CN117167983A - Quick temperature measurement dry burning prevention method - Google Patents
Quick temperature measurement dry burning prevention method Download PDFInfo
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- CN117167983A CN117167983A CN202311129121.1A CN202311129121A CN117167983A CN 117167983 A CN117167983 A CN 117167983A CN 202311129121 A CN202311129121 A CN 202311129121A CN 117167983 A CN117167983 A CN 117167983A
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- 230000002265 prevention Effects 0.000 title claims abstract description 20
- 238000009529 body temperature measurement Methods 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 78
- 239000000956 alloy Substances 0.000 claims abstract description 53
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 claims 1
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001976 improved effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Abstract
The invention discloses a quick temperature measurement dry burning prevention method, which comprises the following steps: s1, taking a temperature measuring circuit and measuring the TCR value of the alloy material resistance of the temperature measuring circuit to be Vtcr; s2, completely attaching the alloy material resistor of the temperature measuring circuit to the heating pipe of the heating circuit and connecting the temperature measuring circuit with the heating circuit; s3, presetting the dry-heating prevention temperature as Tmax and calculating the resistance value Rmax of the alloy material resistor at the temperature; and S4, when the resistance value of the alloy material resistance measured by the temperature measuring circuit in S3 reaches Rmax, the temperature measuring circuit controls the heating circuit to be disconnected. The invention has the advantages of rapid response speed and the like.
Description
Technical Field
The invention belongs to the technical field of over-temperature protection, and particularly relates to a rapid temperature measurement and dry burning prevention method.
Background
The main principle of the heating circuit in the existing heating temperature controller is that whether the current temperature exceeds a certain specified temperature or not is firstly identified, if the current temperature exceeds the specified temperature, the control system of the heating circuit obtains the type of over-temperature through a temperature sensor (such as an NTC sensor or a thermocouple sensor) when the current temperature is detected to be exceeded, the control system judges that the heating circuit is in a dry-heating state at the moment, the control system can control the circuit to be disconnected and stop heating, so that the aim of preventing dry-heating is fulfilled, however, the traditional temperature sensor generally needs seconds to determine the temperature to respond, and the response speed is not ideal.
Disclosure of Invention
The invention provides a quick temperature measurement dry burning prevention method which is quick in response and aims to solve the defects in the prior art.
In order to solve the technical problems, the invention adopts the following technical scheme:
the quick temperature measurement dry burning prevention method comprises the following steps:
s1, taking a temperature measuring circuit and measuring the TCR value of the alloy material resistance of the temperature measuring circuit to be Vtcr;
s2, completely attaching the alloy material resistor of the temperature measuring circuit to the heating pipe of the heating circuit and connecting the temperature measuring circuit with the heating circuit;
s3, presetting the dry-heating prevention temperature as Tmax and calculating the resistance value Rmax of the alloy material resistor at the temperature;
and S4, when the resistance value of the alloy material resistance measured by the temperature measuring circuit in S3 reaches Rmax, the temperature measuring circuit controls the heating circuit to be disconnected.
Preferably, the temperature measuring circuit in S1 includes an MCU, a first ADC module, a second ADC module, a dc power supply, a reference resistor and an alloy material resistor, where the MCU is connected to the dc power supply and the heating circuit, the reference resistor is connected to the MCU through the first ADC module, the alloy material resistor is connected to the MCU through the second ADC module, the reference resistor is connected to the alloy material resistor, and the reference resistor is a fixed resistor and has a resistance value of R1.
Preferably, the calculating Rmax in S3 specifically includes the following steps:
the MCU is disconnected with the heating circuit at normal temperature, then the values of the first ADC module and the second ADC module are read and are V1 and V2 respectively, and then the resistance value R of the alloy material resistor at normal temperature is calculated, wherein the normal temperature is T1, and the calculation formula of the resistance value R of the alloy material resistor is
Connecting MCU with heating circuit, working the heating circuit, reading the values of the first ADC module and the second ADC module and Vt1 and Vt2 respectively, and calculating the resistance value Rt of the alloy material resistor when the heating circuit heats, wherein the calculation formula of the resistance value Rt of the alloy material resistor is
The temperature of the heating pipe measured by the temperature measuring circuit through the alloy material resistor is T, and the calculation formula of the temperature is
Rmax is calculated through a preset Tmax value, and the calculation formula of Rmax is as follows
Rmax＝(Tmax-T1)*Vtcr+R
And finally, calculating a corresponding Vt2 maximum value through the Rmax value, and when the second ADC module detects the Vt2 maximum value, controlling the heating circuit to be disconnected by the MCU.
Preferably, the T1 is 25 ℃, and the alloy material resistance is nichrome wire. .
By adopting the technical scheme, the invention has the following beneficial effects:
according to the invention, the temperature of the heating pipe can be acquired and calculated by connecting the temperature measuring circuit to the heating circuit and attaching the heating pipe to the alloy material resistor, when the temperature measuring circuit is specifically applied, the dry heating prevention temperature is preset to be Tmax, the maximum value of the numerical value Vt2 of the second ADC module acquired by the MCU at the temperature is finally calculated, when the MCU acquires the numerical value, the heating circuit can be controlled to be disconnected from heating, the MCU acquisition numerical value in the invention is in the microsecond level, and compared with the second level in the prior art, the temperature measuring circuit has the advantages of rapid corresponding speed and greatly improved effect efficiency;
in conclusion, the invention has the advantages of rapid response speed and the like.
Drawings
FIG. 1 is a schematic diagram of a temperature measuring circuit and a heating circuit used in the rapid temperature measurement and dry burning prevention method of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown.
The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.
All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Example 1
In this embodiment, the data of the second ADC module is collected in microsecond level, so as to quickly determine whether the temperature of the current heating circuit is over-temperature or not, and whether power-off protection is required, which is quick in corresponding speed.
As shown in FIG. 1, in one embodiment of the present invention, the rapid temperature measurement and dry heating prevention method of the present invention is applied to a heating circuit and mainly used for performing over-temperature protection on the heating circuit, wherein the present invention mainly uses a temperature measurement circuit to perform test and judgment on the heating circuit to determine whether the heating circuit is over-temperature, the temperature measurement circuit is as shown in FIG. 1, and comprises an MCU, a first ADC module, a second ADC module, a direct current power supply, a reference resistor and an alloy material resistor, the MCU is respectively connected with the direct current power supply and the heating circuit, the heating circuit of the present invention may mainly comprise an alternating current power supply, a heating pipe, a relay and other parts, wherein the alternating current power supply is respectively connected with the relay and the heating pipe, the MCU is connected with the relay, the heating circuit can also comprise a heating temperature controller which can be connected with the MCU to receive a breaking signal so as to break the heating circuit for protection, in fig. 1, the MCU, namely the singlechip, is connected with the relay to send the breaking signal to the relay when the breaking is needed, the relay breaks to prevent the heating pipe from continuously heating and dry burning, the reference resistor is connected with the MCU through the first ADC module and is connected between the direct current power supply and the MCU, the alloy material resistor is connected with the MCU through the second ADC module, the reference resistor is connected with the alloy material resistor, namely the reference resistor is connected with the alloy material resistor in series, one end of the second ADC module is connected with the MCU, the other end of the second ADC module is positioned between the alloy material resistor and the reference resistor, the reference resistor is a fixed resistor, the resistance value is R1, and the other end of the alloy material resistor is grounded, and the heating circuit mainly comprises the following steps:
s1, taking a temperature measuring circuit, and determining that the specific alloy material resistance with the TCR value of the alloy material resistance of the temperature measuring circuit is Vtcr is an alloy material with a forward TCR, wherein the TCR value of the alloy material resistance is larger than 1000 ppm/DEG C, the TCR value is a resistance temperature coefficient, and the temperature coefficient of the alloy material resistance is utilized to calculate and finally react to the reading change of an ADC module so as to rapidly judge whether the temperature is over-temperature;
s2, completely attaching the alloy material resistor of the temperature measuring circuit to the heating pipe of the heating circuit and connecting the temperature measuring circuit with the heating circuit, wherein the alloy material resistor can be completely attached to the heating pipe, so that the temperature on the heating pipe can be quickly transferred to the alloy material resistor and can be kept consistent;
s3, presetting the dry-heating prevention temperature as Tmax and calculating the resistance value Rmax of the alloy material resistor at the temperature;
specifically, calculating Rmax in S3 specifically includes the following steps:
firstly, the MCU is disconnected with the heating circuit at normal temperature, namely GPIOA is disconnected in fig. 1, then the values of the first ADC module and the second ADC module are read and are V1 and V2 respectively, and then the resistance value R of the alloy material resistance at normal temperature is calculated, wherein the normal temperature is T1, the normal temperature T1 is generally defined as 25 ℃, and the calculation formula of the resistance value R of the alloy material resistance is that
Then connecting MCU with heating circuit, the heating circuit works, i.e. GPIOA and GPIOB in FIG. 1 are opened simultaneously, then the values of the first ADC module and the second ADC module are read and are Vt1 and Vt2 respectively, then the resistance value Rt of the alloy material resistance at the moment when the heating circuit heats is calculated, and the calculation formula of the resistance value Rt of the alloy material resistance at the moment is that
It will be appreciated that the values of Rt are one-to-one, and the values of Vt1 and Vt2 are one-to-one, and that in a particular application, the values of Vt1 and Vt2 may be collected several times more in order to reduce errors and observe whether the data change is smooth;
the temperature of the heating pipe measured by the temperature measuring circuit through the alloy material resistor is T, and the calculation formula of the temperature is
Rmax is calculated through a preset Tmax value, and the calculation formula of Rmax is as follows
Rmax＝(Tmax-T1)*Vtcr+R
Finally, calculating a corresponding Vt2 maximum value through the Rmax value, and when the second ADC module detects the Vt2 maximum value, controlling the heating circuit to be disconnected by the MCU;
and S4, when the resistance value of the alloy material resistance measured by the temperature measuring circuit in S3 reaches Rmax, the temperature measuring circuit controls the heating circuit to be disconnected.
It can be understood that the values of Vt1 and Vt2 are changed all the time, in the present invention, the maximum value of the change of the value of Vt2 is calculated after the maximum value Tmax of the dry-fire prevention temperature is assumed by the above formula, when the MCU collects the maximum value of Vt2 on the second ADC module, this means that the dry-fire prevention temperature has been reached, the MCU rapidly corresponds and controls the heating circuit to be disconnected, and the response speed is faster.
The invention can also be matched with a heating temperature controller for use, when the dry heating protection temperature set by the heating temperature controller is T2, tmax can be set to be slightly smaller than T2 when the temperature controller is matched with the heating temperature controller for use, so that the temperature measuring circuit can perform over-temperature protection, namely, the temperature measuring circuit can perform double protection, and as the Tmax is set to be slightly smaller than T2, if the T2 is set to be 180 ℃, the TCR fluctuation range of the alloy material resistor can be assumed to be +/-10%, the protection temperature can be set to be about 150 ℃, namely, the Tmax is 150 ℃, the temperature range measured by the temperature measuring circuit is 150+/-10%, so that the program of the invention is identified before the temperature does not reach 180 ℃, then power is cut off, thereby achieving the purpose of dry heating prevention, and the corresponding speed is faster.
The present embodiment is not limited in any way by the shape, material, structure, etc. of the present invention, and any simple modification, equivalent variation and modification made to the above embodiments according to the technical substance of the present invention are all included in the scope of protection of the technical solution of the present invention.
Claims (4)
1. The quick temperature measurement dry burning prevention method is characterized by comprising the following steps of:
s1, taking a temperature measuring circuit and measuring the TCR value of the alloy material resistance of the temperature measuring circuit to be Vtcr;
s2, completely attaching the alloy material resistor of the temperature measuring circuit to the heating pipe of the heating circuit and connecting the temperature measuring circuit with the heating circuit;
s3, presetting the dry-heating prevention temperature as Tmax and calculating the resistance value Rmax of the alloy material resistor at the temperature;
and S4, when the resistance value of the alloy material resistance measured by the temperature measuring circuit in S3 reaches Rmax, the temperature measuring circuit controls the heating circuit to be disconnected.
2. The rapid temperature measurement and dry burning prevention method according to claim 1, wherein: the temperature measuring circuit in S1 comprises an MCU, a first ADC module, a second ADC module, a direct current power supply, a reference resistor and an alloy material resistor, wherein the MCU is respectively connected with the direct current power supply and the heating circuit, the reference resistor is connected with the MCU through the first ADC module, the alloy material resistor is connected with the MCU through the second ADC module, the reference resistor is connected with the alloy material resistor, and the reference resistor is a fixed resistor with a resistance value of R1.
3. The rapid temperature measurement and dry burning prevention method according to claim 2, wherein: the calculating Rmax in the S3 specifically comprises the following steps:
the MCU is disconnected with the heating circuit at normal temperature, then the values of the first ADC module and the second ADC module are read and are V1 and V2 respectively, and then the resistance value R of the alloy material resistor at normal temperature is calculated, wherein the normal temperature is T1, and the calculation formula of the resistance value R of the alloy material resistor is
Connecting MCU with heating circuit, working the heating circuit, reading the values of the first ADC module and the second ADC module and Vt1 and Vt2 respectively, and calculating the resistance value Rt of the alloy material resistor when the heating circuit heats, wherein the calculation formula of the resistance value Rt of the alloy material resistor is
The temperature of the heating pipe measured by the temperature measuring circuit through the alloy material resistor is T, and the calculation formula of the temperature is
Rmax is calculated through a preset Tmax value, and the calculation formula of Rmax is as follows
Rmax＝(Tmax-T1)*Vtcr+R
And finally, calculating a corresponding Vt2 maximum value through the Rmax value, and when the second ADC module detects the Vt2 maximum value, controlling the heating circuit to be disconnected by the MCU.
4. The rapid temperature measurement and dry burning prevention method according to claim 1, wherein: the T1 is 25 ℃, and the alloy material resistance is nickel-chromium alloy wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311129121.1A CN117167983A (en) | 2023-08-31 | 2023-08-31 | Quick temperature measurement dry burning prevention method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311129121.1A CN117167983A (en) | 2023-08-31 | 2023-08-31 | Quick temperature measurement dry burning prevention method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117167983A true CN117167983A (en) | 2023-12-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311129121.1A Pending CN117167983A (en) | 2023-08-31 | 2023-08-31 | Quick temperature measurement dry burning prevention method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117167983A (en) |
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2023
- 2023-08-31 CN CN202311129121.1A patent/CN117167983A/en active Pending
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