CN117219606A - Packaging element capable of preventing solder overflow and packaging method - Google Patents
Packaging element capable of preventing solder overflow and packaging method Download PDFInfo
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- CN117219606A CN117219606A CN202210624193.2A CN202210624193A CN117219606A CN 117219606 A CN117219606 A CN 117219606A CN 202210624193 A CN202210624193 A CN 202210624193A CN 117219606 A CN117219606 A CN 117219606A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 162
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 44
- 239000013078 crystal Substances 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims description 21
- 238000007650 screen-printing Methods 0.000 claims description 12
- 230000004907 flux Effects 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 10
- 238000004378 air conditioning Methods 0.000 claims description 4
- 238000000206 photolithography Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 230000002265 prevention Effects 0.000 claims description 2
- 238000000465 moulding Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
A packaging element for preventing solder overflow and a packaging method are provided, when solder is distributed, a space or a structure capable of limiting the position of the solder is provided, the packaging element comprises a crystal grain, an overflow-preventing layer, a first pin, a second pin and a packaging body, the crystal grain is provided with an electrode pad, the overflow-preventing layer is arranged on the top surface of the electrode pad and is provided with an opening for exposing the surface of the electrode pad, the first pin is connected with the crystal grain, the second pin is welded to the electrode pad of the crystal grain through the opening of the overflow-preventing layer, and the packaging body covers the crystal grain.
Description
Technical Field
The present invention relates to a packaging element and a packaging method, and more particularly, to a packaging element and a packaging method for preventing solder overflow.
Background
Referring to fig. 4A to 4J, a wafer 60 is prepared, and a plurality of die units 61 are formed in the wafer 60, wherein an electrode pad 62 is disposed on a top surface of each die unit 61. Referring to fig. 4B, the wafer 60 is diced to separate the die units 61 from each other, each die unit 61 forms an individual of a single die 63, and the die 63 includes a body 630 and the electrode pad 62 disposed on the top surface of the body 630.
Referring to fig. 4C and 4D, a first leadframe 64 is prepared, the first leadframe 64 includes a plurality of first leads 640, the die 63 are respectively disposed on the solder layers 641 on the first leads 640, wherein each die 63 is disposed on each solder layer 641 with the bottom thereof, and the electrode pads 62 of the die 63 face upward.
Referring to fig. 4E, dispensing is performed, and a solder 65 is dispensed on the surface of the electrode pad 62 of the die 63 by a dispenser.
Then, a second lead is soldered, wherein a plurality of second leads are disposed on a second leadframe (not shown), that is, two opposite sides of the second leadframe are respectively extended to form the second leads in a fishbone state, and the positions of the second leads respectively correspond to the positions of the die 63 shown in fig. 4D, so that when the second leadframe is disposed on the first leadframe 64, the second leads can be respectively connected to the die 63. As shown in fig. 4F and 4G, the bottom surface of the end of each second pin 66 has a convex portion 660 protruding downward, the convex portion 660 is abutted against the solder 65 from above the die 63, and a reflow (reflow) process is performed to make the convex portion 660 of the second pin 66 soldered to the electrode pad 62 of the die 63 and make the bottom of the die 63 soldered to the first pin 640. In the reflow process, the solder 65 melts into a liquid state and can be attached to the surface of the electrode pad 62 and the convex portion 660 of the second pin 66 at the same time, and the solder 65 is cooled and solidified to be fixedly connected and electrically connected with the electrode pad 62 and the second pin 66.
Referring to fig. 4H, a packaging step (molding) is performed to form a package 67, and the die 63 is encapsulated by the package 67. Finally, the package body 67 is removed from the first leadframe 64 to obtain a package product 68 as shown in fig. 4I.
In the dispensing step of fig. 4E, due to the accuracy and solder characteristics of the dispenser itself, the amount of solder 65 on the electrode pad 62 of the die 63 is not uniform, and the position of the solder 65 may be deviated, for example, when the solder 65 of the die 63 is more distributed, the solder 65A in fig. 4J may overflow to the area outside the electrode pad 62, and the overflowed solder 65A may cause abnormal contact or other electrical abnormality of the die 63A due to the conductivity of the solder 65A.
Disclosure of Invention
Accordingly, it is an objective of the present invention to provide a packaging device and a packaging method capable of preventing solder overflow, so as to overcome the solder overflow problem in the prior art.
In order to achieve the above object, the present invention provides a packaging element for preventing solder overflow, comprising:
a die having an electrode pad;
the overflow prevention layer is arranged on the top surface of the electrode pad and is provided with an opening for exposing the surface of the electrode pad;
a first pin connected to the die;
a second pin welded to the electrode pad of the die through the opening of the overflow preventing layer; a kind of electronic device with high-pressure air-conditioning system
A package body for encapsulating the die.
According to the structure that the second pins are welded to the electrode pads of the die through the openings of the anti-overflow layer, namely, the openings of the anti-overflow layer are provided with solder for welding, and the anti-overflow layer has thickness and cohesive force, so that the positions of the solder are limited by the anti-overflow layer, and the overflow of the solder is effectively avoided.
To achieve the above object, the present invention provides another package for preventing solder overflow, comprising:
a die having an electrode pad;
a first pin connected to the die;
a second pin arranged at intervals on the first pin;
a bridge, comprising:
a first end having a recess for soldering the electrode pad of the die by solder; a kind of electronic device with high-pressure air-conditioning system
A second end connected to the second pin; and
a package body for encapsulating the die.
The packaging element as described above, according to the configuration that the recess of the bridge member welds the electrode pad of the die by solder, that is, the position of the solder is limited by the recess of the bridge member, the solder overflow is effectively avoided.
In order to achieve the above object, the present invention provides a packaging method for preventing solder overflow, comprising:
preparing a wafer, which is provided with a plurality of die units, wherein the top surface of each die unit is provided with an electrode pad;
arranging an anti-overflow layer on the electrode pad of each grain unit, wherein the anti-overflow layer is provided with an opening for exposing the surface of the electrode pad;
dicing the wafer to form a die in each die unit;
placing the die on a first pin;
disposing a solder in the opening of the anti-overflow layer on the die, the solder being attached to the electrode pad;
welding a second pin, wherein a convex part is arranged on the bottom surface of one end of the second pin, the convex part is butted with the solder from the upper part of the crystal grain, and then reflow welding is carried out, so that the convex part of the second pin and an electrode pad of the crystal grain are welded; and
packaging is carried out to form a packaging body, and the packaging body wraps the die.
In the above-mentioned packaging method, after the solder is arranged in the opening of the anti-overflow layer by the arrangement of the anti-overflow layer, the position of the solder is limited by the anti-overflow layer because the anti-overflow layer has thickness and the solder has cohesive force, so that the situation that the solder overflows in the welding process is effectively avoided.
To achieve the above object, the present invention provides another packaging method for preventing solder overflow, comprising:
preparing a wafer, which is provided with a plurality of die units, wherein the top surface of each die unit is provided with an electrode pad;
dicing the wafer to form a die in each die unit;
disposing the die on a first pin, the first pin having a second pin disposed opposite to and spaced apart from the first pin;
arranging a solder on the surface of an electrode pad of the die;
welding a bridge piece, wherein the bridge piece comprises a first end and a second end, the bottom surface of the first end is provided with a concave part, the concave part is butted with the solder from the upper part of the crystal grain to enable the solder to enter the concave part, the second end of the bridge piece is arranged on the second pin, and reflow welding is carried out to enable the concave part of the bridge piece and an electrode pad of the crystal grain to form welding; and
packaging is carried out to form a packaging body, and the packaging body wraps the die.
In the packaging method, the at least one solder ball can enter the space of the concave part through the arrangement of the bridge part, and the concave part of the bridge part limits the position of the solder, so that the situation that the solder overflows in the welding process is effectively avoided.
In order to achieve the above object, the present invention provides a packaging method for preventing solder overflow, comprising:
preparing a wafer, which is provided with a plurality of die units, wherein the top surface of each die unit is provided with an electrode pad;
dicing the wafer to form a die in each die unit;
disposing a solder material at the center of the electrode pad surface of the die by screen printing;
sucking the die through a suction nozzle to arrange the die on a first pin, wherein a second pin is arranged opposite to the first pin at intervals;
welding a bridge piece to the electrode pad of the die and connecting the second pin; and
packaging is carried out to form a packaging body, and the packaging body wraps the die.
When the solder is arranged on the surface of the electrode pad of the die by adopting the screen printing method, the quantity and the position of the distributed solder can be precisely limited by the size and the position of the holes of the screen, and the situation that the solder overflows in the welding process is effectively avoided.
In order to achieve the above object, the present invention provides a packaging method for preventing solder overflow, comprising:
preparing a wafer, which is provided with a plurality of die units, wherein the top surface of each die unit is provided with an electrode pad;
dicing the wafer to form a die in each die unit;
dispensing a flux at a center of an electrode pad surface of the die and disposing at least one solder ball on the flux;
sucking the die through a suction nozzle to arrange the die on a first pin, wherein a second pin is arranged opposite to the first pin at intervals;
welding a bridge piece, wherein the bridge piece comprises a first end and a second end, the bottom surface of the first end is provided with a concave part, the concave part is butted with the at least one solder ball from the upper part of the die, the at least one solder ball enters the concave part, the second end of the bridge piece is arranged on the second pin, and reflow welding is carried out, so that the concave part of the bridge piece and an electrode pad of the die are welded; and
packaging is carried out to form a packaging body, and the packaging body wraps the die.
When the at least one solder ball is arranged on the surface of the electrode pad of the die, the packaging method can accurately control the solder consumption by selecting a solder ball with a certain specific specification, and the concave part of the bridging piece limits the position of the at least one solder ball, so that the overflow of the at least one solder ball in the welding process is effectively avoided.
In summary, the present invention provides a space or structure capable of limiting the solder position when dispensing solder on the surface of the electrode pad, so as to effectively avoid the overflow of solder during the soldering process.
Drawings
Fig. 1A to 1K: the manufacturing flow diagram of the first embodiment of the invention.
Fig. 2A to 2I: a schematic flow chart of a second embodiment of the present invention is shown.
Fig. 3A to 3E, 3H and 3I: a schematic flow chart of a third embodiment of the present invention is shown.
Fig. 3F: in a third embodiment of the invention, a schematic perspective view of the suction nozzle is used.
Fig. 3G: in a third embodiment of the invention, a schematic cross-sectional view of the nozzle is used.
Fig. 4A to 4J: the conventional process flow of packaging the device is shown.
Detailed Description
During the packaging process, solder is dispensed onto the surface of the die's electrode pad for the die to be soldered to a leadframe or other metal component. The present invention provides a space or structure for limiting the solder position when dispensing solder, and it should be noted that the present invention is preferably applied to a die structure where soldering is required on the top surface, such as a die of a diode, a triode, a metal oxide semiconductor field effect transistor (MOS FET), but not limited thereto. Embodiments of the present invention are described in detail below.
1. First embodiment
Referring to fig. 1A, a wafer 10 is prepared, a plurality of die units 11 are formed in the wafer 10, and an electrode pad 12 is disposed on a top surface of each die unit 11.
Referring to fig. 1B, an overflow preventing layer 13 is disposed on the electrode pad 12 of each die unit 11, and an opening 130 is formed in the center of the overflow preventing layer 13, that is, the overflow preventing layer 13 partially covers the electrode pad 12, the surface of the electrode pad 12 is exposed out of the opening 130, on the other hand, the size of the electrode pad 12 may be smaller than the size of the overflow preventing layer 13, and the outer edge of the electrode pad 12 is located inside the outer edge of the overflow preventing layer 13. For example, the anti-overflow layer 13 may be manufactured by a photolithography process (photolithography), and a PI (Polyimide) layer may be coated on the surface of the wafer 10, and then a photoresist layer may be coated on the PI layer; after patterning the photoresist layer and the PI layer, the photoresist layer is removed, and the remaining portion of the PI layer forms the structure of the anti-overflow layer 13.
In addition to fabricating the anti-overflow layer 13 by the photolithography process, the anti-overflow layer 13 may also be fabricated by a laser molding process, a printing process, or other means. For example, in the laser forming process, a PI layer may be coated on the surface of the wafer 10, and after patterning is performed by ablating a specific position of the PI layer, a portion of the PI layer may be removed, and a portion of the PI layer is left to form the overflow preventing layer 13; in the printing process, the size and position of the holes on the screen correspond to the structure of the anti-overflow layer 13, so that the PI raw material can be utilized to directly print the structure of the anti-overflow layer 13 on the surface of the wafer 10 through the screen.
The wafer 10 is then diced to separate the die units 11 from each other, referring to fig. 1C, each die unit 110 is formed as a single die 14, and dicing streets 15 are formed between adjacent dies 14 shown in fig. 1C. Fig. 1D is a schematic cross-sectional view of an individual of the die 14, which includes a body 140, the electrode pad 12 disposed on the top surface of the body 140, and the anti-overflow layer 13 disposed on the electrode pad 12, wherein the center of the anti-overflow layer 13 has the opening 130, and the surface of the electrode pad 12 is exposed out of the opening 130. The bottom surface of the body 140 may also form a bottom contact 141, but the invention is not limited thereto.
Referring to fig. 1E, a first leadframe 16 is prepared, the first leadframe 16 is a hollow frame and includes two side bars 161, the two side bars 161 are disposed opposite to each other, and each of the two side bars extends inward to form a plurality of first pins 162 arranged at intervals, each of the first pins 162 is a sheet, and a solder layer 163 is disposed on a top surface of each of the first pins 162. It should be noted that the structure of the first leadframe 16 is merely illustrative, and the solder layer 163 may be a solder paste applied on the first leads 162 by screen printing (screen print).
Referring to fig. 1F, die bonding (die bond) is performed, and the die 14 is placed on the solder layer 163 of the first leads 162, wherein the bottom contacts 141 on the bottom surface of the die 14 are disposed on the solder layer 163, and the top surface of the die 14 faces upward, i.e. the surface of the electrode pad 12 faces upward.
Referring to fig. 1G, dispensing is performed by dispensing a solder 17 on the electrode pad 12 of the die 14 with a dispensing machine, and the solder 17 is located in the opening 130 of the anti-overflow layer 13, wherein the solder 17 may be solder paste because the anti-overflow layer 13 has a thickness and the solder 17 itself has cohesive force, so that the position of the solder 17 is limited in the opening 130 of the anti-overflow layer 13.
On the other hand, the arrangement of the solder 17 is not limited to the dispensing method described above, for example, after the step of dicing the wafer 10 shown in fig. 1C, the dies 14 are separated from each other, but the relative positions of the dies 14 remain fixed, so the solder 17 can be directly printed and coated in the openings 130 of the anti-overflow layer 13 on the dies 14 by screen printing (screen print), and it is understood that the sizes and positions of the holes on the screen correspond to the sizes and positions of the openings 130 of the anti-overflow layer 13.
Referring to fig. 1H and 1I, the second pins 18 are soldered, wherein the second pins 18 are disposed on a second leadframe (not shown), that is, opposite sides of the second leadframe are respectively extended to form the second pins 18 in a fishbone state, and positions of the second pins 18 respectively correspond to positions of the die 14 shown in fig. 1F, so that when the second leadframe is disposed on the first leadframe 16, the second pins 18 can be respectively connected to the die 14. As shown in fig. 1H and 1I, the bottom surface of one end of each second pin 18 has a protruding portion 180 protruding downward, the protruding portion 180 is abutted against the solder 17 from above the die 14, a reflow (reflow) process is performed to make the protruding portion 180 of the second pin 18 soldered to the electrode pad 12 of the die 14, and the bottom contact 141 (shown in fig. 1D) at the bottom of the die 14 soldered to the first pin 162.
Referring to fig. 1J, a packaging step (molding) is performed to form a package 19, wherein the package 19 completely encapsulates the die 14 and partially encapsulates the first pin 162 and the second pin 18, that is, one end of the first pin 162 opposite to the die 14 is exposed to the package 19, and one end of the second pin 18 opposite to the die 14 is exposed to the package 19.
Then, the first lead frame 16 and the second lead frame are cut to obtain the final product of the package device of the present invention as shown in fig. 1K.
Accordingly, the embodiment of the package device of the present invention includes a die 14, an anti-overflow layer 13, a first pin 162 and a second pin 18, the die 14 includes a body 140 and an electrode pad 12, the electrode pad 12 may be disposed on the top surface of the body 140, the die 14 may also include a bottom contact 141, the bottom contact 141 is disposed on the bottom surface of the body 140, but the structure of the die 14 is not limited thereto. The anti-overflow layer 13 is disposed on the top surface of the electrode pad 12, wherein the anti-overflow layer 13 has an opening 130, and the surface of the electrode pad 12 is exposed out of the opening 130. The inner end of the first pin 162 is connected to the die 14, for example, can be soldered to the bottom contact 141 at the bottom of the die 14; the inner end of the second pin 18 is soldered to the electrode pad 12 of the die 14 through the opening 130 of the anti-overflow layer 13, that is, a solder layer 163 is formed between the inner end of the first pin 162 and the bottom contact 141 of the die 14, and solder 17 is formed between the inner end of the second pin 18 and the electrode pad 12 and in the opening 130 of the anti-overflow layer 13. The package 19 encapsulates the die 14 and the inner ends of the first pins 162 and the inner ends of the second pins 18, and the outer ends of the first pins 162 and the outer ends of the second pins 18 may be exposed or extend out of the package 19.
Summarizing the first embodiment of the present invention, the position of the solder 17 is limited by the anti-overflow layer 13, wherein, because the anti-overflow layer 13 has a thickness, the anti-overflow layer 13 can block the flow of the solder 17 on the wall surface of the opening 130, and the solder 17 has cohesive force, the position of the solder 17 is naturally limited in the opening 130 of the anti-overflow layer 13, and does not overflow outwards.
2. Second embodiment
Referring to fig. 2A, a wafer 20 is prepared, and a plurality of die units 21 are formed in the wafer 20, and an electrode pad 22 is disposed on a top surface of each die unit 21.
Then, the wafer 20 is diced to separate the die units 21 from each other, referring to fig. 2B, each die unit 21 forms a single die 23, and the adjacent die 23 shown in fig. 2B has dicing streets 24 formed between the dice 23, and the die 23 includes a body 230 and the electrode pads 22 disposed on the top surface of the body 230. The bottom surface of the body 230 may also form a bottom contact (e.g., the bottom contact 141 shown in fig. 1D), but the invention is not limited thereto.
Referring to fig. 2C, a first leadframe 25 is prepared, the first leadframe 25 includes two side bars 251 and a stem 252 disposed between the side bars 251 and parallel to each other, the stem 252 is in a fishbone shape, the stem 25 2 The opposite sides are respectively extended outwards to form a plurality of first pins 255 which are arranged at intervals, each first pin 255 is a sheet body, the top surface of each first pin 255 is provided with a solder layer 256, the positions of the two side bars 251 are opposite, the two side bars 251 are respectively extended inwards to form a plurality of second pins 253 which are arranged at intervals, each second pin 253 is a sheet body, and the top surface of each second pin 253 is provided with a solder layer 254. The positions of the first pins 255 respectively correspond to the positions of the second pins 253, and a gap 257 is formed between two adjacent second pins 253 and the ends of the first pins 255, that is, each of the first pins 255 is disposed opposite to and spaced apart from each of the second pins 253. It should be noted that the structure of the first lead frame 25 is merely illustrative, and not intended to limit the present invention, and the solder layers 256, 254 may be solder paste respectively coated on the first pins 255 and the second pins 253 by screen printing (screen print).
Referring to fig. 2D, die bonding (die bond) is performed to place the die 23 on the solder layer 256 of the first lead 255, wherein the top surface of the die 23 faces upward, i.e., the surface of the electrode pad 22 faces upward.
Then, a solder is disposed on the surface of the electrode pad 22 of the die 23, wherein the solder is disposed by a ball-mounting means (ball bond), and as for the ball-mounting means, referring to fig. 2E, firstly, a flux 26 (flux) is dispensed, and a dispenser is used to dispense the flux 26 at the center of the surface of the electrode pad 22 of the die 23; referring to fig. 2F again, at least one solder ball 27 is disposed on the flux 26, where the at least one solder ball 27 is, for example, a solder ball (solder ball), and the embodiment only uses one solder ball 27 as an example, and in practical application, a plurality of solder balls 27 may be disposed according to the soldering requirement. On the other hand, the ball-mounting means in fig. 2E and 2F may be replaced by screen printing (screen printing), and the solder is directly applied on the surface of the electrode pad 22 of the die 23, and it is understood that the positions of the holes on the screen correspond to the positions of the electrode pad 22 of the die 23.
Referring to fig. 2G and 2H, the bridge 28 is soldered, wherein the plurality of bridge 28 are disposed on a second leadframe (not shown), that is, two opposite sides of the second leadframe are respectively extended to form the bridge 28 in a fishbone state, and the positions of the bridge 28 respectively correspond to the positions of the solder layer 254 shown in fig. 2C and the electrode pad 22 shown in fig. 2D, so that when the second leadframe is disposed on the first leadframe 25, the bridge 28 can respectively connect the die 14 and the second lead 253. As shown in fig. 2G and 2H, each bridge 28 includes a first end 281 and a second end 282, the bottom surface of the first end 281 has a concave portion 283, the concave portion 283 moves from above the die 23 toward the solder ball 27 to be abutted, the solder ball 27 enters into the space of the concave portion 283, and the solder ball 27 can abut against the bridge 28 in the concave portion 283, the second end 282 of the bridge 28 is disposed on the solder layer 254 of the second pin 253, and then a reflow (reflow) means is performed to make the concave portion 283 of the bridge 28 soldered with the electrode pad 22 of the die 23, and make the bottom portion of the die 23 soldered with the first pin 255, and make the second end 281 of the bridge 28 soldered with the second pin 253.
Referring to fig. 2I, a packaging step (molding) is performed to form a package 29, wherein the package 29 completely encapsulates the die 23 and the bridge 28, and partially encapsulates the first pin 255 and the second pin 253, that is, one end of the first pin 255 opposite to the die 23 is exposed to the package 29, and one end of the second pin 253 opposite to the die 23 is exposed to the package 29. Then, the first leadframe 25 and the second leadframe are cut to remove the package 29, so as to obtain the finished product of the package device of the present invention (the appearance of the finished product can be referred to as fig. 1K).
Accordingly, referring to fig. 2I in conjunction, the second embodiment of the package device of the present invention includes a die 23, a first pin 255, a second pin 253 and a bridge 28, wherein the die 23 includes a body 230 and an electrode pad 22, the electrode pad 22 is disposed on the top surface of the body 230, the die 23 may also include a bottom contact (such as the bottom contact 141 shown in fig. 1D), and the bottom contact may be disposed on the bottom surface of the body 230, but the structure of the die 23 is not limited thereto. The first pin 255 is connected to the die 23, for example, the inner end of the first pin 255 may be soldered to the bottom contact of the die 23, the second pin 253 is disposed at intervals on the first pin 255, the bridge 28 has conductivity, the first end 281 of the bridge 28 is soldered to the electrode pad 22 of the die 23, the second end 282 of the bridge 28 is connected to the inner end of the second pin 253, that is, there is a solder layer 256 between the inner end of the first pin 255 and the bottom contact of the die 23, there is a solder 27' (derived from the solder ball 27 shown in fig. 2H) between the recess 283 of the first end 281 of the bridge 28 and the electrode pad 22 of the die 23, and there may be a solder layer 254 between the second end 282 of the bridge 28 and the inner end of the second pin 253. The package 29 encapsulates the die 23 and the bridge 28, and encapsulates the inner ends of the first and second pins 255 and 253, and the outer ends of the first and second pins 255 and 253 are exposed or extend out of the package 29.
Summarizing the second embodiment of the present invention, the recess 283 of the bridge 28 is used to limit the position of the solder 27' or the at least one solder ball 27, i.e. the wall surface of the bridge 28 in the recess 283 is used to block the flow of the at least one solder ball 27 during melting, so as not to overflow. In addition, there are many solder balls with different volume specifications on the market, so that the solder amount can be precisely controlled by selecting a solder ball with a specific specification and the number thereof, and the solder quality can be effectively controlled without excessive or insufficient solder balls.
3. Third embodiment
Referring to fig. 3A, a wafer 30 is prepared, a plurality of die units 31 are formed in the wafer 30, and an electrode pad 32 is disposed on a top surface of each die unit 31.
Then, the wafer 30 is diced to separate the die units 31 from each other, referring to fig. 3B, each die unit 31 forms a single die 33, and the dicing channels 34 are formed between the adjacent dies 33 shown in fig. 3B after dicing, and the die 33 includes a body 330 and the electrode pads 32 disposed on the top surface of the body 330.
Referring to fig. 3C and 3D, a solder 35 is disposed on the surface of the electrode pad 32 of each die 33, and the solder 35 may be located in the center of the electrode pad 32, for example, the solder 35 may be disposed directly on the surface of the electrode pad 32 of the die 33 by screen printing (screen print), and it is understood that the positions of the holes on the screen correspond to the positions of the electrode pad 32 of the die 33.
Referring to fig. 3E, a first leadframe 36 is prepared, and the structure of the first leadframe 36 can be referred to as the first leadframe 25 of fig. 2C of the second embodiment, which is not repeated herein, in brief, the first leadframe 36 shown in fig. 3E includes two side bars 361 and a backbone 362 between the side bars 361, opposite sides of the backbone 362 are respectively extended outwards to form a plurality of first pins 365, each first pin 365 is provided with a solder layer 366, each side bar 361 is extended inwards to form a plurality of second pins 363, and each second pin 363 is provided with a solder layer 364.
Referring to fig. 3F, 3G and 3H, die bonding (die bonding) is performed to place the die 33 on the solder layer 366 of the first pin 365, wherein the die 33 is sucked by a suction nozzle 40 and moved to the solder layer 366. The suction nozzle 40 includes a gas flow channel 41, the bottom surface of the suction nozzle 40 is provided with a plurality of suction holes 42, the suction holes 42 are communicated with the gas flow channel 41, the bottom surface of the suction nozzle 40 is provided with a groove 43, the groove 43 is positioned at the center of the suction holes 42, the position of the suction holes 42 corresponds to the periphery of the top surface of the die 33, when the suction holes 42 suck the periphery of the top surface of the die 33, the concave space provided by the groove 43 can prevent the solder 35 from adhering to the bottom surface of the suction nozzle 40, so that the suction nozzle 40 can avoid the solder 35 without adhering to the solder 35 when sucking the die 33 through the suction nozzle 40.
Referring to fig. 3I, a bridge 37 is soldered to the electrode pad 32 of the die 33 and connected to the second pin 363, wherein the plurality of bridge 37 are disposed on a second lead frame (not shown), and the second lead frame is constructed with reference to the second embodiment, which is not repeated herein. As shown in fig. 3I, each bridge 37 has a first end 371 and a second end 372, the bottom surface of the first end 371 has a protruding portion 373 protruding downward, the protruding portion 373 is abutted against the solder 35 on the electrode pad 32 from above the die 33, the second end 372 of the bridge 37 is disposed on the solder layer 364 of the second pin 363, and a reflow (reflow) process is performed to make the protruding portion 373 of the bridge 37 soldered to the electrode pad 32 of the die 33, and make the bottom of the die 22 soldered to the first pin 365, and make the second end 372 of the bridge 37 soldered to the second pin 363.
Then, a packaging step (molding) is performed to form a package, which can be described with reference to fig. 1J of the first embodiment and fig. 2I of the second embodiment, but is omitted herein, the package wraps the die 33 and the bridge 37, and partially wraps the first pin 365 and the second pin 363, wherein one end of the first pin 365 opposite to the die 33 is exposed to the package, and one end of the second pin 363 opposite to the die 33 is exposed to the package 29. Then, the first leadframe 36 and the second leadframe are cut to remove the package, so as to obtain the finished product of the package device of the present invention (the appearance of the finished product can be referred to as fig. 1K).
In the foregoing, the screen printing means of fig. 3C and 3D may be replaced by ball placement means (ball bond), which refer to fig. 2E and 2F of the second embodiment, so that solder balls can be located in the grooves 43 of the suction nozzle 40 when the suction nozzle 40 sucks the die; correspondingly, the bridge 37 structure of fig. 3I of the third embodiment may be replaced by the bridge 28 of fig. 2G to 2I of the second embodiment.
Summarizing the third embodiment of the present invention, when the solder 35 is provided at the center of the surface of the electrode pad 32 of the die 33 by screen printing means, the amount and position of the solder 35 dispensed are precisely limited by the size and position of the holes of the screen; in addition, when the solder ball 27 is disposed at the center of the surface of the electrode pad 32 of the die 33 by the ball mounting method, the solder usage can be precisely controlled, and the flow of the solder ball 27 is restricted by the recess 283 of the bridge 28 when melting. In addition, by the structure of the suction nozzle 40, the die 33 can be sucked and moved onto the first pins 365 without being adhered to the solder 35.
In summary, the present invention can provide a space or structure capable of limiting the solder position when dispensing solder on the surface of the electrode pad, such as the anti-overflow layer 13 of the first embodiment, the recess 283 structure of the at least one solder ball 27 and the bridge 28 of the second embodiment, and the solder disposed by the ball placement means or the screen printing means of the third embodiment, so as to effectively avoid the solder overflowing during the soldering process.
The present invention is not limited to the above-mentioned embodiments, but is capable of modification and variation in all embodiments without departing from the spirit and scope of the present invention.
Claims (10)
1. A packaging element for preventing solder overflow, comprising:
a die having an electrode pad;
the overflow prevention layer is arranged on the top surface of the electrode pad and is provided with an opening for exposing the surface of the electrode pad;
a first pin connected to the die;
a second pin welded to the electrode pad of the die through the opening of the overflow preventing layer; a kind of electronic device with high-pressure air-conditioning system
A package body for encapsulating the die.
2. A packaging element for preventing solder overflow, comprising:
a die having an electrode pad;
a first pin connected to the die;
a second pin arranged at intervals on the first pin;
a bridge, comprising:
a first end having a recess for soldering the electrode pad of the die by solder; a kind of electronic device with high-pressure air-conditioning system
A second end connected to the second pin; and
a package body for encapsulating the die.
3. A packaging method for preventing solder overflow, comprising:
preparing a wafer, which is provided with a plurality of die units, wherein the top surface of each die unit is provided with an electrode pad;
arranging an anti-overflow layer on the electrode pad of each grain unit, wherein the anti-overflow layer is provided with an opening for exposing the surface of the electrode pad;
dicing the wafer to form a die in each die unit;
placing the die on a first pin;
disposing a solder in the opening of the anti-overflow layer on the die, the solder being attached to the electrode pad;
welding a second pin, wherein a convex part is arranged on the bottom surface of one end of the second pin, the convex part is butted with the solder from the upper part of the crystal grain, and then reflow welding is carried out, so that the convex part of the second pin and an electrode pad of the crystal grain are welded; and
packaging is carried out to form a packaging body, and the packaging body wraps the die.
4. The method of claim 3, wherein the anti-overflow layer is formed by a photolithography process, a laser forming process, or a printing process.
5. A packaging method for preventing solder overflow, comprising:
preparing a wafer, which is provided with a plurality of die units, wherein the top surface of each die unit is provided with an electrode pad;
dicing the wafer to form a die in each die unit;
disposing the die on a first pin, the first pin having a second pin disposed opposite to and spaced apart from the first pin;
arranging a solder on the surface of an electrode pad of the die;
welding a bridge piece, wherein the bridge piece comprises a first end and a second end, the bottom surface of the first end is provided with a concave part, the concave part is butted with the solder from the upper part of the crystal grain to enable the solder to enter the concave part, the second end of the bridge piece is arranged on the second pin, and reflow welding is carried out to enable the concave part of the bridge piece and an electrode pad of the crystal grain to form welding; and
packaging is carried out to form a packaging body, and the packaging body wraps the die.
6. The method of claim 5, wherein the step of disposing the solder on the electrode pad surface of the die comprises:
dispensing a flux on the electrode pad surface of the die;
the solder is arranged on the soldering flux, wherein the solder is at least one solder ball.
7. A packaging method for preventing solder overflow, comprising:
preparing a wafer, which is provided with a plurality of die units, wherein the top surface of each die unit is provided with an electrode pad;
dicing the wafer to form a die in each die unit;
disposing a solder material at the center of the electrode pad surface of the die by screen printing;
sucking the die through a suction nozzle to arrange the die on a first pin, wherein a second pin is arranged opposite to the first pin at intervals;
welding a bridge piece to the electrode pad of the die and connecting the second pin; and
packaging is carried out to form a packaging body, and the packaging body wraps the die.
8. The method of claim 7, wherein in the step of soldering the bridge member to the electrode pad of the die, the bridge member has a first end and a second end, the bottom surface of the first end has a convex portion, the convex portion is abutted against the solder on the electrode pad from above the die, the second end is connected to the second pin, and reflow soldering is performed to form soldering between the convex portion and the electrode pad of the die.
9. A packaging method for preventing solder overflow, comprising:
preparing a wafer, which is provided with a plurality of die units, wherein the top surface of each die unit is provided with an electrode pad;
dicing the wafer to form a die in each die unit;
dispensing a flux at a center of an electrode pad surface of the die and disposing at least one solder ball on the flux;
sucking the die through a suction nozzle to arrange the die on a first pin, wherein a second pin is arranged opposite to the first pin at intervals;
welding a bridge piece, wherein the bridge piece comprises a first end and a second end, the bottom surface of the first end is provided with a concave part, the concave part is butted with the at least one solder ball from the upper part of the die, the at least one solder ball enters the concave part, the second end of the bridge piece is arranged on the second pin, and reflow welding is carried out, so that the concave part of the bridge piece and an electrode pad of the die are welded; and
packaging is carried out to form a packaging body, and the packaging body wraps the die.
10. The method of claim 9, wherein the bottom surface of the suction nozzle is provided with a plurality of suction holes and a groove, the groove is located at the center of the suction holes, and the positions of the suction holes correspond to the periphery of the top surface of the die.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210624193.2A CN117219606A (en) | 2022-06-02 | 2022-06-02 | Packaging element capable of preventing solder overflow and packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210624193.2A CN117219606A (en) | 2022-06-02 | 2022-06-02 | Packaging element capable of preventing solder overflow and packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117219606A true CN117219606A (en) | 2023-12-12 |
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ID=89035757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210624193.2A Pending CN117219606A (en) | 2022-06-02 | 2022-06-02 | Packaging element capable of preventing solder overflow and packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117219606A (en) |
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2022
- 2022-06-02 CN CN202210624193.2A patent/CN117219606A/en active Pending
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