CN117157166A - Laser processing apparatus, system and method - Google Patents
Laser processing apparatus, system and method Download PDFInfo
- Publication number
- CN117157166A CN117157166A CN202280028528.2A CN202280028528A CN117157166A CN 117157166 A CN117157166 A CN 117157166A CN 202280028528 A CN202280028528 A CN 202280028528A CN 117157166 A CN117157166 A CN 117157166A
- Authority
- CN
- China
- Prior art keywords
- laser
- machining apparatus
- laser machining
- tray
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012545 processing Methods 0.000 title claims abstract description 108
- 238000000034 method Methods 0.000 title description 37
- 238000003754 machining Methods 0.000 claims abstract description 214
- 239000000463 material Substances 0.000 claims abstract description 129
- 238000009423 ventilation Methods 0.000 claims abstract description 78
- 230000005855 radiation Effects 0.000 claims abstract description 52
- 238000011045 prefiltration Methods 0.000 claims abstract description 28
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 20
- 230000003287 optical effect Effects 0.000 claims description 83
- 230000001629 suppression Effects 0.000 claims description 56
- 125000006850 spacer group Chemical group 0.000 claims description 34
- 238000001816 cooling Methods 0.000 claims description 33
- 230000004044 response Effects 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 30
- 230000033001 locomotion Effects 0.000 claims description 19
- 230000007246 mechanism Effects 0.000 claims description 18
- 238000013016 damping Methods 0.000 claims description 17
- 238000012546 transfer Methods 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 9
- 238000004891 communication Methods 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
- 239000005388 borosilicate glass Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 229920001059 synthetic polymer Polymers 0.000 claims description 3
- 239000012815 thermoplastic material Substances 0.000 claims description 3
- 230000000087 stabilizing effect Effects 0.000 claims 2
- 239000003570 air Substances 0.000 description 119
- 230000015654 memory Effects 0.000 description 26
- 230000008901 benefit Effects 0.000 description 23
- 238000003860 storage Methods 0.000 description 13
- 239000007789 gas Substances 0.000 description 11
- 230000006870 function Effects 0.000 description 10
- 239000000356 contaminant Substances 0.000 description 8
- 230000008878 coupling Effects 0.000 description 8
- 238000010168 coupling process Methods 0.000 description 8
- 238000005859 coupling reaction Methods 0.000 description 8
- 238000013461 design Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 238000004590 computer program Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000014759 maintenance of location Effects 0.000 description 5
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000000779 smoke Substances 0.000 description 4
- 239000012855 volatile organic compound Substances 0.000 description 4
- 230000000670 limiting effect Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 230000002441 reversible effect Effects 0.000 description 3
- 230000002459 sustained effect Effects 0.000 description 3
- 239000008207 working material Substances 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000003517 fume Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- -1 debris Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001953 sensory effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
A laser processing apparatus for directing electromagnetic radiation toward a workpiece may include various features. For example, the laser machining apparatus may include a material support tray that is removably supported within an interior volume of the laser machining apparatus. Furthermore, the device may comprise a prefilter arranged in the ventilation path between the working space area of the interior volume and the suction fan. The laser machining apparatus may include a laser cradle assembly that houses the laser module, and the assembly may include a lens tray that is detachably coupled to a support structure of the laser cradle assembly. In various embodiments, a laser processing apparatus includes a cap having a radiation attenuating layer and a fire extinguishing layer.
Description
Cross Reference to Related Applications
The present application claims the U.S. provisional patent application No. 63/158,354 entitled "laser cutter pad and material alignment (Laser Cutting Machine Mat and Material Alignment)" filed on day 3, month 8, 2021, the U.S. provisional patent application No. 63/158,357 entitled "laser cutter cover (Laser Cutting Machine Lid)", the U.S. provisional patent application No. 63/158,335 entitled "laser cutter and engraving machine (Laser Cutting and Engraving Machine)", the U.S. provisional patent application No. 63/158,356 entitled "ventilation system for laser cutters, methods and apparatus (Ventilation Systems, methods, and Apparatus for Laser Cutting Machines)", filed on day 3, month 8, 2021, and the U.S. provisional patent application No. 63/158,736 entitled "laser cutter device, system and method (Laser Cutting Machine Devices, systems, and Methods)", filed on day 3, month 9, 2021, all of which are incorporated herein by reference.
Technical Field
The present disclosure relates to laser processing apparatuses, devices, systems, and methods, and more particularly to components, features, structures, configurations, and/or operations associated with laser processing apparatuses, devices, systems, and methods.
Background
While conventional laser cutting devices have proven useful for a variety of applications, such devices allow improvements to be made that may increase their overall performance and cost. Accordingly, there is a need to develop improved laser processing equipment that improves the state of the art.
Disclosure of Invention
The presently disclosed subject matter has been developed in response to the present state of the art, and in particular, in response to the problems and needs in the art that have not yet been fully solved by currently available laser cutting devices. Thus, the present disclosure has been developed, in accordance with the various embodiments, to overcome many or all of the above-discussed shortcomings in the art.
According to various embodiments, disclosed herein is a laser machining apparatus configured to direct electromagnetic radiation toward a workpiece. The laser processing apparatus may include a housing and a cover pivotably coupled to the housing. The housing and the cover may together at least partially define an interior volume of the laser processing apparatus. The laser machining apparatus may further include a rail assembly mounted to the housing and a laser carriage assembly coupled to the rail assembly, the laser carriage assembly including a laser module configured to emit electromagnetic radiation. In various embodiments, a laser processing apparatus is configured to move a laser carriage assembly within an interior volume and along a rail assembly relative to a workpiece disposed within the interior volume.
The laser machining apparatus further includes a material support tray removably supported within the interior volume such that when the material support tray is removed from the interior volume of the laser machining apparatus, a user can position a workpiece on the material support tray and then load the material support tray and the workpiece supported thereon into the interior volume. The housing includes a workspace bed configured to at least one of receive, engage, support, and hold the material support tray in a known loading position relative to the track assembly within the interior volume. For example, the workspace bed may define a nesting area configured to receive a material support tray therein. The workspace bed includes a plurality of upwardly extending key pins and the material support tray includes a plurality of key recesses configured to align with and respectively receive the plurality of upwardly extending key pins to facilitate consistent and repeatable loading of the material support tray into known loading positions.
In various embodiments, the workspace bed is operably coupled to a lifting mechanism configured to raise and lower the workspace bed within the interior volume of the laser processing apparatus. In various embodiments, the laser processing apparatus includes at least one retaining clip configured to be removably coupled to the material support tray to facilitate securing the workpiece to the material support tray. The housing of the apparatus may include a shelf within the interior volume of the laser machining apparatus, the shelf being configured to support at least one retaining clip for workpiece securement when not in use. The shelf may define a slot configured to receive the rod portion of the retention clip.
In various embodiments, the material support tray includes a rigid grid body for supporting a workpiece thereon, wherein the rigid grid body defines a plurality of cells configured to removably receive the rod portion of the at least one retaining clip. The rigid mesh body may have a honeycomb structure. In various embodiments, the material support tray includes an upper frame and a lower frame, wherein the upper frame is coupled to the lower frame with the rigid grid body sandwiched therebetween. The upper frame includes alignment features to facilitate alignment and positioning of the workpiece on the material support tray. In various embodiments, the upper frame includes raised rib portions extending upwardly from corner sections of the upper frame.
In various embodiments, the laser machining apparatus defines a ventilation path through which ventilation air is configured to flow during operation of the laser machining apparatus. The ventilation path comprises at least a working space region of the interior volume of the laser processing apparatus. The laser machining apparatus may include an exhaust fan configured to draw ventilation air through the ventilation path and ultimately force the ventilation air out of the interior volume of the laser machining apparatus. In various embodiments, the laser machining apparatus includes a prefilter disposed in a ventilation path between a working space region of an interior volume of the laser machining apparatus and the suction fan. The prefilter includes a filter frame that holds a filter medium, wherein the filter frame is removably coupled to a housing of the laser machining apparatus.
In various embodiments, a baffle may be disposed in the ventilation path between the prefilter and the suction fan. The apparatus may further comprise a tunnel (duct) in the ventilation path between the prefilter and the suction fan. The air duct may have a converging cross section from the prefilter towards the suction fan with respect to the flow direction of the ventilation air. In various embodiments, the laser machining apparatus further includes a hose module detachably coupled to the housing of the laser machining apparatus, and the suction fan may be a component of the hose module. The apparatus may include one or more hardware interlock features configured to prevent operation of the laser machining apparatus in response to the hose module being removed from the housing of the laser machining apparatus.
In various embodiments, the hose module may be connected to the housing of the laser machining apparatus in two different orientations such that the outlet of the hose module may be switched to face in a left or right direction relative to the housing of the laser machining apparatus. The hose module may be configured to redirect incoming ventilation air approximately 90 degrees to exit the hose module via the outlet. In various embodiments, the suction fan is a centrifugal fan.
According to various embodiments, the hose module comprises two electrical connectors, wherein each of the two electrical connectors may be individually and separately connected to a single electrical connection port extending from the housing of the laser processing apparatus. The housing of the laser machining apparatus may include a rear panel having a rear surface defining a socket, wherein the hose module is detachably coupled at the socket. The hose module may include an interface plate configured to removably engage the socket, wherein an inlet of the hose module is defined by the interface plate. The interface board is removable from the hose module to allow access to the suction fan. In various embodiments, the interface plate defines at least one finger to facilitate separation of the interface plate from the hose module. According to various embodiments, the hose module includes a blower housing having a first portion and a second portion, wherein the first portion and the second portion of the blower housing together define an airflow surface around the suction fan, wherein the first portion of the blower housing is mounted to the interface board and is separable from the second portion of the blower housing to allow access to the suction fan.
In various embodiments, the housing of the laser machining apparatus at least partially defines the air intake path. The air intake path may be part of a ventilation path configured to redirect ventilation air from one or more air intake ports defined by a bottom panel of a housing of the laser processing apparatus to one or more air delivery ports of a workspace area facing an interior volume of the laser processing apparatus. The air intake path is at least partially defined by a front panel of a housing of the laser processing apparatus. In each, the air intake path includes an L-shaped air intake passage defined at least in part by a front panel of the laser machining apparatus. The L-shaped intake passage of the intake path may have a vertical surge tank and an upper horizontal surge tank. An L-shaped air intake passage of the air intake path may be provided in front of a working space region of the internal volume of the laser processing apparatus. In various embodiments, an upper horizontal plenum fluidly connects the vertical plenum to the one or more gas delivery ports, the upper horizontal plenum configured to straighten ventilation air horizontally before ventilation air passes through the one or more gas delivery ports to a workspace region of an interior volume of the laser processing apparatus. The L-shaped intake passage may have a lower horizontal plenum fluidly connecting one or more intake ports to a vertical plenum. The ventilation air in the lower horizontal plenum generally flows to the front surface of the laser machining apparatus and the ventilation air in the upper horizontal plenum generally flows to the rear surface of the laser machining apparatus.
In various embodiments, the one or more gas delivery ports are configured to deliver laminar flow air to a region of the working space of the internal volume of the laser processing apparatus. The one or more gas delivery ports may be configured such that ventilation air exiting the one or more gas delivery ports forms an air curtain, wherein a width of the air curtain is greater than a width of a material support tray disposed within a workspace region of an interior volume of the laser processing apparatus.
In various embodiments, the apparatus further comprises at least one atmospheric sensor configured to detect a composition of air, the air being at least one of within and out of the interior volume of the laser processing apparatus. In various embodiments, the laser processing apparatus further comprises at least one temperature sensor configured to detect a temperature of at least one of the laser module and air within the interior volume of the laser processing apparatus. In various embodiments, the laser machining apparatus further comprises an accelerometer coupled to the laser carriage assembly and configured to detect movement (or non-movement) of the laser carriage assembly. In various embodiments, the laser machining apparatus further comprises a flame sensor configured to detect the presence of a flame within the interior volume of the laser machining apparatus. In various embodiments, the laser processing apparatus further comprises a glass break sensor configured to detect a break of the cap. In various embodiments, the laser machining apparatus further comprises a laser carriage assembly including an optical sensor configured to detect proximity of a top surface of the workpiece to the laser module. In various embodiments, the laser machining apparatus further includes one or more hardware interlock features configured to prevent operation of the laser machining apparatus in response to the cap being unoccluded (i.e., in response to the laser machining apparatus being in an open configuration). The one or more hardware interlock features are coupled in control communication with the controller, wherein in response to the one or more hardware interlock features detecting that the cap is opened during operation on the workpiece, the controller is configured to suspend operation on the workpiece while operation on the workpiece can be subsequently resumed.
In various embodiments, the cover is pivotally coupled to the housing via a hinge structure. The hinge structure may include a pivot arm having a first portion pivotably coupled to the housing and a second portion coupled to the cover. The second portion of the pivot arm may be coupled to the fire suppression layer of the cap such that force transfer between the pivot arm and the cap occurs only via the fire suppression layer. The hinge structure may include a damping device coupled to the pivot arm, wherein the damping device is configured to slow rotation of the cover between the open position and the closed position. The first portion of the pivot arm is perpendicular to the second portion. The pivot arm may include a curved portion extending between the first portion and the second portion.
The first portion includes a first end pivotally coupled to the housing and a second end opposite the first end and coupled to a third end of the curved portion. The curved portion may have a fourth end coupled to the fifth end of the second portion. The second portion includes a sixth end opposite the fifth end. In various embodiments, the fifth end of the second portion is closer to the first end of the first portion than the second end of the first portion.
In various embodiments, the hinge structure may further include a damping device coupled to the pivot arm, wherein the damping device is configured to slow rotation of the cover between the open position and the closed position. The damping device may be an extension damper configured to dampen rotation of the cap when the extension damper is extended. In various embodiments, the extension damper includes a seventh end pivotably coupled to the housing of the laser machining apparatus and an eighth end pivotably coupled to at least one of the second end of the first portion of the pivot arm and the third end of the curved portion of the pivot arm.
In accordance with various embodiments, a laser cradle assembly for a laser machining apparatus is also disclosed herein. The laser cradle assembly may include: a support structure; a laser module mounted to the support structure and configured to emit electromagnetic radiation along a beam axis toward the workpiece; and a lens tray detachably coupled to the support structure. The lens tray may define a first optical window, and the lens tray may include a first optical lens extending across the first optical window. In various embodiments, when the lens tray is in a mounted position relative to the support structure, the laser module is aligned with the lens tray such that the beam axis extends through the first optical window and intersects the first optical lens.
The support structure includes a lower base plate, and the lens tray is positioned between the laser module and the lower base plate when the lens tray is in the installed position. The lower substrate may include a nozzle extending downwardly and away from the laser module. The nozzle may be configured to direct compressed air toward the workpiece. The beam axis may extend through the nozzle. In various embodiments, the lower substrate defines a compressed air passage configured to deliver compressed air from a compressed air source to the nozzle. The laser cradle assembly may further include an annular gasket disposed in sealing engagement about the beam axis between the nozzle of the lower substrate and a lower surface of the lens tray that surrounds the first optical window when the lens tray is in the installed position. The annular liner defines a passage fluidly connecting the compressed air passage to the nozzle such that compressed air is sent through the annular liner to the nozzle. In various embodiments, the laser cradle assembly further comprises a blower and a heat sink coupled to the support structure, wherein the heat sink is disposed about the laser module and the blower is configured to blow cooling air across the heat sink and about the laser module. The laser cradle assembly may include a removable fan housing forming a top surface of a housing of the laser cradle assembly, wherein the removable fan housing is removably secured via a magnet.
The lens tray defines one or more cooling air windows disposed about the first optical window through which cooling air from the fan flows. The lower substrate may include one or more louvers located below the one or more cooling air windows, wherein the one or more louvers are configured to direct cooling air away from being parallel to the beam axis. In various embodiments, the one or more louvers are configured to direct cooling air in a direction between about 45 degrees and about 90 degrees from the beam axis. In various embodiments, one or more louvers have a concave upper surface. In various embodiments, the one or more louvers are configured to direct cooling air rearward relative to the laser processing apparatus.
The laser cradle assembly may further include a visible light module coupled to the support structure and disposed adjacent to the laser module, wherein the visible light module is configured to emit visible light parallel to the beam axis. The laser cradle assembly may further include an optical sensor coupled to the support structure, wherein the optical sensor is configured to emit radiation along a sensor axis and to receive reflected radiation from the upper surface of the workpiece to determine a distance between the laser module and the upper surface of the workpiece. In various embodiments, the lens tray defines a second optical window, and the lens tray includes a second optical lens extending across the second optical window. According to various embodiments, when the lens tray is in a mounted position relative to the support structure, the optical sensor is aligned with the lens tray such that the sensor axis extends through the second optical window and intersects the second optical lens.
The laser cradle assembly may also include one or more hardware interlock features configured to prevent operation of the laser machining apparatus in response to the lens tray being detached from the support structure (i.e., in response to the lens tray not being in the installed position). The lens tray may include a top portion defining a first optical window and a flange portion extending from at least a portion of a perimeter of the top portion. The flange portion may extend from a front portion and a side portion of the perimeter of the top portion. In various embodiments, the flange portion of the lens tray is configured to engage and at least partially enclose a corresponding peripheral surface of the lower substrate. In various embodiments, the inner surface of the flange portion of the lens tray includes one or more engagement features configured to reversibly engage with corresponding engagement features on the peripheral surface of the lower substrate. The laser carriage assembly may further comprise an O-ring disposed in sealing engagement about the beam axis between a lower end of the laser module and an upper surface of the lens tray that surrounds the first optical window when the lens tray is in the mounted position.
According to various embodiments, a cap for a laser machining apparatus is also disclosed herein. The cover may include a radiation attenuating layer and a fire extinguishing layer coupled to the radiation attenuating layer. The cover may have a perimeter that includes a front edge, a rear edge opposite the front edge, and opposite lateral side edges, the radiation attenuating layer and the fire extinguishing layer may be parallel to one another, and both the radiation attenuating layer and the fire extinguishing layer may extend continuously within the perimeter such that a majority of the body mass of the cover is composed of the radiation attenuating layer and the fire extinguishing layer.
In various embodiments, the radiation attenuating layer forms a top exterior surface of the cap and the fire suppressing layer forms a bottom interior surface of the cap, the bottom interior surface of the cap being configured to face the interior volume of the laser processing apparatus. In various embodiments, the radiation attenuating layer includes at least one of a thermoplastic material and a synthetic polymer (e.g., polymethyl methacrylate). In various embodiments, the radiation attenuating layer is colored to attenuate transmission of electromagnetic radiation from a laser module of the laser processing apparatus. In various embodiments, the fire suppression layer comprises a glass material, such as borosilicate glass.
In various embodiments, the cover further comprises an intermediate spacer frame disposed between the radiation attenuating layer and the fire suppression layer such that a gap is defined between the radiation attenuating layer and the fire suppression layer. In various embodiments, the radiation attenuating layer is at least one of adhered to the upper surface of the intermediate spacer frame and bonded to the upper surface of the intermediate spacer frame. In various embodiments, the cover further comprises a base frame having a bottom portion and a sidewall portion, wherein the intermediate spacer frame is coupled to the bottom portion of the base frame by a plurality of fasteners such that the fire suppression layer is securely held and/or compressed between a lower surface of the intermediate spacer frame and an upper surface of the bottom portion of the base frame. A majority of the plurality of fasteners are located outwardly of the perimeter of the fire suppression layer such that a majority of the plurality of fasteners do not extend through the fire suppression layer. The intermediate spacer frame may have a plurality of tabs extending downwardly around the perimeter of the fire suppression layer and engaging the upper surface of the bottom portion of the base frame. In various embodiments, the plurality of tabs are disposed only in proximity to the plurality of fasteners, respectively, such that the plurality of tabs inhibit uneven overhanging of the intermediate spacer frame in response to securement of the plurality of fasteners during cap manufacture.
In various embodiments, the sidewall portions of the base frame at least partially surround the perimeter of the intermediate spacer frame. According to various embodiments, the upper edges of the sidewall portions of the base frame face the lower surface of the radiation attenuating layer. In various embodiments, the cover further comprises a gasket frame disposed between the lower surface of the fire suppression layer and the upper surface of the bottom portion of the base frame. The gasket frame member may include one or more ribs extending upwardly from the perimeter of the gasket frame and at least partially surrounding the perimeter of the fire suppression layer. One or more ribs are disposed between the perimeter of the fire suppression layer and a plurality of fasteners extending between the intermediate spacer frame and the bottom portion of the base frame. In various embodiments, a plurality of fasteners extend through the cushion frame.
The cushion frame includes a wraparound lip extending inwardly of the inner edge of the bottom portion of the base frame and extending back outwardly below the bottom portion of the base frame. The wraparound lip is made of a resiliently flexible material and may be configured to deform in response to the cap being closed against the housing to engage an upper surface of the housing of the laser processing apparatus. In various embodiments, the fire suppression layer includes outwardly extending wing portions, wherein respective pivot arms of a hinge structure of the laser machining apparatus are respectively coupled to the wing portions of the fire suppression layer. In various embodiments, the gasket frame includes respective wing portions extending between the outwardly extending wing portions of the fire suppression layer and respective pivot arms of the hinge structure of the laser machining apparatus. In various embodiments, the force transfer between the cover and the pivot arm of the hinge structure of the laser processing apparatus occurs via the fire extinguishing layer. In various embodiments, the force transfer between the cover and the one or more pivot arms of the hinge structure of the laser machining apparatus occurs solely via the fire suppression layer.
The foregoing features and elements may be combined in various combinations without being exclusive unless explicitly described otherwise. These features and elements, as well as the operation of the disclosed embodiments will become more apparent from the following description and drawings.
Drawings
To facilitate an understanding of the advantages of the present disclosure, a more particular description of the disclosure briefly described above will be rendered by reference to specific embodiments that are illustrated in the appended drawings. Accordingly, while the subject matter of the present disclosure has been particularly pointed out and distinctly claimed in the concluding portion of the specification, a more complete understanding of the present disclosure may be best obtained by reference to the detailed description and claims when taken in conjunction with the accompanying drawings. Understanding that these drawings depict only typical embodiments of the disclosure and are not therefore to be considered to be limiting of its scope, the subject matter of the application will be described and explained with additional specificity and detail through the use of the accompanying drawings in which:
FIG. 1A is a top, front, right side perspective view of a laser machining apparatus in a closed configuration according to various embodiments;
FIG. 1B is a top, front, right side perspective view of the laser machining apparatus of FIG. 1A in an open configuration according to various embodiments;
FIG. 2A is a top, front, right side perspective view of a laser machining apparatus in a closed configuration, according to various embodiments;
FIG. 2B is a top, front, right side perspective view of the laser machining apparatus of FIG. 2A in an open configuration according to various embodiments;
FIG. 2C is a perspective view of a rail assembly of a laser machining apparatus according to various embodiments;
FIG. 3A is a perspective view of a laser cradle assembly of a laser machining apparatus according to various embodiments;
FIG. 3B is a perspective view of the laser cradle assembly of FIG. 3A showing the fan guard removed in accordance with various embodiments;
FIG. 3C is a perspective view of the laser cradle assembly of FIG. 3A showing the housing and lens tray removed, according to various embodiments;
FIG. 3D is a perspective view of the laser cradle assembly of FIG. 3A showing the blower and heat sink removed and thus the laser module visible, in accordance with various embodiments;
FIG. 3E is a side cross-sectional view of the laser cradle assembly of FIG. 3A along section E-E shown in FIG. 3A, according to various embodiments;
FIG. 3F is a bottom plan view of the laser cradle assembly of FIG. 3A according to various embodiments;
FIG. 3G is a perspective view of the laser cradle assembly of FIG. 3A showing the lens tray removed, according to various embodiments;
FIG. 3H is a top perspective view of the lens tray of FIG. 3G according to various embodiments;
FIG. 4A is a top front perspective view of a cap of a laser machining apparatus according to various embodiments;
FIG. 4B is an exploded view of the cap of FIG. 4A, according to various embodiments;
FIG. 4C is a cross-sectional view of the cap of FIG. 4A, according to various embodiments;
FIG. 4D is another cross-sectional view of the cap of FIG. 4B, according to various embodiments;
FIG. 5A is a side view of a hinge structure of a laser machining apparatus in a closed configuration showing a cross-section of a cover and a housing of the laser machining apparatus in accordance with various embodiments;
FIG. 5B is a side view of the hinge structure of FIG. 5A in an open configuration showing a cross section of a cover in accordance with various embodiments;
FIG. 5C is a front view of the hinge structure of FIG. 5B, according to various embodiments;
FIG. 6A is a bottom, rear, right side perspective view of a laser machining apparatus according to various embodiments;
FIG. 6B is a top, rear, right side perspective view of the laser machining apparatus of FIG. 6A (with the cover removed) in accordance with various embodiments;
FIG. 6C is a side cross-sectional view of the laser processing apparatus of FIG. 6A along section C-C shown in FIG. 6A, in accordance with various embodiments;
FIG. 6D is a top, rear, left perspective view of a laser machining apparatus showing an attached hose module according to various embodiments;
FIG. 6E is a top, rear, left side perspective view of the laser machining apparatus of FIG. 6D showing the hose module removed;
FIG. 6F is a perspective view of a hose module of a laser machining apparatus according to various embodiments;
FIG. 6G is a perspective view of the hose module of FIG. 6F showing the interface plate partially removed in accordance with various embodiments;
FIG. 6H is a perspective view of the hose module of FIG. 6G showing the interface plate completely removed, according to various embodiments;
FIG. 6I is a perspective view of a window vent according to various embodiments;
FIG. 7A is a top perspective view of a material support tray and retaining clip according to various embodiments;
FIG. 7B is a side cross-sectional view of the material support tray, material pad, and retaining clip of FIG. 7A shown in a removed state and an installed state, in accordance with various embodiments;
FIG. 7D is a bottom view of the material support tray of FIG. 7A, according to various embodiments; and
fig. 8 is a schematic diagram of a computing system for controlling a laser processing apparatus according to various embodiments.
Detailed Description
The detailed description of the exemplary embodiments herein makes reference to the accompanying drawings, which show, by way of illustration, exemplary embodiments. While these exemplary embodiments are described in sufficient detail to enable those skilled in the art to practice the disclosure, other embodiments may be realized and logical changes and modifications in design and construction may be made in accordance with the disclosure without departing from the spirit and scope of the disclosure. Accordingly, the detailed description herein is intended for purposes of illustration only and is not intended to be limiting.
In accordance with various embodiments, laser processing apparatus, systems, and methods are disclosed herein. While numerous details and examples are included herein with respect to laser apparatus and related systems and methods in the processing industry, the present disclosure is not necessarily so limited, and thus aspects of the disclosed embodiments may be applicable to applications and/or operations in various other non-processing industries. As such, many applications of the present disclosure may be realized.
The laser processing apparatus, systems, and methods disclosed herein provide various advantages over conventional laser cutters. While many example benefits are explicitly emphasized and identified herein, other benefits and/or technical effects may not be explicitly noted, but are still contemplated by the present disclosure. For example, at least one aspect of the present disclosure provides a laser machining apparatus having a cover and/or hinge structure that provides a user with substantially unobstructed access to an interior working portion of the laser machining apparatus. Such benefits and/or technical effects, even though not explicitly noted herein, are apparent to the reader of this disclosure and thus would fall within the scope of this disclosure.
Generally, according to various embodiments, the laser processing apparatus disclosed herein is a computer numerical control machine configured to direct energy (e.g., electromagnetic radiation along a beam axis, also commonly referred to as a laser beam) at a workpiece for purposes of affecting or otherwise altering a material. For example, a laser machining apparatus may direct electromagnetic radiation toward a workpiece to cut, engrave, cauterize, rasterize, or otherwise impart a design effect on the workpiece. Laser energy can be absorbed by the material to discolor, ablate, burn, melt, evaporate, etc., and/or laser energy can be used to form holes, incisions, engravings, etc. The laser energy can also harden the material of the workpiece, cause a phase change, or otherwise alter the physical properties of the workpiece. The laser beam may be focused such that a maximum power density is obtained on the material.
Turning now to the drawings, fig. 1A, 1B, 2A, 2B, and 2C provide various views of various embodiments and implementations of laser processing apparatus 10, 20. For example, fig. 1A and 1B illustrate a first embodiment of a laser machining apparatus 10 in a closed configuration and an open configuration, respectively, while fig. 2A and 2B illustrate a second embodiment of a laser machining apparatus 20 in a closed configuration and an open configuration, respectively. As is apparent from the comparative embodiments illustrated in fig. 1A, 1B, 2A, and 2B, the laser processing apparatus disclosed herein may take various forms, may have various external shapes, and/or may have various component configurations and structures. For example, the type, intensity, and/or size of the various components (e.g., laser modules) may vary from one embodiment to another. In addition, the size and working area of the device may also vary from embodiment to embodiment without departing from the spirit of the embodiments shown and described herein. Accordingly, various details described in connection with one or more embodiments depicted in the drawings may be used in connection with other depicted implementations. Indeed, although many details and examples are included herein with respect to the form of the laser machining apparatus 20 depicted in fig. 2A and 2B in particular, the scope of the present invention is not limited in this regard.
In various embodiments, referring to fig. 1A and 1B, the laser processing apparatus 10 includes a housing 110 and a cover 140 (e.g., at a hinge connection 150) pivotably connected to the housing 110. In other words, the cover 140 can be selectively opened and closed by rotating the cover 140 relative to the housing 110 at the hinge connection 150. According to various embodiments, fig. 1A illustrates laser machining apparatus 10 in a closed configuration, while fig. 1B illustrates laser machining apparatus in an open configuration. According to various embodiments, in the closed configuration shown in fig. 1A, the boundary line 135 is defined as the interface/junction at which the cap 140 and the housing 110 meet when the device is in the closed configuration. According to various embodiments, the illustrated boundary line 135 represents the shape of the lower edge of the cap 140 and the upper edge of the housing 110 such that the front wall of the housing 110 is lower than the rear wall of the housing 110 when in the open configuration shown in fig. 1B. In this configuration, due to the low height of the front wall of the housing 110, a user may easily access the workspace area (e.g., the area in which the material support tray 170 is disposed), thereby enabling a user to easily insert, remove, and/or manipulate workpieces and other materials within the workspace area, and/or otherwise manipulate, inspect, clean, or otherwise interact with components of the laser machining apparatus 10 (e.g., the laser bracket assembly 130 and/or the rail assemblies 120X, 120Y). Furthermore, the rear wall may be higher than the front wall to provide sufficient space to enclose and house the necessary mechanical structure of the laser machining apparatus 10, as will be described in more detail herein.
In this disclosure, positional terms such as top, upper, bottom, lower, front, back, rear, interior, exterior, and the like are used to describe various components and/or sections, segments, and/or portions of components and structures. These terms are not meant to describe absolute positions, but rather are used to describe the shape and geometry of the various components relative to the perspective and experience of the user during standard engagement and use of the disclosed devices, systems, and methods. To provide further clarity and relevance, the drawing figures are repeatedly labeled with top and bottom axes (e.g., upper and lower axes) and/or front and back axes (e.g., forward and back axes) to depict "standard" viewing angles relative to which components of the laser processing apparatus 10, 20 are described.
In various embodiments, with continued reference to fig. 1A and 1B, the laser machining apparatus 10 includes mechanisms and components that drive and/or move a laser (e.g., a laser carried by a carriage 130 that is positioned above and coplanar with a work surface). The work surface may be a support surface (e.g., a material support tray 170) disposed in a bed or floor of the laser processing apparatus 10. The material support tray 170 may be a surface upon which one or more workpieces may be placed for modification and toward which electromagnetic radiation from a laser is emitted. The laser processing apparatus 10 may include drive components such as rails (e.g., rails 120X and 120Y, generally referred to herein as rail assemblies), belts, gears, cables, wires, motors, cooling systems, and the like. Thus, the drive mechanism and components of the laser machining apparatus may be configured to drive the laser, which is mounted on the carriage 130, above the material support tray 170 and around/across the entire length and width above the material support tray 170, so that the laser may be positioned at any point above the working surface of the material support tray 170.
In various embodiments, not only may the front face of the housing 110 be low enough to provide improved and/or unobstructed access to the material support tray 170, but the bracket 130 and drive components may also be positioned such that the drive components do not obstruct the user from entering the machine in the open state. In other words, the drive component may be disposed below the housing panel and/or within a track cover (e.g., track cover 222 in fig. 3C) such that the laser processing apparatus 10 is configured to prevent insertion of a user's finger into the drive component.
In various embodiments, the bracket 130 may be movably (e.g., slidably) coupled to the rail 120X, and the rail 120X may be proximate to the rear wall of the housing 110 and/or the cover 140. The laser processing apparatus 10 may be configured to controllably move the carriage 130 back and forth along the X-direction. In various embodiments, the rail 120X may extend the full or nearly the full width of the interior volume of the laser machining apparatus 10. In various embodiments, the X drive motor may be configured to drive the carriage 130 to move on the X track 120X. In various embodiments, the X-rail 120X may be suspended above the material support tray 170 via one or more vertical posts. The vertical column may ride along one or more Y tracks 120Y to enable the carriage 130, and thus the laser module mounted on the carriage, to move in the Y direction. As used herein, the term X-direction, etc., refers to lateral movement left and right along a track to which the carriage 130 is coupled, while the term Y-direction, etc., refers to movement forward and backward. In various embodiments, the vertical column of X0 track 120X may extend below the work surface via a slot. The Y drive members may similarly be disposed below the work surface or may be disposed below and/or within the overhead panel to form a shelf adjacent the work surface. Additionally or alternatively, in various embodiments, the Y-drive component may be located below and/or to one or more sides of the work surface such that when the cover 140 is opened, the Y-drive component likewise does not obstruct access to the work surface by a user's hand from the top, front, or either side of the machine.
With respect to Z-direction movement or up-down movement, the carriage 130 itself may be hinged up-down relative to the X-track 120X via one or more motors and vertical tracks. However, in various embodiments, the working surface of the apparatus and/or the bed (e.g., the material support tray 170) are configured to be raised and lowered, thereby enabling the above-described "up and down" movement of the laser module relative to the workpiece.
In various embodiments, additional details of laser processing apparatus 20 are now provided with reference to fig. 2A, 2B, and 2C. The laser processing apparatus 20 described with reference to fig. 2A, 2B, and 2C may include various components, such as the rail assemblies 220X, 220Y, the laser bracket assembly 300, the cover 400, the hinge structure 500, and/or the material support tray 700. These components and assemblies may be similar to the corresponding components 120X, 120Y, 130, 140, 150, and 170 of fig. 1A and 1B, respectively. Thus, various details from one embodiment may be used in another embodiment and vice versa. Indeed, unless explicitly or implicitly described herein, details from various embodiments may be combined with details from other embodiments.
In various embodiments, the laser machining apparatus 20 includes a housing 210 and a cover 400 pivotably coupled to the housing 210 (e.g., via a hinge structure 500). The cover 400 is rotatable between a closed position and an open position, allowing the laser machining apparatus 20 to transition between the closed configuration of fig. 2A and the open configuration of fig. 2B. The housing 210 and the cover 400 may together (and at least partially) define an interior volume 209 of the laser machining apparatus 20. In other words, the housing 210 may provide four walls and a floor of the interior volume 209, and the cover 400 may provide an openable roof of the interior volume 209. In various embodiments, when the laser processing apparatus 20 is in the closed position (fig. 2A), unwanted electromagnetic radiation from the laser module 350 (fig. 3D) is prevented or at least substantially prevented from inadvertently escaping the interior volume 209, as described in more detail below.
The housing 210 may include a front panel 210F, an opposite lateral panel 210S, and a rear panel 210R opposite the front panel 210F. The housing 210 may also include a bottom panel 210B. The housing 210 generally includes both structural members, decorative shells, and interior facing sections and/or exterior facing sections of the laser machining apparatus 20 and panels. Thus, while the various figures may appear to be indicated and labeled with only the reference numerals of the housing, the housing may generally include and provide structural frame and support for the components described below, and thus the term "housing" may refer to more components and features than shown in the figures. For example, the front panel 210F of the housing 210 may include multiple layers and panels of "wall" material and/or may define multiple plenums 615, 616, 617 (see fig. 6C), passageways, or chambers.
In various embodiments, referring to fig. 2B and 2C, the laser machining apparatus 20 includes a laser carriage assembly 300, the laser carriage assembly 300 coupled to a rail assembly mounted to the housing 210. The laser carriage assembly 300 may include a laser module 350 (see fig. 3D), the laser module 350 configured to emit electromagnetic radiation, and the laser machining apparatus 20 may be configured to drive/move the laser carriage assembly along the track assembly within the interior space 209. In other words, the laser machining apparatus 20 may include, or may be coupled in control communication with, one or more controllers and/or processors that actuate movement of the laser carriage assembly 300 along the rail assembly relative to a workpiece disposed within the interior volume of the housing 210. The track assembly may include, for example, an X track 220X and a Y track 220Y. As described above, the laser carriage assembly 300 may be movably (e.g., slidably) coupled to the X-rail 220X, and the X-rail 220X may be movably (e.g., slidably) coupled to one or more Y-rails 220Y. Thus, lateral side-to-side movement of the laser carriage assembly 300 may be effected along the X-track 220X and fore-and-aft movement of the carriage assembly 300 may be effected along one or more Y-tracks 220Y. The laser machining apparatus 20 may also include a lift mechanism 217 to effect movement of the workpiece relative to the Z direction of the laser (vertical, up and down). Reference numeral 217 in fig. 2B refers to a slot in the panel and a lifting mechanism, which may include one or more guide screws or other vertical translation mechanisms, may be provided behind this (and other) panels. The vertical lift mechanism 217 may be coupled to the workspace bed 212 and may be configured to raise and lower the workspace bed 212 within the interior volume 209 of the laser processing apparatus 20.
In various embodiments, the track assembly, the lift mechanism, the drive components, and the laser carriage assembly 300 are disposed within an interior space 209 collectively defined by the housing 210 and the cover 400. The term "workspace region" 211 as used herein refers to a portion or sub-region of the larger interior volume 209 and is specifically intended to represent the effective working area of the laser machining apparatus 20. That is, the workspace region 211 refers to the volume of space directly above the material support tray 700 and below the laser cradle assembly 300 (e.g., below the focal position of the emitted electromagnetic laser radiation) and is defined as the space in which laser operations/work can be performed on the workpiece.
In various embodiments, the laser processing apparatus includes the material support tray 700 described above. The material support tray 700 may be supported within the interior volume 209 of the laser processing apparatus 20. For example, the housing 210 (e.g., bottom panel 210B of the housing 210) may include a workspace bed 212, the workspace bed 212 configured to receive, engage, support, and/or otherwise retain the material support tray 700 in a known loading position relative to the rail assembly within the interior volume 209. The workspace bed 212 may be raised and lowered using the lifting mechanism 217, and the workspace bed 212 may define a nesting area 214, the nesting area 214 being configured to at least partially receive the material support tray 700 therein.
In various embodiments, the material support tray 700 is removable, and thus the material support tray 700 is removably/detachably supported on the workspace bed 212. For example, the material support tray 700 may be reversibly/removably positioned against the workspace bed 12. In other words, in various embodiments, a user may remove the material support tray 700 from the interior space of the laser machining apparatus 20 to allow the user to easily place a workpiece on the material support tray 700. As the material support tray 700 is removed from the interior volume 209, the user may access substantially unimpeded to properly position, place, and couple one or more workpieces to the material support tray 700 prior to returning the material support tray 700 to the interior volume 209. In addition, some of the processing materials are brittle and fragile after being processed by the laser, so after manipulation of the workpiece, it may be advantageous to remove the material support tray 700 from the interior volume 209 of the laser processing apparatus 20 22 while the workpiece is still supported on the material support tray 700. Furthermore, over time, the material support tray 700 or various other internal components may be damaged, possibly requiring cleaning and/or replacement. The removable configuration of the material support tray 700 allows a user to easily remove, replace, clean, or otherwise maintain the laser machining apparatus 20.
Fig. 7A, 7B, and 7C provide various views of an exemplary material support tray 700 according to various embodiments. The material support tray 700 may include a rigid grid body 720 for supporting a workpiece thereon. The rigid grid body 720 may define a plurality of cells. For example, the rigid mesh body 720 may have a honeycomb structure including a plurality of hexagonal cells. According to various embodiments, the cells of the rigid grid body 720 extend generally in a vertical direction perpendicular to the plane of the material support tray 700. The rigid mesh body 720 may be made of a metallic material (e.g., aluminum, steel, or other ferrous material).
The material support tray 700 may also include one or more features, structures, and/or subassemblies that provide workpiece alignment and proper positioning and orientation of the workpiece on the rigid grid body 720. Further, the material support tray 700 may include an assembly or kit including a plurality of associated components for reversibly holding, retaining, securing, attaching, coupling, and/or otherwise securing one or more workpieces to the material support tray 700 during a machining operation performed on the workpieces. For example, the laser machining apparatus 20 may include one or more retention clips 750, and each retention clip 750 may be configured to be removably coupled to the rigid web body 720 of the material support tray 700 to facilitate securing one or more workpieces to the material support tray 700.
In various embodiments, retaining clip 750 includes a stem portion 752 and a cap portion 754. The lever portion 752 may include a plurality of pins configured to extend at least partially within the cells of the rigid grid body 720. The plurality of pins of the lever portion 752 may be parallel to one another, may be sized and distributed slightly apart from one another such that each pin is capable of being inserted into a corresponding cell of the rigid grid body 720 of the material support tray 700 via a resistive or interference fit. For example, rigid grid body 720 may include a hexagonal grid, and the pins of stem portion 752, which may include three pins, may be distributed in a hexagonal pattern relative to each other to conform to the complementary pattern of the hexagonal grid. In various embodiments, referring briefly to fig. 2B, the housing 210 of the laser machining apparatus 20 may have a shelf 215 or other surface within the interior volume 209, the shelf 215 or other surface configured to hold and/or support one or more retaining clips 750 for workpiece fixation when not in use. For example, shelf 215 may define slot 216 and lever portion 752 of retaining clip 750 may be received in slot 216 to stow retaining clip 750 when not in use.
In various embodiments, referring back to fig. 7A, 7B, and 7C, the cap portion 754 of the retention clip 750 can be configured to engage a top, edge, or flange surface of a workpiece, thereby sandwiching at least a portion of the workpiece between the cap portion 754 and the rigid grid body 720 of the material support tray 700. In various embodiments, the cap 754 defines two shoulders 754A, 754B (e.g., two lower flat surfaces) at different heights relative to the overall height of the retention clip 750. In other words, the cap 754 can facilitate securing workpieces of different thicknesses by allowing a user to select which shoulder 754A, 754B serves as a contact/engagement surface against the workpiece.
In various embodiments, the material support tray 700 and/or the laser machining apparatus 20 may include other types of workpiece holders, such as clamps, straight bars, curved bars, and the like. Similar to the retaining clips 750, the workpiece holders may be removable and reconfigurable to provide boundaries or guides for placing workpieces or other materials onto the material support tray 700. For example, a jig having a 90 degree angle may be utilized to define a square space or a rectangular space on the material support tray 700. In various embodiments, one, two, or more clamps may be used in combination to provide guides for material placed on the material support tray 700.
In various embodiments, the workpiece holder may incorporate magnets to be magnetically reversibly secured to a material support tray (e.g., a magnetic metal material forming a rigid grid body 720). In this configuration, the workpiece holder can be easily removed, replaced, and reconfigured as desired by the user. One or more other attachment mechanisms may also be incorporated into the workpiece holders to removably attach the workpiece holders to the material support tray 700. In various embodiments, the frictional engagement between the workpiece holder and the material support tray 700 is sufficient to hold the workpiece holder in place.
In various embodiments, referring specifically to fig. 7B, the material support tray 700 may include a pad 760, the pad 760 extending across the top surface of the material support tray 700. The pad 760 shown schematically in fig. 7B may itself be removed from the material support tray 700. Similar to the benefits described above for removable trays, by having removable pads 760 on removable tray 700, the user's flexibility, operability, and ease of use may be further enhanced. In various embodiments, pad 760 may have grid lines and/or other guiding indicia that are capable of permanently resisting electromagnetic energy emitted by the laser module during operation. In various embodiments, the pad 760 includes one or more recesses for at least partially receiving a portion or section of a workpiece. For example, the pad 760 may include a circular recess for positioning a circular working material, such as a coaster, within the recess. In such a configuration, the user can easily place the workpiece in the correct position on pad 760, which corresponds to a position in the design software user interface grid or virtual pad. Such a coaster or other circular piece may be manufactured to fit specifically within the recess of the cushion 760. In one or more other embodiments, any number or shape of recesses may be added to pad 760 to accommodate any number or combination of correspondingly shaped pieces of work material.
Further, various embodiments of pad 760 may include an identification code, tag, chip, or other identification device. The identification means may be configured to facilitate identification or automatic identification of a particular pad 760 loaded into the device. In this way, by simply placing the pad 760 within the laser machining apparatus 20, the laser machining apparatus 20 may automatically detect the particular pad 760 (and/or the user may manually scan or enter the pad identifier), and the laser machining apparatus 20 may adjust the settings of the laser module 350 or other components to optimally cut the workpiece corresponding to the particular pad 760. In other words, the identification means associated with the pads 760 may be associated with a particular recess or combination of recesses such that the apparatus 20 automatically detects which pad 760 is inserted therein, thereby identifying which materials may be placed on the pads 760 based on those recesses. The firing laser settings and/or other settings of the apparatus, such as carriage movement settings, etc., may then be automatically adjusted accordingly to optimize processing of these materials. The details described above with respect to the specific pads and/or specific recesses also apply to the tray itself. That is, the laser machining apparatus 20 may include multiple material support trays, or different material support trays specifically tailored to support a particular workpiece may be utilized in the apparatus, allowing for the above-described process efficiencies associated with setup and process parameter adjustments based on the workpiece to be machined.
Additionally or alternatively, the laser machining apparatus 20 may include other light sources, such as a visible light source 355 (fig. 3D), or the laser module 350 may operate in alternative modes to project a non-material altering guidance/crosshair pattern onto the material support tray 700. Such a guidance pattern may take any number of forms that help to visually identify the boundaries of the pattern in the design software. The software may communicate the location of the design pattern to laser machining apparatus 20 through the use of virtual pads in the user interface of the design software. The guide pattern may then be projected onto the material support tray 700 and/or directly onto the workpiece to visually display to the user where the boundary of the design will be. The user may use the guide pattern/crosshair to ensure that the workpiece is properly placed to properly cut or engrave the design on the work material.
In various embodiments, the material support tray 700 includes a frame that extends around the perimeter of the rigid grid body 720. For example, the material support tray 700 may include an upper frame 710 and/or a lower frame 730. The upper frame 710 may be coupled to the lower frame 730 with the rigid grid body 720 sandwiched therebetween. The upper frame 710 may include raised rib portions 714 (also referred to herein as raised barrier portions or raised guide walls), with the raised rib portions 714 extending upwardly from the upper frame 710. The raised rib portions may extend at least partially around the rigid grid body 720. Raised rib portions 714 may facilitate proper placement of pad 760 and/or work piece on the tray. That is, material may be placed on the material support tray 700 and positioned against the raised rib portions, thereby enabling a user to consistently and repeatedly position the material relative to the corners of the coordinate system of the tray (i.e., the "zero-zero" corners). For example, the raised rib portions 714 may extend at least partially across two boundaries of the upper frame 710 to form a right angle.
In various embodiments, the upper frame 710 may also include alignment features, guide features, and/or measurement features disposed on an upper surface of the upper frame 710 to facilitate aligning and positioning the workpiece on the material support tray 700. When comparing the desired designs in the software program, the user may refer to the alignment features/guide features of the frame. That is, the user may reference the guiding features on the frame, which may correspond to a grid or other coordinate system in the design software, to place the design and/or the work piece in the same location on the tray 700 to achieve the desired design.
In various embodiments, the workspace bed 212 shown schematically in fig. 7B includes a plurality of upwardly extending bonding pins 213 and the material support tray 700 includes a plurality of bonding recesses 732 (e.g., defined in the lower frame 730, as shown in fig. 7B and 7C). The plurality of bonding recesses 732 may be configured to align with the plurality of upwardly extending bonding pins 213 and to receive the plurality of upwardly extending bonding pins 213, respectively, to facilitate consistent and repeatable loading of the material support tray 700 in known loading positions. Accordingly, the corresponding keying features between the removable material support tray 700 and the workspace bed 212 may be used as fiducials to facilitate proper relative alignment and to ensure that the tray 700 is properly seated in the laser machining apparatus 20.
One or more sets of corresponding keying features 213, 732 may have different and/or non-circular shapes, allowing only material support tray 700 to be positioned on workspace bed 212 in the correct orientation. For example, one of the bonding recesses 732 may have an oval shape (e.g., bonding recess 732 shown on the left side of fig. 7C), and/or one of the bonding recesses may have a flat/planar surface section (e.g., bonding recess 732 shown on the right side of fig. 7C), with the corresponding bonding pin 213 having a uniform/complementary shape. In various embodiments, the material support tray 700 may be exclusively supported by the respective bonding features 213, 732. In other words, when the material support tray 700 is properly positioned within the apparatus 20, the surface of the workspace bed 212 (e.g., the surface defining the nesting area 214) may not directly contact and support the material support tray 700. By having this configuration, all surfaces forming the workspace bed 212 need not be precisely bonded, but only the bonding pins 213 may need to be properly and precisely bonded.
In various embodiments, additional details regarding laser cradle assembly 300 are provided with reference to fig. 3A, 3B, 3C, 3D, 3E, 3F, 3G, and 3H. The laser cradle assembly 300 may include a support structure 305 and a laser module 350 mounted to the support structure 305. As described above, the laser module 350 may be configured to emit electromagnetic radiation along the beam axis 352 toward the workpiece. The support structure 305 may include or may be coupled to a connection structure 302, the connection structure 302 extending to a track assembly (e.g., X-track 220X). The laser cradle assembly 300, or at least a portion thereof, may be removable from the track (e.g., from the connection structure 302) to allow a user to replace the laser cradle assembly 300 or perform maintenance on the laser cradle assembly 300. The connection structure 302 may have a U-shape (best seen in fig. 3E) that enables the track cover 222 (fig. 2C) to fit around the track to substantially prevent inadvertent access to drive components and other elements disposed within and/or along the track. In other words, the U-shape of the connection structure 302 may extend downward and around the lower lip of the track cover 222. Power, communication, compressed air, etc. may be sent from the track to the laser cradle assembly 300 via the connection structure 302.
In various embodiments, the laser cradle assembly 300 further includes a lens tray 370, the lens tray 370 being detachably coupled to the support structure 305. In various embodiments, referring specifically to fig. 3G and 3H, the lens tray 370 defines a first optical window 373, and the lens tray 370 includes a first optical lens 371, the first optical lens 371 extending through the first optical window 373. The first optical lens may be a main optical device for a laser beam emitted from the laser module 350. In this way, when the lens tray 370 is in a mounted position relative to the support structure 305 (i.e., relative to the laser module 350), the laser module 350 is aligned with the lens tray 370 such that the beam axis 352 extends through the first optical window 373 and intersects the first optical lens 371. In various embodiments, keeping the first optical lens 371 clean (free of debris, fumes, contaminants) may be important for the life of the laser module 350, may prevent damage to the user and/or equipment, and may facilitate accurate, reliable, consistent, and repeatable machining operations on the workpiece. Thus, by removably coupling the lens tray 370 to the support structure 305 of the laser cradle assembly 300, a user can clean the distal end of the laser module 350 and the first optical lens 371 supported by the lens tray 370, thereby facilitating achievement of the aforementioned benefits.
In various embodiments, support structure 305 includes a lower substrate 380 (fig. 3C, 3E, 3F, and 3G). The lower substrate 380 may define the lowest portion of the laser cradle assembly 300. The removable lens tray 370 may be removably retained over the lower substrate 380. That is, in the installed position, the lens tray 370 may be located between the laser module 350 and the lower substrate 380. According to various embodiments, the lens tray 370 includes a top portion 376 and a flange portion 377. According to various embodiments, the top portion 376 is a section of the lens tray 370 defining the first optical window 373, and the flange portion 377 extends downwardly from at least a portion of the periphery of the top portion 376. For example, flange portions 377 may extend from front and side portions of the perimeter of top portion 376. Accordingly, the rear side of the lens tray 370 may not have a flange portion extending therefrom, and thus the rear side may be inserted into a gap defined between the laser module 350 and the lower substrate 380. According to various embodiments, flange portions 377 extending from at least a segment of the sides and front of the perimeter of the top portion 376 are configured to engage and at least partially surround the corresponding perimeter surface of the lower substrate 380.
To facilitate proper insertion of the lens tray 370 relative to the support structure 305, and/or to facilitate a secure but detachable connection between the lens tray 370 and the support structure 305 and/or the lower substrate 380, the laser bracket assembly 300 may include corresponding engagement features 379 between the lens tray 370 and the lower substrate 380. In other words, the inner surface of the flange portion 377 of the lens tray 370 may have one or more engagement features configured to reversibly engage with corresponding engagement features 379 (fig. 3F) on the outer peripheral surface of the lower substrate 380. The corresponding engagement features may include a groove and detent configuration, or may additionally include features configured to facilitate a reliable resistance and/or interference fit between the lens tray 370 and the support structure 350/lower substrate 380.
Due to the removable configuration of the lens tray 370, the laser cradle assembly 300 may include one or more sealing members to substantially isolate the optical path from the working area 211 of the laser processing apparatus 20, thereby impeding the entry of dust, smoke, or other contaminants into the main optical path of the laser module above the first optical lens 371. Accordingly, an O-ring or other annular sealing member may be disposed in sealing engagement about beam axis 352 between the lower end of laser module 350 and the upper surface of lens tray 370, the upper surface of lens tray 370 surrounding first optical window 373 when lens tray 370 is in the installed position. In various embodiments, the first optical lens 371 is coupled to a frame that is disposed within the first optical window 373, and thus the first optical lens 371 may be substantially below the top surface of the lens tray 370. In various embodiments, the laser cradle assembly 300 may include one or more hardware interlock features configured to prevent operation of the laser module 350 (and/or the laser machining apparatus 20) in response to the lens tray 270 being disassembled (i.e., in response to the lens tray not being in the installed position).
The laser cradle assembly 300 may include a housing 310, the housing 310 configured to surround and protect the laser module 350. In various embodiments, the housing 310 extends downwardly from an upper end to a lower end adjacent the lens tray 370. That is, the front side of the housing 310 may be substantially flush with the front side of the lens tray 370 such that the flange portions 377 of the housing 310 and the lens tray 370 are substantially continuous when the lens tray is in the installed position.
In various embodiments, referring specifically to fig. 3C, the laser bracket assembly 300 further includes a fan 330 and a heat sink 340. Both the blower 330 and the heat sink 340 may be coupled to the support structure 305. A heat sink 340 may be generally disposed around the laser module 350, and the blower 330 may be configured to blow cooling air through the heat sink 340 to dissipate heat from the laser module 350. In various embodiments, the fan 330 is disposed above the radiator 340 and is directly coupled to the radiator 340 to deliver cooling air into the radiator 340 and through the radiator 340. In various embodiments, the housing 310 of the laser bracket assembly 300 surrounds the lateral side surfaces of the heat sink 340 and the blower 330.
In various embodiments, the laser cradle assembly 300 further includes a removable fan guard 320 (fig. 3B), the removable fan guard 320 forming a top surface of the housing 310 of the laser cradle assembly 300. The fan guard 320 may not be a solid/continuous panel, but may define slots and/or through-holes to allow air to be drawn into the fan 330 and directed down and around the laser module 350. The removable fan guard 320 may extend across the fan inlet to prevent large debris and/or misplaced material from entering the fan 330. In various embodiments, the fan guard 320 is removably secured to the fan 330, the housing 310, and/or the support structure 305 via magnets. The laser bracket assembly 300 may include a sensor or one or more hardware interlocks configured to detect whether the fan guard 320 is properly installed. The laser module 350 may be deactivated in response to the fan guard 320 not being properly installed/positioned.
In various embodiments, the lens tray 370 defines one or more cooling air windows 375, the cooling air windows 375 configured to allow cooling air exiting the heat sink 340 to flow through the lens tray 370 and out through the lower substrate 380. In various embodiments, one or more cooling air windows may be disposed around the first optical window 373 so as to be positioned to convey cooling air from the heat sink 340 to the lower substrate 380 through the lens tray 370, the heat sink 340 being disposed concentrically around the laser module 350. The lower substrate 380 may include corresponding windows and/or openings that are generally aligned with the cooling air windows 375 of the lens tray 370.
The lower substrate 380 may include one or more louvers 386 (fig. 3E and 3F), the one or more louvers 386 being located below the one or more cooling air windows 375 of the lens tray 370. The one or more louvers 386 may be configured to direct cooling air away from being parallel to the beam axis 352. By directing the cooling air away from the beam axis 352, a desired macroscopic ventilation flow dynamics across and through the workspace region 211 of the laser processing apparatus 20 may be maintained. For example, in various embodiments, the laser processing apparatus 20 is equipped with a ventilation system that draws air horizontally across and through the workspace region 211 (e.g., across and around any workpieces supported on the material support tray 700), as described in more detail below with reference to fig. 6A-6I. If the cooling air were allowed to flow downwardly toward the workpiece (i.e., in a direction parallel to the beam axis 352 of the laser module 350), the cooling air could disrupt the desired flow dynamics of the primary ventilation air (i.e., could disrupt the laminar flow of the primary ventilation air flow), which would potentially reduce the effectiveness of the ventilation air flow in purging smoke and other debris formed by the laser radiation from the laser module 350 altering the working space. Thus, by redirecting air away from beam axis 352 by louvers 386, damage to the primary ventilation caused by the cooling airflow is reduced/minimized.
In various embodiments, one or more louvers 386 are configured to direct cooling air in a direction between about 45 degrees and about 90 degrees from beam axis 352. In various embodiments, one or more louvers 386 have a concave upper surface to facilitate redirection of cooling air. In various embodiments, one or more louvers 386 are configured to direct cooling air rearward. As described in more detail below, the ventilation system may be configured to direct the primary ventilation air rearward and thus combine the cooling air with the primary ventilation air flowing in the same direction, further minimizing interruption of the flow of the primary ventilation air.
In various embodiments, the laser cradle assembly 300 further includes a visible light module 355, the visible light module 355 being coupled to the support structure 305. The visible light module 355 may be disposed adjacent to the laser module 350 and may be configured to emit visible light toward the workpiece parallel to the beam axis 352. Visible light from the visible light module 355 may enable a user to generally see where the laser (which may include invisible electromagnetic radiation) will strike the workpiece.
In various embodiments, the laser cradle assembly 300 further includes an optical sensor 360, the optical sensor 360 being coupled to the support structure 305. The optical sensor 360, which may be an optical proximity transducer, may be configured to emit radiation along a sensor axis and receive reflected radiation from the upper surface of the workpiece to determine the distance between the laser module 350 and the upper surface of the workpiece. That is, the optical sensor 360 may be used as feedback by the controller of the laser machining apparatus 20 to determine whether the focus of the laser is properly positioned relative to the workpiece, and the laser machining apparatus 20 may raise or lower the workpiece accordingly. The optical sensor 360 may be referred to herein as a time-of-flight sensor, and may be generally disposed at or near the laser module 350. In various embodiments, an optical sensor may be used to signal the auto-focus of the laser to accommodate larger and smaller workpieces, where the top surface of the workpiece may be closer to or farther from the laser module 350.
In various embodiments, the lens tray 370 defines a second optical window 374, the lens tray 370 including a second optical lens 372, the second optical lens 372 extending through the second optical window 374. The second optical lens 372 may be specifically configured to facilitate accurate sensor readings, and thus the optical sensor 360 may be aligned with the lens tray 370 such that the sensor axis extends through the second optical window 374 and intersects the second optical lens 372. The second optical lens 372 may prevent debris, dust, smoke, and/or other substances from contaminating the optical sensor 360. The second optical lens 372 may also include an anti-reflective coating configured to reduce some signal noise that would otherwise be received by the optical sensor, thereby improving the signal-to-noise ratio of the optical sensor 360.
In various embodiments, referring particularly to fig. 3E, the lower substrate 380 further includes a nozzle configured to provide air assist at the focus of the lasing light where the material change occurs. That is, the lower substrate 380 may include nozzles 382, the nozzles 382 extending downward and away from the laser module 350. Nozzle 382 may be configured to direct compressed air from the compressor of laser machining apparatus 20 toward the workpiece. In various embodiments, nozzle 382 is aligned with laser module 350 such that beam axis 352 extends through nozzle 382. In various embodiments, lower substrate 380 defines a compressed air passageway 385, compressed air passageway 385 configured to deliver compressed air from a compressed air source to nozzles 382.
The laser carriage assembly 300 may further include an annular gasket 383 disposed in sealing engagement about the beam axis 352 between the nozzle 382 of the lower substrate 380 and the lower surface of the lens tray 370, the lower surface of the lens tray 370 surrounding the first optical window 373 when the lens tray 370 is in the mounted position. That is, the annular gasket 383 may facilitate sealing engagement between the removable lens tray 370 and the lower substrate 380, thereby preventing or at least impeding unwanted dust, debris, smoke, and other substances from contaminating the main optical path of radiation emitted from the laser module 350. In various embodiments, annular pad 383 also defines a channel 384, channel 384 fluidly connecting compressed air passage 385 to nozzle 382 such that compressed air is routed through annular pad 383 to nozzle 382. In this configuration, the annular gasket 383 not only prevents contaminants from entering the main optical path, but also seals against unwanted leakage of compressed air as it is delivered to the nozzle to be directed toward the firing point of the laser.
In various embodiments, referring to fig. 4A, 4B, 4C, and 4D, details of the cap 400 of the laser processing apparatus 20 are provided. The cover 400 generally has a double-layer structure configured to mitigate harmful electromagnetic radiation and slow down the propagation of flames in the event of flame combustion initiated by the emitted laser light. Thus, according to various embodiments, the cover 400 may have a radiation attenuating layer 410 and a fire suppressing layer 430. Even with a bilayer, the cover 400 may be configured to be sufficiently transparent to visible light so that a user may see the occurrence of a laser process/operation. The cover 400 may have only sufficient structural strength to be repeatedly manipulated by a user, but may also safely attenuate the unintended transmission of harmful electromagnetic energy through the cover while also providing a degree of fire protection.
In various embodiments, referring particularly to fig. 4A, the perimeter of the cover 400 includes a front edge 400F, a rear edge 400R opposite the front edge 400F, and opposite lateral side edges 400S. In various embodiments, the radiation attenuating layer 410 and the fire extinguishing layer 430 may be parallel to each other, and both the radiation attenuating layer 410 and the fire extinguishing layer 430 may extend continuously within the perimeter such that a majority of the body mass of the cover 400 is comprised of the radiation attenuating layer 410 and the fire extinguishing layer 430. In other words, the radiation attenuating layer 410 and the fire suppressing layer 430 may be the only components of the cover 400 that extend across the entire body of the cover 400, as the other layers and components mentioned below may be simply frame members that partially surround and/or engage one or both perimeters of the radiation attenuating layer 410 and the fire suppressing layer 430.
