CN117129523A - Device and method for testing temperature of heat dissipation coating of integrated circuit - Google Patents
Device and method for testing temperature of heat dissipation coating of integrated circuit Download PDFInfo
- Publication number
- CN117129523A CN117129523A CN202311102513.9A CN202311102513A CN117129523A CN 117129523 A CN117129523 A CN 117129523A CN 202311102513 A CN202311102513 A CN 202311102513A CN 117129523 A CN117129523 A CN 117129523A
- Authority
- CN
- China
- Prior art keywords
- temperature
- cold
- rod
- heat
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 62
- 238000000576 coating method Methods 0.000 title claims abstract description 61
- 239000011248 coating agent Substances 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000012360 testing method Methods 0.000 title claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 31
- 230000004907 flux Effects 0.000 claims abstract description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 238000004364 calculation method Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000004590 computer program Methods 0.000 claims description 3
- 238000010998 test method Methods 0.000 claims description 3
- 238000000691 measurement method Methods 0.000 abstract description 3
- 238000005259 measurement Methods 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K3/00—Thermometers giving results other than momentary value of temperature
- G01K3/005—Circuits arrangements for indicating a predetermined temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
Abstract
The invention discloses a temperature testing device and a temperature testing method for an integrated circuit heat dissipation coating, and belongs to the field of integrated circuit heat dissipation. The temperature testing device comprises a measuring device and a temperature measuring device, wherein the measuring device comprises a cold rod end and a hot rod end, a microscopic infrared detector is arranged on the cold rod end, 5 thermocouples are arranged on the cold rod end and are respectively connected with a data acquisition device, and a microscopic infrared detector is also arranged on the top end of the cold rod and used for measuring the temperature of the top end of the cold rod. The invention provides a method for testing the interface temperature of an integrated circuit, which is based on a heat conduction theory, establishes a heat dissipation model and a measurement method of a heat dissipation coating material of the integrated circuit, and obtains the heat dissipation temperature and the heat flux density of the interface coating to represent the heat dissipation capacity.
Description
Technical Field
The invention belongs to the field of integrated circuit heat dissipation, and particularly relates to a device and a method for testing the temperature of a heat dissipation coating of an integrated circuit.
Background
In recent years, consumer electronics have evolved to be light, thin, high-performance, and multifunctional. The performance of electronic products is becoming more and more powerful, and the integration level and the packing density are continuously improved, resulting in the increase of the working power consumption and the heating value thereof. According to researches, the material failure of the electronic components caused by heat concentration accounts for 65% -80% of the total failure rate, and the thermal management technology is a key factor considered by electronic products. In addition, the functions integrated on the 5G-age electronic devices are gradually increased and complicated, and the volume of the devices is gradually reduced, so that higher requirements are placed on the thermal management technology of the electronic devices. Solving the heat dissipation problem of consumer electronics is one of the difficulties and emphasis of 5G era electronic devices.
The traditional thermal interface material has the defects of low heat conductivity, poor contact, easy aging, easy layering and the like. At present, a method for reducing heat of a contact surface is to fill a thermal interface material such as graphene, heat-conducting silicone grease, a phase-change material, a heat-conducting silica gel sheet and the like at a solid contact interface, wherein the materials are polymer materials with improved heat-conducting performance through adding heat-conducting particles. The graphite heat dissipation film is a brand new heat conduction and dissipation material, and has high heat conduction: a highest thermal conductivity 5300 w/m.k; high flexibility; the heat-conducting plate has unique grain orientation, is mainly used for uniformly conducting heat along two directions, can well adapt to any surface, shields heat sources and components, improves the performance of consumer electronic products, and is widely applied to intelligent terminal products such as mobile phones, computers and the like. Particularly in the semiconductor industry, the most effective method for reducing the interface thermal resistance is to add a thermal interface material such as filling an interface micro-gap, so that a low thermal resistance channel can be provided between two adjacent layers, the heat exchange efficiency inside the device is effectively improved, and the temperature is kept within an acceptable range. However, how to obtain accurate measurement of the heat dissipation of the coating between the electronic device interfaces is an urgent issue to be addressed.
Disclosure of Invention
In order to solve the above problems, the present invention provides a method for testing interface temperature of an integrated circuit, which is based on a heat conduction theory, to build a heat dissipation model and a measurement method of a heat dissipation coating material of the integrated circuit, so as to obtain a heat dissipation temperature and a heat flux density of the interface coating to characterize heat dissipation capability. The measuring method is simple and convenient to implement, and can effectively, accurately and quantitatively measure the heat conduction capacities of different coatings, films and various filling materials of interfaces in the integrated circuit, and accurately measure the heat dissipation temperature and the heat flux density of the interface materials.
In order to achieve the above purpose, the present invention is realized by adopting the following technical scheme: the temperature testing device comprises a cold rod end, a hot rod end, a data acquisition device, a power supply, a heater, a flowmeter, a cold water loop, a water pump and an infrared detector;
an infrared detector is arranged on the cold rod end, a plurality of thermocouples are arranged on the cold rod end and are respectively connected with a data acquisition device, and a microscopic infrared detector for measuring the temperature of the top end of the cold rod is also arranged on the top end of the cold rod;
the thermal rod is provided with a plurality of thermocouples which are respectively connected with the data acquisition device, and the bottom end of the thermal rod is provided with a heater for providing heating source load;
the heater is arranged at the bottom of the hot rod end, and a power supply is connected with the heater to supply power to the heater; a cold water loop is arranged in the cold rod end, and a flowmeter and a water pump are arranged on the cold water loop.
In yet another aspect, a method for testing the temperature of a heat sink coating of an integrated circuit, the method being suitable for use in the device, the method comprising
Measuring the temperature of the upper surface of the cold rod to be T1, and calculating the thermal conductivity of the cold rod;
calculating the temperature of the lower surface of the cold rod according to the thermal conductivity of the cold rod and the distance from the position of the middle thermocouple to the lower surface of the cold rod;
establishing a heat dissipation model of the heat bar, and calculating the temperature of the upper surface of the heat bar;
calculating the heat dissipation temperature and the heat flux density of the interface coating; the heat dissipation temperature and the heat flux density characterize the heat dissipation capacity of the heat dissipation interface of the integrated circuit.
Further, the method for calculating the thermal conductivity of the cold bar is realized by adopting the following steps: the temperature of the upper surface of the cold bar was measured as T1 using a microscopic infrared detector, and the thermal conductivity of the cold bar was as follows according to the fourier conduction law:
wherein T is 1 Is the temperature of the upper surface of the cold rod end, T 2 Is the temperature of the interface of the thermocouple in the middle of the cold rod, d 12 Is the distance from the upper surface of the cold rod to the middle thermocouple, d 2 The upper part is the distance from the middle thermocouple position of the cold rod to the lower surface of the cold rod;
further, the specific method for calculating the temperature of the lower surface of the cold bar is as follows: t is t 1 Measuring temperature, T for a single thermocouple at the interface of the thermocouple on the cold rod 2 The average value of the temperature of the thermocouple in the middle of the cold rod is obtained, and n is the number of thermocouples in the cold rod; according to the formula (1-2), the temperature T of the lower surface of the cold bar Upper part The method can obtain:
further, the specific method for establishing the heat dissipation model of the heat bar and calculating the temperature of the upper surface of the heat bar is as follows:
according to the heat conduction principle, a heat dissipation model of the heat bar is established as follows:
wherein T is 4 Is the temperature of the lower surface of the hot rod end, T 3 Is the temperature of the interface of the thermocouple in the middle of the hot rod, d 34 Is the distance from the lower surface of the hot rod to the middle thermocouple, d 3 below The distance from the thermocouple position in the middle of the hot rod to the upper surface of the hot rod;
t 1 ' temperature is measured by each thermocouple at interface of thermocouple on the hot rod, T 3 Is the average value of the temperature of the thermocouple in the middle of the hot rod, and n' is the number of thermocouples in the hot rod; according to the formula (4-5), the temperature T of the upper surface of the hot rod Lower part(s) The method comprises the following steps:
further, the interface coating heat dissipation temperature and heat flux density calculation method comprises the following steps: according to formulas (3) and (6), the calculated average of the lower surface of the cold bar and the upper surface of the hot bar is used as the coating temperature in the interface:
the heat flux density q through the interface coating was calculated according to fourier's law of thermal conductivity as:
wherein k is Coating Is the heat conductivity coefficient of the interface coating material of the integrated circuitTemperature gradient of topcoatCalculation was performed using a first order taylor expansion:
in the formula (8), d Up and down Thickness of interface coating material for integrated circuit; according to formulas (8) and (9), the interfacial coating heat flux q can be expressed as follows:
thus, the heat flux density of the integrated circuit heat sink interface material can be expressed as follows:
and (3) obtaining the heat dissipation temperature and the heat flux density of the integrated circuit heat dissipation interface material according to the formulas (7) and (11).
