CN117202536B - Double-rail cooling buffer memory for manufacturing electric element assembly - Google Patents
Double-rail cooling buffer memory for manufacturing electric element assembly Download PDFInfo
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- CN117202536B CN117202536B CN202311461267.6A CN202311461267A CN117202536B CN 117202536 B CN117202536 B CN 117202536B CN 202311461267 A CN202311461267 A CN 202311461267A CN 117202536 B CN117202536 B CN 117202536B
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- 238000001816 cooling Methods 0.000 title claims abstract description 246
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 230000015654 memory Effects 0.000 title abstract description 17
- 230000007246 mechanism Effects 0.000 claims abstract description 39
- 239000010410 layer Substances 0.000 claims description 21
- 229920000742 Cotton Polymers 0.000 claims description 19
- 230000005540 biological transmission Effects 0.000 claims description 14
- 238000001914 filtration Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 6
- 239000002344 surface layer Substances 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 claims 1
- XOMKZKJEJBZBJJ-UHFFFAOYSA-N 1,2-dichloro-3-phenylbenzene Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1Cl XOMKZKJEJBZBJJ-UHFFFAOYSA-N 0.000 description 39
- 238000005457 optimization Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 239000000428 dust Substances 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000004781 supercooling Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The invention relates to a double-rail cooling buffer memory for manufacturing an electric element assembly. The double-rail cooling buffer machine for manufacturing the electric element assembly belongs to the technical field of cooling buffer machines; the double-rail cooling buffer machine for manufacturing the electric element assembly comprises two supporting plates, wherein two supporting plates are arranged, a double-rail cooling buffer mechanism is arranged between the two supporting plates, the double-rail cooling buffer mechanism comprises two cooling boxes which are arranged up and down, two sides of each cooling box are respectively and fixedly arranged on one surfaces of the two supporting plates, which are close to each other, a cooling buffer channel for a PCB (printed circuit board) to pass through is formed between the two cooling boxes, and the double-rail cooling buffer mechanism is applied to the cooling buffer of the PCB after the production of the PCB.
Description
Technical Field
The invention belongs to the technical field of cooling buffer memories, and particularly relates to a double-rail cooling buffer memory for manufacturing an electric element assembly.
Background
In the process of manufacturing the electrical component assembly, a cooling buffer is required, and the cooling buffer is equipment for rapidly cooling the electrical component assembly. Especially when the PCB is produced, the cooling rate is faster, so that fine crystal particles are formed, the most compact structure is formed, the intensity of SMT (surface mount technology) patch welding spots on the PCB is improved, the time of the PCB at high temperature is shortened, and the damage to heat-sensitive components is reduced.
However, the existing cooling buffer machine is usually used for realizing rapid cooling in a cold air feeding mode, but when the PCB is cooled by supercooled wind power, the performance of the PCB is easily reduced due to overlarge influence of temperature difference, and the PCB is correspondingly aged, so that the service life of the PCB is reduced.
Therefore, a double-rail cooling buffer for manufacturing an electric element assembly is provided for solving the defects.
Disclosure of Invention
The invention aims to solve the problems and provide the double-rail cooling buffer machine for manufacturing the electric element assembly, which has a simple structure and reasonable design.
The invention realizes the above purpose through the following technical scheme:
the utility model provides a manufacturing of electrical component subassembly is with double track cooling buffer memory, includes the backup pad, the backup pad is provided with two, is provided with double track cooling buffer memory mechanism between two backup pads, and double track cooling buffer memory mechanism includes two cooling boxes that set up from top to bottom, and the both sides of cooling box are fixed mounting respectively in the one side that two backup pads are close to each other, form the cooling buffer memory way that is used for the PCB board to pass through between two cooling boxes, the inside of cooling box is provided with the cooling air buffer memory way, let in the circulating air in the cooling air buffer memory way;
a cooling air diversion buffer channel is arranged in a surface layer structure of the two cooling boxes, the cooling air diversion buffer channel is of a V-shaped channel structure, a diversion inlet and a diversion outlet communicated with the cooling buffer channel are formed in the middle of the V-shaped channel structure, and a diversion inlet and a diversion outlet communicated with the inside of the cooling air buffer channel are respectively formed at two ends of the V-shaped channel structure;
the lower part of the cooling box is provided with a bottom plate, and the bottom plate is provided with an inclination adjusting mechanism for adjusting the inclination of the cooling box.
As a further optimization scheme of the invention, the inclination adjusting mechanism comprises a spring telescopic rod, a second bracket, a first bracket and a first motor, wherein the second bracket is fixedly arranged at one end of the upper surface of the bottom plate, the spring telescopic rod is movably hinged to the other end of the upper surface of the bottom plate, the upper end of the spring telescopic rod is hinged to the lower surface of a cooling box below the spring telescopic rod, the first bracket is simultaneously and fixedly connected to one end, far away from the spring telescopic rod, of two supporting plates, the second bracket is provided with a pair of supporting plates, the lower end of the first bracket extends into the space between the pair of second brackets, the first motor is fixedly arranged on the surface of one of the second brackets, and a rotating shaft of the first motor is fixedly connected with the first bracket.
As a further optimization scheme of the invention, the surfaces of the two cooling boxes, which are close to each other, are respectively provided with an arc-shaped groove, the arc-shaped grooves are rotationally connected with rollers, and the rollers corresponding to each other up and down are respectively movably attached to the upper surface and the lower surface of the PCB.
As a further optimization scheme of the invention, a baffle is arranged at the shunt inlet, and one end of the baffle, which is far away from the spring telescopic rod, is rotationally connected to the inner wall of the cooling air buffer channel through a second power shaft.
As a further optimization scheme of the invention, a second filter cotton layer is fixedly arranged at the split inlet and outlet.
As a further optimization scheme of the invention, one side surface of one supporting plate is fixedly provided with an air box, one end of the air box is fixedly provided with a fan, one end of the air box, which is far away from the fan, is provided with a first air pipe, one end of the second air pipe, which is far away from the air box, is provided with two first bifurcation pipes, which are respectively communicated with one ends of cooling air cache channels in the upper cooling box and the lower cooling box, one end of the first air pipe, which is far away from the fan, is provided with two second bifurcation pipes, and the two second bifurcation pipes are respectively communicated with the other ends of the cooling air cache channels in the upper cooling box and the lower cooling box.
As a further optimization scheme of the invention, the interior of the bellows is fixedly provided with a plurality of first filter cotton layers, the interior of the bellows is divided into a plurality of cooling chambers by the plurality of first filter cotton layers, and a refrigerating mechanism is arranged in the cooling chambers.
As a further optimization scheme of the invention, the middle part of the roller is fixedly connected to the first power shaft, two ends of the first power shaft respectively pass through two side surfaces of the supporting plate, the second power shaft is fixedly connected with the baffle, and two ends of the second power shaft respectively pass through two side surfaces of the supporting plate.
As a further optimization scheme of the invention, one side surface of the supporting plate is provided with a first transmission mechanism and a second transmission mechanism, the first transmission mechanism comprises a first belt, the second transmission mechanism comprises a second belt, one end of the second power shaft, which movably penetrates through the side surface of the supporting plate, is fixedly connected with a second gear, one end of the first power shaft, which movably penetrates through the side surface of the supporting plate, is fixedly connected with a first gear, a plurality of first gears are in transmission connection through the first belt, a plurality of second gears are in transmission connection through the second belt, two motor brackets are fixedly arranged on the side surface of the supporting plate, a second motor is arranged on the motor brackets, a rotating shaft of one second motor is fixedly connected with the end part of one first power shaft, and the other second motor is fixedly connected with the end part of one second power shaft.
As a further optimization scheme of the invention, the refrigerating mechanism comprises a controller, a refrigerator and a temperature sensor.
The invention has the beneficial effects that: the double-rail cooling buffer mechanism is applied to the cooling buffer of the PCB after the production of the PCB, so that the PCB is rapidly and uniformly cooled and cannot be influenced by excessive temperature difference, the performance of the PCB is ensured, and the service life of the PCB is prolonged to some extent.
The whole gradient of cooler bin can be adjusted to gradient adjustment mechanism for the PCB board can be along the track slip of cooling buffer memory way, thereby realizes that the PCB board is from sliding, and the PCB board cools off at the slow gliding in-process in cooling buffer memory way, and cooling efficiency is high, need not power unit drive PCB board and removes.
When cooling air is introduced into the cooling air buffer channel, lower-layer cooling air can be shunted to enter the cooling air shunt buffer channel from the shunt inlet, part of cooling air entering the cooling air shunt buffer channel is discharged from the shunt inlet and the shunt outlet, and the other part of cooling air entering the cooling air shunt buffer channel is discharged from the shunt outlet and then converged into the cooling air buffer channel, so that the cooling efficiency of the PCB can be increased when a small amount of wind is discharged from the shunt inlet and the shunt outlet, and the PCB can be pushed to slide in the cooling buffer channel, and the cooling efficiency of the PCB can be adjusted according to actual requirements.
The PCB can slide along the outer ring of the roller when sliding in the cooling buffer channel, the surface contact is changed into line contact through the roller, the sliding resistance is reduced, and the PCB can slide smoothly along the cooling buffer channel with smaller gradient.
The baffle can rotate around the second power shaft to be adjusted, so that the opening size of the diversion inlet is adjusted, and the wind power diversion amount is correspondingly reduced or increased according to actual requirements.
The second filter cotton layer has a certain flow blocking and buffering effect on wind power, so that the wind power is buffered in a buffer channel for cooling wind diversion, the wind power discharged from a diversion inlet and a diversion outlet is softer, and the filter cotton layer is particularly suitable for keeping stable performance when cooling a PCB; the second filter cotton layer has a certain filtering effect on wind power, can filter dust, and avoids the phenomenon that dust particles and the like are attached to the surface of the PCB in the wind power cooling process to cause the performance reduction of the PCB.
Cooling air after radiating the surface of the PCB can flow back to the cooling air buffer channel through the diversion inlet and outlet of the next stage or downwards, heat on the PCB can be directly brought into the cooling air buffer channel to be discharged in the process of cooling air backflow, the purpose of diverting heat is achieved, and the phenomenon that the surface temperature of the PCB of the next stage is excessively high due to the fact that the heat radiated from the PCB acts on the surface of the PCB for the second time is avoided.
According to the invention, the upper cooling box and the lower cooling box are arranged, so that the PCB conveyed in the cooling buffer channel is in a suspended state, and wind power can act on the upper surface and the lower surface of the PCB, thereby improving the cooling uniformity, and replacing the mode that single-sided cooling in the prior art leads to low cooling efficiency and large temperature difference.
Drawings
FIG. 1 is a schematic view of a dual-rail cooling buffer for manufacturing electrical components according to the present invention;
FIG. 2 is a schematic view of another view of the dual-rail cooling buffer for manufacturing electrical component assembly according to the present invention;
FIG. 3 is an enlarged view of the invention at A in FIG. 2;
FIG. 4 is a cross-sectional view of a dual rail cooling buffer for manufacturing electrical component assemblies according to the present invention;
FIG. 5 is another perspective cross-sectional view of the dual rail cooling buffer for manufacturing an electrical component assembly of the present invention;
FIG. 6 is an enlarged view of the invention at B in FIG. 4;
FIG. 7 is an enlarged view of FIG. 6 at C in accordance with the present invention;
FIG. 8 is a schematic view showing a structure of the double-rail cooling buffer for manufacturing an electric component assembly according to the present invention in a horizontal state;
FIG. 9 is a schematic view showing a structure of the double-rail cooling buffer machine for manufacturing an electric component assembly according to the present invention in an inclined state;
FIG. 10 is a schematic view of the fan in the cooling tank of the present invention;
FIG. 11 is an enlarged view of the invention at D in FIG. 10;
fig. 12 is a schematic view of a cooling air diversion buffer lane structure according to the present invention.
In the figure: the cooling box 1, the support plate 2, the bellows 3, the fan 4, the PCB 5, the cooling buffer channel 6, the first air pipe 7, the second air pipe 8, the first support 9, the second support 10, the spring telescopic rod 11, the bottom plate 12, the hinge plate 13, the second belt 14, the first belt 15, the first motor 16, the second motor 17, the motor support 18, the second gear 19, the first gear 20, the cooling buffer channel 21, the cooling buffer channel 22 for cooling air diversion, the cooling chamber 23, the first filter cotton layer 24, the refrigerating mechanism 25, the baffle 26, the roller 27, the second filter cotton layer 28, the first power shaft 29, the second power shaft 30, the diversion inlet 31, the diversion outlet 32 and the diversion inlet 33.
Detailed Description
The following detailed description of the present application is provided in conjunction with the accompanying drawings, and it is to be understood that the following detailed description is merely illustrative of the application and is not to be construed as limiting the scope of the application, since numerous insubstantial modifications and adaptations of the application will be to those skilled in the art in light of the foregoing disclosure.
As shown in fig. 1 to 12, a dual-rail cooling buffer machine for manufacturing an electrical component assembly comprises two support plates 2, wherein two support plates 2 are provided, a dual-rail cooling buffer mechanism is arranged between the two support plates 2, and the dual-rail cooling buffer mechanism is applied to cooling buffer of a Printed Circuit Board (PCB) after being produced, so that the PCB is rapidly and uniformly cooled, and cannot be influenced by overlarge temperature difference, the performance of the PCB is guaranteed, and the service life of the PCB is prolonged to some extent.
The double-rail cooling buffer mechanism comprises two cooling boxes 1 which are arranged up and down, two sides of each cooling box 1 are respectively and fixedly arranged on one surfaces of the two supporting plates 2, which are close to each other, a cooling buffer channel 6 for the passage of the PCB 5 is formed between the two cooling boxes 1, a cooling air buffer channel 21 is arranged in the cooling boxes 1, and circulating air is introduced into the cooling air buffer channel 21; during operation, the PCB 5 is cooled through the cooling buffer channel 6, and circulating air is introduced into the cooling air buffer channel 21, so that the periphery of the PCB 5 is kept in a low-temperature state, heat around the PCB 5 can be quickly taken away by the circulating air, and the surface of the PCB 5 cannot be directly blown to cause excessive cooling of the surface of the PCB 5.
When the double-rail cooling buffer mechanism is used, the two cooling boxes 1 can be spliced at the discharge port of the PCB forming machine, and the discharged PCB is transported to the cooling buffer channel 6 for cooling buffer.
The below of cooling tank 1 is provided with bottom plate 12, is provided with the inclination adjustment mechanism who adjusts cooling tank 1 gradient on the bottom plate 12, and inclination adjustment mechanism can adjust the holistic gradient of cooling tank 1 for PCB board 5 can slide along the orbit of cooling buffer memory way 6, thereby realizes that PCB board 5 is from sliding, and PCB board 5 cools off at the slow gliding in-process of cooling buffer memory way 6, and cooling efficiency is high, need not power unit drive PCB board 5 and removes.
The specific structure of the inclination adjusting mechanism comprises a spring telescopic rod 11, a second bracket 10, a first bracket 9 and a first motor 16, wherein the second bracket 10 is fixedly arranged at one end of the upper surface of a bottom plate 12, the spring telescopic rod 11 is movably hinged to the other end of the upper surface of the bottom plate 12, the upper end of the spring telescopic rod 11 is hinged to the lower surface of a cooling box 1 below, the first bracket 9 is simultaneously and fixedly connected to one end, far away from the spring telescopic rod 11, of two support plates 2, the second bracket 10 is provided with a pair of support plates, the lower end of the first bracket 9 extends into a pair of second brackets 10, the first motor 16 is fixedly arranged on the surface of one of the second brackets 10, and a rotating shaft of the first motor 16 is fixedly connected with the first bracket 9; during operation, the first motor 16 is started, the first motor 16 drives the first support 9 to rotate through the rotating shaft, and because the first support 9 is fixedly connected to the end parts of the two support plates 2 at the same time, the first support 9 can drive the end parts of the support plates 2 and the cooling box 1 to rotate in the rotating process, and when the cooling box 1 rotates and adjusts, the spring telescopic rod 11 adaptively stretches and contracts, so that stable support of the cooling box 1 is realized.
The hinge plate 13 to which the spring expansion link 11 is hinged is fixedly installed on both the lower surface of the cooling box 1 and the upper surface of the bottom plate 12.
When the gradient of the cooling box 1 is 30 degrees, the PCB 5 in the cooling buffer channel 6 can slowly slide along the length direction of the cooling buffer channel 6, and the gradient of the cooling box 1 can be adjusted according to actual requirements so as to increase or reduce the sliding time of the PCB 5 in the cooling buffer channel 6, thereby controlling the cooling time and enabling the PCB to be sufficiently cooled and buffered.
Because wind power only circulates through the cooling air buffer channel 21 to cool the periphery of the PCB 5, the wind power is not in contact with the surface of the PCB 5, and therefore, the cooling efficiency is low, in order to increase the cooling efficiency, the flow speed of the wind power can be correspondingly increased, or the cooling air buffer channel 22 for cooling air diversion is arranged in a surface layer structure of two cooling boxes 1, the cooling air buffer channel 22 for cooling air diversion is of a V-shaped channel structure, the middle part of the V-shaped channel structure forms a diversion inlet 33 communicated with the cooling buffer channel 6, two ends of the V-shaped channel structure respectively form a diversion inlet 31 and a diversion outlet 32 communicated with the inside of the cooling air buffer channel 21, when the cooling air is introduced into the cooling air buffer channel 21, the cooling air of the lower layer can be shunted into the cooling air diversion buffer channel 22 from the diversion inlet 31, part of the cooling air entering into the cooling air diversion buffer channel 22 is discharged from the diversion inlet 33, and the other part of the cooling air entering the cooling air diversion buffer channel 22 is discharged from the diversion outlet 32 and then is converged into the cooling air buffer channel 21, and a small amount of the wind can push the cooling air to the PCB 5 when the cooling air is discharged from the diversion outlet 33, and the cooling air buffer channel 5 can be effectively adjusted in the PCB 5 according to the actual requirements of the PCB 5.
In order to enable the PCB 5 to slide in the cooling buffer channel 6 for a long time, the gradient of the inclination of the cooling box 1 is generally adjusted to be smaller than 30 degrees, so that the PCB 5 can slide slowly along the cooling buffer channel 6 with a smaller gradient, and due to the smaller gradient, the sliding resistance is correspondingly increased, arc grooves are formed in the surfaces, close to each other, of the two cooling boxes 1, rollers 27 are rotatably connected in the arc grooves, the rollers 27 corresponding to the upper surface and the lower surface of the PCB 5 are movably attached to the upper surface and the lower surface of the PCB respectively, the PCB 5 can slide along the outer ring of the rollers 27 when sliding in the cooling buffer channel 6, the surface is enabled to be in line contact through the rollers 27, and the sliding resistance is reduced, so that the PCB 5 can slide smoothly along the cooling buffer channel 6 with a smaller gradient.
Considering that wind speed of wind flowing out from the split inlet 31 is faster, actual cooling efficiency is too high, the PCB board can be cooled too fast, and service performance of the PCB board is reduced, therefore, the baffle 26 is arranged at the split inlet 31, one end of the baffle 26, which is far away from the spring telescopic rod 11, is rotationally connected to the inner wall of the cooling wind buffer channel 21 through the second power shaft 30, and the baffle 26 can be rotationally adjusted around the second power shaft 30 to adjust the opening size of the split inlet 31, so that the wind split amount is correspondingly reduced or increased according to actual requirements.
Although the cooling air diversion buffer passage 22 is of a V-shaped passage structure, the impact of the wind power discharged from the diversion inlet and outlet 33 is still strong, and wind erosion is caused on the surface of the PCB to reduce the performance, so that the second filter cotton layer 28 is fixedly arranged at the diversion inlet and outlet 33, and the second filter cotton layer 28 has a certain flow blocking and buffering effect on the wind power, so that the wind power is buffered in the cooling air diversion buffer passage 22, the wind power discharged from the diversion inlet and outlet 33 is softer, and the cooling air diversion buffer passage is particularly suitable for keeping the performance stable when cooling the PCB 5.
And further, the second filter cotton layer 28 has a certain filtering effect on wind power, and can filter dust, so that the phenomenon that dust particles and the like are attached to the surface of the PCB 5 in the wind power cooling process to cause the performance of the PCB 5 to be reduced is avoided.
Still further, when the cooling air discharged from the split inlet and outlet 33 flows to the split inlet and outlet 33 of the next stage, the cooling air is converged with the cooling air discharged from the split inlet and outlet 33, which eventually causes the wind power between the PCB 5 and the inner wall of the cooling buffer channel 6 to be larger and larger, but the space between the PCB 5 and the inner wall of the cooling buffer channel 6 is limited, so that the cooling air after radiating the surface of the PCB 5 can flow back to the cooling air buffer channel 21 through the split inlet and outlet 33 of the next stage or down, the heat on the PCB 5 can be directly brought into the cooling air buffer channel 21 to be discharged in the process of cooling air backflow, the purpose of splitting the heat is achieved, and the phenomenon that the surface temperature of the PCB 5 of the next stage is excessively high due to the secondary action of the heat discharged from the PCB 5 on the surface of the PCB 5 is avoided.
According to the invention, the upper cooling box 1 and the lower cooling box 1 are arranged, so that the PCB 5 conveyed in the cooling buffer channel 6 is in a suspended state, and wind power can act on the upper surface and the lower surface of the PCB 5, thereby improving the cooling uniformity, and replacing the mode that the cooling efficiency is low and the temperature difference is large due to single-sided cooling in the prior art.
One of them backup pad 2 side fixed mounting has bellows 3, and bellows 3's one end fixed mounting has fan 4, and bellows 3 and fan 4 cooperate and are arranged in for supplying the circulated air in the cooling air buffer memory 21, and the circulated air pumps through fan 4, in cooling air buffer memory 21 back row income bellows 3, the circulated air in the bellows 3 of being discharged is pumped by fan 4 again and is used after the cooling.
Specifically, a first air pipe 7 is arranged on the fan 4, a second air pipe 8 is arranged at one end, far away from the fan 4, of the air box 3, two first bifurcation pipes are formed at one end, far away from the air box 3, of the second air pipe 8, the two first bifurcation pipes are respectively communicated with one ends of cooling air cache channels 21 in the upper cooling box 1 and the lower cooling box 1, two second bifurcation pipes are formed at one end, far away from the fan 4, of the first air pipe 7, and are respectively communicated with the other ends of the cooling air cache channels 21 in the upper cooling box 1 and the lower cooling box 1; when the fan 4 is started, wind power in the wind box 3 can be sucked into the cooling wind buffer channel 21, the wind power passes through the cooling wind buffer channel 21 so as to rapidly take away heat in the cooling wind buffer channel 21, and when the wind power is shunted through a shunting inlet 31 in the cooling wind buffer channel 21, the heat around the PCB 5 can be further and fully taken away.
It should be noted that, when the PCB 5 is conveyed in the cooling buffer channel 6, heat can be transferred to the cooling air buffer channel 21 through the structural wall of the cooling box 1, and the wind power can cool the PCB 5 indirectly after taking away the heat in the cooling air buffer channel 21 rapidly, so that the heat dissipation performance of the PCB 5 is increased to some extent, and the way of directly blowing the PCB 5 to dissipate heat is replaced.
The inside of the bellows 3 is fixedly provided with a plurality of first filter cotton layers 24, the inside of the bellows 3 is divided into a plurality of cooling chambers 23 by the plurality of first filter cotton layers 24, a refrigerating mechanism 25 is arranged in each cooling chamber 23, the first filter cotton layers 24 have a certain filtering effect on wind power, and the plurality of first filter cotton layers 24 have multiple filtering effects on wind power; and the wind power passes through a plurality of cooling chambers 23 for cooling and buffering, such as: the temperature difference is larger when wind power enters the first cooling chamber 23, the temperature of the wind power is 40-60 ℃ when the wind power is cooled through the first cooling chamber 23, the temperature of the wind power is 35-50 ℃ when the wind power with the temperature of 40-60 ℃ is cooled and mixed again through the second cooling chamber 23, the wind power can be kept at a proper temperature of 20-25 ℃ when the wind power is fed into the cooling wind buffer channel 21 after passing through the plurality of cooling chambers 23, the fluctuation range of the temperature difference is small, and the phenomenon that the performance of the PCB 5 is easy to be reduced when the PCB is cooled by supercooling or cold and hot wind power is reduced.
It should be noted that, the cooling mechanism 25 includes a controller, a refrigerator and a temperature sensor, where the temperature sensor may be used to monitor the wind temperature in each cooling chamber 23, and when the wind temperature is not between the set thresholds, the refrigerator may be correspondingly turned on or off, so as to control the wind temperature in the cooling chamber 23 to be suitable, and when the wind is regulated in the cooling chamber 23, stable output wind with a small temperature difference range may be provided.
The middle part of the roller 27 is fixedly connected to a first power shaft 29, two ends of the first power shaft 29 respectively pass through two side surfaces of the supporting plate 2, a second power shaft 30 is fixedly connected with the baffle 26, and two ends of the second power shaft 30 respectively pass through two side surfaces of the supporting plate 2; the side surface of one supporting plate 2 is provided with a first transmission mechanism and a second transmission mechanism, the first transmission mechanism comprises a first belt 15, the second transmission mechanism comprises a second belt 14, a second power shaft 30 movably penetrates through one end of the side surface of the supporting plate 2 and is fixedly connected with a second gear 19, a first power shaft 29 movably penetrates through one end of the side surface of the supporting plate 2 and is fixedly connected with a first gear 20, a plurality of first gears 20 are in transmission connection through the first belt 15, a plurality of second gears 19 are in transmission connection through the second belt 14, the side surface of the supporting plate 2 is fixedly provided with two motor brackets 18, the motor brackets 18 are provided with second motors 17, the rotating shaft of one second motor 17 is fixedly connected with the end part of one first power shaft 29, and the other second motor 17 is fixedly connected with the end part of one second power shaft 30; when the second motor 17 is started, the second gear 19 or the first gear 20 can be controlled to rotate, when the second gear 19 or the first gear 20 rotates, the second belt 14 or the first belt 15 can be driven to be conveyed respectively, and when the second belt 14 or the first belt 15 conveys, the plurality of second gears 19 or the plurality of first gears 20 can be driven to rotate, so that the rolling of the roller 27 or the adjustment of the rotation angle of the baffle 26 can be realized.
When the roller 27 rolls, the PCB 5 can slide in the cooling buffer channel 6, and the phenomenon that the PCB 5 is blocked in the cooling buffer channel 6 is avoided.
The foregoing examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention.
Claims (5)
1. The utility model provides an electrical component assembly makes and uses double track cooling buffer machine, includes backup pad (2), its characterized in that, backup pad (2) are provided with two, are provided with double track cooling buffer mechanism between two backup pads (2), and double track cooling buffer mechanism includes two cooling tank (1) that set up from top to bottom, and the both sides of cooling tank (1) are fixed mounting respectively in the one side that two backup pads (2) are close to each other, form between two cooling tank (1) and are used for the cooling buffer way (6) that PCB board (5) passed through, the inside of cooling tank (1) is provided with cooling air buffer way (21), let in the circulated air in cooling air buffer way (21);
a cooling air diversion buffer channel (22) is arranged in a surface layer structure of the two cooling boxes (1) which are close to each other, the cooling air diversion buffer channel (22) is of a V-shaped channel structure, a diversion inlet (33) communicated with the cooling buffer channel (6) is formed in the middle of the V-shaped channel structure, and a diversion inlet (31) and a diversion outlet (32) communicated with the inside of the cooling air buffer channel (21) are respectively formed at two ends of the V-shaped channel structure;
a bottom plate (12) is arranged below the cooling box (1), and an inclination adjusting mechanism for adjusting the inclination of the cooling box (1) is arranged on the bottom plate (12);
the inclination adjusting mechanism comprises a spring telescopic rod (11), a second support (10), a first support (9) and a first motor (16), wherein the second support (10) is fixedly arranged at one end of the upper surface of a bottom plate (12), the spring telescopic rod (11) is movably hinged to the other end of the upper surface of the bottom plate (12), the upper end of the spring telescopic rod (11) is hinged to the lower surface of a cooling box (1) below, the first support (9) is fixedly connected to one end, far away from the spring telescopic rod (11), of two support plates (2), the second support (10) is provided with a pair, the lower end of the first support (9) extends into a position between the pair of second supports (10), the first motor (16) is fixedly arranged on the surface of one second support (10), and the rotating shaft of the first motor (16) is fixedly connected with the first support (9);
one side of each cooling box (1) close to the other is provided with an arc groove, rollers (27) are rotationally connected in the arc grooves, and the rollers (27) corresponding to each other up and down are respectively movably attached to the upper surface and the lower surface of the PCB (5);
a baffle plate (26) is arranged at the position of the diversion inlet (31), and one end, far away from the spring telescopic rod (11), of the baffle plate (26) is rotationally connected to the inner wall of the cooling air buffer channel (21) through a second power shaft (30);
a second filter cotton layer (28) is fixedly arranged at the split inlet and outlet (33);
one of them backup pad (2) side fixed mounting has bellows (3), the one end fixed mounting of bellows (3) has fan (4), be provided with first tuber pipe (7) on fan (4), the one end that fan (4) was kept away from to bellows (3) is provided with second tuber pipe (8), the one end that bellows (3) was kept away from to second tuber pipe (8) forms two first bifurcation pipe, two first bifurcation pipe respectively with upper and lower two cooling box (1) inside cooling air buffer channel (21) one end intercommunication, the one end that fan (4) was kept away from to first tuber pipe (7) forms two second bifurcation pipe, two second bifurcation pipe respectively with the inside cooling air buffer channel (21) other end intercommunication of upper and lower two cooling box (1).
2. The dual-rail cooling buffer for manufacturing an electrical component assembly according to claim 1, wherein: the inside of bellows (3) is fixed and is provided with first cotton layer (24) of filtering, first cotton layer (24) of filtering is provided with a plurality ofly, and a plurality of first cotton layers of filtering (24) separate the inside of bellows (3) into a plurality of cooling cavity (23), install refrigerating mechanism (25) in cooling cavity (23).
3. The dual-rail cooling buffer for manufacturing an electrical component assembly according to claim 1, wherein: the middle part fixed connection of gyro wheel (27) is on first power shaft (29), the both ends of first power shaft (29) are movable respectively and are passed the both sides face of backup pad (2), fixed connection between second power shaft (30) and baffle (26), the both ends of second power shaft (30) are movable respectively and are passed the both sides face of backup pad (2).
4. A dual-rail cooling buffer for manufacturing an electrical component assembly according to claim 3 wherein: one of them backup pad (2) side is provided with first drive mechanism and second drive mechanism, and first drive mechanism includes first belt (15), and second drive mechanism includes second belt (14), wherein one end fixedly connected with second gear (19) of backup pad (2) side is passed in second power shaft (30) activity, one of them end fixedly connected with first gear (20) of backup pad (2) side is passed in first power shaft (29) activity, is connected through first belt (15) transmission between a plurality of first gears (20), is connected through second belt (14) transmission between a plurality of second gears (19), the side of backup pad (2) is still fixed mounting has two motor support power 18), be provided with second motor (17) on motor support (18), the pivot of one of them second motor (17) and the tip fixed connection of one of them first motor (29), the tip fixed connection of another second motor (17) and one of them second motor (30).
5. The dual-rail cooling buffer for manufacturing an electrical component assembly according to claim 2, wherein: the refrigeration mechanism (25) includes a controller, a refrigerator, and a temperature sensor.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311461267.6A CN117202536B (en) | 2023-11-06 | 2023-11-06 | Double-rail cooling buffer memory for manufacturing electric element assembly |
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| CN202311461267.6A CN117202536B (en) | 2023-11-06 | 2023-11-06 | Double-rail cooling buffer memory for manufacturing electric element assembly |
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| CN117202536B true CN117202536B (en) | 2024-01-16 |
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| CN116156797A (en) * | 2023-03-16 | 2023-05-23 | 苏州巨迪电子科技有限公司 | PCB board buffer memory machine |
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| JP2005050989A (en) * | 2003-07-28 | 2005-02-24 | Fujitsu Ltd | Shelf for housing printed wiring board and shelf structure |
| CN108347135A (en) * | 2018-04-26 | 2018-07-31 | 重庆智驱科技有限公司 | Motor cooling |
| CN109226723A (en) * | 2018-10-30 | 2019-01-18 | 湖北群鹏实业有限公司 | A kind of cooling device in being machined |
| CN216437853U (en) * | 2021-11-30 | 2022-05-03 | 深圳创劲鑫科技有限公司 | Furnace rear double-track cooling buffer memory machine |
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| CN117202536A (en) | 2023-12-08 |
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