CN117131836A - Measuring point checking method and device and electronic equipment - Google Patents

Measuring point checking method and device and electronic equipment Download PDF

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Publication number
CN117131836A
CN117131836A CN202311090993.1A CN202311090993A CN117131836A CN 117131836 A CN117131836 A CN 117131836A CN 202311090993 A CN202311090993 A CN 202311090993A CN 117131836 A CN117131836 A CN 117131836A
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China
Prior art keywords
pcb
point
measuring
measuring points
welding
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CN202311090993.1A
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Chinese (zh)
Inventor
李倩
陈兵
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Lenovo Beijing Ltd
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Lenovo Beijing Ltd
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Priority to CN202311090993.1A priority Critical patent/CN117131836A/en
Publication of CN117131836A publication Critical patent/CN117131836A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2115/00—Details relating to the type of the circuit
    • G06F2115/12—Printed circuit boards [PCB] or multi-chip modules [MCM]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The application provides a measuring point checking method, a measuring point checking device and electronic equipment, wherein the method comprises the following steps: obtaining attribute information of welding spots in a PCB, wherein the PCB comprises at least one welding spot; identifying a measurement point in the PCB based on the attribute information; the measuring points are welding points to be tested in the PCB; and checking the measuring points in the PCB to obtain the measuring points which do not meet the test requirements.

Description

Measuring point checking method and device and electronic equipment
Technical Field
The present application relates to the field of PCB detection technologies, and in particular, to a method and an apparatus for inspecting a measurement point, and an electronic device.
Background
In the design process of the PCB (Printed Circuit Board, the printed circuit board) can add measuring points on the PCB according to the test requirements, and a designer needs to strictly adhere to the rule of adding the measuring points in the design process of the PCB to add the measuring points on the PCB.
However, in the actual design process of the PCB, multiple designers participate in the design together, experience among the designers is different, so that various problems exist in the added measuring points, and before the PCB is applied to the actual test process, it is required to check whether the properties of the measuring points in the PCB meet the test requirements. Because of the large number of station attributes, for a complex PCB, where tens of thousands of stations may be added, if inspected manually, a significant amount of labor and time is consumed.
Disclosure of Invention
In view of the above, the present application provides a method and apparatus for inspecting a measurement point, and an electronic device.
A site inspection method comprising:
obtaining attribute information of welding spots in a PCB, wherein the PCB comprises at least one welding spot;
identifying a measurement point in the PCB based on the attribute information; the measuring points are welding points to be tested in the PCB;
and checking the measuring points in the PCB to obtain the measuring points which do not meet the test requirements.
In the method, the PCB comprises at least one dot layer, and the dot layer comprises at least one welding spot;
the method further comprises the steps of:
displaying a dot layer in the PCB.
The method further comprises the steps of:
and marking the measuring points which do not meet the test requirements on the displayed point layer.
The method for obtaining the attribute information of the welding spots in the PCB comprises the following steps:
acquiring first position information of welding spots in the PCB;
acquiring a point ID of the welding point based on the first position information;
and inquiring attribute information of welding spots in the PCB by applying the spot ID.
The method, based on the attribute information, identifies a measurement point in the PCB, including:
determining that the welding point with the point type being the measuring point type is the measuring point in the PCB based on the point type pointed by the attribute information of each welding point;
or,
and determining that the size of the bonding pad meets a preset size rule based on the size of the bonding pad and the package name contained in the attribute information of each bonding pad, wherein the bonding pad with the package name meeting the preset package rule is a measuring point.
The method for checking the measuring points in the PCB comprises the following steps:
and checking the measuring points in the PCB in sequence according to the preset sequence of the measuring points in the PCB.
The method for checking the measuring points in the PCB comprises the following steps:
obtaining at least one attribute parameter contained in the attribute information of the measuring point;
comparing the attribute parameters with standard attribute parameters;
under the condition that the attribute parameters are consistent with the standard attribute parameters, the measuring points meet the test requirements;
and under the condition that the attribute parameters are inconsistent with the standard attribute parameters, the measuring point does not meet the test requirements.
