CN117219533A - Liquid recovery assembly, single wafer processing apparatus and control method thereof - Google Patents
Liquid recovery assembly, single wafer processing apparatus and control method thereof Download PDFInfo
- Publication number
- CN117219533A CN117219533A CN202210626143.8A CN202210626143A CN117219533A CN 117219533 A CN117219533 A CN 117219533A CN 202210626143 A CN202210626143 A CN 202210626143A CN 117219533 A CN117219533 A CN 117219533A
- Authority
- CN
- China
- Prior art keywords
- ring
- recovery
- distance
- state
- door
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000011084 recovery Methods 0.000 title claims abstract description 190
- 239000007788 liquid Substances 0.000 title claims abstract description 127
- 238000000034 method Methods 0.000 title claims abstract description 92
- 238000012545 processing Methods 0.000 title claims abstract description 57
- 230000007246 mechanism Effects 0.000 claims abstract description 156
- 239000000758 substrate Substances 0.000 claims description 64
- 230000000630 rising effect Effects 0.000 claims description 12
- 230000001174 ascending effect Effects 0.000 claims description 8
- 238000004891 communication Methods 0.000 claims description 4
- 230000003028 elevating effect Effects 0.000 abstract description 54
- 235000012431 wafers Nutrition 0.000 description 42
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Abstract
The application discloses a liquid recovery assembly, single wafer processing equipment and a control method thereof. The liquid recovery assembly comprises a bearing table, a recovery ring, a door ring, a first lifting mechanism and a second lifting mechanism. The recovery ring is arranged at intervals with the bearing table. The first lifting mechanism is connected with the bearing table and the recovery ring. The recovery ring is moved relative to the carrying table in the vertical direction by the first elevating mechanism. The door ring is arranged on one side of the recovery ring away from the bearing table. The second lifting mechanism is connected with the door ring and the recovery ring. The door ring is moved by the second elevating mechanism in a vertical direction opposite to the recovery ring. According to the application, the recovery ring and the door ring are lifted in a two-stage mode through the two lifting mechanisms, so that the overall height difference of the liquid recovery assembly is improved.
Description
Technical Field
The present application relates to a wet processing apparatus, and more particularly, to a liquid recovery module, a single wafer processing apparatus, and a control method thereof.
Background
In the process of the semiconductor substrate, a plurality of processing steps including wet processing such as etching and cleaning are required for the element-mounting surface of the semiconductor substrate. As the process complexity of semiconductor substrates increases, a single wafer processing apparatus has been developed that includes a turntable and a recovery ring. The single wafer processing apparatus may apply a process liquid to the substrate on the turntable and collect the process liquid through the recovery ring.
In conventional single wafer processing equipment, the recovery ring employs a single lift mechanism. However, if the substrate to be processed is not a flat surface but has a bump structure in which a plurality of chips are stacked on the surface of the wafer, the process liquid may splash beyond the height of the recovery ring when the elevation of the recovery ring is insufficient, and thus may cross the recovery ring to contaminate surrounding elements. On the other hand, if the height difference of the recovery ring is increased in order to prevent the liquid from splashing, the recovery ring easily interferes with the robot arm when the recovery ring descends to the origin, thereby making it difficult for the robot arm to smoothly pick up or put in the wafer.
In view of the above, it is desirable to provide a single wafer processing apparatus that solves the above-mentioned problems
Disclosure of Invention
In order to solve the above-mentioned problems of the prior art, an object of the present application is to provide a liquid recovery module, a single wafer processing apparatus, and a control method thereof, which prevent the liquid from splashing over the recovery ring to contaminate surrounding elements by adding a door ring to the recovery ring.
To achieve the above object, the present application provides a liquid recovery assembly, comprising: a carrying platform; the recovery ring is arranged at intervals with the bearing table; a first lifting mechanism connecting the carrying table and the recovery ring, wherein the recovery ring moves relative to the carrying table along a vertical direction by the first lifting mechanism; the door ring is arranged on one side of the recovery ring, which is far away from the bearing table; and a second elevating mechanism connecting the door ring and the recovery ring, wherein the door ring is relatively moved with the recovery ring along the vertical direction by the second elevating mechanism.
In some embodiments, the first lift mechanism includes a first starting state and a first raised state, the recovery ring is spaced a first distance from the stage when the first lift mechanism is in the first starting state, and the recovery ring is spaced a second distance from the stage when the first lift mechanism is in the first raised state, wherein the second distance is greater than the first distance.
