CN117096677A - Connector assembly, interconnection system and server cluster - Google Patents
Connector assembly, interconnection system and server cluster Download PDFInfo
- Publication number
- CN117096677A CN117096677A CN202210507736.2A CN202210507736A CN117096677A CN 117096677 A CN117096677 A CN 117096677A CN 202210507736 A CN202210507736 A CN 202210507736A CN 117096677 A CN117096677 A CN 117096677A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- cable
- shielding
- shielding shell
- sub
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000712 assembly Effects 0.000 claims description 11
- 238000000429 assembly Methods 0.000 claims description 11
- 230000008054 signal transmission Effects 0.000 abstract description 40
- 230000000694 effects Effects 0.000 description 39
- 238000009434 installation Methods 0.000 description 17
- 238000012360 testing method Methods 0.000 description 15
- 230000002093 peripheral effect Effects 0.000 description 13
- 238000005457 optimization Methods 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000004891 communication Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/627—Snap or like fastening
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
- H01R13/631—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for engagement only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6592—Specific features or arrangements of connection of shield to conductive members the conductive member being a shielded cable
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
The application provides a connector assembly, an interconnection system and a server cluster, wherein the connector assembly comprises a circuit board, a first cable and a first shielding shell; the circuit board comprises a grounding layer, and a first signal panel is arranged on the surface of the circuit board; the first cable is used for transmitting signals and comprises a first cable core and a first shielding layer, the first cable core comprises a first main body part and a first connecting end positioned at one end of the first main body part, the first shielding layer is coated on the outer side of the first main body part, and the first connecting end is connected with the first signal panel; the first shielding shell is fixed on the circuit board and connected with the grounding layer, the first connecting end and the first signal panel are positioned between the first shielding shell and the circuit board, and the first shielding shell is abutted with the part of the surface of the first shielding layer adjacent to the circuit board so that the first shielding layer is connected with the grounding layer. Through the arrangement of the first shielding shell, the interference of external signals on the signal transmission of the first cable can be reduced, and the signal transmission stability and the electric performance of the signal of the first cable are ensured.
Description
Technical Field
The present application relates to the field of connectors, and in particular, to a connector assembly, an interconnection system, and a server cluster.
Background
Along with the upgrade of the communication rate, the integration level of the system is higher and the density of the single board wiring is higher, the system puts more stringent requirements on the high-speed electrical performance index of the connector, and crosstalk is one of the most critical electrical performance indexes. Crosstalk manifests itself as noise injection into the victim network, directly reducing the signal-to-noise ratio of the signal, causing degradation of the signal transmission quality. In the prior art, crosstalk is reduced by arranging a grounding wire, the grounding wire and the signal wire are easy to wind, the difficulty of clearing a circuit is high, the occupied space of the circuit layout is large, the signal interval cannot be compressed, the shielding effect is poor by adopting the grounding wire, and the shielding problem of a cable and a welding area of a circuit board cannot be solved.
Disclosure of Invention
The application provides a connector assembly, an interconnection system and a server cluster, which have good shielding effect and ensure high-quality signal transmission.
In a first aspect, an embodiment of the present application provides a connector assembly, where the connector assembly includes a circuit board, a first cable, and a first shielding shell, the circuit board includes a ground layer, and a first signal pad is disposed on a surface of the circuit board; the first cable is used for transmitting signals and comprises a first cable core and a first shielding layer, the first cable core comprises a first main body part and a first connecting end positioned at one end of the first main body part, the first shielding layer is coated on the outer side of the first main body part, and the first connecting end is connected with the first signal panel; the first shielding shell is fixed on the circuit board and connected with the grounding layer, the first connecting end and the first signal panel are located between the first shielding shell and the circuit board, and the first shielding shell is abutted with the part of the surface, adjacent to the circuit board, of the first shielding layer, so that the first shielding layer is connected with the grounding layer.
The circuit board is provided with a signal layer, the first signal panel is electrically connected with the signal layer, the signal layer and the grounding layer are arranged in a stacked mode along a first direction, and the first direction is intersected with the board surface of the circuit board. In an embodiment, the front projection of the first connection end on the circuit board is located in the front projection of the first signal panel on the circuit board, and the first main body portion extends from the first connection end to the outside of the circuit board, that is, a part of the projection of the first main body portion along the first direction is located on the circuit board, and a part of the projection of the first main body portion along the first direction is located outside of the circuit board, and the first direction intersects with the board surface of the circuit board. In one embodiment, the first direction is perpendicular to a board surface of the circuit board. In one embodiment, the first connection end is welded to the first signal panel, so that the first connection end is electrically connected to the first signal panel. In an embodiment, a gold finger is disposed at an end of the circuit board away from the first cable.
The first cable core is used for transmitting signals, in an embodiment, the first cable core comprises a first sub-core and a second sub-core, the first sub-core and the second sub-core are used for transmitting a differential signal, and signal transmission is achieved through the differential signal, so that the first cable core is high in crosstalk resistance. When two sub-cores are arranged in the first cable core, the first signal panel also comprises two first signal sub-panels, and the two sub-cores are respectively connected with the two first signal sub-panels. In an embodiment, the first cable core may also include only one sub-core, and the first signal pad includes one first signal sub-pad.
The first cable is a non-ground cable, the first cable is grounded through the first shielding layer, and the first cable is grounded, so that the size of the first cable is small because the first cable does not contain a ground wire, the connection of the first cable and the circuit board is more convenient, and the connector assembly is small in size and high in assembly efficiency.
In one embodiment, the first shielding layer is aluminum foil. In an embodiment, the material of the first shielding layer may be other conductive metals with better ductility.
The first shielding shell is arranged on the periphery side of the first connecting end, extends to the outer side of the first main body part along the third direction, is abutted to the first shielding layer, and is in the extending direction of the first cable on the circuit board, and in an embodiment, the third direction is parallel to the board surface of the circuit board and perpendicular to the first direction. In one embodiment, the first shielding shell is abutted with a part of the surface of the first shielding layer, which is away from the circuit board along the first direction, and in other embodiments, the first shielding shell can be abutted with other surfaces of the first shielding layer. The first shield layer is connected to the ground layer by being connected to the first shield case, thereby grounding the first shield layer. In an embodiment, the first shielding shell is detachably connected with the circuit board, so that the first shielding shell can be quickly disassembled and assembled, and the recycling rate of the first shielding shell is improved. In an embodiment, the connection mode of the first shielding shell and the circuit board includes but is not limited to fish eye crimping or pin soldering.
The orthographic projection of the first shielding shell on the circuit board covers the orthographic projection of the first connecting end on the circuit board, in an implementation mode, the size of the first shielding shell is slightly larger than that of the first connecting end, so that the area of the first shielding shell occupied the circuit board is reduced, the cost is reduced, the signal density is improved, and the distance between the first shielding shell and the peripheral side of the first connecting end is relatively close, so that a better shielding effect can be achieved. In an embodiment, the material of the first shielding shell may be metal such as iron, copper, aluminum, etc. In an embodiment, the material of the first shielding shell may be an alloy or a conductive material such as a conductive plastic or a conductive plastic.
Through the arrangement of the first shielding shell, firstly, the first shielding shell is abutted with the first shielding layer on the first main body part, so that the first cable is grounded, normal signal transmission is ensured, interference of external signals on signal transmission of the first cable can be reduced, insertion loss of a first sub-core and a second sub-core can be reduced, and signal transmission quality is improved; meanwhile, the first shielding shell is abutted to the first shielding layer in a surface-to-surface mode, the first shielding shell is not easy to damage the first shielding layer, and good contact between the first shielding shell and the first shielding layer is guaranteed.
Second, the first shielding shell cover is established the outside of first link, can shield external interference signal of first link department just promotes signal transmission stability, because first link needs with first signal panel electricity is connected, first link outside does not wrap up first shielding layer, first link receives external signal easily and interferes with, and first shielding shell can with first link and external interference signal isolation reduces the loss of signal transmission of first link and the appearance of transmission error problem, guarantees first cable transmission signal's integrality, simultaneously, first shielding shell still is used for regard as the signal reference ground of first link, first shielding shell with first shielding layer is connected, realizes the reference ground continuity of first link signal, promotes signal transmission stability.
Third, first shield shell with first shielding layer deviates from the surface butt of circuit board just first shield shell is fixed on the circuit board, first shield shell can with first cable is pressed towards the circuit board, first cable is fixed between first shield shell and the circuit board, reducible because connector assembly vibration is right first link with the adverse effect that first signal disc electricity is connected causes guarantees first link with the steadiness that first signal disc is connected.
Fourth, the accessible control the first shield shell follow the height of first direction, and then control first shield shell with the clamp force of first shielding layer, so that first shield shell with first shielding layer closely laminates, guarantees first shielding layer ground connection all the time, just first shield shell adaptable not unidimensional first cable improves the utilization ratio of first shield shell.
Fifth, in the present application, the first shielding layer is grounded by only installing the first shielding shell without modifying the first cable, so as to achieve the effects of reducing crosstalk and insertion loss, and the first shielding shell has high processing efficiency and simple assembly.
In an embodiment, the connector assembly further comprises a housing, a release buckle and a pull ring, and the connector assembly is connected and disconnected through the cooperation of the release buckle and the pull ring.
In one possible implementation manner, the first shielding shell includes a first sub-portion, a second sub-portion and a third sub-portion that are sequentially connected, an extending direction of the first sub-portion and an extending direction of the third sub-portion are both intersected with an extending direction of the second sub-portion, and one ends of the first sub-portion and the third sub-portion, which are far away from the second sub-portion, are fixed on the circuit board and are connected with the ground layer, and at least part of the second sub-portion is elastically abutted with the first shielding layer so that the first shielding layer is connected with the ground layer.
Because the first shielding shell is a metal shell, the first shielding shell has certain elasticity, and is characterized in that the second sub-part can move along the first direction close to or far away from the circuit board, when the second sub-part is abutted to the first shielding layer, the second sub-part is elastically deformed along the first direction far away from the circuit board, the second sub-part generates an elastic force along the first direction towards the circuit board direction, so that the second sub-part is tightly attached to the first shielding layer, and when the connector assembly vibrates to drive the first cable to vibrate along the first direction, the second sub-part can move along the first shielding layer in a clinging manner through elastic deformation, and the second sub-part is stably and reliably connected with the first shielding layer to ensure the grounding of the first shielding layer, so that the shielding effect of the first shielding shell and the quality of signal transmission are improved.
In an embodiment, the ends of the first sub-portion and the third sub-portion, which are far away from the second sub-portion, are connected with the ground layer, and the connection reliability of the first shielding shell and the ground layer is higher. In an embodiment, one of the first sub-portion and the third sub-portion is connected to the ground layer, and the other of the first sub-portion and the third sub-portion may be directly soldered on a surface of the circuit board adjacent to the first shielding shell or other position where soldering is convenient.
In an embodiment, the first shielding shell is of an integrated structure, the first sub-portion, the second sub-portion and the third sub-portion are integrally formed, the structural strength is higher, and normal operation of the first shielding shell is guaranteed. In an embodiment, the first shielding shell is integrally formed by stamping, so that the processing procedure is simple and the cost is low.
In one possible implementation, the second sub-portion is recessed toward the first cable along a first direction to form a first groove, the first direction intersects the circuit board, and a bottom of the first groove elastically abuts against the first shielding layer.
Through the setting of first recess, increase the second sub-portion is in the degree of deformation of first direction, compare with the second sub-portion sets up to complete smooth shape, first recess with the connection reliability of first shielding layer is higher, just the second sub-portion with the steadiness of first sub-portion with the third sub-portion connection is stronger, especially when using in the frequent environment of vibration connector assembly, the setting of first recess can be guaranteed first shielding shell with first shielding layer is stable to be connected, makes signal high quality transmission.
In an embodiment, the extending direction of the first groove is the same as the extending direction of the first shielding layer, so that the contact area between the first groove and the first shielding layer is increased, and the first shielding shell can play a better shielding role. In an embodiment, the extending direction of the first groove may be different from the extending direction of the first shielding layer, and the extending direction of the first groove may be set according to actual needs. In an embodiment, a part of the second sub-portion is recessed towards the first cable along the first direction to form the first groove, and a part of the second sub-portion is not recessed towards the first cable and still remains parallel to the circuit board, so as to facilitate the mounting connection of the first shielding shell and the circuit board.
In one possible implementation, the first recess is provided with a first opening penetrating the bottom of the recess. The first opening can increase the elasticity of the first groove so as to reduce the possibility of warping during the assembly of the first shielding shell and ensure good contact between the bottom of the first groove and the first shielding layer.