In yet another aspect, an electronic device includes a processor and a memory having stored thereon computer readable instructions that when executed by the processor implement the method for temperature testing an integrated circuit heat sink coating.
In another aspect, a computer storage medium has a computer program stored thereon, which when executed by a processor, implements a method for testing a temperature of a heat sink coating of an integrated circuit as described.
The invention has the beneficial effects that:
the invention provides a method for testing the interface temperature of an integrated circuit, which is based on a heat conduction theory, establishes a measuring device, establishes a heat dissipation model of a heat dissipation coating material of the integrated circuit and a measuring method, and obtains the heat dissipation temperature and the heat flux density of the interface coating to represent the heat dissipation capacity. The method provided by the invention can effectively detect the heat conduction capability of the coating or the material between interfaces of any two materials in the integrated circuit, the measurement accuracy can be effectively improved by adopting thermocouple multipoint measurement in the measurement process, the measurement method is simple and convenient to implement, and the heat conduction capability of different coatings, films and various filling materials of the interfaces in the integrated circuit can be effectively, accurately and quantitatively measured, and the heat dissipation temperature and the heat flux density of the interface material can be accurately measured.
Drawings
FIG. 1 is a flow chart of the method of the present invention;
FIG. 2 is a schematic diagram of the structure of the device of the present invention;
FIG. 3 is a schematic diagram of the device test of the present invention.
In the figure, a 1-cold rod end, a 2-hot rod end, a 3-data collector, a 4-power supply, a 5-heater, a 6-flowmeter, a 7-cold water loop, an 8-water pump and a 9-infrared detector are arranged.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. Exemplary embodiments of the present invention are illustrated in the accompanying drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
The conception in the invention is as follows: based on the heat conduction theory, a measuring device is established, the measuring device consists of a cold rod, a cold water loop 7, an infrared detector 9, a heater 5, a hot rod and a thermocouple, and a heat dissipation model and a measuring method of the integrated circuit heat dissipation coating material are established by measuring the infrared temperature of the upper surface of the cold rod, the thermocouple temperature of the cold rod, the heating temperature of the hot rod and the thermocouple temperature of the hot rod, so that the heat dissipation temperature and the heat flux density of the interface coating are obtained to represent heat dissipation capacity.
As shown in fig. 2, the temperature testing device comprises a cold rod end 1, a hot rod end 2, a data acquisition unit 3, a power supply 4, a heater 5, a flowmeter 6, a cold water loop 7, a water pump 8 and an infrared detector 9; an infrared detector 9 is arranged on the cold rod end 1, 5 thermocouples are arranged on the cold rod end 1 and are respectively connected with the data collector 3, and a microscopic infrared detector 9 for measuring the temperature of the top end of the cold rod is also arranged on the top end of the cold rod; the thermal rod is provided with 5 thermocouples which are respectively connected with the data collector 3, and the bottom end of the thermal rod end 2 is provided with a heater 5 for providing heating source load; the heater 5 is arranged at the bottom of the hot rod end 2, and the power supply 4 is connected with the heater 5 to supply power to the heater 5; a cold water loop 7 is arranged in the cold rod end 1, and a flowmeter 6 and a water pump 8 are arranged on the cold water loop 7.
The water pump 8 is turned on, so that cold water in the water pool takes away heat around the cold bar through the cold water loop 7 by the flowmeter 6, and the heat shield with the heat conductivity coefficient approximately close to 0 is placed outside the testing device, so that heat loss is minimized.
As shown in fig. 1, a temperature test method for heat dissipation coating of an integrated circuit is established, the method is suitable for the device, and the temperature test method comprises the following steps of
Measuring the temperature of the upper surface of the cold rod to be T1, and calculating the thermal conductivity of the cold rod;
the temperature of the upper surface of the cold bar was measured as T1 using a micro infrared detector 9, and the thermal conductivity of the cold bar was as follows according to the fourier conduction law:
wherein T is 1 Is the temperature of the upper surface of the cold bar end 1, T 2 Is the temperature of the interface of the thermocouple in the middle of the cold rod, d 12 Is the distance from the upper surface of the cold rod to the middle thermocouple, d 2 The upper part is the distance from the middle thermocouple position of the cold rod to the lower surface of the cold rod;
calculating the temperature of the lower surface of the cold rod according to the thermal conductivity of the cold rod and the distance from the position of the middle thermocouple to the lower surface of the cold rod;
the specific method for calculating the temperature of the lower surface of the cold bar is as follows: t is t 1 Measuring temperature, T for a single thermocouple at the interface of the thermocouple on the cold rod 2 The average value of the temperature of the thermocouple in the middle of the cold rod is obtained, and n is the number of thermocouples in the cold rod; according to the formula (1-2), the temperature T of the lower surface of the cold bar Upper part The method can obtain:
establishing a heat dissipation model of the heat bar, and calculating the temperature of the upper surface of the heat bar;
the specific method for establishing the heat dissipation model of the heat bar and calculating the temperature of the upper surface of the heat bar comprises the following steps: according to the heat conduction principle, a heat dissipation model of the heat bar is established as follows:
wherein T is 4 Is the temperature of the lower surface of the hot rod end 2, T 3 Is the temperature of the interface of the thermocouple in the middle of the hot rod, d 34 Is the distance from the lower surface of the hot rod to the middle thermocouple, d 3 below The distance from the thermocouple position in the middle of the hot rod to the upper surface of the hot rod;
t 1 ' temperature is measured by each thermocouple at interface of thermocouple on the hot rod, T 3 Is the average value of the temperature of the thermocouple in the middle of the hot rod, and n' is the number of thermocouples in the hot rod; according to the formula (4-5), the temperature T of the upper surface of the hot rod Lower part(s) The method comprises the following steps:
calculating the heat dissipation temperature and the heat flux density of the interface coating; the heat dissipation temperature and the heat flux density characterize the heat dissipation capacity of the heat dissipation interface of the integrated circuit.
The interface coating heat dissipation temperature and heat flux density calculation method comprises the following steps: according to formulas (3) and (6), the calculated average of the lower surface of the cold bar and the upper surface of the hot bar is used as the coating temperature in the interface:
the heat flux density q through the interface coating was calculated according to fourier's law of thermal conductivity as:
wherein k is Coating Thermal conductivity of interface coating material of integrated circuit, temperature gradient of interface coatingCalculation was performed using a first order taylor expansion:
in the formula (8), d Up and down Thickness of interface coating material for integrated circuit; according to formulas (8) and (9), the interfacial coating heat flux q can be expressed as follows:
thus, the heat flux density of the integrated circuit heat sink interface material can be expressed as follows:
and (3) obtaining the heat dissipation temperature and the heat flux density of the integrated circuit heat dissipation interface material according to the formulas (7) and (11). The heat dissipation capability of the heat dissipation interface of the integrated circuit can be characterized.
Example 1
As shown in FIG. 3, the measuring device is first turned on, and the temperature T of the upper surface of the cold bar end 1 is measured by the infrared detector 9 1 The temperature t of the middle 5 thermocouples of the cold bar was then recorded from the data collector 3 at 20.5 deg.c 1 ，t 1 ，t 1 ，t 1 And t 5 。
30.5 ℃,30.8 ℃,30.9 ℃,30.6 ℃,30.6 ℃ respectively, so that the average temperature of the cold rod middle thermocouple is 30.68 ℃. Distance d from upper surface of cold rod to middle thermocouple 12 Distance d from the middle thermocouple position of the cold rod to the lower surface of the cold rod is 40cm 2 on 40cm. According to the measurement result, the temperature-T of the lower surface of the cold bar Upper part Can be 40.86 ℃ according to the formula (12):
the temperature T of the lower surface of the heat bar end 2 is recorded by a heater 5 4 Measurement result t by hot bar interlayer thermocouple at 80 °c 1 ’,t 2 ’,t 3 ’,t 4 ’,t 5 ' 60.4 ℃,60.5 ℃,61.2 ℃,60.8 ℃,60.5 ℃ and 60.68 ℃ as the average temperature of the thermocouple in the middle layer of the hot rod. d, d 34 And d 3 below 40cm and 40cm respectively, and the temperature-T of the upper surface of the hot rod according to the data Lower part(s) From equation 13, 41.36℃can be obtained:
the coating temperature in the interface was 41.11 ℃ using the calculated average of the lower surface of the cold bar and the upper surface of the hot bar as the coating temperature according to formulas (12 and 13):
T coating layer ＝(T Upper part +T Lower part(s) )/2＝(41.36℃+40.86℃)/2＝41.11℃ (14)
Thermal conductivity k of integrated circuit interface coating material Coating 1000mm 2 /s，d Up and down For a thickness of 0.001mm of the integrated circuit interface coating material, the integrated circuit interface coating heat flux density q is according to formulas (12, 14) and data:
thus, the heat dissipation temperature and the heat flux density of the integrated circuit interface material can be obtained.
Those skilled in the art will appreciate that implementing all or part of the above-described methods in accordance with the embodiments may be accomplished by way of a computer program stored on a computer readable storage medium, which when executed may comprise the steps of the embodiments of the methods described above. The storage medium may be a magnetic disk, an optical disk, a read-only memory (ReadOnlyMemory, ROM) or a random access memory (RandomABBessMemory, RAM).
It should be understood that the detailed description of the technical solution of the present invention, given by way of preferred embodiments, is illustrative and not restrictive. Modifications of the technical solutions described in the embodiments or equivalent substitutions of some technical features thereof may be performed by those skilled in the art on the basis of the present description; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. The utility model provides a be used for integrated circuit heat dissipation coating temperature testing arrangement which characterized in that: the temperature testing device comprises a cold rod end (1), a hot rod end (2), a data collector (3), a power supply (4), a heater (5), a flowmeter (6), a cold water loop (7), a water pump (8) and an infrared detector (9);
an infrared detector (9) is arranged on the cold rod end (1), a plurality of thermocouples are arranged on the cold rod end (1) and are respectively connected with the data collector (3), and a microscopic infrared detector (9) for measuring the temperature of the top end of the cold rod is also arranged on the top end of the cold rod;
the thermal rod end (2) is provided with a plurality of thermocouples which are respectively connected with the data acquisition device (3), the bottom end of the thermal rod end (2) is provided with a heater (5) for providing heating source load, and the power supply (4) is connected with the heater (5);
a cold water loop (7) is arranged in the cold rod end (1), and a flowmeter (6) and a water pump (8) are arranged on the cold water loop (7).
2. A method for testing the temperature of a heat sink coating for an integrated circuit, said method being adapted to the apparatus of claim 1, wherein: the temperature test method comprises the following steps of
Measuring the temperature of the upper surface of the cold bar, and calculating the thermal conductivity of the cold bar;
calculating the temperature of the lower surface of the cold rod according to the thermal conductivity of the cold rod and the distance from the position of the middle thermocouple to the lower surface of the cold rod;
establishing a heat dissipation model of the heat bar, and calculating the temperature of the upper surface of the heat bar;
calculating the heat dissipation temperature and the heat flux density of the interface coating; the heat dissipation temperature and the heat flux density characterize the heat dissipation capacity of the heat dissipation interface of the integrated circuit.
3. A method for testing the temperature of a heat sink coating for an integrated circuit according to claim 2, wherein: the method for calculating the thermal conductivity of the cold rod is realized by adopting the following steps: the temperature of the upper surface of the cold bar was measured as T1 using a micro infrared detector 9, and the thermal conductivity of the cold bar was as follows according to the fourier conduction law:
wherein T is 1 Is the temperature of the upper surface of the cold bar end 1, T 2 Is the temperature of the interface of the thermocouple in the middle of the cold rod, d 12 Is the distance from the upper surface of the cold rod to the middle thermocouple, d 2 The upper part is the distance from the middle thermocouple position of the cold rod to the lower surface of the cold rod;
4. a method for testing the temperature of a heat sink coating for an integrated circuit according to claim 2, wherein: the specific method for calculating the temperature of the lower surface of the cold bar is as follows: t is t 1 Measuring temperature, T for a single thermocouple at the interface of the thermocouple on the cold rod 2 The average value of the temperature of the thermocouple in the middle of the cold rod is obtained, and n is the number of thermocouples in the cold rod; according to the formula (1-2), the temperature T of the lower surface of the cold bar Upper part The method can obtain:
5. a method for testing the temperature of a heat sink coating for an integrated circuit according to claim 2, wherein: the specific method for establishing the heat dissipation model of the heat bar and calculating the temperature of the upper surface of the heat bar comprises the following steps:
according to the heat conduction principle, a heat dissipation model of the heat bar is established as follows:
wherein T is 4 Is the temperature of the lower surface of the hot rod end 2, T 3 Is the temperature of the interface of the thermocouple in the middle of the hot rod, d 34 Is the distance from the lower surface of the hot rod to the middle thermocouple, d 3 below The distance from the thermocouple position in the middle of the hot rod to the upper surface of the hot rod;
t 1 ' temperature is measured by each thermocouple at interface of thermocouple on the hot rod, T 3 Is the average value of the temperature of the thermocouple in the middle of the hot rod, and n' is the number of thermocouples in the hot rod; according to the formula (4-5), the temperature T of the upper surface of the hot rod Lower part(s) The method comprises the following steps:
6. a method for testing the temperature of a heat sink coating for an integrated circuit according to claim 2, wherein: the interface coating heat dissipation temperature and heat flux density calculation method comprises the following steps: according to formulas (3) and (6), the calculated average of the lower surface of the cold bar and the upper surface of the hot bar is used as the coating temperature in the interface:
the heat flux density q through the interface coating was calculated according to fourier's law of thermal conductivity as:
wherein k is Coating Thermal conductivity of interface coating material of integrated circuit, temperature gradient of interface coatingCalculation was performed using a first order taylor expansion:
in the formula (8), d Up and down Thickness of interface coating material for integrated circuit; according to formulas (8) and (9), the interfacial coating heat flux q can be expressed as follows:
thus, the heat flux density of the integrated circuit heat sink interface material can be expressed as follows:
and (3) obtaining the heat dissipation temperature and the heat flux density of the integrated circuit heat dissipation interface material according to the formulas (7) and (11).
7. A device for testing the temperature of a heat sink coating for an integrated circuit according to claim 1, wherein: the hot rod end 2 is provided with 5 thermocouples, and the cold rod end 1 is provided with 5 thermocouples.
8. An electronic device, characterized in that: comprising a processor and a memory having stored thereon computer readable instructions which when executed by the processor implement a method for temperature testing of heat sink coatings for integrated circuits as claimed in any one of claims 2 to 6.
9. A computer storage medium, characterized by: a computer program stored thereon, which when executed by a processor, implements a method for testing the temperature of a heat sink coating for an integrated circuit according to any one of claims 2 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311102513.9A CN117129523A (en) | 2023-08-29 | 2023-08-29 | Device and method for testing temperature of heat dissipation coating of integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311102513.9A CN117129523A (en) | 2023-08-29 | 2023-08-29 | Device and method for testing temperature of heat dissipation coating of integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117129523A true CN117129523A (en) | 2023-11-28 |
Family
ID=88859548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311102513.9A Pending CN117129523A (en) | 2023-08-29 | 2023-08-29 | Device and method for testing temperature of heat dissipation coating of integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117129523A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050058178A1 (en) * | 2003-09-11 | 2005-03-17 | Shih Chih C. | Thermal interface material characterizing system |
| CN102297877A (en) * | 2011-05-27 | 2011-12-28 | 上海大学 | Device and method for measuring thermoelectric parameters of film |
| CN102768225A (en) * | 2012-08-07 | 2012-11-07 | 南京理工大学 | High-accuracy method for testing thermal interface material |
| CN105572162A (en) * | 2015-12-17 | 2016-05-11 | 北京航空航天大学 | Thermal contact resistance testing equipment with compensation heating system and thermal insulation system |
| CN109839406A (en) * | 2019-03-27 | 2019-06-04 | 桂林电子科技大学 | A kind of high precision measurement method of interface contact heat resistance |
| CN109991266A (en) * | 2019-03-22 | 2019-07-09 | 上海工程技术大学 | The laser of interface heat exchange coefficient and material thermal conductivity heats measuring device and method |
-
2023
- 2023-08-29 CN CN202311102513.9A patent/CN117129523A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050058178A1 (en) * | 2003-09-11 | 2005-03-17 | Shih Chih C. | Thermal interface material characterizing system |
| CN102297877A (en) * | 2011-05-27 | 2011-12-28 | 上海大学 | Device and method for measuring thermoelectric parameters of film |
| CN102768225A (en) * | 2012-08-07 | 2012-11-07 | 南京理工大学 | High-accuracy method for testing thermal interface material |
| CN105572162A (en) * | 2015-12-17 | 2016-05-11 | 北京航空航天大学 | Thermal contact resistance testing equipment with compensation heating system and thermal insulation system |
| CN109991266A (en) * | 2019-03-22 | 2019-07-09 | 上海工程技术大学 | The laser of interface heat exchange coefficient and material thermal conductivity heats measuring device and method |
| CN109839406A (en) * | 2019-03-27 | 2019-06-04 | 桂林电子科技大学 | A kind of high precision measurement method of interface contact heat resistance |
Non-Patent Citations (3)
| Title |
|---|
| 杜涛 等: "双碳背景下能源与动力工程综合实验", 31 July 2022, 冶金工业出版社, pages: 57 - 59 * |
| 毛爱华 等: "一种测定材料导热系数实验仪器的研制", 大学物理实验, vol. 36, no. 1, 28 February 2023 (2023-02-28), pages 95 - 98 * |
| 谢明君 等: "３种常用热界面材料的接触热阻压力实验研究", 桂林电子科技大学学报, vol. 40, no. 4, 31 August 2020 (2020-08-31), pages 362 - 365 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Mahdavi et al. | Experimental study of the thermal characteristics of a heat pipe | |
| Hosseinzadeh et al. | Optimization and parametric analysis of a nanofluid based photovoltaic thermal system: 3D numerical model with experimental validation | |
| Shih et al. | Height effect on heat-transfer characteristics of aluminum-foam heat sinks | |
| CN107688039B (en) | System and method for testing heat conductivity coefficient and interface thermal resistance of sheet material | |
| US20070006995A1 (en) | Device for testing heat conduction performance of heat pipe | |
| CN106407608A (en) | Steady state junction temperature prediction model of crimping IGBT module considering thermal coupling | |
| Li et al. | Analysis of heat transfer performance and vapor–liquid meniscus shape of ultra-thin vapor chamber with supporting columns | |
| CN208334251U (en) | A kind of heat dissipation index measurement device | |
| Zhu et al. | Experimental and numerical investigation of the melting process of aluminum foam/paraffin composite with low porosity | |
| Zhang et al. | Experimental investigation of heat and mass transfer in a LiBr-H2O solution falling film absorber on horizontal tubes: Comprehensive effects of tube types and surfactants | |
| TW202125289A (en) | Thermal diffusivity performance measuring system and method | |
| Wang et al. | Experimental investigation of the thermal performance of a heat sink with U-shaped heat pipes | |
| Zhu et al. | Thermal performance revival of composite PCM for hybrid BTMSs by architecture and formula integrated optimization | |
| CN108195879A (en) | The method that Transient Method measures material thermal conductivity and thermal diffusion coefficient | |
| Xie et al. | An experimental investigation on a novel high-performance integrated heat pipe–heat sink for high-flux chip cooling | |
| Yu et al. | Solar thermal power generation characteristics based on metal foam and phase change materials doped with nanoparticles | |
| Yu et al. | Photothermal and thermoelectric performance of PCMs doped with nanoparticles and metal foam | |
| He et al. | Heat transfer performance analysis of an ultra-thin aluminum vapor chamber with serrated microgrooves | |
| CN211978736U (en) | Device for measuring heat conductivity coefficient of composite phase change material by steady state method | |
| CN108387601B (en) | Device and method for measuring thermal resistance of high-heat-conducting-piece-metal heat sink interface | |
| Mudhafar et al. | Optimization of Pool Boiling Heat Transfer on microporous metal coating surfaces with FC-72 as a working fluid | |
| Yang et al. | Experimental investigation on the heat transfer behavior of water in offset strip fin channels | |
| Wang et al. | Experimental study on the thermal performance of a liquid-cooled heat sink integrating heat pipes for dual CPU servers | |
| Liu et al. | Experimental study on thermosyphon for shipboard high-power electronics cooling system | |
| CN117129523A (en) | Device and method for testing temperature of heat dissipation coating of integrated circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |