CN117124728B - Printing ink flattening device for printed circuit board - Google Patents
Printing ink flattening device for printed circuit board Download PDFInfo
- Publication number
- CN117124728B CN117124728B CN202311205458.6A CN202311205458A CN117124728B CN 117124728 B CN117124728 B CN 117124728B CN 202311205458 A CN202311205458 A CN 202311205458A CN 117124728 B CN117124728 B CN 117124728B
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- Prior art keywords
- plate
- ink
- circuit board
- groove
- carrying
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Links
- 238000007639 printing Methods 0.000 title claims description 13
- 230000007246 mechanism Effects 0.000 claims abstract description 31
- 238000002347 injection Methods 0.000 claims description 13
- 239000007924 injection Substances 0.000 claims description 13
- 238000003825 pressing Methods 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 12
- 230000008569 process Effects 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000005507 spraying Methods 0.000 abstract description 2
- 230000009471 action Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
- B41J3/4073—Printing on three-dimensional objects not being in sheet or web form, e.g. spherical or cubic objects
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Ink Jet (AREA)
Abstract
The invention relates to the technical field of circuit board manufacturing and discloses a printed circuit board ink flattening device, which comprises a first supporting plate, wherein a second supporting plate is arranged on the side surface of the first supporting plate, a carrying plate is arranged between the first supporting plate and the second supporting plate, a carrying groove is formed in the upper surface of the carrying plate, a lifting mechanism for lifting the carrying plate is arranged on the upper surface of the first supporting plate, a feeding mechanism for injecting ink is arranged on the side surface of the second supporting plate, a lifting mechanism is arranged on the side surface of the second supporting plate, the circuit board needing ink spraying is placed in the carrying groove, a motor is started, the motor drives a power rod to rotate, and the power rod is in threaded connection with the carrying plate, so that the carrying plate and the circuit board move upwards together along with the rotation of the power rod, and the circuit board can be always positioned in the carrying groove in the moving process, so that the ink on the circuit board can be flattened conveniently.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a printed circuit board ink flattening device.
Background
In the process of manufacturing the circuit board, ink is required to be sprayed and the printing ink is required to be flattened, a printed circuit board printing ink flattening device is required to be used for flattening the printing ink, and the printed circuit board printing ink flattening device can flatten the printing ink on the circuit board and mainly comprises a shell component, an ink spraying component, a connecting component, a control component, a flattening component and the like and has the advantages of good flattening effect, convenience in use, wide application range and the like;
common printed circuit board ink leveling devices generally have the following drawbacks when in use:
the method comprises the following steps: when a common printed circuit board ink flattening device is used, before flattening, the circuit board to be flattened needs to be placed at a specific position for flattening, and the circuit board is normally and directly placed, so that the position of the circuit board is offset in the flattening process, the circuit board is easy to damage, and the flattening of the circuit board is not facilitated;
And two,: when the common printed circuit board ink flattening device is used, ink needs to be ejected on the upper surface of the circuit board before flattening, special equipment is usually required to be arranged for ejecting ink on the circuit board, and after the ink ejection is finished, the circuit board after the ink ejection is moved, so that the operation is complex, and a large amount of time is required to be consumed;
And thirdly,: when the common printed circuit board ink flattening device is used, in the flattening process, the flattening of the ink is generally realized by manually holding the flattening plate and moving, so that a large amount of manpower is consumed in the whole process, and the workload of people is increased;
In summary, the common printed circuit board ink pressing device has the defects that the circuit board is easy to damage when in use, special equipment is arranged to jet ink on the circuit board, and the pressing of the ink is realized in a manual holding pressing plate and moving mode.
Disclosure of Invention
In order to overcome the above-mentioned defects in the prior art, the embodiment of the invention provides a printed circuit board ink flattening device to solve the technical problems set forth in the background art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a printed circuit board printing ink flattening device, includes first backup pad, the side of first backup pad is provided with the second backup pad, be provided with the year thing board between first backup pad and the second backup pad, it has carried the thing groove to offer on the upper surface of year thing board, be provided with the elevating system that is used for carrying the thing board to go on going up and down on the upper surface of first backup pad, be provided with the feeding mechanism that is used for the printing ink injection on the side of second backup pad, be provided with the flattening mechanism that is used for flattening printing ink on the side of first backup pad;
The lifting mechanism comprises a supporting table fixedly connected to the upper surface of a first supporting plate, a motor is installed on the side face of the supporting table, lifting grooves are formed in the side faces of the first supporting plate and a second supporting plate, two side faces of the carrying plate are respectively connected with the side faces of the two lifting grooves in a sliding mode, one of the two side faces of the carrying plate is rotatably connected with a power rod at the bottom of the lifting groove, and the upper end of the power rod penetrates through the carrying plate and is fixedly connected with the tail end of an output shaft of the motor.
In a preferred embodiment, the length of the carrying trough is equal to the distance between the first support plate and the second support plate, which are at the same level.
In a preferred embodiment, the power rod is screwed with the carrier plate, and the power rod penetrates through the center of the upper surface of the carrier plate.
In a preferred embodiment, the feeding mechanism comprises a connecting plate fixedly connected to the side surface of the second supporting plate, an ink jet machine is installed on the upper surface of the connecting plate, connecting grooves are formed in the side surfaces of the first supporting plate and the second supporting plate in a penetrating mode, an injection pipe is installed in each connecting groove, one ink outlet of the ink jet machine is connected with the injection pipe, the other ink outlet of the ink jet machine is communicated with one connecting pipe, a circulating pipe is communicated with the side surface of the connecting pipe, a round pipe is communicated with the side surface of the connecting pipe, round holes are formed in the side surface of each connecting groove in a communicating mode, and the lower ends of the two round holes are respectively communicated with the two lifting grooves.
In a preferred embodiment, a plurality of feeding holes are formed in the upper surface of the carrying plate, each feeding hole is communicated with the carrying groove, the inkjet machine is provided with a nozzle capable of changing the inkjet direction, and the feeding hole of the inkjet machine is communicated with an ink source.
In a preferred embodiment, the flattening mechanism comprises a guide rod fixedly connected to the side surface of the first support plate, the other end of the guide rod is fixedly connected to the side surface of the second support plate, one of the guide rod and the side surface of the second support plate is provided with a connecting rod, the other end of the connecting rod is arranged inside the other connecting groove, a moving groove is formed in the side surface of the connecting rod in a penetrating mode, the moving groove is respectively communicated with the two connecting grooves, a moving block is connected to the inner portion of the moving groove in a sliding mode, a sliding block is connected to the outer surface of the connecting rod in a sliding mode, a sliding plate is connected to the lower surface of the guide rod in a sliding mode, and a sensing plate is arranged on the side surfaces of the first support plate and the second support plate.
In a preferred embodiment, the movable block is magnetically connected with the sliding block, a pressing plate is mounted on the lower surface of the sliding plate, the pressing plate is flush with the lower surface of the guide rod, and the sensing plate is in electrical signal connection with the output end of the ink jet machine.
The invention has the technical effects and advantages that:
1. The lifting mechanism is arranged, so that a circuit board needing to be subjected to ink jet is placed in the carrying groove, the motor is started, the motor drives the power rod to rotate, and the power rod is in threaded connection with the carrying plate, so that the carrying plate and the circuit board move upwards along with the rotation of the power rod, the purpose of moving the circuit board is realized, and the circuit board is always positioned in the carrying groove in the moving process, so that the ink on the circuit board can be flattened conveniently.
2. According to the invention, the feeding mechanism is arranged, so that ink can be injected into the connecting groove through the injection pipe according to the upward movement of the carrying plate and the circuit board, the ink in the connecting groove can flow down along the inner wall of the lifting groove through the round hole, and the ink can enter the carrying groove through the feeding hole on the carrying plate, so that the purpose of ink injection on the circuit board in the carrying groove is realized, the ink injection is not required to be performed through specific equipment before flattening, and a large amount of time is saved.
3. The invention is beneficial to blocking the round hole on the upper surface of the carrying plate when the carrying plate moves to the top wall of the lifting groove by arranging the flattening mechanism, ink in the connecting pipe can enter the moving groove, the moving block in the moving groove can move under the action of the ink, the moving block is magnetically connected with the sliding block, the moving block can drive the sliding block to slide on the upper surface of the connecting rod, and meanwhile, the sliding plate slides together.
Drawings
Fig. 1 is a schematic diagram of the overall structure of the present invention.
Fig. 2 is a schematic structural view of a lifting mechanism according to the present invention.
Fig. 3 is a schematic structural diagram of a feeding mechanism of the present invention.
Fig. 4 is a schematic view of the circular hole structure in fig. 3.
Fig. 5 is a schematic structural view of a flattening mechanism according to the present invention.
Fig. 6 is an exploded view of the mobile tank structure of fig. 5.
The reference numerals are: 1. a first support plate; 2. a second support plate; 3. a carrying plate; 4. a carrying groove; 5. a lifting mechanism; 501. a support table; 502. a motor; 503. a power lever; 504. a lifting groove; 6. a material adding mechanism; 601. a connecting plate; 602. an inkjet machine; 603. an injection tube; 604. a connecting pipe; 605. a circulation pipe; 606. a connecting groove; 607. a round hole; 7. a flattening mechanism; 701. a guide rod; 702. a connecting rod; 703. a sliding block; 704. a sensor plate; 705. a sliding plate; 706. a moving groove; 707. and (5) moving the block.
Detailed Description
The embodiments of the present invention will be described more fully hereinafter with reference to the accompanying drawings, in which the configurations of the embodiments described below are merely illustrative, and in which the printed circuit board ink press device according to the present invention is not limited to the configurations described below, but all other embodiments obtained by a person skilled in the art without making any inventive effort are within the scope of the present invention.
Referring to fig. 1, the invention provides a printed circuit board ink flattening device, which comprises a first supporting plate 1, wherein a second supporting plate 2 is arranged on the side surface of the first supporting plate 1, a carrying plate 3 is arranged between the first supporting plate 1 and the second supporting plate 2, a carrying groove 4 is formed in the upper surface of the carrying plate 3, a lifting mechanism 5 for lifting the carrying plate 3 is arranged on the upper surface of the first supporting plate 1, a feeding mechanism 6 for injecting ink is arranged on the side surface of the second supporting plate 2, and a flattening mechanism 7 for flattening ink is arranged on the side surface of the first supporting plate 1.
The embodiment needs to be specifically described as follows: through being provided with elevating system 5, add material mechanism 6 and flattening mechanism 7, can realize that the circuit board can not take place the skew at the in-process that removes, be convenient for follow-up flattening to printing ink, at the in-process that removes, can carry out the inkjet operation, need not to carry out the inkjet specially, the time of having practiced thrift, can carry out flattening of printing ink voluntarily, simple and convenient.
Referring to fig. 2, the lifting mechanism 5 includes a supporting table 501 fixedly connected to the upper surface of the first supporting plate 1, a motor 502 is installed on a side surface of the supporting table 501, lifting grooves 504 are formed on side surfaces of the first supporting plate 1 and the second supporting plate 2, two side surfaces of the carrying plate 3 are respectively slidably connected with side surfaces of the two lifting grooves 504, a power rod 503 is rotatably connected to the bottom of one lifting groove 504, and the upper end of the power rod 503 penetrates through the carrying plate 3 and is fixedly connected to the tail end of an output shaft of the motor 502.
The embodiment needs to be specifically described as follows: the circuit board that will carry out the inkjet is placed in carrying thing inslot 4, starts motor 502, and motor 502 drives power pole 503 and rotates, because power pole 503 and carrying thing board 3 threaded connection, along with the rotation of power pole 503, realizes carrying thing board 3 and circuit board and upwards moving together, realizes the purpose that removes the circuit board, and at the in-process that removes, the circuit board can be in carrying thing inslot 4 all the time, is convenient for follow-up ink to flatten on the circuit board.
Referring to fig. 1, the length of the loading slot 4 is equal to the interval between the first support plate 1 and the second support plate 2, and the first support plate 1 and the second support plate 2 are at the same height.
The embodiment needs to be specifically described as follows: the circuit board needing to be subjected to ink jet is placed inside the carrying groove 4, and the position of the circuit board cannot deviate in the moving process of the carrying plate 3, so that the ink can be flattened conveniently.
Referring to fig. 2, the power rod 503 is screwed with the carrier plate 3, and the power rod 503 penetrates through the center of the upper surface of the carrier plate 3.
The embodiment needs to be specifically described as follows: along with the rotation of the power rod 503, the object carrying plate 3 and the circuit board move upwards together, and the purpose of moving the circuit board is achieved.
Referring to fig. 3 and 4, the feeding mechanism 6 includes a connection plate 601 fixedly connected to a side surface of the second support plate 2, an inkjet machine 602 is installed on an upper surface of the connection plate 601, connection grooves 606 are all formed in the side surfaces of the first support plate 1 and the second support plate 2 in a penetrating manner, an injection pipe 603 is installed in each connection groove 606, one of ink outlets of the inkjet machine 602 is connected with the injection pipe 603, the other ink outlet of the inkjet machine 602 is communicated with one of the connection pipes 604, a circulation pipe 605 is communicated with a side surface of the connection pipe 604, a round pipe is communicated with a side surface of the circulation pipe 605, round holes 607 are formed in the side surface of each connection groove 606, and lower ends of the two round holes 607 are respectively communicated with the two lifting grooves 504.
The embodiment needs to be specifically described as follows: along with the upward movement of the carrier plate 3 and the circuit board, the ink jet machine 602 can inject ink into the connecting groove 606 through the injection pipe 603, the ink in the connecting groove 606 can flow down along the inner wall of the lifting groove 504 through the round hole 607, and the ink can enter the carrier groove 4 through the feeding hole on the carrier plate 3, so that the purpose of jetting ink to the circuit board in the carrier groove 4 is realized, the ink is not required to be jetted through specific equipment before flattening, and a large amount of time is saved.
Referring to fig. 4, a plurality of feed holes are formed in the upper surface of the carrier plate 3, each feed hole is communicated with the carrier groove 4, the inkjet 602 has a nozzle capable of changing the direction of ink jet, and the feed port of the inkjet 602 is communicated with an ink source.
The embodiment needs to be specifically described as follows: ink in the connecting groove 606 flows down along the inner wall of the lifting groove 504 through the round hole 607, and the ink enters the carrying groove 4 through the feeding hole on the carrying plate 3, so that the purpose of jetting ink to the circuit board in the carrying groove 4 is realized.
Referring to fig. 5 and 6, the flattening mechanism 7 includes a guide bar 701 fixedly connected to a side surface of the first support plate 1, the other end of the guide bar 701 is fixedly connected to a side surface of the second support plate 2, a connecting bar 702 is disposed in one connecting groove 606, the other end of the connecting bar 702 is disposed in the other connecting groove 606, a moving groove 706 is formed in the side surface of the connecting bar 702 in a penetrating manner, the moving grooves 706 are respectively communicated with the two connecting grooves 606, a moving block 707 is slidably connected to the inside of the moving groove 706, a sliding block 703 is slidably connected to the outer surface of the connecting bar 702, a sliding plate 705 is slidably connected to the lower surface of the guide bar 701, the sliding block 703 is fixedly connected to the sliding plate 705, and sensing plates 704 are respectively mounted on the side surfaces of the first support plate 1 and the second support plate 2.
The embodiment needs to be specifically described as follows: when the carrier plate 3 moves to the top wall of the lifting groove 504, the upper surface of the carrier plate 3 blocks the round hole 607, ink in the connecting pipe 604 enters the moving groove 706, the moving block 707 in the moving groove 706 moves under the action of the ink, the moving block 707 is magnetically connected with the sliding block 703, the moving block 707 moves to drive the sliding block 703 to slide on the upper surface of the connecting rod 702, and meanwhile the sliding plate 705 slides together.
Referring to fig. 6, a movable block 707 is magnetically connected to a sliding block 703, a platen is mounted on the lower surface of the sliding plate 705, the platen is flush with the lower surface of the guide bar 701, and a sensing plate 704 is electrically connected to the output end of the inkjet 602.
The embodiment needs to be specifically described as follows: when the sliding block 703 is in contact with the sensing plate 704, the ink jetting direction of the ink jet machine 602 is changed, and the sliding plate 705 drives the platen to reciprocate.
The working principle of the invention is as follows: the circuit board needing to be subjected to ink jet is placed in the carrying groove 4, the motor 502 is started, the motor 502 drives the power rod 503 to rotate, and as the power rod 503 is in threaded connection with the carrying plate 3, the carrying plate 3 and the circuit board move upwards together along with the rotation of the power rod 503, the purpose of moving the circuit board is achieved, and in the moving process, the circuit board is always in the carrying groove 4, so that the ink on the circuit board can be flattened conveniently;
Along with the upward movement of the carrier plate 3 and the circuit board, the ink jet machine 602 can inject ink into the connecting groove 606 through the injection pipe 603, the ink in the connecting groove 606 can flow down along the inner wall of the lifting groove 504 through the round hole 607, and the ink can enter the carrier groove 4 through the feeding hole on the carrier plate 3, so that the purpose of jetting ink to the circuit board in the carrier groove 4 is realized, the ink does not need to be jetted through specific equipment before flattening, and a large amount of time is saved;
When the carrier plate 3 moves to the top wall of the lifting groove 504, the upper surface of the carrier plate 3 blocks the round hole 607, ink in the connecting pipe 604 enters the moving groove 706, the moving block 707 in the moving groove 706 moves under the action of the ink, the moving block 707 is magnetically connected with the sliding block 703, the moving block 707 moves to drive the sliding block 703 to slide on the upper surface of the connecting rod 702, and meanwhile the sliding plate 705 slides together.
Finally: the foregoing is only illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the invention, but rather as various modifications, equivalent arrangements, improvements, etc., within the spirit and principles of the present invention.
Claims (5)
1. The utility model provides a printed circuit board printing ink flattening device, includes first backup pad (1), its characterized in that: the ink jet printer is characterized in that a second support plate (2) is arranged on the side face of the first support plate (1), a carrying plate (3) is arranged between the first support plate (1) and the second support plate (2), a carrying groove (4) is formed in the upper surface of the carrying plate (3), a lifting mechanism (5) for lifting the carrying plate (3) is arranged on the upper surface of the first support plate (1), a feeding mechanism (6) for injecting ink is arranged on the side face of the second support plate (2), and a flattening mechanism (7) for flattening ink is arranged on the side face of the first support plate (1);
The lifting mechanism (5) comprises a supporting table (501) fixedly connected to the upper surface of the first supporting plate (1), a motor (502) is installed on the side surface of the supporting table (501), lifting grooves (504) are formed in the side surfaces of the first supporting plate (1) and the second supporting plate (2), two side surfaces of the carrying plate (3) are respectively connected with the side surfaces of the two lifting grooves (504) in a sliding manner, a power rod (503) is rotatably connected to the bottom of one lifting groove (504), and the upper end of the power rod (503) penetrates through the carrying plate (3) and is fixedly connected with the tail end of an output shaft of the motor (502);
The feeding mechanism (6) comprises a connecting plate (601) fixedly connected to the side face of a second supporting plate (2), an ink jet machine (602) is arranged on the upper surface of the connecting plate (601), connecting grooves (606) are formed in the side faces of the first supporting plate (1) and the second supporting plate (2) in a penetrating mode, an injection pipe (603) is arranged in each connecting groove (606), one ink outlet of the ink jet machine (602) is connected with the injection pipe (603), the other ink outlet of the ink jet machine (602) is communicated with one connecting pipe (604), a circulating pipe (605) is communicated with the side face of the connecting pipe (604), round pipes are communicated with the side face of the circulating pipe (605), round holes (607) are formed in the side face of each connecting groove (606), and the lower ends of the two round holes (607) are respectively communicated with the two lifting grooves (504);
The utility model provides a flattening mechanism (7) including guide bar (701) of fixed connection on first backup pad (1) side, the other end of guide bar (701) and the side fixed connection of second backup pad (2), one of them the inside of spread groove (606) is provided with connecting rod (702), the other end setting of connecting rod (702) is inside another spread groove (606), run through on the side of connecting rod (702) and seted up removal groove (706), removal groove (706) respectively with two spread grooves (606) intercommunication, the inside sliding connection of removal groove (706) has movable block (707), sliding connection has slider (703) on the outward appearance of connecting rod (702), sliding connection has slider (705) on the lower surface of guide bar (701), slider (703) and slider (703) fixed connection, sensor board (704) are all installed on the side of first backup pad (1) and second backup pad (2).
2. The printed circuit board ink applanation device of claim 1, wherein: the length of the carrying groove (4) is equal to the distance between the first supporting plate (1) and the second supporting plate (2), and the first supporting plate (1) and the second supporting plate (2) are positioned at the same height.
3. The printed circuit board ink applanation device of claim 1, wherein: the power rod (503) is in threaded connection with the carrying plate (3), and the power rod (503) penetrates through the right center of the upper surface of the carrying plate (3).
4. The printed circuit board ink applanation device of claim 1, wherein: a plurality of feed holes are formed in the upper surface of the carrying plate (3), each feed hole is communicated with the carrying groove (4), the inkjet machine (602) is provided with a spray head capable of changing the inkjet direction, and a feed inlet of the inkjet machine (602) is communicated with an ink source.
5. The printed circuit board ink applanation device of claim 1, wherein: the movable block (707) is magnetically connected with the sliding block (703), a pressing plate is mounted on the lower surface of the sliding plate (705), the pressing plate is flush with the lower surface of the guide rod (701), and the sensing plate (704) is electrically connected with the output end of the ink jet machine (602).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311205458.6A CN117124728B (en) | 2023-09-19 | 2023-09-19 | Printing ink flattening device for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311205458.6A CN117124728B (en) | 2023-09-19 | 2023-09-19 | Printing ink flattening device for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117124728A CN117124728A (en) | 2023-11-28 |
| CN117124728B true CN117124728B (en) | 2024-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311205458.6A Active CN117124728B (en) | 2023-09-19 | 2023-09-19 | Printing ink flattening device for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117124728B (en) |
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| CN214873646U (en) * | 2020-12-24 | 2021-11-26 | 湖北共铭电路有限公司 | Character ink-jet machine for producing circuit board |
| CN214873488U (en) * | 2021-05-30 | 2021-11-26 | 郑州鑫豫达印铁制罐有限公司 | Multi-color high-fidelity printing device |
| CN216573807U (en) * | 2021-07-29 | 2022-05-24 | 武汉昊通光科技有限公司 | Photosensitive oil covering device for processing optical module product |
| CN113733671A (en) * | 2021-08-19 | 2021-12-03 | 王宏鹏 | Corrugated board flattening device |
| CN215705189U (en) * | 2021-09-07 | 2022-02-01 | 山东华旭包装制品有限公司 | Flattening device of UV digital printer for packaging |
| CN113784525A (en) * | 2021-11-10 | 2021-12-10 | 四川英创力电子科技股份有限公司 | Printed circuit board printing ink flattening device |
| CN115071264A (en) * | 2022-07-18 | 2022-09-20 | 韩宏彼 | Printing oil detection and storage device for packaging and printing machine |
| CN219600566U (en) * | 2022-11-21 | 2023-08-29 | 乐清市伟业包装有限公司 | Corrugated paper board flattening device for corrugated paper processing |
| CN116604933A (en) * | 2023-06-19 | 2023-08-18 | 长沙幼儿师范高等专科学校 | Hydraulic type print stamping machine |
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