In some embodiments, the second lifting mechanism includes a second starting state and a second rising state, the door ring is a third distance from the recovery ring when the second lifting mechanism is in the second starting state, and the door ring is a fourth distance from the recovery ring when the second lifting mechanism is in the second rising state, wherein the fourth distance is greater than the third distance.
In some embodiments, the door ring is a sum of the first distance and the third distance from the carrying platform when the first lift mechanism is in the first starting state and the second lift mechanism is in the second starting state, and the door ring is a sum of the second distance and the fourth distance from the carrying platform when the first lift mechanism is in the first raised state and the second lift mechanism is in the second raised state.
The present application also provides a single wafer processing apparatus comprising: a turntable configured to place a substrate; a liquid supply device disposed above the turntable and configured to apply a process liquid to the substrate; and a liquid recovery unit disposed around the turntable and movable in a vertical direction with respect to the turntable. The liquid recovery assembly includes: a carrying platform; a recovery ring spaced from the susceptor and configured to collect the process liquid splashed from the substrate; a first lifting mechanism connecting the carrying table and the recovery ring, wherein the recovery ring moves relatively to the carrying table along the vertical direction by the first lifting mechanism; a door ring disposed on a side of the recovery ring remote from the carrier and configured to collect a portion of the process liquid sprayed outside the recovery ring past the recovery ring; and a second elevating mechanism connecting the door ring and the recovery ring, wherein the door ring is relatively moved with the recovery ring along the vertical direction by the second elevating mechanism.
In some embodiments, the level of the recovery ring and the door ring is lower than the level of the turntable when the substrate is taken and placed, and the level of the recovery ring and the door ring is higher than the level of the turntable when the turntable is rotated.
In some embodiments, the single wafer processing apparatus further comprises a first drain pipe and a second drain pipe, wherein the first drain pipe is in communication with the interior space of the recovery ring and configured to drain the process liquid collected by the recovery ring, and the second drain pipe is in communication with the interior space of the door ring and configured to drain the portion of the process liquid collected by the door ring.
In some embodiments, the first lift mechanism includes a first starting state and a first raised state, the recovery ring is spaced a first distance from the stage when the first lift mechanism is in the first starting state, and the recovery ring is spaced a second distance from the stage when the first lift mechanism is in the first raised state, wherein the second distance is greater than the first distance.
In some embodiments, the second lifting mechanism includes a second starting state and a second rising state, the door ring is a third distance from the recovery ring when the second lifting mechanism is in the second starting state, and the door ring is a fourth distance from the recovery ring when the second lifting mechanism is in the second rising state, wherein the fourth distance is greater than the third distance.
In some embodiments, the door ring is a sum of the first distance and the third distance from the carrying platform when the first lift mechanism is in the first starting state and the second lift mechanism is in the second starting state, and the door ring is a sum of the second distance and the fourth distance from the carrying platform when the first lift mechanism is in the first raised state and the second lift mechanism is in the second raised state.
In some embodiments, the first lift mechanism is in the first starting state and the second lift mechanism is in the second starting state when the substrate is picked and placed, and the first lift mechanism is in the first raised state and the second lift mechanism is in the second raised state when the turntable is rotated.
The present application also provides a control method of a single wafer processing apparatus including a rotary table, a liquid supply device, a carrier table, a recovery ring, a first elevating mechanism, a door ring, and a second elevating mechanism, and the control method includes: placing a substrate on the rotary table; the first lifting mechanism is used for controlling the recovery ring to synchronously drive the door ring to move along the vertical direction in a direction away from the bearing table; controlling the door ring to move along the vertical direction in a direction away from the recovery ring by the second lifting mechanism; and controlling the rotation of the turntable and the liquid supply device to apply a process liquid to the substrate, wherein the recovery ring is configured to collect the process liquid splashed from the substrate, and the door ring is configured to collect the process liquid partially splashed outside the recovery ring past the recovery ring.
In some embodiments, the first lift mechanism includes a first starting state and a first raised state and the second lift mechanism includes a second starting state and a second raised state, and the control method further includes, prior to placing the substrate on the turntable: the first lifting mechanism is controlled to be in the first initial state and the second lifting mechanism is controlled to be in the second initial state, so that the horizontal heights of the recovery ring and the door ring are lower than the horizontal height of the rotary table.
In some embodiments, before controlling the rotation of the turntable and controlling the liquid supply to apply the process liquid to the substrate, the control method further comprises: the first lifting mechanism is controlled to be in the first lifting state and the second lifting mechanism is controlled to be in the second lifting state, so that the horizontal heights of the recovery ring and the door ring are higher than the horizontal height of the rotary table.