In one possible implementation, at least a portion of the first opening does not overlap with an orthographic projection of the first shielding layer on the circuit board. At least part of the first open holes are positioned at the part of the first groove which is not contacted with the first shielding layer, so that the elasticity of the first groove is increased, and meanwhile, the contact area between the first groove and the first shielding layer is increased as much as possible, so that the first shielding shell can play a better shielding role.
In an embodiment, the front projection of the first opening and the front projection of the first shielding layer on the circuit board are not overlapped, and the first opening is located at a position where the first groove is not in contact with the first shielding layer, so that the contact area between the first groove and the first shielding layer is not reduced while the elasticity of the first groove is increased, and the first shielding shell can play a better shielding role.
In an embodiment, the front projection of the first opening and the first connection end on the circuit board at least partially overlaps, when the connector assembly is assembled, the first shielding shell is fixed on the circuit board, and then the first connection end is welded on the first signal panel through the first opening, or the first connection end is adhered on the first signal panel through the first opening in a dispensing manner, and the first shielding shell can play a positioning role for the installation of the first cable. In an embodiment, the orthographic projection of the first opening and the first connection end on the circuit board at least partially overlaps, and when the connector assembly is used for a long time, if the connection between the first connection end and the first signal panel is loose, the connection between the first connection end and the first signal panel can be fastened through the first opening.
In one possible implementation manner, a pin is disposed at an end of the first sub-portion and the third sub-portion, which is far away from the second sub-portion, a ground through hole is disposed on the circuit board, the ground through hole is connected with the ground layer, and the pin extends into the ground through hole so that the first shielding shell is connected with the ground layer. The ground through holes are formed in the periphery of the first cable, penetrate through the circuit board and are close to the surface of the first shielding shell along the first direction, and are connected with the ground through holes through the pins so as to achieve fixed connection of the first shielding shell and the circuit board.
In an embodiment, the ground through hole penetrates through two surfaces of the circuit board along the first direction, so that connection between the pin and the ground through hole is simpler and more reliable. In an embodiment, four ground through holes are formed in the circuit board, two pins are arranged at one end, away from the second sub-portion, of the first sub-portion, two pins are also arranged at one end, away from the second sub-portion, of the third sub-portion, and the four pins extend into the four ground through holes respectively, so that stable connection between the first shielding shell and the circuit board is achieved.
In one possible implementation manner, a second signal panel is arranged on the surface of the circuit board, the connector assembly further comprises a second cable and a second shielding shell, the second cable comprises a second cable core and a second shielding layer, the second cable core comprises a second main body part and a second connecting end positioned at one end of the second main body part, the second shielding layer is coated on the outer side of the second main body part, and the second connecting end is connected with the second signal panel; the second shielding shell is fixed on the circuit board and is connected with the grounding layer, the second connecting end and the second signal panel are positioned between the second shielding shell and the circuit board, and the second shielding shell is abutted with the surface, adjacent to the circuit board, of the second shielding layer so that the second shielding layer is connected with the grounding layer; the second shielding shell and the first shielding shell are positioned on the same side of the circuit board, the second shielding shell and the first shielding shell are arranged at intervals along a second direction, and the second direction is intersected with the extending direction of the first cable.
The arrangement of the second cable increases the density of the signals transmitted by the connector assembly, the arrangement of the first shielding shell can reduce the interference of the second cable on the signals transmitted by the first cable, and the arrangement of the second shielding shell can reduce the interference of the first cable on the signals transmitted by the second cable, so that the signal transmission quality in the connector assembly is improved while the density of the signals transmitted by the connector assembly is increased.
The second signal panel and the second cable are both positioned on the surface of the circuit board, which is close to the first cable, and the orthographic projection of the second shielding shell on the circuit board is not overlapped with the orthographic projection of the first shielding shell on the circuit board. The second direction intersects both the first direction and the third direction, and in one embodiment, the second direction, the first direction and the third direction are perpendicular to each other.
In one embodiment, the second cable is identical to the first cable, and the second shield shell has the same construction and volume as the first shield shell.
In one embodiment, the outer diameter of the second cable is the same as the outer diameter of the first cable. In an embodiment, the outer diameter of the second cable may also be different from the outer diameter of the first cable. In an embodiment, the second shielding shell and the first shielding shell may also be different in material and volume. In one embodiment, the first cable is an input signal cable and the second cable is an output signal cable. In an embodiment, the second cable is an input signal cable and the first cable is an output signal cable. In one embodiment, the first cable and the second cable are both input signal cables. In one embodiment, the first cable and the second cable are both output signal cables.
In an embodiment, the connector assembly further comprises a plurality of first cables and/or second cables, the plurality of cables are located on the same side of the circuit board along the first direction, shielding shells are covered on the peripheral side of each cable, and the plurality of shielding shells are arranged at intervals along the second direction, so that the density of signals transmitted by the connector assembly is increased. In an embodiment, the connector assembly can set up 4, 8, 16 equi-quantity cables according to actual need, and the week side of every cable is all covered and is equipped with shielding shell, and a plurality of shielding shells are followed the interval sets up in the second direction has increased connector assembly transmission signal's density, the cable is followed the interval of second direction can be 3.62 millimeters to 2.23 millimeters, and when setting up more quantity cables, the cable is followed the interval of second direction can be less than 2.23 millimeters, because shielding shell's setting up between the multiple cables, has improved the crosstalk performance between the signal of cable link, has improved the ground backward flow of multiple cable, reduces the return circuit inductance of multiple cable.
In one possible implementation manner, a third signal panel is arranged on the surface of the circuit board, the connector assembly further comprises a third cable and a third shielding shell, the third cable comprises a third cable core and a third shielding layer, the third cable core comprises a third main body part and a third connecting end positioned at one end of the third main body part, the third shielding layer is coated on the outer side of the third main body part, and the third connecting end is connected with the third signal panel; the third shielding shell is fixed on the circuit board and is connected with the grounding layer, the third connecting end and the third signal panel are positioned between the third shielding shell and the circuit board, and the third shielding shell is abutted with the surface, adjacent to the circuit board, of the third shielding layer so that the third shielding layer is connected with the grounding layer; the third shielding shell and the first shielding shell are respectively positioned at two sides of the circuit board along a first direction, the first direction intersects with the circuit board, and orthographic projections of the first shielding shell and the third shielding shell on the circuit board are at least partially not overlapped.
Wherein, the arrangement of the third cable increases the density of the signal transmitted by the connector assembly. The third signal panel and the third cable are both positioned on the surface of the circuit board far away from the first cable along the first direction, and the third shielding shell and the first shielding shell are respectively positioned on two sides of the circuit board along the first direction, so that the space on the circuit board can be saved, and more cables or other electronic elements can be connected on the circuit board. In one embodiment, the first cable is an input signal cable and the third cable is an output signal cable. In an embodiment, the third cable is an input signal cable and the first cable is an output signal cable. In an embodiment, the first cable and the third cable are both input signal cables. In an embodiment, the first cable and the third cable are both output signal cables.
In an embodiment, the third shielding shell and the first shielding shell are staggered along the third direction, that is, the orthographic projection of the third shielding shell on the circuit board and the orthographic projection of the first shielding shell on the circuit board are not overlapped at least partially, so that crosstalk at the third connection end and the first connection end can be reduced better, and a space is reserved for facilitating installation of the third shielding shell, the first shielding shell and the circuit board.
In an embodiment, the third shielding shell and the first shielding shell are staggered along the second direction, that is, the orthographic projection of the third shielding shell on the circuit board and the orthographic projection of the first shielding shell on the circuit board are at least partially not overlapped, so that crosstalk at the third connection end and the first connection end can be reduced better, and a space is reserved for facilitating installation of the third shielding shell, the first shielding shell and the circuit board.
In an embodiment, when the third shielding shell is disposed away from the first shielding shell along the second direction, it may be achieved that an orthographic projection of the third shielding shell on the circuit board does not overlap with an orthographic projection of the first shielding shell on the circuit board.
In an embodiment, the third shielding shell and the first shielding shell are staggered along the second direction and the third direction, so that crosstalk between the third connection end and the first connection end can be reduced better, and a space is reserved for installing the third shielding shell, the first shielding shell and the circuit board.
In an embodiment, the front projection of the third shielding shell on the circuit board and the front projection of the first shielding shell on the circuit board may also overlap, where in order to facilitate smooth installation of the third shielding shell and the first shielding shell, the ground through holes of the third shielding shell need to be staggered with the ground through holes of the first shielding shell, and correspondingly, the pin positions on the third shielding shell need to be different from the pin positions of the first shielding shell, so that the respective pins correspond to the respective ground through holes.
In an embodiment, the connector assembly further includes a plurality of first cables disposed along the second direction at intervals, and the connector assembly includes a plurality of third cables disposed along the second direction at intervals, the plurality of first cables and the plurality of third cables are disposed along two sides of the first direction, each of the first cables is covered with a first shielding shell on a peripheral side, each of the third cables is covered with a third shielding shell on a peripheral side, the plurality of first shielding shells are disposed along the second direction at intervals, the plurality of third shielding shells are disposed along the second direction at intervals, the plurality of first shielding shells and the plurality of third shielding shells are disposed in a staggered manner, the density of signals transmitted by the connector assembly is increased, and a space is reserved for the third shielding shells and the first shielding shells and the circuit board to be mounted.
In an embodiment, the circuit board is provided with the same number of the first cables and the third cables along two sides of the first direction, one of the first cables and the third cables is an input signal cable, and the other of the first cables and the third cables is an output signal cable.
In one possible implementation manner, a second signal panel is arranged on the surface of the circuit board, the connector assembly further comprises a second cable and a second shielding shell, the second cable comprises a second cable core and a second shielding layer, the second cable core comprises a second main body part and a second connecting end positioned at one end of the second main body part, the second shielding layer is coated on the outer side of the second main body part, and the second connecting end is connected with the second signal panel; the second shielding shell is fixed on the circuit board and is connected with the grounding layer, the second connecting end and the second signal panel are positioned between the second shielding shell and the circuit board, and the second shielding shell is abutted with the surface, adjacent to the circuit board, of the second shielding layer so that the second shielding layer is connected with the grounding layer; the second shielding shell and the first shielding shell are positioned on the same side of the circuit board, the second shielding shell and the first shielding shell are connected side by side along a second direction, and the second direction is intersected with the extending direction of the first cable.
Wherein, the arrangement of the second cable increases the density of the signal transmitted by the connector assembly. The second signal panel and the second cable are both positioned on the surface of the circuit board, which is close to the first cable, and the orthographic projection of the second shielding shell on the circuit board is not overlapped with the orthographic projection of the first shielding shell on the circuit board. The second shielding shell and the first shielding shell are connected side by side along the second direction, the second cable is closer to the first cable, the space on the circuit board can be saved, and more cables or other electronic components can be connected on the circuit board. The arrangement of the first shielding shell can reduce the interference of the second cable to the transmission signal of the first cable, and the arrangement of the second shielding shell can reduce the interference of the first cable to the transmission signal of the second cable, so that the transmission signal density of the connector assembly is increased, and meanwhile, the transmission quality of signals in the connector assembly is improved.
In one possible implementation manner, the first shielding shell comprises a first sub-part, a second sub-part and a third sub-part which are sequentially connected, and at least part of the second sub-part is elastically abutted with the first shielding layer; the second shielding shell comprises a third sub-part, a fourth sub-part and a fifth sub-part which are sequentially connected, and at least part of the fourth sub-part is elastically abutted with the second shielding layer.
Wherein the extending direction of the first sub-portion, the extending direction of the third sub-portion and the extending direction of the fifth sub-portion all intersect with the extending direction of the second sub-portion or the extending direction of the fourth sub-portion; one end of the first sub-part far away from the second sub-part is fixed on the circuit board and connected with the ground layer, one end of the third sub-part far away from the second sub-part or the fourth sub-part is fixed on the circuit board and connected with the ground layer, and one end of the fifth sub-part far away from the fourth sub-part is fixed on the circuit board and connected with the ground layer.
The first shielding shell and the second shielding shell are approximately M-shaped, and share the third sub-part, so that on one hand, space on the circuit board can be saved, and more cables or other electronic elements can be connected to the circuit board; on the other hand, the manufacturing costs of the first shield shell and the second shield shell can be saved.
In an embodiment, the first sub-portion, the third sub-portion and the fifth sub-portion may be simplified from a plate shape to a column shape, so that the processing and the installation of the shielding shell are easier.
In an embodiment, the connector assembly includes a plurality of cables arranged along the second direction, and each cable has a shielding shell on a peripheral side, and the shielding shells are sequentially connected and share the same adjacent side to form a whole.
In an embodiment, the connector assembly includes a plurality of cables, the plurality of cables are distributed on two sides of the circuit board along the first direction, and the shielding shells located on two sides of the circuit board along the first direction respectively form a whole shielding shell.
In an embodiment, the first shielding shell is provided with two first openings arranged along the second direction, orthographic projections of the two first openings on the circuit board are located on the periphery side of the first cable, and the arrangement of the first openings can increase the elasticity of the first groove so as to reduce the possibility of warping when the first shielding shell is assembled, ensure good contact between the bottom of the first groove and the first shielding layer, and fix the first cable on the circuit board through the first openings or fix the first cable on the circuit board through the first openings when the first cable is loose, so that the connection between the first cable and the circuit board can be reinforced through the first openings in a dispensing mode. The second shield shell has a similar structure to the first shield shell.
In one possible implementation, the second sub-portion is provided with a second opening, which at least partially overlaps with the orthographic projection of the first connection end and/or the first signal pad on the circuit board.
The second opening is located on one side, close to the first connecting end, of the first opening along the third direction, and the second opening is arranged to facilitate connection and fixation of the first connecting end and the first signal panel. The second shield shell has a similar structure to the first shield shell.
In an embodiment, when the connector assembly is assembled, the first shielding shell is fixed on the circuit board, and then the first connecting end is welded on the first signal panel through the second opening, or the first connecting end is adhered on the first signal panel through the second opening in a dispensing manner, the first shielding shell can play a role in positioning the installation of the first cable, and meanwhile, if the connection of the first connecting end and the first signal panel is loose in long-term use of the connector assembly, the connection of the first connecting end and the first signal panel can be fastened through the second opening.
In one possible implementation manner, a ground pad is disposed on a surface, close to the first cable, of the circuit board, and the ground pad abuts against a part of the first shielding layer, close to one side of the circuit board. The ground pad with the setting of first shielding shell makes two surfaces of first cable edge the first direction are all grounded, just first shielding shell with first shielding layer butt can with first shielding layer with the ground pad compresses tightly, can play shielding effect better to reduce external environment to first cable signal transmission's influence.
In an embodiment, the ground pad is electrically connected to the ground layer, and both surfaces of the first cable along the first direction are electrically connected to the ground layer. In an embodiment, the ground pad is a metal sheet disposed at a local position on the surface of the circuit board, and the first shielding layer is close to the surface of the circuit board and abuts against the metal sheet to achieve a shielding effect. In one embodiment, a portion of the first shielding layer is welded to the ground pad near a surface of the ground pad to protect and fix the first cable. In an embodiment, a portion of the first shielding layer is bonded to the ground pad near a surface of the ground pad, such as by ultraviolet light curing glue (UV glue), to secure the first cable.
In a second aspect, an embodiment of the present application provides an interconnection system comprising a first electronic device and a connector assembly as defined in any one of the preceding claims, the first electronic device being electrically connected to an end of the circuit board remote from the first cable.
In an embodiment, the interconnection system further includes a second electronic device, one end of the connector assembly is electrically connected to the first electronic device, the other end of the connector assembly is electrically connected to the second electronic device, and the first electronic device and the second electronic device are interconnected through the arrangement of the connector assembly.
In an embodiment, the first electronic device may be a board, and the second electronic device may be a back board. In an embodiment, the first electronic device may be a back plate, and the second electronic device may be a single board. In an embodiment, the first electronic device and the second electronic device are both single boards. In an embodiment, the second electronic device is a back plate, and the first electronic device is a network card. In an embodiment, the second electronic device is a back plane and the first electronic device is a switch.
In a third aspect, an embodiment of the present application provides a server cluster, including a plurality of servers, where the servers include a high-speed backplane, a switch, a service board, a backplane connector, and a plurality of connector assemblies as any one of the foregoing, where the backplane connector and an end of the first cable away from the circuit board are connected, where the backplane connector is fixedly connected to the high-speed backplane, where a part of the circuit boards in the connector assemblies in the plurality of connector assemblies are connected to the switch, and where another part of the circuit boards in the connector assemblies in the plurality of connector assemblies are connected to the service board.
According to the application, through the arrangement of the first shielding shell, the first shielding shell is abutted with the first shielding layer on the first main body part, so that the first cable is grounded, normal signal transmission is ensured, interference of external signals on the signal transmission of the first cable can be reduced, and signal transmission quality can be improved.
Drawings
In order to more clearly describe the technical solution in the embodiments of the present application, the drawings required to be used in the embodiments of the present application will be described below.
FIG. 1 is a schematic diagram of an interconnect system provided in accordance with an embodiment of the present application;
FIG. 2 is a schematic diagram of an interconnection system in a server cluster provided in an embodiment of the present application;
fig. 3 is a perspective view of a connector assembly provided by a first embodiment of the present application;
FIG. 4 is an exploded view of a connector assembly provided by a first embodiment of the present application;
FIG. 5 is a schematic structural view of a first cable core according to an embodiment of the present application;
fig. 6 is a schematic structural view of a first shielding shell according to an embodiment of the present application;
FIG. 7a is a schematic diagram of a single ground cable connector assembly provided in an embodiment;
FIG. 7b is a schematic diagram of a dual-ground cable connector assembly provided in an embodiment;
FIG. 8 is a perspective view of a connector assembly according to an embodiment of the present application;
FIG. 9 is an exploded view of a connector assembly according to one embodiment of the present application;
FIG. 10 is a schematic diagram illustrating a relationship between a first opening and a circuit board according to an embodiment of the present application;
fig. 11 is a perspective view of a connector assembly provided by a second embodiment of the present application;
FIG. 12 is an exploded view of a connector assembly provided by a second embodiment of the present application;
FIG. 13a is a graph of far-end crosstalk optimization effects in a second embodiment of the present application;
FIG. 13b is a graph of the near-end crosstalk optimization effect in a second embodiment of the present application;
FIG. 14 is a schematic view of a connector assembly according to an embodiment of the present application;
fig. 15 is a top view of a connector assembly provided by a third embodiment of the present application;
fig. 16 is a bottom view of a connector assembly provided by a third embodiment of the present application;
fig. 17 is a cross-sectional view of a connector assembly provided by a third embodiment of the present application;
fig. 18 is an exploded view of a connector assembly provided by a fourth embodiment of the present application;
fig. 19 is an exploded view of a connector assembly provided by a fifth embodiment of the present application;
FIG. 20 is an exploded view of a connector assembly provided by a fifth embodiment of the present application;
fig. 21 is a bottom view of a shield shell provided by a fifth embodiment of the present application;
FIG. 22a is a graph of far-end crosstalk optimization effects in a fifth embodiment of the present application;
FIG. 22b is a graph of the near-end crosstalk optimization effect of a fifth embodiment of the present application;
FIG. 23a is a graph of far-end crosstalk optimization effects in a fifth embodiment of the present application;
FIG. 23b is a graph of the near-end crosstalk optimization effect in a fifth embodiment of the present application;
FIG. 24 is a schematic view of a connector assembly provided in an embodiment of the present application;
fig. 25 is an exploded view of a connector assembly according to an embodiment of the present application.
Detailed Description
The following description of the technical solutions according to the embodiments of the present application will be given with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments.
The terms "first," "second," and the like herein are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
Furthermore, herein, the terms "upper," "lower," and the like, are defined with respect to the orientation in which the structure is schematically disposed in the drawings, and it should be understood that these directional terms are relative concepts, which are used for descriptive and clarity with respect thereto and which may be varied accordingly with respect to the orientation in which the structure is disposed.
For convenience of understanding, the following explains and describes english abbreviations and related technical terms related to the embodiments of the application.
Crosstalk: refers to the coupling between two signal lines, mutual inductance and mutual capacitance between the signal lines causing noise on the lines.
A single board: the single board includes a printed circuit board (PCB board, printed Circuit Board) and electronic devices (e.g., chips, resistors, capacitors, etc.) disposed on the PCB board.
A backboard: the back plate is an important component in the communication equipment and provides electrical signal connection and physical support for various single plates or modules and the like in the system.
I/O: is an abbreviation of input/output, i.e. input/output port.
QSFP: the four-channel SFP interface is abbreviated as Quad small form-factor plug.
SFP: the Small form-factor plug interface is abbreviated as a Small form-factor plug interface.
OSFP: is an abbreviation of Octal small form-factor plug-in, i.e. eight-channel SFP interface.
GenZ: is an abbreviation for Generation Z, namely GenZ series high speed interface.
CXP: is abbreviated as CoaXPress, namely an asymmetric high-speed point-to-point serial communication digital interface.
minSAS HD: the Mini-SAS High Density is abbreviated, namely a small serial link and High-Density transmission interface.
The application provides a connector, which comprises a circuit board, a first cable and a first shielding shell; the circuit board comprises a grounding layer, and a first signal panel is arranged on the surface of the circuit board; the first cable is used for transmitting signals and comprises a first cable core and a first shielding layer, the first cable core comprises a first main body part and a first connecting end positioned at one end of the first main body part, the first shielding layer is coated on the outer side of the first main body part, and the first connecting end is connected with the first signal panel; the first shielding shell is fixed on the circuit board and connected with the grounding layer, the first connecting end and the first signal panel are located between the first shielding shell and the circuit board, and the first shielding shell is abutted with the surface, adjacent to the circuit board, of the first shielding layer, so that the first shielding layer is connected with the grounding layer.
Through the arrangement of the first shielding shell, the interference of external signals on the signal transmission of the first cable can be reduced, and the signal transmission stability and the electric performance of the signal of the first cable are ensured.
Referring to fig. 1, fig. 1 is a schematic diagram of an interconnection system provided in an embodiment of the present application, where the interconnection system 1 may be used in various communication devices, and the communication device is provided with a backplane and a board, and interconnections between the board and the board or between the board and the backplane form the interconnection system 1 for implementing a communication function, where the interconnection system formed by combining the board and the board is the most common interconnection architecture, and is generally used in a high-speed link of the communication device. Taking connection between a single board and a back board as an example, the back board provides a signal transmission channel, and meanwhile, carrying current is supplied to other single boards, the back board and the single boards together form an interconnection system 1, in order to realize signal interconnection, a connector assembly 10 is arranged between the single boards and the back board, stable connection between the single boards and the back board is realized through the connector assembly 10, and the connector assembly 10 is used as a connecting bridge between the back board and the single boards and is a key component affecting the whole communication equipment. In an embodiment, the board may be a service board or a switch board.
An embodiment of the present application provides an interconnect system 1 (shown in fig. 1), the interconnect system 1 including a first electronic device 20 and a connector assembly 10, the first electronic device 20 being electrically connected to one end of a circuit board in the connector assembly 10. In an embodiment, the interconnection system 1 further includes a second electronic device 30, one end of the connector assembly 10 is electrically connected to the first electronic device 20, the other end of the connector assembly 10 is electrically connected to the second electronic device 30, and the first electronic device 20 and the second electronic device 30 are interconnected by the arrangement of the connector assembly 10.
In an embodiment, the first electronic device 20 may be a single board, and the second electronic device 30 may be a back board. In an embodiment, the first electronic device 20 may be a back plate, and the second electronic device 30 may be a single plate. In an embodiment, the first electronic device 20 and the second electronic device 30 are both single boards. In an embodiment, the second electronic device 30 is a back board, and the first electronic device 20 is a network card. In an embodiment, the second electronic device 30 is a back plane, and the first electronic device 20 is a switch.
Taking the first electronic device 20 as a single board and the second electronic device 30 as a back board, the first electronic device 20 is provided with a single board connector 21, the second electronic device 30 is provided with a back board connector 31, the interconnection system 1 further comprises a cable connector 11, the cable connector 11 is electrically connected with the connector assembly 10 through a cable, one end of the connector assembly 10, which is far away from the cable connector 11, is connected with the single board connector 21 to realize the connection of the connector assembly 10 and the first electronic device 20, and the connector assembly 10 is connected with the second electronic device 30 through the connection of the cable connector 11 and the back board connector 31. In one embodiment, the connector assembly 10 is a male connector, the board connector 21 is a female connector, the cable connector 11 is a female connector, and the back board connector 31 is a male connector, and in other embodiments, the male and female connectors of the connector assembly 10, the board connector 21, the cable connector 11 and the back board connector 31 may be provided according to practical needs, which is not limited in the present application.
In an embodiment, the interface model of the connector assembly 10 to connect with the first electronic device 20 or the second electronic device 30 may be an I/O interface. In an embodiment, the interface model of the connector assembly 10 connected with the first electronic device 20 or the second electronic device 30 may be QSFP, SFP, OSFP, genZ, CXP, minSAS HD, or the like.
Referring to fig. 2, the interconnection system 1 may be applied to a server cluster, where the server cluster includes a plurality of servers, the servers include a first electronic device 20, a second electronic device 30, and a plurality of connector assemblies 10, the servers further include a third electronic device 40, taking the first electronic device 20 as a service board, the second electronic device 30 as a high-speed backplane, and the third electronic device 40 as a switch, the backplane connector 31 is fixedly connected to the high-speed backplane, the first electronic device 20 is connected to the second electronic device 30 through the connector assembly 10a, and the third electronic device 40 is connected to the second electronic device 30 through the connector assembly 10 b. In the embodiment shown in fig. 2, the server includes a high-speed backplane 30, a plurality of service boards 20 and a plurality of switches 40, one end of the connector assembly 10a is connected to the backplane connector 31, the other end of the connector assembly 10a is connected to the service boards 20, one end of the connector assembly 10b is connected to the backplane connector 31, the other end of the connector assembly 10b is connected to the switches 40, and signal communication is achieved between the service boards 20 and the switches 40 through the high-speed backplane 30.
The connector assembly 10 of the present application is described in detail below.
Referring to fig. 3, fig. 4, fig. 5, and fig. 6, fig. 3 is a perspective view of a connector assembly 10 according to a first embodiment of the present application, fig. 4 is an exploded view of fig. 3, fig. 5 is a schematic structural view of a first cable core 211, and fig. 6 is a schematic structural view of a first shielding shell 310.
A first embodiment of the present application provides a connector assembly 10, the connector assembly 10 comprising a circuit board 100, a first cable 210 and a first shielding shell 310; the circuit board 100 includes a ground layer 110, and a first signal panel 120 (as shown in fig. 4) is disposed on a surface of the circuit board 100; the first cable 210 is used for transmitting signals, the first cable 210 includes a first cable core 211 and a first shielding layer 212 (as shown in fig. 3 and 4), the first cable core 211 includes a first main body portion 2112 and a first connection end 2111 (as shown in fig. 5) located at one end of the first main body portion 2112, the first shielding layer 212 is wrapped on the outer side of the first main body portion 2112, and the first connection end 2111 is connected with the first signal disc 120; the first shielding shell 310 is fixed on the circuit board 100 and is connected to the ground layer 110, the first connection end 2111 and the first signal pad 120 are located between the first shielding shell 310 and the circuit board 100 (as shown in fig. 10), and the first shielding shell 310 abuts against a portion of the surface of the first shielding layer 212 adjacent to the circuit board 100, so that the first shielding layer 212 is connected to the ground layer 110.
The circuit board 100 has a multi-layer structure, in one embodiment, one circuit board 100 may have one ground layer 110, and in other embodiments, the circuit board 100 may have two or more ground layers 110. The circuit board 100 is provided with a signal layer (not shown in the figure), the first signal panel 120 is electrically connected with the signal layer, multiple signal layers can be arranged in the circuit board 100 according to requirements, the signal layer and the ground layer 110 are arranged in a stacked manner along a first direction X, the first direction X intersects with the board surface of the circuit board 100, the indication position of the ground layer 110 in fig. 3 is only schematic and does not represent the actual position of the ground layer 110, and the number and the position of the ground layer 110 and the relative position relation between the ground layer 110 and the signal layer are not limited.
The circuit board 100 may be a monolithic board, or include a plurality of circuit sub-boards, where the plurality of circuit sub-boards are spliced into the circuit board 100, and the function of each circuit sub-board may be set as required, and the surface of one circuit sub-board is provided with the first signal panel 120.
In this embodiment, the front projection of the first connection end 2111 on the circuit board 100 is located in the front projection of the first signal pad 120 on the circuit board 100 (as shown in fig. 10), and the first main body portion 2112 extends from the first connection end 2111 to the outside of the circuit board 100, that is, a portion of the projection of the first main body portion 2112 along the first direction X is located on the circuit board 100, and a portion of the projection of the first main body portion 2112 along the first direction X is located outside the circuit board 100, where the first direction X intersects the board surface of the circuit board 100. In the present embodiment, the first direction X is perpendicular to the board surface of the circuit board 100, and the first direction X is the thickness direction of the connector assembly 10. In one embodiment, first connection end 2111 is soldered to first signal pad 120 such that first connection end 2111 is electrically connected to first signal pad 120. In an embodiment, a portion of the first body portion 2112 located on the circuit board 100 is fixedly connected to the circuit board 100 through an insulating adhesive, so that a portion of the first body portion 2112 is fixed on the circuit board 100, and the first connection end 2111 is prevented from being in poor contact with the first signal panel 120 due to loosening of the first body portion 2112, which affects the electrical connection between the first connection end 2111 and the first signal panel 120.
The end of the circuit board 100 away from the first cable 210 is electrically connected to the first electronic device 20, in this embodiment, a gold finger is disposed at the end of the circuit board 100 away from the first cable 210, and the connector assembly 10 is connected to the first electronic device 20 through the gold finger. In an embodiment, the end of the first cable 210 away from the first connection end 2111 is further provided with a cable connector 11 (as shown in fig. 1), and the first cable 210 is electrically connected to the second electronic device 30 through the cable connector 11.
The first cable core 211 is used for transmitting signals, in this embodiment, the first cable core 211 includes a first sub-core 2113 and a second sub-core 2114 (as shown in fig. 5), the first sub-core 2113 and the second sub-core 2114 are used for transmitting a differential signal, signal transmission is achieved through the differential signal, the differential signal is represented as a level difference between the first sub-core 2113 and the second sub-core 2114, two sub-cores are disposed in the first cable core 211, when an external interference signal acts on the first cable core 211, the interference signal simultaneously changes the level of the first sub-core 2113 and the second sub-core 2114, and at this time, the level difference between the first sub-core 2113 and the second sub-core 2114 does not change, so that the crosstalk resistance of the first cable core 211 is strong. When two sub-cores are disposed in the first cable core 211, the first signal panel 120 also includes two first signal sub-panels (not shown in the figure), and the two sub-cores are connected to the two first signal sub-panels, respectively. In an embodiment, the first cable core 211 may also include only one sub-core, where the first signal panel 120 includes a first signal sub-panel, and signal transmission is implemented through single-ended signals, which is simple and convenient in design structure.
The first cable 210 is a non-ground cable, that is, the first cable 210 does not include a ground wire, the first cable 210 is grounded through the first shielding layer 212, so that the first cable 210 is grounded, and the first cable 210 is small in size and convenient to connect with the circuit board 100 due to the fact that the first cable 210 does not include a ground wire, so that the connector assembly 10 is small in size and high in assembly efficiency.
The first cable core 211 is wrapped with a first insulating layer, a first shielding layer 212 and a second insulating layer in sequence, only the first cable core 211 and the first shielding layer 212 are illustrated in fig. 3 and 4, the first insulating layer and the second insulating layer are not illustrated, and the first insulating layer is wrapped on the outer side of the first cable core 211 and is used for insulating and isolating the first cable core 211 from the first shielding layer 212; the first shielding layer 212 is wrapped on the outer side of the first insulating layer, and the first shielding layer 212 is located between the first insulating layer and the second insulating layer, and the first shielding layer 212 is grounded, so that the influence of crosstalk on the signal transmission of the first cable core 211 can be reduced; the second insulating layer is coated on the outer side of the first shielding layer 212, and is used for isolating the first shielding layer 212 from the outside. In the present embodiment, the outer side of the first connection end 2111 is not covered with the first insulating layer, the first shielding layer 212 and the second insulating layer, so that the first connection end 2111 is electrically connected to the first signal pad 120. In this embodiment, only the first insulating layer and the first shielding layer 212 are covered at the contact portion between the first body portion 2112 and the first shielding layer 212, and the first shielding layer 212 is exposed by removing a part of the second insulating layer, so that the first shielding layer 212 is brought into contact with the first shielding layer 212. In one embodiment, the first shielding layer 212 is aluminum foil. In an embodiment, the material of the first shielding layer 212 may be other conductive metals with better ductility.
The first shielding shell 310 is disposed on the peripheral side of the first connection end 2111, and the first shielding shell 310 extends to the outside of the first main body portion 2112 along a third direction Z, which is an extending direction of the first cable 210 on the circuit board 100 in the present embodiment, where the third direction Z is parallel to the board surface of the circuit board 100 and is perpendicular to the first direction X, and the first shielding shell 310 abuts against a portion of the first shielding layer 212 adjacent to the circuit board 100. In the present embodiment, the third direction Z is the longitudinal direction of the connector assembly 10.
In an embodiment, the first shielding shell 310 abuts against a portion of the surface of the first shielding layer 212 facing away from the circuit board 100 along the first direction X, and in other embodiments, the first shielding shell 310 may abut against other surfaces of the first shielding layer 212, for example, the first shielding shell 310 abuts against two surfaces of the first shielding layer 212 along the second direction Y, which intersects with the extending direction of the first cable 210. The first shield layer 212 is connected to the ground layer 110 by being connected to the first shield case 310, thereby grounding the first shield layer 212.
In an embodiment, the first shielding shell 310 is detachably connected to the circuit board 100, so that the first shielding shell 310 can be quickly disassembled and assembled, and the recycling rate of the first shielding shell 310 is improved. In one embodiment, the first shielding shell 310 is connected to the circuit board 100 by, but not limited to, fish-eye crimping, or pin soldering.
The front projection of the first shielding shell 310 on the circuit board 100 covers the front projection of the first connection end 2111 on the circuit board 100, in an embodiment, the size of the first shielding shell 310 is slightly larger than that of the first connection end 2111, so that the area of the first shielding shell 310 occupied by the circuit board 100 is reduced, the cost is reduced, the signal density is improved, and a better shielding effect can be achieved due to the fact that the distance between the first shielding shell 310 and the peripheral side of the first connection end 2111 is relatively short. In one embodiment, the material of the first shielding shell 310 may be iron, copper, aluminum, or other metals. In an embodiment, the material of the first shielding shell 310 may be an alloy or a conductive material such as a conductive plastic or a conductive plastic.
If the first shielding shell 310 is not provided, in order to ensure that the first cable 210 is grounded, in the prior art, the first cable 210 includes the first cable core 211 and the ground wire 213, such as a single ground wire cable (as shown in fig. 7 a) and a double ground wire cable (as shown in fig. 7 b), only the ground wire 213 in the first cable 210 needs to be grounded, but when the ground wire 213 is grounded, a ground wire pad needs to be additionally provided on the circuit board 100 to weld the ground wire 213, which not only occupies the board space of the circuit board 100, but also makes the installation efficiency of the first cable 210 low, and the first cable 210 with the ground wire 213 has a large size, occupies much space of the circuit board 100, which is unfavorable for increasing the signal transmission density of the connector assembly 10. For the first cable 210 without the ground wire 213, a separate shield member for grounding needs to be provided, the shield member is overlapped on the shield layer of the first cable 210, and a fixing member for fixing the shield member needs to be provided to fix the shield member on the first cable 210, which causes the problems of complex processing and increased parts of the connector assembly 10. When the ground pad is disposed on the connector assembly 10, if the surface of the first shielding layer 212 close to the ground pad is bonded or soldered to the ground pad, no additional fixing structure is added to the first shielding layer 212, and in the use process of the connector assembly 10, the problem that the ground pad is in poor contact with the first shielding layer 212 is easy to occur, the process is complex, the processing efficiency is low, and the circuit board 100 or the first cable 210 is easy to be damaged when the first cable 210 is replaced later. The above-mentioned scheme of grounding the first shielding layer 212 does not solve the signal shielding problem and the grounding problem at the first connection end 2111.
In this embodiment, by the arrangement of the first shielding shell 310, in the first aspect, the first shielding shell 310 is abutted to the first shielding layer 212 on the first main body portion 2112, so that the first cable 210 can be grounded, normal signal transmission is ensured, interference of external signals on signal transmission of the first cable 210 can be reduced, insertion loss of the first sub-core and the second sub-core can be reduced, and signal transmission quality is improved; meanwhile, the first shielding shell 310 is abutted with the first shielding layer 212 in a surface-to-surface manner, the first shielding shell 310 is not easy to damage the first shielding layer 212, and good contact between the first shielding shell 310 and the first shielding layer 212 is ensured.
