CN117168772A - Method and device for measuring film stress in real time - Google Patents
Method and device for measuring film stress in real time Download PDFInfo
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- CN117168772A CN117168772A CN202210589476.8A CN202210589476A CN117168772A CN 117168772 A CN117168772 A CN 117168772A CN 202210589476 A CN202210589476 A CN 202210589476A CN 117168772 A CN117168772 A CN 117168772A
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- 239000011521 glass Substances 0.000 claims abstract description 74
- 239000007888 film coating Substances 0.000 claims abstract description 10
- 238000009501 film coating Methods 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
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- -1 acryl Chemical group 0.000 claims description 2
- 239000012994 photoredox catalyst Substances 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 claims 1
- 239000010408 film Substances 0.000 abstract description 75
- 238000007747 plating Methods 0.000 abstract description 29
- 238000001514 detection method Methods 0.000 abstract description 4
- 239000012788 optical film Substances 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 13
- 238000005259 measurement Methods 0.000 description 12
- 238000012544 monitoring process Methods 0.000 description 6
- 101100115215 Caenorhabditis elegans cul-2 gene Proteins 0.000 description 4
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- 238000009434 installation Methods 0.000 description 2
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- 230000003287 optical effect Effects 0.000 description 2
- 239000005304 optical glass Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Abstract
The invention discloses a method and a device for measuring film stress in real time, which belong to the field of detection of optical films, and comprise a cantilever Liang Boli, wherein one end of the cantilever Liang Boli is fixed, and the cantilever Liang Boli is matched with a light source and a linear CCD for use, so that light emitted by the light source is reflected by cantilever beam glass and then irradiates the linear CCD; after the linear CCD senses the light reflected to the linear CCD, the coordinate of the reflected light is read and transmitted to the controller; and the controller calculates the stress value of the film according to the offset of the reflected light before and after the film coating on the cantilever glass. The beneficial effects of the invention are as follows: the cantilever Liang Boli is adopted as a sample main body to be measured, the deflection of the reflected light on the linear CCD is utilized to calculate the warping degree of the cantilever beam glass, the film stress is further calculated, an expensive laser interferometer is not required to be used, the equipment cost is greatly reduced, the method can be used for rapidly measuring the film stress, and the method can also be directly installed in a film plating machine.
Description
Technical Field
The invention relates to the field of detection of optical films, in particular to a method and a device for measuring film stress in real time.
Background
Stress is one of the important performance parameters of optical films and may be the cause of poor products such as film cracks or film release. The measurement of the stress of the film has important value for guiding the coating process.
The main method for measuring the stress of the optical film at the present stage is based on measuring the surface shape by a laser interferometer, specifically, selecting a flatter glass sheet as a co-plating sheet, measuring the surface shape by the laser interferometer before plating, and measuring the surface shape again after plating; and comparing the curvature radius of the accompanying plating surfaces before and after plating, and calculating the film stress by a Stoney formula from the curvature radius. A typical face type measurement comprises the following steps: (1) Coarse adjustment, namely roughly aligning a sample to be measured with a standard mirror, and adjusting the position of a reflection light spot of the sample to be measured generally; (2) Fine-tuning, namely tuning a sample to be tested and a standard mirror to be parallel, and generally adjusting according to interference fringes of the sample to be tested and the standard mirror; (3) And measuring, namely performing multi-step fine movement on the standard mirror by adopting a phase shifting method, measuring the brightness of interference fringes corresponding to different positions, and finally calculating the surface type of the sample to be measured. The problems of high cost and complicated surface type measurement process of the laser interferometer exist, and the application of film stress measurement is limited, for example, stress on-line monitoring cannot be carried out on a deposited film.
Therefore, how to reduce the cost of film stress measurement and increase the measurement speed, so that the film stress measurement can be used for on-line monitoring is a problem to be solved by the technicians in the field.
Disclosure of Invention
In order to overcome the problems that the film stress measuring method in the prior art is high in cost and complex in process and the deposited film cannot be subjected to on-line stress measurement, the invention provides a method for measuring the film stress in real time, which comprises a cantilever Liang Boli, wherein one end of the cantilever Liang Boli is fixed, the cantilever Liang Boli is matched with a light source and a linear CCD for use, and light emitted by the light source is reflected by cantilever beam glass and then irradiated onto the linear CCD;
after the linear CCD senses the light reflected to the linear CCD, the coordinate of the reflected light is read and transmitted to the controller;
and the controller calculates the stress value of the film according to the offset of the reflected light before and after the film coating on the cantilever glass.
The main body of the sample to be measured is a cantilever Liang Boli, namely optical glass, is made of BK7, quartz or other materials, is polished on two sides, and has a length far greater than a width. Preferably, the length of the cantilever beam glass is more than 5 times of the width and more than 10 times of the thickness, and the typical cantilever beam glass specification is 100 x 10 x 0.5mm, and other dimensions meeting the requirements of the conditions are also feasible.
The method can be used for rapidly measuring the film stress, can also be directly arranged in a film plating machine, and can realize real-time monitoring of the film stress by utilizing the warping of the cantilever glass in the film plating process, so that the film plating parameters can be adjusted in real time, the surface shape of a product is ensured, and the yield is greatly improved for the occasion with strict surface shape requirements.
Preferably, the controller calculates the warp of the cantilever glass according to the offset of the reflected light before and after the film coating, and calculates the film stress by using the following formula:
wherein E is S Is the Young's modulus, v, of cantilever Liang Boli s Poisson ratio, t, of cantilever glass s Is the film thickness, L S And Δl are the length and warp, respectively, of the cantilever glass.
Preferably, when coating the surface of the cantilever glass, the controller acquires the offset of the reflected light in real time, and monitors the stress value of the film formed by the coating in real time.
Wherein the light emitted by the light source has three characteristics: (1) approximately parallel light; (2) approximating a line light source; (3) light energy is sensed by the linear CCD. Typical light sources such as lasers and shaped white light sources can be used as long as they meet the above characteristics.
Preferably, the light generated by the light source is parallel light or nearly parallel light. The light source is similar to parallel light and similar to a linear light source, and can prevent light spots from deviating from the detection range of the CCD when glass is warped.
Preferably, the light source and the linear CCD are respectively positioned at two sides of the cantilever glass, and reflected light is offset left and right on the linear CCD in the film coating process.
Preferably, the light source and the linear CCD are positioned directly above the cantilever Liang Boli and are disposed back and forth along the length of the cantilever Liang Boli, and the reflected light is shifted up and down on the linear CCD during the coating process.
The invention also provides a device for measuring the film stress in real time, which comprises cantilever glass and a controller, wherein one end of a cantilever Liang Boli is fixed, and the cantilever Liang Boli is matched with a light source and a linear CCD for use, so that light emitted by the light source can irradiate the linear CCD after being reflected by the cantilever glass; the input end of the controller is connected with the output end of the linear CCD. The controller processes and converts the acquired signals to obtain real-time stress values of the film, outputs the real-time stress values, and properly controls parameters of the film plating machine.
Preferably, the cantilever Liang Boli is made of glass, quartz, acryl, PC, plastic, metal, or other material with an optical surface, such as BK7, and the cantilever glass has a length of 5 times or more the width and a width of 10 times or more the thickness.
Wherein, the fixing base is used for fixing cantilever Liang Boli one end, and its main characterized by: (1) facilitating the installation and removal of cantilever glass; (2) Cantilever Liang Boli can be positioned, i.e., cantilever Liang Boli can be snapped into the same position each time. All the fixing seats meeting the above conditions are feasible.
A typical structure of a fixing base is described below, where the fixing base includes a base body, a slider and a spring, and the slider is installed in the base body by the spring and can move in the extension and retraction direction of the spring in the base body;
when the spring is in no external force, one end of the cantilever Liang Boli is pressed on one surface of the base body by the surface, far away from one side of the spring, of the sliding block; when the spring is in a compressed state, a positioning groove for mounting or dismounting one end of the cantilever Liang Boli is formed on the surface of one side, away from the spring, of the sliding block and one surface of the base.
Preferably, the cantilever glass is placed in a vacuum chamber, the light source and the linear CCD are placed outside the vacuum chamber, and the light rays are transmitted through a glass window of the vacuum chamber.
Preferably, the cantilever glass, the light source and the linear CCD are arranged in a vacuum chamber, and a circulating cooling water device for carrying out high-temperature protection on the light source and the linear CCD is further arranged in the vacuum chamber.
The beneficial effects are that:
the technical scheme of the invention has the following beneficial effects:
(1) The cantilever Liang Boli is adopted as a main body of a sample to be detected, the deflection of the reflected light on the linear CCD is utilized to calculate the warping degree of the cantilever beam glass, the film stress is further calculated, an expensive laser interferometer is not required, and the equipment cost is greatly reduced;
(2) The stress measuring device can be used for rapidly measuring the stress of the film, can be directly arranged in a film plating machine, and can realize real-time monitoring of the stress of the film by utilizing the warping of the cantilever glass in the film plating process, so that the film plating parameters can be adjusted in real time, the surface shape of a product is ensured, and the yield is greatly improved for the occasion with strict requirements on the surface shape, such as film plating production of large-caliber laser components;
(3) The linear CCD is utilized to sense the offset of the reflected light, and the warping degree of the cantilever beam glass is obtained, so that the operation is convenient, the measurement speed is high, and the real-time measurement can be carried out;
(4) One end of the cantilever Liang Boli is clamped by the fixing seat, so that the cantilever Liang Boli is convenient to install and detach.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some examples of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a preferred film stress measurement process of the present invention;
FIG. 2 is a schematic diagram showing the structure of a thin film stress measuring device according to the present invention;
FIG. 3 is a schematic view of a preferred film stress measuring apparatus according to the present invention;
FIG. 4 is a schematic perspective view of a preferred holder according to the present invention;
FIG. 5 is a schematic perspective view of a fixing base according to the present invention.
In the figure, 1, cantilever Liang Boli; 2. a light source; 3. a linear CCD; 4. a controller;
5. a fixing seat; 6. a film plating machine.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, based on the embodiments of the invention, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the invention. Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, based on the embodiments of the invention, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the invention.
According to the embodiment, the cantilever Liang Boli is adopted as a sample main body to be detected, the deflection of the reflected light on the linear CCD is utilized to calculate the warping degree of the cantilever beam glass, the film stress is further calculated, an expensive laser interferometer is not required, and the equipment cost is greatly reduced; the device can be used for rapidly measuring the film stress, can also be directly arranged in a film plating machine, and can realize real-time monitoring of the film stress by utilizing the warping of the cantilever glass in the film plating process, thereby being capable of adjusting film plating parameters in real time. The specific implementation mode is as follows:
as shown in fig. 1 and 2, the method for measuring the film stress in real time comprises a cantilever beam glass 1, wherein one end of the cantilever beam glass 1 is fixed, the cantilever beam glass 1 is matched with a light source 2 and a linear CCD 3 for use, and light emitted by the light source 2 is reflected by the cantilever beam glass 1 and then irradiates on the linear CCD 3;
after the linear CCD 3 senses the light reflected thereon, reading the coordinates of the reflected light thereon, and transmitting the coordinates to the controller 4;
the controller 4 calculates the stress value of the film according to the offset of the reflected light before and after the film coating on the cantilever glass 1. The method comprises the following specific steps:
step S101, fixing one end of a cantilever Liang Boli, and reading the coordinates of reflected light by a linear CCD and transmitting the coordinates to a controller;
step S102, coating a film on one surface of cantilever beam glass, and reading coordinates of reflected light in real time by a linear CCD and transmitting the coordinates to a controller;
and step S103, the controller calculates the stress value of the film in real time according to the offset of the reflected light before and after the film coating on the cantilever glass. When the film plating device is integrated on the film plating machine 6, the controller 4 adjusts the film plating parameters of the film plating machine 6 according to the film plating condition.
The main body of the sample to be measured is a cantilever Liang Boli, namely optical glass, is made of BK7, quartz or other materials, is polished on two sides, and has a length far greater than a width and a width far greater than a thickness, and preferably has a length more than 5 times the width and a width more than 10 times the thickness. Typical cantilever glass specifications are 100 x 10 x 0.5mm, or other specifications that meet a length that is much greater than a width and a width that is much greater than a thickness.
The method can be used for rapidly measuring the film stress, can also be directly arranged in a film plating machine, and can realize real-time monitoring of the film stress by utilizing the warping of the cantilever glass in the film plating process, so that the film plating parameters can be adjusted in real time, the surface shape of a product is ensured, and the yield is greatly improved for the occasion with strict surface shape requirements.
The controller 4 calculates the warping degree of the cantilever glass according to the offset of the reflected light before and after the film coating, and calculates the film stress by using the following formula:
wherein E is S Is the young's modulus of the cantilever Liang Boli,v s poisson ratio, t, of cantilever glass s Is the film thickness, L S And Δl are the length and warp, respectively, of the cantilever glass.
As a preferred embodiment, the controller acquires the deflection of the reflected light in real time when coating the surface of the cantilever glass, and monitors the film stress value formed by the coating in real time, wherein the measurement of the film stress is real-time and dynamic.
Wherein the light emitted by the light source has three characteristics: (1) approximately parallel light; (2) approximating a line light source; (3) light energy is sensed by the linear CCD. Typical light sources such as lasers and shaped white light sources can be used as long as they meet the above characteristics.
As a preferred embodiment, the light generated by the light source is parallel light or nearly parallel light. The light source is similar to parallel light and similar to a linear light source, and can prevent light spots from deviating from the detection range of the CCD when glass is warped.
As a preferred embodiment, the light source and the linear CCD are respectively positioned at two sides of the cantilever glass, and reflected light is offset left and right on the linear CCD in the film coating process.
In the initial state, the light emitted by the light source is reflected by the cantilever glass and then irradiates to a position near the center of the CCD; after coating, the glass is bent under the stress action of the coating layer, and reflected light can deviate. The reflected light may be shifted to the left or right depending on whether the film stress is compressive or tensile. The amount of deflection is linearly related to the degree of warpage of the glass.
As a preferred embodiment, the light source and the linear CCD are located directly above the cantilever Liang Boli and are disposed back and forth along the length of the cantilever Liang Boli, and the reflected light is shifted up and down the linear CCD during the coating process.
As shown in fig. 2-5, the invention also provides a device for measuring the film stress in real time, which comprises a cantilever beam glass 1 and a controller 4, wherein one end of the cantilever beam glass 1 is fixed, the cantilever beam glass 1 is matched with a light source 2 and a linear CCD 3 for use, so that the light emitted by the light source 2 can be irradiated onto the linear CCD after being reflected by the cantilever beam glass 1; the input end of the controller is connected with the output end of the linear CCD. The controller processes and calculates the CCD output signal in real time to obtain the stress value of the current film and outputs the stress value, so that the parameters of the film plating machine can be conveniently adjusted.
The cantilever glass 1 is made of glass, quartz, acrylic, PC, plastic, metal and other materials with optical surfaces, such as BK7. The length is more than 5 times of the width; the width is more than 10 times of the thickness.
The fixing seat 5 is used for fixing one end of the cantilever beam glass 1 and is mainly characterized in that: (1) facilitating the installation and removal of cantilever glass; (2) Cantilever Liang Boli can be positioned, i.e., cantilever Liang Boli can be snapped into the same position each time. All the fixing seats meeting the above conditions are feasible.
When a specific film is subjected to stress analysis, fixing a cantilever Liang Boli before coating on a fixed seat, and reading coordinates of reflected light; coating a film on one surface of the cantilever beam glass; and (3) fixing the cantilever glass on the fixing seat again, reading coordinates of the reflected light, and determining a stress value of the film according to the deflection of the reflected light.
In the following, a typical fixing structure is described, the fixing base 5 includes a base 51, a slider 52 and a spring 53, and the slider 52 is mounted in the base 51 by the spring 53 and is movable in the base in the extending and retracting direction of the spring.
When the spring is in no external force, one end of the cantilever Liang Boli is pressed on one surface of the base body by the surface, far away from one side of the spring, of the sliding block; when the spring is in a compressed state, a positioning groove for mounting or dismounting one end of the cantilever Liang Boli is formed on the surface of one side, away from the spring, of the sliding block and one surface of the base.
As a preferred embodiment, the cantilever glass is placed in a vacuum chamber, the light source and the linear CCD are placed outside the vacuum chamber, and the light is transmitted through a glass window of the vacuum chamber.
As a preferred implementation mode, the cantilever glass, the light source and the linear CCD are arranged in a vacuum chamber, and a circulating cooling water device for carrying out high-temperature protection on the light source and the linear CCD is further arranged in the vacuum chamber.
In the film plating process, the film is gradually accumulated on the lower surface of the cantilever glass, so that the glass is stressed and warped, and reflected light is offset. The deflection of the reflected light can be monitored in real time, so that the stress of the current coating can be monitored in real time. The controller processes and calculates the CCD output signal in real time to obtain the stress value of the current film and outputs the stress value, so that the parameters of the film plating machine can be conveniently adjusted.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, and various modifications and variations may be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The method for measuring the film stress in real time is characterized by comprising a cantilever Liang Boli, wherein one end of the cantilever Liang Boli is fixed, the cantilever Liang Boli is matched with a light source and a linear CCD for use, and light emitted by the light source is reflected by cantilever beam glass and then irradiates the linear CCD;
after the linear CCD senses the light reflected to the linear CCD, the coordinate of the reflected light is read and transmitted to the controller;
and the controller calculates the stress value of the film according to the offset of the reflected light before and after the film coating on the cantilever glass.
2. The method for measuring film stress in real time according to claim 1, wherein the controller calculates the warp of the cantilever glass according to the offset of the reflected light before and after the film coating, and calculates the film stress by using the following formula:
wherein E is S Is the Young's modulus, v, of cantilever Liang Boli s Poisson ratio, t, of cantilever glass s Is the film thickness, L S And Δl are the length and warp, respectively, of the cantilever glass.
3. The method for measuring the film stress in real time according to claim 1, wherein the controller acquires the offset of the reflected light in real time when the surface of the cantilever glass is coated, and monitors the film stress value formed by the coating in real time.
4. A method of measuring film stress in real time according to claim 1, wherein the light generated by the light source is parallel light or nearly parallel light.
5. The device for measuring the film stress in real time is characterized by comprising cantilever glass and a controller, wherein one end of a cantilever Liang Boli is fixed, and the cantilever Liang Boli is matched with a light source and a linear CCD for use, so that light emitted by the light source can irradiate the linear CCD after being reflected by the cantilever glass; the input end of the controller is connected with the output end of the linear CCD.
6. The apparatus for measuring film stress in real time according to claim 5, wherein the cantilever Liang Boli is made of one of glass, quartz, acryl, PC, plastic and metal.
7. The apparatus of claim 5, wherein the cantilever glass has a length that is greater than 5 times the width and a width that is greater than 10 times the thickness.
8. The apparatus for measuring film stress in real time according to claim 5, wherein one end of the cantilever Liang Boli is fixed on a fixed base, the fixed base comprises a base body, a sliding block and a spring, and the sliding block is installed in the base body through the spring and can move in the telescopic direction of the spring in the base body;
when the spring is in no external force, one end of the cantilever Liang Boli is pressed on one surface of the base body by the surface, far away from one side of the spring, of the sliding block; when the spring is in a compressed state, a positioning groove for mounting or dismounting one end of the cantilever Liang Boli is formed on the surface of one side, away from the spring, of the sliding block and one surface of the base.
9. The apparatus for measuring film stress in real time according to claim 5, wherein the cantilever glass is placed in a vacuum chamber, the light source and the linear CCD are placed outside the vacuum chamber, and the light is transmitted through a glass window of the vacuum chamber.
10. The method for measuring film stress in real time according to claim 5, wherein the cantilever glass, the light source and the linear CCD are placed in a vacuum chamber, and a circulating cooling water device for high-temperature protection of the light source and the linear CCD is further arranged in the vacuum chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210589476.8A CN117168772A (en) | 2022-05-26 | 2022-05-26 | Method and device for measuring film stress in real time |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210589476.8A CN117168772A (en) | 2022-05-26 | 2022-05-26 | Method and device for measuring film stress in real time |
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| CN117168772A true CN117168772A (en) | 2023-12-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210589476.8A Pending CN117168772A (en) | 2022-05-26 | 2022-05-26 | Method and device for measuring film stress in real time |
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| Country | Link |
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| CN (1) | CN117168772A (en) |
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- 2022-05-26 CN CN202210589476.8A patent/CN117168772A/en active Pending
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