In some embodiments, after controlling the rotation of the turntable and controlling the liquid supply to apply the process liquid to the substrate, the control method further comprises: controlling the rotation table to stop rotating and controlling the liquid supply device to stop applying the process liquid to the substrate; controlling the door ring to move along the vertical direction towards the direction approaching to the recovery ring through the second lifting mechanism; the first lifting mechanism is used for controlling the recovery ring to synchronously drive the door ring to move along the vertical direction towards the direction close to the bearing table; and removing the substrate from the turntable.
In some embodiments, the single wafer processing apparatus further comprises a first exhaust pipe and a second exhaust pipe, the control method further comprising: the process liquid collected by the recovery ring is discharged through the first discharge pipe and the portion of the process liquid collected by the door ring is discharged through the second discharge pipe while controlling the rotation of the turntable and the liquid supply device to apply the process liquid to the substrate.
Compared with the prior art, the single wafer processing equipment disclosed by the application has the advantages that the door ring is additionally arranged on the recovery ring, and the recovery ring and the door ring are lifted in a two-stage mode through the two lifting mechanisms, so that the overall height difference of the liquid recovery assembly is improved, and the liquid medicine is prevented from splashing beyond the upper part of the recovery ring to pollute the equipment.
Drawings
The technical solution and other advantageous effects of the present application will be made apparent by the following detailed description of the specific embodiments of the present application with reference to the accompanying drawings.
FIG. 1 shows a first schematic view of a single wafer processing apparatus according to an embodiment of the present application;
FIG. 2 shows a second schematic view of a single wafer processing apparatus according to an embodiment of the present application;
fig. 3 shows a third schematic view of a single wafer processing apparatus according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application.
Referring to fig. 1 to 3, fig. 1 shows a first schematic view of a single wafer processing apparatus according to an embodiment of the present application, fig. 2 shows a second schematic view of the single wafer processing apparatus according to an embodiment of the present application, and fig. 3 shows a third schematic view of the single wafer processing apparatus according to an embodiment of the present application. The single wafer processing apparatus 1 includes a rotary table 10, a liquid supply device 20, and a liquid recovery assembly 30. The turntable 10 is configured to hold a substrate 50. In the present application, the single wafer processing apparatus 1 is suitable for wet processing of single wafers, particularly, single wafers having a bump structure on the surface. For example, the substrate 50 includes a 3D-IC Chip 52 and a Wafer 51 (Chip on Wafer) bonded, so that the surface to be processed of the substrate 50 has a plurality of bump structures formed with the 3D-IC Chip 52. The bump structure on the surface aggravates the splashing degree of the process liquid when the substrate 50 is wet processed. The single wafer processing apparatus 1 of the present application can reliably recover splashed process liquid to avoid the process liquid from splashing to surrounding equipment, as described in detail below.
As shown in fig. 1, in the present embodiment, after the substrate 50 is placed on the turntable 10, the substrate 50 may be further fixed on the turntable 10, for example, by using a vacuum chuck or a clamping device. The rotary table 10 is provided with a driving mechanism for driving the rotary table 10 to rotate around the axis. Further, a liquid supply device 20 is provided above the turntable 10 for applying a process liquid to the substrate 50. Alternatively, the liquid chemical supply rotary cantilever of the liquid supply apparatus 20 may include one or more nozzles such that the liquid supply apparatus 20 may apply one or more process liquids to the substrate 50. The nozzles are arranged in alignment with the top of the turntable 10 and one end of the liquid transfer line is connected to the corresponding nozzle and the other end is connected to the corresponding supply of process liquid. With this design, the liquid supply device 20 can be controlled to apply the corresponding process liquid to the substrate 50 on the turntable 10 according to the process requirements, so as to perform etching or cleaning operations on the substrate 50.
As shown in fig. 1 to 3, the liquid recovery assembly 30 is disposed circumferentially around the rotary table 10 and is movable in a vertical direction with respect to the rotary table 10. The liquid recovery assembly 30 serves to collect the process liquid thrown out of the surface of the substrate 50 on the turntable 10 by centrifugal force and discharge the process liquid. The liquid recovery assembly 30 includes a carrier 31, a recovery ring 32, a door ring 33, a first lift mechanism 34, and a second lift mechanism 35. As shown in fig. 3, the recovery ring 32 is spaced apart from the susceptor 31 and is configured to collect a substantial portion of the process liquid 21 splashed from the substrate 50. The door ring 33 is disposed on a side of the recovery ring 32 that is remote from the carrier 31 and is configured to collect the remaining portion of the process liquid 22 that is sprayed outside the recovery ring 32 past the recovery ring 32. In this embodiment, the top of the recovery ring 32 contains a centrally inclined shielding wall, and the top of the door ring 33 also contains a centrally inclined shielding wall. By the design of the shielding wall, splashed liquid can be effectively blocked, and the liquid is driven to flow downwards along the inclined shielding wall.