The method further comprises the steps of:
acquiring measurement point information of measurement points which do not meet the test requirements in the PCB;
and outputting the measuring point information.
A station inspection apparatus comprising:
the device comprises an acquisition unit, a processing unit and a processing unit, wherein the acquisition unit is used for acquiring attribute information of welding spots in a PCB, and the PCB comprises at least one welding spot;
an identifying unit for identifying the measuring points in the PCB based on the attribute information;
and the checking unit is used for checking the measuring points in the PCB to obtain the measuring points which do not meet the test requirement.
A storage medium comprising stored instructions, wherein the instructions, when executed, control a device in which the storage medium resides to perform a site inspection method as described above.
An electronic device comprising a memory, and one or more instructions, wherein the one or more instructions are stored in the memory and configured to be executed by one or more processors to perform the above-described spot inspection method.
Compared with the prior art, the application has the following advantages:
the application provides a measuring point checking method, which comprises the following steps: obtaining attribute information of welding spots in a PCB, wherein the PCB comprises at least one welding spot; identifying the measurement points in the PCB based on the attribute information; the measuring point is a welding point to be tested in the PCB; and checking the measuring points in the PCB to obtain the measuring points which do not meet the test requirements. The application can check the measuring points before the measuring points are tested, avoids abnormal testing of the measuring points under the condition that the measuring points do not meet the testing requirements, and meanwhile, does not need to find out the measuring points which do not meet the testing requirements in a manual mode, thereby improving the testing efficiency of the PCB.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present application, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for inspecting a measurement point according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a measurement point display of a measurement point inspection method according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a marked measurement point of a measurement point inspection method according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a method for inspecting a measurement point according to an embodiment of the present application;
FIG. 5 is a system architecture diagram of a station inspection system according to an embodiment of the present application;
FIG. 6 is a block diagram of a station inspection apparatus according to an embodiment of the present application;
fig. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In the present disclosure, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions, and the terms "comprise," "include," or any other variation thereof, are intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The application is operational with numerous general purpose or special purpose computing device environments or configurations. For example: personal computers, server computers, hand-held or portable devices, tablet devices, multiprocessor devices, distributed computing environments that include any of the above devices or devices, and the like.
The embodiment of the application provides a measuring point checking method, which can be applied to various system platforms, wherein an execution subject of the method can be a computer terminal or processors of various mobile devices, and a flow chart of the method is shown in fig. 1, and specifically comprises the following steps:
s101: and obtaining attribute information of welding spots in the PCB.
Wherein the PCB comprises at least one solder joint.
It should be noted that the solder joints in the PCB may be mechanical connection points or electrical connection points. And welding spots in the PCB on the PCB, wherein each welding spot integrates corresponding attribute information.
The attribute information of the solder joint may include the name, location, spacing, number, size, level, and hole plugging of the solder joint.
It should be further noted that the PCB includes at least one dot layer, and typically the PCB includes two dot layers, a front dot layer and a back dot layer, respectively, each dot layer including at least one solder joint thereon. The spot layer in the PCB may also be displayed before the properties of the solder joints in the PCB are obtained. As shown in fig. 2, the dot layer displayed on the left side in fig. 2 may be a front dot layer, and the dot layer displayed on the right side may be a rear dot layer; marks may be made on the two spot layers separately to distinguish between a spot weld belonging to the front spot layer and a spot weld belonging to the back spot layer.
S102: based on the attribute information, the measurement points in the PCB are identified.
The measuring points are welding points to be tested in the PCB.
It can be appreciated that, according to the attribute information of the solder joint in the PCB, whether the solder joint is the measuring point to be tested in the PCB is determined.
Specifically, the manner of identifying the measurement points in the PCB includes:
embodiment one: and determining that the welding point with the point type being the measuring point type is the measuring point in the PCB based on the point type pointed by the attribute information of each welding point. And determining an indication identifier matched with the attribute information according to the attribute information of the welding spot, wherein the indication identifier is used for indicating the type of the welding spot.
Specifically, the indication identifier matched with the welding spot name can be searched by obtaining the welding spot name contained in the attribute information, and the point type of the welding spot can be determined according to the indication identifier. If the spot type is denoted as a spot type, the spot weld is a spot weld in the PCB.
Embodiment two: based on the size of the bonding pad and the package name contained in the attribute information of each bonding pad, determining that the size of the bonding pad meets the preset size rule, and taking the bonding pad with the package name meeting the preset package rule as a measuring point. The size of the bonding pad refers to the size of a point of the bonding pad welded on the PCB, and the shape of the bonding pad on the PCB is circular, so that the size of the bonding pad can be the diameter or the occupied area of the bonding pad on the PCB; the package name refers to the solder joint name.
It can be understood that, for the solder joint that can be tested, before the solder joint is added to the PCB, it is required to meet the specified addition requirement, and the solder joint name of the solder joint that can be tested includes the identification code corresponding to the solder joint, according to the identification code, it can be determined whether the solder joint is the test point to be tested, and meanwhile, the test point that needs to be tested ensures that the solder joint size of the solder joint on the PCB meets the preset size rule.
It should be noted that, the size rule is that the size of the bonding pad needs to be within a preset size range.
S103: and checking the measuring points in the PCB to obtain the measuring points which do not meet the test requirements.
It should be noted that after determining the measurement point to be tested, the measurement point may be abnormal in the testing process due to different requirements of technicians during the welding of the measurement point on the PCB.
It should be noted that if the measurement points in the PCB point layer are not unique, the measurement points in the PCB are sequentially checked according to the preset order of the measurement points in the PCB. Wherein each measurement point in the front surface point layer can be checked first, and then each measurement point in the back surface point layer can be checked.
Alternatively, if there are tests that do not meet the test requirements, the points that do not meet the test requirements may be marked on the displayed dot layer (as shown in fig. 3, the marked black dots are the points that do not meet the test requirements). A technician can check the measuring points which do not meet the test requirements through the display equipment, and correct the measuring points in time.
Furthermore, besides marking the measuring points which do not meet the test requirement, non-test welding spots on the spot layer can be marked. The marking information of the measuring points which do not meet the test requirements is different from the marking information of the non-tested welding points, for example: the two marked points are distinguished by different colors or by different codes.
The application can ensure that a technician checks and timely corrects the measuring points which do not meet the test requirements through the display equipment, and simultaneously, the technician can check non-test welding points and determine whether to mark the welding points which need to be marked as testable as welding points which do not need to be tested according to the welding point positions of the non-test welding points.
In the method provided by the embodiment of the application, before the test points in the PCB are required to be tested, the test points which can be tested in the PCB are required to be determined in advance. Firstly, obtaining attribute information of each welding spot in the PCB, and determining a measuring point to be tested in the PCB according to the attribute information. And then checking the measuring points to determine whether the measuring points meet the test requirements. If the measuring points meet the test requirements, the performance of the PCB can be tested according to each measuring point, otherwise, the PCB is characterized as an unqualified product currently.
By applying the method provided by the real-time example of the application, the measuring points can be checked before the measuring points are tested, the abnormal testing of the measuring points caused by the condition that the measuring points do not meet the testing requirements is avoided, and meanwhile, the measuring points which do not meet the testing requirements do not need to be found out manually, so that the testing efficiency of the PCB is improved.
Based on the method provided in the foregoing embodiment, the manner of obtaining the attribute information of the solder joint in the PCB may be:
acquiring first position information of welding spots in the PCB; obtaining a point ID of the welding point based on the first position information; and inquiring attribute information of welding spots in the PCB by using the spot ID.
It should be noted that, the attribute information of all the welding spots in the PCB is stored in a pre-generated attribute list, where one spot layer corresponds to one attribute list, and each attribute information in the attribute list is the data information of each welding spot in the corresponding spot layer.
Specifically, first position information of a welding spot in a spot layer to which the welding spot belongs is identified, and a spot ID of the welding spot is obtained according to the first position information. The point ID of the welding point is set according to the corresponding position information, for example: the point ID is +001, which indicates that the spot corresponding to the point ID is the first spot in the front spot layer, the point ID is-001, and the spot corresponding to the point ID is the first spot in the back spot layer. After the point ID is obtained, the attribute information of the welding point is queried in an attribute list corresponding to the point layer to which the welding point belongs.
Based on the method provided by the above embodiment, checking the measurement point in the PCB includes:
obtaining at least one attribute parameter contained in the attribute information of the measuring point; comparing the attribute parameters with the standard attribute parameters; under the condition that the attribute parameters are consistent with the standard attribute parameters, determining that the measuring points meet the test requirements; and under the condition that the attribute parameters are inconsistent with the standard attribute parameters, determining that the measuring point does not meet the test requirement. The attribute parameters in the attribute information are parameters corresponding to the position, the distance, the size, the layer, the plug hole and the like. If the position of the measuring point is at the standard circuit position, the relative distance between the measuring point and other measuring points or welding points meets the preset requirement, the size of the bonding pad (namely the size of the bonding pad) of the measuring point meets the size rule and the like, and the attribute parameters of the marking measuring point are consistent with the standard attribute parameters; otherwise, the non-uniformity is indicated.
For example, before testing the measuring point, the size of the bonding pad of the measuring point needs to be ensured to meet the size rule, if the size of the bonding pad of the welding point is too small, the power-on cannot be performed, and if the size of the bonding pad is too large, the testing of other peripheral measuring points can be affected after the power-on.
In the embodiment of the application, the attribute parameters of the measuring points are checked through the standard attribute parameters so as to avoid the abnormal test of the PCB caused by the test of the measuring points which do not meet the test requirements.
Optionally, if the measurement point does not meet the test requirement, the method can further include, in addition to marking and displaying the measurement point: acquiring measurement point information of measurement points which do not meet the test requirement in the PCB; and outputting the measuring point information.
The measuring point information comprises attribute parameters of the measuring point, which are inconsistent with the standard attribute parameters. After receiving the measurement point information, a technician can correct the measurement point according to the attribute parameters prompted in the information so as to avoid abnormal testing caused by the PCB testing process.
Based on the method provided by the embodiment, all rule requirements of the measurement point attribute are written into the program by utilizing the Allegro language. And acquiring all measuring points List on the board by using the program and the measuring point attributes, and distinguishing the measuring points on the front surface and the back surface. All attributes of each measuring point, such as position, interval, number, size, layer, hole and the like, are acquired by using a program, and each attribute is automatically compared with a corresponding rule. And automatically forming a document form by using a program according to the comparison result of the unsatisfied rule, and highlighting the unsatisfied measuring points.
The method comprises the steps of programming the attribute rules of the measuring points into a program by using an Allegro language, reducing the dependence on the experience of engineers, having more universality, and not needing to check one by one manually, automatically obtaining the measuring points of the whole board by using the program, judging the measuring points which do not meet the requirements by automatically reading all the attributes of the measuring points, and highlighting and forming a document form.
Based on the method provided by the above embodiment, the specific implementation process of the station inspection method of the present application may be as shown in fig. 4, and specifically includes: the Allegro software starts the PCB and runs the program, and automatically opens the front surface dot layer and the back surface dot layer by layer; and judging which of the welding spots in the sub-layer are the measuring points by using the properties such as the size of the welding disc of the measuring point, the name of the package and the like. And respectively acquiring attribute lists of the front surface point layer and the back surface point layer. And reading attribute parameters in all attribute information one by one for the measuring points in the attribute list. Each attribute parameter is automatically compared with a corresponding standard attribute parameter written into the program. And automatically judging whether the measuring point meets the test requirement or not through data analysis, if not, forming information such as the position, the layer surface and the unsatisfied rule of the measuring point into a document for output, and highlighting the unsatisfied measuring point.
Based on the method provided by the above embodiment, referring to fig. 5, the present application may further provide a mid-measurement point inspection system, where the system includes a judging and storing module, a data analyzing module, and an outputting and highlighting module. The judging and storing module is used for judging the measuring points in the PCB and simultaneously storing the attribute information of the measuring points; the data analysis module of the measuring point attribute and the rule is used for determining whether the measuring point meets the test requirement; the output and highlighting module is used for outputting the measurement point information when the test requirement is not met, and marking the measurement points which are not met with the test requirement on the displayed cushion layer.
The specific implementation process and derivative manner of the above embodiments are all within the protection scope of the present application.
Corresponding to the method shown in fig. 1, the embodiment of the present application further provides a measurement point checking device, which is used for implementing the method shown in fig. 1, where the measurement point checking device provided in the embodiment of the present application may be applied to a computer terminal or various mobile devices, and the structural schematic diagram of the measurement point checking device is shown in fig. 6, and specifically includes:
an obtaining unit 601, configured to obtain attribute information of a solder joint in a PCB, where the PCB includes at least one solder joint;
an identifying unit 602, configured to identify a measurement point in the PCB based on the attribute information;
and the checking unit 603 is configured to check the measurement points in the PCB to obtain measurement points that do not meet the test requirement.
In the device provided by the embodiment of the application, before testing the testing point in the PCB, the testing point which can be tested in the PCB is required to be determined in advance. Firstly, obtaining attribute information of each welding spot in the PCB, and determining a measuring point to be tested in the PCB according to the attribute information. And then checking the measuring points to determine whether the measuring points meet the test requirements. If the measuring points meet the test requirements, the performance of the PCB can be tested according to each measuring point, otherwise, the PCB is characterized as an unqualified product currently.
By applying the device provided by the real-time example of the application, the measuring points can be checked before the measuring points are tested, the abnormal testing of the measuring points caused by the condition that the measuring points do not meet the testing requirements is avoided, and meanwhile, the measuring points which do not meet the testing requirements do not need to be found out manually, so that the testing efficiency of the PCB is improved.
In the device provided by the embodiment of the application, the PCB comprises at least one dot layer, and the dot layer comprises at least one welding spot;
the apparatus further comprises:
and the display unit is used for displaying the dot layer in the PCB.
The device provided by the embodiment of the application further comprises:
and the marking unit is used for marking the measuring points which do not meet the test requirement on the displayed point layer.
In the device provided by the embodiment of the present application, the obtaining unit 601 obtains the attribute information of the solder joint in the PCB, which is specifically used for:
acquiring first position information of welding spots in the PCB;
acquiring a point ID of the welding point based on the first position information;
and inquiring attribute information of welding spots in the PCB by applying the spot ID.
In the device provided by the embodiment of the present application, the identifying unit 602 identifies the measurement point in the PCB based on the attribute information, which is specifically configured to:
determining that the welding point with the point type being the measuring point type is the measuring point in the PCB based on the point type pointed by the attribute information of each welding point;
or,
and determining that the size of the bonding pad meets a preset size rule based on the size of the bonding pad and the package name contained in the attribute information of each bonding pad, wherein the bonding pad with the package name meeting the preset package rule is a measuring point.
In the device provided by the embodiment of the present application, the inspection unit 603 is configured to inspect a measurement point in the PCB, and is specifically configured to:
and checking the measuring points in the PCB in sequence according to the preset sequence of the measuring points in the PCB.
In the device provided by the embodiment of the present application, the inspection unit 603 is configured to inspect a measurement point in the PCB, and is specifically configured to:
obtaining at least one attribute parameter contained in the attribute information of the measuring point;
comparing the attribute parameters with standard attribute parameters;
under the condition that the attribute parameters are consistent with the standard attribute parameters, the measuring points meet the test requirements;
and under the condition that the attribute parameters are inconsistent with the standard attribute parameters, the measuring point does not meet the test requirements.
The device provided by the embodiment of the application further comprises:
the output unit is used for acquiring the measuring point information of the measuring points which do not meet the testing requirements in the PCB; and outputting the measuring point information.
The specific working process of each unit and subunit in the measuring point checking device disclosed in the above embodiment of the present application can be referred to the corresponding content in the measuring point checking method disclosed in the above embodiment of the present application, and will not be described herein again.
The embodiment of the application also provides a storage medium, which comprises stored instructions, wherein the equipment where the storage medium is located is controlled to execute the measuring point checking method when the instructions run.
The embodiment of the present application further provides an electronic device, whose structural schematic diagram is shown in fig. 7, specifically including a memory 701, and one or more instructions 702, where the one or more instructions 702 are stored in the memory 701, and configured to be executed by the one or more processors 703, where the one or more instructions 702 perform the following operations:
obtaining attribute information of welding spots in a PCB, wherein the PCB comprises at least one welding spot;
identifying a measurement point in the PCB based on the attribute information; the measuring points are welding points to be tested in the PCB;
and checking the measuring points in the PCB to obtain the measuring points which do not meet the test requirements.
In this specification, each embodiment is described in a progressive manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for a system or system embodiment, since it is substantially similar to a method embodiment, the description is relatively simple, with reference to the description of the method embodiment being made in part. The systems and system embodiments described above are merely illustrative, wherein the elements illustrated as separate elements may or may not be physically separate, and the elements shown as elements may or may not be physical elements, may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art will understand and implement the present application without undue burden.
Those of skill would further appreciate that the elements and algorithm steps of the examples described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both.
To clearly illustrate this interchangeability of hardware and software, various illustrative components and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A site inspection method comprising:
obtaining attribute information of welding spots in a PCB, wherein the PCB comprises at least one welding spot;
identifying a measurement point in the PCB based on the attribute information; the measuring points are welding points to be tested in the PCB;
and checking the measuring points in the PCB to obtain the measuring points which do not meet the test requirements.
2. The method of claim 1, the PCB comprising at least one dot layer comprising at least one solder joint;
the method further comprises the steps of:
displaying a dot layer in the PCB.
3. The method of claim 2, further comprising:
and marking the measuring points which do not meet the test requirements on the displayed point layer.
4. The method of claim 1, the obtaining attribute information of solder joints in a PCB, comprising:
acquiring first position information of welding spots in the PCB;
acquiring a point ID of the welding point based on the first position information;
and inquiring attribute information of welding spots in the PCB by applying the spot ID.
5. The method of claim 4, the identifying a station in the PCB based on the attribute information, comprising:
determining that the welding point with the point type being the measuring point type is the measuring point in the PCB based on the point type pointed by the attribute information of each welding point;
or,
and determining that the size of the bonding pad meets a preset size rule based on the size of the bonding pad and the package name contained in the attribute information of each bonding pad, wherein the bonding pad with the package name meeting the preset package rule is a measuring point.
6. The method of claim 1, the inspecting a station in the PCB comprising:
and checking the measuring points in the PCB in sequence according to the preset sequence of the measuring points in the PCB.
7. The method of claim 1, the inspecting a station in the PCB comprising:
obtaining at least one attribute parameter contained in the attribute information of the measuring point;
comparing the attribute parameters with standard attribute parameters;
under the condition that the attribute parameters are consistent with the standard attribute parameters, the measuring points meet the test requirements;
and under the condition that the attribute parameters are inconsistent with the standard attribute parameters, the measuring point does not meet the test requirements.
8. The method of any of claims 1-7, further comprising:
acquiring measurement point information of measurement points which do not meet the test requirements in the PCB;
and outputting the measuring point information.
9. A station inspection apparatus comprising:
the device comprises an acquisition unit, a processing unit and a processing unit, wherein the acquisition unit is used for acquiring attribute information of welding spots in a PCB, and the PCB comprises at least one welding spot;
an identifying unit for identifying the measuring points in the PCB based on the attribute information;
and the checking unit is used for checking the measuring points in the PCB to obtain the measuring points which do not meet the test requirement.
10. An electronic device comprising a memory, and one or more instructions, wherein the one or more instructions are stored in the memory and configured to perform the spot inspection method of any one of claims 1-8 by one or more processors.
CN202311090993.1A 2023-08-28 2023-08-28 Measuring point checking method and device and electronic equipment Pending CN117131836A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311090993.1A CN117131836A (en) 2023-08-28 2023-08-28 Measuring point checking method and device and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311090993.1A CN117131836A (en) 2023-08-28 2023-08-28 Measuring point checking method and device and electronic equipment

Publications (1)

Publication Number Publication Date
CN117131836A true CN117131836A (en) 2023-11-28

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Application Number Title Priority Date Filing Date
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Country Link
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