CN117129113A

CN117129113A - Sensor and preparation method thereof

Info

Publication number: CN117129113A
Application number: CN202210545355.3A
Authority: CN
Inventors: 袁永帅; 黄雨佳; 齐心; 廖风云
Original assignee: Shenzhen Voxtech Co Ltd
Current assignee: Shenzhen Voxtech Co Ltd
Priority date: 2022-05-19
Filing date: 2022-05-19
Publication date: 2023-11-28

Abstract

The present specification relates to a sensor comprising a base layer and an electrode layer, wherein the base layer is configured to deform under an external force; the electrode layer is disposed on the base layer, a crack structure is disposed in the electrode layer, and deformation of the base layer changes a size of the crack structure, thereby changing a resistance of the electrode layer and generating a sensing signal that varies with the resistance.

Description

Sensor and preparation method thereof

Technical Field

The application relates to the technical field of sensing, in particular to a sensor and a preparation method thereof.

Background

Piezoresistive pressure sensors are the primary form of pressure sensor. The sensitivity of the piezoresistive sensor is mainly determined by the piezoresistive coefficient of the material, but the size of the piezoresistive coefficient is often limited by factors such as the material, the process and the like, and is difficult to be greatly improved. Therefore, it is necessary to provide a sensor that can escape from the limitations of materials and processes and improve the sensitivity of the device from the standpoint of structural design.

Disclosure of Invention

Embodiments of the present specification provide a sensor comprising: a base layer configured to deform under an external force; and an electrode layer disposed on the base layer, the electrode layer having a crack structure disposed therein, deformation of the base layer changing a size of the crack structure, thereby changing a resistance of the electrode layer and generating a sensing signal that varies with the resistance.

In some embodiments, the substrate layer extends along a first direction, and the crack structure includes a plurality of sub-cracks spaced apart along the first direction.

In some embodiments, the substrate layer extends along a first direction, the crack structure includes a plurality of sub-cracks spaced apart along the second direction, each sub-crack of the plurality of sub-cracks extends along the first direction, and the second direction is perpendicular to the first direction.

In some embodiments, the crack structure further comprises a plurality of sub-cracks distributed along the first direction.

In some embodiments, the plurality of sub-cracks are unevenly distributed in the first direction.

In some embodiments, the total number of the plurality of sub-cracks is in the range of 10 to 10000.

In some embodiments, the base layer has a beam-like or plate-like structure, and the first direction is a length direction of the base layer.

In some embodiments, the base layer has a circular film-like structure, the first direction being a radial direction of the base layer.

In some embodiments, each of the partial sub-cracks has a varying width in its direction of extension.

In some embodiments, each of the partial sub-cracks has a width in the range of 100 nanometers to 3 microns.

In some embodiments, the ratio of the maximum width of each of the partial sub-cracks to the length of the substrate layer is less than or equal to the tensile strain of the substrate layer during the manufacturing process.

In some embodiments, the electrode layer is electrically connected to two output terminals, and an angle between a line connecting the two output terminals and an extension direction of the sub-crack is in a range of 80 degrees to 100 degrees.

In some embodiments, each of the partial sub-cracks is curved in its direction of extension.

In some embodiments, the resistance of the electrode layer varies non-linearly with the size of the crack structure.

In some embodiments, the electrode layer comprises a material having a first young's modulus, the base layer comprises a material having a second young's modulus, and the second young's modulus is no more than 1/10 of the first young's modulus.

In some embodiments, the thickness ratio of the electrode layer to the base layer is in the range of 1:20 to 1:2.

The embodiment of the specification provides a preparation method of a sensor, which comprises the following steps: securing the substrate layer material in a contractible state on the substrate; depositing an electrode layer on the base layer material; patterning the electrode layer such that a crack structure is formed in the electrode layer; and performing shrinkage treatment on the substrate layer to reduce the size of the crack structure in the electrode layer.

The embodiment of the specification provides a preparation method of a sensor, which comprises the following steps: securing the substrate layer material in an extensible state to the substrate; depositing an electrode layer on the base layer material; and stretching the substrate layer to form a crack structure in the electrode layer.

The embodiment of the specification provides a preparation method of a sensor, which comprises the following steps: fixing the base layer material on the base; depositing an electrode layer on the base layer material; patterning the electrode layer such that a crack structure is formed in the electrode layer.

Drawings

The application will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. The embodiments are not limiting, in which like numerals represent like structures, wherein:

FIG. 1 is a schematic illustration of the actual contact surface of two electrode layers shown in accordance with some embodiments of the present description;

FIG. 2 is an exemplary frame diagram of a sensor shown in accordance with some embodiments of the present description;

FIG. 3A is a top view of an exemplary sensor shown according to some embodiments of the present description;

FIG. 3B is a front view of an exemplary sensor shown according to some embodiments of the present description;

FIG. 3C is an isometric view of an exemplary sensor shown in accordance with some embodiments of the present disclosure;

FIG. 4A is a graph of resistance change of a sensor at different crack contact areas according to some embodiments of the present disclosure;

FIG. 4B is a graph of resistance change of a sensor for different numbers of crack structures shown in accordance with some embodiments of the present disclosure;

FIG. 5 is an exemplary flow chart of a method of making a sensor according to some embodiments of the present disclosure;

FIG. 6 is an exemplary flow chart of a method of making a sensor according to some embodiments of the present disclosure;

FIG. 7 is a top view of an exemplary electrode layer shown according to some embodiments of the present description;

fig. 8 is an exemplary flow chart of a method of making a sensor according to some embodiments of the present description.

Detailed Description

In order to more clearly illustrate the technical solution of the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is apparent that the drawings in the following description are only some examples or embodiments of the present application, and it is apparent to those of ordinary skill in the art that the present application may be applied to other similar situations according to the drawings without inventive effort. Unless otherwise apparent from the context of the language or otherwise specified, like reference numerals in the figures refer to like structures or operations.

It will be appreciated that "system," "apparatus," "unit" and/or "module" as used herein is one method for distinguishing between different components, elements, parts, portions or assemblies of different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.

As used in the specification and in the claims, the terms "a," "an," "the," and/or "the" are not specific to a singular, but may include a plurality, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus.

A flowchart is used in the present application to describe the operations performed by a system according to embodiments of the present application. It should be appreciated that the preceding or following operations are not necessarily performed in order precisely. Rather, the steps may be processed in reverse order or simultaneously. Also, other operations may be added to or removed from these processes.

Embodiments of the present specification provide a sensor. In some embodiments, the sensor may include a base layer and an electrode layer. Wherein the electrode layer is arranged on the substrate layer, and a crack structure is arranged in the electrode layer. In some embodiments, the base layer may be configured to deform under an external force, thereby causing deformation of a crack structure disposed in an electrode layer disposed thereon, changing the size of the crack structure, thereby changing the resistance of the electrode layer and generating a sensing signal that varies with the resistance. Based on this, by disposing the crack structure in the electrode layer or the base layer, when the base layer is subjected to tensile or compressive deformation, the crack structure contact surfaces are in contact with each other, and even very minute deformation causes the contact resistances of the crack structure contact surfaces to be superimposed cumulatively, thereby amplifying the minute deformation in the sensor. Further, by designing the size, position, shape and number of the crack structures in the sensor, the structures can be utilized most efficiently, and the accumulation effect of the resistance can be improved; and meanwhile, the position and crystal orientation of the sensor, which are easy to break, can be avoided, and the reliability reduction caused by stress concentration is reduced. In addition, the shape and the size of the crack structure can be designed, so that the contact surface of the crack structure can generate gradient change along with the deformation of the structure, the gradient of the resistance along with the deformation can be controlled, and the quality of an output signal can be improved.

The contact resistance of the electrode layers in contact with each other will be described below taking an example in which two electrode layers are in contact with each other. Fig. 1 is a schematic illustration of the actual contact surface of two electrode layers according to some embodiments of the present description. In some embodiments, the two electrode layers are in contact with each other, and the actual contact surface is smaller than the theoretical contact surface. As shown in fig. 1, the difference between the theoretical contact surface and the actual contact surface can be several thousand times depending on the degree of surface smoothness and the magnitude of the contact pressure. In some embodiments, the actual contact surface may be divided into two parts: firstly, the metal-metal direct contact part in the electrode layer is a contact micro-point without transition resistance between metals; and secondly, the contact portions are contacted with each other through nonmetallic substances (such as film pollutants formed on the contact surface of the electrode layer) on the contact interface of the electrode layer.

In some embodiments, the resistance exhibited by the current lines as they contract (or concentrate) as they pass through the actual contact surface in the electrode layer may be referred to as the concentrated resistance. The resistance formed by the contact film layer and the film layer formed by other contaminants can be referred to as the film layer resistance. The resistance of the conductor in the electrode layer may be referred to as the conductor resistance. Thus, the actual total contact resistance R of the contact surface of the two electrode layers can be divided into three parts: the concentrated resistance RC, the film resistance Rf, and the conductor resistance Rp are shown as follows:

R＝R _C +R _f +R _p ＝R _j +R _p (1)，

Wherein, the resistor R is concentrated _C Adding a film resistor R _f Can be referred to as the true contact resistance R _j 。

In some embodiments, the conductor resistance R in the electrode layer _p Is made of conductor material,Length, thickness (cross-sectional area) and use temperature. For example, the conductor resistance Rp may be determined according to equation (2):

wherein ρ is resistivity, which is a parameter describing the conductivity properties, and is related to temperature; l is the conductor length and S is the conductor cross-sectional area.

In some embodiments, the actual contact resistance R _j Can be determined according to formula (3):

wherein K is a constant related to the contact material, the contact surface condition, and the contact surface processing method; f is the contact pressure, and m is a constant related to the contact form. For example, for point contacts, the constant m may be in the range of 0.5 to 0.7; for another example, for a face contact, the constant m may be equal to 1. In some embodiments, the true contact resistance R may be calculated by measuring the contact voltage drop _j . From equations (1) - (3), the actual total contact resistance between the electrode layers is related to the actual contact surface. In some embodiments, the actual contact surface between the electrode layers may be affected by parameters such as the ratio of the base layer to the electrode layer thickness, the size, shape, distribution, and number of crack structures between the electrode layers, and the like. Therefore, the actual total contact resistance between the electrode layers can be adjusted by adjusting parameters such as the ratio of the substrate layer to the electrode layer thickness, the size, shape, distribution, number and the like of crack structures between the electrode layers.

Fig. 2 is an exemplary frame diagram of a sensor 200 according to some embodiments of the present description.

The sensor 200 may be a component having a piezoresistive effect. For example, when the sensor is subjected to stress, the resistance of the sensor 200 changes due to the change in stress, and the sensor 200 may generate an electrical signal based on the change in resistance. As shown in fig. 2, sensor 200 may include a base layer 210 and an electrode layer 220.

In some embodiments, substrate layer 210 may be configured to deform under an external force. In some embodiments, in order to allow the substrate layer 210 to deform in an appropriate amount under the action of an external force, the young's modulus of the material of the substrate layer 210 may be set within a certain range. In some embodiments, the Young's modulus of the material of substrate layer 210 may be in the range of 1kPa to 50 GPa. For example, the Young's modulus of the material of base layer 210 may be in the range of 100kPa to 20GPa, and for another example, the Young's modulus of the material of base layer 210 may be in the range of 500kPa to 5 GPa. In some embodiments, the material of base layer 210 may be a flexible material. For example, the material of the base layer 210 may include Polyimide (PI), polydimethylsiloxane (PDMS), polymethyl methacrylate (PMMA), etc., or any combination thereof. In some embodiments, the material of base layer 210 may cause base layer 210 to shrink in a stretched state, perpendicular to the direction of stretching. For example, the material of the base layer 210 may be a poisson's ratio positive material. Exemplary positive poisson's ratio materials may include Polyimide (PI), polydimethylsiloxane (PDMS), polymethyl methacrylate (PMMA), and the like, or any combination thereof. In some embodiments, the material of base layer 210 may deform base layer 210 in an elongated (or expanded) state, perpendicular to the direction of elongation. For example, the material of the base layer 210 may include a negative poisson's ratio material. Exemplary negative poisson ratio materials may include negative poisson ratio metamaterials and the like.

In some embodiments, substrate layer 210 may be a structure that extends toward a particular direction (e.g., a first direction). For example, substrate layer 210 may be a beam-like structure and the first direction may be a length direction of substrate layer 210 (i.e., a long axis direction of the beam-like structure). For another example, substrate layer 210 may be a plate-like structure, and the first direction may be a longitudinal direction of substrate layer 210 (i.e., a long axis direction of the plate-like structure). For another example, substrate layer 210 may be a circular film-like structure and the first direction may be a radial direction of substrate layer 210 (i.e., a radial direction of the circular film-like structure).

In some embodiments, electrode layer 220 may be disposed on substrate layer 210 and configured to transmit electrical signals. In some embodiments, a crack structure may be disposed in the electrode layer 220. The crack structure may be distributed on a surface opposite the contact surface, extending or not extending to the contact surface. The contact surface refers to the contact surface of the electrode layer 220 with the base layer 210. In some embodiments, deformation of the base layer 210 may change the size of the crack structure on the electrode layer 220, thereby changing the electrical resistance of the electrode layer 220. In some embodiments, sensor 200 may generate a sensing signal that varies with the resistance. The dimensions of the crack structure described herein may refer to the projected area of the crack structure on the surface of the electrode layer 220 (i.e., the surface of the electrode layer 220 opposite the contact surface of the substrate layer 210).

In some embodiments, electrode layer 220 may be a conductive device that conveys electrical signals. In some embodiments, the material of the electrode layer 220 may be a conductive material. Exemplary conductive materials may include copper (Cu), platinum (Pt), iron (Fe), carbon (C), graphite, and the like, or any combination thereof.

In some embodiments, the Young's modulus of the material of the electrode layer 220 may affect the ease with which the contact surface of the crack structure closes and opens. In some embodiments, the Young's modulus of the material of electrode layer 220 may be in the range of 10GPa to 350GPa in order that deformation of substrate layer 210 may change the size of the crack structures on electrode layer 220. For example, the Young's modulus of the material of the electrode layer 220 may be in the range of 30GPa to 320 GPa. For another example, the Young's modulus of the material of the electrode layer 220 may be in the range of 50GPa to 300 GPa.

In some embodiments, the material of electrode layer 220 may be different from the material of base layer 210. For example, the electrode layer 220 may include a material having a first young's modulus, and the base layer 210 may include a material having a second young's modulus. In some embodiments, the second young's modulus may be less than the first young's modulus. For example, the second Young's modulus may not exceed 1/4 of the first Young's modulus. For another example, the second Young's modulus may not exceed 1/5 of the first Young's modulus. For another example, the second Young's modulus may not exceed 1/10 of the first Young's modulus.

In some embodiments, the crack structure may be the sum of all crack structures on the electrode layer 220. In some embodiments, the crack structure may include a plurality of sub-cracks. In some embodiments, the plurality of sub-cracks may be distributed on the electrode layer 220 on a surface opposite the contact surface, extending or not extending to the contact surface. In some embodiments, the plurality of sub-cracks may be spaced apart. In some embodiments, the crack structure may include a plurality of sub-cracks spaced along a particular direction (e.g., a first direction, a second direction). As described above, when the base layer 210 is a beam-like structure or a plate-like structure, the first direction may be a length direction (i.e., a long axis direction) of the base layer 210.

In some embodiments, the crack structure may include a plurality of sub-cracks spaced apart along the length (i.e., long axis) of the substrate layer 210. For another example, when the base layer 210 is a circular film-like structure, the first direction may be a radial direction of the base layer 210, and the crack structure may include a plurality of sub-cracks spaced apart along the radial direction of the base layer 210. In some embodiments, the sub-cracks in the crack structure may extend in a second direction. In some embodiments, when the base layer 210 is a beam-like structure or a plate-like structure, the second direction may be a width direction (i.e., a short axis direction) of the base layer 210, and the sub-cracks in the crack structure may extend along the width direction of the base layer 210. For another example, when the base layer 210 is a circular film-like structure, the second direction may be along the circumferential direction of the base layer 210, and the sub-cracks in the crack structure may extend along the circumferential direction of the base layer 210. For example only, where the crack structures are spaced apart along the length of substrate layer 210 and extend along the width of substrate layer 210, deformation (e.g., tensile deformation or compressive deformation) of substrate layer 210 in the length direction may change the width of the crack structure, thereby changing the size of the crack structure and changing the electrical resistance of electrode layer 220.

In some embodiments, when substrate layer 210 is a beam-like structure or a plate-like structure, the crack structure may include a plurality of sub-cracks spaced apart along the second direction (i.e., the width direction or the short axis direction) of substrate layer 210, and the plurality of sub-cracks may extend along the first direction (i.e., the length direction or the long axis direction). In some embodiments, when the substrate layer 210 is a circular film-like structure, the crack structure may include a plurality of sub-cracks spaced apart along the second direction (i.e., circumferential direction) of the substrate layer 210, which may extend in the first direction (i.e., radial direction). For example only, in the case where the crack structures are spaced apart along the width direction of the base layer 210 and extend along the length direction of the base layer 210, deformation (e.g., tensile deformation or compressive deformation) of the base layer 210 in the length direction may cause the base layer 210 to also deform in the width direction, thereby changing the width of the crack structure and changing the resistance of the electrode layer 220. As described above, when the base layer 210 is in a stretched state in the longitudinal direction, expansion or contraction deformation may occur in the width direction thereof. In the case where expansion deformation also occurs in the width direction (for example, the base layer 210 is made of a negative poisson's ratio material), the crack structure is pressed, the width of the crack structure is reduced accordingly, and the resistance of the electrode layer 220 is reduced accordingly; in the case where shrinkage deformation occurs in the width direction, the width of the crack structure increases accordingly, and thus the resistance of the electrode layer 220 increases.

In some embodiments, the crack structure may include an array of sub-cracks spaced apart along the first and second directions of the substrate layer, respectively, and the plurality of sub-cracks may extend along the first direction. Exemplary sub-crack structures and arrangements may be found in fig. 3A-3C and fig. 7 of the present specification and related description.

In some embodiments, the plurality of sub-cracks may be uniformly distributed in the first direction or the second direction. For example, the spacing between each two adjacent sub-cracks of the plurality of sub-cracks along the first direction or the second direction may be the same. The spacing of adjacent two sub-cracks may refer to the distance between the centers of the adjacent two sub-cracks. In some embodiments, the sub-crack center may refer to a center of a line connecting two intersections of a projected shape of the sub-crack on the surface of the electrode layer 220 and a central axis of the base layer 210 (a central axis of the base layer 210 perpendicular to the second direction). In some embodiments, the sub-crack center may refer to the geometric center of the projected shape of the sub-crack at the surface of the electrode layer 220. In some embodiments, the plurality of sub-cracks may be unevenly distributed in the first direction or the second direction. For example, in some embodiments, the stress may be different at different locations on the base layer 210. When the base layer 210 is fixed to other components (e.g., vibration components providing external force), the base layer 210 has different stresses in the region near the fixed end, the region near the free end, and the intermediate region other than the two regions. For example, the stress is greater in the region near the fixed end than in the region near the free end (or intermediate region). In some embodiments, to reduce the risk of fracture of the more stressed region due to stress concentrations, the reliability of the sensor 200 is improved, and the spacing of adjacent two of the plurality of sub-cracks may be greater than the spacing of adjacent two of the plurality of sub-cracks on the more stressed region (e.g., the region near the fixed end). In some embodiments, the plurality of sub-cracks may be distributed at unequal intervals over a region of greater stress (e.g., a region near the fixed end); the plurality of sub-cracks may be equally spaced over a less stressed region (e.g., a region near the free end or an intermediate region). In some embodiments, the sub-cracks in the more stressed areas are more prone to deformation than the sub-cracks in the less stressed areas, the change in resistance is more pronounced, and the rate of change in the generated sensing signal is greater. In some embodiments, in order to make the rate of change of the sensing signal generated by the small deformation more pronounced, so that the sensing signal is measured, the degree of deformation of the sub-cracks in the region of greater stress may be further increased, and thus, the spacing between two adjacent sub-cracks in the plurality of sub-cracks in the region of greater stress may be smaller than the spacing between two adjacent sub-cracks in the region of lesser stress (i.e., the sub-cracks in the region of greater stress are more densely arranged than the sub-cracks in the region of lesser stress). In some embodiments, a plurality of adjacent two sub-cracks may be equally spaced over a region of greater stress (e.g., a region near the fixed end); on areas of lesser stress (e.g., areas near the free ends or intermediate areas), a plurality of adjacent two sub-cracks may be distributed at unequal intervals. It should be understood that the plurality of sub-cracks are distributed on the electrode layer 220, and the more or less stressed regions of the substrate layer 210 described in this specification refer to the corresponding regions on the electrode layer 220 corresponding to the regions.

In some embodiments, the plurality of sub-cracks may be distributed over the entire surface of the electrode layer 220. In some embodiments, the plurality of sub-cracks may be distributed over only a partial area of the surface. For example, to reduce the risk of fracture of the more stressed region due to stress concentration, to improve the reliability of the sensor 200, the plurality of sub-cracks may not be distributed over the more stressed region (e.g., the region near the fixed end); the plurality of sub-cracks may be distributed in a less stressed region (e.g., a region near the free end).

In some embodiments, the plurality of sub-cracks may be one or more of straight lines, broken lines, circular arcs, or other curves, etc. along their extension. For example, when the plurality of sub-cracks extend in the first direction, the plurality of sub-cracks may be one or more of straight lines, broken lines, circular arcs, or other curves, etc. in the first direction. For another example, when the plurality of sub-cracks extend in the second direction, the plurality of sub-cracks may be one or more of straight lines, broken lines, circular arcs, or other curved lines, etc. in the second direction. In some embodiments, the shape of each sub-crack of the plurality of sub-crack midsection molecular cracks along its direction of extension may be the same or different. In some embodiments, to reduce the risk of fracture of the more stressed region due to stress concentrations, the shape of the sub-crack along its direction of extension may be a curve or a broken line on the more stressed region (e.g., the region near the fixed end); on the region where the stress is smaller (for example, the region near the free end or the intermediate region), the shape of the sub-crack in the extending direction thereof may be a straight line. In some embodiments, in order to make the change rate of the sensing signal generated by small deformation more obvious, so that the sensing signal is measured, the deformation degree of the sub-crack in the area with larger stress can be further increased, and therefore, on the area with larger stress (for example, the area near the fixed end), the shape of the sub-crack along the extending direction of the sub-crack can be a straight line; on the areas of lesser stress (e.g., areas near the free ends or intermediate areas), the shape of the sub-crack along its extension may be a curve or a broken line.

In some embodiments, a length of each of the plurality of sub-cracks in the extension direction thereof may be equal to a length of the electrode layer 220 at a corresponding position in the extension direction. For example, for a beam-like or plate-like structure, when a plurality of sub-cracks extend in the second direction, the length of the electrode layer 220 at corresponding positions in the second direction is the width of the electrode layer 220, i.e., in the second direction, the plurality of sub-cracks may extend through the entire electrode layer 220. When a plurality of sub-cracks extend in the first direction, the length of the electrode layer 220 at corresponding positions in the first direction is the length of the electrode layer 220, i.e., in the first direction, the plurality of sub-cracks may extend through the entire electrode layer 220. For another example, for a circular film structure, when a plurality of sub-cracks extend in the second direction, the length of the electrode layer 220 at corresponding positions in the second direction is the circumference of the electrode layer 220, i.e., in the second direction, the plurality of sub-cracks may extend through the entire electrode layer 220. When a plurality of sub-cracks extend in the first direction, the length of the electrode layer 220 at corresponding positions in the first direction is the radius length of the electrode layer 220, i.e., in the first direction, the plurality of sub-cracks may extend transversely throughout the entire electrode layer 220. In some embodiments, each of the plurality of sub-cracks may have a length in the direction of its extension that is less than a length in the direction of extension of the electrode layer 220 at the corresponding location. In some embodiments, a length of a molecular crack in a middle portion of the plurality of sub-cracks in the extending direction thereof may be equal to a length of the electrode layer 220 at a corresponding position in the extending direction, and a length of the remaining sub-cracks in the extending direction thereof may be smaller than a length of the electrode layer 220 at the corresponding position in the extending direction. For example, in order to reduce the risk of breakage of the region where the stress is large due to stress concentration, on the region where the stress is large (for example, the region near the fixed end), the length of the sub-crack in the extending direction thereof may be smaller than the length of the electrode layer 220 at the corresponding position in the extending direction; on the region where the stress is smaller (for example, a region near the free end or an intermediate region), the length of the sub-crack in the extending direction thereof may be equal to the length of the electrode layer 220 at the corresponding position in the extending direction. In some embodiments, in order to make the rate of change of the sensing signal generated by the small deformation more remarkable, so that the sensing signal is measured, the degree of deformation of the sub-crack in the region of greater stress may be further increased, and thus, on the region of greater stress (for example, the region near the fixed end), the length of the sub-crack in the extending direction thereof may be equal to the length of the electrode layer 220 at the corresponding position in the extending direction thereof; on the region where the stress is smaller (for example, a region near the free end or an intermediate region), the length of the sub-crack in the extending direction thereof may be smaller than the length of the electrode layer 220 at the corresponding position in the extending direction.

In some embodiments, the width of each of the plurality of sub-cracks may be the same. In the present specification, when the plurality of sub-cracks extend in the second direction, the width of the sub-crack may refer to the width of the projection of the sub-crack on the electrode layer 220 in the first direction; when the plurality of sub-cracks extend in the first direction, the width of the sub-crack may refer to the width of the projection of the sub-crack on the electrode layer 220 in the second direction. In some embodiments, each sub-crack may have a varying width in its direction of extension, so a comparison of widths between different sub-cracks in this specification refers to a comparison of the maximum values of the projected widths of each sub-crack. In some embodiments, the width of each sub-crack in the plurality of sub-crack midsection molecular cracks may also be unequal in their direction of extension. In some embodiments, to reduce the risk of fracture of the more stressed region due to overstressing, the width of the sub-crack may be smaller on the more stressed region (e.g., the region near the fixed end) than on the less stressed region (e.g., the region near the free end or the middle region). In some embodiments, to make the rate of change of the sensing signal generated by small deformations more pronounced, so that the sensing signal is measured, the degree of deformation of the sub-cracks in the more stressed region may be further increased, and thus, the width of the sub-cracks may be greater in the more stressed region (e.g., the region near the fixed end) than in the less stressed region (e.g., the region near the free end or the middle region).

In some embodiments, each of the partial sub-cracks may have the same width in the direction of its extension. In some embodiments, to ensure that the contact surfaces of the sub-cracks do not simultaneously break away from contact as substrate layer 210 is stretch deformed, but rather the contact pressure gradually decreases as the tensile strain increases, the contact surfaces gradually break away from contact, ensuring that the contact resistance of the sub-crack contact surfaces gradually changes, each of the partial sub-cracks may have a varying width in the direction in which it extends. For example, when the sub-cracks extend in the second direction, the width of each sub-crack may be maximum at one end point, gradually decrease in the extending direction of the sub-crack, minimum at the central axis of the base layer 210 (the central axis of the base layer 210 perpendicular to the second direction), and gradually increase to be maximum at the other end point. For another example, when the sub-cracks extend in the second direction, the width of each sub-crack may be smallest at one end point, gradually increasing in the extending direction of the sub-crack (i.e., the second direction), largest at the central axis of the base layer 210 (the central axis of the base layer 210 perpendicular to the second direction), and gradually decreasing to smallest at the other end point. For another example, when the sub-cracks extend in the first direction, the width of each sub-crack may be greatest at one end point, gradually decrease in the direction of extension of the sub-crack, and gradually decrease to the smallest at the central axis of the base layer 210 (the central axis of the base layer 210 perpendicular to the first direction), and gradually increase to the greatest at the other end point. As another example, each sub-crack may have other regular or irregular shapes as long as it may have a varying width in its direction of extension.

In some embodiments, the width of each of the partial sub-cracks may be in the range of 10 nanometers to 10 microns, taking into account the manufacturing process and the deformation limit of substrate layer 210. For example, the width of each of the partial sub-cracks may be in the range of 50 nanometers to 5 microns. For example, the width of each of the partial sub-cracks may be in the range of 100 nanometers to 3 microns.

In some embodiments, to ensure that the sub-cracks can close after removal of the tensile stress during fabrication of base layer 210, the resistance of electrode layer 220 may be further modified by the sub-cracks under deformation of base layer 210, and the ratio of the maximum width of each of the partial sub-cracks to the length of base layer 210 may be less than or equal to the tensile strain of base layer 210 during fabrication. For example, the ratio of the maximum width of each of the plurality of sub-cracks to the length of substrate layer 210 may be less than or equal to the tensile strain of substrate layer 210 during fabrication. For another example, the ratio of the maximum width of each of the plurality of sub-cracks to the length of the base layer 210 may be less than or equal to the tensile strain of the base layer 210 during the manufacturing process, and the ratio of the maximum width of each of the remaining sub-cracks to the length of the base layer 210 may be greater than the tensile strain, so long as the presence of a sub-crack capable of closing on the electrode layer 220 is ensured, the electrical resistance of the electrode layer 220 may be further changed.

In some embodiments, the number of the plurality of sub-cracks may be determined according to a required amount of resistance change. In some embodiments, the greater the number of sub-cracks, the greater the amount of resistance change of the electrode layer 220. When the total number of sub-cracks of the crack structure 230 is too large, the reliability of the electrode layer 220 may be reduced, noise may be increased, and even breakage of the electrode layer 220 may be caused. In some embodiments, to reduce the risk of fracture of the more stressed region due to stress concentrations and reduce noise, the number density of sub-cracks on the more stressed region (e.g., the region near the fixed end) may be less than the number density of sub-cracks on the less stressed region (e.g., the region near the free end or the middle region). The number density of sub-cracks in the present specification may be a ratio of the number of sub-cracks in one region on the electrode layer 220 to the length of the region in the first direction. In some embodiments, to make the amount of change in resistance of the electrode layer 220 large enough to detect the sensing signal, the number density of sub-cracks may be greater than or equal to the number density of sub-cracks on areas of greater stress (e.g., areas near the fixed end) than on areas of lesser stress (e.g., areas near the free end or the middle area). In some embodiments, the number of the plurality of sub-cracks may be in the range of 5 to 1000000 in order to balance factors such as resistance variation, reliability, and noise. For example, the number of the plurality of sub-cracks may be in the range of 7 to 500000. For another example, the number of the plurality of sub-cracks may be in the range of 8 to 50000. For another example, the total number of the plurality of sub-cracks is in the range of 10 to 10000.

In some embodiments, the thickness of electrode layer 220 and substrate layer 210 may determine how easily the contact surface of the sub-crack closes and opens. In some embodiments, to facilitate the closure of the sub-cracks during the fabrication of substrate layer 210 and the opening of the sub-cracks under the deformation of substrate layer 210, the thickness ratio of substrate layer 210 to electrode layer 220 may be in the range of 1:1 to 100:1. For example, the thickness ratio of base layer 210 to electrode layer 220 may be in the range of 2:1 to 50:1. For another example, the thickness ratio of base layer 210 to electrode layer 220 may be in the range of 2:1 to 20:1.

In some embodiments, the electrode layer 220 may be electrically connected to two output terminals to output the sensing signal varying with resistance. In some embodiments, the manner of electrical connection includes, but is not limited to, leads, coatings, and the like. The connection of the two outputs may be used to indicate the direction of current flow in the electrode layer 220. In some embodiments, there may be an angle between the connection of the two outputs (i.e., the direction of current flow in electrode layer 220) and the direction of propagation of the sub-crack. For example, the angle between the line connecting the two output ends and the extension direction of the sub-crack is in the range of 80 degrees to 100 degrees. For another example, the angle between the line of the two output terminals and the extension direction of the sub-crack may be 90 degrees, i.e., the line of the two output terminals (i.e., the current direction in the electrode layer 220) is perpendicular to the extension direction of the sub-crack. For example, when the plurality of sub-cracks extend in the second direction, the connection lines of the two output terminals (i.e., the current direction in the electrode layer 220) are parallel to the first direction and perpendicular to the second direction. For another example, when the plurality of sub-cracks extend in the first direction, the connection lines of the two output terminals (i.e., the current direction in the electrode layer 220) are parallel to the second direction and perpendicular to the first direction.

Some embodiments of the present disclosure characterize by a large electrical signal variation by arranging a crack structure comprising a plurality of sub-cracks in the electrode layer 220, and by the deformation of the base layer 210 changing the dimensions of the crack structure, thereby bringing the contact surfaces between the sub-cracks into contact with each other, even with very small deformations, resulting in a cumulative superposition of contact resistances of the contact surfaces of the large number of sub-cracks.

Fig. 3A is a top view of an exemplary sensor 200 shown according to some embodiments of the present description. Fig. 3B is a front view of an exemplary sensor 200 shown according to some embodiments of the present description. Fig. 3C is an isometric view of an exemplary sensor 200 shown according to some embodiments of the present disclosure.

As illustrated in fig. 2, substrate layer 210 may have a variety of structures, and for illustrative purposes, fig. 3A-3C will be described with respect to a beam-like structure of substrate layer 210 of sensor 200. The first direction is the longitudinal direction (i.e., the long axis direction) of the base layer 210, and the second direction is the width direction (i.e., the short axis direction) of the base layer 210. As shown in fig. 3A-3C, electrode layer 220 is disposed on substrate layer 210, and substrate layer 210 may extend toward a first direction. The electrode layer 220 has a crack structure 230 disposed therein. The crack structure 230 may include a plurality of sub-cracks, such as sub-crack 230-1, sub-crack 230-2, etc., spaced apart along the first direction. The plurality of sub-cracks may be uniformly distributed in the first direction. The spacing between two adjacent sub-cracks (the distance between the centers of the adjacent two sub-cracks) in the first direction is the same. As shown in FIG. 3A, a first spacing d between two adjacent sub-cracks along the first direction ₁ Equal to a first distance d between two other sub-cracks along the first direction ₂ . The sub-crack center refers to the center of the line connecting two intersections of the projected shape of the sub-crack on the surface of the electrode layer 220 and the central axis of the base layer 210 (the central axis of the base layer 210 perpendicular to the second direction). Each of the plurality of sub-cracks (e.g., sub-crack 230-1 or sub-crack 230-2) may extend in a second directionThe plurality of sub-cracks (e.g., sub-crack 230-1 or sub-crack 230-2) may be curved along the direction of extension thereof (i.e., the second direction). As shown in FIG. 3A, the length L of the plurality of sub-cracks (e.g., sub-crack 230-1 or sub-crack 230-2) in the direction of extension thereof (i.e., the second direction) _lw May be equal to the length L of the electrode layer 220 at the corresponding position in the second direction _dj I.e. the plurality of sub-cracks may extend transversely throughout the electrode layer 220. In some embodiments, the width of each sub-crack of the plurality of sub-crack midsection molecular cracks along the first direction may not be equal. FIG. 3A shows the width W of the sub-crack 230-1 in the first direction ₁ And the width W of the sub-crack 230-2 in the first direction ₂ May not be equal. For example, the width W of the sub-crack 230-1 in the first direction near the end 320 of the sensor 200 ₁ May be greater than the width W of the sub-crack 230-2 in the first direction near the other end 330 of the sensor 200 ₂ . In some embodiments, a sub-crack (e.g., sub-crack 230-1 or sub-crack 230-2) may have a varying width along the first direction in its direction of extension (i.e., the second direction). As shown in fig. 3A and 3C, taking the sub-crack 230-1 as an example, the width of the sub-crack 230-1 may be greatest at one end 2311, gradually decrease in the extension direction (i.e., the second direction) of the sub-crack, and then gradually decrease to the smallest at the central axis 310 of the base layer 210 (the central axis of the base layer 210 perpendicular to the second direction), and then gradually increase to the greatest at the other end 2312. It should be understood that the sensor 200 shown in fig. 3A-3C is only an example and is not intended to limit the scope of the present disclosure.

As shown in sensor 200 of fig. 3A-3C, the sub-crack extends in a second direction, and when base layer 210 is stretch deformed in a first direction, the width of the sub-crack (e.g., sub-crack 230-1 or sub-crack 230-2) in crack structure 230 changes in the first direction, resulting in a change in the size of the crack structure, thereby changing the electrical resistance of electrode layer 220 and producing a sensing signal that varies with the electrical resistance.

FIG. 4A is a graph of resistance change of a sensor at different crack contact areas according to some embodiments of the present disclosure. FIG. 4B is a graph of resistance change of a sensor for different numbers of crack structures, according to some embodiments of the present disclosure. Wherein the abscissa may represent the size of the crack structure in square millimeters; the ordinate indicates the resistance of the sensor in ohms; n in fig. 4B may represent the total number of sub-cracks, in units of one. In some embodiments, the area of the crack contact surface is inversely proportional to the crack structure size. For example, the larger the size of the crack structure, the smaller the area of the crack contact surface. Therefore, the resistance change of the sensor under the areas of different crack contact surfaces can reflect the resistance change of the sensor under different crack structure sizes.

As shown in fig. 4A, the resistance of the sensor 200 gradually decreases as the crack contact area increases, while ensuring that other conditions (e.g., number of sub-cracks, shape, position, etc.) are unchanged. The resistance of the sensor 200 (or electrode layer 220) varies non-linearly with the size of the crack structure or crack contact area. As shown in FIG. 4A, each crack contact area increases by 0.5X10 ^-5 The crack structure decreases in size as the square millimeter, and the rate of change of the resistance of the sensor 200 is progressively smaller (i.e., the curve is progressively flatter and the slope is progressively smaller). Crack contact area is 1×10 ^-5 Square millimeter increases to 5 x 10 ^-5 The size of the crack structure decreases accordingly, from about 0.58 ohms to about 0.24 ohms for the sensor 200. It follows that the amount of change in resistance of the sensor 200 is on the order of ohms. If a voltage on the order of millivolts is applied, the current in the circuit may be on the order of milliamperes, while the operating current of sensor 200 is on the order of hundred microamperes, so that a sensor 200 designed in accordance with some embodiments of the present disclosure may effectively detect a sensing signal resulting from a change in resistance. In addition, the sensor signal may be adjusted by increasing or decreasing the size of the crack structure.

When the number of sub-cracks in the crack structure is changed, namely, the total number of sub-cracks is n=16, n=30, n=40, and the resistance change curve of the sensor at different crack structure sizes is shown in fig. 4B. As can be seen from each curve, similar to fig. 4A, the resistance of the sensor 200 (or electrode layer 220) varies non-linearly with the size of the crack structure. From a comparison of the three curves, the resistance of the sensor gradually increases as the number of sub-cracks n increases when the crack contact area (or the size of the crack structure) is the same. When the number n of sub-cracks increases from 16 to 40, the resistance of the sensor 200 increases from about 0.6 ohms to about 0.95 ohms. It can be seen that the change amount of the resistance of the sensor 200 is in the ohmic level, and the sensing signal generated by the resistance change can be effectively measured; moreover, the sensor signal may be adjusted by increasing or decreasing the number of sub-cracks.

Fig. 5 is an exemplary flow chart of a method 500 of manufacturing a sensor according to some embodiments of the present disclosure. As shown in fig. 5, the process 500 includes the steps of:

at step 510, the substrate layer material in a shrinkable state is secured to the substrate. In some embodiments, the base layer material may be secured to the base after stretching. In some embodiments, a shrinkable substrate material may be secured to the substrate under certain process conditions (e.g., extrusion, reduced temperature, etc.).

In some embodiments, the base layer material may have a young's modulus. In some embodiments, the Young's modulus of the base layer material may be in the range of 1kPa to 50 GPa. For example, the Young's modulus of the base layer material may be in the range of 100kPa to 20GPa, and for another example, the Young's modulus of the base layer material may be in the range of 500kPa to 5 GPa. In some embodiments, the base layer material may be a flexible material. For example, the base layer material may include Polyimide (PI), polydimethylsiloxane (PDMS), polymethyl methacrylate (PMMA), or the like, or any combination thereof.

In some embodiments, the substrate may refer to a mold used in constructing the substrate layer. In some embodiments, the substrate may be determined based on the structure of the substrate layer. For example, if the structure of the base layer is a plate-like structure, the base needs to select a mold that can make the finished product a plate-like structure.

An electrode layer is deposited on the base layer material, step 520.

In some embodiments, deposition may be performed in a variety of ways, e.g., magnetron sputtering, MOCVD, etc. In some embodiments, an electrode layer may also be affixed to the base layer material. In the process of pasting, various glues such as acrylic ester glue, composite structural glue, high polymer glue and the like can be used. In some embodiments, the material of the electrode layer may be a conductive material. Exemplary conductive materials may include copper (Cu), platinum (Pt), iron (Fe), carbon (C), graphite, and the like, or any combination thereof. In some embodiments, to facilitate the closure of the sub-cracks during the preparation of the base layer and the opening of the sub-cracks under the deformation of the base layer, the thickness ratio of the base layer to the electrode layer may be in the range of 1:1 to 100:1. For example, the thickness ratio of the base layer to the electrode layer may be in the range of 2:1 to 50:1. For another example, the thickness ratio of the base layer to the electrode layer may be in the range of 2:1 to 20:1.

At step 530, the electrode layer is patterned such that a crack structure is formed in the electrode layer.

In some embodiments, patterning may refer to a process that relies on a series of masking and etching steps to print a pattern. Patterning may include, but is not limited to, photolithography, etching, and the like. For more description of crack structure see fig. 2 and its associated description.

In step 540, the base layer is subjected to a shrink treatment to reduce the size of the crack structure in the electrode layer.

The shrinkage process may refer to a related operation capable of making the size of the object smaller. In some embodiments, the base layer material may be shrunk under certain process conditions (e.g., extrusion, reduced temperature, etc.) to reduce the size of the crack structure in the electrode layer. In some embodiments, the tensile stress in step 510 may be removed to allow the base layer to shrink, which in turn may reduce the size of the crack structure in the electrode layer. In some embodiments, to ensure that the sub-cracks can close after removal of the tensile stress during the preparation of the substrate layer, the ratio of the maximum width of each of the partial sub-cracks to the length of the substrate layer may be less than or equal to the tensile strain of the substrate layer pre-applied in step 510 during patterning of the electrode layer. For example, the ratio of the maximum width of each of the plurality of sub-cracks to the length of the substrate layer may be less than or equal to the tensile strain of the substrate layer pre-applied in step 510.

Fig. 6 is an exemplary flow chart of a method 600 of manufacturing a sensor according to some embodiments of the present disclosure. As shown in fig. 6, the process 600 includes the steps of:

At 610, the base layer material in an extensible state is secured to the base. In some embodiments, the base layer material may be shrunk and then secured to the base. In some embodiments, an extensible substrate material may be secured to the substrate under certain process conditions (e.g., stretching, increasing temperature, etc.).

At step 620, an electrode layer is deposited on the base layer material. In some embodiments, the electrode layer may have different thicknesses at different locations in the first direction (e.g., the length direction or the radial direction of the base layer) in order to form crack structures at thinner thickness locations or to more easily increase the size of crack structures relative to thicker locations during subsequent elongation processes. The description of step 620 may be found in the relevant description of step 520 of fig. 5 in this specification, and will not be described here.

And 630, stretching the substrate layer to form a crack structure in the electrode layer.

The elongation process may refer to a related operation capable of making the size of the object large. In some embodiments, the base layer material may be elongated under certain process conditions (e.g., stretching, increasing temperature, etc.) to form a crack structure in the electrode layer. In some embodiments, the shrinkage stress in step 610 may be removed to allow the base layer to elongate, which may form a crack structure in the electrode layer.

In some embodiments, to avoid stress concentrations resulting from stretching of the crack structure, which in turn may cause damage to sensor 200, the sub-cracks in the crack structure may stretch in the direction of extension of substrate layer 210, i.e., the sub-cracks extend in the same direction as the extension of substrate layer 210.

Fig. 7 is a top view of an exemplary electrode layer 220 shown in accordance with some embodiments of the present description. In some embodiments, base layer 210 may have a different structure, and for illustrative purposes, fig. 7 will be described using base layer 210 of sensor 200 as a beam-like structure. The first direction is the longitudinal direction (i.e., the long axis direction) of the base layer 210, and the second direction is the width direction (i.e., the short axis direction) of the base layer 210. Electrode layer 220 is disposed on substrate layer 210, and substrate layer 210 may extend toward the first direction. The electrode layer 220 has a crack structure 230 disposed therein. In some embodiments, the crack structure 230 may include a plurality of sub-cracks spaced apart along the first direction and/or the second direction. For example, as shown in fig. 7, the crack structure 230 may include a plurality of sub-cracks, such as sub-crack 230-1, sub-crack 230-2, etc., spaced apart along the first direction and the second direction, respectively. The plurality of sub-cracks may be uniformly distributed in the first direction and/or the second direction. In some embodiments, the spacing between two adjacent sub-cracks (the distance between the centers of the adjacent two sub-cracks) in the first direction (or second direction) may be the same. As shown in fig. 7, the spacing between two adjacent sub-cracks along the first direction may be the same. In some embodiments, the sub-crack center may refer to the geometric center of the projected shape of the sub-crack at the surface of the electrode layer 220. In some embodiments, as shown in FIG. 7, each of the plurality of sub-cracks (e.g., sub-crack 230-1 or sub-crack 230-2) may extend in a first direction, and the plurality of sub-cracks (e.g., sub-crack 230-1 or sub-crack 230-2) may be linear along its direction of extension (i.e., the first direction). In some embodiments, the length of the plurality of sub-cracks (e.g., sub-crack 230-1 or sub-crack 230-2) in the extending direction thereof (i.e., the first direction) may be equal to the length of the electrode layer 220 at the corresponding position in the first direction, i.e., the plurality of sub-cracks may extend through the entire electrode layer 220. In some embodiments, the length of the plurality of sub-cracks (e.g., sub-crack 230-1 or sub-crack 230-2) in the extending direction thereof (i.e., the first direction) may be smaller than the length of the electrode layer 220 at the corresponding position in the first direction. As shown in fig. 7, a plurality of sub-cracks may be distributed in the first direction of the electrode layer 220, and each sub-crack may have a length in the first direction smaller than that of the electrode layer 220. In some embodiments, the width of each sub-crack of the plurality of sub-crack midsection molecular cracks along the second direction may or may not be equal. As shown in fig. 7, the width of the sub-crack 230-1 in the second direction and the width of the sub-crack 230-2 in the second direction may be equal. In some embodiments, the sub-crack (e.g., sub-crack 230-1 or sub-crack 230-2) may have the same or varying width along the second direction in its direction of extension (i.e., the first direction). As shown in fig. 7, taking the sub-crack 230-1 as an example, the width of the sub-crack 230-1 along the second direction may be the same. It should be understood that the electrode layer 220 shown in fig. 7 is only an example and does not limit the protection scope of the present disclosure.

In some embodiments, sensor 200 including electrode layer 220 shown in fig. 7 may be made using a negative poisson's ratio material. As shown in fig. 7, the sub-cracks extend in a first direction, and when the base layer 210 is deformed in a tensile manner in the first direction, the material of the base layer 210 expands in a second direction, and the sub-cracks (e.g., sub-crack 230-1 or sub-crack 230-2) in the crack structure 230 are pressed together, resulting in a reduction in the size of the crack structure, thereby changing the electrical resistance of the electrode layer 220 and generating a sensing signal that varies with the electrical resistance.

Fig. 8 is an exemplary flow chart of a method 800 of manufacturing a sensor according to some embodiments of the present description. As shown in fig. 8, the process 800 includes the steps of:

at step 810, a base layer material is secured to a substrate.

In some embodiments, the base layer material may be a material having a negative poisson's ratio.

Step 820, depositing an electrode layer on the base layer material.

At step 830, the electrode layer is patterned such that a crack structure is formed in the electrode layer. The descriptions of steps 820 and 830 may be referred to in the present specification as related descriptions of steps 520 and 530 of fig. 5, and will not be described here.

In some embodiments, a material of negative poisson's ratio undergoes elongation (or expansion) deformation perpendicular to the direction of elongation during the tensile deformation, and thus, no deformation (e.g., elongation or contraction) of the substrate layer is required during the manufacturing process.

While the basic concepts have been described above, it will be apparent to those skilled in the art that the foregoing detailed disclosure is by way of example only and is not intended to be limiting. Although not explicitly described herein, various modifications, improvements and adaptations of the application may occur to one skilled in the art. Such modifications, improvements, and modifications are intended to be suggested within the present disclosure, and therefore, such modifications, improvements, and adaptations are intended to be within the spirit and scope of the exemplary embodiments of the present disclosure.

Meanwhile, the present application uses specific words to describe embodiments of the present application. Reference to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic is associated with at least one embodiment of the application. Thus, it should be emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various positions in this specification are not necessarily referring to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of the application may be combined as suitable.

Furthermore, those skilled in the art will appreciate that the various aspects of the application are illustrated and described in the context of a number of patentable categories or circumstances, including any novel and useful procedures, machines, products, or materials, or any novel and useful modifications thereof. Accordingly, aspects of the application may be performed entirely by hardware, entirely by software (including firmware, resident software, micro-code, etc.) or by a combination of hardware and software. The above hardware or software may be referred to as a "data block," module, "" engine, "" unit, "" component, "or" system. Furthermore, aspects of the application may take the form of a computer product, comprising computer-readable program code, embodied in one or more computer-readable media.

The computer storage medium may contain a propagated data signal with the computer program code embodied therein, for example, on a baseband or as part of a carrier wave. The propagated signal may take on a variety of forms, including electro-magnetic, optical, etc., or any suitable combination thereof. A computer storage medium may be any computer readable medium that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. Program code located on a computer storage medium may be propagated through any suitable medium, including radio, cable, fiber optic cable, RF, or the like, or a combination of any of the foregoing.

The computer program code necessary for operation of portions of the present application may be written in any one or more programming languages, including an object oriented programming language such as Java, scala, smalltalk, eiffel, JADE, emerald, C ++, c#, vb net, python, etc., a conventional programming language such as C language, visual Basic, fortran 2003, perl, COBOL 2002, PHP, ABAP, dynamic programming languages such as Python, ruby and Groovy, or other programming languages, etc. The program code may execute entirely on the user's computer or as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the latter scenario, the remote computer may be connected to the user's computer through any form of network, such as a Local Area Network (LAN) or a Wide Area Network (WAN), or the connection may be made to an external computer (for example, through the Internet), or the use of services such as software as a service (SaaS) in a cloud computing environment.

Furthermore, the order in which the elements and sequences are presented, the use of numerical letters, or other designations are used in the application is not intended to limit the sequence of the processes and methods unless specifically recited in the claims. While certain presently useful inventive embodiments have been discussed in the foregoing disclosure, by way of example, it is to be understood that such details are merely illustrative and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover all modifications and equivalent arrangements included within the spirit and scope of the embodiments of the application. For example, while the system components described above may be implemented by hardware devices, they may also be implemented solely by software solutions, such as installing the described system on an existing server or mobile device.

Similarly, it should be noted that in order to simplify the description of the present disclosure and thereby aid in understanding one or more inventive embodiments, various features are sometimes grouped together in a single embodiment, figure, or description thereof. This method of disclosure, however, is not intended to imply that more features than are required by the subject application. Indeed, less than all of the features of a single embodiment disclosed above.

In some embodiments, numbers describing the components, number of attributes are used, it being understood that such numbers being used in the description of embodiments are modified in some examples by the modifier "about," approximately, "or" substantially. Unless otherwise indicated, "about," "approximately," or "substantially" indicate that the number allows for a 20% variation. Accordingly, in some embodiments, numerical parameters set forth in the specification and claims are approximations that may vary depending upon the desired properties sought to be obtained by the individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and employ a method for preserving the general number of digits. Although the numerical ranges and parameters set forth herein are approximations in some embodiments for use in determining the breadth of the range, in particular embodiments, the numerical values set forth herein are as precisely as possible.

Each patent, patent application publication, and other material, such as articles, books, specifications, publications, documents, etc., cited herein is hereby incorporated by reference in its entirety. Except for the application history file that is inconsistent or conflicting with this disclosure, the file (currently or later attached to this disclosure) that limits the broadest scope of the claims of this disclosure is also excluded. It is noted that the description, definition, and/or use of the term in the appended claims controls the description, definition, and/or use of the term in this application if there is a discrepancy or conflict between the description, definition, and/or use of the term in the appended claims.

Finally, it should be understood that the embodiments described herein are merely illustrative of the principles of the embodiments of the present application. Other variations are also possible within the scope of the application. Thus, by way of example, and not limitation, alternative configurations of embodiments of the application may be considered in keeping with the teachings of the application. Accordingly, the embodiments of the present application are not limited to the embodiments explicitly described and depicted herein.

Claims

1. A sensor, comprising:

a base layer configured to deform under an external force; and

An electrode layer disposed on the base layer, the electrode layer having a crack structure disposed therein, deformation of the base layer changing a size of the crack structure, thereby changing a resistance of the electrode layer and generating a sensing signal that varies with the resistance.

2. The sensor of claim 1, wherein the substrate layer extends along a first direction, the crack structure comprising a plurality of sub-cracks spaced apart along the first direction.

3. The sensor of claim 1, wherein the substrate layer extends along a first direction, the crack structure comprises a plurality of sub-cracks spaced apart along the second direction, each sub-crack of the plurality of sub-cracks extends along the first direction, and the second direction is perpendicular to the first direction.

4. The sensor of claim 3, wherein the crack structure further comprises a plurality of sub-cracks distributed along the first direction.

5. The sensor of claim 2, wherein the plurality of sub-cracks are unevenly distributed in the first direction.

6. The sensor of claim 2, wherein the base layer has a beam-like or plate-like structure and the first direction is a length direction of the base layer.

7. The sensor of claim 2, wherein the base layer has a circular film-like structure, the first direction being a radial direction of the base layer.

8. The sensor of claim 2, wherein each of the partial sub-cracks has a varying width in a direction of extension thereof.

9. The sensor of claim 2, wherein the electrode layer is electrically connected to two output terminals, and an angle between a line connecting the two output terminals and an extension direction of the sub-crack is in a range of 80 degrees to 100 degrees.

10. The sensor of claim 2, wherein each of the partial sub-cracks is curved in its direction of extension.

11. A method of manufacturing a sensor, comprising:

securing the substrate layer material in a contractible state on the substrate;

depositing an electrode layer on the base layer material;

patterning the electrode layer such that a crack structure is formed in the electrode layer; and

and performing shrinkage treatment on the substrate layer to reduce the size of the crack structure in the electrode layer.

12. A method of manufacturing a sensor, comprising:

securing the substrate layer material in an extensible state to the substrate;

Depositing an electrode layer on the base layer material; and

and (3) stretching the substrate layer to form a crack structure in the electrode layer.

13. A method of manufacturing a sensor, comprising:

fixing the base layer material on the base;

depositing an electrode layer on the base layer material;

patterning the electrode layer such that a crack structure is formed in the electrode layer.