As shown in fig. 1-3, the first lift mechanism 34 includes a first starting state and a first rising state, and the second lift mechanism 35 includes a second starting state and a second rising state. The first elevating mechanism 34 connects the carrier 31 and the recovery ring 32. The recovery ring 32 is moved by the first elevating mechanism 34 in a vertical direction opposite to the stage 31. The second elevating mechanism 35 connects the door ring 33 and the recovery ring 32. The door ring 33 is moved by the second elevating mechanism 35 in a vertical direction opposite to the recovery ring 32. It should be noted that when the first lifting mechanism 34 is lifted, the recovery ring 32 moves the door ring 33 together.
As shown in fig. 1, when the first lifting mechanism 34 is in the first starting state, the recovery ring 32 is separated from the carrying table 31 by a first distance D1. As shown in fig. 2 and 3, when the first lifting mechanism 34 is in the first lifted state, the recovery ring 32 is separated from the carrying table 31 by a second distance D2. The second distance D2 is greater than the first distance D1. In some embodiments, the difference between the second distance D2 and the first distance D1 is 60mm.
As shown in fig. 1 and 2, when the second elevating mechanism 35 is in the second starting state, the door ring 33 is spaced apart from the recovery ring 32 by a third distance D3. As shown in fig. 3, when the second elevating mechanism 35 is in the second elevated state, the door ring 33 is spaced from the recovery ring 32 by a fourth distance D4. The fourth distance D4 is greater than the third distance D3. In some embodiments, the difference between the fourth distance D4 and the third distance D3 is 30mm.
As shown in fig. 1, when the first elevating mechanism 34 is in the first start state and the second elevating mechanism 35 is in the second start state, the distance between the door ring 33 and the carrying table 31 is the sum of the first distance D1 and the third distance D3. As shown in fig. 3, when the first elevating mechanism 34 is in the first elevated state and the second elevating mechanism 35 is in the second elevated state, the door ring 33 is separated from the carrying table 31 by the sum of the second distance D2 and the fourth distance D4.
As shown in fig. 1, when the substrate 50 is taken from the turntable 10, the first elevating mechanism 34 is in the first initial state and the second elevating mechanism 35 is in the second initial state. At this time, the door ring 33 and the recovery ring 32 are both lower in level than the table top of the turntable 10 on which the substrate 50 is placed. It should be noted that when the door ring 33 and the recovery ring 32 are lowered to the lowest point (i.e., the first elevating mechanism 34 is in the first initial state and the second elevating mechanism 35 is in the second initial state), the robot arm can smoothly grip or insert the substrate 50 without being blocked by the door ring 33 and the recovery ring 32. That is, the robotic arm does not interfere structurally with the fluid recovery assembly 30 as it traverses.
As shown in fig. 2, when the substrate 50 to be processed is placed on the turntable 10, the first elevating mechanism 34 starts to ascend such that the first elevating mechanism 34 is in the first ascending state and the second elevating mechanism 35 is in the second starting state. At this time, the door ring 33 and the recovery ring 32 are both higher in level than the table top of the turntable 10.
As shown in fig. 3, after the first elevating mechanism 34 is raised, the second elevating mechanism 35 starts to be raised, so that the first elevating mechanism 34 is in the first raised state and the second elevating mechanism 35 is in the second raised state. At this time, the door ring 33 and the recovery ring 32 are also higher than the table top of the turntable 10. Furthermore, when the second elevating mechanism 35 is elevated, the distance between the recovery ring 32 and the turntable 10 is unchanged, and the door ring 33 further increases the distance from the turntable 10 as compared to the recovery ring 32. By lifting the height of the door ring 33, the overall height differential of the liquid recovery assembly 30 (i.e., the height differential of the door ring 33 and the recovery ring 32) can be increased, ensuring that process liquid 22 splashed past above the recovery ring 32 can be collected by the door ring 33 without contaminating surrounding equipment. Generally, existing single wafer processing equipment includes only a single lift mechanism and a recovery ring. When the elevation of the recovery ring is insufficient, the liquid is liable to splash beyond the height of the recovery ring, and further splashes from above the recovery ring to contaminate surrounding equipment. In contrast to existing single wafer processing equipment, the single wafer processing equipment of the present application ensures that process liquid 22 splashed over the recovery ring 32 can be collected by the door ring 33 without contaminating surrounding equipment.
