CN117109340A - Printed circuit board type heat exchanger with cross flow structure and manufacturing method - Google Patents
Printed circuit board type heat exchanger with cross flow structure and manufacturing method Download PDFInfo
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- CN117109340A CN117109340A CN202311256736.0A CN202311256736A CN117109340A CN 117109340 A CN117109340 A CN 117109340A CN 202311256736 A CN202311256736 A CN 202311256736A CN 117109340 A CN117109340 A CN 117109340A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 238000005192 partition Methods 0.000 claims abstract description 11
- 238000005530 etching Methods 0.000 claims description 13
- 238000003754 machining Methods 0.000 claims description 13
- 238000004140 cleaning Methods 0.000 claims description 12
- 238000003466 welding Methods 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 11
- 239000012530 fluid Substances 0.000 description 20
- 238000012546 transfer Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000005482 strain hardening Methods 0.000 description 2
- DDTVVMRZNVIVQM-UHFFFAOYSA-N 2-(1-azabicyclo[2.2.2]octan-3-yloxy)-1-cyclopentyl-1-phenylethanol;hydrochloride Chemical compound Cl.C1N(CC2)CCC2C1OCC(O)(C=1C=CC=CC=1)C1CCCC1 DDTVVMRZNVIVQM-UHFFFAOYSA-N 0.000 description 1
- 229910000885 Dual-phase steel Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 206010028980 Neoplasm Diseases 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D9/04—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being formed by spirally-wound plates or laminae
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/0219—Arrangements for sealing end plates into casing or header box; Header box sub-elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/22—Arrangements for directing heat-exchange media into successive compartments, e.g. arrangements of guide plates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The invention provides a printed circuit board type heat exchanger with a cross flow structure and a manufacturing method thereof, wherein the printed circuit board type heat exchanger comprises a pipe core arranged on a support, a pipe box is arranged at the end part of the pipe core, the pipe core comprises an upper end plate and a lower end plate which are arranged in parallel, a first plate body, a second plate body and a partition plate are periodically and sequentially arranged between the upper end plate and the lower end plate, and the first plate body and the second plate body are respectively provided with a flow passage for a first working medium to flow along a first direction and a second working medium to flow along a second direction. The printed circuit board type heat exchanger can perform transverse heat exchange and longitudinal heat exchange at the same time, and has high heat exchange efficiency; the first working medium or the second working medium is prevented from flowing or even being short-circuited between the first plate body and the second plate body, the operation is stable and reliable, and the production and the processing are convenient.
Description
Technical Field
The invention relates to the technical field of heat exchange equipment, in particular to a printed circuit board type heat exchanger with a cross flow structure and a manufacturing method thereof.
Background
The printed circuit board type heat exchanger (Printed Circuit Heat Exchanger, PCHE for short) is a high-efficiency compact heat exchanger with excellent heat transfer performance, has the advantages of high and low temperature resistance, high pressure resistance, compact structure, small volume, high heat transfer area density, difficult leakage and the like, is widely applied to the fields of petrochemical industry, ocean engineering, nuclear energy, thermal power, ships, hydrogen energy and the like, and belongs to system core equipment. The heat exchanger forms a runner on the metal heat exchange plates by means of etching or machining and the like, and after a plurality of metal heat exchange plates are laminated and combined, a diffusion welding method is utilized to form a heat exchange core body. However, each layer of plate flow channel of the conventional core body can only circulate the same fluid (cold fluid or hot fluid), so that the cold fluid and the hot fluid can only exchange heat longitudinally and are difficult to exchange heat transversely, and the heat exchange efficiency is low.
Therefore, the Chinese patent of application number 201610636285.7 discloses an interchange type microchannel efficient compact heat exchanger, wherein part of flow channels of an upper layer plate and a lower layer plate are opened through the design of inlet and outlet flow channels of the heat exchanger so as to realize the purpose of three-dimensional fluid arrangement of cold and hot flow channels in a printed circuit board; however, as the flow channels are processed on one side, the communication between different plate layers is realized through the parallel communicated openings, when the number of the flow channels is required to be expanded, the parallel communicated openings limit the staggered expansion of the flow channels, the hollowed-out flow channels are required to be staggered through the two through holes, and the processing difficulty is high, because the flow channel spacing of the staggered through holes is increased, and the flow channels cannot be closely distributed.
