CN117102703A - Laser processing method of composite ceramic through hole - Google Patents
Laser processing method of composite ceramic through hole Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 131
- 239000002131 composite material Substances 0.000 title claims abstract description 16
- 238000003672 processing method Methods 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 50
- 230000005855 radiation Effects 0.000 claims description 8
- 238000003754 machining Methods 0.000 claims description 6
- 238000010408 sweeping Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000009825 accumulation Methods 0.000 abstract description 11
- 239000010410 layer Substances 0.000 description 129
- 229920000139 polyethylene terephthalate Polymers 0.000 description 79
- 229910052573 porcelain Inorganic materials 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 229920002799 BoPET Polymers 0.000 description 7
- 238000002679 ablation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000010909 process residue Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000004814 ceramic processing Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- SWPMTVXRLXPNDP-UHFFFAOYSA-N 4-hydroxy-2,6,6-trimethylcyclohexene-1-carbaldehyde Chemical compound CC1=C(C=O)C(C)(C)CC(O)C1 SWPMTVXRLXPNDP-UHFFFAOYSA-N 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000005467 ceramic manufacturing process Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a processing method of a composite ceramic through hole, which comprises the following steps: respectively determining the processing paths of the PET layer and the ceramic layer according to the shape and the size of the through hole to be processed; controlling laser along the determined PET layer processing path, and sequentially processing all sub paths from inside to outside until the ceramic layer is exposed; controlling laser to sequentially process all the through holes to be processed along the determined ceramic layer processing path until all the through holes are obtained; the PET layer processing path comprises a plurality of sub-paths which are similar to the shape of the through hole to be processed, different in size and nested in sequence, at least the outermost sub-path coincides with the center point of the through hole to be processed, and the size of the PET layer processing path is equal to or slightly smaller than the size of the through hole to be processed; the processing path of the ceramic layer is a pattern with the same shape and size as the through hole to be processed, or similar shape and slightly smaller size. According to the invention, the PET layer is processed in a specific path combination mode, and then the ceramic part is processed, so that the thermal accumulation of laser heat on the PET layer is reduced, the processing quality of the through hole is improved, and the taper approaching to 0 is realized.
Description
Technical Field
The invention relates to the technical field of multilayer ceramic processing, in particular to a processing method of a composite ceramic through hole.
Background
The processing of the through holes of the green ceramic chips is one of the key processes of the multilayer ceramic technology. Along with the development of the high-temperature and low-temperature co-fired ceramic technology, the requirements on the quality and the efficiency of the processing of the raw ceramic through holes are higher and higher, and the difficulty of processing the small-diameter through holes is higher and higher. Laser processing of through holes is widely used because of its much higher efficiency than mechanical punching. However, the disadvantage of laser processing is that the heat generated by the laser can accumulate at the processing location, resulting in undesirable processing quality and greater taper that is difficult to control. On the other hand, the green ceramic chip of the composite ceramic is generally formed by laminating a green ceramic film layer with a certain thickness and a PET layer with a certain thickness, and the combination of the heterogeneous materials also increases the difficulty of laser one-step forming processing.
The current method for processing the raw porcelain through holes by laser is shown in figure 1, for each hole with a certain diameter to be processed, laser is incident from the raw porcelain surface, a round laser processing path with the same diameter is adopted, the path is repeated for a plurality of times until the hole is punched, and then the laser is moved to the next position to be punched for processing again until all the through holes are processed.
According to the conventional through hole laser processing method, as the laser path is repeated for a plurality of times in unit time, materials at the processing path are repeatedly processed by laser, heat is easily accumulated at the processing path, and the processing quality of holes is reduced. Some technicians usually tear off the PET film before laser processing, and only punch the raw porcelain part and perform subsequent hole filling, printing and other works in order to solve the problems that PET is melted and overflows from the hole, and the problem that multiple materials are difficult to form by laser processing once. However, this method makes the multilayer ceramic process very cumbersome. And after losing the bearing and protection of PET, the ceramic layer is easy to break, resulting in material loss and increased process cycle.