In the present embodiment, as shown in fig. 3, after both the first and second elevating mechanisms 34 and 35 are elevated, the turntable 10 starts rotating and the liquid supply apparatus 20 starts applying the process liquid to the substrate 50. That is, when the turntable 10 rotates, the first elevating mechanism 34 is in the first elevated state and the second elevating mechanism 35 is in the second elevated state.
As shown in fig. 1 to 3, the single wafer processing apparatus 1 further includes a first exhaust pipe 41 and a second exhaust pipe 42. The first drain pipe 41 communicates with the inner space of the recovery ring 32 and is configured to drain the process liquid collected by the recovery ring 32. The second drain pipe 42 communicates with the inner space of the door ring 33 and is configured to drain a portion of the process liquid collected by the door ring 33. After the process liquid sprayed from the liquid supply device 20 is stopped by the recovery ring 32 and the door ring 33, the process liquid directly flows downward along the inside of the recovery ring 32 and the door ring 33 and is collected to the bottom of the chamber space, and is then discharged or recovered by the first discharge pipe 41 and the second discharge pipe 42 connected to the bottom of the respective chamber spaces, respectively.
The embodiment of the application also provides a control method of the single wafer processing equipment. The single wafer processing apparatus of the present embodiment includes the single wafer processing apparatus 1 described above. The single wafer processing apparatus 1 includes the rotary table 10, the liquid supply device 20, the carrier 31, the recovery ring 32, the door ring 33, the first lifting mechanism 34, and the second lifting mechanism 35, and the specific structures of the plurality of elements are described above and are not described here. The control method of the single wafer processing apparatus of the present application includes the following steps.
First, as shown in fig. 1, a substrate 50 is placed on a turntable 10. In the present embodiment, the first elevating mechanism 34 includes a first initial state and a first rising state, and the second elevating mechanism 35 includes a second initial state and a second rising state. Before the substrate 50 is taken from the turntable 10, the first elevating mechanism 34 is controlled to be in the first start state and the second elevating mechanism 35 is controlled to be in the second start state. At this time, the levels of the door ring 33 and the recovery ring 32 are lower than the table top of the turntable 10 for placing the substrate 50 (i.e., the level of the turntable 10). It should be noted that when the door ring 33 and the recovery ring 32 are lowered to the lowest point, the first elevating mechanism 34 is in the first initial state and the second elevating mechanism 35 is in the second initial state. Therefore, the robot arm can smoothly grip or insert the substrate 50 without being blocked by the door ring 33 and the recovery ring 32. That is, the robotic arm does not interfere structurally with the fluid recovery assembly 30 as it traverses.
As shown in fig. 2, after the substrate 50 is fixed on the turntable 10, the first lifting mechanism 34 controls the recovery ring 32 to synchronously drive the door ring to move along the vertical direction in a direction away from the carrying table 31. In this step, the first elevating mechanism 34 starts to ascend such that the first elevating mechanism 34 is in the first ascending state and the second elevating mechanism 35 is in the second starting state. At this time, the door ring 33 and the recovery ring 32 are both higher in level than the table top of the turntable 10.
As shown in fig. 3, after the first elevating mechanism 34 is elevated, the door ring 33 is controlled to move in the vertical direction away from the recovery ring 32 by the second elevating mechanism 35. In this step, the second elevating mechanism 35 starts to ascend such that the first elevating mechanism 34 is in the first ascending state and the second elevating mechanism 35 is in the second ascending state. At this time, the door ring 33 and the recovery ring 32 are also higher than the table top of the turntable 10. Furthermore, when the second elevating mechanism 35 is elevated, the distance between the recovery ring 32 and the turntable 10 is unchanged, and the door ring 33 further increases the distance from the turntable 10 as compared to the recovery ring 32.
