the initial mold model; wherein the positioning portion includes the positioning surface;
correspondingly, the disposing the preset positioning model at the target disposing point location, and determining the positioning direction of the preset positioning model as the direction of the target normal line includes:
and coinciding the origin of the positioning model coordinate system with the target arrangement point position, and setting the transverse axis direction of the positioning model coordinate system as the opposite direction of the target normal.
7. A positioning model arranging device, characterized by comprising:
a first determining module for determining a blank line of the initial mold model;
the second determining module is used for determining a target arrangement point position according to the blank line; wherein the target placement point is located on a binder of the initial mold model;
the arrangement module is used for arranging a preset positioning model on the initial die model according to the target arrangement point positions to obtain a target die model;
the first determining module is configured to: acquiring a plurality of process lines of the initial mold model; and determining a process line which is farthest from the initial mold model and meets a preset flatness condition from the plurality of process lines as the blank line.
8. An electronic device, the electronic device comprising:
a processor;
a memory for storing the processor-executable instructions;
the processor is configured to read the executable instructions from the memory and execute the instructions to implement the positioning model arrangement method according to any of the preceding claims 1-6.
9. A computer-readable storage medium, characterized in that the storage medium stores a computer program for executing the positioning model arrangement method according to any one of the preceding claims 1-6.
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