Disclosure of Invention
The invention aims to provide a processing method of a composite ceramic through hole, which is characterized in that a PET layer of the composite ceramic is processed in a specific path combination mode, then a ceramic part is processed, so that the thermal accumulation of laser heat on the PET layer is reduced, the problems of excessive ablation of a PET film, difficult-to-process residues, residue overflow and the like are solved, and the processing quality of the through hole is improved.
The invention adopts the technical scheme that: a processing method of a composite ceramic through hole comprises the following steps:
determining the shape and size of a through hole to be processed;
respectively determining the processing paths of the PET layer and the ceramic layer according to the shape and the size of the through hole to be processed; the processing paths of the PET layer comprise a plurality of sub-paths which are respectively similar to the shape of the through holes to be processed, the plurality of sub-paths are different in size and are sequentially nested, at least the center point of the outermost sub-path coincides with the center point of the through holes to be processed, and the size of the outermost sub-path is equal to or slightly smaller than the size of the through holes to be processed; the processing path of the ceramic layer is a graph with the same shape and size as the through hole to be processed, or a graph with the similar shape and size as the through hole to be processed and slightly smaller size;
controlling laser emitted by a laser to sequentially process all sub-paths from inside to outside along a determined PET layer processing path until the ceramic layer is exposed;
and controlling laser emitted by the laser to sequentially process all the through holes to be processed along the determined ceramic layer processing path until all the through holes are obtained.
The above-mentioned "size" means that it is different depending on the shape of the through hole to be processed, for example, if the through hole to be processed is circular, the size thereof may refer to the diameter or radius of the circular shape, if the through hole to be processed is square, the size thereof may refer to the side length of the square shape, or the distance from the center point to the side or angle, and so on in the case of other shapes.
The above-mentioned "slightly smaller" means that, for the to-be-processed through hole of micron order, when the picosecond ultraviolet laser is adopted for processing, the dimension difference should be within 5um and be in a slightly smaller range, the slightly smaller range between the two pattern dimensions is also affected by the diameter of the laser spot and the energy, if the laser spot is larger and the energy is larger, the dimension difference slightly smaller than the indicated dimension difference should be correspondingly adjusted to a larger direction.
According to the technical scheme, the PET layer is firstly processed for a plurality of circles from inside to outside, and the PET layer is processed to give out a position by utilizing the thermal retraction effect of the PET layer, so that laser hardly acts on the PET layer in the heating process of the ceramic layer, and the problems of excessive ablation of the PET film, residue overflow and the like caused by accumulation of laser heat on the PET layer are avoided.
Optionally, an outermost sub-path in the PET layer processing path coincides with the ceramic layer processing path, and the sizes of the two paths are slightly smaller than the size of the through hole to be processed. The final machined through hole size can be avoided from being larger than required. The dimension difference between the outermost sub-path and the ceramic layer processing path and the through hole to be processed can be determined according to the laser spot diameter of the laser, the laser energy (i.e. the heat affected zone), the processing times and the like.
Optionally, the through hole to be processed is circular, each sub-path in the PET layer processing path and the ceramic layer processing path are concentric circles with the through hole to be processed, and the outer layer sub-path in the PET layer processing path and the ceramic layer processing path are mutually overlapped, and the diameters of the outer layer sub-path and the ceramic layer processing path are slightly smaller than the diameter of the through hole to be processed. Of course, the through holes to be processed can be in other shapes, such as square shapes or other regular or irregular patterns, and all that is needed is to make all the sub-paths in the PET layer processing path and the ceramic layer processing path parallel to each other and the center point coincide with the outline of the through holes to be processed.
Optionally, at least 3 sub-paths of the processing path of the PET layer are provided, and the path line distances between every two sub-paths are equal or the difference value between the path line distances between different sub-paths is within a set difference value range. The number of the sub-paths can be adjusted according to the size of the through holes, the thickness of the PET layers and other factors, so that the PET layers can be more effectively retracted to an area which does not affect the processing of the ceramic layers after being processed by laser, and the overall processing efficiency of the through holes is not affected due to overlong processing paths of the PET layers.
Optionally, the controlling the laser emitted by the laser sequentially processes each through hole to be processed along the determined processing path of the ceramic layer, so as to: and (3) carrying out laser processing on all the through holes to be processed along the determined ceramic layer processing path repeatedly, and processing the ceramic layer processing paths of all the through holes to be processed for one circle in turn in a radiation scanning mode in each round of circulation. The method uses one path of laser processing as one element time, and traverses all paths of the through holes to be processed as one layer time, and the unit element time multi-layer time spoke scanning processing mode adopted by the method can enable Kong Zhouyou of each hole to dissipate heat for a sufficient time, reduce heat accumulation and realize taper approaching 0.
Optionally, for a circular through hole to be processed with the diameter of 150um, the PET layer processing path comprises 3 concentric circular sub-paths with the diameters of 60um, 100um and 137um respectively, and the ceramic layer processing path is a circle with the diameter of 137um, which coincides with the center of the through hole to be processed; the laser adopts a picosecond ultraviolet laser.
Optionally, the laser processing of the single composite ceramic green tile includes:
s1, fixing a raw ceramic chip and enabling a PET layer of the raw ceramic chip to face a laser, and sequentially processing the PET layers of all through holes to be processed; the processing process of each through hole to be processed is as follows: controlling laser to sequentially process along all sub-paths of the PET layer processing path from inside to outside, and processing the next sub-path after each sub-path is processed to a molten state until the outermost sub-path is processed to expose the ceramic layer;
s2, after the PET layers of all the through holes to be processed on the green ceramic chip are processed, controlling laser to circularly process the ceramic layers exposed out of all the through holes to be processed along a ceramic layer processing path for multiple times until ceramic posts in all the through holes to be processed can fall off; and during each round of circulation, the laser sequentially scans the ceramic layer processing paths of all the through holes to be processed for one circle in a radiation surface scanning mode.
It can be seen that the processing process of the PET layer adopts a laser scanning mode with multiple element times and single layer times, and the processing process of the ceramic layer adopts a laser scanning mode with multiple element times and multiple coating times, and the matching of the two laser scanning modes considers the characteristics of thermal retraction of the PET layer and the laser heat accumulation effect, so that each hole has sufficient time for heat dissipation, heat accumulation is reduced and the taper approaching 0 is realized on the basis that the processing process of the ceramic layer is not interfered by the PET layer.
Optionally, in the foregoing laser processing, the laser feeding distance is 0mm, the scanning speed is 200mm/s, the jump speed is 5000mm/s, the scanning delay is 150ms, the jump delay is 150ms, the light-on delay is 150ms, and the Guan Guangyan time is 150ms.
Optionally, the method further comprises: before controlling the laser to work, the PET layer faces the laser, and the ceramic layer is adsorbed on the sample stage through a vacuum suction stage.
Optionally, the method further comprises: and cleaning scraps generated by machining by utilizing sweeping wind in the machining process of the laser and after the through holes are obtained after the working is finished.
Advantageous effects
According to the composite ceramic processing method, laser is incident from the PET surface of the green ceramic chip, and different laser parameters and paths are adopted for processing the PET layer and the ceramic layer successively: for the PET carrier film, PET in the whole processing aperture range is sequentially melted, shrunk, upward moved and solidified from inside to outside under the action of laser through a plurality of concentric circles step by step processing from inside to outside, and the shrinkage and upward movement of the PET give way for laser processing raw porcelain, so that laser hardly acts on the PET in the processing process of the raw porcelain, thereby reducing the thermal accumulation of the laser on the PET layer, improving the problems of excessive ablation of the PET film, difficult-to-process residues, residue overflow and the like, and then adopting a simple annular path to finish the processing of the through hole of the raw porcelain layer; in the ceramic manufacturing process, a unit pixel number multi-layer number breadth scanning mode is adopted, so that each hole has sufficient time for heat dissipation, and heat accumulation is reduced. Practice proves that the combination of the processing methods of the PET layer and the ceramic layer can realize the taper approaching 0, the quality of the through hole is obviously improved, the processing efficiency reaches about 100 holes/second on average, and the processing efficiency is at a higher level.
Drawings
FIG. 1 is a schematic view of a laser processing path in the conventional processing of a green tile through hole;
FIG. 2 is a schematic diagram of laser processing of a through-hole of a green tile according to the prior art;
FIG. 3 is a schematic diagram of a laser processing path of a PET layer during processing of a through hole of a green ceramic tile according to an embodiment of the present invention;
FIG. 4 is a schematic diagram showing a laser processing path of a ceramic layer during processing of a through hole of a green ceramic chip according to an embodiment of the present invention;
fig. 5 is a schematic flow chart of a processing procedure of a through hole of a green ceramic tile in an application example of the invention.
Detailed Description
The technical conception of the invention is as follows: when the composite ceramic through hole is processed, laser is incident from the PET surface, firstly, the PET layer is processed in a specific path combination mode, a channel is reserved for ceramic layer processing, and then the ceramic layer is processed, so that the laser hardly acts with the PET material in the processing process, the thermal accumulation of the laser on the PET layer is reduced, and the influence of the problems of excessive ablation of the PET film, difficult-to-process residue and residue overflow and the like on the taper and quality of the through hole is improved. The ceramic layer can be processed by adopting a simple annular path, and the accumulation of heat at the periphery of each hole can be further reduced by combining the unit pixel number and the number of layers and combining the format scanning mode of the number of layers, so that the quality of the through hole is further improved, and the taper of the hole is reduced.
Further description is provided below in connection with the drawings and the specific embodiments.
Example 1
The embodiment introduces a processing method of a composite ceramic through hole, which comprises the following steps:
determining the shape and size of a through hole to be processed;
respectively determining the processing paths of the PET layer and the ceramic layer according to the shape and the size of the through hole to be processed; the processing paths of the PET layer comprise a plurality of sub-paths which are respectively similar to the shape of the through holes to be processed, the plurality of sub-paths are different in size and are sequentially nested, at least the center point of the outermost sub-path coincides with the center point of the through holes to be processed, and the size of the outermost sub-path is equal to or slightly smaller than the size of the through holes to be processed; the processing path of the ceramic layer is a graph with the same shape and size as the through hole to be processed, or a graph with the similar shape and size as the through hole to be processed and slightly smaller size;
controlling laser emitted by a laser to sequentially process all sub-paths from inside to outside along a determined PET layer processing path until the ceramic layer is exposed;
and controlling laser emitted by the laser to sequentially process all the through holes to be processed along the determined ceramic layer processing path until all the through holes are obtained.
In the above scheme, if the through hole to be processed is circular, the dimension thereof may refer to the diameter or radius of the circular shape, if the through hole to be processed is square, the dimension thereof may refer to the side length of the square, or the distance from the center point to the side or corner, and so on for other shapes. That is, the meaning of the "size" is different according to the shape of the through hole to be processed, and is not repeated in the prior art.
The above-mentioned "size slightly smaller" means that, for the circular to-be-processed through hole of micron order, when the picosecond ultraviolet laser is adopted for processing, the size difference between the diameter of the through hole and the diameter of the annular path should be within 5um, and when the size difference is in a slightly smaller range, the slightly smaller range between the two pattern sizes is also affected by the diameter and the energy of the laser spot, if the laser spot is larger and the energy is larger, the size difference slightly smaller than the indicated size difference should be correspondingly adjusted to a larger direction.
In this embodiment, at least 3 sub-paths of the processing path of the PET layer are provided, and the path line distances between every two sub-paths are equal or the difference between the path line distances between different sub-paths is within a set difference range. The number of the sub-paths can be adjusted according to the size of the through holes, the thickness of the PET layers and other factors, so that the PET layers can be more effectively retracted to an area which does not affect the processing of the ceramic layers after being processed by laser, and the overall processing efficiency of the through holes is not affected due to overlong processing paths of the PET layers.
Further, the center points of all sub-paths in the PET layer processing path are overlapped, the outermost sub-path is overlapped with the ceramic layer processing path, the sizes of the two sub-paths are slightly smaller than the size of the through hole to be processed, the PET layer processing can be guaranteed to give up a channel for the ceramic layer processing, and meanwhile the size of the through hole finally processed is prevented from being larger than the required size.
In this embodiment, the method for laser processing the ceramic layer includes: and (3) carrying out laser processing on all the through holes to be processed along the determined ceramic layer processing path repeatedly, and processing the ceramic layer processing paths of all the through holes to be processed for one circle in turn in a radiation scanning mode in each round of circulation.
To sum up, the laser processing of the single composite ceramic green ceramic tile according to the present embodiment includes:
s1, fixing a raw ceramic chip and enabling a PET layer of the raw ceramic chip to face a laser, and sequentially processing the PET layers of all through holes to be processed; the processing process of each through hole to be processed is as follows: controlling laser to sequentially process along all sub-paths of the PET layer processing path from inside to outside, processing the next sub-path after each sub-path is processed to a molten state until the outermost sub-path is processed to expose the ceramic layer, and giving up a processing channel for the processing path of the ceramic layer;
s2, after the PET layers of all the through holes to be processed on the green ceramic chip are processed, controlling laser to circularly process the ceramic layers exposed out of all the through holes to be processed along a ceramic layer processing path for multiple times until ceramic posts in all the through holes to be processed can fall off; and during each round of circulation, the laser sequentially scans the ceramic layer processing paths of all the through holes to be processed for one circle in a radiation surface scanning mode.
A circle of laser processing is used as one element time, a circle of traversing processing is used as one layer time for a group of paths of the same type to be processed, the embodiment adopts a laser scanning mode of multi-element time single layer time for a PET layer, and a radiation surface scanning processing mode of single element time and multi layer time for a ceramic part. The quality and the efficiency of through hole processing are effectively improved by the cooperation of the two laser scanning modes.
Example 2
This embodiment is described in terms of a specific processing requirement. The green ceramic sheet material is formed by compounding white LTCC alumina ceramic and a transparent PET carrier film, the green ceramic sheet is 200mm long and 200mm wide, the ceramic layer thickness is 0.15mm, and the PET film layer thickness is 0.075mm, and is shown in reference to FIG. 5. A set of circular through holes with a diameter of 150um are required to be machined in the composite ceramic, as shown in the hole pattern combination of fig. 4.
After the shape and the size of the through hole to be processed are determined, the laser processing path of the PET layer and the laser processing path of the ceramic layer can be comprehensively determined by referring to the light spot and the energy of the adopted laser.
In the embodiment, the laser adopts a picosecond ultraviolet laser, the fundamental frequency of which is 150kHz, the frequency is selected to be 4, and the power factor is 45%. The PET layer laser processing path is three concentric circles which are nested in sequence from inside to outside, and the diameters of the three concentric circles are respectively 60um, 100um and 137um. The ceramic layer laser processing path coincides with the outermost sub-path of the PET layer laser processing path.
Referring to the process flow shown in fig. 5, the process flow of the present embodiment includes the following steps:
s1, fixing a green ceramic chip, enabling a PET layer of the green ceramic chip to face a laser, and adsorbing a ceramic surface on a sample stage through a vacuum suction stage;
starting a laser, firstly processing the PET layers of all to-be-processed through holes in sequence, and processing three concentric circular sub-paths with different diameters of the PET layers at each to-be-processed through hole in sequence from inside to outside, wherein the process is shown in figure 5:
(1) a green state;
(2) scanning laser along the sub-path of the innermost layer to enable PET at the center to be processed to be in a molten state, enabling the molten PET to shrink towards the center under the influence of tension, and stretching towards the height direction of a light source under the influence of a laser heat source;
(3) scanning the laser along a second layer sub-path from inside to outside, continuously shrinking the molten PET towards the center, and stretching the molten PET towards the height direction of the light source;
(4) scanning laser along the outermost sub-path, shrinking and stretching the outer circle of the PET layer to be close to the diameter level of the target circle, shrinking and stretching the PET above the position of the target opening to the center and upwards, solidifying the PET above the raw porcelain, and shrinking to generate a deep groove with a certain width, namely providing a channel for laser cutting the ceramic layer;
at the moment, the laser is controlled to scan along the processing path of the ceramic layer according to the state (5), the state (6) is formed after the times of a plurality of layers and the times of elements, and the knob insulator in the through hole and the PET material solidified on the knob insulator can fall off from the hole.
Processing the PET layer at each through hole to be processed on the green ceramic chip according to the steps (1) - (4), processing the next sub-path after each sub-path is processed to a molten state until the outermost sub-path at all the through holes to be processed is processed until the ceramic layer is exposed, and finishing processing the PET layer of all the through holes to be processed on the green ceramic chip;
s2, controlling laser to circularly process the ceramic layers exposed out of all the through holes to be processed along the ceramic layer processing path for multiple times until the porcelain posts in all the through holes to be processed can fall off; and when the laser circulates for each round, the laser scans the ceramic layer processing paths of all the through holes to be processed for one circle in turn in a radiation surface scanning mode, so that the material of the processed area of each target through hole has sufficient time for heat dissipation, the heat accumulation is the lowest, and the processing taper is ensured to be small enough.
In the above S1 and S2, the processing parameters of the PET carrier film portion are: the element times are 3 times, the layer times are 1 time, the feeding distance is 0mm, the scanning speed is 200mm/s, the jump speed is 5000mm/s, the scanning delay is 150ms, the jump delay is 150ms, the light-on delay is 150ms, and the Guan Guangyan time is 150ms;
the ceramic part processing parameters are as follows: the element times are 1, the layer times are 9, the feeding distance is 0mm, the scanning speed is 200mm/s, the jump speed is 5000mm/s, the scanning delay is 150ms, the jump delay is 150ms, the light-on delay is 150ms, and the Guan Guangyan time is 150ms.
In the processing process, the sweeping and blowing can be simultaneously started, and scraps generated in the processing can be cleaned in time; and after the through hole is processed, closing the wind sweeping and the air suction of the carrier to recycle the sample.
In the embodiment, after the laser processing is completed, PET is stripped together with the raw porcelain column body after being melted, the residue and scraps generated in the processing process are few, the diameter of the finally obtained hole is 150um, the processing efficiency is about 10 holes/second on average, after the PET film is torn off, the diameter difference between the through holes at the laser inlet and the through holes at the laser outlet is less than 1um, and the processing quality of the hole is obviously improved. Moreover, the invention adopts the processing from the PET surface, so the raw porcelain surface has high cleanliness and is beneficial to the subsequent printing process.
Besides the contents mentioned in the above embodiments, the invention has wide applicability, is suitable for processing LTCC green ceramic through holes compounded by various materials, the compound ceramic can also be LTCC and HTCC green ceramic chips, and the ceramic component can be various common ceramic materials such as alumina, barium titanate and the like. The bearing film can be various polymer film materials such as PET. The length and width dimensions of the green ceramic chip can be arbitrary, the thickness of the ceramic layer of the green ceramic chip can be 0.01mm-1mm, and the thickness of the bearing film can be 0-0.1mm. The holes to be machined may be circular, square or any other shape, and may have a diameter or side length of 0.03mm or more.
The laser may be a nanosecond laser, a picosecond laser, a femtosecond laser, an infrared laser, an ultraviolet laser, a carbon dioxide laser, or the like.
In order to ensure the processing quality and efficiency, the parameters of the laser, such as jump delay, switch light delay, scanning speed and the like, can be adjusted according to actual conditions. Experiments prove that the machining efficiency can reach 100 holes/s or higher, PET is stripped together with the raw porcelain column body after being melted, residue scraps are less, and the taper of the through hole is close to zero taper.
The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present invention and the scope of the claims, which are all within the protection of the present invention.
Claims (10)
1. The processing method of the composite ceramic through hole is characterized by comprising the following steps of:
determining the shape and size of a through hole to be processed;
respectively determining the processing paths of the PET layer and the ceramic layer according to the shape and the size of the through hole to be processed; the processing paths of the PET layer comprise a plurality of sub-paths which are respectively similar to the shape of the through holes to be processed, the plurality of sub-paths are different in size and are sequentially nested, at least the center point of the outermost sub-path coincides with the center point of the through holes to be processed, and the size of the outermost sub-path is equal to or slightly smaller than the size of the through holes to be processed; the processing path of the ceramic layer is a graph with the same shape and size as the through hole to be processed, or a graph with the similar shape and size as the through hole to be processed and slightly smaller size;
controlling laser along the determined PET layer processing path, and sequentially processing all sub paths from inside to outside until the ceramic layer is exposed;
and controlling laser to sequentially process all the through holes to be processed along the determined ceramic layer processing path until all the through holes are obtained.
2. The method of claim 1 wherein the outermost sub-paths of the PET layer processing paths coincide with the ceramic layer processing paths and are sized slightly smaller than the size of the vias to be processed.
3. The method according to claim 1 or 2, wherein the through hole to be processed is circular, each sub-path in the PET layer processing path and the ceramic layer processing path are concentric circles with the through hole to be processed, and an outer layer sub-path in the PET layer processing path and the ceramic layer processing path are mutually overlapped, and the diameters of the two sub-paths are slightly smaller than the diameter of the through hole to be processed.
4. The method of claim 1, wherein the PET layer has at least 3 sub-paths of the processing path, and the difference between the path line distances between two sub-paths is within a set difference range.
5. The method according to claim 1, wherein the controlling the laser sequentially processes each through hole to be processed along the determined processing path of the ceramic layer comprises: and (3) carrying out laser processing on all the through holes to be processed along the determined ceramic layer processing path repeatedly, and processing the ceramic layer processing paths of all the through holes to be processed for one circle in turn in a radiation scanning mode in each round of circulation.
6. The method according to claim 1, wherein for a circular through hole to be processed with a diameter of 150um, the PET layer processing path comprises 3 concentric circular sub-paths with diameters of 60um, 100um and 137um respectively, and the ceramic layer processing path is a circle with a diameter of 137um, which coincides with the center of the circle of the through hole to be processed; the laser adopts a picosecond ultraviolet laser.
7. The method of claim 1 or 6, wherein the laser machining of the individual composite ceramic green tiles comprises:
s1, fixing a raw ceramic chip and enabling a PET layer of the raw ceramic chip to face a laser, and sequentially processing the PET layers of all through holes to be processed; the processing process of each through hole to be processed is as follows: controlling laser to sequentially process along all sub-paths of the PET layer processing path from inside to outside, and processing the next sub-path after each sub-path is processed to a molten state until the outermost sub-path is processed to expose the ceramic layer;
s2, after the PET layers of all the through holes to be processed on the green ceramic chip are processed, controlling laser to circularly process the ceramic layers exposed out of all the through holes to be processed along a ceramic layer processing path for multiple times until ceramic posts in all the through holes to be processed can fall off; and during each round of circulation, the laser sequentially scans the ceramic layer processing paths of all the through holes to be processed for one circle in a radiation surface scanning mode.
8. The method of claim 7, wherein during laser processing, the laser feed distance is 0mm, the scanning speed is 200mm/s, the jump speed is 5000mm/s, the scanning delay is 150ms, the jump delay is 150ms, the light-on delay is 150ms, and the Guan Guangyan time is 150ms.
9. The method as recited in claim 7, further comprising: before controlling the laser to work, the PET layer faces the laser, and the ceramic layer is adsorbed on the sample stage through a vacuum suction stage.
10. The method as recited in claim 7, further comprising: and cleaning scraps generated by machining by utilizing sweeping wind in the machining process of the laser and after the through holes are obtained after the working is finished.
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| CN202210529544.1A CN117102703A (en) | 2022-05-16 | 2022-05-16 | Laser processing method of composite ceramic through hole |
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| CN202210529544.1A CN117102703A (en) | 2022-05-16 | 2022-05-16 | Laser processing method of composite ceramic through hole |
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