As shown in fig. 3, when both the first and second elevating mechanisms 34 and 35 are elevated, the rotation of the turntable 10 is controlled and the liquid supply apparatus 20 is controlled to apply the process liquid to the substrate 50. That is, before the rotation of the turntable 10 is controlled and the liquid supply device 20 is controlled to apply the process liquid to the substrate 50, the first elevating mechanism 34 is controlled to be in the first elevating state and the second elevating mechanism 35 is controlled to be in the second elevating state so that the horizontal height of the edges of the recovery ring 32 and the door ring 33 is higher than the horizontal height of the turntable 10. The recovery ring 32 is configured to collect a substantial portion of the process liquid 21 splashed from the substrate 50 as the turntable 10 rotates. The door ring 33 is configured to collect the remaining portion of the process liquid 22 that is sprayed outside the recovery ring 32 past the recovery ring 32. In this step, the overall height difference of the liquid recovery assembly 30 (i.e., the height difference between the door ring 33 and the recovery ring 32) is increased due to the further elevation of the door ring 33, thereby ensuring that the process liquid 22 splashed over the recovery ring 32 can be collected by the door ring 33 without causing contamination of surrounding equipment. Generally, existing single wafer processing equipment includes only a single lift mechanism and a recovery ring. When the elevation of the recovery ring is insufficient, the liquid is liable to splash beyond the height of the recovery ring, and further splashes from above the recovery ring to contaminate surrounding equipment. In contrast to existing single wafer processing equipment, the single wafer processing equipment of the present application ensures that process liquid 22 splashed over the recovery ring 32 can be collected by the door ring 33 without contaminating surrounding equipment.
As shown in fig. 1 to 3, the single wafer processing apparatus 1 further includes a first exhaust pipe 41 and a second exhaust pipe 42. The first drain pipe 41 communicates with the inner space of the recovery ring 32 and is configured to drain the process liquid collected by the recovery ring 32. The second drain pipe 42 communicates with the inner space of the door ring 33 and is configured to drain a portion of the process liquid collected by the door ring 33. That is, when the rotation of the rotation table 10 is controlled and the liquid supply device 20 is controlled to apply the process liquid to the substrate 50, the process liquid collected by the recovery ring 32 is discharged through the first discharge pipe row 41, and a portion of the process liquid collected by the door ring 33 is discharged through the second discharge pipe 42. After the process liquid sprayed from the liquid supply device 20 is stopped by the recovery ring 32 and the door ring 33, the process liquid directly flows downward along the inside of the recovery ring 32 and the door ring 33 and is collected to the bottom of the chamber space, and is then discharged or recovered by the first discharge pipe 41 and the second discharge pipe 42 connected to the bottom of the respective chamber spaces, respectively.
After the wet processing of the substrate 50 is completed, the turntable 10 is controlled to stop rotating and the liquid supply device 20 is controlled to stop applying the process liquid to the substrate 50. Next, as shown in fig. 2, the door ring 33 is controlled to move in the vertical direction toward the recovery ring 32 by the second elevating mechanism 35. Then, as shown in fig. 1, the first lifting mechanism 34 controls the recovery ring 32 to synchronously drive the door ring 33 to move along the vertical direction towards the direction approaching the carrying table 31. Finally, the substrate 50 is removed from the turntable 10 by a robot arm.
In the liquid recovery module, the single wafer processing apparatus, and the control method thereof of the present application, the recovery ring and the door ring are lifted in two stages by the two lifting mechanisms, compared to the prior art. When the recovery ring and door ring are raised, the overall height differential of the liquid recovery assembly is increased to ensure that process liquid splashed past over the recovery ring can be collected by the door ring without causing contamination of surrounding equipment. When the recovery ring and the door ring descend, the mechanical arm can smoothly clamp or put the substrate, and the substrate cannot be blocked by the door ring and the recovery ring.
The above description is provided for the details of a liquid recovery assembly, a single wafer processing apparatus and a control method thereof, and specific examples are applied to illustrate the principles and implementation of the present application, and the above description of the examples is only for helping to understand the technical solution and core idea of the present application. Those of ordinary skill in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some of the technical features thereof can be replaced by equivalents. Such modifications and substitutions do not depart from the spirit of the application.
Claims (16)
1. A liquid recovery assembly, the liquid recovery assembly comprising:
a carrying platform;
the recovery ring is arranged at intervals with the bearing table;
a first lifting mechanism connecting the carrying table and the recovery ring, wherein the recovery ring moves relative to the carrying table along a vertical direction by the first lifting mechanism;
the door ring is arranged on one side of the recovery ring, which is far away from the bearing table; and
and a second lifting mechanism connecting the door ring and the recovery ring, wherein the door ring moves relatively to the recovery ring along the vertical direction by the second lifting mechanism.
