CN117147590A - Image acquisition method, device, equipment and storage medium - Google Patents
Image acquisition method, device, equipment and storage medium Download PDFInfo
- Publication number
- CN117147590A CN117147590A CN202310875583.1A CN202310875583A CN117147590A CN 117147590 A CN117147590 A CN 117147590A CN 202310875583 A CN202310875583 A CN 202310875583A CN 117147590 A CN117147590 A CN 117147590A
- Authority
- CN
- China
- Prior art keywords
- imaging
- assembly
- radiation
- control node
- radiation imaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000003384 imaging method Methods 0.000 claims abstract description 156
- 230000005855 radiation Effects 0.000 claims abstract description 127
- 230000033001 locomotion Effects 0.000 claims abstract description 70
- 238000001514 detection method Methods 0.000 claims abstract description 57
- 238000012545 processing Methods 0.000 claims description 23
- 238000004590 computer program Methods 0.000 claims description 6
- 238000003672 processing method Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 13
- 238000007689 inspection Methods 0.000 description 11
- 239000011093 chipboard Substances 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000000644 propagated effect Effects 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 241000579895 Chlorostilbon Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000013170 computed tomography imaging Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010976 emerald Substances 0.000 description 1
- 229910052876 emerald Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- ZLIBICFPKPWGIZ-UHFFFAOYSA-N pyrimethanil Chemical compound CC1=CC(C)=NC(NC=2C=CC=CC=2)=N1 ZLIBICFPKPWGIZ-UHFFFAOYSA-N 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
- G01N23/046—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using tomography, e.g. computed tomography [CT]
Landscapes
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Pulmonology (AREA)
- Radiology & Medical Imaging (AREA)
- Theoretical Computer Science (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Abstract
The application discloses an image acquisition method, an image acquisition device, image acquisition equipment and a storage medium. The method is implemented in a radiation imaging apparatus, comprising: dividing a region to be examined of an object to be imaged into a plurality of imaging regions, wherein each imaging region corresponds to a control node, and the control node limits positions of a ray generation assembly and a detection assembly of the radiation imaging device when the radiation imaging device performs radiation imaging on the imaging region; determining one or more target imaging regions associated with the detection region from the plurality of imaging regions, and corresponding target control nodes; synchronously controlling the ray generation assembly and the detection assembly to move with the same motion parameters so as to traverse the position defined by the target control node, and performing radiation imaging on the object to be imaged when the ray generation assembly and the detection assembly reach the position defined by the target control node; the motion parameters indicate at least a direction of motion and a trajectory of motion.
Description
Technical Field
The present application relates to synchronous motion control, and more particularly to a method, apparatus, device and storage medium for controlling synchronous motion of multiple components in a radiation imaging apparatus or system.
Background
With the continuous development of semiconductor technology, semiconductor devices are increasingly integrated, semiconductor chips are becoming smaller in size, traditional manual visual inspection cannot meet the requirements of detection quality and detection efficiency, and defect detection equipment based on machine vision is generated.
One current machine vision inspection method is based on the use of radiation imaging (e.g., CT imaging). For example, imaging/reconstruction of a scanned image of a sample is performed using an X-ray tomosynthesis method after scanning. In this method, any two of the radiation generator, the object under examination, and the radiation imager must be moved in an arc in synchronization to perform imaging simultaneously. This movement requires the same amount of movement and is complex to control, and the reconstruction may take a significant amount of time.
Disclosure of Invention
The technical problem to be solved by the embodiment of the application is how to realize simple and effective motion control of the radiation imaging device and acquire higher-quality images.
In order to solve the problems, the application discloses an image acquisition method, an image acquisition device and a storage medium.
According to a first aspect of the present application, there is provided an image acquisition method implemented in a radiation imaging apparatus, comprising: dividing a region to be examined of an object to be imaged into a plurality of imaging regions, wherein each imaging region corresponds to a control node, and the control node limits positions of a ray generation assembly and a detection assembly of the radiation imaging device when the radiation imaging device performs radiation imaging on the imaging region; determining one or more target imaging regions associated with the detection region from the plurality of imaging regions, and corresponding target control nodes; synchronously controlling the ray generation assembly and the detection assembly to move with the same motion parameters so as to traverse the position defined by the target control node, and performing radiation imaging on the object to be imaged when the ray generation assembly and the detection assembly reach the position defined by the target control node; wherein the motion parameters at least indicate a motion direction and a motion trajectory.
According to some embodiments of the application, the division of the imaging area is determined based on a field of view size of the radiation imaging apparatus.
According to some embodiments of the application, the object to be imaged comprises a multi-layer printed circuit board carrying integrated circuits, the area to be inspected being located in a horizontal cross-section of the multi-layer printed circuit board.
According to some embodiments of the application, the plurality of positions defined by the plurality of control nodes corresponding to the radiation generating assembly are in a first plane, the plurality of positions corresponding to the position of the detection assembly are in a second plane, the first plane and the second plane are parallel to each other, and the first plane and the second plane are parallel to the horizontal cross section.
According to some embodiments of the application, a line between the positions of the radiation generating assembly and the detecting assembly defined by the same control node is perpendicular to the horizontal cross section.
According to some embodiments of the application, the movement of the radiation generating assembly and the detecting assembly between positions is a linear movement.
According to some embodiments of the application, the shortest distance between the target control defined locations is determined based on the field of view size and resolution of the radiation imaging apparatus.
According to a second aspect of the present application there is provided an image acquisition apparatus for controlling movement of a component of a radiation imaging apparatus, comprising: the dividing module is configured to divide a region to be examined of an object to be imaged into a plurality of imaging regions, wherein each imaging region corresponds to a control node, and the control node limits positions of a ray generation assembly and a detection assembly of the radiation imaging device when the radiation imaging device performs radiation imaging on the imaging region; a determining module configured to determine one or more target imaging regions associated with the detection region from the plurality of imaging regions, and a corresponding target control node; the control module is configured to synchronously control the ray generation assembly and the detection assembly to move with the same motion parameters so as to traverse the position defined by the target control node, and perform radiation imaging on the object to be imaged when the ray generation assembly and the detection assembly reach the position defined by the target control node; wherein the motion parameters at least indicate a motion direction and a motion trajectory.
According to a third aspect of the present application, a processing apparatus is provided. The processing device comprises a memory, a processor and a computer program stored on the memory and executable on the processor, which when executed by the processor, implements the steps of the method as described above.
According to a fourth aspect of the present application, a computer readable storage medium is provided. The storage medium has stored thereon a computer program which, when executed by a processor, implements the steps of the method as described above.
The motion control method of the radiation imaging device can control the components of the radiation imaging device to synchronously perform linear motion in a short time and simultaneously perform radiation imaging on an object to be imaged. The radiation image can be reused. The method is easy to realize, simple and effective in control, and the finally obtained image is excellent in quality.
Drawings
The application will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. The embodiments are not limiting, in which like numerals represent like structures, wherein:
FIG. 1 is an exemplary flow chart of an image acquisition method according to some embodiments of the application;
FIG. 2 is an exemplary schematic diagram of a radiation imaging apparatus shown in accordance with some embodiments of the application;
FIG. 3 is an exemplary schematic diagram of an imaging region and a detection region shown in accordance with some embodiments of the present application;
FIG. 4 is an exemplary schematic diagram of a target control node shown in accordance with some embodiments of the application;
FIG. 5 is a schematic diagram illustrating exemplary motions for a radiation imaging apparatus according to some embodiments of the application;
FIG. 6 is an exemplary block diagram of a processing system for image acquisition, shown in accordance with some embodiments of the present application;
FIG. 7 is an exemplary functional block diagram of a processing system according to some embodiments of the present application;
fig. 8 is an exemplary radiation imaging diagram shown in accordance with some embodiments of the present application.
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
It will be understood that when an element is referred to as being "mounted" to another element, it can be directly mounted to the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" and/or "as used herein includes any and all combinations of one or more of the associated listed items.
Some preferred embodiments of the present application are described below with reference to the accompanying drawings. It should be noted that the following description is for illustrative purposes and is not intended to limit the scope of the present application.
FIG. 1 is an exemplary flow chart of an image acquisition method according to some embodiments of the application. In some embodiments, the image acquisition method 100 may be performed by the image acquisition system 600 for implementing motion control of various components of the radiation imaging apparatus and controlling the radiation imaging apparatus to radioactively image an object to be imaged. For example, the image acquisition method 100 may be stored in a storage device (e.g., a self-contained memory unit or an external memory device of the image acquisition system 600) in the form of a program or instructions that, when executed, may implement the image acquisition method 100. As shown in fig. 1, the image acquisition method 100 may include the following steps.
In step 110, the region to be examined of the object to be imaged is divided into a plurality of imaging regions.
In some embodiments, the object to be imaged may comprise a multi-layer printed circuit board, such as a chip board, or the like, carrying integrated circuits. It is known that machine vision inspection of multi-layered chip boards requires the determination of the arrangement and connection of the components of each layer. The region to be examined may then lie on a certain examination plane of the object to be imaged, such as a horizontal cross section. The plane may be parallel or coincident with the plate surface. The size of the area to be checked may be the same as the size of the whole board surface, or may be a part of the board surface.
The radiation imaging apparatus for machine vision detection of an object to be imaged may be an X-ray imaging apparatus. Referring to fig. 2, fig. 2 is an exemplary schematic diagram of a radiation imaging assembly according to some embodiments of the application. As shown in fig. 2, radiation imaging assembly 200 may include at least a radiation generating assembly 210 and a detecting assembly 220. The radiation generating component 210 may be a component for generating radiation (e.g., X-rays), such as a high voltage accelerator, an electron induction accelerator, a linac, a very rotary accelerator, or the like. The radiation beam generated by the radiation generating assembly 210 passes through the object 230 to be imaged and is absorbed/attenuated before being received by the detection assembly 220. The detection component 220 may convert the received radiation energy into a computer-processable signal that is transmitted to a processing component (not shown in fig. 2) of the radiation detection device 200 for image reconstruction. By way of example, the detection assembly 220 may include a gas detector, a scintillation detector, a semiconductor detector, and the like. Taking a scintillation detector as an example, a scintillation crystal and a photoelectric conversion device coupled to each other may be included. Scintillation crystals (e.g., BGO, PWO, LYSO: ce, GAGG: ce, naI: TI, csI: TI, laBr3: ce, baF2, etc.) convert detected radiation rays (e.g., X-rays) into visible light signals, and photoelectric conversion devices (e.g., photomultiplier tubes PMT, silicon photomultiplier tubes SiPM, etc.) are used to convert the visible light signals into electrical signals that are converted to digital signals output via analog/digital converters. In some embodiments, the structure of the probe assembly 220 may be a plate type. That is, the detection assembly 220 may be a flat panel detector.
In some embodiments, the division of the imaging region may be determined based on a field of view size of the radiation imaging apparatus. The imaging region may be exemplarily divided according to a form of n×n of the field size. n may be an integer greater than or equal to 2. That is, the range of the n×n imaging regions is the same as the field of view size of the radiation imaging apparatus. Referring to fig. 3, fig. 3 is an exemplary schematic diagram of an imaging region and a detection region shown in accordance with some embodiments of the present application. As shown in fig. 3, a rectangular area of the maximum range may represent the region to be examined, and a plurality of smaller rectangular areas divided by a plurality of horizontal and vertical grid lines may be the imaging region. In the present application, the imaging region may also be referred to as RA. In this example, the imaging region may be 3×3 divided according to the field size. The sketched rectangle in fig. 3 may represent the field of view size of the radiation imaging apparatus, comprising 9 RA.
In some embodiments, each imaging region may correspond to a control node. The control node may define where a radiation generating component and a detection component of the radiation imaging apparatus are respectively located when the radiation imaging apparatus performs radiation imaging on the imaging region. The plurality of positions defined by the plurality of control nodes corresponding to the radiation generating assembly may lie in a first plane and the plurality of positions corresponding to the position of the detection assembly may lie in a second plane. The first plane and the second plane may be parallel to each other, and the first plane and the second plane may be parallel to the horizontal cross section. Referring back to fig. 2, the positions corresponding to the radiation generating assembly 210 or the detecting assembly 220 may be at both sides of the assembly 230 to be imaged. For example, the corresponding location of the radiation generating assembly 210 may be on a first plane that is located below the object 230 to be imaged. The corresponding position of the detection assembly 220 may be on a second plane above the object 230 to be imaged. Both planes of motion may be parallel to a horizontal cross-section of the object 230 to be imaged (e.g., a chip board).
In some embodiments, a line between the positions of the radiation generating assembly and the detecting assembly defined by the same control node may be perpendicular to the horizontal cross section. According to the division mode of the imaging areas, when n is an odd number, the connecting line can pass through the geometric center point of the corresponding imaging area. When n is even, the line may pass through one of the four vertices (or upper right vertex) of the corresponding imaging region.
Step 120, determining one or more target imaging areas associated with the detection area from the plurality of imaging areas, and corresponding target control nodes.
In some embodiments, the detection region may be a region where a specific examination is desired. For example, a resistor is stacked above and below a certain area in a multi-layer chip board, and it is necessary to check whether each resistor is connected correctly. This region may be referred to as a detection region. The detection area may be predetermined. For example, this area becomes a critical inspection target during the fabrication of the chip board or is delineated by the inspection operator prior to radiation imaging of the object to be imaged.
In some embodiments, the target imaging region may be an imaging region overlapping the detection region. Referring to fig. 3, RA1-RA5 are six imaging regions. The detection areas are IA0 and IA1. Wherein, IA0 and RA1 overlap each other, and IA1 and RA2 and RA5 overlap each other. Then the target imaging areas may be RA0, RA1, RA2 and RA5.
In some embodiments, the target control node may include a control node corresponding to the target imaging region and a control node corresponding to an imaging region adjacent to the target imaging region. Referring to fig. 4, fig. 4 is an exemplary schematic diagram of a target control node shown in accordance with some embodiments of the present application. As shown in fig. 4, the 8 imaging areas adjacent to each of RA0, RA1, RA2, and RA5, and the 18 control nodes corresponding to the 18 imaging areas after the repetition are removed may be target control nodes. The control node corresponding to the imaging area where the gray dot is located in fig. 4 may be the target control node. The grey dots may also directly represent the positions defined by the target control node (when the object to be imaged is viewed in top view in fig. 2). In the example, when the imaging region is divided in a form of 3×3 according to the field size, the gray dots are located at the geometric center of the imaging region. The connection between the positions of the radiation generating component and the detecting component defined by the corresponding control node will pass through the grey dots.
And 130, synchronously controlling the radiation generating component and the detecting component to move with the same motion parameters so as to traverse the position defined by the target control node, and performing radiation imaging on the object to be imaged when the radiation generating component and the detecting component reach the position defined by the target control node.
In the present application, "synchronization" may mean both simultaneously and simultaneously. That is, the "synchronously controlled" movement may be a simultaneous control of the radiation generating assembly and the detecting assembly to start movement and to end movement. For example, the components start at the same time from respective corresponding locations defined by the same target control node and then arrive at the same time at respective corresponding locations defined by another target control node. In some embodiments, the motion parameters may indicate at least a direction of motion and a trajectory of motion. That is, the motion of the radiation generating assembly and the detecting assembly is consistent. The same movement direction and the same movement track.
In the present application, "traversal" may refer to the location at which the ray-generating component and the detection component will pass each of the target control nodes. The number of passes may be one or more, and the present application is not particularly limited. In some embodiments, the radiation generating assembly and the detection assembly may perform the movement at a position defined by the primary target control node. The passing position may be a feature point passing position of the component. For example, the feature point of the radiation generating assembly may be a radiation emitting point (e.g., a tube cathode) and the feature point of the detection assembly may be a geometric center of the flat panel detector.
In some embodiments, the trajectory of the radiation generating assembly and the detection assembly may be of various types. For example, it may be a broken line, an arc, an irregular curve, or the like. Alternatively or preferably, the displacement may be performed in a linear motion by the radiation generating assembly and the detection assembly. Referring to fig. 5, fig. 5 is an exemplary motion diagram for a radiation imaging apparatus, shown in accordance with some embodiments of the present application. In connection with fig. 4 and 5, the gray dots may represent the positions of components of the radiation imaging apparatus defined by the target control node, where the respective positions of the two components (the radiation generating component and the detecting component) coincide with each other in a top view. The two components start moving synchronously starting from the grey dot in the lower left corner and starting in the direction indicated by the arrow shown in fig. 5. The trajectory between two positions (grey dots) may be a straight line (e.g. a line connecting the two grey dots). After 17 more linear movements, the two assemblies can traverse these 18 positions.
In some embodiments, the shortest distance between the target control defined locations may be determined based on the field of view size and resolution of the radiation imaging apparatus. The shortest distance may be the distance between locations defined by two target control nodes that are adjacent. The target control nodes are contiguous, which may mean that their corresponding imaging regions have the same edges. Referring back to fig. 4, for example, the target control nodes corresponding to RA1 and RA2 are contiguous. In the example, the imaging region is obtained by dividing the field size into a form of 3×3. The target control node may also indicate where the component is located. In connection with fig. 5, the straight-line distance between the positions corresponding to the front and rear ends of the arrow may then be the shortest distance. A scaled relationship between the pixel size indicated by the resolution and the actual length is determined for a field of view length (when moving in the direction indicated by the vertical arrow in fig. 5) or width (when moving in the direction indicated by the horizontal arrow in fig. 5) of 1/3. Of course, when the imaging region is divided into 2×2, the field length or width of 1/2 is calculated. 4X 4 is 1/4. That is, the n partitions will be calculated using a field length or width of 1/n.
In some embodiments, the object to be imaged is radiation imaged when the radiation generating assembly and the detection assembly reach a position defined by the target control node. Referring back to fig. 5, that is, after moving according to the arrow in fig. 5, each gray dot (i.e., the position defined by the target control node) is reached, the radiation imaging apparatus will perform radiation imaging on the object to be imaged. It can be seen that the first position, when imaged, includes the target imaging region RA0. The first position, when imaged, also includes the target imaging region RA0. But RA0 is located differently in the resulting image. When travelling to position a, all positions related to the target area RA0 complete one imaging. At this time, image reconstruction may be performed based on the radiation images obtained by these imaging, completing an inspection image concerning RA0. When travelling to position B, all positions related to the target area RA1 have been imaged once. The 6 radiation images associated with RA0 can be used simultaneously for the reconstruction of the examination image of RA 1. When travelling to position C, all positions related to the target area RA2 have been imaged once. Some of the radiation images associated with RA0 and RA1 can be used simultaneously for reconstruction of the examination image of RA 2. When travelling to position D, all positions related to the target area RA5 have been imaged once. The 6 radiation images associated with RA0 and RA2 can be used simultaneously for reconstruction of the examination image of RA 2. That is, a radiation image obtained by radiation imaging at one location may be used for reconstruction of one or more examination images. The method achieves the effect of recycling and reduces imaging times.
The process 100 is briefly described below. The ray generation assembly and the detection assembly of the radiation imaging assembly are respectively positioned at two sides of the object to be imaged. Before starting the movement, the two are in a state of forward opposite. That is, the optical axis of the radiation beam emitted by the radiation generating assembly is perpendicular to the imaging plane of the object to be imaged. Subsequently, the radiation generating assembly and the detecting assembly are moved synchronously. The plane of motion is a plane parallel to the imaging plane. Each movement starts at the same time and arrives at the same time. The motion parameters of each motion are the same. That is, the movement directions are the same, the movement tracks are the same, and the movement speeds at any time are the same. After reaching each of the predetermined positions, the object to be imaged is radiation imaged. And obtaining a corresponding image, and then reconstructing the corresponding image to obtain a final inspection image.
Referring to fig. 8, fig. 8 is an exemplary radiation imaging image shown in accordance with some embodiments of the present application. As shown in fig. 8, (a) - (i) are images obtained by radiation imaging an object to be imaged (e.g., PCB board) at positions defined by 9 object control nodes. (j) Is the final inspection image obtained after reconstruction based on the 9 images. It can be known that the detection area of the inspection image is clearly displayed and has excellent quality.
The image acquisition method of the radiation imaging device can control the components of the radiation imaging device to perform linear motion in a short time and perform radiation imaging on an object to be imaged. The method is easy to realize, simple and effective in control, and the finally obtained image is excellent in quality.
FIG. 6 is an exemplary block diagram of a processing system for image acquisition, according to some embodiments of the application. The processing system may synchronize control of the movement of the components of the radiation imaging apparatus and perform radiation imaging of the object to be imaged. As shown in fig. 6, the image acquisition system 600 may include a partitioning module 610, a determining module 620, and a control module 630.
The dividing module 610 may implement dividing the region to be examined of the object to be imaged into a plurality of imaging regions as shown in step 110 above. The object to be imaged may comprise a multi-layer printed circuit board, such as a chip board or the like, carrying integrated circuits. The region to be examined may then lie on a certain examination plane of the object to be imaged, such as a horizontal cross section. The plane may be parallel or coincident with the plate surface. The size of the area to be checked may be the same as the size of the whole board surface, or may be a part of the board surface. The radiation imaging apparatus for machine vision inspection of an object to be imaged may be an X-ray imaging apparatus and may include at least a camera generation assembly and a detection assembly. The division of the imaging region may be determined based on a field of view size of the radiation imaging apparatus. The imaging region may be exemplarily divided according to a form of n×n of the field size. n may be an integer greater than or equal to 2. Each imaging region may correspond to a control node. The control node may define where a radiation generating component and a detection component of the radiation imaging apparatus are respectively located when the radiation imaging apparatus performs radiation imaging on the imaging region. The plurality of positions defined by the plurality of control nodes corresponding to the radiation generating assembly may lie in a first plane and the plurality of positions corresponding to the position of the detection assembly may lie in a second plane. The first plane and the second plane may be parallel to each other, and the first plane and the second plane may be parallel to the horizontal cross section. The line between the positions of the radiation generating assembly and the detecting assembly defined by the same control node may be perpendicular to the horizontal cross section.
The determination module 620 may implement the determination of one or more target imaging regions associated with the detection region from the plurality of imaging regions, and the corresponding target control nodes, as shown in step 120 above. The detection area may be an area where a specific examination is required. May be predetermined. For example, this area becomes a critical inspection target during the fabrication of the chip board or is delineated by the inspection operator prior to radiation imaging of the object to be imaged. The target imaging region may be an imaging region overlapping the detection region. The target control node may include a control node corresponding to the target imaging region and a control node corresponding to an imaging region adjacent to the target imaging region.
The control module 630 performs the simultaneous control of the movement of the radiation generating assembly and the detecting assembly with the same movement parameters as described in step 130 above to traverse the position defined by the target control node and to perform radiation imaging of the object to be imaged when the radiation generating assembly and the detecting assembly reach the position defined by the target control node. The motion parameters may indicate at least a direction of motion and a trajectory of motion. The control module 630 may control the radiation generating assembly and the detecting assembly to move in unison (including the same direction of movement, the same trajectory of movement, the same speed of movement, etc., while starting and stopping). The control module 630 may control the radiation generating assembly and the detecting assembly to complete the movement through a position defined by the primary target control node. The shortest distance between these locations may be determined based on the field of view size and resolution of the radiation imaging apparatus. When the radiation generating assembly and the detection assembly reach the position defined by the target control node, the control module 630 may control the radiation imaging apparatus to perform radiation imaging on the object to be imaged.
For further description of the above modules reference is made to the flow charts of the application and relevant parts thereof, e.g. fig. 1-5.
It should be appreciated that the system shown in fig. 6 and its modules may be implemented in a variety of ways. For example, in some embodiments, the system and its modules may be implemented in hardware, software, or a combination of software and hardware. Wherein the hardware portion may be implemented using dedicated logic; the software portions may then be stored in a memory and executed by a suitable instruction execution system, such as a microprocessor or special purpose design hardware. Those skilled in the art will appreciate that the methods and systems described above may be implemented using computer executable instructions and/or embodied in processor control code, such as provided on a carrier medium such as a magnetic disk, CD or DVD-ROM, a programmable memory such as read only memory (firmware), or a data carrier such as an optical or electronic signal carrier. The system of the present specification and its modules may be implemented not only with hardware circuits such as very large scale integrated circuits or gate arrays, semiconductors such as logic chips, transistors, etc., or programmable hardware devices such as field programmable gate arrays, programmable logic devices, etc., but also with software executed by various types of processors, for example, and with a combination of the above hardware circuits and software (e.g., firmware).
It should be noted that the above description of the modules is for convenience of description only and is not intended to limit the present description to the scope of the illustrated embodiments. It will be appreciated by those skilled in the art that, given the principles of the system, various modules may be combined arbitrarily or a subsystem may be constructed in connection with other modules without departing from such principles. For example, each module may share one memory module, or each module may have a respective memory module. Such variations are within the scope of the present description.
Fig. 7 is an exemplary block diagram of a processing device according to some embodiments of the application. Processing device 700 may include any of the components used to implement the systems described in embodiments of the present application. For example, the processing device 700 may be implemented in hardware, software programs, firmware, or a combination thereof. For example, processing device 700 may implement processing system 600. For convenience, only one processing device is depicted, but the computing functions described in implementing embodiments of the application may be implemented in a distributed manner by a similar set of platforms to distribute the processing load of the system.
In some embodiments, processing device 700 may include a processor 710, a memory 720, an input/output unit 730, and a communication port 740. In some embodiments, processor (e.g., CPU) 710 may execute program instructions in the form of one or more processors. In some embodiments, memory 720 includes different forms of program memory and data memory, such as a hard disk, read-only memory (ROM), random Access Memory (RAM), etc., for storing a wide variety of data files for processing and/or transmission by a computer. In some embodiments, input/output component 730 may be used to support input/output between processing device 600 and other components. In some embodiments, communication port 740 may be connected to a network for enabling data communications. An exemplary processing device may include program instructions stored in read-only memory (ROM), random Access Memory (RAM), and/or other types of non-transitory storage media for execution by processor 710. The methods and/or processes of the embodiments of the present description may be implemented in the form of program instructions. The processing device 700 may also receive the programs and data disclosed in the present application through network communication.
For ease of understanding, only one processor is schematically depicted in fig. 7. It should be noted, however, that the processing device 700 in the embodiments of the present specification may include a plurality of processors, and thus the operations and/or methods described in the embodiments of the present specification as being implemented by one processor may also be implemented by a plurality of processors collectively or individually. For example, if in this specification the processors of the processing device 700 perform steps 1 and 2, it should be understood that steps 1 and 2 may also be performed jointly or independently by two different processors of the processing device 700 (e.g., a first processor performing step 1, a second processor performing step 2, or both the first and second processors jointly performing steps 1 and 2).
Having described the basic concepts herein, it will be apparent to those skilled in the art that the foregoing detailed disclosure is by way of example only and is not intended to be limiting. Although not explicitly described herein, various modifications, improvements, and adaptations to the present disclosure may occur to one skilled in the art. Such modifications, improvements, and modifications are intended to be suggested within this specification, and therefore, such modifications, improvements, and modifications are intended to be included within the spirit and scope of the exemplary embodiments of the present application.
Meanwhile, the specification uses specific words to describe the embodiments of the specification. Reference to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic is associated with at least one embodiment of the present description. Thus, it should be emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various positions in this specification are not necessarily referring to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of the present description may be combined as suitable.
Furthermore, those skilled in the art will appreciate that the various aspects of the specification can be illustrated and described in terms of several patentable categories or circumstances, including any novel and useful procedures, machines, products, or materials, or any novel and useful modifications thereof. Accordingly, aspects of the present description may be performed entirely by hardware, entirely by software (including firmware, resident software, micro-code, etc.), or by a combination of hardware and software. The above hardware or software may be referred to as a "data block," module, "" engine, "" unit, "" component, "or" system. Furthermore, aspects of the specification may take the form of a computer product, comprising computer-readable program code, embodied in one or more computer-readable media.
The computer storage medium may contain a propagated data signal with the computer program code embodied therein, for example, on a baseband or as part of a carrier wave. The propagated signal may take on a variety of forms, including electro-magnetic, optical, etc., or any suitable combination thereof. A computer storage medium may be any computer readable medium that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. Program code located on a computer storage medium may be propagated through any suitable medium, including radio, cable, fiber optic cable, RF, or the like, or a combination of any of the foregoing.
The computer program code necessary for operation of portions of the present description may be written in any one or more programming languages, including an object oriented programming language such as Java, scala, smalltalk, eiffel, JADE, emerald, C ++, c#, vb net, python, and the like, a conventional programming language such as C language, visual Basic, fortran 3003, perl, COBOL 3002, PHP, ABAP, a dynamic programming language such as Python, ruby, and Groovy, or the like. The program code may execute entirely on the user's computer or as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the latter scenario, the remote computer may be connected to the user's computer through any form of network, such as a Local Area Network (LAN) or a Wide Area Network (WAN), or the connection may be made to an external computer (for example, through the Internet), or the use of services such as software as a service (SaaS) in a cloud computing environment.
Furthermore, the order in which the elements and sequences are processed, the use of numerical letters, or other designations in the description are not intended to limit the order in which the processes and methods of the description are performed unless explicitly recited in the claims. While certain presently useful inventive embodiments have been discussed in the foregoing disclosure, by way of various examples, it is to be understood that such details are merely illustrative and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover all modifications and equivalent arrangements included within the spirit and scope of the embodiments of the present disclosure. For example, while the system components described above may be implemented by hardware devices, they may also be implemented solely by software solutions, such as installing the described system on an existing server or mobile device.
Likewise, it should be noted that in order to simplify the presentation disclosed in this specification and thereby aid in understanding one or more inventive embodiments, various features are sometimes grouped together in a single embodiment, figure, or description thereof. This method of disclosure, however, is not intended to imply that more features than are presented in the claims are required for the present description. Indeed, less than all of the features of a single embodiment disclosed above.
In some embodiments, numbers describing the components, number of attributes are used, it being understood that such numbers being used in the description of embodiments are modified in some examples by the modifier "about," approximately, "or" substantially. Unless otherwise indicated, "about," "approximately," or "substantially" indicate that the number allows for a 20% variation. Accordingly, in some embodiments, numerical parameters set forth in the specification and claims are approximations that may vary depending upon the desired properties sought to be obtained by the individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and employ a method for preserving the general number of digits. Although the numerical ranges and parameters set forth herein are approximations that may be employed in some embodiments to confirm the breadth of the range, in particular embodiments, the setting of such numerical values is as precise as possible.
Each patent, patent application publication, and other material, such as articles, books, specifications, publications, documents, etc., referred to in this specification is incorporated herein by reference in its entirety. Except for application history documents that are inconsistent or conflicting with the content of this specification, documents that are currently or later attached to this specification in which the broadest scope of the claims to this specification is limited are also. It is noted that, if the description, definition, and/or use of a term in an attached material in this specification does not conform to or conflict with what is described in this specification, the description, definition, and/or use of the term in this specification controls.
Finally, it should be understood that the embodiments described in this specification are merely illustrative of the principles of the embodiments of this specification. Other variations are possible within the scope of this description. Thus, by way of example, and not limitation, alternative configurations of embodiments of the present specification may be considered as consistent with the teachings of the present specification. Accordingly, the embodiments of the present specification are not limited to only the embodiments explicitly described and depicted in the present specification.
Claims (10)
1. An image acquisition method implemented in a radiation imaging apparatus, the method comprising:
dividing a region to be examined of an object to be imaged into a plurality of imaging regions, wherein each imaging region corresponds to a control node, and the control node limits positions of a ray generation assembly and a detection assembly of the radiation imaging device when the radiation imaging device performs radiation imaging on the imaging region;
determining one or more target imaging regions associated with the detection region from the plurality of imaging regions, and corresponding target control nodes;
synchronously controlling the ray generation assembly and the detection assembly to move with the same motion parameters so as to traverse the position defined by the target control node, and performing radiation imaging on the object to be imaged when the ray generation assembly and the detection assembly reach the position defined by the target control node; wherein the motion parameters at least indicate a motion direction and a motion trajectory.
2. The image acquisition method of claim 1 wherein the division of the imaging area is determined based on a field of view size of the radiation imaging apparatus.
3. The image acquisition method of claim 1, wherein the object to be imaged comprises a multi-layer printed circuit board carrying integrated circuits, the region to be inspected being located in a horizontal cross-section of the multi-layer printed circuit board.
4. The image acquisition method of claim 3 wherein a plurality of positions defined by a plurality of control nodes corresponding to the radiation generating assembly are in a first plane and a plurality of positions defined by a plurality of control nodes corresponding to the detection assembly are in a second plane, the first plane and the second plane being parallel to each other and the first plane and the second plane being parallel to the horizontal cross-section.
5. A method of image acquisition according to claim 3, wherein the line between the positions of the radiation generating assembly and the detecting assembly defined by the same control node is perpendicular to the horizontal cross-section.
6. The image acquisition method of claim 1 wherein the movement of the radiation generating assembly and the detecting assembly between positions is a linear motion.
7. The image acquisition method according to claim 1, characterized in that the shortest distance between the target control-defined positions is determined based on the field of view size and resolution of the radiation imaging apparatus.
8. An image acquisition device for controlling movement of a component of a radiation imaging device, the movement control device comprising:
the dividing module is configured to divide a region to be examined of an object to be imaged into a plurality of imaging regions, wherein each imaging region corresponds to a control node, and the control node limits positions of a ray generation assembly and a detection assembly of the radiation imaging device when the radiation imaging device performs radiation imaging on the imaging region;
a determining module configured to determine one or more target imaging regions associated with the detection region from the plurality of imaging regions, and a corresponding target control node;
the control module is configured to synchronously control the ray generation assembly and the detection assembly to move with the same motion parameters so as to traverse the position defined by the target control node, and perform radiation imaging on the object to be imaged when the ray generation assembly and the detection assembly reach the position defined by the target control node; wherein the motion parameters at least indicate a motion direction and a motion trajectory.
9. A processing apparatus, comprising: memory, a processor and a computer program stored on the memory and executable on the processor, which when executed by the processor, implements the steps of the processing method according to any of claims 1-7.
10. A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the steps of the processing method according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310875583.1A CN117147590A (en) | 2023-07-17 | 2023-07-17 | Image acquisition method, device, equipment and storage medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310875583.1A CN117147590A (en) | 2023-07-17 | 2023-07-17 | Image acquisition method, device, equipment and storage medium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117147590A true CN117147590A (en) | 2023-12-01 |
Family
ID=88903394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310875583.1A Pending CN117147590A (en) | 2023-07-17 | 2023-07-17 | Image acquisition method, device, equipment and storage medium |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117147590A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117743062A (en) * | 2024-02-21 | 2024-03-22 | 北京怀美科技有限公司 | Anti-radiation detection method applied to memory chip |
-
2023
- 2023-07-17 CN CN202310875583.1A patent/CN117147590A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117743062A (en) * | 2024-02-21 | 2024-03-22 | 北京怀美科技有限公司 | Anti-radiation detection method applied to memory chip |
| CN117743062B (en) * | 2024-02-21 | 2024-05-03 | 北京怀美科技有限公司 | Anti-radiation detection method applied to memory chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4097934B2 (en) | Method and apparatus for local digital radiological inspection | |
| EP3586752A1 (en) | Static real-time ct imaging system adaptable to large visual field requirementsand imaging method | |
| CN107533018B (en) | X-ray inspection apparatus, X-ray inspection method, and method for manufacturing structure | |
| EP2541279B1 (en) | X-Ray Scanners | |
| CN117147590A (en) | Image acquisition method, device, equipment and storage medium | |
| US10413259B2 (en) | Gap resolution for linear detector array | |
| CN102715914B (en) | G-shaped arm X-ray machine, three-dimensional image generating method and device for G-shaped arm X-ray machine | |
| US11948325B2 (en) | Determining rotation axis from x-ray radiographs | |
| CN106896120A (en) | Multi-modal detecting system and method | |
| CN107192726B (en) | The quick high-resolution 3 D cone-beam computer tomography method of plate shell object and device | |
| CN108670284A (en) | A kind of determination method and system of CT scanner source focal point | |
| JP2006170876A (en) | Ct apparatus | |
| CN111096760A (en) | Radiation imaging apparatus, motion control method, system, medium, and storage medium thereof | |
| US20230194442A1 (en) | CT Scanner Calibration | |
| US20240193775A1 (en) | Out-of-view ct scan detection | |
| CN105319225B (en) | A kind of scan method for realizing plaques high-resolution large-viewing open country CL imaging | |
| US7231013B2 (en) | Precise x-ray inspection system utilizing multiple linear sensors | |
| EP4212917A1 (en) | Multi-channel static ct equipment | |
| Maisl et al. | Computed laminography for x-ray inspection of lightweight constructions | |
| KR20110131135A (en) | Ct device | |
| JPWO2018198242A1 (en) | Inspection apparatus, inspection method, and method of manufacturing inspection object | |
| EP4413925A1 (en) | Ct imaging system | |
| CN117110325A (en) | Motion control method, device, equipment and storage medium | |
| Chae et al. | Geometric calibration of a computed laminography system for high‐magnification nondestructive test imaging | |
| CN115486863A (en) | Static CT imaging equipment with tube current modulation function and imaging method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |