CN117206716A - Fitting method, terminal and medium for XY axis moving path of PCB laser drilling machine - Google Patents
Fitting method, terminal and medium for XY axis moving path of PCB laser drilling machine Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 87
- 238000005553 drilling Methods 0.000 title claims abstract description 80
- 238000004364 calculation method Methods 0.000 claims abstract description 19
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
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- 238000004080 punching Methods 0.000 description 1
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Abstract
The application discloses a fitting method, a terminal and a medium of an XY axis moving path of a PCB laser drilling machine, wherein the fitting method comprises the steps of sequentially obtaining a point n on a path to be drilled i And first boundary information, wherein the first boundary information includes x min 、x max 、y min 、y max The method comprises the steps of carrying out a first treatment on the surface of the According to point n i Coordinates (x) i ,y i ) And first boundary information, determining second boundary information, the second boundary information including x 2min 、x 2max 、y 2min 、y 2max The method comprises the steps of carrying out a first treatment on the surface of the When the boundary size in the second boundary information does not exceed the preset size, the point n is determined i Coordinates (x) i ,y i ) Updating the first boundary information; when edges in the second boundary informationThe boundary size exceeds the preset size, and according to the first boundary information, a fitting point is calculated; and when the points on the path to be drilled are traversed, outputting an XY axis moving path according to all the fitting points obtained through calculation.
Description
Technical Field
The application belongs to the technical field of electronics, and particularly relates to a fitting method, a terminal and a medium of an XY axis moving path of a PCB laser drilling machine.
Background
PCB (Pr inted Ci rcu it Board) the Chinese name printed circuit board, also called printed circuit board, is an important electronic component, is a support for electronic components, and is a carrier for electrically interconnecting electronic components. It is called a "printed" circuit board because it is made using electronic printing.
In the PCB processing process, a drilling process of the copper plate is included, and the process is completed by adopting a multi-axis linkage laser drilling machine. In the processing process of the copper plate, the main time-consuming steps comprise punching the point to be processed of the laser-ablated copper plate and laser moving time, wherein the laser moving time is related to the length of a drilling path, the speed, the acceleration and the like of laser moving.
Referring to fig. 1, reference numeral 1 in fig. 1 is a lens set, reference numeral 2 is a laser cavity, reference numeral 3 is a laser drilling platform (on which a flexible plate to be processed is placed), and reference numeral 4 is a scope of processing of a galvanometer axis. The moving part of the laser drilling machine is divided into two parts, namely AB axis movement (hereinafter referred to as a vibrating mirror axis) in the vibrating mirror device and XY axis movement of the laser drilling machine, wherein the vibrating mirror device (hereinafter referred to as a vibrating mirror) integrally moves relative to the laser drilling platform 3 through the XY axis movement, namely relative to a flexible plate to be processed, and after the laser is driven to a processing point position by the vibrating mirror device, the laser emits laser through the laser cavity 2 to process a copper plate through the vibrating mirror axis movement in the vibrating mirror device. Since the movable range of the vibrating mirror shaft is limited by the inclination angle of the laser, the movement range cannot exceed a certain limit, and a square range (such as the vibrating mirror shaft processing range 4 in fig. 1) is usually preset to be formed on the laser drilling platform 3, that is, a square range is formed on the flexible board to be processed during production. Fig. 1 also shows a lens package 1 or the like for use with moving parts of a laser drilling machine, which is not described in detail here.
In the traditional processing method, the XY axis and the vibrating mirror axis of the laser drilling machine are independent in movement during processing, namely, the XY axis firstly moves the vibrating mirror to a certain fixed position relative to the platform, then the vibrating mirror is processed at the position through the movement of the vibrating mirror axis, and when the point positions which can be processed by the vibrating mirror axis (namely, all the point positions to be processed in the preset processing range of the laser drilling platform) are processed, the XY axis moves the vibrating mirror to the next position again, and the process is continued until the processing of all the point positions is completed. The method has lower efficiency in actual production.
In order to improve the operation efficiency of the laser drilling machine, a method of linkage of the vibrating mirror shaft and the XY shaft is required, which can be roughly described as that the XY shaft and the vibrating mirror shaft move simultaneously and continuously process along a pre-input hole site path. The XY axis motion speed is low, the acceleration is small, the error is large, and the vibrating mirror axis motion speed is high, the acceleration is large, and the error is small. In order to ensure the processing quality of the copper plate, the PCB laser drilling machine should reasonably plan the movement of the XY axis when processing, so that the vibrating mirror bearing arm moves more as much as possible to reduce the precision error caused by the movement and improve the processing efficiency of laser drilling. In the existing big data algorithm, there are many methods how to determine that a path planned by a certain method is an optimal path, in the prior art, the planned path is input into a laser drilling machine and is determined by the actual operation of the machine, but the method not only needs repeated shutdown operation to determine whether the input path meets the requirement, but also cannot intuitively observe the running track of the planned path on site (the running data of the machine needs to be derived and special software is used for opening the data), so that the efficiency is low, the reaction speed is low, and meanwhile, the production is seriously influenced. Therefore, a method is necessary to perform offline fitting on the path planning sequence input in advance, and simultaneously, the running track of the XY axes can be intuitively observed, so that real-time guidance is provided for optimization of the path planning, and the fitting must be consistent with the actual running track of the machine. However, the prior art lacks a method of fitting the XY axis movement path of a PCB laser drilling machine.
Disclosure of Invention
Therefore, the application provides a fitting method, a terminal and a medium for an XY axis moving path of a PCB laser drilling machine, and aims to solve the technical problem that the fitting method for the XY axis moving path of the PCB laser drilling machine is lacking in the prior art.
In order to solve the technical problems, the application provides a fitting method of an XY axis moving path of a PCB laser drilling machine, comprising the following steps:
sequentially acquiring a point n on a path to be drilled i And first boundary information, wherein the first boundary information includes x min 、x max 、y min 、y max ；
According to point n i Coordinates (x) i ,y i ) And first boundary information, determining second boundary information, the second boundary information including x 2min 、x 2max 、y 2min 、y 2max ；
When the boundary size in the second boundary information does not exceed the preset size, the point n is determined i Coordinates (x) i ,y i ) Updating the first boundary information;
when the boundary size in the second boundary information exceeds the preset size, calculating fitting points according to the first boundary information;
and when the points on the path to be drilled are traversed, outputting an XY axis moving path according to all the fitting points obtained through calculation.
Preferably, in the fitting method of the XY axis moving path of the PCB laser drilling machine, the step of when the boundary size in the second boundary information exceeds a preset size includes:
when the boundary size of the second boundary information is larger than Yu Zhenjing, the maximum machining range of the shaft on the laser drilling platform is half.
Preferably, in the fitting method of the XY axis movement path of the PCB laser drilling machine, the reference point n i Coordinates (x) i ,y i ) And the first boundary information, in the step of determining the second boundary information, a calculation formula of the second boundary information is as follows:
x 2min ＝min{x i ，x min }、x 2max ＝max{x i ，x max }、y 2min ＝min{y i ，y min }、y 2max ＝max{y i ，x max }；
correspondingly, the boundary dimension in the second boundary information is s ize=max { x } 2max -x 2min ，y 2max -y 2min }。
Preferably, in the fitting method of the XY axis moving path of the PCB laser drilling machine, when the boundary size in the second boundary information does not exceed the preset size, the point n will be based on i Coordinates (x) i ,y i ) The step of updating the first boundary information includes:
when the boundary size in the second boundary information does not exceed the preset size, updating the first boundary information, wherein the calculation formula is as follows:
updated x min ＝min{x i ，x min }、x max ＝max{x i ，x max }、y min ＝min{y i ，y min }、y max ＝max{y i ，x max }。
Preferably, in the fitting method of the XY axis moving path of the PCB laser drilling machine, after the step of calculating the fitting point according to the first boundary information when the boundary size in the second boundary information exceeds the preset size, the fitting method further includes, before the step of outputting the XY axis moving path according to all the fitting points obtained by the calculation after the step of traversing the points on the path to be drilled:
according to point n i Coordinates (x) i ,y i ) Initializing the first boundary information.
Preferably, in the fitting method of the XY axis moving path of the PCB laser drilling machine, when the boundary size in the second boundary information exceeds the preset size, a calculation formula of the fitting point in the step of calculating the fitting point according to the first boundary information is:
wherein, (x) j ，y j ) The coordinates of the j-th fitting point are j, which is a positive integer from 1.
Preferably, in the fitting method of the XY axis moving path of the PCB laser drilling machine, the step of outputting the XY axis moving path according to all the fitting points obtained by calculation when the points on the path to be drilled are traversed includes:
and when the points on the path to be drilled are traversed, obtaining an ordered XY axis moving path according to the sequence of obtaining the fitting points.