2. The liquid recovery assembly of claim 1, wherein the first lift mechanism comprises a first starting state and a first ascending state, the recovery ring being spaced a first distance from the stage when the first lift mechanism is in the first starting state, and the recovery ring being spaced a second distance from the stage when the first lift mechanism is in the first ascending state, wherein the second distance is greater than the first distance.
3. The liquid recovery assembly of claim 2, wherein the second lift mechanism comprises a second starting state and a second rising state, the door ring being spaced a third distance from the recovery ring when the second lift mechanism is in the second starting state, and the door ring being spaced a fourth distance from the recovery ring when the second lift mechanism is in the second rising state, wherein the fourth distance is greater than the third distance.
4. The liquid recovery assembly of claim 3 wherein the door ring is a sum of the first distance and the third distance from the load carrier when the first lift mechanism is in the first starting state and the second lift mechanism is in the second starting state, and wherein the door ring is a sum of the second distance and the fourth distance from the load carrier when the first lift mechanism is in the first raised state and the second lift mechanism is in the second raised state.
5. A single wafer processing apparatus, comprising:
a turntable configured to place a substrate;
a liquid supply device disposed above the turntable and configured to apply a process liquid to the substrate; and
and a liquid recovery assembly circumferentially disposed around the rotary table and movable relative thereto along a vertical direction, wherein the liquid recovery assembly includes:
a carrying platform;
a recovery ring spaced from the susceptor and configured to collect the process liquid splashed from the substrate;
a first lifting mechanism connecting the carrying table and the recovery ring, wherein the recovery ring moves relatively to the carrying table along the vertical direction by the first lifting mechanism;
a door ring disposed on a side of the recovery ring remote from the carrier and configured to collect a portion of the process liquid sprayed outside the recovery ring past the recovery ring; and
and a second lifting mechanism connecting the door ring and the recovery ring, wherein the door ring moves relatively to the recovery ring along the vertical direction by the second lifting mechanism.
6. The single wafer processing apparatus of claim 5, wherein the recovery ring and the door ring have a level lower than a level of the turntable when the substrate is taken and placed, and a level higher than a level of the turntable when the turntable is rotated.
7. The single wafer processing apparatus of claim 5, further comprising a first drain and a second drain, wherein the first drain is in communication with an interior space of the recovery ring and configured to drain the process liquid collected by the recovery ring, and the second drain is in communication with an interior space of the door ring and configured to drain the portion of the process liquid collected by the door ring.
8. The single wafer processing apparatus of claim 5, wherein the first lift mechanism comprises a first starting state and a first ascending state, the recovery ring being spaced a first distance from the susceptor when the first lift mechanism is in the first starting state, and the recovery ring being spaced a second distance from the susceptor when the first lift mechanism is in the first ascending state, wherein the second distance is greater than the first distance.
9. The single wafer processing apparatus of claim 8, wherein the second lift mechanism comprises a second starting state and a second rising state, the door ring being spaced a third distance from the recovery ring when the second lift mechanism is in the second starting state, and the door ring being spaced a fourth distance from the recovery ring when the second lift mechanism is in the second rising state, wherein the fourth distance is greater than the third distance.
10. The single wafer processing apparatus of claim 9, wherein the door ring is a sum of the first distance and the third distance from the carrier when the first lift mechanism is in the first starting state and the second lift mechanism is in the second starting state, and wherein the door ring is a sum of the second distance and the fourth distance from the carrier when the first lift mechanism is in the first raised state and the second lift mechanism is in the second raised state.
11. The single wafer processing apparatus of claim 9, wherein the first lift mechanism is in the first starting state and the second lift mechanism is in the second starting state when the substrate is taken and placed, and wherein the first lift mechanism is in the first raised state and the second lift mechanism is in the second raised state when the turntable rotates.
12. A control method of a single wafer processing apparatus, the single wafer processing apparatus including a rotary table, a liquid supply device, a carrier table, a recovery ring, a first lifting mechanism, a door ring, and a second lifting mechanism, the control method comprising:
placing a substrate on the rotary table;
the first lifting mechanism is used for controlling the recovery ring to synchronously drive the door ring to move along the vertical direction in a direction away from the bearing table;
controlling the door ring to move along the vertical direction in a direction away from the recovery ring by the second lifting mechanism; and
controlling the rotation of the turntable and controlling the liquid supply to apply a process liquid to the substrate, wherein the recovery ring is configured to collect the process liquid splashed from the substrate, and the door ring is configured to collect the process liquid partially splashed outside the recovery ring past the recovery ring.
13. The method of controlling a single wafer processing apparatus of claim 12, wherein the first lift mechanism comprises a first start state and a first lift state and the second lift mechanism comprises a second start state and a second lift state, and wherein prior to placing the substrate on the turntable, the method further comprises:
the first lifting mechanism is controlled to be in the first initial state and the second lifting mechanism is controlled to be in the second initial state, so that the horizontal heights of the recovery ring and the door ring are lower than the horizontal height of the rotary table.
14. The control method of the single wafer processing apparatus according to claim 13, wherein before controlling the rotation of the turntable and controlling the liquid supply device to apply the process liquid to the substrate, the control method further comprises:
the first lifting mechanism is controlled to be in the first lifting state and the second lifting mechanism is controlled to be in the second lifting state, so that the horizontal heights of the recovery ring and the door ring are higher than the horizontal height of the rotary table.
15. The method of controlling a single wafer processing apparatus according to claim 12, wherein after controlling rotation of the turntable and controlling the liquid supply device to apply the process liquid to the substrate, the method further comprises:
controlling the rotation table to stop rotating and controlling the liquid supply device to stop applying the process liquid to the substrate;
controlling the door ring to move along the vertical direction towards the direction approaching to the recovery ring through the second lifting mechanism;
the first lifting mechanism is used for controlling the recovery ring to synchronously drive the door ring to move along the vertical direction towards the direction close to the bearing table; and
and removing the substrate from the rotary table.
16. The method of controlling a single wafer processing apparatus of claim 12, wherein the single wafer processing apparatus further comprises a first exhaust pipe and a second exhaust pipe, the method further comprising:
the process liquid collected by the recovery ring is discharged through the first discharge pipe and the portion of the process liquid collected by the door ring is discharged through the second discharge pipe while controlling the rotation of the turntable and the liquid supply device to apply the process liquid to the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210626143.8A CN117219533A (en) | 2022-06-02 | 2022-06-02 | Liquid recovery assembly, single wafer processing apparatus and control method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210626143.8A CN117219533A (en) | 2022-06-02 | 2022-06-02 | Liquid recovery assembly, single wafer processing apparatus and control method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117219533A true CN117219533A (en) | 2023-12-12 |
Family
ID=89049754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210626143.8A Pending CN117219533A (en) | 2022-06-02 | 2022-06-02 | Liquid recovery assembly, single wafer processing apparatus and control method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117219533A (en) |
-
2022
- 2022-06-02 CN CN202210626143.8A patent/CN117219533A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5375871B2 (en) | Liquid processing apparatus, liquid processing method, and storage medium storing computer program | |
| JP4532508B2 (en) | Substrate processing equipment | |
| JP5270251B2 (en) | Substrate processing equipment | |
| JP4763567B2 (en) | Substrate processing equipment | |
| JP6010398B2 (en) | Substrate processing equipment | |
| KR101035983B1 (en) | Single type substrate treating apparatus and method of exhausting in the apparatus | |
| KR101899165B1 (en) | Liquid processing apparatus | |
| KR101623412B1 (en) | Apparatus and Method for treating substrate | |
| JP4850952B2 (en) | Liquid processing apparatus, liquid processing method, and storage medium | |
| JP3837017B2 (en) | Substrate processing apparatus, substrate processing method, and substrate processing apparatus cleaning method | |
| CN111146074A (en) | Substrate processing method and substrate processing apparatus | |
| JP4146709B2 (en) | Substrate processing equipment | |
| JP3917384B2 (en) | Substrate processing apparatus and substrate cleaning apparatus | |
| JP6238741B2 (en) | Substrate processing method and substrate processing apparatus | |
| CN117219533A (en) | Liquid recovery assembly, single wafer processing apparatus and control method thereof | |
| CN217426691U (en) | Liquid recovery module and single wafer processing apparatus | |
| JP4685022B2 (en) | System for processing workpieces | |
| JP2002332597A (en) | Solution treatment apparatus and solution treatment method | |
| JP2009158564A (en) | Substrate treatment apparatus and substrate treatment method | |
| TWM632763U (en) | Liquid recycle assembly and single wafer processing equipment | |
| JP4504859B2 (en) | Substrate processing equipment | |
| TW202349474A (en) | Liquid recycle assembly, single wafer processing equipment and control method thereof | |
| CN218887160U (en) | Single-wafer rotary cleaning equipment with soaking, cleaning and etching functions | |
| JP2022080274A (en) | Spin rinse dryer with improved drying characteristics | |
| JP4791068B2 (en) | Substrate processing equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |