CN117169112A - Composite material monitoring system and method based on wireless film pressure sensor - Google Patents
Composite material monitoring system and method based on wireless film pressure sensor Download PDFInfo
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- CN117169112A CN117169112A CN202311141882.9A CN202311141882A CN117169112A CN 117169112 A CN117169112 A CN 117169112A CN 202311141882 A CN202311141882 A CN 202311141882A CN 117169112 A CN117169112 A CN 117169112A
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- 239000002131 composite material Substances 0.000 title claims abstract description 71
- 238000012544 monitoring process Methods 0.000 title claims description 34
- 238000000034 method Methods 0.000 title claims description 16
- 238000001514 detection method Methods 0.000 claims abstract description 28
- 239000010408 film Substances 0.000 claims description 47
- 239000010409 thin film Substances 0.000 claims description 22
- 238000003860 storage Methods 0.000 claims description 18
- 230000006854 communication Effects 0.000 claims description 10
- 238000005070 sampling Methods 0.000 claims description 10
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- 238000005516 engineering process Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims description 5
- 229910001120 nichrome Inorganic materials 0.000 claims description 5
- 230000000087 stabilizing effect Effects 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 3
- -1 polydimethylsiloxane Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 28
- 238000010586 diagram Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
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- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 2
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- 238000005259 measurement Methods 0.000 description 2
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
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- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000003306 harvesting Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
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Abstract
The application relates to the technical field of composite material detection, and solves the problems that in the prior art, wiring is needed for interface debonding detection of a composite material, the detection cost is high and the detection range is limited.
Description
Technical Field
The application relates to the technical field of composite material detection, in particular to a composite material monitoring system and method based on a wireless film pressure sensor.
Background
Composite materials are important structural materials, such as Glass Fiber Reinforced Polymer (GFRP) and Carbon Fiber Reinforced Polymer (CFRP), and have been widely used in large-scale engineering of aerospace, wind turbine blades, etc. due to their high strength, low weight, low coefficient of thermal expansion, high fatigue resistance, inherent corrosion resistance and low electromagnetic reflectivity. These projects all share some common significant features: first, long-term service, these projects often are an important component of national economic development, often requiring continuous operation and work; secondly, the operation environment is bad, the engineering is often in the external open air environment, and can be eroded by rain water and be damaged by other external environments; third, the early accumulation damage is small and not easily noticeable. The damage that builds up earlier refers on the one hand to defects that occur during the manufacturing of the composite material and on the other hand to defects that are formed at the time of assembly of the machine. Defects that may occur during the manufacture of the composite material are numerous and include microcracking, fiber breakage, delamination, interfacial debonding, and the like. These defects can create potential safety hazards to the equipment and result in immeasurable losses.
In order to detect the problem of interfacial debonding in composites, researchers have developed various detection methods. For example: the embedded sensors are directly arranged in the composite material for detection, such as metal foil sensors and optical fiber sensors, but the sensors need to rely on a cable system for data acquisition and power supply in the working process, the cable system is a complicated and huge project, a large amount of manpower and material resources are involved, and the working temperature of the cable system is generally lower than 70 ℃ and cannot be used in a high-temperature extreme environment of about 200 ℃.
Disclosure of Invention
The application aims to solve the problems that wiring is needed, the detection cost is high and the detection range is limited in the prior art for performing interface debonding detection on a composite material, and provides a composite material monitoring system and method based on a wireless film pressure sensor.
In a first aspect, a composite monitoring system based on a wireless thin film pressure sensor is provided, comprising:
an RFID reader for transmitting electromagnetic waves containing an interrogation signal and receiving and demodulating a backscatter signal;
the RFID reader comprises a tag chip, wherein the tag chip is used for collecting and managing energy in a space, identifying an interrogation signal and responding, the tag chip is connected with a tag antenna and a microcontroller, the tag antenna is used for receiving electromagnetic waves sent by the RFID reader and sending back scattering signals according to instructions of the tag chip, and the microcontroller is connected with a flexible film pressure sensor through an analog-to-digital converter.