Preferably, in the fitting method of the XY axis moving path of the PCB laser drilling machine, the sequentially acquiring a point n on the path to be drilled i And prior to the step of first boundary information, the fitting method further comprises:
initializing first boundary information, x min ＝y min ＝+∞，x max ＝y max ＝-∞。
In order to achieve the above object, the present application provides a terminal comprising:
at least one processor; the method comprises the steps of,
a memory communicatively coupled to the at least one processor; wherein,
the memory stores instructions executable by the at least one processor to enable the at least one processor to perform the method of fitting an XY axis movement path of a PCB laser drilling machine described above.
In order to achieve the above object, the present application provides a computer readable storage medium storing a computer program, wherein the computer program, when executed by a processor, implements the above-mentioned method for fitting an XY axis movement path of a PCB laser drilling machine.
The technical scheme provided by the application has the following advantages:
the fitting method of the XY axis moving path of the PCB laser drilling machine comprises the steps of sequentially obtaining a point n on a path to be drilled i And first boundary information, wherein the first boundary information includes x min 、x max 、y min 、y max The method comprises the steps of carrying out a first treatment on the surface of the According to point n i Coordinates (x) i ,y i ) And first boundary information, determining second boundary information, the second boundary information including x 2min 、x 2max 、y 2min 、y 2max The method comprises the steps of carrying out a first treatment on the surface of the And then when the boundary size in the second boundary information does not exceed the preset size, the point n is determined i Coordinates (x) i ,y i ) Updating the first boundary information; then when the boundary size in the second boundary information exceeds the preset size, calculating a fitting point according to the first boundary information; finally, when points on the path to be drilled are traversed, outputting an XY axis moving path according to all the fitting points obtained through calculation, so that the XY axis moving path of the PCB laser drilling machine can be accurately simulated, the path form and length of the XY axis moving are conveniently estimated, and the path planning of drilling is better assisted;
further, points on a path to be drilled are sequentially traversed, a plurality of fitting points are established on the PCB laser drilling machine in the traversing process, the fitting points are sequentially connected, and the obtained track is regarded as an XY axis movement track of the laser drilling machine.
Furthermore, the fitting method of the XY axis moving path of the PCB laser drilling machine provided by the application realizes that the path of the center of the vibrating mirror axis is found through the point of the path to be drilled, thus the XY axis moving path which is consistent with the actual running track of the machine can be accurately fitted, real-time guidance is provided for the optimization of the XY axis moving path, the movement of the XY axis is convenient to adjust and optimize, the XY bearing can move more, the length of the moving path of the XY axis and the upper limit of the acceleration during the movement are reasonably controlled, and the repeated path is avoided as much as possible, so that the movement of the XY axis and the XY axis is convenient to reasonably plan; without the need to repeatedly verify by inputting the path into the laser drilling machine, through the actual operation of the machine. Moreover, the moving path of the XY axis can be intuitively observed through fitting, and further, the difference and the advantages and disadvantages of different methods on the moving path of the XY axis can be intuitively compared, so that the method is quick, simple and convenient.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present application, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a moving part of a PCB laser drilling machine;
FIG. 2 is a schematic diagram of the original path of a PCB borehole;
FIG. 3 is a schematic diagram of an embodiment of a method for fitting XY axis movement paths of a PCB laser drilling machine according to the present application;
FIG. 4 is a schematic diagram of an embodiment of a path after fitting using the method for fitting the XY axis movement path of the PCB laser drilling machine of the present application;
FIG. 5 is a schematic illustration of the actual path of travel of the PCB laser drilling machine;
FIG. 6 is a schematic diagram of a first embodiment of a method of fitting the XY axis movement path of the PCB laser drilling machine of the present application;
fig. 7 is a schematic diagram of a terminal according to the present application.
The achievement of the objects, functional features and advantages of the present application will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present application will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the application are shown. The application will be described in detail hereinafter with reference to the drawings in conjunction with embodiments. It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.
In the present application, unless otherwise indicated, terms of orientation such as "upper, lower, top, bottom" are used generally with respect to the orientation shown in the drawings or with respect to the component itself in the vertical, upright or gravitational direction; also, for ease of understanding and description, "inner and outer" refers to inner and outer relative to the profile of each component itself, but the above-mentioned orientation terms are not intended to limit the present application.
Implementation details of the fitting method of the XY axis movement path of the PCB laser drilling machine according to the first embodiment of the present application are described below, and the following details are provided only for easy understanding, and are not necessary to implement the present embodiment.
