CN117153759B - Silicon wafer bearing positioning calibration method and system - Google Patents
Silicon wafer bearing positioning calibration method and system Download PDFInfo
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- CN117153759B CN117153759B CN202311420561.2A CN202311420561A CN117153759B CN 117153759 B CN117153759 B CN 117153759B CN 202311420561 A CN202311420561 A CN 202311420561A CN 117153759 B CN117153759 B CN 117153759B
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 105
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 104
- 239000010703 silicon Substances 0.000 title claims abstract description 104
- 238000000034 method Methods 0.000 title claims abstract description 50
- 238000012545 processing Methods 0.000 claims abstract description 147
- 238000005192 partition Methods 0.000 claims abstract description 54
- 238000004458 analytical method Methods 0.000 claims abstract description 24
- 238000004364 calculation method Methods 0.000 claims abstract description 10
- 238000004088 simulation Methods 0.000 claims description 33
- 238000012544 monitoring process Methods 0.000 claims description 27
- 238000006073 displacement reaction Methods 0.000 claims description 16
- 238000012360 testing method Methods 0.000 claims description 11
- 238000003754 machining Methods 0.000 claims description 6
- 238000012549 training Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 7
- 235000012431 wafers Nutrition 0.000 description 72
- 230000000875 corresponding effect Effects 0.000 description 15
- 230000001133 acceleration Effects 0.000 description 5
- 238000005498 polishing Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
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- 238000001914 filtration Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000002864 sequence alignment Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- G—PHYSICS
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- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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Abstract
The invention discloses a silicon wafer bearing positioning calibration method and a system, belonging to the field of intelligent control, wherein the method comprises the following steps: acquiring initial position information of silicon chip placement of a bearing platform, position information of a processing platform and carrier distribution information, and determining a bearing motion coordinate track; setting a positioning target; dividing the bearing motion coordinate track to determine a motion control partition; performing control parameter characteristic analysis to determine control characteristics of each partition; matching and executing motor control types, carrying out motor control type identification on the motion control partition, and determining a motor control area and a calibration control area; and extracting motor control parameters of the calibration control area, performing positioning deviation calculation, and performing deviation calibration on the bearing movement. The method solves the technical problems of large bearing and positioning deviation of the silicon wafer and influence on the processing quality of the silicon wafer in the prior art, and achieves the technical effects of improving the positioning precision of the silicon wafer on the bearing table and improving the processing quality of the silicon wafer by utilizing the double-power motor for accurate control.
Description
Technical Field
The invention relates to the field of intelligent control, in particular to a silicon wafer bearing positioning calibration method and system.
Background
With the rapid development of electronic information technology, the demand for silicon wafers is increasing, and the demand for silicon wafer quality is also increasing. In order to ensure the surface quality of the silicon wafer, precise polishing treatment is required to be carried out on the silicon wafer. In the silicon wafer polishing treatment, the positioning accuracy of the silicon wafer directly influences the treatment quality. Therefore, how to improve the positioning accuracy of the silicon wafer on the bearing table becomes a key technical problem affecting the polishing quality of the silicon wafer. At present, the silicon wafer positioning control mainly adopts a mechanical limiting mode for positioning, but the positioning mode has the problem of larger positioning deviation, so that the quality of the processed silicon wafer cannot be effectively controlled.
Disclosure of Invention
The application aims to solve the technical problems that in the prior art, silicon wafer bearing and positioning deviation is large and silicon wafer processing quality is affected by the silicon wafer bearing and positioning calibration method and system.
In view of the above problems, the present application provides a method and a system for calibrating the bearing and positioning of a silicon wafer.
In a first aspect of the disclosure, a method for calibrating load-bearing positioning of a silicon wafer is provided, the method comprising: acquiring initial position information of silicon chip placement of a bearing platform, position information of a processing platform and carrier distribution information, and determining a bearing motion coordinate track, wherein the bearing motion coordinate track at least comprises X-direction motion and Y-direction motion; setting a positioning target based on the placement initial position information, the processing table position information and the object carrying distribution information; dividing the bearing motion coordinate track by using the distribution of the positioning targets in the bearing motion coordinate track to determine a motion control partition; performing control parameter characteristic analysis by utilizing the motion control subareas, and determining control characteristics of each subarea; performing motor control type identification on the motion control subareas based on the matching execution of the control characteristics of each subarea, and determining a motor control area and a calibration control area, wherein the motor control area is high-power motor control, and the calibration control area is low-power motor control; and extracting motor control parameters of the calibration control area, performing positioning deviation calculation based on the motor control parameters, and performing deviation calibration on the bearing movement.
In another aspect of the disclosure, a system for calibrating a silicon wafer carrier positioning is provided, the system comprising: the coordinate track determining unit is used for acquiring initial position information of the silicon chip placement of the bearing platform, position information of the processing platform and carrier distribution information and determining a bearing motion coordinate track, wherein the bearing motion coordinate track at least comprises X-direction motion and Y-direction motion; the positioning target setting unit is used for setting a positioning target based on the placement initial position information, the processing table position information and the carrying distribution information; the coordinate track dividing unit is used for dividing the bearing motion coordinate track by utilizing the distribution of the positioning targets in the bearing motion coordinate track and determining a motion control partition; the parameter characteristic analysis unit is used for carrying out control parameter characteristic analysis by utilizing the motion control subareas and determining the control characteristics of each subarea; the control area determining unit is used for performing motor control type based on the matching of the control characteristics of each partition, performing motor control type identification on the motion control partition, and determining a motor control area and a calibration control area, wherein the motor control area is high-power motor control, and the calibration control area is low-power motor control; and the bearing deviation calibration unit is used for extracting motor control parameters of the calibration control area, performing positioning deviation calculation based on the motor control parameters, and performing deviation calibration on the bearing movement.
One or more technical solutions provided in the present application have at least the following technical effects or advantages:
the primary position information of the silicon chip placement of the bearing platform, the position information of the processing platform and the carrier distribution information are acquired to determine the bearing motion coordinate track, so that the acquisition of basic data required by determining the bearing platform motion track is realized; setting a positioning target according to the initial position information, the processing table position information and the object distribution information, and determining the expected position of positioning according to the basic data; dividing the track by using the distribution condition of the positioning targets in the track carrying the motion coordinates, determining motion control partitions, and dividing control areas according to different positioning precision requirements; performing control parameter feature analysis on each motion control partition, and determining control features corresponding to the partitions; different motor control types are executed according to the control characteristic matching, a motor control area and a calibration control area are determined, and motors with different powers are adopted to control according to the control characteristic requirements; the technical scheme of extracting motor control parameters of a calibration control area, calculating positioning deviation and carrying out deviation calibration to realize accurate positioning solves the technical problems of large silicon wafer bearing positioning deviation and influence on silicon wafer processing quality in the prior art, achieves the technical effects of accurately controlling by utilizing a double-power motor, improving the positioning precision of the silicon wafer on a bearing table and improving the silicon wafer processing quality.
The foregoing description is only an overview of the technical solutions of the present application, and may be implemented according to the content of the specification in order to make the technical means of the present application more clearly understood, and in order to make the above-mentioned and other objects, features and advantages of the present application more clearly understood, the following detailed description of the present application will be given.
Drawings
Fig. 1 is a schematic flow chart of a method for calibrating the bearing and positioning of a silicon wafer according to an embodiment of the present application;
fig. 2 is a schematic flow chart of generating vibration displacement calibration reminding information in a silicon wafer bearing positioning calibration method according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a silicon wafer bearing positioning calibration system according to an embodiment of the present application.
Reference numerals illustrate: the device comprises a coordinate track determining unit 11, a positioning target setting unit 12, a coordinate track dividing unit 13, a parameter characteristic analyzing unit 14, a control area determining unit 15 and a bearing deviation calibrating unit 16.
Detailed Description
The technical scheme provided by the application has the following overall thought:
the embodiment of the application provides a silicon wafer bearing positioning calibration method and system. Firstly, the bearing motion coordinate track is determined by collecting the initial position information of the silicon chip placement of the bearing platform, the position information of the processing platform and the carrier distribution information, and a foundation is provided for subsequent positioning control. Then, a positioning target is set by using the collected basic information, and positioning control of the bearing platform is performed by taking the target as a guide. And then, dividing the whole track into different motion control partitions according to the distribution condition of the positioning target in the bearing motion track, and analyzing the control parameter characteristics of each partition. And then, according to the control characteristics of each partition, motors with different powers are matched for control, and a motor control area and a calibration control area for accurate positioning are determined. Finally, the motor parameters of the calibration control area are extracted, deviation is calculated and calibration is carried out, so that high-precision positioning of the silicon wafer is realized, and the processing quality and the processing efficiency of the silicon wafer are improved.
Having described the basic principles of the present application, various non-limiting embodiments of the present application will now be described in detail with reference to the accompanying drawings.
Example 1
As shown in fig. 1, an embodiment of the present application provides a method for calibrating a silicon wafer bearing location, where the method includes:
acquiring initial position information of silicon chip placement of a bearing platform, position information of a processing platform and carrier distribution information, and determining a bearing motion coordinate track, wherein the bearing motion coordinate track at least comprises X-direction motion and Y-direction motion;
in the embodiment of the application, the bearing platform is a platform for placing and transporting a plurality of silicon wafers; the initial placement information refers to the initial placement position of each silicon wafer on the bearing table; the processing table is equipment for carrying out subsequent processing treatment on the silicon wafer, and the processing table position information refers to the space coordinate position of the processing table; the carrier distribution information refers to the arrangement and distribution condition of a plurality of silicon chips on the carrying platform.
And by collecting initial position information, processing table position information and object carrying distribution information, the motion coordinate track of the silicon wafer on the carrying table is planned and determined according to the motion track of the silicon wafer in the processing process, so that the carrying motion coordinate track is determined. The bearing motion coordinate track moves at least in the X direction and the Y direction, wherein the X direction is the track from the position where the silicon wafer is placed to the position of the processing table, and the Y direction is the track for sequentially processing a plurality of silicon wafers on the bearing table. The determination of the motion coordinate track lays a foundation for subsequent motion control and accurate positioning.
Setting a positioning target based on the initial position information, the processing table position information and the object distribution information;
further, the method specifically comprises the following steps:
based on the carrier distribution information, collecting positioning features for placing initial positions;
based on the carrier distribution information, collecting positioning characteristics of a processing table;
determining initial positioning and subsequent processing positioning according to the positioning characteristics of the initial positioning and the positioning characteristics of the processing table;
setting the positioning target according to the initial positioning and the subsequent processing positioning of the operation.
In a preferred embodiment, the positioning target refers to various positioning requirements in the operation flow, including positioning the initial placement position of the silicon wafer, positioning the processing table, positioning the silicon wafer on the processing table, and the like. Firstly, analyzing carrier distribution information, namely the distribution condition of silicon wafers on a bearing table, and collecting positioning characteristics of initial placement positions of all silicon wafers, including initial placement coordinate characteristics, placement direction characteristics, placement precision characteristics and the like, so that the initial placement state of all the silicon wafers can be clearly known when all the silicon wafers are transported and positioned later, and accurate positioning can be performed. Meanwhile, the carrier distribution information is analyzed, and the positioning characteristics of the processing table are collected, including the spatial coordinate position characteristics, the direction characteristics, the precision characteristics and the like of the processing table, so that the positioning requirements of the processing table can be clarified when the silicon wafer is conveyed to the processing table for processing in the follow-up process, and the accurate positioning can be performed.
Then, determining the position to which the bearing platform needs to be controlled to move at the beginning of the operation flow according to the positioning characteristics of the initial position, and determining the initial positioning of the operation according to the direction and the precision requirement for placing each silicon wafer; and determining the track, the direction and the positioning accuracy of the silicon wafer to be sent to the processing table according to the track, the track and the direction of the bearing table to be controlled after the operation flow according to the positioning characteristics of the processing table. And determining the subsequent processing positioning. And then, extracting the parameter requirements of the target placement coordinates, placement angles, placement precision and the like of each silicon wafer from the operation initial positioning to serve as target parameter setting of the initial positioning, and extracting the parameters of the target coordinates, the entrance angles and the like fed into the processing table from the subsequent processing positioning to serve as target parameters of the subsequent positioning. And integrating and summarizing the target parameters extracted in each positioning stage to form a complete positioning target, wherein the complete positioning target comprises the placement coordinates, angles and the like of each silicon wafer which are required to be achieved in the initial positioning, and the entrance coordinates, angles and the like of a processing table which are required to be achieved in the subsequent positioning, so that a basis is provided for accurate control.
Dividing the bearing motion coordinate track by using the distribution of the positioning targets in the bearing motion coordinate track, and determining a motion control partition;
in the embodiment of the present application, the bearing motion coordinate track refers to a spatial motion path that the bearing platform needs to follow in completing the operation flow. The whole track is divided into a plurality of sections according to the track position of the positioning target, for example, the section from the beginning to the first positioning point is the section one, the section from the first positioning point to the second positioning point is the section two, and so on, each section forms different motion control partitions, but the motion control parameters of each section are designed according to the difference of the positioning target.
By dividing the bearing motion coordinate track into sections, the motion control mode and parameters in each section can be more targeted, and accurate positioning control is facilitated.
Performing control parameter characteristic analysis by utilizing the motion control subareas, and determining control characteristics of each subarea;
further, the method specifically comprises the following steps:
determining length information and processing characteristics of each partition according to the motion control partition;
according to the processing characteristics of each partition, carrying out motion speed characteristic analysis, determining speed characteristics, and determining control time characteristics by combining the length information;
and carrying out positioning demand analysis according to the processing characteristics, and determining the positioning demand characteristics.
In a preferred embodiment, each zone control feature includes length information, process features, speed features, control time features, positioning demand features, etc. to provide a detailed understanding of the control demand on the wafer in each run control zone. Firstly, calculating and recording the coordinates of start and stop points of each partition according to the determined motion control partition, and determining the length information of the partition according to the coordinate information; meanwhile, the processing characteristics contained in the partition are judged according to the positioning target and the motion task of the partition, such as whether a precise positioning process is contained, whether high-speed motion is needed or not, and the like. The length information and the processing characteristics of each motion control partition are analyzed and disassembled, so that the motion range and the main task type of each partition are clearly known, and a basis is provided for formulating the special control parameters and strategies of the partition.
And then, determining the required movement speed characteristics of the silicon wafer in each subarea according to the obtained processing characteristics of each movement control subarea. For example, for a partition containing precise positioning, according to the positioning precision requirement, analyzing and determining that a lower movement speed is required to ensure the precision requirement, and taking the lower movement speed as the speed characteristic of the partition; for a partition which does not need precise positioning, on the basis of ensuring the movement stability, a higher movement speed is determined as the speed characteristic of the partition. And then, determining the stay time of the silicon wafer in the motion control subarea according to the speed characteristics and the length information of the silicon wafer in different motion control subareas, and taking the stay time as the control time characteristics of the subareas.
Meanwhile, according to the processing characteristics of different subareas, analyzing the positioning precision requirements of the subareas containing precise positioning on the silicon wafer, and determining the positioning requirement characteristics of high precision; for areas that do not require precision positioning, lower positioning accuracy features are determined.
By analyzing and determining the control characteristics of the motion control partitions one by one instead of uniformly adopting a set of control parameters, the positioning and the motion of each motion control partition can reach the due control effect and accuracy, and a foundation is provided for the subsequent formulation of a partition-specific control strategy.
Performing motor control type identification on the motion control subareas based on the matched execution motor control types of the subareas, and determining a motor control area and a calibration control area, wherein the motor control area is high-power motor control, and the calibration control area is low-power motor control;
in the embodiment of the application, each partition control feature is a dynamic control parameter feature such as a determined motion speed, a positioning precision and the like corresponding to each motion control partition. The motor control type refers to the control mode of motors with different powers.
Specifically, for the subareas needing rapid movement, matching and selecting a high-power motor to execute torque control, and marking the motor control type selected by the subareas to determine a motor control area; for a partition needing accurate positioning, such as a polishing partition, matching and selecting a low-power motor to execute fine displacement control, and identifying the motor control type selected by the partition to determine a calibration control area.
By matching the partition control characteristics with the motor control types, the motor driving device realizes the differential motor driving of the motion control partition, adapts the motors with different powers, ensures that good control effects are obtained in a rapid motion interval and a precise positioning interval, meets diversified control requirements, improves the processing quality of the silicon wafer, and ensures the processing efficiency of the silicon wafer.
And extracting motor control parameters of the calibration control area, performing positioning deviation calculation based on the motor control parameters, and performing deviation calibration on the bearing movement.
Further, the method specifically comprises the following steps:
acquiring current motion coordinates;
according to the motor control parameters and the current motion coordinates, performing motion trail simulation in a time sequence to obtain operation simulation data;
acquiring control parameters of a processing table, performing control operation simulation, and determining processing simulation data;
and aligning the operation simulation data with the processing simulation data in a time sequence, determining a cross deviation amount, wherein the cross deviation amount is a positioning deviation, and performing motor control parameter calibration based on the cross deviation amount so that the cross point deviation amount of the operation simulation data and the processing simulation data is 0.
In a preferred embodiment, the calibration control region is a motion control region for determining the need to use low-power precision motor control, and the motor control parameters include parameters such as driving voltage, rotating speed and the like of the motor.
In the motion process of a certain calibration control area, the bearing table continuously collects position data of the bearing table in the motion process through the motion sensor, a time sequence of the position data is recorded, and motion track coordinate information of the bearing table in a time dimension is obtained, wherein the motion coordinate recorded in the latest time is the current motion coordinate. And simultaneously, reading motor control parameters of the calibration control area. Then, the current motion coordinates and motor control parameters simulate continuous tracks and motion states in the motion execution process, and operation simulation data are generated. Specifically, the motor control parameters comprise information such as rotation speed, acceleration, driving force and the like, and the motion speed and acceleration curve output by the motor are determined; the current motion coordinate gives a starting position state; according to the speed curve output by the motor, starting from the current motion coordinate, obtaining the acceleration components of different time points according to the acceleration curve; then, vector synthesis is carried out on the velocity component and the acceleration component, and the motion displacement increment of different time points is calculated; and accumulating the displacement increment of each time point, simulating the whole motion trail of the calibration control area from the moment corresponding to the current motion coordinate to the moment corresponding to the current motion coordinate on the basis of the current motion coordinate, and recording the displacement coordinates at different moments to obtain time sequence operation simulation data. Meanwhile, control parameters of the processing table are acquired, including indexes such as positioning accuracy, driving voltage, maximum speed and the like. Setting a micro displacement increment of a processing table according to the positioning precision range, and simulating a precise positioning process; setting movement speeds in different time periods according to the driving voltage and the speed parameters, and simulating a movement process; and (3) obtaining the processing procedures of the processing table in different time periods through time segment division, and integrating the processing procedures of each time period according to time sequence to obtain the processing simulation data.
And then, carrying out time sequence alignment on the operation simulation data and the processing simulation data, searching a cross matching point on a time axis, and calculating coordinate deviation of the silicon chip in the operation simulation data and the processing simulation data on the cross matching point to obtain a cross deviation amount, namely, positioning deviation of the silicon chip in the positioning process. And then, taking the cross deviation amount as feedback, adjusting the motor control parameters, and performing simulation calculation again until the cross deviation amount of the simulation operation data and the processing data is reduced to 0, so as to realize closed loop calibration, thereby performing accurate motion control and zero deviation positioning.
Further, as shown in fig. 2, the embodiment of the present application further includes:
constructing a bearing vibration sensing module, wherein the bearing vibration sensing module comprises a plurality of patch sensors which are respectively arranged on a carrier surface of a bearing table, and carrying out targeted sensing monitoring on a silicon wafer on the bearing table to obtain vibration sensing data of the bearing vibration sensing module;
determining the sensing data characteristics corresponding to the silicon chip offset through the sensing test data;
generating vibration feedback information when the vibration sensing data meets the sensing data characteristics;
and when the vibration feedback information is received, generating vibration displacement calibration reminding information.
In a preferred embodiment, the load-bearing vibration sensing module is used for monitoring the vibration state of the load-bearing table in real time during the movement process. The module comprises a plurality of patch sensors which are small integrated circuit sensors manufactured by adopting MEMS (micro electro mechanical systems) technology, and can realize high-sensitivity vibration measurement. For carrying out comprehensive monitoring to the plummer, a plurality of patch sensors are tiled on the carrier plane of plummer, realize carrying out high-density vibration monitoring to every piece of silicon chip that sets up on the plummer. When the bearing table moves, the patch sensors monitor the vibration of each silicon wafer arranged on the bearing surface in a targeted manner and output vibration signals. And synthesizing vibration signals output by the patch sensors to obtain vibration sensing data describing the overall vibration state of the bearing table, and then judging whether the silicon wafer is subjected to position deviation on the bearing table or not. Before the method, a sensing test is carried out through a patch sensor, and when the silicon chip deflects to different degrees on the bearing table, the characteristic change of corresponding vibration sensing data is acquired, so that the sensing data characteristic corresponding to the silicon chip deflection is determined. For example, when the silicon wafer is offset by 1mm, the amplitude of vibration monitored by a certain sensor exhibits a change in a particular pattern.
In the operation process of the bearing table, after vibration sensing data are acquired, feature extraction is carried out on the vibration sensing data, and then the feature extraction is compared with the sensing data. When the monitored vibration sensing data meets the sensing data characteristics, the silicon wafer is proved to deviate, and vibration feedback information is generated. After the bearing positioning calibration system receives the vibration feedback information, the abnormal condition of the silicon wafer deflection is detected. In order to correct the offset, the vibration feedback information is packaged, and vibration displacement calibration reminding information is generated so as to perform corresponding calibration operation.
Further, the embodiment of the application further includes:
carrying out vibration uniformity analysis according to the vibration sensing data, and determining the vibration deviation synchronism of the object carrying surface;
when the vibration deviation synchronicity of the object carrying surfaces meets the requirement, extracting a vibration average value, analyzing and positioning the silicon wafer offset of the object carrying surfaces by utilizing the vibration average value according to the sensing test data, and determining the vibration offset value of each object carrying surface;
when the vibration deviation synchronicity of the object carrying surfaces does not meet the requirement, respectively analyzing and positioning the silicon wafer offset of the object carrying surfaces according to the sensing test data, and determining the vibration offset value of each object carrying surface;
and performing machining positioning calibration by using the vibration offset value, and adjusting control parameters of the machining treatment table based on the position after positioning calibration.
In a preferred embodiment, after the vibration displacement calibration reminding information is obtained, first, vibration sensing data, such as vibration frequency, vibration amplitude and the like, on each object carrying surface are compared to determine whether obvious deviation exists among the vibration parameters of each object carrying surface. If the deviation is smaller, the vibration among the object carrying surfaces is coordinated and synchronous, and the vibration deviation of the object carrying surfaces is judged to be good in synchronism; if the large deviation exists, the synchronization of the vibration deviation of the object plane is judged to be poor. And determining the vibration deviation synchronism of the object plane by performing vibration uniformity analysis.
When the determined vibration deviation synchronicity of the object-carrying surfaces meets the requirement, the vibration states of the object-carrying surfaces are proved to be more coordinated, and the average value of the vibration data of the object-carrying surfaces is extracted at the moment to serve as the overall vibration average value. The vibration mean value is a comprehensive parameter obtained by averaging vibration parameters of each object plane, such as frequency, amplitude and the like. After the vibration mean value is obtained, the vibration mean value is matched with the sensing data characteristic corresponding to the vibration mean value according to the sensing data characteristic corresponding to the various silicon wafer deflection conditions which are determined in advance through a sensor test, the sensing data characteristic corresponding to the vibration mean value is obtained, and then the deflection corresponding to the sensing data characteristic is obtained and is used as the vibration deflection value of each object carrying plane.
When the determined vibration deviation synchronicity of the object carrying surfaces does not meet the requirement, the vibration states of the object carrying surfaces are obviously different. At this time, the whole vibration average value cannot be directly adopted, the vibration sensing data and the sensing data characteristics on each carrier surface are required to be respectively matched, and then the corresponding offset is acquired, so that the vibration offset value of each carrier surface is judged.
And then, according to the determined vibration offset value of each carrier surface, obtaining the actual deviation position of the silicon wafer, correcting the position of the silicon wafer on the carrier based on the actual deviation position, and realizing the calibration of positioning. After the positioning calibration of the silicon chip on the bearing platform is finished, the control parameters of the processing platform are correspondingly adjusted due to the fact that the position of the silicon chip is changed, so that the processing accuracy is maintained. For example, according to the new position information, the motion track, the positioning parameters and the like of the processing table are recalculated and set, so that the accurate processing control for the new position is realized, and the closed-loop calibration and the control parameter correction are realized, thereby ensuring the processing quality.
Further, the embodiment of the application further includes:
constructing a twin network through training sample data, wherein the twin network comprises a bearing platform state prediction sub-network and a processing platform working state prediction sub-network, and the bearing platform state prediction sub-network and the processing platform working state prediction sub-network are sharing weight networks;
the method comprises the steps that a sensor is arranged to monitor the motion state of a bearing table, wherein the motion state comprises motion speed and vibration sensing data;
constructing a processing table sensing monitoring module to perform working state positioning monitoring on the processing table to obtain processing table positioning monitoring data;
and respectively inputting the motion state monitoring data of the bearing table and the positioning monitoring data of the processing table into the state prediction sub-network of the bearing table and the working state prediction sub-network of the processing table in the twin network, positioning the motion state of the bearing table, positioning the processing position state of the processing table, and outputting the coincidence degree of the positioning of the position states of the bearing table and the processing table for evaluating whether deviation occurs.
In a preferred embodiment, first, sample data of the carrier and the processing station in various operating states, including various sensor readings, state parameters, etc., are collected, and these sample data are labeled for the corresponding operating states. Secondly, respectively training a bearing platform state prediction sub-network and a processing platform working state prediction sub-network by using the sample data to construct a twin network. In the training process, network parameters are set so that two sub-networks share the same set of network weights, namely, part or all network layers in the two networks adopt a weight sharing structure so as to enhance the internal association between the sub-networks. Then, the state prediction function for the bearing platform and the processing platform is obtained through training and optimizing the network weight, and the sub-networks have collaborative association prediction capability through sharing the weight. The training-completed twin network comprises two sub-networks with highly correlated state prediction, and can simultaneously predict the working states of the bearing platform and the processing platform.
Then, in the actual running process, a sensor is arranged on the bearing table to monitor the motion state of the bearing table, and data such as the motion speed, vibration sensing data and the like are obtained to reflect the real-time state of the bearing table. Meanwhile, sensors, such as an image sensor, a distance sensor, a pressure sensor and the like, are arranged at key parts of the processing table and used for monitoring the working state of the processing table; and a hardware circuit module for constructing processing signals is used for amplifying, filtering, digitally converting and the like signals acquired by the sensors to obtain digital state parameter signals, so that the construction of the sensor monitoring module of the processing platform is realized. Then, the information such as the working displacement, the positioning accuracy, the micro displacement of the processing part and the like of the processing table is monitored by the processing table sensing and monitoring module, and the positioning and monitoring data of the processing table is obtained.
And then, inputting the acquired motion state monitoring data of the bearing platform into a bearing platform state prediction sub-network in the trained twin network, and simultaneously inputting the acquired processing platform positioning monitoring data into a processing platform working state prediction sub-network. The twin network predicts and positions the two real-time states, outputs the matching degree of the state positioning of the two states, evaluates whether the position of the bearing platform and the processing platform deviates from the position of the bearing platform and the processing platform in the normal running state, and provides a basis for the calibration of the bearing positioning of the silicon chip.
In summary, the method for calibrating the bearing and positioning of the silicon wafer provided by the embodiment of the application has the following technical effects:
and acquiring initial position information of silicon chip placement of the bearing platform, position information of the processing platform and carrier distribution information, and determining a bearing motion coordinate track to obtain basic data required by determining the bearing motion track. And setting a positioning target based on the initial position information, the processing table position information and the object carrying distribution information, and determining the expected position of positioning. And dividing the bearing motion coordinate track by utilizing the distribution of the positioning targets in the bearing motion coordinate track, determining a motion control partition, and dividing a control area according to different precision requirements. Performing control parameter characteristic analysis by utilizing the motion control subareas, and determining control characteristics of each subarea; and carrying out motor control type identification on the motion control subareas based on the matching execution of the control characteristics of each subarea, and determining a motor control area and a calibration control area, wherein the motor control area is high-power motor control, the calibration control area is low-power motor control, and different power motors are adopted for control. And extracting motor control parameters of the calibration control area, performing positioning deviation calculation based on the motor control parameters, performing deviation calibration on bearing movement, and realizing accurate positioning, thereby improving the technical effect of silicon wafer processing quality.
Example two
Based on the same inventive concept as the silicon wafer bearing and positioning calibration method in the foregoing embodiment, as shown in fig. 3, an embodiment of the present application provides a silicon wafer bearing and positioning calibration system, which includes:
the coordinate track determining unit 11 is used for acquiring initial position information of silicon chip placement of the bearing platform, position information of the processing platform and carrier distribution information and determining a bearing motion coordinate track, wherein the bearing motion coordinate track at least comprises X-direction motion and Y-direction motion;
a positioning target setting unit 12 for setting a positioning target based on the placement beginner position information, the processing table position information, and the carrier distribution information;
a coordinate track dividing unit 13, configured to divide the carrier motion coordinate track by using the distribution of the positioning target in the carrier motion coordinate track, and determine a motion control partition;
a parameter characteristic analysis unit 14, configured to perform control parameter characteristic analysis by using the motion control partition, and determine each partition control characteristic;
a control area determining unit 15, configured to perform motor control type identification on a motion control partition based on the matching of the partition control features, determine a motor control area and a calibration control area, where the motor control area is high-power motor control, and the calibration control area is low-power motor control;
and the bearing deviation calibration unit 16 is used for extracting motor control parameters of the calibration control area, performing positioning deviation calculation based on the motor control parameters, and performing deviation calibration on the bearing movement.
Further, the positioning target setting unit 12 includes the following execution steps:
based on the carrier distribution information, collecting positioning features for placing initial positions;
based on the carrier distribution information, collecting positioning characteristics of a processing table;
determining initial positioning and subsequent processing positioning according to the positioning characteristics of the initial positioning and the positioning characteristics of the processing table;
setting the positioning target according to the initial positioning and the subsequent processing positioning of the operation.
Further, the load deviation calibration unit 16 includes the following steps:
acquiring current motion coordinates;
according to the motor control parameters and the current motion coordinates, performing motion trail simulation in a time sequence to obtain operation simulation data;
acquiring control parameters of a processing table, performing control operation simulation, and determining processing simulation data;
and aligning the operation simulation data with the processing simulation data in a time sequence, determining a cross deviation amount, wherein the cross deviation amount is a positioning deviation, and performing motor control parameter calibration based on the cross deviation amount so that the cross point deviation amount of the operation simulation data and the processing simulation data is 0.
Further, the embodiment of the application further comprises a displacement calibration reminding unit, and the unit comprises the following execution steps:
constructing a bearing vibration sensing module, wherein the bearing vibration sensing module comprises a plurality of patch sensors which are respectively arranged on a carrier surface of a bearing table, and carrying out targeted sensing monitoring on a silicon wafer on the bearing table to obtain vibration sensing data of the bearing vibration sensing module;
determining the sensing data characteristics corresponding to the silicon chip offset through the sensing test data;
generating vibration feedback information when the vibration sensing data meets the sensing data characteristics;
and when the vibration feedback information is received, generating vibration displacement calibration reminding information.
Further, the displacement calibration reminding unit further comprises the following execution steps:
carrying out vibration uniformity analysis according to the vibration sensing data, and determining the vibration deviation synchronism of the object carrying surface;
when the vibration deviation synchronicity of the object carrying surfaces meets the requirement, extracting a vibration average value, analyzing and positioning the silicon wafer offset of the object carrying surfaces by utilizing the vibration average value according to the sensing test data, and determining the vibration offset value of each object carrying surface;
when the vibration deviation synchronicity of the object carrying surfaces does not meet the requirement, respectively analyzing and positioning the silicon wafer offset of the object carrying surfaces according to the sensing test data, and determining the vibration offset value of each object carrying surface;
and performing machining positioning calibration by using the vibration offset value, and adjusting control parameters of the machining treatment table based on the position after positioning calibration.
Further, the parameter characteristic analysis unit 14 includes the following execution steps:
determining length information and processing characteristics of each partition according to the motion control partition;
according to the processing characteristics of each partition, carrying out motion speed characteristic analysis, determining speed characteristics, and determining control time characteristics by combining the length information;
and carrying out positioning demand analysis according to the processing characteristics, and determining the positioning demand characteristics.
Further, the embodiment of the application further includes a deviation evaluation unit, which includes the following execution steps:
constructing a twin network through training sample data, wherein the twin network comprises a bearing platform state prediction sub-network and a processing platform working state prediction sub-network, and the bearing platform state prediction sub-network and the processing platform working state prediction sub-network are sharing weight networks;
the method comprises the steps that a sensor is arranged to monitor the motion state of a bearing table, wherein the motion state comprises motion speed and vibration sensing data;
constructing a processing table sensing monitoring module to perform working state positioning monitoring on the processing table to obtain processing table positioning monitoring data;
and respectively inputting the motion state monitoring data of the bearing table and the positioning monitoring data of the processing table into the state prediction sub-network of the bearing table and the working state prediction sub-network of the processing table in the twin network, positioning the motion state of the bearing table, positioning the processing position state of the processing table, and outputting the coincidence degree of the positioning of the position states of the bearing table and the processing table for evaluating whether deviation occurs.
Any of the steps of the methods described above may be stored as computer instructions or programs in a non-limiting computer memory and may be called by a non-limiting computer processor to identify any of the methods to implement embodiments of the present application, without unnecessary limitations.
Further, the first or second element may not only represent a sequential relationship, but may also represent a particular concept, and/or may be selected individually or in whole among a plurality of elements. It will be apparent to those skilled in the art that various modifications and variations can be made in the present application without departing from the scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the present application and the equivalents thereof, the present application is intended to cover such modifications and variations.
Claims (8)
1. The method for calibrating the bearing and positioning of the silicon wafer is characterized by comprising the following steps of:
acquiring initial position information of silicon chip placement of a bearing platform, position information of a processing platform and carrier distribution information, and determining a bearing motion coordinate track, wherein the bearing motion coordinate track at least comprises X-direction motion and Y-direction motion;
setting a positioning target based on the initial position information, the processing table position information and the object distribution information;
dividing the bearing motion coordinate track by using the distribution of the positioning targets in the bearing motion coordinate track, and determining a motion control partition;
performing control parameter characteristic analysis by utilizing the motion control subareas, and determining control characteristics of each subarea;
performing motor control type identification on the motion control subareas based on the matched execution motor control types of the subareas, and determining a motor control area and a calibration control area, wherein the motor control area is high-power motor control, and the calibration control area is low-power motor control;
and extracting motor control parameters of the calibration control area, performing positioning deviation calculation based on the motor control parameters, and performing deviation calibration on the bearing movement.
2. The method of claim 1, wherein setting a positioning target based on the placement beginner position information, processing station position information, and carrier distribution information comprises:
based on the carrier distribution information, collecting positioning features for placing initial positions;
based on the carrier distribution information, collecting positioning characteristics of a processing table;
determining initial positioning and subsequent processing positioning according to the positioning characteristics of the initial positioning and the positioning characteristics of the processing table;
setting the positioning target according to the initial positioning and the subsequent processing positioning of the operation.
3. The method of claim 1, wherein extracting motor control parameters of the calibration control region, performing a position offset calculation based on the motor control parameters, performing offset calibration on the bearing motion, comprises:
acquiring current motion coordinates;
according to the motor control parameters and the current motion coordinates, performing motion trail simulation in a time sequence to obtain operation simulation data;
acquiring control parameters of a processing table, performing control operation simulation, and determining processing simulation data;
and aligning the operation simulation data with the processing simulation data in a time sequence, determining a cross deviation amount, wherein the cross deviation amount is a positioning deviation, and performing motor control parameter calibration based on the cross deviation amount so that the cross point deviation amount of the operation simulation data and the processing simulation data is 0.
4. A method as recited in claim 3, further comprising:
constructing a bearing vibration sensing module, wherein the bearing vibration sensing module comprises a plurality of patch sensors which are respectively arranged on a carrier surface of a bearing table, and carrying out targeted sensing monitoring on a silicon wafer on the bearing table to obtain vibration sensing data of the bearing vibration sensing module;
determining the sensing data characteristics corresponding to the silicon chip offset through the sensing test data;
generating vibration feedback information when the vibration sensing data meets the sensing data characteristics;
and when the vibration feedback information is received, generating vibration displacement calibration reminding information.
5. The method of claim 4, wherein generating the vibration displacement calibration alert information, then comprises:
carrying out vibration uniformity analysis according to the vibration sensing data, and determining the vibration deviation synchronism of the object carrying surface;
when the vibration deviation synchronicity of the object carrying surfaces meets the requirement, extracting a vibration average value, analyzing and positioning the silicon wafer offset of the object carrying surfaces by utilizing the vibration average value according to the sensing test data, and determining the vibration offset value of each object carrying surface;
when the vibration deviation synchronicity of the object carrying surfaces does not meet the requirement, respectively analyzing and positioning the silicon wafer offset of the object carrying surfaces according to the sensing test data, and determining the vibration offset value of each object carrying surface;
and performing machining positioning calibration by using the vibration offset value, and adjusting control parameters of the machining treatment table based on the position after positioning calibration.
6. The method of claim 1, wherein determining each zone control feature using the motion control zone for control parameter feature analysis comprises:
determining length information and processing characteristics of each partition according to the motion control partition;
according to the processing characteristics of each partition, carrying out motion speed characteristic analysis, determining speed characteristics, and determining control time characteristics by combining the length information;
and carrying out positioning demand analysis according to the processing characteristics, and determining the positioning demand characteristics.
7. The method as recited in claim 4, further comprising:
constructing a twin network through training sample data, wherein the twin network comprises a bearing platform state prediction sub-network and a processing platform working state prediction sub-network, and the bearing platform state prediction sub-network and the processing platform working state prediction sub-network are sharing weight networks;
the method comprises the steps that a sensor is arranged to monitor the motion state of a bearing table, wherein the motion state comprises motion speed and vibration sensing data;
constructing a processing table sensing monitoring module to perform working state positioning monitoring on the processing table to obtain processing table positioning monitoring data;
and respectively inputting the motion state monitoring data of the bearing table and the positioning monitoring data of the processing table into the state prediction sub-network of the bearing table and the working state prediction sub-network of the processing table in the twin network, positioning the motion state of the bearing table, positioning the processing position state of the processing table, and outputting the coincidence degree of the positioning of the position states of the bearing table and the processing table for evaluating whether deviation occurs.
8. A silicon wafer carrier positioning calibration system for implementing a silicon wafer carrier positioning calibration method as defined in any one of claims 1-7, said system comprising:
the coordinate track determining unit is used for acquiring initial position information of silicon chip placement of the bearing platform, position information of the processing platform and carrier distribution information and determining a bearing motion coordinate track, wherein the bearing motion coordinate track at least comprises X-direction motion and Y-direction motion;
the positioning target setting unit is used for setting a positioning target based on the initial position information, the position information of the processing table and the load distribution information;
the coordinate track dividing unit is used for dividing the bearing motion coordinate track by utilizing the distribution of the positioning target in the bearing motion coordinate track and determining a motion control partition;
the parameter characteristic analysis unit is used for carrying out control parameter characteristic analysis by utilizing the motion control subareas and determining control characteristics of each subarea;
the control area determining unit is used for performing motor control type identification on the motion control subareas based on the subarea control characteristic matching, and determining a motor control area and a calibration control area, wherein the motor control area is high-power motor control, and the calibration control area is low-power motor control;
and the bearing deviation calibration unit is used for extracting motor control parameters of the calibration control area, performing positioning deviation calculation based on the motor control parameters, and performing deviation calibration on bearing movement.
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| CN115458431A (en) * | 2022-10-18 | 2022-12-09 | 深圳市中图仪器股份有限公司 | Wafer measuring system |
| CN116021304A (en) * | 2022-12-19 | 2023-04-28 | 江门职业技术学院 | Positioning system, positioning method, electronic device, and storage medium |
| CN116572236A (en) * | 2023-04-26 | 2023-08-11 | 深圳众为兴技术股份有限公司 | Wafer dynamic deviation correcting method and device and computer equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115458431A (en) * | 2022-10-18 | 2022-12-09 | 深圳市中图仪器股份有限公司 | Wafer measuring system |
| CN116021304A (en) * | 2022-12-19 | 2023-04-28 | 江门职业技术学院 | Positioning system, positioning method, electronic device, and storage medium |
| CN116572236A (en) * | 2023-04-26 | 2023-08-11 | 深圳众为兴技术股份有限公司 | Wafer dynamic deviation correcting method and device and computer equipment |
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