Further, the tag chip comprises a processor, and a radio frequency front end module, a rectifying and voltage stabilizing module, a clock module, a storage module and an SPI control module which are connected with the processor, wherein the tag antenna is connected with the radio frequency front end module, and the microcontroller is connected with the SPI control module.
Further, the radio frequency front end module comprises an energy acquisition module, an energy management module, an envelope detection module, a sampling module and a radio frequency switch module, wherein the energy acquisition module, the envelope detection module and the radio frequency switch module are all connected with a tag antenna, the energy acquisition module is connected with the energy management module, the envelope detection module is connected with the sampling module, and the energy management module, the sampling module and the radio frequency switch module are all connected with a processor.
Further, the microcontroller is directly connected with the flexible film pressure sensor, and the microcontroller comprises an analog-to-digital conversion module, and the analog-to-digital conversion module is used for converting an analog signal detected by the flexible film pressure sensor into a digital signal.
Further, the processor further comprises an encryption module, and the encryption module is used for encrypting the digital signal after analog-to-digital conversion through a symmetric encryption algorithm or an asymmetric encryption algorithm.
Further, the flexible film pressure sensor comprises a base layer, a sensitive layer, a supporting layer and a pressing layer which are sequentially arranged.
Furthermore, the base layer is made of polyimide, the sensitive layer comprises a plurality of NiCr film resistance grids, the supporting layer is a negative photoresist SU-8 square supporting layer, and the pressing layer is made of polydimethylsiloxane materials.
In a second aspect, there is provided a composite monitoring method based on a wireless thin film pressure sensor, comprising the composite monitoring system of any one of the first aspects, the monitoring method comprising:
a plurality of groups of flexible film pressure sensors and tag chips are arranged between two layers of composite materials to be monitored;
transmitting electromagnetic waves containing an interrogation signal through an RFID reader;
receiving the electromagnetic wave through a tag antenna, converting the electromagnetic wave into direct current to supply power for a tag chip, and demodulating an interrogation signal in the electromagnetic wave through the tag chip;
the tag chip sends a corresponding instruction to the microcontroller according to the demodulated inquiry signal;
the microcontroller controls the flexible film pressure sensor to carry out pressure data among the composite materials according to the received instruction;
the flexible film pressure sensor converts the detected pressure data into pressure information of a digital signal through an analog-to-digital converter;
the microcontroller sends the pressure information to the tag chip and stores the pressure information in a storage module of the tag chip;
the tag chip reads the pressure information in the storage module, generates a modulation signal by combining the self identification information, and sends out the modulation signal through the tag antenna based on the back scattering communication technology;
the RFID reader receives the modulation signal and demodulates the modulation signal to obtain pressure information and identification information, judges the debonding degree of the composite material according to the change of the pressure information, and identifies the position information of the flexible film pressure sensor according to the identification information.
Further, the tag chip encrypts the received pressure information to obtain encrypted data and stores the encrypted data in the storage module, reads the encrypted data in the storage module and generates a modulation signal by combining with own identification information, and sends the modulation signal out through the tag antenna based on a backscattering communication technology, the RFID reader receives the modulation signal and demodulates the modulation signal to obtain the encrypted data, the encrypted data is decrypted to obtain the pressure information, the composite material debonding degree is judged according to the change of the pressure information, and the position information of the flexible film pressure sensor is identified according to the identification information.
Further, the tag chip encrypts the received pressure information through a symmetric encryption algorithm or an asymmetric encryption algorithm.
The application has the following beneficial effects: the application can realize wireless detection of pressure between composite materials, has low detection cost, gets rid of the limitation of a complex wiring circuit, has wider application range, judges the debonding degree of the composite materials through the pressure change between the composite materials, and can realize interface debonding monitoring of the composite materials, thereby better ensuring the quality of the composite materials, early warning hidden danger caused by debonding the composite materials, and greatly improving the application range of the monitoring system by adopting a high-temperature-resistant material to manufacture a flexible film pressure sensor.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application.
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic structural diagram of a composite monitoring system based on a wireless thin film pressure sensor according to embodiment 1 of the present application;
fig. 2 is a schematic structural diagram of a radio frequency front end module in a composite material monitoring system based on a wireless thin film pressure sensor according to embodiment 1 of the present application;
FIG. 3 is a schematic diagram of the structure of a microcontroller in a composite material monitoring system based on a wireless thin film pressure sensor according to embodiment 1 of the present application;
FIG. 4 is a schematic structural diagram of a flexible film pressure sensor in a composite material monitoring system based on a wireless film pressure sensor according to embodiment 1 of the present application;
FIG. 5 is a schematic diagram of the structure of the composite monitoring system based on the wireless thin film pressure sensor according to the embodiment 1 of the present application, wherein the composite is not debonded;
FIG. 6 is a schematic diagram of the structure of the composite material monitoring system based on the wireless thin film pressure sensor according to the embodiment 1 of the present application, wherein the composite material is debonded;
FIG. 7 is a front view of a composite monitoring system based on a wireless thin film pressure sensor of example 1 of the present application installed between composites;
fig. 8 is a flow chart of a method for monitoring composite materials based on a wireless thin film pressure sensor according to embodiment 2 of the present application.
Reference numerals:
100. an RFID reader; 200. a tag chip; 201. a processor; 2011. an encryption module; 202. a radio frequency front end module; 2021. an energy harvesting module; 2022. an energy management module; 2023. an envelope detection module; 2024. a sampling module; 2025. a radio frequency switch module; 203. a rectifying and voltage stabilizing module; 204. a clock module; 205. a storage module; 206. an SPI control module; 300. a tag antenna; 400. a microcontroller; 401. an analog-to-digital conversion module; 500. an analog-to-digital converter; 600. a flexible thin film pressure sensor; 601. a base layer; 602. a sensitive layer; 603. a support layer; 604. and a pressing layer.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Example 1
The composite material monitoring system based on a wireless film pressure sensor according to embodiment 1 of the present application, as shown in fig. 1, includes:
an RFID reader 100 for transmitting electromagnetic waves including an interrogation signal and receiving and demodulating the backscatter signal, wherein the RFID reader 100 loads the interrogation information into the prepared carrier signal, emits into a space in the form of radio waves through an antenna of the RFID reader 100, and provides energy and the interrogation information to each tag chip 200;
the tag chip 200 is used for collecting and managing energy in a space and identifying an interrogation signal and responding, the tag chip 200 is connected with the tag antenna 300 and the microcontroller 400, the tag antenna 300 is used for receiving electromagnetic waves sent by the RFID reader 100 and sending back scattering signals according to instructions of the tag chip 200, and the microcontroller 400 is connected with the flexible film pressure sensor 600 through the analog-to-digital converter 500.
Specifically, the tag chip 200 includes a processor 201, and a radio frequency front end module 202, a rectifying and voltage stabilizing module 203, a clock module 204, a storage module and an SPI control module 206 connected to the processor 201, where the tag antenna 300 is connected to the radio frequency front end module 202, the microcontroller 400 is connected to the SPI control module 206, the data detected by the flexible film pressure sensor 600 is stored in the storage module 205 after being subjected to analog-to-digital conversion, and the tag chip 200 itself runs an analysis program to modulate the data, and then back-scatters and transmits the data back to the RFID reader 100 in combination with its own identification code.
In a further embodiment, as shown in fig. 2, the radio frequency front end module 202 includes an energy collecting module 2021, an energy management module 2022, an envelope detection module 2023, a sampling module 2024 and a radio frequency switch module 2025, where the energy collecting module 2021, the envelope detection module 2023 and the radio frequency switch module 2025 are all connected to the tag antenna 300, the energy collecting module 2021 is connected to the energy management module 2022, the envelope detection module 2023 is connected to the sampling module 2024, and the energy management module 2022, the sampling module 2024 and the radio frequency switch module 2025 are all connected to the processor 201, where a driver of the tag chip 200 needs to be written, on one hand, to ensure that the energy collecting module 2021 in the integrated space collects energy required for the chip and the whole tag chip 200 such as the microcontroller 400 to work normally, and on the other hand, identify specific interrogation signals, envelope detection, collection and the like.
