CN117202727A - Display panel, manufacturing method thereof and display device - Google Patents

Abstract

The application discloses a display panel, a manufacturing method thereof and a display device. The display panel of an embodiment includes a display panel including: a substrate base; the color filter comprises a black matrix and color filters arranged between the black matrices, and orthographic projection of the spacer layer on the substrate falls in orthographic projection of the pixel defining layer on the substrate. According to the embodiment of the application, the spacer layer is arranged between the first electrode and the pixel defining layer, so that the connection of the convex interfaces of the film layer caused by the spacer layer is smooth, and the display product can meet the brightness attenuation index of the color film structure and does not generate wrinkle transverse lines.

Description

Display panel, manufacturing method thereof and display device

Technical Field

The present application relates to the field of display technologies, and in particular, to a display panel, a manufacturing method thereof, and a display device.

Background

Compared with the liquid crystal display device, the organic light emitting diode (Organic Light Emitting Diode, OLED) display device has a self-luminous property, and does not require a separate light source. And OLED display devices have been receiving more and more attention because of their characteristics of low power consumption, high brightness, and fast response speed. In the development process of OLED display, various new technologies, such as a technology of disposing a color filter on a package cover plate (Color filter on Encapsulation, COE), have been developed gradually.

The thickness of the cole is thinner than that of the polarizer, but in order to meet the brightness attenuation index, the organic encapsulation layer needs to be thinned, and at present, the organic encapsulation layer is easy to cause wrinkle cross lines after being thinned.

Disclosure of Invention

In order to solve at least one of the above problems, a first aspect of the present application provides a display panel comprising:

a substrate base;

a first electrode, a spacer layer, and a pixel defining layer sequentially stacked on the substrate; and

the color film layer is arranged on one side of the pixel defining layer away from the substrate base plate, and comprises a black matrix and a color filter arranged between the black matrices,

wherein, the orthographic projection of the spacer layer on the substrate falls within the orthographic projection of the pixel defining layer on the substrate.

In some alternative embodiments, further comprising: the thin film packaging layer is arranged between the pixel defining layer and the color film layer, and comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer which are sequentially stacked on the substrate.

In some alternative embodiments, wherein the thickness of the organic encapsulation layer is 7.5 μm or more and 8.5 μm or less.

In some alternative embodiments, the method may include, among other things,

the thickness of the spacer layer is 0.7 μm or more and 1.2 μm or less, and

the thickness of the pixel defining layer is 1.0 μm or more and 1.3 μm or less.

In some alternative embodiments, the spacer layer is circular in orthographic projection on the substrate.

In some alternative embodiments, further comprising: the touch control layer is arranged on one side of the color film layer close to the substrate or one side far away from the substrate.

A second aspect of the application provides a display device comprising a display panel as described above.

A third aspect of the present application provides a method of manufacturing the display panel described above, comprising:

providing a substrate;

sequentially forming a first electrode, a spacer layer and a pixel defining layer on a substrate, wherein orthographic projection of the spacer layer on the substrate falls into orthographic projection of the pixel defining layer on the substrate;

forming a thin film encapsulation layer on the pixel defining layer; and

and forming a color film layer on the film packaging layer.

In some alternative embodiments, sequentially forming the first electrode, the spacer layer, and the pixel defining layer on the substrate base plate further includes:

forming a first electrode on a substrate base plate;

depositing a first material layer on the first electrode and patterning the first material layer to form a spacer layer; and

a second material layer is deposited on the spacer layer and patterned to form a pixel defining layer overlying the spacer layer.

In some alternative embodiments, forming the thin film encapsulation layer over the pixel defining layer further comprises:

forming a first inorganic packaging layer on the pixel defining layer by a chemical vapor deposition mode or a reactive sputtering mode;

forming an organic encapsulation layer on the first inorganic encapsulation layer by means of inkjet printing; and

and forming a second inorganic packaging layer on the organic packaging layer by a chemical vapor deposition mode or a reactive sputtering mode.

The beneficial effects of the application are as follows:

aiming at the existing problems at present, the application designs a display panel, a manufacturing method thereof and a display device, and the spacer layer is arranged between the first electrode and the pixel defining layer, so that the connection of the convex interfaces of the film layer caused by the spacer layer is smooth, and the display product does not generate transverse wrinkles while meeting the brightness attenuation index of the color film structure, thereby improving the display uniformity and having wide application prospect.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 shows the relationship between film encapsulation layer thickness and luminance decay;

FIGS. 2a and 2b are schematic diagrams showing the relationship between the thickness of the thin film encapsulation layer and the light exit angle;

fig. 3 shows a schematic cross-sectional view of a related art display panel;

FIG. 4 is a slice view showing the position of the corrugation cross-section of a related art display panel;

fig. 5 shows a schematic cross-sectional view of a display panel according to an embodiment of the present application;

fig. 6 to 11 are schematic flowcharts showing a method of manufacturing a display panel according to an embodiment of the present application.

Detailed Description

In order to more clearly illustrate the present application, the present application will be further described with reference to preferred embodiments and the accompanying drawings. Like parts in the drawings are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and that this application is not limited to the details given herein.

It should be noted that, as used herein, "on … …", "formed on … …", and "disposed on … …" may mean that one layer is directly formed or disposed on another layer, or that one layer is indirectly formed or disposed on another layer, i.e., that other layers are present between the two layers.

In addition, in the present application, the term "co-layer arrangement" is used to mean that two layers, components, members, elements or portions may be formed by the same manufacturing process (e.g., patterning process, etc.), and the two layers, components, members, elements or portions are generally formed of the same material. For example, the two or more functional layers are arranged in the same layer, meaning that the functional layers arranged in the same layer may be formed using the same material layer and the same manufacturing process, so that the manufacturing process of the display substrate may be simplified.

The COE is to manufacture a color filter on the packaging layer to replace a Polaroid (POL) to realize an anti-reflection function. The basic principle is that color filters with colors corresponding to the RGB sub-pixels are respectively arranged at the corresponding positions of the RGB luminescent layers, the color filters are separated by Black Matrixes (BM), the black matrixes correspond to the separation positions between the RGB sub-pixels, namely correspond to the pixel defining layers, and external light is absorbed when passing through the color film layers, so that the anti-reflection function is realized. Compared with POL, COE has higher transmittance, lower power consumption and longer service life; the color of emergent light of each sub-pixel is purer, and the color gamut is wider; in addition, the thickness of the cole is thinner, which is advantageous for bending, so that the application of the cole tends to be performed in more and more display products.

However, in the COE technology, the Luminance Decay (L-Decay) is related to the distance from the color film layer to the light emitting layer, and since the thickness of the thin film encapsulation layer is large and the thickness of each of the two inorganic encapsulation layers in the thin film encapsulation layer is almost only 1/10 of the thickness of the organic encapsulation layer, the L-Decay is strongly related to the thickness of the organic encapsulation layer in the thin film encapsulation layer, as shown in fig. 1, the two are in a linear inverse proportion relationship, and the thicker the organic encapsulation layer is, the faster the L-Decay is. The specific schematic diagrams are shown in fig. 2a and 2b, and it can be seen from the diagrams that the thin film encapsulation layer in fig. 2a is thicker than the thin film encapsulation layer in fig. 2b, or the organic encapsulation layer in fig. 2a is thicker than the organic encapsulation layer in fig. 2b, the light emitting layer in fig. 2a has a light emitting angle θ1 smaller than the light emitting layer in fig. 2b, the smaller the light emitting angle θ2, more light is absorbed by the black matrix, so that the faster the L-Decay decays, and according to practical measurement, the L-Decay is 40.7% if the thickness of the organic encapsulation layer is 10 μm, and the L-Decay is 36.6% if the thickness of the organic encapsulation layer is 6 μm, and according to experimental data, the thickness of the organic encapsulation layer meeting the L-Decay index expected by the customer should reach at least 8.5 μm.

However, in the existing production line production, the required thickness of 8.5 μm cannot be satisfied. Referring to fig. 3, in order to form a good support in the display panel, a spacer layer is required to be disposed on the pixel defining layer, and then a thin film encapsulation layer is formed, and an organic encapsulation layer in the thin film encapsulation layer is prepared by an inkjet printing method. The organic packaging layer formed by ink-jet printing needs to be leveled to package the display panel, because the spacer layer is a convex structure arranged on the pixel defining layer, the interface between the spacer layer and the pixel defining layer is rough, the radian is large, and the change is severe (see the area in the oval dotted line frame), when the thickness of the spacer layer is reduced to 8.5 mu m, the organic packaging layer is not easy to flow into a pixel pit (pixel area) due to the interface, so that the packaging is invalid, the reliability problems such as GDS (gas dynamic) are caused, a large number of folds are generated on the organic packaging layer, a large number of fold transverse lines (Orange Mura) exist in the display area, the Edge of the spacer layer is provided with Edge transverse lines (Edge Mura), a physical slice diagram at the fold transverse lines is shown in fig. 4, and the problem of organic packaging layer missing occurs at the visible transverse lines.

The above problems reduce the reliability and display effect of the product and seriously obstruct the mass production of the product. Therefore, it is desirable to provide a display panel that can meet the thickness of the organic encapsulation layer required by the L-scan index desired by the customer while avoiding the problems of wrinkling, edge marking, and package failure.

Based on one of the above problems, an embodiment of the present application provides a display panel including:

a substrate base;

a first electrode, a spacer layer and a pixel defining layer which are sequentially laminated on the substrate; and

the color film layer is arranged on one side of the pixel defining layer away from the substrate base plate, and comprises a black matrix and a color filter arranged between the black matrices,

the orthographic projection of the spacer layer on the substrate falls within the orthographic projection of the pixel defining layer on the substrate.

In this embodiment, the spacer layer is disposed between the first electrode and the pixel defining layer, so that the interface between the protrusions of the film layer caused by the spacer layer is smooth, so that the display product does not generate wrinkle cross lines while meeting the brightness attenuation index of the color film structure, the display uniformity is improved, and the packaging effectiveness is ensured.

In a specific example, referring to fig. 5, the display panel includes a substrate base 100, and a first electrode 101, a spacer layer 102, and a pixel defining layer 103 sequentially stacked on the substrate base 100. The first electrode may be an anode.

Specifically, the pixel defining layer 103 is disposed on a surface of the spacer layer 102 remote from the substrate 100, the pixel defining layer 103 covering the spacer layer 102. In other words, the orthographic projection of the spacer layer 102 onto the substrate 100 falls within the orthographic projection of the pixel defining layer 103 onto the substrate 100.

Referring to fig. 5, the display panel further includes a color film layer 104 disposed on the pixel defining layer 103, the color film layer 104 includes a black matrix 114 and color filters 124 disposed between the black matrices 114, and the color of the color filters 124 is consistent with the color of the light emitted from the light emitting layer of the corresponding sub-pixel. That is, if the light emitting layer of the sub-pixel at the corresponding position emits blue light, the color filter 124 is a blue filter, if the light emitting layer of the sub-pixel at the corresponding position emits red light, the color filter 124 is a red filter, and if the light emitting layer of the sub-pixel at the corresponding position emits green light, the color filter 124 is a green filter. Those skilled in the art will appreciate that the color filter layer 104 is a color filter structure formed by the COE technology.

More specifically, with continued reference to fig. 5, the display panel further includes: the thin film encapsulation layer 105 disposed between the pixel defining layer 103 and the color film layer 104, the thin film encapsulation layer 105 includes a first inorganic encapsulation layer 115, an organic encapsulation layer 125, and a second inorganic encapsulation layer 135 sequentially stacked on the substrate 100. The material of the first inorganic encapsulation layer 115 and the second inorganic encapsulation layer 135 may be silicon oxynitride or silicon oxide.

Optionally, the material of the first inorganic encapsulation layer 115 is silicon oxynitride, and the material of the second inorganic encapsulation layer 135 is silicon oxide. An alternative combination of structures is that both the first inorganic encapsulation layer 115 and the second inorganic encapsulation layer 135 are silicon oxynitride. Of course, the material combinations of the two are not limited thereto.

The thickness of the first inorganic encapsulation layer 115 may be, for example, 1 μm, and the thickness of the second inorganic encapsulation layer 135 may be, for example, 0.6 μm, but is not limited thereto. The first inorganic encapsulation layer 115 and the second inorganic encapsulation layer 135 are formed by chemical vapor deposition or reactive sputtering, and the organic encapsulation layer 125 is formed by inkjet printing.

Referring to fig. 5, by disposing the spacer layer 102 between the first electrode 101 and the pixel defining layer 103, the protrusion formed on the side away from the substrate 100 at the portion where the spacer layer 102 is raised is integrally formed by the pixel defining layer 103. So that the interface at the bulge (marked by a dashed box) has a smooth curvature.

With this arrangement, fluidity at the time of inkjet printing of the organic encapsulation layer 125 can be increased, so that it can effectively flow into the pixel pits (light emitting areas defined by the pixel defining areas), the problems of wrinkles and poor edges can be avoided, and effective encapsulation can be achieved. Therefore, the thickness of the organic encapsulation layer 125 according to the embodiment of the present application is thinned to 7.5 μm or more and 8 μm or less in the case of avoiding the wrinkle and the edge defect and effectively encapsulating. The thickness can ensure to meet the L-Decay index expected by customers, and the light emitting effect is greatly improved.

Further preferably, referring to fig. 5, the thickness h1 of the spacer layer 102 is 0.7 μm or more and 1.2 μm or less, and the thickness h2 of the pixel defining layer 103 is 1.0 μm or more and 1.3 μm or less.

By this arrangement, it is possible to ensure that the interface transition between the raised region and the horizontal region of the pixel defining layer 103 is sufficiently smooth, that the fluidity is increased when the organic encapsulation layer 125 is formed by inkjet printing, that the display product is free of wrinkles and edges and has good reliability and packaging quality, while ensuring that a sufficiently high bump is formed on the surface of the pixel defining layer 103 by the height of the spacer layer 102, thereby providing sufficient support for the display region.

It is further preferred that the orthographic projection of the spacer layer 102 on the substrate base 100 is circular. That is, the spacer layer 102 has a cylindrical structure. The cylindrical structure enables the edge interface of the convex portion of the surface of the pixel defining layer 103 to be smoother and more uniform than other shapes, and increases fluidity thereof when the organic encapsulation layer 125 is formed by inkjet printing. More preferably, the orthographic projection of the spacer layer 102 on the substrate 100 and the orthographic projection of the corresponding pixel defining layer 103 on the substrate 100 are concentric.

By this arrangement, uniformity of the package structure of the thin film package layer 105 in each pixel pit is ensured, and uniformity of the display product is improved.

Optionally, a flexible multi-layering (english: flexible Multilayer On Cell, abbreviated as FMLOC) process may be utilized to dispose a touch layer on the display panel, so that the display panel has a touch function, and the touch layer 106 is disposed on a side of the display panel where the color film layer 104 is close to the substrate 100 or far from the substrate 100. Fig. 5 shows a schematic structural diagram of a display panel with a touch function, wherein the touch layer 106 is disposed on a side of the color film layer 104 near the substrate 100.

In addition to the above structure, referring to fig. 5, when the display panel is an OLED display panel, the display panel further includes: a light emitting functional layer 107 provided on the pixel defining layer 103, and a second electrode 108, such as a cathode, provided on the light emitting functional layer 107. Those skilled in the art will appreciate that the organic functional layer may include a hole transport layer, an electroluminescent layer, an electron transport layer, etc., and will not be described herein.

Of course, the present application is not intended to limit the type of display panel to OLED display panels, alternatively the display panel may be: active-matrix organic light emitting diodes (AMOLED), quantum dot light emitting diode (Quantum Dot Light Emitting Diodes, QLED) display panels, and the like.