In various embodiments, the radiation attenuating layer 410 forms the top exterior surface of the cap 4 400. In various embodiments, the fire extinguishing layer 430 forms a bottom interior surface of the cap 400 (i.e., the portion of the cap 400 configured to face the interior volume 209 of the laser processing apparatus 20). The radiation attenuating layer 410 may include at least one of a thermoplastic material and a synthetic polymer. For example, the radiation attenuating layer 410 may include polymethyl methacrylate. According to various embodiments, the radiation attenuating layer 410 is colored to attenuate transmission of electromagnetic radiation from the laser module 350 of the laser cradle assembly 300. For example, the radiation attenuating layer 410 may be colored green or orange depending on the particular wavelength of electromagnetic radiation configured to be generated/emitted by the laser module 350. In various embodiments, the fire extinguishing layer 430 may include a glass material. For example, the fire suppression layer 430 may be borosilicate glass.
In various embodiments, the two layers 410, 430 of the cap 400 are separated from direct contact with each other by a middle spacer frame 420. In other words, the intermediate spacer frame 420 may be disposed between the radiation attenuating layer 410 and the fire extinguishing layer 430. The intermediate spacer frame 420 may contact only the respective peripheries of the two main layers 410, 430, and thus may define a gap 425 (e.g., an air gap) between the radiation attenuating layer 410 and the fire suppressing layer 430.
In various embodiments, the radiation attenuating layer 410 is bonded and/or adhered to the upper surface of the intermediate spacer frame 420. That is, the adhesive perimeter layer 415 may bond the radiation attenuating layer 410 to the intermediate spacer frame 420. In various embodiments, the covering 400 further includes a base frame 450. The intermediate spacer frame 420 may be coupled to the base frame 450 by a plurality of fasteners 424 such that the fire suppression layer 430 is held/compressed between a lower surface of the intermediate spacer frame 420 and an upper surface of the base frame 450. More specifically, according to various embodiments, the base frame 450 includes a bottom portion 452 and a sidewall portion 454, and a plurality of fasteners 424 may connect the intermediate spacer frame 420 to the bottom portion 452 of the base frame 450 to compress and retain the fire suppression layer 430 therebetween.
Fig. 4D is a cross-sectional view of the cap 400 taken along a section intersecting one of the plurality of fasteners 424, according to various embodiments. In various embodiments, a majority of the plurality of fasteners 424 are located outside the perimeter of the fire suppression layer 430. That is, more than half of the plurality of fasteners 424 do not extend through the fire extinguishing layer 430, but rather extend adjacent to the perimeter of the fire extinguishing layer 430. In various embodiments, each of the fasteners (i.e., all) used to attach the intermediate spacer frame 420 to the base frame 450 do not extend through the fire extinguishing layer 430. According to various embodiments, the structural strength and structural toughness of the fire extinguishing layer 430 is enhanced by having fewer fastener holes extending therethrough.
Referring to fig. 4B and 4D, the intermediate spacer frame 420 may have a plurality of tabs 422 extending downwardly around the perimeter of the fire extinguishing layer 460 and engaging the upper surface of the bottom portion 452 of the base frame 450. In various embodiments, the tabs 422 are only disposed adjacent to fasteners 424, respectively. In this configuration, the plurality of tabs 422 prevent uneven overhanging of the intermediate spacer frame 420 in response to the securement of the plurality of fasteners 424 during manufacture of the cap 400. That is, without the tab 422, compression of the fastener 424 would cause a localized section of the intermediate spacer frame to deform in the vicinity of the fastener 424 due to the fact: on the inside of the fastener, the intermediate spacer frame will be supported by the fire suppression layer, while on the outside of the fastener, there will be no east-west support against compression, and therefore the intermediate spacer frame may deform, thereby reducing the compressive strength on the fire suppression layer.
In various embodiments, the sidewall portion 454 of the base frame 450 at least partially surrounds the perimeter of the intermediate spacer frame 420. In various embodiments, the upper edges of the sidewall portions 454 of the base frame 450 face the lower surface of the radiation attenuating layer 410. In various embodiments, the cover 400 includes a gasket frame 440, the gasket frame 440 being disposed between a lower surface of the fire extinguishing layer 430 and an upper surface of the bottom portion 452 of the base frame 450. The cushion frame 440 may include a resiliently flexible material configured to absorb some of the force of the covering 400. Thus, according to various embodiments, instead of compressing (via fasteners 424) the fire suppression layer 430 into direct contact with a rigid (e.g., metallic) base frame 450, the gasket frame 440 may provide an intervening cushion and/or force dissipating layer between the fire suppression layer 430 and the base frame 450.
In various embodiments, referring particularly to fig. 4B and 4D, the gasket frame 440 includes one or more ribs 442, which ribs 442 extend upwardly from the perimeter of the gasket frame 440 and at least partially surround the perimeter of the fire extinguishing layer 430. The ribs 442 may provide at least a partial contour around the perimeter of the fire extinguishing layer 430 to facilitate proper placement and positioning of the fire extinguishing layer 430 during stacking of the layers. In various embodiments, one or more ribs 442 may be disposed between the fire suppression layer 430 and a plurality of fasteners 424, the fasteners 424 extending between the intermediate spacer frame 420 and the bottom portion 452 of the base frame 450. Additionally or alternatively, according to various embodiments, a plurality of fasteners 424 may extend through the gasket frame 440, but the gasket frame 440 may have a grommet, boss, or other raised feature around the fasteners 424, so that the ribs 442 and/or these grommet/bosses of the gasket frame 440 provide force absorbing/cushioning benefits by preventing the perimeter of the fire suppression layer 430 from directly contacting the fasteners 424.
In various embodiments, the cushion frame 440 includes a wraparound lip 444, the wraparound lip 444 extending within an inner edge of the bottom portion 452 of the base frame 450 and extending back outwardly below the bottom portion 452 of the base frame 450. That is, as shown in fig. 4D, the gasket frame 440, or at least the wraparound lip 444 of the gasket frame 440, is made of a resiliently flexible material configured to deform in response to the cover 400 being closed against the housing 210 to engage with the upper surface of the housing 210 of the laser processing apparatus 20. In other words, the wraparound lip 444 of the cushion frame 440 may be specifically configured to engage with an upper surface or an inner surface (or both) of the top edge of the housing 210 of the laser machining apparatus (see fig. 5A). Such engagement of the gasket frame 440 against the housing 210 of the laser machining apparatus 20 may provide an optical seal between the cap 400 and the housing 210, thereby preventing or at least impeding unintentional leakage of electromagnetic radiation from the interior volume 209 of the laser machining apparatus 20.
In various embodiments, the fire suppression layer 430 includes outwardly extending wing portions 435, and the pivot arms 510 of the hinge structure of the laser processing apparatus 20 are respectively coupled to the outwardly extending wing portions 435. That is, one or more hinge fasteners 434 (fig. 4B and 4C) may be anchored at one end to a support 427, the support 427 being disposed in the gap 425 between the radiation attenuating layers 410, and the opposite end of the hinge fastener 434 being anchored to a portion of the pivot arm 510 of the hinge structure 500 of the laser processing apparatus 20. The hinge fastener 434 is different and separate from the fastener 424 described above in that the hinge fastener 434 extends through an aperture defined in the fire extinguishing layer 430, the hinge fastener 434 is internal to the fastener 424, and the hinge fastener 434 is not anchored to the base frame 450 as is the fastener 424. In various embodiments, in order to absorb forces between the support 427 and the fire suppression layer, a pad segment is disposed between the support 427 and the upper surface of the fire suppression layer 430. In various embodiments, the liner frame 440 includes wing portions 445, the wing portions 445 corresponding to and vertically aligned with the wing portions 435 of the fire suppression layer 430. The wing portion 445 of the cushion frame 440 may be configured to provide similar cushioning/force absorption between the lower surface of the fire suppression layer 430 and the pivot arm 510 of the hinge structure 500. In various embodiments, the wing portions 445 of the gasket frame 440 extend inwardly from the perimeter of the gasket frame 440 (while the wing portions 435 of the fire suppression layer 430 extend outwardly from the perimeter of the fire suppression layer 430).
In various embodiments, the force transfer between the cover 400 and the one or more pivot arms 510 of the hinge structure 500 of the laser machining apparatus 20 occurs only via the fire extinguishing layer 430. That is, rather than the pivot arm 510 being coupled to the rigid perimeter/frame layer, the pivot arm 510 is directly coupled to the fire suppression layer 430. Such a "direct" coupling does not necessarily mean direct physical contact, as one or more cushioning/force absorbing layers may be disposed between the fire suppression layer and the pivot arm 510, but refers to the nature of the engagement between the two components, as there is no other intervening rigid structure in force transfer communication between the fire suppression layer 430 and the pivot arm 510.
In various embodiments, details regarding hinge structure 500 are provided with reference to fig. 5A, 5B, and 5C. The cover 400 is generally configured to be pivotably coupled to the housing 210 of the laser processing apparatus 20 via a hinge structure 500. According to various embodiments, the hinge structure 500 includes one or more pivot arms 510, the pivot arms 510 extending from the hinge/pivot point to the cover 400. For example, each pivot arm 510 may include a first portion 511 and a second portion 512, the first portion 511 being pivotably coupled to the housing 210 and the second portion 512 being coupled to the cover 400. As described above, the connection between the second portion 512 of the pivot arm 510 and the cover 400 may be at the fire suppression layer 430 of the cover 400 (such that the force transfer between the pivot arm 510 and the cover 400 occurs only via the fire suppression layer 430). The first portion 511 and the second portion 512 of the pivot arm 510 may generally extend in non-parallel directions.
In various embodiments, the hinge structure 500 includes a damping device coupled to the pivot arm 510. The damping device may be configured to slow the rotation of the cover 400 when the cover 400 is rotated from the open position to the closed position. In various embodiments, the damping device does not provide rotational damping when the cover 400 is rotated from the closed position to the open position, allowing a user to easily lift the cover 400 to the open position without having to counter the action of the damping device.
In various embodiments, the damping device is an extension damper 530 (shown in fig. 5A and 5B). The extension damper 530 may have a linear telescopic structure specifically configured to dampen the extension of its structure while allowing free contraction of its structure. In various embodiments, the extension damper 530 is a two-stage damper and is thus configured to slow the rotation of the cover 400 toward the closed position even when the cover is only opened a few degrees. In other words, the extension damper 530 may be configured to provide extension damping along substantially its entire linear range of motion.
In various embodiments, the first portion 511 of the pivot arm 510 is perpendicular to the second portion 512. In various embodiments, the pivot arm 510 further includes a curved portion 513, the curved portion 513 extending between the first portion 511 and the second portion 512. In various embodiments, with continued reference to fig. 5A-5C, the first portion 511 of the pivot arm 510 includes a first end 521 and a second end 522, the first end 521 being pivotably coupled to the housing 210, the second end 522 being opposite the first end 521, and coupled to a third end 523 of the curved portion 513. The curved portion 513 may include a fourth end 524, the fourth end 524 coupled to a fifth end 525 of the second portion 512, and the second portion 5112 may include a sixth end 526 opposite the fifth end 525. In various embodiments, the fifth end 525 of the second portion 512 is closer to the first end 521 of the first portion 511 than the second end 522 of the first portion 511. In various embodiments, the extension damper 530 includes a seventh end 527 and an eighth end 528, the seventh end 527 being pivotably coupled to the housing 210 (forward of the main hinge axis of the hinge structure) of the laser machining apparatus 20, the eighth end 528 being pivotably coupled to at least one of the second end 522 of the first portion 511 of the pivot arm 510 and the third end 523 of the curved portion 513 of the pivot arm 510. Such a configuration may be particularly suitable for an extension damper (e.g., damper 530) because the range of motion experienced by the pivot arm 510 results in a well-balanced and smooth closing motion throughout the damped extension dynamics. The configuration of the hinge structure in such a configuration may provide a compact assembly that allows a user to easily access the interior volume without the cumbersome and/or bulky hinge structure occupying a significant amount of space, or otherwise blocking or at least limiting the user's access to the interior volume from the side of the machine.
In various embodiments, the hinge structure 500 further includes a cap retainer mechanism 540, the cap retainer mechanism 540 configured to retain the cap 400 in the open position to prevent inadvertent, premature, and/or accidental closure of the cap 400. In various embodiments, the hinge structure 500 is configured to enable the cap 400 to rotate just over 90 degrees. While such a degree of rotation may provide some resistance to inadvertent or accidental closure of the cap 400, the cap retainer mechanism 540 may provide additional security to prevent inadvertent closure of the cap 400. In various embodiments, cap retainer mechanism 540 includes arms 542 and engagement features 544. The arm 542 may be a spring arm or may be otherwise configured to bias the engagement feature 544 into engagement with the one or more pivot arms 510 of the hinge structure 500.
In response to the lid 400 being fully opened, the lid retainer mechanism 540 is configured to "lock" the hinge structure 500 against reverse rotation (i.e., resist rearward rotation toward the closed position). For example, the engagement feature 544 may be configured to ride/slide along one of the portions of the pivot arm 510 (e.g., the first portion 511) until the cover 400 has been sufficiently opened, at which point the engagement feature 544 passes below the surface of the pivot arm segment to resist reverse rotation unless the reverse force is sufficiently large (indicating the intent of the user to close the cover 400). In response to such an intentional sufficient force, the bias of arms 542 of the cap retainer mechanism is overcome, disengaging the engagement features from the corresponding portions of the pivot arms, allowing the cap 400 to return to the closed position.
In various embodiments, referring to fig. 6A-6H, details of the ventilation system of laser processing apparatus 20 are provided. As described above, the laser processing apparatus 20 may be configured to generate a ventilation air flow across and through at least the workspace region 211 of the interior volume 209 to facilitate removal of debris, dust, fumes, particles released by the workpiece, and/or other contaminants from the workspace. By proper ventilation, the accumulation of contaminants is limited, thereby enabling the user to operate longer between maintenance/cleaning. In fact, if debris particles are not sufficiently removed from the interior of the laser processing apparatus 20 during and/or after laser operation, contaminants may accumulate on and damage components of the apparatus over time. For example, the laser lens may become blurred over time, gears, motors, and belts may become stuck, and other important components may be damaged over time if these byproduct particles in the air are not sufficiently removed or cleaned.
The laser machining apparatus 20 may define a ventilation path through which ventilation air is configured to flow during operation of the laser machining apparatus. The ventilation path may comprise a working space region of the internal volume of the laser processing apparatus. The laser processing apparatus 20 may be specifically configured to control and/or optimize the fluid dynamics of the ventilation air in the ventilation path to maximize contaminant removal and/or improve the safety of laser operation on the workpiece. A further benefit of proper ventilation is fire suppression and heat dissipation. In various embodiments, the laser machining apparatus includes an exhaust fan 650, the exhaust fan 650 configured to draw ventilation air through the ventilation path and ultimately force the ventilation air out of the interior volume 209 of the laser machining apparatus 20. That is, rather than using a forced air mechanism to push air through the ventilation path, the ventilation system of laser machining apparatus 20 may use suction fan 650 to draw air across working area 211, with the air intake of suction fan 650 coupled in fluid-receiving communication with interior volume 209. By drawing air across the workpiece and through the workspace region 211, the workspace region 211 is at negative pressure, meaning that the machine does not need to be fully sealed to contain the effluent. If a fan is included to force air from the air inlet into the working volume of the machine, any leakage in the machine housing can result in leakage of effluent from the machine housing.
In various embodiments, the laser machining apparatus includes a pre-filter 620, the pre-filter 620 being disposed in a ventilation path between the workspace region 211 of the interior volume 209 of the laser machining apparatus 22 and the suction fan 650. The suction fan 650 may be disposed at the rear of the housing 210, and thus the ventilation air may be configured to flow from the front of the machine to the rear of the machine. In various embodiments, it may be advantageous to position suction fan 650 near the rear of the machine to improve acoustics, form factor, and utilization of available space. Prefilter 620 may be configured to remove some contaminants and debris before such particles reach suction fan 650 itself. Such a pre-filter 620 may be on-machine such that the pre-filter 620 may face and at least partially define the working area 211 of the laser machining apparatus 20. In other words, pre-filter 620 may form at least a section of the back wall of working area 211.
In various embodiments, referring specifically to fig. 6C, pre-filter 620 includes a filter frame 622, filter frame 622 holding filter media 624. Filter frame 622 may be detachably coupled to housing 210 of laser machining apparatus 20, allowing pre-filter disassembly and removal so that a user may clean or replace filter media 624. In various embodiments, the laser machining apparatus 20 further includes a baffle 630, the baffle 630 being disposed in the ventilation path between the pre-filter 620 and the suction fan 650. The baffle 630 may be disposed adjacent to the pre-filter 620 but behind the filter 620 and may be configured to facilitate distribution of ventilation air over the pre-filter 620. According to various embodiments, the baffle 630 is followed by an air duct 640, the air duct 640 being in the ventilation path between the pre-filter 620 and the suction fan 650. According to various embodiments, the duct 640 has a converging cross section from the pre-filter 620 toward the suction fan 650 with respect to the flow direction of the ventilation air.
In various embodiments, the housing 210 of the laser machining apparatus 20 at least partially defines an air intake path. The intake path may be part of the overall ventilation path and may generally be defined in the housing 210 forward of the workspace region 211. For example, the air intake path may be defined at least in part by a front panel 210F of the housing 210 of the laser machining apparatus 20. As described below, the air intake path is configured to redirect ventilation air from one or more air intake ports 612 defined by the bottom panel 210B of the housing 210 of the laser machining apparatus 20 to one or more air delivery ports 618 facing the workspace region 211 of the interior volume 2109 of the laser machining apparatus 20.
In various embodiments, the air intake path includes an L-shaped air intake passage 614, the L-shaped air intake passage 614 being at least partially defined by a front panel 210F of the laser machining apparatus. The L-shaped intake passage 614 of the intake path may include a vertical plenum 616 and an upper horizontal plenum 617. An L-shaped intake passage 614 of the intake path may be provided in front of the working area 211. In various embodiments, upper horizontal plenum 617 fluidly connects vertical plenum 616 to one or more gas delivery ports 618. The upper horizontal plenum 617 may be configured to straighten the ventilation air horizontally before it passes through the one or more gas delivery ports 618 to the workspace region 211 of the interior volume 209 of the laser processing apparatus 20. The L-shaped intake passage may also include a lower horizontal plenum 615, the lower horizontal plenum 615 fluidly connecting one or more intake ports 612 to a vertical plenum 616.
In various embodiments, the ventilation air in the lower horizontal plenum 615 is generally directed toward the front surface of the laser machining apparatus, and the ventilation air in the upper horizontal plenum 617 is generally directed toward the rear surface of the laser machining apparatus 20. In various embodiments, the one or more gas delivery ports 618 are configured to deliver laminar flow air to the workspace region 211 of the interior volume 209 of the laser processing apparatus 20. The one or more gas delivery ports 618 are configured such that ventilation air exiting the one or more gas delivery ports 618 forms an air curtain, wherein the air curtain has a width that is greater than a width of the material support tray 700, and the material support tray 700 is disposed within the workspace region 211 of the interior volume 209 of the laser processing apparatus 20. In various embodiments, upper horizontal plenum 617 and/or gas delivery port 618 are configured such that the emitted air curtain always "covers" the focal point of the laser light.
The laser machining apparatus 20 may also include a hose module 660, the hose module 660 being detachably coupled to the housing 210 of the laser machining apparatus 20. For example, the hose module 660 may be coupled to the rear panel 210R of the housing 210 of the laser machining apparatus 20. Suction fan 650 may be a component of hose module 660. There may be one or more hardware interlock features configured to prevent operation of the laser machining apparatus in response to the hose module being removed from the housing of the laser machining apparatus.
In various embodiments, the hose module 660 is connectable to the housing 210 of the laser machining apparatus 20 in two different orientations such that the outlet of the hose module 660 (i.e., the hose 668) can be switched to face in either a left or right direction relative to the housing 210 of the laser machining apparatus 20. Accordingly, the hose module may be configured to redirect incoming ventilation air approximately 90 degrees to exit the hose module via the outlet. In various embodiments, the hose 668 of the hose module 660 may be coupled to a hose port 678 of the window unit 670 (fig. 6I) for discharging the effluent to the outside. Alternatively, the hose 668 may be coupled to a separate filter unit.
In various embodiments, suction fan 650 is a centrifugal fan. The hose module 660 of the laser machining apparatus 20 may include two electrical connectors 662A, 662B, wherein each of the two electrical connectors is individually and individually connectable to a single electrical connection port 162, the single electrical connection port 162 extending from the housing 210 of the laser machining apparatus 20. This configuration allows the suction fan 650 disposed within the hose module 660 to be powered regardless of the positioning of the hose module 660.
In various embodiments, the housing 210 of the laser machining apparatus 20 includes a rear panel 210R, the rear panel 210R having a rear surface defining a receptacle 218. The hose module 660 may be detachably coupled to the housing 210 at the receptacle 218. In various embodiments, the hose module 660 has an interface board 661, the interface board 661 being configured to removably engage the receptacle 218. In various embodiments, the inlet of the hose module is defined by an interface plate 661. In various embodiments, the interface board 661 is detachable from the hose module 660 to allow a user to access the suction fan 650 housed within the fan housing 664. For example, the interface board 661 can define at least one finger 663 to facilitate separation of the interface board 661 from the hose module 660.
The blower housing 664 of the hose module 660 may include a first portion 665 and a second portion 666, the first portion 665 and the second portion 666 of the blower housing 664 collectively defining an airflow surface around the suction fan 650. The first portion 665 of the blower housing 664 can be mounted to the interface board 661 and can be separated from the second portion 666 of the blower housing 664 to allow a user to widely access the suction fan 650 for cleaning and/or replacement of the suction fan 650.
In various embodiments, the laser processing apparatus 20 includes one or more sensors (e.g., safety sensors) configured to detect conditions within the apparatus. The laser machining apparatus 20 may include at least one atmospheric sensor configured to detect a composition of air within the interior volume 209 of the laser machining apparatus 20 and/or out of the interior volume 209. For example, the laser processing apparatus 20 may include one or more volatile organic compound ("VOC") sensors for detecting emissions of the apparatus during operation. VOC sensors may be used downstream of the pre-filter 620 to ensure that the air exiting the machine is clean enough. The VOC sensor may compare the exiting air to ambient air as a baseline reference to determine the adequacy of the ventilation/filtration system. In various embodiments, one or more of these types of sensors may be placed upstream and downstream of the pre-filter to determine the efficacy of the filter and to determine when the pre-filter 620 should be cleaned and/or when the filter media should be replaced.
In various embodiments, the laser machining apparatus 20 includes at least one temperature sensor configured to detect a temperature of at least one of the laser module 350 and air (e.g., ventilation air) within the interior volume 209 of the laser machining apparatus 20. The laser machining apparatus 20 may include one or more temperature sensors located at or near the top of the interior volume 209 of the apparatus. The temperature sensor may be a thermistor or thermocouple and may be used to detect a rapid rise in temperature, either due to a sustained unwanted fire or due to a failure of the ventilation system.
The laser machining apparatus may include a flame sensor configured to detect the presence of a flame within the interior volume 209 of the laser machining apparatus 20. The flame sensor may determine whether a sustained fire is occurring or has occurred within the device. The flame sensor may be an infrared sensor configured to identify a flame. Although small periodic flames may occur during normal cutting or engraving, the flame sensor may be configured to detect the presence of a sustained, larger fire. For example, if a small flame is detected and the position of the small flame corresponds to the cut point of the laser, the threshold value is not exceeded. On the other hand, if a larger flame persists for some time and is present elsewhere in the cut point, this may exceed a threshold and trigger a machine shutdown or other fire extinguishing protocol.
In various embodiments, the laser machining apparatus includes an accelerometer coupled to the laser carriage assembly 300 and configured to detect movement (or lack thereof) of the laser carriage assembly 300. If instructions are still being sent to move the laser carriage assembly 300, but no movement is detected by the accelerometer, this indicates that some of the drive components of the carriage are malfunctioning. Such a determination may trigger an auto-close or other mitigation protocol because the non-mobile laser emitting light at the same point of the working material for an extended period of time may result in an unwanted fire or undesirable/unwanted change in the working material. In various embodiments, the laser processing apparatus may include a glass break sensor configured to detect breakage of the cap.
In various embodiments, the laser machining apparatus includes one or more hardware interlock features configured to prevent or at least limit operation of the laser machining apparatus 20. For example, in response to the lid 400 not being closed (i.e., in response to the laser machining apparatus being in an open configuration), one or more hardware interlocks may be configured to shut down the laser module. Other examples of hardware interlocks and other examples of sensor feedback are described above. The computing device controlling the laser machining apparatus may be configured to shut down various functions of the apparatus in response to sensor and/or hardware feedback. However, in various embodiments, the controller/computing device is configured to suspend (rather than cancel) operations on the workpiece while enabling subsequent resumption of operations on the workpiece (e.g., after a problem or detected problematic condition has been resolved). The laser machining apparatus may also include one or more tachometers or other speed sensors configured to detect the operating fan speed of the suction fan. The detected fan speed may be used to estimate the air flow rate and/or to determine when the pre-filter needs cleaning and/or replacement.
Fig. 8 is a schematic diagram of an exemplary computing system/device 3000 that may be used to implement the systems and methods described herein. Computing device 3000 is intended to represent various forms of digital computers, such as laptops, desktops, smartphones, workstations, personal digital assistants, servers, blade servers, mainframes, and/or other appropriate computers. The components of computing device 3000, such as 3010, 3020, 3030, 3040, 3050, and 3060, their connections and relationships, and their functions, are merely exemplary and are not meant to limit the embodiments of the invention described and/or claimed herein. Furthermore, the various features and functions of the computing device 3000 may be implemented in one or more separate computers and/or one or more controllers, may be integrated within the disclosed laser processing apparatus 10, 20 itself, and/or may be implemented with various other computing devices, as described below.
According to various embodiments, computing device 3000 may include a processor 3010, a memory 3020, a storage device 3030, a high-speed interface/controller 3040 connected to memory 3020 and high-speed expansion ports 3050, and a low-speed interface/controller 3060 connected to low-speed bus 3070 and storage device 3030. Each of the components 3010, 3020, 3030, 3040, 3050, and 3060 may be interconnected using various buses, and may be mounted on a common motherboard or in other manners as appropriate.
The processor 3010 may process instructions for execution within the computing device 3000, including instructions stored in the memory 3020 or on the storage device 3030. The instructions may include operations to display graphical information of a Graphical User Interface (GUI) on an external input/output device, such as display 3080 coupled to high-speed interface 3040. In various embodiments, multiple processors and/or multiple buses may be used, as appropriate, along with multiple memories and types of memory. In addition, multiple computing devices 3000 may be connected (e.g., as a server bank, a set of blade servers, or a multi-processor system), each providing portions of the operations/functions.
Memory 3020 stores information non-temporarily within computing device 3000. Memory 3020 may include computer-readable media, volatile memory units, and/or nonvolatile memory units. Non-transitory memory 3020 may be a physical device for temporarily or permanently storing programs (e.g., sequences of instructions) or data (e.g., program state information) for use by computing device 3000. Examples of non-volatile memory include, but are not limited to, flash memory and read-only memory (ROM)/programmable read-only memory (PROM)/erasable programmable read-only memory (EPROM)/electrically erasable programmable read-only memory (EEPROM) (e.g., typically used for firmware such as a boot program). Examples of volatile memory include, but are not limited to, random Access Memory (RAM), dynamic Random Access Memory (DRAM), static Random Access Memory (SRAM), phase Change Memory (PCM), and magnetic disk or tape.
The storage device 3030 is capable of providing mass storage for the computing device 3000. In some implementations, the storage device 3030 is a computer-readable medium. In various embodiments, storage device 3030 may be a floppy disk device, hard disk device, optical disk device, magnetic tape device, flash memory or other similar solid state memory device, and/or an array of devices (including devices in a storage area network or other configuration). In various embodiments, the computer program product is tangibly embodied in an information carrier. The computer program product may contain instructions that, when executed, perform one or more methods, such as those described herein. The information carrier may be a computer-or machine-readable medium, such as memory 3020, storage 3030, and/or memory on processor 3010.
The high-speed controller 3040 may manage bandwidth-intensive operations of the computing device 3000, while the low-speed controller 3060 may manage lower bandwidth-intensive operations. This allocation of responsibilities is merely exemplary. In some implementations, the high-speed controller 3040 is coupled to the memory 3020, the display 3080 (e.g., by a graphics processor or accelerator), and to the high-speed expansion port 3050, which 3050 may accept various expansion cards (not shown). In some embodiments, low speed controller 3060 is coupled to storage device 3030 and low speed expansion port 3090. The low speed expansion port 3090 may include various communication ports (e.g., USB, bluetooth, ethernet, wireless ethernet) that may be coupled to one or more input/output devices, such as a keyboard, a pointing device, a scanner, and/or a network device (e.g., a switch or router), for example, through a network adapter.
The computing device 3000 may be implemented in a variety of forms. For example, computing device 3000 may be implemented in laser machining apparatus 10, 20, laptop computer 3000a, mobile device 3000b, tablet device 3000c, and/or one or a combination of the following. In various embodiments of the system, the operations, functions, and techniques described herein may be implemented in digital electronic and/or optical circuits, integrated circuits, FPGAs (field programmable gate arrays), specially designed ASICs (application specific integrated circuits), programmable logic devices, discrete gate or transistor logic, discrete hardware components, computer hardware, firmware, software, and/or combinations thereof.
The processes, functions, operations, and/or logic flows described in this specification can be performed by one or more programmable processors, also referred to as data processing hardware, executing one or more computer programs to perform functions by operating on input data and generating output. The processor and the memory may be supplemented by, or incorporated in, special purpose logic circuitry. Processors suitable for the execution of a computer program include, by way of example, both general and special purpose microprocessors, and any one or more processors of any kind of digital computer. Generally, a processor will receive instructions and data from a read-only memory or a random access memory or both. The essential elements of a computer are a processor for executing instructions and one or more memory devices for storing instructions and data.
Generally, a computer will also include, or be operatively coupled to receive data from or transfer data to, or both, one or more mass storage devices for storing data, e.g., magnetic, magneto-optical disks, or optical disks. However, the computer need not have such devices. Computer readable media suitable for storing computer program instructions and data include various forms of non-volatile memory, media and storage devices, including by way of example semiconductor memory devices, e.g., EPROM, EEPROM, and flash memory devices; magnetic disks, such as internal hard disks or removable disks; magneto-optical disk; CDROM and DVD-ROM discs.
These computer programs (also known as programs, software applications and/or code) include machine instructions for a processor, and may be implemented in a high-level procedural and/or object-oriented programming language, and/or in assembly/machine language. As used herein, the terms "machine-readable medium" and "computer-readable medium" refer to any computer program product, non-transitory computer-readable medium, apparatus and/or device (e.g., magnetic discs, optical disks, memory, programmable Logic Devices (PLDs)) used to provide machine instructions and/or data to a programmable processor, including a machine-readable medium that receives machine instructions as a machine-readable signal. The term "machine-readable signal" refers to any signal used to provide machine instructions and/or data to a programmable processor.
The term "non-transitory" is to be understood as removing only the propagating transitory signal itself from the scope of the claims and not relinquishing rights to all standard computer readable media that do not merely propagate the transitory signal itself. In other words, the terms "non-transitory computer-readable medium" and "non-transitory computer-readable storage medium" should be construed to exclude only those types of transitory computer-readable media found in ReNuijten that do not fall within the patentable subject matter scope under 35 u.s.c.101.
A software application (i.e., a software resource) may refer to computer software that causes a computing device to perform tasks. In some instances, a software application may be referred to as an "application," app, "or" program. Exemplary applications include, but are not limited to, system diagnostic applications, system management applications, system maintenance applications, word processing applications, spreadsheet applications, messaging applications, media streaming applications, social networking applications, and gaming applications.
To provide for interaction with a user, one or more aspects of the invention can be implemented on a computer having a display device, e.g., a CRT (cathode ray tube), LCD (liquid crystal display) monitor or touch screen for displaying information to the user (e.g., a display of the user device), and optionally a keyboard and a pointing device (e.g., a mouse or a trackball) by which the user can provide input to the computer. Other types of devices may also be used to provide for interaction with a user; for example, feedback provided to the user may be any form of sensory feedback, such as visual feedback, auditory feedback, or tactile feedback; and input from the user may be received in any form, including acoustic, speech, or tactile input. In addition, the computer may interact with the user by sending files to and receiving files from the device used by the user; for example, by sending a web page to a web browser on a user client device in response to a request received from the web browser.
Benefits, other advantages, and solutions to problems have been described herein with regard to specific embodiments. The benefits, advantages, solutions to problems, and any element(s) that may cause any benefit, advantage, or solution to occur or become more pronounced, however, are not to be construed as a critical, required, or essential feature or element of the present disclosure.
Reference throughout this specification to features, advantages, or similar language does not imply that all of the features and advantages that may be realized with the present disclosure should be or are in any single embodiment of the application. Rather, language referring to the features and advantages is understood to mean that a specific feature, advantage, or characteristic described in connection with an embodiment is included in at least one embodiment of the subject matter disclosed herein. Thus, discussion of the features and advantages, and similar language, throughout this specification may, but do not necessarily, refer to the same embodiment.
Furthermore, the described features, advantages, and characteristics of the disclosure may be combined in any suitable manner in one or more embodiments. One skilled in the relevant art will recognize that the subject matter of the application may be practiced without one or more of the specific features or advantages of a particular embodiment. In other instances, additional features and advantages may be recognized in certain embodiments that may not be present in all embodiments of the disclosure. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the disclosed subject matter. No claim element is intended to refer to 35u.s.c.112 (f) unless the element is explicitly stated using the phrase "means for … …".
The terms "comprising," "including," "having," and variations thereof as used herein mean "including but not limited to," unless expressly specified otherwise. Thus, the terms "comprises," "comprising," "includes," "including," "having," and variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. The listing of items does not imply that any or all of the items are mutually exclusive and/or inclusive, unless explicitly stated otherwise.
Furthermore, in the detailed description herein, references to "one embodiment," "an embodiment," "some embodiments," "various embodiments," "one instance," "an example," "some examples," "various examples," "one implementation," "an implementation," "some implementations," "one aspect," "an aspect," "some aspects," "various aspects," etc., indicate that the embodiment, example, implementation, and/or aspect described may include a particular feature, structure, or characteristic, but every embodiment, example, implementation, and/or aspect does not necessarily include the particular feature, structure, or characteristic. Moreover, these phrases are not necessarily referring to the same embodiment, example, implementation, or aspect. Thus, when a particular feature, structure, or characteristic is described in connection with an embodiment, example, implementation, and/or aspect, it is submitted that it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments, examples, implementations, and/or aspects whether or not explicitly described. Features, structures, components, characteristics, and/or functions may be associated with one or more embodiments, examples, implementations, and/or aspects of the present disclosure if no explicit correlation is indicated otherwise. After reading the description, it will become apparent to a person skilled in the relevant art how to implement the present disclosure in alternative configurations.
The scope of the present disclosure is limited only by the appended claims, wherein reference to an element in the singular is not intended to mean "one and only one" unless explicitly so stated, but rather "one or more" is to be understood as referring to "a", "an", and/or "the" may include one or more than one, and reference to an item in the singular may include the item in the plural unless specifically stated otherwise. Furthermore, the term "plurality" may be defined as "at least two". As used herein, the phrase "at least one" when used with a list of items means that different combinations of one or more of the listed items can be used and that only one of the items in the list may be required. The item may be a particular object, thing, or category. Furthermore, when a phrase similar to "at least one of A, B and C" is used in the claims, the phrase is intended to be construed to mean that a is present in an embodiment alone, B is present in an embodiment alone, C is present in an embodiment alone, or any combination of elements A, B and C may be present in a single embodiment; for example, a and B, A and C, B and C, or A, B and C. In some cases, "at least one of item a, item B, and item C" may mean, for example, but not limited to, two of item a, one of item B, and ten of item C; four of items B, seven of items C; or some other suitable combination.
Unless otherwise described, the terms "first," "second," and the like are used herein merely as labels, and are not intended to impose order, position, or order requirements on the items to which these terms refer. Furthermore, reference to an item such as "second" does not require or exclude the presence of items such as "first" or lower numbered items, and/or items such as "third" or higher numbered items.
All ranges and ratio limits disclosed herein can be combined. Unless otherwise defined herein, a number, percentage, ratio, or other value described herein is intended to include that value, as well as other values of "about" or "approximately" the value, as would be understood by one of ordinary skill in the art encompassed by the embodiments of the present disclosure. Accordingly, the values should be construed as broad enough to encompass values at least close enough to the values to perform the desired function or to achieve the desired result. The values include at least the variations contemplated during suitable manufacturing or production, and may include values within 5%, within 1%, within 0.1%, or within 0.01% of the values.
Different cross-hatching may be used throughout the drawings to represent different components, but need not represent the same or different materials. In all figures, surface hatching may be used to represent different parts or regions, but does not necessarily represent the same or different materials. In some cases, the reference coordinates may be specific to each graphic. Furthermore, the connecting lines shown in the various figures contained herein are intended to represent example functional relationships and/or physical couplings between the various elements. It should be noted that many alternative or additional functional relationships or physical connections may be present in a practical system.
Any reference to attaching, securing, connecting, etc. may include permanent, removable, temporary, partial, complete, and/or any other possible attachment option. Further, any reference to no contact (or similar phrase) may also include reducing contact or minimizing contact. In the above description, certain terms may be used, such as "above," "below," "upper," "lower," "horizontal," "vertical," "left," "right," and the like. These terms are used where applicable to provide some clear description when dealing with relative relationships. However, these terms are not intended to imply absolute relationships, positions, and/or orientations. For example, for an object, the "upper" surface may be changed to the "lower" surface simply by flipping the object over. Nevertheless, it is still the same object.
Furthermore, the term "coupled" in this specification to one element to another element may include both direct and indirect coupling. A direct coupling may be defined as one element being coupled to and in some contact with another element. An indirect coupling may be defined as a coupling between two elements that are not in direct contact with each other, but with one or more additional elements between the coupled elements. Furthermore, an element "coupled" to another element may refer to two separate components being connected or joined together, or may refer to different sections, segments or portions of an integrated/monolithic structure that extend relative to each other or have some other contrasting characteristic, shape, property, etc. Further, as used herein, securing one element to another element may include direct securing and indirect securing. Further, as used herein, "adjacent" does not necessarily mean in contact. For example, one element may be adjacent to another element without contacting the element.
The schematic flow chart diagrams included herein are generally set forth in the form of a logic flow chart diagram. Accordingly, the depicted order and labeled steps are indicative of one or more embodiments of the presented method. The steps recited in any method or process description may be performed in any order and are not necessarily limited to the order presented. Furthermore, any reference to the singular includes the plural embodiments, and any reference to more than one component or step may include the singular embodiments or steps. The elements and steps in the figures are illustrated for simplicity and clarity and have not necessarily been presented in any particular order. Other steps and methods may be conceived that are equivalent in function, logic, or effect to one or more steps, or portions thereof, of the illustrated method.
Additionally, the format and symbols employed are provided to explain the logical steps of the method and are understood not to limit the scope of the method. Although various arrow types and line types may be employed in the flow chart diagrams, they are understood not to limit the scope of the corresponding method. Indeed, some arrows or other connectors may be used to indicate only the logical flow of the method. For example, an arrow may indicate a waiting or monitoring period of unspecified duration between enumerated steps of the depicted method. Furthermore, the order in which a particular method occurs may or may not strictly adhere to the order of the corresponding steps shown. Furthermore, no element, component, or method step in the present disclosure is intended to be dedicated to the public regardless of whether the element, component, or method step is explicitly recited in the claims.
The subject matter of the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The described embodiments are to be considered in all respects only as illustrative and not restrictive. The scope of the disclosure is, therefore, indicated by the appended claims rather than by the foregoing description. All changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.
Claims (105)
1. A laser machining apparatus configured to direct electromagnetic radiation toward a workpiece, the laser machining apparatus comprising:
a housing;
a cover pivotably coupled to the housing, wherein the housing and the cover together at least partially define an interior volume of the laser processing apparatus;
a track assembly mounted to the housing; and
a laser cradle assembly coupled to the track assembly, the laser cradle assembly comprising a laser module configured to emit electromagnetic radiation;
wherein the laser machining apparatus is configured to move the laser carriage assembly within the interior volume and along the rail assembly relative to a workpiece disposed within the interior volume.
2. The laser processing apparatus of claim 1, further comprising a material support tray removably supported within the interior volume such that when the material support tray is removed from the interior volume of the laser processing apparatus, a user can place the workpiece on the material support tray and then load the material support tray and the workpiece supported thereon into the interior volume.
3. The laser processing apparatus of claim 2, wherein the housing includes a workspace bed configured to at least one of receive, engage, support, and hold the material support tray in a known loading position relative to the rail assembly within the interior volume.
4. The laser processing apparatus of claim 3, wherein the workspace bed defines a nesting area configured to receive the material support tray therein.
5. The laser processing apparatus of claim 4, wherein the workspace bed includes a plurality of upwardly extending bonding pins and the material support tray includes a plurality of bonding recesses configured to align with and respectively receive the plurality of upwardly extending bonding pins to facilitate consistent and repeatable loading of the material support tray in the known loading position.
6. The laser processing apparatus of claim 3, wherein the workspace bed is operably coupled to a lifting mechanism configured to raise and lower the workspace bed within the interior volume of the laser processing apparatus.
7. The laser machining apparatus of claim 2, further comprising at least one retaining clip configured to be detachably coupled to the material support tray to facilitate securing the workpiece to the material support tray.
8. The laser machining apparatus of claim 7, wherein the housing includes a shelf within an interior volume of the laser machining apparatus, the shelf configured to support the at least one retaining clip for workpiece securement when not in use.
9. The laser machining apparatus of claim 8, wherein the shelf defines a slot configured to receive a rod portion of the retaining clip.
10. The laser machining apparatus of claim 7, wherein the material support tray includes a rigid grid body for supporting the workpiece thereon, wherein the rigid grid body defines a plurality of cells configured to removably receive the rod portion of the at least one retaining clip.
11. The laser processing apparatus of claim 10, wherein the rigid grid body has a honeycomb structure.
12. The laser machining apparatus of claim 10, wherein the material support tray comprises an upper frame and a lower frame, wherein the upper frame is coupled to the lower frame, wherein the rigid grid body is sandwiched between the upper frame and the lower frame.
13. The laser processing apparatus of claim 12, wherein the upper frame includes alignment features to facilitate alignment and positioning of the workpiece on the material support tray.
14. The laser processing apparatus of claim 12, wherein the upper frame includes raised rib portions extending upwardly from corner segments of the upper frame.
15. The laser processing apparatus of claim 1, wherein:
the laser machining apparatus defines a ventilation path through which ventilation air is configured to flow during operation of the laser machining apparatus;
the ventilation path comprises at least a workspace region of an interior volume of the laser processing apparatus; and is also provided with
The laser machining apparatus includes a suction fan configured to draw the ventilation air through the ventilation path and ultimately force the ventilation air out of an interior volume of the laser machining apparatus.
16. The laser machining apparatus of claim 15, further comprising a prefilter disposed in a ventilation path between a workspace area of an interior volume of the laser machining apparatus and the suction fan.
17. The laser machining apparatus of claim 16, wherein the pre-filter includes a filter frame that holds a filter medium, wherein the filter frame is detachably coupled to a housing of the laser machining apparatus.
18. The laser machining apparatus of claim 16, further comprising a baffle disposed in a vent path between the prefilter and the suction fan.
19. The laser machining apparatus of claim 18, further comprising a wind tunnel in a ventilation path between the prefilter and the suction fan.
20. The laser machining apparatus of claim 19, wherein the air duct has a converging cross section from the prefilter toward the suction fan with respect to a flow direction of the ventilation air.
21. The laser machining apparatus of claim 15, further comprising a hose module detachably coupled to a housing of the laser machining apparatus, wherein the suction fan is a component of the hose module.
22. The laser machining apparatus of claim 21, further comprising one or more hardware interlock features configured to prevent operation of the laser machining apparatus in response to the hose module being removed from a housing of the laser machining apparatus.
23. The laser machining apparatus of claim 21, wherein the hose module is connectable to the housing of the laser machining apparatus in two different orientations such that the outlet of the hose module can be switched to face in a left or right direction relative to the housing of the laser machining apparatus.
24. The laser machining apparatus of claim 23, wherein the hose module is configured to redirect incoming ventilation air approximately 90 degrees to exit the hose module via the outlet.
25. The laser machining apparatus of claim 23, wherein the suction fan is a centrifugal fan.
26. The laser machining apparatus of claim 23, wherein the hose module includes two electrical connectors, wherein each of the two electrical connectors is individually and individually connectable to a single electrical connection port extending from a housing of the laser machining apparatus.
27. The laser machining apparatus of claim 21, wherein the housing of the laser machining apparatus includes a rear panel having a rear surface defining a socket at which the hose module is detachably coupled.
28. The laser machining apparatus of claim 27, wherein the hose module includes an interface plate configured to removably engage the socket, wherein an inlet of the hose module is defined by the interface plate.
29. The laser machining apparatus of claim 28, wherein the interface plate is detachable from the hose module to allow access to the suction fan.
30. The laser machining apparatus of claim 29, wherein the interface plate defines at least one finger to facilitate separation of the interface plate from the hose module.
31. The laser processing apparatus of claim 29, wherein the hose module includes a blower housing having a first portion and a second portion that together define an airflow surface around the blower, the first portion of the blower housing being mounted to the interface plate and separable from the second portion of the blower housing to allow access to the blower.
32. The laser processing apparatus of claim 15, wherein:
the housing of the laser machining apparatus at least partially defines an air intake path;
the air intake path is part of the ventilation path; and is also provided with
The air intake path is configured to redirect the ventilation air from one or more air intake ports defined by a bottom panel of a housing of the laser machining apparatus to one or more air delivery ports facing a workspace region of an interior volume of the laser machining apparatus.
33. The laser machining apparatus of claim 32, wherein the air intake path is defined at least in part by a front panel of a housing of the laser machining apparatus.
34. The laser processing apparatus of claim 33, wherein:
the air intake path includes an L-shaped air intake passage defined at least in part by a front panel of the laser machining apparatus;
the L-shaped air inlet passage of the air inlet path comprises a vertical pressure stabilizing chamber and an upper horizontal pressure stabilizing chamber; and is also provided with
An L-shaped air intake passage of the air intake path is provided in front of a working space region of an internal volume of the laser processing apparatus.
35. The laser processing apparatus of claim 34, wherein the upper horizontal plenum fluidly connects the vertical plenum to the one or more gas delivery ports, wherein the upper horizontal plenum is configured to straighten the ventilation air horizontally before the ventilation air passes through the one or more gas delivery ports to a workspace region of an interior volume of the laser processing apparatus.
36. The laser machining apparatus of claim 35, wherein the L-shaped air intake passageway includes a lower horizontal plenum fluidly connecting the one or more air intake ports to the vertical plenum.
37. The laser machining apparatus of claim 36, wherein the ventilation air in the lower horizontal plenum generally flows to a front surface of the laser machining apparatus and the ventilation air in the upper horizontal plenum generally flows to a rear surface of the laser machining apparatus.
38. The laser machining apparatus of claim 32, wherein the one or more gas delivery ports are configured to deliver laminar flow air to a region of a working space of an interior volume of the laser machining apparatus.
39. The laser processing apparatus of claim 32, wherein the one or more gas delivery ports are configured such that ventilation air exiting the one or more gas delivery ports forms an air curtain having a width that is greater than a width of a material support tray disposed within a workspace area of an interior volume of the laser processing apparatus.
40. The laser processing apparatus of claim 1, further comprising at least one atmospheric sensor configured to detect an air composition, the air being at least one of within and out of an interior volume of the laser processing apparatus.
41. The laser machining apparatus of claim 1, further comprising at least one temperature sensor configured to detect a temperature of at least one of a laser module and air within an interior volume of the laser machining apparatus.
42. The laser machining apparatus of claim 1, further comprising an accelerometer coupled to the laser carriage assembly, the accelerometer configured to detect movement (or non-movement) of the laser carriage assembly.
43. The laser machining apparatus of claim 1, further comprising a flame sensor configured to detect the presence of a flame within an interior volume of the laser machining apparatus.
44. The laser processing apparatus of claim 1, further comprising a glass breakage sensor configured to detect breakage of the cap.
45. The laser machining apparatus of claim 1, wherein the laser carriage assembly includes an optical sensor configured to detect proximity of a top surface of the workpiece to the laser module.
46. The laser machining apparatus of claim 1, further comprising one or more hardware interlock features configured to prevent operation of the laser machining apparatus in response to the cap not being closed (i.e., in response to the laser machining apparatus being in an open configuration).
47. The laser machining apparatus of claim 46, wherein the one or more hardware interlock features are coupled in control communication with a controller, wherein in response to the one or more hardware interlock features detecting that the cap is opened during operation of the workpiece, the controller is configured to suspend operation of the workpiece while operation of the workpiece can be subsequently resumed.
48. The laser machining apparatus of claim 1, wherein the cap is pivotably coupled to the housing via a hinge structure.
49. The laser machining apparatus of claim 48, wherein the hinge structure includes a pivot arm having a first portion pivotably coupled to the housing and a second portion coupled to the cap.
50. The laser processing apparatus of claim 49, wherein the second portion of the pivot arm is coupled to the fire suppression layer of the cap such that force transfer between the pivot arm and the cap occurs only via the fire suppression layer.
51. The laser machining apparatus of claim 49, wherein the hinge structure includes a damping device coupled to the pivot arm, wherein the damping device is configured to slow rotation of the cap between the open and closed positions.
52. The laser machining apparatus of claim 49, wherein the first portion of the pivot arm is perpendicular to the second portion.
53. The laser machining apparatus of claim 49, wherein the pivot arm includes a curved portion extending between the first portion and the second portion.
54. A laser processing apparatus as recited in claim 53, wherein:
the first portion includes a first end pivotably coupled to the housing and a second end opposite the first end coupled to a third end of the curved portion;
the curved portion includes a fourth end coupled to a fifth end of the second portion; and is also provided with
The second portion includes a sixth end opposite the fifth end.
55. A laser machining apparatus according to claim 54, wherein the fifth end of the second portion is closer to the first end of the first portion than the second end of the first portion.
56. A laser machining apparatus according to claim 54, wherein:
the hinge structure further includes a damping device coupled to the pivot arm, wherein the damping device is configured to slow rotation of the cover between an open position and a closed position; and is also provided with
The damping device is an extension damper configured to dampen rotation of the cap when the extension damper is extended.
57. A laser machining apparatus according to claim 56, wherein the extension damper includes a seventh end pivotably coupled to the housing of the laser machining apparatus and an eighth end pivotably coupled to at least one of the second end of the first portion of the pivot arm and the third end of the curved portion of the pivot arm.
58. A laser cradle assembly for a laser machining apparatus, the laser cradle assembly comprising:
A support structure;
a laser module mounted to the support structure and configured to emit electromagnetic radiation along a beam axis toward a workpiece; and
a lens tray detachably coupled to the support structure, the lens tray defining a first optical window, and the lens tray including a first optical lens extending across the first optical window;
wherein when the lens tray is in a mounted position relative to the support structure, the laser module is aligned with the lens tray such that the beam axis extends through the first optical window and intersects the first optical lens.
59. The laser tray assembly of claim 58, wherein the support structure comprises a lower base plate, wherein the lens tray is positioned between the laser module and the lower base plate when the lens tray is in the installed position.
60. The laser bracket assembly of claim 59, wherein:
the lower substrate includes a nozzle extending downwardly and away from the laser module;
the nozzle is configured to direct compressed air toward the workpiece; and is also provided with
The beam axis extends through the nozzle.
61. The laser bracket assembly of claim 60, wherein the lower base plate defines a compressed air passage configured to deliver compressed air from a compressed air source to the nozzle.
62. The laser tray assembly of claim 61, further comprising an annular gasket disposed in sealing engagement about the beam axis between the nozzle of the lower substrate and a lower surface of the lens tray that surrounds the first optical window when the lens tray is in the mounted position.
63. The laser bracket assembly of claim 62, wherein the annular liner defines a channel fluidly connecting the compressed air passage to the nozzle such that the compressed air is sent to the nozzle through the annular liner.
64. The laser bracket assembly of claim 59, further comprising a blower and a heat sink coupled to the support structure, wherein the heat sink is disposed about the laser module and the blower is configured to blow cooling air across the heat sink and around the laser module.
65. The laser bracket assembly of claim 64, further comprising a removable fan guard forming a top surface of a housing of the laser bracket assembly, wherein the removable fan guard is removably secured via a magnet.
66. The laser bracket assembly of claim 64, wherein the lens tray defines one or more cooling air windows disposed around the first optical window through which cooling air from the fan flows.
67. The laser tray assembly of claim 66, wherein the lower substrate comprises one or more louvers positioned below the one or more cooling air windows, wherein the one or more louvers are configured to direct the cooling air away from being parallel to the beam axis.
68. The laser carriage assembly of claim 67 wherein the one or more louvers are configured to direct the cooling air in a direction between about 45 degrees and about 90 degrees from the beam axis.
69. A laser carriage assembly as described in claim 67 wherein said one or more louvers have a concave upper surface.
70. The laser carriage assembly of claim 67 wherein the one or more louvers are configured to direct the cooling air rearward relative to the laser machining apparatus.
71. The laser tray assembly of claim 58, further comprising a visible light module coupled to the support structure and disposed adjacent to the laser module, wherein the visible light module is configured to emit visible light parallel to the beam axis.
72. The laser carriage assembly of claim 58 further comprising an optical sensor coupled to the support structure, wherein the optical sensor is configured to emit radiation along a sensor axis and to receive reflected radiation from an upper surface of the workpiece to determine a distance between the laser module and the upper surface of the workpiece.
73. A laser bracket assembly as defined in claim 72, wherein:
the lens tray defines a second optical window;
the lens tray includes a second optical lens extending across the second optical window; and is also provided with
When the lens tray is in the mounted position relative to the support structure, the optical sensor is aligned with the lens tray such that the sensor axis extends through the second optical window and intersects the second optical lens.
74. The laser bracket assembly of claim 58, further comprising one or more hardware interlock features configured to prevent operation of the laser machining apparatus in response to the lens tray being detached from the support structure (i.e., in response to the lens tray not being in the installed position).
75. The laser bracket assembly of claim 59, wherein the lens tray includes a top portion defining the first optical window and a flange portion extending from at least a portion of a perimeter of the top portion.
76. The laser bracket assembly of claim 75, wherein the flange portion extends from a front portion and a side portion of a perimeter of the top portion.
77. The laser bracket assembly of claim 76, wherein the flange portion of the lens tray is configured to engage and at least partially enclose a corresponding peripheral surface of the lower substrate.
78. The laser bracket assembly of claim 77, wherein an inner surface of the flange portion of the lens tray comprises one or more engagement features configured to reversibly engage with corresponding engagement features on a peripheral surface of the lower substrate.
79. A laser carriage assembly as described in claim 58 wherein an O-ring is disposed in sealing engagement about said beam axis between a lower end of said laser module and an upper surface of said lens tray, said upper surface of said lens tray surrounding said first optical window when said lens tray is in said installed position.
80. A cover for a laser machining apparatus, the cover comprising:
a radiation attenuating layer; and
a fire suppression layer coupled to the radiation attenuating layer.
81. The cap of claim 80 wherein:
the cover has a perimeter including a front edge, a rear edge opposite the front edge, and opposite lateral side edges;
the radiation attenuation layer and the fire extinguishing layer are parallel to each other; and is also provided with
Both the radiation attenuating layer and the fire suppressing layer extend continuously within the perimeter such that a majority of the body mass of the cover consists of the radiation attenuating layer and the fire suppressing layer.
82. The cap of claim 81 wherein the radiation attenuating layer forms a top exterior surface of the cap and the fire suppressing layer forms a bottom interior surface of the cap, the bottom interior surface of the cap being configured to face an interior volume of the laser processing apparatus.
83. The cap of claim 82 wherein said radiation attenuating layer comprises at least one of a thermoplastic material and a synthetic polymer.
84. The cap of claim 83 wherein the radiation attenuating layer comprises polymethyl methacrylate.
85. The cap of claim 82 wherein the radiation attenuating layer is colored to attenuate transmission of electromagnetic radiation from a laser module of the laser processing apparatus.
86. The covering of claim 82 wherein the fire suppression layer comprises a glass material.
87. The covering of claim 86 wherein the fire suppression layer comprises borosilicate glass.
88. The covering of claim 80 further comprising an intermediate spacer frame disposed between the radiation attenuating layer and the fire suppressing layer such that a gap is defined between the radiation attenuating layer and the fire suppressing layer.
89. The covering of claim 88 wherein the radiation attenuating layer is at least one of adhered to the upper surface of the intermediate spacer frame and bonded to the upper surface of the intermediate spacer frame.
90. The covering of claim 89, further comprising a base frame having a bottom portion and a side wall portion, wherein the intermediate spacer frame is coupled to the bottom portion of the base frame via a plurality of fasteners such that the fire suppression layer is securely held and/or compressed between a lower surface of the intermediate spacer frame and an upper surface of the bottom portion of the base frame.
91. The covering of claim 90 wherein a majority of the plurality of fasteners are positioned outside of a perimeter of the fire suppression layer such that a majority of the plurality of fasteners do not extend through the fire suppression layer.
92. The covering of claim 91 wherein said intermediate spacer frame includes a plurality of tabs extending downwardly around the perimeter of said fire suppression layer and engaging the upper surface of the bottom portion of said base frame.
93. The cap of claim 92 wherein the plurality of tabs are disposed only in proximity to the plurality of fasteners, respectively, and whereby the plurality of tabs resist uneven overhanging of the intermediate spacer frame in response to securement of the plurality of fasteners during fabrication of the cap.
94. The covering of claim 92 wherein the sidewall portion of the base frame at least partially surrounds the perimeter of the intermediate spacer frame.
95. The covering of claim 94 wherein an upper edge of the sidewall portion of the base frame faces a lower surface of the radiation attenuating layer.
96. The covering of claim 90 further comprising a gasket frame disposed between a lower surface of the fire suppression layer and an upper surface of the bottom portion of the base frame.
97. The covering of claim 96 wherein the gasket frame includes one or more ribs extending upwardly from a perimeter of the gasket frame and at least partially surrounding a perimeter of the fire suppression layer.
98. The covering of claim 97, wherein the one or more ribs are disposed between a perimeter of the fire suppression layer and the plurality of fasteners extending between the intermediate spacer frame and a bottom portion of the base frame.
99. The covering of claim 98 wherein the plurality of fasteners extend through the cushion frame.
100. The covering of claim 96 wherein the cushion frame includes a wraparound lip extending inwardly of an inner edge of the bottom portion of the base frame and extending back outwardly below the bottom portion of the base frame.
101. The cap of claim 100 wherein the wraparound lip is made of a resiliently flexible material and is configured to deform into engagement with an upper surface of a housing of the laser processing apparatus in response to the cap closing against the housing.
102. The covering of claim 96, wherein the fire suppression layer includes outwardly extending wing portions, wherein respective pivot arms of a hinge structure of the laser processing apparatus are respectively coupled to the wing portions of the fire suppression layer.
103. The covering of claim 102 wherein the gasket frame includes respective wing portions extending between the outwardly extending wing portions of the fire suppression layer and respective pivot arms of a hinge structure of the laser processing apparatus.
104. The cap of claim 102 wherein force transfer between the cap and a pivot arm of a hinge structure of the laser machining apparatus occurs via the fire suppression layer.
105. The cap of claim 80 wherein force transfer between the cap and one or more pivot arms of a hinge structure of the laser machining apparatus occurs solely via the fire suppression layer.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US63/158,357 | 2021-03-08 | ||
| US63/158,335 | 2021-03-08 | ||
| US63/158,354 | 2021-03-08 | ||
| US63/158,356 | 2021-03-08 | ||
| US202163158736P | 2021-03-09 | 2021-03-09 | |
| US63/158,736 | 2021-03-09 | ||
| PCT/US2022/019403 WO2022192299A2 (en) | 2021-03-08 | 2022-03-08 | Laser crafting apparatus, system, and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117157166A true CN117157166A (en) | 2023-12-01 |
Family
ID=88910567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280028528.2A Pending CN117157166A (en) | 2021-03-08 | 2022-03-08 | Laser processing apparatus, system and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117157166A (en) |
-
2022
- 2022-03-08 CN CN202280028528.2A patent/CN117157166A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6481527B1 (en) | Methods and apparatus for attenuating noise from a cabinet that houses computer equipment | |
| US9610198B2 (en) | Protection device for a welder | |
| JP6228040B2 (en) | Clean room air circulation system with exhaust circulation safety cabinet and exhaust circulation safety cabinet | |
| US20240139870A1 (en) | Laser Crafting Apparatus, System, and Method | |
| JP4324570B2 (en) | Optical disk device | |
| JP2006163217A (en) | Outdoor display device | |
| KR20040086475A (en) | Method and device for prevention of adhesion of dirt and contamination on optical parts in laser beam machine | |
| CN117157166A (en) | Laser processing apparatus, system and method | |
| KR20180043572A (en) | Safety helmet having multi-funcion | |
| WO2021005869A1 (en) | Safe cabinet | |
| US20120052783A1 (en) | Reduced-emission fume hood | |
| US20140260130A1 (en) | Ductless laboratory hood apparatus | |
| CN206122904U (en) | Cabinet type laser beam machining device | |
| JPWO2009116508A1 (en) | Shape measuring device and robot device equipped with the same | |
| CN103132069B (en) | Laser processing wire-feeding powder-feeding cladding atmosphere protective device | |
| JP5995652B2 (en) | Airflow control method and airflow control device for welding work room | |
| JPWO2019111451A1 (en) | Push hood | |
| JP2604012B2 (en) | Clean robot | |
| CA2966270A1 (en) | Fume hood with horizontally moveable panels | |
| CN202383415U (en) | Protector for projector | |
| US20230168002A1 (en) | Manufacturing fixtures including an integrated diffuser for diffusing conditioned air | |
| CN112917019A (en) | Laser cutting apparatus and control method thereof | |
| CN205809520U (en) | Hermetically sealed constant temperature and humidity super-clean environment laser projection system | |
| JP7196339B1 (en) | safety cabinet | |
| TW201448710A (en) | Chassis and blowing device thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |