CN117102161B - Vacuum plasma cleaning equipment - Google Patents
Vacuum plasma cleaning equipment Download PDFInfo
- Publication number
- CN117102161B CN117102161B CN202311383523.4A CN202311383523A CN117102161B CN 117102161 B CN117102161 B CN 117102161B CN 202311383523 A CN202311383523 A CN 202311383523A CN 117102161 B CN117102161 B CN 117102161B
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- cleaning box
- box
- cleaning
- plate
- plates
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- 238000004140 cleaning Methods 0.000 title claims abstract description 160
- 238000007789 sealing Methods 0.000 claims description 33
- 239000011521 glass Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 22
- 230000000694 effects Effects 0.000 description 6
- 238000010926 purge Methods 0.000 description 5
- 238000005406 washing Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
Abstract
The invention provides vacuum plasma cleaning equipment, and relates to the technical field of plasma cleaning. This vacuum plasma cleaning equipment, including the base, fixed setting is in the first case of wasing at base top and the fixed second of wasing at first case top of wasing, the second washs the incasement and is provided with a plurality of working plates, the second washs the incasement and is provided with the subassembly that opens and shuts that is used for wasing first case and second and washs the case intercommunication, the first incasement of wasing is provided with and is used for carrying the conveying assembly who places the board to the second and washs the case. Through having set up the box of two equidimension, when needing to place the semiconductor wafer, become the vacuum with the box that the volume is great at first, place the semiconductor wafer in the box that the volume is less, then become the vacuum with the box that the volume is less, when two boxes are the vacuum state, carry the semiconductor wafer to the box that the volume is great has the clearance function in this moment and wash to can save certain time, thereby improved abluent efficiency.
Description
Technical Field
The invention relates to the technical field of plasma cleaning, in particular to vacuum plasma cleaning equipment.
Background
The plasma cleaning machine is also called a plasma surface treatment machine, and achieves the effect which cannot be achieved by conventional water washing and brush washing by utilizing plasma, wherein the plasma is a state of a substance and does not belong to a fourth state of a common solid-liquid-gas three-state, and the plasma is formed by applying enough energy to the gas to ionize the gas into a plasma state, and the active components of the plasma comprise: ion, electron, atom, active group, excited nuclide, photon, etc., and the plasma cleaning machine is to treat the surface of sample by utilizing the properties of these active components, so as to realize the cleaning purpose.
At present, when plasma cleaning is carried out, firstly, a semiconductor wafer is required to be placed in a cleaning box, then the cleaning box is vacuumized, and finally the semiconductor wafer is cleaned through plasma, but generally, the cleaning box is internally provided with cleaning components, the cleaning components are required to be arranged, the box body is required to be vacuumized, the box body is caused to be large in size, a certain time is required to be consumed when the cleaning box is vacuumized, the cleaning time is increased, and therefore the cleaning working efficiency is reduced.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the invention provides vacuum plasma cleaning equipment, which solves the problems that the cleaning time is increased because a certain time is required to be consumed when the cleaning box is vacuumized because the volume of the cleaning box is larger.
(II) technical scheme
In order to achieve the above purpose, the invention is realized by the following technical scheme: the automatic cleaning device comprises a base, a first cleaning box fixedly arranged at the top of the base and a second cleaning box fixedly arranged at the top of the first cleaning box, wherein the front ends of the first cleaning box and the second cleaning box are both hinged with a box door, the inner rear sides of the first cleaning box and the second cleaning box are respectively provided with an air inlet pipe and an air outlet pipe, a placing plate is placed in the first cleaning box, a placing groove is formed in the top of the placing plate, a plurality of working plates are arranged in the second cleaning box, an opening and closing assembly used for communicating the first cleaning box with the second cleaning box is arranged in the second cleaning box, and a conveying assembly used for conveying the placing plate to the second cleaning box is arranged in the first cleaning box;
the opening and closing assembly comprises a connecting groove which is formed in the top end of the first cleaning box and the bottom end of the second cleaning box, two baffle plates are hinged to the left side and the right side in the connecting groove, the tops of the two baffle plates are respectively provided with a first pull ring, the left side and the right side of the inner wall of the second cleaning box are rotatably provided with second threaded rods, the second threaded rods are provided with second thread seats, the second thread seats are in sliding connection with the inner wall of the second cleaning box, the opposite sides of the two second thread seats are respectively provided with a second pull ring, third pull rings are respectively buckled between the second pull rings and the first pull rings, and the two third pull rings on the same side are connected through pull rods;
the top ends of the left side and the right side of the inner wall of the second cleaning box rotate to form a first bevel gear, the top of the inner wall of the second cleaning box rotates to form a rotating rod, the left end and the right end of the rotating rod are fixedly provided with second bevel gears meshed with the first bevel gear, the first bevel gear is coaxial with a second threaded rod, and the left side of the first bevel gear is driven by a first motor;
the conveying assembly comprises a U-shaped seat fixedly arranged at the bottom in the first cleaning box, a first threaded rod is arranged on the inner side of the U-shaped seat in a rotating mode, first threaded seats are movably arranged at two ends of the first threaded rod, the first threaded seats are in sliding connection with the U-shaped seat, threaded sections with opposite rotation directions are arranged at two ends of the first threaded rod, a conveying plate is movably arranged above the U-shaped seat, the top of the conveying plate is in contact with the bottom of the placing plate, the bottom of the conveying plate is connected with the top of the first threaded seat through a push rod, the push rods are respectively hinged to the connecting positions of the first threaded seats and the conveying plate, and the first threaded rod is driven by a second motor.
Through above-mentioned technical scheme, through having set up the box of two equidimension, when needing to place the semiconductor wafer, become the vacuum with the great box of volume at first, place the semiconductor wafer in the less box of volume, then become the vacuum with the less box of volume, when two boxes are the vacuum state, carry the semiconductor wafer to the great box that has the clearance function in this moment and wash to can save certain time, thereby improved abluent efficiency.
Preferably, two clamping plates are movably arranged in the second cleaning box, opposite sides of the two clamping plates are connected with the inner wall of the second cleaning box through spring telescopic rods, a push plate is arranged on the rear side in the second cleaning box in a sliding mode, the bottom of the push plate is connected with the bottom end of the rear side in the second cleaning box through a plurality of electric telescopic rods, push blocks are arranged on the left side and the right side of the top of the push plate, two push blocks are right-angle triangular plates, inclined planes of the two push blocks are oppositely arranged, and the bottom of the rear end of each clamping plate is respectively contacted with the inclined planes of the two push blocks.
Through above-mentioned technical scheme, set up splint through the activity, when being equipped with the semiconductor wafer and being carried to the second and wash the case, and then can be through splint with placing the board and carry out the centre gripping, guarantee the stability when wasing.
Preferably, the left side and the right side of the placing plate are both provided with connecting plates, and one side of each connecting plate is provided with a groove matched with the clamping plate.
Preferably, the baffle is respectively articulated to set up in the first closing plate of spread groove left and right sides, two the opposite side of first closing plate all articulates and is provided with the second closing plate, two the opposite side of second closing plate contacts each other, the front and back end rotation that first closing plate one side was kept away from to the second closing plate is provided with the slider, the gliding spout of cooperation slider has been seted up to the second washs the incasement.
Through above-mentioned technical scheme, divide into first closing plate and second closing plate through with the baffle, and then reduced the activity space of baffle to holistic space utilization has been improved.
Preferably, a pressure sensor is arranged at the bottom in the second cleaning box, and a trigger block matched with the pressure sensor is fixedly arranged at the top of the first sealing plate at the left side.
Preferably, two placing strips for placing the placing plates are arranged in the first cleaning box, the tops of the two placing strips are provided with guide strips, the bottoms of the placing plates are provided with guide grooves for matching with the guide strips, the tops of the placing strips are provided with stop blocks, and the stop blocks are located on the rear sides of the guide strips.
Preferably, the bottom in the first cleaning box is connected with the bottom of the placing plate through a plurality of telescopic guide rods.
Preferably, the output end of the pressure sensor is electrically connected with the input end of the processor, the output end of the processor is electrically connected with the input end of the relay, and the output end of the relay is electrically connected with the second motor.
Preferably, the volume of the space in the first cleaning tank is 1/2 of the volume of the space in the second cleaning tank.
Preferably, an observation window is arranged at the front end of the box door, and the observation window is made of transparent glass.
(III) beneficial effects
The invention provides vacuum plasma cleaning equipment. The beneficial effects are as follows:
1. this vacuum plasma cleaning equipment, through having set up the box of two equidimension, when needing to place the semiconductor wafer, become the vacuum with the great box of volume at first, place the semiconductor wafer in the less box of volume, then become the vacuum with the less box of volume, when two boxes are the vacuum state, carry the semiconductor wafer to the great box that has the clearance function in this moment and wash to can save certain time, thereby improved abluent efficiency.
2. This vacuum plasma cleaning equipment has set up splint through the activity, when being equipped with the semiconductor wafer and being carried to the second and washs the case, and then can carry out the centre gripping through splint with placing the board, guarantees the stability when wasing.
3. This vacuum plasma cleaning equipment through divide into first closing plate and second closing plate with the baffle, and then reduced the activity space of baffle to holistic space utilization has been improved.
Drawings
FIG. 1 is an illustration of the present invention;
FIG. 2 is an interior display view of the cleaning tank of the present invention;
FIG. 3 is an illustration of a second purge bin in accordance with the present invention;
FIG. 4 is a schematic view of the structure of a second purge bin according to the present invention;
FIG. 5 is an illustration of a first purge bin in accordance with the present invention;
FIG. 6 is a schematic view of the structure of the first cleaning tank according to the present invention;
FIG. 7 is an illustration of a placement plate in accordance with the present invention;
FIG. 8 is an illustration of a baffle plate of the present invention;
fig. 9 is a view showing placement of a strip in the present invention.
1, a base; 2. a first purge bin; 3. a second purge bin; 4. a door; 5. placing a plate; 6. an air inlet pipe; 7. an exhaust pipe; 8. a transport assembly; 9. an opening and closing assembly; 21. placing a strip; 22. a guide bar; 23. a stop block; 31. a work plate; 32. a clamping plate; 33. a push plate; 34. an electric telescopic rod; 35. a spring telescoping rod; 41. an observation window; 51. a connecting plate; 81. a U-shaped seat; 82. a first threaded rod; 83. a first screw seat; 84. a conveying plate; 85. a push rod; 86. a telescopic guide rod; 91. a baffle; 92. a first pull ring; 93. a second pull ring; 94. a second screw seat; 95. a second threaded rod; 96. a pull rod; 97. a first bevel gear; 98. a rotating rod; 99. a second bevel gear; 911. a first sealing plate; 912. a second sealing plate; 913. a trigger block; 914. a pressure sensor; 915. a sliding block.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Examples:
as shown in fig. 1-9, embodiments of the present invention provide: the cleaning device comprises a base 1, a first cleaning box 2 fixedly arranged at the top of the base 1 and a second cleaning box 3 fixedly arranged at the top of the first cleaning box 2, wherein the front ends of the first cleaning box 2 and the second cleaning box 3 are both hinged with a box door 4, the inner rear sides of the first cleaning box 2 and the second cleaning box 3 are respectively provided with an air inlet pipe 6 and an air outlet pipe 7, a placing plate 5 is placed in the first cleaning box 2, a placing groove is formed in the top of the placing plate 5, a plurality of working plates 31 are arranged in the second cleaning box 3, an opening and closing assembly 9 used for communicating the first cleaning box 2 with the second cleaning box 3 is arranged in the second cleaning box 3, and a conveying assembly 8 used for conveying the placing plate 5 to the second cleaning box 3 is arranged in the first cleaning box 2;
the opening and closing assembly 9 comprises a connecting groove which is formed in the top end of the first cleaning box 2 and the bottom end of the second cleaning box 3, two baffle plates 91 are hinged to the left side and the right side in the connecting groove at the upper end, first pull rings 92 are arranged at the tops of the two baffle plates 91, second threaded rods 95 are rotatably arranged on the left side and the right side of the inner wall of the second cleaning box 3, second threaded seats 94 are arranged on the second threaded rods 95, the second threaded seats 94 are in sliding connection with the inner wall of the second cleaning box 3, second pull rings 93 are arranged on the opposite sides of the two second threaded seats 94, third pull rings are buckled between the second pull rings 93 and the first pull rings 92, and the two third pull rings at the same side are connected through pull rods 96;
the top ends of the left side and the right side of the inner wall of the second cleaning box 3 rotate to form a first bevel gear 97, the top of the inner wall of the second cleaning box 3 rotates to form a rotating rod 98, the left end and the right end of the rotating rod 98 are fixedly provided with second bevel gears 99 meshed with the first bevel gear 97, the first bevel gear 97 is coaxial with the second threaded rod 95, and the left side first bevel gear 97 is driven by a first motor;
the conveying assembly 8 comprises a U-shaped seat 81 fixedly arranged at the inner bottom of the first cleaning box 2, a first threaded rod 82 is rotatably arranged on the inner side of the U-shaped seat 81, two ends of the first threaded rod 82 are movably provided with first threaded seats 83, the first threaded seats 83 are in sliding connection with the U-shaped seat 81, two ends of the first threaded rod 82 are provided with threaded sections with opposite rotation directions, a conveying plate 84 is movably arranged above the U-shaped seat 81, the top of the conveying plate 84 is in contact with the bottom of the placing plate 5, the bottom of the conveying plate 84 is connected with the top of the first threaded seat 83 through a push rod 85, the push rod 85 is hinged with the connecting positions of the first threaded seat 83 and the conveying plate 84 respectively, and the first threaded rod 82 is driven by a second motor;
the bottom in the second cleaning tank 3 is provided with a pressure sensor 914, and the top of the left first sealing plate 911 is fixedly provided with a trigger block 913 matched with the pressure sensor 914;
two placing strips 21 for placing the placing plates 5 are arranged in the first cleaning box 2, guide strips 22 are arranged at the tops of the two placing strips 21, guide grooves for matching the guide strips 22 are formed in the bottom of the placing plates 5, a stop block 23 is arranged at the top of the placing strip 21, and the stop block 23 is positioned at the rear side of the guide strips 22;
the bottom end in the first cleaning box 2 is connected with the bottom of the placing plate 5 through a plurality of telescopic guide rods 86;
the output end of the pressure sensor 914 is electrically connected with the input end of the processor, the output end of the processor is electrically connected with the input end of the relay, and the output end of the relay is electrically connected with the second motor;
the space volume in the first cleaning tank 2 is 1/2 of the space volume in the second cleaning tank 3;
the front end of the box door 4 is provided with an observation window 41, and the observation window 41 is made of transparent glass;
when the semiconductor wafer is required to be cleaned, the inside of the first cleaning tank 2 is first brought into a vacuum state through the exhaust pipe 7 in the second cleaning tank 3, the semiconductor wafer is further placed in the placing groove of the placing plate 5, the placing plate 5 with the semiconductor wafer is placed in the first cleaning tank 2, the placing plate 5 is slid into the first cleaning tank 2 through the cooperation of the placing bar 21 and the guide groove, at this time, the door 4 is closed, the inside of the first cleaning tank 2 is exhausted, the inside of the first cleaning tank 2 is brought into a vacuum state, the time for bringing the inside of the first cleaning tank 2 into a vacuum state is shorter than the time for bringing the inside of the second cleaning tank 3 into a vacuum state because the inside space of the first cleaning tank 2 is smaller than the inside of the second cleaning tank 3, and when the inside of the first cleaning tank 2 and the inside of the second cleaning tank 3 are both in a vacuum state, at this time, the first motor is driven, the first motor drives the left first bevel gear 97 to rotate, the first bevel gear 97 drives the second bevel gear 99 to rotate, the right first bevel gear 97 is driven to rotate, the first bevel gear 97 rotates to drive the second threaded rod 95 to rotate due to the fact that the rotating shaft of the first bevel gear 97 is coaxial with the second threaded rod 95, the second threaded seat 94 is driven to move upwards, the second threaded seat 94 pulls the baffle 91 to wind the rotating shaft point to rotate until the baffle 91 is changed from a horizontal state to a vertical state, at the moment, the first cleaning tank 2 and the second cleaning tank 3 are communicated through the connecting groove, after the left baffle 91 is changed to the vertical state, the triggering block 913 triggers the pressure sensor 914, and the pressure sensor 914 transmits signals to the processor to process, the result of processing is sent to the relay by the processor, and the relay controls the second motor to rotate, and then drives the first threaded rod 82 to rotate, and then drives the first threaded seat 83 to move, so that two first threaded seats 83 move in opposite directions, and then the conveying plate 84 is pushed to move upwards through the push rod 85, and then the conveying plate 84 moves upwards to push the placing plate 5, so that the placing plate 5 moves to the inside of the second cleaning box 3, and after the placing plate 5 moves to the inside of the second cleaning box 3, the semiconductor wafer at the top of the placing plate 5 can be cleaned.
As shown in fig. 1-9, embodiment two: two clamping plates 32 are movably arranged in the second cleaning box 3, opposite sides of the two clamping plates 32 are connected with the inner wall of the second cleaning box 3 through spring telescopic rods 35, a push plate 33 is arranged on the rear side in the second cleaning box 3 in a sliding manner up and down, the bottom of the push plate 33 is connected with the bottom of the rear side in the second cleaning box 3 through a plurality of electric telescopic rods 34, push blocks are arranged on the left side and the right side of the top of the push plate 33, the two push blocks are specifically right-angle triangular plates, inclined planes of the two push blocks are oppositely arranged, and the bottoms of the rear ends of the two clamping plates 32 are respectively contacted with the inclined planes of the two push blocks;
the left side and the right side of the placing plate 5 are provided with connecting plates 51, and one side of each connecting plate 51 is provided with a groove matched with the clamping plate 32;
after placing board 5 and removing second washing case 3, drive electric telescopic handle 34, and then electric telescopic handle 34 drive push pedal 33 upward movement, and then drive the kicking block upward movement, and then the kicking block can promote two splint 32 and remove in opposite directions, makes two splint 32 support into the recess, will place board 5 and press from both sides tightly, has guaranteed to place the stability of board 5 when wasing.
As shown in fig. 1-9, embodiment three: the baffles 91 are respectively first sealing plates 911 hinged on the left side and the right side of the connecting groove, the opposite sides of the two first sealing plates 911 are respectively hinged with second sealing plates 912, the opposite sides of the two second sealing plates 912 are contacted with each other, the front end and the rear end of one side of the second sealing plate 912 far away from the first sealing plate 911 are rotatably provided with sliding blocks 915, and the second cleaning box 3 is internally provided with sliding grooves matched with the sliding blocks 915 to slide;
because the baffle 91 is divided into the first sealing plate 911 and the second sealing plate 912, and the first sealing plate 911 and the second sealing plate 912 are hinged to each other, the first sealing plate 911 and the second sealing plate 912 can rotate, meanwhile, the sliding block 915 is rotatably arranged on the front side and the rear side of the second sealing plate 912, the sliding block 915 is slidably connected with the second cleaning box 3, and when the first sealing plate 911 rotates, the second sealing plate 912 can be folded relatively, so that the movable range of the baffle 91 is reduced.
Working principle: when the semiconductor wafer is required to be cleaned, the inside of the first cleaning tank 2 is first vacuumized through the exhaust pipe 7 in the second cleaning tank 3, the semiconductor wafer is further placed in the placing groove of the placing plate 5, the placing plate 5 with the semiconductor wafer is placed in the first cleaning tank 2, the placing plate 5 is slid into the first cleaning tank 2 through the cooperation of the placing bar 21 and the guide groove, the door 4 is closed at this time, the inside of the first cleaning tank 2 is exhausted, the inside of the first cleaning tank 2 is vacuumized, the time for changing the inside of the first cleaning tank 2 into the vacuumized state is shorter than the time for changing the inside of the second cleaning tank 3 into the vacuumized state because the inside of the first cleaning tank 2 is smaller than the time for changing the inside of the second cleaning tank 3, when the inside of the first cleaning tank 2 and the inside of the second cleaning tank 3 are both vacuumized, the first motor is driven at this time, the first bevel gear 97 on the left side is driven to rotate, the second bevel gear 99 is driven to rotate by the first bevel gear 97, the first bevel gear 97 on the right side is driven to rotate, the rotating shaft of the first bevel gear 97 is coaxial with the second threaded rod 95, the first bevel gear 97 rotates to drive the second threaded rod 95 to rotate, the second threaded seat 94 is driven to move upwards, the baffle 91 is pulled to rotate around the rotating shaft point by the second pull ring 92, the second pull ring 93, the third pull ring and the pull rod 96 by the second threaded seat 94 until the baffle 91 is changed from a horizontal state to a vertical state, the baffle 91 is divided into the first sealing plate 911 and the second sealing plate 912, the first sealing plate 911 and the second sealing plate 912 are hinged with each other, the first sealing plate 911 and the second sealing plate 912 can rotate, meanwhile, the slide block 915 is arranged on the front side and the rear side of the second sealing plate 912 in a rotating mode, the slider 915 and the second washs case 3 sliding connection, and then first closing plate 911 rotates, the second closing plate 912 can fold relatively, the scope of baffle 91 activity has been reduced, this moment first washs case 2 and second washs case 3 and communicates through the spread groove, after left side baffle 91 becomes vertical state, trigger piece 913 can trigger pressure sensor 914 this moment, and then pressure sensor 914 can give signal transmission to the treater and handle, the result of handling is sent to the relay to the treater, the relay control second motor rotates, and then drive first threaded rod 82 rotates, and then drive first screw thread seat 83 and remove, make two first screw thread seats 83 remove in opposite directions, and then promote delivery plate 84 through push rod 85 and upwards remove, and then delivery plate 84 upwards removes and can promote and place board 5, make place board 5 remove to the inside of second washs case 3, after placing board 5 and remove the inside of second washs case 3, and then electric telescopic handle 34 drives push pedal 33 upwards, and then drive the push piece upwards remove, and then push piece can promote two looks removal of clamp plates 32, make two clamp plates 32 to place in order to guarantee that the top is placed in the semiconductor is washed 5, and the top is placed to the semiconductor is washed to the steady.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A vacuum plasma cleaning apparatus, characterized in that: the novel cleaning device comprises a base (1), a first cleaning box (2) fixedly arranged at the top of the base (1) and a second cleaning box (3) fixedly arranged at the top of the first cleaning box (2), wherein the front ends of the first cleaning box (2) and the second cleaning box (3) are hinged with a box door (4), the rear sides of the inside of the first cleaning box (2) and the second cleaning box (3) are respectively provided with an air inlet pipe (6) and an air outlet pipe (7), a placing plate (5) is placed in the first cleaning box (2), a placing groove is formed in the top of the placing plate (5), a plurality of working plates (31) are arranged in the second cleaning box (3), an opening and closing component (9) used for communicating the first cleaning box (2) with the second cleaning box (3) is arranged in the second cleaning box (3), and a conveying component (8) used for conveying the placing plate (5) to the second cleaning box (3) is arranged in the first cleaning box (2).
The opening and closing assembly (9) comprises a connecting groove which is formed in the top end of the first cleaning box (2) and the bottom end of the second cleaning box (3), two baffles (91) are hinged to the left side and the right side in the connecting groove, a first pull ring (92) is arranged at the top of each baffle (91), a second threaded rod (95) is rotatably arranged on the left side and the right side of the inner wall of the second cleaning box (3), a second threaded seat (94) is arranged on the second threaded rod (95), the second threaded seat (94) is in sliding connection with the inner wall of the second cleaning box (3), second pull rings (93) are arranged on the opposite sides of the two second threaded seats (94), a third pull ring is buckled between each second pull ring (93) and each first pull ring (92), and the two third pull rings on the same side are connected through a pull rod (96);
the top ends of the left side and the right side of the inner wall of the second cleaning box (3) rotate to form a first bevel gear (97), the top of the inner wall of the second cleaning box (3) rotates to form a rotating rod (98), the left end and the right end of the rotating rod (98) are fixedly provided with second bevel gears (99) meshed with the first bevel gear (97), the first bevel gear (97) is coaxial with the second threaded rod (95), and the left side of the first bevel gear (97) is driven by a first motor;
the conveying assembly (8) comprises a U-shaped seat (81) fixedly arranged at the inner bottom of the first cleaning box (2), a first threaded rod (82) is rotatably arranged at the inner side of the U-shaped seat (81), first threaded seats (83) are movably arranged at two ends of the first threaded rod (82), the first threaded seats (83) are slidably connected with the U-shaped seat (81), threaded sections with opposite rotation directions are arranged at two ends of the first threaded rod (82), a conveying plate (84) is movably arranged above the U-shaped seat (81), the top of the conveying plate (84) is in contact with the bottom of the placing plate (5), the bottom of the conveying plate (84) is connected with the top of the first threaded seat (83) through a push rod (85), the push rod (85) is hinged with the connecting positions of the first threaded seat (83) and the conveying plate (84) respectively, and the first threaded rod (82) is driven by a second motor;
two clamping plates (32) are movably arranged in the second cleaning box (3), opposite sides of the two clamping plates (32) are connected with the inner wall of the second cleaning box (3) through spring telescopic rods (35), pushing plates (33) are arranged on the inner rear side of the second cleaning box (3) in a sliding mode, the bottoms of the pushing plates (33) are connected with the bottom end of the inner rear side of the second cleaning box (3) through a plurality of electric telescopic rods (34), pushing blocks are arranged on the left side and the right side of the top of the pushing plates (33), the two pushing blocks are specifically right-angle triangular plates, inclined surfaces of the two pushing blocks are arranged oppositely, and the bottoms of the rear ends of the two clamping plates (32) are respectively contacted with the inclined surfaces of the two pushing blocks;
the space volume in the first cleaning box (2) is specifically 1/2 of the space volume in the second cleaning box (3).
2. A vacuum plasma cleaning apparatus according to claim 1, wherein: the left side and the right side of the placing plate (5) are both provided with connecting plates (51), and one side of each connecting plate (51) is provided with a groove matched with the clamping plate (32).
3. A vacuum plasma cleaning apparatus according to claim 1, wherein: the baffle (91) are respectively hinged to first sealing plates (911) arranged on the left side and the right side of the connecting groove, two opposite sides of the first sealing plates (911) are respectively hinged to second sealing plates (912), the opposite sides of the second sealing plates (912) are contacted with each other, sliding blocks (915) are rotatably arranged at the front end and the rear end of one side, far away from the first sealing plates (911), of the second sealing plates (912), and sliding grooves matched with the sliding blocks (915) are formed in the second cleaning box (3).
4. A vacuum plasma cleaning apparatus according to claim 3, wherein: the bottom in the second cleaning box (3) is provided with a pressure sensor (914), and the top of the first sealing plate (911) on the left side is fixedly provided with a trigger block (913) matched with the pressure sensor (914).
5. A vacuum plasma cleaning apparatus according to claim 1, wherein: be provided with two in the first washbox (2) and be used for placing place strip (21) of board (5), two place the top of strip (21) and be provided with guide bar (22), the guide way that is used for cooperation guide bar (22) has been seted up to the bottom of placing board (5), place the top of strip (21) and be provided with dog (23), dog (23) are located guide bar (22) rear side.
6. A vacuum plasma cleaning apparatus according to claim 1, wherein: the bottom in the first cleaning box (2) is connected with the bottom of the placing plate (5) through a plurality of telescopic guide rods (86).
7. A vacuum plasma cleaning apparatus as claimed in claim 4, wherein: the output end of the pressure sensor (914) is electrically connected with the input end of the processor, the output end of the processor is electrically connected with the input end of the relay, and the output end of the relay is electrically connected with the second motor.
8. A vacuum plasma cleaning apparatus according to claim 1, wherein: the front end of the box door (4) is provided with an observation window (41), and the observation window (41) is made of transparent glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311383523.4A CN117102161B (en) | 2023-10-24 | 2023-10-24 | Vacuum plasma cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| JP2003068661A (en) * | 2001-08-30 | 2003-03-07 | Mitsubishi Heavy Ind Ltd | Vacuum processing apparatus |
| JP2010089014A (en) * | 2008-10-08 | 2010-04-22 | Jpe:Kk | Plasma cleaning apparatus |
| CN106282958A (en) * | 2016-11-03 | 2017-01-04 | 成都捷翼电子科技有限公司 | A kind of volume to volume fine vacuum sputter system for flexible electronic component and method |
| CN207918951U (en) * | 2018-01-03 | 2018-09-28 | 惠科股份有限公司 | Plasma enhanced chemical vapor deposition unit |
| CN113458086A (en) * | 2021-06-03 | 2021-10-01 | 广东工业大学 | Cleaning device and cleaning method for rocket engine parts |
| CN115069664A (en) * | 2022-05-26 | 2022-09-20 | 广东中天优智工业科技有限公司 | Ultrasonic vacuum cleaning device for semiconductor processing |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE102004020768A1 (en) * | 2004-04-16 | 2005-11-17 | Centrotherm Photovoltaics Gmbh + Co. Kg | Plasma reactor with high productivity |
| US20080127993A1 (en) * | 2006-11-30 | 2008-06-05 | Totalcat Group, Inc. | Filter Regeneration Using Plasma |
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|---|---|---|---|---|
| JP2003068661A (en) * | 2001-08-30 | 2003-03-07 | Mitsubishi Heavy Ind Ltd | Vacuum processing apparatus |
| JP2010089014A (en) * | 2008-10-08 | 2010-04-22 | Jpe:Kk | Plasma cleaning apparatus |
| CN106282958A (en) * | 2016-11-03 | 2017-01-04 | 成都捷翼电子科技有限公司 | A kind of volume to volume fine vacuum sputter system for flexible electronic component and method |
| CN207918951U (en) * | 2018-01-03 | 2018-09-28 | 惠科股份有限公司 | Plasma enhanced chemical vapor deposition unit |
| CN113458086A (en) * | 2021-06-03 | 2021-10-01 | 广东工业大学 | Cleaning device and cleaning method for rocket engine parts |
| CN115069664A (en) * | 2022-05-26 | 2022-09-20 | 广东中天优智工业科技有限公司 | Ultrasonic vacuum cleaning device for semiconductor processing |
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