Corresponding to the display panel, the embodiment of the application also provides a method for manufacturing the display panel, which comprises the following steps:

providing a substrate;

sequentially forming a first electrode, a spacer layer and a pixel defining layer on a substrate, wherein orthographic projection of the spacer layer on the substrate falls into orthographic projection of the pixel defining layer on the substrate;

forming a thin film encapsulation layer on the pixel defining layer; and

and forming a color film layer on the film packaging layer.

In this embodiment, the spacer layer is formed between the first electrode and the pixel defining layer, so that the interface between the protrusions of the film layer caused by the spacer layer is smooth, and therefore, the display product does not generate wrinkle cross lines while meeting the brightness attenuation index of the color film structure, and the display uniformity is improved, and the display device has a wide application prospect.

Optionally, forming the first electrode, the spacer layer, and the pixel defining layer in this order on the substrate base plate further includes: forming a first electrode on a substrate base plate; depositing a first material layer on the first electrode and patterning the first material layer to form a spacer layer, depositing a second material layer on the spacer layer and patterning the second material layer to form a pixel defining layer overlying the spacer layer.

Optionally, forming a thin film encapsulation layer on the pixel defining layer further comprises: the first inorganic packaging layer is formed on the pixel defining layer through a chemical vapor deposition mode or a reactive sputtering mode, the organic packaging layer is formed on the first inorganic packaging layer through an ink-jet printing mode, and the second inorganic packaging layer is formed on the organic packaging layer through a chemical vapor deposition mode or a reactive sputtering mode.

The specific manufacturing process will be described below with reference to fig. 6 to 11, taking the display panel shown in fig. 5 as an example.

Referring to fig. 6, in step S1, a substrate 100 is provided, and the substrate 100 may be a silicon-based substrate or a flexible substrate. The flexible material comprises Polyimide (PI), PEN, PET and the like. The flexible substrate may be a single layer structure or a plurality of layers. If the structure is a multilayer structure, a buffer layer can be added between the layers, and the buffer layer is an inorganic film and can be SiNx, siOx or a composite layer thereof.

It should be noted that, although not shown, those skilled in the art will understand that a driving circuit layer including a thin film transistor should be further included on the substrate base 100.

The thin film transistor may include: an active layer, a gate insulating layer, a gate electrode, a dielectric layer, a source electrode, a drain electrode and the like. Illustratively, the active layer may be a Poly polysilicon layer, the material of the gate insulating layer may be silicon oxide, silicon nitride, or other inorganic insulating materials such as silicon oxynitride, and the gate insulating layer may have one or more layers. The material of the gate electrode can also be a multi-layer metal structure. And forming a through hole after the dielectric layer, and forming a source drain electrode through a magnetron sputtering metal layer, wherein the film layer combination of the source drain electrode can be one or lamination of Mo/Al/Mo, mo/Cu, moNb/Cu/MoTi and the like. The planarization layer may be deposited after the thin film transistor is formed, and will not be described herein.

In step S2, as shown in fig. 6 and 7, the first electrode 101, the spacer layer 102, and the pixel defining layer 103 are sequentially formed on the substrate 100. The first anode may be formed by a vacuum evaporation process. The spacer layer 102 and the pixel defining layer 103 may be formed by a dry etching process. Specifically, a first material layer is deposited on the first electrode 101 and patterned to form the spacer layer 102, and a second material layer is deposited on the spacer layer 102 and patterned to form the pixel defining layer 103 covering the spacer layer 102. The material of the first material layer can be transparent polymer material with toughness and rigidity, so that each film layer in the display panel is fixedly supported, and the compression resistance and deformation resistance of the display panel are improved. The material of the second material layer may be an inorganic material such as SiOx, siNx, or the like.

The bump formed on the side away from the substrate 100 by the portion where the spacer layer 102 is raised is integrally formed with the pixel defining layer 103 by making the spacer layer 102 before forming the pixel defining layer 103. So that the interface at the bulge (marked by a dashed box) has a smooth curvature.

With this arrangement, fluidity at the time of inkjet printing of the organic encapsulation layer 125 can be increased, so that it can effectively flow into the pixel pits (light emitting areas defined by the pixel defining areas), the problems of wrinkles and poor edges can be avoided, and effective encapsulation can be achieved. Therefore, the thickness of the organic encapsulation layer 125 according to the embodiment of the present application is thinned to 7.5 μm or more and 8 μm or less in the case of avoiding the wrinkle and the edge defect and effectively encapsulating. The thickness can ensure to meet the L-Decay index expected by customers, and the light emitting effect is greatly improved.

Preferably, the thickness h1 of the spacer layer 102 is 0.7 μm or more and 1.2 μm or less, and the thickness h2 of the pixel defining layer 103 is 1.0 μm or more and 1.3 μm or less.

By this arrangement, it is possible to ensure that the interface transition between the raised region and the horizontal region of the pixel defining layer 103 is sufficiently smooth, that the fluidity is increased when the organic encapsulation layer 125 is formed by inkjet printing, that the display product is free of wrinkles and edges and has good reliability and packaging quality, while ensuring that a sufficiently high bump is formed on the surface of the pixel defining layer 103 by the height of the spacer layer 102, thereby providing sufficient support for the display region.

Referring to fig. 8, in step S3, a light emitting function layer 107 and a second electrode 108 covering the light emitting function layer 107 are formed on the pixel defining layer 103. The second electrode 108 may be a cathode, which is covered over its entire surface. The second electrode 108 may also be formed by a vacuum evaporation process.

In step S4, a thin film encapsulation layer 105 is formed on the pixel defining layer 103, the thin film encapsulation layer 105 being specifically formed on the second electrode 108. Specifically, referring to fig. 9, a first inorganic encapsulation layer 115 is formed on the pixel defining layer 103 by chemical vapor deposition or reactive sputtering. The thickness of the first inorganic encapsulation layer 115 may be, for example, 1 μm. The material of the first inorganic encapsulation layer 115 may be silicon oxynitride or silicon oxide, or other inorganic materials. The inorganic material has certain hardness and can isolate water vapor.

Referring to fig. 10, an organic encapsulation layer 125 is next formed on the first inorganic encapsulation layer 115 by an inkjet printing method. The thickness of the organic encapsulation layer 125 is reduced to 7.5 μm or more and 8 μm or less, and since the pixel defining layer 103 is smooth at the interface of the bump structure, the organic encapsulation layer 12 has good fluidity during inkjet printing, and an effective encapsulation is formed on the surface of the display panel, so that it can absorb moisture and isolate oxygen, and meanwhile, the occurrence of wrinkles and edges is avoided, the display uniformity and the product reliability of the display panel are improved, and mass production is facilitated.

Next, as shown in fig. 10, a second inorganic encapsulation layer 135 is formed on the organic encapsulation layer 125 by chemical vapor deposition or reactive sputtering. The thickness of the second inorganic encapsulation layer 135 may be, for example, 0.6 μm or less. The material of the first inorganic encapsulation layer 115 may be silicon oxynitride or silicon oxide, or other inorganic materials. The inorganic material has a certain hardness and can protect the display panel from being scratched.

In step S5, referring to fig. 11, the touch layer 106 is formed on the second inorganic packaging layer 135 by using a flexible multi-layered (english: flexible Multilayer On Cell, abbreviated as FMLOC) process, and the specific film structure of the touch layer 106 is not described again.

Next, a color film layer 104 is formed on the touch layer 106. The specific forming process may be that the black matrix 114 of the opaque material is formed by using a patterning process, and then the sub-pixel color films of each color are sequentially formed by using an edge exposure process, where the sequence of forming the sub-pixel color films of each color is not limited, for example, the red sub-pixel color film may be formed first, the green sub-pixel color film may be formed, and finally the blue sub-pixel color film may be formed, or the red sub-pixel color film may be formed first, the blue sub-pixel color film may be formed, and finally the green sub-pixel color film may be formed. A protective layer (not shown) may be formed on the side of the color film layer 104 away from the substrate 100 by deposition, coating, sputtering, or the like.

After that, as can be appreciated by those skilled in the art, the display panel can be cut into independent display panels by a cutting process and then bonded with FPC or the like to complete the manufacture of the display panel, which is not described herein again.

Based on the same inventive concept, the embodiment of the present application also provides a display device including the display panel described in the above embodiment. Since the display panel included in the display device provided by the embodiment of the present application corresponds to the display panel provided by the above embodiment, the foregoing embodiment is also applicable to the display device provided by the present embodiment, and will not be described in detail in the present embodiment.

In this embodiment, the display device may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, or a navigator. Particularly, for the display product with high requirements on L-Decay and color saturation, the display product can be ensured to have good reliability and display uniformity under the condition that the display panel meets the higher requirements on L-Decay and color.

Aiming at the existing problems at present, the application designs a display panel, a manufacturing method thereof and a display device, and the spacer layer is arranged between the first electrode and the pixel defining layer, so that the connection of the convex interfaces of the film layer caused by the spacer layer is smooth, the display product does not generate transverse wrinkles while meeting the brightness attenuation index of the color film structure, the display uniformity is improved, the mass production of the product is facilitated, and the display device has wide application prospect.

It should be understood that the foregoing examples of the present application are provided merely for clearly illustrating the present application and are not intended to limit the embodiments of the present application, and that various other changes and modifications may be made therein by one skilled in the art without departing from the spirit and scope of the present application as defined by the appended claims.

Claims (10)

1. A display panel, comprising:

a substrate base;

a first electrode, a spacer layer and a pixel defining layer which are sequentially laminated on the substrate; and

the color film layer is arranged on one side of the pixel defining layer far away from the substrate base plate and comprises a black matrix and a color filter arranged between the black matrices,

wherein, the orthographic projection of the spacer layer on the substrate falls in the orthographic projection of the pixel defining layer on the substrate.

2. The display panel of claim 1, further comprising: the thin film packaging layer is arranged between the pixel defining layer and the color film layer, and comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer which are sequentially stacked on the substrate.

3. The display panel according to claim 2, wherein the thickness of the organic encapsulation layer is 7.5 μm or more and 8.5 μm or less.

4. The display panel of claim 1, wherein,

the thickness of the spacer layer is 0.7 μm or more and 1.2 μm or less, and

the thickness of the pixel defining layer is 1.0 μm or more and 1.3 μm or less.

5. The display panel of claim 1, wherein an orthographic projection of the spacer layer on the substrate base plate is circular.

6. The display panel of claim 1, further comprising: the touch control layer is arranged on one side of the color film layer close to the substrate or one side of the color film layer far away from the substrate.

7. A display device comprising the display panel according to any one of claims 1-6.

8. A method of making the display panel of any one of claims 1-6, comprising:

providing the substrate base;

sequentially forming the first electrode, the spacer layer and the pixel defining layer on the substrate, wherein the orthographic projection of the spacer layer on the substrate falls into the orthographic projection of the pixel defining layer on the substrate;

forming a thin film encapsulation layer on the pixel defining layer; and

and forming the color film layer on the film packaging layer.

9. The display panel of claim 8, wherein the sequentially forming the first electrode, the spacer layer, and the pixel defining layer on the substrate base plate further comprises:

forming a first electrode on the substrate base plate;

depositing a first material layer on the first electrode and patterning the first material layer to form the spacer layer; and

a second material layer is deposited over the spacer layer and patterned to form a pixel defining layer overlying the spacer layer.

10. The method of claim 8, wherein forming a thin film encapsulation layer over the pixel-defining layer further comprises:

forming a first inorganic packaging layer on the pixel defining layer by a chemical vapor deposition mode or a reactive sputtering mode;

forming an organic encapsulation layer on the first inorganic encapsulation layer by means of inkjet printing; and

and forming a second inorganic packaging layer on the organic packaging layer by a chemical vapor deposition mode or a reactive sputtering mode.