In the second aspect, the first shielding shell 310 is covered on the outer side of the first connection end 2111, and can shield the external interference signal at the first connection end 2111 and improve the signal transmission stability, since the first connection end 2111 needs to be electrically connected with the first signal panel 120, the first connection end 2111 is not covered by the first shielding layer 212, the first connection end 2111 is easy to be interfered by the external signal, and the first shielding shell 310 can isolate the first connection end 2111 from the external interference signal, so as to reduce the loss of signal transmission and occurrence of transmission error problem of the first connection end 2111, and ensure the integrity of the signal transmitted by the first cable 210, meanwhile, the first shielding shell 310 is also used as the signal reference ground of the first connection end 2111, the first shielding shell 310 is connected with the first shielding layer 212, so as to realize the reference ground continuity of the signal of the first connection end 2111, and improve the signal transmission stability.
The connector assembly 10 further includes a housing 400 (shown in fig. 8), the circuit board 100 and the first cable 210 being located within the housing 400. When the connector assembly 10 includes only the first cable 210, the housing 400 of the connector assembly 10 has a certain shielding effect, and may be used for signal shielding at the first connection end 2111, but if the housing 400 is used for shielding signals and grounding the first cable 210 without providing the first shielding shell 310, an additional shielding spring (not shown in the drawing) needs to be provided on the inner surface of the housing 400, and the shielding spring compresses the first shielding layer 212 to implement grounding of the first shielding layer 212, and since the housing 400 is generally a standard housing, the housing 400 has a larger volume than the first shielding shell 310, the housing 400 has a larger distance from the first connection end 2111, and not only has a poor shielding effect on the first connection end 2111, but also has a poor matching property between the shielding spring and the housing 400, and the shielding spring has a poor abutting effect on the first shielding layer 212, and cannot achieve a good connection accuracy, so that the housing 400 and the first connection end 2111 are damaged, the shielding spring is easy to implement grounding of the first shielding layer 212, and the housing 400 has a complex and high shielding process cost.
In the third aspect, when the first shielding shell 310 abuts against the surface of the first shielding layer 212 facing away from the circuit board 100 and the first shielding shell 310 is fixed on the circuit board 100, the first shielding shell 310 may press the first cable 210 toward the circuit board 100, and the first cable 210 is fixed between the first shielding shell 310 and the circuit board, which may reduce an adverse effect on the electrical connection between the first connection end 2111 and the first signal pad 120 caused by the vibration of the connector assembly 10, and ensure the connection stability of the first connection end 2111 and the first signal pad 120.
In the fourth aspect, the height of the first shielding shell 310 along the first direction X can be controlled, so as to control the pressing force between the first shielding shell 310 and the first shielding layer 212, so that the first shielding shell 310 is tightly attached to the first shielding layer 212, the first shielding layer 212 is ensured to be grounded all the time, the first shielding shell 310 can be adapted to the first cables 210 with different sizes, and the utilization rate of the first shielding shell 310 is improved.
In the fifth aspect, in the present embodiment, the first shielding layer 212 can be grounded by only installing the first shielding shell 310 without modifying the first cable 210, and the effects of reducing crosstalk and insertion loss can be achieved, and the first shielding shell 310 is efficient in processing and simple in assembly.
Referring to fig. 8 and 9, fig. 8 is a schematic structural view of the connector assembly 10, and fig. 9 is an exploded view of the connector assembly 10 of fig. 8. In an embodiment, the connector assembly 10 further includes a housing 400, a release catch 500, and a pull ring 600 (as shown in fig. 8 and 9), a portion of the circuit board 100, a portion of the first cable 210, and the first shielding shell 310 are located in the housing 400, and the first cable 210 extends from inside the housing 400 to outside the housing 400 along the third direction Z so as to facilitate connection of the first cable 210 with the second electronic device 30; one end of the circuit board 100 away from the first cable 210 along the third direction Z is connected to the second electronic device 30; the connector assembly 10 is connected to and disconnected from the first electronic device 20 by the mating use of the unlatching 500 and the pull ring 600. In one embodiment, the housing 400 includes a first sub-housing 410 and a second sub-housing 420 that are connected, and the housing 400 is a detachable housing to facilitate mounting the first cable 210, the first shielding shell 310, and the circuit board 100 into the housing 400, and to facilitate assembly of the connector assembly 10.
In one possible embodiment, the first shielding shell 310 includes a first sub-portion 311, a second sub-portion 312 and a third sub-portion 313 (as shown in fig. 6) connected in sequence, the extending direction of the first sub-portion 311 and the extending direction of the third sub-portion 313 are intersected with the extending direction of the second sub-portion 312, and one ends of the first sub-portion 311 and the third sub-portion 313 away from the second sub-portion 312 are fixed on the circuit board 100 and connected with the ground layer 110, at least part of the second sub-portion 312 is elastically abutted with the first shielding layer 212 so that the first shielding layer 212 is connected with the ground layer 110. The extending direction of the first sub-portion 311, the extending direction of the second sub-portion 312, and the extending direction of the third sub-portion 313 all refer to the extending direction of the whole plate surface, in this embodiment, the first sub-portion 311 and the third sub-portion 313 are both straight plates, and in other embodiments, the first sub-portion 311 and the third sub-portion 313 may be arc plates having a certain radian. In an embodiment, the shape of the plate surface of the second sub-portion 312 may be determined according to the shape of the surface of the first shielding layer 212, if the surface of the first shielding layer 212 facing away from the circuit board 100 is square, the abutting portion of the second sub-portion 312 and the first shielding layer 212 may be square, and if the surface of the first shielding layer 212 facing away from the circuit board 100 is circular arc, the abutting portion of the second sub-portion 312 and the first shielding layer 212 may be circular arc, so as to ensure that the second sub-portion 312 and the first shielding layer 212 may be adhered and arranged, and ensure the connection reliability of the second sub-portion 312 and the first shielding layer 212.
The first shielding shell 310 is generally "concave" shaped with the notch facing the first cable 210 to encase the first cable 210. In the present embodiment, the extending direction of the first sub-portion 311 and the extending direction of the third sub-portion 313 are parallel, and the extending direction of the first sub-portion 311 and the extending direction of the third sub-portion 313 perpendicularly intersect with the extending direction of the second sub-portion 312. In an embodiment, the extending direction of the first sub-portion 311 and the extending direction of the third sub-portion 313 are both parallel to the first direction X. In an embodiment, the extending direction of the second sub-portion 312 is parallel to the board surface of the circuit board 100.
Because the first shielding shell 310 is a metal shell, the first shielding shell 310 has a certain elasticity, and particularly, the second sub-portion 312 can move along the first direction X near to or far from the circuit board 100, when the second sub-portion 312 is abutted to the first shielding layer 212, the second sub-portion 312 is elastically deformed along the first direction X far away from the circuit board 100, the second sub-portion 312 generates an elastic force along the first direction X towards the circuit board 100, so that the second sub-portion 312 is tightly attached to the first shielding layer 212, and when the connector assembly 10 vibrates to drive the first cable 210 to vibrate along the first direction X, the second sub-portion 312 can move along the first shielding layer 212 through elastic deformation, and the second sub-portion 312 and the first shielding layer 212 are stably and reliably connected, so that the grounding of the first shielding layer 212 is ensured, and the shielding effect and the signal transmission quality of the first shielding shell 310 are improved.
In the present embodiment, the ends of the first sub-portion 311 and the third sub-portion 313, which are far from the second sub-portion 312, are connected to the ground layer 110, and the connection reliability of the first shield case 310 and the ground layer 110 is higher. In an embodiment, one of the first sub-portion 311 and the third sub-portion 313 is connected to the ground layer 110, and the other of the first sub-portion 311 and the third sub-portion 313 may be soldered directly to the surface of the circuit board 100 adjacent to the first shielding shell 310 or other soldered locations.
In an embodiment, the first shielding shell 310 is an integrated structure, and the first sub-portion 311, the second sub-portion 312 and the third sub-portion 313 are integrally formed, so that the structural strength is higher, and the normal operation of the first shielding shell 310 is ensured. In one embodiment, the first shielding shell 310 is integrally formed by stamping, and the processing procedure is simple and the cost is low.
In one possible implementation, the second sub-portion 312 is recessed toward the first cable 210 along the first direction X to form a first groove 3121 (as shown in fig. 6), the first direction X intersects the circuit board 100, and a bottom of the first groove 3121 elastically abuts the first shielding layer 212. By the arrangement of the first grooves 3121, the degree of deformability of the second sub-portion 312 in the first direction X is increased, and the connection reliability of the first grooves 3121 and the first shielding layer 212 is higher, and the connection stability of the second sub-portion 312 and the first sub-portion 311 and the third sub-portion 313 is stronger, compared to the arrangement of the second sub-portion 312 in a completely flat shape, and particularly when the connector assembly 10 is used in an environment with frequent vibration, the arrangement of the first grooves 3121 can ensure the stable connection of the first shielding shell 310 and the first shielding layer 212, so that the signal is transmitted with high quality.
In an embodiment, the extending direction of the first recess 3121 is the same as the extending direction of the first shielding layer 212, that is, the first recess 3121 and the first shielding layer 212 both extend along the third direction Z, so that the contact area between the first recess 3121 and the first shielding layer 212 is increased, and the first shielding housing 310 can perform better shielding function. In an embodiment, the extending direction of the first recess 3121 may also be different from the extending direction of the first shielding layer 212, and the extending direction of the first recess 3121 may be set according to actual needs. In the present embodiment, a portion of the second sub-portion 312 is recessed toward the first cable 210 along the first direction X to form the first groove 3121, and a portion of the second sub-portion 312 is not recessed toward the first cable 210 and still remains parallel to the circuit board 100, so as to facilitate the mounting connection of the first shielding housing 310 and the circuit board 100.
In one possible implementation, the first recess 3121 is provided with a first opening 3122 (shown in fig. 6) extending through the bottom of the recess. The first opening 3122 may increase the elasticity of the first groove 3121 to reduce the possibility of warpage when the first shielding shell 310 is assembled, ensuring good contact between the bottom of the first groove 3121 and the first shielding layer 212.
In one possible implementation, at least a portion of the first aperture 3122 does not overlap with an orthographic projection of the first shielding layer 212 on the circuit board 100. At least part of the first openings 3122 are located at the position where the first grooves 3121 do not contact with the first shielding layer 212, and the elasticity of the first grooves 3121 is increased, and meanwhile, the contact area between the first grooves 3121 and the first shielding layer 212 is increased as much as possible, so that the first shielding housing 310 can play a better shielding role.
In an embodiment, the orthographic projections of the first openings 3122 and the first shielding layer 212 on the circuit board 100 do not overlap (as shown in fig. 10), the first openings 3122 are located at a portion of the first grooves 3121 not contacting the first shielding layer 212, and the contact area between the first grooves 3121 and the first shielding layer 212 is not reduced while increasing the elasticity of the first grooves 3121, so that the first shielding housing 310 can perform better shielding function.
In an embodiment, the first opening 3122 at least partially overlaps with the front projection of the first connection end 2111 on the circuit board 100, and when the connector assembly 10 is assembled, the first shielding shell 310 is fixed on the circuit board 100, and then the first connection end 2111 is welded on the first signal panel 120 through the first opening 3122, or the first connection end 2111 is glued on the first signal panel 120 through the first opening 3122 in a dispensing manner, so that the first shielding shell 310 can play a role in positioning for the installation of the first cable 210. In an embodiment, the front projection of the first opening 3122 and the first connection end 2111 on the circuit board 100 at least partially overlap, and when the connector assembly 10 is used for a long time, if the connection between the first connection end 2111 and the first signal panel 120 is loose, the connection between the first connection end 2111 and the first signal panel 120 can be fastened through the first opening 3122.
In one possible implementation, the first sub-portion 311 and the third sub-portion 313 are provided with a pin 301 (as shown in fig. 6) at an end far from the second sub-portion 312, the circuit board 100 is provided with a ground through hole 101 (as shown in fig. 4), the ground through hole 101 is connected to the ground layer 110, and the pin 301 extends into the ground through hole 101 to connect the first shielding shell 310 with the ground layer 110. The ground through hole 101 is disposed on the peripheral side of the first cable 210, and the ground through hole 101 penetrates through the circuit board 100 to approach the surface of the first shielding shell 310 along the first direction X, and is connected with the ground through hole 101 through the pin 301 to realize the fixed connection between the first shielding shell 310 and the circuit board 100.
In an embodiment, the ground through hole 101 penetrates through two surfaces of the circuit board 100 along the first direction X, so that the connection between the pin 301 and the ground through hole 101 is simpler and more reliable. In an embodiment, four ground through holes 101 are formed in the circuit board 100, two pins 301 are disposed at one end of the first sub-portion 311 away from the second sub-portion 312, two pins 301 are disposed at one end of the third sub-portion 313 away from the second sub-portion 312, and the four pins 301 extend into the four ground through holes 101 respectively, so as to achieve stable connection between the first shielding shell 310 and the circuit board 100.
In one possible implementation, the surface of the circuit board 100 near the first cable 210 is provided with a ground pad 111 (as shown in fig. 4), and the ground pad 111 abuts a portion of the first shielding layer 212 near one side of the circuit board 100. The ground pad 111 and the first shielding shell 310 are arranged, so that the two surfaces of the first cable 210 along the first direction X are grounded, and the first shielding shell 310 is abutted against the first shielding layer 212 to press the first shielding layer 212 against the ground pad 111, so that a shielding effect can be better achieved, and the influence of the external environment on signal transmission of the first cable 210 is reduced.
In one embodiment, the ground pad 111 is electrically connected to the ground layer 110, and both surfaces of the first cable 210 along the first direction X are electrically connected to the ground layer 110. In an embodiment, the ground pad 111 is a metal sheet disposed at a local position on the surface of the circuit board 100, and the first shielding layer 212 is close to the surface of the circuit board 100 and abuts against the metal sheet to achieve a shielding effect. In an embodiment, a portion of the first shielding layer 212 is soldered to the ground pad 111 near a surface of the ground pad 111 to protect and fix the first cable 210. In an embodiment, a portion of the surface of the first shielding layer 212 near the ground pad 111 is bonded to the ground pad 111, such as by ultraviolet light curing glue (UV glue) to bond the first shielding layer 212 to the ground pad 111 to protect and fix the first cable 210.
Referring to fig. 11 and 12, fig. 11 is a perspective view of a connector assembly 10 provided in a second embodiment of the present application, fig. 12 is an exploded view of fig. 11, and a second embodiment of the present application provides a connector assembly 10, different from the first embodiment, a second signal board 130 is further provided on a surface of a circuit board 100, the connector assembly 10 further includes a second cable 220 and a second shielding shell 320, the second cable 220 includes a second cable core 221 and a second shielding layer 222, the second cable core 221 includes a second main body portion 2212 and a second connection end 2211 located at one end of the second main body portion 2212, the second shielding layer 222 is wrapped on an outer side of the second main body portion 2212, and the second connection end 2211 is connected with the second signal board 130; the second shielding shell 320 is fixed on the circuit board 100 and is connected with the ground layer 110, the second connection end 2211 and the second signal panel 130 are located between the second shielding shell 320 and the circuit board 100, and the second shielding shell 320 is abutted against the surface of the second shielding layer 222 facing away from the circuit board 100, so that the second shielding layer 222 is connected with the ground layer 110; the second shielding case 320 is located at the same side of the circuit board 100 as the first shielding case 310, and the second shielding case 320 is spaced apart from the first shielding case 310 along a second direction Y intersecting the extending direction of the first cable 210.
Wherein the provision of the second cable 220 increases the density of the signals transmitted by the connector assembly 10. The second signal pad 130 and the second cable 220 are both located on the surface of the circuit board 100 near the first cable 210, and the front projection of the second shielding shell 320 on the circuit board 100 is not overlapped with the front projection of the first shielding shell 310 on the circuit board 100. The second direction Y intersects with the first direction X and the third direction Z, and in this embodiment, the second direction Y, the first direction X and the third direction Z are perpendicular to each other, the second direction Y is a width direction of the connector assembly 10, the first direction X is a thickness direction of the connector assembly 10, and the third direction Z is a length direction of the connector assembly 10.
In the present embodiment, the second cable 220 is identical to the first cable 210, and the second shield case 320 has the same configuration and volume as the first shield case 310.
In one embodiment, the outer diameter of the second cable 220 is the same as the outer diameter of the first cable 210. In an embodiment, the outer diameter of the second cable 220 may also be different from the outer diameter of the first cable 210. In an embodiment, the material and the volume of the second shielding shell 320 and the first shielding shell 310 may be different. In one embodiment, the first cable 210 is an input signal cable and the second cable 220 is an output signal cable. In one embodiment, the second cable 220 is an input signal cable and the first cable 210 is an output signal cable. In one embodiment, the first cable 210 and the second cable 220 are both input signal cables. In one embodiment, the first cable 210 and the second cable 220 are both output signal cables.
If the first shielding case 310 and the second shielding case 320 are not provided, the first cable 210 and the second cable 220 are coupled to each other when transmitting signals, and the transmission of signals between the first cable 210 and the second cable 220 is adversely affected, especially when the interval between the first cable 210 and the second cable 220 is smaller, the crosstalk between the two cables is more serious, wherein the crosstalk between the end of the first cable 210 near the first connection end 2111 and the end of the second cable 220 near the second connection end 2211 is referred to as near-end crosstalk, the crosstalk between the end of the first cable 210 far from the first connection end 2111 and the end of the second cable 220 near the second connection end 2211 is referred to as far-end crosstalk, and similarly the crosstalk between the end of the second cable 220 near the second connection end 2211 and the end of the second cable 220 near the first cable 210 near the first connection end 2111 is referred to as near-end crosstalk, and the crosstalk between the end of the second cable 220 far from the second connection end 2211 and the end of the first cable 210 near the first connection end 2111 is referred to as far-end 2111 is crosstalk.
In the present embodiment, the first shielding shell 310 may reduce the interference of the second cable 220 on the signal transmitted by the first cable 210, and the second shielding shell 320 may reduce the interference of the first cable 210 on the signal transmitted by the second cable 220, so as to increase the density of the signal transmitted by the connector assembly 10 and improve the quality of the signal transmitted in the connector assembly 10.
Referring to fig. 13a and 13b, fig. 13a is a graph of the effect of optimizing the far-end crosstalk in the second embodiment of the present application, fig. 13b is a graph of the effect of optimizing the near-end crosstalk in the second embodiment of the present application, in order to illustrate the effect of optimizing the near-end crosstalk and the far-end crosstalk in the second embodiment of the present application, the embodiment shown in fig. 11 is compared with the embodiment of the single ground cable grounding in fig. 7a and the embodiment of the dual ground cable grounding in fig. 7b, the abscissa in fig. 13a and 13b represents the frequency, the ordinate represents the crosstalk amplitude, the psfext_diff2_outcd_q112 represents the far-end crosstalk test data of the embodiment of fig. 11, psfext_diff2_outcd_outcd_q56_sgnd represents the far-end crosstalk test data of the embodiment of the single ground cable grounding in fig. 7 a; in fig. 13b, psnext_diff2_outcd_q112 Setup1: the Sweep represents the near-end crosstalk test data of the embodiment of fig. 11, psnext_diff2_outcd_dgnd-referenced represents the near-end crosstalk test data of the embodiment of the dual-ground cable ground of fig. 7b, and psnext_diff2_outcd_sgnd-referenced represents the near-end crosstalk test data of the embodiment of the single-ground cable ground of fig. 7 a.
At a signal transmission rate of 112gbps PAM4 format, the fundamental frequency of the signal is 112/4=28 GHz, so the crosstalk amplitude at 28GHz is selected as the frequency point for optimal comparison, as can be seen from fig. 13a and fig. 13b, the embodiment of fig. 11 optimizes both near-end crosstalk and far-end crosstalk by 25dB, and optimizes the crosstalk amplitude by about 25% compared to the embodiment of dual-ground cable grounding in fig. 7 b. The embodiment of fig. 11 has a near-end crosstalk optimization of 33dB, a far-end crosstalk optimization of 35dB, and an overall crosstalk magnitude improvement of about 58% compared to the single-ground cable grounding embodiment of fig. 7 a. As can be seen, in the present embodiment, the mode of combining the non-ground cable with the shielding shell improves the shielding effect on crosstalk, particularly improves the crosstalk shielding effect at the first connection end 2111 and the second connection end 2211, and makes the quality of signal transmission higher.
In an embodiment, the connector assembly 10 further includes a plurality of first cables 210 and/or second cables 220 (as shown in fig. 14), the plurality of cables are located on the same side of the circuit board 100 along the first direction X, and the peripheral side of each cable is covered with a shielding shell, where the plurality of shielding shells are spaced along the second direction Y, so as to increase the density of signals transmitted by the connector assembly 10. In an embodiment, the connector assembly 10 may be provided with 4, 8, 16 etc. cables according to actual needs, and the circumference of each cable is covered with a shielding shell, and the plurality of shielding shells are arranged at intervals along the second direction Y, so that the density of signals transmitted by the connector assembly 10 is increased, the spacing between the cables along the second direction Y may be 3.62 mm to 2.23 mm, and when a greater number of cables are provided, the spacing between the cables along the second direction Y may be less than 2.23 mm, and due to the arrangement of the shielding shells, the crosstalk performance between signals at the cable connection ends is improved, the ground reflux of the cables is improved, and the loop inductance of the cables is reduced.
Referring to fig. 15, 16 and 17, fig. 15 is a top view of a connector assembly 10 according to a third embodiment of the present application, fig. 16 is a bottom view of the connector assembly 10 according to the third embodiment of the present application, fig. 17 is a cross-sectional view of the connector assembly 10 according to the third embodiment of the present application, and the third embodiment of the present application provides a connector assembly 10. Unlike the first embodiment, the surface of the circuit board 100 is further provided with a third signal pad 140, the connector assembly 10 further includes a third cable 230 and a third shielding shell 330, the third cable 230 includes a third cable core 231 and a third shielding layer 232, the third cable core 231 includes a third main body 2312 and a third connection end 2311 at one end of the third main body 2312, the third shielding layer 232 is wrapped on the outer side of the third main body 2312, and the third connection end 2311 is connected with the third signal pad 140; the third shielding shell 330 is fixed on the circuit board 100 and is connected with the ground layer 110, the third connection end 2311 and the third signal panel 140 are located between the third shielding shell 330 and the circuit board 100, and the third shielding shell 330 abuts against the surface of the third shielding layer 232 adjacent to the circuit board 100 so that the third shielding layer 232 is connected with the ground layer 110; the third shielding shell 330 and the first shielding shell 310 are respectively located at two sides of the circuit board along the first direction X, the first direction X intersects the circuit board 100, and the orthographic projections of the first shielding shell 310 and the third shielding shell 330 on the circuit board 100 are at least partially not overlapped.
Wherein the provision of the third cable 230 increases the density of signals transmitted by the connector assembly 10. The third signal panel 140 and the third cable 230 are both located on the surface of the circuit board 100 away from the first cable 210 along the first direction X, and the third shielding shell 330 and the first shielding shell 310 are respectively located on two sides of the circuit board along the first direction X, so that space on the circuit board 100 can be saved, and more cables or other electronic components can be connected on the circuit board 100. In one embodiment, the first cable 210 is an input signal cable and the third cable 230 is an output signal cable. In one embodiment, the third cable 230 is an input signal cable and the first cable 210 is an output signal cable. In one embodiment, the first cable 210 and the third cable 230 are both input signal cables. In one embodiment, the first cable 210 and the third cable 230 are both outgoing signal cables.
In an embodiment, the third shielding shell 330 is located on one side of the first shielding shell 310 along the third direction Z, or the first shielding shell 310 is located on one side of the third shielding shell 330 along the third direction Z (as shown in fig. 17), where the third shielding shell 330 is staggered with the first shielding shell 310 along the third direction Z, that is, the orthographic projection of the third shielding shell 330 on the circuit board 100 and the orthographic projection of the first shielding shell 310 on the circuit board 100 are not overlapped at least partially, so that crosstalk at the third connection end 2311 and the first connection end 2111 can be reduced better, and a space is reserved so that the installation of the third shielding shell 330 and the first shielding shell 310 and the installation of the first shielding shell 310, for example, when the third shielding shell 330 and the first shielding shell 310 are fixedly connected with the circuit board using the ground through hole 101, the third shielding shell 330 and the first shielding shell 310 are staggered with each other along the third direction Z, and the ground through hole 101 of the third shielding shell 330 and the ground through hole 101 of the first shielding shell 310 are also staggered with the ground through hole 101 of the first shielding shell 310 along the third direction Z.
In an embodiment, the third shielding shell 330 is located on one side of the first shielding shell 310 along the second direction Y, or the first shielding shell 310 is located on one side of the third shielding shell 330 along the second direction Y, where the third shielding shell 330 is staggered with the first shielding shell 310 along the second direction Y, that is, the orthographic projection of the third shielding shell 330 on the circuit board 100 and the orthographic projection of the first shielding shell 310 on the circuit board 100 are not overlapped at least partially, so that crosstalk at the third connection end 2311 and the first connection end 2111 can be reduced better, and a space is reserved to facilitate the installation of the third shielding shell 330 and the first shielding shell 310 with the circuit board 100, for example, when the third shielding shell 330 and the first shielding shell 310 are fixedly connected with the circuit board using the ground through hole 101, the ground through hole 101 of the third shielding shell 330 is staggered with the first shielding shell 310 along the second direction Y, and the ground through hole 101 of the third shielding shell 330 is also staggered with the ground through hole 101 of the first shielding shell 310 along the second direction Y, so that the installation of the third shielding shell 330 and the installation of the first shielding shell 310 will not interfere with each other.
In an embodiment, when the third shielding shell 330 is disposed away from the first shielding shell 310 along the second direction Y, it may be achieved that the front projection of the third shielding shell 330 on the circuit board 100 does not overlap with the front projection of the first shielding shell 310 on the circuit board 100.
In an embodiment, the third shielding shell 330 is located on one side of the first shielding shell 310 along the second direction Y, and the third shielding shell 330 is located on one side of the first shielding shell 310 along the third direction Z, where the third shielding shell 330 and the first shielding shell 310 are staggered along the second direction Y and the third direction Z, so that crosstalk at the third connection end 2311 and the first connection end 2111 can be reduced better, and a space is reserved for installing the third shielding shell 330 and the first shielding shell 310 and the circuit board 100.
In an embodiment, the front projection of the third shielding shell 330 on the circuit board 100 and the front projection of the first shielding shell 310 on the circuit board 100 may also overlap, where in order to facilitate smooth installation of the third shielding shell 330 and the first shielding shell 310, the ground through holes 101 of the third shielding shell 330 need to be staggered with respect to the ground through holes 101 of the first shielding shell 310, and correspondingly, the positions of the pins 301 on the third shielding shell 330 need to be different from those of the pins 301 of the first shielding shell 310, so that the respective pins 301 correspond to the respective ground through holes 101.
In an embodiment, the connector assembly 10 further includes a plurality of first cables 210 disposed at intervals along the second direction Y, and the connector assembly 10 includes a plurality of third cables 230 disposed at intervals along the second direction Y, where the plurality of first cables 210 and the plurality of third cables 230 are respectively located at two sides of the circuit board 100 along the first direction X, a first shielding shell 310 is covered on a peripheral side of each first cable 210, a third shielding shell 330 is covered on a peripheral side of each third cable 230, the plurality of first shielding shells 310 are disposed at intervals along the second direction Y, the plurality of third shielding shells 330 are disposed at intervals along the second direction Y, the plurality of first shielding shells 310 and the plurality of third shielding shells 330 are disposed in a staggered manner, so that the density of signal transmission of the connector assembly 10 is increased, and a space is reserved for mounting the third shielding shells 330 and the first shielding shells 310 on the circuit board 100.
In an embodiment, the circuit board 100 is provided with the same number of first and third cables 210 and 230 along both sides of the first direction X, one of the first and third cables 210 and 230 is an input signal cable, and the other of the first and third cables 210 and 230 is an output signal cable.
Referring to fig. 18, fig. 18 is an exploded view of a connector assembly 10 according to a fourth embodiment of the present application, wherein a second signal panel 130 is further disposed on a surface of a circuit board 100, and the connector assembly 10 further includes a second cable 220 and a second shielding shell 320, the second cable 220 includes a second cable core 221 and a second shielding layer 222, the second cable core 221 includes a second main body portion 2212 and a second connection end 2211 located at one end of the second main body portion 2212, the second shielding layer 222 is wrapped on an outer side of the second main body portion 2212, and the second connection end 2211 is connected with the second signal panel 130, unlike the first embodiment; the second shielding shell 320 is fixed on the circuit board 100 and is connected with the ground layer 110, the second connection end 2211 and the second signal panel 130 are located between the second shielding shell 320 and the circuit board 100, and the second shielding shell 320 is abutted against the surface of the second shielding layer 222 adjacent to the circuit board 100 so that the second shielding layer 222 is connected with the ground layer 110; the second shielding shell 320 and the first shielding shell 310 are located on the same side of the circuit board 100, the second shielding shell 320 and the first shielding shell 310 are connected side by side along a second direction Y, and the second direction Y intersects with the extending direction of the first cable 210.
Wherein the provision of the second cable 220 increases the density of the signals transmitted by the connector assembly 10. The second signal pad 130 and the second cable 220 are both located on the surface of the circuit board 100 near the first cable 210, and the front projection of the second shielding shell 320 on the circuit board 100 is not overlapped with the front projection of the first shielding shell 310 on the circuit board 100. The second shielding shell 320 and the first shielding shell 310 are connected side by side along the second direction Y, and the second cable 220 is disposed closer to the first cable 210, so that space on the circuit board 100 can be saved, and more cables or other electronic components can be connected to the circuit board 100. The first shielding shell 310 may reduce interference of the second cable 220 on the signal transmitted by the first cable 210, and the second shielding shell 320 may reduce interference of the first cable 210 on the signal transmitted by the second cable 220, thereby improving the quality of signal transmission in the connector assembly 10 while increasing the signal density transmitted by the connector assembly 10.
Referring to fig. 19, a fifth embodiment of the present application provides a connector assembly 10, which is different from the fourth embodiment in that a first shielding shell 310 includes a first sub-portion 311, a second sub-portion 312 and a third sub-portion 313 connected in sequence, and at least a portion of the second sub-portion 312 is elastically abutted against a first shielding layer 212; the second shielding shell 320 includes a third sub-portion 313, a fourth sub-portion 314, and a fifth sub-portion 315 that are sequentially connected, at least a portion of the fourth sub-portion 314 elastically abuts against the second shielding layer 222.
Wherein, the extending direction of the first sub-portion 311, the extending direction of the third sub-portion 313 and the extending direction of the fifth sub-portion 315 intersect with the extending direction of the second sub-portion 312 or the extending direction of the fourth sub-portion 314; one end of the first sub-portion 311 far from the second sub-portion 312 is fixed on the circuit board 100 and connected with the ground layer 110, one end of the third sub-portion 313 far from the second sub-portion 312 or the fourth sub-portion 314 is fixed on the circuit board 100 and connected with the ground layer 110, and one end of the fifth sub-portion 315 far from the fourth sub-portion 314 is fixed on the circuit board 100 and connected with the ground layer 110.
The overall shape of the first shielding shell 310 and the second shielding shell 320 is approximately M-shaped, and the first shielding shell 310 and the second shielding shell 320 share the third sub-portion 313, so that on one hand, space on the circuit board 100 can be saved, and more cables or other electronic components can be connected on the circuit board 100; on the other hand, the manufacturing costs of the first shield case 310 and the second shield case 320 can be saved.
Referring to fig. 20 and 21, fig. 20 is an exploded view of a connector assembly 10 according to a fifth embodiment of the present application, and fig. 21 is a bottom view of a shielding shell according to a fifth embodiment of the present application, in an embodiment, the first sub-portion 311, the third sub-portion 313 and the fifth sub-portion 315 may be simplified from a plate shape to a column shape, so that the processing and the installation of the shielding shell are easier.
In one possible implementation, the first shielding shell 310 and the second shielding shell 320 are in an integrated structure, and the shielding shells are formed integrally, so that on one hand, space on the circuit board 100 is saved, cables can be distributed on the circuit board 100 in a high density, and signal transmission density and quality of the connector assembly 10 are improved; on the other hand, the processing of the shielding shell is simpler, the processability is improved, and the production efficiency of the shielding shell is improved; in yet another aspect, the first and second shielding shells 310 and 320 may provide positioning for the installation of the first and second cables 210 and 220 such that the first and second cables 210 and 220 may be more accurately installed onto the circuit board 100.
Referring to fig. 22a and 22b, fig. 22a is a graph of the effect of optimizing the far-end crosstalk in the fifth embodiment of the present application, fig. 22b is a graph of the effect of optimizing the near-end crosstalk in the fifth embodiment of the present application, in order to illustrate the effect of optimizing the near-end crosstalk and the far-end crosstalk by using the implementation in the present embodiment, the implementation in fig. 20 is compared with the implementation in the single-wire cable ground in fig. 7a and the implementation in the double-wire cable ground in fig. 7b, fig. 22a and 22b are shown with the abscissa indicating the frequency, the ordinate indicating the crosstalk amplitude, the psfext_diff2_outcd-mapped indicates the far-end test data in the implementation in fig. 20, psfext_diff2_outcd_ dualdrain Imported indicates the far-end test data in the implementation in the single-wire cable ground in fig. 7a, and psfext_diff2_outcd_ singledrain Imported indicates the far-end test data in the implementation in the single-wire cable ground in fig. 7 a; in fig. 22b, psnext_diff2_outcd-Imported represents the near-end test data of the embodiment of fig. 20, psnext_diff2_outcd dualdrain Imported represents the near-end test data of the dual-ground cable-grounded embodiment of fig. 7b, and psnext_diff2_outcd singledrain Imported represents the near-end test data of the single-ground cable-grounded embodiment of fig. 7 a.
Selecting the crosstalk amplitude at 28GHz as the frequency point for optimization comparison, as can be seen from fig. 22a and 22b, the embodiment of fig. 20 is compared with the dual-ground cable grounding embodiment of fig. 7b, and the comprehensive near-end crosstalk is optimized by 7dB, and the crosstalk amplitude is optimized by about 12%; the comprehensive far-end crosstalk is optimized by 9dB, and the crosstalk amplitude is optimized by about 17%. The embodiment of fig. 20 has an overall near-end crosstalk optimization of 8dB, and a crosstalk amplitude optimization of about 14% compared to the single-ground cable grounding embodiment of fig. 7 a; the comprehensive far-end crosstalk is optimized by 12dB, and the crosstalk amplitude is optimized by about 23%. As can be seen, in the present embodiment, the mode of combining the non-ground cable with the shielding shell improves the shielding effect on crosstalk, particularly improves the crosstalk shielding effect at the first connection end 2111 and the second connection end 2211, and makes the quality of signal transmission higher.
Referring to fig. 23a and 23b, fig. 23a is a graph of the effect of optimizing the far-end crosstalk in the fifth embodiment of the present application, fig. 23b is a graph of the effect of optimizing the near-end crosstalk in the fifth embodiment of the present application, in order to illustrate the effect of the shield shell on optimizing the near-end crosstalk and the far-end crosstalk in the present embodiment, the embodiment with the shield shell in fig. 20 is compared with the embodiment with the shield shell removed in fig. 20, fig. 23a and 23b show the frequency on the abscissa and the crosstalk amplitude on the ordinate, and fig. 23a shows the far-end test data of the embodiment with the shield shell in fig. 20 on the psfext_diff2_outcd_qupinbi-Imported represents the far-end test data of the embodiment with the shield shell removed in fig. 20; in fig. 23b, psnext_diff2_outcd-referenced represents the near-end test data of fig. 20 with the shadow shell embodiment, psnext_diff2_outcd_quoyinbi-referenced represents the near-end test data of fig. 20 with the shadow shell embodiment removed.
As can be seen from fig. 23a and 23b, the embodiment of fig. 20 with the shielding shell and the embodiment of fig. 20 with the shielding shell removed have a total near-end crosstalk optimized by 9dB and an overall crosstalk amplitude optimized by about 16%; the total far-end crosstalk is optimized by 4dB, and the total crosstalk amplitude is optimized by about 7%. It can be seen that, in this embodiment, the arrangement of the shielding shell has a better shielding effect, and the mode of combining the non-ground cable with the shielding shell improves the shielding effect on crosstalk, especially improves the crosstalk shielding effect at the first connection end 2111 and the second connection end 2211, so that the quality of signal transmission is higher.
In one embodiment, the connector assembly 10 includes a plurality of cables (as shown in fig. 24) arranged along the second direction Y, and each cable has a shielding shell disposed on a peripheral side thereof, and the shielding shells are sequentially connected to each other and share the same adjacent side to form a whole. The connector assembly 10 in fig. 24 is a four-way connector.
In one embodiment, the connector assembly 10 includes more cables, the cables are distributed on two sides of the circuit board 100 along the first direction X (as shown in fig. 25), and the shielding shells on two sides of the circuit board 100 along the first direction X respectively form a whole shielding shell. The connector assembly 10 in fig. 25 is an eight-channel connector.
In an embodiment, the first shielding shell 310 is provided with two first openings 3122 (as shown in fig. 21) arranged along the second direction Y, the orthographic projection of the two first openings 3122 on the circuit board 100 is located on the peripheral side of the first cable 210, and the arrangement of the first openings 3122 can increase the elasticity of the first groove 3121 on one hand, so as to reduce the possibility of warping when the first shielding shell 310 is assembled, ensure good contact between the bottom of the first groove 3121 and the first shielding layer 212, and on the other hand, fix the first cable 210 on the circuit board 100 through the first openings 3122, or fasten the connection between the first cable 210 and the circuit board 100 through the first openings 3122 in a dispensing manner when the first cable 210 is loosened. The second shielding case 320 has a similar structure to the first shielding case 310 and will not be described again.
In one possible implementation, the second sub-portion 312 is provided with a second opening 3123 (as shown in fig. 21), and the second opening 3123 at least partially overlaps with the front projection of the first connection end 2111 and/or the first signal pad 120 on the circuit board 100. The second opening 3123 is located on a side of the first opening 3122 near the first connection end 2111 along the third direction Z, and the second opening 3123 is configured to facilitate connection and fixation of the first connection end 2111 and the first signal panel 120. The second shielding case 320 has a similar structure to the first shielding case 310 and will not be described again.
In an embodiment, when the connector assembly 10 is assembled, the first shielding shell 310 is first fixed on the circuit board 100, and then the first connection end 2111 is welded on the first signal panel 120 through the second opening 3123, or the first connection end 2111 is glued on the first signal panel 120 through the second opening 3123 in a dispensing manner, the first shielding shell 310 can play a role in positioning the installation of the first cable 210, and meanwhile, when the connector assembly 10 is used for a long time, if the connection between the first connection end 2111 and the first signal panel 120 is loose, the connection between the first connection end 2111 and the first signal panel 120 can be fastened through the second opening 3123.
The connector, the interconnection system and the server cluster provided by the embodiments of the present application have been described in detail, and specific examples are applied herein to illustrate the principles and embodiments of the present application, and the description of the above embodiments is only for helping to understand the method and core ideas of the present application; meanwhile, as those skilled in the art will have variations in specific embodiments and application scope in light of the ideas of the present application, the present description should not be construed as limiting the present application.
Claims (14)
1. A connector assembly, the connector assembly comprising:
the circuit board comprises a grounding layer, and a first signal panel is arranged on the surface of the circuit board;
the first cable is used for transmitting signals and comprises a first cable core and a first shielding layer, wherein the first cable core comprises a first main body part and a first connecting end positioned at one end of the first main body part, the first shielding layer is coated on the outer side of the first main body part, and the first connecting end is connected with the first signal panel;
the first shielding shell is fixed on the circuit board and connected with the grounding layer, the first connecting end and the first signal panel are positioned between the first shielding shell and the circuit board, and the first shielding shell is abutted with the part of the surface, adjacent to the circuit board, of the first shielding layer, so that the first shielding layer is connected with the grounding layer.
2. The connector assembly of claim 1, wherein the first shield shell includes a first sub-portion, a second sub-portion, and a third sub-portion connected in sequence, an extending direction of the first sub-portion and an extending direction of the third sub-portion each intersect an extending direction of the second sub-portion, and one ends of the first sub-portion and the third sub-portion away from the second sub-portion are fixed on the circuit board and connected to the ground layer, and at least a portion of the second sub-portion is elastically abutted to the first shield layer to connect the first shield layer to the ground layer.
3. The connector assembly of claim 2, wherein the second sub-portion is recessed toward the first cable in a first direction forming a first groove, the first direction intersecting the circuit board, a bottom of the first groove resiliently abutting the first shield layer.
4. A connector assembly according to claim 3, wherein the first recess is provided with a first opening extending through the bottom of the groove.
5. The connector assembly of claim 4, wherein at least a portion of the first aperture does not overlap with an orthographic projection of the first shield layer on the circuit board.
6. The connector assembly of claim 2, wherein the first and third sub-portions have pins at ends thereof remote from the second sub-portion, the circuit board has ground vias, the ground vias are connected to the ground plane, and the pins extend into the ground vias to connect the first shield shell to the ground plane.
7. The connector assembly of claim 1, wherein a second signal pad is disposed on a surface of the circuit board, the connector assembly further comprises a second cable and a second shielding shell, the second cable comprises a second cable core and a second shielding layer, the second cable core comprises a second main body part and a second connection end located at one end of the second main body part, the second shielding layer is wrapped on the outer side of the second main body part, and the second connection end is connected with the second signal pad; the second shielding shell is fixed on the circuit board and is connected with the grounding layer, the second connecting end and the second signal panel are positioned between the second shielding shell and the circuit board, and the second shielding shell is abutted with the surface, adjacent to the circuit board, of the second shielding layer so that the second shielding layer is connected with the grounding layer;
The second shielding shell and the first shielding shell are positioned on the same side of the circuit board, the second shielding shell and the first shielding shell are arranged at intervals along a second direction, and the second direction is intersected with the extending direction of the first cable.
8. The connector assembly of claim 1, wherein a third signal pad is disposed on a surface of the circuit board, the connector assembly further comprises a third cable and a third shielding shell, the third cable comprises a third cable core and a third shielding layer, the third cable core comprises a third main body portion and a third connection end located at one end of the third main body portion, the third shielding layer is wrapped on the outer side of the third main body portion, and the third connection end is connected with the third signal pad; the third shielding shell is fixed on the circuit board and is connected with the grounding layer, the third connecting end and the third signal panel are positioned between the third shielding shell and the circuit board, and the third shielding shell is abutted with the surface, adjacent to the circuit board, of the third shielding layer so that the third shielding layer is connected with the grounding layer;
the third shielding shell and the first shielding shell are respectively positioned at two sides of the circuit board along a first direction, the first direction intersects with the circuit board, and orthographic projections of the first shielding shell and the third shielding shell on the circuit board are at least partially not overlapped.
9. The connector assembly of claim 1, wherein a second signal pad is disposed on a surface of the circuit board, the connector assembly further comprises a second cable and a second shielding shell, the second cable comprises a second cable core and a second shielding layer, the second cable core comprises a second main body part and a second connection end located at one end of the second main body part, the second shielding layer is wrapped on the outer side of the second main body part, and the second connection end is connected with the second signal pad; the second shielding shell is fixed on the circuit board and is connected with the grounding layer, the second connecting end and the second signal panel are positioned between the second shielding shell and the circuit board, and the second shielding shell is abutted with the surface, adjacent to the circuit board, of the second shielding layer so that the second shielding layer is connected with the grounding layer;
the second shielding shell and the first shielding shell are positioned on the same side of the circuit board, the second shielding shell and the first shielding shell are connected side by side along a second direction, and the second direction is intersected with the extending direction of the first cable.
10. The connector assembly of claim 9, wherein the first shield shell comprises a first sub-portion, a second sub-portion, and a third sub-portion connected in sequence, at least a portion of the second sub-portion being in resilient abutment with the first shield layer; the second shielding shell comprises a third sub-part, a fourth sub-part and a fifth sub-part which are sequentially connected, and at least part of the fourth sub-part is elastically abutted with the second shielding layer.
11. The connector assembly of claim 10, wherein the second sub-portion is provided with a second aperture that at least partially overlaps with an orthographic projection of the first connection end and/or the first signal pad on the circuit board.
12. The connector assembly of claim 1, wherein a surface of the circuit board adjacent to the first cable is provided with a ground pad, the ground pad abutting a portion of the first shield layer adjacent to a side of the circuit board.
13. An interconnect system comprising a first electronic device and the connector assembly of any of claims 1-12, the first electronic device being electrically connected to an end of the circuit board remote from the first cable.
14. A server cluster comprising a plurality of servers, wherein the servers comprise a high-speed backplane, a switch, a service board, a backplane connector and a plurality of connector assemblies according to any of claims 1-12, wherein the backplane connector is connected to an end of the first cable remote from the circuit board, wherein the backplane connector is fixedly connected to the high-speed backplane, wherein a portion of the circuit boards in the connector assemblies of the plurality of connector assemblies are connected to the switch, and wherein a portion of the circuit boards in the connector assemblies of the plurality of connector assemblies are connected to the service board.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210507736.2A CN117096677A (en) | 2022-05-11 | 2022-05-11 | Connector assembly, interconnection system and server cluster |
| PCT/CN2023/088986 WO2023216816A1 (en) | 2022-05-11 | 2023-04-18 | Connector assembly, interconnection system, and server cluster |
| TW112116885A TW202410579A (en) | 2022-05-11 | 2023-05-05 | Connector components, interconnect systems, and server clusters |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210507736.2A CN117096677A (en) | 2022-05-11 | 2022-05-11 | Connector assembly, interconnection system and server cluster |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117096677A true CN117096677A (en) | 2023-11-21 |
Family
ID=88729624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210507736.2A Pending CN117096677A (en) | 2022-05-11 | 2022-05-11 | Connector assembly, interconnection system and server cluster |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN117096677A (en) |
| TW (1) | TW202410579A (en) |
| WO (1) | WO2023216816A1 (en) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6869308B2 (en) * | 2002-12-11 | 2005-03-22 | Hon Hai Precision Ind. Co., Ltd. | Cable connector having cross-talk suppressing feature and method for making the connector |
| CN205004467U (en) * | 2015-07-01 | 2016-01-27 | 东莞莫仕连接器有限公司 | Cable connector |
| CN205104699U (en) * | 2015-08-07 | 2016-03-23 | 富士康(昆山)电脑接插件有限公司 | Cable connector module |
| CN206364484U (en) * | 2016-12-19 | 2017-07-28 | 番禺得意精密电子工业有限公司 | Cable installation |
| CN207199937U (en) * | 2017-08-10 | 2018-04-06 | 东莞铭基电子科技集团有限公司 | High speed connector |
| CN111755911B (en) * | 2020-07-10 | 2021-06-15 | 上海航天科工电器研究院有限公司 | Cable connecting structure of high-speed connector |
| CN114256696B (en) * | 2020-09-21 | 2023-03-03 | 华为技术有限公司 | Connector assembly, method of manufacturing the same, and electronic apparatus |
| CN113346262B (en) * | 2021-04-29 | 2022-09-20 | 山东英信计算机技术有限公司 | Cable switching device and method for pulse amplitude modulation |
| CN216450895U (en) * | 2021-07-26 | 2022-05-06 | 浙江兆龙互连科技股份有限公司 | Electric connector with shielding and grounding functions |
| CN113904129B (en) * | 2021-12-09 | 2022-03-11 | 鹏元晟高科技股份有限公司 | High-speed signal cable assembly |
-
2022
- 2022-05-11 CN CN202210507736.2A patent/CN117096677A/en active Pending
-
2023
- 2023-04-18 WO PCT/CN2023/088986 patent/WO2023216816A1/en unknown
- 2023-05-05 TW TW112116885A patent/TW202410579A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202410579A (en) | 2024-03-01 |
| WO2023216816A1 (en) | 2023-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11637390B2 (en) | I/O connector configured for cable connection to a midboard | |
| US7497738B2 (en) | Electrical connector interacting between two different interfaces | |
| USRE36845E (en) | High density, high bandwidth, coaxial cable, flexible circuit and circuit board connection assembly | |
| US5663526A (en) | Optical module with tolerant wave soldered joints | |
| US9590338B1 (en) | Rigid-flex circuit connector | |
| US9252510B2 (en) | Soldering structure for mounting connector on flexible circuit board | |
| US20030119343A1 (en) | Wire spacer for high speed cable termination | |
| US20170207579A1 (en) | Interconnect system having a circuit board having resonance control | |
| CN114824953A (en) | Signal connector | |
| US20110189892A1 (en) | Male connector, female connector, and connector | |
| US6176743B1 (en) | Electrical adapter | |
| CN212162125U (en) | Differential pair module, connector, communication device and shielding assembly | |
| KR102499673B1 (en) | Electric connector for radio frequency | |
| US5421741A (en) | Electrical connection assembly | |
| CN111193156B (en) | Connector assembly, connector, network device and manufacturing method | |
| CN216488672U (en) | Electrical connector with improved contact arrangement | |
| CN117096677A (en) | Connector assembly, interconnection system and server cluster | |
| WO2022057422A1 (en) | Connector assembly and manufacturing method therefor, and electronic device | |
| CN113725641A (en) | Cable connecting device, connecting assembly and manufacturing method of connecting assembly | |
| CN219040754U (en) | Electric connector, electronic assembly and electronic equipment | |
| CN220173479U (en) | Circuit board assembly, interconnection assembly and electronic device | |
| KR102523875B1 (en) | Electric connector for radio frequency | |
| CN114122831B (en) | Connector assembly and communication equipment | |
| US11342695B2 (en) | Cable connection apparatus, connection assembly, and method for manufacturing connection assembly | |
| CN116014481A (en) | Electric connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication |