CN117140346A - Surface grinding device for wafer production and processing - Google Patents
Surface grinding device for wafer production and processing Download PDFInfo
- Publication number
- CN117140346A CN117140346A CN202311231507.3A CN202311231507A CN117140346A CN 117140346 A CN117140346 A CN 117140346A CN 202311231507 A CN202311231507 A CN 202311231507A CN 117140346 A CN117140346 A CN 117140346A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 230000000712 assembly Effects 0.000 claims abstract description 13
- 238000000429 assembly Methods 0.000 claims abstract description 13
- 230000008878 coupling Effects 0.000 claims abstract description 8
- 238000010168 coupling process Methods 0.000 claims abstract description 8
- 238000005859 coupling reaction Methods 0.000 claims abstract description 8
- 230000005540 biological transmission Effects 0.000 claims description 22
- 238000005096 rolling process Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 abstract description 46
- 230000001360 synchronised effect Effects 0.000 abstract description 10
- 230000000694 effects Effects 0.000 description 5
- 239000000872 buffer Substances 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910001651 emery Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0092—Grinding attachments for lathes or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a surface grinding device for wafer production and processing, and relates to the technical field of wafer grinding; to solve the problem of inefficiency; the device specifically comprises a base, the top outer wall of base rotates and is connected with the main shaft, and the top outer wall fixed mounting of main shaft has the supporting disk, a plurality of groups of bearing assembly have been arranged to the circular array of inner wall of supporting disk, the top outer wall of base is provided with multiunit grinding assembly, the bottom outer wall fixed mounting of base has motor one, and the output shaft and the main shaft of motor one pass through the coupling joint. According to the invention, the two groups of grinding assemblies are symmetrically arranged, a worker can stand at two positions perpendicular to the connecting line direction of the grinding assemblies to perform loading and unloading, after loading, the motor is started to rotate, and the supporting plate can be driven to rotate, so that the bearing assembly is driven to rotate, and when the bearing assembly rotates to the position of the grinding assembly, the two groups of grinding assemblies polish the end face of a wafer at the same time, thereby achieving the purpose of multi-station synchronous performance and improving the polishing efficiency.
Description
Technical Field
The invention relates to the technical field of wafer grinding, in particular to a surface grinding device for wafer production and processing.
Background
In the production of semiconductor devices, various materials are repeatedly formed into a film shape having a laminated structure on a semiconductor wafer, and in order to form the laminated structure, a technique of flattening the surface of the semiconductor wafer is important, and the wafer is polished by using a grinding wheel parallel polishing technique, thereby ensuring the flatness of the surface thereof and being widely used.
Through searching, the patent with the Chinese patent publication number of CN211220219U discloses a wafer grinding device, which comprises a grinding table with a grinding pad, wherein the grinding pad is used for grinding the surface of a wafer; a supply arm, located above the polishing pad, for delivering a polishing liquid to the polishing pad; the wafer carrier is positioned above the polishing pad and is used for pressing the wafer to the polishing pad, and the wafer carrier is provided with a bearing surface and a non-bearing surface; wherein the bearing surface is in contact with the wafer; the wafer carrier is characterized in that an adhesive tape is stuck on the side wall of the supply arm and the non-bearing surface of the wafer carrier, and the surface roughness of the adhesive tape is smaller than or equal to the preset surface roughness.
The above patents have the following disadvantages: it cannot perform multi-station polishing on a wafer, resulting in lower polishing efficiency, and further improvement is still required.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a surface grinding device for wafer production and processing.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the utility model provides a surface grinding device for wafer production and processing, includes the base, the top outer wall of base rotates and is connected with the main shaft, and the top outer wall fixed mounting of main shaft has the supporting disk, a plurality of groups of bearing assembly have been arranged to the circular array of inner wall of supporting disk, the top outer wall of base is provided with multiunit grinding assembly, the bottom outer wall fixed mounting of base has motor one, and the output shaft and the main shaft of motor one pass through the coupling joint.
Preferably: the top outer wall of base fixed mounting has the switch board, the outer wall fixed mounting of main shaft has the positioning cam.
Further: the top outer wall fixed mounting of base has backup pad one and push type signal switch, the inner wall sliding connection of backup pad one has the push rod, and the outer wall fixed mounting of push rod has end plate one, and the outer wall cover of push rod is equipped with spring one, and the inner wall roll connection of end plate one has ball one, motor one and the equal electric connection of push type signal switch in the switch board.
Based on the scheme: the bearing assembly comprises a groove type bearing box and a keyed transmission shaft which are fixedly installed with each other, a shaft sleeve is in clearance sliding fit with the outer wall of the keyed transmission shaft, and the shaft sleeve is rotationally connected to the inner wall of the supporting disc.
Among the foregoing, the preferred one is: the bottom outer wall fixed mounting of groove type bearing box has end plate two, and end plate two's inner wall roll connection has ball two, the top outer wall fixed mounting of base has the spacing ring, and the equal fixed mounting of top outer wall that the spacing ring is located the grinding component direction has spacing arc arch, the outer wall cover of keyed transmission shaft is equipped with spring two.
As a further scheme of the invention: the inner wall rotation of base is connected with two symmetry's synchronizing shaft, two the synchronizing shaft is symmetrical about two groups of grinding component's symmetry plane, two the outer wall fixed mounting that the synchronizing shaft passes through hold-in range transmission cooperation synchronizing shaft has gear two, the outer wall fixed mounting of keyed transmission shaft has gear one, the bottom outer wall fixed mounting of base has motor two, and the output shaft of motor two passes through the coupling joint in one of them on the outer wall of synchronizing shaft.
Meanwhile, the grinding assembly comprises an L-shaped bracket and a motor III, the L-shaped bracket is fixedly arranged on the top outer wall of the base, the outer wall of the L-shaped bracket is slidably connected with a lifting slide block through a linear slide rail, and the outer wall of the bottom of the lifting slide block is slidably connected with a support plate II through a slide bar.
As a preferred embodiment of the present invention: and a motor IV is fixedly arranged on the outer wall of the top of the support plate II, and the outer wall of an output shaft of the motor IV is connected with a grinding wheel through a flange.
Meanwhile, a spring III is sleeved on the outer wall of the sliding rod, and a limiting plate is fixedly arranged on the outer wall of the top of the sliding rod.
As a more preferable scheme of the invention: the shell of the motor III is fixedly arranged on the top outer wall of the L-shaped bracket, an output shaft of the motor III is connected with a screw rod through a coupler, and the screw rod is connected onto the inner wall of the lifting sliding block through threads.
The beneficial effects of the invention are as follows:
1. this a surface grinding device for wafer production and processing, two sets of grinding component symmetry set up, and the workman can stand and go up the unloading in two positions of perpendicular to grinding component line direction, and after the material loading, one rotation of starter motor can drive the supporting disk to drive and bear the weight of the subassembly rotation, when rotating the position to grinding component, two sets of grinding component polish the wafer terminal surface simultaneously, thereby realized the purpose that the multistation goes on in step, improved the efficiency of polishing.
2. This a surface grinding device for wafer production and processing, when the main shaft rotates, can drive the synchronous rotation of positioning cam, and positioning cam is spacing through its structure, presses the induction pole of push type signal switch through the push rod, and push type signal switch produces the electrical signal, and the switch board is closed according to electrical signal control motor one to realize the rotatory accurate location of supporting disk, guaranteed the accurate switching of polishing station and last unloading station.
3. This a surface grinding device for wafer production and processing, when rolling to spacing arc protruding department, bear box jack-up through spacing effect with key formula transmission shaft and groove to with wafer and grinding component cooperation polishing, on the accurate basis of rotation location is guaranteed to the preface, realized rotation location and the cooperation precision of perpendicular location of polishing, thereby guaranteed reliability and the precision of polishing.
4. This a surface grinding device for wafer production and processing, when motor two starts, the accessible hold-in range drives two synchronizing shafts and rotates, thereby drive gear two and rotate, when the keyed transmission shaft removes to polishing station department, when shifting up, drive gear one and shift up, thereby make gear one and gear two meshing, drive grooved carrier box and wafer rotation through gear two, thereby realize polishing even function, and if and only when the wafer is in polishing station, just have rotation power, this also can be fine make the wafer be in and go up unloading station can stop rotating, and need not additional control system control, the synchronism is stronger.
5. This a surface grinding device for wafer production and processing is through being provided with the spring III, on the one hand, when the wafer rises and contacts the emery wheel, the spring III can absorb the impact, buffers, prevents the damage, on the other hand, the pressure that the spring III corresponds increases on the wafer, the emery wheel increases with the pressure of wafer for earlier stage grinding rate is faster, along with grinding, the spring three compresses gradually resumes, the elasticity reduces, the pressure reduces, grinding rate is slower, thereby can grind more meticulously.
Drawings
FIG. 1 is a schematic diagram of a front view of a surface grinding device for wafer processing according to the present invention;
FIG. 2 is a schematic view of a positioning cam and its mating parts for a surface grinding device for wafer processing according to the present invention;
FIG. 3 is a schematic front view of a carrier assembly of a surface grinding device for wafer manufacturing according to the present invention;
FIG. 4 is a schematic cross-sectional view of a carrier assembly of a surface grinding device for wafer processing according to the present invention;
FIG. 5 is a schematic view of a polishing assembly of a surface polishing apparatus for wafer processing according to the present invention;
fig. 6 is a schematic circuit diagram of a surface polishing apparatus for wafer production and processing according to the present invention.
In the figure: 1. a base; 2. a carrier assembly; 3. a control cabinet; 4. a main shaft; 5. a support plate; 6. a grinding assembly; 7. a first motor; 8. a first spring; 9. a first supporting plate; 10. a push type signal switch; 11. a push rod; 12. positioning a cam; 13. a first ball; 14. an end panel I; 15. a trough-type carrying case; 16. a keyed drive shaft; 17. a shaft sleeve; 18. a second spring; 19. limiting arc-shaped bulges; 20. an end panel II; 21. a second ball; 22. a limiting ring; 23. a second motor; 24. a synchronizing shaft; 25. a first gear; 26. a second gear; 27. a synchronous belt; 28. a linear slide rail; 29. an "L" shaped stent; 30. a screw rod; 31. a third motor; 32. a limiting plate; 33. a slide bar; 34. a fourth motor; 35. grinding wheel; 36. a second supporting plate; 37. a third spring; 38. and lifting the sliding block.
Detailed Description
The technical scheme of the patent is further described in detail below with reference to the specific embodiments.
Embodiments of the present patent are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present patent and are not to be construed as limiting the present patent.
In the description of this patent, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the patent and simplify the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be configured and operated in a particular orientation, and are therefore not to be construed as limiting the patent.
In the description of this patent, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "disposed" are to be construed broadly, and may be fixedly connected, disposed, detachably connected, disposed, or integrally connected, disposed, for example. The specific meaning of the terms in this patent will be understood by those of ordinary skill in the art as the case may be.
Example 1
The surface grinding device for wafer production and processing comprises a base 1, wherein the top outer wall of the base 1 is rotationally connected with a main shaft 4, the top outer wall of the main shaft 4 is fixedly provided with a supporting disc 5 through bolts, the inner walls of the supporting discs 5 are circularly arrayed and provided with a plurality of groups of bearing assemblies 2, the top outer wall of the base 1 is provided with a plurality of groups of grinding assemblies 6, the bottom outer wall of the base 1 is fixedly provided with a motor I7 through bolts, and the output shaft of the motor I7 is connected with the main shaft 4 through a coupling; in this embodiment, the specific number of the groups of the carrying component 2 and the polishing component 6 is not limited, and may be set in any combination according to practical situations, and preferably: the bearing assemblies 2 are four groups, and the grinding assemblies 6 are two groups; when the device is used, two groups of grinding assemblies 6 are symmetrically arranged, workers can stand at two positions perpendicular to the connecting line direction of the grinding assemblies 6 to carry out feeding and discharging, after feeding, the first motor 7 is started to rotate, the supporting disc 5 can be driven to rotate, the bearing assembly 2 is driven to rotate, when the bearing assembly 2 rotates to the position of the grinding assembly 6, the two groups of grinding assemblies 6 polish the end face of a wafer simultaneously, the purpose of multi-station synchronous carrying out is achieved, and the polishing efficiency is improved.
In order to solve the positioning problem; as shown in fig. 2 and 6, the control cabinet 3 is fixed on the top outer wall of the base 1 by bolts, and the positioning cam 12 is welded on the outer wall of the spindle 4, and in this embodiment, the specific type of the positioning cam 12 is not limited, and preferably: the positioning cam 12 is a four-bulge cam; the top outer wall of the base 1 is fixedly provided with a first supporting plate 9 and a push type signal switch 10 through bolts, the inner wall of the first supporting plate 9 is slidably connected with a push rod 11, the outer wall of the push rod 11 is welded with a first end plate 14, the outer wall of the push rod 11 is sleeved with a first spring 8, the inner wall of the first end plate 14 is in rolling connection with a first ball 13, and the first motor 7 and the push type signal switch 10 are electrically connected to the control cabinet 3; when the main shaft 4 rotates, the positioning cam 12 can be driven to synchronously rotate, the positioning cam 12 is limited by the structure of the positioning cam, the push rod 11 presses the induction rod of the push type signal switch 10, the push type signal switch 10 generates an electric signal, the control cabinet 3 controls the motor 7 to be closed according to the electric signal, and therefore accurate positioning of rotation of the support disc 5 is achieved, and accurate switching of a polishing station and a loading and unloading station is guaranteed.
To solve the problem of carrying; as shown in fig. 3, the bearing assembly 2 includes a slot-type bearing box 15 and a keyed transmission shaft 16 that are fixedly installed with each other, a shaft sleeve 17 is slidably fitted on an outer wall of the keyed transmission shaft 16, the shaft sleeve 17 is rotatably connected to an inner wall of the supporting disc 5, a second end plate 20 is fixed on a bottom outer wall of the slot-type bearing box 15 through a bolt, a second ball 21 is rotatably connected to an inner wall of the second end plate 20, a limiting ring 22 is fixed on a top outer wall of the base 1 through a bolt, limiting arc-shaped protrusions 19 are fixed on top outer walls of the limiting ring 22 in a direction of the grinding assembly 6 through bolts, and a second spring 18 is sleeved on an outer wall of the keyed transmission shaft 16; during the use, can place the wafer in the recess that the groove type bore box 15, the supporting disk 5 rotates and drives the groove type and bore box 15 synchronous rotation, and ball two 21 rolls with the top of spacing ring 22, when rolling to spacing arc arch 19 department, will take key transmission shaft 16 and groove type to bore box 15 jack-up through spacing effect to with the cooperation of wafer and grinding component 6, guarantee on the accurate basis of rotational positioning in the preface, realized rotational positioning and the cooperation accuracy of perpendicular location of polishing, thereby guaranteed reliability and the accuracy of polishing.
In order to solve the polishing uniformity and synchronism problem; as shown in fig. 4, the inner wall of the base 1 is rotatably connected with two symmetrical synchronizing shafts 24, the two synchronizing shafts 24 are symmetrical about the symmetry plane of the two groups of grinding assemblies 6, the two synchronizing shafts 24 are in transmission fit with the outer wall of the synchronizing shafts 24 through a synchronous belt 27, a gear two 26 is welded on the outer wall of the keyed transmission shaft 16, a gear one 25 is welded on the outer wall of the keyed transmission shaft 16, a motor two 23 is fixed on the outer wall of the bottom of the base 1 through bolts, and an output shaft of the motor two 23 is connected to the outer wall of one synchronizing shaft 24 through a coupling; when the motor II 23 is started, the synchronous belt 27 can drive the two synchronous shafts 24 to rotate, so that the gear II 26 is driven to rotate, when the keyed transmission shaft 16 moves to a polishing station, the gear I25 is driven to move upwards, so that the gear I25 is meshed with the gear II 26, the gear II 26 drives the groove type bearing box 15 and the wafer to rotate, thereby realizing the function of uniform polishing, and the wafer has rotating power if and only when the wafer is in the polishing station, so that the wafer can stop rotating at the loading and unloading stations, and the wafer is controlled by a control system without other control systems, and has strong synchronism.
In this embodiment, when in use, the wafer can be placed in the groove of the groove type bearing box 15, the worker can stand at two positions perpendicular to the connecting line direction of the grinding component 6 to perform loading and unloading, after loading, the first motor 7 is started to rotate, the first supporting disk 5 is driven to rotate through the main shaft 4, when the main shaft 4 rotates, the positioning cam 12 can be driven to synchronously rotate, the positioning cam 12 is limited through the structure, the push rod 11 presses the induction rod of the push type signal switch 10, the push type signal switch 10 generates an electric signal, the control cabinet 3 controls the first motor 7 to be closed according to the electric signal, thereby realizing the accurate positioning of the rotation of the supporting disk 5, the supporting disk 5 rotates to drive the groove type bearing box 15 to synchronously rotate, the second ball 21 and the top of the limiting ring 22 roll, when the ball rolls to the limiting arc-shaped bulge 19, the keyed transmission shaft 16 and the groove type bearing box 15 are jacked up through the limiting function, thereby polishing the wafer and the grinding component 6 in a matched mode, when the second motor 23 is started, the two synchronous shafts 24 are driven to rotate through the synchronous belt 27, thereby driving the second gear 26 to rotate, when the keyed transmission shaft 16 moves to the polishing position, the first gear 25 moves to the first gear 26, and the second gear 25 is driven to rotate, thereby realizing the function of uniformly polishing, and the second gear 26 is meshed with the second gear 25.
Example 2
A surface grinding device for wafer production and processing, as shown in fig. 1 and 5, in order to solve the problem of polishing function; the present example was modified on the basis of example 1 as follows: the grinding assembly 6 comprises an L-shaped bracket 29 and a motor III 31, wherein the L-shaped bracket 29 is fixed on the top outer wall of the base 1 through bolts, the outer wall of the L-shaped bracket 29 is connected with a lifting slide block 38 in a sliding manner through a linear slide rail 28, the bottom outer wall of the lifting slide block 38 is connected with a support plate II 36 in a sliding manner through a slide rod 33, the top outer wall of the support plate II 36 is fixed with a motor IV 34 through bolts, and the outer wall of an output shaft of the motor IV 34 is connected with a grinding wheel 35 through a flange; when the motor IV 34 is started, the motor IV can drive the grinding wheel 35 to rotate, so that the wafer is polished.
In order to solve the polishing effect problem, as shown in fig. 5, the outer wall of the sliding rod 33 is sleeved with a spring three 37, the top outer wall of the sliding rod 33 is fixedly provided with a limiting plate 32 through bolts, and the spring three 37 is provided with the spring three 37, so that on one hand, when a wafer rises to contact with the grinding wheel 35, the spring three 37 can absorb impact and buffer the impact to prevent damage, on the other hand, the pressure of the wafer rises to shrink the spring three 37, the corresponding elasticity of the spring three 37 is increased, the pressure of the grinding wheel 35 and the wafer is increased, the early grinding speed is higher, the compression of the spring three 37 is gradually recovered along with grinding, the elasticity is reduced, the pressure is reduced, the grinding speed is slower, and therefore the polishing is finer.
In order to solve the problem of adjusting the grinding height, as shown in fig. 5, a shell of the third motor 31 is fixed on the top outer wall of the L-shaped bracket 29 through bolts, an output shaft of the third motor 31 is connected with a lead screw 30 through a coupler, and the lead screw 30 is connected on the inner wall of the lifting slide block 38 through threads; when the motor III 31 is started, the motor III can drive the screw rod 30 to rotate, so that the lifting slide block 38 is driven to lift through the threaded connection effect, and the polishing plane of the grinding wheel 35 is synchronously driven to change.
When the polishing device is used, the motor III 31 is started, the screw rod 30 can be driven to rotate, the lifting slide block 38 is driven to lift through the threaded connection effect, the polishing plane of the polishing wheel 35 is synchronously driven to change, when the motor IV 34 is started, the motor IV can drive the polishing wheel 35 to rotate, thereby polishing a wafer, and the spring III 37 is arranged, on one hand, when the wafer ascends to contact with the polishing wheel 35, the spring III 37 can absorb impact and buffer the impact to prevent damage, on the other hand, the pressure of the wafer is increased by the spring III 37, the pressure of the polishing wheel 35 and the wafer is increased, the early polishing speed is higher, the spring III 37 is gradually recovered along with polishing, the elasticity is reduced, the pressure is reduced, and the polishing speed is slower.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (8)
1. The surface grinding device for wafer production and processing comprises a base (1), and is characterized in that the top outer wall of the base (1) is rotationally connected with a main shaft (4), a supporting disc (5) is fixedly arranged on the top outer wall of the main shaft (4), a plurality of groups of bearing assemblies (2) are circularly arranged on the inner wall of the supporting disc (5), a plurality of groups of grinding assemblies (6) are arranged on the top outer wall of the base (1), a motor I (7) is fixedly arranged on the bottom outer wall of the base (1), and an output shaft of the motor I (7) is connected with the main shaft (4) through a coupling;
the bearing assembly (2) comprises a groove type bearing box (15) and a keyed transmission shaft (16) which are fixedly arranged with each other, a shaft sleeve (17) is in clearance sliding fit with the outer wall of the keyed transmission shaft (16), and the shaft sleeve (17) is rotationally connected with the inner wall of the supporting disc (5);
the bottom outer wall fixed mounting of groove type bears box (15) has end plate two (20), and the inner wall roll connection of end plate two (20) has ball two (21), the top outer wall fixed mounting of base (1) has spacing ring (22), and spacing ring (22) are located the top outer wall of grinding component (6) direction and all fixed mounting have spacing arc arch (19), the outer wall cover of key-type transmission shaft (16) is equipped with spring two (18).
2. The surface grinding device for wafer production and processing according to claim 1, wherein a control cabinet (3) is fixedly arranged on the outer wall of the top of the base (1), and a positioning cam (12) is fixedly arranged on the outer wall of the main shaft (4).
3. The surface grinding device for wafer production and processing according to claim 2, wherein a supporting plate I (9) and a pressing type signal switch (10) are fixedly arranged on the outer wall of the top of the base (1), a push rod (11) is slidably connected to the inner wall of the supporting plate I (9), an end plate I (14) is fixedly arranged on the outer wall of the push rod (11), a spring I (8) is sleeved on the outer wall of the push rod (11), a ball I (13) is in rolling connection with the inner wall of the end plate I (14), and the motor I (7) and the pressing type signal switch (10) are electrically connected to the control cabinet (3).
4. The surface grinding device for wafer production and processing according to claim 1, wherein two symmetrical synchronizing shafts (24) are rotatably connected to the inner wall of the base (1), the two synchronizing shafts (24) are symmetrical with respect to the symmetrical planes of the two groups of grinding components (6), the two synchronizing shafts (24) are fixedly provided with a gear two (26) through the outer wall of the synchronizing shaft (24) in transmission fit with a synchronizing belt (27), the outer wall of the keyed transmission shaft (16) is fixedly provided with a gear one (25), the bottom outer wall of the base (1) is fixedly provided with a motor two (23), and the output shaft of the motor two (23) is connected to the outer wall of one of the synchronizing shafts (24) through a coupling.
5. The surface grinding device for wafer production and processing according to claim 1, wherein the grinding assembly (6) comprises an L-shaped bracket (29) and a motor III (31), the L-shaped bracket (29) is fixedly installed on the top outer wall of the base (1), the outer wall of the L-shaped bracket (29) is slidably connected with a lifting slide block (38) through a linear slide rail (28), and the bottom outer wall of the lifting slide block (38) is slidably connected with a support plate II (36) through a slide bar (33).
6. The surface grinding device for wafer production and processing according to claim 5, wherein a fourth motor (34) is fixedly arranged on the outer wall of the top of the second supporting plate (36), and an outer wall of an output shaft of the fourth motor (34) is connected with a grinding wheel (35) through a flange.
7. The surface grinding device for wafer production and processing according to claim 6, wherein a spring III (37) is sleeved on the outer wall of the sliding rod (33), and a limiting plate (32) is fixedly arranged on the outer wall of the top of the sliding rod (33).
8. The surface grinding device for wafer production and processing according to claim 7, wherein a housing of the motor III (31) is fixedly installed on the top outer wall of the L-shaped bracket (29), an output shaft of the motor III (31) is connected with a lead screw (30) through a coupling, and the lead screw (30) is connected on the inner wall of the lifting slide block (38) through threads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311231507.3A CN117140346A (en) | 2023-09-22 | 2023-09-22 | Surface grinding device for wafer production and processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311231507.3A CN117140346A (en) | 2023-09-22 | 2023-09-22 | Surface grinding device for wafer production and processing |
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| Publication Number | Publication Date |
|---|---|
| CN117140346A true CN117140346A (en) | 2023-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311231507.3A Pending CN117140346A (en) | 2023-09-22 | 2023-09-22 | Surface grinding device for wafer production and processing |
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| CN (1) | CN117140346A (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0788760A (en) * | 1993-09-21 | 1995-04-04 | Sumitomo Sitix Corp | Mirror surface polishing device for semiconductor substrate |
| KR20050087966A (en) * | 2004-02-28 | 2005-09-01 | 유수남 | A chemical mechanical polishing apparatus |
| CN211073142U (en) * | 2019-12-20 | 2020-07-24 | 江苏航锋金刚石工具有限公司 | Multi-station diamond grinding equipment |
| CN112123150A (en) * | 2020-10-27 | 2020-12-25 | 永州市亿达自动化机械有限公司 | High-efficiency nine-shaft glass polishing machine |
| CN213858196U (en) * | 2020-09-15 | 2021-08-03 | 江苏巨麦机床科技有限公司 | Workpiece fixing and clamping device for machine tool |
| CN114029823A (en) * | 2021-11-19 | 2022-02-11 | 西安理工大学 | Special sanding device and method for ring-shaped piece based on mechanical design |
| CN114100813A (en) * | 2021-11-22 | 2022-03-01 | 德州德药制药有限公司 | Nifedipine controlled release tablet grinding equipment and use method thereof |
| CN215920104U (en) * | 2021-08-10 | 2022-03-01 | 北轴(洛阳)科技有限公司 | Bearing ring polishing device for bearing production and processing |
| CN114274008A (en) * | 2022-01-05 | 2022-04-05 | 黑龙江科技大学 | Bearing polishing equipment |
| CN115116912A (en) * | 2022-05-11 | 2022-09-27 | 江苏卓玉智能科技有限公司 | Semiconductor wafer silicon wafer separator |
| CN218592533U (en) * | 2022-11-26 | 2023-03-10 | 内蒙古天陆实业有限公司 | Environment-friendly plastic floor grinding machine |
| CN218736878U (en) * | 2022-09-02 | 2023-03-28 | 固始风吹麦浪食品有限公司 | Dessert forming device |
| CN116276389A (en) * | 2023-03-10 | 2023-06-23 | 金华新天齿轮有限公司 | Gear end face polishing device |
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2023
- 2023-09-22 CN CN202311231507.3A patent/CN117140346A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0788760A (en) * | 1993-09-21 | 1995-04-04 | Sumitomo Sitix Corp | Mirror surface polishing device for semiconductor substrate |
| KR20050087966A (en) * | 2004-02-28 | 2005-09-01 | 유수남 | A chemical mechanical polishing apparatus |
| CN211073142U (en) * | 2019-12-20 | 2020-07-24 | 江苏航锋金刚石工具有限公司 | Multi-station diamond grinding equipment |
| CN213858196U (en) * | 2020-09-15 | 2021-08-03 | 江苏巨麦机床科技有限公司 | Workpiece fixing and clamping device for machine tool |
| CN112123150A (en) * | 2020-10-27 | 2020-12-25 | 永州市亿达自动化机械有限公司 | High-efficiency nine-shaft glass polishing machine |
| CN215920104U (en) * | 2021-08-10 | 2022-03-01 | 北轴(洛阳)科技有限公司 | Bearing ring polishing device for bearing production and processing |
| CN114029823A (en) * | 2021-11-19 | 2022-02-11 | 西安理工大学 | Special sanding device and method for ring-shaped piece based on mechanical design |
| CN114100813A (en) * | 2021-11-22 | 2022-03-01 | 德州德药制药有限公司 | Nifedipine controlled release tablet grinding equipment and use method thereof |
| CN114274008A (en) * | 2022-01-05 | 2022-04-05 | 黑龙江科技大学 | Bearing polishing equipment |
| CN115116912A (en) * | 2022-05-11 | 2022-09-27 | 江苏卓玉智能科技有限公司 | Semiconductor wafer silicon wafer separator |
| CN218736878U (en) * | 2022-09-02 | 2023-03-28 | 固始风吹麦浪食品有限公司 | Dessert forming device |
| CN218592533U (en) * | 2022-11-26 | 2023-03-10 | 内蒙古天陆实业有限公司 | Environment-friendly plastic floor grinding machine |
| CN116276389A (en) * | 2023-03-10 | 2023-06-23 | 金华新天齿轮有限公司 | Gear end face polishing device |
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