In order to reduce the circuit structure, the process of performing analog-to-digital conversion on the analog signal is implemented by a program, specifically, as shown in fig. 3, the microcontroller 400 is directly connected to the flexible film pressure sensor 600, and the microcontroller 400 includes an analog-to-digital conversion module 401, where the analog-to-digital conversion module 401 is configured to convert the analog signal detected by the flexible film pressure sensor 600 into a digital signal.
In order to increase the security of the data, the processor 201 further includes an encryption module 2011, where the encryption module 2011 is configured to encrypt the analog-to-digital converted digital signal by using a symmetric encryption algorithm or an asymmetric encryption algorithm.
It should be noted that, a driver of the microcontroller 400 needs to be written to ensure that the query information transmitted by the tag chip 200 is received and responded. The pressure information of the flexible film pressure sensor 600 is analog-to-digital converted such that the analog signal is converted into a digital signal, and the pressure signal is encrypted. Data encryption is implemented using symmetric encryption or asymmetric encryption algorithms. Symmetric encryption uses the same key for encrypting and decrypting data, while asymmetric encryption uses a pair of public and private keys for encrypting and decrypting. The tag chip 200 shares a key or a public key with the FRID reader through a pre-shared key or establishing a secure communication channel to achieve data encryption and decryption.
As shown in fig. 4, the flexible film pressure sensor 600 includes a base layer 601, a sensitive layer 602, a supporting layer 603, and a pressure applying layer 604 sequentially disposed, where the base layer 601 is made of polyimide, so that the base layer 601 has a good high temperature resistance, the sensitive layer 602 includes a plurality of NiCr film resistors, where the NiCr film resistors have a small range along with a temperature fluctuation, so as to be capable of stably operating in a high temperature environment, and provide a reliable pressure detection result, the supporting layer 603 is a negative photoresist SU-8 loop-shaped supporting layer 603, the pressure applying layer 604 is made of a polydimethylsiloxane material, and when pressure is applied to the pressure applying layer 604, the resistance of the NiCr film resistor of the sensitive layer 602 changes correspondingly, and whether the composite material is debonded or not can be determined according to the change of the resistance, and the flexible film pressure sensor 600 can stably operate in a high temperature environment of about 200 ℃ and provide a reliable pressure detection result.
During monitoring, the tag antenna 300, the tag chip 200, the microcontroller 400 and the flexible film pressure sensor 600 are designed into a circuit board with a layout as shown in fig. 7 and are arranged between two layers of composite materials to be monitored, firstly, the RFID reader 100 sends electromagnetic waves to the tag antenna 300, wherein the electromagnetic waves comprise interrogation signals and energy, the tag antenna 300 receives the electromagnetic waves, on one hand, the electromagnetic waves are collected, rectified, stabilized in voltage and boosted to be converted into direct current, and the required energy is provided for the tag chip 200; on the other hand, the radio frequency front end module 202 reads and demodulates the query information transmitted by the RFID reader 100, the flexible film pressure sensor 600 module converts the pressure information into a resistance analog signal and transmits the resistance analog signal to the microcontroller 400, the microcontroller 400 converts the resistance analog signal into a digital signal by utilizing the analog-to-digital converter 500 and transmits the digital signal to the storage module 205 of the tag chip 200 through the communication port, at the moment, the tag chip 200 reads the information in the storage module 205 and carries out signal modulation together with the identification information of the tag chip, the information is transmitted to the RFID reader 100 by utilizing back scattering communication, the RFID reader 100 receives the information and processes the information to obtain the pressure information, so that the once complete wireless communication process of the pressure information is completed, and the flexible film pressure sensor 600 is a resistance type pressure sensor, and has the advantages of high sensitivity, high measurement speed, simple structure, high resolution and good frequency response characteristic, and can work under severe conditions of high temperature, high pressure and the like, and can be suitable for wireless detection of debonding of composite materials in large-scale projects such as aviation and wind blades, and the phenomenon of interface debonding does not occur at all, and the pressure value detected by the flexible film pressure sensor 600 is the maximum as shown in fig. 5; as shown in fig. 6, at this time, the composite materials at both sides are interfacial debonded, and the pressure value detected by the flexible film pressure sensor 600 is reduced.
Example 2
As shown in fig. 8, a method for monitoring a composite material based on a wireless thin film pressure sensor according to embodiment 2 of the present application includes:
s101, installing a plurality of groups of flexible film pressure sensors 600 and tag chips 200 between two layers of composite materials to be monitored;
s102, transmitting electromagnetic waves containing an interrogation signal through the RFID reader 100;
s103, receiving the electromagnetic wave through the tag antenna 300, converting the electromagnetic wave into direct current to supply power for the tag chip 200, and demodulating an interrogation signal in the electromagnetic wave through the tag chip 200;
s104, the tag chip 200 sends a corresponding instruction to the microcontroller 400 according to the demodulated inquiry signal;
s105, the microcontroller 400 controls the flexible film pressure sensor 600 to perform pressure data among the composite materials according to the received instruction;
s106, the flexible film pressure sensor 600 converts the detected pressure data into pressure information of a digital signal through the analog-to-digital converter 500;
s107, the microcontroller 400 sends the pressure information to the tag chip 200, and stores the pressure information in the memory module 205 of the tag chip 200;
s108, the tag chip 200 reads the pressure information in the storage module 205 and generates a modulation signal by combining the identification information of the tag chip 200, and sends out the modulation signal through the tag antenna 300 based on a backscattering communication technology;
s109, the RFID reader 100 receives the modulated signal and demodulates the modulated signal to obtain pressure information and identification information, wherein the identification information can be the number of the tag chip 200, and the number can be associated with the installation position during installation, so that the pressure information can be quickly identified as measurement data of which position of the composite material according to the number information, the debonding degree of the composite material can be judged according to the change of the pressure information, and the position information of the flexible film pressure sensor 600 can be identified according to the identification information.
In a further embodiment, the tag chip 200 encrypts the received pressure information to obtain encrypted data and stores the encrypted data in the storage module 205, the tag chip 200 reads the encrypted data in the storage module 205 and generates a modulation signal in combination with the identification information thereof, and sends the modulation signal out through the tag antenna 300 based on the backscatter communication technology, the RFID reader 100 receives the modulation signal and demodulates the modulation signal to obtain the encrypted data, decrypts the encrypted data to obtain the pressure information, determines the interface debonding degree of the composite material according to the change of the pressure information, and identifies the position information of the flexible film pressure sensor 600 according to the identification information.
In a further embodiment, the tag chip 200 encrypts the received pressure information by a symmetric encryption algorithm or an asymmetric encryption algorithm.
It should be noted that, by the method described in this embodiment, the wireless detection of the pressure between the composite materials can be implemented, and the adhesive layer between the composite materials can be arranged with corresponding numbers of tag antennas 300, tag chips 200, microcontrollers 400 and flexible film pressure sensors 600 (as shown in fig. 7) according to the area size and the requirement of the composite materials, so that the detection cost is low, the limitation of complex wiring circuits is eliminated, the application range is wider, and the debonding degree of the composite materials is judged by the pressure change between the composite materials, so that the interface debonding monitoring of the composite materials can be implemented, the quality of the composite materials can be better ensured, and the hidden danger brought after the debonding of the composite materials is early warned.
The above is only a preferred embodiment of the present application; the scope of the application is not limited in this respect. Any person skilled in the art, within the technical scope of the present disclosure, may apply to the present application, and the technical solution and the improvement thereof are all covered by the protection scope of the present application.
Claims (10)
1. A composite material monitoring system based on a wireless thin film pressure sensor, comprising:
an RFID reader for transmitting electromagnetic waves containing an interrogation signal and receiving and demodulating a backscatter signal;
the RFID reader comprises a tag chip, wherein the tag chip is used for collecting and managing energy in a space, identifying an interrogation signal and responding, the tag chip is connected with a tag antenna and a microcontroller, the tag antenna is used for receiving electromagnetic waves sent by the RFID reader and sending back scattering signals according to instructions of the tag chip, and the microcontroller is connected with a flexible film pressure sensor through an analog-to-digital converter.
2. The composite monitoring system based on the wireless film pressure sensor of claim 1, wherein the tag chip comprises a processor, and a radio frequency front end module, a rectifying and voltage stabilizing module, a clock module, a storage module and an SPI control module which are connected with the processor, wherein the tag antenna is connected with the radio frequency front end module, and the microcontroller is connected with the SPI control module.
3. The wireless thin film pressure sensor-based composite material monitoring system of claim 2, wherein the radio frequency front end module comprises an energy acquisition module, an energy management module, an envelope detection module, a sampling module and a radio frequency switch module, wherein the energy acquisition module, the envelope detection module and the radio frequency switch module are all connected with a tag antenna, the energy acquisition module is connected with the energy management module, the envelope detection module is connected with the sampling module, and the energy management module, the sampling module and the radio frequency switch module are all connected with a processor.
4. The wireless thin film pressure sensor based composite monitoring system of claim 1, wherein the microcontroller is directly connected to the flexible thin film pressure sensor, the microcontroller comprising an analog to digital conversion module for converting analog signals detected by the flexible thin film pressure sensor to digital signals.
5. The wireless thin film pressure sensor based composite monitoring system of claim 2, wherein the processor further comprises an encryption module for encrypting the analog-to-digital converted digital signal by a symmetric encryption algorithm or an asymmetric encryption algorithm.
6. The wireless thin film pressure sensor-based composite monitoring system of claim 1, wherein the flexible thin film pressure sensor comprises a base layer, a sensitive layer, a support layer, and a pressure applying layer disposed in sequence.
7. The composite monitoring system based on a wireless thin film pressure sensor of claim 6, wherein the base layer is made of polyimide, the sensitive layer comprises a plurality of NiCr thin film resistors, the support layer is a negative photoresist SU-8 loop support layer, and the pressure applying layer is made of polydimethylsiloxane material.
8. A composite monitoring method based on a wireless thin film pressure sensor, comprising the composite monitoring system of any one of claims 1-7, the monitoring method comprising:
a plurality of groups of flexible film pressure sensors and tag chips are arranged between two layers of composite materials to be monitored;
transmitting electromagnetic waves containing an interrogation signal through an RFID reader;
receiving the electromagnetic wave through a tag antenna, converting the electromagnetic wave into direct current to supply power for a tag chip, and demodulating an interrogation signal in the electromagnetic wave through the tag chip;
the tag chip sends a corresponding instruction to the microcontroller according to the demodulated inquiry signal;
the microcontroller controls the flexible film pressure sensor to carry out pressure data among the composite materials according to the received instruction;
the flexible film pressure sensor converts the detected pressure data into pressure information of a digital signal through an analog-to-digital converter;
the microcontroller sends the pressure information to the tag chip and stores the pressure information in a storage module of the tag chip;
the tag chip reads the pressure information in the storage module, generates a modulation signal by combining the self identification information, and sends out the modulation signal through the tag antenna based on the back scattering communication technology;
the RFID reader receives the modulation signal and demodulates the modulation signal to obtain pressure information and identification information, judges the debonding degree of the composite material according to the change of the pressure information, and identifies the position information of the flexible film pressure sensor according to the identification information.
9. The method for monitoring the composite material based on the wireless film pressure sensor according to claim 8, wherein the tag chip encrypts the received pressure information to obtain encrypted data and stores the encrypted data in the storage module, the tag chip reads the encrypted data in the storage module and generates a modulation signal by combining with the identification information of the tag chip, the modulation signal is sent out through the tag antenna based on a backscatter communication technology, the RFID reader receives the modulation signal and demodulates the modulation signal to obtain the encrypted data, the encrypted data is decrypted to obtain the pressure information, the debonding degree of the composite material is judged according to the change of the pressure information, and the position information of the flexible film pressure sensor is identified according to the identification information.
10. The method for monitoring composite material based on wireless film pressure sensor according to claim 9, wherein the tag chip encrypts the received pressure information by a symmetric encryption algorithm or an asymmetric encryption algorithm.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117554276A (en) * | 2024-01-09 | 2024-02-13 | 中国石油大学(华东) | Nonmetallic material aging detection device and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117554276A (en) * | 2024-01-09 | 2024-02-13 | 中国石油大学(华东) | Nonmetallic material aging detection device and method |
| CN117554276B (en) * | 2024-01-09 | 2024-03-26 | 中国石油大学(华东) | Nonmetallic material aging detection device and method |
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