In view of this, the present invention has been made.
Disclosure of Invention
The invention solves the problems that the structure of the traditional printed circuit board type heat exchanger is unreasonable and the heat exchange efficiency is still not ideal.
In order to solve the problems, the invention provides a printed circuit board type heat exchanger with a cross flow structure, which comprises a tube core arranged on a support, wherein a tube box is arranged at the end part of the tube core, the tube core comprises an upper end plate and a lower end plate which are arranged in parallel, a first board body, a second board body and a partition board are periodically and sequentially arranged between the upper end plate and the lower end plate, and the first board body and the second board body are respectively provided with a flow passage for a first working medium to flow along a first direction and a second working medium to flow along a second direction.
The printed circuit board type heat exchanger with the cross flow structure can perform transverse heat exchange and longitudinal heat exchange at the same time, and has high heat exchange efficiency; meanwhile, the structure is compact, the thickness of the first plate body and the thickness of the second plate body can be set according to the requirements, and the operation is stable and reliable. Preferably, the left end and the right end of the upper end plate and the lower end plate are provided with pipe boxes.
Preferably, the upper surface of the first plate body is alternately provided with a first flow channel and a second flow channel, the first flow channel is used for conveying a first working medium, two ends of the second flow channel are respectively provided with a first through hole penetrating through the first plate body, the lower surface of the first plate body is provided with a third flow channel perpendicular to the second flow channel, and one end of the third flow channel is communicated with the second flow channel through the first through hole and is used for conveying a second working medium. The device has a simple structure and is convenient for large-scale production and processing.
Preferably, the third flow channels are two and are respectively positioned at two sides of the second flow channel. Preferably, the second flow channels are multiple and arranged in a staggered manner, that is to say: the distance between the second flow channel and the end part of the first plate body in the length direction is gradually increased or decreased. The third flow channel has a plurality of lengths which gradually increase or decrease, and preferably, the length of the third flow channel near the edge of the first plate body is greater than the length of the third flow channel near the center of the first plate body.
Preferably, a fourth runner and a sixth runner are alternately arranged on the upper surface of the second plate body, a fifth runner perpendicular to the fourth runner is further arranged on the upper surface of the second plate body, and two fifth runners are respectively communicated with two ends of the fourth runner and used for conveying a second working medium; second through holes are formed in two ends of the sixth flow passage, a seventh flow passage is formed in the lower surface of the second plate body, and the seventh flow passage is communicated with the sixth flow passage through the second through holes.
Preferably, the fifth flow channels have a plurality of lengths which sequentially decrease or increase, and the sixth flow channels have a plurality of lengths which are staggered, that is to say: the distance between the Liu Liudao th plate and the end part of the second plate body is gradually increased or decreased, and the end part refers to two ends of the second plate body in the length direction.
The first plate body and the second plate body are processed in double sides, and the communication between different plate layers is realized through working medium through holes which are staggered in steps, so that the length of the working medium heat exchange area flow channel is not influenced when the number of flow channels is required to be expanded; the first working medium and the second working medium form cross flow, and meanwhile, longitudinal heat exchange and transverse heat exchange are realized, so that the heat exchange efficiency is greatly improved, and the volume of the heat exchanger is reduced.
Preferably, the projections of the first through hole and the second through hole on the horizontal plane are not overlapped. The arrangement can ensure that the first working medium and the second working medium are arranged alternately on the longitudinal axis direction of the first plate body and the second plate body, the space between the flow passages is not increased, the compactness of the flow passage structure is ensured, meanwhile, the first working medium or the second working medium is arranged in parallel between the first plate body and the second plate body, and the flowing direction of the working medium can be standardized to ensure good heat exchange.
Preferably, the projections of the first runner and the fourth runner on the horizontal plane are collinear, and the projections of the second runner and the sixth runner on the horizontal plane are collinear. The heat exchanger has compact structure and high heat exchange efficiency.
Preferably, the flow channel is formed into a linear structure, a Z-shaped structure or an S-shaped structure by etching or machining. Preferably, the longitudinal section of the runner is semicircular, and the diameter of the circle where the semicircle is located is 1-6mm.
The invention also provides a manufacturing method of the printed circuit board type heat exchanger with the cross flow structure, which comprises the following steps: step 1), respectively coating photoresist on the front surface and the back surface of a first plate body, exposing at a designated position to develop positions of a first runner, a second runner and a third runner positioned on the back surface, etching the corresponding positions to form the first runner, the second runner and the third runner, and removing the film for cleaning; the processing method is mature, simple and reliable and has strong operability. Step 2), fixing a first plate body through a positioning tool, and cleaning the first plate body through machining to form a first through hole so as to remove metal scraps; step 3), photoresist is coated on the front surface and the back surface of the second plate body respectively, exposure is carried out at a designated position to develop positions of a fourth runner, a fifth runner, a sixth runner and a seventh runner positioned on the back surface, etching processing is carried out on the corresponding positions to form the fourth runner, the fifth runner, the sixth runner and the seventh runner positioned on the back surface, and then film stripping and cleaning are carried out; step 4), fixing a second plate body through a positioning tool, and cleaning the second plate body through machining to form a second through hole so as to remove metal scraps; step 5), sequentially and circularly arranging the second plate body, the first plate body and the partition plate on the lower end plate, and performing vacuum diffusion welding after arranging the upper end plate on the top to form a tube core; and 6) welding the pipe box and the support on the pipe core by adopting argon arc welding of welding rods.
According to the printed circuit board type heat exchanger, the first board body and the second board body are subjected to double-sided processing by combining etching processing and machining, so that the heat exchange efficiency is high; meanwhile, working mediums in the adjacent first plate body and second plate body cannot cross to generate short circuit, and the operation is stable and reliable.
Compared with the prior art, the printed circuit board type heat exchanger has the following beneficial effects: 1) The first plate body or the second plate body can fully perform transverse heat exchange, and the first plate body and the second plate body can perform longitudinal heat exchange, so that the heat exchange efficiency is high, and the volume of the heat exchanger is reduced; 2) The first through holes and the second through holes are arranged in a staggered manner, so that the first working medium or the second working medium is prevented from flowing or even being short-circuited between the first plate body and the second plate body, and the operation is stable and reliable; 3) The etching processing and the machining are combined, the runner is processed on two sides, and the structure is simple, so that the production and the processing are convenient; 4) The cold and hot flow channels on the heat exchange plates are arranged in a staggered manner, the projection of the flow channels is consistent with that of the conventional flow channels, the space between the transverse flow channels is not increased, the compactness of the flow channel structure is ensured, the number of the flow channels can be increased or decreased according to the width of the plates, compared with the existing three-dimensional micro-channel heat exchanger, the communication between different plate layers is realized through the working medium through holes arranged in a staggered manner in steps, and when the number of the flow channels is required to be expanded, the length of the flow channels of the working medium heat exchange area is not influenced; the semicircular flow passage sections are spliced to form a complete circular section, so that the distance between the longitudinal flow passages is further reduced, and the heat exchange efficiency is improved.
Drawings
Fig. 1 is an overall schematic view of a printed circuit board heat exchanger according to embodiment 1 of the present invention;
FIG. 2 is a schematic structural view of a core according to embodiment 1 of the present invention;
FIG. 3 is a longitudinal cross-sectional view of the core of FIG. 2 taken along side A-A;
FIG. 4 is a schematic structural view of the arrangement of the flow channels in the first plate according to embodiment 1 of the present invention;
fig. 5 is a first view of the first plate and the second plate according to embodiment 1 of the present invention;
FIG. 6 is a second view of the first plate according to embodiment 1 of the present invention
FIG. 7 is a schematic view of the structure of the arrangement of the flow channels in the second plate according to embodiment 1 of the present invention;
fig. 8 is a first view of a second plate according to embodiment 1 of the present invention;
fig. 9 is a second view of the second plate according to embodiment 1 of the present invention;
FIG. 10 is a temperature cloud chart of a section of a runner middle section of a conventional printed circuit board type heat exchanger;
FIG. 11 is a temperature cloud of the middle section of a printed circuit board heat exchanger according to the present invention;
FIG. 12 is a graph comparing heat transfer coefficients of the present invention and a conventional printed circuit board heat exchanger;
FIG. 13 is a schematic view of a longitudinal section of the middle portion of the core according to example 2 of the present invention;
fig. 14 is an exploded view of the core according to embodiment 2 of the present invention.
Reference numerals illustrate:
1-a tube box; 2-die; 3-supporting seats; 4-an upper end plate; 5-a first plate body; 501-a first flow channel; 502-a second flow channel; 503-a first via; 504-third flow path; 6-a second plate body; 601-fourth flow channel; 602-a fifth flow channel; 603. a sixth flow passage; 604-a second via; 605-seventh flow channel; 7-a separator; 8-lower end plate.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. It should be noted that the technical features of the present invention may be combined with each other without collision.
At present, a printed circuit board type heat exchanger is a two-dimensional fluid distribution structure formed by alternately superposing a cold fluid plate layer and a hot fluid plate layer, namely, only cold fluid or hot fluid flows on a single fluid plate layer. The cold and hot fluid is distributed in a two-dimensional flow mode at most under the structural arrangement, only the upper face and the lower face of the hot fluid are in contact cooling with the cold fluid, and the left face and the right face of the hot fluid are still in contact with the hot fluid. Therefore, the chinese patent of application No. 202011615091.1 discloses a three-ply spiral wound printed circuit board type heat exchanger, which is formed by sequentially overlapping and welding a double-sided etched runner board, a perforated single-sided etched board and a reverse-buckled perforated single-sided etched board, so that three kinds of tumor bodies can perform heat exchange simultaneously. But this scheme can lead to same kind of liquid to communicate and influence the heat transfer effect behind the multilayer owing to the through-hole of setting, and actual heat transfer effect remains to improve. For this, the applicant proposes the following technical solutions:
example 1
As shown in fig. 1-3, the printed circuit board type heat exchanger with the cross flow structure comprises a tube core 2 arranged on a support 3, wherein a tube box 1 is arranged at the end part of the tube core 2, the tube box 1 comprises a first inlet cover and a first outlet cover which are arranged along a first direction and communicated with the tube core 2 and used for flowing a first working medium, and the tube box 1 further comprises a second inlet cover and a second outlet cover which are arranged along a second direction and communicated with the tube core 2 and used for flowing a second working medium.
Preferably, the die 2 comprises an upper end plate 4 and a lower end plate 8 which are arranged in parallel, a first plate body 5, a second plate body 6 and a partition plate 7 are periodically and sequentially arranged between the upper end plate 4 and the lower end plate 8, and flow channels for flowing a first working medium and a second working medium are respectively arranged on the first plate body 5 and the second plate body 6.
The first plate body 5, the second plate body 6 and the partition plate 7 can be made of austenitic stainless steel, dual-phase steel, nickel-based alloy or titanium. Preferably, the projections of the first plate 5, the second plate 6 and the partition 7 on the horizontal plane are mutually overlapped, that is, the shapes of the first plate 5, the second plate 6 and the partition 7 are the same, and the thicknesses of the first plate 5, the second plate 6 and the partition 7 can be the same or different.
The hydraulic diameter of the runner is 1-6mm, the runner can be formed by etching or machining and the like, the runner can be in a linear structure, a Z-shaped structure or an S-shaped structure, and the longitudinal section of the runner is in a semicircular structure or a rectangular structure. The first working medium and the second working medium can adopt a forward flow or reverse flow mode, and the main first working medium and the second working medium in the tube core 2 form cross flow, namely each first working medium is surrounded by cold fluid of the second working medium, and meanwhile, longitudinal heat exchange and transverse heat exchange are realized. As an example of the present invention, the first working medium is a high-temperature fluid, and the second working medium is a low-temperature fluid.
As shown in fig. 4-6, the upper surface of the first plate body 5 is alternately provided with a first flow channel 501 and a second flow channel 502, the first flow channel 501 is used for conveying a first working medium, two ends of the second flow channel 502 are respectively provided with a first through hole 503 penetrating through the first plate body 5, the lower surface of the first plate body 5 is provided with a third flow channel 504 perpendicular to the second flow channel 502, and one end of the third flow channel 504 is communicated with the second flow channel 502 through the first through hole 503 and is used for conveying a second working medium.
As shown in fig. 7-9, the upper surface of the second plate body 6 is alternately provided with a fourth runner 601 and a sixth runner 603, the upper surface of the second plate body 6 is also provided with a fifth runner 602 perpendicular to the fourth runner 601, and the fifth runners 602 are two and respectively communicated with two ends of the fourth runner 601 for conveying a second working medium; second through holes 604 are formed at two ends of the fourth flow channel 601, a seventh flow channel 605 is formed on the lower surface of the second plate body 6, and the seventh flow channel 605 is coplanar with the fourth flow channel 601 and is communicated with the fourth flow channel through the second through holes 604.
The first plate body 5 and the second plate body 6 are processed on two sides, and the communication between different plate layers is realized through working medium through holes which are staggered in steps, so that the length of the working medium heat exchange area flow channels is not influenced when the number of flow channels is required to be expanded; the first working medium and the second working medium form cross flow, and meanwhile, longitudinal heat exchange and transverse heat exchange are realized, so that the heat exchange efficiency is greatly improved, and the volume of the heat exchanger is reduced. Preferably, the length of the sixth flow channel 603 is smaller than the length of the fourth flow channel 601, and the sixth flow channel 603 is located between the adjacent fifth flow channels 602. The arrangement can avoid the first working medium or the second working medium from flowing between the first plate body and the second plate body and even from short circuit, and the operation is stable and reliable.
Preferably, the projections of the first flow channel 501 and the fourth flow channel 601 on the horizontal plane are collinear, the projections of the second flow channel 502 and the sixth flow channel 603 on the horizontal plane are collinear, and the projections of the first through hole 503 and the second through hole 604 on the horizontal plane are not overlapped. The arrangement can ensure that the first working medium and the second working medium of the first plate body 5 and the second plate body 6 are arranged alternately in the longitudinal axis direction, the space between the flow passages is not increased, the compactness of the flow passage structure is ensured, meanwhile, the heat exchange can be fully realized, and meanwhile, the first working medium or the second working medium is arranged in parallel between the first plate body 5 and the second plate body 6, so that the flowing direction of the working medium can be standardized to ensure good heat exchange. The specific number of the flow channels can be appropriately increased or decreased according to the width of the plate body.
The working principle of the printed circuit board type heat exchanger is as follows: after the first working medium and the second working medium enter the tube core 2, the first working medium and the second working medium enter the pipelines of the first plate body 5 and the second plate body 6 in parallel for flow heat exchange; specifically, in the first plate body 5, the first working medium enters the first flow channel 501 to be conveyed forwards, and the second working medium sequentially enters the third flow channel 504, the first through hole 503, the second flow channel 502 and the third flow channel 504 to be conveyed forwards and to perform transverse heat exchange with the first working medium;
in the second plate body 6, the first working medium sequentially enters the seventh flow channel 605, the second through hole 604, the sixth flow channel 603, the second through hole 604 and the seventh flow channel 605 for forward conveying, the second working medium sequentially enters the fifth flow channel 602, the fourth flow channel 601 and the fifth flow channel 602 for forward conveying, and the first working medium and the second working medium perform transverse heat exchange.
Meanwhile, the first working medium positioned in the first flow channel 501, the second working medium positioned in the fourth flow channel 601, the second working medium positioned in the second flow channel 502 and the first working medium positioned in the sixth flow channel 603 perform longitudinal heat exchange, so that the heat exchange efficiency is high.
As an example of the present invention, the printed circuit board type heat exchanger is prepared by the following method:
step 1), respectively coating photoresist on the front side and the back side of the first plate body 5, exposing at a designated position to develop positions of a first flow channel 501, a second flow channel 502 and a third flow channel 504 positioned on the back side, etching the corresponding positions to form the first flow channel 501, the second flow channel 502 and the third flow channel 504, and removing the film for cleaning; the processing method is mature, simple and reliable and has strong operability.
Step 2), fixing the first plate body 5 through a positioning tool, and cleaning the first plate body 5 through machining to form a first through hole 503 so as to remove metal scraps;
step 3), photoresist is coated on the front surface and the back surface of the second plate body 6 respectively, exposure is carried out at a designated position to develop the positions of a fourth runner 601, a fifth runner 602, a sixth runner 603 and a seventh runner 605 positioned on the back surface, etching processing is carried out on the corresponding positions to form the fourth runner 601, the fifth runner 602, the sixth runner 603 and the seventh runner 605 positioned on the back surface, and film removal cleaning is carried out;
step 4), fixing the second plate body 6 through a positioning tool, and cleaning the second plate body 6 through machining to form a second through hole 604 so as to remove metal scraps;
sequentially and circularly arranging a second plate body 6, a first plate body 5 and a partition plate 7 on a lower end plate 8 on the step 5), and performing vacuum diffusion welding after arranging an upper end plate 4 on the top to form a tube core 2;
and 6) welding the tube box 1 and the support 3 on the tube core 2 by adopting argon arc welding.
The printed circuit board type heat exchanger disclosed by the invention has the advantages that the double-sided processing is carried out on the first board body 5 and the second board body 6 by combining etching processing and machining, so that the heat exchange efficiency is high, as shown in figures 10-12; meanwhile, working mediums in the adjacent first plate body 5 and second plate body 6 cannot cross to generate short circuit, and the operation is stable and reliable. It should be noted that: conventional printed circuit board type heat exchangers are generally provided with a hot working medium flow passage on one layer, and a cold working medium flow passage on one side, so that the hot working medium flow passage and the cold working medium flow passage are alternately arranged between layers.
Example 2
In order to further improve the heat exchange efficiency, the applicant carries out the following improvement on the basis of the embodiment 1:
as shown in fig. 13 and 14, the lower panel of the partition 7 is etched with a flow channel corresponding to the upper panel of the first plate 5, and simultaneously the lower panel of the first plate 5 is etched with a flow channel corresponding to the upper panel of the second plate 6, so that the semicircular flow channel sections are spliced to form a complete circular section after assembly, the longitudinal flow channel spacing is further reduced, and the heat exchange efficiency is improved.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.
Claims (8)
1. The utility model provides a printed circuit board formula heat exchanger with cross flow structure, its characterized in that, including establishing die (2) on support (3), the tip of die (2) sets up tube case (1), die (2) are including upper end plate (4), lower end plate (8) of parallel arrangement, first plate body (5), second plate body (6), baffle (7) have been arranged in order to periodicity between upper end plate (4), the lower end plate (8), first plate body (5), second plate body (6) all are equipped with the runner that is used for first working medium to flow along first direction, second working medium to flow along the second direction.
2. The printed circuit board type heat exchanger with the cross flow structure according to claim 1, wherein the upper surface of the first board body (5) is alternately provided with a first flow channel (501) and a second flow channel (502), the first flow channel (501) is used for conveying a first working medium, two ends of the second flow channel (502) are respectively provided with a first through hole (503) penetrating through the first board body (5), the lower surface of the first board body (5) is provided with a third flow channel (504) perpendicular to the second flow channel (502), and one end of the third flow channel (504) is communicated with the second flow channel (502) through the first through hole (503) and is used for conveying the second working medium.
3. The printed circuit board type heat exchanger with the cross flow structure according to claim 2, wherein a fourth runner (601) and a sixth runner (603) are alternately arranged on the upper surface of the second board body (6), a fifth runner (602) perpendicular to the fourth runner (601) is further arranged on the upper surface of the second board body (6), and two fifth runners (602) are respectively communicated with two ends of the fourth runner (601) and used for conveying a second working medium; second through holes (604) are formed in two ends of the sixth flow channel (603), a seventh flow channel (605) is formed in the lower surface of the second plate body (6), and the seventh flow channel (605) is communicated with the sixth flow channel (603) through the second through holes (604).
4. A printed circuit board heat exchanger with a cross-flow structure according to claim 3, characterized in that the projections of the first through hole (503), the second through hole (604) on the horizontal plane do not overlap.
5. The printed circuit board type heat exchanger with the cross flow structure according to claim 4, wherein the projections of the first flow channel (501) and the fourth flow channel (601) on the horizontal plane are collinear, and the projections of the second flow channel (502) and the sixth flow channel (603) on the horizontal plane are collinear.
6. The printed circuit board type heat exchanger with the cross flow structure according to claim 1, wherein the flow channels are formed into a linear structure, a Z-shaped structure or an S-shaped structure by etching or machining.
7. The printed circuit board type heat exchanger with the cross-flow structure according to claim 6, wherein the longitudinal section of the flow channel is semicircular, and the diameter of a circle where the semicircle is located is 1-6mm.
8. A method of manufacturing a printed circuit board heat exchanger having a cross-flow configuration as in any of claims 1-7, comprising:
step 1), respectively coating photoresist on the front side and the back side of a first plate body (5), exposing at a designated position to develop positions of a first flow channel (501), a second flow channel (502) and a third flow channel (504) positioned on the back side, etching the corresponding positions to form the first flow channel (501), the second flow channel (502) and the third flow channel (504), and removing the film for cleaning;
step 2), fixing a first plate body (5) through a positioning tool, and cleaning the first plate body (5) through machining to form a first through hole (503) so as to remove metal scraps;
step 3), respectively coating photoresist on the front side and the back side of the second plate body (6), exposing at a designated position to develop positions of a fourth runner (601), a fifth runner (602), a sixth runner (603) and a seventh runner (605) positioned on the back side, etching the corresponding positions to form the fourth runner (601), the fifth runner (602), the sixth runner (603) and the seventh runner (605) positioned on the back side, and removing the film for cleaning;
step 4), fixing a second plate body (6) through a positioning tool, and cleaning the second plate body (6) through machining to form a second through hole (604) so as to remove metal scraps;
step 5), sequentially and circularly arranging the second plate body (6), the first plate body (5) and the partition plates (7) on the lower end plate (8), and performing vacuum diffusion welding after arranging the upper end plate (4) on the top to form a tube core (2);
and 6) welding the tube box (1) and the support (3) on the tube core (2) by adopting argon arc welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311256736.0A CN117109340A (en) | 2023-09-27 | 2023-09-27 | Printed circuit board type heat exchanger with cross flow structure and manufacturing method |
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| CN202311256736.0A CN117109340A (en) | 2023-09-27 | 2023-09-27 | Printed circuit board type heat exchanger with cross flow structure and manufacturing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117479420A (en) * | 2023-12-28 | 2024-01-30 | 西安交通大学 | Printed circuit board heat exchanger core body with cold and hot runners arranged in same layer |
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- 2023-09-27 CN CN202311256736.0A patent/CN117109340A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117479420A (en) * | 2023-12-28 | 2024-01-30 | 西安交通大学 | Printed circuit board heat exchanger core body with cold and hot runners arranged in same layer |
| CN117479420B (en) * | 2023-12-28 | 2024-04-05 | 西安交通大学 | Printed circuit board heat exchanger core body with cold and hot runners arranged in same layer |
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