The specific flow of this embodiment is shown in fig. 6, and specifically includes:
step S100, sequentially acquiring a point n on the path to be drilled i And first boundary information, wherein the first boundary information includes x min 、x max 、y min 、y max ；
It should be understood that the path to be drilled is t= { n 1 ，n 2 ，……，n k N is }, where n i Is the i-th point on the path T. Sequentially acquiring a point n on a path to be drilled i I.e. the points in T are acquired in the order i=1, 2, … …, k. In this embodiment, the path to be drilled is the path to be drilled on the copper plate, and correspondingly, the path to be drilled is simulatedIs also a simulated XY axis path.
It should be noted that, when the first point and the first boundary information are taken by the path to be drilled, the first boundary information generally needs to be initialized, for example, step S110 may be further included before step S100, the first boundary information is initialized, and x is the sum of the first boundary information and the second boundary information min ＝y min ＝+∞，x max ＝y max = - ≡; it may also include step S120 after step S100 and before step S200, when point n i For the first point n in the path to be drilled 1 When n is adopted 1 Initializing the first boundary information, or when point n i For the first point n in the path to be drilled 1 Initializing the first boundary information, x min ＝y min ＝+∞，x max ＝y max ＝-∞。
Wherein n is adopted 1 Initializing first boundary information, in particular x min ＝x max ＝x 1 ，y min ＝y max ＝y 1 。
Step S200, according to point n i Coordinates (x) i ,y i ) And first boundary information, determining second boundary information, the second boundary information including x 2min 、x 2max 、y 2min 、y 2max ；
It should be understood that the second boundary information refers to the first boundary information at the addition point n i And the boundary information thereafter.
Specifically, the calculation formula of the second boundary information is x 2min ＝min{x i ，x min }、x 2max ＝max{x i ，x max }、y 2min ＝min{y i ，y min }、y 2max ＝max{y i ，x max }. Correspondingly, the boundary dimension in the second boundary information is s ize=max { x } 2max -x 2min ，y 2max -y 2min }。
Step S300, when the boundary size in the second boundary information does not exceed the preset size, the point n is determined i Coordinates (x) i ,y i ) Updating the first boundary information;
it should be understood that when the boundary size of the second boundary information does not exceed the preset size, the current joining point n is considered i And then can be used for updating the first boundary information; at this time, continue to take the next point n in T i+1 Continuing to judge the adding point n i+1 Whether the second boundary information exceeds a preset size or not, if not, updating the first boundary information; continue to take the next point n in T i+2 … …, until the determination result is yes, the process proceeds to step S400.
In this embodiment, the preset dimension is half of the maximum dimension of the galvanometer axis that can drill on the laser drilling platform. The preset maximum machining range of the vibrating mirror shaft is recorded as L (the machining range 4 of the vibrating mirror shaft is a square with the side length of L in general), and then the preset size is L/2. As shown in fig. 1, a galvanometer axis machining range 4 is schematically shown in fig. 1.
Specifically, when the boundary size in the second boundary information does not exceed the preset size, the first boundary information is updated, and the calculation formula is as follows:
updated x min ＝min{x i ，x min }、x max ＝max{x i ，x max }、y min ＝min{y i ，y min }、y max ＝max{y i ，x max }。
Step S400, when the boundary size in the second boundary information exceeds the preset size, calculating a fitting point according to the first boundary information;
it should be understood that in this embodiment the coordinates (x j ，y j ) The calculation formula is as follows:
wherein, (x) j ，y j ) For the j-th fitting point c j J is a positive integer starting from 1.
For example:
sequentially acquiring a point n on a path to be drilled 1 And first boundary information, which may be represented by formula x min ＝y min ＝+∞，x max ＝y max Initialization of = - ≡may be performed by using n 1 Initializing, x min ＝x max ＝x 1 ，y min ＝y max ＝y 1 The method comprises the steps of carrying out a first treatment on the surface of the According to n 1 And first boundary information, determining second boundary information; the boundary size in the second boundary information does not exceed the preset size, and the point n is determined according to 1 Coordinates (x) 1 ,y 1 ) Updating the first boundary information, wherein the first boundary information is x min ＝x max ＝x 1 ，y min ＝y max ＝y 1 ；
Continuing to acquire a point n on the path to be drilled in sequence 2 First boundary information (at this time x min ＝x max ＝x 1 ，y min ＝y max ＝y 1 ) The method comprises the steps of carrying out a first treatment on the surface of the According to n 2 And first boundary information, determining second boundary information (x 2min ＝min{x 2 ，x min (at this time, min { x } 1 ，x 2 })、x 2max ＝max{x 2 ，x max "at this time max { x } 1 ，x 2 })、y 2min ＝min{y 2 ，y min "at this time, min { y } 1 ，y 2 })、y 2max ＝max{y 2 ，y max "at this time, max { y } 2 ，y 1 -j); the boundary size in the second boundary information does not exceed the preset size, and the point n is determined according to 2 Coordinates (x) 2 ,y 2 ) Updating the first boundary information, wherein the first boundary information is updated x min ＝min{x 2 ，x min }、x max ＝max{x 2 ，x max }、y min ＝min{y 2 ，y min }、y max ＝max{y 2 ，y max }；
……
Continuing to acquire a point n on the path to be drilled in sequence i And first boundary information (x updated at this time min Taking min { x } i-1 ，x min }、x max Taking max { x } i-1 ，x max }、y min Taking min { y } i-1 ，y min }、y max Taking max { y } i-1 ，x max -j); according to n i And first boundary information, determining second boundary information (x 2min ＝min{x i ，x min }、x 2max ＝max{x i ，x max }、y 2min ＝min{y i ，y min }、y 2max ＝max{y i ，y max -j); the boundary size in the second boundary information exceeds the preset size, and the fitting point c is calculated according to the first boundary information 1 ；
……
And so on until the points on the path to be drilled are traversed, the fitting point c can be obtained j (j＝1，2,……)。c 1 、c 2 、……、c j Is an ordered set of path points, generated in the order of points traversing the borehole path.
And S500, outputting an XY axis moving path according to all the fitting points obtained through calculation when the points on the path to be drilled are traversed.
It should be appreciated that the XY axis movement path is ordered according to the path to be drilled, so that the XY axis movement path is more accurate.
Specifically, the step S500 includes:
and when the points on the path to be drilled are traversed, obtaining an ordered XY axis moving path according to the sequence of obtaining the fitting points.
The XY axis movement path may be an XY axis movement path formed by sequentially connecting points in order according to the order in which the fitting points are generated.
For example, the fitting point obtained by traversing the path to be drilled includes c 1 、c 2 、……c t . At this time will c 1 、c 2 、……c t The simulated XY axis moving path is obtained by connecting the two paths in sequence.
In addition, after the step S400, before the step S500, the fitting method further includes:
step S600, according to point n i Coordinates (x) i ,y i ) Initializing the first boundary information.
It should be understood that in terms of n i The fitting point c is calculated when the boundary size of the updated second boundary information exceeds L/2 j The first boundary information then needs to be initialized to begin computing the next fitting point. After the first boundary information is initialized, the following steps are: x is x min ＝x max ＝x i ，y min ＝y max ＝y i 。
Further, fig. 4 is a schematic diagram of an embodiment of a path after being fitted by using the method for fitting the XY axis moving path of the PCB laser drilling machine according to the present application, and fig. 5 is a schematic diagram of an actual running path of the PCB laser drilling machine, and as can be seen by comparing fig. 4 and fig. 5, the method for fitting the XY axis moving path of the PCB laser drilling machine according to the present application is very close to the actual running path of the PCB laser drilling machine, so that the fitting can be performed accurately.
For clarity of illustration, the following is illustrative:
s1, a path T= { n to be drilled 1 ，n 2 ，……，n k Sequentially take n in } i The value of i is incremented by 1 each time the coordinates of the next point are acquired. From n first 1 Starting to fetch, initializing first boundary information x before S1 min ＝y min ＝+∞，x max ＝y max ＝-∞；
S2, according to n 1 Coordinates (x) 1 ,y 1 ) And first boundary information, second boundary information is determined, x 2min ＝min{x 1 ，
x min }、x 2max ＝max{x 1 ，x max }、y 2min ＝min{y 1 ，y min }、y 2max ＝max{y 1 ，y max }；
S3, the boundary size of the second boundary information does not exceed L/2, and the method is based onPoint n i Coordinates (x) 1 ,y 1 ) Updating the first boundary information x min ＝x max ＝x 1 ，y min ＝y max ＝y 1 ；
S4, continuing to drill from the path T= { n 1 ，n 2 ，……，n k Sequentially take n in } 2 ；
S5, according to n 2 Coordinates (x) 2 ,y 2 ) And first boundary information, second boundary information is determined, x 2min ＝min{x 2 ，x min }、x 2max ＝max{x 2 ，x max }、y 2min ＝min{y 2 ，y min }、y 2max ＝max{y 2 ，y max }；
S6, calculating the fitting point c according to the first boundary information, wherein the boundary size of the second boundary information exceeds L/2 1 ；
S7, according to point n 2 Coordinates (x) 2 ,y 2 ) Initializing the first boundary information, namely initializing x min ＝x max ＝x 2 ，
y min ＝y max ＝y 2 。
S8, continuing to drill from the path T= { n 1 ，n 2 ，……，n k Sequentially take n in } 3 ；
……
S X And when the points on the path to be drilled are traversed, the points are not taken from the path to be drilled continuously, and an XY axis moving path is output according to all the fitting points obtained through calculation.
Referring to FIG. 3, the example illustrated in FIG. 3, the first fitting point is at traversal to n 10 At this time, the boundary size of the second boundary information exceeds L/2, and c can be calculated 1 At this time c 1 Is based on black bolded boundary information (i.e. by n 1 To n 9 Formed boundary information) is calculated; to calculate c 1 According to n 10 Initializing first boundary information, x min ＝x max ＝x 10 ，y min ＝y max ＝y 10 At this time, the second boundary information is x 2min ＝x 2max ＝x 10 、y 2min ＝y 2max ＝y 10 FIG. 3 illustrates the state of traversing to the 10 th point, where x ’ Illustrated is x in the second boundary information at this time 2min 、x 2max 、x min 、x max The method comprises the steps of carrying out a first treatment on the surface of the Continue traversing n 11 … … to find the next fitting point.
The fitting method of the XY axis moving path of the PCB laser drilling machine comprises the steps of sequentially obtaining a point n on a path to be drilled i And first boundary information, wherein the first boundary information includes x min 、x max 、y min 、y max The method comprises the steps of carrying out a first treatment on the surface of the According to point n i Coordinates (x) i ,y i ) And first boundary information, determining second boundary information, the second boundary information including x 2min 、x 2max 、y 2min 、y 2max The method comprises the steps of carrying out a first treatment on the surface of the And then when the boundary size in the second boundary information does not exceed the preset size, the point n is determined i Coordinates (x) i ,y i ) Updating the first boundary information; then when the boundary size in the second boundary information exceeds the preset size, calculating a fitting point according to the first boundary information; finally, when points on the path to be drilled are traversed, outputting an XY axis moving path according to all the fitting points obtained through calculation, so that the XY axis moving path of the PCB laser drilling machine can be accurately simulated, the path form and length of the XY axis moving are conveniently estimated, and the path planning of drilling is better assisted;
further, points on a path to be drilled are sequentially traversed, a plurality of fitting points are established on the PCB laser drilling machine in the traversing process, the fitting points are sequentially connected, and the obtained track is regarded as an XY axis movement track of the laser drilling machine.
Furthermore, the fitting method of the XY axis moving path of the PCB laser drilling machine provided by the application realizes that the path of the center of the vibrating mirror axis is found through the point of the path to be drilled, thus the XY axis moving path which is consistent with the actual running track of the machine can be accurately fitted, real-time guidance is provided for the optimization of the XY axis moving path, the movement of the XY axis is convenient to adjust and optimize, the XY bearing can move more, the length of the moving path of the XY axis and the upper limit of the acceleration during the movement are reasonably controlled, and the repeated path is avoided as much as possible, so that the movement of the XY axis and the XY axis is convenient to reasonably plan; without the need to repeatedly verify by inputting the path into the laser drilling machine, through the actual operation of the machine. It is emphasized that the fitting method of the application does not pursue the shortest moving path, but aims at reasonably adjusting and optimizing the movement of the XY axis by finding the path of the center of the vibrating mirror axis, so that the vibrating mirror bearing can move more, and further, guidance can be provided for optimizing the real-time moving path of the XY axis. Moreover, the moving path of the XY axis can be intuitively observed through fitting, and further, the difference and the advantages of different methods on the moving path of the XY axis can be intuitively compared.
Subsequently, on the basis of optimizing the path, the precision error of the laser drilling machine caused by the movement of the XY axis can be reduced and the machining efficiency of laser drilling caused by path optimization can be improved by matching with the design optimization of the movement speed and the acceleration of the XY axis.
In order to achieve the above object, the present application also provides a terminal, as shown in fig. 7, which includes at least one processor 701; and a memory 702 communicatively coupled to the at least one processor 701; the memory 702 stores instructions executable by the at least one processor 701, where the instructions are executed by the at least one processor 701 to enable the at least one processor 701 to perform the above-mentioned method for fitting the XY axis movement path of the PCB laser drilling machine.
Where memory 702 and processor 701 are connected by a bus, the bus may comprise any number of interconnected buses and bridges, the buses connecting the various circuits of the one or more processors 701 and memory 702. The bus may also connect various other circuits such as peripherals, voltage regulators, and power management circuits, which are well known in the art, and therefore, will not be described any further herein. The bus interface provides an interface between the bus and the transceiver. The transceiver may be one element or may be a plurality of elements, such as a plurality of receivers and transmitters, providing a means for communicating with various other apparatus over a transmission medium. The data processed by the processor 701 is transmitted over a wireless medium via an antenna, which further receives the data and transmits the data to the processor 701.
The processor 701 is responsible for managing the bus and general processing and may provide various functions including timing, peripheral interfaces, voltage regulation, power management, and other control functions. And memory 702 may be used to store data used by processor 701 in performing operations.
The technical scheme provided by the application has the following advantages:
the fitting method of the XY axis moving path of the PCB laser drilling machine comprises the steps of sequentially obtaining a point n on a path to be drilled i And first boundary information, wherein the first boundary information includes x min 、x max 、y min 、y max The method comprises the steps of carrying out a first treatment on the surface of the According to point n i Coordinates (x) i ,y i ) And first boundary information, determining second boundary information, the second boundary information including x 2min 、x 2max 、y 2min 、y 2max The method comprises the steps of carrying out a first treatment on the surface of the And then when the boundary size in the second boundary information does not exceed the preset size, the point n is determined i Coordinates (x) i ,y i ) Updating the first boundary information; then when the boundary size in the second boundary information exceeds the preset size, calculating a fitting point according to the first boundary information; finally, when points on the path to be drilled are traversed, outputting an XY axis moving path according to all the fitting points obtained through calculation, so that the XY axis moving path of the PCB laser drilling machine can be accurately simulated, the path form and length of the XY axis moving are conveniently estimated, and the path planning of drilling is better assisted;
further, points on a path to be drilled are sequentially traversed, a plurality of fitting points are established on the PCB laser drilling machine in the traversing process, the fitting points are sequentially connected, and the obtained track is regarded as an XY axis movement track of the laser drilling machine.
Furthermore, the fitting method of the XY axis moving path of the PCB laser drilling machine provided by the application realizes that the path of the center of the vibrating mirror axis is found through the point of the path to be drilled, thus the XY axis moving path which is consistent with the actual running track of the machine can be accurately fitted, real-time guidance is provided for the optimization of the XY axis moving path, the movement of the XY axis is convenient to adjust and optimize, the XY bearing can move more, the length of the moving path of the XY axis and the upper limit of the acceleration during the movement are reasonably controlled, and the repeated path is avoided as much as possible, so that the movement of the XY axis and the XY axis is convenient to reasonably plan; without the need to repeatedly verify by inputting the path into the laser drilling machine, through the actual operation of the machine. Moreover, the moving path of the XY axis can be intuitively observed through fitting, and further, the difference and the advantages and disadvantages of different methods on the moving path of the XY axis can be intuitively compared, so that the method is quick, simple and convenient.
In order to achieve the above object, the present application provides a computer readable storage medium storing a computer program which, when executed by a processor, implements the above-described method of fitting an XY axis movement path of a PCB laser drilling machine.
That is, it will be understood by those skilled in the art that all or part of the steps in implementing the methods of the embodiments described above may be implemented by a program stored in a storage medium, where the program includes several instructions for causing a device (which may be a single-chip microcomputer, a chip or the like) or a processor (processor) to perform all or part of the steps in the methods of the embodiments of the present application. And the aforementioned storage medium includes: a usb disk, a removable hard disk, a Read-only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
It will be apparent that the embodiments described above are merely some, but not all, embodiments of the application. Based on the embodiments of the present application, those skilled in the art may make other different changes or modifications without making any creative effort, which shall fall within the protection scope of the present application.
Claims (10)
1. A method for fitting an XY axis movement path of a PCB laser drilling machine, the method comprising:
sequentially acquiring a point n on a path to be drilled i And first boundary information, wherein the first boundary information includes x min 、x max 、y min 、y max ；
According to point n i Coordinates (x) i ,y i ) And first boundary information, determining second boundary information, the second boundary information including x 2min 、x 2max 、y 2min 、y 2max ；
When the boundary size in the second boundary information does not exceed the preset size, the point n is determined i Coordinates (x) i ,y i ) Updating the first boundary information;
when the boundary size in the second boundary information exceeds the preset size, calculating fitting points according to the first boundary information;
and when the points on the path to be drilled are traversed, outputting an XY axis moving path according to all the fitting points obtained through calculation.
2. The method of fitting an XY axis movement path of a PCB laser drilling machine according to claim 1, wherein the step of when the boundary size in the second boundary information exceeds a preset size comprises:
when the boundary size of the second boundary information is larger than Yu Zhenjing, the maximum machining range of the shaft on the laser drilling platform is half.
3. The method of fitting an XY axis movement path of a PCB laser drilling machine of claim 1, wherein the reference point n i Coordinates (x) i ,y i ) And the first boundary information, in the step of determining the second boundary information, a calculation formula of the second boundary information is as follows:
x 2min ＝min{x i ，x min }、x 2max ＝max{x i ，x max }、y 2min ＝min{y i ，y min }、y 2max ＝max{y i ，x max }；
accordingly, the boundary dimension in the second boundary information is size=max { x } 2max -x 2min ，y 2max -y 2min }。
4. The method of fitting an XY axis movement path of a PCB laser drilling machine according to claim 1, wherein when the boundary size in the second boundary information does not exceed the preset size, the point n is based on i Coordinates (x) i ,y i ) The step of updating the first boundary information includes:
when the boundary size in the second boundary information does not exceed the preset size, updating the first boundary information, wherein the calculation formula is as follows:
updated x min ＝min{x i ，x min }、x max ＝max{x i ，x max }、y min ＝min{y i ，y min }、y max ＝max{y i ，x max }。
5. The method of fitting an XY axis movement path of a PCB laser drilling machine according to claim 1, wherein after the step of calculating fitting points according to the first boundary information when the boundary size in the second boundary information exceeds a preset size, the method of fitting further comprises, before the step of outputting an XY axis movement path according to all fitting points calculated when the points on the path to be drilled are traversed:
according to point n i Coordinates (x) i ,y i ) Initializing the first boundary information.
6. The method of fitting an XY axis movement path of a PCB laser drilling machine according to claim 1, wherein when the boundary size in the second boundary information exceeds a preset size, the calculation formula of the fitting point in the step of calculating the fitting point according to the first boundary information is:
wherein, (x) j ，y j ) The coordinates of the j-th fitting point are j, which is a positive integer from 1.
7. The method of fitting an XY axis movement path of a PCB laser drilling machine according to claim 1, wherein the step of outputting the XY axis movement path according to all fitting points calculated as the points on the path to be drilled are all traversed, comprises:
and when the points on the path to be drilled are traversed, obtaining an ordered XY axis moving path according to the sequence of obtaining the fitting points.
8. The method for fitting an XY axis movement path of a PCB laser drilling machine according to claim 1, wherein the sequentially obtaining a point n on the path to be drilled i And prior to the step of first boundary information, the fitting method further comprises:
initializing first boundary information, x min ＝y min ＝+∞，x max ＝y max ＝-∞。
9. A terminal, comprising:
at least one processor; the method comprises the steps of,
a memory communicatively coupled to the at least one processor; wherein,
the memory stores instructions executable by the at least one processor to enable the at least one processor to perform the method of fitting an XY axis movement path of a PCB laser drilling machine according to any one of claims 1 to 8.
10. A computer readable storage medium storing a computer program, wherein the computer program when executed by a processor implements the method of fitting the XY axis movement path of the PCB laser drilling machine according to any one of claims 1 to 8.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117773370A (en) * | 2024-02-27 | 2024-03-29 | 吉林大学 | Planning method and device for punching path of circuit board, computer equipment and medium |
| CN117787526A (en) * | 2024-02-23 | 2024-03-29 | 吉林大学 | Optimization method, prediction method and medium for track of PCB laser drilling equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117787526A (en) * | 2024-02-23 | 2024-03-29 | 吉林大学 | Optimization method, prediction method and medium for track of PCB laser drilling equipment |
| CN117773370A (en) * | 2024-02-27 | 2024-03-29 | 吉林大学 | Planning method and device for punching path of circuit board, computer equipment and medium |
| CN117773370B (en) * | 2024-02-27 | 2024-05-31 | 吉林大学 | Planning method and device for punching path of circuit board, computer equipment and medium |
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