CN117115847A

CN117115847A - Anti-bonding pad setting method, device, computer equipment and storage medium

Info

Publication number: CN117115847A
Application number: CN202311269267.6A
Authority: CN
Inventors: 段治宇; 辛加静; 杨娟娟; 彭艳艳; 吴朋宾
Original assignee: Dawning Information Industry Co Ltd
Current assignee: Dawning Information Industry Co Ltd
Priority date: 2023-09-27
Filing date: 2023-09-27
Publication date: 2023-11-24

Abstract

The application relates to an anti-bonding pad setting method, an anti-bonding pad setting device, computer equipment and a storage medium. The method comprises the following steps: firstly, responding to a setting command input by a user on an application display interface, displaying a selection interface, then responding to a confirmation command input by the user on the selection interface, generating and displaying a first display interface according to a pad setting module confirmed by the confirmation command, then responding to a first operation command input by the user on the first display interface, acquiring the position information of an anti-pad corresponding to a target pad, and generating and displaying the graph of the anti-pad corresponding to the target pad on the first display interface according to the position information. The method realizes the method for setting the anti-bonding pad for any type of target bonding pad in a man-machine interaction mode, and greatly improves the efficiency of setting the anti-bonding pad for the target bonding pad.

Description

Anti-bonding pad setting method, device, computer equipment and storage medium

Technical Field

The present application relates to the technical field of printed circuit boards, and in particular, to a method and apparatus for setting an anti-pad, a computer device, and a storage medium.

Background

With the rapid development of the electronic industry and the increase of high-speed signals, the requirements on the quality of the signals are more strict. To improve signal quality and ensure signal integrity, impedance continuity needs to be optimized in the design of a printed circuit board (Printed Circuit Board, PCB), and the manner of optimizing impedance continuity mainly includes disposing an anti-pad under a pad of an interface terminal or device, however, before disposing the anti-pad under the pad of the interface terminal or device, disposing a corresponding anti-pad on a drawing of the circuit board is required, so that the disposing of the anti-pad on the actual circuit board can be completed according to the drawing of the anti-pad in the later stage.

At present, a method for setting anti-bonding pads in a drawing mainly depends on professionals to manually sketch or mark corresponding anti-bonding pads on each bonding pad in the drawing according to the shape and the size of an actual bonding pad on the drawing of a circuit board, for example, sketching the shape of the anti-bonding pads, marking the positions and the sizes of the anti-bonding pads, and the like, so that the setting of the anti-bonding pads in the drawing is completed.

However, the above method of disposing the anti-pad has a problem of low efficiency.

Disclosure of Invention

In view of the foregoing, it is desirable to provide an anti-pad setting method, apparatus, computer device, and storage medium capable of improving the anti-pad setting efficiency.

In a first aspect, the present application provides a method for setting an anti-pad, including:

responding to a setting command input by a user on an application display interface, and displaying a selection interface; the selection interface includes a plurality of options; different options correspond to different types of pad setting modules;

responding to a confirmation instruction input by a user on a selection interface, and generating and displaying a first display interface according to a pad setting module confirmed by the confirmation instruction;

and responding to a first operation instruction input by a user on the first display interface, acquiring the position information of the anti-bonding pad corresponding to the target bonding pad, and generating and displaying the graph of the anti-bonding pad corresponding to the target bonding pad on the first display interface according to the position information.

The method realizes a method for setting the anti-bonding pad for any type of target bonding pad by a man-machine interaction mode, wherein the anti-bonding pad can be set for different types of bonding pads and corresponding graphs of the anti-bonding pad can be displayed only by responding to a series of instructions by computer equipment.

In one embodiment, the obtaining, in response to a first operation instruction input by a user on a first display interface, position information of an anti-pad corresponding to a target pad, and generating and displaying, on the first display interface, a graph of the anti-pad corresponding to the target pad according to the position information includes:

responding to a first operation instruction input by a user on a first display interface, and acquiring attribute information of a target bonding pad;

determining the position information of an anti-bonding pad corresponding to the target bonding pad according to the attribute information of the target bonding pad;

and generating and displaying a graph corresponding to the anti-bonding pad on the first display interface according to the position information of the anti-bonding pad.

The method realizes a method for setting the anti-bonding pad for any type of target bonding pad in a man-machine interaction mode, wherein the anti-bonding pad can be set for different types of bonding pads and corresponding graphs of the anti-bonding pad can be displayed only by responding to a first operation instruction by computer equipment.

In one embodiment, the attribute information includes profile information, a preset spread value, and an offset direction; determining the position information of the anti-bonding pad corresponding to the target bonding pad according to the attribute information of the target bonding pad, wherein the method comprises the following steps:

determining initial position information of the anti-bonding pad according to the outline information and a preset expansion value;

and correcting the initial position information of the anti-bonding pad according to the offset direction, and determining the position information of the anti-bonding pad.

The anti-bonding pad setting method provided by the embodiment of the application can automatically generate the anti-bonding pad in the surrounding area of the target bonding pad according to the acquired profile information, the preset expansion value and the offset direction, thereby avoiding manual delineation of the anti-bonding pad and greatly improving the anti-bonding pad setting efficiency.

In one embodiment, the profile information includes center position and radius information, the preset flare value includes a first flare value and a second flare value, and determining initial position information of the anti-pad according to the profile information and the preset flare value includes:

determining first size information of the anti-bonding pad according to the center position, the radius information and the first expansion value;

determining second size information of the anti-bonding pad according to the radius information and the second expansion value;

And determining initial position information of the anti-bonding pad according to the outline information, the first size information and the second size information.

According to the anti-bonding pad setting method, the initial position of the anti-bonding pad can be determined by determining the first size information and the second size information of the anti-bonding pad, the calculation process is simple and feasible, the accuracy is high, and the problem of low anti-bonding pad setting efficiency caused by a complex calculation process is avoided.

In one embodiment, correcting initial position information of the anti-pad according to the offset direction, determining the position information of the anti-pad includes:

weighting the second expansion value to obtain a processed second expansion value;

determining the current position of the anti-bonding pad according to the initial position information of the anti-bonding pad;

and (3) shifting the anti-bonding pad from the current position according to the shifting direction to obtain the second expansion value after shifting, and obtaining the position information of the shifted anti-bonding pad.

According to the anti-bonding pad setting method provided by the embodiment of the application, the anti-bonding pad at the initial position is moved based on the offset direction and the second expansion value, so that the position information of the moved anti-bonding pad can be determined, the calculation process is simple and feasible, the accuracy is high, and the problem of the anti-bonding pad setting accuracy caused by the complex sketching process is avoided.

In one embodiment, before responding to the first operation instruction of the user on the first display interface, the method further includes:

receiving a second operation instruction of a user on the first display interface;

acquiring attribute information of a target pad, including:

and acquiring attribute information of the target bonding pad according to the second operation instruction.

According to the anti-bonding pad setting method provided by the embodiment of the application, the attribute information of the target bonding pad can be determined only based on the input instruction and the selection instruction of the user, the user does not need to manually sketch the target bonding pad to determine the attribute information of the target bonding pad or measure the target bonding pad according to the bonding pad on the actual circuit board, and the efficiency of setting the anti-bonding pad for the target bonding pad is greatly improved.

In one embodiment, the second operation instruction includes a first selection instruction, a second selection instruction, and an input instruction, and acquiring attribute information of the target pad according to the second operation instruction includes:

determining the offset direction of a target bonding pad selected by a user on a first display interface according to a first selection instruction;

determining the identification of the target bonding pad according to the second selection instruction, and calling a preset function to obtain the contour information of the target bonding pad according to the identification of the target bonding pad;

And extracting a preset expansion value of the target bonding pad from the input instruction.

In the anti-bonding pad setting method provided by the embodiment of the application, the attribute information of the target bonding pad is obtained by receiving the second operation instruction of the user, so that a basis is provided for determining the position information of the anti-bonding pad according to the attribute information of the target bonding pad.

In one embodiment, in response to a confirmation instruction input by a user on the selection interface, the pad setting module configured to confirm according to the confirmation instruction generates and displays a first display interface, including:

and responding to a confirmation instruction input by a user on the selection interface, calling a configuration file corresponding to the pad setting module confirmed by the confirmation instruction, and generating and displaying a first display interface.

In the anti-bonding pad setting method provided by the embodiment of the application, the first display interface for setting the anti-bonding pad can be generated only by loading the configuration file, so that a convenient tool is provided for setting the anti-bonding pad for a user, and the intelligence of the method is improved.

In a second aspect, the present application also provides an apparatus for setting an anti-pad, including:

the display module is used for responding to a setting command input by a user on the application display interface and displaying the selection interface; the selection interface includes a plurality of options; different options correspond to different types of pad setting modules;

The response module is used for responding to a confirmation instruction input by a user on the selection interface, and generating and displaying a first display interface according to the pad setting module confirmed by the confirmation instruction;

the generating module is used for responding to a first operation instruction input by a user on the first display interface, acquiring the position information of the anti-bonding pad corresponding to the target bonding pad, and generating and displaying the graph of the anti-bonding pad corresponding to the target bonding pad on the first display interface according to the position information.

In a third aspect, the present application also provides a computer device comprising a memory and a processor, the memory storing a computer program, the processor implementing the following steps when executing the computer program:

In a fourth aspect, the present application also provides a computer readable storage medium having stored thereon a computer program which when executed by a processor performs the steps of:

In a fifth aspect, the application also provides a computer program product comprising a computer program which, when executed by a processor, performs the steps of:

The method, the device, the computer equipment and the storage medium for setting the anti-bonding pad are characterized in that firstly, a setting command input by a user on an application display interface is responded, a selection interface is displayed, then, a confirmation command input by the user on the selection interface is responded, a first display interface is generated and displayed according to a bonding pad setting module confirmed by the confirmation command, then, the position information of the anti-bonding pad corresponding to the target bonding pad is obtained according to a first operation command input by the user on the first display interface, and the graph of the anti-bonding pad corresponding to the target bonding pad is generated and displayed on the first display interface according to the position information. The method realizes a method for setting the anti-bonding pad for any type of target bonding pad by a man-machine interaction mode, wherein the anti-bonding pad can be set for different types of bonding pads and corresponding graphs of the anti-bonding pad can be displayed only by responding to a series of instructions by computer equipment.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the related art, the drawings that are required to be used in the embodiments or the related technical descriptions will be briefly described, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.

FIG. 1 is an application environment diagram of a method of anti-pad placement in one embodiment;

FIG. 2 is a flow chart of a method of anti-pad placement in one embodiment;

FIG. 3 is a flow chart of an anti-pad arrangement method according to another embodiment;

FIG. 4 is a flow chart of an anti-pad arrangement method according to another embodiment;

FIG. 5 is a schematic diagram of a target pad and an anti-pad;

FIG. 6 is a schematic diagram of a target pad and an anti-pad;

FIG. 7 is a flow chart of an anti-pad arrangement method according to another embodiment;

FIG. 8 is a schematic diagram of a target pad and an anti-pad;

FIG. 9 is a schematic diagram of a target pad and an anti-pad;

FIG. 10 is a flow chart of an anti-pad arrangement method according to another embodiment;

FIG. 11 is a flow chart of an anti-pad arrangement method according to another embodiment;

FIG. 12 is a flow chart of an anti-pad arrangement method according to another embodiment;

FIG. 13 is a flow chart of an anti-pad arrangement method according to another embodiment;

FIG. 14 is a flow chart of a method of anti-pad placement in one embodiment;

FIG. 15 is a flow chart of an anti-pad arrangement method according to another embodiment;

FIG. 16 is a schematic diagram of a target pad and an anti-pad;

FIG. 17 is a schematic diagram of a target pad and an anti-pad;

FIG. 18 is a flow chart of an anti-pad arrangement method according to another embodiment;

FIG. 19 is a schematic diagram of a target pad and an anti-pad;

FIG. 20 is a schematic diagram of a target pad and an anti-pad;

FIG. 21 is a schematic diagram of a target pad and an anti-pad;

FIG. 22 is a flow chart of an anti-pad arrangement method in another embodiment;

FIG. 23 is a flow chart of an anti-pad arrangement method in another embodiment;

FIG. 24 is a flow chart of an anti-pad arrangement method according to another embodiment;

FIG. 25 is a flow chart of an anti-pad arrangement method according to another embodiment;

FIG. 26 is a flow chart of an anti-pad arrangement method according to another embodiment;

FIG. 27 is a block diagram showing the arrangement of anti-pads in another embodiment;

fig. 28 is a block diagram showing a configuration of an anti-pad setting device in another embodiment.

Detailed Description

The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description of the application and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion.

In the description of embodiments of the present application, the technical terms "first," "second," and the like are used merely to distinguish between different objects and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, a particular order or a primary or secondary relationship. In the description of the embodiments of the present application, the meaning of "plurality" is two or more unless explicitly defined otherwise.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

With the rapid development of the electronic industry and the increase of high-speed signals, the requirements on the quality of the signals are more strict. To improve signal quality and ensure signal integrity, impedance continuity needs to be optimized in the design of the printed circuit board (Printed Circuit Board, PCB), and the manner in which impedance continuity is optimized mainly includes providing anti-pads underneath the pads of the interface terminals or devices. For example, when a pad of an interface terminal is connected to a high-speed signal line, if the pad is particularly large and the high-speed signal line is particularly narrow, the impedance of the large pad is small and the impedance of the narrow signal line is large, in which case impedance discontinuity occurs, which causes signal reflection, an anti-pad is generally provided under the interface terminal or the large pad of the device to make the impedance continuous.

In general, before an anti-bonding pad is set under an interface terminal or a bonding pad of a device, a corresponding anti-bonding pad needs to be set on a drawing of a circuit board, so that the setting of the anti-bonding pad on an actual circuit board can be completed according to the drawing of the anti-bonding pad in the later period. At present, a method for setting anti-bonding pads in a drawing mainly depends on professionals to manually sketch or mark corresponding anti-bonding pads on each bonding pad in the drawing according to the shape and the size of an actual bonding pad on the drawing of a circuit board, for example, sketching the shape of the anti-bonding pads, marking the positions and the sizes of the anti-bonding pads, and the like, so that the setting of the anti-bonding pads in the drawing is completed. However, the above method of disposing the anti-pad has a problem of low efficiency. The present application aims to solve this problem.

After the background technology of the anti-pad setting method provided by the embodiment of the present application is described above, an implementation environment related to the anti-pad setting method provided by the embodiment of the present application will be briefly described below. The anti-bonding pad setting method provided by the embodiment of the application can be applied to the computer equipment shown in the figure 1. The computer device may be a terminal or a server, and includes a processor, a memory, an input/output interface, a communication interface, a display unit, and an input means. The processor, the memory and the input/output interface are connected through a system bus, and the communication interface, the display unit and the input device are connected to the system bus through the input/output interface. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The input/output interface of the computer device is used to exchange information between the processor and the external device. The communication interface of the computer device is used for carrying out wired or wireless communication with an external terminal, and the wireless mode can be realized through WIFI, a mobile cellular network, NFC (near field communication) or other technologies. The computer program is executed by a processor to implement a method of anti-pad setting. The display unit of the computer device is used for forming a visual picture, and can be a display screen, a projection device or a virtual reality imaging device. The display screen can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, can also be a key, a track ball or a touch pad arranged on the shell of the computer equipment, and can also be an external keyboard, a touch pad or a mouse and the like.

It will be appreciated by those skilled in the art that the architecture shown in fig. 1 is merely a block diagram of some of the architecture associated with the present inventive arrangements and is not limiting of the computer device to which the present inventive arrangements are applied, and that a particular terminal may include more or fewer components than shown, or may combine some of the components, or have a different arrangement of components.

In one embodiment, as shown in fig. 2, a method for setting an anti-pad is provided, and the method is applied to the computer device in fig. 1 for illustration, and includes the following steps:

s201, responding to a setting command input by a user on an application display interface, and displaying a selection interface.

The computer equipment is provided with corresponding application software, wherein the application software is software or a plug-in unit for setting anti-bonding pads for bonding pads, and the application software is specifically developed and generated by engineering personnel. When the computer equipment starts the application software to set the anti-bonding pad, an application display interface can be displayed, wherein the application display interface comprises an operation area, a drawing display area, a file management column and other interfaces. The selection interface includes a plurality of options, for example, a circular pad option, an elliptical pad option, a square pad option, a rectangular pad option, a polygonal pad option. The different options correspond to different types of pad setting modules, the round pad options correspond to round pad setting modules, the oval pad options correspond to oval pad setting modules, the square pad options correspond to square pad setting modules, the rectangular pad options correspond to square pad setting modules, and the polygonal pad options correspond to square pad setting modules. The pad setting module is used for performing anti-pad setting on the corresponding type of pad, and can be specifically program code of the anti-pad setting. The set command is used to instruct the computer device to initiate an anti-pad set program so that the user can set the anti-pad for the target pad through the application software.

In the embodiment of the application, the computer equipment can be pre-provided with the application software or the application program for setting the anti-bonding pad for the target bonding pad, when a user needs to set the corresponding anti-bonding pad for the target bonding pad, the application software on the computer equipment can be started first, the computer equipment displays an application display interface, a user can trigger a setting command on the application display interface, when the computer equipment receives the setting command generated by the user trigger, the computer equipment displays a selection interface on the application display interface, wherein a plurality of options are included, the user can select from the plurality of options according to the type of the actual target bonding pad, and the bonding pad setting module for setting the anti-bonding pad corresponding to the target bonding pad, namely the bonding pad setting program code is determined, so that the computer equipment can directly call the bonding pad setting program code to realize the anti-bonding pad setting for the target bonding pad. For example, if the target pad is a rectangular pad (e.g., a Surface-Mount Technology (SMT) pad), the user selects a rectangular pad option on the selection interface, and the computer device may call a pad setting module corresponding to the rectangular pad option to perform the anti-pad setting of the type; if the target pad is a circular type pad (e.g., slot type pad), the user selects a circular pad option on the selection interface, and the computer device may call the pad setting module corresponding to the circular pad option to perform the anti-pad setting of the type.

S202, responding to a confirmation instruction input by a user on the selection interface, and generating and displaying a first display interface according to a pad setting module confirmed by the confirmation instruction.

The first display interface may include a display area and an input area, where the display area is used to display graphics and attribute parameters corresponding to the bonding pad and the anti-bonding pad, and the attribute parameters may include position information of the bonding pad, position information of the anti-bonding pad, level information of the anti-bonding pad, and the like; the input area comprises an input box, an input control, an input drop-down list and the like, and a user can input parameter information of an anti-bonding pad and the like in the input box; the input control can comprise a running instruction control, a pause instruction control and the like, wherein a user can start the calculation module through the running instruction control to calculate the attribute parameters of the anti-bonding pad according to the parameter information of the anti-bonding pad and the attribute parameters of the bonding pad, and the user can pause the calculation through the pause instruction control. In this embodiment, the display area of the first display interface may include at least one target pad, where the target pad is a circular pad, an elliptical pad, a square pad, a rectangular pad, a polygonal pad, or the like. The content contained in the first display interface corresponding to each type of pad setting module can be the same or different.

In the embodiment of the application, after the user triggers the confirmation instruction of the corresponding option on the selection interface, the computer equipment can receive the confirmation instruction, determine the type of the target bonding pad according to the confirmation instruction, directly call the program code of the first display interface corresponding to the type according to the type of the target bonding pad, then generate the corresponding first display interface based on the program code, and display the first display interface on the current application display interface, so that the user can set the anti-bonding pad of the type of the target bonding pad on the first display interface. For example, if the user inputs a confirmation instruction of the round pad option on the selection interface, the computer device may directly call the program code of the first display interface corresponding to the round pad, generate the first display interface according to the program code, and display the first display interface on the current application display interface, where the first display interface is used to set the anti-pad of the round pad. It should be noted that, the correspondence between the different types of pads and the program codes of the first display interface may be pre-constructed and stored.

S203, responding to a first operation instruction input by a user on the first display interface, acquiring the position information of the anti-bonding pad corresponding to the target bonding pad, and generating and displaying the graph of the anti-bonding pad corresponding to the target bonding pad on the first display interface according to the position information.

The first operation instruction may be an operation instruction generated by triggering an input control by a user on an input area of the first display interface, or an operation instruction generated by selecting a target pad in a display area of the first display interface by the user. For example, the user triggers an operation instruction generated by the operation instruction control on the input area, and at this time, the first operation instruction is used for starting a calculation module, and the calculation module is used for calculating and obtaining the attribute parameters of the anti-bonding pad according to the parameter information of the anti-bonding pad and the attribute parameters of the bonding pad. The user triggers an operation instruction generated by the stop instruction control on the input area, and at the moment, the first operation instruction is used for stopping the calculation module; for another example, the user clicks the target pad in the display area, and at this time, the first operation instruction is used to determine the target pad to be set.

The anti-pad position information includes corner coordinate information of the anti-pad when the target pad is a rectangular pad, for example; when the target pad is a circular pad, the position information of the anti-pad includes profile information of the anti-pad.

In the embodiment of the application, after the first display interface is displayed by the pad setting module confirmed according to the confirmation instruction of the user, the user can determine the target pad in the display area in the first display interface, the user can trigger the operation instruction control to generate the first operation instruction in the input area in the first display interface, the computer equipment can acquire the determined attribute information (such as the position, the shape, the center point, the expansion direction, the expansion value and the like of the target pad) of the target pad from the database according to the first operation instruction, determine the position information of the anti-pad corresponding to the target pad according to the attribute information of the target pad, then determine the coordinate position and the shape of the anti-pad according to the position information of the anti-pad, finally call the drawing tool to generate the graph of the anti-pad corresponding to the target pad according to the coordinate position and the shape of the anti-pad, and display the graph of the anti-pad on the first display interface.

According to the anti-bonding pad setting method provided by the embodiment of the application, firstly, a setting command input by a user on an application display interface is responded, a selection interface is displayed, then, a confirmation command input by the user on the selection interface is responded, a first display interface is generated and displayed according to a bonding pad setting module confirmed by the confirmation command, then, the position information of the anti-bonding pad corresponding to the target bonding pad is obtained according to a first operation command input by the user on the first display interface, and the graph of the anti-bonding pad corresponding to the target bonding pad is generated and displayed on the first display interface according to the position information. The method realizes a method for setting the anti-bonding pad for any type of target bonding pad by a man-machine interaction mode, wherein the anti-bonding pad can be set for different types of bonding pads and corresponding graphs of the anti-bonding pad can be displayed only by responding to a series of instructions by computer equipment.

In one embodiment, an implementation manner of generating and displaying an anti-pad corresponding graph is provided, that is, "in response to a first operation instruction input by a user on a first display interface in S203, position information of an anti-pad corresponding to a target pad is obtained, and the anti-pad corresponding graph of the target pad is generated and displayed on the first display interface according to the position information", as shown in fig. 3, including:

s401, responding to a first operation instruction input by a user on a first display interface, and acquiring attribute information of a target bonding pad.

Wherein, the corresponding attribute information of different types of target pads is different. For example, when the target pad is a rectangular pad, the attribute information of the type of target pad includes corner coordinate information of the target pad, a preset flare value of the target pad, a flare direction of the target pad, and the like; when the target pad is a circular pad, the attribute information of the type of target pad includes profile information of the target pad, a preset flare value, an offset direction, and the like.

In the embodiment of the application, because the display area in the first display interface may contain a plurality of bonding pads, before the anti-bonding pads are set, a user can determine a target bonding pad from the plurality of bonding pads in the display area in the first display interface, that is, the user selects the target bonding pad in the first display interface to generate a first operation instruction, and the computer equipment can acquire attribute information of the target bonding pad from the database when receiving the first operation instruction; optionally, after the user selects the target pad in the display area in the first display interface, the user triggers the operation instruction control in the input area in the first display interface to generate a first operation instruction, and when the computer equipment receives the first operation instruction, the attribute information of the target pad is obtained from the database.

S402, determining the position information of the anti-bonding pad corresponding to the target bonding pad according to the attribute information of the target bonding pad.

Wherein the location information of the different types of target pads, their corresponding anti-pads, is different. For example, when the target pad is a rectangular pad, the anti-pad corresponding to the target pad of this type is also a rectangular anti-pad (see the anti-pad schematic diagram shown in fig. 17), and the positional information thereof includes corner coordinate information of the anti-pad, and the like; when the target pad is a circular pad, the anti-pad corresponding to the target pad of this type may be a circular anti-pad (see the anti-pad schematic diagram shown in fig. 5), and the position information thereof includes coordinates of a center point of the anti-pad, a circle radius, profile information, and the like; alternatively, the anti-bonding pad corresponding to the circular bonding pad may be an elliptical anti-bonding pad, and the position information includes coordinates, major axis radius, minor axis radius, contour information and the like of the center point of the anti-bonding pad; alternatively, the anti-pad corresponding to the circular pad may be an anti-pad of a special shape (see an anti-pad schematic diagram shown in fig. 6), the anti-pad corresponding pattern of the special shape includes a rectangular region pattern, two semicircular region patterns, and the position information of the anti-pad of the type includes a length and a width of the rectangular region, a radius corresponding to an arc of each semicircle, coordinates of a center point, profile information of the anti-pad, and the like.

In the embodiment of the application, after the attribute information of the target bonding pad is obtained, the position information of the anti-bonding pad can be obtained by calculation according to the attribute information of the target bonding pad; for example, when the target pad is a rectangular pad, the coordinate positions of the four corners on the anti-pad can be obtained by calculation according to the corner coordinate information of the target pad, the preset expansion value, the expansion direction and the like, so as to obtain the corner coordinate information. When the target bonding pad is a circular bonding pad, the coordinate position of each point on the contour of the anti-bonding pad, the coordinate of the center point, the corresponding radius of the circular arc and the like can be obtained through calculation according to the contour information of the target bonding pad, the preset expansion value, the offset direction and the like. Optionally, the corresponding relationship between the attribute information of the different types of bonding pads and the position information of the anti-bonding pad may be stored in advance on the computer device, and in practical application, when the computer device obtains the attribute information of the target bonding pad and sets the anti-bonding pad for the target bonding pad, the position information of the anti-bonding pad corresponding to the attribute information of the target bonding pad may be searched directly based on the corresponding relationship, so that the anti-bonding pad is set for the target bonding pad directly according to the searched position information of the anti-bonding pad. It should be noted that, the correspondence between the attribute information of the different types of pads and the position information of the anti-pad may be created in advance, and the position information of the anti-pad may be determined according to the determination rule of the signal integrity and the attribute information of the bonding target pad.

S403, generating and displaying a graph corresponding to the anti-bonding pad on the first display interface according to the position information of the anti-bonding pad.

In the embodiment of the application, after the position information of the anti-bonding pad is determined, the coordinate position and the shape of each point or key point on the anti-bonding pad can be determined according to the position information of the anti-bonding pad, and finally, a drawing tool is called to generate the graph of the anti-bonding pad corresponding to the target bonding pad according to the coordinate position and the shape of the anti-bonding pad, and the graph of the anti-bonding pad is displayed on the first display interface.

The method for setting the anti-bonding pad realizes a method for setting the anti-bonding pad for any type of target bonding pad in a man-machine interaction mode, wherein the anti-bonding pad can be set for different types of bonding pads and corresponding graphs of the anti-bonding pad can be displayed only by responding to a first operation instruction, and compared with the existing mode of manually sketching or marking the corresponding anti-bonding pad on a drawing by a professional, the method does not need to sketch the anti-bonding pad manually, only needs to respond to a series of instructions input by a user, and can display the corresponding graphs of the anti-bonding pad on a display interface, so that the setting of the anti-bonding pad on an actual circuit board can be completed directly according to the corresponding graphs of the anti-bonding pad in the later period, and the efficiency of setting the anti-bonding pad for the target bonding pad is greatly improved.

In one embodiment, an implementation manner of setting an anti-pad by using a circular target pad is provided, that is, "determining, according to attribute information of the target pad, location information of the anti-pad corresponding to the target pad" in S402, as shown in fig. 4, includes:

s601, determining initial position information of the anti-bonding pad according to the outline information and a preset expansion value.

The attribute information of the round target pad comprises contour information, a preset expansion value and an offset direction. The preset expansion value is a width value of the target pad, which needs to extend in all directions, that is, the preset expansion value can include one expansion value or multiple expansion values of different types, and in the case of including multiple expansion values, the multiple expansion values can be the same or different. The contour information of the target pad may refer to the coordinates and radius of the center point of the center pad, or may refer to the coordinates of each point on the contour of the circular pad.

The initial position information of the anti-pad corresponds to the position information of the anti-pad, for example, the initial contour information of the anti-pad, the coordinates of the initial center point, the initial arc corresponding radius, and the like may be included. The initial profile information of the anti-pad refers to the coordinates of each point on the corresponding profile of the anti-pad, or if the anti-pad is a circular anti-pad, the initial profile information of the anti-pad refers to the coordinates and radius of the center point of the circular anti-pad.

In the embodiment of the application, after the profile information and the preset expansion value of the target bonding pad are determined, the initial position information of the anti-bonding pad can be obtained by calculation according to the profile information and the preset expansion value of the target bonding pad. For example, when the target bonding pad is a circular bonding pad and the corresponding anti-bonding pad is a circular anti-bonding pad, determining the coordinates and the radius of the central point of the circular bonding pad according to the contour information of the circular bonding pad, further combining with a preset outer expansion value, performing addition operation on the radius of the circular bonding pad and the preset outer expansion value to obtain the initial radius of the circular anti-bonding pad, taking the central point of the circular bonding pad as the initial central point of the anti-bonding pad to obtain the initial central point of the anti-bonding pad, and finally obtaining the coordinates and the initial radius of the initial central point of the circular anti-bonding pad. For example, as shown in FIG. 5, the coordinate position of the center point of the circular pad is O ₁ Radius r ₁ And presets the spread value a ₁ Then the calculated solder mask is used in accordance with the method described aboveThe initial center point of the disk has the coordinates of O ₁ Initial radius r ₁ +a ₁ And generating the outline of the anti-bonding pad according to the data, namely obtaining the outline information of the circular anti-bonding pad.

Optionally, when the target bonding pad is a circular bonding pad and the corresponding anti-bonding pad is a special-shaped anti-bonding pad, because the figure corresponding to the special-shaped anti-bonding pad comprises a figure of a rectangular area and a figure of two semicircular areas (see fig. 6), the coordinates and the radius of the central point of the circular bonding pad are determined according to the outline information of the circular bonding pad, and then the radius and the width of the circular bonding pad are combined with the width of the preset external expansion value to perform addition operation to obtain the initial radius of the semicircular area in the special-shaped anti-bonding pad, and the width of the rectangular area in the special-shaped anti-bonding pad is obtained according to the initial radius of the semicircular area, and the height of the rectangular area in the special-shaped anti-bonding pad is determined according to the height of the external expansion value in the preset external expansion value. As another example, as shown in fig. 6, the coordinate position of the center point of the circular pad is O ₂ Radius r ₂ The preset spreading value comprises two spreading values, and a width spreading value b ₁ Height spread b ₂ Then the initial center point of the special-shaped anti-bonding pad is determined to have the coordinates of O ₂ The height of the rectangular area on the anti-pad is b ₂ The width of the rectangular area on the anti-pad is 2 x (r ₂ +b ₁ ) The radius of the two semicircles on the anti-bonding pad is r ₂ +b ₁ And generating the profile of the anti-bonding pad according to the data, thus obtaining the profile information of the special-shaped anti-bonding pad.

Optionally, taking the special-shaped anti-pad as an example, an implementation manner of determining the initial position of the anti-pad is provided, that is, the step S601 described above, as shown in fig. 7, includes:

s6010, determining first size information of the anti-pad according to the radius and the first spread value.

The target bonding pad is a circular bonding pad, the contour information of the target bonding pad comprises a center position and a radius, and the corresponding preset expansion value comprises a first expansion value and a second expansion value; specifically, the center position is the coordinate of the center point of the circular bonding pad, and the radius is the radius of the circular bonding pad. The first flare value is the flare width of the circular pad in the horizontal radius direction, i.e., the width flare value. The second expansion value is the expansion width, namely the height expansion value, of the circular bonding pad in the vertical radius direction. The first dimension information of the anti-pad refers to the radius of each semicircle on the anti-pad.

In the embodiment of the application, because the circular bonding pad corresponds to the special-shaped anti-bonding pad and comprises the pattern of the rectangular area and the pattern of the two identical semicircular areas, after the radius and the first expansion value of the circular bonding pad are determined, the radius and the first expansion value can be subjected to addition operation, and the radius of each identical semicircular area on the anti-bonding pad is obtained through calculation, so that the first size information of the anti-bonding pad is obtained. For example, see the radius r of the semi-circles S1 and S2 in FIG. 6 ₂ And a first spread value of b ₁ Then the first dimension information of the anti-pad determined according to the sum of the semicircle S1 and the first spread value is r ₂ +b ₁ 。

S6011, determining second dimension information of the anti-pad according to the first dimension information and the second expansion value.

Wherein the second dimension information of the anti-pad refers to the width and height of the rectangular region on the anti-pad.

In the embodiment of the application, after the first size information is obtained, the diameter of the semicircle can be directly determined according to the radius of the semicircle, then the diameter of the semicircle is directly used as the width of the rectangular area on the anti-bonding pad, and the second expansion value is directly used as the height of the rectangular area on the anti-bonding pad, so that the second size information of the anti-bonding pad is obtained. For example, see fig. 6 where the rectangular area L has a width of 2 x (r ₂ +b ₁ ) Height b ₂ 。

S6012, determining initial position information of the anti-pad according to the center position, the first size information, and the second size information.

In the embodiment of the application, after the center position of the target pad, the first size information and the second size information of the anti-pad are determined, the drawing tool can be directly called to generate the anti-pad graph in the display area according to the center position of the target pad, the first size information and the second size information of the anti-pad, and finally the graph is based on the graphThe initial position information of the anti-bonding pad can be obtained, for example, the initial contour information of the anti-bonding pad, the coordinates of the initial center point, the corresponding radius of the initial arc and the like are obtained. For example, as shown in FIG. 6, according to the center position O of the target pad ₂ Radius r of semicircle on anti-pad ₁ +b ₂ The width of the rectangular area on the anti-pad is 2 x (r ₂ +b ₁ ) And height b ₁ The anti-bonding pad graph formed by the semicircle S1, the semicircle S2 and the rectangle L can be automatically generated, and the coordinates of each point on the graph outline can be obtained.

S602, correcting initial position information of the anti-bonding pad according to the offset direction, and determining the position information of the anti-bonding pad.

The offset direction refers to a movement direction of the anti-pad in a plane, and specifically includes a movement direction on a vertical axis, for example, a direction moving up or down along the vertical axis.

In the embodiment of the application, after the initial position information of the anti-bonding pad is determined, the current position of the anti-bonding pad can be determined according to the initial position information of the anti-bonding pad, the target semicircle is determined according to the offset direction, and then the anti-bonding pad is moved according to the offset direction, so that the center point of the target semicircle on the moved anti-bonding pad coincides with the center point of the target bonding pad. Optionally, determining the target semicircle according to the offset direction includes: when the offset direction is the direction of upward movement, the target semicircle is the lower semicircle in the anti-pad, and when the offset direction is the direction of downward movement, the target semicircle is the upper semicircle in the anti-pad. For example, as shown in FIG. 8, wherein the target pad Y, the corresponding anti-pad F, the center point O of the target pad Y ₃ The anti-bonding pad F comprises an upper semicircle S ₁ Lower semicircle S ₂ Rectangle L, upper semicircle S ₁ Is q ₁ Lower semicircle S ₂ Is q ₂ If the offset direction P is moving upward along the vertical axis, the lower semicircle S ₂ Specifically, the anti-bonding pad F is moved upwards from the current position as a target semicircle, and the moved lower semicircle S ₂ Center point q of (2) ₂ And a center point O to a target pad Y ₃ Overlapping; as shown in fig. 9, the target pad Y, the corresponding inverse Pad F, center point O of target pad Y ₄ The anti-bonding pad F comprises an upper semicircle S ₁ Lower semicircle S ₂ Rectangle L, upper semicircle S ₁ Is q ₃ Lower semicircle S ₂ Is q ₄ If the offset direction P is downward along the vertical axis, the lower semicircle S ₁ Specifically, the anti-bonding pad F is moved upwards from the current position as a target semicircle, and the moved lower semicircle S ₁ Center point q of (2) ₃ And a center point O to a target pad Y ₄ And (5) overlapping.

Optionally, a way to correct the initial position information of the anti-pad according to the offset direction and determine the position information of the anti-pad is provided below, as shown in fig. 10, S602 "correct the initial position information of the anti-pad according to the offset direction and determine the position information of the anti-pad", which includes:

and S6020, carrying out weighting treatment on the second expansion value to obtain a treated second expansion value.

The weighting process includes a process of amplifying or reducing the second expansion value, specifically, a process of multiplying the second expansion value by a weighting coefficient, where the weighting coefficient may be determined according to an actual expansion requirement.

In the embodiment of the present application, after the second outer expansion value is obtained, the second outer expansion value may be weighted to obtain a processed second outer expansion value, so that the processed second outer expansion value is a preset multiple of the second outer expansion value, where the preset multiple may be an integer multiple or a fractional multiple, for example, 1/2 multiple, 1/3 multiple, 2 multiple, or 3 multiple.

S6021, determining the current position of the anti-bonding pad according to the initial position information of the anti-bonding pad.

The current position of the anti-pad refers to coordinates of each key point on the outline of the anti-pad, for example, coordinates of four corners of a rectangular area on the anti-pad, coordinates of each point on an upper semicircle, coordinates of each point on a lower semicircle, and the like.

In the embodiment of the present application, after the initial position information of the anti-pad is determined in the above embodiment, that is, after the width and the height of the rectangular area on the anti-pad, the radius of the upper semicircle, the radius of the lower semicircle, and the coordinates of the center point of the anti-pad are determined, the coordinates of the four corners of the rectangular area on the anti-pad, the coordinates of each point on the upper semicircle, the coordinates of each point on the lower semicircle, and the like can be calculated according to these data.

S6022, the anti-bonding pad is shifted from the current position according to the shift direction to obtain the second expansion value after the shift, and the position information of the shifted anti-bonding pad is obtained.

In the embodiment of the application, after the processed second expansion value and the current position of the anti-bonding pad are determined, the anti-bonding pad is moved from the current position according to the offset direction by taking the processed second expansion value as the offset, so that the position information of the offset anti-bonding pad is obtained.

In one embodiment, based on the embodiment shown in fig. 3, before responding to the first operation instruction of the user on the first display interface, as shown in fig. 11, the method further includes:

s404, receiving a second operation instruction of the user on the first display interface.

The second operation instruction comprises an input instruction and a selection instruction, wherein the input instruction is used for inputting a preset expansion value, and the selection instruction is used for selecting a bonding pad to be set.

In the embodiment of the application, before responding to the first operation instruction of the user on the first display interface, the user also needs to input a preset expansion value in the input area of the first display interface in advance, and trigger to generate the selection instruction of the pad to be set of the display area on the first display interface, and the computer equipment can receive the second operation instruction of the user on the display interface.

Correspondingly, when the computer device executes the step S401 of "obtaining the attribute information of the target pad", the steps are specifically executed: and acquiring attribute information of the target bonding pad according to the second operation instruction.

In the embodiment of the application, after the computer equipment receives the second operation instruction, the attribute information of the target bonding pad indicated by the second operation instruction can be directly obtained from the database.

Optionally, in the following, a manner of acquiring attribute information of the target pad on the first display interface according to a second operation instruction is provided, as shown in fig. 12, where the second operation instruction includes a first selection instruction, a second selection instruction, and an input instruction, and S401 "acquire attribute information of the target pad according to the second operation instruction" includes:

s4010, determining the offset direction of the target pad selected by the user on the first display interface according to the first selection instruction.

Wherein the first selection instruction may include an upward offset instruction and a downward offset instruction.

In the embodiment of the present application, after the user triggers the generation of the first selection instruction on the first display interface, the computer device may determine the offset direction according to the type of the first selection instruction, for example, if the first selection instruction is an upward offset instruction, the offset direction is an upward offset direction; the first selection instruction is a downward shift instruction, and the shift direction is a downward shift direction.

S4011, determining the identification of the target bonding pad according to the second selection instruction, and calling a preset function to obtain the contour information of the target bonding pad according to the identification of the target bonding pad.

The preset function may be an axlDBGetPad function. The identity of the target pad is used to uniquely characterize the target pad.

In the embodiment of the application, after the user triggers the generation of the second selection instruction on the first display interface, the computer equipment can acquire the identifier of the target pad from the pad database according to the target pad indicated by the second selection instruction, and call the axlDBGetPad function to select the outline information of the target pad corresponding to the identifier of the target pad from the pad database according to the identifier of the target pad. It should be noted that, the correspondence between the pad identifier and the profile information of the pad may be pre-constructed and stored in the pad database, so as to be used for searching.

S4012, extracting a preset expansion value of the target bonding pad from the input instruction.

In the embodiment of the application, after the user inputs the preset expansion value of the target pad in the input area of the first display interface, the computer equipment can receive the input instruction of the user and extract the preset expansion value of the target pad from the input instruction. Alternatively, the user may determine the preset spreading value according to Signal Integrity (SI) requirements, or may determine the preset spreading value according to other design requirements.

In one embodiment, before the computer device sets the anti-pad, a different setting interface may be selected by confirming the type of the target pad, and the following embodiment provides a method for confirming the type of the target pad, that is, the computer device executes the following steps in response to a confirmation instruction input by a user on the selection interface in step S202, and the pad setting module confirmed according to the confirmation instruction generates and displays a first display interface, where the steps are specifically executed: and responding to a confirmation instruction input by a user on the selection interface, calling a configuration file corresponding to the pad setting module confirmed by the confirmation instruction, and generating and displaying a first display interface.

The configuration file corresponding to the pad setting module comprises executable program codes of the pad setting module.

In the embodiment of the application, after the user selects the corresponding option on the selection interface, the computer equipment can receive the confirmation instruction of the user and determine the type of the target bonding pad to be set according to the confirmation instruction, for example, determine that the type of the target bonding pad is a round bonding pad, further, the computer equipment can directly call the configuration file corresponding to the bonding pad setting module of the option, execute the program code in the configuration file and generate and display the corresponding first display interface.

Optionally, the method for setting the configuration file corresponding to the pad setting module may include:

step one: modifying an Allegro software configuration file by using an expansion interface provided by application software (for example, allegro software) for setting an anti-pad for a target pad, namely writing a common scheme of the anti-pad corresponding to a processing SLOT (SLOT) connector into a program in the application software, and directly establishing an anti-pad model corresponding to the SLOT (SLOT) connector in the application software by using the program;

step two: modifying a configuration file of the application software, and adding a menu bar configuration file allegro.men to the configuration file menu bar of the application software, namely adding a tool for automatically setting an anti-pad for a SLOT (SLOT) connector to the menu bar;

Step three: adding a code ' load ' (anti-routekeepout. Il ') into an allegro. Ilinit file in the application software, changing the file name from the original allegro. Ilinit to anti-routekeepout. Il, and putting the modified anti-routekeepout. Il file into the same directory of the design file of the application software;

step four: when in application, a user inputs a shortcut instruction on an application software interface: the application software may execute rko the command to automatically generate and present the corresponding first display interface, axlCmdRegister ("rko" route_rk).

In all the above embodiments, as shown in fig. 13, a complete anti-pad setting method is also provided, which includes:

s20, responding to a setting command input by a user on an application display interface, and displaying a selection interface;

s21, responding to a confirmation instruction input by a user on a selection interface, calling a configuration file corresponding to a bonding pad setting module confirmed by the confirmation instruction, and generating and displaying a first display interface;

S22, receiving a second operation instruction of a user on the first display interface, responding to the first operation instruction input by the user on the first display interface, and acquiring the radius, the first expansion value, the second expansion value, the center position and the offset direction of the target bonding pad according to the second operation instruction;

s23, determining first size information of the anti-bonding pad according to the radius and the first expansion value;

s24, determining second size information of the anti-bonding pad according to the first size information and the second expansion value;

s25, determining initial position information of the anti-bonding pad according to the center position, the first size information and the second size information;

s26, carrying out weighting treatment on the second expansion value to obtain a treated second expansion value;

s27, determining the current position of the anti-bonding pad according to the initial position information of the anti-bonding pad;

s28, the anti-bonding pad is offset from the current position according to the offset direction to obtain the offset anti-bonding pad position information;

and S29, generating and displaying a graph corresponding to the anti-bonding pad on the first display interface according to the position information of the anti-bonding pad.

The above steps are described in the foregoing, and the detailed description is referred to the foregoing description, which is not repeated here.

The following provides a method for providing an anti-pad for a polygonal pad, and it should be noted that the "display interface" in the following embodiment is the "first display interface" in the foregoing embodiment.

In one embodiment, as shown in fig. 14, a method for setting an anti-pad is provided, and the method is applied to the computer device in fig. 1 for illustration, and includes the following steps:

s101, responding to a first operation instruction of a user on a display interface, and acquiring attribute information of a target bonding pad on the display interface.

The display interface may include a display area and an input area, where the display area is used to display graphics and attribute parameters corresponding to the bonding pad and the anti-bonding pad, and the attribute parameters may include position information of the bonding pad, position information of the anti-bonding pad, level information of the anti-bonding pad, and the like; the input area comprises an input box, an input control, an input drop-down list and the like, and a user can input parameter information of an anti-bonding pad and the like in the input box; the input control can comprise a running instruction control, a pause instruction control and the like, wherein a user can start the calculation module through the running instruction control to calculate the attribute parameters of the anti-bonding pad according to the parameter information of the anti-bonding pad and the attribute parameters of the bonding pad, and the user can pause the calculation through the pause instruction control. In this embodiment, the display area of the first display interface may include at least one target pad, where the target pad is a circular pad, an elliptical pad, a square pad, a rectangular pad, a polygonal pad, or the like. The content contained in the first display interface corresponding to each type of pad setting module can be the same or different.

The first operation instruction may be an operation instruction generated by triggering an input control by a user on an input area of the display interface, or may be an operation instruction generated by selecting a target pad in the display area of the display interface by the user. For example, the user triggers an operation instruction generated by the operation instruction control on the input area, and at this time, the first operation instruction is used for starting a calculation module, and the calculation module is used for calculating and obtaining the attribute parameters of the anti-bonding pad according to the parameter information of the anti-bonding pad and the attribute parameters of the bonding pad. The user triggers an operation instruction generated by the stop instruction control on the input area, and at the moment, the first operation instruction is used for stopping the calculation module; for another example, the user clicks the target pad in the display area, and at this time, the first operation instruction is used to determine the target pad to be set.

Wherein, the corresponding attribute information of different types of target pads is different. For example, when the target pad is a rectangular pad, the attribute information of the type of target pad includes corner coordinate information of the target pad, a preset flare value of the target pad, a flare direction of the target pad, and the like; when the target pad is a circular pad, the attribute information of the type of target pad includes profile information of the target pad, a preset flare value, an offset direction, and the like. It should be noted that, in this embodiment, the display area of the display interface includes at least one target pad, and the target pad includes at least two pads to be set, where the pads to be set are polygonal pads, for example, the pads to be set are rectangular pads, square pads, triangular pads, and so on.

In the embodiment of the application, because the display area in the display interface may contain a plurality of bonding pads, before the anti-bonding pads are set, a user can determine a target bonding pad from the plurality of bonding pads in the display area in the display interface, namely, the user selects the target bonding pad in the display interface to generate a first operation instruction, and the computer equipment can acquire attribute information of the target bonding pad from the database when receiving the first operation instruction; optionally, after the user selects the target pad in the display area in the display interface, the user triggers the operation instruction control in the input area in the display interface to generate a first operation instruction, and when the computer equipment receives the first operation instruction, the attribute information of the target pad is obtained from the database.

S102, determining the position information of the anti-bonding pad corresponding to the target bonding pad according to the attribute information of the target bonding pad.

In the embodiment of the application, after the attribute information of the target bonding pad is obtained, the position information of the anti-bonding pad can be obtained by calculation according to the attribute information of the target bonding pad; for example, when the target pad is a rectangular pad, the coordinate positions of the four corners on the anti-pad can be obtained by calculation according to the corner coordinate information of the target pad, the preset expansion value, the expansion direction and the like, so as to obtain the corner coordinate information. Optionally, the corresponding relationship between the attribute information of the different types of bonding pads and the position information of the anti-bonding pad may be stored in advance on the computer device, and in practical application, when the computer device obtains the attribute information of the target bonding pad and sets the anti-bonding pad for the target bonding pad, the position information of the anti-bonding pad corresponding to the attribute information of the target bonding pad may be searched directly based on the corresponding relationship, so that the anti-bonding pad is set for the target bonding pad directly according to the searched position information of the anti-bonding pad. It should be noted that, the correspondence between the attribute information of the different types of pads and the position information of the anti-pad may be created in advance, and the position information of the anti-pad may be determined according to the determination rule of the signal integrity and the attribute information of the bonding target pad.

S103, generating and displaying a corresponding graph of the anti-bonding pad on the display interface according to the position information of the anti-bonding pad.

In the embodiment of the application, after the position information of the anti-bonding pad is determined, the coordinate position and the shape of each point or key point on the anti-bonding pad can be determined according to the position information of the anti-bonding pad, finally, a drawing tool is called to generate the graph of the anti-bonding pad corresponding to the target bonding pad according to the coordinate position and the shape of the anti-bonding pad, the graph of the anti-bonding pad is displayed on a display interface, and the hierarchy information of the anti-bonding pad is displayed on the corresponding graph of the anti-bonding pad on the display interface according to the hierarchy information of the anti-bonding pad.

The method for setting the anti-bonding pad provided by the embodiment of the application realizes a method for setting the anti-bonding pad for any type of target bonding pad in a man-machine interaction mode, wherein the anti-bonding pad can be set for the polygonal type bonding pad and the corresponding graph of the anti-bonding pad can be displayed only by responding to a first operation instruction, compared with the existing mode of manually sketching or marking the corresponding anti-bonding pad on a drawing by a professional, the method does not need to sketch the anti-bonding pad manually, and only needs to respond to a series of instructions input by a user, the corresponding graph of the anti-bonding pad can be displayed on a display interface, so that the setting of the anti-bonding pad on an actual circuit board can be completed directly according to the corresponding graph of the anti-bonding pad in the later period, and the efficiency of setting the anti-bonding pad for the target bonding pad is greatly improved.

In one embodiment, an implementation manner of setting an anti-pad by using a square target pad is provided, that is, "determining, according to attribute information of the target pad, location information of the anti-pad corresponding to the target pad" in S102, as shown in fig. 15, includes:

s301, determining initial position information of the anti-bonding pad according to the corner coordinate information and a preset expansion value.

The attribute information of the square target bonding pad comprises corner coordinate information, a preset expansion value and an expansion direction. The preset expansion value is a width value of the target pad, which needs to extend in all directions, that is, the preset expansion value can include one expansion value or multiple expansion values of different types, and in the case of including multiple expansion values, the multiple expansion values can be the same or different.

The initial position information of the anti-pad corresponds to the position information of the anti-pad, and for example, it may include initial corner coordinate information of the anti-pad, and the like.

In the embodiment of the application, after the corner coordinate information and the preset expansion value of the target bonding pad are determined, the initial position information of the anti-bonding pad can be obtained by calculation according to the corner coordinate information and the preset expansion value of the target bonding pad. For example, when the target bonding pad is a square bonding pad and the corresponding anti-bonding pad is also a square anti-bonding pad, determining the width and the height of the target bonding pad and the center point of the target bonding pad according to the corner coordinate information of the target bonding pad, further combining the preset outer expansion value, performing addition operation on the width and the height of the square bonding pad and the preset outer expansion value to obtain the width and the height of the square anti-bonding pad, taking the center point of the target bonding pad as the initial center point of the anti-bonding pad to obtain the initial center point of the anti-bonding pad, and finally obtaining the coordinate of the initial center point of the square anti-bonding pad, the width and the height of the square anti-bonding pad. For example, as shown in FIG. 16, the coordinate position of the center point of two square pads is P ₁ Two square bonding pads with width W ₁ Height is H ₁ And the distance of the two square pads in the horizontal direction determined according to the corner coordinate information of the two square pads is a ₁ And presets the spread value x ₁ Then the initial center point of the anti-pad calculated according to the above method has a coordinate P ₁ An initial width of 2 x (W ₁ +x ₁ )+a ₁ An initial height of H ₁ +2*x ₁ 。

Optionally, when the target pad is a square pad and the corresponding anti-pad is also a square anti-pad, determining the width of the target pad according to the corner coordinate information of the target pad, further determining the width of the square anti-pad according to the width of the target pad and the preset width expansion value, determining the height of the target pad according to the corner coordinate information of the target pad, further determining the height of the square anti-pad according to the height of the target pad and the preset height expansion value, determining the center point of the target pad according to the corner coordinate information of the target pad, and taking the center point of the target pad as the initial center point of the anti-pad to obtain the initial center point of the anti-pad, thereby finally obtaining the coordinates of the initial center point of the square anti-pad, the width and the height of the square anti-pad. For example, as shown in FIG. 17, the coordinate position of the center point of two square pads is P ₂ Two square bonding pads with width W ₂ Height is H ₂ And the distance of the two square pads in the horizontal direction determined according to the corner coordinate information of the two square pads is a ₂ And presets the width spread value x ₂ Presetting a height spread value x ₃ Then the initial center point of the anti-pad calculated according to the above method has a coordinate P ₂ An initial width of 2 x (W ₂ +x ₂ )+a ₂ An initial height of H ₂ +x ₃ 。

Optionally, taking a square anti-pad as an example, an implementation manner of determining the initial position of the anti-pad is provided, that is, the step S301 described above, as shown in fig. 18, includes:

s3010, determining the height information of the anti-bonding pad according to the corner coordinate information and the first expansion value.

Wherein the target pad is a square pad, and the corresponding preset flare value includes a first flare value (i.e., a height flare value) and a second flare value (i.e., a width flare value). The first expansion value is the expansion width, i.e. the height expansion value, of the square bonding pad in the vertical direction. The second spread value is the spread width of the square pad in the horizontal direction, i.e., the width spread value. The height information of the anti-pad refers to height information of the anti-pad in the vertical direction.

In the embodiment of the application, when the target bonding pad is a square bonding pad, the corresponding anti-bonding pad is also a square bonding pad, so that the corner coordinate information of the square bonding pad is determined to determine the height information of the square bonding pad, and the height information of the square bonding pad and twice of the first expansion value are subjected to addition operation, so that the height information of the anti-bonding pad is obtained through calculation. It should be noted that, if the target pads are arranged laterally (for example, as shown in fig. 17), the first spread value and the height information of the target pads are accumulated and calculated, so that the height information of the anti-pads can be determined; if the target pads are arranged longitudinally (as shown in fig. 19), the height information of the anti-pads can be determined by adding up and summing up the two times of the first spread value and the height information of the target pads. For example, see fig. 17 where the square pad has a height information H ₂ And a first spread value of x ₃ Then the height information of the anti-bonding pad determined according to the height information of the square bonding pad and the first expansion value is H ₂ +x ₃ . For another example, see fig. 19 where the height information of two vertically arranged square pads is H ₃ And a first spread value of x ₄ Then the height information of the anti-bonding pad determined according to the height information of the square bonding pad and the first expansion value is H ₂ +2*x ₄ 。

S3011, determining the width information of the anti-bonding pad according to the corner coordinate information and the second expansion value.

The width information of the anti-pad refers to width information of the anti-pad in the horizontal direction.

In the embodiment of the application, after the corner coordinate information of the square bonding pad is obtained, the width information of the square bonding pad and the horizontal distance between the square bonding pads can be determined according to the corner coordinate information of the square bonding pad, and then the width information of the anti-bonding pad is calculated according to the width information of the square bonding pad, the horizontal distance between the square bonding pads and the second expansion value. If the target pads are arranged laterally (e.g., as shown in fig. 17), the second expansion value is calculated and the target pads are solderedThe width information of the disc and the horizontal distance between each square bonding pad are accumulated and calculated, so that the width information of the anti-bonding pad can be determined; if the target pads are arranged longitudinally (as shown in fig. 19), the second expansion value and the width information of the target pads are accumulated and summed, so that the height information of the anti-pads can be determined. For example, see the square pad width information W in FIG. 17 ₂ And a second spread value of x ₂ Then the width information of the anti-pad determined from the height information of the square pad and the second spread value is 2 x (W ₂ +x ₂ )+a ₃ The method comprises the steps of carrying out a first treatment on the surface of the For another example, see the square pad width information W in FIG. 19 ₃ And a second spread value of x ₅ Then the width information of the anti-pad determined according to the height information of the square pad and the second expansion value is W ₃ +x ₅ 。

S3012, determining initial position information of the anti-bonding pad according to the corner coordinate information, the height information and the width information.

In the embodiment of the application, after the corner coordinate information of the target bonding pad, the height information of the anti-bonding pad and the width information of the anti-bonding pad are determined, the center position of the target bonding pad can be determined according to the corner coordinate information of the target bonding pad, the drawing tool is directly called to generate the graph of the anti-bonding pad in the display area according to the center position of the target bonding pad, the height information of the anti-bonding pad and the width information of the anti-bonding pad, and finally the initial position information of the anti-bonding pad, such as the corner coordinate information of the anti-bonding pad, can be obtained based on the graph. For example, as shown in FIG. 17, according to the center position P of the target pad ₂ Width information of anti-pad 2 x (W ₂ +x ₂ )+a ₂ Height information H of anti-pad ₂ +x ₃ The pattern of the square anti-bonding pad can be automatically generated, and the corner coordinate information of each corner on the pattern outline can be obtained. As another example, as shown in FIG. 19, according to the center position P of the target pad ₃ Width information W of anti-pad ₃ +x ₅ Height information H of anti-pad ₃ +2x ₄ The pattern of the square anti-bonding pad can be automatically generated, and the corner coordinate information of each corner on the pattern outline can be obtained.

S302, correcting initial position information of the anti-bonding pad according to the expansion direction, and determining the position information of the anti-bonding pad.

The expansion direction refers to a movement direction of the anti-pad in a plane, and specifically includes a movement direction on a vertical axis and a movement direction on a horizontal axis, for example, a direction moving up or down along the vertical axis or a direction moving left or down along the horizontal axis. It should be noted that, if at least two pads to be disposed are laterally arranged as shown in fig. 17, the outward expansion direction can only be upward or downward; if at least two pads to be disposed are arranged longitudinally as shown in fig. 19, the direction of expansion thereof can be only left or right.

In the embodiment of the application, after the initial position information of the anti-bonding pad is determined, the current position of the anti-bonding pad can be determined according to the initial position information of the anti-bonding pad, the anti-bonding pad is moved according to the expansion direction until the edge, which is farthest from the expansion direction, in the anti-bonding pad is moved to the target edge, at the moment, the movement position of the anti-bonding pad is obtained, and the position information of the anti-bonding pad is determined according to the movement position of the anti-bonding pad. Optionally, the determining the target edge according to the expansion direction includes: when the outward expansion direction is the upward moving direction, the target edge is the bottommost edge where the target bonding pad is positioned; when the outward expansion direction is the downward movement direction, the target edge is the topmost edge where the target bonding pad is positioned; when the outward expansion direction is the leftward movement direction, the target edge is the rightmost edge where the target bonding pad is positioned; when the expansion direction is the rightward moving direction, the target edge is the leftmost edge where the target bonding pad is located. For example, as shown in fig. 20, if the target pad Y and the corresponding anti-pad F move upward along the vertical axis, the bottom edge where the target pad is located is taken as the target edge, and the edge farthest from the edge in the outward expansion direction in the anti-pad is moved to the target edge, so as to obtain the position information of the anti-pad; as shown in fig. 21, if the expansion direction P is horizontal, the target pad Y and the corresponding anti-pad F are moved to the left, the rightmost side of the target pad is taken as the target side, and the side of the anti-pad farthest from the expansion direction is moved to the target side, so as to obtain the position information of the anti-pad.

Optionally, a way to correct the initial position information of the anti-pad according to the expansion direction and determine the position information of the anti-pad is provided below, as shown in fig. 22, where the step S302 "corrects the initial position information of the anti-pad according to the expansion direction and determines the position information of the anti-pad", includes:

s3020, carrying out weighting processing on the first outer expansion value to obtain a processed first outer expansion value.

If the target pads are arranged transversely, the weighting processing includes amplifying or reducing the first spread value, specifically, multiplying the first spread value by a weighting coefficient, where the weighting coefficient may be determined according to the actual spread requirement.

In the embodiment of the present application, after the first outer expansion value is obtained, the first outer expansion value may be weighted to obtain a processed first outer expansion value, so that the processed first outer expansion value is a preset multiple of the first outer expansion value, where the preset multiple may be an integer multiple or a fractional multiple, for example, 1/2 multiple, 1/3 multiple, 2 multiple or 3 multiple, and so on.

Or if the target pads are arranged longitudinally, the weighting processing includes processing of amplifying or reducing the second expansion value, specifically processing of multiplying the second expansion value by a weighting coefficient, where the weighting coefficient can be determined according to the actual expansion requirement.

S3021, determining the current position of the anti-bonding pad according to the initial position information of the anti-bonding pad.

The current position of the anti-pad refers to coordinates of key points on the outline of the anti-pad, such as corner coordinate information of corners on the anti-pad.

In the embodiment of the application, after the initial position information of the anti-bonding pad is determined in the above embodiment, the corner coordinate information of each corner on the anti-bonding pad is determined.

S3022, shifting the anti-bonding pad from the current position according to the expansion direction to obtain the position information of the shifted anti-bonding pad.

In the embodiment of the application, if the target bonding pads are transversely arranged, after the processed first expansion value and the current position of the anti-bonding pads are determined, the anti-bonding pads are moved from the current position according to the offset direction by taking the processed first expansion value as the offset, so that the position information of the offset anti-bonding pads is obtained.

In the embodiment of the application, if the target bonding pads are longitudinally arranged, after the processed second expansion value and the current position of the anti-bonding pad are determined, the anti-bonding pad is moved from the current position according to the offset direction by taking the processed second expansion value as the offset, so that the position information of the offset anti-bonding pad is obtained.

According to the anti-bonding pad setting method provided by the embodiment of the application, the anti-bonding pad can be automatically generated in the surrounding area of the target bonding pad according to the acquired corner coordinate information, the preset outward expansion value and the outward expansion direction, so that the manual delineation of the anti-bonding pad is avoided, and the anti-bonding pad setting efficiency is greatly improved.

In one embodiment, based on the embodiment shown in fig. 14, before responding to the first operation instruction of the user on the display interface, as shown in fig. 23, the method further includes:

s104, receiving a second operation instruction of the user on the display interface.

In the embodiment of the application, before responding to the first operation instruction of the user on the display interface, the user also needs to input a preset expansion value in the input area of the display interface in advance, and trigger to generate the selection instruction of the pad to be set of the display area on the display interface, and the computer equipment can receive the second operation instruction of the user on the display interface.

Correspondingly, when the computer device executes the step of S101 "obtaining the attribute information of the target pad", the steps are specifically executed: and acquiring attribute information of the target bonding pad on the display interface according to the second operation instruction.

Optionally, in the following, a manner of acquiring attribute information of the target pad on the display interface according to a second operation instruction is provided, as shown in fig. 24, where the second operation instruction includes a first selection instruction, a second selection instruction, and an input instruction, and S101 "acquire attribute information of the target pad on the display interface according to the second operation instruction" includes:

s1010, determining a selection sequence of at least two pads to be set on a display interface by a user according to the selection instruction, and determining the expansion direction of the target pad according to the selection sequence.

The selection instruction may include an instruction selected by a user on the display interface to select at least two pads to be set to correspond to each other.

In the embodiment of the application, after the user triggers the selection instruction of the pads to be set on the display interface, the computer equipment can determine the selection sequence of at least two pads to be set, which are sequentially selected by the user on the display interface, according to the received selection instruction, and determine the expansion direction of the target pad according to the selection sequence. For example, if the selection instruction received by the user determines that the user sequentially selects the pads to be set from left to right on the display interface, the expansion direction of the target pad is upward; if the selection instruction received by the user determines that the user sequentially selects the pads to be set from right to left on the display interface, the outward expansion direction of the target pad is up and down; if the selection instruction received by the user determines that the user sequentially selects the pads to be set from top to bottom on the display interface, the outward expansion direction of the target pad is rightward; if the selection instruction received by the user determines that the user sequentially selects the pads to be set from bottom to top on the display interface, the expansion direction of the target pad is leftward.

S1011, determining the identification of the target bonding pad according to the selection instruction, and calling a preset function to obtain the corner coordinate information of the target bonding pad according to the identification of the target bonding pad.

In the embodiment of the application, after the user triggers generation of the selection instruction on the display interface, the computer equipment can acquire the identifier of the target pad from the pad database according to the target pad indicated by the selection instruction, and call the axlDBGetPad function to select the outline information of the target pad corresponding to the identifier of the target pad from the pad database according to the identifier of the target pad. It should be noted that, the correspondence between the pad identifier and the profile information of the pad may be pre-constructed and stored in the pad database, so as to be used for searching.

S1012, extracting a preset expansion value of the target bonding pad from the input instruction.

In the embodiment of the application, after the user inputs the preset expansion value of the target bonding pad in the input area of the display interface, the computer equipment can receive the input instruction of the user and extract the preset expansion value of the target bonding pad from the input instruction. Alternatively, the user may determine the preset spreading value according to Signal Integrity (SI) requirements, or may determine the preset spreading value according to other design requirements.

In one embodiment, on the basis of the embodiment shown in fig. 14, the attribute information further includes hierarchy information, and as shown in fig. 25, the method further includes:

s501, determining the anti-bonding pad layer information according to the target bonding pad layer information.

Wherein the level information of the target pad includes a surface layer and a bottom layer, and the level information of the anti-pad includes a second layer and a penultimate layer.

In the embodiment of the application, after the user triggers the selection instruction of the pad to be set on the display interface, the computer equipment can also determine the identification of the target pad based on the selection instruction triggered by the user, and call the axlDBGetPad function to select the level information of the target pad corresponding to the identification of the target pad from the pad database according to the identification of the target pad. Further, the anti-pad level information may be determined from the target pad level information. For example, the level information of the target pad is the surface layer, and then the level information of the anti-pad is the second layer; the level information of the target pad is the bottom layer, and then the level information of the anti-pad is the penultimate layer.

S502, displaying the hierarchical information of the anti-bonding pad on the corresponding graph of the anti-bonding pad on the display interface.

In the embodiment of the application, after the corresponding graph of the anti-bonding pad is displayed on the display interface and the level information of the anti-bonding pad is determined, the level information of the anti-bonding pad can be displayed on the corresponding graph of the anti-bonding pad on the display interface.

According to the anti-bonding pad setting method, the anti-bonding pad level information is determined based on the target bonding pad level information, and the anti-bonding pad level information is displayed on the corresponding graph of the anti-bonding pad, so that a user can quickly acquire the anti-bonding pad level information, and the anti-bonding pad is set according to the level information, and the anti-bonding pad setting efficiency is further improved.

In one embodiment, as shown in fig. 26, there is further provided a complete anti-pad setting method, including:

s10, receiving a second operation instruction of a user on a display interface;

s11, responding to a first operation instruction of a user on a display interface, and acquiring corner coordinate information, a first expansion value, a second expansion value, an expansion direction and level information of a target bonding pad on the display interface according to a second operation instruction;

s12, determining the height information of the anti-bonding pad according to the corner coordinate information and the first expansion value;

S13, determining width information of the anti-bonding pad according to the corner coordinate information and the second expansion value;

s14, determining initial position information of the anti-bonding pad according to the corner coordinate information, the height information and the width information;

s15, carrying out weighting treatment on the first outer expansion value to obtain a treated first outer expansion value;

s16, determining the current position of the anti-bonding pad according to the initial position information of the anti-bonding pad;

s17, shifting the anti-bonding pad from the current position according to the outward expansion direction to obtain the position information of the shifted anti-bonding pad;

s18, determining the hierarchical information of the anti-bonding pad according to the hierarchical information of the target bonding pad;

and S19, generating and displaying the corresponding graph of the anti-bonding pad on the display interface according to the position information of the anti-bonding pad and the hierarchy information of the anti-bonding pad, and displaying the hierarchy information of the anti-bonding pad on the corresponding graph of the anti-bonding pad.

According to the anti-bonding pad setting method provided by the embodiment of the application, firstly, the attribute information of the target bonding pad on the display interface is acquired in response to the first operation instruction of the user on the display interface, then, the position information of the anti-bonding pad corresponding to the target bonding pad is determined according to the attribute information of the target bonding pad, and then, the corresponding graph of the anti-bonding pad is generated and displayed on the display interface according to the position information of the anti-bonding pad. The method realizes a method for setting the anti-bonding pad for any type of target bonding pad in a man-machine interaction mode, wherein the anti-bonding pad can be set for the bonding pad of the polygon type and the corresponding graph of the anti-bonding pad can be displayed only by responding to a first operation instruction, and compared with the existing mode of manually sketching or marking the corresponding anti-bonding pad on a drawing by a professional, the method does not need to sketch the anti-bonding pad manually, and only needs to respond to a series of instructions input by a user, the corresponding graph of the anti-bonding pad can be displayed on a display interface, so that the setting of the anti-bonding pad on an actual circuit board can be completed directly according to the corresponding graph of the anti-bonding pad in the later period, and the efficiency of setting the anti-bonding pad for the target bonding pad is greatly improved.

It should be understood that, although the steps in the flowcharts related to the embodiments described above are sequentially shown as indicated by arrows, these steps are not necessarily sequentially performed in the order indicated by the arrows. The steps are not strictly limited to the order of execution unless explicitly recited herein, and the steps may be executed in other orders. Moreover, at least some of the steps in the flowcharts described in the above embodiments may include a plurality of steps or a plurality of stages, which are not necessarily performed at the same time, but may be performed at different times, and the order of the steps or stages is not necessarily performed sequentially, but may be performed alternately or alternately with at least some of the other steps or stages.

Based on the same inventive concept, the embodiment of the application also provides an anti-bonding pad setting device for realizing the above-mentioned anti-bonding pad setting method. The implementation of the solution provided by the device is similar to the implementation described in the above method, so the specific limitation in the embodiment of the device for disposing one or more anti-pads provided below may be referred to the limitation of the method for disposing anti-pads hereinabove, and will not be repeated herein.

In an exemplary embodiment, as shown in fig. 27, there is provided an anti-pad setting apparatus including: a presentation module 20, a response module 21 and a generation module 22, wherein:

the display module 20 is configured to respond to a setting command input by a user on the application display interface, and display a selection interface; the selection interface includes a plurality of options; different options correspond to different types of pad setting modules.

And the response module 21 is used for responding to the confirmation instruction input by the user on the selection interface, and generating and displaying the first display interface according to the pad setting module confirmed by the confirmation instruction.

The generating module 22 is configured to obtain, in response to a first operation instruction input by a user on the first display interface, position information of an anti-pad corresponding to the target pad, and generate and display, on the first display interface, a graph of the anti-pad corresponding to the target pad according to the position information.

In an exemplary embodiment, the generating module 22 includes: the device comprises an acquisition unit, a determination unit and a display unit, wherein:

the acquisition unit is specifically used for responding to a first operation instruction input by a user on the first display interface and acquiring attribute information of the target bonding pad;

the determining unit is specifically used for determining the position information of the anti-bonding pad corresponding to the target bonding pad according to the attribute information of the target bonding pad;

The display unit is specifically configured to generate and display a graphic corresponding to the anti-bonding pad on the first display interface according to the position information of the anti-bonding pad.

In an exemplary embodiment, the attribute information includes profile information, a preset spread value, and an offset direction, and the determining unit is specifically configured to determine initial position information of the anti-pad according to the profile information and the preset spread value; and correcting the initial position information of the anti-bonding pad according to the offset direction, and determining the position information of the anti-bonding pad.

In an exemplary embodiment, the profile information includes a center position and radius information, the preset expansion value includes a first expansion value and a second expansion value, and the determining unit is specifically configured to determine first size information of the anti-pad according to the center position, the radius information and the first expansion value, and determine second size information of the anti-pad according to the radius information and the second expansion value; and determining initial position information of the anti-bonding pad according to the outline information, the first size information and the second size information.

In an exemplary embodiment, the determining unit is specifically configured to perform a weighting process on the second outer spread value, to obtain a processed second outer spread value; determining the current position of the anti-bonding pad according to the initial position information of the anti-bonding pad; and (3) shifting the anti-bonding pad from the current position according to the shifting direction to obtain the second expansion value after shifting, and obtaining the position information of the shifted anti-bonding pad.

In an exemplary embodiment, the above apparatus further includes: the receiving module is used for receiving a second operation instruction of a user on the first display interface;

the acquiring unit is specifically configured to acquire attribute information of the target pad according to the second operation instruction.

In an exemplary embodiment, the second operation instruction includes a first selection instruction, a second selection instruction, and an input instruction, and the acquiring unit is specifically configured to determine, according to the first selection instruction, an offset direction of the target pad selected by the user on the first display interface; determining the identification of the target bonding pad according to the second selection instruction, and calling a preset function to obtain the contour information of the target bonding pad according to the identification of the target bonding pad; and extracting a preset expansion value of the target bonding pad from the input instruction.

In an exemplary embodiment, the response module 21 is further configured to, in response to a confirmation instruction input by a user on the selection interface, invoke a configuration file corresponding to the pad setting module confirmed by the confirmation instruction, and generate and display a first display interface.

In an exemplary embodiment, as shown in fig. 28, there is provided an anti-pad setting apparatus including: an acquisition module 10, a first determination module 11 and a generation module 12, wherein:

The acquiring module 10 is configured to respond to a first operation instruction of a user on the display interface, and acquire attribute information of a target pad on the display interface; the target bonding pad comprises at least two bonding pads to be arranged;

a first determining module 11, configured to determine, according to attribute information of the target pad, location information of an anti-pad corresponding to the target pad;

and the generating module 12 is used for generating and displaying the corresponding graph of the anti-bonding pad on the display interface according to the position information of the anti-bonding pad.

In an exemplary embodiment, the attribute information includes corner coordinate information, a preset flare value and a flare direction, and the determining module 11 includes: a determination unit and a correction unit, wherein:

the determining unit is specifically used for determining initial position information of the anti-bonding pad according to the corner coordinate information and a preset expansion value;

the correction unit is specifically used for correcting the initial position information of the anti-bonding pad according to the expansion direction and determining the position information of the anti-bonding pad.

In an exemplary embodiment, the preset expansion value includes a first expansion value and a second expansion value, and the determining unit is specifically configured to determine the anti-pad height information according to the corner coordinate information and the first expansion value; determining width information of the anti-bonding pad according to the corner coordinate information and the second expansion value; and determining initial position information of the anti-bonding pad according to the corner coordinate information, the height information and the width information.

In an exemplary embodiment, the correction unit is configured to perform a weighting process on the first despread value to obtain a processed first despread value; determining the current position of the anti-bonding pad according to the initial position information of the anti-bonding pad; and (3) shifting the anti-bonding pad from the current position according to the expansion direction to obtain the position information of the shifted anti-bonding pad.

In an exemplary embodiment, the above apparatus further includes: the receiving module is used for receiving a second operation instruction of a user on the display interface;

the acquiring module 10 is configured to acquire attribute information of the target pad on the display interface according to the second operation instruction.

In an exemplary embodiment, the second operation instruction includes a selection instruction and an input instruction, and the obtaining module 10 is further configured to determine, according to the selection instruction, a selection order of sequentially selecting at least two pads to be set on the display interface by the user, and determine a direction of expansion of the target pad according to the selection order; determining the identification of the target bonding pad according to the selection instruction, and calling a preset function to obtain corner coordinate information of the target bonding pad according to the identification of the target bonding pad; and extracting a preset expansion value of the target bonding pad from the input instruction.

In an exemplary embodiment, the attribute information further includes hierarchy information, and the apparatus further includes: a second determining module and a display module, wherein:

a second determining module, configured to determine anti-pad level information according to the target pad level information;

and the display module is used for displaying the hierarchical information of the anti-bonding pads on the corresponding graph of the anti-bonding pads on the display interface. The respective modules in the above-described anti-pad setting device may be implemented in whole or in part by software, hardware, or a combination thereof. The above modules may be embedded in hardware or may be independent of a processor in the computer device, or may be stored in software in a memory in the computer device, so that the processor may call and execute operations corresponding to the above modules.

In one exemplary embodiment, a computer device is provided, which may be a terminal, and an internal structure diagram thereof may be as shown in fig. 1. The computer device includes a processor, a memory, an input/output interface, a communication interface, a display unit, and an input means. The processor, the memory and the input/output interface are connected through a system bus, and the communication interface, the display unit and the input device are connected to the system bus through the input/output interface. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The input/output interface of the computer device is used to exchange information between the processor and the external device. The communication interface of the computer device is used for carrying out wired or wireless communication with an external terminal, and the wireless mode can be realized through WIFI, a mobile cellular network, NFC (near field communication) or other technologies. The computer program is executed by a processor to implement a method of anti-pad setting. The display unit of the computer device is used for forming a visual picture, and can be a display screen, a projection device or a virtual reality imaging device. The display screen can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, can also be a key, a track ball or a touch pad arranged on the shell of the computer equipment, and can also be an external keyboard, a touch pad or a mouse and the like.

It will be appreciated by those skilled in the art that the architecture shown in fig. 1 is merely a block diagram of some of the architecture relevant to the present inventive arrangements and is not limiting as to the computer device to which the present inventive arrangements may be implemented, as a particular computer device may include more or less components than those shown, or may be combined with some components, or may have a different arrangement of components.

In an embodiment, there is also provided a computer device comprising a memory and a processor, the memory having stored therein a computer program, the processor implementing the steps of the method embodiments described above when the computer program is executed.

In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored which, when executed by a processor, carries out the steps of the method embodiments described above.

In an embodiment, a computer program product is provided, comprising a computer program which, when executed by a processor, implements the steps of the method embodiments described above.

Those skilled in the art will appreciate that implementing all or part of the above described methods may be accomplished by way of a computer program stored on a non-transitory computer readable storage medium, which when executed, may comprise the steps of the embodiments of the methods described above. Any reference to memory, database, or other medium used in embodiments provided herein may include at least one of non-volatile and volatile memory. The nonvolatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, high density embedded nonvolatile Memory, resistive random access Memory (ReRAM), magnetic random access Memory (Magnetoresistive Random Access Memory, MRAM), ferroelectric Memory (Ferroelectric Random Access Memory, FRAM), phase change Memory (Phase Change Memory, PCM), graphene Memory, and the like. Volatile memory can include random access memory (Random Access Memory, RAM) or external cache memory, and the like. By way of illustration, and not limitation, RAM can be in the form of a variety of forms, such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM), and the like. The databases referred to in the embodiments provided herein may include at least one of a relational database and a non-relational database. The non-relational database may include, but is not limited to, a blockchain-based distributed database, and the like. The processor referred to in the embodiments provided in the present application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic unit, a data processing logic unit based on quantum computing, or the like, but is not limited thereto.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing examples illustrate only a few embodiments of the application and are described in detail herein without thereby limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of the application should be assessed as that of the appended claims.

Claims

1. A method for disposing an anti-pad, the method comprising:

responding to a confirmation instruction input by the user on the selection interface, and generating and displaying a first display interface according to a bonding pad setting module confirmed by the confirmation instruction;

And responding to a first operation instruction input by the user on the first display interface, acquiring the position information of the anti-bonding pad corresponding to the target bonding pad, and generating and displaying the graph of the anti-bonding pad corresponding to the target bonding pad on the first display interface according to the position information.

2. The method of claim 1, wherein the responding to the first operation instruction input by the user on the first display interface, obtaining the position information of the anti-pad corresponding to the target pad, and generating and displaying the graph of the anti-pad corresponding to the target pad on the first display interface according to the position information, includes:

responding to a first operation instruction input by a user on the first display interface, and acquiring attribute information of the target bonding pad;

3. The method of claim 2, wherein the attribute information includes profile information, a preset flare value, and an offset direction; the determining the position information of the anti-bonding pad corresponding to the target bonding pad according to the attribute information of the target bonding pad comprises the following steps:

Determining initial position information of the anti-bonding pad according to the profile information and the preset expansion value;

4. The method of claim 3, wherein the profile information includes a center location and a radius, the preset flare value includes a first flare value and a second flare value, and the determining initial location information of the anti-pad based on the profile information and the preset flare value includes:

determining first size information of the anti-bonding pad according to the radius and the first expansion value;

determining second size information of the anti-bonding pad according to the first size information and the second expansion value;

and determining initial position information of the anti-bonding pad according to the center position, the first size information and the second size information.

5. The method of claim 4, wherein the correcting the initial position information of the anti-pad according to the offset direction, determining the position information of the anti-pad, comprises:

and shifting the anti-bonding pad from the current position according to the shifting direction by the processed second expansion value to obtain the position information of the shifted anti-bonding pad.

6. A method according to claim 3, wherein prior to said responding to a first user operation instruction on said first display interface, said method further comprises:

receiving a second operation instruction of the user on the first display interface;

the obtaining the attribute information of the target bonding pad includes:

7. The method of claim 6, wherein the second operation instruction includes a first selection instruction, a second selection instruction, and an input instruction, and wherein the obtaining attribute information of the target pad according to the second operation instruction includes:

determining the offset direction of the target pad selected by the user on the first display interface according to the first selection instruction;

8. The method of claim 1, wherein the responding to the confirmation instruction input by the user on the selection interface, the pad setting module confirmed according to the confirmation instruction generates and displays a first display interface, comprises:

and responding to the confirmation instruction input by the user on the selection interface, calling a configuration file corresponding to the bonding pad setting module confirmed by the confirmation instruction, and generating and displaying the first display interface.

9. A computer device comprising a memory and a processor, the memory storing a computer program, characterized in that the processor implements the steps of the method of any one of claims 1 to 8 when the computer program is executed.

10. A computer readable storage medium, on which a computer program is stored, characterized in that the computer program, when being executed by a processor, implements the steps of the method of any of claims 1 to 8.