CN117103888A - Printing method with semiconductor label, semiconductor label and product - Google Patents
Printing method with semiconductor label, semiconductor label and product Download PDFInfo
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- CN117103888A CN117103888A CN202311130430.0A CN202311130430A CN117103888A CN 117103888 A CN117103888 A CN 117103888A CN 202311130430 A CN202311130430 A CN 202311130430A CN 117103888 A CN117103888 A CN 117103888A
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- semiconductor
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- transfer
- ink
- printing
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 434
- 238000007639 printing Methods 0.000 title claims abstract description 87
- 238000000034 method Methods 0.000 title claims abstract description 53
- 239000000853 adhesive Substances 0.000 claims abstract description 44
- 238000005516 engineering process Methods 0.000 claims abstract description 22
- 239000010410 layer Substances 0.000 claims description 288
- 230000001681 protective effect Effects 0.000 claims description 84
- 230000001070 adhesive effect Effects 0.000 claims description 33
- 238000004806 packaging method and process Methods 0.000 claims description 21
- 239000003292 glue Substances 0.000 claims description 18
- 238000010023 transfer printing Methods 0.000 claims description 17
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 2
- 239000000976 ink Substances 0.000 description 302
- 239000012780 transparent material Substances 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 4
- 229920006255 plastic film Polymers 0.000 description 4
- 229920006254 polymer film Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000004753 textile Substances 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- -1 Polyethylene terephthalate Polymers 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/025—Duplicating or marking methods; Sheet materials for use therein by transferring ink from the master sheet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
- B41M1/30—Printing on other surfaces than ordinary paper on organic plastics, horn or similar materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
Abstract
The application provides a printing method with a semiconductor label, the semiconductor label and a product. Therefore, when the semiconductor label printed by the method is transferred to the appointed product, the semiconductor label is not adhered to the appointed product through the self-adhesive, but is transferred to the appointed product through the transfer technology, so that the semiconductor label can be firmly transferred to the appointed product for a long time.
Description
Technical Field
The present application relates to the field of semiconductor technologies, and in particular, to a printing method with a semiconductor label, and a product.
Background
In order to meet different requirements of different application scenes on the radio frequency performance parameters of the semiconductor, various semiconductor antennas, namely the manufacturing process of the radio frequency antenna, such as the manufacturing process of the RFID antenna, appear. At present, all the semiconductor tags manufactured by the radio frequency antenna manufacturing process are required to be adhered to a required product by using a self-adhesive, and in practical application, materials (such as plastic films or papers) for bearing the radio frequency antenna are required to be used, and the manufactured radio frequency antenna plastic films, namely the semiconductor tags, are specifically required to be adhered to corresponding bearing objects through the self-adhesive, but the self-adhesive is easy to dry and fall off along with the time and the influence of the environment, so that the semiconductor tags manufactured by the radio frequency antenna are difficult to be firmly adhered to the specified product for a long time.
Disclosure of Invention
In view of the above, the present application provides a printing method with a semiconductor label, and a product, which can firmly transfer the semiconductor label to a specified product for a long period of time, thereby integrating the semiconductor label with the specified product.
Specifically, the application is realized by the following technical scheme:
in a first aspect, an embodiment of the present application provides a printing method with a semiconductor label, the transfer printing method including:
The first step, printing transfer ink on the paved set base layer;
secondly, after the transfer ink is dried, printing conductive ink on the transfer ink layer in a mode of forming a set tag antenna;
thirdly, binding the semiconductor to be packaged in a set binding area on the conductive ink layer by using special semiconductor reverse packaging equipment after the conductive ink is dried; the number of the binding areas is greater than or equal to 1, and the number of semiconductors bound by each binding area is greater than or equal to 1;
and fourthly, printing transfer glue on the transfer ink layer in a mode of covering the semiconductor and the conductive ink after the semiconductor is bound, and finally obtaining a printed semiconductor label after the transfer glue is dried so as to be transferred onto a designated product through a transfer printing technology.
In a second aspect, an embodiment of the present application provides a semiconductor tag with a semiconductor, the semiconductor tag including:
the base layer is formed by a base layer,
the transfer ink layer is flatly paved and adhered on the base layer;
the conductive ink layer is flatly paved and adhered on the transfer ink layer;
a semiconductor bonded within the bonding region of the conductive ink layer;
And the transfer adhesive is wrapped and bonded on the transfer ink layer in a mode of covering the semiconductor and the conductive ink layer.
In a third aspect, an embodiment of the present application provides a product with a semiconductor tag, where the semiconductor tag is any one of the semiconductor tags in the foregoing embodiments, the semiconductor tag is transferred onto a target interface of the product, and the target medium surface is an interface to which the tag can be attached.
Therefore, the embodiment of the application provides a printing method with a semiconductor label, the semiconductor label and a product, when the method is used for printing the semiconductor label, transfer ink is printed on a base layer, conductive ink is printed on the transfer ink, a semiconductor is bound in a binding area which is arranged in the conductive ink, the semiconductor and the conductive ink are wrapped in the transfer ink through transfer glue, and after the semiconductor label is dried, the printed semiconductor label is finally obtained, so that the transfer ink is transferred to a designated product after being separated from the base layer through a transfer technology. Therefore, when the semiconductor label printed by the printing method provided by the embodiment is transferred to the appointed product, the semiconductor label is not adhered to the appointed product through the self-adhesive, but is transferred to the appointed product through the transfer technology, so that the semiconductor label can be firmly transferred to the appointed product for a long time like printing, and the integration with the appointed product is realized.
Drawings
FIG. 1 is a flow chart of a first printing method for a semiconductor label according to an exemplary embodiment of the present application;
FIG. 2 is a flow chart illustrating a transfer method for a semiconductor label according to an exemplary embodiment of the present application;
FIG. 3 is a flow chart of a second printing method for a semiconductor label according to an exemplary embodiment of the present application;
FIG. 4 is a flow chart of a third printing method for a semiconductor label according to an exemplary embodiment of the present application;
FIG. 5 is a flow chart of a fourth printing method for a semiconductor label according to an exemplary embodiment of the present application;
FIG. 6 is a flowchart of a fifth printing method for a semiconductor label according to an exemplary embodiment of the application;
FIG. 7 is a flowchart of a sixth printing method for a semiconductor label according to an exemplary embodiment of the application;
fig. 8 is a schematic structural view of a first semiconductor-on-semiconductor tag according to an exemplary embodiment of the present application;
fig. 9 is a schematic structural view of a second semiconductor-on-semiconductor tag according to an exemplary embodiment of the present application;
fig. 10 is a schematic structural view of a third semiconductor-on-semiconductor tag according to an exemplary embodiment of the present application;
Fig. 11 is a schematic structural view of a fourth semiconductor tag with semiconductor according to an exemplary embodiment of the present application;
fig. 12 is a schematic structural view of a fifth semiconductor tag with semiconductor according to an exemplary embodiment of the present application.
Description of the embodiments
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the application. Rather, they are merely examples of apparatus and methods consistent with aspects of the application as detailed in the accompanying claims.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.
It should be understood that although the terms first, second, third, etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the application. The word "if" as used herein may be interpreted as "at … …" or "at … …" or "responsive to a determination", depending on the context.
In order to meet different requirements of different application scenes on the radio frequency performance parameters of the semiconductor, various semiconductor antennas, namely the manufacturing process of the radio frequency antenna, such as the manufacturing process of the RFID antenna, appear. At present, all the semiconductor tags manufactured by the radio frequency antenna manufacturing process are required to be adhered to a required product by using a self-adhesive, and in practical application, materials (such as plastic films or papers) for bearing the radio frequency antenna are required to be used, and the manufactured radio frequency antenna plastic films, namely the semiconductor tags, are specifically required to be adhered to corresponding bearing objects through the self-adhesive, but the self-adhesive is easy to dry and fall off along with the time and the influence of the environment, so that the semiconductor tags manufactured by the radio frequency antenna are difficult to be firmly adhered to the specified product for a long time.
In order to solve the above technical problems, an embodiment of the present application provides a printing method for a semiconductor tag, including: the first step, printing transfer ink on the paved set base layer; secondly, after the transfer ink is dried, printing conductive ink on the transfer ink layer in a mode of forming a set tag antenna; thirdly, binding the semiconductor to be packaged in a set binding area on the conductive ink layer by using special semiconductor reverse packaging equipment after the conductive ink is dried; the number of the binding areas is greater than or equal to 1, and the number of semiconductors bound by each binding area is greater than or equal to 1; and fourthly, printing transfer glue on the transfer ink layer in a mode of covering the semiconductor and the conductive ink after the semiconductor is bound, and finally obtaining a printed semiconductor label after the transfer glue is dried so as to be transferred onto a designated product through a transfer printing technology. Therefore, when the semiconductor label printed by the technical scheme provided by the embodiment is transferred to the appointed product, the semiconductor label is not adhered to the appointed product through the self-adhesive, but is transferred to the appointed product through the transfer technology, so that the semiconductor label can be firmly transferred to the appointed product for a long time like printing, and the integration with the appointed product is realized.
The following is a detailed description in the form of examples:
referring to fig. 1, fig. 1 is a schematic flow chart of a first printing method for a semiconductor tag according to an embodiment of the present application, and as one embodiment, the semiconductor tag may be a chip tag, as another embodiment, the semiconductor tag may be a radio frequency tag, such as an RFID antenna tag, and as another embodiment, the semiconductor tag may be a radio frequency chip tag, that is, a chip tag with a radio frequency function.
The printing method for realizing FIG. 1 comprises the following steps:
in a first step, a transfer ink is printed on the laid-down setting substrate.
The base layer in this embodiment is a base material, which may be a polymer film layer. As an example, the polymer film layer may be made of PET (Polyethylene terephthalate, polyester resin).
The transfer ink can be waterproof, stretchable and transferable, and can be separated from a base layer such as a high polymer film layer under the transfer technology, so that the semiconductor label separated from the high polymer film layer can be waterproof, and the semiconductor can be protected. In addition, the transfer ink can also have a protective effect, which can play a role in protecting semiconductors and conductive inks.
As an example, the transfer ink may be or contain a protective ink, a UV (ultra violet) ink, a TPU (Thermoplastic Urethane, thermoplastic polyurethane elastomer) ink, a nylon ink, and an ink treated with set requirements.
And secondly, printing conductive ink on the transfer ink layer in a mode of forming a set tag antenna after the transfer ink is dried.
The conductive ink will form conductive traces on the transfer ink in the desired antenna shape, and the traces in the conductive ink will be set a recognizable distance to form microwaves.
In addition, the matching degree of the transfer ink and the conductive ink is better, the conductive circuit formed by the conductive ink on the transfer ink can be better in conductivity, and the conductive ink can be directly arranged on the transfer ink on the premise of better performance.
It should be noted that, the transfer layer formed by printing the transfer ink on the base layer may be directly obtained, for example, purchased, so that the conductive ink may be printed directly on the transfer ink layer in the purchased transfer layer in a manner of forming the set tag antenna.
And thirdly, binding the semiconductor to be packaged in a set binding area on the conductive ink layer by using special semiconductor reverse packaging equipment after the conductive ink is dried.
In this embodiment, the number of the binding regions is greater than or equal to 1, and the number of the semiconductors bound by each binding region is greater than or equal to 1.
A plurality of binding areas can be arranged on the conductive ink layer, and the number of semiconductors which are larger than or equal to 1 can be bound in each binding area.
For example, the conductive ink may be provided with a binding region a, a binding region B, and a binding region C, wherein the binding region a binds the semiconductor A1, the semiconductor A2, and the semiconductor A3, the binding region B binds the semiconductor B1, and the binding region C binds the semiconductor C1, the semiconductor C2, and the semiconductor C3.
The conductive ink layer and the semiconductor are connected together to form a core portion of the most predominant semiconductor.
And fourthly, printing transfer glue on the transfer ink layer in a mode of covering the semiconductor and the conductive ink after the semiconductor is bound, and finally obtaining a printed semiconductor label after the transfer glue is dried so as to be transferred onto a designated product through a transfer printing technology.
The transfer glue in this embodiment may be made of a material having insulation and waterproof effects, such as aqueous glue or oily glue. The transfer adhesive of the embodiment can protect the problems of short circuit and corrosion of the semiconductor and the conductive ink caused by the external environment, and can be bonded on the target medium surface of the appointed product under the thermal transfer technology.
It should be noted that, the semiconductor label obtained in this embodiment may be cut into a semiconductor label with a desired shape and size, or may be directly transferred onto the target medium surface of the specified product without cutting, which is related to the actual application requirement as to whether cutting is performed or not.
The transfer technique in the present embodiment may be a thermal transfer technique, a cold transfer technique, or a water transfer technique, and the present embodiment is not limited to this.
The flow described in fig. 1 is thus completed.
Therefore, the embodiment of the application provides a printing method with a semiconductor label, the semiconductor label and a product, when the method is used for printing the semiconductor label, transfer ink is printed on a base layer, conductive ink is printed on the transfer ink, a semiconductor is bound in a binding area which is arranged in the conductive ink, the semiconductor and the conductive ink are wrapped in the transfer ink through transfer glue, and after the semiconductor label is dried, the printed semiconductor label is finally obtained, so that the transfer ink is transferred to a designated product after being separated from the base layer through a transfer technology. Therefore, when the semiconductor label printed by the printing method provided by the embodiment is transferred to the appointed product, the semiconductor label is not adhered to the appointed product through the self-adhesive, but is transferred to the appointed product through the transfer technology, so that the semiconductor label can be firmly transferred to the appointed product for a long time like printing, and the technical effect of being integrated with the appointed product is realized.
After completing the flow described in fig. 1, as shown in fig. 2, as an embodiment, after the fourth step, the method further includes;
and fifthly, after the transfer adhesive is dried, cutting the printed semiconductor labels according to the set shape requirement of the semiconductor labels, so that each cut semiconductor label comprises at least one binding area, and finally, the printed semiconductor labels are obtained and transferred to the appointed products through a transfer printing technology.
In this embodiment, the printed semiconductor tag may include a plurality of binding areas, each binding area may have a different shape, and may be cut according to a specified shape requirement of the semiconductor tag, for example, a heart-shaped semiconductor tag may be cut, or a peach-shaped semiconductor tag may be cut, no matter what shape of the semiconductor tag is used, each binding area in the cut semiconductor tag includes at least one binding area, in other words, each cut semiconductor tag may have a plurality of binding areas, and at least one semiconductor may be set in the binding area in each semiconductor tag according to actual requirements.
In this step, the printed semiconductor label is diced to obtain individual semiconductor labels, rolled semiconductor labels, or full-thickness semiconductor labels.
After dicing the semiconductor labels, the diced semiconductor labels may be transferred to a target media side in a given product by a transfer technique.
As an embodiment, as shown in fig. 3, when the printed semiconductor label needs to be transferred, the printing method further includes the steps of:
and sixthly, sticking the transfer adhesive layer of the semiconductor label to a target medium surface of a product to be transferred, pressing the base layer of the semiconductor label through preset transfer equipment, and stripping the base layer after the transfer adhesive is melted and fixed on the target medium surface to finish transfer printing of the semiconductor label on the target medium surface.
In this embodiment, the base layer is peeled from the transfer ink surface.
In this embodiment, after the transfer adhesive is melted on the target interface, the semiconductor chip can be printed on a desired product like a garment, and when the semiconductor label is bonded by using the dry adhesive in the prior art, the conventional semiconductor label is difficult to fix on the garment due to the difficulty in bonding the dry adhesive on the garment fabric. Meanwhile, the design of the transfer ink can enable the base layer to be peeled off from the transfer ink after the transfer is completed.
In addition, the semiconductor label printed by the technical scheme provided by the embodiment can play a role in anti-counterfeiting when being transferred to a designated product, if the adhesive such as a coated adhesive or an adhesive-bonded semiconductor label is adopted, the semiconductor label can play a role in genuine product identification, then after the adhesive is separated, some users pick up the separated semiconductor label and bond the separated semiconductor label to other products of non-genuine products through the adhesive, in other words, the adhesive-bonded semiconductor label can be removed, and the semiconductor label provided by the embodiment of the application can exist on the product like printing after being transferred to a target medium surface of the product, can not fall off, and can play a role in playing a role in anti-counterfeiting label.
As another embodiment, when it is desired to transfer the printed semiconductor label, the printing method further comprises the steps of:
and sixthly, sticking the transfer adhesive layer of the semiconductor label to a target medium surface of a product to be transferred, pressing the base layer of the semiconductor label through preset transfer equipment, and stripping the base layer and the transfer ink layer after the transfer adhesive is melted and fixed on the target medium surface to finish transfer printing of the semiconductor label on the target medium surface.
In this embodiment, the base layer and the transfer ink layer may be peeled off as a whole, and especially when the conductive ink and the semiconductor are protected by the protective ink layer, the base layer and the transfer ink layer may be peeled off at the same time according to actual requirements, and the protective ink layer at this time also has the same function as the transfer ink.
As an embodiment, as shown in fig. 4, fig. 4 is a flow chart of a third printing method for a semiconductor label according to the present embodiment, and specifically includes the following steps:
in a first step, a transfer ink is printed on the laid-down setting substrate.
And secondly, printing conductive ink on the transfer ink layer in a mode of forming a set tag antenna after the transfer ink is dried.
Thirdly, binding the semiconductor to be packaged in a set binding area on the conductive ink layer by using special semiconductor reverse packaging equipment after the conductive ink is dried; the number of the binding areas is greater than or equal to 1, and the number of the semiconductors bound by each binding area is greater than or equal to 1.
And fourthly, printing a first semiconductor protection ink on the transfer ink layer in a mode of covering the semiconductor and the conductive ink after the semiconductor is bound, and printing transfer adhesive on the first semiconductor protection ink layer after the first semiconductor protection ink layer is dried.
In the present embodiment, the first semiconductor protective ink is merely a name for convenience of distinction from the following semiconductor protective ink, and is not intended to limit a certain semiconductor protective ink.
The first semiconductor protective ink may serve to further protect the semiconductor and the conductive ink. After the first semiconductor protective ink is disposed, a transfer paste is printed on the first semiconductor protective ink layer, which encapsulates the semiconductor and conductive ink layers on the transfer ink layer, in other words, the first semiconductor protective ink layer encapsulates the semiconductor and conductive ink layers together with the transfer ink layer. As an embodiment, the first semiconductor protective ink may be an ink or a silicone oil as an embodiment.
And fifthly, after the transfer adhesive is dried, cutting the printed semiconductor labels according to the set shape requirement of the semiconductor labels, so that each cut semiconductor label comprises at least one binding area, and finally, the printed semiconductor labels are obtained and transferred to the appointed products through a transfer printing technology.
As another embodiment, as shown in fig. 5, fig. 5 is a flow chart of a fourth printing method for a semiconductor label according to the present embodiment, and specifically includes the following steps:
In a first step, a transfer ink is printed on the laid-down setting substrate.
A second step of printing a second semiconductor protection ink on the transfer ink layer after the transfer ink is dried; and printing conductive ink on the second semiconductor protective ink layer to form a set tag antenna after the second semiconductor protective ink is dried.
In the present embodiment, the second semiconductor protective ink is named for convenience of description, and is not intended to limit a certain semiconductor protective ink. Accordingly, the second semiconductor protective ink is named for convenience of description only, and is not intended to limit a certain semiconductor protective ink.
The first semiconductor protective ink in this embodiment may be the same as or different from the second semiconductor protective ink, and this embodiment is not limited thereto.
Thirdly, binding the semiconductor to be packaged in a set binding area on the conductive ink layer by using special semiconductor reverse packaging equipment after the conductive ink is dried; the number of the binding areas is greater than or equal to 1, and the number of the semiconductors bound by each binding area is greater than or equal to 1.
And fourthly, printing a first semiconductor protection ink on the second semiconductor protection ink layer in a mode of covering the semiconductor and the conductive ink after the semiconductor is bound, and printing transfer glue on the first semiconductor protection ink layer after the first semiconductor protection ink layer is dried.
In this embodiment, the first semiconductor protective ink and the second semiconductor protective ink can further protect the functions of the semiconductor and the conductive ink together. After the first semiconductor protective ink is disposed, a transfer paste is printed on the first semiconductor protective ink layer, which encapsulates the semiconductor and conductive ink layer on the second semiconductor protective ink layer, in other words, the first semiconductor protective ink layer encapsulates the semiconductor and conductive ink layer together with the second semiconductor protective ink layer.
And fifthly, after the transfer adhesive is dried, cutting the printed semiconductor labels according to the set shape requirement of the semiconductor labels, so that each cut semiconductor label comprises at least one binding area, and finally, the printed semiconductor labels are obtained and transferred to the appointed products through a transfer printing technology.
As another embodiment, as shown in fig. 6, fig. 6 is a flow chart of a fifth printing method for a semiconductor label according to the present embodiment, and specifically includes the following steps:
in a first step, a transfer ink is printed on the laid-down setting substrate.
Secondly, printing pattern ink with a set pattern on the transfer ink layer after the transfer ink is dried; and after the pattern ink is dried, printing conductive ink on the pattern ink layer in a mode of forming a set tag antenna.
In this embodiment, the pattern ink layer may be one layer or may be multiple layers, and when the pattern ink is multiple layers, different pattern ink layers may be printed on any one of the structural layers of the semiconductor tag, or different pattern ink layers may be printed on different structural layers of the semiconductor tag, which is not limited in this embodiment.
The pattern ink layer can be personalized, such as LOGO units, or patterns giving meaning. To identify the product, the patterned ink layer may be personalized to distinguish between different series of products.
Thirdly, binding the semiconductor to be packaged in a set binding area on the conductive ink layer by using special semiconductor reverse packaging equipment after the conductive ink is dried; the number of the binding areas is greater than or equal to 1, and the number of the semiconductors bound by each binding area is greater than or equal to 1.
And fourthly, after the binding of the semiconductors is completed, printing the first semiconductor protection ink on the transfer ink layer in a mode of sequentially covering the semiconductors, the conductive ink and the pattern ink.
In this embodiment, the first semiconductor protective ink layer encapsulates the semiconductor, the conductive ink, and the pattern ink on the transfer ink layer, in other words, the first semiconductor protective ink layer encapsulates the semiconductor, the conductive ink, and the pattern ink together with the transfer ink layer.
In this embodiment, the pattern ink is printed first and then the first semiconductor protection ink layer is printed, but when the first semiconductor protection ink layer is made of a transparent material, the first semiconductor protection ink layer may be printed first and then the pattern ink is printed, so that the pattern information of the pattern ink layer is displayed through the transparent first semiconductor protection ink layer, and meanwhile, the function of protecting the pattern ink layer can be also achieved.
And fifthly, after the transfer adhesive is dried, cutting the printed semiconductor labels according to the set shape requirement of the semiconductor labels, so that each cut semiconductor label comprises at least one binding area, and finally, the printed semiconductor labels are obtained and transferred to the appointed products through a transfer printing technology.
As another embodiment, as shown in fig. 7, fig. 7 is a flowchart of a sixth printing method for a semiconductor label according to the present embodiment, and specifically includes the following steps:
in a first step, a transfer ink is printed on the laid-down setting substrate.
A second step of printing a second semiconductor protection ink on the transfer ink layer after the transfer ink is dried; printing pattern ink with a set pattern on the second semiconductor protective ink layer after the second semiconductor protective ink is dried; and after the pattern ink is dried, printing conductive ink on the pattern ink layer in a mode of forming a set tag antenna.
In this embodiment, the pattern ink layer is disposed between the second semiconductor protective ink and the conductive ink layer.
Thirdly, binding the semiconductor to be packaged in a set binding area on the conductive ink layer by using special semiconductor reverse packaging equipment after the conductive ink is dried; the number of the binding areas is greater than or equal to 1, and the number of the semiconductors bound by each binding area is greater than or equal to 1.
And fourthly, after the binding of the semiconductors is completed, printing the first semiconductor protection ink on the second semiconductor protection ink layer in a mode of sequentially covering the semiconductors, the conductive ink and the pattern ink.
In the case of printing the second semiconductor protective ink layer, the pattern ink layer may be printed first, then the second semiconductor protective ink layer may be printed, or the second semiconductor protective ink layer may be printed first, then the pattern ink layer 8 may be printed, and as to whether the pattern ink layer 8 is printed first or the second semiconductor protective ink layer is printed first, this is related to whether the second semiconductor protective ink layer is a transparent material or not. If the second semiconductor protective ink layer is made of transparent materials, the second semiconductor protective ink layer is printed first, then pattern ink is printed, and vice versa.
And fifthly, after the transfer adhesive is dried, cutting the printed semiconductor labels according to the set shape requirement of the semiconductor labels, so that each cut semiconductor label comprises at least one binding area, and finally, the printed semiconductor labels are obtained and transferred to the appointed products through a transfer printing technology.
As another embodiment, the binding of the semiconductor to be packaged in the set packaging area on the conductive ink layer using the dedicated semiconductor flip-packaging device in the third step includes the following steps a to B:
and step A, locking a binding area for binding the semiconductor on the conductive ink layer 3 by using special semiconductor flip-chip packaging equipment, and dispensing conductive adhesive in the binding area by using the semiconductor flip-chip packaging equipment.
The binding area in this embodiment may be manually determined in advance, or may be automatically determined by the semiconductor flip-chip packaging apparatus, which is not limited in this embodiment.
And B, immediately using the semiconductor reverse packaging equipment to place the semiconductor on the conductive adhesive after the conductive adhesive is dispensed, and synchronously using a hot pressing head of the semiconductor reverse packaging equipment to hot press the semiconductor so as to dry the conductive adhesive, thereby completing the binding of the semiconductor.
In this embodiment, after the conductive adhesive is dispensed, the semiconductor is required to be placed on the conductive adhesive immediately by using the semiconductor flip-package device, so as to bond the semiconductor on the conductive adhesive, and the thermal head can bond the semiconductor on the conductive adhesive.
In a second aspect, as shown in fig. 10, fig. 10 is a schematic structural diagram of a semiconductor tag with a semiconductor according to an embodiment of the present application, where the semiconductor tag includes: a base layer 1, a transfer ink layer 2, a conductive ink layer 3, a semiconductor 4 and a transfer paste 5.
Wherein, the transfer ink layer 2 is flatly adhered on the base layer 1; the conductive ink layer is flatly paved and adhered on the transfer ink layer 2; the semiconductor 4 is bound in the binding region 31 of the conductive ink layer; as shown in fig. 7, a transfer paste 5 is wrapped and bonded on the transfer ink layer 2 in a manner to cover the semiconductor 4 and the conductive ink layer 3.
In the present embodiment, the transfer paste 5 and the transfer ink layer 2 encapsulate the semiconductor 4 and the conductive ink layer 3 to protect and fix the semiconductor 4 and the conductive ink layer 3.
As an example, as shown in fig. 11, the semiconductor tag further includes a first semiconductor protective ink layer 6, and the first semiconductor protective ink layer 6 is wrapped around the transfer ink layer 2 in a manner of covering the semiconductor 4 and the conductive ink layer 3; the transfer paste 5 is adhered to the first semiconductor protective ink layer 6.
In order to further protect the semiconductor 4 and the conductive ink layer 3 from the external environment, the semiconductor tag provided by the embodiment of the application further adds the first semiconductor protective ink layer 6, wherein the first semiconductor protective ink layer 6 is arranged between the conductive ink layer 3 and the transfer adhesive 5, and is combined with the transfer ink layer 2 to wrap the semiconductor 4 and the conductive ink layer 3 inside, so that a protective effect is achieved.
As another embodiment, as shown in fig. 10, the semiconductor tag further includes: a second semiconductor protective ink layer 7; the second semiconductor protective ink layer 7 is flatly adhered to the transfer ink layer 2, and is combined with the first semiconductor protective ink layer 6 to wrap the semiconductor 4 and the conductive ink layer 3.
To further protect the other side of the semiconductor 4 and the conductive ink layer 3, embodiments of the present application further add a second semiconductor protective ink layer 7 to encapsulate the semiconductor 4 and the conductive ink layer 3 in combination with the first semiconductor protective ink layer 6.
As another embodiment, as shown in fig. 11, the semiconductor tag further includes: a pattern ink layer 8; the pattern ink layer 8 is flatly adhered to the transfer ink layer 2, and the first semiconductor protective ink layer 6 is adhered to the transfer ink layer 2 in a manner of covering the semiconductor 4, the conductive ink layer 3 and the pattern ink layer 8.
The first semiconductor protective ink layer 6 together with the transfer ink layer 2 encloses the semiconductor 4, the conductive ink layer 3 and the pattern ink layer 8 for protection. In some embodiments, the pattern ink layer 8 may also be interposed between the transfer paste 5 and the first semiconductor protective ink layer 6. The present embodiment is not limited thereto.
In other embodiments, in the case where the pattern information of the pattern ink layer 8 needs to be displayed, if the first semiconductor protection ink layer 6 is made of a transparent material, the first semiconductor protection ink layer 6 is printed first, and then the pattern ink layer 8 is printed, in other words, the printed semiconductor label, the pattern ink layer 8 is located closer to the transfer glue layer than the first semiconductor protection ink layer 6, so that the pattern information of the pattern ink layer 8 can be displayed through the transparent first semiconductor protection ink layer 6, and the function of protecting the pattern ink layer 8 can be also achieved.
If the first semiconductor protective ink layer 6 is made of a non-transparent material, such as white, the pattern ink layer 8 is printed first, and then the first semiconductor protective ink layer 6 is printed, in other words, the printed semiconductor label, the first semiconductor protective ink layer 6 is located closer to the transfer glue layer than the pattern ink layer 8, so as to display the pattern information of the pattern ink layer 8.
In the case of printing the second semiconductor protective ink layer 7, the pattern ink layer 8 may be printed first, then the second semiconductor protective ink layer 7 may be printed, or the second semiconductor protective ink layer 7 may be printed first, then the pattern ink layer 8 may be printed, as to whether the pattern ink layer 8 is printed first or the second semiconductor protective ink layer 7 is printed first, which is related to whether the second semiconductor protective ink layer 7 is a transparent material or not. If the second semiconductor protective ink layer 7 is made of a transparent material, as another embodiment, as shown in fig. 12, the semiconductor tag further includes: a pattern ink layer 8; the pattern ink layer 8 is wrapped and adhered to the second semiconductor protection ink layer 7, and the second semiconductor protection ink layer 7 is combined with the first semiconductor protection ink layer 6 to wrap the semiconductor 4, the conductive ink layer 3 and the pattern ink layer 8. In this embodiment, the second semiconductor protective ink layer 7 is closer to the base layer 1 than the pattern ink layer 8, and the pattern ink layer 8 can be displayed through the second semiconductor protective ink layer 7.
If the second semiconductor protective ink layer 7 is made of a non-transparent material, as another embodiment, the semiconductor tag further includes: a pattern ink layer; the pattern ink layer 8 is wrapped and adhered to the transfer ink layer 2, the second semiconductor protection ink layer 7 is flatly adhered to the pattern ink layer 8, and the second semiconductor protection ink layer 7 and the first semiconductor protection ink layer 6 are combined and wrapped with the semiconductor 4 and the conductive ink layer 3. In this embodiment, the pattern ink layer 8 is closer to the base layer 1 than the second semiconductor protective ink layer 7, and the pattern ink layer 8 can be displayed through the transfer ink layer 2.
As one embodiment, the semiconductor tag is a chip tag.
As another embodiment, the semiconductor tag is a radio frequency tag.
As another embodiment, the semiconductor tag is a chip tag, and the chip tag has a radio frequency function, which is also called a radio frequency tag.
The implementation process of the functions and roles of each unit in the above device is specifically shown in the implementation process of the corresponding steps in the above method, and will not be described herein again.
It can be seen that the embodiment of the application provides a semiconductor tag with a semiconductor, and the transfer ink layer 2 of the semiconductor tag is flatly adhered on the base layer 1; the conductive ink layer is flatly paved and adhered on the transfer ink layer 2; the semiconductor 4 is bound in the binding region 31 of the conductive ink layer; the transfer adhesive 5 is wrapped and adhered on the transfer ink layer 2 in a mode of covering the semiconductor 4 and the conductive ink layer 3, and can be transferred to a designated product after the transfer ink is separated from the base layer 1 by a transfer technology. Therefore, when the semiconductor label printed by the printing method provided by the embodiment is transferred to the appointed product, the semiconductor label is not adhered to the appointed product through the self-adhesive, but is transferred to the appointed product through the transfer printing technology, meanwhile, the base layer 1 can be peeled from the transfer ink layer 2 by transferring ink, the semiconductor label can be firmly transferred to the appointed product for a long time like printing, and the technical effect of being integrated with the appointed product is realized.
In a third aspect, an embodiment of the present application further provides a product printed with a semiconductor tag, where the semiconductor tag is the semiconductor tag according to any one of the above embodiments, the semiconductor tag is transferred onto a target interface of the product, and the target medium surface is an interface to which the tag can be attached.
The product with the semiconductor tag in this embodiment may be a woven product, a home textile product or a fabric product, such as clothing, shoes, caps, bags, and woven bags, and in order to ensure product safety, the corresponding semiconductor tag may be transferred onto the target medium surface designated by the product. If the home textile product is a garment, the semiconductor tag can be transferred onto the designated area of the garment through a transfer printing technology so as to realize intelligent checkout, in addition, automatic tracking can be realized through the semiconductor tag, for example, in the industry, an alarm can be generally caused to alarm through identifying a tag, but if the tag is detached and placed in a store, but the garment cannot be alarmed when being stolen through an alarm door, so that the garment is easy to be stolen out of the store, but if the semiconductor tag provided by the embodiment is transferred onto the garment, the semiconductor tag cannot be easily taken off because of being transferred onto the garment, and at the moment, the specific position of the stolen garment can be known at any time through the semiconductor tag transferred onto the garment, so that the occurrence of a theft event can be reduced.
For the device embodiments, reference is made to the description of the method embodiments for the relevant points, since they essentially correspond to the method embodiments. The apparatus embodiments described above are merely illustrative, wherein the elements illustrated as separate elements may or may not be physically separate, and the elements shown as elements may or may not be physical elements, may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purposes of the present application. Those of ordinary skill in the art will understand and implement the present application without undue burden.
The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather to enable any modification, equivalent replacement, improvement or the like to be made within the spirit and principles of the application.
Claims (16)
1. A printing method for a label with a semiconductor, characterized in that the transfer printing method comprises:
the first step, printing transfer ink on the paved set base layer;
secondly, after the transfer ink is dried, printing conductive ink on the transfer ink layer in a mode of forming a set tag antenna;
Thirdly, binding the semiconductor to be packaged in a set binding area on the conductive ink layer by using special semiconductor reverse packaging equipment after the conductive ink is dried; the number of the binding areas is greater than or equal to 1, and the number of semiconductors bound by each binding area is greater than or equal to 1;
and fourthly, printing transfer glue on the transfer ink layer in a mode of covering the semiconductor and the conductive ink after the semiconductor is bound, and finally obtaining a printed semiconductor label after the transfer glue is dried so as to be transferred onto a designated product through a transfer printing technology.
2. The printing method according to claim 1, further comprising, after the transfer paste is dried in the fourth step;
and fifthly, slitting the printed semiconductor labels according to the set shape requirement of the semiconductor labels, so that each slit semiconductor label contains at least one binding area, and finally, the printed semiconductor labels are obtained and transferred to the appointed products through a transfer printing technology.
3. The printing method according to claim 2, wherein the printing of the transfer paste on the transfer ink layer in such a manner as to cover the semiconductor and the conductive ink, comprises:
And printing a first semiconductor protection ink on the transfer ink layer in a mode of covering the semiconductor and the conductive ink, and printing transfer glue on the first semiconductor protection ink layer after the first semiconductor protection ink layer is dried.
4. A printing method according to claim 3, wherein said printing conductive ink on said transfer ink layer in the form of a set tag antenna comprises:
printing a second semiconductor protective ink on the transfer ink layer; printing conductive ink on the second semiconductor protective ink layer to form a set tag antenna after the second semiconductor protective ink is dried;
the printing of the first semiconductor protective ink on the transfer ink layer in a manner to cover the semiconductor and conductive ink includes:
a first semiconductor protective ink is printed on the second semiconductor protective ink layer in a manner to cover the semiconductor and conductive ink.
5. A printing method according to claim 3, wherein said printing conductive ink on said transfer ink layer in the form of a set tag antenna comprises:
printing pattern ink with a set pattern on the transfer ink layer; printing conductive ink on the pattern ink layer to form a set tag antenna after the pattern ink is dried;
The printing of the first semiconductor protective ink on the transfer ink layer in a manner to cover the semiconductor and conductive ink includes:
and printing a first semiconductor protective ink on the transfer ink layer in a manner of covering the semiconductor, the conductive ink and the pattern ink in sequence.
6. The printing method of claim 4 wherein said printing conductive ink on said second semiconductor protective ink layer in the form of a set tag antenna comprises:
printing pattern ink with a set pattern on the second semiconductor protective ink layer; printing conductive ink on the pattern ink layer to form a set tag antenna after the pattern ink is dried;
the printing of the first semiconductor protective ink on the transfer ink layer in a manner to cover the semiconductor and conductive ink includes:
and printing a first semiconductor protective ink on the second semiconductor protective ink layer in a mode of sequentially covering the semiconductor, the conductive ink and the pattern ink.
7. The printing method according to claim 2, wherein after the fifth step, when the printed semiconductor label needs to be transferred, further comprising:
And sixthly, sticking the transfer adhesive layer of the semiconductor label to a target medium surface of a product to be transferred, pressing the base layer of the semiconductor label through preset transfer equipment, and stripping the base layer after the transfer adhesive is melted and fixed on the target medium surface, or finishing transfer printing of the semiconductor label on the target medium surface by the base layer and the transfer ink layer.
8. The printing method of claim 1, wherein the binding of the semiconductor to be packaged within the set packaging region on the conductive ink layer using a dedicated semiconductor flip-chip packaging apparatus comprises:
locking a binding area for binding a semiconductor on a conductive ink layer by using special semiconductor flip-packaging equipment, and dispensing conductive adhesive in the binding area by using the semiconductor flip-packaging equipment;
and after the conductive adhesive is dispensed, the semiconductor is immediately placed on the conductive adhesive by using the semiconductor reverse packaging equipment, and the semiconductor is hot-pressed by using a hot pressing head of the semiconductor reverse packaging equipment synchronously, so that the conductive adhesive is dried, and the binding of the semiconductor is completed.
9. The printing method according to any one of claims 1 to 8, wherein the semiconductor tag is a chip tag or/and a radio frequency tag.
10. A semiconductor tag with a semiconductor, the semiconductor tag comprising:
a base layer;
the transfer ink layer is flatly paved and adhered on the base layer;
the conductive ink layer is flatly paved and adhered on the transfer ink layer;
a semiconductor bonded within the bonding region of the conductive ink layer;
and the transfer adhesive is wrapped and bonded on the transfer ink layer in a mode of covering the semiconductor and the conductive ink layer.
11. The semiconductor tag of claim 10, wherein said semiconductor chip further comprises a first semiconductor protective ink layer wrapped around said transfer ink layer in a manner covering said semiconductor and said conductive ink layer; the transfer glue is adhered to the first semiconductor protective ink layer.
12. The semiconductor tag of claim 11, wherein said semiconductor tag further comprises: a second semiconductor protective ink layer;
the second semiconductor protective ink layer is flatly adhered to the transfer ink layer, and is combined with the first semiconductor protective ink layer to wrap the semiconductor and the conductive ink layer.
13. The semiconductor tag of claim 11, wherein said semiconductor tag further comprises: a pattern ink layer;
the pattern ink layer is flatly adhered to the transfer ink layer, and the first semiconductor protection ink layer is adhered to the transfer ink layer in a mode of covering the semiconductor, the conductive ink layer and the pattern ink layer.
14. The semiconductor tag of claim 12, wherein said semiconductor tag further comprises: a pattern ink layer;
the pattern ink layer is wrapped and bonded on the second semiconductor protection ink layer, and the second semiconductor protection ink layer is combined with the first semiconductor protection ink layer to wrap the semiconductor, the conductive ink layer and the pattern ink layer; or (b)
The pattern ink layer is wrapped and bonded on the transfer ink layer, the second semiconductor protection ink layer is tiled and bonded on the pattern ink layer, and the second semiconductor protection ink layer and the first semiconductor protection ink layer are combined and wrapped on the semiconductor and the conductive ink layer.
15. The semiconductor tag according to any one of claims 10 to 14, wherein the semiconductor tag is a chip tag or/and a radio frequency tag.
16. A product with a semiconductor label, wherein the semiconductor label is the semiconductor label according to any one of claims 10 to 15, the semiconductor label is transferred onto a target interface of the product, and the target medium surface is an interface to which the label can be attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311130430.0A CN117103888A (en) | 2023-09-04 | 2023-09-04 | Printing method with semiconductor label, semiconductor label and product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311130430.0A CN117103888A (en) | 2023-09-04 | 2023-09-04 | Printing method with semiconductor label, semiconductor label and product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117103888A true CN117103888A (en) | 2023-11-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311130430.0A Pending CN117103888A (en) | 2023-09-04 | 2023-09-04 | Printing method with semiconductor label, semiconductor label and product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117103888A (en) |
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2023
- 2023-09-04 CN CN202311130430.0A patent/CN117103888A/en active Pending
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