CN117231658A - Production method for buffer structure, electronic product and die - Google Patents

Abstract

The application relates to the technical field of anti-impact of electronic products and discloses a buffer structure which comprises a silica gel protection pad and a filler, wherein a cavity is formed in the silica gel protection pad, and the silica gel protection pad is used for protecting the electronic products; and the filling material is filled in the cavity, and the filling material is formed by foaming pearl wool. This disclosure carries out the cavity setting with the inside of silica gel protection pad, has filled pearl cotton in the cavity, can effectively reduce the holistic weight of buffer structure, compares in the buffer structure of full silica gel, and buffer structure density of this disclosure is low, and the quality is light. The buffer structure can overcome the defects of easy deformation and poor wear resistance of the pearl cotton, effectively combine the organic silica gel with the pearl cotton, has low density and light weight, can meet the indexes of high and low temperature, damp heat and the like, and can be applied to the anti-vibration impact drop of electronic products. The application also discloses a production method for the buffer structure, an electronic product and a die.

Description

Production method for buffer structure, electronic product and die

Technical Field

The application relates to the technical field of impact prevention of electronic products, in particular to a production method for a buffer structure, the buffer structure, an electronic product and a die.

Background

The reinforced electronic product equipment has various use sites, and the reinforced index is strictly required. With optimization of man-machine functions of industrial electronic products, the conflict between reinforcement indexes and ergonomics is drastically increased. In particular, in order to make the user easily and conveniently carry and use the handheld electronic product, the size of the product is thinner and thinner, and the weight of the product is lighter and lighter, so that the anti-vibration impact drop performance of the electronic product is greatly reduced.

Disclosure of Invention

The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview, and is intended to neither identify key/critical elements nor delineate the scope of such embodiments, but is intended as a prelude to the more detailed description that follows.

The embodiment of the disclosure provides a production method for a buffer structure, the buffer structure, an electronic product and a die, so as to solve the problem of poor shock resistance of the electronic product.

In some embodiments, the buffer structure is used for an electronic product, the buffer structure comprises a silica gel protection pad and a filler, a cavity is arranged in the silica gel protection pad, and the silica gel protection pad is used for protecting the electronic product; and the filling material is filled in the cavity, and the filling material is formed by foaming pearl wool.

Optionally, the density of the buffer structure is (0.03a+1.2b)/(a+b); wherein a is the volume of the filler, and b is the volume of the silica gel protective pad.

Optionally, the silica gel protection pad comprises a connecting part and a protection part, wherein the connecting part is provided with an installation through hole for a connecting piece to pass through and is used for being connected with a supporting surface or a working surface of the electronic product; the protection part is connected with the connecting part in a bending way and is used for protecting the side face of the electronic product.

Optionally, the silica gel protection pad is integrally formed, and the connecting part and the protection part are communicated inside to form a cavity.

Optionally, a first foaming hole is formed in the surface of the silica gel protection pad and used for foaming the filler in the cavity.

Optionally, the connecting portion and the protection portion are both L-shaped structures, and the connecting portion is connected with the protection portion in a bending way, and the silica gel protection pad is used for protecting corner parts of the electronic product.

In some embodiments, the electronic product includes a body and a cushioning structure as described above mounted on an outer edge of the body.

Optionally, the buffer structure is provided with a plurality of, and a plurality of buffer structures are installed respectively in the corner position of body.

In some embodiments, the mold is applied to a cushioning structure as described above, the mold cooperating with an outer wall structure of a silicone protective pad of the cushioning structure; a second foaming hole is reserved on the die, and the second foaming hole is matched with the first foaming hole of the silica gel protection pad in position to form a foaming channel; the mould is made of rigid materials and is used for limiting the silica gel protective pad when the pearl cotton foams.

In some embodiments, the method of producing a cushioning structure comprises:

the silica gel protection pad is positioned in the mold, the mold is clung to the outer surface of the silica gel protection pad, and the first foaming holes are aligned with the second foaming holes to form foaming channels;

injecting a pearl cotton foaming agent into the cavity of the silica gel protective pad;

and after the pearl cotton foaming agent is solidified, taking the silica gel protective pad filled with the pearl cotton from the mold.

The production method for the buffer structure, the electronic product and the die provided by the embodiment of the disclosure can realize the following technical effects:

by adopting the buffer structure provided by the embodiment of the disclosure, the characteristics that both the organic silica gel and the EPE pearl cotton have high-strength buffer and anti-seismic properties are utilized to manufacture the structure with the outside being the silica gel protection pad and the inside being filled with the pearl cotton for the buffer structure of the electronic product.

The silica gel protective pad is made of organic silica gel, so that the silica gel protective pad has strong wear resistance, corrosion resistance, tear resistance and toughness, and can meet the high and low temperature environment and damp and hot environment due to the strong physical inertia and aging resistance of the organic silica gel. The pearl cotton has certain firmness, can effectively absorb impact force, has good softness and buffer property, has unchanged characteristics when repeatedly impacted, has good shockproof performance and plasticity, has strong toughness, and protects articles from damage; almost no water absorption; is not affected by various climatic conditions, and has excellent weather resistance; the foam material with independent bubbles has good shockproof performance.

But organic silica gel density is higher, and the mass is heavier under the same volume, and this disclosure carries out the cavity setting with the inside of silica gel protection pad, has filled pearl cotton in the cavity, can effectively reduce the holistic weight of buffer structure, compares in the buffer structure of full silica gel, and the buffer structure density of this disclosure is low, and the quality is light. And can overcome EPE pearl cotton and be out of shape, the wearability is poor shortcoming, makes organic silica gel and pearl cotton combine effectively, forms density low, light in weight, can satisfy the buffer structure of index such as high low temperature, damp heat, can be applied to electronic product anti-vibration impact and falls.

The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.

Drawings

One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which like reference numerals refer to similar elements, and in which:

fig. 1 is a schematic structural diagram of an electronic product according to an embodiment of the disclosure;

FIG. 2 is a schematic diagram of a buffer structure provided by an embodiment of the present disclosure;

FIG. 3 is a schematic structural view of another buffer structure provided by an embodiment of the present disclosure;

fig. 4 is a schematic cross-sectional view of a silicone protective pad according to an embodiment of the present disclosure.

Reference numerals:

1: an electronic product; 2: a buffer structure; 21: a connection part; 22: a protective part; 23: a cavity; 3: a screw; 4: mounting through holes; 5: a first foaming chamber.

Detailed Description

So that the manner in which the features and techniques of the disclosed embodiments can be understood in more detail, a more particular description of the embodiments of the disclosure, briefly summarized below, may be had by reference to the appended drawings, which are not intended to be limiting of the embodiments of the disclosure. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may still be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawing.

The terms first, second and the like in the description and in the claims of the embodiments of the disclosure and in the above-described figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe embodiments of the present disclosure. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.

In the embodiments of the present disclosure, the azimuth or positional relationship indicated by the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", etc. is based on the azimuth or positional relationship shown in the drawings. These terms are used primarily to better describe embodiments of the present disclosure and embodiments thereof and are not intended to limit the indicated device, element, or component to a particular orientation or to be constructed and operated in a particular orientation. Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the embodiments of the present disclosure will be understood by those of ordinary skill in the art in view of the specific circumstances.

In addition, the terms "disposed," "connected," and "fixed" are to be construed broadly. For example, "connected" may be in a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the embodiments of the present disclosure may be understood by those of ordinary skill in the art according to specific circumstances.

The term "plurality" means two or more, unless otherwise indicated.

In the embodiment of the present disclosure, the character "/" indicates that the front and rear objects are an or relationship. For example, A/B represents: a or B.

The term "and/or" is an associative relationship that describes an object, meaning that there may be three relationships. For example, a and/or B, represent: a or B, or, A and B.

It should be noted that, without conflict, the embodiments of the present disclosure and features of the embodiments may be combined with each other.

As shown in connection with fig. 1-4, embodiments of the present disclosure provide a buffer structure 2 for an electronic product 1, the buffer structure 2 including a silicone protective pad and a filler.

The inside of silica gel protection pad is provided with cavity 23, the silica gel protection pad is used for protecting electronic product 1.

A filler is filled in the cavity 23, and the filler is formed by foaming pearl wool.

It is understood that the silicone gel product is a common anti-vibration impact drop protection for the electronic product 1. The density of the organic silica gel ranges from 1.2 g/cm < 3 >, and the higher the density is, the heavier the mass is under the same volume; the higher the density, the higher the strength and elasticity. The organic silica gel can keep elasticity for a long time in an environment of-65 ℃ to 250 ℃, has strong wear resistance, corrosion resistance, tear resistance and toughness, is strong in physiological inertia and aging resistance, and the physical properties of the organic silica gel determine that the organic silica gel is a good buffering and damping material.

EPE pearl cotton with density of 0.03g/cm3 and using temperature range of-60 ℃ to +80 ℃ is a common packaging material. It is composed of low-density polyethylene resin which is physically foamed to generate countless independent bubbles. The weight is light, and certain firmness is realized; the impact force can be effectively absorbed, the softness and the buffer property are good, the characteristics of the impact force are unchanged when the impact force is repeatedly impacted, the shock resistance, the plasticity performance and the toughness are good, and the articles are protected from being damaged; foam material of independent bubbles has almost no water absorption; is not affected by various climatic conditions, and has excellent weather resistance; the foam material with independent bubbles has good shockproof performance. The EPE pearl wool has the disadvantages of easy deformation and poor wear resistance, which is also a common reason for the lining of packaging.

According to the performance characteristics of the organic silica gel and the EPE pearl cotton, the organic silica gel and the EPE pearl cotton have high-strength buffering and anti-seismic properties. The composite material with the EPE pearl wool filled in the surface organic silica gel has low density and light weight, meets the indexes of high and low temperature, damp heat and the like, and is applied to the electronic product 1 for resisting vibration impact drop.

By adopting the buffer structure 2 provided by the embodiment of the disclosure, the characteristics that both organic silica gel and EPE pearl cotton have high-strength buffering and anti-seismic properties are utilized to manufacture the structure with the outside being a silica gel protection pad and the inside being filled with the pearl cotton for the buffer structure 2 of the electronic product 1.

The silica gel protective pad is made of organic silica gel, so that the silica gel protective pad has strong wear resistance, corrosion resistance, tear resistance and toughness, and can meet the high and low temperature environment and damp and hot environment due to the strong physical inertia and aging resistance of the organic silica gel. The pearl cotton has certain firmness, can effectively absorb impact force, has good softness and buffer property, has unchanged characteristics when repeatedly impacted, has good shockproof performance and plasticity, has strong toughness, and protects articles from damage; almost no water absorption; is not affected by various climatic conditions, and has excellent weather resistance; the foam material with independent bubbles has good shockproof performance.

But organic silica gel density is higher, and the mass is heavier under the same volume, and this disclosure carries out the cavity setting with the inside of silica gel protection pad, has filled pearl cotton in cavity 23, can effectively reduce buffer structure 2 holistic weight, compares in buffer structure 2 of full silica gel, and buffer structure 2 density of this disclosure is low, and the quality is light. And can overcome EPE pearl cotton and be out of shape, the shortcoming that wearability is poor easily, make organic silica gel and pearl cotton combine effectively, form density low, the quality is light, can satisfy buffer structure 2 of index such as high low temperature, damp heat, can be applied to electronic product 1 anti-vibration impact and fall.

Optionally, the density of the buffer structure 2 is (0.03a+1.2b)/(a+b); wherein a is the volume of the filler, and b is the volume of the silica gel protective pad.

It will be appreciated that the cushioning structure 2 made according to this density is effective in terms of both silicone and pearl wool properties, and is not too heavy.

Optionally, the silica gel protection pad includes a connection part 21 and a protection part 22, where the connection part 21 is provided with a mounting through hole 4 for a connection piece to pass through, and is used for connecting with a supporting surface or a working surface of the electronic product 1; the protecting part 22 is connected with the connecting part 21 in a bending way and is used for protecting the side surface of the electronic product 1.

It can be understood that the connection portion 21 is mainly used for connecting with the electronic product 1, and the protection portion 22 is used for protecting a side surface of the electronic product 1.

As an example, a fastener passes through the mounting through hole 4 to fix the silicone protective pad on the electronic product 1.

Optionally, the silica gel protection pad is integrally formed, and the connecting portion 21 and the protection portion 22 are internally communicated to form a cavity 23.

As an example, the connection portion 21 and the protection portion 22 are hollow structures, and the connection portion 21 and the protection portion 22 are connected to each other, and the hollow structures of each other are communicated to form the cavity 23.

As another example, the connection portion 21 and the protection portion 22 are both of an open structure, the connection portion 21 is connected to an open end of the protection portion 22, and the connection portion 21 and the protection portion 22 surround to form a cavity 23 in the silica gel protection pad.

Optionally, the surface of the silica gel protection pad is provided with a first foaming hole 5 for foaming the filler in the cavity 23.

It is understood that the pearl wool of the present disclosure may be foamed directly into a silicone protective pad.

Optionally, as shown in fig. 1, the connecting portion 21 and the protecting portion 22 are both in L-shaped structures, the connecting portion 21 and the protecting portion 22 are connected in a bending manner, and the silica gel protection pad is used for protecting the corner portion of the electronic product 1.

It is understood that the buffer structure 2 may be used to protect the corner portions of the electronic product 1. The connection between the connection portion 21 and the protection portion 22 may be an L-shaped structure.

As shown in fig. 1, the present disclosure further provides an electronic product 1, including a body and a buffer structure 2 as described above, where the buffer structure 2 is mounted on an outer edge of the body.

Optionally, the buffer structure 2 is provided with a plurality of, and a plurality of buffer structures 2 are installed respectively in the corner position of body.

It can be appreciated that when the electronic product 1 falls, the corners are most likely to bear the impact, and the electronic product 1 of the present disclosure adopts a plurality of buffer structures 2, which are mainly used for protecting the corners of the body of the electronic product 1.

The present disclosure also provides a mold applied to the buffer structure 2 as described above, the mold being matched with an outer wall structure of the silica gel protection pad of the buffer structure 2; a second foaming hole is reserved on the die, and the second foaming hole is matched with the first foaming hole 5 of the silica gel protection pad in position to form a foaming channel; the mould is made of rigid materials and is used for limiting the silica gel protective pad when the pearl cotton is foamed.

It can be understood that the main body of the silica gel protective pad is a thin-wall cavity 23, EPE pearl cotton is injected into the cavity 23 of the organic silica gel protective pad through EPE pearl cotton foaming holes, and the complete buffer structure 2 of the organic silica gel and EPE pearl cotton composite material is formed. The electronic product 1 and the protective pad are fastened by means of screws 3 through mounting through holes 4.

It should be noted that, because the silicone protection pad has better elastoplasticity, if EPE pearl cotton is directly injected into the silicone protection pad cavity 23, the silicone protection pad deforms under the action of injection pressure, and the designed size and shape cannot be realized. In order to solve the problem, the main body of the organic silica gel protective pad is placed in a rigid mold completely conforming to the shape of the main body of the organic silica gel protective pad, the rigid mold is closely attached to the whole outer surface of the organic silica gel protective pad, EPE pearl wool foaming holes are reserved in the rigid mold, the EPE pearl wool foaming holes are aligned with the 4EPE pearl wool foaming holes on the silica gel protective pad to form a foaming channel, and the EPE pearl wool foaming agent is injected into the cavity 23 of the silica gel protective pad, so that the cavity 23 of the complete silica gel protective pad can be filled under the action of the rigid mold, and the deformation of the silica gel protective pad is avoided. And (3) after the EPE pearl wool foaming agent is solidified, taking the silica gel protective pad filled with the EPE pearl wool out of the rigid die. The rigid mould can be a mould used in the production of the silica gel protective pad, and can also be a mould specially used in the foaming of pearl wool.

The present disclosure also provides a production method for the cushioning structure 2, comprising:

(1) The silicone protection pad is positioned in the mold as described above, the mold is tightly attached to the outer surface of the silicone protection pad, and the first foaming holes 5 are aligned with the second foaming holes to form foaming channels.

(2) A pearl wool foaming agent is injected into the cavity 23 of the silica gel protective pad.

(3) And after the pearl cotton foaming agent is solidified, taking the silica gel protective pad filled with the pearl cotton from the mold.

By adopting the production method for the buffer structure 2 provided by the embodiment of the disclosure, the organic silica gel is used as the coating material, the EPE pearl cotton is used as the coated material, and the coated material is filled with the coating material in an injection mode. The EPE pearl cotton foaming agent is injected into the cavity 23 of the organic silica gel pad, and under the action of the rigid mold, the cavity 23 of the complete organic silica gel pad can be filled, and the deformation of the organic silica gel pad is avoided. After the EPE pearl cotton foaming agent is solidified, the organic silica gel pad filled with the EPE pearl cotton is taken out of the rigid die, so that the mixed material made of the organic silica gel and the EPE pearl cotton can be obtained, and the mixed material can be used as the buffer structure 2 of the electronic product 1 according to the shape of the organic silica gel pad.

The above description and the drawings illustrate embodiments of the disclosure sufficiently to enable those skilled in the art to practice them. Other embodiments may include structural and other modifications. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in, or substituted for, those of others. The embodiments of the present disclosure are not limited to the structures that have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. Buffer structure, characterized in that it is intended for an electronic product (1), comprising:

the inside of the silica gel protection pad is provided with a cavity (23), and the silica gel protection pad is made of organic silica gel and is used for protecting the electronic product (1);

and the filling material is filled in the cavity (23), and is formed by foaming pearl wool.

2. The buffer structure according to claim 1, wherein,

the density of the buffer structure (2) is (0.03a+1.2b)/(a+b);

wherein a is the volume of the filler, and b is the volume of the silica gel protective pad.

3. The cushioning structure of claim 1 or 2, wherein the silicone protective pad comprises:

a connecting part (21) provided with a mounting through hole (4) for a connecting piece to pass through, and used for connecting with a supporting surface or a working surface of the electronic product (1);

and the protection part (22) is connected with the connecting part (21) in a bending way and is used for protecting the side surface of the electronic product (1).

4. A buffer structure as claimed in claim 3, characterized in that,

the silica gel protection pad is integrally formed, and the connecting part (21) and the protection part (22) are internally communicated to form the cavity (23).

5. A buffer structure as claimed in claim 3, characterized in that,

the surface of the silica gel protection pad is provided with a first foaming hole (5) for foaming the filler in the cavity (23).

6. A buffer structure as claimed in claim 3, characterized in that,

the connecting part (21) and the protecting part (22) are of L-shaped structures, the connecting part (21) is connected with the protecting part (22) in a bending mode, and the silica gel protecting pad is used for protecting corner parts of the electronic product (1).

7. An electronic product, comprising:

the body is provided with a plurality of grooves,

a cushioning structure (2) according to any one of claims 1 to 6, mounted on an outer edge of the body.

8. The electronic product of claim 7, wherein the electronic product comprises,

the buffer structure (2) is provided with a plurality of buffer structures (2), and the buffer structures (2) are respectively installed at the corner parts of the body.

9. A mold for a cushioning structure according to any one of claims 1 to 6,

the die is matched with the outer wall structure of the silica gel protection pad of the buffer structure (2);

a second foaming hole is reserved on the die, and the second foaming hole is matched with the first foaming hole (5) of the silica gel protection pad in position to form a foaming channel;

the mould is made of rigid materials and is used for limiting the silica gel protective pad when the pearl cotton foams.

10. A method of producing a cushioning structure according to any one of claims 1 to 6, comprising:

positioning a silica gel protection pad in the mold as claimed in claim 9, wherein the mold is tightly attached to the outer surface of the silica gel protection pad, and the first foaming holes (5) are aligned with the second foaming holes to form foaming channels;

injecting a pearl wool foaming agent into a cavity (23) of the silica gel protective pad;

and after the pearl cotton foaming agent is solidified, taking the silica gel protective pad filled with the pearl cotton from the mold.