CN117177430A - Circuit board, integrated circuit module and electronic equipment - Google Patents

Abstract

The embodiment of the application provides a circuit board, an integrated circuit module and electronic equipment. The first sub-board layer of circuit board has seted up first through-hole, first through-hole is equipped with first conductive structure, the outward flange of the axial projection of first conductive structure is defining the through-flow projection region on the second sub-board layer of superpose on first sub-board layer surface, the second through-hole has been seted up in the through-flow projection region, the second through-hole intussuseption is filled with solid, and with the second conductive structure of first conductive structure electrical contact, first via hole and second via hole have still been seted up to the second sub-board layer, at least part of first via hole is located the through-flow projection region, and with first conductive structure insulation, the second via hole is outside the through-flow projection region, and through the circuit of second sub-board layer and corresponding first via hole electrical connection, the second via hole still is with the circuit electrical contact of first sub-board layer surface. Thus, the influence on the high-density arrangement of the circuit board connection structure on the surface of the circuit board under the condition of meeting the requirement of large current flow can be reduced.

Description

Circuit board, integrated circuit module and electronic equipment

Technical Field

The embodiment of the application relates to the technical field of circuit boards, in particular to a circuit board, an integrated circuit module and electronic equipment.

Background

The circuit board is a carrier for electrically connecting electronic components such as chips, and can be provided with corresponding through holes for connecting lines which are positioned in different layers and are in the same network, wherein the through holes can comprise signal through holes for transmitting signals, power supply through holes for transmitting current, grounding through holes for grounding and the like.

With the development of technology, the power requirements of some electronic components connected with a circuit board are continuously increased, and correspondingly, the requirements on the current-passing capability of the power via hole of the circuit board are also continuously increased, and the current-passing capability of the power via hole is related to the section size of the conductor therein. In some thick circuit boards need to carry out the scene of heavy current through-flow, in order to increase the through-flow capacity of power via hole, can set up through-hole formula through-hole on the circuit board, the power via hole includes the pore wall in through-hole and inlays the solid copper post of establishing in the through-hole, transmits the electric current through solid copper post. Because the smaller the diameter of the solid copper column is, the more difficult it is to manufacture and embed the solid copper column into the corresponding through holes, the more difficult it is to manufacture the power via hole with smaller aperture, and the power via hole with larger aperture distributed on the surface of the circuit board is unfavorable for the high-density arrangement of the circuit board connection structure of the circuit board surface for connecting electronic components. Therefore, how to reduce the influence on the high-density arrangement of the circuit board connection structure on the surface of the circuit board under the condition of meeting the requirement of large current flow becomes a problem to be solved urgently.

Disclosure of Invention

The embodiment of the application provides a circuit board, an integrated circuit module and electronic equipment. Through making the conductive structure that is used for transmitting electric current in the circuit board divide into two sections that the size is different, a section that the size is less is located the top layer that the circuit board is used for setting up electronic components, and rearrange the arrangement of the via hole that the circuit board is used for setting up the top layer of electronic components through the via hole that distributes at different layer dislocation, the influence of the great section of conductive structure size to the arrangement of surface layer via hole is little, can reduce the influence to the high-density arrangement of circuit board connection structure on circuit board surface under the demand that satisfies big electric current flow.

A first aspect of the present application provides a circuit board comprising a first sub-board layer having a surface on which a second sub-board layer is stacked. The first sub-board layer is provided with a first through hole, the first through hole is provided with a first conductive structure, and the outer edge of the axial projection of the first conductive structure defines a through-flow projection area on the second sub-board layer. The through-flow projection area is internally provided with a second through-flow hole which is a blind hole, the aperture of the second through-flow hole is smaller than that of the first through-flow hole with the opposite end surfaces, the second through-flow hole is internally filled with a second conductive structure which is a solid conductor, and the second conductive structure is in electrical contact with the first conductive structure with the opposite end surfaces. The second sub-board layer is also provided with a first via hole with blind holes, at least part of the first via hole is positioned in the through-flow projection area, the first via hole and the first conductive structure are arranged at intervals and are mutually insulated, the second sub-board layer is also provided with a second via hole corresponding to the first via hole, the second via hole is outside the through-flow projection area and is electrically connected with the corresponding first via hole through a circuit of the inner layer of the second sub-board layer where the second via hole is positioned, and the second via hole is also electrically contacted with a circuit of the surface of the first sub-board layer.

According to the circuit board provided by the embodiment of the application, the first through-hole with larger aperture is formed in the first sub-board layer, the first conductive structure is arranged in the first through-hole, the second sub-board layer is superposed on the surface of the first sub-board layer, the second through-hole with smaller aperture is formed in the through-flow projection area defined by the axial projection of the first conductive structure on the second sub-board layer, the second conductive structure is arranged in the second through-hole and is a solid conductive body, so that the second conductive structure is in electrical contact with the first conductive structure, current on the circuit board can be transmitted along the thickness direction of the circuit board through the first conductive structure and the second conductive structure, the aperture of the first through-hole is larger, the first conductive structure is easier to arrange, the second sub-board layer is positioned on the surface layer of the circuit board, the thickness of the second sub-board layer can be thinner, and the second conductive structure arranged as a solid conductive body is easier. Besides the second through holes, the through-flow projection area is further provided with first through holes which are spaced from the first conductive structures and are insulated from each other, the first through holes are electrically connected with the second through holes which are arranged on the second sub-board layer and are positioned outside the through-flow projection area through lines in the second sub-board layer, the first through holes are arranged in a staggered mode with the corresponding second through holes, the first through holes can be communicated with the lines which are positioned outside the first through holes on the first sub-board layer through the second through holes, the second conductive structures and the first through holes can be connected with different networks on the first sub-board layer, the first through holes and the second through holes which are connected in a staggered mode can be used for connecting component connecting parts of different networks on the electronic component respectively, the positions of the through holes of the second sub-board layer, which are opposite to the surface of the first sub-board layer, the first through holes of the first sub-board layer and the first conductive structures in the first through holes are arranged in the first through holes are small in the staggered mode, the second through holes are small in the influence of the arrangement of the through holes on the surface of the second sub-board layer, and the second through holes are small in the hole size, and the first through holes are beneficial to the high-density arrangement of the circuit board structure which deviates from the surface of the first sub-board layer. In addition, as the first through holes and the first conductive structures in the first through holes have small influence on the arrangement of the through holes on the surface of the second sub-board layer for mounting the electronic component, the first through holes with larger sizes can be formed, and the first conductive structures with larger sizes can be arranged in the first through holes, so that the first conductive structure can be suitable for a scene that a circuit board needs large current through flow, and the influence on the high-density arrangement of circuit board connection structures on the surface of the circuit board under the requirement of meeting the large current through flow can be reduced.

In one possible embodiment, the first conductive structure is electrically connected to a power line of the first sub-board layer inner layer.

In one possible embodiment, the first conductive structure is a solid structure filling the first through-hole lumen.

In one possible embodiment, the first conductive structure includes a first conductive wall formed on a wall of the first through hole and a filler filled in the first conductive wall.

In one possible embodiment, the filler is an electrically conductive filler, which is in electrical contact with the first electrically conductive wall.

In one possible embodiment, the conductive filler is integrated with the first conductive wall as a unitary structure.

In one possible embodiment, the filler is a hole plugging glue.

In one possible embodiment, the first conductive structure further includes a conductive connection portion disposed at an end of the first conductive wall facing the second sub-board layer, the conductive connection portion covering a corresponding end face of the filler and being electrically connected to the first conductive wall, and the second conductive structure is in electrical contact with the conductive connection portion.

In one possible embodiment, the thickness of the first conductive wall is greater than or equal to 4 mils.

In one possible embodiment, the first conductive structure comprises a solid metal block disposed within the first through-hole and in fastened connection with a wall of the first through-hole.

In one possible embodiment, the metal block is in an interference fit with the bore wall of the first through-flow bore.

In one possible embodiment, the first conductive structure further includes a first conductive wall formed on a wall of the first through hole, and the metal block is in interference fit with the first conductive wall.

In one possible embodiment, the metal block is adhesively secured to the wall of the first through-flow opening.

In one possible implementation manner, a third via hole is further formed at the connection part of the metal block and the first through hole, and the metal block is electrically connected with the power line of the inner layer of the first sub-board layer through the third via hole.

In one possible embodiment, the second sub-board layer is a multi-level high density interconnection board layer, the second via hole and the second conductive structure therein form a multi-level stacked hole structure, and the first via hole and the corresponding second via hole form a multi-level staggered hole structure.

In one possible embodiment, both side surfaces of the first sub-sheet layer are stacked with the second sub-sheet layer.

In one possible embodiment, at least two second throughflow holes are provided in the throughflow projection region.

In one possible embodiment, the second through-flow aperture has a pore size greater than or equal to 10 mils and less than or equal to 12 mils.

In one possible embodiment, the first through-flow aperture has a pore size of greater than or equal to 20 mils.

In one possible embodiment, the second via is a buried via.

A second aspect of the embodiment of the present application provides an integrated circuit module, including an electronic component and a circuit board according to any one of the foregoing embodiments, where the electronic component is disposed on the circuit board.

A third aspect of the embodiment of the present application provides an electronic device, including an electronic component and a circuit board according to any one of the foregoing embodiments, where the electronic component is disposed on the circuit board.

Drawings

Fig. 1 is a schematic structural diagram of a circuit board with electronic components according to an embodiment of the present application;

fig. 2 is a diagram showing a distribution of via holes on a surface of a second sub-board layer of a circuit board according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of another circuit board with electronic components according to an embodiment of the present application;

fig. 4 is a schematic structural diagram of another circuit board with electronic components according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of another circuit board with electronic components according to an embodiment of the present application;

fig. 6 is a schematic structural diagram of another circuit board with electronic components according to an embodiment of the present application;

Fig. 7 is a schematic structural diagram of another circuit board with electronic components according to an embodiment of the present application;

fig. 8 is a schematic structural diagram of another circuit board with electronic components according to an embodiment of the present application;

fig. 9 is a schematic diagram of a connection between a first conductive structure on a first sub-board layer of a circuit board and a power line through a third via according to another embodiment of the present application.

Reference numerals illustrate:

100. a first sub-sheet layer; 110. a first through-flow hole; 120. a first conductive structure; 121. a first conductive wall; 122. a filler; 123. a conductive connection portion; 124. a metal block; 130. a third via; 140. a fourth via; 200. a second sub-sheet layer; 210. a second vent; 220. a second conductive structure; 230. a first via; 240. a second via; 250. a through-flow projection region; 300. a line; 310. a power line; 400. an electronic component; 410. component connection structure.

Detailed Description

The terminology used in the description of the embodiments of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application, as will be described in detail with reference to the accompanying drawings.

The present application provides an electronic device that may include, but is not limited to, a cell phone, tablet, notebook, ultra-mobile personal computer (ultra-mobile personal computer, UMPC), handheld computer, touch-sensitive television, intercom, netbook, POS, personal digital assistant (personal digital assistant, PDA), wearable device, virtual reality device, smart door lock, server, switch, speaker, desk lamp, robot, etc.

The electronic device provided by the application can comprise an integrated circuit module and a shell, wherein the integrated circuit module is arranged in the shell. The integrated circuit module may include, but is not limited to, a backplane module, a midplane module, a backplane module, a switch fabric module, a main control board module, a service board module, and the like.

Fig. 1 is a schematic structural diagram of a circuit board with electronic components according to an embodiment of the present application.

As shown in fig. 1, the integrated circuit module provided by the present application may include a circuit board and an electronic component 400 disposed on the circuit board, where the electronic component 400 may be a chip such as a central processing unit (central processing unit, CPU), a graphics processor (graphics processing unit, GPU), a memory, or may also be a power module, a resistor, a capacitor, an inductor, or the like. One or more electronic components 400 may be disposed on a circuit board, and a plurality of different types of electronic components 400 may be disposed on the circuit board.

In an embodiment of the present application, the circuit board may include stacked multiple sub-board layers, each sub-board layer may include stacked multiple core boards, two adjacent core boards may be fixed by bonding with a prepreg, each core board may have a circuit 300 disposed thereon, the circuit 300 may include a power line 310, a signal line, a ground line, and the like, and each core board may have one or more of the power line 310, the signal line, and the ground line disposed thereon.

It can be understood that the power lines 310 on the same core board can be in the same network, and multiple segments of power lines 310 which are disconnected from each other and are in multiple different networks can be arranged on the same core board; the signal wires on the same core board can be in the same network, and the same core board can be provided with a plurality of sections of signal wires which are disconnected with each other and are in a plurality of different networks; the ground wires on the same core board can be in the same network, and the same core board can also be provided with a plurality of sections of ground wires which are disconnected with each other and are in a plurality of different networks.

In the embodiment of the present application, the electronic component 400 may be disposed on the circuit board through a circuit board connection structure on a surface of the circuit board and the component connection structure 410 on the electronic component 400 and electrically connected to the circuit board, where the arrangement of the circuit board connection structure on the circuit board corresponds to the arrangement of the component connection structure 410 on the electronic component disposed on the circuit board, and the component connection structure 410 on the electronic component 400 is connected to the corresponding circuit board connection structure on the circuit board.

It is understood that the circuit board connection structure may be a pad, a solder ball, etc. disposed on a surface of the circuit board, and the component connection structure 410 may be a pin, etc. disposed on the electronic component 400.

In the embodiment of the present application, the circuit board is further provided with a via hole, and the via hole may include a power via hole for connecting the power lines 310 of different layers, a signal via hole for connecting the signal lines of different layers, a ground via hole for connecting the ground lines of different layers, and the like.

On some circuit boards, the vias of the circuit board surface may be disposed between two adjacent circuit board connection structures, or the circuit board connection structures may be disposed on the end faces of the vias of the circuit board surface by a plating-fill-via technique (Plated Over Filled Via, POFV).

It should be noted that, the size of the circuit board connection structure and the center-to-center distance between two adjacent circuit board connection structures are related to the aperture of the via hole on the circuit board surface, the smaller the aperture of the via hole on the circuit board surface is, the smaller the size of the circuit board connection structure and the center-to-center distance between two adjacent circuit board connection structures are, the higher the density of the circuit board connection structures is, so that the circuit board connection structures on the circuit board surface can correspond to the component connection structures 410 arranged on the electronic component 400 on the circuit board in a high density. For example, in a circuit board for mounting a Ball Grid Array (BGA) chip, since the Ball Grid Array chip has a high density of solder Ball arrangement, a corresponding high density circuit board connection structure needs to be provided on the circuit board, which requires controlling the aperture of the via hole on the surface of the circuit board.

As technology advances, the power requirements of some electronic components 400 connected to circuit boards continue to increase. For example, for some high power chips, the increase in power needs to rely on the increase in chip power. After the power of the electronic component 400 is increased, the current required to flow through the electronic component 400 is correspondingly increased, and the requirement of the current capacity of the power via hole of the circuit board communicating with the power line 310 of the electronic component 400 is correspondingly increased. The current capacity of the power via hole is related to the cross-sectional area of the conductive structure of the power via hole, and the larger the cross-sectional area is, the stronger the current capacity of the power via hole is. In order to improve the current capacity of the power via, the conductive structure of the power via may be a solid conductor in the through hole of the power via, where the solid conductor may be formed in the through hole of the power via by electroplating, or may be set in the through hole of the power via by embedding.

However, solid conductors can only be formed in through-holes of circuit boards that are thin (e.g., less than 1mm thick) by one plating. For circuit boards with slightly thicker thicknesses (for example, the thickness is greater than or equal to 1mm and less than 4 mm), a multi-step electroplating filling method can be adopted to perform multi-press fit, multi-time drilling and multi-time electroplating to form power supply via holes with multi-step stacked hole structures, the multi-step electroplating filling method is adopted to form the power supply via holes comprising solid conductors on the circuit board, the process flow is long, the cost is high, and the reliability of the circuit board after the multi-press fit is low. When the thickness of the circuit board is thick (for example, the thickness is 4mm or more), it is difficult to form the power via including the solid conductor by electroplating, limited by the number of times the circuit board is subjected to press-fitting.

In the method of forming the solid conductor and then embedding the solid conductor in the through hole of the power via hole, the smaller the diameter of the solid conductor is, the more difficult the solid conductor is to be manufactured and embedded in the corresponding through hole, the more difficult the method of embedding the preformed solid conductor in the through hole of the power via hole is to be manufactured into the power via hole with smaller aperture, which is not beneficial to the high-density arrangement of the circuit board connection structure on the surface of the circuit board, and affects the arrangement and connection of the electronic components 400 with the high-density arrangement of the component connection structure 410 on the circuit board.

Fig. 2 is a diagram illustrating a distribution of via holes on a surface of a second sub-board layer of a circuit board according to an embodiment of the present application.

As shown in fig. 2 and referring to fig. 1, based on this, an embodiment of the present application provides a circuit board including a first sub-board layer 100, and a second sub-board layer 200 is stacked on a surface of the first sub-board layer 100. The first sub-sheet layer 100 is provided with a first through-flow hole 110, the first through-flow hole 110 is provided with a first conductive structure 120, and an axially projected outer edge of the first conductive structure 120 defines a through-flow projection region 250 on the second sub-sheet layer 200. The through-flow projection area 250 is provided with a second through-flow hole 210, the second through-flow hole 210 is a blind hole, the aperture of the second through-flow hole 210 is smaller than that of the first through-flow hole 110 with the opposite end surfaces, the second through-flow hole 210 is filled with a second conductive structure 220, the second conductive structure 220 is a solid conductor, and the second conductive structure 220 is in electrical contact with the first conductive structure 120 with the opposite end surfaces. The second sub-board layer 200 is further provided with a first blind hole type via hole 230, at least part of the first via hole 230 is located in the through-flow projection area 250, the first via hole 230 and the first conductive structure 120 are arranged at intervals and are insulated from each other, the second sub-board layer 200 is further provided with a second via hole 240 corresponding to the first via hole 230, the second via hole 240 is outside the through-flow projection area 250, and the circuit 300 of the inner layer of the second sub-board layer 200 where the second via hole 240 is located is electrically connected with the corresponding first via hole 230, and the second via hole 240 is further electrically contacted with the circuit 300 on the surface of the first sub-board layer 100.

Thus, for a thicker circuit board, the second conductive structure 220 can be formed in the second through-hole 210 of the second sub-board layer 200 on the surface layer by electroplating, the second conductive structure 220 is a solid conductor, the required aperture of the second through-hole 210 is smaller, and the requirement of large current flow can be met, the first through-hole 110 with larger aperture is formed on the first sub-board layer 100, the first conductive structure 120 capable of being used for large current flow can be easily arranged in the first through-hole 110, and the current on the circuit board can be transmitted along the thickness direction of the circuit board through the first conductive structure 120 and the second conductive structure 220 which are in electrical contact. Besides the second through hole 210, the through-flow projection area 250 is further provided with first through holes 230 which are spaced from the first conductive structures 120 and are insulated from each other, the first through holes 230 are electrically connected with the second through holes 240 which are arranged on the second sub-board layer 200 and are positioned outside the through-flow projection area 250 through the circuits 300 in the second sub-board layer 200, the first through holes 230 are arranged in a staggered manner with the corresponding second through holes 240, the first through holes 230 can be communicated with the circuits 300 which are arranged outside the first through hole 110 on the first sub-board layer 100 through the second through holes 240, the second conductive structures 220 and the first through holes 230 can be connected with different networks on the first sub-board layer 100, the first through holes 230 and the second through holes 240 which are connected in a staggered manner can be respectively connected with the element connecting parts of different networks on the electronic element 400, the positions of the through holes of the second sub-board layer 200, which are opposite to the surface of the first sub-board layer 100, the first through holes 110 of the first sub-board layer 100 and the first conductive structures 120 in the first through holes 110 of the first sub-board layer 100 can be arranged on the surface of the second sub-board layer 200, the second through holes 200 are arranged away from the surface of the second sub-board layer 200, and the second through holes of the second conductive structures of the second sub-board layer 200 are arranged on the surface of the second sub-board layer 200, and the surface of the second sub-board layer 200 is opposite to the surface of the second through hole 200, which is arranged. In addition, since the first through-hole 110 and the first conductive structure 120 therein have a small influence on the arrangement of the through holes on the surface of the second sub-board layer 200 for mounting the electronic component 400, the first through-hole 110 with a larger size can be formed and the first conductive structure 120 with a larger size can be arranged in the first through-hole 110, which is suitable for a scenario that the circuit board needs a large current through-flow, thus reducing the influence on the high-density arrangement of the circuit board connection structure on the surface of the circuit board under the requirement of meeting the large current through-flow.

The implementation manner of the circuit board provided by the embodiment of the application is explained below.

As shown in fig. 1, the circuit board according to the embodiment of the present application includes a first sub-board layer 100, and a second sub-board layer 200 is stacked on a surface of the first sub-board layer 100. It should be noted that the second sub-board layer 200 may be stacked only on the surface of one side of the first sub-board layer 100, or the second sub-board layer 200 may be stacked on the surface of both sides of the first sub-board layer 100.

It will be appreciated that the first sub-sheet layer 100 and the second sub-sheet layer 200 may be secured by prepreg bonding. The first sub-sheet layer 100 and the second sub-sheet layer 200 may each be formed by laminating a plurality of stacked core sheets and prepreg positioned between two adjacent core sheets. The second sub-sheet layer 200 may be fabricated on the surface of the first sub-sheet layer 110 after the first sub-sheet layer 100 is molded. The first sub-sheet layer 100 and the second sub-sheet layer 200 may be formed separately and then pressed together.

As shown in fig. 1 and 2, in the embodiment of the present application, the first sub-board layer 100 is provided with a first through-hole 110, the first through-hole 110 is provided with a first conductive structure 120, and an axially projected outer edge of the first conductive structure 120 defines a through-flow projection area 250 on the second sub-board layer 200.

It should be noted that, when the second sub-board layer 200 is stacked on the surface of only one side of the first sub-board layer 100 and the surface of the other side is the surface of the circuit board, the first through-hole 110 is a blind hole; when the second sub-board layer 200 is stacked on both side surfaces of the first sub-board layer 100, or the second sub-board layer 200 is stacked on one side surface of the first sub-board layer 100, and other sub-board layers are stacked on the other side surface, the first through hole 110 is a buried hole, and the first sub-board layer 100 is an inner layer structure of the circuit board.

The first conductive structure 120 may include a first conductive wall 121 formed on a hole wall of the first through hole 110, and an inner cavity of the first conductive wall 121 may be a hollow structure or may be filled with a filler 122. The first conductive structure 120 may also include a conductive body embedded in the first through hole 110, and the conductive body may be a solid structure or a hollow structure.

The first conductive structure 120 may be insulated from the circuit 300 of the inner layer of the first sub-board layer 100, and may electrically connect the first conductive structure 120 with the power line 310 of the inner layer of the first sub-board layer 100.

It can be appreciated that the first sub-board layer 100 may be provided with one or more first through holes 110 according to needs, and the first conductive structures 120 in different first through holes 110 may be connected to different power networks.

In the embodiment of the present application, the through-flow projection area 250 of the second sub-board layer 200 is provided with a second through-flow hole 210, the second through-flow hole 210 is a blind hole, the aperture of the second through-flow hole 210 is smaller than that of the first through-flow hole 110 opposite to the end surface thereof, the second through-flow hole 210 is filled with a second conductive structure 220, the second conductive structure 220 is a solid conductor, and the second conductive structure 220 is in electrical contact with the first conductive structure 120 opposite to the end surface thereof.

It will be appreciated that the second conductive structure 220 may be formed by electroplating the second sub-sheet layer 200 prior to lamination of the first sub-sheet layer 100 and the second sub-sheet layer 200 to form a circuit board. The second conductive structure 220 may also be formed during the fabrication of the second sub-board layer 200 on the surface of the first sub-board layer 100.

The second conductive structures 220 may be copper pillars, silver pillars, etc.

A circuit board connection structure for connection with the component connection structure 410 of the electronic component 400 may be disposed on an end surface of the second conductive structure 220 facing away from the first conductive structure 120, and the second conductive structure 220 may be electrically connected with the power line 310 of the electronic component 400 through the circuit board connection structure and the corresponding component connection structure 410 of the end surface thereof.

In the embodiment of the present application, the second sub-board layer 200 is further provided with a first via 230 with a blind hole, at least a portion of the first via 230 is located in the through-current projection area 250, and the first via 230 and the first conductive structure 120 are spaced apart and insulated from each other. The second sub-board layer 200 is further provided with a second via hole 240 corresponding to the first via hole 230, the second via hole 240 is outside the through-flow projection area 250, and is electrically connected with the corresponding first via hole 230 through the circuit 300 of the inner layer of the second sub-board layer 200 where the second via hole 240 is located, and the second via hole 240 is further electrically contacted with the circuit 300 on the surface of the first sub-board layer 100.

It should be noted that, the first via 230 and the second via 240 are connected to the circuit 300 of the same network, and the first via 230 and the second via 240 may be signal vias, power vias or ground vias, and may be connected to a signal network, a power network or a ground network.

A circuit board connection structure for connection with the component connection structure 410 of the electronic component 400 may be disposed on an end surface of the first via 230 opposite to the first conductive structure 120, and the first via 230 may be electrically connected with a signal line, a power line 310 or a ground line corresponding to the electronic component 400 through the circuit board connection structure and the corresponding component connection structure 410 on the end surface.

It is understood that the second via 240 may be a blind via or a buried via.

The conductive structure of the first via 230 may be a second conductive wall or a solid conductor formed in the wall of the first via 230, and the conductive structure of the second via 240 may be a third conductive wall or a solid conductor formed in the wall of the second via 240.

In the above embodiment, for a thicker circuit board, the second conductive structure 220 may be formed in the second through-hole 210 of the second sub-board layer 200 on the surface layer by electroplating, the second conductive structure 220 is a solid conductor, the required aperture of the second through-hole 210 is smaller, and the requirement of large current flow can be met, the first through-hole 110 with larger aperture is formed on the first sub-board layer 100, the first conductive structure 120 for large current flow can be easily arranged in the first through-hole 110, and the current on the circuit board can be transferred along the thickness direction of the circuit board through the first conductive structure 120 and the second conductive structure 220 in electrical contact. Besides the second through hole 210, the through-flow projection area 250 is further provided with first through holes 230 which are spaced from the first conductive structures 120 and are insulated from each other, the first through holes 230 are electrically connected with the second through holes 240 which are arranged on the second sub-board layer 200 and are positioned outside the through-flow projection area 250 through the circuits 300 in the second sub-board layer 200, the first through holes 230 are arranged in a staggered manner with the corresponding second through holes 240, the first through holes 230 can be communicated with the circuits 300 which are arranged outside the first through hole 110 on the first sub-board layer 100 through the second through holes 240, the second conductive structures 220 and the first through holes 230 can be connected with different networks on the first sub-board layer 100, the first through holes 230 and the second through holes 240 which are connected in a staggered manner can be respectively connected with the element connecting parts of different networks on the electronic element 400, the positions of the through holes of the second sub-board layer 200, which are opposite to the surface of the first sub-board layer 100, the first through holes 110 of the first sub-board layer 100 and the first conductive structures 120 in the first through holes 110 of the first sub-board layer 100 can be arranged on the surface of the second sub-board layer 200, the second through holes 200 are arranged away from the surface of the second sub-board layer 200, and the second through holes of the second conductive structures of the second sub-board layer 200 are arranged on the surface of the second sub-board layer 200, and the surface of the second sub-board layer 200 is opposite to the surface of the second through hole 200, which is arranged. In addition, since the first through-hole 110 and the first conductive structure 120 therein have a small influence on the arrangement of the through holes on the surface of the second sub-board layer 200 for mounting the electronic component 400, the first through-hole 110 with a larger size can be formed and the first conductive structure 120 with a larger size can be arranged in the first through-hole 110, which is suitable for a scenario that the circuit board needs a large current through-flow, thus reducing the influence on the high-density arrangement of the circuit board connection structure on the surface of the circuit board under the requirement of meeting the large current through-flow.

In some examples, a fourth via 140 is further disposed in the first sub-board layer 100, and the fourth via 140 is electrically connected to the second via 240 through a line 300 on the surface layer of the first sub-board layer 100. In this way, the second via holes 240 corresponding to the second sub-board layer 200 may be connected to the lines 300 of the inner layer of the first sub-board layer 100 through the fourth via holes 140, or the second via holes 240 corresponding to the second sub-board layer 200 on both sides of the first sub-board layer 100 may be connected through the fourth via holes 140. Note that the fourth via 140 may be a buried via.

It can be appreciated that when the first via 230 and the second via 240 are power vias, the fourth via 140 electrically connected to the first via and the second via is also a power via; when the first via 230 and the second via 240 are signal vias, the fourth via 140 electrically connected to the first via and the second via is also a signal via; when the first via 230 and the second via 240 are ground vias, the fourth via 140 electrically connected to the first via and the second via is also a ground via.

In an embodiment of the present application, the aperture of the first via 230 is less than or equal to 6 mils. In this way, a highly dense arrangement of circuit board connection structures of the second sub-board layer 200 for providing a surface of the electronic component 400 is facilitated.

In an embodiment of the present application, the second via 240 has a pore size less than or equal to 6 mils. In this way, the effect of the second via 240 on the routing of the line 300 on the surface of the first sub-board layer 100 can be reduced.

In an embodiment of the present application, the first conductive structure 120 is electrically connected to the power line 310 of the inner layer of the first sub-board layer 100. In this way, the current in the first conductive structure 120 can flow to the power line 310 of the inner layer of the first sub-board layer 100, and the current can flow in the direction perpendicular to the thickness direction of the circuit board through the first conductive structure 120.

In an embodiment of the present application, the second via 240 is a buried via. In this way, the influence of the second via holes 240 on the arrangement of the circuit board connection structures on the surface of the circuit board can be reduced, and the circuit board connection structures for connecting more different networks can be arranged on the surface of the second sub-board layer 200 facing away from the first sub-board layer 100.

In the embodiment of the present application, at least two second through-holes 210 are formed in the through-flow projection area 250. In this way, the second conductive structures 220 in the plurality of second through holes 210 may be communicated with the same power network through the first conductive structure 120 in one first through hole 110, so that the number of the first through holes 110 and the first conductive structures 120 in the first sub-board layer 100 may be reduced, which is beneficial to increasing the size of the first through holes 110 and the first conductive structures 110, improving the through-current capability of the first conductive structures 120, and improving the manufacturing efficiency and reducing the manufacturing cost of the first sub-board layer 100.

It will be appreciated that two, three, four or more second through-flow apertures 210 may be provided in the same through-flow projection area 250, with the first conductive structure 120 being in electrical contact with the second conductive structure 220 opposite its end face.

Multiple component connection structures 410 on the same electronic component 400 that need to be connected to the same power network may be electrically connected to multiple different second conductive structures 220 that are in electrical contact with the same first conductive structure 120. Multiple component connection structures 410 on different electronic components 400 that need to be connected to the same power network may be electrically connected to multiple different second conductive structures 220 that are in electrical contact with the same first conductive structure 120.

In an embodiment of the present application, both side surfaces of the first sub-sheet layer 100 are stacked with the second sub-sheet layer 200. Thus, under the requirement of large current, the circuit board connection structures on both sides of the circuit board can be arranged in high density, and the electronic components 400 with the component connection structures 410 arranged in high density can be arranged on both sides of the circuit board.

Fig. 3 is a schematic structural diagram of another circuit board with electronic components according to an embodiment of the present application.

As shown in fig. 3 and referring to fig. 1, in the embodiment of the present application, the second sub-board layer 200 is a multi-level high density interconnect board (High Density Interconnector, HDI) layer, the second via hole 210 and the second conductive structure 220 therein form a multi-level stacked hole structure, and the first via hole 230 and the corresponding second via hole 240 form a multi-level staggered hole structure.

In this way, the first via 230 and the second via 240 are formed in a staggered arrangement on the second sub-board layer 200, and the second conductive structure 220 is formed on the second sub-board layer 200 with a slightly thicker thickness.

As shown in fig. 1, in some examples, the second sub-plate layer 200 may be a second order high density interconnect plate layer, with the second via 210 and the second conductive structure 220 therein forming a second order stacked via structure.

As shown in fig. 3, in some examples, the second sub-plate layer 200 may also be a third-order high-density interconnect plate layer, and the second via hole 210 and the second conductive structure 220 therein form a third-order stacked hole structure, and one of the first via hole 230 and the second via hole 240 is a second-order stacked hole structure.

Of course, the second sub-sheet layer 200 may also be a four or more level high density interconnect sheet layer structure.

As shown in fig. 1, the method for forming the first via 230, the second via 240, the second via 210 and the second conductive structure 220 on the second sub-board layer 200 is described by taking the second sub-board layer 200 as a second-order high-density interconnection board layer as an example, so that the second sub-board layer 200 includes a first core board and a second core board, the first core board is laminated on the surface of the first sub-board layer 100, after the first core board is laminated on the surface of the first sub-board layer 100, the hole wall of the second via 240 and the first section of the second via 210 are formed on the first core board by laser or deep-drilling, then the first core board is electroplated, the conductive structure of the second via 240 electrically contacted with the circuit 300 on the surface of the first sub-board layer 100 is formed in the hole wall of the second via 240, and the first section of the second conductive structure 220 electrically contacted with the first conductive structure 120 is formed in the first section of the second via 210, then the second core board is laminated on the surface of the first core board through-board, the hole wall of the second via 230 is formed in the hole wall of the second via 210 and the second section of the second conductive structure is formed in the second via 220 electrically contacted with the first section of the second via 220, and the second section of the second conductive structure is formed in the first section of the second via 220 electrically contacted with the second via 220.

As shown in fig. 1-3, in an embodiment of the present application, the second through-flow aperture 210 has a pore size greater than or equal to 10 mils and less than or equal to 12 mils. It is appreciated that the diameter of the second conductive structures 220 within the second through-flow holes 210 is also greater than or equal to 10 mils and less than or equal to 12 mils.

In this way, the through-flow capability of the second conductive structure 220 in the second through-flow hole 210 is larger, and the aperture of the second through-flow hole 210 is smaller, which has less influence on the high-density arrangement of the circuit board connection structures of the second sub-board layer 200 for providing the surface of the electronic component 400. For example, when the second conductive structure 220 is a solid copper pillar filled in the second through-hole 210, the through-current capability of the second conductive structure 220 may reach 7 to 8A.

In an embodiment of the present application, the aperture of the first through-flow aperture 110 is greater than or equal to 20 mils.

In this way, the first conductive structure 120 with a larger size is formed in the first through hole 110, so as to meet the requirement of the through-current capability of the first conductive structure 120.

In an embodiment of the present application, the first conductive structure 120 is a solid structure that fills the cavity of the first through-hole 110.

In this way, the first conductive structure 120 can support the second sub-board layer 200, which is beneficial to press-forming the second sub-board layer 200 and the first sub-board layer 100, and reduces the risk of the second sub-board layer 200 being recessed at the first through hole 110.

Fig. 4 is a schematic structural diagram of another circuit board with electronic components according to an embodiment of the present application.

As shown in fig. 4, in an embodiment of the present application, the first conductive structure 120 includes a first conductive wall 121 formed on a wall of the first via hole 110.

In this way, the first conductive structure 120 is formed easily, and facilitates connection of the first conductive structure 120 to the power line 310 of the inner layer of the first sub-board layer 100.

It is to be understood that the first conductive wall 121 may be formed by opening the first through hole 110 on the first sub-board layer 100 and electroplating the first sub-board layer 100 before the first sub-board layer 100 and the second sub-board layer 200 are laminated.

In an embodiment of the present application, the thickness of the first conductive wall 121 is greater than or equal to 4 mils.

In this way, the first conductive wall 121 has a larger current-carrying capacity, which is beneficial to meeting the current-carrying requirement of the electronic component 400 connected with the first conductive wall 121. For example, when the first conductive wall 121 is a copper wall, the current-carrying capacity of the first conductive wall 121 may reach 7 to 8A.

In an embodiment of the present application, the first conductive structure 120 includes a filler 122 that is further filled in the first conductive wall 121.

In this way, the filler 122 can support the second sub-board layer 200, which is beneficial to press-forming the second sub-board layer 200 and the first sub-board layer 100, so as to reduce the risk of the second sub-board layer 200 sinking at the first through hole 110, and the filler 122 is easy to be arranged. In addition, the filler 122 is also beneficial to tightly attaching the first conductive wall 121 to the first through hole 110, so as to reduce the risk of the first conductive wall 121 falling off or being disconnected from the power line 310 in the first sub-board layer 100.

It is understood that the filler 122 may be an electrical conductor or an insulator.

In an embodiment of the present application, the filler 122 is a conductive filler that is in electrical contact with the first conductive wall 121.

In this way, the conductivity of the first conductive structure 120 is increased, and the current-passing capability of the first conductive structure 120 is improved.

It is understood that the conductive filler may be a structure formed by conductive paste such as conductive copper paste and conductive silver paste; the conductive filler may be a structure formed of a colloid such as a conductive resin or a conductive rubber.

In an embodiment of the present application, the conductive filler is integrated with the first conductive wall 121 as a unitary structure. In this way, the conductive filler is fixed firmly, is not easy to move and deform, is in electrical contact with the second conductive structure 220 stably, and has high efficiency and stable transmission of current between the conductive filler and the first conductive wall 121.

Illustratively, the conductive filler is a structure formed by conductive paste such as conductive copper paste and conductive silver paste, and can be combined with the first conductive wall 121 into an integral structure when the conductive paste is condensed.

In the embodiment of the present application, the filler 122 is a hole plugging glue. Thus, after the first conductive wall 121 is formed, the plug hole rubber plug is inserted into the hollow part of the first conductive wall 121 to complete filling, and the filling body 122 is more convenient to fill in the first conductive wall 121.

It is understood that the hole plugging glue may be a conductive glue, such as conductive rubber, conductive resin, etc.; the plug hole paste may also be an insulating paste, such as insulating resin, insulating rubber, or the like.

Fig. 5 is a schematic structural diagram of another circuit board with electronic components according to an embodiment of the present application.

As shown in fig. 5, in the embodiment of the present application, the first conductive structure 120 further includes a conductive connection portion 123 disposed at an end portion of the first conductive wall 121 facing the second sub-board layer 200, the conductive connection portion 123 covers a corresponding end surface of the filling body 122 and is electrically connected to the first conductive wall 121, and the second conductive structure 220 is electrically contacted to the conductive connection portion 123. In this way, the second conductive structure 220 is facilitated to be electrically connected with the first conductive wall 121.

It is understood that the conductive connection portion 123 may be a pad or other conductive plate, conductive sheet, or the like covering the corresponding end surface of the filler 122. The conductive connection portion 123 may be formed by electroplating the first sub-board layer 100 filled with the filler 122, and the conductive connection portion 123 may be formed together when forming the wiring 300 on the surface of the first sub-board layer 100.

When the filler 122 is a conductor or an insulator, the end of the first conductive wall 121 facing the second sub-board layer 200 may be provided with a conductive connection portion 123.

Fig. 6 is a schematic structural diagram of another circuit board with electronic components according to an embodiment of the present application.

As shown in fig. 6, in the embodiment of the present application, the first conductive structure 120 includes a solid metal block 124, where the metal block 124 is disposed in the first through hole 110 and is fastened to the hole wall of the first through hole 110. In this way, the first conductive structure 120 has strong current-passing capability, the metal block 124 has stable structure, is not easy to deform, and has good supporting effect on the second sub-board layer 200.

By way of example, the metal block 124 may be a copper block, a silver block, or the like.

In an embodiment of the present application, the metal block 124 is interference fit with the hole wall of the first through-hole 110. In this way, the metal block 124 is firmly fixed to the hole wall of the first through hole 110, the metal block 124 is not easy to move, is in electrical contact with the second conductive structure 220 stably, and is beneficial to electrically connecting the metal block 124 with the power line 310 extending from the inner layer of the first sub-board layer 100 to the hole wall of the first through hole 110. At this time, the first through-hole 110 may be opened after the first sub-board layer 100 is formed, and after the first through-hole 110 is formed, the preformed metal block 124 is embedded into the first through-hole 110, so that the metal block 124 is in interference fit with the hole wall of the first through-hole 110.

Fig. 7 is a schematic structural diagram of another circuit board with electronic components according to an embodiment of the present application.

As shown in fig. 7, in the embodiment of the present application, the first conductive structure 120 further includes a first conductive wall 121 formed on the hole wall of the first through hole 110, and the metal block 124 is in interference fit with the first conductive wall 121. In this way, the metal block 124 is electrically connected with the power line 310 extending from the inner layer of the first sub-board layer 100 to the hole wall of the first through hole 110 through the first conductive wall 121, and the stability of the electrical connection between the metal block 124 and the power line 310 of the inner layer of the first sub-board layer 100 is better. At this time, the first through hole 110 may be formed after the first sub-board layer 100 is formed, then the first conductive wall 121 is formed in the first through hole 110, and after the first conductive wall 121 is formed on the hole wall of the first through hole 110, the preformed metal block 124 is embedded into the first conductive wall 121, so that the metal block 124 is in interference fit with the first conductive wall 121.

In the embodiment of the present application, the metal block 124 is adhered to the wall of the first through-hole 110. In this way, the metal block 124 is easily fixed to the first through-hole 110.

In some examples, the metal block 124 may be adhesively secured by prepreg within the first sub-sheet layer 100. Thus, no additional adhesive is needed, and the manufacturing efficiency can be improved. It should be noted that, before the first sub-board layer 100 is pressed and formed, the metal block 124 may be placed into the first through-hole 110 formed, and during the pressing process of the first sub-board layer 100, the prepreg in the first sub-board layer 100 is pressed into the first through-hole 110, and the metal block 124 in the first through-hole 110 is bonded and fixed.

Of course, after the first sub-board layer 100 is pressed, the metal block 124 with the side wall coated with the adhesive may be placed in the first through hole 110, so that the metal block 124 and the hole wall of the first through hole 110 are adhered and fixed.

Fig. 8 is a schematic structural diagram of another circuit board with electronic components according to an embodiment of the present application, and fig. 9 is a schematic structural diagram of a first conductive structure on a first sub-board layer of another circuit board according to an embodiment of the present application, which is connected to a power line through a third via hole.

As shown in fig. 8 and 9, in the embodiment of the present application, a third via 130 is further formed at a connection portion between the metal block 124 and the first through hole 110, and the metal block 124 is electrically connected to the power line 310 of the inner layer of the first sub-board layer 100 through the third via 130. In this way, the metal block 124 can be connected to the power line 310 of the inner layer of the first sub-board layer 100, and the current can be passed through the metal block 124 and the third via 130 in the direction perpendicular to the thickness direction of the circuit board.

It should be noted that after the metal block 124 is fixed in the first through hole 110, a portion of the power line 310 on the first sub-board layer 100 is opened at the edge of the end surface of the metal block 124 along the thickness direction of the circuit board, and a portion of the third via hole 130 on the metal block 124 communicates the metal block 124 with the power line 310 on the first sub-board layer 100 through the conductive structure of the third via hole 130.

It is understood that the conductive structure of the third via 130 may be a fourth conductive wall formed in the wall of the third via 130, and the fourth conductive wall is filled with a solid structure for supporting the second sub-board layer 200.

In describing embodiments of the present application, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "coupled" should be construed broadly, and may be, for example, fixedly coupled, indirectly coupled through an intermediary, in communication between two elements, or in an interaction relationship between two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to specific circumstances.

The terms first, second, third, fourth and the like in the description and in the claims and in the above-described figures, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the embodiments of the present application, and are not limited thereto; although embodiments of the present application have been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims (21)

1. A circuit board comprising a first sub-board layer, the surface of the first sub-board layer being superposed with a second sub-board layer;

the first sub-board layer is provided with a first through-flow hole, the first through-flow hole is provided with a first conductive structure, and the axially projected outer edge of the first conductive structure defines a through-flow projection area on the second sub-board layer;

a second through hole is formed in the through-flow projection area, the second through hole is a blind hole, the aperture of the second through hole is smaller than that of the first through hole opposite to the end face of the second through hole, a second conductive structure is filled in the second through hole, the second conductive structure is a solid conductor, and the second conductive structure is in electrical contact with the first conductive structure opposite to the end face of the second conductive structure;

the second sub-board layer is further provided with a first via hole with blind holes, at least part of the first via hole is located in the through-flow projection area, the first via hole and the first conductive structure are arranged at intervals and are mutually insulated, the second sub-board layer is further provided with a second via hole corresponding to the first via hole, the second via hole is located outside the through-flow projection area, and the circuit of the inner layer of the second sub-board layer where the second via hole is located is electrically connected with the corresponding first via hole, and the second via hole is further electrically contacted with the circuit of the surface of the first sub-board layer.

2. The circuit board of claim 1, wherein the first conductive structure is electrically connected to a power line of the first sub-board layer inner layer.

3. The circuit board of claim 1 or 2, wherein the first conductive structure is a solid structure filling the first through-hole cavity.

4. The circuit board of claim 3, wherein the first conductive structure comprises a first conductive wall formed on a wall of the first via hole and a filler filled in the first conductive wall.

5. The circuit board of claim 4, wherein the filler is a conductive filler that is in electrical contact with the first conductive wall.

6. The circuit board of claim 5, wherein the conductive filler is integrated with the first conductive wall.

7. The circuit board of claim 4 or 5, wherein the filler is a paste.

8. The circuit board of any one of claims 4-7, wherein the first conductive structure further comprises a conductive connection portion provided at an end of the first conductive wall facing the second sub-board layer, the conductive connection portion covering a corresponding end face of the filler and being electrically connected to the first conductive wall, the second conductive structure being in electrical contact with the conductive connection portion.

9. The circuit board of any one of claims 4-8, wherein the first conductive wall has a thickness greater than or equal to 4 mils.

10. The circuit board of claim 3, wherein the first conductive structure comprises a solid metal block disposed within the first through-hole and in secure connection with a wall of the first through-hole.

11. The circuit board of claim 10, wherein the metal block is in interference fit with a hole wall of the first through hole;

or, the first conductive structure further comprises a first conductive wall formed on the hole wall of the first through hole, and the metal block is in interference fit with the first conductive wall.

12. The circuit board of claim 10, wherein the metal block is adhesively secured to the aperture wall of the first through-flow aperture.

13. The circuit board of claim 12, wherein a third via is further formed at a connection portion between the metal block and the first via hole, and the metal block is electrically connected to the power line of the inner layer of the first sub-board layer through the third via hole.

14. The circuit board of any of claims 1-13, wherein the second sub-board layer is a multi-level high density interconnect board layer, the second via and the second conductive structure therein form a multi-level stacked via structure, and the first via and the corresponding second via form a multi-level staggered via structure.

15. The circuit board of any of claims 1-14, wherein the second sub-board layer is stacked on both side surfaces of the first sub-board layer.

16. The circuit board of any one of claims 1-15, wherein at least two of the second vent holes are provided in the vent projection area.

17. The circuit board of any one of claims 1-16, wherein the second through-flow aperture has a pore size greater than or equal to 10 mils and less than or equal to 12 mils.

18. The circuit board of any one of claims 1-17, wherein the first through-flow aperture has a pore size of greater than or equal to 20 mils.

19. The circuit board of any one of claims 1-18, wherein the second via is a buried via.

20. An integrated circuit module comprising an electronic component and a circuit board according to any one of claims 1-19, the electronic component being disposed on the circuit board.

21. An electronic device comprising an electronic component and a circuit board according to any one of claims 1-19, the electronic component being disposed on the circuit board.