CN117202473A - Stacked module and electronic equipment - Google Patents
Stacked module and electronic equipment Download PDFInfo
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- CN117202473A CN117202473A CN202210601160.6A CN202210601160A CN117202473A CN 117202473 A CN117202473 A CN 117202473A CN 202210601160 A CN202210601160 A CN 202210601160A CN 117202473 A CN117202473 A CN 117202473A
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- Prior art keywords
- substrate
- hollowed
- metal
- module
- out area
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- 239000000758 substrate Substances 0.000 claims abstract description 150
- 239000002184 metal Substances 0.000 claims abstract description 53
- 229910052751 metal Inorganic materials 0.000 claims abstract description 53
- 238000003466 welding Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
A stacked module, comprising: the first substrate is hollowed out in the middle to form at least one hollowed-out area, and comprises a first surface and a second surface, wherein the first surface and the second surface are provided with metal bare dew points; the second substrate comprises a first surface and a second surface, the second surface of the second substrate is arranged on the first surface of the first substrate through a metal bare point of the first surface of the first substrate, and the electronic element on the second surface of the second substrate is positioned in a hollowed-out area of the first substrate; and the third substrate is arranged on the second surface of the first substrate through the metal bare dew point of the second surface of the first substrate, so that the extension area of the substrate is reduced.
Description
Technical Field
The present application relates to a module structure, and more particularly, to a stacked module and an electronic device.
Background
The existing LTE/WiFi/BT/GNSS wireless module designs mostly adopt a single-sided component design, and all components are arranged on the same surface of the PCB. When different wireless modules, especially 5G modules, are to be integrated onto one PCB, the module size is too large, and the 5G modules have complex functions, such as BB, MCP, POWER and RF, TX-RX of RF, and each working unit needs to be isolated from each other. Single sided arrangements typically use an external shield to separate the cells to be isolated, with the best effect that each cell shares a separate shield, but for extremely limited size products such as 5G modules it is almost impossible to achieve, typically with the same shield in a split cavity. However, the more the shielding frame separating units are, the more the accumulated mechanical bending gaps are, each bending gap is more than 2mm, and the worse the shielding efficiency of the shielding frame is, the module performance is correspondingly reduced.
Disclosure of Invention
In view of the foregoing, it is desirable to provide a stacked module that reduces the extended area of the substrate while improving the module performance.
An embodiment of the present application provides a stacking module, including:
the first substrate is hollowed out in the middle to form at least one hollowed-out area, and comprises a first surface and a second surface, wherein the first surface and the second surface are provided with metal bare dew points;
the second substrate comprises a first surface and a second surface, the second surface of the second substrate is arranged on the first surface of the first substrate through a metal bare point of the first surface of the first substrate, and the electronic element on the second surface of the second substrate is positioned in a hollowed-out area of the first substrate;
and the third substrate is arranged on the second surface of the first substrate through the metal bare dew point of the second surface of the first substrate.
Preferably, the metal bare dew point of the second surface of the second substrate and the metal bare dew point of the first surface of the first substrate are arranged on the first surface of the first substrate in a welding mode;
the metal bare dew points of the third substrate and the second surface of the first substrate are arranged on the second surface of the first substrate in a welding mode.
Preferably, the metal bare dew point is an LGA pad.
Preferably, the circumference of the hollowed-out area ring is plated with metal.
Preferably, metal through holes are formed in the periphery of the hollowed-out area according to preset distances.
Preferably, the first surface of the second substrate is provided with a first wireless system and a metal shielding cover, and the wireless system is arranged in the metal shielding cover.
Preferably, a ground pad is disposed around the hollowed-out area so that the first substrate, the second substrate and the third substrate form a common ground shield.
Preferably, the first substrate, the second substrate and the third substrate are PCB boards.
Preferably, the electronic components on the second side of the second substrate form at least one second wireless system, each second wireless system being located in an hollowed-out area of the first substrate.
In view of this, it is also necessary to provide an electronic device that reduces the extension area of the substrate and improves the communication performance of the product.
The application further provides electronic equipment, which comprises the stacking module.
Compared with the prior art, the stacking module provided by the embodiment of the application comprises a first substrate, a second substrate and a third substrate, wherein the first substrate is hollowed out to form a hollowed-out area, and the first surface and the second surface are provided with metal bare dew points; the second surface of the second substrate is arranged on the first surface of the first substrate through the metal bare dew point of the first surface of the first substrate, and the electronic element on the second surface of the second substrate is positioned in the hollowed-out area of the first substrate; and the third substrate is arranged on the second surface of the first substrate through the metal bare dew point of the second surface of the first substrate, so that a stacked structure is formed, the extension area of the PCB is reduced, a wireless system is arranged in the hollowed-out area, and the periphery of the third substrate is provided with a metal shielding layer, so that the coexistence interference among the wireless systems of the stacked module is effectively reduced, and the communication performance is improved.
Drawings
FIG. 1 is a schematic diagram of a stacked module according to an embodiment of the present application;
FIG. 2 is a top and bottom view of an embodiment of a hollowed out area of a stacking module of the present application;
fig. 3 is a schematic structural diagram of another embodiment of the stacking module according to the present application.
Description of the main reference numerals
Stacked module 1, 1a
First substrate 10, 10a
Second substrate 20, 10a
Third substrate 30, 30a
The hollowed-out areas 100, 100a, 100b
Ground pad 101
First wireless system 200, 200a, 200b
Metallic shield covers 201, 201a, 201b
Second wireless systems 202, 202a, 202b
Region 300
Metal via
The application will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the applications herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description of the application and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion. The terms first, second and the like in the description and in the claims or in the above-described figures, are used for distinguishing between different objects and not necessarily for describing a sequential or chronological order.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a stacking module 1 according to the present application. In this embodiment, the stacking module 1 may be applied to an electronic device including a wireless communication module, such as a mobile phone, a wearable product, and a notebook computer. The stacking module 1 includes a first substrate 10, a second substrate 20, and a third substrate 30. The first substrate 10, the second substrate 20, and the third substrate 30 are stacked in a three-dimensional structure. The first substrate 10, the second substrate 20 and the third substrate 30 may be PCB boards, but not limited thereto, and each substrate may be provided with different circuit structures according to actual requirements.
In the present embodiment, the first substrate 10 is hollowed out at the middle thereof to form at least one hollowed-out region 100, and in the present embodiment, one hollowed-out region is taken as an example. The first substrate 10 includes a first surface and a second surface, both of which are provided with a metal bare dew point pad. In practical applications, the metal bare dew point may be an LGA pad. The second substrate 20 includes a first face and a second face. The second surface of the second substrate 20 is disposed on the first surface of the first substrate 10 through the metal bare spot pad of the first surface of the first substrate 10, and the electronic component on the second surface of the second substrate 20 is located in the hollowed-out region 100 of the first substrate 10. The third substrate 30 is disposed on the second surface of the first substrate 10 through the metal bare spot pad of the second surface of the first substrate 10. The first substrate 10, the second substrate 20 and the third substrate 30 form a three-dimensional structure in a stacked manner, thereby reducing the extension area of the PCB.
In one embodiment of the present application, the metal bare points of the second surface of the second substrate 20 and the first surface of the first substrate 10 are disposed on the first surface of the first substrate 10 by soldering. The third substrate 30 and the metal bare spot pad of the second surface of the first substrate 10 are disposed on the second surface of the first substrate 10 by soldering.
In the present embodiment, the first surface of the second substrate 20 is provided with the first wireless system 200 and the metal shielding cover 201, and the first wireless system 200 is placed inside the metal shielding cover 201, and the metal shielding cover 201 prevents the first wireless system 200 from being interfered by other wireless systems.
In the present embodiment, the electronic components on the second side of the second substrate 20 form at least one second wireless system 202, and each second wireless system 202 is located in a hollowed-out area of the first substrate 10. In this embodiment, a second wireless system is described as an example. The second wireless system 202 is located in the hollowed-out area 100 of the first substrate 10, and referring to fig. 2, fig. 2 is a top view and a bottom view of the first substrate 10, and the inner periphery of the hollowed-out area 100 is filled with metal, such as copper metal. In the present embodiment, the hollowed-out area 100 is coated with copper metal in the area 300 corresponding to the third substrate 30, so that the second wireless system 202 is completely wrapped by the metal up, down, left and right, and a good shielding effect is achieved. And even if two wireless systems exist at the same time in the stacked module 1, the coexistence interference between the two wireless systems is greatly reduced, and the communication performance of the product is improved. The first wireless system 200 and the second wireless system 202 may be, but are not limited to, 5G modules.
In other embodiments of the present application, metal through holes via are provided around the hollowed out area 100 at a predetermined distance, and the metal through holes via function the same as the metal layer around the ring of the hollowed out area 100. In other embodiments of the present application, the hollowed-out region 100 may also be provided with a metal via and a metal layer around the ring.
In the present embodiment, the ground pad 101 is provided around the hollowed-out region 100 to form a common ground shield for the first substrate 10, the second substrate 20, and the third substrate 30, thereby further improving the shielding effect.
Referring to fig. 3, fig. 3 is a schematic structural diagram of another embodiment of a stacking module 1a according to the present application. The stacking module 1a includes a first substrate 10a, a second substrate 20a, and a third substrate 30a. The first substrate 10a, the second substrate 20a, and the third substrate 30a are stacked in a three-dimensional structure. The first substrate 10a, the second substrate 20a and the third substrate 30a may be, but are not limited to, PCB boards, and each substrate may have different circuit structures according to actual requirements. In the present embodiment, the stacking principle of the first substrate 10a, the second substrate 20a and the third substrate 30a is similar to that of the above embodiment, and will not be repeated here.
In the present embodiment, the first substrate 10 is hollowed out in the middle, and up to 2 hollowed-out regions 100a and 100b are formed. The electronic components on the second side of the second substrate 20a form 2 second wireless systems 202a and 202b, the second wireless system 202a is located in the hollowed-out area 100a of the first substrate 10a, and the second wireless system 202b is located in the hollowed-out area 10b of the first substrate 10a, so that each second wireless system is located in a closed shielding space.
In this embodiment, the first surface of the second substrate 20a is provided with the first wireless system 200a, the first wireless system 200b, the first metal shielding cover 201a and the first metal shielding cover 201b, the first wireless system 200a is built in the first metal shielding cover 201a, and correspondingly, the first wireless system 200b is built in the first metal shielding cover 201b, so that each first wireless system is in a closed shielding space, and the first wireless systems 200a and 200b are prevented from being interfered by other wireless systems by the metal shielding covers 201a and 201 b.
It should be understood that the foregoing embodiments are only for better understanding of the present application, the number of hollowed-out areas may be determined according to the number of wireless systems actually applied, and the wireless systems on the first surface of the second substrate 20a are determined according to the actual application requirements, which is not limited herein.
Compared with the prior art, the stacking module provided by the embodiment of the application comprises a first substrate, a second substrate and a third substrate, wherein the first substrate is hollowed out to form a hollowed-out area, and the first surface and the second surface are provided with metal bare dew points; the second surface of the second substrate is arranged on the first surface of the first substrate through the metal bare dew point of the first surface of the first substrate, and the electronic element on the second surface of the second substrate is positioned in the hollowed-out area of the first substrate; and the third substrate is arranged on the second surface of the first substrate through the metal bare dew point of the second surface of the first substrate, so that a stacked structure is formed, the extension area of the PCB is reduced, a wireless system is arranged in the hollowed-out area, and the periphery of the third substrate is provided with a metal shielding layer, so that the coexistence interference among the wireless systems of the stacked module is effectively reduced, and the communication performance is improved.
It will be appreciated by persons skilled in the art that the above embodiments have been provided for the purpose of illustrating the application and are not to be construed as limiting the application, and that suitable modifications and variations of the above embodiments are within the scope of the application as claimed.
Claims (10)
1. A stacked module, comprising:
the first substrate is hollowed out in the middle to form at least one hollowed-out area, and comprises a first surface and a second surface, wherein the first surface and the second surface are provided with metal bare dew points;
the second substrate comprises a first surface and a second surface, the second surface of the second substrate is arranged on the first surface of the first substrate through a metal bare point of the first surface of the first substrate, and the electronic element on the second surface of the second substrate is positioned in a hollowed-out area of the first substrate;
and the third substrate is arranged on the second surface of the first substrate through the metal bare dew point of the second surface of the first substrate.
2. The stacking module of claim 1, wherein:
the second surface of the second substrate and the metal bare dew point of the first surface of the first substrate are arranged on the first surface of the first substrate in a welding mode;
the metal bare dew points of the third substrate and the second surface of the first substrate are arranged on the second surface of the first substrate in a welding mode.
3. The stacked structure of claim 1, wherein the metal bare dew point is an LGA pad.
4. The stacking module of claim 1 wherein the hollowed out area is metallized around the perimeter of the ring.
5. The stacking module of claim 1 wherein metal vias are provided around the hollowed out area at a predetermined distance.
6. The stacked module of claim 1, wherein the first side of the second substrate is provided with a first wireless system and a metallic shielding cover, the wireless system being built into the metallic shielding cover.
7. The stacked module of claim 1, wherein a ground pad is disposed around the hollowed out area to form a common ground shield for the first substrate, the second substrate, and the third substrate.
8. The stacked module of claim 1, wherein the first substrate, the second substrate, and the third substrate are PCB boards.
9. The stacking module of claim 1 wherein the electronic components on the second side of the second substrate form at least one second wireless system, each second wireless system being located in a hollowed out area of the first substrate.
10. An electronic device comprising a stack module according to any one of the preceding claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210601160.6A CN117202473A (en) | 2022-05-30 | 2022-05-30 | Stacked module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210601160.6A CN117202473A (en) | 2022-05-30 | 2022-05-30 | Stacked module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117202473A true CN117202473A (en) | 2023-12-08 |
Family
ID=89002136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210601160.6A Pending CN117202473A (en) | 2022-05-30 | 2022-05-30 | Stacked module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117202473A (en) |
-
2022
- 2022-05-30 CN CN202210601160.6A patent/CN117202473A/en active Pending
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