CN117172181A - Multi-scale body-attached grid generation method for multi-physical-field simulation - Google Patents
Multi-scale body-attached grid generation method for multi-physical-field simulation Download PDFInfo
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Abstract
The invention discloses a multi-scale body-attached grid generation method for multi-physical field simulation, which is a rapid generation method of discontinuous localized grids based on background grids, can realize precise geometric attachment aiming at complex shapes, can accommodate density differences of grids of a plurality of orders of magnitude between blocks, is continuous in key topological shape feature points, and is discontinuous in other discrete internal nodes; the operation speed is high, the non-uniform grid technology cross-scale simulation task can be realized without a large number of grids, and the calculation cost is low; in addition, the local area network grid technology only carries out multi-level sub-grid subdivision on the region of interest, greatly reduces grid number on the premise of not reducing calculation resolution, and provides a numerical skeleton for multi-scale simulation from micro-nano to system-level electronic devices.
Description
Technical Field
The invention relates to the technical field of chip multi-physical field simulation, in particular to a multi-scale body-attached grid generation method for multi-physical field simulation.
Background
For the multi-scale multi-physical field problem, the mainstream solution in recent years is to combine the traditional numerical calculation methods of microscopic scale (represented by a molecular dynamics method, no grid is needed), mesoscale (represented by a lattice boltzmann method, uniform grid) and macroscopic scale (represented by a finite element and finite volume method), and respectively solve and mutually transmit information.
Because of the principle, whether the grid exists or not and the difference of calculated variables among different scale methods is larger, the variable definition and conservation transfer of the interactive information among the cross-scale interfaces still have more difficulties.
The interfaces between blocks in the traditional block grid technology mostly belong to continuous grids, only similar scale problems can be simulated, for grid division of semiconductor devices with complex shapes, the prior commercial software mostly adopts an octree grid method to approach boundary surfaces through ladder right-angle grids, and the method has the following defects:
1. the zigzag geometric boundary is used for realizing the body fitting, which easily leads to larger errors in the calculation of multiple physical fields.
2. The thermal electromagnetic boundary is difficult to set.
3. Octree grid encryption involves a slow recursive iterative generation speed, which makes it difficult to meet the requirements of rapid design engineering.
Disclosure of Invention
The invention aims to provide a multi-scale body-attached grid generation method for multi-physical-field simulation, which aims at realizing accurate geometric fit aiming at complex appearance, can accommodate density differences of grids of a plurality of orders of magnitude among blocks, is continuous in key topological shape feature points, is discontinuous in other discrete internal nodes, has obvious advantages of cross-scale calculation, and opens up a new multi-scale semiconductor simulation idea.
In order to achieve the above object, the present invention provides a method for generating a multi-scale patch grid for multi-physical field simulation, including:
geometric modeling of the semiconductor device is realized through the basic shape building block type stacking modeling macro;
establishing a material linked list data structure, a mesh division constraint linked list data structure and a geometric component linked list data structure;
performing preliminary data processing on the geometric part linked list data in the geometric part linked list data structure to obtain an updated characteristic point set so as to generate a background grid of preliminary welting;
setting subdivision parameters for each side of the background grid and carrying out encryption processing;
a localized subdivision part for obtaining a localized multi-scale orthogonal welt grid;
it is determined whether to display the grid.
Optionally, in the method for generating a multi-scale body-attached grid for multi-physical-field simulation, the geometric modeling is implemented by a cuboid, prismatic and pyramidal building block stacked modeling macro, and parameterized and rapid modeling of capacitors, radiators, chips, PCB circuit boards and fans is implemented.
Optionally, in the method for generating a multi-scale patch grid for multi-physical field simulation, the material linked list data structure includes one or more of a material number, a material name, a phase attribute, a density, a viscosity, and a thermal conductivity.
Optionally, in the multi-scale patch mesh generation method for multi-physical field simulation, the mesh subdivision constraint linked list data structure includes one or more of index number, minimum mesh size and whether to localize identification information.
Optionally, in the method for generating a multi-scale patch grid for multi-physical field simulation, the geometric component linked list data structure includes one or more of component type, geometric parameter information, minimum envelope cuboid geometric information, grid constraint number and material number.
Optionally, in the method for generating a multi-scale patch grid for multi-physical field simulation, the generating a background grid of the preliminary welt includes:
forming a set of vertices of each geometric part envelope geometry in the geometric part linked list data;
deleting the duplicate points;
and (3) sequencing the coordinate geometry according to the ascending order of x/y/z respectively to obtain an updated characteristic point set, so as to generate a background grid of the preliminary welt.
Optionally, in the method for generating a multi-scale patch grid for multi-physical field simulation, setting subdivision parameters for each side of a background grid includes the steps of:
firstly, circulating each edge of the background grid, and then circulating the data of the linked list of the geometric parts; if the grid constraint localization identification of the geometric component is no, the grid constraint of the geometric component participates in the generation of non-uniform grids to obtain the minimum grid number and the maximum grid number of the edge under the constraint, and the intersection of the minimum grid number and the maximum grid number obtained before the edge is identical to the edge is obtained to obtain the subdivision parameters of the edge after updating.
Optionally, in the method for generating a multi-scale body-attached grid for multi-physical field simulation, the subdivision parameter of each edge of the background grid is encrypted to obtain the non-uniform grid coordinates and the node number of the calculation domain.
Optionally, in the method for generating a multi-scale patch grid for multi-physical field simulation, the step of locally splitting the component to obtain the localized multi-scale orthogonal welt grid includes the steps of: and (3) for the data circulation of the linked list of the geometric parts, if the grid constraint localization identification of the geometric parts is yes, sequentially recursively dividing bounding volumes j bounding i shapes from outside to inside, wherein the background grid of the bounding volumes j is formed by the grid of the last recursion bounding volume divided by the background grid, and finally obtaining the localized multi-scale orthogonal welt grid, wherein i and j are positive integers.
Optionally, in the method for generating a multi-scale patch grid for multi-physical field simulation, determining whether to display the grid includes the steps of: circulating the geometric parts, and judging whether the grid cells linked by the current geometric parts are displayed or not; if the center of the grid is not covered by the subsequent blocks, displaying the grid unit, and storing the local number and the global number of the grid unit into a mark array; if the center of the grid is covered by a subsequent block, the grid cells are not displayed.
Optionally, the method for generating the multi-scale patch grid for multi-physical field simulation further includes a complex geometric boundary grid segmentation method, including the steps of:
performing triangular patch description on the curved surface boundary, judging whether the display grid is intersected with any triangular patch representing the curved surface boundary or not based on the orthorhombic grid, and if so, calculating coordinates of polygonal corner points of the intersected cross section to obtain an interface polygon;
and dividing the orthogonal hexahedral mesh into two parts to form a new polyhedral mesh, and recording polyhedral mesh information on the two sides of the normal direction of the interface.
Optionally, in the multi-scale patch grid generating method for multi-physical field simulation, the polyhedral grid information includes one or more of the number of vertices, coordinate points, the number of faces, and a vertex set of the constituent faces, which are arranged in order.
Optionally, in the method for generating a multi-scale patch grid for multi-physical field simulation, the new polyhedral grid judges whether to display according to whether to be in a calculation domain.
Optionally, in the method for generating a multi-scale patch grid for multi-physical field simulation, the method further includes the steps of:
assigning material properties to all display grids; the mesh linked list is circulated first, whether the mesh is contained by the block is judged, and the material number of the block containing the mesh is assigned to the mesh.
Compared with the prior art, the invention has the following beneficial effects: the rapid generation method of the discontinuous localized grid based on the background grid can realize precise geometric fit aiming at complex shapes, can accommodate the density difference of grids of a plurality of orders of magnitude among blocks, is continuous in key topological shape feature points, and is discontinuous in other discrete internal nodes; the operation speed is high, the non-uniform grid technology cross-scale simulation task can be realized without a large number of grids, and the calculation cost is low; in addition, the local area network grid technology only carries out multi-level sub-grid subdivision on the region of interest, greatly reduces grid number on the premise of not reducing calculation resolution, and provides a numerical skeleton for multi-scale simulation from micro-nano to system-level electronic devices.
Drawings
FIG. 1 is a flow chart of a method for generating a multi-scale patch grid for multi-physical field simulation in an embodiment of the invention;
FIG. 2A is a schematic diagram of a multi-physical field geometry model of a semiconductor device system in accordance with an embodiment of the present invention;
fig. 2B is a schematic diagram of a multi-scale grid of a semiconductor device system according to an embodiment of the present invention;
FIG. 3A is a schematic diagram of a geometric modeling four-sided model in an embodiment of the invention;
FIG. 3B is a schematic diagram of a geometric modeling octahedral model in an embodiment of the present invention;
FIG. 3C is a schematic diagram of a twelve-sided model of geometric modeling in an embodiment of the invention;
FIG. 3D is a diagram of a sixteen-sided model of geometric modeling in an embodiment of the invention;
FIG. 4 is a schematic diagram of a multi-level LAN cell in accordance with an embodiment of the present invention;
FIG. 5A is a schematic diagram of an interface polygon in a method for edge segmentation and pasting of a curved surface boundary grid according to an embodiment of the present invention;
FIG. 5B is a schematic diagram of a second interface polygon in the method for edge segmentation and pasting of a curved surface boundary grid according to an embodiment of the present invention;
FIG. 5C is a schematic diagram III of an interface polygon in a method for edge segmentation and pasting of a curved surface boundary grid according to an embodiment of the present invention;
FIG. 5D is a schematic diagram of an interface polygon in a method for edge segmentation and pasting of a curved surface boundary grid according to an embodiment of the present invention;
fig. 5E is a schematic diagram of an interface polygon in the method for edge segmentation and pasting of a curved surface boundary grid according to an embodiment of the present invention.
Detailed Description
The present invention will be described in more detail below with reference to the drawings, in which preferred embodiments of the invention are shown, it being understood that one skilled in the art can modify the invention herein described while still achieving the advantageous effects of the invention. Accordingly, the following description is to be construed as broadly known to those skilled in the art and not as limiting the invention.
The invention is more particularly described by way of example in the following paragraphs with reference to the drawings. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the invention.
In this embodiment, a method for generating a multi-scale patch grid for multi-physical field simulation is provided, please refer to fig. 1 and fig. 2A-2B, which includes the following steps:
s1, geometric modeling of a semiconductor device is realized through a basic shape building block type stacking modeling macro;
s2, establishing a material linked list data structure, a mesh division constraint linked list data structure and a geometric component linked list data structure;
s3, performing preliminary data processing on the geometric part linked list data in the geometric part linked list data structure to obtain an updated characteristic point set so as to generate a background grid of the preliminary welt;
s4, setting subdivision parameters for each side of the background grid and carrying out encryption processing;
s5, locally splitting the component to obtain a localized multi-scale orthogonal welt grid;
s6, judging whether to display the grid.
Specifically, in step S1, please refer to fig. 3A-3D, intelligent geometric modeling is performed on the semiconductor device, and parametric rapid modeling of the semiconductor device such as the capacitor, the radiator, the chip, the PCB and the fan is realized through the basic shape building block type stacked modeling macros such as the cuboid, the prism and the cone building block.
In step S2, establishing the linked list data structure includes establishing a material linked list data structure, establishing a mesh constraint linked list data structure, and establishing a geometric component linked list data structure.
Specifically, the material chain table data structure includes one or more of material number, material name, phase attribute, density, viscosity, thermal conductivity and other physical information.
The mesh dissection constraint linked list data structure contains one or more of an index number, a minimum mesh size, and whether or not to localize identification information.
The geometric parts linked list data structure contains one or more of parts type, geometric parameter information, minimum envelope bounding box (boundbox) cuboid geometric information, grid constraint number, and material number.
In step S3, 8 vertices of each geometric part envelope geometry in the geometric part linked list data are assembled, duplicate points are deleted, the coordinate geometry is sorted according to ascending order of x, y and z, and an updated feature point set is obtained, so as to generate a background grid of the preliminary welt.
In step S4, please refer to fig. 4, the steps of performing local area network subdivision include:
s41, setting subdivision parameters for each edge of the background grid of the preliminary welt;
specifically, for each edge of the background grid of the preliminary welt, and then for the linked list data of the geometric component, if the grid constraint localization identifier of the geometric component is false (no), the grid constraint participates in the generation of the non-uniform grid.
Further, the minimum grid number and the maximum grid number of the edge under the constraint are obtained, and the intersection set of the minimum grid number and the maximum grid number of the edge in the grid subdivision constraint linked list data is obtained, so that the updated subdivision parameters of the edge are obtained.
S42, encrypting each side of the background grid according to subdivision parameters of each side to obtain non-uniform grid coordinates and node number of a calculation domain;
wherein the coordinate sets in the x, y and z directions are respectively denoted as x grid 、y grid Z grid 。
S43, performing localized subdivision of geometric components;
specifically, for the linked list data circulation of the geometric parts, if the grid constraint localization identification of the geometric parts is True (yes), sequentially recursively dividing bounding volumes j bounding i shapes from outside to inside, wherein the background grid of the bounding volumes j is formed by the grid of the last recursion bounding volume divided by the background grid, and finally, a localized multi-scale orthogonal welt grid is obtained, wherein i and j are positive integers.
In step S5, determining whether to perform grid display includes looping around the geometric part, determining whether the grid cell linked by the geometric part is displayed.
Further, the judging criteria include: judging whether the center of the grid is inside a subsequent Block (Block), if not, displaying the grid unit, and storing the local number and the global number of the grid unit into a mark array.
If the center of the grid is covered by a subsequent block, the grid cell is not displayed.
In step S6, when the mesh generated by the above method cannot be attached to the geometric boundary of the curved surface for the curved surface boundary such as a sphere, a cone or an external CAD input part, a mesh segmentation method is proposed in this embodiment to generate an aptamer mesh attached to the curved surface boundary.
Specifically, the method for cutting and welting the boundary grid of the complex geometric surface comprises the following steps: and (3) describing a series of triangular patches on the curved surface boundary, judging whether the display grid is intersected with any triangular patch representing the curved surface boundary or not based on the orthorhombic grid, if so, calculating coordinates of polygonal corner points of the intersected section, and further turning over, translating and axially transforming 128 possible cases into 5 cases through analysis, wherein reference is made to fig. 5A-5E, so that an interface polygon is obtained.
Further, the grid generated in the step S5 is divided into two parts to form a new polyhedral grid, and polyhedral grid information on the two sides of the normal direction of the interface is recorded.
The polyhedral mesh information includes one or more of the number of vertices, coordinate points, the number of faces, and a set of vertices arranged in order constituting the faces.
Further, whether the new polyhedral grid is displayed is judged according to whether the new polyhedral grid is in the calculation domain, the new polyhedral grid is displayed in the calculation domain, and otherwise, the new polyhedral grid is not displayed.
Further, after step S6, step S7 is further included: assigning material properties to all display grids; the mesh linked list is circulated first, whether the mesh is contained by the block is judged, and the material number of the block containing the mesh is assigned to the mesh.
In addition, post-processing rendering can be performed on the derived grid result data.
In summary, the scheme provided by the invention can rapidly and even real-timely generate tens of millions of orthogonal high-quality hexahedral meshes, and the operation speed is superior to that of the existing main stream commercial mesh subdivision software unstructured mesh technology; the cross-scale simulation task of the non-uniform grid technology can be realized without massive grids, and the calculation cost is low; in addition, the invention provides a local area network grid technology which only performs multi-level sub-grid subdivision on the region of interest, greatly reduces the grid number on the premise of not reducing the calculation resolution, and provides a numerical skeleton for multi-scale simulation from micro-nano to system-level electronic devices.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (14)
1. The multi-scale body-attached grid generation method for multi-physical field simulation is characterized by comprising the following steps of:
geometric modeling of the semiconductor device is realized through the basic shape building block type stacking modeling macro;
establishing a material linked list data structure, a mesh division constraint linked list data structure and a geometric component linked list data structure;
performing preliminary data processing on the geometric part linked list data in the geometric part linked list data structure to obtain an updated characteristic point set so as to generate a background grid of preliminary welting;
setting subdivision parameters for each side of the background grid and carrying out encryption processing;
a localized subdivision part for obtaining a localized multi-scale orthogonal welt grid;
it is determined whether to display the grid.
2. The method for generating a multi-scale body-attached grid for multi-physical-field simulation according to claim 1, wherein the geometric modeling is parameterized fast modeling of capacitors, heat sinks, chips, PCB boards and fans by cuboid, prismatic and pyramidal building block stacked modeling macros.
3. The method of generating a multi-scale patch grid for multi-physical field simulation of claim 1, wherein the material linked list data structure comprises one or more of a material number, a material name, a phase attribute, a density, a viscosity, and a thermal conductivity.
4. The method for multi-scale patch grid generation for multi-physical field simulation of claim 1, wherein the mesh subdivision constraint linked list data structure includes one or more of an index number, a minimum mesh size, and whether to localize identification information.
5. The method for multi-scale patch grid generation for multi-physical field simulation of claim 1, wherein the geometric component linked list data structure comprises one or more of component type, geometric parameter information, minimum envelope bounding box cuboid geometric information, grid constraint number, and material number.
6. The method for generating a multi-scale patch grid for multi-physical field simulation of claim 1, wherein the generating of the preliminary-welted background grid comprises:
forming a set of vertices of each geometric part envelope geometry in the geometric part linked list data;
deleting the duplicate points;
and (3) sequencing the coordinate geometry according to the ascending order of x/y/z respectively to obtain an updated characteristic point set, so as to generate a background grid of the preliminary welt.
7. The method for generating a multi-scale patch grid for multi-physical field simulation according to claim 1, wherein setting subdivision parameters for each side of the background grid comprises the steps of:
firstly, circulating each edge of the background grid, and then circulating the data of the linked list of the geometric parts; if the grid constraint localization identification of the geometric component is no, the grid constraint of the geometric component participates in the generation of non-uniform grids to obtain the minimum grid number and the maximum grid number of the edge under the constraint, and the intersection of the minimum grid number and the maximum grid number obtained before the edge is identical to the edge is obtained to obtain the subdivision parameters of the edge after updating.
8. The method for generating a multi-scale patch grid for multi-physical field simulation according to claim 7, wherein the subdivision parameters of each side of the background grid are encrypted to obtain non-uniform grid coordinates and node numbers of the calculation domain.
9. The method for generating a multi-scale patch grid for multi-physical field simulation of claim 7, wherein the step of obtaining the localized multi-scale orthogonal welt grid by locally dissecting the component comprises the steps of: and (3) for the data circulation of the linked list of the geometric parts, if the grid constraint localization identification of the geometric parts is yes, sequentially recursively dividing bounding volumes j bounding i shapes from outside to inside, wherein the background grid of the bounding volumes j is formed by the grid of the last recursion bounding volume divided by the background grid, and finally obtaining the localized multi-scale orthogonal welt grid, wherein i and j are positive integers.
10. The multi-scale patch grid generation method for multi-physical field simulation of claim 1, wherein determining whether to display the grid comprises the steps of:
circulating the geometric parts, and judging whether the grid cells linked by the current geometric parts are displayed or not; if the center of the grid is not covered by the subsequent blocks, displaying the grid unit, and storing the local number and the global number of the grid unit into a mark array; if the center of the grid is covered by a subsequent block, the grid cells are not displayed.
11. The method for generating a multi-scale patch grid for multi-physical field simulation of claim 1, further comprising a complex geometric border grid segmentation method comprising the steps of:
performing triangular patch description on the curved surface boundary, judging whether the display grid is intersected with any triangular patch representing the curved surface boundary or not based on the orthorhombic grid, and if so, calculating coordinates of polygonal corner points of the intersected cross section to obtain an interface polygon;
and dividing the orthogonal hexahedral mesh into two parts to form a new polyhedral mesh, and recording polyhedral mesh information on the two sides of the normal direction of the interface.
12. The method for multi-scale patch grid generation for multi-physical field simulation of claim 11, wherein the polyhedral grid information comprises one or more of a vertex number, a coordinate point, a face number, and a sequentially arranged vertex set constituting a face.
13. The method for generating a multi-scale patch grid for multi-physical-field simulation of claim 11, wherein the new polyhedral grid determines whether to display according to whether or not it is within a computational domain.
14. The method for generating a multi-scale patch grid for multi-physical field simulation of claim 11, further comprising the step of:
assigning material properties to all display grids; the mesh linked list is circulated first, whether the mesh is contained by the block is judged, and the material number of the block containing the mesh is assigned to the mesh.
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